WO2010018816A1 - Memory card socket - Google Patents

Abstract

A memory card socket (10) is provided with common contact shoes (C1-C9) with which common terminals (P1-P9) of a first or a second memory card (MC1, MC2) make contact, and also with dedicated contact shoes (C10-C13) with which dedicated terminals (P10-P13) of the second memory card (MC2) make contact.  The dedicated contact shoes (C10-C13) are provided with contact preventing sections (713) for preventing contact between common terminals (P3, P6) and contact sections (712) with which the dedicated terminals (P10-P13) make contact.  When the first memory card (MC1) is mounted in the memory card socket, the contact preventing sections (713) make contact with a partition (1060) of the first memory card (MC1) to deform the dedicated contact shoes (C10-C13), separating the dedicated contact shoes (C10-C13) from the common terminals (P3, P6).  When the second memory card (MC2) is mounted in the memory card socket, the contact preventing sections (713) are located in cutouts (1200) formed in the partition (1060) of the second memory card (MC2), and this causes the dedicated contact shoes (C10-C13) to make contact with the dedicated terminals (P10-P13).

Description

Memory card socket

The present invention relates to a memory card socket, and more particularly to a memory card socket corresponding to a memory card (SD memory card or multimedia card).

Conventionally, there are SD memory cards and multimedia cards (MMC) as small and large capacity memory cards.

For example, Japanese Published Patent Publication No. 2004-71175 and Japanese Published Patent Publication No. 2003-249290 disclose memory card sockets for SD memory cards. When using an SD memory card, the SD memory card is inserted into a memory card socket mounted on an electrical device.

SD memory cards are often used as storage media for video recording equipment (electric equipment) such as digital cameras and digital video cameras.

In recent years, with the increase in definition of video recording equipment, content stored in storage media has become larger. Therefore, at the data transfer speed of the conventional SD memory card, it takes a relatively long time to record a large amount of data in real time or transfer it to an external device such as a computer.

Therefore, next-generation SD memory cards (hereinafter referred to as high-speed memory cards) with higher data transfer speeds have been proposed. The high-speed memory card has the same terminal (common terminal) as the conventional memory card so as to be compatible with the conventional SD memory card (hereinafter referred to as the conventional memory card). Also have terminals (dedicated terminals) for high-speed data transfer.

A tapered surface is formed at one end in the width direction of the front end surface (front end surface) of the conventional memory card. On the other hand, a tapered surface similar to that of the conventional memory card is formed at one end in the width direction of the front end surface of the high-speed memory card, but a step is formed on the tapered surface of the high-speed memory card.

A memory card socket capable of supporting both conventional memory cards and high-speed memory cards includes a contact corresponding to a common terminal (common contact) and a contact corresponding to a dedicated terminal (dedicated contact). . Here, when the high-speed memory card is inserted into the memory card socket, if the dedicated contact is in contact with the common terminal of the high-speed memory card, the prescribed data transfer speed may not be obtained. For this reason, in both compatible memory card sockets, it is necessary to prevent the dedicated contact from contacting the common terminal of the high-speed memory card when the high-speed memory card is inserted.

Therefore, in the above-described memory card socket, the high-speed memory card is distinguished from the conventional memory card by using the step of the tapered surface of the high-speed memory card.

For example, a mechanism has been proposed in which the insertion position of the conventional memory card is different from that of the high-speed memory card by using a step on the tapered surface of the high-speed memory card.

However, the above-described mechanism has a relatively complicated structure, and has been a cause of high cost and large size of the memory card socket.

It is also conceivable to add an identification device for identifying the type of memory card to the memory card socket. In this case, a switching device is provided in the electrical device in which the memory card socket is mounted. The switching device is configured to electrically disconnect the dedicated contact from the electric device according to the identification result in the identification device. However, in this case, it is necessary to add a switching device to the electric device when using the memory card socket.

The present invention has been made in view of the above reasons. An object of the present invention is to provide a memory card socket with a simple configuration and capable of appropriately bringing a contact into contact with a terminal of a memory card according to the type of the memory card.

The memory card socket according to the present invention can be mounted with a memory card including a card-shaped main body and a plurality of terminals arranged along the width direction at one end in the length direction of one surface in the thickness direction of the main body. . The memory card socket has a card slot and holds the memory card inserted through the card slot at a predetermined insertion position, and the memory card provided at the socket body and held at the insertion position. A contactor that is in contact with the terminal. The memory card includes a first memory card and a second memory card. The terminals include a common terminal provided in common for the first memory card and the second memory card, and a dedicated terminal provided only for the second memory card. A partition for partitioning the terminals is formed in the main body. A notch is formed at one end in the length direction of the partition of the second memory card. The contact includes a common contact for contact with the common terminal and a dedicated contact for contact with the dedicated terminal. The dedicated contact includes a contact portion that contacts the dedicated terminal and a contact prevention portion that prevents the contact portion from contacting the common terminal. When the first memory card is held at the insertion position, the contact prevention unit deforms the dedicated contact by hitting the partition of the first memory card so that the dedicated contact is removed from the common terminal. Configured to separate. In addition, when the second memory card is held at the insertion position, the contact prevention portion deforms the dedicated contact by being located in the notch formed in the partition of the second memory card. It is comprised so that the said exclusive contact may be made to contact the said exclusive terminal, without making it.

According to the present invention, when the second memory card is mounted, the contact between the contact prevention portion and the partition is avoided by the notch formed in the partition, and the contact portion of the dedicated contact is the dedicated terminal. To touch. When the first memory card is mounted, the contact preventing portion hits the partition, thereby deforming the dedicated contact and separating the dedicated contact from the common terminal. Therefore, the contact state between the dedicated contact and the common terminal can be switched depending on the presence or absence of the notch. Accordingly, the contact can be appropriately brought into contact with the terminal of the memory card according to the type of the memory card.

Preferably, the notch is formed in the partition located next to the dedicated terminal. The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. A projecting portion projecting toward the end side is provided. The contact portion is provided at the tip of the protruding portion. The contact preventing portion is integrally connected to the protruding portion after the protruding portion.

According to this configuration, the elastic modulus of the protruding portion that determines the contact pressure when the contact portion contacts the terminal can be individually designed regardless of the contact prevention portion. Therefore, the contact pressure can be easily designed.

Alternatively, the notch is formed in the partition located next to the dedicated terminal. The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. A projecting portion projecting toward the end side is provided. The contact portion is provided at the tip of the protruding portion. The contact preventing portion is integrally connected to the contact portion at the tip of the contact portion.

According to this configuration, since the contact prevention portion is integrally connected to the tip of the contact portion, the contact portion easily moves together with the contact prevention portion. Therefore, the contact portion can be reliably separated from the common terminal when the first memory card is mounted.

Alternatively, the notch is formed in the partition located next to the dedicated terminal. The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. A projecting portion projecting toward the end side is provided. The contact preventing portion protrudes from the tip of the protruding portion along a crossing direction that intersects the length direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. Formed. The contact portion is formed so as to protrude from the tip of the contact prevention portion toward the other end side in the length direction of the memory card held at the insertion position.

According to this configuration, when the first memory card is mounted, the contact portion can be reliably separated from the common terminal.

Alternatively, the notch is formed in the partition located next to the dedicated terminal. The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. A projecting portion projecting toward the end side is provided. The contact preventing portion protrudes from the tip of the protruding portion along a crossing direction that intersects the length direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. Formed. The contact portion is formed so as to protrude from the tip of the contact prevention portion along the intersecting direction.

According to this configuration, when the first memory card is mounted, the contact portion can be reliably separated from the common terminal. Further, in the length direction of the memory card held at the insertion position, the distance from the inner surface of the socket body can be made uniform between the contact prevention portion and the contact portion. Thereby, since the length of the protrusion can be made relatively long, it is possible to prevent the dedicated contactor from being plastically deformed when the first memory card is mounted.

Alternatively, the dedicated contactor is parallel to the one surface of the memory card held at the insertion position from the inner side surface of the socket body facing the side surface in the width direction of the memory card held at the insertion position. Protruding portions projecting along the intersecting direction intersecting the length direction of the memory card in the plane. The contact preventing portion is formed so as to protrude along the intersecting direction from the tip of the protruding portion. The contact portion is formed so as to protrude from the tip of the contact prevention portion along the intersecting direction. The notch is formed in the partition that overlaps with the contact prevention portion in the thickness direction when held at the insertion position.

According to this configuration, since the contact prevention portion is located between the protruding portion and the contact portion, the contact portion can be reliably separated from the common terminal when the first memory card is mounted. it can. In addition, the length of the protruding portion can be set regardless of the distance between the side surface on one end side in the length direction of the memory card held at the insertion position and the inner surface of the socket body facing the side surface. That is, since the length of the protruding portion can be increased while the distance is shortened, the dedicated contact can be prevented from being plastically deformed when the first memory card is mounted.

Another memory card socket according to the present invention can be mounted with a memory card including a card-shaped main body and a plurality of terminals arranged along the width direction at one end in the length direction of one surface in the thickness direction of the main body. It is. The memory card socket has a card slot and holds the memory card inserted through the card slot at a predetermined insertion position, and the memory card provided at the socket body and held at the insertion position. And a contact preventing means. The memory card includes a first memory card and a second memory card. The terminals include a common terminal provided in common for the first memory card and the second memory card, and a dedicated terminal provided only for the second memory card. The main body of the first memory card is formed with a first recess in which the common terminal is disposed on the bottom surface. The main body of the second memory card is formed with a second recess in which the common terminal and the dedicated terminal are disposed on the bottom surface. In each of the recesses, the surface on one end side in the length direction is opened. In the second recess, the surface on the other end side in the length direction is located on the other end side in the length direction than the surface on the other end side in the length direction of the first recess. The contact includes a common contact for contact with the common terminal and a dedicated contact for contact with the dedicated terminal. When the first memory card is held at the insertion position, the contact preventing means abuts against the surface of the first recess on the other end side in the length direction from the inside of the first recess to the first recess. The dedicated contact is deformed by being pushed out, and the dedicated contact is separated from the common terminal in the first recess. In addition, the contact prevention means does not contact the surface of the second recess in the length direction, and the second memory card is not held in the second recess when the second memory card is held at the insertion position. By being positioned, the dedicated contact is brought into contact with the dedicated terminal in the second recess without deforming the dedicated contact.

According to the present invention, it is possible to deal with both the first and second memory cards, and it is possible to prevent deterioration of signal transmission characteristics when the second memory card is mounted. Therefore, the contact can be appropriately brought into contact with the terminal of the memory card according to the type of the memory card.

Preferably, the socket body includes a holding tool for holding the dedicated contact. The holder is located closer to the card slot than the terminal of the memory card held at the insertion position. The dedicated contact is used for contact with the dedicated terminal provided at the end of the protruding portion protruding from one end of the memory card in the length direction of the memory card held at the insertion position from the holder. A contact portion. The said contact prevention means is provided in the said protrusion part of the said exclusive contact.

According to this configuration, since it is only necessary to provide the contact prevention means on the dedicated contactor, it can be realized with a simple structure while suppressing the manufacturing cost.

More preferably, the dedicated contact includes a connection portion that is electrically connected to an external substrate. The connection portion is formed so as to protrude from the outer surface of the socket body along a crossing direction intersecting the length direction in a plane parallel to the one surface of the memory card held at the insertion position.

According to this configuration, mounting on a substrate using a reverse mount method can be easily performed.

Preferably, a plurality of the dedicated contacts arranged in the width direction of the memory card held at the insertion position, and a connector for connecting the adjacent dedicated contacts in a state of being insulated from each other. Prepare. The connector is disposed on the protrusion.

According to this configuration, since the adjacent dedicated contacts are connected to each other by the connector, the adjacent dedicated contacts can be simultaneously contacted and separated from the corresponding dedicated terminals. Moreover, it can suppress by the said connection tool that the said exclusive contactor vibrates when inserting the said memory card in the said socket main body. Therefore, it can prevent that the said exclusive contactor contacts the said other contactor and the said terminal accidentally by such a vibration.

More preferably, the contact preventing means is provided in the connector.

According to this configuration, the dedicated contact itself does not need to be provided with the contact preventing means, so that the shape of the dedicated contact can be simplified and an increase in manufacturing cost can be suppressed.

More preferably, the contact prevention means includes a card contact portion that comes into contact with the main body of the first memory card held at the insertion position. The card contact portion has an axisymmetric shape with respect to a center line passing through the center between the adjacent dedicated contacts along the length direction of the memory card held at the insertion position.

According to this configuration, when the memory card is inserted into and removed from the socket body, the contact preventing means does not tilt obliquely. Therefore, the synchronization accuracy between the dedicated contacts connected by the connector is improved.

More preferably, the connector is disposed closer to the contact portion than the contact preventing means.

This configuration can more effectively suppress the vibration of the dedicated contactor.

In another memory card socket according to the present invention, the contact prevention means is provided in the socket body.

According to this configuration, the contact can be appropriately brought into contact with the terminal of the memory card according to the type of the memory card.

Preferably, the contact preventing means includes a protruding portion made of an elastic material and a pressing portion that is provided at a tip of the protruding portion and presses the dedicated contact. The protruding portion protrudes from the portion of the memory card held at the insertion position in the socket body to one end side in the length direction of the memory card held at the insertion position from the portion on the card slot side. Formed as follows.

