TW201024072A - A method for forming metal capped substrate imprints - Google Patents

Abstract

A method for selectively depositing a metal layer on a substrate is provided. The method comprises the steps of: (a) providing a mold having an imprint forming surface coated with said metal layer thereon, wherein said imprint forming surface comprises a first region and a second region, and wherein said first region is dimensioned to have a greater surface area compared to said second region; and (b) contacting said mold to said substrate to form an imprint on said substrate and to simultaneously selectively deposit said metal layer from said first region of said mold to said imprint on said substrate.

Description

201024072 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to metal-coated substrate embossing' and in particular to a method of embossing a substrate onto a substrate which is covered with a metal layer. This metal-covered I-print can be used for surface reflection in the sensor for light reflection. [Prior Art] In the field of electronics, the ability to deposit or pattern various conductive materials on a substrate is an important technique. An organic electronic component (electronic-electronics) is a type of electronic component that uses a conductive polymer. The key step in the advancement of advanced organic electronic components is the ability to deposit or pattern various conductive materials onto polymer substrates. Existing patterning technologies include optical lithography, electron beam lithography, and rigid mask technology (々 id – mask technology). Conventional optical lithography techniques typically use light in the form of ultraviolet radiation to selectively illuminate a predetermined portion of the photosensitive chemical on the surface of the substrate, referred to as photoresist. The step of selective illumination is typically accomplished using a reticle to mask/exposure the UV light to the corresponding area of the photoresist. Next, a process of removing a portion of the photoresist layer and an excess (plethora)/product is performed, such as chemical vapor deposition (CVD) or physical vapor deposition (PVD). The problem encountered with optical lithography is the choice of .1 ± deposited metal # method independent of the mask or rigid mask. In addition, the use of rigid masks in the I process is expensive and time consuming to produce, thus increasing the cost of lithography. 201024072 Similarly, other traditional lithography techniques have some drawbacks. One of these shortcomings is that traditional lithography requires multiple processing steps, resulting in increased costs. Another disadvantage is that these conventional lithography techniques cannot selectively deposit metal onto the substrate without relying on the reticle, or require extensive and precise alignment to selectively deposit metal onto the substrate. Moreover, none of these techniques are suitable for forming metal patterns on non-planar substrates. For sensing wafers, eg for surface plasma resonance spectrometers

