201018345 、 九、發明說明： ‘【發明所屬之技術領域】 ‘ 本發明涉及印刷電路板領域，尤其涉及一種電路板製 作方法及採用上述方法製作之電路板。 【先前技術】 •多層印刷電路板係由多於兩層之導電線路與絕緣材料 交替黏結於一起且層間導電線路按設計要求進行互連之印 ®刷電路板。多層印刷電路板因具有裝配密度高等優點而得 到廣泛應用，參見文獻 Takahashi，A. Ooki，N. Nagai，A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880，IEEE Trans, on Components, Packaging, and Manufacturing Technology，1992，15(4): 418-425。多層印刷電路板有硬 性、軟性、軟硬結合等多種類型。多層軟性電路板由於體 _積小、重量輕，可自由彎曲、捲繞或折疊等特點近來發展 迅速。 目前，多層電路板之製作一般採用傳統製作工藝。首 先，製作基板，於基板上製作出相應之導電線路及導孔； 其次，於基板製作有導電線路之表面壓合覆蓋層，以對導 電線路進行保護；再次，於保護層外壓合膠層與鋼H基板； 最後，於銅箔基板上形成外層電路，從而形成多層電路板。 然而’於上述多層電路板之製作過程中，需要經過多次之 壓合過程，壓合過程需要對壓合之產品施加高溫高壓，由 201018345 '於熱量由壓合產品之表面向内部擴散’因此，產品表面溫 度較高’而内部溫度相對較低，容易造成產品受熱不均。 另外，電路板中覆蓋層與膠層等由絕緣材料製成導電線 路通常由銅製成’絕緣材料與銅之導熱係數相差很大，亦 會導致產品受熱不均。於實際之電路板產品之壓合過程 中，容易因受熱不均而導致電路板產品之諸多㈣。例如， 可月匕由於電路板產品之局部溫度過高而導致電路板產品顏 ❹色發生變化’可能由於受熱不均造成之電路板產品之彎曲 ”翹曲’還可此為使電路板產品之内部達到需要之溫度而 需要較長之加熱時間；另外還可能由於受熱不均引起膠 層、覆蓋層線路表面結合不良，導致電路板產品於使用過 程中產生爆開，嚴重影響電路板信賴性。 【發明内容】 有鑑於此，有必要提供一種電路板製作方法，提高電 ❹路板產叩壓合過程中電路板產品受熱均勻程度以解決由 於壓合受熱不均而引起之諸多問題。 以下將以實施例說明一種電路板製作方法及採用上述 方法製作之電路板。 一種電路板製作方法，包括步驟：提供基板、覆蓋層 及=層，該基板包括產品區域與非產品區域；於基板之非 f °°區域形成複數沿產品區域延伸之第一熱交換槽，於覆 蓋層形成第二熱交換槽，於膠層形成第三熱交換槽，且使 第二熱交換槽、第三熱交換槽均與第一熱交換槽相對應； 201018345 -壓合膠層、覆蓋層與基板以形成電路板。 一種電路板，其包括基板、覆蓋層及膠層，該基板包 括產品區域與非產品區域，該非產品區域具有沿該產品區 域延伸之第一熱交換槽。該覆蓋層具有第二熱交換槽，該 膠層具有第三熱交換槽。該第二熱交換槽、第三熱交換槽 均與第一熱交換槽相對應，且該第一熱交換槽、第二熱交 換槽及第三熱交換槽相連通。 與先前技術相比，該電路板及電路板之製作方法由在 ®於電路板之各層設置熱交換槽，於電路板製作之壓合與烘 烤過程中可增加熱之產品與環境熱交換之面積，從而提高 熱擴散之速度，並且使得電路板各部分受熱均勻。因而， 上述電路板可避免局部溫度過高而導致電路板產品顏色發 生變化；亦可避免由於受熱不均造成電路板產品之彎曲與 翹曲；還可節省為使電路板產品内部達到需要之溫度而需 要之加熱時間；另外還可改善由於受熱不均引起膠層、覆 ϋ蓋層線路表面結合不良，導致電路板產品於使用過程中產 生爆開，嚴重影響電路板信賴性之問題。 【實施方式】 下面結合附圖及實施例對本技術方案提供之電路板製 作方法及電路板作進一步說明。 本技術方案施例提供之一種電路板製作方法，包括步 驟： 第一步，請一併參閱圖1、圖2及圖3,提供基板100、 8 201018345 -覆蓋層200及膠層300,基板100包括產品區域110與非產 品區域120。 多層電路板通常由至少一雙面線路板與至少一單面線 路板壓合而形成，因此，該用於製作多層電路板之基板1〇〇 可為單面覆銅基板，用於形成單面線路板；亦可為雙面覆 銅基板，用於形成雙面線路板，從而將所形成單面線路板 與雙面線路板壓合形成多層電路板。本實施例中，該基板 ❹100為雙面覆銅基板，用於形成後續用於構成多層電路板之 雙面線路板。 基板100包括產品區域110與非產品區域12〇β該產品 區域110上形成有導電線路、導通孔與金手指等結構，基 板100除產品區域11〇其他區域定義為非產品區域。本實 施例中’產品區域110包括第一部分ηι、第三部分113及 連接於第一部分111與第三部分113之間之第二部分112。 第一部分111與第三部分113平行，第二部分112垂直連 ❹接第一部分111與第三部分113。 電路板產品通常需要與其他元件進行插接，為了保護 電路板產品之端點及提供良好接通性能，於產品區域n〇 還包括兩個金手指區域114’其中一個金手指區域114連接 於第一部分111遠離第二部分112之一端，另一個金手指 區域114連接於第三部分113遠離第二部分112之一端。 覆蓋層200用於貼合於電路板工作區域之表面，以保 護電路板產品。覆蓋層200為片狀結構，其對應於基板ι〇〇 之兩個金手指區域114之位置開設有兩個開口 201，兩個開 9 201018345 -口 2〇1形狀與兩個金手指區域in形狀相同。 • 膠層30.0通常為半固化片（Prepreg)，即指將玻璃纖維 或者其他纖維等補強材料含浸於液態樹脂中，經加熱液態 樹脂以始液態樹脂部分聚合而形成處於半固化狀態之片狀 材料。 第二步，於基板100之非產品區域120形成沿產品區 域110延伸之第一熱交換槽121，於覆蓋層200形成第二熱 ❹交換槽202，於膠層300形成第三熱交換槽30X，且使第二 熱交換槽202、第三熱交換槽3〇1均與第一熱交換槽121 相對應。 第一熱交換槽121用於將基板1〇〇於壓合形成電路板 時’便將熱量藉由第一熱交換槽121傳遞到基板1〇〇之内 部，從而使得基板1〇〇之產品區域n〇具有較快升溫速度 並受熱均勻。該第一熱交換槽121設置於非產品區域12〇 靠近產品區域11〇之位置，且第一熱交換槽121貫穿基板 ❿100。第一熱父換槽121可位於產品區域no之一侧或者兩 側。第一熱交換槽121之形狀不限，可依具體產品區域11〇 之形狀而定。一般地，其可為沿產品區域11〇長度方向之 長條形開口，亦可為沿產品區域11〇之長度方向依次排列 之複數通孔。本實施例中，第一熱交換槽121包括第一基 板槽1211、第二基板槽1212、第三基板槽1213、第四基板 槽1214與第五基板槽1215。第一基板槽1211與第二基板 槽1212分別位於第一部分ln之相對兩側。第一基板槽 1211與第二基板槽1212之延伸方向基本平行於第一部分 201018345 -Ill之長度方向，第一基板槽1211與第二基板槽1212之長 度基本等於第一部分111之長度。第三基板槽1213位元於 重 第二部分112遠離第一部分111與第二部分113之一側， 且其長度方向基本平行於第二部分112之長度方向。第四 基板槽1214與第五基板槽1215分別位元於第三部分113 之相對兩侧，且第四基板槽1214與第五基板槽1215之延 伸方向基本平行於第三部分113之長度方向，第四基板槽 1214與第五基板槽1215之長度基本等於第三部分113之長 度。並且，第一基板槽1211、第二基板槽1212、第三基板 槽1213、第四基板槽1214與第五基板槽1215不相連通。 本實施例中，第一基板槽1211、第二基板槽1212、第 三基板槽1213、第四基板槽1214與第五基板槽1215均為 鋸齒狀開口。