According to this configuration, the structure of the contact preventing means can be simplified, and an increase in manufacturing cost can be suppressed.

More preferably, the protrusion is formed integrally with the socket body.

According to this configuration, since the number of parts and the number of assembly steps can be reduced, an increase in manufacturing cost can be suppressed.

More preferably, a plurality of dedicated contacts arranged in the width direction of the memory card held at the insertion position are provided. The pressing portion is configured to simultaneously press at least two of the dedicated contacts.

According to this configuration, a plurality of the dedicated contacts can be simultaneously contacted and separated from the corresponding dedicated terminals.

The memory card socket of Embodiment 1 with which the 2nd memory card was mounted | worn is shown, (a) is a top view of the principal part, (b) is a fragmentary sectional view. It is a fragmentary perspective view of a memory card socket same as the above. The 1st memory card is shown, (a) is a back view, (b) is a left view, (c) is a right view. The 2nd memory card is shown, (a) is a back view, (b) is a top view, (c) is a front view. The 2nd memory card is shown, (a) is a back view and (b) is a perspective view. It is a fragmentary perspective view of the memory card socket of Embodiment 1 with which the 2nd memory card was mounted | worn. The memory card socket of Embodiment 1 with which the 1st memory card was mounted | worn is shown, (a) is a partial top view, (b) is a fragmentary sectional view. It is a fragmentary perspective view of the memory card socket of Embodiment 1 with which the 1st memory card was mounted | worn. It is a fragmentary perspective view of the modification of a memory card socket same as the above. The memory card socket of Embodiment 2 with which the 2nd memory card was mounted | worn is shown, (a) is a partial top view, (b) is a fragmentary sectional view. It is a fragmentary perspective view of the memory card socket of Embodiment 2 with which the 2nd memory card was mounted. The memory card socket of Embodiment 2 with which the 1st memory card was mounted | worn is shown, (a) is a partial top view, (b) is a fragmentary sectional view. It is a fragmentary perspective view of the memory card socket of Embodiment 2 with which the 1st memory card was mounted | worn. (A) is a fragmentary sectional view of the memory card socket of Embodiment 2, (b) is a fragmentary sectional view of the memory card socket of Embodiment 1. The modification of the contact in Embodiment 2 is shown, (a) is a perspective view, (b) is a side view. The memory card socket of Embodiment 3 with which the 2nd memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. The memory card socket of Embodiment 3 with which the 1st memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. The memory card socket of Embodiment 4 with which the 2nd memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. The memory card socket of Embodiment 4 with which the 1st memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. The memory card socket of Embodiment 5 with which the 2nd memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. The memory card socket of Embodiment 5 with which the 1st memory card was mounted | worn is shown, (a) is a partial top view, (b) is a partial longitudinal cross-sectional view, (c) is a partial cross-sectional view. It is explanatory drawing of the memory card socket of Embodiment 6. It is a perspective view of a memory card socket same as the above. It is a top view of the holding block in the same as the above. It is a top view of the memory card socket of Embodiment 6 with which the 2nd memory card was mounted | worn. It is a top view of the memory card socket of Embodiment 6 with which the 1st memory card was mounted | worn. The 1st memory card is shown, (a) is a back view and (b) is a sectional view. The 2nd memory card is shown, (a) is a back view and (b) is a sectional view. It is explanatory drawing of the memory card socket of Embodiment 7. It is a top view of the holding block in the same as the above. It is a top view of the memory card socket of Embodiment 7 with which the 2nd memory card was mounted | worn. It is a top view of the memory card socket of Embodiment 7 with which the 1st memory card was mounted | worn. (A) is a perspective view of the state where the cover shell is removed from the memory card socket of Embodiment 8, and (b) is a partially enlarged view of the same. It is explanatory drawing explaining operation | movement of a contactor when a 1st memory card is inserted in a memory card socket same as the above. It is explanatory drawing which shows the state which inserted the 2nd memory card in the memory card socket same as the above. 10 shows a memory card socket according to Embodiment 9, wherein (a) is a perspective view with a cover removed, and (b) is a partially enlarged view. FIG. It is a perspective view of a memory card socket same as the above. The principal part of a memory card socket same as the above is shown, (a) is a perspective view, (b) is a top view, and (c) is a side view. The memory card socket same as the above is shown, (a) is a partial sectional view showing a state where the memory card is not held, (b) is a partial sectional view showing a state where the second memory card is held, and (c) is a first sectional view. It is a fragmentary sectional view which shows the state holding the memory card. It is a perspective view of the state which removed the cover of the modification of a memory card socket same as the above. 10 shows a first example of a memory card socket of Embodiment 10, wherein (a) is a partial cross-sectional view showing a state in which a second memory card is held, (b) is a partial top view showing the same, and (c) is a first memory. The fragmentary sectional view which shows the state holding the card | curd, (d) is a partial top view which shows the same as the above. 2 shows a second example of the memory card socket same as above, (a) is a partial cross-sectional view showing a state where the second memory card is held, (b) is a partial top view showing the same, and (c) is the first memory card. The fragmentary sectional view which shows the state hold | maintained, (d) is a partial top view which shows the same as the above. The third example of the memory card socket is shown, (a) is a partial cross-sectional view showing a state where the second memory card is held, (b) is a partial top view showing the same, and (c) is the first memory card. The fragmentary sectional view which shows the state hold | maintained, (d) is a partial top view which shows the same as the above. The 4th example of a memory card socket same as the above is shown, (a) is a fragmentary sectional view showing the state where the 2nd memory card is held, (b) is a partial top view showing the same, and (c) shows the 1st memory card. The fragmentary sectional view which shows the state hold | maintained, (d) is a partial top view which shows the same as the above.

In the following embodiments, a memory card socket that can be used for both a conventional memory card (first memory card) and a high-speed memory card (second memory card) is illustrated. The memory card socket according to the present invention is a memory card socket for a memory card (for example, a multimedia card) other than an SD memory card, or a card for an SDIO card having the same size and terminal arrangement as the SD memory card. It can also be applied to sockets.

(Embodiment 1)
As shown in FIGS. 1 and 2, the memory card socket 10 of the present embodiment includes a flat rectangular box-shaped socket body 20 and contacts (contacts) C1 to C13. The socket body 20 has a card slot 21 and holds the memory card MC inserted through the card slot 21 at a predetermined insertion position. The contacts C1 to C13 are individually contacted with terminals (contact pads) P1 to P13 of the memory card MC provided on the socket body 20 and held at the insertion position.

3 to 5 show the memory card MC. In the following description, in order to distinguish the first memory card and the second memory card as necessary, the first memory card is denoted by reference numeral MC1 and the second memory card is denoted by reference numeral MC2, as necessary.

FIG. 3 shows the first memory card MC1. The first memory card MC1 includes a main body 1000 formed in a card shape (rectangular plate shape) using, for example, a resin material. The main body 1000 contains a non-volatile storage element (not shown) such as a flash memory. 3A is the length direction of the first memory card MC1 (main body 1000), the left-right direction of FIG. 3A is the width direction of the first memory card MC1, and the left-right direction of FIG. The direction is the thickness direction of the first memory card MC1.

A plurality (eight in the illustrated example) of rectangular recesses (pad recesses) 1100 (1101 to 1108) are formed at one end (front end) in the length direction of one surface (back surface) of the main body 1000. Is done. The recesses 1101 to 1108 are arranged along the width direction of the main body 1000. Each of the recesses 1101 to 1108 is open at one end (front end) in the length direction. That is, each of the recesses 1101 to 1108 has an open end at the front end. Partitions (ribs) 1060 (1061 to 1067) between adjacent recesses 1101 to 1108 are formed in a band shape along the length direction of the main body 1000. The partitions 1061 to 1067 prevent the contacts C1 to C13 from coming into contact with each other when the memory card MC is mounted in the memory card socket 10.

A plurality (9 in the illustrated example) of terminals (I / O contact surfaces) P1 to P9 are provided at the front end of the back surface of the main body 1000. Terminals P1 to P7 are provided on the bottom surfaces of the recesses 1101 to 1107, respectively. Two terminals P8 and P9 are provided on the bottom surface of the recess 1108. The terminals P1 to P9 are arranged along the width direction of the main body 1000.

The first memory card MC1 is inserted into the memory card socket from the front end (the forward direction of the first memory card MC1 is the insertion direction into the memory card socket).

Projections 1010 are formed on both sides (left and right sides) of the main body 1000 in the width direction. A notch 1020 that is inclined obliquely is formed at a corner on one end side in the width direction of the front end surface of the main body 1000 (left end side in FIG. 3A). As a result, a tapered surface is formed at one end in the width direction of the front end surface of the first memory card MC1.

Further, an engaging portion 1030 that engages with the engaging claw 43 of the memory card socket 10 is formed on the side surface (the left side surface in FIG. 3A) on one end side in the width direction of the main body 1000. A concave portion 1040 is formed on the side surface on the other end side in the width direction of the main body 100 (the right side surface in FIG. 3A). A write protect switch knob 1050 is slidably disposed in the recess 1040.

The first memory card MC1 can be used by switching the operation mode. The functions of the terminals P1 to P9 are switched according to the operation mode. For example, in the first memory card MC1, in a mode in which high-speed data transfer is possible, data transfer is performed using four terminals. That is, 4-bit data transfer is performed in one clock cycle.

4 and 5 show the second memory card MC2. The second memory card MC2 includes a main body 1000 similar to the first memory card MC1. Hereinafter, in order to distinguish between the main body 1000 of the first memory card MC1 and the main body 1000 of the second memory card MC2, the main body 1000 of the first memory card MC1 is denoted by reference numeral 1001 as necessary, and the second memory card MC2 The main body 1000 is denoted by reference numeral 1002.

The main body 1002 is formed in the same card shape as the main body 1001. Similar to the main body 1001, the main body 1002 includes a protrusion 1010, an engaging portion 1030, a recess 1040, a knob 1050, recesses 1101 to 1108, and partitions 1061 to 1067.

The second memory card MC2 includes four terminals P10 to P13 in addition to the terminals P1 to P9. Terminals P1 to P9 are common terminals provided in common to the first memory card MC1 and the second memory card MC2, and terminals P10 to P13 are dedicated terminals provided only in the second memory card MC2.

In the second memory card MC2, common terminals P1 to P9 are arranged at positions similar to those of the conventional memory card MC1. That is, the common terminals P1 to P9 are arranged at one end (front end) in the length direction of one surface (back surface) in the thickness direction of the main body 1002.

The common terminals P3 and P6 are shorter in length (dimension in the front-rear direction) than the other common terminals P4, P5, P7 to P9. The front end positions of the common terminals P3 and P6 are located rearward (downward in FIG. 3A) from the front end positions of the other common terminals P4, P5, P7 to P9.

Dedicated terminals P10 and P11 are disposed on the bottom surface of the recess 1103. The dedicated terminals P10 and P11 are arranged in the width direction and are located in front of the terminal P3. Similarly, the dedicated terminals P12 and P13 are disposed on the bottom surface of the recess 1106. The dedicated terminals P12 and P13 are arranged in the width direction and are located in front of the common terminal P6.

The operation mode of the second memory card MC2 includes an SD mode that performs the same operation as the first memory card MC1, and a high-speed mode that performs higher-speed data transfer. The functions of the terminals P1 to P13 are switched between the SD mode and the high speed mode.

In the high-speed mode, a pair of dedicated terminals P10 and P11 and a pair of dedicated terminals P12 and P13 each transmit and receive a 1-bit differential data signal. That is, 2-bit data is transmitted / received using the dedicated terminals P10 to P13. Here, the number of bits that can be transmitted in one clock cycle is smaller in the high-speed mode than in the SD mode, but the frequency of the operation clock is dramatically increased by transmitting and receiving differential data. Therefore, high-speed data transmission is realized in the high-speed mode compared to the SD mode.

The main body 1002 of the second memory card MC2 includes a notch 1070 instead of the notch 1020. The main body 1002 is formed in the same external shape and dimensions as the main body 1001 of the first memory card MC1 except for the shape of the notch 1070. The second memory card MC2 is also inserted into the memory card socket from the front end (the front direction of the second memory card MC2 is the insertion direction into the memory card socket).

The notch 1070 is provided continuously with the first notch 1080 adjacent to the front surface of the main body 1002 at the same position as the notch 1020 and the first notch 1080, and the side of the main body 1002 (the left side in FIG. 4A). And a second notch 1090 adjacent to the first notch. The second notch 1090 is located behind the first notch 1080 and a step is formed between the first notch 1080 and the second notch 1090.

As described above, in the second memory card MC2, the first notch portion 1080 and the second notch portion having different depths in the insertion direction into the memory card socket (vertical direction in FIG. 4A) are provided at the front end portion of the main body 1002. 1090 is provided. In other words, a tapered surface similar to the first memory card MC1 is formed at one end in the width direction of the front end surface of the second memory card MC2, but a step is formed on the tapered surface of the second memory card MC2. Has been.