Surface plasmon resonance spectroscopy, if previously described to form metal on these wafers, is not sufficient and expensive. Typically, the sensing wafer is based on a Kretschmann structure for use. However, the Kretschmann structure is subject to the optical properties of many supporting substrates and requires a reflective material in a specific range. Usually this range is from gold to 46 to 5 () coffee. It has been confirmed that a grating coupled surface plasmon spectr〇 sc〇py can be used, which is coated with a reflective material such as gold having a thickness of about IGGnm to increase the surface electric power on the substrate. The efficiency of the slurry resonance can be reduced to enthalpy. However, these lights are composed of a grid-like structure coated with a single metal. Therefore, what is needed in the industry is to provide a method of forming an imprint on a metal layer, wherein the imprint has a metal layer. [Invention] The first object of the present invention is to provide an imprint on a method of having a metal layer thereon, the method comprising the steps of: (&) providing a mold having a first region and a second region forming surface, having a large surface area, and One of the metal coatings; and the pre-printing of the domain to form a surface (iinprint the first region compared to the second region of the first region and the second region having (1) the mold and the first substrate are in contact with Forming a stamp on the first substrate, wherein the conditions for forming the stamp are selected such that the metal coating on the first region of the mold is substantially transferred to the formed stamp 'and The metal coating on the second region remains substantially on the mold. 0. Advantageously, since the surface area of the first region of the mold is larger than the surface area of the second region of the mold, the first region of the mold and the substrate are Corresponding area There is a better adhesion between the two, thus facilitating or facilitating the transfer of the metal layer onto the substrate. Advantageously, the method disclosed herein can simultaneously form an imprint on the substrate (imprint And depositing a metal layer on the selected area on the substrate imprint. Advantageously, the method disclosed herein provides a reflective substrate for use in a detection system, such as a surface plasma resonance system, Only a portion of the detection system has a reflective metal that is embossed in micron or nanometer size, thus greatly increasing its analytical application, such as analyzing multiple discrete conjugations to a single sensor. Biomolecules 0 Advantageously, the methods disclosed herein provide a conductive pathway between a substrate comprising a polymeric bipolar plate and a catalyst for a polymer fuel cell. Currently, the weight of the metal bipolar plate Up to 70% of the total fuel cell weight of the bipolar plate and the application of electrical conductivity to reduce the weight. According to the method disclosed in the present invention, it is effective to use the polymeric material on selected areas of the bipolar plate. The method of the present invention uses a selectively metallized substrate to control a particular mode of fluid flow. In particular, the flow of fluid can be controlled in microfluidic applications. Providing an embossing substrate having a one-micron or nano-sized embossing integrally formed on a surface of a substrate and having a metal layer deposited on at least a portion of the embossing. A third object is to provide a substrate comprising an array of barriers to form a trench between the adjacent stamps, wherein a metal layer covers the stamps or the trenches. The formation of embossed and selectively deposited metal layers on the substrate occurs simultaneously on the embossing. According to a fourth object of the present invention, a substrate as described above is provided for use in a fuel cell, a surface plasma resonator, an organic electronic component, a microelectromechanical system/nanoelectromechanical system (MEMs/NEMs), micro Fluid or plasma device. According to a fifth object of the present invention, there is provided a substrate as described above, wherein the substrate is obtained by the method as described above. According to a sixth object of the present invention, there is provided a substrate as described above which can be obtained by the method as described above. According to a seventh object of the present invention, there is provided a substrate as described above, wherein the substrate is obtained by the method as described above, which is used in a fuel cell 7 201024072 cell, a surface plasma resonator, an organic electronic component, MEMS/Nano Electromechanical Systems (MEMs/NEMs), microfluidic devices or plasma devices. According to an eighth object of the present invention, there is provided a substrate as described above, wherein the substrate is obtainable by a method as described above for use in a fuel cell, a surface plasma resonator, an organic electronic component, a microelectromechanical system / Nano electromechanical systems (MEMs/NEMs), microfluidic devices or plasma devices. According to a ninth object of the present invention, there is provided a sensing wafer having a substrate body comprising an array of micron-sized or nano-sized imprints extending from the substrate and arranged to imprint adjacent to each other A trench is formed therebetween, wherein a metal layer covers the stamp or the trenches. According to a tenth aspect of the present invention, a surface plasma resonance system includes: a light source; a sensing wafer as described above; and a photodetector for receiving the reflective metal layer from the sensing wafer Reflected light; and an optical modulator for directing modulated light onto the sensing wafer. [Embodiment] The term capsule used herein, unless otherwise specified, has the following meanings: "imprinting (impr iηΐ)" and ϋ & amp 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 In the context of this specification, it is intended to include physical forms of any form of plastic solids (eg, thermal polymeric substrates). Typically, the stamp is a long structure that extends from the surface of the substrate along a longitudinal longitudinal axis that is on or adjacent to the proximal end of the substrate and relatively opposite to the near point Extend between the distal ends. 201024072 Often, the longitudinal axis is nonnal in the horizontal plane of the substrate, but this longitudinal axis can be greatly changed in angle, for example, 45 degrees from the substrate level. The embossed array has a series of 歹, j regular columns or rows on the substrate 丨, and 彳 forms a trench between adjacent columns and columns. The length and thickness of the stamp can be in the nanometer scale and the micrometer scale, so the groove is also on the nanometer scale and the micrometer scale. Unless otherwise specified, in the present specification, when the "surface πα" is referred to as the first region and/or the second region of the embossed surface of the mold, it may be interpreted as: a part of the mold, This portion has a metal layer that is in contact with the substrate to be imprinted. Therefore, when the mold is in contact with the substrate, the "surface area" means the area where the surface is formed by the mold, which is in contact with the substrate but excludes other places where the metal layer is not present, even though these places May come into contact with the substrate. Substantially does not exclude "completely", that is, a composition "substantially, without gamma, meaning that it is possible to be completely free of gamma. Where necessary, the present invention may omit the definition of "substantiaUy". The term "integrally f0rmed" means a substrate, which is a single whole, containing magic and metal layers. The integrally formed substrate can be manufactured by imprint stamping. In this method, a mold having a metal layer on the imprint forming surface is applied to the substrate under certain conditions to form Embossing and simultaneously transferring the metal layer to the embossing. Non-imprinting embossing (nan〇imprinting im〇graphy), can be broadly interpreted to include any defined pattern on the surface at a certain temperature and pressure. Or the surface structure of the mold contacts, and on the surface of the substrate 201024072 print or create a micron and / or nano-scale pattern or structure. Micron-scale" and "micron size, which can be used interchangeably, can be interpreted as included in A scale of about 1 to 100 microns. The nanoscale and "nano size, here interchangeable" can be interpreted to encompass any scale below about 1 micron. "Three dimensional" "can be broadly interpreted to include any structure, structural element, embossing or pattern having lateral variations (thickness) and depth variations. Glass transition temperature Tg (glass transition ® rature) can be interpreted as including Any polymer is located between the rubber and the glass-like L. This means that when the glass transition temperature l exceeds the polymer, the polymer becomes rubbery and can be stretched or shaped without breaking. When the polymer is less than Tg Usually, the polymer becomes non-stretchable and brittle so that it will break when it is applied to the polymer. It is worth noting that the glass transition temperature is not a very narrow transition temperature, but it usually gradually The transformation varies according to actual conditions (eg, film thickness, polymer law, and the like). The glass transition temperature of a real polymer will vary with the thickness of the film. The glass transition temperature is herein defined as poly. The bulk glass transition temperature of the substrate. The large glass transition temperature is a specific value' and is widely documented in the literature. The glass transition temperature of the polymer can be obtained from the software of ppp Handbook711 edited by Dr. D. T Wu 2_. "W〇rk of adhesion" means how much bonding force acts on the mold and the substrate. Inter-contact area 'its unit is expressed as Nm' 10 201024072 Unless otherwise indicated, "comprising," and its part-of-speech change, means "open, statement, to include the described elements and Additional but undescribed components may also be included. "About" indicates the concentration of the component, usually +/- 5% of the indicated amount, more often +/_4% of the indicated amount, more often +/- 3% of the indicated amount. More often +/ - 2% of the indicated magnitude, + /-1% of the indicated magnitude and even +/_〇. 5% of the indicated magnitude. In the entire specification, some implementations The examples are disclosed in a range format. Values® Each 'It is noted that in the following description, this range format representation is merely for convenience and brevity, but does not imply that the scope described herein is constructed in a range that is not elastically adjustable. Therefore, the ranges stated in this specification should have all possible sub-ranges and all individual values in the range. For example, when the range in the specification is 1 to 6, it should have 1 to 3, 1 to 4, 1 to 5, 2 to 4, 2 to 6, 3 to 6, and the like, and should also have independent numerical values in the range 'for example, 1, 2, 3, 4, 5, 6. No matter how broad the range φ is applicable. Various exemplary embodiments of a method for selective deposition on a first substrate will be disclosed herein, but the invention is not limited thereto. The method includes the steps of: providing a mold having an embossed surface of the first region and the second region, wherein the first region has a larger surface area than the second region, and wherein the first region and The second region has a metal coating. The method also includes the steps of: contacting the mold with the substrate to form a first imprint on the first substrate, wherein the conditions for forming the imprint are selected, So that the metal on the upper portion of the first region of the stamp is substantially 11 201024072 and the metal coating on the second region remains transferred to the formed stamp. On the mold, the inventors discovered that the stamp was used. The stamp forming surface can be viewed as a region having two different surface areas. When the mold is applied to the substrate, a region having a larger surface area selectively transfers the metal layer from the mold to the substrate than other regions. Subject to this theory, the inventors believe that this selective transfer or deposition of a metal layer on a substrate is due to the area between the mold having a larger surface area and the corresponding area on the substrate. High adhesion work. Due to the high adhesion work, the metal layer can be selectively deposited on the substrate. Compared with the lower surface area of the mold, the area with a small surface area does not cause the high adhesion work required for the transfer metal. When the mold is applied to the substrate, the metal layer on this region is not transferred to the corresponding region on the substrate. The surface area of the first region of the embossed surface can be 50% more than the surface area of the second region. Preferably, 60%, preferably 鄕, preferably 8%, preferably 9%, and most preferably 95% or more. More preferably, the surface area of the first region may be at least 2 times, or at least 5, of the second region. Multiple, or at least, at least 15 times, or at least 20 times or at least 25 times. The stamp has a patterned stamp forming surface thereon. The pattern may include holes, cylinders (c 〇lumns), columns, dimples (d11BPies), pr〇jections, barriers or trenches. This pattern may have a predetermined height, width and length' which may be on the micrometer scale or on the nanometer scale. The pattern and the pattern can be separated from each other. This pattern can be a three-dimensional structure. In an embodiment, the first region may mean a 12 201024072 pattern that protrudes from the surface of the mold, such as projections or gratings. The second region may mean a pattern that does not protrude from the surface of the mold, such as a hole, the groove mold surface itself. The first region can also be referred to as the mold surface itself. In another implementation, the -region may mean a pattern that does not protrude from the surface of the mold, such as holes 'di_es', the trenches surface itself. The second region may mean a pattern that protrudes from the surface of the mold, such as columns or pilates, projections or gratings. The second region is also meaningful; refers to the mold surface itself β. The pattern formed on the mold can be formed by the following methods: optical lithography, deep reactive ion etching, hologram lithography (h〇1〇graphic lithography) ), electron beam lithography (e_beam Uth〇graphy), ion beam lithography (lon-beam lithography), and combinations of the foregoing. In an embodiment, the pattern on the mold may include a gate barrier or trench. The grids and/or grooves may extend along a longitudinal axis relative to the mold. The width of the fence or groove φ can be on the micrometer or nanometer scale. When the mold has both a fence and a groove, the fence and the groove may be arranged in parallel with each other. The pattern on the mold can also contain lines and spaces. The width of the barrier and the grooves can each independently be selected from the group consisting of: about 5 to 50 microns, about 5 to 40 microns, about 5 to 3 microns, about 5 to 20 microns, about 5 to 1 inch, about 10 to 5 μm, about 2 to 5 μm, about 30 to 50 μm, and about 40 to 50 μm. In one embodiment, the width of the grid and the corresponding channel may be about 1 micron. The fence formed has a fence constant of 100 nm to 1000 nm. 13 201024072 The height of the barrier formed can be 10 to 100 nm. The barrier formed may be a shape. When viewed in a sectional view, the following groups are selected: sine wave, square wave, trapezoid (trapezoidal

