TW201018714A - Infrared low-emmisive paint and method for manufacturing the same - Google Patents

Infrared low-emmisive paint and method for manufacturing the same Download PDF

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TW201018714A
TW201018714A TW97142641A TW97142641A TW201018714A TW 201018714 A TW201018714 A TW 201018714A TW 97142641 A TW97142641 A TW 97142641A TW 97142641 A TW97142641 A TW 97142641A TW 201018714 A TW201018714 A TW 201018714A
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Taiwan
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low emissivity
weight
infrared low
infrared
filler
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TW97142641A
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Chinese (zh)
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TWI382067B (en
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Kun-Cheng Lin
Jing-Lyang Jeng
I-Te Huang
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Ind Tech Res Inst
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Abstract

Disclosed is an infrared low-emmisive paint and method for manufacturing the same. Multipolymer, double bond monomer, acrylate, and initiator are dissolved in solvent and heated to branch the double bond monomer and the acrylate on the multipolymer for forming binder. The binder is evenly mixed with metal filler, colorant filler, semiconductive filler, and process agent to form the infrared low-emmisive paint.

Description

.201018714 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種紅外線低放射率塗料,更特別關於 其黏結劑組成。 【先前技術】 •、己X來王世界此源消耗大幅增長’節能已是全世 界的共識。在工業上,保溫隔熱塗料在此刻具有重大意義, 保服熱主要在阻隔鍋爐管件自身熱量散失,另一方面, ί、乍者起保5蒦作用。熱源一般會以對流、輕射、傳導的 方^傳播’ t面溫環境時紅外輕射的比重會加^,輕射熱 的即此就相當重要。而降低紅外輕射的途徑有三:-、改 變目標的紅外輻射特性,即目標物的放射率分佈,二 = =,;、調節紅外_播路#。研製低放 輻射;度性及降低紅外 /天為個間早有效的隔熱保溫方法。 燃燒系統或高溫物體都會發出大量的輻射埶 體發出熱量一部份會由設備和水管組所吸收,吸、…、輕射 會重新輻射,因此本技術為降低工業鋼爐及=也 損失及節省燃料,保護高表面温度的中碳鋼材:命射 喷塗低放射率的塗料減少熱的損失達到減少投夕用 料,達到降低c〇2氣體產生量及系統節約能源之:的燃 低放射率塗料開發起源於軍事紅外隱身應用, 段,最早至1967年美國空軍就委託霍尼威 階 (H〇neywel〗)開展了漫反射型紅外反射塗料的研究。第^二 201018714 段,20世紀70年代末期至8〇年代中葉,美陸軍軍備司令 部對於中、遠紅外線隱身塗料及適合黏結劑進行許多研 究’Nntick研究發展實驗室及Beivoir研究發展中心也對低 放射率熱隱身塗料進行許多研究工作。20世紀8〇年代中 期後’西方各國紛紛介入熱隱身塗料研究。德、英、法、 曰、加、澳洲在這一時期均有反映這方面工作的訊息出現。 其中澳大利亞國防部材料實驗室於1984年發表的一篇熱 隱身塗料研製報告引起了廣泛的注意。據專家推測:熱隱 馨身塗料的研製工作已由初期探索進入活躍的秘密開發階 段。第一階段放射率均高於0.5,第三階段中的第二代紅外 . 線隱身塗料’主要加強在新黏結劑和著色顏料開發。第四 階段由於第二代紅外線隱身塗料成熟階段,塗料採用紅外 透明度高的聚合物(可能是丁基橡膠、Krat〇n樹脂)和著 色顏料(可能包括硫化鎘、氧化鐵等組合),再加入少量 金屬顏料’這種塗料已商品化,商業產品放射率小於〇.5。 美國Aestra公司是製造廠商之一,表1的第5號配方是其 ®雛形。 表1鹗種紅外隱身塗料配方與性能 研製者 基本配方(質量%) 熱隱身性能 其他性能 1 RP.Si^coe (1981) A1 粉(10-20) ’ Co (2〜15),Co〇 (2〜5;j, ΤΑ (7~23) ’有機石夕醇酸樹脂(65~75),其 他 A (〇3-1.8> Mm~〇*623 灰色,可見光偽裝及一般 物理性能良好 2 R-F.Si^coe (1982) Α1 粉(10-20) ’ ZnS (5-^9),SbjS (8-14), Al2〇3 (3~7) ’有機石夕醇睃樹脂(40-60),有 機顏料(1.3~1·8),其他 ε(2〜15)μτη=0.512 £ (叫4) [1111=0520 A (〇只8) 藍灰色,可見光偽裝及一 般物理性能良好 3 GTschulaia (1981) Α1箔片(ΚΚ20,ψ50μχη),商業無色聚氨脂 m___ 灰色(RAL7000),一般 物理性能良好 4 GTschuIena (1981) A1箔片(20-30,ψ50μιη),黃橄稅色醇醆漆, 顏料(PAL6015) ε·πκ=0.6 徹视色(PAL6014),一般 物理性能良好 6 GadHugo (1986) …(5),丁溶解顏料 綠色’顏色可調範圍較大 6 .201018714 表2列舉低放射率塗料專利及功效矩陣,塗料專利有 宣稱放射率大都高於0.5以上,主要採取手段都是改良顏 填料技術、多層結構堆疊設計,或是做物理氣相沈積做低 放射窗(low emissivity window)應用,其中物理氣相沈積方 式的產品放射率可達0.3’物理氣相沈積方式的缺點成本高 及現場塗布較難,且很少針對黏結劑之官能基及紅外透光 性之性質作進一步的探討。只有US3189576中提到使用石夕 氧樹脂(silicon-bonded oxime resin)當作黏結劑,US4131593 ® 應用於核閃光保護。現在原物料高漲的矽樹脂(特用型矽樹 脂’ >NT$ l〇〇〇/kg),由於矽樹脂放射率並不低,因此需 • 要添加高比例的金屬粉漿來降低放射率,而鋁銀漿價格也 • 不輸矽樹脂,因此使得塗料價格非常高,且放射率只能達 到0.45以上。 表2低放射率塗料專利功效.201018714 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to an infrared low emissivity coating, and more particularly to a binder composition thereof. [Prior Art] • The consumption of this source has increased dramatically. “Energy saving is the consensus of the whole world. In the industry, thermal insulation coatings are of great significance at this moment. The heat of protection is mainly to block the heat loss of the boiler tubes themselves. On the other hand, the ί and the 起 are used to protect the 蒦. The heat source will generally increase the specific gravity of the infrared light when the convection, light radiation, and conduction are transmitted. The light heat is very important. There are three ways to reduce the infrared light shot: -, change the infrared radiation characteristics of the target, that is, the