By the way, as shown in FIGS. 3 and 4, the second memory card MC2 mounted in the memory card socket 10 of the present embodiment has a partition 1062 between the recesses 1102 and 1103 and a partition between the recesses 1103 and 1104. 1063, a partition 1065 between the recesses 1105 and 1106, and a partition 1066 between the recesses 1106 and 1107 are provided with notches (relief portions) 1200 (1201 to 1204), respectively. The notches 1201 to 1204 are formed in the partitions 1062, 1063, 1065, and 1066 adjacent to the recesses 1103 and 1106 (both adjacent) where the dedicated terminals P10 to P13 are provided on the bottom surface. The notches 1201 to 1204 are formed from the front ends (one end in the length direction of the main body 1002) to the center in the length direction (front-rear direction) of the partitions 1062, 1063, 1065, and 1066. The notches 1201 to 1204 have a depth that makes the height of the partitions 1062, 1063, 1065, and 1066 approximately one half. Note that the shapes of the notches 1201 to 1204 are not limited to the above example.

Next, the memory card socket 10 of this embodiment will be described.

The socket body 20 has a base shell 30 and a cover shell 40 as shown in FIG. The socket body 20 has a holding block 50 that holds the contacts C1 to C13. In the following embodiments, description will be made using the front and rear (depth), top and bottom (thickness), and left and right (width) directions shown in FIG. This is not intended to limit the mounting direction of the memory card socket 10.

The base shell 30 is formed, for example, by stamping or bending a stainless steel metal plate having a very thin rectangular plate shape. The base shell 30 includes a rectangular plate-shaped top plate 31 and side pieces 32 extending downward from both left and right ends of the top plate 31. The base shell 30 has a box shape in which the lower side and the front and rear sides are open.

At the front end and the right end of the top plate 31 of the base shell 30, a plurality of protruding pieces 33 protruding downward are formed by bending. On the front end side of the top plate 31, a plurality of through holes 34 for preventing contact with the contacts C1 to C13 are formed. A support piece 35 is formed at the rear end of the top plate 31 so as to protrude downward from the left side of the position where the memory card MC passes through the card slot 21. The support piece 35 has an L shape with a tip protruding forward.

The cover shell 40 is formed by punching or bending a rectangular stainless steel plate having a very thin thickness. The cover shell 40 includes a bottom plate 41 having the same shape as the top plate 31. A bent piece (not shown) protruding upward is formed at the front end of the bottom plate 41 by bending. On the bottom plate 41, a plurality of protruding pieces 45 (see FIG. 37) protruding upward are formed by cutting and raising slightly behind the bent pieces. The cover shell 40 is disposed on the lower surface side of the holding block 50.

The cover shell 40 includes an elastic piece 42 that elastically contacts the lower surface of the main body 1000 and suppresses rattling of the main body 1000 when the memory card MC is attached (when the memory card MC is held at the insertion position). The cover shell 40 includes an engagement piece 44 having an engagement claw 43 that engages with the engagement portion 1030 of the main body 1000 when the memory card MC is attached. The elastic piece 42 and the engagement piece 44 are formed using cutting and raising or bending. The engagement piece 44 projects rearward from the left front corner of the cover shell 40. The front end of the engagement piece 44 is bent to the right to form the engagement claw 43.

The holding block 50 is a resin molded product and is formed in an L shape in plan view. The holding block 50 includes a prismatic holding tool 51 whose length direction is the left-right direction, and a prismatic leg 52 that protrudes rearward from the right end of the holding tool 51. The holder 51 is disposed along the left-right direction of the front ends of the base shell 30 and the cover shell 40 and constitutes the front wall of the socket body 20. The legs 52 are arranged along the front-rear direction of the right side piece 32 of the base shell 30 and constitute the right wall of the socket body 20. The leg 52 is provided with a step portion 521 that extends along the front-rear direction and faces the back surface of the memory card MC.

A first press-fitting groove (not shown) into which the protruding piece 33 of the base shell 30 is press-fitted is formed on the upper surface of the holding block 50. The base shell 30 is fixed to the upper surface side of the holding block 50 by press-fitting the protruding piece 33 of the base shell 30 into the first press-fitting groove of the holding block 50 (the holding block on the lower surface side of the top plate 31 of the base shell 30). 50 is fixed). A second press-fitting groove (not shown) into which the protruding piece 45 of the cover shell 40 is press-fitted is formed on the lower surface of the holding block 50. The cover shell 40 is fixed to the holding block 50 by press-fitting the protruding piece 45 of the cover shell 40 into the second press-fitting groove. The outer periphery of the cover shell 40 is fixed to the outer periphery of the base shell 30 fixed to the upper surface side of the holding block 50 using laser welding or the like.

As described above, the cover shell 40 and the base shell 30 are fixed to the holding block 50, whereby the socket body 20 is configured. A card slot (card insertion slot) 21 for inserting the memory card MC into the socket body 20 is formed on the rear surface of the socket body 20.

In the socket body 20 described above, the position of the front end of the first memory card MC1 held at the insertion position is the same as the position of the front end of the second memory card MC2 held at the insertion position.

Each contact C1 to C13 is formed by punching and bending a metal plate having excellent conductivity. The contacts C1 to C13 are held in the holder 51 of the holding block 50 by press-fitting (or simultaneous molding) so that they can come into contact with the terminals P1 to P13 of the second memory card MC2 held at the insertion position. Is done.

The contacts C1 to C9 are common contacts for contact with the common terminals P1 to P9, and the contacts C10 to C13 are dedicated contacts for contact with the dedicated terminals P10 to P13.

The common contacts C1 to C9 include a contact terminal 61 for contacting the common terminals P1 to P9 and a mounting terminal 62 for soldering. The contact terminal 61 protrudes toward the card slot 21 (rear) from the rear surface of the holder 51 (the inner surface of the socket body 20 facing the side surface on one end side in the length direction of the memory card MC held at the insertion position). The mounting terminal 62 protrudes forward from the front surface of the holding portion 51.

The dedicated contacts C10 to C13 include a contact terminal 71 for contacting the dedicated terminals P10 to P13 and a mounting terminal 72 for soldering. The contact terminal 71 protrudes rearward from the rear surface of the holder 51. The mounting terminal 72 projects forward from the front surface of the holder 51.

The mounting terminals 62 and 72 are connecting portions that are electrically connected to an external substrate (host substrate). As for the mounting terminals 62 and 72, the protrusion part from the front surface of the holder 51 is bent upward. The front ends of the mounting terminals 62 and 72 are extended forward, and the upper surface thereof is substantially the same height as the upper surface of the base shell 30.

The contact terminals 61 of the common contacts C1 to C9 include a spring part (protrusion part) 611 that protrudes rearward from the rear surface of the holder 51, and a contact part (contact part) 612 formed at the tip of the spring part 611. .

The contact portion 612 is used for contact with the common terminals P1 to P9. The contact portion 612 is formed in an arc shape that protrudes downward (on the cover shell 40 side).

The spring portion 611 is configured to bring the contact portion 612 into contact with the corresponding terminals P1 to P9 with a predetermined contact pressure. The spring portion 611 is formed in a tapered shape whose width becomes narrower toward the distal end side.

The contact terminals 71 of the dedicated contacts C10 to C13 include a spring part (protrusion part) 711, a contact part (contact part) 712 provided at the tip of the spring part 711, a contact prevention part 713, and a spring part 711. And a connecting portion 714 that integrally connects Rui and the rear preventing portion 713. In this way, the contact terminal 71 has a bifurcated shape branched into the spring portion 711 and the contact prevention portion 713 in the left-right direction.

The contact portion 712 is used for contact with the dedicated terminals P10 to P13. The contact portion 712 is formed in an arc shape that protrudes downward (on the cover shell 40 side).

The spring portion 711 is configured to bring the contact portion 712 into contact with the corresponding terminals P10 to P13 with a predetermined contact pressure. The spring portion 711 is formed in a tapered shape whose width becomes narrower toward the distal end side.

When the second memory card MC2 is mounted, the contact prevention unit 713 has the tip (contact portion) 715 received in the corresponding notches 1201 to 1204, but when the first memory card MC1 is mounted, the corresponding partitions 1062, 1063 By hitting 1065 and 1066, it is moved upward.

That is, when the first memory card MC1 is held at the insertion position, the contact prevention unit 713 deforms the dedicated contacts C10 to C13 by hitting the partitions 1062, 1063, 1065, and 1066 of the first memory card MC1. The dedicated contacts C10 to C13 are separated from the common terminals P3 and P6. On the other hand, when the second memory card MC2 is held at the insertion position, the contact prevention unit 713 is located in the notches 1201 to 1204 formed in the partitions 1062, 1063, 1065, and 1066 of the second memory card MC2. Thus, the dedicated contacts C10 to C13 are brought into contact with the dedicated terminals P10 to P13 without deforming the dedicated contacts C10 to C13.

In the dedicated contacts C10 and C12, the contact prevention unit 713 is positioned on the left side of the contact unit 712, and in the dedicated contacts C11 and C13, the contact prevention unit 713 is positioned on the right side of the contact unit 712. The dedicated contacts C10, C11 (C12, C13) are line symmetric with respect to the common contact C3 (C6). Therefore, the contact portions 712 of the dedicated contacts C10, C11 (C12, C13) are disposed between the contact prevention portions 713 of the dedicated contacts C10, C11 (C12, C13), and the dedicated contacts C10, C11 (C12, C12, The contact portion 612 of the common contact C3 (C6) is arranged between the contact portions 712 of C13).

In this embodiment, a guide groove 510 is formed on the rear surface of the holder 51. The guide groove 510 is formed in such a size that the contact terminal 71 (the connecting portion 714 of the contact terminal 71) can be swung up and down within a predetermined range. Due to the guide groove 510, the displacement width (stroke) in the vertical direction of the contact portion 712 and the contact prevention portion 713 becomes relatively large.

The contact prevention part 713 has a larger width dimension (dimension in the left-right direction) than the contact part 712 and the spring part 711. The tip of the contact preventing portion 713 is bent upward in an arc shape. The tip of the contact prevention unit 713 constitutes the contact part 715. The contact preventing portion 713 is bent into a crank shape at the center in the length direction. Thereby, as for the contact prevention part 713, the front end side is located above the rear side. The height difference between the lower surface of the contact portion 715 of the contact prevention portion 713 and the lower surface of the contact portion 712 is less than the height dimension of the partitions 1061 to 1067 of the memory card MC and the height dimension of the partitions 1061 to 1067. The value is slightly larger than half.

In the present embodiment, the contact prevention part 713 is made of metal and is formed integrally with the contact part 712 and the spring part 711. However, the contact prevention part 713 may be made of a synthetic resin. In this case, the contact prevention part 713, the contact part 712, and the spring part 711 may be integrally formed.

Incidentally, the length of the contact terminal 61 (the amount of protrusion from the rear surface of the holder 51) is longer than the length of the contact terminal 71. Further, the contact terminal 61 of the contact C1 is longer than the contact terminals 61 of the other contacts C2 to C9. Thus, the lengths of the contact terminals 61 and 71 of the respective contacts C1 to C13 are set in accordance with the distances of the corresponding terminals P1 to P13 from the front end surface of the main body 1000. Thus, when the second memory card MC2 is mounted, the contact portions 612 and 712 of the contacts C1 to C13 can be brought into elastic contact with the corresponding terminals P1 to P13.

The dedicated contacts C10 to C13 and the common contacts C1 to C9 are close to each other in the left-right direction. In order to avoid contact between the contacts C1 to C13, the dedicated contacts C10 to C13 are disposed below (on the cover shell 40 side) than the common contacts C1 to C9 (see FIG. 1B).

When the second memory card MC2 is mounted, as shown in FIG. 1B, the lower surface of the contact portion 715 of the contact prevention portion 713 and the partition 1062 are provided by the notches 1201 to 1204 provided in the partitions 1062, 1063, 1065, and 1066. , 1063, 1065, 1066, a gap is formed between the bottom surfaces of the notches 1201 to 1204 provided on the respective parts, 1063, 1065, 1066, so that the contact part 715 does not contact the partitions 1062, 1063, 1065, 1066. Therefore, as shown in FIG. 6, the contact portions 712 of the dedicated contacts C10 to C13 are in contact with dedicated terminals P10 to P13 formed on the bottom surfaces of the recesses 1103 and 1106. That is, when the second memory card MC2 is mounted, the high-speed mode contacts C10 to C13 and the corresponding dedicated terminals P10 to P13 are conducted.

7A and 7B, when the first memory card MC1 is mounted, the lower surface of the contact portion 715 of the contact prevention portion 713 contacts the upper surface of the partitions 1062, 1063, 1065, and 1066. As a result, the contact preventing portion 713 is pushed upward by the reaction force from the partitions 1062, 1063, 1065, and 1066. When the contact preventing portion 713 is pushed up, the contact terminals 71 of the dedicated contacts C10 to C13 are elastically deformed, and the contact portion 712 moves upward together with the contact preventing portion 713. Therefore, the contact portion 712 is lifted from the bottom surfaces of the recesses 1103 and 1106. As a result, even when the contact portion 712 and the terminals P3 and P6 overlap in the vertical direction, the contact portion 712 is separated from the common terminals P3 and P6 formed on the bottom surfaces of the recesses 1103 and 1106 as shown in FIG. . That is, the high-speed mode contacts C10 to C13 and the common terminals P3 and P6 are not electrically connected.