Shape ), blazed shape and triangle. The peach shed and/or the groove may have a group consisting of the following aspect ratios: about 〇·1~3. 0, about 0·1~2. 5, about 0·1~2·0, about 〇. l ~l 5, about 0.1~1.0 and about 〇.1~〇5. In an embodiment, the aspect ratio of the barrier and/or the trench is about 〇. In another embodiment, the pattern on the mold can comprise cylindrical and or circular holes. The diameter of the cylindrical and or circular holes can be on the micrometer scale. The round on the mold may also contain Pillars and/or dimples. The diameter of the cylinder and/or the circular hole can be independently selected from the following groups

The group of people: about 1~10 about 1~8 vm, about 1~6 about

Am about 1~2 private m, about 2~1〇 #m, about 4~ 参"m, about 8~10 ym and about 4~6 /zm. In one embodiment, the cylindrical and/or circular holes are about 5 in diameter. The aspect ratio of the cylinder, the column, the recess and the circular hole is selected from the group consisting of the following composition: about G.1~2.0, about 0.1~1.5, about (j.iqo and about ~0.5. The ice-to-width ratio of the column, the column, the recess, and the circular hole may be about 0.5. In another embodiment, the aspect ratio of the column, the column, the four traps, and the circular hole may be about 丨.〇. The metal in the metal layer may be selected from the group consisting of the following metals: the periodic table of the lanthanum and the IUA group, the foregoing alloys, and combinations thereof. In one embodiment, the group of the following metals may be selected: aluminum, copper, 14 201024072 Gold, silver, recording, road and combinations thereof. In one embodiment, the metal may be gold. In another embodiment, the metal may be silver. The metal may be thermally evaporated, electronically Electron beam evapration or sputtering is deposited on the surface of the mold. The thickness of the metal layer on the surface of the mold can be selected from the group consisting of: about 50~500 nm, about '50~400 nm. , about 50~300 nm, about 50~200 nm, about 50~100 nm, about 100~500 nm, about 200~ 500 nm, about 300 to 500 nm, and about 400 to 500 nm. In one embodiment, the thickness of the metal layer can be selected to be about 1 〇〇 to 2 〇〇 ηιη. The metal layer can be selected during contact with the substrate. Embossing or transferring onto the substrate. After the mold is applied to the first substrate, the remaining metal layer is not selectively transferred to the first substrate and remains on the second region of the mold. The mold is in contact with the # second substrate, and the remaining metal layer on the second region of the mold is selectively transferred to the second substrate to simultaneously form an embossed and selectively deposited metal layer from the second region of the mold to the second Substrate. It will be appreciated by those skilled in the art that the first and second contacting steps are interchangeable. The first and/or second substrate can be a polymeric substrate, such as a thermoplastic polymer substrate. The thermoplastic polymer substrate may comprise at least one monomer selected from the group consisting of acryiates, phthalamides, acrylonitriles (acryi〇nitriles). ), fiber 15 201024072 cellulosics, styrene s, Hyun • alkyls, alkyl methacrylates, rare (311^61165), _ thinning (]1&1〇舀6113±6 (1&1 let 61163), Amides (amides), imides, aryletherketones, butadienes, ketones, esters, acetates, carbonates Carbonates) and combinations of the foregoing. In one embodiment, the thermoplastic 'polymer is a polycarbonate. The monomer forming the thermoplastic polymer may be selected from the group consisting of methy 1 s, ethy 1 enes, propylenes, methyl methacrylates. ), methypentenes, vinyludene, vinyludene chloride, etherimides, ethylenechlorinates, urethanes, Ethylene vinyl alcohols, fluorocarbons, fluoroplatics, carbonates, acrylonitrile-butadiene-styrenes, etheretherketones, ions Polymers (ionomers), butylenes, phenylene oxides, sulfones, ehtersulfones, phenylene sulfones, thermoplastic elastomers (elastomers) , ethy 1 ene terephthalate, ethylene terephthalate, naphthalene phthalate 16 201024072 (ethylenenaphthalate) and the foregoing Combination. The resulting stamp pattern on the substrate during each contact step is complementary to the pattern on the mold. For example, when the mold is applied to the substrate, the checkerboard has a barrier pattern to provide a complementary channel structure on the corresponding substrate. In one embodiment, the method may include the step of controlling the temperature to exceed the glass transition temperature of the first and/or second polymeric substrate during the step of contacting the mold with the first and/or second polymeric substrate. At this temperature, the polymerization: softening and shaping according to the shape of the mold, so that the waste printing is created on the surface of the polymer, wherein when the polymer substrate is cooled and hardened, the embossed pattern thereon can be on the mold The patterns are complementary. Additionally, the mold may be preferably applied for a predetermined period of time to form an imprint on the surface of the polymer. The temperature and pressure used are determined by the use of the polymer. This method can include the use of nano-typography lithography. This method can change the planar or tertiary spatial structure of the substrate surface. The mold may be any suitable material that is chemically inert and harder than the soft substrate at temperatures above the glass transition temperature of the soft substrate. The mold may be formed of a metallic glass, quartz, ceramic or a combination of the foregoing. When the mold is contacted to the temperature at which the first and/or second polymeric substrates are used, they may each independently be selected from the group consisting of the following temperature ranges: about 120. ~20 (TC, 'about 14〇~2〇〇ΐ, about 16〇~2〇, about 18〇~2〇〇°C, about 120~14〇.〇, about 12〇~16〇t: and About 12 〇 to 180 〇 C. The μ degree is preferably controlled to exceed the glass transition temperature of the first and/or second polymer substrate. Preferably, the temperature is controlled above the first and/or second 17 201024072 The glass transition temperature of the polymer substrate is above 20 °C. ° When the mold is in contact with the pressure used in the first and/or second polymer substrate, it can be independently selected from the following pressure ranges: about 1 〇bar (1 MPa)~50 bat (5 MPa), about 10 bar (1 MPa)~40 bar (4 MPa), about i〇bar (1 MPa) ~30 bar (3 MPa), about 10 bar (1 MPa)~20 bar (2 MPa), about 20 bar (2 MPa) ~50 bar (5 MPa), about 3〇bar (3 MPa) ~50 bar (5 MPa), about 40 bar (4 MPa)~5 〇bar (5 MPa) and about 20 bar (2 MPa) ~ 30 bar (3 MPa). In one embodiment, the applied pressure is about 22 10 bar (2.2 MPa). The mold is contacted to the first and / or The time of the second polymer substrate can be independently controlled to be about 5 to 120 minutes. For the polyacrylate substrate, the first contacting step is about 15 minutes and the second contacting step is about 9 minutes. As will be appreciated by those skilled in the art, the first and/or second contacting steps The time taken is determined by the morphology and pattern of the substrate used and the morphology and density of the pattern. The relationship between the surface area and the time of the first and second contact steps is based on experience. However, The general rule under certain rule of thumb is that when the surface area of the domain 1 is greater than 95% of the second surface area, it takes 15 minutes. The second contact step takes a long time of 90 minutes. _ This method can be Including, in the first contact step or the second contact step, the month 1J' is for the adhesion promoter to 隹. JJ- « JJ. The step of the J main substrate and the first substrate. Promote who is paralyzed than #double agent white to the first substrate and the second substrate to form Table 18 201024072 surface coated on it. The metal has been selectively transferred from the mold p; release mold to the first And/or

