TW201018988A - Optical film peeling device and the method for peeling an optical film - Google Patents

Optical film peeling device and the method for peeling an optical film Download PDF

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TW201018988A
TW201018988A TW97143145A TW97143145A TW201018988A TW 201018988 A TW201018988 A TW 201018988A TW 97143145 A TW97143145 A TW 97143145A TW 97143145 A TW97143145 A TW 97143145A TW 201018988 A TW201018988 A TW 201018988A
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optical film
substrate
cable
removing device
film
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TW97143145A
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Chinese (zh)
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TWI371613B (en
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Chun-Kai Wang
Cheng-Pin Huang
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Au Optronics Corp
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Abstract

An optical film peeling device has two support arms and a plurality of lines that are set between the support arms. The length of the lines is at least longer than the length of the side of a optical film, and the area constituted by the lines is not smaller than 1/3 of the area of the optical film. The optical film peeling device may have a division plate and the support arms are separately set on the opposite sides of the division plate. A method for peeling the optical film is also disclosed.

Description

201018988 九、發明說明: . 【發明所屬之技術領域】 本發明是有關於一種光學膜移除裝置及方法,且特別 是有關於液晶面板製程中一種光學膜移除裝置及方去。 【先前技術】 液晶顯示面板之結構為三明治結構,主要是由薄膜電 晶體基板、液晶、彩色濾光層基板等構成。其中,偏光片 ® 係、為貼附於基板上的一種光學膜,僅容許特定偏振方向的 光通過,並配合液晶分子因電性改變時會扭轉的特性,來 控制光線的角度變化以產生各種畫面變化。然而,在貼附 光學膜至基板的過程中,容易因為光學膜與基板間產生氣 泡或光學膜貼附不平導致偏貼過程失敗,亦或是光學膜本 身在製程中或後續檢測中出現到傷損壞而產生許多不良 品。此時需利用重工製程將已貼附於基板上之光學膜移 除,並且重新貼附新的光學膜,因而導致成本增加。由於 * 《學膜是以黏膠固定於基板上,不易直接移除,因此需藉 助移除裝置移除。 習知光學膜移除裝置具有圓柱狀之移除棒,移除光學 膜之方法為將移除棒置於黏合於基板之光學臈上,利用移 除棒將光學膜由基板上強行捲起移除。但是在捲起移除的 過私中’移除棒會對基板形成向外拉扯的力量,易造成基 板扣壞甚至破裂而必須將基板報廢,且在強行捲起移除光 學膜的過程中’易使光學膜受到移除棒的拉扯導致變形或 201018988 破裂而無法再使用,須重新貼附新的光學膜。 【發明内容】 因=本發明之一目的係為提供光學膜移除農置,使得 在重工製㈣’可以減少光學膜移除裝置對於基板與光學 膜的破壞,進而❹基板與光學膜的報廢,且增加光學膜 回收再利用之可能性,以降低製程成本。 根據本發明之—較佳實施例,提出一種光學膜移除裝 置具有一支撐臂與多個纜線。纜線固設於二支撐臂之 間’欖線長度至少較藝饋人光學膜之的邊長長,且欖線 所構成的平面面積不小於光學膜面積的三分之一。[Technical Field] The present invention relates to an optical film removing apparatus and method, and more particularly to an optical film removing apparatus and a method in a liquid crystal panel manufacturing process. [Prior Art] The structure of the liquid crystal display panel is a sandwich structure, and is mainly composed of a thin film transistor substrate, a liquid crystal, a color filter layer substrate, and the like. The polarizer® is an optical film attached to a substrate, which only allows light of a specific polarization direction to pass through, and matches the change of the angle of the liquid crystal molecules when the liquid crystal molecules are twisted due to electrical changes to generate various kinds of light. The picture changes. However, in the process of attaching the optical film to the substrate, it is easy to cause the offset process to fail due to the occurrence of air bubbles between the optical film and the substrate, or the optical film itself may be damaged during the process or subsequent detection. Damage caused many bad products. At this time, the rework process is required to remove the optical film attached to the substrate and reattach the new optical film, resulting in an increase in cost. Because * film is fixed on the substrate by adhesive, it is not easy to remove directly, so it needs to be removed by removing the device. The conventional optical film removing device has a cylindrical removing rod. The optical film is removed by placing the removing rod on the optical crucible bonded to the substrate, and the optical film is forcibly rolled up from the substrate by the removing rod. except. However, in the over-removal of the roll-up, the removal of the rod will force the substrate to pull outward, which may cause the substrate to buckle or even break, and the substrate must be scrapped, and in the process of forcibly rolling up and removing the optical film. It is easy for the optical film to be deformed by the pulling of the removing rod or the 201018988 is broken and can no longer be used, and a new optical film must be reattached. SUMMARY OF THE INVENTION It is an object of the present invention to provide optical film removal, so that the rework (4) can reduce the damage of the optical film removal device to the substrate and the optical film, and thereby the rejection of the substrate and the optical film. And increase the possibility of recycling and reuse of optical film to reduce process cost. In accordance with a preferred embodiment of the present invention, an optical film removal device is provided having a support arm and a plurality of cables. The cable is fixed between the two support arms. The length of the lamella is at least longer than the side of the optical film of the artist, and the plane area formed by the lamella is not less than one third of the area of the optical film.