emissivity distribution of the target, two = =,;, adjust the infrared _ broadcast road #. Develop low-level radiation; degree and reduce infrared/day as an early effective insulation method. Burning systems or high-temperature objects will emit a large amount of radiation. The heat generated by the equipment will be absorbed by the equipment and the water pipe group. The suction, ..., and light radiation will re-radiate. Therefore, the technology reduces the loss and saving of the industrial steel furnace. Fuel, medium carbon steel that protects high surface temperature: Spraying low emissivity coatings to reduce heat loss to reduce the amount of materials used to reduce c〇2 gas production and system energy saving: low emissivity Paint development originated from military infrared stealth applications. From the earliest, in 1967, the US Air Force commissioned Honeywell (H〇neywel) to conduct research on diffuse reflective infrared reflective coatings. In the second paragraph of 201018714, from the late 1970s to the mid-1980s, the US Army Armaments Command conducted many studies on medium and far-infrared stealth coatings and suitable adhesives. The Nntick Research and Development Laboratory and the Beivoir Research and Development Center are also low. Emissivity heat stealth coatings do a lot of research work. After the mid-1980s, the Western countries have been involved in hot stealth coating research. German, English, French, German, Canadian and Australian have all reported information on this aspect of work during this period. A report on the development of thermal stealth coatings published by the Australian Department of Defense Materials Laboratory in 1984 attracted widespread attention. According to experts' speculation, the development of the thermal hidden scent paint has entered the active secret development stage from the initial exploration. The first stage of emissivity is higher than 0.5, and the second generation of infrared in the third stage. The line stealth coating 'is mainly strengthened in the development of new binders and pigments. The fourth stage is due to the maturity stage of the second generation of infrared stealth coatings. The coatings are made of polymers with high infrared transparency (possibly butyl rubber, Krat〇n resin) and coloring pigments (possibly including cadmium sulfide, iron oxide, etc.). A small amount of metallic pigments 'this coating has been commercialized, and commercial products have an emissivity of less than 〇.5. Aestra is one of the manufacturers in the United States, and the No. 5 formula in Table 1 is its prototype. Table 1 Formulation and Performance of Infrared Stealth Coatings Basic Formulation (% by Mass) Thermal Stealth Performance Other Properties 1 RP.Si^coe (1981) A1 Powder (10-20) ' Co (2~15), Co〇( 2~5;j, ΤΑ (7~23) 'Organic stone alkyd resin (65~75), other A (〇3-1.8> Mm~〇*623 gray, visible light camouflage and general physical properties 2 RF .Si^coe (1982) Α1 powder (10-20) ' ZnS (5-^9), SbjS (8-14), Al2〇3 (3~7) 'Organic Shiki alcohol resin (40-60) , organic pigment (1.3~1·8), other ε(2~15)μτη=0.512 £ (called 4) [1111=0520 A (〇8 only) blue-gray, visible light camouflage and general physical properties 3 GTschulaia (1981 Α1 foil (ΚΚ20, ψ50μχη), commercial colorless polyurethane m___ grey (RAL7000), good physical properties 4 GTschuIena (1981) A1 foil (20-30, ψ50μιη), yellow olive tax melamine paint, pigment (PAL6015) ε·πκ=0.6 Vision color (PAL6014), generally good physical properties 6 GadHugo (1986) ... (5), butyl soluble pigment green 'color adjustable range is larger 6. 201018714 Table 2 lists low emissivity coating Patent and efficacy matrix, coating patents claim that the emissivity is mostly higher than 0.5, the main methods are improved pigment filling technology, multi-layer structure stack design, or physical vapor deposition for low emissivity window applications. The product of the physical vapor deposition method has an emissivity of up to 0.3'. The disadvantages of the physical vapor deposition method are high and the coating on the spot is difficult, and the properties of the functional group and the infrared light transmittance of the binder are rarely further discussed. Only US3189576 mentions the use of silicon-bonded oxime resin as a binder, and US4131593 ® for nuclear flash protection. Now the raw material is high in enamel resin (special type enamel resin > NT$ l〇) 〇〇/kg), because the emissivity of the resin is not low, it is necessary to add a high proportion of metal paste to reduce the emissivity, and the price of the aluminum paste is also not to lose the resin, so the price of the coating is very high. And the emissivity can only reach 0.45 or above. Table 2 Low emissivity coating patent efficacy