這樣，於進行壓合時可使第一熱交換槽121 具有較大之空間與外界進行熱交換，從而進一步提高壓合 過程中熱之傳遞速度與均勻程度。當然，第一基板槽1211、 φ第二基板槽1212、第三基板槽1213、第四基板槽1214與 第五基板槽1215亦可為波浪形開口、矩形開口或其他形狀 之開口。 為保證於電路板製作過程中基板100之剛性並能起到 熱交換作用，第一熱交換槽121寬度之D為0.1毫米至1 毫米之間，為保證第一熱交換槽121於壓合過程中之熱交 換作用且不損傷產品區域110,第一熱交換槽121與產品區 域110之間之距離較佳為1毫米至1釐米之間。 當然，於形成第一熱交換槽121之前或之後，可於基 11 201018345 • 板100上之產品區域110藉由影像轉移及蝕刻工序形成導 電線路，並製作導通孔及\或其他相應結構。另外，第一熱 « 交換槽121可藉由衝型或者雷射切割形成。 請參閱圖5，本實施例中，採用衝型或雷射切割之方式 於覆蓋層200形成與第一熱交換槽121相對應之第二熱交 換槽202。第二熱交換槽202包括第一覆蓋層槽2021、第 二覆蓋層槽2022、第三覆蓋層槽2023、第四覆蓋層槽2024 與第五覆蓋層槽2025，其中，第一覆蓋層槽2021與第一基 ®板槽1211相對應，第二覆蓋層槽2022與第二板槽1212相 對應，第三覆蓋層槽2023與第三基板槽1213相對應，第 四覆蓋層槽2024與第四基板槽1214相對應，第五覆蓋層 槽2025與第五基板槽1215相對應。 請參閱圖6,藉由衝型或雷射切割之方式，於膠層300 内形成與第一熱交換槽121相對應之第三熱交換槽301。第 三熱交換槽3011包括第一膠層槽3011、第二膠層槽3012、 ^第三膠’層槽3013、第四膠層槽3014與第五膠層槽3015。 其中，第一膠層槽3011與第一基板槽1211相對應，第二 膠層槽3012與第二基板槽1212相對應，第三膠層槽3013 與第三基板槽1213相對應，第四膠層槽3014與第四基板 槽1214相對應，第五膠層槽3015與第五基板槽1215相對 應。 第三步，堆疊並壓合膠層300、覆蓋層200及基板100， 以形成電路板400，並使第一熱交換槽121、第二熱交換槽 202及第三熱交換槽301對應連通。 12 201018345 - 首先，按照實際電路板產品之需要，將一定數量之膠 層300、覆蓋層200與基板100進行堆疊，並使得設置於它 瓠 們内部之熱交換槽相連通，從而獲得單面、雙面或者多層 之電路板400。請參閱圖8，本實施例中，堆疊三個基板 100、兩個覆蓋層200以及兩個膠層300，並使得每一個覆 蓋層200與膠層300均位於兩個基板100之間，以待形成 一個多層之電路板400。並且，三個基板100之第一熱交換 槽121、兩個覆蓋層200之第二熱交換槽202以及兩個膠層 ® 300之第三熱交換槽301相對應，以待形成熱交換區域 401，以便於進行基板100、覆蓋層200與膠層300之間之 熱量交換。於上述之堆疊過程中，可藉由於膠層300、覆蓋 層200與基板100之對應位置設置對位孔，從而保證於疊 板過程中對位之精度，確保各熱交換槽相互重疊。 其次，壓合堆疊後之兩個膠層300、兩個覆蓋層200 與三個基板100，形成多層之電路板400。壓合一般藉由對 ❹膠層300、覆蓋層200與基板100進行加熱加壓實現。由於 膠層300與覆蓋層200均由機樹脂等材料製成，於對膠層 300、覆蓋層200與基板100加熱時，使膠層300與覆蓋層 200中之有機樹脂等材料發生相轉化，從而產生形變與黏 性，使得壓合後膠層300、覆蓋層200與基板100形成一體， 從而形成多層之電路板400。本實施例中，電路板400具有 熱交換區域401，熱交換區域401由基板100之第一熱交換 槽121、覆蓋層200之第二熱交換區域201、膠層300之第 三熱交換區域301對應連通而形成，用於進行基板100、覆 13 201018345 - 蓋層200與膠層300之間之熱交換。從而壓合時，熱量不 僅由電路板400之外表面向電路板400内部擴散，亦藉由 每個熱交換區域401向電路板400内部擴散。上述之電路 板400可避免局部溫度過高而導致電路板產品顏色發生變 化；亦可避免由於受熱不均造成電路板產品彎曲與翹曲； 還可節省為使電路板400產品内部達到需要溫度而需要之 加熱時間；另外還可改善由於受熱不均引起膠層300、覆蓋 層200表面結合不良，導致電路板產品於使用過程中產生 爆開，嚴重影響電路板信賴性之問題。 另外，為對電路板400最外層之基板100之產品區402 進行保護，可於電路板400表面壓合保護層。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 ^應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之用於製作電路板之基 板之示意圖。 圖2係本技術方案實施例提供之用於製作電路板之覆 蓋層之示意圖。 圖3係本技術方案實施例提供之用於製作電路板之膠 層之示意圖。 圖4係本技術方案實施例提供之用於製作電路板之基 201018345 板形成第一熱交換槽後之示意圖。 圖5係本技術方案實施例提供之用於製作電路板之覆 蓋層形成第二熱交換槽後之示意圖。 圖6係本技術方案實施例提供之用於製作電路板之膠 層形成第三熱交換槽後之示意圖。 圖7係本技術方案實施例製作之電路板之示意圖。 圖8係圖7沿VIII-VIII線之剖面圖。 【主要元件符號說明】 基板 100 產品區域 110 非產品區域 120 第一部分 111 第二部分 112 第三部分 113 金手指區域 114 第一熱交換槽 121 第一基板槽 1211 第二基板槽 1212 第三基板槽 1213 第四基板槽 1214 第五基板槽 1215 覆蓋層 200 開口 201 15 201018345201018345, IX, invention description: ‘[Technical field to which the invention pertains] ‘ The present invention relates to the field of printed circuit boards, and more particularly to a method of manufacturing a circuit board and a circuit board produced by the above method. [Prior Art] • A multilayer printed circuit board is a printed circuit board in which two or more layers of conductive lines and insulating materials are alternately bonded together and the interlayer conductive lines are interconnected as designed. Multilayer printed circuit boards are widely used due to their high assembly density, see literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed Circuit board for HITAC M-880, IEEE Trans, on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425. Multilayer printed