根據本發明之另一較佳實施例,提出一種光學膜移除 裝置,具有分隔平板、兩支律臂與㈣。兩支樓臂分設於 分隔平板之兩對邊並分別向外延伸。_固設於兩支撐臂 間且纜線長度至少較纜線饋入光學膜之邊長為長。 本發月的另一目的是在提供一種光學膜移除方法,以 纜線與隔離結構在光學膜與基板間平行移動的方式使光 學膜與基板分離’在移除過程巾不會因拉扯而破壞基板鱼 光學膜。 ~ 、根據本發明之又—較佳實施例,提出—種光學膜移除 方法H提供第—纜線置於該基板之上且鄰近光學膜 的側緣。接著’施加與該基板實質平行的力於第-規線, 使第一纜線饋入光學膜與基板之接面以分離光學膜與基 板最後於第一镜線之後饋入隔離結構,以避免已與基 201018988 板分離的部分光學膜黏回基板。 本發明之光學膜移除裝置及方法利用平行移動 式移除黏合於基板上之光學膜,在移除過程中不會對=方 及光學膜造成傷害。因此利用本發明之光學膜移除裝:: 方法可以提高光學膜再利用的可能性、減少材料耗^, 而降低製程成本。 貝' 【實施方式】 鲁 請參照第1圖,其繪示依照本發明一較佳實施例之 學膜移除裝置的示意圖。光學膜移除裝置2可用來移除黏 合於基板上之光學膜。光學膜移除裝置2具有兩個支 2〇。於兩支撐臂20之間可設有多個欖線,例如:第—境 ^2及多個第二規線24 ’且多個第二鏡線Μ可構成隔離 30。第—規線22係可用以分離光學膜與基板,而隔 離結構3〇可避免已與基板分離的部分光學膜又重新黏回 基板°硯線所構成之平面面積不可小於光學膜叫示於第 Z)面積的三分之一 ’以避免被移除之光學膜再度黏回 土〗〇上。較佳實施例中,纜線所構成之平面面積可大 2學膜12的面積。光學膜可為偏光片、保護膜或調整 均勾度的膜’但不限於此,可依實際需求 的種類。 狀 ,佳實施例中,兩兩規線間的間距不大於5公分。兩 盘i *間的間距表不兩相鄰之瘦線距離,包含第一、纜線22 ”目郇第二纜線24之間的間距或者兩相鄰第二纜線24之 201018988 =的間距。間的距離在此僅是舉例說明,亦可 .^兄調整所需之間距,且每個兩相鄰料間距也益需相 .=依實際情況調整。需說明的是,纔線數目‘:二 ”刀布疏密並不限於圖式所示,可以實際需求調整。 第4tt,'纜線長度至少需較欲被移除之光學膜12(示於 二圖)之-邊長還長。也就是說,第一缦線22及第二 、1線24之長度需較欲被移除之光學膜12之— • SI操作。於此,上述之-邊長可為光學模12之長'邊 =邊。在較佳實施例中,纔線長度可較欲被移除之光學 膜2之對角線長。也就是 之县谇纜線22及第二纜線24 t長度可較欲被移除之光學膜12之對角線長。因此 學膜移除裝置2除可正向移除光學膜外, 學膜,將於後續詳述。 加移除先 :學膜移除裝置:除可具有第—境線與多個第二繞線 成隔離分:平板’分隔平板與第二缓線共同構 ❷㈣可大於光學膜之面積。或者==的平* 第二欖線24所構成的隔離結構(如第2圖所示Y板取代 =參照第2圖,其繪示本發明另—較佳實施例之光學 膜移除裝置示意圖。光學膜移除裝置4具有兩支撐臂4〇 於兩支撐臂40間則設有第1線22與分隔平板44’且於 本貫施例中,分隔平板44即為隔離結構 、 e ώ; ^ . 不',見跟22之 長度而較欲被移除的光學膜12(示於第4圖)之— ’ 之長度可 以方便操作。在一較佳實施例中,第一纜線22 &長, 8 201018988 較欲被移除之光學膜12之對 .移除光學膜。再者,第-纜線/與長:方便斜向與正向 側邊的間距可不大於5公分;;隔平板44之相鄰一 距。第-纜線22愈分隔平板44依實際需求調整其間 於光學膜12面積成之平面面積可不小 ㈣分隔平板實施财,第—瘦線 穑,以阳较〜 千面面積可大於光學膜12的面 積以阻隔移除之光學膜再次黏回基板10上。另外’為 ❿二移:之光學膜黏覆於分隔平板44上後不易撕除,因 ::隔平板44的至少-面可具有離型表面46,而分隔平 板44的雙面亦可皆具有離型表面牝。 製成較中之缆線為具有彈性且不易斷裂之材質 製成,如金屬銅或聚酯類聚合物。 基板,瘦線直徑較佳為易於为離光學膜與 至H)毫米。為毫未至2°毫米,更佳為2毫米 第一::圖係為第一纜線22的剖面圖。如第3圖所示, …22之外圍可包覆有同軸滑套%,可避免從美板 ❹上㈣光學膜時光學_基板。此外 土 ;:圍:可包覆有同轴滑套%。同轴滑…二塑 :依實際需求選用適當材質。在移除光學膜的過 二軸滑套權不會因光學膜與基板上之殘餘 黏,且同軸滑套26以第一⑽22或第二欖線24 間移^動’使得光學膜移除裝置更容易於基板與光學膜 另外’具有同軸滑套包覆之麟也不會刮傷光學 土 進而增進移除之光學膜再利用的可能性與減少 9 201018988 基板的損壞報廢。 綜上所述,本發明之光學膜移除裝置可阻隔被移除之 光學膜再杨喊板上,且裝置結構於移除過程巾不會對 先學膜與基板產生破壞。此外,若被移除之光學膜點覆至 光學膜移除裝置上也可㈣撕除。因此,若因貼附不佳而 欲移除的光學膜能在無損害的情況下移除,移除下的光學 膜因保持良好可再重複使用,而不用重新更換新的光學 膜。 請參照第4A圖與第4BW,第4A圖緣示利用本發明 一較佳實施例之光學膜移除裝置移除光學膜之方法示意 圖,第4B圖繪示第4A囷之光學膜移除方法的側視圖。; 先’將光學膜移除裝置2中的第一纜線22置於基板忉上 且靠近光學膜12的側緣,以方便之後將第一纜線22饋入 光學膜12與基板1G間。接著,於光學膜移除裝置2上施 加與基板實質平行的力5〇,使第—鏡線22饋人光學膜η 與基板10之間以分離光學膜12與基板1〇,如第犯圖所 響示。由於施加之力5G為實f平行於基板lQ,因此可避免 對基板10產生足以造成基板破裂之挽曲力,可大幅減少 基板10的破裂與損壞。 在第一纜線22饋入光學膜12與基板1〇間後,饋入 隔離結構30 ’於此實施例中,隔離結構%由至少一個第 二境線24所組成。當第—I線22移動時,隔離結構3〇 會同步移動’如此一來,隔離結構30便可避免已與基板 10分離的部分光學膜12黏回基板1〇。再者,由於第— 10 201018988 線22與隱結構心_料餘間 • 光學膜掀起而與基板分齙m 仃移動方式將 拉扯而造成破壞。所以利t不會對基板與光學膜產生 .少、基板與光學膜損壞的情之光學膜移除方法可減 " 達到降低成本。 ❼’、、、® ’係緣示依照本發明另一較 光學膜移除方法示意圖。不同於上述實施例,1=: 將光學膜移除裝置2斜向對應光學膜12 為 ,移除裝置Μ的第—_置於基板:::說近 光學膜12的-角,使光學膜移除裝置2:二= 學膜12與基板間,進而移除光㈣⑴ :=:r學膜對角線方向斜向進八,可::力 述實施例相L除㈣12。後續移除光學®之方法則與前 此外’上述實施财由第二料24所之士 構可更包含分隔平板。或 離、、,。 纜線24。如第6圖所、二 A千板直接取代第二 φ A 不,’、為繪示依照本發明又一較佳實 學除裝置移除光學膜之方法示意圖。移除光 、方法與如述實施例相似。 然山而’本實施例與前述實施例不同之處在於’第—纜 為分光學膜12與基板10間之後所饋入之隔離結構 步移:、反44<>當第一繞線22移動時’分隔平板44會同 外,為使移除之光學膜12再次黏合回基板1〇。此 吏/、基板分離的部分光學膜12黏合至分隔平板44 夺可輕易撕除,分隔平板44上具有離型表面46。 11 201018988 由上述本發明較佳實施例可知,應用本發明具有下列 優點。第―,本發明之光學膜移除裝置可阻隔已被移除之 先學膜再次黏回基板上,若被移除之光學膜黏覆至光學膜 移除裝置上也可輕易撕除,且裝置結構於移除過程會 ^學膜與基板產生破壞。第二,利用平行基板之力將光 予膜移除裝置嵌入光學膜與基板接面的過程中,可避免對 ^板產生足以造成基板破裂的扭力,以減少重卫製程 ❹ φ =的=率。第三,利用平行基板之力將光學膜掀起移 ^不會拉扯光學膜,也可降低對光學膜的損壞 利用的可能性。基於上述優點,利用本發: 本。子、夕除裝置及方法可減少材料消耗,降低製程成 限定:::發明已以較佳實施例揭露如上’然其並非用以 和’任何ή此技藝者,在不脫離本發明之精神 範=見,當可作各種之更動與潤飾,因此本發明之保護 圍备視後附之中料利_所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的.