TW201021301A

TW201021301A - Memory card socket

Info

Publication number: TW201021301A
Application number: TW98127001A
Authority: TW
Inventors: Tomonori Tanaka; Nobuhiko Kimura; Hidetoshi Takeyama; Tsunehiro Anzai
Original assignee: Panasonic Elec Works Co Ltd
Priority date: 2008-08-12
Filing date: 2009-08-11
Publication date: 2010-06-01

Abstract

A memory card socket (10) is provided with common contact shoes (C1-C9) with which common terminals (P1-P9) of a first or a second memory card (MC1, MC2) make contact, and also with dedicated contact shoes (C10-C13) with which dedicated terminals (P10-P13) of the second memory card (MC2) make contact. The dedicated contact shoes (C10-C13) are provided with contact preventing sections (713) for preventing contact between common terminals (P3, P6) and contact sections (712) with which the dedicated terminals (P10-P13) make contact. When the first memory card (MC1) is mounted in the memory card socket, the contact preventing sections (713) make contact with a partition (1060) of the first memory card (MC1) to deform the dedicated contact shoes (C10-C13), separating the dedicated contact shoes (C10-C13) from the common terminals (P3, P6). When the second memory card (MC2) is mounted in the memory card socket, the contact preventing sections (713) are located in cutouts (1200) formed in the partition (1060) of the second memory card (MC2), and this causes the dedicated contact shoes (C10-C13) to make contact with the dedicated terminals (P10-P13).

Description

201021301 六、發明說明：【發明所屬之技術領域】本發明係有關於一種記憶卡插座，尤其是有關於一種對應記憶卡.（SD 記憶卡（Secure Digital Memory Card，安全數位記憶卡）或多媒體記憶卡（Multimedia Card ))之記憶卡插座。【先前技術】先前以來’作為小型且大容量之記憶卡，有SD記憶卡及多媒體記憶卡（MMC )。例如’於曰本公開專利公報2〇〇4 7丨丨75及日本公開專利公報2〇〇3-249290中，揭示有一種SD記憶卡用之記憶卡插座。於使用SD記憶卡時，係將SD記憶卡安插於電子機器所搭載之記憶卡插座中。201021301 VI. Description of the Invention: [Technical Field] The present invention relates to a memory card socket, and more particularly to a corresponding memory card (SD memory card (Secure Digital Memory Card) or multimedia memory) Card (Multimedia Card) memory card socket. [Prior Art] As a small and large-capacity memory card, there have been SD memory cards and multimedia memory cards (MMC). A memory card socket for an SD memory card is disclosed in, for example, Japanese Laid-Open Patent Publication No. 4-775, and Japanese Laid-Open Patent Publication No. Hei-3-249290. When using an SD memory card, insert the SD memory card into the memory card socket of the electronic device.

SD δ己憶卡，多作為例如數位相機（以呂丨^1 )或數位攝㈣（digital vide。eamefa )等影像記錄機器（電子機器）之記憶媒體而使用。近年來_隨影像記錄機器之高精細度化，儲存於記 2體中的内容不斷大容量化。因此，於先前記憶卡的資料傳輸速率下，大外部機器之㈣心量貝料之即時記錄或向電腦等機器之傳輪，需耗費相對較長的時間。的提出有一種使資料傳輸速率變得更快之次世代、§隱卡（以下，稱為高速型記憶外高速型記憶卡， 3 201021301 包含與先前之SD記憶卡（以下，稱為先前型記憶卡）相同的端子（共通端子），以與先前型記憶卡具有互換性除此以外’南速型s己憶卡還包含用於較先前更高速地進行資料傳輸的端子（專用端子）。於先前型記憶卡的頂端面（前端面）的寬度方向的一 - 端，形成有錐形面。另一方面，高速型記憶卡的頂端面的 ] 宽度方向的一端’亦形成與先前型記憶卡相同的錐形面， φ 但局速型記憶卡的錐形面形成有段差。可對應先前型記憶卡與高速型記憶卡兩者的記憶卡插座，包括對應於共通端子之接觸子（共通接觸子）、及對應於專用端子之接觸子（專用接觸子）。此處，當將高速型記憶卡安插於記憶卡插座中時，若專用接觸子接觸高速型記憶卡的共通端子，則存在無法獲得如規定般之資料傳輸速率的情形。因此，對於雙對應之記憶卡插座，於安插高速型記憶卡時’必須使專用接觸子不會接觸高速型記憶卡的共通端子。，因此，上述記憶卡插座中，係利用高速型記憶卡的錐形面的段差，來區分高速型記憶卡與先前型記憶卡。例如，提出有一種利用高速型記憶卡的錐形面的段差，而使先前型記憶卡與高速型記憶卡之插入位置不同之機構。然而’上述機構之結構相對複雜，導致記憶卡插座高成本化及大型化。又考慮於6己憶卡插座中附加辨識記憶卡的種類之辨 4 201021301 識裝置。此時，係於搭載記憶卡插座之電子機器中設置切換裝置。切換裝置係構成為根據辨識裝置中之辨識結果而將專用接觸子自電子機器電性切離。然而，此時必需在使用記憶卡插座時對電子機器附加切換裝置。【發明内容】The SD δ recall card is often used as a memory medium of a video recording device (electronic device) such as a digital camera (in the case of Lv丨^1) or a digital camera (e). In recent years, with the high definition of the image recording machine, the content stored in the body has been increasing in capacity. Therefore, at the data transfer rate of the previous memory card, it takes a relatively long time for the external external machine to record the instantaneous amount of material or the transfer to a computer or the like. There is a generation that makes the data transfer rate faster, § hidden card (hereinafter, referred to as high-speed memory high-speed memory card, 3 201021301 contains the previous SD memory card (hereinafter, referred to as the prior type memory) Card) The same terminal (common terminal) for compatibility with the previous type of memory card. In addition, the 'Southern Speed Type' card also contains terminals (dedicated terminals) for data transmission at a higher speed than before. The one end of the width direction of the top end face (front end face) of the previous type memory card is formed with a tapered surface. On the other hand, the end of the top end of the high speed type memory card is formed with the previous type memory card. The same tapered surface, φ but the tapered surface of the local speed type memory card is formed with a step difference. The memory card socket corresponding to both the previous type memory card and the high speed type memory card, including the contact corresponding to the common terminal (common contact) Sub) and the contact (specific contact) corresponding to the dedicated terminal. Here, when the high-speed type memory card is inserted in the memory card socket, if the dedicated contact is in contact with the high-speed type memory For the common terminal, there is a case where the data transfer rate is not as specified. Therefore, for the dual-corresponding memory card socket, when inserting the high-speed type memory card, the special contact must not be in contact with the high-speed memory card. Therefore, in the above memory card socket, the high-speed type memory card and the previous type memory card are distinguished by the step difference of the tapered surface of the high-speed type memory card. For example, a tapered surface using a high-speed type memory card is proposed. The difference between the previous type memory card and the high-speed type memory card is different. However, the structure of the above-mentioned mechanism is relatively complicated, resulting in high cost and large size of the memory card socket. Also considered in the 6-remember card socket Identification of the type of additional identification memory card 4 201021301 Identification device. At this time, a switching device is provided in an electronic device equipped with a memory card socket. The switching device is configured to apply a dedicated contact to the electronic device according to the identification result in the identification device. Electrically cut off. However, it is necessary to add a switching device to the electronic device when using the memory card socket. Ming content]

V V 本發明係有鑒於上述緣由而完成。本發明之目的在於 ❹提供一種記憶卡插座，其能利用簡單的構成而根據記憶卡的種類使接觸子適宜地接觸記憶卡的端子。本發明之記憶卡插座中，可安插記憶卡，該記憶卡具備卡片形狀之本體、及於上述本體的厚度方向的一面的長度方向的一端沿寬度方向排列之複數個端子◊該記憶卡插座具備：插座本體，其具有卡片槽，將通過上述卡片槽而插入之上述記憶卡保持於規定之插入位置；及接觸子其係設於上述插座本體，與保持於上述插入位置之上述記憶 ® 卡的上述端子接觸。上述記憶卡，有第1記憶卡及第2記 ί 憶卡。上述端子’有共通地設於上述第1記憶卡與上述第 2記憶卡的共通端子、及僅設於上述第2記憶卡的專用端子。於上述本體中形成有將上述端子間隔開之間隔壁。於上述第2記憶卡的上述間隔壁的上述長度方向的一端，形成有切口。上述接觸子’有與上述共通端子接觸用之共通接觸子、及與上述專用端子接觸用之專用接觸子。上述專用接觸子’具備要接觸上述專用端子之接觸部、及防止上 5 201021301 述接觸部接觸上述共通端子邱^ 之接觸防止部。上述接觸防止部，係構成為：當將上 ni ^ 礼罘1 δ己憶卡保持於上述插入位置時’其利用觸抵上述第1兮愔丰己隐卡的上述間隔壁而使上述專用接觸子變形，從而使上过·專用接觸子遠離上述共通端又’上述接觸防止部，择播士、故.Α 、係構成為.當將上述第2記憶 " 上述插入位置時’其利用位於上述第2記憶卡的《上述間隔壁上所形成之上述切口内，而使上述專用接觸子 ❹不變形’從而使上述專用接觸子接觸上述專用端子。若根據本發明，當安插上述第2記憶卡時，藉由形成於上述間隔壁之上述切口而避免上述接觸防止部與上述間隔壁接觸，從而使上述專用接觸子之上述接觸部接觸上述專用端子。當安插上述第1記憶卡時，藉由使上述接觸防止部觸抵上述間隔壁而使上述專用接觸子變形從而使上述專用接觸子遠離上述共通端子。因此，上述切口’而改變上述專用接觸子與上述共通端子= 癱狀態。因此，可根據上述記憶卡之種類而使上述接觸子適 ί 宜地接觸上述記憶卡的上述端子。較佳為上述切口係形成於位於上述專用端子旁之上述間隔壁上。上述專用接觸子，具備突出部，其係自與保持於上述插入位置之上述記憶卡的長度方向的一端侧的側面相向之上述插座本體的内面，朝向保持於上述插入位置之上述記憶卡的長度方向的另一端側突出。上述接觸部係設置於上述突出部的頂端。上述接觸防止部，於上述突出部的後端，與上述突出部連結成一體。 6 201021301 若根據該構成’可不考慮上述接觸防止部而單獨地設計決定上述接觸部接觸上述端子時之接觸壓力的上述突出部之彈性模數。藉此，接觸壓力之設計變得容易。 s或者，上述切口形成於位於上述專用端子旁之上述間。上述專用接觸子，具備突出部，其係自與保持於 /入位置之上述記憶卡的長度方向的一端側的側面相 β之上述插座本體的内面，朝向保持於上述插人位置之上述記憶卡的長度方向的另一端侧突出。上述接觸部係設置 ;述突出的頂端。上述接觸防止部於上述接觸部的頂端’與上述接觸部連結成一體。若根據該構成，由於上述接觸防止部，於上述接觸部的頂端，與上述接觸部連結成一體，故而上述接觸部容易與上述接觸防止部一起移動。藉此，安插上述第i記憶卡時，可使上述接觸部確實地遠離上述共通端子。 w 麟 λ 或者’上述切口形成於位於上述專用端子旁之上述間隔壁上。上述專用接觸子，具備突出部，其係自與保持於上述插入位置之上述記憶卡的長度方向的一端側的側面相向之上述插座本體的内面，朝向保持於上述插入位置之上述記憶卡的長度方向的另一端側突出。上述接觸防止部，係形成為自上述突出部的頂端’在與保持於上述插入位置之上述記憶卡的上述一面平行之面内’沿與上述記憶卡的長度方向交叉之交又方向突出。上述接觸部，係形成為自 ^述接觸防止部的頂端，朝向保持於上述插入位置之上述記憶卡的長度方向的另一端侧突出。 7 201021301 若根據該構成’安插上述第！記憶卡時可使上述接觸部確實地遠離上述共通端子。或者，上述切口形成於位於上述專用端子旁之上述間㈣上°上述專用㈣子’具備突出部’其係自與保持於上述插入位置之上述記憶卡的長度方向的一端側的側面相向之上述插座本體的内面’朝向保持於上述插入位置之上述記憶卡的長度方向的另—額突I上述接觸防止部，係形成為自上述突出部的頂端，在與保持於上述插入位置之上述記憶卡的上述—面平行之面内，沿與上述記憶卡的長度方向交叉之交叉方向突出。上述接觸部，係形成為自上述接觸防止部的頂端，沿上述交又方向突出。若根據該構成，安插上述第！記憶卡時，可使上述接觸部確實地遠離上述共通端子。x，可使上述接觸防止部及上述接觸部於保持於上述插人位置之上述記憶卡之長度方向上相距上述插座本體之上述内面的距離一致。藉此，可使上述突出部之長度相對較長，故而可防止在安插上述第1 §己憶卡時上述專用接觸子產生塑性變形。或者，上述專用接觸子具備突出部，其係自與保持於上述插入纟置之上述記憶卡的寬度方向的側面相向之上述插座本體的内側面，在與保持於上述插入位置之上述記憶卡的上述一面平行之面内，沿與上述記憶卡的長度方向^ 叉之交又方向突出。上述接觸防止部，係形成為自上述突出部的頂端沿上述交又方向突出。上述接觸部，自上述接觸防止部的頂端沿上述交叉方向突出係形成為。上述切 8 201021301 係形成於.當保持於上述插入位置時，於厚度方向上與上述接觸防止部重疊之上述間隔壁上。右根據該構成，由於上述接觸防止部係位於上述突出部與上述接觸部之間，故而當安插上述第1記憶卡時，可使上述接觸部確實地遠離上述共通端子。又，可不對保持、’上述插入位置之上述記憶卡的長度方向的一端側的側丨面、與和該側面相向之上述插座本體之内面的距離加以考慮地設定上述突出部的長度。亦即，即便 •可將;上述突出部的長度設為較長，故而可防止在安;= 第1記憶卡時，上述專用接觸子產生塑性變形。本發明之另一記憶卡插座，可安插記憶卡，該記憶卡具備卡片形狀之本體、及於上述本體的厚度方向的一面的長度方向的一端沿寬度方向排列之複數個端子。該記憶卡插座，具備：插座本體，其具有卡片槽，將通過上述卡片槽而插入之上述記憶卡保持於規定之插入位置；接觸子， •其係設於上述插座本體，與保持於上述插入位置之上述記 ;憶卡的上述端子接觸；及接觸防止機構。上述記憶卡，有第1記憶卡及第2記憶卡。上述端子，有共通地設於上述第1記憶卡與上述第2記憶卡的共通端子、及僅設於上述第2記憶卡的專用端子。於上述第1記憶卡的上述本體，形成有在其底面配置有上述共通端子之第丨凹部。於上述第2記憶卡的上述本體，形成有在其底面配置有上述共通端子及上述專用端子之第2凹部。各上述凹部的上述長度方向的一端側的面開放》上述第2凹部的上述長度方向的 9 201021301 另一端側的面，位於較上述第1凹部的上述長度方向的另一端側的面更偏向上述長度方 A衣:度万向的另一端側。上述接觸子，有與上述共通端子接觸用之共通接觸子、及與上述用端子接觸用之專用接觸子。卜、+，姐雄、心寻用接觸子。上述接觸防止機構，係構成為田將上述第1兄憶卡保持於上述插入位置時，其觸抵上述第1凹部的上述長度方向的另一端側的面而被自上述第1凹部内推出至上述第J凹部外，藉此使上述專用接觸 >子變形’從而使上述專用接觸子遠離上述第1凹部内之上述共通端子。又，上述接觸防止機構，係構成為：當將上述第2記憶卡保持於上述插入位置時，其不觸抵上述第2 凹部的上述長度方向的另一端侧的面而位於上述第2凹部内，藉此使上述專用接鋪寻用接觸子不變形，從而使上述專用接觸子接觸上述第2凹部内之上述專用端子。若根據本發明，其可支持上述第1及上述第2記憶卡兩者並且可防止當安插上述第2記憶卡時訊號傳輸特性惡化。藉此’可根據上述記憶卡之種類而使接觸子適宜地接觸上述記憶卡之端子。較佳為上述插座本體具備保持上述專用接觸子之保持具。上述料具，位於較保持於上述插人位置之上述記憶卡之上述端子更偏向上述卡片槽側。上述專用接觸子，具備自上述保持具朝保持於上述插人位置之上述記憶卡的長度方向的-端側突出之突出部、及設於上述突出部的頂端而用於接觸上述專用端子之接觸部。上述接觸防止機構，係設於上述專用接觸子的上述突出部。 201021301 若根據該構成’可僅於上述專用接觸子設置上述接觸防止機構，故而可抑制製造成本，且可以簡單之結構實現本發明之記憶卡插座。更佳為上述專用接觸子，具備與外部之基板電性連接之連接部。上述連接部，係形成為：自上述插座本體的外 . 面，在與保持於上述插入位置之上述記憶卡的上述一面平行之面内’沿與長度方向交叉之交又方向突出。 ❹ 右根據該構成，可容易地使用反轉安裝方式將本發明之記憶卡插座安裝於基板上。又，較佳為本發明之記憶卡插座具備：複數個上述專用接觸子，這些接觸子係沿保持於上述插入位置之上述記憶卡的寬度方向排列；及連結件，將鄰接之上述專用接觸子彼此以相互絕緣之狀態而連結。上述連結件係配置於上述突出部。若根據該構成，由於鄰接之上述專用接觸子彼此由上參述連結件連結’故而可使鄰接之上述專用接觸子同時接 ;觸、離開對應之專用端子。x，可藉由上述連結件而抑制將上述記憶卡插入至上述插座本體中時上述專用接觸子之振動。因此，可防止由於如此之振動而導致上述專用接觸子誤接觸其他上述接觸子或上述端子。更佳為將上述接觸防止機構設於上述連結件。若根據該構成，可無須於上述專用接觸子本身設置上述接觸防止機構，故而可使上述專用接觸子的形狀較為簡單，可抑制製造成本之增加。 11 201021301 更佳為上述接觸防止機構，具備卡片接觸部其與保持於上述插入位置之上述第“己憶卡之上述本體接觸。上述卡片接觸部，係相對於沿保持於上述插入位置之上述記憶卡的長度方向通過鄰接之上述專用接觸子間之中心的中心線’呈線對稱之形狀。 ‘ 絲據該構成，當對上述插座本體拔插上述記憶卡 •時，上述接觸防止機構不會斜向傾斜。因此，可提高由上 ❹述連結件連結之上述專用接觸子間之同步精度。更佳為將上述連結件配置於較上述接觸防止機構更偏向上述接觸部側。若根據該構成，可更有效地抑制上述專用接觸子之振動》又，於上述本發明之另一記憶卡插座中上述接觸防止機構係設於上述插座本體中。若根據該構成，可根據上述記憶卡之種類而使接觸子 ®適宜地接觸上述記憶卡之端子。，办較佳為上述接觸防止機構，具備··由彈性材料製造之犬出邛、及設於上述突出部的頂端而按壓上述專用接觸子之按壓部。上述突出部，係形成為：於上述插座本體中，自較保持於上述插人位置之上述記憶卡的上述端子更偏向上述卡片槽側的部位，朝保持於上述插入位置之上述記憶卡的長度方向一端侧突出。若根據該構成，可使上述接觸防止機構的結構較為簡單，可抑制製造成本之增加。 12 201021301 更佳為上述突出部係與上述插座本體形成為一體。若根據該構成，可削減零件個數及裝配工時故而可抑制製造成本之增加。更佳為本發明之記憶卡插座，具備複數個上述專用接觸子，這#•接觸子係沿保持於上述插入位置之上述記憶卡 •的寬度方向排列。上述按壓部係構成為同時按壓至少：個上述專用接觸子。尊 ❿ 若根據該構成，可使複數個上述專用接觸子同時接觸、離開對應之上述專用端子。【實施方式】以下之各實施形態中，例示可支持先前型記憶卡（第^ 記憶卡）與高速型記憶卡（第2記憶卡）兩者之記憶卡插座。再者，本發明之記憶卡插座，亦可用作SD記憶卡以外之記憶卡（例如多媒體記憶卡）用之記憶卡插座、或與 ^ SD圮憶卡具有相同大小及端子排列的SDI〇 (以⑶代 - Dlgital Input/Output)卡用之卡片插座。 (實施形態1 ) 如第1、2圖所示’本實施形態之記憶卡插座1〇,包括：扁平的矩形箱狀之插座本體20、及接觸子（c〇ntact) C1〜 C13。插座本體20包含卡片槽21’且將通過卡片槽21而插入之記憶卡MC保持於規定之插入位置。接觸子ci〜 C13’係設於插座本體20中，分別與保持於上述插入位置 13 201021301 之記憶卡MC的端子（contact pad，接觸墊）pi〜pl3接觸。第3圖〜第5圖係表示記憶卡mc。以下之說明中，為了根據必需而區分第1記憶卡與第2記憶卡，而視情況將第1記憶卡用符號MCI來表示，將第2記憶卡用符號Mc2 來表示。 ‘ 第3圖係表示第1記憶卡MCI。第i記憶卡MC1包括 •本體1000，其係使用例如樹脂材料而形成為卡片形狀（矩 φ 形板狀）。在本體1000中，内置有快閃記憶體 (flash-memory)等非揮發性記憶元件（未圖示以下，將第3圖（a)的上下方向設為第i記憶卡M(M(本體ι〇〇〇) 的長度方向’將第3圖（a)的左右方向設為第丨記億卡 MCM的寬度方向，將第3圖（b)的左右方向設為第i記憶卡MCI的厚度方向。於本體麵的厚度方向的—面（背面）的長度方向的 φ 一端（前端），形成有複數個（圖示例中為8個）矩形之凹部（塾片用凹部）1100(1101〜11〇8)。凹部ιι〇ι〜·，係沿本體觸的寬度方向排列。各凹部li〇i〜謂的長度方向的-端（前端）開放。亦即，各凹部刚於前端具備開放端，接之凹部1101〜1108間之間隔壁(肋) 職（腕〜膽)’係形成為沿本體1000的長度方向之帶狀。該間隔壁削〜聊係於將記憶卡Mc安插於記憶卡插座H)中時，防止接觸子C1〜C13彼此接觸。於本體麵的背面的前端，設有複數個（圖㈣中為 9幻端子⑽接觸面）P1〜P9。於各凹部u〇i〜膽 14 201021301 的底面，設置各端子P1〜P7 ^於凹部1108的底面，設置有兩個端子Ρ8、Ρ9。端子Ρ1〜Ρ9係沿本體1000的寬度方向排列。第1記憶卡MC1，係自前端插入至記憶卡插座中（第 1記憶卡MCI的前方向成為向記憶卡插座中插入之方向）。 * 於本體1000的寬度方向的兩側（左右兩側）形成有突，部1010。於本體1000的前端面的寬度方向的一端側（第3 _ 圖（a)中左端側）的角部’形成有斜向傾斜之切口 1〇2〇〇藉此，於第1 s己憶卡MC1的前端面的寬度方向的一端形成錐形面。又，於本體1000的寬度方向的一端側的側面（第3圖 (a)中的左側面），形成有卡合記憶卡插座1〇的卡合爪 43之卡合部！請。於本體⑽的寬度方向的另一端側的側面（第3圖（a)中的右側面）形成有凹陷冑1〇4〇。在凹V V The present invention has been made in view of the above reasons. SUMMARY OF THE INVENTION An object of the present invention is to provide a memory card socket which can appropriately contact a contact of a memory card with a simple configuration depending on the type of the memory card. In the memory card socket of the present invention, the memory card is provided with a card-shaped body and a plurality of terminals arranged in the width direction at one end in the longitudinal direction of one surface in the thickness direction of the main body. a socket body having a card slot for holding the memory card inserted through the card slot in a predetermined insertion position; and a contact portion attached to the socket body and the memory card held in the insertion position The above terminals are in contact. The above memory card has a first memory card and a second memory card. The terminal '' is commonly provided to a common terminal of the first memory card and the second memory card, and a dedicated terminal provided only to the second memory card. A partition wall that partitions the terminals is formed in the body. A slit is formed in one end of the partition wall of the second memory card in the longitudinal direction. The contact sub- has a common contact for contact with the common terminal and a dedicated contact for contact with the dedicated terminal. The above-mentioned dedicated contact member has a contact portion to be in contact with the dedicated terminal, and a contact preventing portion for preventing the contact portion of the upper portion of the contact portion from contacting the common terminal. The contact preventing portion is configured to: when the upper ni ^ 罘 1 δ 己忆 card is held at the insertion position, the special contact is made by touching the partition wall of the first 兮愔己隐隐The sub-deformation is such that the upper-only dedicated contact is away from the common end and the above-mentioned contact preventing portion, and the selected player, the 播, 系, is configured to be used when the second memory " In the second memory card, "the inside of the slit formed in the partition wall is formed so that the dedicated contact pin is not deformed", so that the dedicated contact is in contact with the dedicated terminal. According to the present invention, when the second memory card is inserted, the contact preventing portion is prevented from coming into contact with the partition by the slit formed in the partition wall, so that the contact portion of the dedicated contact contacts the dedicated terminal. . When the first memory card is inserted, the dedicated contact is deformed by bringing the contact preventing portion into contact with the partition to move the dedicated contact away from the common terminal. Therefore, the above-described slit ′ changes the state of the dedicated contact and the common terminal = 瘫 state. Therefore, the above-mentioned contacts can be appropriately brought into contact with the above-mentioned terminals of the above-mentioned memory card in accordance with the kind of the above-mentioned memory card. Preferably, the slit is formed on the partition wall beside the dedicated terminal. The dedicated contact member includes a protruding portion that faces the inner surface of the socket body facing the side surface on one end side in the longitudinal direction of the memory card held at the insertion position, and faces the length of the memory card held at the insertion position The other end side of the direction protrudes. The contact portion is provided at a top end of the protruding portion. The contact preventing portion is integrally coupled to the protruding portion at a rear end of the protruding portion. According to the configuration, the elastic modulus of the protruding portion that determines the contact pressure at which the contact portion contacts the terminal can be individually designed irrespective of the contact preventing portion. Thereby, the design of the contact pressure becomes easy. s Alternatively, the slit is formed between the above-mentioned dedicated terminals. The dedicated contact member includes a protruding portion that faces the memory card held in the insertion position from an inner surface of the socket body that is opposite to a side surface on one end side in a longitudinal direction of the memory card held at the in-position position. The other end side of the length direction protrudes. The above contact portion is provided; the protruding top end is described. The contact preventing portion is integrally coupled to the contact portion at a distal end portion of the contact portion. According to this configuration, since the contact preventing portion is integrally coupled to the contact portion at the distal end of the contact portion, the contact portion is likely to move together with the contact preventing portion. Thereby, when the ith memory card is inserted, the contact portion can be surely moved away from the common terminal. w Lin λ or 'The above slit is formed on the above-mentioned partition wall beside the dedicated terminal. The dedicated contact member includes a protruding portion that faces the inner surface of the socket body facing the side surface on one end side in the longitudinal direction of the memory card held at the insertion position, and faces the length of the memory card held at the insertion position The other end side of the direction protrudes. The contact preventing portion is formed so as to protrude from the distal end of the protruding portion in a direction parallel to the longitudinal direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. The contact portion is formed so as to protrude from the tip end of the contact preventing portion toward the other end side in the longitudinal direction of the memory card held at the insertion position. 7 201021301 According to this structure, insert the above! The memory card can make the contact portion surely away from the common terminal. Alternatively, the slit is formed in the middle portion (four) located beside the dedicated terminal, and the dedicated (four) sub-'providing projection portion' is formed from the side surface on the one end side in the longitudinal direction of the memory card held at the insertion position. The inner surface of the socket main body is oriented toward the longitudinal direction of the memory card held at the insertion position, and the contact preventing portion is formed from the top end of the protruding portion and the memory card held at the insertion position The plane parallel to the surface protrudes in a direction intersecting the longitudinal direction of the memory card. The contact portion is formed to protrude from the distal end of the contact preventing portion in the direction of the intersection. According to this configuration, the above paragraph is inserted! In the case of the memory card, the contact portion can be surely moved away from the common terminal. x is such that the contact preventing portion and the contact portion are spaced apart from each other by the distance from the inner surface of the socket main body in the longitudinal direction of the memory card held at the insertion position. Thereby, the length of the protruding portion can be made relatively long, so that the plastic contact of the dedicated contact member can be prevented from being generated when the first memory card is inserted. Alternatively, the dedicated contact member includes a protruding portion that is opposed to the inner side surface of the socket body that faces the side surface in the width direction of the memory card of the insertion device, and the memory card that is held at the insertion position The surface parallel to the one side protrudes in a direction perpendicular to the longitudinal direction of the memory card. The contact preventing portion is formed to protrude from the distal end of the protruding portion in the horizontal direction. The contact portion is formed to protrude from the distal end of the contact preventing portion in the intersecting direction. The above-described cutting 8 201021301 is formed on the partition wall which overlaps with the contact preventing portion in the thickness direction when held at the insertion position. According to this configuration, since the contact preventing portion is located between the protruding portion and the contact portion, when the first memory card is inserted, the contact portion can be surely moved away from the common terminal. Further, the length of the protruding portion can be set in consideration of the distance between the side surface of the one end side in the longitudinal direction of the memory card at the insertion position and the inner surface of the socket body facing the side surface. That is, even if the length of the protruding portion is long, it is possible to prevent plastic deformation of the dedicated contact by the first memory card. In another memory card socket of the present invention, a memory card having a card-shaped body and a plurality of terminals arranged in the width direction at one end in the longitudinal direction of one surface in the thickness direction of the main body can be inserted. The memory card socket includes: a socket body having a card slot for holding the memory card inserted through the card slot at a predetermined insertion position; and a contact member, which is attached to the socket body and held in the insertion The above-mentioned position of the position; the above-mentioned terminal contact of the card; and the contact preventing mechanism. The above memory card has a first memory card and a second memory card. The terminal is provided in common between the first memory card and the second memory card, and a dedicated terminal provided only on the second memory card. In the main body of the first memory card, a second recessed portion in which the common terminal is disposed on a bottom surface thereof is formed. In the main body of the second memory card, a second recessed portion in which the common terminal and the dedicated terminal are disposed on a bottom surface thereof is formed. The surface of the one end side in the longitudinal direction of each of the recessed portions is open, and the surface of the other end side of the second recessed portion in the longitudinal direction is located on the other end side of the first recessed portion in the longitudinal direction. Length A clothing: the other end side of the universal direction. The contact has a common contact for contact with the common terminal and a dedicated contact for contact with the terminal. Bu, +, sister Xiong, heart use contact. The contact preventing mechanism is configured such that when the first brother card is held at the insertion position, the contact is pushed out from the first recess to the surface of the first recess in the longitudinal direction. The dedicated contact > sub-deformation is performed outside the J-th recess to move the dedicated contact away from the common terminal in the first recess. Further, the contact preventing mechanism is configured such that when the second memory card is held at the insertion position, it is located in the second recess without contacting the other end side surface of the second recess in the longitudinal direction. Thereby, the dedicated contact-seeking contact is not deformed, and the dedicated contact is brought into contact with the dedicated terminal in the second recess. According to the present invention, it is possible to support both of the first and second memory cards described above and to prevent deterioration of signal transmission characteristics when the second memory card is inserted. Thereby, the contact can be appropriately brought into contact with the terminal of the above-mentioned memory card in accordance with the type of the above-mentioned memory card. Preferably, the socket body is provided with a holder for holding the dedicated contact. In the above-mentioned material, the terminal of the memory card which is held at the insertion position is more biased toward the card slot side. The dedicated contact member includes a protruding portion that protrudes from the holder toward the end side in the longitudinal direction of the memory card that is held at the insertion position, and a contact portion that is provided at a tip end of the protruding portion for contacting the dedicated terminal. unit. The contact preventing mechanism is provided in the protruding portion of the dedicated contact. According to this configuration, the contact preventing mechanism can be provided only by the dedicated contact member described above, so that the manufacturing cost can be suppressed, and the memory card socket of the present invention can be realized in a simple configuration. More preferably, the above-mentioned dedicated contact has a connection portion electrically connected to an external substrate. The connecting portion is formed such that the outer surface of the socket body protrudes in a direction intersecting with the longitudinal direction in a plane parallel to the one surface of the memory card held at the insertion position.右 Right According to this configuration, the memory card socket of the present invention can be easily mounted on the substrate by the reverse mounting method. Moreover, it is preferable that the memory card socket of the present invention includes: a plurality of the dedicated contactors arranged in a width direction of the memory card held at the insertion position; and a connecting member to be adjacent to the dedicated contact They are connected to each other in a state of being insulated from each other. The above coupling member is disposed on the protruding portion. According to this configuration, since the adjacent dedicated contact members are connected to each other by the upper connecting member, the adjacent dedicated contact members can be simultaneously connected, and the corresponding dedicated terminals can be touched and separated. x, the vibration of the dedicated contact when the memory card is inserted into the socket body can be suppressed by the coupling member. Therefore, it is possible to prevent the above-mentioned dedicated contact from accidentally contacting the other contact or the above-mentioned terminal due to such vibration. More preferably, the contact preventing mechanism is provided on the connecting member. According to this configuration, the contact preventing means can be provided without the need for the dedicated contact member itself, so that the shape of the dedicated contact member can be simplified, and the increase in manufacturing cost can be suppressed. 11 201021301 More preferably, the contact preventing mechanism includes a card contact portion that is in contact with the body of the first "remember card" held at the insertion position. The card contact portion is relative to the memory held along the insertion position The longitudinal direction of the card is in a line symmetrical shape by the center line 'the center between the adjacent dedicated contact members. ' According to this configuration, when the memory card is inserted into the socket body, the contact preventing mechanism does not tilt Therefore, it is possible to improve the synchronization accuracy between the dedicated contactors connected by the above-described connecting member. More preferably, the connecting member is disposed on the side of the contact portion more than the contact preventing mechanism. Further, in the memory card socket of the present invention, the contact preventing mechanism is provided in the socket body. According to the configuration, depending on the type of the memory card, The contactor® is suitably brought into contact with the terminal of the above memory card. a dog outlet made of an elastic material, and a pressing portion provided at a distal end of the protruding portion to press the dedicated contact. The protruding portion is formed in the socket body to be held in the insertion body The terminal of the memory card at the position is further biased toward the card slot side, and protrudes toward one end side in the longitudinal direction of the memory card held at the insertion position. According to this configuration, the structure of the contact preventing mechanism can be simplified. It is possible to suppress the increase in the manufacturing cost. 12 201021301 It is preferable that the protruding portion is integrally formed with the socket body. According to this configuration, the number of components and the number of assembly steps can be reduced, and the increase in manufacturing cost can be suppressed. The memory card socket of the present invention includes a plurality of the dedicated contactors, wherein the contact sub-systems are arranged along a width direction of the memory card held at the insertion position. The pressing portion is configured to simultaneously press at least one of the dedicated contacts. According to this configuration, a plurality of the above-mentioned dedicated contactors can be simultaneously contacted and left. The above-described dedicated terminal is used. [Embodiment] In the following embodiments, a memory card socket capable of supporting both a previous type memory card (the second memory card) and a high speed type memory card (the second memory card) is exemplified. The memory card socket of the present invention can also be used as a memory card socket for a memory card other than an SD memory card (for example, a multimedia memory card), or a SDI file having the same size and terminal arrangement as the SD memory card (to (3) A card socket for a Dlgital Input/Output card. (Embodiment 1) As shown in Figs. 1 and 2, a memory card socket 1 of the present embodiment includes: a flat rectangular box-shaped socket body 20, and The contact body (c〇ntact) C1 to C13. The socket body 20 includes a card slot 21' and holds the memory card MC inserted through the card slot 21 at a predetermined insertion position. The contact members ci to C13' are provided in the socket body 20, and are in contact with the terminals (contact pads) pi to pl3 of the memory card MC held at the insertion position 13 201021301, respectively. Figures 3 to 5 show the memory card mc. In the following description, the first memory card and the second memory card are distinguished as necessary, and the first memory card is indicated by the symbol MCI as appropriate, and the second memory card is indicated by the symbol Mc2. ‘ Figure 3 shows the first memory card MCI. The i-th memory card MC1 includes a body 1000 which is formed into a card shape (a moment φ-shaped plate shape) using, for example, a resin material. In the main body 1000, a non-volatile memory element such as a flash memory (flash-memory) is built in (not shown below, the vertical direction of the third figure (a) is set as the i-th memory card M (M (main body ι长度) The length direction 'The left and right direction of Fig. 3 (a) is the width direction of the 亿亿亿 card MCM, and the left and right direction of Fig. 3 (b) is the thickness direction of the ith memory card MCI A plurality of (eight in the illustrated example) rectangular recesses (recesses for the cymbal) 1100 (1101 to 11) are formed at one end (front end) in the longitudinal direction of the surface (back surface) in the thickness direction of the body surface. 〇8). The recesses ιι〇ι~· are arranged along the width direction of the body contact. The end-ends (front ends) of the respective lengths of the recesses li〇i~ are open, that is, the recesses have an open end just at the front end. The partition wall (rib) between the recessed portions 1101 to 1108 is formed in a strip shape along the longitudinal direction of the body 1000. The partition wall is cut into the memory card Mc and inserted into the memory card socket. In the case of H), the contact members C1 to C13 are prevented from coming into contact with each other. The front end of the back surface of the body surface is provided with plural numbers (Fig. The middle is a 9-terminal terminal (10) contact surface) P1 to P9. Each of the terminals P1 to P7 is provided on the bottom surface of each of the recesses u〇i to biliary 14 201021301. The bottom surface of the recess 1108 is provided with two terminals Ρ8 and Ρ9. Terminal Ρ1 The Ρ9 series are arranged along the width direction of the main body 1000. The first memory card MC1 is inserted into the memory card socket from the front end (the front direction of the first memory card MCI is the direction of insertion into the memory card socket). A projecting portion 1010 is formed on both sides (left and right sides) in the width direction. The corner portion 'on one end side in the width direction of the front end surface of the main body 1000 (the left end side in the third to the other side (a) is formed with an oblique direction) By the inclined slit 1〇2, a tapered surface is formed at one end of the front end surface of the first suffix card MC1 in the width direction. Further, the side surface on the one end side in the width direction of the main body 1000 (Fig. 3 (Fig. 3) In the left side of the a), the engaging portion of the engaging claw 43 that engages the memory card socket 1 is formed, and the side surface on the other end side in the width direction of the main body (10) (in FIG. 3(a) The right side surface is formed with a recessed 胄1〇4〇.