序號 專利號瑪 中請年度 申請人~~~'~~' 功效分類 1 US4131593 1978 U.S.Air Force AJB.CDK 2 昭 57>67670 1982 &下電器 E 3 昭 57«68172 1982 松下電器 E 4 W09510569 1995 JOHNSON(GB) BJE !> US5405680 1995 Hughes Aircraft CiHnpany B3 6 CN1118799A 1996 趨雜 CJDJE, Ί CN11554713A 2004 周紅明 B 8 CN1549935A 2004 德商阿爾登 C3 9 CN1552660A 2004 不國解&軍―~~ B 10 CN1653011A 2005 1爾金頓北美G E J1 CN1837301A 2006 濟南中化紡蘇- B 12 CN101044283A 2007 納幕爾杜邦公司 Ef.Q 功效为類代號.A.核此曝曬,b.紅外隱身,C.長時金屬與 非金屬高溫阻抗,D·金屬與非金屬熱控制,Ε·節能及隔熱, F.透氣性,G.濕氣凝結。 7 201018714 綜合上述,國外開發現況,第一,國外紅外隱身塗料 已彩色化,但色彩不夠豐富且實用化少;第二,國外研發 低放射率塗料對付可見光、紅外光和微波,但其兼容性仍 沒有完全解決;第三,大部份應用於軍事,但很少應用於 工業鍋爐外表面。 國内現況來看,紅外線低放射率塗料的研究歷史很 短,且偈限於軍事研究單位。由於本技術牽涉到國防熱隱 身匿蹤技術(包含導彈、隱形戰機、飛行器、地面設備、迷 ® 彩衣),先進各國極為保密,所以研發的情況較少披露,相 比起國外飛速發展的紅外隱身技術,國内還有相當差距。 雖然不發展國防軍事,但是於民生節能相當重要。而國内 此類產品不多,顏色只有灰色,紅外放射率約高於0.5,且 少應用於工業節能。清華大學曾探討過奈米級銀粒子及無 機黏結劑應用於薄膜上,紅外放射率約0.04,另外也探討 雙層高分子基質透明度在低放射率影響,紅外放射率約高 於0.7,此外很多國内學校討論發展導電高分子材料,雖然 學術界有一些零散研發,但是不是價格過高,物理性能不 佳,就是因此放射率太高,難以拿到工業節能上應用。綜 上所述,國内關於紅外線低放射率塗料要實用化、廣大節 能化、環保化、色彩化,還有相當長遠的路要走。 【發明内容】 本發明提供一種紅外線低放射率塗料之形成方法,包 括將10至30重量份之多元共聚物、70至90重量份之雙 鍵單體及丙烯酸酯、及0.1至0.3重量份之起始劑溶於100 8 .201018714 至150重量份之溶劑後加熱,使該雙鍵單體與該丙烯酸酯 接枝至該多元共聚物以形成黏結劑;以及將100重量份之 該黏結劑、10至30重量份之金屬填料、0.1至1重量份之 著色填料、5至10重量份之半導體填料、與0.5至1重量 份之助劑均勻混合,形成紅外線低放射率填料。 本發明亦提供一種紅外線低放射率塗料,包括黏結 劑,係由10至30重量份之多元共聚物與70至90重量份 之雙鍵單體及丙烯酸酯接枝共聚而成;以及10至30重量 ® 份之金屬填料、0.1至1重量份著色填料、5至10重量份 之半導體填料、0.5至1重量份之助劑與100重量份之該黏 結劑均勻混合。 【實施方式】 黏結劑是塗料的主要成膜物質,是主要影響塗層放射 率的主要因素之一。塗層的熱紅外線頻段的吸收能力至少 有60%取決於黏結劑。目前研究較多是顏填料,而黏結劑 較少人著墨,且因軍事應用不公開原則,也較難取得有效 的物質資料。此外,黏結劑除應滿足物理機械性能、施工 性能、成本低廉等一般要求外,還應具備紅外線低放射率 或高透明性能。一般用於塗料黏結劑樹脂在8〜14μιη波長 内透明度低、放射率高,即使優良紅外透明的Kraton樹脂, 在遠紅外波段平均放射率也高達0.84。因此,本發明提出 低放射率黏結劑來克服塗料的高放射率。本案提出以開發 更低價、更低放射率的黏結劑取代特用型矽樹脂,不僅價 格便宜、耐高溫、且放射率可低於0.2,使得低放射率塗料 9 .201018714 得以成功’大幅縮短以前只能用較貴物理氣相沈積方式(真 空條件下)產生低放射率產品,因此未來大面積化才可能得 以實現’特別是汽車和建築上的應用。 首先’將起始劑溶於溶劑後加熱,形成自由基。適用 於本發之起始劑為熱起始劑如偶氮類或過氧化物類。偶氮 類如 2,2’-偶氮二雙(2,4-二曱基正戊 腈)(2,2,-azobis(2,4-dimethyl valeronitrile))、二曱基,2,2’-偶 氮雙 (2- 丙酸甲 醋) (dimethyl 2,2’-azobis(2-methylpropionate)、2,2_ 偶氮雙異丁腈 (2,2-azobisisobutyronitrile,以下簡稱 AIBN)、2,2-偶氮雙(2-曱基異丁腈)(2,2-azobis(2-methylisobutyronitrile))、1,1’-偶 氮雙 (環 己烷-1- 腈)1,1’-乱2〇1^3(。}^1〇116父&1^-1-〇&!'1)〇11!1;1'以))、2,2’-偶氮雙 [N-2- 丙 基 -2- 曱 基 丙 醯 胺](2,2’-azobis[N-(2-propenyl)_2_methylpropionamide])、 1·[(氰基-1-甲基乙基)-偶氮基]曱醯胺 (l-[(cyano-l-methylethyl)azo]formamide)、2,2’-偶氮雙(Ν- 丁 基 -2- 甲 基丙酿 胺)(2,2’-azobis(N-butyl-2_methylpropionamide))、2,2’偶氮 雙 (N- 環己基 -2- 曱 基丙酿 胺)(2,2’42〇1^(]^-〇}^1〇]16义)^1-2-11161;11}^1'(^〇皿11^46)、或其 他合適之偶氮類起始劑;過氧化物類包括苯曱醯基過氧化 物(benzoyl peroxide)、1,1-雙(第三丁基過氧基)環己烧 (l,l-bis(tert-butylperoxy)cyclohexane)、2,5-雙(第三 丁基過 10 201018714 氧 基 )-2,5- 二曱基 環己烷 (2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane)、2,5-雙 (第三丁基過氧基)-2,5-二曱基-3-環己炔 (2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne) ' 雙 (1-(第三丁基過氧基)-1-曱基乙基)苯 (bis(l-(tert-butylpeorxy)-l-methy-ethyl)benzene)、第三丁基 過氧化氳(tert-butyl hydroperoxide)、第三丁基過氧化物 (tert-butyl peroxide)、第三丁基過氧基苯曱酸(tert-butyl peroxybenzoate)、茴香基過氧化氫(Cumene hydroperoxide)、環己酮基過氧化物(cyclohexanone peroxide)、二茴香基過氧化物(dicumyl peroxide)、月桂基 過氧化物(lauroyl peroxide)、或其他合適之過氧化物。上述 之熱起始劑除可單一使用外,亦可混合使用,端視需要而 定。起始劑之種類及用量可決定聚合物分子量及聚合度。 合適之溶劑可為二甲笨、曱苯、四氫吱喃、正丁醇、 鲁甲乙_。在之後的聚合反應中,溶劑的作用包括溶解和分 散反應物質,促進反應物均勻接觸、控制溫度、傳遞熱量、 促使鍵結轉移、並控制分子量。 接著將多元共聚物、雙鍵單體、及丙烯酸酯溶於上述 含有自由基之溶液後加熱,使雙鍵單體與丙烯酸酯接枝至 多兀共聚物以形成黏結劑。雙鍵單體可為苯乙烯、聚丁二 烯、乙烯、丙烯、丙烯腈、或上述之組合。丙烯酸酯可為 丙烯酸、甲基丙烯酸曱酯、丙烯酸曱酯、丙烯酸丁酯、丙 烯酸己酯或上述之組合。多元共聚物為乙烯_丙烯_二烯共 11 201018714 聚物(EPDM)、丙烯腈_丁二烯_苯乙烯共聚物(ABs)、或上 述之混合物。 在上述聚合反應中,起始劑重量約占反應物總重之 ο.1%至〇.3%,多元共聚物重量約占反應物總重之10%至 30%,雙鍵單體與丙烯酸酯約占反應物總重之7〇%至卯% 之間,溶劑重量約為反應物總重之〗至15倍。上述聚合 溫度為80。(:至i2(rc之間,反應時間為8至1〇小時。。 接著將上述形成之黏結劑與金屬填料、著色填料、半 V體填料、以及助劑均自混合後,即完成本發明之紅外線 低放射率塗料。金屬填料包括片材銘粉、還原性鐵粉、或 銀粉。金屬填料之作用為增加反射紅外光、增加熱傳導性, 及提高塗料耐溫性,且黏著劑與金屬填料之重量比例介於 之間。當金屬填料咖 例大於放射率,但當金屬填料所占比 :放射率降 ,無機鹽、及有機顏料。