TW201017331A - Photosensitive resin composition and sealant - Google Patents

Abstract

Problem to be solved: To provide a photosensitive resin composition and sealant with both good hydrofluoric acid resistance and permeability. Solution: The photosensitive resin composition of the present invention comprises: end (methyl) acrylate oligomer (A), one or more types of monomers (B) selected from the group consisting of a monomer (b1) expressed by a formula (1) and a monomer (b2) expressed by a formula (2), and a photopolymerization initiator (C). In the formula (1), A has cyclic amido or cyclic imido; nitrogen atoms are bonded with the residue of the formula (1); R1, R1' and R2 independently represent a hydrogen atom or methyl; and a and b independently represent an integer selected from 1 and 3. In the formula (2), R3 represents a hydrogen atom or methyl; B represents alkylene with its single bond or carbon number between 1 and 5; and R4 represents a residue formed by removing one hydrogen atom from a carbon atom bonded with monocyclic or polycyclic lactone compound.

Description

201017331 VI. Description of the Invention: [Technical Field of Invention + κ, - genus] The present invention relates to a photosensitive resin composition and a sealant. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A display device such as a display panel is also required to be thinned. In order to reduce the thickness of the device, a method of bonding a thin glass to manufacture a glass panel, and a method of physically or chemically thinning a glass portion after manufacturing a glass panel are discussed. In the case where a thin glass is bonded to a glass panel, the thickness of the thin glass used is generally low because it is considered to be insufficient in the process. Therefore, there has been proposed a method of thinning the thickness of glass by laminating or etching a glass surface by laminating glass of a usual thickness to produce a glass panel. (Patent Documents 1 to 3), ......................................... The above-mentioned grinding method of the glass surface, there is physical by grinding or the like Grinding method and chemical grinding method (money engraving) using hydrofluoric acid, etc., based on the ability to easily ............................. . . . The reason for controlling the thickness of the glass with sufficient strength and the ability to perform the continuous processing, etc., is widely used using a residual layer of hydroxy acid or the like. However, when etching with hydrofluoric acid, if the glass panel is immersed in the etching solution, the engraved liquid will enter the interior of the Boma panel and cause various kinds of defects. . . . . . . . . . . . . 1 ... The case reveals that a stalk prevents the intrusion of such etchant. - · - faint... - - ....................... .... :. . . seal agent (Patent Document 4). 201017331 [Patent Document 1] Japanese Patent No. 2722798 [Specialist Document 2] Japanese Patent Laid-Open No. 4_7664 No. . . . . . . . . . . . . . .

[Patent Document 3] Japanese Patent Laid-Open Publication No. Hei. No. 4-317981 (Patent Document 4). 。 。 。 。 。 。 φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ φ The sealant comprising: an oligomer (A) obtained by reacting an epoxy resin (a) having an epoxy equivalent of 400 to 2500 eq/g and a monocarboxylic acid (a2) containing an ethylenically unsaturated group, The compound (B) containing an ethylenic acid group other than the component (A) and the photopolymerization initiator (C)» here must be used in order to ensure the affinity for the use of argon fluoride acid. The high viscosity resin composition acts as a sealant. In recent years, due to the demand for a thinner display device, it is required to increase the etching time and the accuracy of the etching amount. However, if the viscosity of the sealant v before the sealant is applied to the glass panel with a narrow gap, it must be long and dense in order to penetrate into the gap of the glass panel. . . . . . . . . . . . . The sealant has poor permeability to the gap and cannot penetrate completely into the inner sealant. ...... . . . .. .... ... ... ... 'In the case of the glass surface, the outer side of the board. The bulge and the convex shape of the bulge. Therefore, after the etching, the p-convex bulge is thicker than the glass panel and has a glass. ' : ' . . ' . . . \ \ 昏 + + + The panel is damaged. Therefore, it is a sealant that requires low viscosity and excellent permeability to the gap, but the low-viscosity sealant has the disadvantages of low molecular weight, low resistance to chlorofluoro acid P and 'when the solvent is used for viscosity adjustment, 201017331 (4) The low density of the product will have the problem of softening the hydrogen fluoride resistance when the problem is softened. The present invention has been made in view of the above-mentioned problem (4), and an object thereof is to provide a photosensitive resin composition having excellent hydrogen (tetra) (four) good permeability and a sealant using the photosensitive resin composition. [Technical means for solving the problem] The present inventors have found that the present invention can be solved by solving the above problems by using a specific monomer component. Specifically, the present invention provides the following. (1) The present invention provides a photosensitive resin composition comprising: a terminal (meth) acrylate oligomer (human), a monomer (bl) selected from the following formula (1), and One or more kinds of monomers (B) composed of the monomer (b2) represented by the formula (2), and a photopolymerization initiator (c). R1· 〇