、㈣、優 犯更明顯易僅,所附圖式之詳細說明如下:只施例 第i圖係繪示依照本發一 裝置示意圖。 奴佳實關之光學膜移除 第2圖係繪示依照本發明另一較佳實施例之光學膜移 12 201018988 除裝置示意圖。 * 第3圖係繪示第一纜線的剖面圖。 • 第4A圖係繪示依照本發明一較佳實施例之光學膜移 除方法示意圖。 第4B圖係繪示第4A圖之光學膜移除方法的側視圖。 第5圖係繪示依照本發明另一較佳實施例之光學膜移 除方法示意圖。 • 第6圖係繪示依照本發明又一較祛眘竑你丨夕,物―办 響 双佳實轭例之光學膜移 ,'乃冼示意圖。 【、主要元件符號說明】 4.光學骐移除裝置In accordance with another preferred embodiment of the present invention, an optical film removal apparatus is provided having a dividing plate, two arms and (4). The two arm arms are disposed on two opposite sides of the dividing plate and extend outward respectively. _ is fixed between the two support arms and the cable length is at least longer than the length of the cable feeding the optical film. Another object of the present month is to provide an optical film removal method for separating the optical film from the substrate by moving the cable and the isolation structure in parallel between the optical film and the substrate. Destroy the substrate fish optical film. In accordance with yet another preferred embodiment of the present invention, an optical film removal method H is provided to provide a first cable disposed over the substrate adjacent to a side edge of the optical film. Then 'applying a force substantially parallel to the substrate to the first gauge line, feeding the first cable to the junction of the optical film and the substrate to separate the optical film from the substrate and finally feeding the isolation structure after the first mirror line to avoid A portion of the optical film that has been separated from the base 201018988 plate is adhered to the substrate. The optical film removing device and method of the present invention utilizes parallel movement to remove the optical film adhered to the substrate without causing damage to the square and optical film during the removal process. Therefore, the optical film removal device of the present invention can improve the possibility of recycling the optical film, reduce the material consumption, and reduce the process cost. [Embodiment] Referring to Figure 1, there is shown a schematic view of a film removing device in accordance with a preferred embodiment of the present invention. The optical film removal device 2 can be used to remove an optical film bonded to a substrate. The optical film removing device 2 has two branches. A plurality of ridge lines may be disposed between the two support arms 20, for example, a first environment ^2 and a plurality of second regular lines 24' and a plurality of second mirror wires Μ may constitute the isolation 30. The first rule line 22 can be used to separate the optical film from the substrate, and the isolation structure 3 can prevent a part of the optical film that has been separated from the substrate from re-sticking back to the substrate. The plane area formed by the line is not less than the optical film. Z) One-third of the area 'to avoid the removed optical film re-sticking back to the soil. In the preferred embodiment, the area of the cable formed by the cable can be as large as the area of the film 12. The optical film may be a polarizer, a protective film or a film for adjusting the degree of hooking, but is not limited thereto, and may be of a type according to actual needs. In the preferred embodiment, the spacing between the two lines is not more than 5 cm. The spacing between the two disks i* is not the distance between two adjacent thin wires, including the first, the cable 22", the spacing between the second cables 24 or the spacing of the two adjacent second cables 24 of 201018988 = The distance between the two is only an example here, and the distance between the two required spacings is also adjusted, and the distance between each two adjacent materials is also required. = Adjust according to the actual situation. It should be noted that the number of lines is ' : "Two" knife cloth density is not limited to the figure shown, can be adjusted to actual needs. 