circuit boards are available in a variety of types including hard, soft, soft and hard. Multi-layer flexible circuit boards have recently developed rapidly due to their small volume, light weight, and the ability to bend, wind, or fold freely. At present, the fabrication of multilayer circuit boards generally uses a conventional manufacturing process. First, the substrate is fabricated, and the corresponding conductive lines and via holes are formed on the substrate. Secondly, the surface of the substrate is formed with a conductive line to press the cover layer to protect the conductive line; again, the adhesive layer is pressed outside the protective layer. And the steel H substrate; finally, an outer layer circuit is formed on the copper foil substrate to form a multilayer circuit board. However, in the manufacturing process of the above multilayer circuit board, it is necessary to undergo a plurality of pressing processes, and the pressing process needs to apply high temperature and high pressure to the pressed product, and the heat is diffused from the surface of the pressed product to the inside by 201018345. The product has a high surface temperature and the internal temperature is relatively low, which is likely to cause uneven heating of the product. In addition, the conductive layer made of insulating material such as the cover layer and the adhesive layer in the circuit board is usually made of copper. The thermal conductivity of the insulating material and copper differ greatly, which may also cause uneven heating of the product. In the process of pressing the actual circuit board products, it is easy to cause many circuit board products due to uneven heating (4). For example, the mooncake may change the color of the board product due to the local temperature of the board product being too high. 'The bending of the board product may be caused by uneven heating.' The internal heating time is required to reach the required temperature; in addition, the surface of the adhesive layer and the cover layer may be poorly coupled due to uneven heating, which may cause the circuit board product to burst during use, which seriously affects the reliability of the circuit board. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a method for manufacturing a circuit board, which improves the uniformity of heat dissipation of a circuit board product during the process of pressing and pressing the electric circuit board to solve various problems caused by uneven heating of the press. A circuit board manufacturing method and a circuit board manufactured by the above method are described by way of an embodiment. A circuit board manufacturing method includes the steps of: providing a substrate, a cover layer and a = layer, the substrate comprising a product area and a non-product area; The f °° region forms a plurality of first heat exchange grooves extending along the product region, forming a second layer in the cover layer The exchange tank forms a third heat exchange tank in the glue layer, and the second heat exchange tank and the third heat exchange tank correspond to the first heat exchange tank; 201018345 - press-bonding the glue layer, the cover layer and the substrate to form a circuit A circuit board comprising a substrate, a cover layer and a glue