(1) ......................... (wherein A represents a cyclic guanamine group or a cyclic oxime imine group, and the nitrogen atom system and formula The group of the residue bond in (1), R1, R1. and ^ are independently a hydrogen atom or a methyl group, and the aAb is an integer representing 丨~3 independently. ) , . . . . R3. (2) (2) 201017331 (wherein R3 represents a hydrogen atom or a methyl group, and B represents a single bond or a stretching group having a carbon number of 1 to 5'. R means that one bond is bonded to a single ring. a residue formed by a hydrogen atom on a carbon atom of a cyclic or internal cyclic vinegar compound). (2) Further, the present invention provides a sealant obtained by using the above-mentioned photosensitive resin composition. [Efficacy] The photosensitive resin composition of the present invention has excellent hydrofluoric resistance and has a lower viscosity than the conventional resin composition for a sealant. Therefore, the convex bulging which is excellent in permeability and applied to the outer peripheral portion of the glass panel can reduce the possibility of breakage when the glass panel is thinned. Further, it is possible to achieve an effect of preventing degradation of hydrogen fluoride resistance during hardening. [Embodiment] Hereinafter, embodiments of the present invention will be described. ... . . . . : The photosensitive resin composition of the present invention contains an oligomer (A), a single . . . . . . . body (B) and a photopolymerization-initiated sword (C). Further, any component as described later can be contained, and each component will be described below. . . . . . . . . . . (End-end (meth) acrylate oligomer (A)> The end contained in the photosensitive resin composition of the present invention (A) The acrylate oligomer (A) "hereinafter, also referred to as component (A)", can be appropriately selected from the group consisting of CH2=CHC00-group or CH2=CCH3C00-group at the terminal of the oligomer. In the present invention, for example, an oligomer obtained by reacting an epoxy resin (al) with a monobasic acid (a2) containing a vinyl group of 201017331 is preferred. By containing such a component (A), it is possible to achieve excellent hydrofluoric acid resistance and water resistance, and to impart appropriate elongation and hardness to the cured product obtained by curing the photosensitive resin composition. The components constituting the component (A) are as follows. [Epoxy Resin (al)] Examples of the epoxy resin (hereinafter also referred to as "(al) component") include bisphenol A type epoxy resin, bisphenol f type epoxy resin, and double type. Cyclooxygen, N,N-diepoxypropyl-indole-toluidine, n,N-diepoxypropylaniline, resorcinol diepoxypropyl ether, hydrazine, 6-hexanediol Di-epoxypropyl ether, dimethylolpropane tricyclodecyl propyl ether, polypropylene glycol diepoxypropyl ether, hexahydrophthalic anhydride diepoxypropyl ester, and the like. Among them, bisphenol A type epoxy resin and bisphenol F type epoxy resin are preferred, and bisphenol A type epoxy resin is particularly preferred. These epoxy resins may be used singly or in combination of plural kinds. [Vinyl group-containing monocarboxylic acid (a2)] As the vinyl group-containing monocarboxylic acid (hereinafter also referred to as (a2) component), for example, (mercapto)acrylic acid, or saturated or not A reaction of a saturated dibasic acid with a vinyl-containing monoepoxypropyl compound. Examples of the (meth)acrylic acid include acrylic acid, methacrylic acid, cold styrene-acrylic acid, s-mercapto-acrylic acid, saturated or unsaturated dibasic acid anhydride, and one molecule. a molar reaction of a (meth)acrylic acid vinegar derivative having one hydroxyl group, that is, a half ester, a saturated or unsaturated dibasic acid, and a monoglycidyl (meth)acrylate derivative. The molar reactants are also semi-esters. ... . . . . . . . . . . As a saturated or unsaturated binary 201017331 acid anhydride used in the manufacture of the above-mentioned half vinegar, it is exemplified by succinic anhydride, cis. Succinic anhydride, acid