著色化物、琉化物、魏 提供紅外光透明性,且 、”、之作用為增加美觀及 1士〇〇幻至m:1之間。=著色填料之重量比例介於 知’將會易趣色,但當著张料所占比例切上述範圍 料能增加成本。半導體填;f所占^例大於上述範園時, 或摻紹氧化鋅。半導體填等、夕、二氧化麵錫、氧化録錫、 率、增加可見光透率且提升」用為增加導電度降低放射 體填料之重量比例介於】00:5夕反射率,且黎著劍輿半導 100:1〇之間。當半導體填 12 201018714No. Patent No. Ma Zhong invites the applicant of the year~~~'~~' Efficacy classification 1 US4131593 1978 USAir Force AJB.CDK 2 Shou 57>67670 1982 &Empty appliance E 3 昭57«68172 1982 Matsushita Electric E 4 W09510569 1995 JOHNSON(GB) BJE !> US5405680 1995 Hughes Aircraft CiHnpany B3 6 CN1118799A 1996 Twisted CJDJE, Ί CN11554713A 2004 Zhou Hongming B 8 CN1549935A 2004 German Business Arden C3 9 CN1552660A 2004 Unsolved & Army-~~ B 10 CN1653011A 2005 1 Argington North America GE J1 CN1837301A 2006 Jinan Sinochem Su-B 12 CN101044283A 2007 Natur DuPont Ef.Q Efficacy is the code. A. Nuclear exposure, b. Infrared stealth, C. Long-term metal and non- Metal high temperature impedance, D · metal and non-metal thermal control, Ε · energy saving and heat insulation, F. gas permeability, G. moisture condensation. 7 201018714 In summary, the foreign discovery situation, first, foreign infrared stealth coatings have been colorized, but the color is not rich enough and practical and less; Second, foreign research and development of low emissivity coatings against visible light, infrared light and microwave, but Its compatibility is still not fully solved; third, most of it is applied to the military, but it is rarely applied to the outer surface of industrial boilers. In the domestic situation, the research history of infrared low emissivity coatings is very short, and it is limited to military research units. Because this technology involves the defense stealth stealth technology (including missiles, stealth fighters, aircraft, ground equipment, fans® color clothing), advanced countries are extremely confidential, so the research and development situation is less disclosed, compared with the rapid development of foreign countries. Infrared stealth technology, there is still a considerable gap in China. Although it does not develop national defense military, it is very important to save energy in Minsheng. However, there are not many such products in China, the color is only gray, the infrared emissivity is higher than 0.5, and it is less used in industrial energy conservation. Tsinghua University has discussed the application of nano-sized silver particles and inorganic binders on films. The infrared emissivity is about 0.04. In addition, the transparency of double-layer polymer matrix is also affected by low emissivity. The infrared emissivity is higher than 0.7. Domestic schools discuss the development of conductive polymer materials. Although there are some scattered research and development in the academic world, they are not too expensive and have poor physical properties. Therefore, the emissivity is too high and it is difficult to obtain industrial energy-saving applications. In summary, there is still a long way to go in China for the practical use of infrared low emissivity coatings, energy saving, environmental protection, and colorization. SUMMARY OF THE INVENTION The present invention provides a method for forming an infrared low emissivity paint comprising 10 to 30 parts by weight of a multicomponent copolymer, 70 to 90 parts by weight of a double bond monomer and an acrylate, and 0.1 to 0.3 parts by weight. The initiator is dissolved in 100 8 .201018714 to 150 parts by weight of a solvent, and then heated to graft the double bond monomer and the acrylate to the multicomponent copolymer to form a binder; and 100 parts by weight of the binder, 10 to 30 parts by weight of the metal filler, 0.1 to 1 part by weight of the colored filler, 5 to 10 parts by weight of the semiconductor filler, and 0.5 to 1 part by weight of the auxiliary agent are uniformly mixed to form an infrared low emissivity filler. The present invention also provides an infrared low emissivity coating comprising a binder comprising 10 to 30 parts by weight of a multicomponent copolymer and 70 to 90 parts by weight of a double bond monomer and an acrylate graft copolymerized; and 10 to 30 The weight of the metal filler, 0.1 to 1 part by weight of the colored filler, 5 to 10 parts by weight of the semiconductor filler, 0.5 