陷部1040内’滑動自如地配置有防寫開關（w出她以 switch)之撥塊 1〇5〇。第1記憶卡顧可切換動作模式而加以使用。根據動 :模式而切換各端^P1〜P9之功能。例如，於可高速傳輸 :料之模式下’第！記憶卡MC1中係利用四個端子進行資料傳輸。亦即進行i時脈週期4位元之資料傳輸。具供tl、5圖絲^第2記針MC2°第2記憶卡赠，第：與第：憶卡MC1相同的本體100。。以下為了區分而視MC1的本體1000與第2記憶卡MC2的本體 ,、需將第1記憶卡MC1的本體⑽〇用符號刪 15 201021301 來表示’將第2記憶卡MC2的本體i 〇〇〇用㈣i 〇〇2來表示0 本體1002形成為與本體1001相同的卡片形狀。本體 1002與本體1001，同樣地具備：突部1010、卡合部1030、凹陷部1040、撥塊1050、凹部11〇1〜11〇8、及間隔壁麗〜1067。 • 第2記憶卡MC2,除了端子P1〜P9以外，還包括四個 ❹端子P10〜P13。端子P1〜P9係共通地設於第1記憶卡體與第2記憶卡MC2的共通端子，端子pi()〜pi3係僅設於第2記憶卡MC2的專用端子。第2記憶卡MC2中，係於與先前型記憶卡mc丨相同之位置，配置共通端子P1〜P9。亦即，共通端子ρι〜ρ9 係被配置於本體H)〇2的厚度方向的—面（背面）的長度方向的一端（前端）》共通端子Ρ3'Ρ6的長度（前後方向的尺寸），相比其馨他共通端子Ρ4、Ρ5、Ρ7〜Ρ9ΜβΜ^ρ3、ρ6_ ，端位置’位於較其他共通端子ρ4、ρ5、ρ7〜的前端位置更後方（第3圖（a)的下方）。專用端子ί>1〇、Ρ11，被配置於凹部11〇3的底面。專用端子Ρ10、ρ Π係沿寬度方向排列，且位於較端子ρ3更前方。同樣地，專用端子Ρ12、Ρ13,被配置於凹部11〇6的底面。專用端子Ρ12、Ρ13係沿寬度方向排列，且位於較共通端子Ρ6更前方。第2記憶卡MC2之動作模式有：進行與第丨記憶卡 16 201021301 MCI相同之動作的SD模式及進行更高速之資科傳輸之高速模式。根據SD模式及高速模式而切換各端子ρι〜ρΐ3 之功能。於间速模式下，係以一對專用端子ρι〇、ριι與一對專用端子P12、P13 ’分別發送/接收^立元之差動資料訊號。亦即使用專用端子P1〇〜Pl3 其中’儘管與SD模式相比，來發送/接收2位元之資料。尚速模式下1時脈週期可傳Inside the trap 1040, a dial 1 〇 5 防 is slidably disposed with an anti-write switch (w is out of the switch). The first memory card can be used by switching the operation mode. The function of each terminal ^P1 to P9 is switched according to the mode: mode. For example, in the mode of high-speed transmission: material! In the memory card MC1, four terminals are used for data transmission. That is, data transmission of 4 bits in the i clock cycle is performed. It is provided with tl, 5, and 2nd needles, MC2°, 2nd memory card, and the same body 100 as the first memory card MC1. . In the following, in order to distinguish between the main body 1000 of the MC1 and the main body of the second memory card MC2, the main body (10) of the first memory card MC1 is denoted by the symbol 15 201021301, and the main body i of the second memory card MC2 is indicated. The (4) i 〇〇 2 is used to indicate that the 0 body 1002 is formed in the same card shape as the body 1001. Similarly to the main body 1001, the main body 1002 includes a projection 1010, an engaging portion 1030, a recessed portion 1040, a dial 1050, recesses 11〇1 to 11〇8, and a partition wall 1067. • The second memory card MC2 includes four ❹ terminals P10 to P13 in addition to the terminals P1 to P9. The terminals P1 to P9 are commonly provided in the common terminal of the first memory card body and the second memory card MC2, and the terminals pi() to pi3 are provided only in the dedicated terminals of the second memory card MC2. In the second memory card MC2, the common terminals P1 to P9 are disposed at the same position as the previous type memory card mc丨. In other words, the common terminals ρι to ρ9 are disposed at one end (front end) in the longitudinal direction of the surface (back surface) in the thickness direction of the main body H) 〇2. The length of the common terminal Ρ3' Ρ 6 (the dimension in the front-rear direction), The terminal Ρ4, Ρ5, Ρ7~Ρ9ΜβΜ^ρ3, ρ6_ are common to the other end, and the end position 'is located later than the front end positions of the other common terminals ρ4, ρ5, ρ7~ (below the figure (a) of Fig. 3). The dedicated terminals ί>1〇 and Ρ11 are disposed on the bottom surface of the recess 11〇3. The dedicated terminals Ρ10, ρ Π are arranged in the width direction and are located further ahead than the terminal ρ3. Similarly, the dedicated terminals Ρ12 and Ρ13 are disposed on the bottom surface of the recess 11〇6. The dedicated terminals Ρ12 and Ρ13 are arranged in the width direction and are located further forward than the common terminal Ρ6. The operation mode of the second memory card MC2 includes an SD mode in which the same operation as the second memory card 16 201021301 MCI is performed, and a high speed mode in which a higher speed resource transmission is performed. The function of each terminal ρι to ρΐ3 is switched according to the SD mode and the high speed mode. In the inter-speed mode, the differential data signals of the elegans are transmitted/received by a pair of dedicated terminals ρι〇, ριι, and a pair of dedicated terminals P12 and P13', respectively. That is, the dedicated terminals P1 〇 P Pl3 are used, where 'send/receives 2-bit data, although compared with the SD mode. 1 clock cycle can be transmitted in the fast mode

輸之位το數較少’但其藉由發送/接收差動資料而使動作時脈之頻率得到飛躍性提高。因此，於高速模式下可實現較 SD模式高速之資料傳輸。The number of bits of the input τ is small', but the frequency of the action clock is dramatically improved by transmitting/receiving the differential data. Therefore, high-speed data transmission in the SD mode can be realized in the high-speed mode.