anhydride, hydroquinone anhydride, hexahydrophthalic anhydride, mercapto hexahydrophthalic anhydride, mercapto tetrahydrofurfuryl anhydride, iconic acid, methyl endomethylene tetrahydro ugly acid liver, and the like. Further, the (meth) acrylate derivative having a hydroxyl group of 1 γ 〃 右 in one molecule may, for example, be 2-hydroxyethyl (meth)acrylate or 2-(meth)acrylic acid 2-(meth)acrylate Sodium sulfonate, 4-hydroxybutyl (meth) acrylate, polyethylene glycol mono(methyl) acrylate, glycerol bis(indenyl) acrylate, methacrylic acid (fluorenyl) hydrazine Acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(methyl) acrylate vinegar, phenyl epoxidized propyl ether (meth) acrylate, and the like. Further, 'saturated or unsaturated diterpene acid used for producing the above-mentioned half esters may, for example, be succinic acid, maleic acid, adipic acid, decanoic acid, tetrahydrofurfuric acid or hexahydrofuric acid. , itaconic acid, fumaric acid, and the like. Further, the (meth)acrylic acid monoglycidyl ester derivative may, for example, be a (meth)acrylic acid glycidyl ester (a2) component, and may be used singly or in combination. Techunchun's (a2) component (mercapto) acrylic acid. The component (A) can be obtained by reacting the component (a1) with the component (a2). This synthesis reaction can be carried out by a generally known method. For example, by adding a predetermined equivalent ratio of acryl or mercapto acrylic acid, a catalyst (for example, benzyl dimethylamine, triethylamine, vaporized benzyl triammonium ammonium, .... . . . . triphenylphosphine, triphenylstibine and polymerization inhibitors (eg . . . . . . . . . . . . me thoqui none, hydrogen brewing, sulfhydryl Hydrogen, 0, butyl, dibutyl, phenyl, etc., and, for example, reacted at ~11 〇C to obtain component (A). The molecular weight of the synthesized component (A) is thus obtained. It is preferably 300 to 6 Å, and 201017 331 is preferably 500 to 3,000. By having such a molecular weight, the component (A) can have excellent hydrogen fluoride resistance and water resistance and an appropriate viscosity. . . . In the case of the adhesion improvement, the component (A) has a hydroxyl group as a ruthenium. Further, as a commercial product corresponding to the component (A), EBECRYL 600, EBECRYL 605, EBECRYL 645, EBECRYL 648, EBECRYL 860, EBECRYL 606, EBECRYL 3105, EBECRYL 3213 can be cited. ,EBECRYL3420, EBECRYL3500, EBECRYL3608, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRY Epoxy acrylate vinegar such as L3703, EBECRYL3708, EBECRYL6040 _, etc.; (meth)acrylic acid acrylate such as EBECRYL303, EBECRYL740-40TP, EBECRYL745, EBECRYL767 'EBECRYL1200; (any one is manufactured by DAICEL-CYTEC). A polyester-based (meth) acrylate such as CNUVE 151 (manufactured by SARTOMER Co., Ltd.), etc. The content of the component (A) is preferably 15 to 60% by mass, and preferably 17 to 50% by mass based on the photosensitive resin composition. % is preferably in the range of 20 to 40% by mass. The permeability of the precursor resin composition is improved by the upper limit or less, and the hydrofluoric acid resistance is improved by the lower limit or more. ... . . . . . . . . . Also, by the above range, the water resistance is improved and can be imparted to the hard ..... Appropriate extensibility and the effect of hardness. ... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..... . . . . . . The monomer contained in the photosensitive resin composition of the present invention (hereinafter also referred to as . . . . . . . . . . . ... is called (B) component), is selected from the following formula (1) The monomer (bl) and the lower................................................... . . . One or more of the groups consisting of the monomers (b2) shown in the above formula (2). The components of the component (B) 201017331 are as follows. [Monomer (bl) represented by the formula (1)] The monomer (bl) (hereinafter also referred to as (bl) component) is represented by the following formula (1). Further, "or 丫, 丄Λ U ) "Residues in the system" means "- [-(CHRLCHR1· )a -〇']b-CO-CR2=CH2j 〇[Chemical 3]