layer, the substrate comprising a product area and a non-product area, the non-product area having a first heat exchange groove extending along the product area. The cover layer has a second heat exchange a groove, the rubber layer has a third heat exchange groove. The second heat exchange groove and the third heat exchange groove respectively correspond to the first heat exchange groove, and the first heat exchange groove, the second heat exchange groove and the third The heat exchange tanks are connected to each other. Compared with the prior art, the circuit board and the circuit board are manufactured by setting heat exchange grooves on the layers of the circuit board, and adding heat during the press-bonding and baking process of the circuit board fabrication. The area of heat exchange between the product and the environment, thereby increasing the speed of heat diffusion and making the various parts of the circuit board evenly heated. Therefore, the above circuit board can avoid the local temperature being too high and causing the color of the circuit board product to change; It can also avoid bending and warping of the circuit board product due to uneven heating; it can also save the heating time required to achieve the required temperature inside the circuit board product; in addition, it can also improve the rubber layer and cover due to uneven heating. The surface of the cover layer is poorly coupled, which causes the circuit board product to burst during use, which seriously affects the reliability of the circuit board. [Embodiment] The circuit board manufacturing method and circuit provided by the technical solution are described below with reference to the accompanying drawings and embodiments. The board is further described. The method for manufacturing a circuit board provided by the embodiment of the technical solution includes the following steps: First, please refer to FIG. 1 , FIG. 2 and FIG. 3 together to provide the substrate 100 , 8 201018345 - the cover layer 200 and the glue The substrate 100 includes a product region 110 and a non-product region 120. The multilayer circuit board is generally formed by pressing at least one double-sided circuit board and at least one single-sided circuit board, and thus, the substrate 1 for manufacturing the multilayer circuit board 〇〇 can be a single-sided copper-clad substrate for forming a single-sided circuit board; or a double-sided copper-clad substrate for forming a double-sided circuit board, thereby forming a shape The single-sided circuit board is pressed together with the double-sided circuit board to form a multilayer circuit board. In this embodiment, the substrate ❹100 is a double-sided copper-clad substrate for forming a double-sided circuit board for subsequently forming a multilayer circuit board. The substrate 100 includes a product region 110 and a non-product region 12〇. The product region 110 is formed with a conductive line, a via hole, and a gold finger. The substrate 100 is defined as a non-product region except for the product region 11 . The 'product area 110' in this embodiment includes a first portion ηι, a third portion 113, and a second portion 112 connected between the first portion 111 and the third portion 113. The first portion 111 is parallel to the third