4tt, 'The cable length must be at least longer than the side of the optical film 12 (shown in Figure 2) to be removed. That is, the lengths of the first twist line 22 and the second and first lines 24 need to be compared to the SI film to be removed. Here, the above-mentioned side length may be the long side of the optical mold 12 = side. In the preferred embodiment, the length of the wire can be longer than the diagonal of the optical film 2 to be removed. That is, the length of the county cable 22 and the second cable 24 t may be longer than the diagonal of the optical film 12 to be removed. Therefore, in addition to the positive removal of the optical film, the film removal device 2 will be described later. Adding and removing first: The film removing device: in addition to having a first-line and a plurality of second windings, the flat plate' separating plate and the second slow wire may be larger than the area of the optical film. Or the flat structure of the second slab 24 of the == (the Y-plate replacement as shown in FIG. 2 = refer to the second figure, which shows the optical film removal device of the preferred embodiment of the present invention) The optical film removing device 4 has two supporting arms 4 between the two supporting arms 40 and is provided with a first line 22 and a separating plate 44'. In the present embodiment, the separating plate 44 is an isolation structure, e ώ; ^. No, see the length of 22 and the optical film 12 (shown in Figure 4) that is to be removed - the length of ' can be easily manipulated. In a preferred embodiment, the first cable 22 &amp ;长, 8 201018988 Pair of optical film 12 to be removed. Remove the optical film. Furthermore, the first cable / length: the distance between the convenient diagonal and the positive side can be no more than 5 cm; The adjacent distance of the flat plate 44. The more the first cable 22 is separated by the flat plate 44, the area of the optical film 12 is adjusted according to the actual needs, and the planar area of the optical film 12 is not small. (4) Separating the flat plate to implement the financial, the first-thin line, the yang is less than ~ thousand The area of the surface of the optical film 12 can be larger than that of the optical film 12 to prevent the removed optical film from sticking back to the substrate 10. After being adhered to the separation plate 44, it is not easy to tear off because: at least the face of the spacer plate 44 may have a release surface 46, and both sides of the separation plate 44 may also have a release surface 牝. The cable is made of a material that is elastic and not easily broken, such as a metallic copper or polyester polymer. The substrate, the diameter of the thin wire is preferably from the optical film to H) mm. It is not more than 2 mm, more preferably 2 mm. First:: The figure is a cross-sectional view of the first cable 22. As shown in Fig. 3, the periphery of ...22 can be covered with a coaxial sliding sleeve %, which can avoid the optical_substrate when the optical film is applied from the top plate. In addition, soil:: circumference: can be covered with a coaxial sliding sleeve%. Coaxial sliding... 