After a substrate, the "adhesion promoter can be used to hang KP" is used to increase the adhesion of the metal layer to the first substrate and/or the second substrate. This adhesion promoter can be a money compound. This compound can be selected from the group consisting of 2-ercaptoethyltrimeth〇xyane, 3-thiolpropyltrimethoxysilane (3iercapt〇pr〇pyi trimethoxysilane). , 2-mercapt propyl pranopyrene, 3-mercaptopropyl triethoxys ilane ' 2 thiolacyl ethyl 2-mercapt〇ethyi tripropoxysilane, 2-mercaptoethyl tributoxybutane (2-mercap1; oe1:hyl tri sec-butoxysilane), 3-thiolpropyl 3-mercaptopropyl tri sec-butoxysilane, 3-mercaptopropy 1 tri isopropoxysi lane, 3-thiol group • propyl trisole 3-mercaptopropy 1 trioctoxysilane, 2-mercaptoethy1 tri-2, -ethylhexoxysilane, 2_thiolethyl 2-mercap1: ethyl dimethoxyethoxy si lane, 3-thiol propyl oxime 2-mercaptopropyl methoxyethoxypropoxysi lane, 3-mercaptopropyl dimethoxymethylsilane, 3-thiolpropylmethoxymethyl dimethyl 2-mercaptopropy 1 ethoxy dimethylsilane, 3-mercaptopropy 1 ethoxy dimethylsilane, 3-thiol propylcyclohexyloxymethyl decane (3-19) -mercaptopropyl cy cl oh exoxy methyl silane), 4-inercaptobutyl trimethoxysilane, 3-thiol-3-methylpropyltrimethoxysilane (3-mercapto- 3-methylpropyl tri methoxy si lane), 3-mercapto-3-methylpropy1 tripropoxysilane, 3-

3-mercapto-3-ethylpropy1 dimethoxy methylsilane, 3-mercapto-2-mercaptopropyltrimethoxy oxalate (3- Mercapto-2-methylpropy1 trimethoxysilane ), 3-mereapto-2-methylpropy1 dimethoxy phenylsilane, 3-thiol cyclohexyltrimethoxy 3-mercapto-cyclohexyl trimethoxysi lane, 12-mercaptododecyl trimethoxysi lane, 12-thiol-dodecyl triethoxyxilan (12-mercaptododecy 1 tr i ethoxysi lane ), 18-mercaptooctadecyl trimethoxysi lane, 18-mercapto-octadecyl trimethoxysi lane, 18-thiol- 18 妓 基 methoxy dimethyl dimethyl dream (18-mercaptooctadecy1 methoxydimethy1 si lane ), 2-mercapto-2-methylehtyl tripropoxysi1ane , 2- 20 201024072 thiol-2_ decyl 2-mercapto-2-methy1ehty1 trioctoxysi1ane, 2-thiolphenyl triterpenoid 2-mercaptophenyl trimethoxysilane, 2-mercaptophenyl triethoxysilane, 2-mercaptotolyl trimethoxysilane , 2-mercaptotolyl triethoxysi lane, 1-mercaptomethy 1 toly 1 tr imethoxysi lane , 1-mercaptomethyltolyl triethoxysilane, 2-mercaptoehtylpheny 1 trimethoxysi lane, 2-thiol group B 2-mercaptoeh1;ylphenyl tri ethoxys i lane ), 2-mercaptoehty 1 toly 1 trimethoxysi lane , 2- Thiol-ylethyl phenyl triethoxymethane (2-mercapi: oeh1:yltolyl triethoxysilane), 2-mercaptopropy lpheny 1 trimethoxysi lane 2-mercaptopropyl propyl triethoxy zebra (2-mercapto Propylphenyl tr i ethoxysi lane ), 3-aminopropyltrimethoxysilane, 3-aminopropy 1 triethoxysi lane, 4-aminobutyl tri 3-aminobutyltriethoxysilane, N-mercapto 3-ammon-2-methylpropyltrimethoxydecane 21 201024072 (N-methy1-3-amino-2-methy 1 propyltrimethoxys ilane ), N- N-ethyl-3-amino-2-methy 1 propyltrimethoxysilane, N-ethyl_3_amino-2-methylpropyl Ethoxymethyl calcination (N-ethy1-3-amino-2-methylpropyldiethoxymethy1 si la ne ), N-ethyl-3-ammon-2-mercaptopropyltriethoxydecane (N-ethy1-3 -amino-2-methylpropyltrimethoxysi lane ), N-ethy1-3-amino-2-methy 1 propyl-methyltrimethoxys ilane N-buty1-3-amino-2-methylpropyltrimethoxysi lane, 3-(N-methyl-3-amino-1-methyl _1-ethyl)propyltrimethoxymethanol* (3-(N-methy1-3-amino-1-methyl-1-ethy 1)-propy1 trim ethoxy silane ) , N-ethyl-4-amino-3,3-dimercaptobutyl dimethoxymethyl decane (N-ethyl-4-amino-3,3-dimethylbuty1 dimethoxymethy 1 Silane), N-ethyl-4-amino-3, 3-dimethylbutyltrimethoxysilan e, N-(cyclohexyl) N-(cyclohexyl)-3-aminopropyl1;rin]ethoxysilane), N-(2-aminoethyl)-3-aminopropyltrimethoxyoxymethane ( N-(2-aminoethy 1 ) -3-aminopropyltrimethoxysi lane ), N-(2-aminoethyl)-3-aminopropyltriethoxysilane (N-(2-aminoethy 1 ) -3-aminopropyltriethoxysilane) , N-(2-Aminoethyl)-3-ammonia 201024072 propyl-methyl-2-methoxypropy lmethyldimethoxysi lane (N-(2-aminoethyl)-3-aminopropy lmethyldimethoxysi lane), aminopropyltriethoxy oxime (aminopropyl tr iethoxysi lane ), bis(trimethoxysiliy-2-methylpropyl)amine and N-(3' methoxypropyl)-3- Amino-2-methylpropyltrimethoxysidecane (N-(3,-trimethoxysi1iypropyl)-3-amino-2-me1;hylpr Opyl1: riinethoxysi lane). In one embodiment, the decane compound is 3-thiolpropyltrimethoxydecane (MPTMS). Without being bound by any particular theory, it is generally believed that the chemistry of 3_thiolpropyl dimethoxydecane (MPTMS) acts as a gold adhesion promoter in which the thiol group of this compound is bonded to gold, and The trimethoxylized monthly t* base is bonded to the polycarbonate substrate. In one embodiment, the surface of the adhesion promoter is coated to less than about 1 inch.