第2記憶卡MC2的本體1〇〇2，具備切口 ι〇7〇而非切口 1020。本體1〇02，除了切口 1〇7〇的形狀以外外形形狀及尺寸形成為與第i記憶卡MC1的本體1〇〇1相同。第2 〇己隐卡MC2 ’亦係自前端插入至記憶卡插座中（第2記憶卡MC2的前方向成為向記憶卡插座中插入的方向切口 1070，係由：在與切口 1020相同的位置，與本體 1002的前面鄰接之第]切口部1〇8〇;及與第i切口部1〇8〇連續地設置，且與本體丨〇〇2的側面（第4圖（a)中的左側面）鄰接之第2切口部1〇9〇所構成。第2切口部1〇9〇，位於較第1切口部1〇8〇更後方，從而於第1切口部1〇8〇與第2切口部1 〇9〇之間形成段差β 如此，第2記憶卡MC2 _，於本體1〇〇2的前端部，設有於向記憶卡插座中插入之方向（第4圖（a)中的上下方向）上深度不同的第i切口部1〇8〇與第2切口部1〇9〇。 17 201021301 換言之，於第2記憶卡MC2的前端面的寬度方向的一端，形成有與第1記憶卡MCI相同的錐形面，但在第2記憶卡 MC2的錐形面則形成有段差。且說，如第3圖及第4圖所示’安插於本實施形態之記憶卡插座10中之第2記憶卡MC2,於凹部11〇2與1103 間之間隔壁1062、凹部11〇3與1104間之間隔壁1〇63、凹部1105與11〇6間之間隔壁1〇65、凹部11〇6與11〇7間之 ❹間隔壁！〇66,分別具備切口（凹進部）12〇〇( 12〇1〜12〇4)。各切口 1201〜1204 ’係形成於底面設有專用端子pi〇〜pl 3 的凹部1103、1106旁（兩旁）之間隔壁i〇62、1063、1065、 1066中。切口 1201〜1204,係形成為跨及自間隔壁1〇62、 1063、1065、1066的前端（本體1〇〇2的長度方向的一端）至長度方向（前後方向）的中央。切口 1201〜1204，具有間隔壁1062、1063、1065、1066的高度的大致二分之一之深度。再者，切口 1201〜1204的形狀並不限定於上述例。 β 以下，就本實施形態之記憶卡插座1 0進行說明。 - 如第2圖所示’插座本體20,包括底殼30及罩殼40» 又’插座本體20，具有保持接觸子C1〜C13之保持區塊 50。再者，以下之實施形態中，使用第2圖中所示之前後 (縱深）、上下（厚度）、左右（寬度）之各方向來進行說明。此方向並不限定記憶卡插座之安裝方向。底殼30 ’例如係藉由對厚度極薄之矩形板狀之不銹鋼金屬板實施衝壓加工或彎曲加工而形成。底殼3〇，具備：矩形板狀之頂板31、及分別自頂板31的左右兩端朝下方 18 201021301 令片3 2。底设3 〇為下側及前後兩側開放之箱狀。於底殼3〇的頂板31的前端及右端，分別彎折地形成有朝下方突出之複數個突片33。於頂板31的前端側，形成有用於防止頂板31與接觸子cl〜cn接觸之複數個通孔34。於頂板3 !的後端形成有支持片35，其係自較記憶 ' 卡MC通過卡片槽21之位置更左側朝下方突出。支持片35 • 為頂端朝前方突出之L字形。〇罩般40’係藉由對厚度極薄之矩形板狀之不銹鋼金屬板實施衝壓加工或彎曲加工而形成。罩殼4〇具備與頂板 31形狀相同之底板41。於底板41的前端，藉由彎折加工而形成有朝上方突出之彎曲片（未圖示）。於底板41的較 f曲片之稍後方’藉由切縫翻邊加工而形成有朝上方突出之複數個突出片45 (參照第37圖）。罩殼40係被配置於保持區塊5 0的下面侧（底面側）。罩殼40具備彈性片42，當安插記憶卡MC時（將記憶卡Mc保持於上述插入位置時），其彈性接觸本體1000的 * 底面而抑制本體1000晃動。罩殼40，具備：包含卡合爪 43之卡合片44 ’安插記憶卡MC時，該卡合爪43與本體 1000之卡合部1030卡合。彈性片42及卡合片44，係利用切縫翻邊或彎曲加工而形成。卡合片44自罩殼40的左前的角朝後方突出。卡合片44的頂端朝右側彎曲而構成卡合爪43 〇保持區塊50為樹脂成型品，形成為俯視L字形。保持區塊50’具有：以左右方向作為長度方向之棱柱狀的保持 19 201021301 具5卜及自保持具51的右端朝後方突出之稜柱狀的銷52。保持具5 1係沿底殼30及罩殼40的前端的左右方向配置，構成插座本體20的前壁。銷52係沿底殼30的右侧之侧片 32的前後方向配置’構成插座本體2〇的右壁。於銷52設有段部521 ’其沿前後方向延伸，且與記憶卡MC的背面相 • 向。 . 於保持區塊5〇的頂面，形成有第1壓入槽（未圖示）， φ 其要被壓入底殼30的突片33。藉由將底殼30的突片33 壓入於保持區塊50的第1壓入槽中，而將底殼固定於保持區塊50的上面側（將保持區塊5〇固定於底殼3〇的頂板31的下面側於保持區塊5〇的底面，形成有第2壓入槽（未圖示），其要被壓入罩殼4〇的突出片45。藉由將罩殼40的犬出片45壓入於上述第2壓入槽中，而將罩殼4〇固定於保持區塊50。再者，利用雷射焊接等，將罩殼4〇的外周’固著於已被固定在保持區塊5〇的上面侧（頂面側）辱之底殼30的外周。 -藉由以上’將罩殼40及底殼30固定於保持區塊5〇, 藉此構成插座本體20。於插座本體2〇的後面，構成用於將記憶卡MC插入至插座本體2〇十之卡片槽（卡片插入口） 21 〇以上所述之插座本懸20中，保拉於、+. τ 称得於上述插入位置的第 1記憶卡MC1的前端之位置、與保拄兴饰得於上述插入位置的第 2記憶卡MC2的前端之位置相同。各接觸子CM〜C13’係藉由對導電性優異之金屬板實 20 201021301 施衝壓加工及彎曲加工而形成。接觸子cl〜ci3，以可與被保持於上述插入位置之第2記憶卡MC2的各端子P1〜接觸之方式’藉由壓入（或同時成形）而被保持於保持區塊50的保持具51中。接觸子C1〜C9,係與共通端子pl〜p9接觸用之共通接觸子，接觸子C1()〜⑴，係與專用端子〜M3接觸用之專用接觸子。 • 共通接觸子C1〜C9,具備：用於接觸共通端子ρι〜ρ9 之接觸端子61、及焊錫用之構裝端子62。接觸端子61自、、、的後面（與保持於插入位置之記憶卡MC的長度方向的―端侧的側面相向之插座本鍾2G的内面）朝卡片槽 ·!(後方）突出。構裝端子62自保持部51的前面朝前專用接觸子C10〜Γ1Ί « ^ 13 具備.用於接觸專用端子P10 P13之接觸端子μ、及捏雜田+ 今磨夂焊錫用之構裝端子72。接觸端子自保持具51的後面朝徭古办 ςι 1无®1朝设方犬出。構裝端子72自保持具 1的前面朝前方突出。 ^裝端子62、72 ’係與外部之基板（主基板）電性連出之办接冑構裝端子62、72，其從保持具51的前面突 . 攝裝端子62、72的頂端朝前延長，其頂面與底殼30的頂而盔士站4 刃頂面為大致相同高度。共通接觸子C1〜C9的接觸唑工“ 51的幻接觸端子61，具備：自保持具的傻面’朝後方突出之成於彈& 彈簧4 (犬出部）611 ;及被形菁°? 611的頂端之接觸部（接點部）612。 21 201021301 於接觸共通端子 Ρ1 〜Ρ9 40側）凸起之圓弧狀。接觸部612係用形成為朝下方（罩殼彈簧部611，係構成為藉 612接觸對應之端子ρι〜ρ9 側寬度越變窄之錐形形狀。接觸部612 由特定之接觸壓力而使接觸部。彈簧部611形成為越往頂端 ^用接觸子C1()〜C13的接觸端子Η，具備：彈酱部大出部）711、設於彈簧部711的頂端之接觸部（接點部） :、接觸防止部713、及將彈菁部711的後端與接觸防止 # 713的後端連結成一體之連結部714〇如此接觸端子係於左右方向上分岔成彈簧部711與接觸防止部713之兩岔形狀。 ,接觸部712係用於接觸專用端子ρι〇〜pi3。接觸部712 形成為朝下方（罩殼4〇側）凸起之圓弧狀。彈簧部711構成為藉由特定之接觸壓力而使接觸部η] 接觸對應之端子Ρ1〇〜Ρ13β彈簧部711形成為越往頂端側 41寬度越變窄之錐形形狀。 • 虽安插第2記憶卡MC2時，接觸防止部713將頂端部 (抵接部）715收納於對應之切口 12〇1〜12〇4中，當安插第1記憶卡MC1時’其利用觸抵對應之間隔壁丨〇62、丨〇63、 1065、1066而向上方移動。亦即，當將第1記憶卡MCI保持於上述插入位置時，接觸防止部713利用觸抵第1記憶卡mc 1之間隔壁1062、 1063、1065、1066而使專用接觸子ci〇〜C13變形，從而使專用接觸子C10〜C13遠離共通端子p3、P6。另一方面， 22 201021301 當將第2記憶卡MC2保持於上述插入位置時接觸防止部 713,利用位於第2 s己憶卡MC2之間隔壁1062、1〇63、1〇65、 1066中所形成之切口 1201〜12〇4内，而使專用接觸子ci〇〜C13不變形，從而使專用接觸子cl〇〜C13接觸專用端子 P10〜P13。 . 再者，專用接觸子CIO、C12中，接觸防止部713較接 .觸部712位於左側，專用接觸子cu、cu中，接觸防止 ❹部713較接觸部712位於右侧。專用接觸子cl〇 cii( ci2、 C13)相對於共通接觸子C3 (C6)呈線對稱。因此，於專用接觸子CIO、Cll (C12、C13)的接觸防止部713之間，配置有專用接觸子C1〇、cll(cl2、cl3)的接觸部712, 於專用接觸子C10、C11(C12、C13)的接觸部712之間，配置有共通接觸子C3 (C6)的接觸部612。本實施形態中，於保持具51的後面形成有導引槽 51〇。導引槽510形成為可使接觸端子71 (接觸端子71的 ® 連結部714)在特定範圍内上下擺動之大小。藉由該導引 • 槽51〇，接觸部712及接觸防止部713的往上下方向之位移幅度（行程，stroke )相對增大。接觸防止部713,與接觸部712及彈簧部711相比，寬度尺寸（左右方向之尺寸）較大。接觸防止部713的頂端部朝上方彎曲成圓弧狀。接觸防止部713的頂端部構成抵接部715。接觸防止部713係於長度方向的中央部彎曲成曲柄（crank)形狀。藉此，接觸防止部713的頂端侧較後端側位於更上方。該接觸防止部713的抵接部715的底 23 201021301 之值，未達記憶卡MC 且稍大於間隔壁1061 面與接觸部712的底面之間的高低差之間隔壁1061〜1067的高度尺寸、〜1067的高度尺寸的二分之一。再者’本實施形態中’接觸防止部713係由金屬製造且與接觸部712及彈簧部711形成為一趙，但接觸防止部川亦可由合成樹脂製造。此時，可將接觸防止部⑴、接觸部712及彈簧部7U 一體成形。The body 1〇〇2 of the second memory card MC2 is provided with a slit 〇7〇 instead of the slit 1020. The body 1 〇 02 is formed in the same shape and size as the body 1 〇〇 1 of the i-th memory card MC1 except for the shape of the slit 1 〇 7 。. The second hidden card MC2' is also inserted into the memory card socket from the front end (the front direction of the second memory card MC2 becomes the direction slit 1070 inserted into the memory card socket by the same position as the slit 1020. The first slit portion 1 〇 8 邻接 adjacent to the front surface of the main body 1002; and the ith slit portion 1 〇 8 〇 are continuously provided, and the side surface of the main body 丨〇〇 2 (the left side surface in Fig. 4 (a) The second notched portion 1〇9〇 is formed adjacent to the first notch portion 1〇8〇, and is located behind the first notch portion 1〇8〇, so that the first notch portion 1〇8〇 and the second incision The step difference β is formed between the parts 1 and 9〇. The second memory card MC2_ is provided at the front end of the main body 1〇〇2 in the direction of insertion into the memory card socket (the upper and lower sides in Fig. 4(a) In the direction), the i-th notch portion 1〇8〇 and the second notch portion 1〇9〇 have different depths. 17 201021301 In other words, the first memory card is formed at one end in the width direction of the front end surface of the second memory card MC2. The same tapered surface of the MCI, but a step is formed on the tapered surface of the second memory card MC2. And, as shown in Fig. 3 and Fig. 4, The second memory card MC2 of the memory card socket 10 of the embodiment is disposed between the partitions 1062 between the recesses 11〇2 and 1103, the partition walls 1〇63 between the recesses 11〇3 and 1104, and the recesses 1105 and 11〇6. The partition wall 1〇65 and the partition wall 〇66 between the recesses 11〇6 and 11〇7 respectively have slits (recessed portions) 12〇〇 (12〇1 to 12〇4). Each of the slits 1201 to 1204' The partition walls i〇62, 1063, 1065, and 1066 are formed on the side (the sides) of the recesses 1103 and 1106 having the dedicated terminals pi〇 to pl 3 on the bottom surface. The slits 1201 to 1204 are formed to span the partition wall 1 The front ends of the crucibles 62, 1063, 1065, and 1066 (the one end in the longitudinal direction of the main body 1〇〇2) are at the center in the longitudinal direction (the front-rear direction). The slits 1201 to 1204 have the heights of the partition walls 1062, 1063, 1065, and 1066. Further, the shape of the slits 1201 to 1204 is not limited to the above example. β Hereinafter, the memory card socket 10 of the present embodiment will be described. - As shown in Fig. 2, the socket body 20, comprising a bottom case 30 and a cover 40» and a 'socket body 20, having a holding block for holding contacts C1 to C13 50. In the following embodiments, the front and rear (depth), upper and lower (thickness), and left and right (width) directions shown in Fig. 2 are used. This direction does not limit the installation of the memory card socket. The bottom case 30' is formed, for example, by press working or bending a rectangular plate-shaped stainless steel metal plate having a very small thickness. The bottom case 3〇 has a rectangular plate-shaped top plate 31 and a top plate 31 respectively. The left and right ends are facing downwards 18 201021301 to make a piece 3 2 . The bottom part is 3 〇 which is open to the lower side and the front and rear sides. A plurality of projections 33 projecting downward are formed at the front end and the right end of the top plate 31 of the bottom case 3, respectively. On the front end side of the top plate 31, a plurality of through holes 34 for preventing the top plate 31 from coming into contact with the contact pins cl to cn are formed. A support piece 35 is formed at the rear end of the top plate 3!, which protrudes downward from the position where the memory card MC passes through the card slot 21. Support piece 35 • L-shaped for the top to protrude forward. The cover-like 40' is formed by press working or bending a rectangular plate-shaped stainless steel metal plate having an extremely small thickness. The casing 4A is provided with a bottom plate 41 having the same shape as the top plate 31. At the front end of the bottom plate 41, a bent piece (not shown) that protrudes upward is formed by bending. A plurality of projecting pieces 45 projecting upward are formed by slitting and burring at a later portion of the lower surface of the bottom plate 41 (see Fig. 37). The casing 40 is disposed on the lower surface side (bottom side) of the holding block 50. The casing 40 is provided with an elastic piece 42 which elastically contacts the bottom surface of the body 1000 to prevent the body 1000 from rattling when the memory card MC is inserted (when the memory card Mc is held at the above-described insertion position). The cover 40 includes an engagement piece 44 that includes the engagement claws 43. When the memory card MC is inserted, the engagement claws 43 are engaged with the engagement portions 1030 of the main body 1000. The elastic piece 42 and the engaging piece 44 are formed by slitting or bending. The engaging piece 44 protrudes rearward from the left front corner of the casing 40. The distal end of the engaging piece 44 is bent toward the right side to constitute the engaging claw 43. The holding block 50 is a resin molded product and is formed in an L shape in plan view. The holding block 50' has a prismatic shape in which the left and right direction is a prismatic shape in the longitudinal direction. 19 201021301 A prismatic pin 52 having a fifth end and a right end of the holder 51 projecting rearward. The holder 51 is disposed in the left-right direction along the front ends of the bottom case 30 and the cover 40, and constitutes the front wall of the socket body 20. The pin 52 is disposed along the front-rear direction of the side piece 32 on the right side of the bottom case 30 to constitute the right wall of the socket body 2''. The pin 52 is provided with a segment portion 521' which extends in the front-rear direction and faces the back surface of the memory card MC. A first press-in groove (not shown) is formed on the top surface of the holding block 5, and φ is pressed into the tab 33 of the bottom case 30. The bottom case is fixed to the upper surface side of the holding block 50 by pressing the tab 33 of the bottom case 30 into the first press-in groove of the holding block 50 (the holding block 5 is fixed to the bottom case 3). The lower surface side of the top plate 31 of the crucible is formed on the bottom surface of the holding block 5〇, and a second press-in groove (not shown) is formed which is pressed into the protruding piece 45 of the cover 4〇. By the cover 40 The dog piece 45 is press-fitted into the second press-fitting groove, and the cover 4 is fixed to the holding block 50. Further, the outer circumference of the cover 4' is fixed to the already-covered by laser welding or the like. The outer periphery of the bottom case 30 is fixed to the upper side (top side) of the holding block 5〇. - The cover 40 and the bottom case 30 are fixed to the holding block 5 by the above, thereby constituting the socket body 20 Behind the socket body 2〇, a card slot (card insertion slot) for inserting the memory card MC into the socket body 2 构成构成中〇〇 , , , , , , + + + + + + + + + + + The position of the front end of the first memory card MC1 at the insertion position is the same as the position of the front end of the second memory card MC2 that is decorated at the insertion position. The contactors CM to C13' are formed by press working and bending processing on the metal plate 20 201021301 having excellent conductivity. The contacts c1 to c3 are compatible with the second memory card MC2 held at the above insertion position. Each of the terminals P1 to "contact" is held in the holder 51 of the holding block 50 by press-fitting (or simultaneous molding). The contacts C1 to C9 are common contacts for contact with the common terminals pl to p9. Contactor C1()~(1) is a special contact for contact with the dedicated terminal ~M3. • Common contact C1~C9, with contact terminal 61 for contact common terminal ρι~ρ9, and solder structure The terminal 62 is mounted. The rear surface of the contact terminal 61 (the inner surface of the socket main clock 2G facing the side surface on the end side in the longitudinal direction of the memory card MC held at the insertion position) protrudes toward the card slot·! (rear) The mounting terminal 62 is provided from the front side of the holding portion 51 to the front special contact C10~Γ1Ί « ^ 13 . The contact terminal μ for contacting the dedicated terminal P10 P13, and the mounting terminal for the pinning field + the current grinding solder 72. The contact terminal is behind the holder 51徭古ςς1 1 is set to the square dog. The mounting terminal 72 protrudes from the front of the holder 1 toward the front. ^The terminal 62, 72' is electrically connected to the external substrate (main substrate). The mounting terminals 62, 72 are extended from the front surface of the holder 51. The top ends of the camera terminals 62, 72 are extended forward, and the top surface thereof is substantially the same as the top of the bottom case 30 and the top surface of the helmet station 4. The contact of the contactors C1 to C9 of the common contacts "1, the magical contact terminal 61 of 51, has the self-holding of the silly face" protruding toward the rear into the spring & spring 4 (dog outlet) 611; The contact portion (contact portion) 612 of the top end of the 603. 21 201021301 In the contact common terminal Ρ1 ~ Ρ 9 40 side) convex arc shape. The contact portion 612 is formed to face downward (the cover spring portion 611 is configured to have a tapered shape in which the width is narrowed by the terminal ρι to ρ9 on the 612 contact. The contact portion 612 is contacted by a specific contact pressure. The spring portion 611 is formed so that the contact terminal C1 (C1) of the contacts C1 (C1) to C13 is provided at the top end, and the contact portion (contact portion) provided at the tip end of the spring portion 711 is provided: The contact preventing portion 713 and the connecting portion 714 that integrally connects the rear end of the elastic portion 711 and the rear end of the contact preventing # 713, so that the contact terminals are branched into the spring portion 711 and the contact preventing portion 713 in the left-right direction. Two shapes. The contact portion 712 is used to contact the dedicated terminals ρι〇 to pi3. The contact portion 712 is formed in an arc shape that is convex downward (the side of the cover 4). The spring portion 711 is configured such that the contact portion η] contacts the corresponding terminal Ρ1〇 to Ρ13β by a specific contact pressure, and the spring portion 711 is formed in a tapered shape in which the width becomes narrower toward the distal end side 41. When the second memory card MC2 is inserted, the contact preventing portion 713 stores the distal end portion (contact portion) 715 in the corresponding slits 12〇1 to 12〇4, and when the first memory card MC1 is inserted, the contact is prevented. The partition walls 62, 丨〇 63, 1065, and 1066 are moved upward. That is, when the first memory card MCI is held at the above-described insertion position, the contact preventing portion 713 deforms the dedicated contact ci〇 to C13 by the partition walls 1062, 1063, 1065, and 1066 that touch the first memory card mc1. Thus, the dedicated contacts C10 to C13 are moved away from the common terminals p3 and P6. On the other hand, 22 201021301 when the second memory card MC2 is held at the above-described insertion position, the contact preventing portion 713 is formed by the partition walls 1062, 1〇63, 1〇65, 1066 located in the 2nd s memory card MC2. The slits 1201 to 12〇4 are cut in, and the dedicated contacts ci〇 to C13 are not deformed, so that the dedicated contacts cl〇 to C13 are in contact with the dedicated terminals P10 to P13. Further, in the dedicated contact members CIO and C12, the contact preventing portion 713 is in contact with each other. The contact portion 712 is located on the left side, and the contact preventing portion 713 is located on the right side of the contact portion 712. The dedicated contact cl〇 cii (ci2, C13) is line symmetrical with respect to the common contact C3 (C6). Therefore, the contact portions 712 of the dedicated contact C1〇, c11 (cl2, cl3) are disposed between the contact preventing portions 713 of the dedicated contact CIO, C11 (C12, C13), and the dedicated contact C10, C11 (C12) A contact portion 612 that shares the contact C3 (C6) is disposed between the contact portions 712 of C13). In the present embodiment, a guide groove 51 is formed in the rear surface of the holder 51. The guide groove 510 is formed to be able to swing the contact terminal 71 (the connection portion 714 of the contact terminal 71) up and down within a specific range. By the guide groove 51, the displacement range (stroke) of the contact portion 712 and the contact preventing portion 713 in the vertical direction is relatively increased. The contact preventing portion 713 has a larger width (dimension in the left-right direction) than the contact portion 712 and the spring portion 711. The distal end portion of the contact preventing portion 713 is curved upward in an arc shape. The distal end portion of the contact preventing portion 713 constitutes a contact portion 715. The contact preventing portion 713 is bent in a crank shape at a central portion in the longitudinal direction. Thereby, the distal end side of the contact preventing portion 713 is located above the rear end side. The value of the bottom 23 201021301 of the contact portion 715 of the contact preventing portion 713 does not reach the height of the memory card MC and is slightly larger than the height of the partition wall 1061 to 1067 between the partition 1061 surface and the bottom surface of the contact portion 712. ~1067 of the height dimension of one-half. In the present embodiment, the contact preventing portion 713 is made of metal and is formed in a contact with the contact portion 712 and the spring portion 711. However, the contact preventing portion may be made of synthetic resin. At this time, the contact preventing portion (1), the contact portion 712, and the spring portion 7U can be integrally formed.