Thus, in the memory card socket 10 of the present embodiment, if the memory card MC mounted in the memory card socket 10 is the second memory card MC2, the dedicated contacts C10 to C13 are brought into contact with the dedicated terminals P10 to P13. If the memory card MC mounted in the memory card socket 10 is the first memory card MC1, the dedicated contacts C10 to C13 are not brought into contact with the common terminals P3 and P6. In other words, the contacts C1 to C13 are brought into contact with the terminals P1 to P13 in a state suitable for exerting the performance of each memory card MC according to the type of the memory card MC inserted into the memory card socket 10. Can do. In particular, when the second memory card MC2 is mounted, the high-speed mode contacts C10 to C13 can be brought into contact with the terminals P10 to P13, whereas when the first memory card MC1 is mounted, the high-speed mode contacts Contact between the children C10 to C13 and the common terminals P3 and P6 can be prevented. Therefore, it is possible to avoid the problem that the high-speed mode contacts C10 to C13 come into contact with the common terminals P3 and P6 and the signal transmission characteristics of the SD mode change and the predetermined transfer speed is not reached.

In addition, according to the memory card socket 10 of the present embodiment, since it is not necessary to provide the switching device as described above in the electric device, it is not necessary to make any changes to the electric device in which the memory card socket 10 is mounted. Therefore, the memory card socket 10 can be easily mounted on an electric device.

FIG. 9 shows a modification of the memory card socket 10 of the present embodiment. In FIG. 9, the connecting portion 714 of the contact terminal 71 of the dedicated contacts C10 to C13 is provided closer to the spring portion 711 than the example shown in FIG.

In the present embodiment, the contact prevention unit 713 elastically deforms the dedicated contacts C10 to C13, but may be configured to deform the contacts C10 to C13 using a link mechanism or the like.

(Embodiment 2)
As shown in FIGS. 10 to 13, the memory card socket 10A of the present embodiment is different from the memory card socket 10 of the first embodiment in the contact terminals 71A of the dedicated contacts C10 to C13. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10A of this embodiment, and the memory card socket 10 of Embodiment 1, and the description is abbreviate | omitted.

The contact terminal 71 </ b> A includes a spring portion 711, a contact portion 712, a contact prevention portion 713, and a connecting portion 714. The spring portion 711 is formed in a belt shape and protrudes rearward from the rear surface of the holder 51. The contact part 712 is provided at the tip of the spring part 711. The contact prevention part 713 is arrange | positioned so that it may be parallel to the contact part 711 in the width direction (left-right direction). The tip end portion (upper end portion in FIG. 10) of the contact prevention portion 713 constitutes the contact portion 715. The connecting portion 714 integrally connects the tip of the contact portion 712 (Shimozu in FIG. 10) and the rear end of the contact preventing portion 713 (Shimozu in FIG. 10). Therefore, the contact preventing unit 713 is integrally connected to the contact unit 712 at the tip of the contact unit 712.

That is, in the contact terminal 71 of the first embodiment, the contact prevention portion 713 is connected to the spring portion 711 and the contact portion 712 in the rear of the spring portion 711, whereas in the contact terminal 71A of the present embodiment, the contact prevention is performed. The part 713 is connected to the spring part 711 and the contact part 712 at the tip of the contact part 711.

When the second memory card MC2 is mounted, as shown in FIG. 10 (b), the notches 1201 to 1204 of the partitions 1062, 1063, 1065, and 1066 cause a gap between the lower surface of the contact portion 715 and the bottom surfaces of the notches 1021 to 1204. (The contact portion 715 does not contact the partitions 1062, 1063, 1065, 1066). At this time, as shown in FIG. 11, since the contact portion 712 contacts the dedicated terminals P10 to P13, the dedicated contacts C10 to C13 are electrically connected to the corresponding dedicated terminals P10 to P13.

When the first memory card MC1 is mounted (see FIG. 12A), the lower surface of the contact portion 715 contacts the upper surface of the partitions 1062, 1063, 1065, and 1066 as shown in FIG. The contact portion 715 is pushed upward by the reaction force from the partitions 1062, 1063, 1065, and 1066. As a result, as shown in FIG. 13, a gap is generated between the contact portion 712 and the common terminals P3 and P6, and the dedicated contacts C10 to C13 do not conduct with the common terminals P3 and P6.

In the memory card socket 10A of the present embodiment, since the contact prevention part 713 and the contact part 712 are integrally connected on the tip side of the contact part 712, a portion (connection) between the contact prevention part 713 and the contact part 712 is connected. The rigidity of the portion 714) can be increased. Therefore, the contact portion 712 can be reliably moved upward together with the contact prevention portion 713 when the first memory card MC1 is mounted. That is, the contact portion 712 can be reliably lifted from the bottom surfaces of the recesses 1103 and 1106. Moreover, since the contact preventing portion 713 is pushed up while elastically deforming the spring portion 711, a sufficient spring length can be secured by the spring portion 711. Therefore, it is possible to prevent the dedicated contacts C10 to C13 from being plastically deformed when the first memory card MC1 is mounted.

In the contact terminal 71A in the present embodiment, when the first memory card MC1 is inserted into the memory card socket 10A, the contact prevention unit 713 is attached to the main body 1001 before the contact unit 712, as shown in FIG. Contact. On the other hand, in the contact terminal 71 in the first embodiment, as shown in FIG. 14B, the contact portion 712 comes into contact with the main body 1001 before the contact prevention portion 713. Therefore, in the contact terminal 71A, it is necessary to increase the bending amount of the contact portion 715 of the contact prevention portion 713 (the length on the tip side from the connecting portion 714 that is a bent portion). Therefore, the height of the contact preventing portion 713 from the upper surface of the partitions 1062, 1063, 1065, and 1066 in the state where the conventional memory card MC1 is mounted is higher than that in the first embodiment (FIG. 12B, FIG. 7). (See (b)).

FIG. 15 shows a modification of the memory card socket 10A of the present embodiment. In the contact terminal 71 </ b> A in this modified example, the connecting portion 714 is formed by folding the tip of the contact portion 712 in the thickness direction. The connecting portion 714 integrally connects the contact portion 712 and the contact prevention portion 713. According to this configuration, when the first memory card MC1 is inserted, the contact portion 712 comes into contact with the main body 1001 before the contact prevention portion 713, so that the bending amount of the contact prevention portion 713 can be reduced.

(Embodiment 3)
As shown in FIGS. 16 and 17, the memory card socket 10B of the present embodiment is different from the memory card socket 10 of the first embodiment in the contact terminals 71B of the dedicated contacts C10 to C13. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10B of this embodiment, and the memory card socket 10 of Embodiment 1, and the description is abbreviate | omitted. 16 and 17, some components (for example, the contacts C1 to C9 and the engagement piece 44) are omitted as appropriate.

The contact terminal 71B includes a spring portion 711, a contact portion 712, and a contact prevention portion 713. The spring portion 711 is formed in a belt shape and protrudes rearward from the rear surface of the holder 51. The contact preventing part 713 is formed so as to protrude along the crossing direction from the tip of the spring part 711 (the lower side in FIG. 16A). The intersecting direction is a direction intersecting the length direction of the memory card MC in a plane parallel to the back surface of the memory card MC held at the insertion position. In the present embodiment, the intersecting direction is, for example, the width direction of the memory card MC held at the insertion position (the left-right direction in FIG. 16A). The contact portion 712 is formed so as to protrude from the tip of the contact prevention portion 713 toward the other end side in the length direction of the memory card MC held at the insertion position (the rear side of the memory card socket 10B). .

That is, in the memory card socket 10B of the present embodiment, the contact terminals 71B of the high-speed mode contacts C10 to C13 are not branched into the spring portion 711 and the contact prevention portion 713. A contact portion 712 is provided at the tip of the contact terminal 71B (the lower end in FIG. 16A), and a contact prevention portion 713 is provided at the center in the length direction of the contact terminal 71B. That is, the contact terminal 71 </ b> B is a crank provided with an L-shaped first piece 716 whose tip extends in one of the left and right directions, and a second piece 717 that extends backward from the tip of the first piece 716. Shape. The tip of the second piece 717 becomes the contact portion 712, and the tip of the first piece 716 becomes the contact prevention portion 713. Thereby, the contact prevention part 713 and the contact part 712 are arrange | positioned on one contact terminal 71B.

Moreover, in this embodiment, the contact prevention part 713 is formed in flat form. In the second memory card MC2, the notches 1201 to 1204 are formed by notching the partitions 1062, 1063, 1065 and 1066 over the entire length in the height direction (vertical direction).

When the second memory card MC2 is mounted, a gap is generated between the lower surface of the contact prevention portion 713 and the back surface of the main body 1002 due to the notches 1201 to 1204 as shown in FIG. Therefore, the contact prevention unit 713 does not contact the main body 1002. At this time, as shown in FIG. 16C, the contact portion 712 contacts the dedicated terminals P10 to P13, and the dedicated contacts C10 to C13 are electrically connected to the corresponding dedicated terminals P10 to P13.

When the first memory card MC1 is mounted, as shown in FIG. 17B, the lower surface of the contact prevention unit 713 contacts the upper surface of the partitions 1062, 1063, 1065, 1066, and the contact prevention unit 713 is connected to the partitions 1062, 1063. It is pushed upward by the reaction force from 1065 and 1066. As a result, as shown in FIG. 17C, a gap is generated between the contact portion 712 and the bottom surfaces of the recesses 1103 and 1106, and the dedicated contacts C10 to C13 are not electrically connected to the common terminals P3 and P6.

In the memory card socket 10B of the present embodiment, a contact portion 712 is formed at the tip of the contact prevention portion 713. Therefore, when the first memory card MC1 is mounted, the contact portion 712 can be reliably lifted from the bottom surfaces of the recesses 1103 and 1106.

In the present embodiment, the contact preventing portion 713 is pushed up while elastically deforming the spring portion 711 (a portion between the contact terminal 71B and the contact preventing portion 713). It is necessary to make the spring portion 711 sufficiently long so that the dedicated terminals P10 to P13 are not plastically deformed when the first memory card MC1 is mounted. Since the length of the spring portion 711 is determined by the distance between the front end surface of the memory card MC held at the insertion position and the rear surface of the holder 51, the insertion portion is set so that the spring portion 711 can be set to a desired length. It is desirable to set the position.

(Embodiment 4)
As shown in FIGS. 18 and 19, the memory card socket 10C of the present embodiment is different from the memory card socket 10B of the third embodiment in the contact terminals 71C of the dedicated contacts C10 to C13. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10C of this embodiment, and the memory card socket 10B of Embodiment 3, and the description is abbreviate | omitted. 18 and 19, some components (for example, common contacts C1, C2, C4, C5, C7 to C9 and the engagement piece 44) are not shown.

The contact terminal 71 </ b> C includes a spring portion 711, a contact portion 712, and a contact prevention portion 713. The spring portion 711 is formed in a belt shape and protrudes rearward from the rear surface of the holder 51. The contact preventing portion 713 extends from the tip of the spring portion 711 (the lower side in FIG. 18A) to the cross direction, for example, the width direction of the memory card MC held at the insertion position (left and right in FIG. 18A). Direction). The contact portion 712 is formed so as to protrude from the tip of the contact prevention portion 713 along the intersecting direction.

That is, in the memory card socket 10C of the present embodiment, the contact terminals 71C of the high-speed mode contacts C10 to C13 are formed from the strip-shaped first piece 716 whose longitudinal direction is the front-rear direction and the tip of the first piece 716. It is formed in an L shape having a second piece 717 extending in one of the left and right directions. The tip of the second piece 717 is bent downward. The tip of the second piece 717 forms a contact portion 712. The tip (lower end) of the contact portion 712 has an arc shape. On the other hand, the center of the second piece 717 constitutes a contact prevention unit 713. The contact prevention part 713 is positioned so as to straddle the recesses 1103 and 1106 and the recesses 1102, 1104, 1105 and 1107 adjacent to the recesses 1103 and 1106.

When the second memory card MC2 is mounted, as shown in FIG. 18B, the contact between the contact preventing portion 713 and the main body 1002 is prevented by the notches 1201 to 1204. At this time, as shown in FIG. 18C, the contact portion 712 contacts the dedicated terminals P10 to P13. Therefore, the dedicated contacts C10 to C13 are electrically connected to the corresponding dedicated terminals P10 to P13.

When the first memory card MC1 is mounted, as shown in FIG. 19 (b), the contact preventing portion 713 hits the partitions 1062, 1063, 1065, 1066 and is pushed upward. As a result, the dedicated contacts C10 to C13 are deformed so that the contact portion 712 is separated from the common terminals P3 and P6. As a result, even if the contact portion 712 and the common terminals P3 and P6 overlap in the vertical direction as shown in FIG. 19A, the contact portion 712 and the common terminals P3 and P6 as shown in FIG. 19C. There is a gap between them. Therefore, the dedicated contacts C10 to C13 do not conduct with the common terminals P3 and P6.