Nm ° Here is provided an I material having a micron or nanometer embossed 'formed into the surface of the substrate' and having a metal layer deposited on at least a portion of the embossing. The micron size or the nephew of the must-have item provides a substrate: an array of size imprints. The substrate comprises an arrangement of fences::::: some adjacent stamping spaces form a trench, and a metal layer in the crucible Cover the grooves. &丨a The substrate provided above can be used for fuel cell 'surface 23 201024072 plasma spectrometer, organic electronic components, microelectromechanical systems / nanomechanical systems (MEMs / NEMs), microfluidic devices or plasma Device. The substrate as described above is provided herein, wherein the substrate is obtained by the method described above. Provided herein is a substrate as described above, wherein the substrate is obtainable by the method described above. Provided herein is a substrate as described above, wherein the substrate is obtained by the method described above and can be used in fuel cells, surface plasma spectrometers, organic electronic components, MEMS/NEMs, (MEMs/NEMs), Microfluidic® Body Device or Plasma Device Here, a substrate as described above is provided, wherein the substrate can be obtained by the method described above, which can be used for fuel cells, surface plasma spectrometers, organic electronic components, MEMS/ Nano electromechanical systems (MEMs/NEMs), microfluidic devices or plasma devices. There is provided a sensing wafer having a substrate body (b〇dy), comprising an array of micron- or nano-sized imprints extending from the substrate and arranged to imprint adjacent to each other A trench is formed therebetween, wherein a reflective metal layer covers the stamps or the trenches. There is provided a surface plasma resonance system comprising: a light source; a sensing wafer as described above; a light source detector for receiving light reflected by the reflective metal layer of the sensing wafer; and an optical amplitude modulation A 〇ptical modulator is used to direct the modulated light onto the sensing wafer. Figure 1 is a schematic view showing a selective deposition of a metal layer onto a first substrate (steps (a) - (c)) and subsequent selective deposition of a metal layer onto a second substrate of 24 201024072 (step (d) - (f)) Method 10. In the step (a) of Fig. 1, the crucible mold 12 has an imprint forming surface 'which includes a first region (14a, 14b, 14c) and a second region containing the bumps (16a, 16b, .16c, 16d) ), a reflective metal (for example, gold) is applied via an electron beam vapor. The mold 12 is mounted on an electron beam evaporation instrument (not shown) and is at a distance from the gold target to make the vapor deposition unidirectional, and forms a gold coating on the first region (14a, 14b, 14c). The cloth layer (18a, ❻ 1, 18c) and the gold coating layer of the second region (2〇a, 乜, 2〇c, 2〇d). The surface area (250, 000 # m2) of the first region (14a, 14b, 14c) is larger than the surface area (1〇, 〇〇〇 #^) of the second region (16a, 16b, 16c, 16d). Prior to step (a), the first polycarbonate (PC) substrate is treated with a adhesion promoter (3-thiolpropyl propyl methoxy decane) to form a surface coating 24 of the adhesion promoter. In step (b) of Figure 1, 'mold the mold 12 to polycarbonate (PC) under the condition that the temperature exceeds the glass transition temperature U8(TC) of the polycarbonate substrate 22 and the pressure is 2.2 MPa. The surface of the substrate 22 was rubbed for 5 minutes to form an impression on the polycarbonate substrate 22. In step (c) of Figure 1, 'the polycarbonate substrate 22 is cooled to locpc for a period of time (5 minutes) before the film is removed from the mold 12. The embossing formed on the polycarbonate substrate 22 includes a first region (26a, 26b, 26c) of ridges and a second region (28a, 28b, 28c, 28d) of depressions. The gold layer (i8a, 18b, 18c) on the first region (14a, 14b, 14c) of the mold 12 is transferred to the first region 25 201024072 domain (26a, 26b, 26c) of the corresponding ridge on the polycarbonate substrate 22. ). This is because the surface area of the first region (14a, 14b, 14c) on the mold 12 is larger than the surface area of the second region (16a, 16b, 16c, 16d) of the bulge, so that the first region of the mold 12 (Ua, 丨" And l4c) having a greater adhesion to the first regions (26a, 26b, 26c) of the corresponding ridges on the polycarbonate substrate 22. In the step (d) of Fig. 1, a coating layer having a gold coating layer (2) is used. 〇a, 2〇b, 20c, 20d) the same tantalum mold 12 on the second region (16a, 16b, 16.16d) of the ridge, while simultaneously imprinting and selectively depositing the metal onto the second polycarbonate substrate 30 The second polycarbonate substrate 3 is also treated with a binder promoter (MPTMS) to form a coated surface of the adhesion promoter 32. In step (e) of Figure 1, the temperature exceeds the polycarbonate. The glass transition temperature of the substrate 30 (18 (rc), under a pressure of 22 MPa, was applied to the surface of the mold 12 to the surface of the polycarbonate substrate 3 for 9 minutes to form a pressure on the polycarbonate substrate 30. In step (f) of Figure 1, the polycarbonate substrate 30 to 10 is cooled (TC 1-5 minutes) before the polycarbonate substrate 3 is released from the mold 12 The stamp formed on the polycarbonate 30 includes a first region of the ridge (3 cut, ® 34b 34c) and a second region (36a, 36b, 36c, 36d) of the recess. The second region of the mold 12 (163) , 161), 16 (:, 16 (1) gold layer (2 (^, 20b, 20c, 20d) transferred to the corresponding second region (36a, 36b, 36c, 36d) on the polycarbonate substrate 3 The following is a detailed description of the preferred embodiments as follows, but it is not limited to 26 201024072 to limit the invention. Materials and methods gold deposition at 3. 8xl 〇-6mbai· ( 3. 8xl 〇-'7 kPa Under the pressure, current 100