且說，接觸端子61的長度（自保持具51的後面突出之突出量）長於接觸端子71的長度。又，接觸子〇的接觸端子61’長於其他接觸子C2〜C9的接觸端子6卜如此，各接觸子C1〜CM3的接觸端+ 61、71的長度係配合對應之端子Pi〜P13相距本體_的前端面之距離而設定。藉此，安插第2圯憶卡MC2時，可使各接觸子cl〜c13 的接觸部612、712彈性接觸對應之端子pi〜pi3。專用接觸子CIO〜C13與共通接觸子C1〜C9,於左右方向上相互接近。為了避免接觸子C1〜C13彼此接觸，而將專用接觸子C10〜C13配置於較共通接觸子C1〜C9更下方（罩殼40側）（參照第！圖（b ))。安插第2記憶卡MC2時，如第1圖（b)所示，藉由 tit 於間隔壁 1062、1063、1065、1066 的切口 1201 〜1204，，接觸防止部713的抵接部715的下面（底面）與設於間隔壁 1062、1063、1065、1〇66 的切口 1201 〜1204 的底面之間產生間隙’故而抵接部715不會接觸間隔壁1〇62、1〇63、 1065、1066。因此，如第6圖所示’專用接觸子C10〜C13 24 201021301 的接觸部712，接觸已被形成於凹部11〇3、11〇6的底面之專用端子P10〜P13。亦即，安插第2記憶卡MC2時高速模式用之接觸子cio〜C13與和其對應之專用端子ρι〇〜P13導通。如第7圖（a)、（b)所示，安插第i記憶卡MC j時， •接觸防止部713的抵接部715的下面（底面）抵接間隔壁， 62 1063、1065、1066的上面（頂面）。藉此，來自間隔〇壁1〇62、1063、1〇65、W66之反作用力將接觸防止部713 朝上方推升。若接觸防止部713受到推升，則專用接觸子 C10〜C13的接觸端子71產生彈性變形而使接觸部712亦與接觸防止部713 -同朝上方移動。藉此，接觸部712自凹部1103、11〇6的底面抬升。其結果，即便接觸部712與端子P3、P6於上下方向重疊之情形時，亦會如第8圖所示般，接觸部712離開已被形成於凹部11〇3、11〇6的底面之共通端子P3、P6。亦即，高速模式用之接觸子C10〜C13 霉不與共通端子P3、P6導通。 • 如此，本實施形態之記憶卡插座10令，若安插於記憶卡插座10中之記憶卡MC為第2記憶卡MC2，則使專用接觸子C10〜C13接觸專用端子ρι〇〜P13，若安插於記憶卡插座1〇中之記憶卡MC為第i記憶卡MC1，則使專用接觸子C10〜C13不接觸共通端子P3、P6。換言之，可根據安插於記憶卡插座1〇中之記憶卡Mc之種類，而以適合發揮各記憶卡MC之性能之狀態使接觸子C1〜C13接觸端子ρι 〜P13 ^尤其是當安插第2記憶卡MC2時，可使高速模式 25 201021301 用之接觸子CIO〜C13接觸端子P10〜P13，相對於此，當安插第1記憶卡MCI時，可防止高速模式用之接觸子〜⑴與共通端子P3、P6接觸。因此，可避免因高速模式用之接觸子C10〜C13接觸共通端子P3、P6，使得8〇模式之訊號傳輸特性發生變化而無法達到既定之傳輸速率的不良狀況》 . 又，根據本實施形態之記憶卡插座10，可無須於電子 β機器中設置如上所述之切換裝置，故無須對搭載記憶卡插座10之電子機器施以任何變更。藉此，變得容易將記憶卡插座10搭載於電子機器。第9圖表示本實施形態之記憶卡插座1〇之變形例。第 9圖中，專用接觸子C10〜C13的接觸端子71的連結部714 係被設置為較第6圖所示之例更靠近彈簧部7u。於本實施形態中，接觸防止部713係使專用接觸子ci〇〜cn產生彈性變形，但亦可構成為使用連桿（unk)機構耱等來使接觸子C10〜C13變形。 (實施形態2 ) 如第10圖〜第13圖所不，本實施形態之記憶卡插座 10A中，其專用接觸子C10〜C13的接觸端子71八，與實施形態1之記憶卡插座10不同》再者，對本實施形態之記憶卡插座10A與實施形‘態【之記憶卡插座1〇的共通構成，標注相同符號且省略其說明。接觸端子71A’具備：彈簣部7"、接觸部712、接觸 26 201021301 防止部713、及連結部714。彈簧部711形成為帶狀，自保持具51的後面朝後方突出。接觸部712係設於彈簧部711 的頂端。接觸防止部713,係被配置為於寬度方向（左右方向）上與接觸部712平行。接觸防止部713的頂端部（第 1〇圖中的上端部）構成抵接部715 ^連結部714將接觸部 • 712的頂端（第1〇圖中的下端）與接觸防止部713的後端 (第10圖中的下端）連結成一體。藉此，接觸防止部713 φ 於接觸部712的頂端與接觸部712連結成一體。亦即’實施形態1之接觸端子71中，接觸防止部713 係於彈簧部711的後端與彈簧部711及接觸部712連結，而相對於此’本實施形態之接觸端子71A中，接觸防止部 713係於接觸部712的頂端與彈簧部711及接觸部712連結。女插第2 s己憶卡MC 2時，如第1〇圖（b)所示，藉由間隔壁 1062、1063、1065、1066 的切口 1201 〜1204，抵 ® 接部715的下面（底面）與切口 1021〜1204的底面之間產生 - 間隙（抵接部715不與間隔壁1062、1063、1065、1066接觸）。此時，如第11圖所示，接觸部712接觸專用端子ρι〇〜P13，故專用接觸子C10〜C13與對應之專用端子ρι〇〜 P13導通。安插第1記憶卡MCI時（參照第12圖（a))，如第12 圖（b)所示，抵接部715的下面（底面）抵接間隔壁1〇62、 1063、1065、1066的上面（頂面），故來自間隔壁1〇62、1〇63、 1065、1066之反作用力將抵接部715朝上方推升。其結果， 27 201021301 如第13圖所示，於接觸部⑴與共通端子P3 生間隙’專用接觸子C1G〜⑴不與共通端子p3 p6^產與接= 形2Γ記憶卡插座⑽中，由於接觸防止部-與接觸。P 712係於接觸部712的頂端側連結成—體可提高接觸防止部713與接觸部712間之部位（連結部川）因此*插第！記憶卡㈣時，可使接觸部川確實地與接觸防止冑713—起向上方移動。亦即觸部m確實地自凹部1103、1106的底面抬升。而且，由於係-面使彈簧部711產生彈性變形—面推升接觸防止部 7U’故而可藉由彈簧冑711而確保充分之彈簧長度。藉此’可防止安插第i記憶卡MC1時專用接觸子Ci〇產生塑性變形。本實施形態中之接觸端子71A中，當將第i記憶卡Md 安插於記憶卡插座10A中時，如第14圖（〇所示，接觸防止部713先於接觸部712接觸本體1〇〇1。相對於此實參施形態1中之接觸端子71中，如第14圖（b)所示，係接 - 觸部712先於接觸防止部713接觸本體ι001 ^因此，接觸端子71A中，必需將接觸防止部713的抵接部715的彎曲量（較彎曲部位也就是連結部714更位於頂端侧的部分的長度）設定為較大。因此，於安插有先前記憶卡Mci之狀態下，接觸防止部713距離間隔壁1〇62、1063、1〇65、1066 的上面（頂面）的高度，高於實施形態i(參照第12圖（b)、第7圖（b))。第1 5圖係表示本實施形態之記憶卡插座丨〇 a之變形 28 201021301 例。該變形例中之接觸端子71A中，係使接觸部712的頂端沿厚度方向折疊而形成連結部714。藉由該連結部7 14，將接觸部712與接觸防止部713連結成一體。根據該構成，當插入第1記憶卡MCI時，接觸部712先於接觸防止部713 接觸本體1〇〇1，故可將接觸防止部713的彎曲量設置為較 /J\ 〇 (實施形態3 ) 如第16圖、第17圖所示，本實施形態之記憶卡插座其專用接觸子cl〇〜⑶的接觸端子nB，與實施形態1之記憶卡插座Π)不同。再者，對本實施形態之記憶卡插座10B與實施形態！之記憶卡插座1〇的共通構成標注相同的符號且省略其說明。再者，第16圖、第17圖中適當省略了一部分構成要素（例如接觸子ci〜c9及卡合片 44)之圖示。參接觸端子71B，具備：彈普部711、接觸部712、及接觸防止部7U。彈簧部711形成為帶狀，自保持具Η的後面朝後方突出。接觸防止部713係形成為自彈簧部川的頂端（第16圖、"丄固…中的下端）沿交又方向突出。上述交又方向為在與保持於上述插入位置之記憶卡mc的背面平 =面内與記憶卡Mc的長度方向交叉之方向。本實施形二’二述交又方向例如為保持於上述插入位置之記憶卡 Γ:成為度自方：(第16圖⑴中的左右方向)。接觸… 係I成為自接觸防止部713 丨713的頂端’朝向保持於上述插入 29 201021301 置之。己隐卡MC的長度方向的另一端侧（記憶卡插座的後侧）突出。亦即，於本實施形態之記憶卡插座丨〇B中，高速模式用之接觸子C10〜C13的接觸端子71B，並不分岔為彈簧部 711與接觸防止部713。該接觸子C10〜C13係於接觸端子 .71B的頂端（第16圖（a)中的下端）設置接觸部712，於 . 接觸端子71B的長度方向的中央設置接觸防止部713。亦籲即，接觸端？ 71B為曲柄形狀，包括頂端沿左右方向的一方向延設的L字形之第i片716、及自帛t片716的頂端朝後方延設之第2片717。第2片717的頂端成為接觸部 712，第1片716的頂端成為接觸防止部713。藉此，將接觸防止部713與接觸部712配置於一個接觸端子7ib上。又，於本實施形態中，接觸防止部713形成為平板狀。又，第2記憶卡MC2中’切口 12〇1〜12〇4係藉由對間隔 _壁1〇62、1063、1065、1〇66遍及高度方向（上下方向）的全長切除而形成。安插第2記憶卡MC2時，如第16圖（b)所示，藉由切口 1201〜12〇4,於接觸防止部713的下面（底面）與本體 1〇〇2的背面之間產生間隙。因此，接觸防止部713不接觸本體1002。此時，如第16圖（c)所示’接觸部712接觸專用端子ριο〜P13 ’專用接觸子C10〜C13與對應之專用端.子P10〜P13導通。接觸安插第1記憶卡MCI時，如第17圖（b)所示防止部713的下面（底面）抵接間隔壁1〇62、1〇63、 30 1065、 201021301 ι〇6ό的上面（頂面），來自間隔壁ι〇62、1063、1065、1〇66 之反作用力將接觸防止部71 3朝上方推升。其結果，如第 17圖（c)所示，於接觸部712與凹部11〇3、u 〇6的底面之間產生間隙，專用接觸子C10〜C 13不與共通端子p3、 P6導通。 . 本實施形態之記憶卡插座10B中，接觸部712係形成 • 於接觸防止部713的頂端。因此安插第1記憶卡MC丨時，〇可確實地使接觸部712自凹部1103、1106的底面抬升。本實施形態中，係一面使彈簧部711 (接觸端子71B 的後端與接觸防止部713之間之部分）產生彈性變形一面推升接觸防止部713。必須使彈簧部7丨丨充分長以使得在安插第1記憶卡MCI時專用端子P10〜P13不會產生塑性變形。由於彈簧部711的長度係由保持於上述插入位置之記憶卡MC的前端面與保持具51的後面之距離所決定，故而理想的是以可將彈簧部711設定成所期望的長度的方式 ® 來設定上述插入位置。 (實施形態4 ) 如第18圖、第19圖所示，本實施形態之記憶卡插座 10C的專用接觸子C10〜C13的接觸端子71C，與實施形態 3之記憶卡插座10B不同。再者，對本實施形態之記憶卡插座10C與實施形態3之記憶卡插座1〇B之共通構成，標 /主相同的符號且省略其說明。再者，第18圖及第19圖中省略了一部分構成要素（例如共通接觸子C〖、匚2、C4、 31 201021301 C5、C7〜C9及卡合片44)之圖示。接觸端子71C，具備彈簧部711、接 ^ 镬觸邛712、及接觸防止部713。彈簧部711形成為帶狀，知& +心目保持具5 1的後面朝後方突出。接觸防止部713係形雁马自彈簧部711的頂端（第18圖（a)中的下端），沿上又方向、例如保持述插入位置之記憶卡MC的寬度方向（第18圖⑴Further, the length of the contact terminal 61 (the amount of protrusion protruding from the rear surface of the holder 51) is longer than the length of the contact terminal 71. Further, the contact terminal 61' of the contact sub-small is longer than the contact terminal 6 of the other contact C2 to C9. Thus, the lengths of the contact ends + 61, 71 of the contact sub-C1 to CM3 are matched with the corresponding terminals Pi to P13 from the body _ Set by the distance of the front end face. Thereby, when the second memory card MC2 is inserted, the contact portions 612 and 712 of the respective contacts c1 to c13 can elastically contact the corresponding terminals pi to pi3. The dedicated contact members CIO to C13 and the common contact members C1 to C9 are close to each other in the left and right directions. In order to prevent the contactors C1 to C13 from coming into contact with each other, the dedicated contacts C10 to C13 are disposed below the common contacts C1 to C9 (on the side of the casing 40) (see Fig. (b)). When the second memory card MC2 is inserted, as shown in FIG. 1(b), the lower surface of the contact portion 715 of the contact preventing portion 713 is cut by the slits 1201 to 1204 of the partition walls 1062, 1063, 1065, and 1066 ( A gap is formed between the bottom surface and the bottom surfaces of the slits 1201 to 1204 provided in the partition walls 1062, 1063, 1065, and 1〇66. Therefore, the abutting portion 715 does not contact the partition walls 1〇62, 1〇63, 1065, and 1066. Therefore, as shown in Fig. 6, the contact portion 712 of the dedicated contact C10 to C13 24 201021301 contacts the dedicated terminals P10 to P13 which are formed on the bottom surfaces of the recesses 11〇3 and 11〇6. That is, when the second memory card MC2 is inserted, the contacts cio to C13 for the high speed mode are turned on with the corresponding dedicated terminals ρι〇 to P13. As shown in Fig. 7 (a) and (b), when the i-th memory card MC j is inserted, the lower surface (bottom surface) of the contact portion 715 of the contact preventing portion 713 abuts against the partition wall, 62 1063, 1065, 1066 Above (top). Thereby, the reaction force from the partition walls 1〇62, 1063, 1〇65, and W66 pushes the contact preventing portion 713 upward. When the contact preventing portion 713 is pushed up, the contact terminals 71 of the dedicated contacts C10 to C13 are elastically deformed, and the contact portion 712 is also moved upward together with the contact preventing portion 713. Thereby, the contact portion 712 is lifted from the bottom surfaces of the recessed portions 1103, 11B6. As a result, even when the contact portion 712 and the terminals P3 and P6 overlap in the vertical direction, as shown in Fig. 8, the contact portion 712 is separated from the common surface formed on the bottom surfaces of the concave portions 11〇3 and 11〇6. Terminals P3, P6. That is, the contactors C10 to C13 for the high speed mode are not electrically connected to the common terminals P3 and P6. In the memory card socket 10 of the present embodiment, when the memory card MC inserted in the memory card socket 10 is the second memory card MC2, the dedicated contacts C10 to C13 are brought into contact with the dedicated terminals ρι〇 to P13. When the memory card MC in the memory card socket 1 is the i-th memory card MC1, the dedicated contacts C10 to C13 are not in contact with the common terminals P3 and P6. In other words, the contacts C1 to C13 can be brought into contact with the terminals ρι to P13 in accordance with the type of the memory card Mc inserted in the memory card socket 1 in a state suitable for exerting the performance of each of the memory cards MC, especially when the second memory is inserted. In the case of the card MC2, the contact pins C10 to C13 for the high-speed mode 25 201021301 can be brought into contact with the terminals P10 to P13. On the other hand, when the first memory card MCI is inserted, the contact pins ~1 and the common terminal P3 for the high-speed mode can be prevented. , P6 contact. Therefore, it is possible to prevent the contact terminals C10 to C13 for the high-speed mode from contacting the common terminals P3 and P6, so that the signal transmission characteristics of the 8〇 mode are changed and the predetermined transmission rate cannot be achieved. The memory card socket 10 does not need to be provided with the above-described switching device in the electronic beta device, so that it is not necessary to apply any change to the electronic device in which the memory card socket 10 is mounted. Thereby, it becomes easy to mount the memory card socket 10 on an electronic device. Fig. 9 is a view showing a modification of the memory card socket 1 of the embodiment. In Fig. 9, the connection portion 714 of the contact terminals 71 of the dedicated contacts C10 to C13 is set closer to the spring portion 7u than the example shown in Fig. 6. In the present embodiment, the contact preventing portion 713 causes the dedicated contact members ci 〜 cn to be elastically deformed. However, the contact members C10 to C13 may be deformed by using an unk mechanism or the like. (Embodiment 2) As shown in Figs. 10 to 13 , in the memory card socket 10A of the present embodiment, the contact terminals 71 of the dedicated contacts C10 to C13 are different from the memory card socket 10 of the first embodiment. In addition, the common configuration of the memory card socket 10A of the present embodiment and the memory card socket 1A of the present embodiment will be denoted by the same reference numerals and will not be described. The contact terminal 71A' includes a magazine portion 7", a contact portion 712, a contact 26, a 201021301 prevention portion 713, and a coupling portion 714. The spring portion 711 is formed in a strip shape and protrudes rearward from the rear surface of the retainer 51. The contact portion 712 is provided at the top end of the spring portion 711. The contact preventing portion 713 is disposed in parallel with the contact portion 712 in the width direction (left-right direction). The distal end portion of the contact preventing portion 713 (the upper end portion in the first drawing) constitutes the abutting portion 715. The connecting portion 714 connects the distal end of the contact portion 712 (the lower end in the first drawing) and the rear end of the contact preventing portion 713. (the lower end in Fig. 10) is integrated into one. Thereby, the contact preventing portion 713 φ is integrally coupled to the contact portion 712 at the distal end of the contact portion 712. In the contact terminal 71 of the first embodiment, the contact preventing portion 713 is coupled to the spring portion 711 and the contact portion 712 at the rear end of the spring portion 711, and the contact prevention is prevented in the contact terminal 71A of the present embodiment. The portion 713 is coupled to the spring portion 711 and the contact portion 712 at the distal end of the contact portion 712. When the female inserts the second card MC 2, as shown in FIG. 1(b), the lower surface (bottom surface) of the contact portion 715 is obtained by the slits 1201 to 1204 of the partition walls 1062, 1063, 1065, and 1066. A gap is formed between the bottom surfaces of the slits 1021 to 1204 (the abutting portion 715 is not in contact with the partition walls 1062, 1063, 1065, and 1066). At this time, as shown in Fig. 11, the contact portion 712 is in contact with the dedicated terminals ρι〇 to P13, so that the dedicated contacts C10 to C13 are electrically connected to the corresponding dedicated terminals ρι〇 to P13. When the first memory card MCI is inserted (see Fig. 12(a)), as shown in Fig. 12(b), the lower surface (bottom surface) of the abutting portion 715 abuts against the partition walls 1〇62, 1063, 1065, 1066. The upper surface (top surface) is such that the reaction force from the partition walls 1〇62, 1〇63, 1065, and 1066 pushes the abutting portion 715 upward. As a result, 27 201021301, as shown in Fig. 13, a gap is formed between the contact portion (1) and the common terminal P3. The dedicated contact C1G to (1) is not connected to the common terminal p3 p6 and is connected to the memory card socket (10). Prevention - contact. P 712 is connected to the distal end side of the contact portion 712. The portion between the contact preventing portion 713 and the contact portion 712 can be increased (the connection portion is formed). In the case of the memory card (4), the contact portion can be surely moved upward with the contact preventing 胄713. That is, the contact portion m is surely lifted from the bottom surface of the recessed portions 1103, 1106. Further, since the spring portion 711 is elastically deformed by the system-surface, the surface push-up contact preventing portion 7U' can secure a sufficient spring length by the spring 胄 711. By this, it is possible to prevent plastic deformation of the dedicated contact Ci2 when the i-th memory card MC1 is inserted. In the contact terminal 71A of the present embodiment, when the i-th memory card Md is inserted into the memory card socket 10A, as shown in FIG. 14 (〇, the contact preventing portion 713 contacts the body 1〇〇 before the contact portion 712). With respect to the contact terminal 71 in the first embodiment, as shown in FIG. 14(b), the contact-contact portion 712 contacts the body ι001 before the contact preventing portion 713. Therefore, in the contact terminal 71A, it is necessary. The amount of bending of the abutting portion 715 of the contact preventing portion 713 (the length of the portion where the connecting portion 714 is located further on the distal end side) is set to be larger. Therefore, in the state in which the previous memory card Mci is inserted, the contact is made. The height of the upper portion (top surface) of the preventing portions 713 from the partition walls 1〇62, 1063, 1〇65, and 1066 is higher than that of the embodiment i (see FIGS. 12(b) and 7(b)). 5 is a view showing a modification of the memory card socket 丨〇a of the present embodiment. In the contact terminal 71A of the modification, the distal end of the contact portion 712 is folded in the thickness direction to form a coupling portion 714. The connecting portion 7 14 integrally connects the contact portion 712 and the contact preventing portion 713 According to this configuration, when the first memory card MCI is inserted, the contact portion 712 comes into contact with the body 1〇〇1 before the contact preventing portion 713, so that the amount of bending of the contact preventing portion 713 can be set to be /J\ (Embodiment 3) As shown in Figs. 16 and 17, the memory card socket of the present embodiment differs from the contact terminal nB of the dedicated contact pins c1 to (3) in the memory card socket of the first embodiment. Furthermore, the memory card socket 10B and the embodiment of the present embodiment are provided! The common components of the memory card socket 1 are denoted by the same reference numerals and the description thereof will be omitted. Further, in the sixteenth and seventeenth drawings, a part of the constituent elements (e.g., the contact members ci to c9 and the engaging piece 44) are appropriately omitted. The reference contact terminal 71B includes a spring portion 711, a contact portion 712, and a contact preventing portion 7U. The spring portion 711 is formed in a belt shape and protrudes rearward from the rear surface of the holding member. The contact preventing portion 713 is formed so as to protrude in the direction of the intersection from the tip end of the spring portion (the lower end in Fig. 16 and "丄...). The direction of intersection is a direction intersecting the longitudinal direction of the memory card Mc in the plane of the back surface of the memory card mc held at the insertion position. In the second embodiment, the direction of the intersection is, for example, a memory card held at the insertion position: the degree is the same as (the left-right direction in Fig. 16 (1)). The contact I becomes the tip end of the self-contact preventing portion 713 丨 713 and is held by the insertion 29 201021301. The other end side of the length direction of the hidden card MC (the rear side of the memory card socket) protrudes. That is, in the memory card socket 丨〇B of the present embodiment, the contact terminals 71B of the contact pins C10 to C13 for the high speed mode are not divided into the spring portion 711 and the contact preventing portion 713. The contactors C10 to C13 are provided with a contact portion 712 at the distal end of the contact terminal .71B (the lower end in Fig. 16(a)), and a contact preventing portion 713 is provided at the center of the contact terminal 71B in the longitudinal direction. Also called, the contact end? The 71B is in the shape of a crank, and includes an L-shaped ith piece 716 whose tip is extended in one direction in the left-right direction, and a second piece 717 which is extended rearward from the tip end of the 帛t piece 716. The distal end of the second piece 717 serves as the contact portion 712, and the distal end of the first piece 716 serves as the contact preventing portion 713. Thereby, the contact preventing portion 713 and the contact portion 712 are disposed on one contact terminal 7ib. Further, in the present embodiment, the contact preventing portion 713 is formed in a flat plate shape. Further, in the second memory card MC2, the slits 12〇1 to 12〇4 are formed by cutting the entire lengths of the partition walls 1〇62, 1063, 1065, and 1〇66 in the height direction (up and down direction). When the second memory card MC2 is inserted, as shown in Fig. 16(b), a gap is formed between the lower surface (bottom surface) of the contact preventing portion 713 and the back surface of the body 1〇〇2 by the slits 1201 to 12〇4. Therefore, the contact preventing portion 713 does not contact the body 1002. At this time, as shown in Fig. 16(c), the contact portions 712 are in contact with the dedicated terminals ριο to P13'. The contact pins C10 to C13 are electrically connected to the corresponding dedicated terminals. The sub-P10 to P13 are turned on. When the first memory card MCI is placed in contact with the first memory card MCI, the lower surface (bottom surface) of the preventing portion 713 abuts against the upper surface (top surface) of the partition walls 1〇62, 1〇63, 30 1065, 201021301 ι〇6ό as shown in Fig. 17(b). The reaction forces from the partition walls ι 62, 1063, 1065, and 1 〇 66 push the contact preventing portion 71 3 upward. As a result, as shown in Fig. 17(c), a gap is formed between the contact portion 712 and the bottom surfaces of the concave portions 11?3, u?6, and the dedicated contact members C10 to C13 are not electrically connected to the common terminals p3, P6. In the memory card socket 10B of the present embodiment, the contact portion 712 is formed at the distal end of the contact preventing portion 713. Therefore, when the first memory card MC is inserted, the contact portion 712 can be surely lifted from the bottom surfaces of the recesses 1103 and 1106. In the present embodiment, the contact preventing portion 713 is pushed up while elastically deforming the spring portion 711 (the portion between the rear end of the contact terminal 71B and the contact preventing portion 713). It is necessary to make the spring portion 7丨丨 sufficiently long so that the dedicated terminals P10 to P13 do not undergo plastic deformation when the first memory card MCI is inserted. Since the length of the spring portion 711 is determined by the distance between the front end surface of the memory card MC held at the insertion position and the rear surface of the holder 51, it is preferable to set the spring portion 711 to a desired length. To set the above insertion position. (Embodiment 4) As shown in Figs. 18 and 19, the contact terminals 71C of the dedicated contacts C10 to C13 of the memory card socket 10C of the present embodiment are different from those of the memory card socket 10B of the third embodiment. The memory card socket 10C of the present embodiment is the same as the memory card socket 1B of the third embodiment, and the same reference numerals are used for the same reference numerals and the description thereof will not be repeated. Further, in Figs. 18 and 19, a part of constituent elements (e.g., common contact C, 匚2, C4, 31 201021301 C5, C7 to C9, and engaging piece 44) are omitted. The contact terminal 71C includes a spring portion 711, a contact 712, and a contact preventing portion 713. The spring portion 711 is formed in a belt shape, and the rear side of the <RTIgt; The contact preventing portion 713 is formed by the top end of the spring portion 711 (the lower end in Fig. 18(a)), and in the upper direction, for example, the width direction of the memory card MC holding the insertion position (Fig. 18(1)

中的左右方向）突出。接觸冑712係形成為自接觸防止部 713的頂端沿上述交叉方向突出。亦即’於本實施形態之記憶卡插座㈣中，高速模式用之接觸子CH)〜C13的接觸端子71C形成為l字形其具備.以前後方向作為長度方向的帶狀之帛i片716、及自第1片716的頂端沿左右方向的一方向延設之第2片 717。第2片717的頂端朝下方寶折。該第2 # m的項端構成接觸部712。該接觸部712的頂端（下端）為圓弧狀。另一方面，第2片717的中央部構成接觸防止部713。接觸防止部713，係被定位成橫跨凹部11〇3、11〇6及與其鄰接之凹部 1102、11〇4、11〇5、11〇7。安插第2記憶卡MC2時，如第18圖（15)所示，藉由切口 1201〜1204而防止接觸防止部713與本體1〇〇2接觸。此時，如第18圖（c)所示，接觸部712接觸專用端子Ρ10〜Ρ13。藉此，專用接觸子cl〇〜cl3與對應之專用端子P10〜P13導通。安插第1記憶卡MCI時，如第19圖（b)所示，接觸防止部713觸抵間隔壁ι〇62、1〇63、1〇65、1〇66而朝上方 32 201021301 推升。藉此，真爾垃細7 專用接觸子C10〜C13產生 712遠離共通端子仗接觸〇丨。其結果，即便如第19圖（a) 般接觸部712與丘播袖2 τ» 興，、通端子P3、p6於上下方向重疊，但如第 19圖（c)所不般於接觸部712與共通端子M M之間形稽此寻用接觸子C10〜C13不與共通端、 P6導通》 . *根據本實施形態之記憶卡插座10C，可使接觸防止 _部713朝後方（第18圖（a)的下方）遠離保持具直至與接觸部712相同的位置為止。因此，可使彈簧部7ιι 較實施形態3之記憶卡插座_更長，可防止安插第i記憶卡MCI時專用接觸子cl〇〜C13產生塑性變形。且說，於第18圖所示之第2記憶卡MC2中，切口 ΐ2〇ι 〜1204的長度（第18圖（a)中的上下方向之尺寸）係較第16圖所示之第2記憶卡MC2更長，以使得本實施形態中之接觸端子71C的接觸防止部713不會與間隔壁ι〇62、 • 1063、1065、1066 接觸。例如，於間隔壁 1062、1063、1065、 . 1066的長度為6.0mm之情形時，切口 1201〜1204之長度於第16圖所示之第2記憶卡MC2中係設為2.5 mm，於第 18圖所示之第2記憶卡MC2中係設為 3.0 mm。 (實施形態5 ) 如第20圖、第21圖所示’本實施形態之記憶卡插座 10D的專用接觸子C10〜C13之接觸端子71D及保持區塊 50D與實施形態4之記憶卡插座1 〇c不同。再者，對本實 33 201021301 施形態之記憶卡插座10D與實施形態4之記憶卡插座i〇c 之共通構成，標注相同之符號且省略其說明。再者第圖及第21 K中適當省略了一部分構成要例如接觸子 Cl C2、C4、C5、C7〜C9及卡合片44)之圖示。保持區塊50D形成為俯視u字形。保持區塊5〇D，具 .備：保持具51、銷（第1銷）52以及自保持具51之左端朝後方突出之稜柱狀之銷（第2銷）53。第2銷53係沿底 •殼3〇的左側的側片32的前後方向配置，構成插座本體20 的左壁。接觸端子71D，具備：彈簧部711、接觸部712、及接觸防止部713。彈簧部711形成為帶狀。專用接觸子C10、 C11的彈簧部711，自與保持於上述插入位置之記憶卡的寬度方向的一側面（左側面）相向之插座本體2〇的内側面（第2銷53的右側面）’沿上述交叉方向（第2〇圖（&) 中的右方向）突出。另一方面，專用接觸子Cl2 ci3的 • 彈簧部711自與保持於上述插入位置之記憶卡Mc的寬度 .方向的另一側面（右側面）相向之插座本體20的内側面（第 1銷52的左側面），沿上述交叉方向（第2〇圖（心中的左方向）突出《接觸防止部713係形成為自彈簧部711的頂端沿上述交又方向突出。接觸部712係形成為自接觸防止部713的頂端沿上述交又方向突出。亦即’將與端子P10、P11對應之接觸子Cl〇、cil保持於左側之第2銷53 ’將與端子P12、P13對應之接觸子 C12、C13保持於右側之第i銷52。各接觸端子7id形成 34 201021301 為以《己隐卡插座10D之左右方向作為長度方向之帶狀。接觸端子71D的頂端部構成接觸部712，接觸端子的中央部構成接觸防止部713。此處，接觸子cl〇、cu (ci2、 C1 3 )係配置為沿前後方向排列。前方（第20圖（a)中的上方）之接觸子Cll (C12)的接觸部712，自接觸防止部 • 713朝後方突出。再者，專用接觸子cl〇〜C13係配置於共通接觸子C1〜C9之下方。因此’即便於共通接觸子C1〜 ❹C9與專用接觸子cl〇〜C13交又之位置，共通接觸子以〜C9與專用接觸子C10〜C13亦不相互接觸。且說，於第2記憶卡MC2中，如第2〇圖（a)所示，於虽將第2記憶卡MC2以上述插入位置而保持於記憶卡插座10D中時，於厚度方向上與接觸端子7lD的接觸防止部 713重疊的間隔壁1〇61、1〇62、1〇66、1〇67中形成有切口 1205、1201、1204、1206。亦即，於抵觸接觸子ci〇〜 C13的接觸端子71D的間隔壁ι〇61、1〇62、1〇66、1〇67中， .形成有切口 1205、1201、1204、1206。換言之，於位於底面设有專用端子pl〇、pil之凹部11〇3與第ι切口部之間的間隔壁1061、1062,以及位於底面設有專用端子 P12、P13之凹部1106與本體1〇〇2的右邊緣之間的間隔壁 1066、1067 中’均形成有切口 1205、1201、1204、1206。又，於第2記憶卡MC2地右端，形成有用於防止與專用接觸子C12、C13的彈簧部711接觸之切口 1207。安插第2記憶卡MC2時，如第20圖（b)所示，由於存在切口 1201、1204〜1206，故而接觸防此部713不接觸 35 201021301 本體1002。此時，如第2〇圖（c)所示接觸部接觸專用端子P1〇〜P13,藉此專用接觸子cl〇〜⑴與對應之專用端子P10〜P13導通。 * 安插第1記憶卡MCI時，如第21圖（b)所示，接觸防止部713觸抵間隔壁1〇61、1〇62、1〇66、1〇67，藉此將 .接觸防止部⑴朝上方推升。其结果，如第21圖所示於 •接觸部712與設於凹部1103、1106之底面的共通端子ρι β〜P9之間產生間隙，專用接觸子CIO〜C13不與共通端子 P3、P6導通。若根據本實施形態之記憶卡插座10D，可不考慮保持於上述插入位置之圮憶卡MC的前端面與保持具Η的後面之間的距離而將彈簧部711的長度設計為所期望之值。因此，即便保持於上述插入位置之記憶卡Mc的前端面與保持具51的後面的距離較短，亦可充分確保彈簧部η〗的長度，從而可防止安插帛！記憶卡MC1時專用接觸子ci〇〜尊 C13產生塑性變形。 (實施形態6 ) 如第22〜24圖所示’本實施形態之記憶卡插座10E’ 具備：扁平之矩形箱狀之插座本體2〇E，該插座本體2〇E 包含底殼3〇E及罩殼40。又，記憶卡插座10E，具備：接觸子C1〜C13、保持接觸子C1〜C13之保持區塊5〇E、滑塊8〇及鎖疋機構（未圖示）。再者’對本實施形態之記隐卡插座10E與實施形態i之記憶卡插座1〇之共通構成， 36 201021301 標注相同之符號且省略其說明。此處，第27圖係表不第i記憶卡MC1，第28圖係表示第2 „己憶卡MC2。第28圖所示之第2記憶卡MC2中，未形成有切口 1200。第2記憶卡MC2的凹部11〇〇( 11〇2〜11〇8)的前後方 .向（第28圖中之上下方向）之尺寸L2，大於第1記憶卡 MCI的凹部1100 ( 1102〜11〇8)的前後方向（第27圖中 ❹之上下方向）之尺寸L1 (亦即L2>L1)。第i記憶卡MC1 的凹部1103 ( 1106 )形成於第1記憶卡MC1的本體1〇〇1 中構成底面配置有共通端子P3(P6)之第1凹部1301 (1302)。相對於此，第2記憶卡MC2的凹部ιι〇3( 11〇6)，被形成於第2記憶卡MC2的本體1 〇〇2中，構成底面配置有共通端子P3 (P6)及專用端子Pi〇、pii (pi2、pi3) 之第2凹部1401( 1402)。由於第2記憶卡MC2的凹部11〇〇 (1102〜1108)的前後方向的尺寸L2大於第1記憶卡MC1 • 的凹部1100 ( 1102〜1108)的前後方向的尺寸L1，故而第 • 2凹部1401、1402的長度方向的另一端側（第28圖中的下端側）的面（後端面）1411、1412’位於較第1凹部13〇卜 1302的長度方向的另一端側（第27圖中之下端側）的面 (後端面）1311、1312，更偏向長度方向的另一端側（第 28圖中的下端側）。於底殻3 0E的頂板31，具備：用於使接觸子C10〜C13 的構裝端子72自插座本體20E面向外部之通孔36。通孔 36係形成於較通孔34更後方。 37 201021301 具備：保持具（共通 (專用保持具）54。保持區塊50E，如第24圖所示保持具）51、銷52、53以及保持具於共通保持具51巾，壓人並目定有與九個共通端子Η 〜P9分別對應之九個共通接觸子（第ι接觸子）各共通接觸子C1〜C9的接觸側（接點部612)，朝共通保持具51的後面側（卡片槽21側）突i於共通保持具ηThe left and right direction of the protrusion). The contact port 712 is formed so as to protrude from the tip end of the contact preventing portion 713 in the above-described intersecting direction. In the memory card socket (4) of the present embodiment, the contact terminals 71C of the contacts CH) to C13 for the high-speed mode are formed in a l-shaped shape, and the strip-shaped y-slice 716 having the longitudinal direction is used in the front and rear directions. And a second piece 717 extending from one end of the first piece 716 in one direction in the left-right direction. The top end of the second piece 717 is folded downward. The term end of the 2nd #m constitutes the contact portion 712. The tip end (lower end) of the contact portion 712 has an arc shape. On the other hand, the central portion of the second piece 717 constitutes the contact preventing portion 713. The contact preventing portion 713 is positioned to straddle the recesses 11〇3, 11〇6 and the recesses 1102, 11〇4, 11〇5, 11〇7 adjacent thereto. When the second memory card MC2 is inserted, as shown in Fig. 18 (15), the contact preventing portion 713 is prevented from coming into contact with the main body 1〇〇2 by the slits 1201 to 1204. At this time, as shown in Fig. 18(c), the contact portion 712 contacts the dedicated terminals Ρ10 to Ρ13. Thereby, the dedicated contact pins cl1 to cl3 are turned on with the corresponding dedicated terminals P10 to P13. When the first memory card MCI is inserted, as shown in Fig. 19(b), the contact preventing portion 713 is pushed up against the partition walls ι 62, 1 〇 63, 1 〇 65, and 1 〇 66 and is pushed upward toward 32 201021301. Thereby, the special contact pins C10 to C13 of the genre 7 are generated 712 away from the common terminal 仗 contact 〇丨. As a result, even if the contact portion 712 and the mound sleeve 2 τ are as shown in Fig. 19(a), the through terminals P3 and p6 overlap in the vertical direction, but the contact portion 712 is not as shown in Fig. 19(c). Between the common terminal MM and the common terminal MM, the contact terminals C10 to C13 are not electrically connected to the common terminal, and P6 is turned on. * According to the memory card socket 10C of the present embodiment, the contact preventing portion 713 can be made rearward (Fig. 18 ( The lower part of a) is away from the holder until it is at the same position as the contact portion 712. Therefore, the spring portion 7 can be made longer than the memory card socket_ of the third embodiment, and it is possible to prevent plastic deformation of the dedicated contact members cl〇 to C13 when the i-th memory card MCI is inserted. In addition, in the second memory card MC2 shown in Fig. 18, the length of the slits 〇2〇ι to 1204 (the dimension in the vertical direction in Fig. 18(a)) is the second memory card shown in Fig. 16. The MC2 is longer so that the contact preventing portion 713 of the contact terminal 71C in the present embodiment does not come into contact with the partition walls ι 62, 1063, 1065, 1066. For example, when the length of the partition walls 1062, 1063, 1065, . 1066 is 6.0 mm, the length of the slits 1201 to 1204 is set to 2.5 mm in the second memory card MC2 shown in FIG. The second memory card MC2 shown in the figure is set to 3.0 mm. (Embodiment 5) As shown in Fig. 20 and Fig. 21, the contact terminals 71D and the holding block 50D of the dedicated contacts C10 to C13 of the memory card socket 10D of the present embodiment and the memory card socket 1 of the fourth embodiment are as follows. c is different. In addition, the common configuration of the memory card socket 10D of the present embodiment and the memory card socket i〇c of the fourth embodiment will be denoted by the same reference numerals and will not be described. Further, in the drawings and the 21st K, a part of the configuration, for example, the contact members Cl C2, C4, C5, C7 to C9, and the engaging piece 44) are appropriately omitted. The holding block 50D is formed in a U-shape in plan view. The holding block 5〇D is provided with a retainer 51, a pin (first pin) 52, and a prismatic pin (second pin) 53 projecting rearward from the left end of the holder 51. The second pin 53 is disposed along the front-rear direction of the side piece 32 on the left side of the bottom case 3〇, and constitutes the left wall of the socket body 20. The contact terminal 71D includes a spring portion 711, a contact portion 712, and a contact preventing portion 713. The spring portion 711 is formed in a strip shape. The spring portion 711 of the dedicated contactors C10 and C11 is formed on the inner side surface (the right side surface of the second pin 53) of the socket body 2A facing the one side surface (left side surface) of the memory card held in the insertion position. It protrudes along the above-mentioned crossing direction (the right direction in the second figure (&)). On the other hand, the spring portion 711 of the dedicated contact Cl2 ci3 is opposed to the inner side surface of the socket body 20 (the first pin 52) facing the other side (right side surface) of the width direction of the memory card Mc held at the above insertion position. The left side surface is protruded in the intersecting direction (the second drawing (the left direction in the center). The contact preventing portion 713 is formed so as to protrude from the distal end of the spring portion 711 in the direction of the intersection. The contact portion 712 is formed to be self-contact. The tip end of the preventing portion 713 protrudes in the direction of the above-mentioned intersection direction. That is, the contact pin C12 corresponding to the terminals P12 and P13, which holds the contact pins C1 and cil corresponding to the terminals P10 and P11 on the left side, C13 is held on the right i-th pin 52. Each contact terminal 7id is formed 34. 201021301 is a strip shape in which the left-right direction of the hidden card socket 10D is the longitudinal direction. The distal end portion of the contact terminal 71D constitutes the contact portion 712, and the center of the contact terminal The contact portion 713 is configured to be arranged in the front-rear direction, and the contact C11 (C12) of the front side (above in FIG. 20(a)) is arranged. Contact portion 712, self-connected The prevention unit 713 protrudes toward the rear. Further, the dedicated contact pins c1 to C13 are disposed below the common contact C1 to C9. Therefore, even if the common contact C1 to C9 and the special contact c1 to C13 are placed, In the position, the common contact is not in contact with the C9 and the dedicated contact C10 to C13. Further, in the second memory card MC2, as shown in the second figure (a), the second memory card MC2 is used. When the memory card socket 10D is held in the above-described insertion position, a slit is formed in the partition walls 1〇61, 1〇62, 1〇66, and 1〇67 which overlap with the contact preventing portion 713 of the contact terminal 71D in the thickness direction. 1205, 1201, 1204, and 1206. That is, in the partition walls ι 61, 1〇62, 1〇66, and 1〇67 of the contact terminals 71D of the contact ci〇~C13, the slits 1205 and 1201 are formed. 1204, 1206. In other words, the partition walls 1061 and 1062 between the recessed portion 11〇3 and the first vacant portion of the dedicated terminal pl〇, pil, and the recessed portion 1106 having the dedicated terminals P12 and P13 on the bottom surface. The partition walls 1066, 1067 between the right edge of the body 1〇〇2 are formed with Incisions 1205, 1201, 1204, and 1206. Further, a slit 1207 for preventing contact with the spring portions 711 of the dedicated contactors C12 and C13 is formed at the right end of the second memory card MC2. When the second memory card MC2 is inserted, As shown in FIG. 20(b), since the slits 1201, 1204 to 1206 are present, the contact preventing portion 713 does not contact the 35 201021301 body 1002. At this time, as shown in Fig. 2(c), the contact portions contact the dedicated terminals P1 to P13, whereby the dedicated contacts c1 to (1) are electrically connected to the corresponding dedicated terminals P10 to P13. * When the first memory card MCI is inserted, as shown in Fig. 21(b), the contact preventing portion 713 comes into contact with the partition walls 1〇61, 1〇62, 1〇66, and 1〇67, thereby making the contact preventing portion (1) Push up. As a result, as shown in Fig. 21, a gap is formed between the contact portion 712 and the common terminals ρι to P9 provided on the bottom surfaces of the concave portions 1103 and 1106, and the dedicated contact members C10 to C13 are not electrically connected to the common terminals P3 and P6. According to the memory card socket 10D of the present embodiment, the length of the spring portion 711 can be designed to a desired value irrespective of the distance between the front end surface of the memory card MC held at the insertion position and the rear surface of the holder. Therefore, even if the distance between the front end surface of the memory card Mc held at the insertion position and the rear surface of the holder 51 is short, the length of the spring portion η can be sufficiently ensured, and the insertion can be prevented! When the memory card MC1 is dedicated to the contact ci〇~ 尊 C13 produces plastic deformation. (Embodiment 6) As shown in Figs. 22 to 24, the memory card socket 10E' of the present embodiment includes a flat rectangular box-shaped socket body 2A, and the socket body 2E includes a bottom case 3E and Cover 40. Further, the memory card socket 10E includes a contact C1 to C13, a holding block 5A for holding the contact C1 to C13, a slider 8A, and a lock mechanism (not shown). In addition, the common structure of the memory card socket 10E of the present embodiment and the memory card socket 1 of the embodiment i are denoted by the same reference numerals, and the description thereof will be omitted. Here, Fig. 27 shows the ith memory card MC1, and Fig. 28 shows the XX memory card MC2. In the second memory card MC2 shown in Fig. 28, the slit 1200 is not formed. The dimension L2 of the front and rear sides of the concave portion 11〇〇 (11〇2 to 11〇8) of the card MC2 is larger than the concave portion 1100 (1102 to 11〇8) of the first memory card MCI. The dimension L1 (that is, L2 > L1) of the front-rear direction (the upper and lower directions of the ❹ in the Fig. 27). The concave portion 1103 (1106) of the i-th memory card MC1 is formed in the body 1〇〇1 of the first memory card MC1. The first recess 1301 (1302) of the common terminal P3 (P6) is disposed on the bottom surface. On the other hand, the recess ιι 3 (11〇6) of the second memory card MC2 is formed on the body 1 of the second memory card MC2. In the second embodiment, the second recess 1401 (1402) in which the common terminal P3 (P6) and the dedicated terminals Pi〇 and pii (pi2, pi3) are disposed on the bottom surface is formed. The recess 11 〇〇 (1102 to 1108) of the second memory card MC2 is formed. The dimension L2 in the front-rear direction is larger than the dimension L1 in the front-rear direction of the recess 1100 (1102 to 1108) of the first memory card MC1. Therefore, the other end side of the second recess 1401 and 1402 in the longitudinal direction The surface (rear end surface) 1411, 1412' of the lower end side in the second drawing portion is located on the other end side (the lower end side in the twenty-first drawing side) of the first recessed portion 13 〇 1302 in the longitudinal direction (rear end surface) 1311 1312 is further biased toward the other end side in the longitudinal direction (the lower end side in FIG. 28). The top plate 31 of the bottom case 30E is provided with the mounting terminal 72 for contacting the contacts C10 to C13 from the socket body 20E. The outer through hole 36. The through hole 36 is formed further behind the through hole 34. 37 201021301 is provided with: a holder (common (private holder) 54. holding block 50E, as shown in Fig. 24) 51, The pins 52, 53 and the holder are held in the common holder 51, and the nine common contacts (the first contact) corresponding to the nine common terminals Η to P9 are respectively indented, and the common contacts C1 to C9 are respectively pressed. The contact side (contact portion 612) protrudes toward the rear side (card groove 21 side) of the common holder 51 in the common holder η