According to the memory card socket 10C of the present embodiment, the contact prevention unit 713 can be separated from the holder 51 to the rear (downward in FIG. 18A) to the same position as the contact unit 712. Therefore, the spring portion 711 can be made longer than the memory card socket 10B of the third embodiment, and the dedicated contacts C10 to C13 can be prevented from being plastically deformed when the first memory card MC1 is mounted.

Incidentally, in the second memory card MC2 shown in FIG. 18, the lengths of the notches 1201 to 1204 are set so that the partitions 1062, 1063, 1065, and 1066 do not contact the contact preventing portion 713 of the contact terminal 71C in this embodiment (FIG. 18). The vertical dimension in (a) is longer than that of the second memory card MC2 shown in FIG. For example, when the lengths of the partitions 1062, 1063, 1065 and 1066 are 6.0 mm, the lengths of the notches 1201 to 1204 are 2.5 mm in the second memory card MC2 shown in FIG. 16, and the second memory shown in FIG. In card MC2, it is set to 3.0 mm.

(Embodiment 5)
As shown in FIGS. 20 and 21, the memory card socket 10D of the present embodiment is different from the memory card socket 10C of the fourth embodiment in the contact terminals 71D of the dedicated contacts C10 to C13 and the holding block 50D. In addition, the same code | symbol is attached | subjected to the structure which is common in memory card socket 10D of this embodiment, and memory card socket 10C of Embodiment 4, and the description is abbreviate | omitted. 20 and FIG. 21, illustration of some components (for example, the contacts C1, C2, C4, C5, C7 to C9 and the engagement piece 44) is omitted as appropriate.

The holding block 50D is formed in a U shape in plan view. The holding block 50 </ b> D includes a prism 51 (second leg) 53 that protrudes rearward from the left end of the holder 51 in addition to the holder 51 and the leg (first leg) 52. The second leg 53 is disposed along the front-rear direction of the left side piece 32 of the base shell 30 and constitutes the left wall of the socket body 20.

The contact terminal 71D includes a spring portion 711, a contact portion 712, and a contact prevention portion 713. The spring part 711 is formed in a band shape. The spring portions 711 of the dedicated contacts C10 and C11 are arranged on the inner side surface (the right side surface of the second leg 53) of the socket body 20 facing the one side surface (left side surface) in the width direction of the memory card MC held at the insertion position. ) Project along the crossing direction (the right direction in FIG. 20A). On the other hand, the spring portions 711 of the dedicated contacts C12 and C13 are arranged on the inner side surface (the first leg 52 of the first leg 52) of the socket body 20 facing the other side surface (right side surface) in the width direction of the memory card MC held at the insertion position. It protrudes from the left side surface along the intersecting direction (left direction in FIG. 20A). The contact prevention part 713 is formed so that it may protrude from the front-end | tip of the spring part 711 along the said crossing direction. The contact portion 712 is formed so as to protrude from the tip of the contact prevention portion 713 along the intersecting direction.

That is, the contacts C10 and C11 corresponding to the terminals P10 and P11 are held by the left second leg 53, and the contacts C12 and C13 corresponding to the terminals P12 and P13 are held by the right first leg 52. Each contact terminal 71D is formed in a strip shape with the left-right direction of the memory card socket 10D as the length direction. The front end portion of the contact terminal 71D constitutes a contact portion 712, and the central portion of the contact terminal 71D constitutes a contact prevention portion 713. Here, the contacts C10 and C11 (C12 and C13) are arranged to be aligned in the front-rear direction. The contact portion 712 of the contact C11 (C12) at the front (upper in FIG. 20A) protrudes rearward from the contact prevention portion 713. The dedicated contacts C10 to C13 are disposed below the common contacts C1 to C9. Therefore, even when the common contacts C1 to C9 and the dedicated contacts C10 to C13 intersect, the common contacts C1 to C9 and the dedicated contacts C10 to C13 do not contact each other.

By the way, in the second memory card MC2, as shown in FIG. 20A, when held in the memory card socket 10D at the insertion position, a partition 1061 overlapping with the contact preventing portion 713 of the contact terminal 71D in the thickness direction. , 1062, 1066, 1067 are formed with notches 1205, 1201, 1204, 1206. That is, the notches 1205, 1201, 1204, 1206 are formed in the partitions 1061, 1062, 1066, 1067 that interfere with the contact terminals 71D of the contacts C10 to C13. In other words, the partitions 1061 and 1062 positioned between the recess 1103 where the dedicated terminals P10 and P11 are provided on the bottom surface and the first cutout 1080, and the recess 1106 where the dedicated terminals P12 and P13 are provided on the bottom surface Notches 1205, 1201, 1204, 1206 are formed in all of the partitions 1066, 1067 located between the right edge of the main body 1002. A cutout 1207 is formed at the right end of the second memory card MC2 to prevent contact with the spring portions 711 of the dedicated contacts C12 and C13.

When the second memory card MC2 is mounted, as shown in FIG. 20 (b), the contact prevention portion 713 does not contact the main body 1002 because there are notches 1201, 1204 to 1206. At this time, as shown in FIG. 20C, the contact portion 712 contacts the dedicated terminals P10 to P13, and the dedicated contacts C10 to C13 are electrically connected to the corresponding dedicated terminals P10 to P13.

When the first memory card MC1 is mounted, as shown in FIG. 21B, the contact prevention unit 713 hits the partitions 1061, 1062, 1066, 1067, and the contact prevention unit 713 is pushed upward. As a result, as shown in FIG. 21, a gap is generated between the contact portion 712 and the common terminals P1 to P9 provided on the bottom surfaces of the recesses 1103 and 1106, and the dedicated contacts C10 to C13 are connected to the common terminals P3 and P13. Not conducting with P6.

According to the memory card socket 10D of the present embodiment, the length of the spring portion 711 is designed to a desired value regardless of the distance between the front end surface of the memory card MC held at the insertion position and the rear surface of the holder 51. it can. Accordingly, while the distance between the front end surface of the memory card MC held at the insertion position and the rear surface of the holder 51 is shortened, the length of the spring portion 711 is sufficiently secured and the first memory card MC1 is mounted. It is possible to prevent plastic deformation of the dedicated contacts C10 to C13 at the time.

(Embodiment 6)
As shown in FIGS. 22 to 24, the memory card socket 10E of the present embodiment includes a flat rectangular box-shaped socket body 20E including a base shell 30E and a cover shell 40. In addition, the memory card socket 10E includes contacts C1 to C13, a holding block 50E that holds the contacts C1 to C13, a slider 80, and a lock unit (not shown). In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10E of this embodiment, and the memory card socket 10 of Embodiment 1, and the description is abbreviate | omitted.

Here, FIG. 27 shows the first memory card MC1, and FIG. 28 shows the second memory card MC2. In the second memory card MC2 shown in FIG. 28, the notch 1200 is not formed.

The dimension L2 in the front-rear direction (vertical direction in FIG. 28) of the recesses 1100 (1102 to 1108) of the second memory card MC2 is the front-rear direction (in FIG. 27) of the recesses 1100 (1102 to 1108) of the first memory card MC1. It is larger than the dimension L1 in the vertical direction (that is, L2> L1). The recess 1103 (1106) of the first memory card MC1 constitutes a first recess 1301 (1302) formed in the main body 1001 of the first memory card MC1 and having the common terminal P3 (P6) disposed on the bottom surface. On the other hand, the recess 1103 (1106) of the second memory card MC2 is formed in the main body 1002 of the second memory card MC2, and the common terminal P3 (P6) and the dedicated terminals P10, P11 (P12, P13) are on the bottom surface. The second recess 1401 (1402) to be arranged is configured. Since the dimension L2 in the front-rear direction of the recess 1100 (1102 to 1108) of the second memory card MC2 is larger than the dimension L1 in the front-rear direction of the recess 1100 (1102 to 1108) of the first memory card MC1, the second recess The locations 1401 and 1402 are the other end sides in the length direction (the lower end side in FIG. 28) (rear side surfaces) 1411 and 1412 are the other end sides in the length direction of the first recesses 1301 and 1302 (see FIG. 27). Is located on the other end side (lower end side in FIG. 28) in the length direction from the surfaces (rear side surfaces) 1311 and 1312.

The base shell 30E includes a through hole 36 in the top plate 31 for allowing the mounting terminals 72 of the contacts C10 to C13 to face the outside of the socket body 20E. The through hole 36 is formed behind the through hole 34.

As shown in FIG. 24, the holding block 50 </ b> E includes a holder (dedicated holder) 54 in addition to the holder (common holder) 51 and the legs 52 and 53.

In the common holder 51, nine common contacts (first contacts) C1 to C9 respectively corresponding to the nine common terminals P1 to P9 are press-fitted and fixed. The contact side (contact portion 612) of each of the common contacts C1 to C9 protrudes to the rear surface side (card slot 21 side) of the common holder 51. A spring receiver (not shown) that holds one end of a later-described coil spring 83 is provided at the right end of the rear surface of the common holder 51.

The dedicated holder 54 is formed in a prismatic shape with the left-right direction as the length direction, and is arranged in a shape facing the common holder 51. The dedicated holder 54 connects the substantially intermediate portions of the legs 52 and 53 in the front-rear direction. The dedicated holder 54 connects the legs 52 and 53 on the base shell 30E side (upper side) so that the memory card MC can be disposed between the bottom plate 41 of the cover shell 40 and the dedicated holder 54 (see FIG. 22). ). The dedicated holder 54 is located closer to the card slot 21 than the terminals P1 to P13 of the memory card MC held at the insertion position (see FIGS. 25 and 26).

Four dedicated contacts (second contacts) C10 to C13 respectively corresponding to the four dedicated terminals P10 to P13 are press-fitted into the dedicated holder 54 and fixed. The contact side (contact portion 713) of each of the dedicated contacts C10 to C13 protrudes to the front side of the dedicated holder 54 (memory card insertion direction).

Thus, in the memory card socket 10E of the present embodiment, the common contacts C1 to C9 and the dedicated contacts C10 to C13 face each other in the insertion direction of the memory card MC (up and down direction in FIG. 24).

As shown in FIG. 22, the dedicated contacts C10 to C13 are formed in a belt shape having the longitudinal direction as the longitudinal direction, the front end side thereof is used as the contact terminal 71E, the rear end side is used as the mounting terminal 72, and the contact terminal A portion between 71E and the mounting terminal 72 is used as a connecting portion 73 embedded in the dedicated holder 54.

The dedicated terminal 71E includes a spring portion (protruding portion) 711 that protrudes forward from the front end (upper end in FIG. 24) of the connecting portion 73, and a contact portion 712 provided at the tip (upper end in FIG. 24) of the spring portion 711. Prepare.

The central part of the spring part 711 is bent in a crank shape. A bent portion, which is a portion bent in the spring portion 711, constitutes a contact preventing portion (climbing portion) 713E. When the first memory card MC1 is held at the insertion position, the contact preventing portion 713E hits the rear surface 1311 or 1312 of the first recess 1301 or 1302 and enters the first recess 1301 or 1302 from the inside of the first recess 1301 or 1302. When the second memory card MC2 is pushed out of the locations 1301 and 1302 and held in the insertion position, the second recesses 1401 and 1402 do not hit the rear surface 1411 or 1412 but are in the second recesses 1401 and 1402. Configured to be located in When the contact prevention portion 713E is pushed out of the first recesses 1301 and 1302 to the outside of the first recesses 1301 and 1302, the dedicated contacts C10 to C13 are connected to the common terminals P3 and P6 in the first recesses 1301 and 1302, respectively. Deforms so that it does not touch. On the other hand, when the contact prevention portion 713E is located in the second recesses 1401 and 1402, the dedicated contacts C10 to C13 are not deformed, and the dedicated contacts C10 to C13 are dedicated to the second recesses 1401 and 1402. Contact the terminals P10 to P13.

As described above, the dedicated contacts C10 to C13 include the spring portion 711 that is a protruding portion that protrudes from the dedicated holder 54 to one end side (front end side) in the length direction of the memory card MC held at the insertion position. A contact portion 712 provided at the tip of the spring portion 711 and used for contact with the dedicated terminals P10 to P13. The contact preventing unit 713E serving as a contact preventing unit is provided in a spring portion 711 that is a portion between the contact portion 712 and the connecting portion 73 of the dedicated contacts C10 to C13.

The mounting terminal 72 is bent in a crank shape so as to come out of the socket body 20E from the corresponding through hole 36.

The slider 80 is disposed in the socket body 20E so as to be movable in the front-rear direction along the insertion direction of the memory card MC (vertical direction in FIG. 24). The slider 80 abuts on the front end (front end) of the memory card MC inserted from the card slot 21 and moves forward together with the memory card MC upon receiving a pressing force from the memory card MC.

The slider 80 is a synthetic resin molded product, and integrally includes a first side portion 81 and a second side portion 82. The first side portion 81 is formed in a strip shape and is in contact with the left side surface of the main body 1000 of the memory card MC. On the lower edge of the inner side surface of the first side portion 81, a step portion 811 (see FIG. 36) that extends along the insertion direction of the memory card MC and faces the back surface of the memory card MC is integrally projected. . The second side portion 82 projects rightward from the tip end portion (front end portion) of the first side portion 81. The second side portion 83 is formed in contact with the tapered surface formed by the notch 1020 of the main body 1001 and the tapered surface formed by the first notched portion 1080 of the main body 1002. When the first memory card MC1 is inserted into the memory card socket 10E, the tapered surface formed by the notch 1020 of the first memory card MC1 abuts the inclined surface of the second side portion 82, and the second memory card MC2 is inserted. In this case, the tapered surface formed by the first notch portion 1080 of the second memory card MC2 collides with the inclined surface of the second side portion 82. As a result, the slider 80 moves forward in response to the pressing force from the memory card MC.