Ma, under the condition of deposition rate 〇.llnm/s, was coated with gold on the enamel mold by electron beam evaporation. The 矽 mold is mounted on Edfard Aut〇 3〇6 electron beam evaporation. It is a distance from the gold standard to ensure that gold is deposited in the 矽 mold. Gold does not deposit on the sidewalls of any recessed areas. The thickness of the gold layer is from 100 nm to 200 nm. Polycarbonate surface treatment polycarbonate film is treated with a adhesion promoter (3_thiol trimethoxy decane; MPTMS) to enhance the bonding between polycarbonate and gold layer during the imprint process. The carbonate was immersed in a mixed solution of 5ffil 3_thiol trimethoxy hydrazine UPTMS) with 240 ml of ethanol and 1 〇ffil of deionized water. The film was placed in this solution overnight to ensure that the 3-thiol trimethoxy oxime (MPTMS) reacted with the polycarbonate film to form a surface coating to promote adhesion. Gold Transfer 3-Compression Using a conventional nanoimprint technique, a gold-coated die and a thiol-based trimethoxydecane (MPTMS)-treated polymer substrate are used for printing. On a Obducant press, a gold coated mold was placed on top of the poly 27 201024072 substrate. The temperature was then heated to a temperature exceeding the glass transition temperature of the polymer substrate (180 Å, the force was 2.2 MPa' for 15 minutes. Then, at 100 ° C, the ruthenium mold was released from the polymer. The depressed region was transferred. After the embossing of the gold transfer region, the gold layer from the protruding region of the mold or to the corresponding recessed region or the raised region of the polymer substrate, in particular, the 'gold transfer occurs. The surface area of the first region is greater than the geometric pattern of the moldable mold. It is controlled to be more than 95% of the second region in the relatively large area of the surface area. Then a new printing step is carried out with the remaining gold attached to the crucible mold. The temperature is again heated to the glass transition temperature of the polymer substrate ( 18〇°C), pressure is 2.2MPa' for 9〇 minutes, the precise imprinting time is determined according to geometric pattern and density. The end point of this process cycle is 矽 mold from polymer substrate at 1〇〇<t Lower release film. After imprinting, the remaining gold layer is transferred from the crucible mold to the polymer substrate in the opposite region of the first imprint. The polymer is distinguished from gold by a significantly different reflectance. Optical microscopy can be used to identify whether gold has consistent selective transfer. In optical microscopy images, the 'shell area is represented by gold, and the darker area represents no gold. Energy dispersive X-ray spectral element distribution is also used. (Energy dispersive X~ray spectroscopy elemental; EDS elemental mapping) to confirm the knot obtained from the optical microscope image 201024072. Similarly, 'EDSeleinental mapping can identify special elements' For example, gold, a brighter* area is indicated as covering the gold's darker area representing no gold. Example 1 This example will be described in the method 10 shown in Figure 1, using a 10/zm column (pillar) a pattern (aspect ratio 〇. 5) (shown in Fig. 2) 矽 a 矽 矽 mold. The 矽 mold has an embossed surface comprising the first recessed region 40 and the second raised region 42 coated with gold as described above. The polycarbonate substrate is also treated with a binder promoter as described above. During the first imprinting step, the gold layer in the first recessed region of the Shixi mold is transferred to the polycarbonate substrate. Corresponding ridge region 5〇 (4th and 4b), wherein the gold layer in the ridge region 42 is still maintained on the dies. The corresponding recessed regions 52 on the polycarbonate substrate (Fig. 4b) do not have Gold layer. Referring to Figures 2 and 3, the recessed area 4〇 of the 矽 mold has a surface area greater than the ridge area of the 矽 ®® with a surface area of 42 to promote or facilitate the transfer of the gold layer from the recessed area of the mold to the substrate. The energy dispersive X-ray spectral element distribution (EDS elefflental (4) PP^g) was performed to confirm that the gold was indeed on the substrate. Figure 5 shows a guilloche pattern for the substrate. Figure 6 shows a corresponding scanning electron micrograph (SEM) T to see the presence of gold on the raised areas on the polycarbonate substrate. Subsequently, a second imprinting step as described above is carried out on the substrate. The remaining gold layer on the 49 p + λ field 42 of the second raised region of the Jane mold is transferred to the corresponding recessed region 60 on the second substrate 29 201024072. The raised region 62 on the second substrate does not have a gold layer (Figs. 7a and 7b). Example 2 This example will describe an exemplary method of selectively depositing gold using a 10//m dimple pattern ( The aspect ratio 10) (shown in Figure 8) is the mold. The crucible mold has an imprint forming surface comprising a first raised region 7〇 and a second recessed region 72 coated with gold as described above. As shown in Figures 8 and 9, the first raised region 7 of the crucible mold has a larger surface area than the first recessed region 72 of the mold. The hair mold has a gold layer coating as described above. The polycarbonate substrate is also treated with a adhesion promoter as described above. During the first imprinting step, the gold layer in the first raised region of the crucible is transferred to the corresponding recessed region 8〇 of the polycarbonate substrate (Figs. 1 and 3〇b), and in the recessed region 72 The gold layer remains on the mold (Fig. 9). Thus, the corresponding raised regions 82 (Fig. 1a and 1〇b 10) on the polycarbonate substrate do not have a gold layer. The recessed area 7〇 of the crucible mold has a surface area greater than the raised area 72 of the crucible mold, which facilitates or facilitates the transfer of the gold layer from the raised region 70 of the crucible mold to the substrate. The amount of at is measured by EDS elemental mapping to confirm that the gold is indeed on the substrate. Figure u shows the elemental distribution of the substrate. Figure 12 shows the corresponding scanning electron microscope (SEM). It can be seen that gold is present on the recessed areas 8〇 on the polycarbonate substrate. 30 201024072 Example 3