portion 113, and the second portion 112 is vertically coupled to the first portion 111 and the third portion 113. The board product usually needs to be plugged with other components. In order to protect the end of the board product and provide good connection performance, the product area n〇 also includes two gold finger regions 114'. One of the gold finger regions 114 is connected to the first One portion 111 is remote from one end of the second portion 112 and the other gold finger region 114 is coupled to the third portion 113 away from one end of the second portion 112. The cover layer 200 is intended to conform to the surface of the board's working area to protect the board product. The cover layer 200 is a sheet-like structure, and two openings 201 are opened corresponding to the positions of the two gold finger regions 114 of the substrate ι, two open 9 201018345 - 2 〇 1 shape and two gold finger regions in shape the same. • The adhesive layer 30.0 is usually a prepreg, which means that a reinforcing material such as glass fiber or other fiber is impregnated into the liquid resin, and the liquid resin is heated to partially polymerize the liquid resin to form a sheet-like material in a semi-cured state. In the second step, a first heat exchange groove 121 extending along the product region 110 is formed in the non-product region 120 of the substrate 100, a second heat exchange groove 202 is formed in the cover layer 200, and a third heat exchange groove 30X is formed on the adhesive layer 300. And the second heat exchange tank 202 and the third heat exchange tank 3〇1 are both corresponding to the first heat exchange tank 121. When the first heat exchange groove 121 is used to press the substrate 1 to form a circuit board, heat is transferred to the inside of the substrate 1 through the first heat exchange groove 121, so that the product area of the substrate 1 is N〇 has a faster heating rate and is evenly heated. The first heat exchange groove 121 is disposed at a position other than the product region 11A of the non-product region 12, and the first heat exchange groove 121 penetrates the substrate ❿100. The first hot parent change slot 121 may be located on one side or both sides of the product area no. The shape of the first heat exchange groove 121 is not limited and may depend on the shape of the specific product area 11〇. Generally, it may be an elongated opening in the longitudinal direction of the product region 11 or a plurality of through holes arranged in the longitudinal direction of the product region 11A. In this embodiment, the first heat exchange groove 121 includes a first substrate groove 1211, a second substrate groove 1212, a third substrate groove 1213, a fourth substrate groove 1214, and a fifth substrate groove 1215. The first substrate slot 1211 and the second substrate slot 1212 are respectively located on opposite sides of the first portion ln. The extending direction of the first substrate slot 1211 and the second substrate slot 1212 is substantially parallel to the length direction of the first portion 201018345-I11, and the lengths of the first substrate slot 1211 and the second substrate slot 1212 are substantially equal to the length of the first portion 111. The third substrate groove 1213 is located on the side of