In the state where the memory card MC is inserted to the insertion position, the front end of the first memory card MC1 and the front end of the second memory card MC2 are at the same position.

Between the slider 80 and the spring holder of the common holder 51, there is interposed a coil spring 83 that constantly urges the slider 80 rearward (on the card slot 21 side).

The above-mentioned locking means (slider locking means) fixes the slider 80 so as not to retract from a predetermined position (position shown in FIGS. 25 and 26). When the slider 80 is moved forward by pushing the memory card MC forward after the slider 80 is fixed, the lock means releases the fixation of the slider 80.

The slider 80, the urging spring 83, and the locking means are well known in the art and will not be described in detail.

Next, the operation of the contacts C1 to C13 when the memory card MC is inserted into the memory card socket 10E of the present embodiment will be described.

As described above, the front-rear dimension L2 of the second recesses 1401, 1402 is larger than the front-rear dimension L1 of the first recesses 1301, 1302.

Therefore, when the second memory card MC2 is mounted, as shown in FIG. 22A, the contact preventing portions 713E of the dedicated contacts C10 and C11 hit the rear end surface 1411 of the corresponding second recess 1103 (1401). There is nothing. Therefore, the contact prevention part 713E is located in the 2nd recess 1401, and the contact part 712 of each exclusive contact C10 and C11 contacts the corresponding exclusive terminals P10 and P11, respectively. Similarly, the contact preventing portions 713E of the dedicated contacts C12 and C13 are also located in the second recess 1402, and the contact portions 712 of the dedicated contacts C12 and C13 are in contact with the corresponding dedicated terminals P12 and P13, respectively. Further, the contact portions 612 of the common contacts C1 to C9 also contact the corresponding common terminals P1 to P9 (see FIG. 25).

When the first memory card MC1 is mounted, as shown in FIG. 22B, the contact preventing portions 713E of the dedicated contacts C10 and C11 hit the rear end surface 1311 of the corresponding first recess 1103 (1301), and Ride outside from one recess 1301. Therefore, the contact portions 712 of the dedicated contacts C10 and C11 do not contact the common terminal P3 in the first recess 1301. Similarly, the contact preventing portion 713E of the dedicated contacts C12 and C13 rides outside the first recess 1302, and the contact portions 712 of the dedicated contacts C12 and C13 do not contact the common terminal P6 in the first recess 1302. . On the other hand, the contact portions 612 of the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9 (see FIG. 26).

According to the memory card socket 10E of the present embodiment described above, when the first memory card MC1 is inserted, the contact preventing portions 713E of the dedicated contacts C10 to C13 are outward from the first recesses 1301 and 1302. Since it is pushed out, each of the dedicated contacts C10 to C13 can be separated from the common terminals P3 and P6. Therefore, it is possible to prevent deterioration of signal transmission characteristics. In addition, when the second memory card MC2 is inserted, the contact preventing portions 713E of the dedicated contacts C10 to C13 are not pushed outward from the second recesses 1401 and 1402, so that each of the dedicated contacts C10 to C13 The contact portion 712 can be brought into contact with the corresponding dedicated terminals P10 to P13. Thus, the memory card socket 10E of the present embodiment can support both the first and second memory cards MC1 and MC2. Further, since it is only necessary to provide the contact prevention part 713E between the contact part 712 and the connecting part 73 of each of the dedicated contacts C10 to C13, a memory card that can handle both the first and second memory cards MC1 and MC2. The socket can be realized with a simple structure while suppressing an increase in manufacturing cost.

In this embodiment, the mounting terminals 72 of the dedicated contacts C10 to C13 protrude from the holding block 50E in the direction opposite to the insertion direction of the memory card MC (downward in FIG. 24). You may protrude in the direction (width direction of memory card MC) which cross | intersects the insertion direction of MC.

(Embodiment 7)
As shown in FIGS. 29 to 32, the memory card socket 10F of the present embodiment is different from the memory card socket 10E of the sixth embodiment in the contacts C1 to C13. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10F of this embodiment, and the memory card socket 10E of Embodiment 6, and the description is abbreviate | omitted.

The memory card socket 10F of the present embodiment is mounted on, for example, a host board (not shown). As a mounting method on the host substrate, there are a standard mounting method and a reverse mounting method. In the standard mounting method, the memory card socket is mounted on the host substrate with the top plate 31 of the base shell 30E facing the host substrate. In the reverse mount method, the memory card socket is mounted on the host substrate with the bottom plate 41 of the cover shell 40 facing the host substrate. The memory card socket 10E of the sixth embodiment is suitable for the standard mount method, and the memory card socket 10F of the present embodiment is suitable for the reverse mount method.

As shown in FIG. 30, the connecting portion 73 of the dedicated contacts C10 and C11 has one side surface (in this embodiment, the width direction of the memory card MC) in the direction in which the mounting terminal 72 intersects the insertion direction of the memory card MC (for example, in this embodiment). The left leg of the second leg 53 is formed in an L shape so as to protrude outward. On the other hand, the connecting portion 73 of the dedicated contacts C12 and C13 is provided on the other side surface (in the present embodiment, the first leg 52 in the direction in which the mounting terminal 72 intersects the insertion direction of the memory card MC, for example, the width direction of the memory card MC). The right side surface of the lens is formed in an L shape so as to protrude outward.

In this way, the mounting terminals 72 of the dedicated contacts C10 to C13 intersect the length direction of the memory card MC in a plane parallel to the back surface of the memory card MC held at the insertion position from the outer surface of the socket body 20E. Are formed so as to protrude along the intersecting direction (in this embodiment, the width direction of the memory card MC).

The mounting terminals 62 of the common contacts C1 to C9 are formed in an S shape so that the tips are located below the lower surface of the bottom plate 41 of the cover shell 40 (see FIGS. 29A and 29B). .

When the mounting terminals 72 of the dedicated contacts C10 to C13 are extended in the insertion direction of the memory card MC as in the sixth embodiment, the memory card MC held at the insertion position becomes an obstacle and the mounting terminals 72 are It cannot be bent to the host substrate side (the cover shell 40 side).

If the mounting terminals 72 of the dedicated contacts C10 to C13 are extended in a direction crossing the insertion direction of the memory card MC as in the present embodiment, the memory card MC held at the insertion position is not obstructed. The mounting terminal 72 can be bent to the host substrate side (the cover shell 40 side).

Therefore, according to the memory card socket 10F of the present embodiment, as shown in FIGS. 29 (a) and 29 (b), it can be mounted on the host substrate by the reverse mount method.

Next, the operation of the contacts C1 to C13 when the memory card MC is inserted into the memory card socket 10F of the present embodiment will be described.

When the second memory card MC2 is mounted, as shown in FIG. 29 (a), the contact preventing portions 713E of the dedicated contacts C10 and C11 may hit the rear end surface 1411 of the corresponding second recess 1103 (1401). Therefore, the contact portions 712 of the dedicated contacts C10 and C11 come into contact with the corresponding dedicated terminals P10 and P11, respectively. Similarly, the contact portions 712 of the dedicated contacts C12 and C13 come into contact with the corresponding dedicated terminals P12 and P13, respectively. Further, the contact portions 612 of the common contacts C1 to C9 are also in contact with the corresponding common terminals P1 to P9 (see FIG. 31).

When the first memory card MC1 is mounted, as shown in FIG. 29 (b), the contact preventing portions 713E of the dedicated contacts C10 and C11 hit the rear end surface 1311 of the corresponding first recess 1103 (1301), and Ride outside from one recess 1301. Therefore, the contact portions 712 of the dedicated contacts C10 and C11 do not contact the common terminal P3 in the first recess 1301. Similarly, the contact portions 712 of the dedicated contacts C12 and C13 do not contact the common terminal P6 in the first recess 1302, respectively. On the other hand, the contact portions 612 of the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9 (see FIG. 32).

The dedicated holder 54 may be formed separately from the legs 52 and 53. Further, the dedicated contacts C1 to C13 may be formed simultaneously with the dedicated holder 54.

(Embodiment 8)
As shown in FIGS. 33 to 35, the memory card socket 10G of the present embodiment is different from the memory card socket 10E of the sixth embodiment in that it mainly includes a connector (connecting member) 74. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10G of this embodiment, and the memory card socket 10E of Embodiment 6, and the description is abbreviate | omitted.

In this embodiment, the holding block 50G does not include the second leg 53.

As shown in FIG. 33 (a), the dedicated contacts C10 to C13 are arranged in the left-right direction at a predetermined interval. That is, the plurality of dedicated contacts C10 to C13 are arranged along the width direction of the memory card MC held at the insertion position.

In this embodiment, the contact prevention portion 713E is not formed on the spring portion 711 of the contact terminal 71G of the dedicated contacts C10 to C13.

The connecting tool 74 connects the adjacent dedicated contacts C10 and C11 (C12 and C13) with each other insulated from each other. In the present embodiment, adjacent dedicated contacts C <b> 10 and C <b> 11 are integrally connected by a connecting tool 74. Adjacent dedicated contacts C12 and C13 are integrally connected by a connector 74.

Here, a plurality of through holes 37 are formed slightly behind the front end of the top plate 31 of the base shell 30G. The through hole 37 is provided to prevent each connector 74 and the corresponding contacts C10 and C11 (or contacts C12 and C13) from contacting the top plate 31. The through hole 37 is formed in a T-shape, for example.

The connecting tool 74 is, for example, a synthetic resin molded product, and is formed in a horizontally long substantially rectangular parallelepiped shape as shown in FIG. Each connector 74 is simultaneously molded together with the contacts C10 and C11 (C12 and C13) in a state where the spring portions 711 of the corresponding dedicated contacts C10 and C11 (or dedicated contacts C12 and C13) penetrate in the front-rear direction, for example. Is done. That is, the connector 74 is disposed on the spring portion 711 of the dedicated contacts C10, C11 (C12, C13).

A contact preventing portion 75 is formed on the upper surface of the connecting tool 74. The contact preventing portion 75 is formed in a trapezoidal shape having an inclined surface 751 inclined obliquely forward and an abutting surface 752 extending forward from the front end of the inclined surface 751. When the first memory card MC1 is inserted into the memory card socket 10G, the inclined surface 751 of the contact prevention unit 75 comes into contact with the rear end surfaces 1311 and 1312 of the corresponding first recesses 1301 and 1302 of the first memory card MC1. Further, in the state where the first memory card MC1 is inserted to the insertion position, the contact preventing portion 75 is pushed out from the first recesses 1301 and 1302, and the contact surface 752 is around the first recesses 1301 and 1302. (The main body 1001 is in contact with the first recesses 1301 and 1302 at the rear). When the contact preventing portion 75 is pushed outward from the first recesses 1301 and 1302, the dedicated contacts C10 to C13 are connected to the common terminals P3. It is deformed so as not to contact P6.

Thus, in this embodiment, the contact prevention unit 75 constitutes a contact prevention means. That is, the contact preventing means is provided on the connector 74.

Further, the inclined surface 751 and the contact surface 752 of the contact preventing portion 75 constitute a card contact portion that comes into contact with the main body 1001 of the first memory card MC1 held at the insertion position. The card contact portion (inclined surface 751 and contact surface 752) has the normal direction as the arrangement direction of the contacts C10 to C13 between the adjacent contacts C10 and C11 (or contacts C12 and C13). And it is formed in the left-right symmetrical shape with respect to the plane which is equidistant from both adjacent contacts C10 and C11 (or contacts C12 and C13). In other words, the card contact portion is a line with respect to the center line passing along the length direction of the memory card MC held at the insertion position through the center between the adjacent dedicated contacts C10, C11 (C12, C13). It is a symmetric shape.

Next, the operation of the contacts C1 to C13 when the memory card MC is inserted into the memory card socket 10G of the present embodiment will be described.

When the memory card MC is not inserted into the memory card socket 10G, as shown in FIG. 34 (a), the length direction of the dedicated contacts C10 to C13 is in a state along the front-rear direction.

When the second memory card MC2 is mounted, as shown in FIG. 34 (b), the contact preventing portion 75 does not contact the rear end surfaces 1411 and 1412 of the corresponding second recesses 1401 and 1402, so each dedicated contactor The contact portions 712 of C10 to C13 are in elastic contact with the corresponding dedicated terminals P10 to P13, respectively. At this time, the dedicated contacts C10 and C11 (or the dedicated contacts C12 and C13) are integrally connected by the connecting tool 74, so that the dedicated terminals P10 and P11 (or dedicated terminals P12 and P13) corresponding to the dedicated contacts P10 and P11 (or the dedicated terminals P12 and P13) almost simultaneously. Contact. On the other hand, the contact portions 612 of the common contacts C1 to C9 are also in contact with the corresponding common terminals P1 to P9 (see FIGS. 35A and 35B).