2 plastic: Select the appropriate material according to actual needs. The pass-through sleeve of the optical film is removed without the residual adhesion of the optical film to the substrate, and the coaxial sleeve 26 is moved between the first (10) 22 or the second ridge 24 to cause the optical film removal device It is easier to use the substrate with the optical film and the 'coaxial sleeve coated with the lining will not scratch the optical soil and thus enhance the possibility of removing the optical film and reduce the damage of the 2010 18988 substrate. In summary, the optical film removing device of the present invention can block the removed optical film and then slam the board, and the device structure can not damage the film and the substrate. In addition, if the removed optical film is overlaid onto the optical film removal device, it can be removed (4). Therefore, if the optical film to be removed due to poor attachment can be removed without damage, the removed optical film can be reused because it remains good without replacing the new optical film. Please refer to FIG. 4A and FIG. 4BW, FIG. 4A shows a schematic diagram of a method for removing an optical film by using an optical film removing device according to a preferred embodiment of the present invention, and FIG. 4B illustrates a method for removing an optical film of FIG. 4A. Side view. The first cable 22 in the optical film removing device 2 is first placed on the substrate 且 and adjacent to the side edge of the optical film 12 to facilitate feeding the first cable 22 between the optical film 12 and the substrate 1G. Next, a force 5 实质 substantially parallel to the substrate is applied to the optical film removing device 2, so that the first mirror wire 22 is fed between the optical film η and the substrate 10 to separate the optical film 12 from the substrate 1 , as shown in the figure. Resounded. Since the applied force 5G is parallel to the substrate lQ, it is possible to avoid the occurrence of a pulling force sufficient for causing the substrate to be broken, and the cracking and damage of the substrate 10 can be greatly reduced. After the first cable 22 is fed between the optical film 12 and the substrate 1 , it is fed into the isolation structure 30 ′. In this embodiment, the isolation structure % is composed of at least one second boundary 24 . When the -I line 22 moves, the isolation structure 3 同步 moves synchronously. Thus, the isolation structure 30 can prevent the portion of the optical film 12 that has been separated from the substrate 10 from sticking back to the substrate 1 . Furthermore, since the line 10 of the 10th 201018988 and the hidden structure are left over, the optical film is picked up and the substrate is separated from the substrate, and the moving mode is pulled to cause damage. Therefore, the optical film removal method which does not cause the substrate and the optical film to be produced, and the substrate and the optical film are damaged can be reduced. The ❼', ,, ′′ phylum shows a schematic view of another comparative optical film removal method in accordance with the present invention. Different from the above embodiment, 1 =: the optical film removing device 2 is obliquely directed to the corresponding optical film 12, and the first portion of the removing device is placed on the substrate::: the angle of