the second portion 112 away from the first portion 111 and the second portion 113, and its length direction is substantially parallel to the length direction of the second portion 112. The fourth substrate slot 1214 and the fifth substrate slot 1215 are respectively located on opposite sides of the third portion 113, and the extending directions of the fourth substrate slot 1214 and the fifth substrate slot 1215 are substantially parallel to the length direction of the third portion 113. The length of the fourth substrate groove 1214 and the fifth substrate groove 1215 is substantially equal to the length of the third portion 113. Further, the first substrate groove 1211, the second substrate groove 1212, the third substrate groove 1213, and the fourth substrate groove 1214 are not in communication with the fifth substrate groove 1215. In this embodiment, the first substrate groove 1211, the second substrate groove 1212, the third substrate groove 1213, the fourth substrate groove 1214, and the fifth substrate groove 1215 are both serrated openings. Thus, the first heat exchange tank 121 can have a large space for heat exchange with the outside during press-bonding, thereby further increasing the heat transfer speed and uniformity during the press-fitting process. Of course, the first substrate slot 1211, the φ second substrate slot 1212, the third substrate slot 1213, the fourth substrate slot 1214, and the fifth substrate slot 1215 may also be wavy openings, rectangular openings, or other shaped openings. In order to ensure the rigidity of the substrate 100 during the manufacturing process of the circuit board and to perform heat exchange, the width D of the first heat exchange groove 121 is between 0.1 mm and 1 mm, in order to ensure the first heat exchange groove 121 during the pressing process. The heat exchange effect does not damage the product region 110, and the distance between the first heat exchange groove 121 and the product region 110 is preferably between 1 mm and 1 cm. Of course, before or after the first heat exchange groove 121 is formed, the conductive line can be formed by the image transfer and etching process on the product area 110 on the substrate 10 201018345 • the board 100, and the via holes and/or other corresponding structures can be fabricated. In addition, the first heat «exchange groove 121 may be formed by punching or laser cutting. Referring to FIG. 5, in the embodiment, a second heat exchange groove 202 corresponding to the first heat exchange groove 121 is formed in the cover layer 200 by punching or laser cutting. The second heat exchange groove 202 includes a first cover layer groove 2021, a second cover layer groove 2022, a third cover layer groove 2023, a fourth cover layer groove 2024 and a fifth cover layer groove 2025, wherein the first cover layer groove 2021 Corresponding to the first base plate groove 1211, the second cover groove 2022 corresponds to the second plate groove 1212, the third cover groove 2023 corresponds to the third substrate groove 1213, and the fourth cover groove 2024 and the fourth cover The substrate groove 1214 corresponds to the fifth cover groove 2025 corresponding to the fifth substrate groove 1215. Referring to FIG. 6, a third heat exchange groove 301 corresponding to the first