In the formula, the lanthanide has no cyclic guanamine or cyclic quinone imine group and the nitrogen atom is bonded to the residue in the formula (1), R1, ! ?1. and R2 stands for hydrogen atom or methyl group, ... is unique to number). 1~中' R is preferably a hydrogen atom. R1 is preferably a hydrogen atom, and b 1 to 2 is preferably 'I is more ruthenium. 0 ^ ^(1)Ψ f A k f ^ ^ t ^ . T , Γ. , 丨u is (4) It is more preferable to have a smear-like amide group or a ring-shaped saponin or to combine two or more of 2 as an amine group. %, %' 醯 醯 或 or cyclic 醯 5 As such (M) component, for example, the blanking 1} (1-4 < 201017331 [Chemical 4]

b,=l (1-1) b,=2(l-21) b,=l (1-2) b,=2(l-22) ο

b'=l (1-3) b'=2 (1-23)

b'=l (1-4) b'=2 (1-24) Ref 11 201017331 [5]

ο b'=l (1-5) b'=2(l-25) b'=l (1-6) b,=2(l-26) b'=l (1-7) b'=2 (1-27) b'=l (1-8) b'=2 (1-28) 12 201017331 [6]

O b'=l (1-9) b'=2 (1-29) b'=l (1-10) b'=2(l-30) b'=l (1-11) b'=2 (l-31) b'=l (1-12) b,=2 (1-32) 13 201017331 [Chem. 7]

b'=l (1-13) b'=2 (1-33) b'=l (1-14) b'=2 (1-34)

0 CH3 b'=l (1-15) b,=2(l-35)

Ch3 o b'=l (1-16) b'=2(l-36) o 14 201017331 [化8] ❿

B-l (1-17) b'=2 (1-37) b'=l (1-18) b'=2 (1-38)

b'=l (1-19) b'=2 (1-39)

b'=l (1-20) b'=2 (1-40) where 'in terms of adhesion enhancement, the formula (1-5) to (1-20) and the formula having a cyclic quinone imine group The monomer represented by (1-25) to (1-40) is preferred. Moreover, in terms of the improvement of the residual resistance, it is more preferable to use a monomer represented by the formula (1 -9) to (2 〇) and the formula (1 _29) to (1-40) to n-cyanate. Oxyethylhexahydroiminoimine (1 -9) or N-methylpropenyloxyethyl hexahydroindenimide (1 -10 ) is a special 佺^ (b丨) component which can be used alone 'It is also possible to mix a plurality of kinds and 15 201017331. By using such a (bl) component, shrinkage at the time of hardening can be reduced and adhesion can be improved. [Monomer (b2) represented by the formula (2)] The monomer (b2) (hereinafter also referred to as the component (b2) is represented by the following formula (2). __ _ [Chemical 9] 〇

R3 (2) (wherein R3 represents a hydrogen atom or a methyl group, B represents a single bond or a condensed group having a carbon number of 1 to 5, and R4 represents a bond removed in a monocyclic or polycyclic ring. a residue formed by a hydrogen atom on a carbon atom of a cyclic lactone compound). When the B system is extended, the alkyl group may be linear or branched. By containing such a component (b2), shrinkage at the time of hardening can be reduced, and heat resistance is improved. The component (b 2 ) may, for example, be a monomer represented by the following formula (b 2 _)) to (b2-5), 201017331

[化 ίο] R'

R3 0>2-1)

(b2-5) (wherein R3 is as defined above, R is a gas β7. A ruthenium atom, a lower alkyl group, a filament having a carbon number of 5 or (10) R'R, 'a hydrogen atom, or also ^ The carbon number substituted by the gas or the gasification group is a straight bond of the bromine group, and the J system OU'Q system may also contain an alkyl group or an oxygen group having an oxygen atom or a sulfur atom of 1 to 5 carbon atoms. Atom or sulfur atom) When R' is a lower alkyl group, the lower alkyl group preferably has a carbon number of 丨5. 17 201017331 R" is a linear or branched chain alkyl group, the alkyl group having a carbon number of 1 to 10 is preferred - a carbon number of 1 to 5 is more preferably a "R" cyclic alkyl group. When the carbon number is 3 to 15, the carbon number is preferably 4 to 12, and the carbon number is 5 to 10, which is preferably used. The polycyclic alkane such as one of a cycloalkane, a dicycloalkane or a tricycloalkane tetracycloalkane substituted by an atom or a fluorinated alkyl group is substituted with at least one hydrogen atom, and the like. More specifically, Out of the ring, the hexagram, etc. - chain burn, or