的後面右端，設有保持後述之螺旋彈簣83的一端的彈簧座 (未圖示）。專用保持具54,形成為以左右方向作為長度方向之棱柱狀，以與共通保持具51相向之形態而配置。專用保持具 5心將銷52、53的前後方向的大致中間部彼此連結。專用保持具54,係以可在罩殼4G的底板41與專用保持具^ 之間配置記憶卡MC之方式，於底殼观冑（上側）將銷 52、53彼此連結（參照第22圖）。又’專用保持具η位於較保持於上述插入位置之記憶卡MC的端子ρι〜ρΐ3更偏向卡片槽21侧（參照第25、26圖）。於專用保持具54中，壓入並固定有與四個專用端子 P10〜P13分別對應之四個專用接觸子（第2接觸子）c1〇〜C13。各專用接觸子CIO〜C13之接觸側（接點部713) 朝專用保持具54之前面側（記憶卡之插入方向）突出。如此’於本實施形態之記憶卡插座10E中，共通接觸子C1〜C9與專用接觸子C10〜C13係於記憶卡Mc之插入方向（第24圖中之上下方向）上彼此相向。如第22圖所示，專用接觸子C10〜C13形成為以前後 38 201021301 方向作為長度方向之；^ μ & 之帶狀其則端側係用作接觸端子 71Ε’後端側用作構裝稱衮端子72,接觸端子71Ε與構裝端子 72之間的部位，係用作以寻用保持具54中之連結部接觸端子71E，具備：自連結部73的前端（第24圖中的上端）朝前方突出之彈簧部（突出部）川及設於彈菁部711的頂端（第24圖中的上端）之接觸部712。At the rear right end, a spring seat (not shown) that holds one end of a screw magazine 83 to be described later is provided. The dedicated holder 54 is formed in a prismatic shape having a longitudinal direction in the left-right direction, and is disposed to face the common holder 51. The dedicated holder 5 connects the substantially intermediate portions of the pins 52 and 53 in the front-rear direction to each other. In the dedicated holder 54, the pins 52 and 53 are connected to each other in the bottom case (upper side) so that the memory card MC can be disposed between the bottom plate 41 of the cover 4G and the dedicated holder (refer to Fig. 22). . Further, the dedicated holder η is located on the side of the card slot 21 more than the terminals ρι to ρ3 of the memory card MC held at the above-described insertion position (see Figs. 25 and 26). In the dedicated holder 54, four dedicated contacts (second contacts) c1 to C13 corresponding to the four dedicated terminals P10 to P13 are press-fitted and fixed. The contact side (contact portion 713) of each of the dedicated contacts C10 to C13 protrudes toward the front side of the dedicated holder 54 (in the insertion direction of the memory card). In the memory card socket 10E of the present embodiment, the common contacts C1 to C9 and the dedicated contacts C10 to C13 are opposed to each other in the insertion direction (upward and downward direction in Fig. 24) of the memory card Mc. As shown in Fig. 22, the dedicated contactors C10 to C13 are formed in the longitudinal direction of the front and rear 38 201021301; the strip shape of the ^ μ & the end side is used as the contact terminal 71 Ε 'the rear end side is used as the structure The terminal 72, the portion between the contact terminal 71A and the component terminal 72 is used as the connection portion contact terminal 71E in the seek holder 54, and includes the front end of the connection portion 73 (the upper end in Fig. 24). a spring portion (protrusion portion) protruding forward, and a contact portion 712 provided at a tip end (upper end in FIG. 24) of the elastic portion 711.

m 彈簧部711的中央部彎折成曲柄狀。彈簧部711中之 f折的部位即折曲部，構成接觸防止冑（攀㈣）WE。該接觸防止部713E’係構成為如下：當將第i記憶卡體保持於上述插入位置時，其觸抵第t凹部13〇卜i3〇2的後端面1311、1312而被自第i凹部13〇1、13〇2内推出至第 1凹部130卜1302夕卜，當將第2記憶卡MC2保持於上述插入位置時，其不觸抵第2凹部14〇1、14〇2的後端面MU、 ⑷2而位於第2凹部_、1術内。當將該接觸防止部 713E自第i凹部13()1、13()2内推出至第ι凹部i3()i、聰外時，專用接觸子C10〜C13,產生變形使其不接觸第玉凹部⑽卜⑽内之共通端子p3、p6。另—方面，當接觸防止部713E位於第2凹部1401、14〇2内時，專用接觸子 C10〜C13不變形，從而專用接觸子cl〇〜cu接觸第2凹部1401、1402内之專用端子ρι〇〜ρΐ3。如此，專用接觸子C10〜C13係具備··自專用保持具 54朝保持於上述插入位置之記憶卡MC的長度方向的一端侧（前端側）突出之突出部即彈簧部7丨丨；以及設於彈簧 39 201021301 部7U的頂端而用於接觸專用端子ρι〇〜pi3之接觸部 712。而且，作為接觸防止機構之接觸防止部7i3E，係^ 於彈簧部7U的專用接觸子〜⑶的接觸部712與：結部73之間之部位。〜構裝端子72係贊折成曲柄狀，以自對應之通孔％露出至插座本體20E之外部。滑塊80係以於沿記憶卡MC之插入方向（帛μ圖中 ❿ 磨之上下方向）t前後方向上移動自如之方式而配置於插座本體2犯内。滑塊8〇與自卡片# 21插入之記憶卡批之頂端（前端）對接，受到來自記憶卡⑽之推力而與記憶卡MC —同朝前方移動。滑塊80為合成樹脂成形品，一體地具備第i側部η 與第2側部82。第！側部81形成為條狀且形成為抵接記憶卡MC的本體10〇〇的左侧面之形態。於第ι側部μ 的内側面的下側緣，一體地突設有沿記憶+ MC之插入方向延伸’且與記憶| Mc的背面相向之段部8ιι (參照第 36圖）。第2側部82，自第1侧部81的頂端部（前端部）朝右方突出°第2侧部82係形成為抵接由本體1001的切口 1020形成之錐形面以及由本體臓的第^刀口部咖形成之錐形面的形態。當於記憶卡插座⑺Ε中插入第1記隐卡MC1時，由第1記憶卡MCI的切口部1〇2〇形成之錐形面與第2側部82的傾斜面對接，當插人第2記憶卡贈時’由第2記憶卡MC2的第i切口部咖形成之錐形面與第2側部82的傾斜面對接》其結果，滑塊80受到來自 201021301 記憶卡MC之推力而朝前方移動。置之狀態的前端位再者’於將記憶卡MC插人到達上述插入位下，第1記憶卡MCI的前端與第2記憶卡⑽ 於相同位置。於該滑塊80盘共捕保姓：i^ _ 一兴逋保持具51的彈簧座之間，介設 • ^對滑塊8〇朝後方（卡片槽21側）施力之螺旋彈簧83。 • 上述鎖定機構（滑塊鎖定機構）將滑塊80固定，以使鬱其不自特疋位置（第25、26圖所示之位置）後退。上述鎖定機構，將滑塊㈣定後，藉由朝前方推壓記憶卡㈣而使滑塊8G朝前方移動，從而將滑塊8()之固定解除。再者，關於滑塊80、施力彈簧83、鎖定機構，先前已眾所周知’故省略詳細說明。繼而，就於本實施形態之記憶卡插座1〇E中插入記憶卡MC時的接觸子C1〜C13之動作進行說明❶ 〜如上所述，第2凹部1401、14〇2的前後方向的尺寸L2, 大於第1凹部1301、1302的前後方向的尺寸L1。因此，安插第2記憶卡MC2時，如第22圖（a)所示，各專用接觸子CIO、C11的接觸防止部713E不會觸抵對應之第2凹部11〇3(1401)的後端面mu。因此，接觸防止部713E位於第2凹部1401内，各專用接觸子C10、cu 的接觸部712接觸各自對應之專用端子P1〇、pil。同樣地，專用接觸子C12、C13的接觸防止部713E亦位於第2凹部 1402内’各專用接觸子C12、C13的接觸部712接觸各自對應之專用端子P12、P13。又’各共通接觸子C1〜C9的 41 201021301 接觸部612亦接觸對應之共通端子P1〜p%參照第25圖安插第1記憶卡MC1時，如第22圖（b)所示，各專用接觸子CIO、C11的接觸防止部713E觸抵對應之第1凹部1103 ( 1301 )的後端面1311而自第！凹部13〇1朝外側攀肢。藉此，各專用接觸子（：10、（：：11的接觸部712不會，接觸第1凹部1301内之共通端子P3。同樣地，專用接觸子C12、C13的接觸防止部713E自第1凹部13〇2朝外側 φ 攀爬，各專用接觸子C12、C13的接觸部712不會接觸第j 凹部1302内之共通端子P6。另一方面，各共通接觸子^ 〜C9之接觸部612接觸對應之共通端子ρι〜ρ9 (參照第 26 圖）。根據以上所述之本實施形態之記憶卡插座1〇E，當插入第1記憶卡MCI時，由於會將專用接觸子C10〜ci3的接觸防止部713E自第1凹部1301、1;302推出至外側，故而可使各專用接觸子C10〜C13遠離共通端子P3、p6<)因此， Φ 可防止訊號傳輸特性惡化。又，當插入第2記憶卡MC2時，由於不會將專用接觸子C10〜C13的接觸防止部713E自第 2凹部140卜1402推出至外側，故而可使各專用接觸子cl〇〜C13的接觸部712接觸對應之專用端子ρι〇〜ρΐ3β如此，本實施形態之記憶卡插座10Ε可支持（對應）第丨及第2 記憶卡MCI、MC2兩者。進而，由於僅於各專用接觸子 C10〜C13的接觸部712與連結部73之間設置接觸防止部 713E即可，故而可抑制製造成本之增加且可以簡單之結構實現可支持第1及第2記憶卡MCM、MC2兩者的記憶卡插 42 201021301 座。再者’於本實施形態中’專用接觸子⑽〜⑶的構裝端子72’係自保持區塊5〇E ’朝與記憶卡廳之插入方向相反之方向（帛24圖中的下方向）突出，但專用接觸子 ci〇〜cu的構裝端子72例如亦可朝與記憶卡mc之插入方向交叉之方肖（記憶卡批的宽度方向）突出。 φ (實施形態7 ) 如第29圖〜第32圖所示，本實施形態之記憶卡插座The central portion of the m spring portion 711 is bent into a crank shape. The portion of the spring portion 711 where f is folded is the bent portion, and constitutes a contact preventing 胄 (Climbing (4)) WE. The contact preventing portion 713E' is configured such that when the i-th memory card body is held at the insertion position, it comes into contact with the rear end faces 1311 and 1312 of the t-th recessed portion 13 i3〇2 from the i-th recessed portion 13 〇1, 13〇2 are pushed out to the first recess 130b, 1302, and when the second memory card MC2 is held at the insertion position, it does not touch the rear end surface MU of the second recesses 14〇1, 14〇2 (4) 2 is located in the second recess _, 1 intraoperatively. When the contact preventing portion 713E is pushed out from the i-th recessed portions 13()1, 13()2 to the first recessed portion i3()i, Cong outside, the dedicated contactors C10 to C13 are deformed so as not to contact the jade. Common terminals p3, p6 in the recess (10) (10). On the other hand, when the contact preventing portion 713E is located in the second recessed portions 1401 and 14〇2, the dedicated contactors C10 to C13 are not deformed, so that the dedicated contact member cl〇~cu contacts the dedicated terminal ρι in the second recessed portion 1401, 1402. 〇~ρΐ3. In this way, the dedicated contact members C10 to C13 are provided with a spring portion 7 that protrudes from the dedicated holder 54 toward the one end side (front end side) in the longitudinal direction of the memory card MC held at the insertion position; The contact portion 712 of the dedicated terminal ρι〇 to pi3 is used at the tip end of the spring 39 201021301 portion 7U. Further, the contact preventing portion 7i3E as the contact preventing means is a portion between the contact portion 712 of the dedicated contact of the spring portion 7U (3) and the junction portion 73. ~ The mounting terminal 72 is folded into a crank shape and exposed to the outside of the socket body 20E from the corresponding through hole %. The slider 80 is disposed in the socket body 2 so as to be movable in the front-rear direction of the insertion direction of the memory card MC (the upper and lower directions of the rubbing in the 帛μ map). The slider 8 is docked with the top end (front end) of the memory card inserted from the card # 21, and is moved forward from the memory card MC by the thrust from the memory card (10). The slider 80 is a synthetic resin molded article, and integrally includes an i-th side portion η and a second side portion 82. The first! The side portion 81 is formed in a strip shape and formed to abut against the left side surface of the body 10A of the memory card MC. On the lower side edge of the inner side surface of the first side portion μ, a segment portion 8 which is extended in the insertion direction of the memory + MC and which faces the back side of the memory | Mc is integrally formed (refer to Fig. 36). The second side portion 82 protrudes rightward from the distal end portion (front end portion) of the first side portion 81. The second side portion 82 is formed to abut against the tapered surface formed by the slit 1020 of the main body 1001 and by the body. The shape of the tapered surface formed by the second knife. When the first memory card MC1 is inserted into the memory card socket (7), the tapered surface formed by the notch portion 1〇2 of the first memory card MCI faces the slant of the second side portion 82, and is inserted. (2) When the memory card is presented, the tapered surface formed by the i-th cutout portion of the second memory card MC2 faces the slant of the second side portion 82. As a result, the slider 80 receives the thrust from the memory card MC of 201021301. Move forward. The front end position of the state is set to "the memory card MC is inserted into the insertion position, and the front end of the first memory card MCI is at the same position as the second memory card (10). In the slider 80, the total number of survivors is: i^ _ between the spring seats of the 逋逋 holder 51, and a coil spring 83 that urges the slider 8 〇 toward the rear (the side of the card slot 21). • The above-mentioned locking mechanism (slider lock mechanism) fixes the slider 80 so that it does not retreat from the position (the position shown in Figs. 25 and 26). In the above locking mechanism, after the slider (4) is fixed, the slider 8G is moved forward by pressing the memory card (4) toward the front, thereby releasing the fixing of the slider 8(). Further, the slider 80, the biasing spring 83, and the lock mechanism have been previously known, and detailed descriptions thereof will be omitted. Next, the operation of the contact C1 to C13 when the memory card MC is inserted into the memory card socket 1A of the present embodiment will be described. 〜~ As described above, the dimension L2 of the second concave portion 1401, 14〇2 in the front-rear direction It is larger than the dimension L1 of the first recesses 1301 and 1302 in the front-rear direction. Therefore, when the second memory card MC2 is inserted, as shown in Fig. 22(a), the contact preventing portions 713E of the dedicated contact pieces CIO and C11 do not touch the rear end faces of the corresponding second recessed portions 11〇3 (1401). Mu. Therefore, the contact preventing portion 713E is located in the second recess 1401, and the contact portions 712 of the dedicated contacts C10 and cu are in contact with the respective dedicated terminals P1, pil. Similarly, the contact preventing portions 713E of the dedicated contacts C12 and C13 are also located in the second recess 1402. The contact portions 712 of the dedicated contacts C12 and C13 are in contact with the respective dedicated terminals P12 and P13. Further, 41 201021301 of each of the common contactors C1 to C9, the contact portion 612 is also in contact with the corresponding common terminal P1 to p%, and when the first memory card MC1 is inserted with reference to FIG. 25, as shown in FIG. 22(b), each dedicated contact is shown. The contact preventing portion 713E of the sub-CIOs and C11 is in contact with the rear end surface 1311 of the corresponding first recess 1103 (1301). The recess 13〇1 climbs toward the outside. Thereby, the contact portions 712 of the respective contactors (10:(::11) do not contact the common terminal P3 in the first recess 1301. Similarly, the contact preventing portions 713E of the dedicated contacts C12 and C13 are from the first The recess 13 〇 2 climbs toward the outer side φ, and the contact portions 712 of the dedicated contacts C12 and C13 do not contact the common terminal P6 in the j-th recess 1302. On the other hand, the contact portions 612 of the common contacts C1 to C9 are in contact with each other. Corresponding common terminals ρι to ρ9 (refer to Fig. 26). According to the memory card socket 1A of the embodiment described above, when the first memory card MCI is inserted, the contact of the dedicated contact C10 to ci3 is Since the preventing portion 713E is pushed out from the first recessed portions 1301, 1; 302 to the outside, the dedicated contactors C10 to C13 can be moved away from the common terminals P3 and p6. Therefore, Φ can prevent the signal transmission characteristics from deteriorating. In the case of the memory card MC2, since the contact preventing portions 713E of the dedicated contactors C10 to C13 are not pushed out from the second concave portion 140b 1402, the contact portions 712 of the dedicated contact members cl〇 to C13 can be brought into contact with the corresponding dedicated portions. Terminal ρι〇~ρΐ3β, this is the real The memory card socket 10 of the embodiment can support (correspond to) both the second and second memory cards MCI and MC2. Further, contact prevention is provided only between the contact portion 712 of each dedicated contact C10 to C13 and the connection portion 73. In the present embodiment, it is possible to suppress the increase in the manufacturing cost and realize the memory card insertion 42 201021301 which can support both the first and second memory cards MCM and MC2 in a simple configuration. The mounting terminals 72' of the contacts (10) to (3) are protruded from the holding block 5〇E' in a direction opposite to the insertion direction of the memory card hall (the downward direction in the figure 24), but the dedicated contact ci〇~cu For example, the configuration terminal 72 may protrude toward the direction in which the insertion direction of the memory card mc intersects (the width direction of the memory card batch). φ (Embodiment 7) As shown in Figs. 29 to 32, this embodiment Memory card socket