This embodiment will be described in the 10th/im fence pattern (method of the aspect ratio 1 shown in Fig. 5) (shown on the first page, using the figure 13). The ruthenium mold has an embossed surface, and the first recessed region 90 and the second ridged region are coated with gold as described above. The polycarbonate substrate is also treated with a adhesion promoter as described above. During the first stamping step, the gold layer in the first recessed region 9〇 of the Shixi mold is transferred to the corresponding raised region 100 of the polycarbonate substrate (Figs. 15a and 5b) ffii in the raised region 92<gold layer still Maintained on the mold (Fig. 14), the corresponding recessed H-domain 102 (Figs. 15a and 15b) on the 'polycarbonate substrate' does not have a gold layer. The recessed area 90 of the center of the heart and the i4 figure mold has a surface area larger than that of the raised area of the enamel mold to promote or facilitate the transfer of the gold layer from the recessed area 9 of the dream mold to the substrate. The energy dispersive X-ray spectral element distribution (EDS el(10) 10mapping) was confirmed to confirm that the gold was indeed on the substrate.帛 16_ is shown as the elemental distribution map of the substrate. Figure 17 shows the corresponding scanning electron microscope (SEM). It can be seen that gold is present on the raised areas of the polycarbonate substrate. Subsequently, the second step is carried out on the second substrate as previously described. The remaining gold on the second raised region 92 on the crucible mold is transferred to the corresponding recessed region 200 of the second substrate. The raised region 2〇2 on the second substrate does not have a gold layer (Figs. 18a and 18b). 31 201024072 The method described herein provides a selective deposition of a metal layer on at least a portion of a substrate. Process. Advantageously, the selective deposition of a metal layer onto the substrate in accordance with the method of the present invention can be accomplished without the need for a reticle or rigid hard mask. Beneficially, the method of the invention described herein avoids the use of some amount. The preparation or process 'is a lower cost and consumes less time than the conventional method. The method described herein can simultaneously form embossing on the substrate; on the substrate and/or redundant metal The layer is on the selected area of the imprint on the substrate. More preferably, the method of the invention described herein selectively deposits a metal layer on a non-planar substrate. Beneficially, the molds described herein using the present invention can then be used to imprint an approximately or different substrate. This is because the metal I maintained on the mold during the first-simultaneous imprinting and selective deposition can then be used for simultaneous imprinting and selective deposition on another substrate.

Advantageously, (10) a fuel cell surface plasma spectrometer, an organic electronic component 'microelectromechanical system/nanoelectromechanical system (MEMs/NEMs), a microfluidic device or a plasma device, in accordance with the present invention. While the invention has been described above in terms of several preferred embodiments, the invention is intended to be limited to the scope of the invention. 'Therefore, the scope of protection of the present invention should be regarded as a

The standard is subject to change. & @ I 32 201024072 [Schematic Description of the Drawings] FIG. 1 is a view of a method of selectively depositing a metal layer onto a first substrate and then selectively selecting a metal layer onto a second substrate in accordance with an embodiment of the present invention. Flow chart. Fig. 2 is a scanning electron micrograph showing a boring mold according to an embodiment of the present invention. Fig. 3 is a photomicrograph (magnification: 50X) of the second mold after the first simultaneous imprinting and selective placement of the metal layer onto the first substrate. Figures 4a and 4b show optical micrographs of the first substrate after the first simultaneous imprinting and selective deposition of the metal layer onto the first substrate by the die of Figure 2 (magnification: (a) 5 〇X (b) 5X). Figures 5 and 6 each show the elemental map and the scanning electron microscope image corresponding to the 4a and 4b figures. Figures 7a and 7b show optical micrographs of the second substrate after the first simultaneous compression printing and selective deposition of the metal layer onto the second substrate by the dream mold of Figure 2 (magnification: (a) 50X (b) 5X). Fig. 8 is a view showing a cat-type electron micrograph of a dream mold according to another embodiment of the present invention. Figure 9 is an optical micrograph of the broken mold (magnification magnification: 50X) after the first simultaneous imprinting and selective > metal layer on the first substrate by the mold of Fig. 8. 10a and lb are micrographs of the first substrate after the first simultaneous imprinting and selective deposition of the metal layer onto the first substrate by the tantalum mold of Fig. 8 201024072 micromirror (magnification :(a)50X (b) 5X). Figures 11 and 12 each show the element distribution map and the scanning electron microscope image corresponding to the first 〇a and 〇b diagrams. Fig. 1 3 shows a scanning electron microscope image of a enamel mold according to still another embodiment of the present invention. Fig. 14 is an optical micrograph (magnification magnification: 50X) of the enamel mold after the first simultaneous imprinting and selective deposition of the metal layer onto the first substrate by the 矽 mold of Fig. 13. Figures 15a and 15b are optical micrographs of the first substrate after the first simultaneous imprinting © and the selective deposition of a metal layer onto the first substrate by the Shixi mold of Fig. 13 (magnification: (a) 50X (b) 5X). Figures 16 and 17 each show a corresponding element distribution map and a scanning electron microscope image for the 15a and 15b drawings. Figures 18a and 18b show optical micrographs of the second substrate after the first simultaneous imprinting and selective deposition of the metal layer onto the second substrate by the die of Figure 14 (magnification: (a) 5 〇X (b) 5X). [Description of main component symbols] 12 to 矽 molds 14a, 14b, 14c to first regions 16a, 16b, 16c, 16d~ second regions 18a, 18b, 18c to gold layers 20a, 20b, 20c on the first region, 20d to the second region, the gold layer 34a, 34b, 34c~ the substrate ridges the first region 34 201024072 36a, 36b, 36c, 36d ~ the substrate recessed second region 40 0 ~ recessed region 42 ~ raised region 50 ~ Rising area 5 2~ recessed area 7 0 ~ raised area 72 ~ recessed area

80~ corresponding recessed area 82~ corresponding raised area 90~ recessed area 92~ raised area 100~ corresponding raised area 102~ corresponding recessed area 200~ corresponding recessed area 202~ corresponding raised area

35

Claims (1)