the near optical film 12 is made to make the optical film Removal device 2: two = between the film 12 and the substrate, and then remove the light (4) (1): =: r film diagonal direction into the eight, can:: force the embodiment phase L divided (four) 12. The subsequent method of removing the optics® may further include a spacer plate in addition to the above-described implementation of the second material. Or away,,,. Cable 24. As shown in Fig. 6, the second A-plate directly replaces the second φ A, ', which is a schematic diagram showing a method for removing the optical film according to another preferred embodiment of the present invention. The light is removed and the method is similar to the embodiment described. The present embodiment differs from the previous embodiment in that the 'the first cable is the isolation structure stepped after the optical film 12 and the substrate 10 are fed:, the reverse 44<> when the first winding 22 When moving, the 'dividing plate 44 is the same as the outer surface, so that the removed optical film 12 is bonded back to the substrate 1 again. The partial optical film 12 separated from the substrate and adhered to the separation plate 44 can be easily removed, and the separation plate 44 has a release surface 46 thereon. 11 201018988 From the above-described preferred embodiments of the present invention, the application of the present invention has the following advantages. First, the optical film removing device of the present invention can block the previously removed film from being adhered to the substrate again, and can be easily removed if the removed optical film is adhered to the optical film removing device, and The device structure will cause damage to the film and substrate during the removal process. Secondly, by using the force of the parallel substrate to embed the photo-pre-film removing device into the interface between the optical film and the substrate, it is possible to avoid generating a torsion force sufficient to cause the substrate to be broken, so as to reduce the rate of the repetitive process ❹ φ = . Third, the optical film is lifted by the force of the parallel substrate. The optical film is not pulled, and the possibility of damage to the optical film can be reduced. Based on the above advantages, the use of this hair: Ben. The device and the method for reducing the material consumption and the process for reducing the process are defined as follows: The invention has been disclosed in the preferred embodiment as described above, but it is not intended to be used in any way, without departing from the spirit of the invention. = See, when a variety of changes and retouching can be made, the protection of the present invention is subject to the definition of the material. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, (4), and superiors of the present invention more obvious, the detailed description of the drawings is as follows: only the first embodiment of the present invention is a schematic diagram of a device according to the present invention. . Optical Film Removal of Nujiaguan Figure 2 is a schematic diagram of an optical film removal according to another preferred embodiment of the present invention. * Figure 3 is a cross-sectional view of the first cable. Figure 4A is a schematic illustration of an optical film removal method in accordance with a preferred embodiment of the present invention. Fig. 4B is a side view showing the optical film removing method of Fig. 4A. Fig. 5 is a view showing a method of removing an optical film according to another preferred embodiment of the present invention. • Figure 6 is a schematic diagram showing the optical film shift of the yoke case in accordance with the present invention. [, main component symbol description] 4. Optical 骐 removal device