10F的各接觸子與實施形態6之記憶卡插座10E 不同。再者，對本實施形態之記憶卡插座丨〇F與實施形態 6之圮隐卡插座ι〇Ε的共通構成，標注相同之符號且省略其說明。本實施形態之記憶卡插座1〇F，係安裝於例如主基板 (未圖示）上。作為向主基板上安裝之方法，有標準安裝 -❹方式、及反轉安裝方式。於標準安裝方式下，係以使底殼 * 3〇E的頂板31與主基板相向之狀態，而將記憶卡插座安裝於主基板上。於反轉安裝方式下’係以使罩殼4〇的底板 41與主基板相向之狀態，而將記憶卡插座安裝於主基板上。實施形態6之記憶卡插座1〇E適合標準安裝方式，本實施形態之記憶卡插座丨〇F則適合反轉安裝方式。如第30圖所示’專用接觸子CIO、C11的連結部73形成為L字形’以使構裝端子72自與記憶卡MC之插入方向交又之方向（例如記憶卡的寬度方向）的一側面（本 43 201021301 實施形態中為帛2鎖53的左側面）朝外方突出。另一方面專用接觸子⑴，3的連結部73形成為L字形，以使構裝端子72自與記憶卡之插入方向交又之方向（例2 憶卡MC #寬度方向）的另一側面（本實施形態中為第1 銷52的右側面）朝外方突出。如此’專用接觸子⑽〜⑴的構裝端子_形成為自插座本體20E之外面，在與保持於上述插入位置之記怜 e 卡MC的背面平行的面内，沿與記憶卡紅的長度方向: 叉之交又方向（本實施形態中為記憶+ Mc的寬度突出。 /、通接觸子C1〜C9的構裝端子62，係以使頂端位於較罩殼40的底板41@下面（底面）更下方之方式而形成字形（參照第29圖（a)、（ b))。若如實施形態6般使專用接觸子cl〇〜C13的構裝端子 72朝記憶卡MC之插入方向延長，則保持於上述插入位置 -❹之記憶卡MCt成為阻礙而導致無法將構裝端子72朝主基 . 板側（罩殼40側）彎折。若如本實施形態般使專用接觸子C10〜C13的構裝端子72朝與s己憶卡MC之插入方向交叉之方向延長，則可不受保持於上述插入位置之記憶卡MC阻礙地將構裝端子72 朝主基板側（罩殼40侧）彎折。因此，根據本實施形態之記憶卡插座10F，可如第29 圖（a)、（b)所示般’將記憶卡插座以反轉安裝方式而安裝於主基板上。 44 201021301 以下’就於本實施形態之記憶卡插座10F中插入記憶卡MC時的接觸子C1〜C13之動作進行說明。安插第2記憶卡MC2時，如第29圖（a)所示，由於各專用接觸子CIO、C11的接觸防止部713E不會觸抵對應之第2凹部1103 ( 1401)的後端面1411,故而各專用接觸子C10、C11的接觸部712接觸各自對應之專用端子pl〇、 P11。同樣地，各專用接觸子C12、013的接觸部712接觸 φ 各自對應之專用端子p12、P13。又，各共通接觸子C1〜 C9的接觸部612亦接觸各自對應之共通端子ρι〜ρ9(參照第31圖）。安插第1記憶卡MCI時，如第29圖（b)所示，各專用接觸子cio、cii的接觸防止部713E觸抵對應之第i凹郤1103 ( 13〇1)的後端面1311而自第i凹部朝外側攀爬。藉此’專用接觸子Cl〇、cu的接觸部712均不接參觸第1凹部1301内之共通端子Ρ3β同樣地，專用接觸子 C12、C13的接觸部712亦均不接觸第i凹部η。〗内之共通端子P6。另一方面，各共通接觸子ci〜C9的接觸部⑴ 接觸對應之共通端子P1〜p9 (參照第32圖Each contact of 10F is different from the memory card socket 10E of the sixth embodiment. The common configuration of the memory card socket 丨〇F of the present embodiment and the hidden card socket 〇Ε of the sixth embodiment will be denoted by the same reference numerals and will not be described. The memory card socket 1A of the present embodiment is mounted on, for example, a main substrate (not shown). As a method of mounting on the main substrate, there are a standard mounting method, a reverse mounting method, and a reverse mounting method. In the standard mounting mode, the memory card socket is mounted on the main substrate with the top plate 31 of the bottom case *3〇E facing the main substrate. In the reverse mounting mode, the memory card socket is mounted on the main substrate in a state in which the bottom plate 41 of the casing 4 is opposed to the main substrate. The memory card socket 1A of the sixth embodiment is suitable for the standard mounting method, and the memory card socket 丨〇F of the present embodiment is suitable for the reverse mounting method. As shown in Fig. 30, the connection portion 73 of the dedicated contact CIO and C11 is formed in an L shape so that the configuration terminal 72 is in a direction intersecting the insertion direction of the memory card MC (for example, the width direction of the memory card). The side surface (the left side surface of the 帛2 lock 53 in the embodiment of the present invention, 2010, 2011, 301) protrudes outward. On the other hand, the connecting portion 73 of the dedicated contact (1), 3 is formed in an L shape so that the other end of the mounting terminal 72 in the direction of the insertion direction of the memory card (for example, the card MC #width direction) ( In the present embodiment, the right side surface of the first pin 52 protrudes outward. The configuration terminal _ of the 'special contactor (10) to (1) is formed from the outer surface of the socket main body 20E in the direction parallel to the back side of the memory card red in a plane parallel to the back surface of the memory card MC held at the above-mentioned insertion position. : The cross direction of the cross (in the present embodiment, the width of the memory + Mc is prominent. /, the mounting terminal 62 of the contact pins C1 to C9 is such that the top end is located below the bottom plate 41@ of the cover 40 (bottom surface) Further, a zigzag pattern is formed in the following manner (see FIGS. 29(a) and (b)). When the component terminals 72 of the dedicated contacts c1 to C13 are extended in the insertion direction of the memory card MC as in the sixth embodiment, The memory card MCt held at the above-described insertion position is blocked, and the component terminal 72 cannot be bent toward the main substrate side (the casing 40 side). The dedicated contact C10 to C13 is used as in the present embodiment. When the component terminal 72 is extended in a direction crossing the insertion direction of the suffix card MC, the component terminal 72 can be bent toward the main substrate side (the casing 40 side) without being hindered by the memory card MC held at the insertion position. Therefore, according to the memory card socket 10F of the present embodiment, As shown in Fig. 29 (a) and (b), the memory card socket is mounted on the main board in a reverse mounting manner. 44 201021301 The following is a description of inserting the memory card MC into the memory card socket 10F of this embodiment. In the case of the second memory card MC2, as shown in Fig. 29 (a), the contact preventing portion 713E of each of the dedicated contact members CIO and C11 does not touch the corresponding portion. The rear end surface 1411 of the recessed portion 1103 (1401) is such that the contact portions 712 of the dedicated contactors C10 and C11 are in contact with the respective dedicated terminals pl〇 and P11. Similarly, the contact portions 712 of the dedicated contactors C12 and 013 are in contact with φ. The respective dedicated terminals p12 and P13 are also provided. Further, the contact portions 612 of the common contacts C1 to C9 are also in contact with the corresponding common terminals ρι to ρ9 (see Fig. 31). When the first memory card MCI is inserted, the 29th is inserted. As shown in (b), the contact preventing portion 713E of each of the dedicated contacts cio, cii touches the rear end surface 1311 of the corresponding i-th recess 1103 (13〇1) and climbs outward from the i-th recess. The contact portions 712 of the dedicated contact pins Cl 〇 and cu are not in contact with the first recess 1301 Similarly, in the common terminal Ρ3β, the contact portions 712 of the dedicated contacts C12 and C13 do not contact the common terminal P6 in the i-th recess η. On the other hand, the contact portions (1) of the common contacts ci to C9 are in contact with each other. Common terminals P1 to p9 (refer to Figure 32)

再者，專用保持具54 ·5Γ A 丹4可與銷52、53分開形成。又，專用接觸子CM〜Cl3可與專用保持具Μ同時成形。 (實施形態8 ) 如第33圖〜第35圖所千+ 圃所不，本實施形態之記憶卡插座 10G ’主要於具備連結件 (連、°構件）74之方面，與實施 45 201021301 形態6之記憶卡插座1 〇E不同。再者，對本實施形態之記憶卡插座10G與實施形態6之記憶卡插座1〇Ε的共通構成’標注相同之符號且省略其說明。 - 於本實施形態中’保持區塊50G不具備第2銷53。如第33圖（a)所示，專用接觸子cl〇〜C13係以特定之間隔沿左右方向排列配置。亦即，複數個專用接觸子C10 〜C13係沿保持於上述插入位置之記憶卡Mc的寬度方向 ▲ 排列》 9 本實施形態中，未於專用接觸子C10〜C13的接觸端子 71G的彈簧部711，形成接觸防止部713E。連結件74將鄰接之專用接觸子CIO、Cll (C12、C13) 彼此以相互絕緣之狀態而連結。本實施形態中鄰接之專用接觸子C1G、C11，由連結件74連結成—體。又，鄰接之專用接觸子C12、C13,由連結件74連結成一體。其中，於較底殼30G的頂板31的前端的稍後方，形成麝有複數個通孔37。通孔37係為了防止各連結件74及對應 •之接觸子C1〇、C11 (或接觸子C12、C13)接觸頂板31而設置。通孔37例如形成為τ字形。連結件74例如為合成樹脂成形品’且如第33圖所示，形成為橫長之大致長方體狀。各連結件74例如以由對應之專用接觸子C1G、C11 (或專用接觸子⑴、cn) 的彈簧部711沿前後方向貫通之狀態，而與接觸子⑽、 71卜 (2 C13 )起同時成形。亦即，連結件74係被配置於專用接觸子c1〇、CU (C12、C13)之彈簧部 46 201021301 於連結件74的上面（頂面）形成有接觸防止部75。接觸防止部75形成為梯形’包括朝斜前方傾斜之傾斜面⑸、及自傾斜面751之前端朝前方延伸之抵接面752。當於記憶卡插座1〇G中插入第1記憶卡㈣時，接觸防止部75 的傾斜面751抵接第丨Μ。，按弟1 3己憶卡MC1的對應之第1凹部Further, the dedicated holder 54·5Γ A Dan 4 can be formed separately from the pins 52, 53. Further, the dedicated contact members CM to Cl3 can be formed simultaneously with the dedicated holding member. (Embodiment 8) As shown in Fig. 33 to Fig. 35, the memory card socket 10G' of the present embodiment mainly includes a connector (connection member), and is implemented in the form of 45 201021301. The memory card socket 1 〇E is different. The common structure of the memory card socket 10G of the present embodiment and the memory card socket 1 of the sixth embodiment are denoted by the same reference numerals and the description thereof will not be repeated. - In the present embodiment, the holding block 50G does not have the second pin 53. As shown in Fig. 33(a), the dedicated contact members cl〇 to C13 are arranged side by side at a predetermined interval in the left-right direction. That is, the plurality of dedicated contactors C10 to C13 are arranged along the width direction ▲ of the memory card Mc held at the above-described insertion position. 9 In the present embodiment, the spring portion 711 of the contact terminal 71G not in the dedicated contact C10 to C13 is provided. A contact preventing portion 713E is formed. The joint member 74 connects the adjacent dedicated contact members CIO and C11 (C12, C13) to each other in a state of being insulated from each other. In the present embodiment, the adjacent dedicated contactors C1G and C11 are connected to each other by a connecting member 74. Further, the adjacent dedicated contactors C12 and C13 are integrally coupled by a coupling member 74. Here, a plurality of through holes 37 are formed in the later side of the front end of the top plate 31 of the bottom case 30G. The through hole 37 is provided to prevent the respective connecting members 74 and the corresponding contact members C1, C11 (or the contact members C12, C13) from contacting the top plate 31. The through hole 37 is formed, for example, in a zigzag shape. The connecting member 74 is, for example, a synthetic resin molded article', and as shown in Fig. 33, is formed into a substantially rectangular parallelepiped shape. Each of the connecting members 74 is formed in a state in which the spring portions 711 of the corresponding dedicated contacts C1G, C11 (or the dedicated contacts (1), cn) penetrate in the front-rear direction, for example, and simultaneously with the contacts (10), 71 (2 C13). . That is, the coupling member 74 is disposed on the spring portion 46 201021301 of the dedicated contact c1, CU (C12, C13). The contact preventing portion 75 is formed on the upper surface (top surface) of the coupling member 74. The contact preventing portion 75 is formed in a trapezoidal shape, and includes an inclined surface (5) that is inclined obliquely forward, and an abutting surface 752 that extends forward from the front end of the inclined surface 751. When the first memory card (4) is inserted into the memory card socket 1A, the inclined surface 751 of the contact preventing portion 75 abuts on the second side. , according to the first recess of the brother 1 3 memory card MC1