heat exchange groove 121 is formed in the glue layer 300 by punching or laser cutting. The third heat exchange tank 3011 includes a first glue layer groove 3011, a second glue layer groove 3012, a third glue layer groove 3013, a fourth glue layer groove 3014, and a fifth glue layer groove 3015. The first glue layer groove 3011 corresponds to the first substrate groove 1211, the second glue layer groove 3012 corresponds to the second substrate groove 1212, and the third glue layer groove 3013 corresponds to the third substrate groove 1213, and the fourth glue The layer groove 3014 corresponds to the fourth substrate groove 1214, and the fifth glue layer groove 3015 corresponds to the fifth substrate groove 1215. In the third step, the adhesive layer 300, the cover layer 200, and the substrate 100 are stacked and laminated to form the circuit board 400, and the first heat exchange groove 121, the second heat exchange groove 202, and the third heat exchange groove 301 are connected to each other. 12 201018345 - First, according to the needs of the actual circuit board products, a certain number of glue layers 300, cover layers 200 and the substrate 100 are stacked, and the heat exchange grooves disposed inside them are connected to obtain a single-sided, A double-sided or multi-layered circuit board 400. Referring to FIG. 8 , in the embodiment, three substrates 100 , two cover layers 200 , and two adhesive layers 300 are stacked, and each cover layer 200 and the adhesive layer 300 are located between the two substrates 100. A multilayer circuit board 400 is formed. Moreover, the first heat exchange groove 121 of the three substrates 100, the second heat exchange grooves 202 of the two cover layers 200, and the third heat exchange grooves 301 of the two glue layers 3.0 correspond to form the heat exchange region 401. In order to facilitate heat exchange between the substrate 100, the cover layer 200 and the glue layer 300. In the above-mentioned stacking process, the alignment holes can be provided by the corresponding positions of the adhesive layer 300, the cover layer 200 and the substrate 100, thereby ensuring the alignment accuracy during the lamination process, and ensuring that the heat exchange grooves overlap each other. Next, the stacked two adhesive layers 300, the two cover layers 200 and the three substrates 100 are laminated to form a multilayer circuit board 400. Press bonding is generally achieved by heating and pressurizing the silicone layer 300, the cover layer 200, and the substrate 100. Since the adhesive layer 300 and the cover layer 200 are both made of a material such as a resin, when the adhesive layer 300, the cover layer 200, and the substrate 100 are heated, the adhesive layer 300 and the organic resin in the cover layer 200 are phase-converted. Thereby, the deformation and the adhesiveness are generated, so that the adhesive layer 300 and the cover layer 200 are integrated with the substrate 100 after the pressing, thereby forming the multilayer circuit board 400. In this embodiment, the circuit board 400 has a heat exchange area 401. The heat exchange area 401 is composed of a first heat exchange groove 121 of the substrate 100, a second heat exchange area 201 of the cover layer 200, and a third heat exchange area 301 of the