to 1 part by weight of the auxiliary agent and 100 parts by weight of the binder are uniformly mixed. [Embodiment] The binder is the main film-forming substance of the coating, and is one of the main factors mainly affecting the emissivity of the coating. At least 60% of the absorption capacity of the thermal infrared band of the coating depends on the binder. At present, more research is on pigments and fillers, while binders are less inked, and it is difficult to obtain effective material information because of the principle of non-disclosure of military applications. In addition, in addition to the general requirements of physical and mechanical properties, construction performance, and low cost, the binder should also have low infrared emissivity or high transparency. Generally used for coating binder resin, the transparency is low and the emissivity is high in the wavelength of 8~14μηη. Even the excellent infrared transparent Kraton resin has an average emissivity of 0.84 in the far infrared band. Accordingly, the present invention proposes a low emissivity binder to overcome the high emissivity of the coating. In this case, it is proposed to replace the special type enamel resin with a lower-cost, lower emissivity binder, which is not only cheap, high temperature resistant, and the emissivity can be less than 0.2, which makes the low emissivity coating 9.201018714 successful In the past, it was only possible to produce low emissivity products using the more expensive physical vapor deposition (under vacuum), so it is possible to achieve a large area in the future, especially for automotive and architectural applications. First, the initiator is dissolved in a solvent and heated to form a radical. Suitable starters for use in the present invention are thermal starters such as azo or peroxides. Azos such as 2,2'-azobis(2,4-dimethyl valeronitrile), dimercapto, 2,2' - azo 2,2'-azobis(2-methylpropionate), 2,2-azobisisobutyronitrile (hereinafter referred to as AIBN), 2,2 -2,2-azobis(2-methylisobutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile) 1,1'-chaotic 2 〇1^3(.}^1〇116Father&1^-1-〇&!'1)〇11!1;1' by)), 2,2'-azo double [N-2- Propyl-2-mercaptopropionamide] (2,2'-azobis[N-(2-propenyl)_2_methylpropionamide]), 1·[(cyano-1-methylethyl)-azo]曱Indole (l-[(cyano-l-methylethyl)azo]formamide), 2,2'-azobis(Ν-butyl-2-methylpropanol) (2,2'-azobis(N- Butyl-2_methylpropionamide)), 2,2' azobis(N-cyclohexyl-2-mercaptopropenamine) (2,2'42〇1^(]^-〇}^1〇]16))^ 1-2-11161; 11}^1' (^ dish 11^46), or other suitable azo initiators; peroxides include benzoyl peroxide (benzo Yl peroxide), 1,1-bis(tert-butylperoxycyclohexane), 2,5-bis (t-butylper 10 201018714 oxy )-2,5-bis(tert-butylperoxy-2,5-dimethylcyclohexane), 2,5-bis(t-butylperoxy)-2,5- Dimethyl 3-cyclohexyne (2,5-bis(tert-butylperoxy-2,5-dimethyl-3-cyclohexyne) 'bis(1-(t-butylperoxy)-1-fluorenyl) Bis(butyl-butylperoxy-l-methy-ethyl)benzene, tert-butyl hydroperoxide, tert-butyl peroxide ), tert-butyl peroxybenzoate, cumene hydroperoxide, cyclohexanone peroxide, dicumyl peroxide ), lauroyl peroxide, or other suitable peroxide. The above thermal initiators may be used in combination or in combination, as needed. The type and amount of the initiator can determine the molecular weight and degree of polymerization of the polymer. Suitable solvents may be dimethyl benzene, benzene, tetrahydrofuran, n-butanol, urethane. In the subsequent polymerization, the action of the solvent includes dissolving and dispersing the reactants, promoting uniform contact of the reactants, controlling temperature, transferring heat, promoting bond transfer, and controlling molecular weight. Next, the multicomponent copolymer, the double bond monomer, and the acrylate are dissolved in the above radical-containing solution, and then heated to graft the double bond monomer and the acrylate to the polyfluorene copolymer to form a binder. The double bond monomer may be styrene, polybutadiene, ethylene, propylene, acrylonitrile, or a combination thereof. The acrylate may be acrylic acid, decyl methacrylate, decyl acrylate, butyl acrylate, hexyl acrylate or a combination thereof. The multicomponent copolymer is ethylene-propylene/diene total 11 201018714 polymer (EPDM), acrylonitrile-butadiene-styrene copolymer (ABs), or a mixture as described above. In the above polymerization, the weight of the initiator is from about 0.1% to about 3% by weight based on the total weight of the reactants, and the weight of the multicomponent copolymer is from about 10% to about 30% by weight based on the total weight of the reactants. The ester comprises from about 7% to about 总% by weight of the total reactants, and the weight of the solvent is from about 15 times the total weight of the reactants. The above polymerization temperature was 80. (: to i2 (between rc, the reaction time is 8 to 1 hour.) Next, the above-formed binder is self-mixed with a metal filler, a colored filler, a semi-V filler, and an auxiliary agent, thereby completing the present invention. Infrared low emissivity coating. Metal filler includes sheet powder, reducing iron powder, or silver powder. The role of metal filler is to increase the reflection of infrared light, increase the thermal conductivity, and improve the temperature resistance of the coating, and the adhesive and metal filler The weight ratio is between. When the metal filler is larger than the emissivity, but when the metal filler accounts for: the emissivity decreases, the inorganic salt, and the organic pigment. The coloring compound, the telluride, and Wei provide infrared light transparency, and The role of "," is to increase the appearance and between 1 〇〇 〇〇 至 m m = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Cost. Semiconductor filling; f accounted for more than the above-mentioned Fan Park, or mixed with zinc oxide. Semiconductor filling, etc., Xi, dioxide surface tin, oxidation recording tin, rate, increase visible light transmittance and increase" to increase conductivity Degree reduction The weight ratio of the radiation filler is between 00:5 and the reflectivity of the hexagram, and the radius of the scorpion is between 100:1 。. When the semiconductor is filled 12 201018714

二斤、匕例h於上述範圍時,將會使放射率明顯提高,但 f半導體填料所占比例大於上述範圍時,也會提高放射 率。助劑包括起始劑、石夕貌偶聯劑、濁濕分散劑、或架橋 Mi ,助Μ之作用為與基材附著性、塗料組份間分散性、結 構穩定性,且黏著劑與助劑之重量比例介於lG〇:0.5至 1〇〇:1之間。當助劑所占比例小於上述範圍時,將會凝團、 f層、結,散、易麟、不易成膜’但當助劑所占比例 於么上述乾圍時,則可能黏度太高不易施工、增加成本。 供、Ϊ上述方式形成之紅外線低放射率塗料塗刷保溫設 ^道、鋼爐和管件的金屬和非金屬表面,可降低熱力 ':、、的紅外輕射熱,減少系統的散熱損失,或塗布在建築、 =車或其他領域’(比如:在冬天冷的環境房内採暖,或 △夏天熱的環境房内使用空調冷卻),採被動的方式控制熱 2射傳播’達到節能損耗性能。此種塗料的配方利用金 屬^粉及改性黏結劑可大幅降低波長2〜22㈣之放射率 的私2此改性黏結劑的配方具有紅外透明及良好 货里|±月b。§反應物中的多元共聚物為EpDM系列時, 線放料約為0.2。當反應物中的多元共聚物為燃 糸列時,其紅外線放射率約為〇13。 說明為更清楚指出本發明之特徵’特舉例於下述之實施例 【實施例】 貫施例1When two kilograms and sputum h are in the above range, the emissivity will be significantly improved, but when the proportion of the f-semiconductor filler is larger than the above range, the emissivity is also increased. The auxiliary agent includes an initiator, a Shixia coupling agent, a wet dispersing agent, or a bridging Mi, and the role of the auxiliary agent is adhesion to the substrate, dispersibility between the coating components, structural stability, and adhesion and assistance. The weight ratio of the agent is between lG 〇: 0.5 to 1 〇〇:1. When the proportion of the auxiliary agent is less than the above range, it will be agglomerated, f layer, knot, scattered, easy to be lining, and difficult to form a film'. However, when the proportion of the auxiliary agent is in the above-mentioned dry circumference, the viscosity may be too high. Construction, increase costs. The infrared and low emissivity coatings formed by the above methods can be used to heat the metal and non-metal surfaces of steel pipes and pipe fittings, thereby reducing the heat of the infrared light, reducing the heat loss of the system, or Coated in construction, = car or other areas ' (for example: heating in a cold environment in winter, or using air conditioning to cool in a hot summer environment), passively controlling the heat 2 radiation to achieve energy-saving loss performance. The formulation of this coating utilizes metal powder and modified binder to significantly reduce the emissivity of wavelengths 2 to 22 (4). The formulation of this modified binder has infrared transparency and good goods | ± month b. § When the multicomponent copolymer in the reactant is the EpDM series, the line discharge is about 0.2. When the multicomponent copolymer in the reactant is in a ruthenium column, its infrared emissivity is about 〇13. The description is made to more clearly indicate the features of the present invention, which are exemplified in the following examples. [Examples] Example 1