蘭、蘭的後端面則、1312。進而，於將第i記憶卡插進到達上述插入位置之狀態下，會將接觸防止部π 自第1凹部ucn、13〇2推出至外侧，抵接面752抵接第ι 凹部13(H、1302的周邊（於本趙刪中較第！凹部⑴卜位於後方的部分）。藉由將接觸防止部75自第！凹部 1301、1302推出至外方，專用接觸子⑽〜⑴產生變形使其不會接觸第1凹部13G1、内之共通端子p3 p6。如此，於本實施形態中，接觸防止部75構成接觸防止機構。亦即，接觸防止機構係設於連結件74。又，接觸防止部75的傾斜面751與抵接面752，構成接觸保持於上述插入位置之第1記憶卡MCI的本體1001 的卡片接觸部。該卡片接觸部（傾斜面751及抵接面752) 係形成為相對於位於鄰接之接觸子cl〇、cu (或接觸子 CU、Cl3)之間，以各接觸子C10〜C13之排列方向為法線方向’且與鄰接之兩接觸子CIO、C11 (或接觸子C12、 Cl3)為等距離的平面呈左右對稱之形狀。換言之卡片接觸。卩係相對於沿保持於上述插入位置之記憶卡MC的長度方向而通過鄰接之專用接觸子C10、C11(C12、C13)間之中心的中心線呈線對稱之形狀。 47 201021301 繼而’就於本實施形態之記憶卡插座1〇G中插入記憶卡MC時的接觸子C1〜ci3之動作進行說明。於記憶卡插座1 0G中未插入有記憶卡MC之狀態下，如第34圖（a)所示，專用接觸子C10〜ci 3的長度方向為沿前後方向之狀態。安插第2記憶卡MC2時，如第34圖（b)所示，由於接觸防止部75不抵接對應之第2凹部1401、1402的後端 ❹面14!1、1412,故而各專用接觸子cl〇〜C13的接觸部712 彈性接觸各自對應之專用端子P10〜P13。此時，由於專用接觸子CIO、C11 (或專用接觸子C12、C13)係由連結件 74連結成一體，因此係大致同時接觸對應之專用端子 Ρ1〇、Ρ11 (或專用端子P12、P13)。另一方面，各共通接觸子C1〜C9的接觸部612亦接觸各自對應之共通端子ρι 〜P9 (參照第35圖（a)、（ b))。安插第1記憶卡MCI時，各接觸防止部75的傾斜面 751抵接對應之第1凹部13〇卜13〇2的後端面1311、1312。進而’當將第1記憶卡MC1推入至插座本體2〇G内時（將第1記憶卡MCI插進到達上述插入位置時），如第34圖（c) 所不’接觸防止部75的抵接面752攀爬至第1凹部1301、 13 02的後方《藉此’對由連結件74連結之專用接觸子cl〇、 C11 (或接觸子C12、C13)朝上方（第34圖（c)中的下方）施力，各專用接觸子cl〇〜C13的接觸部712離開共通端子P3、P6。另一方面，各共通接觸子C1〜C9的接觸部612接觸對應之共通端子ρι~ρ9。若根據本實施形 48 201021301 態之記憶卡插座l〇G，藉由利用連結件74將鄰接之專用接觸子CH)、C11 (或專用接觸子C12、C13)彼此連結成一體，而可使兩專用接觸子C10、cu (或專用接觸子⑴、 C13)同時接觸、離開對應之專用端子pi〇、pu (或專用端子pmu)。&，安插記憶卡Mc時，可藉由連結件 • 74而抑制各專用接觸子⑽〜⑴之頂端振動。因此，例如即便端子P1〜P13之間隔較窄之情形時，亦可防止專用 ❹接觸子CH)〜C13祕觸共通接觸？ C3、C6或鄰接之端子 P1 〜P13。進而，因係將作為接觸防止機構之接觸防止部75設置於連結件74,故而可不用對專用接觸子Ci〇、cu (或專用接觸子C12、C13)本身實施加工，因此專用接觸子⑽ 〜CU之形狀可較為簡單。其結果，可抑制製造成本。又，於本實施形態中，係使接觸記憶卡Mc的本體ι〇〇〇的卡片接觸部，形成為如下形態：亦即在鄰接之專用接觸 •子。〇、C11 (或專用接觸子C12、C13)之間以各專用接觸子CU)〜C13之排列方向為法線方向，且相對於位於距鄰接之兩專用接觸子C1〇、cu(或專用接觸子dhCU) 為等距離的平面呈左右對稱。藉此，例如拔插記憶卡Μ 時’接觸防止部75不會斜向傾斜，從而可提高上述兩專用接觸子cio、C11 (或專用接觸子C12、〇”間之同步精度。再者，於本實施形態中’係將接觸防止部乃與連結件 74設為-體。然而，並非必須於連結件74設置接觸防止 49 201021301 部75。例如，於實施形態6、7之專用接觸子ci〇〜ci3中，亦可將連結件74 g&置於較接觸防止部713E更偏向接觸部 712側。如此，可提高連結件74對各專用接觸子ci〇、cU (或專用接觸子C12、C13)之頂端振動之抑制效果。又，卡片接觸部的形狀並不限定於本實施形態之例， •其只要形成為：在鄰接之專用接觸子C10、C11(C12、C13) •之間，以專用接觸子C1〇〜C13之排列方向為法線方向， ❹且相對於位於距鄰接之兩專用接觸子C10、C11(C12、C13) 為等距離的平面呈左右對稱之形狀即可。 (實施形態9 ) 如第36圖及第37圖所示，本實施形態之記憶卡插座 1(>H，具備.由底殼3〇H及罩殼4〇所構成之扁平的矩形箱狀之插座本體20H。又’記憶卡插座膽，具備：接觸子 C1〜CU、保持接觸子C1〜C13之保持區塊50、滑塊80、 .及鎖定機構（未圖示）。再者，對本實施形態之記憶卡插座 -1〇Ii與其他實施形態之記憶卡插座1〇、10A〜1〇G的共通構成，標注相同之符號且省略其說明。保持區塊50的保持具5卜保持接觸子C1〜C13。各接觸子C1〜C13的接觸端子6卜71(}，朝保持具51的後面側突出，構裝端子62、72，朝保持具5丨的前面側突出。又，雖然在本實施形態中有省略圖示，但於銷52配設有用於檢測出撥塊1050的位置之位置檢測用接點。於底殼30H，設置有接觸防止部（接觸防止機構）9〇, 50 201021301 當安插第1記憶卡]^(：1時，該接觸防止部（接觸防止機構） 90按壓專用接觸子cl〇〜C13以使其遠離共通端子p3、 P6。亦即’接觸防止部9〇係設於插座本體2〇h中。接觸防止部90’具備：突出部91、以及設於突出部91 的頂端而按壓對應的專用接觸子C10〜C13之按壓部（攀爬部）92。 -犬出4 91 ’係形成為自較保持於上述插入位置的記憶 φ卡MC的端子P1〜P13更偏向卡片槽21側（後側）的插座本體20H之部立，朝保持於上述插入位置之記憶卡的長度方向的一端側（前端侧）突出。於本實施形態中，突出°卩91，係藉由將底殼30H的頂板31的一部分切缝翻邊而形成為縱長之矩形板狀。亦即，突出部91與插座本體 2〇H形成為一體。尤其是由於底殼3〇h係由具有彈性之金屬材料製造’故而突出部91為彈性材料製造。按壓邛92，係藉由壓入成形或嵌入成形而一體地保持突出部91的頂端。當安插記憶卡第1MC時按壓部％攀爬至較第1記憶卡Mc i的第i凹部13〇卜"Μ更後方的部分而按壓對應之專用接觸子cl〇〜cl3,以使其不與共通端子P3、P6接觸。、再者，於本實施形態中，與共通接觸子C3、C6對應之通孔34的長度較其他通孔34更長發揮防止接觸防止部 90與頂板31接觸之作用。按壓部92為合成樹脂成型品，形成為大致長方體狀。按魔部92於頂端一體地包括兩個按壓片92i、92i。兩個 51 201021301 按Μ片921、921係空出特定之間隔而左右排列。各按壓片 921係構成如下，當將第1記憶卡MCI插入至插座本體20Η 中時，各按壓片921按壓對應之專用接觸子C10〜C13。按壓部92的一對按壓片921間的距離與對應之一對專用接觸子CIO、C11 (或一對專用接觸子ci2、C13)之間隔大致相等。又’於一對按壓片921、921間之間隙中，插入有對應之共通接觸子C3(或共通接觸子C6>如此，按壓部92 參構成為同時按壓兩個專用接觸子CIO、Cll (C12、C13)。再者’按壓部92亦可構成為同時按壓三個以上之專用接觸子C10〜C13。又’按壓部92並非必須為合成樹脂成形品。例如’於藉由切縫翻邊而將接觸防止部9〇與底殼3〇H形成為一體之情形時，亦可於按壓部92所對應之部分形成絕緣膜。於圯憶卡插座10H中未插入有記憶卡MC；之狀態下， -❹ 如第39圖（a)所不，按壓部92的各按壓片921抵接對應之接觸子C10〜C13之下面。當安插第2記憶卡MC2時，如第39圖（b)所示，按壓部92係被配置於第2記憶卡MC2的帛2凹部ι4〇ι ΐ4〇2 内，而並*攀錢較第2記憶卡MC2的第2凹部·、刚更後方之邛分。因& ’專用接觸子Cl〇〜n接觸對應之專用端子P10〜P13。此時，專用接觸子ci〇〜⑶與對應之專用端子PU)〜P13彈性接觸因而遠離按壓片—。又，共通接觸子C1〜C9接觸對應之共通端子pi〜p9。當安插第1記憶卡MC1時，如第39圖（c)所示按 52 201021301 壓部92攀爬至第1記憶卡MCI的第1凹部13(H、1302後方的部分。因此，專用接觸子C10〜C13由對應之按壓片 921朝遠離第1記憶卡河以之方向（第”圖中的下方）按壓。其結果’專用接觸子C10〜C13的接觸部712 遠離共通端子P3' P6。此時’由於按壓部92及接觸子C10 -〜C13自通孔11露出至外部，故而較佳為在安裝記憶卡插座1〇H之基板上’設置用於防止按壓部92及接觸子C10 參〜與基板接觸之凹部。當將第1記憶卡MC1自記憶卡插座丨〇H中取出時，按壓部92利用突出部91之彈簧力、專用接觸子C10〜C13 利用彈簧711之彈簧力而返回至初始位置（參照第3 9圖 (a))。根據以上所述之本實施形態之記憶卡插座i 〇H，將第i "己憶卡MC1插入至插座本體2〇h中時，按壓部92觸抵第 1凹部1301、13〇2的後端面1311、1312,攀爬至較第"己 ••憶卡MCI的第i凹部13()1、13。2更後方的部分。因此， ‘ 可使專用接觸子C10〜C13遠離第1凹部1301、1302内之共通端子P3、P6。因此，可防止訊號傳輸特性惡化。又，將第2記憶卡MC2插入至插座本體2〇11中時，由於按壓部 92不會攀爬至較第2記憶卡MC2的第2凹部14〇1、14〇2 更後方之部分’故而可使各專用接觸子C10〜C13接觸對應之專用端子P10〜P13。因此，可支持第i及第2記憶卡 MCI、MC2 兩者。又’接觸防止部90，由於係由設於插座本體20H中之 53 201021301 突出部91、及設於突出部91的頂端之按壓部％所構成，故而可使結構較為簡單。又’由於突出部91係與插座本體20H形成為一體，故而可削減零件個數及裝配工時，從而可降低製造成本。又，由於能以一個按壓部92同時按壓兩個專用接觸子 C10、C11 (或C12、C13)’故而可使專用接觸子ci〇、C11 (或C12、C13)同時接觸、離開對應之專用端子ρι〇 ριι (或 P12、P13) 〇第40圓係表示本實施形態之變形例之記憶卡插座ι〇ι。於記憶卡插座101中，其接觸防止部901與記憶卡插座 10H不同。再者，對記憶卡插座1〇1與記憶卡插座的共通構成’標注相同之符號且省略其說明。接觸防止部901.為合成樹脂成形品，且如第4〇圖所示一體地具備：橫長之矩形板狀之主片93;自主片93的前端朝前方突出之縱長的矩形板狀之突出部91 ;及自突出部 -β 91的刖端（頂端）朝前方突出之按壓部92。 - 接觸防止部901，例如係藉由將底殼30Η上所設之壓入片（未圖示）’壓入至接觸防止部9〇1的主片93上所設之壓入槽（未圖示）中而固定於底殼3〇Η。因此，第40圖所示之記憶卡插座1〇1亦與上述記憶卡插座10Η同樣可防止訊號傳輸特性惡化，而且可支持第^ 及第2記憶卡MCI、MC2兩者。又，底殼30H亦可為合成樹脂成形品。此時，可將接觸防止部9〇1與底殼贿成形為一體。又，亦可將接觸防 54 201021301 止部901與保持區塊50形成為一體。 (實施形態10) 第41圖係表示本實施形態之記憶卡插座i〇j。本實施形態之記憶卡插座i〇j的各接觸子C1〜C13與實施形態9 之記憶卡插座10H不同《再者，對本實施形態之記憶卡插座10J與實施形態9之記憶卡插座10H的共通構成，標注 ❹相同之符號且省略其說明。本實施形態之記憶卡插座l〇j係構成為可應對反轉安裝方式。於記憶卡插座10J中’藉由將底殼3〇H的頂板31的— 部分切缝翻邊而形成接觸防止部9〇j。接觸防止部90J，具備突出部91J及按壓部92J。突出部91J係藉由彎折成刮面視形狀為菱形狀而形成。按壓部 92J具備一對按壓片921J、921J。各按壓片9211係設於突 ❷出部91J的頂端。一對按壓片921J、921J以與對應之專用接觸子C10、C11(C12、C13)相向之方式而左右排列（參照第41圖（b)、（d))。又，按壓部92J的各按壓片921J 由絕緣膜被覆，以使得當其接觸對應之專用接觸子C10〜 C13時不會與接觸子ci〇〜C13導通。將第2記憶卡Mc2插入至記憶卡插座1(>j中時，接觸防止部90J的突出部91J配置於第2記憶卡MC2的第2凹 1401、1402内。因此，接觸防止部90J不會攀爬至較第 1 3己憶卡MCI的第1凹部1401、1402更後方之部分，故而 55 201021301 各按壓片921J不會接觸對應之專用接觸子cio'cn (或接觸子C12、C13)。因此’各專用接觸子CIO〜C13的接觸部712接觸對應之專用端子P10〜pi3(參照第41圖 (a))〇又’各共通接觸子C1〜C9接觸對應之共通端子pi 將第1記憶卡MCI插入至記憶卡插座10J中時，由於突出部91J攀爬至第1記憶卡MCI的第1凹部13〇卜13〇2 鲁之周邊，故而將兩按壓片921J、921J朝上方推升。藉此，專用接觸子C10〜C13由對應之按壓片921J朝上方推升，接觸部712遠離共通端子p3、P6 (參照第41圖（c))<>另一方面’共通接觸子C1〜C9接觸對應之共通端子ρι〜ρ9。如此，根據S己憶卡插座10J，可使插座本體的厚度較薄，實現小型化。第42圖係表示本實施形態之第i變形例之記憶卡插座 10K。再者’對該s己憶卡插座1〇κ與記憶卡插座的共通構成’標注相同之符號且省略其說明。 • °己隐卡插座1〇K’具備合成樹脂製之接觸防止部90K。接觸防止部90Κ，接觸防止琿90Κ，具備：在其頂端配備有按壓片The back end of the orchid and the blue is 1312. Further, when the i-th memory card is inserted into the insertion position, the contact preventing portion π is pushed out from the first recesses ucn and 13〇2 to the outside, and the abutting surface 752 is in contact with the first recess 13 (H, The periphery of the 1302 (the portion of the recessed portion (1) is located at the rear of the concave portion (1)). By pushing the contact preventing portion 75 from the first recess 1301, 1302 to the outside, the dedicated contact (10) to (1) is deformed. In the present embodiment, the contact preventing portion 75 constitutes a contact preventing mechanism. That is, the contact preventing mechanism is provided in the connecting member 74. Further, the contact preventing portion is not in contact with the common terminal p3 p6 in the first recess portion 13G1. The inclined surface 751 of the 75 and the abutting surface 752 constitute a card contact portion of the main body 1001 of the first memory card MCI held in the insertion position. The card contact portion (the inclined surface 751 and the abutting surface 752) are formed to be opposite each other. Between adjacent contactors cl〇, cu (or contact sub-CU, Cl3), the direction of arrangement of each contact C10~C13 is the normal direction 'and two adjacent contacts CIO, C11 (or contact) C12, Cl3) are equidistant and symmetrical in a plane The shape is in contact with the card. The lanthanum is linearly symmetrical with respect to the center line of the center between the adjacent dedicated contact C10, C11 (C12, C13) along the longitudinal direction of the memory card MC held at the above-mentioned insertion position. 47. The operation of the contact pins C1 to ci3 when the memory card MC is inserted into the memory card socket 1A of the present embodiment will be described. In the state where the memory card MC is not inserted in the memory card socket 10G. As shown in Fig. 34 (a), the longitudinal direction of the dedicated contact C10 to ci 3 is in the front-rear direction. When the second memory card MC2 is inserted, as shown in Fig. 34 (b), the contact preventing portion 75 does not abut the rear end faces 14!1 and 1412 of the corresponding second recesses 1401 and 1402. Therefore, the contact portions 712 of the dedicated contacts c1 to C13 elastically contact the respective dedicated terminals P10 to P13. Since the dedicated contact CIO, C11 (or the dedicated contact C12, C13) is integrally connected by the connecting member 74, the corresponding dedicated terminals Ρ1〇, Ρ11 (or the dedicated terminals P12, P13) are substantially simultaneously contacted. , common contact with C1~C9 The contact portion 612 also contacts the corresponding common terminals ρι to P9 (see FIGS. 35(a) and (b)). When the first memory card MCI is inserted, the inclined surface 751 of each contact preventing portion 75 abuts the corresponding first one. The recessed portion 13 is the rear end faces 1311 and 1312 of the 13〇2. Further, when the first memory card MC1 is pushed into the socket body 2〇G (when the first memory card MCI is inserted into the insertion position), Fig. 34(c) shows that the abutting surface 752 of the contact preventing portion 75 climbs to the rear of the first recesses 1301, 1300, thereby "by this" for the dedicated contacts cl〇, C11 connected by the connecting member 74 (or The contactors C12 and C13) are urged upward (downward in FIG. 34(c)), and the contact portions 712 of the dedicated contacts c1 to C13 are separated from the common terminals P3 and P6. On the other hand, the contact portions 612 of the common contactors C1 to C9 are in contact with the corresponding common terminals ρι to ρ9. According to the memory card socket 100 of the present embodiment 48 201021301, by using the connecting member 74 to connect the adjacent dedicated contact CH), C11 (or the dedicated contact C12, C13) to each other, two The dedicated contact C10, cu (or the dedicated contact (1), C13) simultaneously contacts and leaves the corresponding dedicated terminal pi〇, pu (or dedicated terminal pmu). & When the memory card Mc is inserted, the vibration of the top end of each of the dedicated contacts (10) to (1) can be suppressed by the link member 74. Therefore, for example, even when the interval between the terminals P1 to P13 is narrow, it is possible to prevent the dedicated contact of the contact points CH) to C13 from being in common contact. C3, C6 or adjacent terminals P1 to P13. Further, since the contact preventing portion 75 as the contact preventing means is provided in the connecting member 74, the dedicated contact sub-Ci, cu (or the dedicated contact C12, C13) itself can be processed, so that the dedicated contact (10) is used. The shape of the CU can be relatively simple. As a result, the manufacturing cost can be suppressed. Further, in the present embodiment, the card contact portion that contacts the main body ι of the memory card Mc is formed in such a manner as to be adjacent to the dedicated contact. 〇, C11 (or special contact C12, C13) with the special contact sub-CU) ~ C13 arranged in the normal direction, and relative to the two adjacent contact C1 〇, cu (or special contact) Sub-dhCU) is bilaterally symmetric for equidistant planes. Thereby, for example, when the memory card 拔 is inserted or removed, the contact preventing portion 75 is not inclined obliquely, so that the synchronization accuracy between the two dedicated contacts cio, C11 (or the dedicated contact C12, 〇) can be improved. In the present embodiment, the contact preventing portion and the connecting member 74 are formed as a body. However, it is not necessary to provide the contact preventing member 49 with the contact preventing member 49 201021301. For example, the special contact ci〇 in the sixth and seventh embodiments. In the case of ci3, the connecting member 74g& can be placed on the side closer to the contact portion 712 than the contact preventing portion 713E. Thus, the special contact ci〇, cU (or the dedicated contact C12, C13) of the connecting member 74 can be improved. The shape of the card contact portion is not limited to the example of the embodiment, and the shape of the card contact portion is formed between adjacent dedicated contactors C10 and C11 (C12, C13). The arrangement direction of the dedicated contact C1〇~C13 is the normal direction, and may be a shape that is bilaterally symmetrical with respect to a plane located equidistant from the adjacent dedicated contact C10, C11 (C12, C13). Form 9) as shown in Figures 36 and 37 The memory card socket 1 of the present embodiment (>H includes a flat rectangular box-shaped socket body 20H composed of a bottom case 3〇H and a cover 4〇. Also, a memory card socket has: contact Sub-C1 to CU, holding block 50 for holding contact C1 to C13, slider 80, and locking mechanism (not shown). Further, the memory card socket-1〇Ii of the present embodiment and other embodiments are The common configuration of the memory card sockets 1A, 10A to 1〇G is denoted by the same reference numerals, and the description thereof will be omitted. The holder 5 of the holding block 50 holds the contacts C1 to C13. The contact terminals 6 of the respective contacts C1 to C13 71(}, the rear side of the holder 51 protrudes, and the terminals 62 and 72 are protruded toward the front side of the holder 5A. Further, although not shown in the embodiment, the pin 52 is disposed. There is a contact detecting position for detecting the position of the dial block 1050. The bottom case 30H is provided with a contact preventing portion (contact preventing mechanism). 9〇, 50 201021301 When the first memory card is inserted] (: 1, the Contact prevention portion (contact prevention mechanism) 90 presses the dedicated contact pins cl〇 to C13 to keep them away from the common The contact terminals p3 and P6, that is, the contact preventing portion 9A are provided in the socket body 2〇h. The contact preventing portion 90' includes a protruding portion 91 and a dedicated contact provided at the tip end of the protruding portion 91 to press the corresponding contact C10 to C13 pressing portion (climbing portion) 92. - Dog out 4 91 ' is formed so as to be biased toward the card slot 21 side (rear side) from the terminals P1 to P13 of the memory φ card MC held at the insertion position The socket body 20H is formed so as to protrude toward the one end side (front end side) of the longitudinal direction of the memory card held at the insertion position. In the present embodiment, the protrusion 91 is formed into a vertically long rectangular plate shape by cutting a part of the top plate 31 of the bottom case 30H. That is, the protruding portion 91 is formed integrally with the socket body 2〇H. In particular, since the bottom case 3〇h is made of a metal material having elasticity, the protruding portion 91 is made of an elastic material. The cymbal 92 is pressed to integrally hold the tip end of the protruding portion 91 by press-fitting or insert molding. When the memory card 1MC is inserted, the pressing portion % climbs to a portion closer to the rear than the i-th recess 13 of the first memory card Mci, and presses the corresponding dedicated contact cl〇~cl3 so as not to It is in contact with the common terminals P3 and P6. Further, in the present embodiment, the length of the through hole 34 corresponding to the common contact members C3 and C6 is longer than that of the other through holes 34, and the contact preventing portion 90 is prevented from coming into contact with the top plate 31. The pressing portion 92 is a synthetic resin molded article and is formed in a substantially rectangular parallelepiped shape. The pressing portion 92 integrally includes two pressing pieces 92i, 92i at the top end. Two 51 201021301 The left and right sides of the 921 and 921 are arranged at different intervals. Each of the pressing pieces 921 is configured such that when the first memory card MCI is inserted into the socket main body 20A, each of the pressing pieces 921 presses the corresponding dedicated contact C10 to C13. The distance between the pair of pressing pieces 921 of the pressing portion 92 is substantially equal to the interval between the corresponding pair of dedicated contacts CIO, C11 (or a pair of dedicated contacts ci2, C13). Further, in the gap between the pair of pressing pieces 921 and 921, the corresponding common contact C3 (or the common contact C6) is inserted. Thus, the pressing portion 92 is configured to simultaneously press the two dedicated contacts CIO, C11 (C12). Further, the pressing portion 92 may be configured to simultaneously press three or more dedicated contact members C10 to C13. Further, the pressing portion 92 is not necessarily a synthetic resin molded article. For example, 'being by slitting When the contact preventing portion 9A and the bottom case 3〇H are integrally formed, an insulating film may be formed in a portion corresponding to the pressing portion 92. The memory card MC is not inserted in the memory card socket 10H. - ❹ As shown in Fig. 39 (a), each pressing piece 921 of the pressing portion 92 abuts against the lower surface of the corresponding contact C10 to C13. When the second memory card MC2 is inserted, as shown in Fig. 39 (b) It is to be noted that the pressing portion 92 is disposed in the 凹2 recessed portion ι4〇ι ΐ4〇2 of the second memory card MC2, and the money is smaller than the second concave portion of the second memory card MC2. Because & 'Special contact sub-Cl〇~n contact corresponding dedicated terminals P10~P13. At this time, the special contact sub-ci〇~ And corresponding to the dedicated terminal PU) ~P13 resilient contact piece is pressed so far -. Further, the common contacts C1 to C9 are in contact with the corresponding common terminals pi to p9. When the first memory card MC1 is inserted, as shown in Fig. 39 (c), the pressing portion 92 is climbed to the first recess 13 of the first memory card MCI (the portion behind the H, 1302). Therefore, the dedicated contact is used. C10 to C13 are pressed by the corresponding pressing piece 921 in the direction away from the first memory card (lower in the figure). As a result, the contact portion 712 of the dedicated contact C10 to C13 is away from the common terminal P3' P6. When the pressing portion 92 and the contact portions C10-C13 are exposed to the outside from the through hole 11, it is preferable to provide a contact preventing portion 92 and a contact portion C10 on the substrate on which the memory card socket 1H is mounted. When the first memory card MC1 is taken out from the memory card socket 丨〇H, the pressing portion 92 is returned to the spring force of the spring 711 by the spring force of the protruding portion 91 and the dedicated contact C10 to C13. Initial position (refer to Fig. 39 (a)). According to the memory card socket i 〇 H of the embodiment described above, when the i-th memory card MC1 is inserted into the socket body 2〇h, the pressing portion 92 touches the rear end faces 1311, 1312 of the first recesses 1301, 13〇2, and climbs to the first " • Recalling the rear portion of the i-th recess 13 (1, 13.2) of the card MCI. Therefore, the dedicated contact C10 to C13 can be moved away from the common terminals P3 and P6 in the first recess 1301, 1302. When the second memory card MC2 is inserted into the socket body 2〇11, the pressing portion 92 does not climb to the second recesses 14〇1, 14〇2 of the second memory card MC2. Further, the dedicated contacts C10 to C13 can be brought into contact with the corresponding dedicated terminals P10 to P13. Therefore, both the i-th and second memory cards MCI and MC2 can be supported. The projection portion 91 provided in the socket main body 20H and the pressing portion % provided at the distal end of the protruding portion 91 can be simplified in structure. Further, the protruding portion 91 is integrally formed with the socket main body 20H. Therefore, the number of parts and the number of assembly man-hours can be reduced, and the manufacturing cost can be reduced. Further, since the two dedicated contact members C10 and C11 (or C12, C13) can be simultaneously pressed by one pressing portion 92, the special contact can be used. Ci〇, C11 (or C12, C13) contact and leave at the same time The corresponding dedicated terminal ρι〇ριι (or P12, P13) 〇 40th circle shows the memory card socket ι〇ι of the modification of the embodiment. In the memory card socket 101, the contact preventing portion 901 and the memory card socket 10H In addition, the common configuration of the memory card socket 1〇1 and the memory card socket is denoted by the same reference numeral and the description thereof is omitted. The contact preventing portion 901 is a synthetic resin molded article, and is integrally formed as shown in Fig. 4 The main piece 93 having a rectangular plate shape of a horizontally long shape; a longitudinally elongated rectangular plate-shaped projecting portion 91 projecting forwardly from the front end of the autonomous piece 93; and a front end (tip) of the self-protruding portion -β 91 protruding forward The pressing portion 92 is pressed. - The contact preventing portion 901 is pressed into the press-fitting groove provided on the main piece 93 of the contact preventing portion 9〇1 by, for example, press-fitting a sheet (not shown) provided on the bottom case 30 (not shown). It is fixed in the bottom case 3〇Η. Therefore, the memory card socket 101 shown in Fig. 40 can also prevent the deterioration of the signal transmission characteristics as well as the memory card socket 10, and can support both the second and second memory cards MCI and MC2. Further, the bottom case 30H may be a synthetic resin molded article. At this time, the contact preventing portion 9〇1 and the bottom shell can be integrally formed. Further, the contact portion 901 of the contact prevention 54 201021301 may be formed integrally with the holding block 50. (Embodiment 10) FIG. 41 shows a memory card socket i〇j of this embodiment. The contact pins C1 to C13 of the memory card socket i〇j of the present embodiment are different from the memory card socket 10H of the ninth embodiment. Further, the common to the memory card socket 10J of the present embodiment and the memory card socket 10H of the ninth embodiment. The same components are denoted by the same reference numerals and the description thereof will be omitted. The memory card socket 100 of the present embodiment is configured to cope with the reverse mounting method. In the memory card socket 10J, the contact preventing portion 9〇j is formed by cleaving the portion of the top plate 31 of the bottom case 3〇H. The contact preventing portion 90J includes a protruding portion 91J and a pressing portion 92J. The protruding portion 91J is formed by bending into a scraped surface and having a diamond shape. The pressing portion 92J includes a pair of pressing pieces 921J and 921J. Each of the pressing pieces 9211 is provided at the tip end of the protruding portion 91J. The pair of pressing pieces 921J and 921J are arranged side by side so as to face the corresponding dedicated contact elements C10 and C11 (C12 and C13) (refer to Fig. 41 (b) and (d)). Further, each of the pressing pieces 921J of the pressing portion 92J is covered with an insulating film so that it does not conduct with the contacts ci〇 to C13 when it contacts the corresponding dedicated contact C10 to C13. When the second memory card Mc2 is inserted into the memory card socket 1 (>j, the protruding portion 91J of the contact preventing portion 90J is disposed in the second recess 1401 and 1402 of the second memory card MC2. Therefore, the contact preventing portion 90J does not It will climb to the rear of the first recess 1401, 1402 of the first memory card MCI, so that the pressing pads 921J of 55 201021301 will not contact the corresponding dedicated contact cio'cn (or contact C12, C13). Therefore, the contact portion 712 of each of the dedicated contact pins C10 to C13 contacts the corresponding dedicated terminal P10 to pi3 (refer to FIG. 41(a)), and the common terminal pi corresponding to each of the common contact pins C1 to C9 contacts the first terminal pi. When the memory card MCI is inserted into the memory card socket 10J, the protruding portion 91J climbs up to the periphery of the first concave portion 13 of the first memory card MCI, so that the two pressing pieces 921J and 921J are pushed upward. Thereby, the dedicated contact members C10 to C13 are pushed upward by the corresponding pressing piece 921J, and the contact portion 712 is away from the common terminals p3 and P6 (refer to Fig. 41 (c)) <> on the other hand, the common contact C1~C9 contact corresponding common terminals ρι~ρ9. Thus, according to the S memory card socket 10J, the socket can be made The thickness of the body is thin and the size is reduced. Fig. 42 is a view showing a memory card socket 10K according to an i-th modification of the embodiment. Further, 'the common composition of the memory card socket 1〇κ and the memory card socket' The same reference numerals are given and the description thereof is omitted. • The hidden card socket 1〇K' is provided with a synthetic resin contact preventing portion 90K. The contact preventing portion 90A and the contact preventing 珲90Κ are provided with a pressing piece at the top end thereof.

921Κ 之一 56 201021301 轉動自如地支持於底殼3 0H上。將第2記憶卡MC2插入至記憶卡插座1〇κ中時，各按壓片921Κ不會攀爬至較第2記憶卡MC2的第2凹部 1401、1402更後方的部分，從而專用接觸子cl〇〜ci3的接觸部712接觸對應之專用端子ρι〇〜ρΐ3 (參照第42圖 • ( a))。又，共通接觸子C1〜C9接觸對應之共通端子ρι 〜P9。 φ 將第1記憶卡MCI插入至記憶卡插座1〇κ中時，各按壓片921Κ攀爬至較第1記憶卡MC1的第j凹部13〇卜更後方的部分，專用接觸子Cl〇〜C13的接觸部712遠離共通端子P3、P6(參照第42圖（e))。此時，共通接觸子 C1〜C9接觸對應之共通端子P1〜P9。第43圖係表示本實施形態之第2變形例之記憶卡插座 l〇L。再者，對該記憶卡插座1〇L與記憶卡插座i〇h的共通構成，標注相同之符號且省略其說明。 • 與接觸防止部90J同樣地，接觸防止部90L係藉由將 .底殼3011的頂板3丨的一部分切缝翻邊而形成。接觸^止部 9〇L’具備突出部91L’該突出部91L以朝向記憶卡㈣之插入方向（第43圖⑴〜⑷中的右方向）之方式而彎折成u字形…接觸防止部9〇L，於突出部91[的頂端側包括按壓部92L。按壓部92L，具有以朝向記憶卡MC之插入方向之方式而突出的一對按壓片92il、92il。一對按壓片921L、921L，係以與對應之專用接觸子ci〇 cii (C12、C13)相向之方式而左右排列。又，各按壓片· 57 201021301 係由絕緣膜被覆’以使得當其與對應之專用接觸子CIO〜 c13接觸時不會與專用接觸子C10〜C13導通。再者，插入記憶卡MC時記憶卡插座10L之動作與記憶卡插座10J相同’故而省略其說明。第44圖係表示本實施形態之第3變形例之記憶卡插座 1 〇M。再者，對該記憶卡插座10M與記憶卡插座10H的共通構成，標注相同之符號且省略其說明。One of the 921Κ 56 201021301 is rotatably supported on the bottom case 30H. When the second memory card MC2 is inserted into the memory card socket 1 〇 κ, each of the pressing pieces 921 Κ does not climb to a portion further rearward than the second concave portions 1401 and 1402 of the second memory card MC2, so that the dedicated contact pin 〇 The contact portion 712 of the ~ci3 contacts the corresponding dedicated terminal ρι〇~ρΐ3 (refer to Fig. 42 (a)). Further, the common contacts C1 to C9 are in contact with the corresponding common terminals ρ1 to P9. φ When the first memory card MCI is inserted into the memory card socket 1 〇 κ, each of the pressing pieces 921 Κ climbs to a portion further rearward than the j-th recessed portion 13 of the first memory card MC1, and the dedicated contact is Cl 〇 C C13 The contact portion 712 is away from the common terminals P3 and P6 (see FIG. 42(e)). At this time, the common contacts C1 to C9 contact the corresponding common terminals P1 to P9. Fig. 43 is a view showing a memory card socket l〇L according to a second modification of the embodiment. The common configuration of the memory card socket 1A and the memory card socket i〇h will be denoted by the same reference numerals and will not be described. • Similarly to the contact preventing portion 90J, the contact preventing portion 90L is formed by cleaving a part of the top plate 3 of the bottom case 3011. The contact portion 9'L' includes a protruding portion 91L' which is bent in a U-shape so as to face the insertion direction of the memory card (four) (the right direction in FIGS. 43(1) to (4)). The contact preventing portion 9 〇L includes a pressing portion 92L on the distal end side of the protruding portion 91 [. The pressing portion 92L has a pair of pressing pieces 92il and 92il that protrude toward the insertion direction of the memory card MC. The pair of pressing pieces 921L and 921L are arranged side by side so as to face the corresponding dedicated contact ci〇 cii (C12, C13). Further, each of the pressing pieces 57, 201021301 is covered by an insulating film so that it does not conduct with the dedicated contacts C10 to C13 when it comes into contact with the corresponding dedicated contacts C10 to c13. Further, the operation of the memory card socket 10L when the memory card MC is inserted is the same as that of the memory card socket 10J. Therefore, the description thereof will be omitted. Fig. 44 is a view showing a memory card socket 1 〇M according to a third modification of the embodiment. The common configuration of the memory card socket 10M and the memory card socket 10H will be denoted by the same reference numerals and will not be described.

與接觸防止部90J同樣，接觸防止部9〇M係藉由將底殼3 0H的頂板31的一部分切縫翻邊且於特定位置處折曲而形成。接觸防止部90M，具備突出部91M，該突出部91M 係以朝向與記憶卡MC之插入方向（第44圖（a)〜（d) 中的右方向）相反之方向（第44圖（a)〜（d)中的左方向）之方式而彎折成u字形。又，接觸防止部90M，於突出β 91M的頂端侧包含按壓部92M。按壓部92M，具備以朝向記憶卡MC之插入方向之方式而突出的一對按壓片 921M、921M。一對按壓片921M、921M係以與對應之專用接觸子C1〇、cn (C!2、Cl3)相向之方式左右排列。又，於突出部91M的頂端設有傾斜片95,該傾斜片”係用於使得接觸防止部90M容易沿第！凹部13〇1、13〇2的後端面⑶卜丨⑴而攀就較第丨凹部⑽測靠後方的本體1001之部分。傾斜片95朝斜上方（後斜上方）突出。再者，按麼部隨的各按壓片92im、92im，係由絕緣膜被覆，以使得當其接觸對應之專用接觸子ci〇〜時不會與專用接觸子㈣〜CI3導通。插入記憶卡㈣時記 58 201021301 憶卡插座10M之動作與記憶卡插座i〇J相同，故而省略其說明》根據本實施形態之記憶卡插座10J〜10M，其等可與實施形態9之記憶卡插座1〇H同樣地支持第1及第2記憶卡 MCI、MC2兩者，並且可防止訊號傳輸特性惡化。Similarly to the contact preventing portion 90J, the contact preventing portion 9A is formed by crimping a part of the top plate 31 of the bottom case 30H and bending it at a specific position. The contact preventing portion 90M includes a protruding portion 91M that faces in a direction opposite to the insertion direction of the memory card MC (the right direction in FIGS. 44(a) to (d)) (FIG. 44(a) The shape of the left direction in ~(d) is bent into a u shape. Further, the contact preventing portion 90M includes a pressing portion 92M on the distal end side of the protruding β 91M. The pressing portion 92M includes a pair of pressing pieces 921M and 921M that protrude toward the insertion direction of the memory card MC. The pair of pressing pieces 921M and 921M are arranged side by side so as to face the corresponding dedicated contact members C1 〇, cn (C! 2, Cl3). Further, an inclined piece 95 is provided at the distal end of the protruding portion 91M, and the inclined piece is used to make the contact preventing portion 90M easy to climb along the rear end surface (3) of the first concave portion 13〇1, 13〇2 (1) The recessed portion (10) measures a portion of the body 1001 at the rear. The inclined piece 95 protrudes obliquely upward (back obliquely upward). Further, each of the pressing pieces 92im, 92im according to the portion is covered with an insulating film so that when When the contact is made with the special contact ci〇~, it will not be connected with the special contact (4)~CI3. When inserting the memory card (4), note 58 201021301 The action of the memory card socket 10M is the same as that of the memory card socket i〇J, so the description is omitted. The memory card sockets 10J to 10M of the present embodiment can support both the first and second memory cards MCI and MC2 in the same manner as the memory card sockets 1A of the ninth embodiment, and can prevent deterioration of signal transmission characteristics.