When the first memory card MC1 is mounted, the inclined surface 751 of each contact prevention unit 75 comes into contact with the corresponding rear end surfaces 1311 and 1312 of the first recesses 1301 and 1302. Furthermore, when the first memory card MC1 is pushed into the socket body 20G (when the first memory card MC1 is inserted to the insertion position), as shown in FIG. 752 rides behind the first recesses 1301 and 1302. As a result, the dedicated contacts C10 and C11 (or the contacts C12 and C13) connected by the connecting tool 74 are urged upward (downward in FIG. 34C), and the contacts of the dedicated contacts C10 to C13 are contacted. The part 712 is separated from the common terminals P3 and P6. On the other hand, the contact portions 612 of the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9.

According to the memory card socket 10G of this embodiment, adjacent dedicated contacts C10, C11 (or dedicated contacts C12, C13) are connected together by the connecting tool 74, so that both dedicated contacts C10, C11 ( Alternatively, the dedicated contacts C12 and C13) can be simultaneously contacted and separated from the corresponding dedicated terminals P10 and P11 (or dedicated terminals P12 and P13). Further, the connecting tool 74 can suppress the vibration of the tips of the dedicated contacts C10 to C13 when the memory card MC is mounted. Therefore, for example, even when the distance between the terminals P1 to P13 is narrow, the dedicated contacts C10 to C13 can be prevented from erroneously contacting the common contacts C3 and C6 and the adjacent terminals P1 to P13.

Further, since the contact prevention portion 75 serving as a contact prevention means is provided in the connector 74, the dedicated contacts C10 and C11 (or the dedicated contacts C12 and C13) themselves do not have to be processed. The shape of C13 can be simplified. As a result, the manufacturing cost can be suppressed.

In the present embodiment, the card contact portion that contacts the main body 1000 of the memory card MC is provided between the dedicated contacts C10 and C11 (or the dedicated contacts C12 and C13) adjacent to each of the dedicated contacts C10 to C13. The arrangement direction is set as a normal direction and is symmetrical with respect to a plane that is equidistant from the adjacent dedicated contacts C10 and C11 (or dedicated contacts C12 and C13). Therefore, for example, when the memory card MC is inserted and removed, the contact preventing portion 75 does not tilt obliquely, and the synchronization accuracy between the two dedicated contacts C10 and C11 (or the dedicated contacts C12 and C13) can be improved. it can.

In this embodiment, the contact preventing portion 75 is provided integrally with the connector 74. However, the contact prevention part 75 does not necessarily need to be provided in the coupler 74. For example, in the dedicated contacts C10 to C13 of the sixth and seventh embodiments, the connecting tool 74 may be disposed closer to the contact portion 712 than the contact prevention portion 713E. If it does in this way, the suppression effect of the deflection | deviation of the front-end | tip of each exclusive contact C10, C11 (or exclusive contact C12, C13) by the connector 74 can be heightened.

Further, the shape of the card contact portion is not limited to the example of the present embodiment, and the arrangement direction of the dedicated contacts C10 to C13 between the adjacent dedicated contacts C10, C11 (C12, C13) is a normal direction. And what is necessary is just a symmetrical shape with respect to the plane equidistant from adjacent both exclusive contact C10, C11 (C12, C13).

(Embodiment 9)
As shown in FIGS. 36 and 37, the memory card socket 10H of this embodiment includes a flat rectangular box-shaped socket body 20H including a base shell 30H and a cover shell 40. The memory card socket 10H includes contacts C1 to C13, a holding block 50 that holds the contacts C1 to C13, a slider 80, and a lock unit (not shown). In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10H of this embodiment, and the memory card sockets 10 and 10A-10G of other embodiment, and the description is abbreviate | omitted.

The holder 51 of the holding block 50 holds the contacts C1 to C13. The contact terminals 61 and 71G of the respective contacts C1 to C13 project to the rear side of the holder 51, and the mounting terminals 62 and 72 project to the front side of the holder 51. Although not shown in the present embodiment, the leg 52 is provided with a position detection contact for detecting the position of the knob 1050.

The base shell 30H is provided with a contact prevention portion (contact prevention means) 90 that presses the dedicated contacts C10 to C13 away from the common terminals P3 and P6 when the first memory card MC1 is mounted. That is, the contact prevention part 90 is provided in the socket main body 20H.

The contact prevention unit 90 includes a protruding portion 91 and a pressing portion (climbing portion) 92 that is provided at the tip of the protruding portion 91 and presses the corresponding dedicated contacts C10 to C13.

The protruding portion 91 is the length of the memory card MC held at the insertion position from the portion of the socket body 20H closer to the card slot 21 (rear side) than the terminals P1 to P13 of the memory card MC held at the insertion position. It is formed so as to protrude in one direction side (front end side). In the present embodiment, the protruding portion 91 is formed in a vertically long rectangular plate shape by cutting a part of the top plate 31 of the base shell 30H. That is, the protrusion 91 is formed integrally with the socket body 20H. In particular, since the base shell 30H is made of a metal material having elasticity, the protrusion 91 is made of an elastic material.

The pressing portion 92 is integrally held at the tip of the protruding portion 91 by press-fitting or insert molding. When the first memory card MC is mounted, the pressing part 92 rides on the rear part of the first recesses 1301 and 1302 of the first memory card MC1 and contacts the corresponding dedicated contacts C10 to C13 to the common terminals P3 and P6. Do not press.

In the present embodiment, the through holes 34 corresponding to the common contacts C3 and C6 are longer than the other through holes 34, and play a role of preventing contact between the contact prevention unit 90 and the top plate 31. .

The pressing portion 92 is a synthetic resin molded product and is formed in a substantially rectangular parallelepiped shape. The pressing part 92 is integrally provided with two pressing pieces 921 and 921 at the tip. The two pressing pieces 921 and 921 are arranged on the left and right sides with a predetermined interval. Each pressing piece 921 is configured to press the corresponding dedicated contacts C10 to C13 when the first memory card MC1 is inserted into the socket body 20H. The distance between the pair of pressing pieces 921 of the pressing portion 92 is substantially equal to the distance between the corresponding pair of dedicated contacts C10 and C11 (or the pair of dedicated contacts C12 and C13). Further, the corresponding common contact C3 (or common contact C6) is inserted into the gap between the pair of pressing pieces 921, 921. As described above, the pressing portion 92 is configured to press the two dedicated contacts C10 and C11 (C12 and C13) simultaneously. The pressing portion 92 may be configured to simultaneously press three or more dedicated contacts C10 to C13). Further, the pressing portion 92 is not necessarily a synthetic resin molded product. For example, when the contact preventing portion 90 is formed integrally with the base shell 30H by cutting and raising, an insulating film may be formed on a portion corresponding to the pressing portion 92.

When the memory card MC is not inserted into the memory card socket 10H, as shown in FIG. 39A, each pressing piece 921 of the pressing portion 92 is in contact with the lower surface of the corresponding contact C10 to C13. .

When the second memory card MC2 is mounted, as shown in FIG. 39B, the pressing portion 92 is disposed in the second recesses 1401 and 1402 of the second memory card MC2, and the second recess of the second memory card MC2. It does not ride on the part behind the places 1401 and 1402. Therefore, the dedicated contacts C10 to 13 are in contact with the corresponding dedicated terminals P10 to P13. At this time, the dedicated contacts C10 to C13 are elastically contacted with the corresponding dedicated terminals P10 to P13, so that they are separated from the pressing piece 921. Further, the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9.

When the first memory card MC1 is mounted, as shown in FIG. 39 (c), the pressing portion 92 rides on the rear part of the first recesses 1301, 1302 of the first memory card MC1. Therefore, the dedicated contacts C10 to C13 are pressed in the direction away from the first memory card MC1 (downward in FIG. 39C) by the corresponding pressing piece 921. As a result, the contact portions 712 of the dedicated contacts C10 to C13 are separated from the common terminals P3 and P6. At this time, since the pressing portion 92 and the contacts C10 to C13 come out of the through hole 11, contact between the pressing portion 92, the contacts C10 to C13 and the substrate is prevented from being mounted on the substrate on which the memory card socket 10H is mounted. It is preferable to provide a recess for this purpose.

When the first memory card MC1 is taken out from the memory card socket 10H, the pressing portion 92 is moved to its original position by the spring force of the protruding portion 91, and the dedicated contacts C10 to C13 are moved to the original position by the spring force of the spring portion 711 (FIG. 39A). Return to Browse.

According to the memory card socket 10H of the present embodiment described above, when the first memory card MC1 is inserted into the socket body 20H, the pressing portion 92 has the rear surfaces 1311 and 1312 of the first recesses 1301 and 1302. In this case, the first memory card MC1 rides on the rear part of the first recesses 1301 and 1302. Therefore, the dedicated contacts C10 to C13 can be separated from the common terminals P3 and P6 in the first recesses 1301 and 1302. Therefore, deterioration of signal transmission characteristics can be prevented. In addition, when the second memory card MC2 is inserted into the socket body 20H, the pressing portion 92 does not run over the rear portions of the second recesses 1401 and 1402 of the second memory card MC2. The children C10 to C13 can be brought into contact with the corresponding dedicated terminals P10 to P13. Therefore, both the first and second memory cards MC1 and MC2 can be handled.

Moreover, since the contact prevention part 90 is comprised by the protrusion part 91 provided in the socket main body 20H, and the press part 92 provided in the front-end | tip of the protrusion part 91, a structure can be simplified.

Moreover, since the protrusion 91 is formed integrally with the socket body 20H, the number of parts and the number of assembly steps can be reduced, and the manufacturing cost can be reduced.

In addition, since the two dedicated contacts C10, C11 (or C12, C13) can be simultaneously pressed by one pressing portion 92, the dedicated contacts C10, C11 (or C12, C13) correspond to the dedicated terminals P10, P11 (or P12 and P13) can be simultaneously contacted and separated.

FIG. 40 shows a memory card socket 10I according to a modification of the present embodiment.

In the memory card socket 10I, the contact prevention unit 90I is different from the memory card socket 10H. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10I and the memory card socket 10H, and the description is abbreviate | omitted.

The contact preventing portion 90I is a synthetic resin molded product, and as shown in FIG. 40, a horizontally long rectangular plate-shaped main piece 93, and a vertically long rectangular plate-shaped protruding portion 91 protruding forward from the front end of the main piece 93. A pressing portion 92 that protrudes forward from the front end (tip) of the protruding portion 91 is integrally provided.

For example, the contact prevention unit 90I press-fits a press-fitting piece (not shown) provided in the base shell 30H into a press-fitting groove (not shown) provided in the main piece 93 of the contact prevention unit 90I. Fixed.

Therefore, also in the memory card socket 10I shown in FIG. 40, it is possible to prevent the signal transmission characteristics from deteriorating similarly to the above-described memory card socket 10H, and it is possible to cope with both the first and second memory cards MC1 and MC2. .

Further, the base shell 30H may be a synthetic resin molded product. In this case, the contact preventing portion 90I can be formed integrally with the base shell 30H. Further, the contact preventing portion 90I may be formed integrally with the holding block 50.

(Embodiment 10)
FIG. 41 shows the memory card socket 10J of the present embodiment. The memory card socket 10J of the present embodiment is different from the memory card socket 10H of the ninth embodiment in the contacts C1 to C13. In addition, the same code | symbol is attached | subjected to the structure which is common in the memory card socket 10J of this embodiment, and the memory card socket 10H of Embodiment 9, and the description is abbreviate | omitted.

The memory card socket 10J of the present embodiment is configured to support the reverse mount method.

In the memory card socket 10J, a contact prevention portion 90J is formed by cutting and raising a part of the top plate 31 of the base shell 30H.

The contact prevention part 90J is provided with the protrusion part 91J and the press part 92J. The protrusion 91J is formed by bending the cross-sectional shape into a diamond shape. The pressing portion 92J includes a pair of pressing pieces 921J and 921J. Each pressing piece 921J is provided at the tip of the protrusion 91J. The pair of pressing pieces 921J and 921J are arranged side by side so as to oppose the corresponding dedicated contacts C10 and C11 (C12 and C13) (see FIGS. 41B and 41D). Each pressing piece 921J of the pressing portion 92J is coated with an insulating film so as not to be electrically connected to the contacts C10 to C13 when contacting the corresponding dedicated contacts C10 to C13.

When the second memory card MC2 is inserted into the memory card socket 10J, the protruding portion 91J of the contact preventing portion 90J is disposed in the second recesses 1401 and 1402 of the second memory card MC2. For this reason, the contact preventing portion 90J does not run over the rear portions of the first recesses 1401 and 1402 of the first memory card MC1, so that each pressing piece 921J has a corresponding dedicated contact C10, C11 (or contact C12, No contact with C13). Therefore, the contact portions 712 of the dedicated contacts C10 to C13 come into contact with the corresponding dedicated terminals P10 to P13 (see FIG. 41 (a)). Each of the common contacts C1 to C9 contacts the corresponding common terminals P1 to P9.

When the first memory card MC1 is inserted into the memory card socket 10J, the protruding portion 91J rides around the first recesses 1301 and 1302 of the first memory card MC1, so that both the pressing pieces 921J and 921J are pushed upward. As a result, the dedicated contacts C10 to C13 are pushed upward by the corresponding pressing pieces 921J, and the contact portions 712 are separated from the common terminals P3 and P6 (see FIG. 41 (c)). On the other hand, the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9.