取 o.lg 之 AIBN 溶於 100mL 之二甲苯(xylene)中 加 13 201018714 熱至80°C後形成自由基。另外取30g之EPDM (S.Prosper Corp.(H01-1002))、7〇g 之丙烯腈(SHOWA(昭和一級))、或 70g之丙烯酸丁酯(SHOWA (昭和一級;))加入含有自由基之 溶劑中,於80°C下反應1〇小時以形成黏結劑。將上述黏 結劑回溫至室溫後,加入20g之片狀鋁金屬填料(Al:83%組 成、S.Prosper Corp,(FAl-02))、lg 之著色填料(Iron chromium oxide hematite、S.Prosper Corp.(I-G223))、9g 之 半導體填料(ITO:In2〇3:Sn〇2=90:l〇wt%、S.Prosper Corp. (D01-9000))、與 〇.5g 之矽烷偶聯劑(S Pr〇sper Corp‘(G02-1002)) ’均勻攪拌混合後,即形成本發明之紅外 線低放射率塗料。將上述塗料旋轉塗佈於基材後,加熱烘 乾塗層以去除溶劑,即形成厚度為〇 2mm,面積為1〇〇cm2 之薄膜’其紅外線放射率為0.2。 實施例2The AIBN of o.lg is dissolved in 100mL of xylene and added to 13 201018714 to form a free radical after heating to 80 °C. In addition, 30 g of EPDM (S. Prosper Corp. (H01-1002)), 7 g of acrylonitrile (SHOWA (Showa)), or 70 g of butyl acrylate (SHOWA (Showa Level 1)) were added to contain free radicals. The solvent was reacted at 80 ° C for 1 hour to form a binder. After the above adhesive was warmed to room temperature, 20 g of a sheet metal aluminum filler (Al: 83% composition, S. Prosper Corp, (FAl-02)), lg coloring filler (Iron chromium oxide hematite, S. Prosper Corp. (I-G223)), 9 g of semiconductor filler (ITO: In2〇3: Sn〇2=90: l〇wt%, S. Prosper Corp. (D01-9000)), and 55 g of decane The coupling agent (S Pr〇sper Corp' (G02-1002))' was uniformly stirred and mixed to form the infrared low emissivity paint of the present invention. After the coating material was spin-coated on the substrate, the coating was dried to remove the solvent, i.e., a film having a thickness of 〇 2 mm and an area of 1 〇〇 cm 2 was formed, and its infrared ray ratio was 0.2. Example 2

與實施例1類似,其差異在於反應物之EPDM置換為 ABS。最後形成之薄膜的厚度為〇 lmm,面積為⑽2, 且紅外線放射率為〇13。 —雖然本發明已以數個實施例揭露如上,然其並非用以 ^離::二2何所屬技術領域中具有通常知識者,在不 ::二 =神和範圍内,當可作任意之更動與潤飾, ^準本發月之保護範圍當視後附之中請專利範圍所界定者 14 201018714Similar to Example 1, the difference was that the EPDM of the reactant was replaced with ABS. The resulting film has a thickness of 〇 lmm, an area of (10) 2 , and an infrared ray of 〇13. - Although the invention has been disclosed above in several embodiments, it is not intended to be used as a general knowledge in the technical field of the art, and may be used in any of the following: Change and refinement, ^The scope of protection of the prospective month of the month, as defined by the patent scope, 14 201018714

【圖式簡單說明】 無。 【主要元件符號說明】 無0 15[Simple description of the diagram] None. [Main component symbol description] No 0 15

Claims (1)

.201018714 十、申請專利範圍: 1. 一種紅外線低放射率塗料之形成方法,包括: 將10至30重量份之多元共聚物、70至90重量份之 雙鍵單體及丙烯酸酯、及0.1至0.3重量份之起始劑溶於 100至150重量份之溶劑後加熱,使該雙鍵單體與該丙烯 酸酯接枝至該多元共聚物以形成一黏結劑;以及 將100重量份之該黏結劑、10至30重量份之金屬填 料、0.1至1重量份之著色填料、5至10重量份之半導體 • 填料、與0.5至1重量份之助劑均勻混合,形成一紅外線 低放射率填料。 2. 如申請專利範圍第1項所述之紅外線低放射率塗料 之形成方法,其中該多元共聚物包括EPDM、ABS、或上 述之混合物。 3. 如申請專利範圍第1項所述之紅外線低放射率塗料 之形成方法,其中該起始劑包括偶氮化合物或過氧化物。 4. 如申請專利範圍第1項所述之紅外線低放射率塗料 ® 之形成方法,其中該雙鍵單體包括苯乙烯、聚丁二烯、乙 豨、丙烯、丙烯腈、或上述之組合。 5. 如申請專利範圍第1項所述之紅外線低放射率塗料 之形成方法,其中該丙烯酸酯包括丙烯酸、曱基丙烯酸曱 酉旨、丙稀酸甲醋、丙稀酸丁醋、丙烯酸己S旨或上述之組合。 6. 如申請專利範圍第1項所述之紅外線低放射率塗料 之形成方法,其中該金屬填料包括片材鋁粉、還原性鐵粉、 或銀粉。 16 201018714 7.如申請專利範圍第1項所述之紅外線低放射率塗料 之形成方法,其中該著色填料包括金屬氧化物和氫氧化 物、硫化物、硒化物、無機鹽、及有機顏料。 8·如申4專利範圍第1項所述之紅外線低放射率塗料 ^形成方法,其中該半導體填料包括氧化銦錫、氧化銻錫、 或摻鋁氧化鋅。 ,9.如申请專利範圍帛i項所述之紅外線低放射率塗料 •=形成方法,其中該助劑包括起始劑、矽烷偶聯劑、 分散劑、或架橋劑。 10.——種紅外線低放射率塗料,包括: 一曰黏結劑,係由1〇至3〇重量份之多元共聚物與兀至 重里份之雙鍵單體及丙烯酸酯接枝共聚而成;以及 10至30重量份之金屬填料、〇1至i重量份著色填料、 重量份之半導體填料、〇.5 i i重量份之助劑與ι〇〇 里里份之該黏結劑均勻混合。 鲁塗申請專利㈣第1G項所述之紅外線低放射率 人^ ’其中該多元共聚物包括EPDM、娜、或上述之混 塗料 埽、 12.如中請專利範圍第H)項所述之紅外線低放射率 ’其中該雙鍵單體包括苯乙烯、聚丁二稀、乙稀、丙 兩烯腈、或上述之組合。 3. Μ料職圍第1()項所狀紅特低放射率 烯萨甲::中該丙烯酸醋包括丙烯酸、甲基丙稀酸”旨、丙 甲酉曰、丙烯酸丁酯、丙烯酸己酯或上述之組合。 17 .201018714 14. 如申請專利範圍第10項所述之紅外線低放射率 塗料,其中該金屬填料包括片材鋁粉、還原性鐵粉、或銀 粉。 15. 如申請專利範圍第10項所述之紅外線低放射率 塗料,其中該著色填料包括金屬氧化物和氫氧化物、硫化 物、砸化物、無機鹽、及有機顏料。 16. 如申請專利範圍第10項所述之紅外線低放射率 塗料,其中該半導體填料包括氧化銦錫、氧化銻錫、或摻 ❿鋁氧化鋅。 Π.