再者’接觸防止部90並不限定於上述例，只要構成為將第1記憶卡MCI插入至記憶卡插座1〇中時，高速傳輸用之接觸子C10〜C13不會接觸端子p3、p6即可。亦即，接觸防止機構係構成為；當將第1記憶卡MC i 保持於上述插入位置時，其觸抵第i凹部13〇1、13〇2的後端面1311、1312而被自第j凹部13〇1、13〇2内推出至第 1凹部130卜1302外，藉此使專用接觸子cl〇〜C13變形，從而使專用接觸子cio〜C13遠離第i凹部13〇1、13〇2内之共通端+ P3、P6。進而，接觸防止機構係構成為：當將第2記憶卡MC2保持於上述插人位置時，其不觸抵第2凹部I401、1402的後端面1411、1412而值於第2凹部1401、内，藉此使專用接觸子Cl〇〜⑴不變形，從而使專 1401、14〇2内之專用端用接觸子C10〜C13接觸第2凹部子 P10〜P13 。 59 201021301 【圖式簡單說明】第1圖係表示安插有第2記憶卡之實施形態1的記愔卡插座，（〇為主要部分之俯視圖、(b)為部分剖面圖。第圖係安插有第2記憶卡之實施形態1的座之部分立體圖。〜卡插第3圖係表示第！記憶卡，（a)為背面圖、（b 側面圖、（〇為右側面圖。為左參 ❹ 第4圖係表示筮^Further, the 'contact preventing unit 90' is not limited to the above example, and when the first memory card MCI is inserted into the memory card socket 1A, the contact pins C10 to C13 for high-speed transmission do not contact the terminals p3 and p6. can. In other words, the contact preventing mechanism is configured to be in contact with the rear end faces 1311 and 1312 of the i-th recessed portions 13〇1 and 13〇2 from the j-th recessed portion when the first memory card MC i is held at the insertion position. 13 〇 1, 13 〇 2 is pushed out to the first recess 130 130 1 2, thereby deforming the dedicated contacts c〇 to C13, so that the dedicated contacts cio ～ C13 are away from the ith recess 13 〇 1, 13 〇 2 Common to + P3, P6. Further, the contact preventing mechanism is configured such that when the second memory card MC2 is held at the insertion position, it does not touch the rear end faces 1411 and 1412 of the second recesses I401 and 1402 and is valued in the second recess 1401. Thereby, the dedicated contacts C1 to (1) are not deformed, so that the dedicated terminals in the special 1401, 14〇2 contact the second recesses P10 to P13 with the contactors C10 to C13. 59 201021301 [Simplified description of the drawings] Fig. 1 shows a card memory socket according to the first embodiment in which the second memory card is inserted, (the front view of the main part and the partial cross-sectional view of (b). Partial perspective view of the seat of the first embodiment of the second memory card. The third card shows the first memory card, (a) is a rear view, (b side view, (〇 is a right side view. Figure 4 shows 筮^

第2圮憶卡，（a)為背面圖、（b)A 面圖、（〇為前视圖。為千第5圖係表示篦,^ 體圖。 5己憶卡，“）為背面圖、(b)為立第ό圖係安杨座之部分立趙圖。記憶卡之實施形態1的記憶卡插第7圖係表； ,^ ^ < a y、女插有第1記憶卡之實施形態1的t& 卡插座’（a)為部的δ己憶筮8 ®及俯現圖、（b )為部分剖面圖。第8圖係安插有笛座之部分立體圖β 記憶卡之實施形態1的記憶卡插第9圖係安插有座的變形例之部八 a己憶卡之實施形態1的記愧卡插 π立體圆。第10圖係表示卡插座，U)為部分有第2記憶卡之實施形態2的記憶第11圖係安插有俯現圖、(b)為部分剖面圖。座之部分立_。第2記憶卡之實㈣態、2的記憶卡插 60 201021301 第12圖係表示安插有第丨記憶卡之實施形態2的記憶卡插座，（a)為部分俯視圖、（b)為部分剖面圏。第b圖係安插有第丨記憶卡之實施形態2的記憶卡插座之部分立體圖。第14圖（a)係實施形態2的記憶卡插座之部分剖面圖（b)係實施形態1的記憶卡插座之部分剖面圖。 ❹The second memory card, (a) is the rear view, (b) A side view, (〇 is the front view. It is the 第5, the figure is 篦, ^ is the body picture. The 5 memory card, ") is the rear view (b) is a part of the vertical map of the Anyang block. The memory card is inserted into the seventh card of the implementation of the memory card; ^ ^ < ay, the female inserted the first memory card The t& card socket of the first embodiment is a part of the δ 筮筮 8 、 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 The memory card of Fig. 1 is inserted into the ninth figure of the embossed part of the embossed embossed card. The 愧插插立体。。。。。。第第第第第第第第第第第第第第第第第第第第第第第2 Memory card embodiment 2 memory is shown in Fig. 11 with a top view and (b) a partial cross-section. Part of the stand _. The second memory card (4) state, 2 memory card insert 60 201021301 Fig. 12 is a view showing a memory card socket of the second embodiment in which a second memory card is inserted, wherein (a) is a partial plan view and (b) is a partial cross-section. Fig. b is a second embodiment in which a second memory card is inserted. Fig. 14(a) is a partial cross-sectional view showing the memory card socket of the second embodiment. Fig. 14(b) is a partial cross-sectional view showing the memory card socket of the first embodiment.

第15圖係表示實施形態2中的接觸子之變形例，（a) 為立體圖’（b )為側面圖。卡插第16圖係表示安插有第2記憶卡之實施形態3的記憶座（a )為部分俯視圖、（b )為部分縱剖面圖、（c ) 為部分橫剖面圖。卡插1 17圖係表示安插有第1記憶卡之實施形態3的記憶氣细座（a)為部分俯視圖、（b)為部分縱剖面圖、（c) 為°Ρ分横剖面圖。卡插1 ^圖係表示安插有第2記憶卡之實施形1 4的記憶為邱八U)為部分俯視圖、（b)為部分縱剖面圖、（c) 〇刀横剖面圖。卡插座Γ圖係表不安插有第1記憶卡之實施形態4的記憶為部分锖）為部分俯視圖、(b)為部分縱剖面圖、⑺ 甘J面圖。卡插座（圖係表不安插有第2記憶卡之實施形態5的記憶為部分擠為部分俯視圖、（b)為部分縱剖面圖、（C) 剖面圖。第圖係表不安插有第1記憶卡之實施形態5的記憶 201021301 卡插座（a)為部分俯視圖、（b)為部分縱剖面圖、（c) 為部分橫剖面圖。第22圖係實施形態6的記憶卡插座之說明圖。第23圖係實施形態6的記憶卡插座之立體圖。第24圖係實施形態6的記憶卡插座中之保持區塊之平面圖。第25圖係安插有第2記憶卡之實施形態6的記憶卡插座之俯視圖。第20圖係安插有第1記憶卡之實施形態6的記憶卡插座之俯視圖。第27圖係表示第1記憶卡，（a)為背面圖、（b)為剖面圖。第28圖係表示第2記憶卡，（a )為背面圖、（b )為剖面圖。第29圖係實施形態7的記憶卡插座之說明圖。第30圖係實施形態7的記憶卡插座中的保持區塊之平面圖。第31圖係安插有第2記憶卡之實施形態7的記憶卡插座之俯視圖。第32圖係安插有第1記憶卡之實施形態7的記憶卡插座之俯視圖。第33圖广；!、^ @ la)為自實施形態8的記憶卡插座除去罩殼後的狀態之立體圖、（b)為自實施形態8的記憶卡插座除去罩殼後的狀態之部分放大圖。 62 201021301 第34圖係、說明㈣施形態8的記憶卡插座中插入第^ 記憶卡時的接觸子的動作之說明圖。第35圖係表示於實施形態8的記憶卡插座中插入第2 記憶卡後的狀態之說明圖。第36圖係表示實施形態9的記憶卡插座⑴為將罩殼除去後的狀態之立體圖、（b)為部分放大圖。第37圖係實施形態9的記憶卡插座之立艘圖。 ❹ .馨第38圖係表示實施形態9的記憶卡插座的主要部分， (a)為立體圖、（b)為俯視圖、（c)為側面圖。第39圖係表示實施形態9的記憶卡插座，（&)為表示未保持有記憶卡的狀態之部分剖面圖，⑴為表示保持；第2記憶卡的狀態之部分剖面圖，（c)為表示保持有第^ 記憶卡的狀態之部分剖面圖。第4〇圖係實施形態9的記憶卡插座之變形例的將罩殼除去後的狀態之立體圖。第41圖係表示實施形態1〇的記憶卡插座的第m，（心為表不保持有第2記憶卡的狀態之部分剖面圖、（卜）為表示保持有第2記憶卡的狀態之部分俯視圖、（c)為表示保持有第！記憶卡的狀態之部分剖面圖、（d)為表示保持有第1 §己憶卡的狀態之部分俯視圖。第42圖係表示實施形態1〇的記憶卡插座的第2例，（狂）為表示保持有第2記憶卡的狀態之部分剖面圖、（b)為表示保持有第2記憶卡的狀態之部分俯視圖、（〇為表示保持有第1記憶卡的狀態之部分剖面圖、（d)為表示保持有 63 201021301 第1記憶卡的狀態之部分俯視圖。第43圖係表示實施形態10的士巧5己憶卡插座的第3例，（a) 為表示保持有第2記憶卡的狀態> -μ 士態之部分剖面圖、（b)為表不保持有第2記憶卡的狀態之部拍:古哲俯視圖、（Ο為表示保持有第1記憶卡的狀態之部分剖 ^ t ^ 面圖、（d)為表示保持有第1記憶卡之狀態之部分俯視圖。亏有第44圖係表示實施形態1〇 m 為表示保_2記憶卡的狀赌C憶卡插座的第4例’⑴ 示保持有S 2記憶卡的狀態之:P 面圖、（b )為表持有第1記憶卡的狀態之部分刀俯視圖、（c)為表示保第1記憶卡的狀態之部分俯視圖面圖（d)為表不保持有Fig. 15 is a view showing a modification of the contact in the second embodiment, and (a) is a perspective view (b) is a side view. Fig. 16 is a partial plan view showing a memory holder (a) of the third embodiment in which the second memory card is inserted, (b) a partial longitudinal sectional view, and (c) a partial cross-sectional view. The card insertion 1 17 is a partial view showing a memory chamber (a) of the third embodiment in which the first memory card is inserted, (b) a partial longitudinal sectional view, and (c) a partial cross-sectional view. The card insertion 1 ^ figure shows the memory of the embodiment 14 in which the second memory card is inserted. The memory is Qiu Ba U) is a partial plan view, (b) is a partial longitudinal cross-sectional view, and (c) a cross-sectional view of the file. In the card socket, the memory of the fourth embodiment in which the first memory card is inserted is a partial plan view, (b) a partial longitudinal view, and (7) a J-side view. Card socket (the memory of the fifth embodiment in which the second memory card is inserted is partially compressed into a partial plan view, (b) is a partial longitudinal sectional view, and (C) is a cross-sectional view. Memory card of the fifth embodiment of the memory card 201021301 card socket (a) is a partial plan view, (b) is a partial longitudinal sectional view, and (c) is a partial cross-sectional view. Fig. 22 is an explanatory view of the memory card socket of the sixth embodiment Fig. 23 is a perspective view showing a memory card socket of the sixth embodiment. Fig. 24 is a plan view showing a holding block in the memory card socket of the sixth embodiment. Fig. 25 is a view showing the memory of the sixth embodiment in which the second memory card is inserted. Fig. 20 is a plan view of a memory card socket according to a sixth embodiment in which a first memory card is inserted. Fig. 27 is a view showing a first memory card, wherein (a) is a rear view and (b) is a cross-sectional view. Fig. 28 is a view showing a second memory card, (a) is a rear view, and (b) is a cross-sectional view. Fig. 29 is an explanatory view of a memory card socket of the seventh embodiment. Fig. 30 is a memory card socket of the seventh embodiment. A plan view of the holding block in the middle. Figure 31 shows the second memory. Fig. 32 is a plan view of the memory card socket of the seventh embodiment in which the first memory card is inserted. Fig. 33 is wide; !, ^@ la) is from the eighth embodiment. A perspective view showing a state in which the memory card socket is removed from the casing, and (b) is a partially enlarged view showing a state in which the casing is removed from the memory card socket of the eighth embodiment. 62 201021301 Fig. 34 is a diagram for explaining the operation of the contactor when the second memory card is inserted into the memory card socket of the eighth embodiment. Fig. 35 is an explanatory view showing a state in which the second memory card is inserted into the memory card socket of the eighth embodiment. Fig. 36 is a perspective view showing a state in which the memory card socket (1) of the ninth embodiment is removed, and (b) is a partially enlarged view. Figure 37 is a stand diagram of the memory card socket of the ninth embodiment.第. 38 shows the main part of the memory card socket of the ninth embodiment, (a) is a perspective view, (b) is a plan view, and (c) is a side view. Figure 39 is a partial cross-sectional view showing a state in which a memory card is not held, and (1) is a partial cross-sectional view showing a state of a second memory card, (c) A partial cross-sectional view showing the state in which the second memory card is held. Fig. 4 is a perspective view showing a state in which a casing is removed in a modified example of the memory card socket of the ninth embodiment. Fig. 41 is a cross-sectional view showing a portion m of the memory card socket of the first embodiment, (the heart is a partial cross-sectional view showing a state in which the second memory card is not held, and (b) is a portion showing a state in which the second memory card is held. In the plan view, (c) is a partial cross-sectional view showing a state in which the first memory card is held, and (d) is a partial plan view showing a state in which the first memory card is held. Fig. 42 is a view showing the memory of the first embodiment. In the second example of the card socket, (crazy) is a partial cross-sectional view showing a state in which the second memory card is held, and (b) is a partial plan view showing a state in which the second memory card is held, (〇 indicates that the first state is held) A partial cross-sectional view of the state of the memory card, and (d) is a partial plan view showing a state in which the first memory card of 63 201021301 is held. Fig. 43 is a view showing a third example of the Shiqiao 5 card memory card of the tenth embodiment, ( a) is a partial cross-sectional view showing the state in which the second memory card is held, and - (b) is a part of the state in which the second memory card is not held: the top view of Gu Zhe, (Ο indicates the hold Partial section of the state of the first memory card, (d) A partial plan view showing the state in which the first memory card is held. The 44th figure shows that the embodiment 1〇m is the fourth example of the gambling C memory card socket indicating the _2 memory card, and (1) shows that S 2 is maintained. The state of the memory card: P-side view, (b) is a partial plan view of the state in which the first memory card is held, and (c) is a partial plan view (d) showing the state of the first memory card. Don't keep there

6464

201021301 【主要元件符號說明】 10、10A〜10M 記憶卡插座 20、20E、20G、20H 插座本體 21卡片槽 30、30E、30G、30H 底殼 31頂板 32側片 33突片 34、36、37 通孔 35支持片 40罩殼 41底板 42彈性片 43卡合爪 44卡合片 45突出片 50、50D、50E、50G 保持區塊 51保持具 52銷（第1銷） 53銷（第2銷） 54專用保持具 6卜 7卜 71A〜ΉΕ、71G 接觸端子 62、72構裝端子 73、714連結部 74連結件 75接觸防止部 80滑塊 81第1側部 82第2側部 83螺旋彈簧 90、 901 〜90M、713、713E 接觸防止部 91、 911〜91厘突出部 92、 92J〜92M 按壓部 93主片 94轴部 95 傾斜片 510導引槽 52卜811 段部 611 > 711 彈簧部 612'712 接觸部 715 抵接部 716 第1片 717 第2片 65 201021301 751 傾斜面 1100〜1108 凹部 752 抵接面 1301 ' 1302 第1凹部 921 ' 921J〜921M 按壓片 1311 ' 1312 後端面 1000 ' 1001 ' 1002 本體 1401 ' 1402 第2凹部 1010 突部 1411 ' 1412 後端面 1020 、1070、1201 〜1207 切口 C1 〜C9 共通接觸子 1030 卡合部 C10 〜C13 專用接觸子 1040 凹陷部 P1 〜P9 共通端子 1050 撥塊 P10〜P13 專用端子 1060〜1067 間隔壁 MC 記憶卡 1080 第1切口部 MCI第1記憶卡 1090 第2切口部 MC2第2記憶卡 .參 66201021301 [Description of main component symbols] 10, 10A~10M Memory card socket 20, 20E, 20G, 20H Socket body 21 Card slot 30, 30E, 30G, 30H Bottom case 31 Top plate 32 Side piece 33 Tabs 34, 36, 37 Hole 35 support piece 40 cover 41 bottom plate 42 elastic piece 43 engagement claw 44 engagement piece 45 protruding piece 50, 50D, 50E, 50G holding block 51 holding 52 pin (first pin) 53 pin (second pin) 54 dedicated holder 6 卜 7 卜 71A ΉΕ 71G contact terminal 62 , 72 constituting terminal 73 , 714 connecting portion 74 connecting member 75 contact preventing portion 80 slider 81 first side portion 82 second side portion 83 coil spring 90 901 ～ 90M, 713, 713E contact preventing portion 91, 911 to 91 PCT protruding portion 92, 92J to 92M pressing portion 93 main piece 94 shaft portion 95 inclined piece 510 guiding groove 52 811 segment portion 611 > 711 spring portion 612'712 contact portion 715 abutting portion 716 first piece 717 second piece 65 201021301 751 inclined surface 1100 to 1108 concave portion 752 abutting surface 1301 '1302 first concave portion 921 '921J to 921M pressing piece 1311 ' 1312 rear end surface 1000 ' 1001 '1002 body 1401 '1402 second recess 1010 projection 1411 ' 1412 rear end surface 1020, 10 70, 1201 ~ 1207 Incision C1 ~ C9 Common Contact 1030 Engagement C10 ~ C13 Dedicated Contact 1040 Depression P1 ~ P9 Common Terminal 1050 Dial P10 ~ P13 Dedicated Terminal 1060 ~ 1067 Partition MC Memory Card 1080 1st Cut Part MCI 1st Memory Card 1090 2nd Cutout Section MC2 2nd Memory Card.

Claims

201021301 VII. Patent application scope: 1. A memory card socket which is capable of inserting a memory card, the memory card having a card-shaped body and one end of the length direction of one side of the body in the width direction a plurality of terminals, the memory card socket comprising: a socket body having a card slot for holding the memory card inserted through the card slot at a predetermined insertion position; and a % contact member The socket body is in contact with the terminal of the memory card held at the insertion position; and the memory card has a first memory card and a second memory card, wherein the terminal is commonly provided on the ith memory card and a common terminal of the second memory card and a dedicated terminal provided only on the second memory card, wherein a partition wall that partitions the terminal is formed in the main body, and the terminal portion is on the partition wall of the second memory card a slit is formed in the longitudinal direction, and the contact is in common contact with the common terminal. And a dedicated contact for contact with the dedicated terminal, wherein the dedicated contact has a contact to be contacted with the dedicated terminal and a contact preventing portion for preventing the contact portion of the contact portion (4), and is configured to be: When the first memory card is in the position of 2 people, the dedicated contact is deformed by touching the I wall of the first memory card, so that the dedicated connection 67 201021301 is away from the common material; When the memory card (4) is at the insertion position, "the inside of the partition wall of the second memory card is cut by π", the dedicated contact is not deformed, and the dedicated contact is brought into contact with the dedicated terminal. The memory card socket according to the first aspect of the invention, wherein the slit is formed on the partition wall 10 adjacent to the dedicated terminal. The dedicated contact has a protruding portion which is self-holding and holding. The inner surface of the socket main body facing the one end side in the longitudinal direction of the memory card at the insertion position protrudes toward the other end side of the longitudinal direction of the memory card held at the insertion position, and the contact portion is provided on the protruding portion The distal end of the portion, and the contact preventing portion ' is integrally connected to the protruding portion at the rear end of the protruding portion. ❸ ' 3. ” The memory card socket of the first aspect of the patent, wherein the slit is formed on the partition wall beside the dedicated terminal, and the special contact has a protruding portion The inner surface of the socket main body facing the one end side in the longitudinal direction of the memory card held at the insertion position protrudes toward the other end side of the longitudinal direction of the memory card held at the insertion position, and the contact portion is provided to The front end of the protruding portion, and the contact preventing portion of the contact portion is connected to the contact portion of the contact portion, and the memory card socket is as described in the above-mentioned patent portion, wherein the slit is formed. The spacer is disposed adjacent to the dedicated terminal. The dedicated contact has a protrusion (4) that faces the side of the socket body from a side surface on one end side of the longitudinal direction of the memory card held at the insertion position. The inner surface protrudes toward the other end side in the longitudinal direction of the memory card held at the insertion position The contact preventing portion is formed from a distal end of the protruding portion and protrudes in a direction intersecting with a longitudinal direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. The contact portion is formed from the tip end of the contact preventing portion toward the other end of the length direction of the memory card held in the insertion position. The memory card socket according to claim 1, wherein the slit system is The dedicated contact member is formed on the partition wall adjacent to the dedicated terminal, and the dedicated contact member includes a protruding portion that faces from an inner surface of the socket body facing a side surface on one end side in a longitudinal direction of the memory card held at the insertion position. The contact preventing portion is formed toward the other end side of the memory card in the longitudinal direction of the insertion position, and the contact preventing portion is formed from the top end of the protruding portion and the above-mentioned memory card held at the insertion position. - in the plane parallel to the side, along with the length of the above memory card The contact portion is formed so as to protrude from the tip end of the contact preventing portion in the intersecting direction. .6· The memory card socket described in item i of the patent scope, wherein the above-mentioned dedicated contact has a protrusion a portion of the inner side surface of the socket body facing the side surface in the width direction of the memory card held at the insertion position, in a plane parallel to the one surface of the memory card held at the insertion position, The length direction of the memory card is perpendicular to the intersecting direction, and the contact preventing portion is formed to protrude from the terminating end of the protruding portion in the intersecting direction, and the contact portion is formed from the tip end of the contact preventing portion. The slit is protruded in a direction, and the slit is formed on the partition wall that overlaps the contact preventing portion in the thickness direction when held at the insertion position.记忆'' A memory card socket having a card-shaped body, and a plurality of terminals arranged in the width direction at one end in the longitudinal direction of one surface in the thickness direction of the main body, the memory The card socket is characterized in that: the socket body has a card slot, and the memory card inserted through the card slot 70 201021301 is held at a predetermined insertion position; the contact member is attached to the socket body, and is held The terminal contact of the memory card at the insertion position; and a contact preventing mechanism; and the memory card 'having a second memory card and a second memory card, the terminal is commonly provided on the first memory card and The common terminal of the second * memory card and the dedicated end of the second memory card are disposed on the main body of the first memory card, and a first recessed portion having the common terminal disposed on a bottom surface thereof is formed. The main body of the second memory card is formed with a second recessed portion in which the common terminal and the dedicated terminal are disposed on a bottom surface thereof. A surface on one end side in the longitudinal direction of each of the concave portions is open, and a surface on the other end side in the longitudinal direction of the second concave portion is located more outward than a surface on the other end side in the longitudinal direction of the first concave portion. On the other end side in the longitudinal direction, the contact pair ' has a common contact for contacting the common terminal and a dedicated contact for contacting the dedicated terminal, and the contact preventing mechanism is configured to: When the memory card is held at the insertion position, it comes into contact with the other end side surface in the longitudinal direction of the concave portion of the f1 and is pushed out from the inside of the 帛i concave portion to the outside of the first concave portion, thereby making the dedicated contact Deformation, & the dedicated contact is moved away from the common terminal in the first recess; and when the second XX card is held at the insertion position, the above-mentioned second recess 71 201021301 is not used The other end side surface in the longitudinal direction is located in the second recess, whereby the dedicated contact is not deformed, and the dedicated contact is contacted with the second recess Within the dedicated terminal. 8. The memory card socket according to claim 7, wherein the socket body is provided with a holder for holding the dedicated contact, and the holder is located at the memory card which is held at the insertion position. The terminal is further biased toward the card slot side, and the dedicated contact includes a protruding portion that protrudes from one end of the holder toward the longitudinal direction of the memory card that is held at the insertion position, and a tip that is provided at a distal end of the protruding portion. The above-mentioned special contact portion is used for contacting the above-mentioned dedicated terminal portion, and the contact preventing mechanism is provided in the above-mentioned special contact. The memory card socket according to the eighth aspect of the patent application, wherein the special contact is provided The connection portion is electrically connected to the external substrate, and is formed from the outer surface of the socket body and protrudes in the direction of the length direction of the memory card held in the insertion position . The memory card socket according to item 8 or item 9 of the 仃 , 10. 10. 。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。 And the connecting member connects the adjacent dedicated contact members in a state of being insulated from each other; and the connecting member is disposed on the protruding portion. 11. The memory card socket according to claim 0, wherein the contact prevention mechanism is provided in the connecting member. 12. The memory card socket according to claim 5, wherein the contact preventing mechanism includes a card contact portion that is in contact with the body of the second memory card held at the insertion position, the card contact portion The shape is linearly symmetrical with respect to a center line passing through a center between the contacts for the upper material along the longitudinal direction of the memory card held at the insertion position. 13. The memory card socket of claim 1 , wherein the connecting member is disposed more toward the contact portion side than the contact preventing mechanism. The memory card is as described in claim 7 of the patent application. The socket 'where the above-mentioned contact preventing mechanism is provided in the socket body. 15. The memory card socket according to Item 14 of the patent scope, wherein: 73 201021301, a contact preventing mechanism, comprising: a protruding portion made of an elastic material, and pressing the top contact of the dog out portion to press the dedicated contact And the protruding portion is formed in the socket body, wherein the portion of the memory card that is held at the insertion position is biased toward the card. The memory card of the position protrudes from one end side in the longitudinal direction. 16. The memory card socket of claim 15, wherein the protruding portion is formed integrally with the socket body. The memory card socket of claim 15 or claim 16, wherein: the plurality of dedicated contacts are arranged along a width direction of the memory card held at the insertion position, and ❹ The pressing portion is configured to simultaneously press at least two of the above-mentioned dedicated contacts 0 74