i〇:基板 20 ' 40 :支撐臂 24 :第二纜線 3 〇 :隔離結構 46 :離型表面 13I〇: substrate 20 ' 40 : support arm 24 : second cable 3 〇 : isolation structure 46 : release surface 13

Claims (1)

201018988 十、申請專利範圍: 1·—種先學膜移除裝置’係用於將-光學膜自一基板 * 上移除’該裝置至少包含: 二支撐臂;以及 複數個纜線,固設於該二支樓臂之間,其中每一該些 、·覽、本長度至少較該光學膜的一邊長長且該些纜線所構成 的平面面積不小於該光學膜面積的三分之一。 ―2·如申請專利範圍第1項所述之光學膜移除裝置,其 中每該些纜線長度至少較該光學膜的對角線長。 3·如申凊專利範圍第1項所述之光學膜移除裝置,其 中该些纜線所構成的平面面積大於該光學膜之面積。 4·如申請專利範圍第1項所述之光學膜移除裝置,更 參 &括-分隔平板,該些支樓臂分別設於該分隔平板之兩對 邊並分別沿著該分隔平板之該兩對邊向外延伸。 5. 如申請專利範圍第4項所述之光學膜移除裝置,其 中該分隔平板與該些纜線所構成的平面面積大於該光二 膜之面積。 予 6. 如申請專利範圍第4項所述之光學膜移除裝置,其 中忒分隔平板的至少一面具有一離塑層。 14 201018988 置,至 7_如中請專利範圍第1項所述之光學膜移㈣ 該些纜線更包括—同軸滑套。 & ,其 中該=:二=學_除“’其 I 〇·如申5月專利範圍帛7項所述之光學膜移除裝置,其 中該同軸滑套以該纜線為輛滾動。 II ·如申印專利範圍第彳項所述之光學膜移除裝置,其 中該些纜線以兩兩間距不大於5公分之間距排列。'、 12.—種光學膜移除裝置,係用於將一光學膜自一基板 上移除’該裝置至少包含: 一分隔平板; 一支撐臂’分別設於該分隔平板之兩對邊並分別沿著 該分隔平板之該兩對邊向外延伸;以及 一纜線’固設於該二支撐臂之間,其中該纜線長度至 少較該光學膜的一邊長長。 15 201018988 13·如申請專利範圍第12項所述之光學膜移除裝置, 其中該纜線長度至少較該光學膜的對角線長。 14.如申請專利範圍第12項所述之光學膜移除裝置, 其中該分隔平板與該I賴構成的平面面積大於該光學 膜之面積。 Λ 15.如巾請專利12項所述之光學膜移除裝置, 其中該分隔平板的至少一面具有一離型層。 16_如申請專利範圍第12項所述之光學獏移除裝置, 該纔線更包括一同軸滑套。 17.如申請專利範圍第12項所述之光學膜移除裝置, 其中該纜線直徑約為1毫米至2〇毫米。 、 ❹ 18·如中請專利範圍帛12項所述之光學膜移除裂置, 其中該纜線直徑約為2毫米至1〇毫米。 乂 19_如申請專利範圍第16項所述之光學膜移除裝置, 其中該同軸滑套以該纜線為軸滾動。 I ‘ 20.如申請專利範圍第12項所述之光學膜移除裝置, 其中該纜線與該分隔平板相鄰的一側邊間距不大於5八 16 201018988 分。 21.—種光學膜移除方法,係用於將黏合於一基板上之 一光學膜移除,該方法至少包含·· 提供-第-I線置於該基板之上且鄰近該光學膜的 側緣·; 施加一與該基板實質平行的力於該第一纜線以使該 第一纜線饋入該光學膜與該基板之接面以分離該光學膜 與該基板;以及 於5亥第一纟覽線之後饋入一隔離結構,以避免已與該基 板分離的部分該光學膜黏回該基板。 22. 如申請專利範圍第21項所述之光學膜移除方法, 其中該隔離結構包含至少一第二境線。 23. 如申請專利範圍第21項所述之光學膜移除方法, 其中該隔離結構包含一分隔平板。 24. 如申請專利範圍第23項所述之光學膜移除方法, 其中該分隔平板的至少一面具有一離型層。 25_如申請專利範圍第21項所述之光學膜移除方法, 其中該隔離結構與該第一纜線同步移動。 17201018988 X. Patent application scope: 1. The first film removal device is used to remove the optical film from a substrate*. The device comprises at least: two support arms; and a plurality of cables, fixed Between the two arms, each of the lengths, the length of the film is at least longer than one side of the optical film, and the planar area formed by the cables is not less than one third of the area of the optical film. . The optical film removing device of claim 1, wherein each of the cables has a length that is at least longer than a diagonal of the optical film. 3. The optical film removing device of claim 1, wherein the cable has a planar area greater than an area of the optical film. 4. The optical film removing device according to claim 1, further comprising: a separating plate, wherein the branch arms are respectively disposed on two opposite sides of the dividing plate and respectively along the separating plate The two pairs of edges extend outward. 5. The optical film removing apparatus of claim 4, wherein the partitioning plate and the cables form a planar area larger than an area of the photonic film. 6. The optical film removing device of claim 4, wherein at least one side of the crucible separating plate has a release layer. 