glue layer 300. Formed correspondingly for communication, for performing heat exchange between the substrate 100, the cover 13 201018345 - the cover layer 200 and the adhesive layer 300. Therefore, heat is diffused not only from the outer surface of the circuit board 400 to the inside of the circuit board 400 but also to the inside of the circuit board 400 by each heat exchange region 401. The circuit board 400 can avoid the local temperature being too high and cause the color of the circuit board product to change; and avoid bending and warping of the circuit board product due to uneven heating; and saving the required temperature inside the circuit board 400 product. The heating time is required; in addition, the surface bonding of the adhesive layer 300 and the cover layer 200 due to uneven heating may be improved, which may cause the circuit board product to explode during use, which seriously affects the reliability of the circuit board. In addition, in order to protect the product area 402 of the substrate 100 of the outermost layer of the circuit board 400, the protective layer can be pressed on the surface of the circuit board 400. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a substrate for fabricating a circuit board provided by an embodiment of the present technical solution. 2 is a schematic diagram of a cover layer for fabricating a circuit board provided by an embodiment of the present technical solution. FIG. 3 is a schematic diagram of a glue layer for fabricating a circuit board provided by an embodiment of the present technical solution. 4 is a schematic diagram of a substrate for manufacturing a circuit board provided by an embodiment of the present technical solution. The 201018345 board forms a first heat exchange slot. FIG. 5 is a schematic diagram of the cover layer for fabricating a circuit board provided in the embodiment of the present technical solution to form a second heat exchange groove. FIG. 6 is a schematic diagram of the adhesive layer for fabricating a circuit board provided in the embodiment of the present technical solution to form a third heat exchange groove. FIG. 7 is a schematic diagram of a circuit board fabricated by the embodiment of the present technical solution. Figure 8 is a cross-sectional view taken along line VIII-VIII of Figure 7. [Main component symbol description] Substrate 100 Product area 110 Non-product area 120 First part 111 Second part 112 Third part 113 Gold finger area 114 First heat exchange groove 121 First substrate groove 1211 Second substrate groove 1212 Third substrate groove 1213 fourth substrate slot 1214 fifth substrate slot 1215 cover layer 200 opening 201 15 201018345
第二熱交換槽 202 第一覆蓋層槽 2021 第二覆蓋層槽 2022 第三覆蓋層槽 2023 第四覆蓋層槽 2024 第五覆蓋層槽 2025 膠層 300 第三熱交換槽 301 第一膠層槽 3011 第二膠層槽 3012 第三膠層槽 3013 第四膠層槽 3014 第五膠層槽 3015 電路板 400 熱交換區域 401 產品區 402 16Second heat exchange tank 202 first cover layer groove 2021 second cover layer groove 2022 third cover layer groove 2023 fourth cover layer groove 2024 fifth cover layer groove 2025 glue layer 300 third heat exchange groove 301 first glue layer groove 3011 second adhesive layer slot 3012 third adhesive layer slot 3013 fourth adhesive layer slot 3014 fifth adhesive layer slot 3015 circuit board 400 heat exchange area 401 product area 402 16