如申請專利範圍第10項所述之紅外線低放射率 塗料,其中該助劑包括起始劑、矽烷偶聯劑、潤濕分散劑、 或架橋劑。.201018714 X. Patent Application Range: 1. A method for forming an infrared low emissivity paint comprising: 10 to 30 parts by weight of a multicomponent copolymer, 70 to 90 parts by weight of a double bond monomer and an acrylate, and 0.1 to 0.3 parts by weight of the initiator is dissolved in 100 to 150 parts by weight of a solvent, and then heated to graft the double bond monomer and the acrylate to the multicomponent copolymer to form a binder; and 100 parts by weight of the binder The agent, 10 to 30 parts by weight of the metal filler, 0.1 to 1 part by weight of the colored filler, 5 to 10 parts by weight of the semiconductor filler, and 0.5 to 1 part by weight of the auxiliary agent are uniformly mixed to form an infrared low emissivity filler. 2. The method of forming an infrared low emissivity paint according to claim 1, wherein the multicomponent copolymer comprises EPDM, ABS, or a mixture thereof. 3. The method of forming an infrared low emissivity paint according to claim 1, wherein the initiator comprises an azo compound or a peroxide. 4. The method of forming the infrared low emissivity coating material according to claim 1, wherein the double bond monomer comprises styrene, polybutadiene, oxime, propylene, acrylonitrile, or a combination thereof. 5. The method for forming an infrared low emissivity paint according to claim 1, wherein the acrylate comprises acrylic acid, methacrylic acid, methyl acetonate, butyl acrylate, and acrylic acid S. Or a combination of the above. 6. The method of forming an infrared low emissivity paint according to claim 1, wherein the metal filler comprises a sheet aluminum powder, a reducing iron powder, or a silver powder. The method of forming an infrared low emissivity paint according to claim 1, wherein the colored filler comprises a metal oxide and a hydroxide, a sulfide, a selenide, an inorganic salt, and an organic pigment. 8. The method for forming an infrared low emissivity coating according to claim 1, wherein the semiconductor filler comprises indium tin oxide, antimony tin oxide, or aluminum-doped zinc oxide. 9. The method of forming an infrared low emissivity paint according to the scope of claim •i, wherein the auxiliary agent comprises a starter, a decane coupling agent, a dispersing agent, or a bridging agent. 10.-Infrared low emissivity coating, comprising: a bismuth binder, which is obtained by graft copolymerization of a multi-copolymer of 1 〇 to 3 重量 by weight with a double bond monomer and acrylate of hydrazine to heavy parts; And 10 to 30 parts by weight of the metal filler, 〇1 to i parts by weight of the colored filler, parts by weight of the semiconductor filler, 〇5 ii by weight of the auxiliaries and the ι 里 里Lu Tu application patent (4) The infrared low emissivity of the 1G item, wherein the multi-component copolymer comprises EPDM, Na, or the above-mentioned mixed paint 埽, 12. The infrared ray according to item H) Low emissivity 'where the double bond monomer comprises styrene, polybutylene, ethylene, propylene dienenitrile, or a combination thereof. 3. The content of red and low emissivity in the first and second paragraphs of the material category: the acrylic vinegar includes acrylic acid, methyl acrylate, propyl hydrazine, butyl acrylate, hexyl acrylate The infrared low emissivity paint according to claim 10, wherein the metal filler comprises a sheet aluminum powder, a reducing iron powder, or a silver powder. The infrared low emissivity paint according to item 10, wherein the coloring filler comprises a metal oxide and a hydroxide, a sulfide, a telluride, an inorganic salt, and an organic pigment. 16. As described in claim 10 The infrared low emissivity paint, wherein the semiconductor filler comprises indium tin oxide, antimony tin oxide, or antimony-doped aluminum zinc oxide. The infrared low emissivity paint according to claim 10, wherein the auxiliary agent comprises A starter, a decane coupling agent, a wetting and dispersing agent, or a bridging agent. 18 201018714 七、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明:無。 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: 無。18 201018714 VII. Designation of representative representatives: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None. 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: None.
TW97142641A 2008-11-05 2008-11-05 Infrared low-emmisive paint and method for manufacturing the same TWI382067B (en)

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