14 201018988 Set, to 7_ as mentioned in the patent scope of the first film of the optical film shift (4) These cables also include - coaxial sliding sleeve. & , where the =: two = learning _ in addition to "'I 〇 · as claimed in the May patent scope 帛 7 item of the optical film removal device, wherein the coaxial sliding sleeve is rolled by the cable. II The optical film removing device of claim 1, wherein the cables are arranged at a distance of not more than 5 cm between two and two. ', 12. An optical film removing device is used for Removing an optical film from a substrate. The device comprises at least: a dividing plate; a supporting arm respectively disposed on two opposite sides of the dividing plate and extending outward along the two opposite sides of the dividing plate; And a cable affixed between the two support arms, wherein the cable length is at least longer than one side of the optical film. 15 201018988 13 The optical film removal device of claim 12, Wherein the length of the cable is at least longer than the diagonal of the optical film. The optical film removing device of claim 12, wherein the partitioning plate and the planar surface of the insulating film are larger than the optical film. The area of Λ 15. For the towel, please call the light according to patent 12 The film removing device, wherein at least one side of the separating plate has a release layer. 16_ The optical fiber removing device according to claim 12, wherein the wire further comprises a coaxial sliding sleeve. The optical film removing device of claim 12, wherein the cable has a diameter of about 1 mm to 2 mm. ❹ 18 · The optical film removal crack described in the patent scope 帛 12 The optical film removing device according to claim 16, wherein the coaxial sliding sleeve is rolled on the cable. I ' 20 The optical film removing device according to claim 12, wherein a distance between a side of the cable adjacent to the partitioning plate is not more than 5,8,8,8,18,18,988. 21. An optical film removing method, For removing an optical film adhered to a substrate, the method comprising at least providing a -I-line disposed on the substrate adjacent to a side edge of the optical film; applying a substance to the substrate Parallel force on the first cable to feed the first cable The interface between the optical film and the substrate is used to separate the optical film from the substrate; and an isolation structure is fed after the first viewing line to avoid adhesion of the optical film to the substrate. The method of removing an optical film according to claim 21, wherein the isolation structure comprises at least one second alignment. The optical film removal method according to claim 21, wherein the isolation The optical film removal method according to claim 23, wherein at least one side of the separation plate has a release layer. 25_Optical as described in claim 21 A film removal method, wherein the isolation structure moves in synchronization with the first cable. 17
TW097143145A 2008-11-07 2008-11-07 Optical film peeling device and the method for peeling an optical film TWI371613B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102173176A (en) * 2010-12-30 2011-09-07 友达光电股份有限公司 Thin piece peeling equipment and peeling method
CN106298617A (en) * 2015-05-25 2017-01-04 中华映管股份有限公司 Delamination method for laminated structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102173176A (en) * 2010-12-30 2011-09-07 友达光电股份有限公司 Thin piece peeling equipment and peeling method
CN102173176B (en) * 2010-12-30 2013-06-12 友达光电股份有限公司 Thin piece peeling equipment and peeling method
CN106298617A (en) * 2015-05-25 2017-01-04 中华映管股份有限公司 Delamination method for laminated structure

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