201024072 VII. Patent Application Range: 1. A method of forming an imprint on a substrate having a metal layer thereon' includes the following steps: (a) providing - stamping with a first region and a second region a mold of an imprint f0rming surface, the first region having a larger surface area than the second region and wherein the first region and the second region have a metal coating; and (b) the mold and Contacting a first substrate, forming a stamp on the first substrate, wherein the conditions for forming the stamp are selected such that the metal coating on the first region of the mold is substantially transferred to the The stamp is formed and the metal coating on the second region remains substantially on the mold. 2. The method of forming an imprint on a substrate having a metal layer thereon as described in the scope of claim 2, wherein the imprint is substantially an elongate imprint having a longitudinal axis a proximal end adjacent to the substrate and a distal end opposite the proximal end. 3. A method of forming an imprint on a substrate having a metal layer thereon as described in claim 2, wherein a metal coating system transferred from the first region of the mold is deposited at the imprinting distance end. 4. A method of forming an imprint on a substrate having a metal layer thereon as described in claim 2, wherein a metal coating system transferred from the first region of the mold is deposited on the imprint On the side wall between the distal end and the proximal end. 5. The method of forming an imprint on a substrate having a layer of metal 36 201024072 as described in any one of the claims of claim 4, after step (b), further comprising: (C) The mold is in contact with a second substrate to form an imprint on the second substrate to transfer metal on the second region to the stamp formed on the second substrate. 6. The method of forming an imprint on a substrate having a metal layer thereon according to any one of claims 1-4, comprising providing an adhesive layer before the φ of the step (b) On the substrate. 7. The method of forming an imprint on a substrate having a metal layer thereon according to any one of claims 1 to 6, wherein the first substrate and the first substrate are a thermoplastic polymer. . 8. The method of forming an imprint on a substrate having a metal layer thereon according to claim 7, wherein the thermoplastic polymer comprises a monomer selected from the group consisting of: acrylate (acry 1 es ), phthalamides, acrylonitriles, cellulosics, styrenes, alkyls, alkyl acrylates (aikyl) Methacrylates), rares (alkenes), ι|halogenated alkenes, amides, imides, aryletherketones, butadienes, ketones Ketones), esters, acetals (ace1; als), carbonates, and mixtures of the foregoing monomers. 9. The method of forming an imprint on a substrate having a metal layer thereon according to any one of claims 7 or 8 of the invention, which is included in the steps (b) and 37 201024072 (C) The temperature is controlled to exceed the glass temperature of the thermoplastic polymer. 10. The method of forming a money on a substrate having a metal layer as described in claim 9, wherein during the step (1) 卩 (C), the temperature exceeds at least the thermoplastic polymer. Broken glass transfer 20 ° C or more. also The method of forming a stamp on a substrate having a metal layer as described in any one of claims 5 to 10, comprising the step of controlling the pressure during the steps (匕) and (c). — (between 1 heart) and 5〇^ (5 MPa). 12. The method of forming a waste print on a substrate having a gold layer: any of the above-mentioned patents, wherein the control time period is 5 during the steps (b) and (c). Minutes to i2q minutes. 13. The method of forming an imprint on a substrate having a metal layer thereon according to any one of claims 12, comprising at least one selected from Groups IB and IIIA of the Periodic Table of the Elements. The metal of the layer. 14. The method of forming an imprint on a substrate having gold s as described in any one of the claims of claim 13, comprising selecting a surface area of the first region on the imprint forming surface to be larger than the first The method of forming an imprint on a substrate having a metal layer thereon as described in any one of claims 6 to 14 includes selecting a decane compound as the adhesive layer. 16. An embossed substrate having a micron or nanometer size 38 201024072 printed integrally formed on a portion of the surface of the substrate. And having a metal layer deposited on at least the π-type substrate, having an array of micron-sized or nano-sized embossed extensions from the substrate, the substrate comprising an array of-barrier forms for embossing adjacent The intervening step 捭, the embossing or the grooves are covered by a __ ... 18. The substrate of any one of claims 16-17, wherein the metal layer of the crucible covers only the one of the embossments or the grooves. The substrate of any one of claims 16-17, wherein each of the stamps is covered by a separate metal layer, and the trenches are not covered by the metal layer. The substrate of any one of claims 16-17, wherein an adhesive layer is disposed between the embossing and the metal layer. The substrate of any one of claims 16-17, wherein each of the grooves is covered by an independent metal layer, and the embossing is not covered by the metal layer. 22. The substrate of any of claims 16-17, wherein an adhesive layer is disposed between the bottom of the trench and the metal layer. 23. The substrate of any of claims 16-17, wherein the embossing comprises a plurality of grooves, barriers, studs, and circular holes. 24. The substrate of claim 23, wherein the trenches, grids, strips, and circular holes are each sized in a micron size or a nanometer size. 25. The substrate according to claim 16-24 wherein the base 39 201024072 is a thermoplastic polymer. 26. The substrate of claim 25, wherein the thermoplastic polymer is a polycarbonate. 27. The substrate of claim 16, wherein the metal of the metal layer is selected from the group IB and the genus of the periodic table of the elements at least - 〇 28. as claimed in claim 27 The substrate, wherein the metal is selected from the group consisting of aluminum, copper, gold, silver, and the combination of the foregoing. 29. The substrate of claim 2, wherein the adhesion is The layer is a film layer comprising a decane compound. 30. The substrate of claim 17, wherein the barrier has a grating constant of from 100 nm to 1 〇〇〇 nm. 31. The substrate of claim 30, wherein the barrier is about 10 nm to 1 〇〇 nm high. The substrate according to any one of the preceding claims, wherein the fence has a shape which, when viewed from a different angle, is shaped to be free from the following group: sinusoidal wavy, The squares are wavy, trapezoidal, blazed and angular. An application of a substrate according to any one of claims 16 to 32 for use in a fuel cell, a surface plasma spectrometer, an organic electronic component, a microelectromechanical system/nano electromechanical system (MEMs/NEMs) ), a microfluidic device or a plasma device. 34. A substrate as claimed in any one of claims 16 to 32, wherein the substrate is manufactured by the patent claims 1 to i. 35— A sensing wafer having a substrate body, an extended array of micron-sized or nano-sized imprints, and adjacent adjacent stamping spaces forming trenches, one of which reflects the metal or the trenches. 36. A surface plasma resonance system comprising: a light source; a sensory light detector as described in claim 35, for receiving light reflected by the sensing wafer; and an optical amplitude modulation The optical modulator is lighted onto the sensing wafer. Any one of the above-described substrates comprising the substrate and arranged to cover the embossed J wafers at the layer, the reflective metal layer for guiding modulation 41