As described above, according to the memory card socket 10J, the thickness of the socket body 20H can be reduced, and the size can be reduced.

FIG. 42 shows a memory card socket 10K according to a first modification of the present embodiment. In addition, the same code | symbol is attached | subjected to the structure which is common in this memory card socket 10K and the memory card socket 10H, and the description is abbreviate | omitted.

The memory card socket 10K includes a contact prevention unit 90K made of synthetic resin. The contact prevention unit 90K includes a pair of protrusions 91K each having a pressing piece 921K at the tip. The protruding portion 91 </ b> K is integrally connected by a connecting piece 93. The pair of pressing pieces 921K and 921K constitutes a pressing portion 92K. A shaft portion 94 that is pivotally supported by a bearing portion (not shown) formed by cutting and raising from the top plate 31 of the base shell 30H is provided at the rear end of each protruding portion 91K. The contact preventing portion 90K is pivotable to the base shell 30H by pivotally supporting each shaft portion 94 on the bearing portion of the corresponding base shell 30H with the tip side facing the insertion direction of the memory card MC. Supported.

When the second memory card MC2 is inserted into the memory card socket 10K, each pressing piece 921K does not ride on the rear part of the second recesses 1401 and 1402 of the second memory card MC2, and the contact portions of the dedicated contacts C10 to C13. Reference numeral 712 contacts the corresponding dedicated terminals P10 to P13 (see FIG. 42A). Further, the common contacts C1 to C9 are in contact with the corresponding common terminals P1 to P9.

When the first memory card MC1 is inserted into the memory card socket 10K, each pressing piece 921K rides on a portion behind the first recesses 1301 and 1302 of the first memory card MC1, and contacts 712 of the dedicated contacts C10 to C13. Is away from the common terminals P3 and P6 (see FIG. 42C). At this time, the common contacts C1 to C9 come into contact with the corresponding common terminals P1 to P9.

FIG. 43 shows a memory card socket 10L of a second modification of the present embodiment. In addition, the same code | symbol is attached | subjected to the structure which is common in this memory card socket 10L and the memory card socket 10H, and the description is abbreviate | omitted.

The contact prevention part 90L is formed by raising a part of the top plate 31 of the base shell 30H, similarly to the contact prevention part 90J. The contact preventing portion 90L includes a protruding portion 91L that is bent in a U shape so as to extend in the insertion direction of the memory card MC (the right direction in FIGS. 43A to 43D). Moreover, the contact prevention part 90L is provided with the press part 92L in the front end side of the protrusion part 91L. The pressing portion 92L includes a pair of pressing pieces 921L and 921L that protrude toward the insertion direction of the memory card MC. The pair of pressing pieces 921L and 921L are arranged side by side so as to face the corresponding dedicated contacts C10 and C11 (C12 and C13). Each pressing piece 921L is coated with an insulating film so as not to be electrically connected to the dedicated contacts C10 to C13 when contacting the corresponding dedicated contacts C10 to C13. Since the operation of the memory card socket 10L when the memory card MC is inserted is the same as that of the memory card socket 10J, description thereof is omitted.

FIG. 44 shows a memory card socket 10M of a third modification of the present embodiment. In addition, the same code | symbol is attached | subjected to the structure which is common in this memory card socket 10M and the memory card socket 10H, and the description is abbreviate | omitted.

The contact prevention part 90M is formed by cutting and raising a part of the top plate 31 of the base shell 30H and bending it at a predetermined location, like the contact prevention part 90J. The contact prevention unit 90M is arranged so as to face in a direction opposite to the insertion direction of the memory card MC (right direction in FIGS. 44 (a) to (d)) (left direction in FIGS. 44 (a) to (d)). A protrusion 91M bent into a letter shape is provided. Moreover, the contact prevention part 90M is provided with the press part 92M in the front end side of the protrusion part 91M. The pressing portion 92M has a pair of pressing pieces 921M and 921M that protrude in the insertion direction of the memory card MC. The pair of pressing pieces 921M and 921M are arranged side by side so as to face the corresponding dedicated contacts C10 and C11 (C12 and C13). Further, at the tip of the protruding portion 91M, the contact preventing portion 90M makes it easy to ride on the portion of the main body 1001 behind the first recesses 1301 and 1302 along the rear surface 1311 and 1312 of the first recesses 1301 and 1302. An inclined piece 95 is provided. The inclined piece 95 protrudes obliquely upward (backward obliquely upward). The pressing pieces 921M and 921M of the pressing portion 92M are coated with an insulating film so as not to conduct with the dedicated contacts C10 to C13 when contacting the corresponding dedicated contacts C10 to C13. Since the operation of the memory card socket 10M when the memory card MC is inserted is the same as that of the memory card socket 10J, description thereof is omitted.

According to the memory card sockets 10J to 10M of the present embodiment, similar to the memory card socket 10H of the ninth embodiment, both the first and second memory cards MC1 and MC2 can be supported, and deterioration of signal transmission characteristics can be prevented. it can.

The contact prevention unit 90 is not limited to the above example, and the high-speed transmission contacts C10 to C13 do not contact the terminals P3 and P6 when the first memory card MC1 is inserted into the memory card socket 10. It only has to be configured.

That is, when the first memory card MC1 is held in the insertion position, the contact preventing means hits the rear surface 1311 or 1312 of the first recess 1301 or 1302 and enters the first recess from the first recess 1301 or 1302. The dedicated contacts C10 to C13 are deformed by being pushed out of the locations 1301 and 1302, and the dedicated contacts C10 to C13 are separated from the common terminals P3 and P6 in the first recesses 1301 and 1302. Further, when the second memory card MC2 is held at the insertion position, the contact preventing means does not contact the rear surface 1411 or 1412 of the second recess 1401 or 1402, but enters the second recess 1401 or 1402. By being located, the dedicated contacts C10 to C13 are configured to contact the dedicated terminals P10 to P13 in the second recesses 1401 and 1402 without deforming the dedicated contacts C10 to C13.

Claims (17)

1. A memory card socket capable of mounting a memory card comprising a card-shaped main body and a plurality of terminals arranged along the width direction at one end in the length direction of one surface in the thickness direction of the main body,
   A socket body having a card slot and holding the memory card inserted through the card slot at a predetermined insertion position;
   A contact provided on the socket body and in contact with the terminal of the memory card held at the insertion position;
   The memory card includes a first memory card and a second memory card,
   The terminal includes a common terminal provided in common to the first memory card and the second memory card, and a dedicated terminal provided only in the second memory card,
   A partition for partitioning the terminals is formed in the main body,
   A notch is formed at one end in the length direction of the partition of the second memory card,
   The contact includes a common contact for contact with the common terminal and a dedicated contact for contact with the dedicated terminal.
   The dedicated contact includes a contact portion that contacts the dedicated terminal, and a contact prevention portion that prevents the contact portion from contacting the common terminal,
   When the first memory card is held at the insertion position, the contact prevention unit deforms the dedicated contact by hitting the partition of the first memory card so that the dedicated contact is removed from the common terminal. And when the second memory card is held at the insertion position, the dedicated contact is not deformed by being located in the notch formed in the partition of the second memory card. A memory card socket configured to bring a child into contact with the dedicated terminal.
2. The notch is formed in the partition located next to the dedicated terminal,
   The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. Providing a protruding part that protrudes toward the end side,
   The contact portion is provided at a tip of the protruding portion,
   2. The memory card socket according to claim 1, wherein the contact preventing portion is integrally connected to the protruding portion after the protruding portion.
3. The notch is formed in the partition located next to the dedicated terminal,
   The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. Providing a protruding part that protrudes toward the end side,
   The contact portion is provided at a tip of the protruding portion,
   The memory card socket according to claim 1, wherein the contact prevention unit is integrally connected to the contact unit at a tip of the contact unit.
4. The notch is formed in the partition located next to the dedicated terminal,
   The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. Providing a protruding part that protrudes toward the end side,
   The contact preventing portion protrudes from the tip of the protruding portion along a crossing direction that intersects the length direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. Formed into
   2. The contact portion is formed so as to protrude from the tip of the contact prevention portion toward the other end side in the length direction of the memory card held at the insertion position. Memory card socket.
5. The notch is formed in the partition located next to the dedicated terminal,
   The dedicated contact is arranged in the length direction of the memory card held at the insertion position from the inner surface of the socket body facing the side surface at one end side in the length direction of the memory card held at the insertion position. Providing a protruding part that protrudes toward the end side,
   The contact preventing portion protrudes from the tip of the protruding portion along a crossing direction that intersects the length direction of the memory card in a plane parallel to the one surface of the memory card held at the insertion position. Formed into
   2. The memory card socket according to claim 1, wherein the contact portion is formed so as to protrude from the tip of the contact prevention portion along the intersecting direction.
6. The dedicated contact is arranged in a plane parallel to the one surface of the memory card held at the insertion position from the inner side surface of the socket body facing the side surface in the width direction of the memory card held at the insertion position. And a projecting portion projecting along the intersecting direction intersecting the length direction of the memory card,
   The contact prevention portion is formed so as to protrude from the tip of the protruding portion along the crossing direction,
   The contact portion is formed so as to protrude from the tip of the contact prevention portion along the crossing direction,
   2. The memory card socket according to claim 1, wherein the notch is formed in the partition that overlaps with the contact preventing portion in a thickness direction when being held at the insertion position.
7. A memory card socket capable of mounting a memory card comprising a card-shaped main body and a plurality of terminals arranged along the width direction at one end in the length direction of one surface in the thickness direction of the main body,
   A socket body having a card slot and holding the memory card inserted through the card slot at a predetermined insertion position;
   A contact provided on the socket body and in contact with the terminal of the memory card held at the insertion position;
   Contact prevention means,
   The memory card includes a first memory card and a second memory card,
   The terminal includes a common terminal provided in common to the first memory card and the second memory card, and a dedicated terminal provided only in the second memory card,
   The main body of the first memory card is formed with a first recess in which the common terminal is disposed on the bottom surface,
   The main body of the second memory card is formed with a second recess in which the common terminal and the dedicated terminal are arranged on the bottom surface,
   Each of the recesses has an open surface on one end side in the length direction,
   In the second recess, the surface on the other end side in the length direction is located on the other end side in the length direction than the surface on the other end side in the length direction of the first recess,
   The contact includes a common contact for contact with the common terminal and a dedicated contact for contact with the dedicated terminal.
   When the first memory card is held at the insertion position, the contact preventing means abuts against the surface of the first recess on the other end side in the length direction from the inside of the first recess to the first recess. When the second contact card is held in the insertion position when the second contact card is held in the insertion position by deforming the dedicated contact to be separated from the common terminal in the first recess. Positioning the dedicated contact in the second recess without deforming the dedicated contact by being located in the second recess without hitting the other end surface in the length direction of the recess. A memory card socket configured to be in contact with the memory card.
8. The socket body includes a holder for holding the dedicated contact,
   The holder is located closer to the card slot than the terminal of the memory card held at the insertion position;
   The dedicated contact is used for contact with the dedicated terminal provided at the end of the protruding portion protruding from one end of the memory card in the length direction of the memory card held at the insertion position from the holder. A contact portion, and
   8. The memory card socket according to claim 7, wherein the contact preventing means is provided at the projecting portion of the dedicated contact.
9. The dedicated contact includes a connection portion that is electrically connected to an external substrate,
   The connection portion is formed so as to protrude from an outer surface of the socket body along a crossing direction intersecting with a length direction in a plane parallel to the one surface of the memory card held at the insertion position. The memory card socket according to claim 8.
10. A plurality of dedicated contacts arranged along the width direction of the memory card held at the insertion position;
    A connector for connecting adjacent dedicated contacts in a state of being insulated from each other;
    10. The memory card socket according to claim 8, wherein the connector is disposed on the protruding portion.
11. 11. The memory card socket according to claim 10, wherein the contact preventing means is provided in the connector.
12. The contact prevention means includes a card contact portion that comes into contact with the main body of the first memory card held at the insertion position,
    The card contact portion has a shape symmetrical with respect to a center line passing through a center between the adjacent dedicated contacts along the length direction of the memory card held at the insertion position. The memory card socket according to claim 11.
13. 11. The memory card socket according to claim 10, wherein the connector is disposed closer to the contact portion than the contact prevention means.
14. The memory card socket according to claim 7, wherein the contact preventing means is provided in the socket body.
15. The contact preventing means includes a protruding portion made of an elastic material, and a pressing portion that is provided at the tip of the protruding portion and presses the dedicated contact.
    The protruding portion protrudes from the portion of the memory card held at the insertion position in the socket body to one end side in the length direction of the memory card held at the insertion position from the portion on the card slot side. 15. The memory card socket according to claim 14, wherein the memory card socket is formed as follows.
16. 16. The memory card socket according to claim 15, wherein the protrusion is formed integrally with the socket body.
17. A plurality of the dedicated contacts arranged along the width direction of the memory card held at the insertion position,
    The memory card socket according to claim 15 or 16, wherein the pressing portion is configured to press at least two of the dedicated contacts simultaneously.

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