Polycyclic alkanes such as diamond, sputum, dioxane, 捸, Cyclodecane, tetracyclodecane, etc., remove one or more hydrogen atoms. rh9 ςχ* Soil points. In the formulas (b2-l) to (b2-5), it is considered to be industrially preferable. When R is a hydrogen atom or a hydrogen atom or a sulfur atom group, the alkylene group may specifically be an alkylene group having a carbon number of 1 to 5, _〇- CH2_, _CH2_〇, extended ethyl, n-propyl, and the like. ^ GHz - - - CH2 - S - CH2 - The following shows the above (bbi) - by way of example. 5) The specifics of the monomers shown. . . . . . . . . . . . .

18 201017331

[化 12]

[Chem. 13]

19 201017331 [Chem. 14] ο

Ο

α>2-4-3)

[化15]

R3 H3C〇- Φ2·5·3>

(b2-5-4) where 'in terms of adhesion and heat resistance, the formula (b2i (5)-3) is called (4), and the formula (b2~2-8)~(b2_2_9# is monomer It is better, especially in the case of the viscous erection of Lu, the formula (Mq ~ (b2-l-2) and the formula (b2_2~~^ 9 Q, s (b 2)) More preferably, the α-propyl ethoxy group ~ butyl jjjggt ' 丁内 S 曰 and 10,000-methacryl oxime butyl butyl inner 20 201017331 is particularly good e (b2) component can be used alone or in combination with a plurality of species [Hydroxy group-containing (meth)acrylic acid vinegar (b3)] Further, the photosensitive resin composition of the present invention contains a hydroxyl group-containing (meth)acrylic acid vinegar (hereinafter also referred to as (1) 3) When the component (b3) is contained, the shrinkage at the time of curing can be reduced, and the adhesion can be further improved. The component (b3) includes a monomer represented by the following formula (3_υ) [Chem. 16] R5

(3-1) represents a hydrogen atom or a methyl 'r8 system represents a hydroxyalkyl group which may have a substituent. The sulfhydryl group which is ancient in R6, preferably a sulfhydryl group having a carbon number of 〇 or less, is chain-like or Branching chain shape is preferred, and the (four) group having a carbon number of 2 to 8 is more: it is specifically limited by methyl group, ethyl group or propyl group, preferably 1 or 2, and 丨Λ ^ from For better. The bonding position is not particularly limited, and it is preferred to bond to the end of the alkyl group. The substituted ΓIt(tetra) group' may have a phenoxy group or a phenoxy group as a substituent. As the phenoxy Mmoxymethyl group, phenoxyethyl phenoxypropyl group is preferred. It is preferred that one of the hydrogen atoms of the carbon atom to which the hydroxyl group of the R6 &quot;oxy group is bonded is substituted with a strepoxyalkyl group. Examples of the preferable (b3) component represented by 18]) on the gas atom include the monomers represented by the following formula (2010). R5 R7 0 (wherein R5 is the same as above) R7 represents a hydrogen atom or a phenoxyalkyl group, and c represents an integer of 1 or more and 3 or less): φ wherein hydroxy group is decyl acrylate Ethyl ester, hydroxyethyl acrylate, 2-hydroxy-3-phenoxypropyl acrylate and 2-hydroxy-3-phenoxypropyl methacrylate are preferred. In addition, as the component (b3), a monomer other than the above may be a monomer in which a hydrogen atom of a hydroxyl group of the above formula (3-1) is further substituted with a hydroxyl group-containing organic group or a carboxyl group-containing organic group. . The organic group preferably contains an ester bond. As the monomer substituted with the above-mentioned hydroxyl group-containing organic group, 2-methylpropenyloxyethyl-2-carbylpyrene ruthenate β can be suitably used as the upper carboxylic group substituted with a carboxyl group-containing organic group. The monomer can be suitably selected from the group consisting of 2-methylpropenyloxyethyl succinic acid, 2-methylpropenyloxyethyl hexahydrophthalic acid and hexahydrofurfuric acid-acryloxyethyl ester. . • .... : . . . (b3) The components may be used singly or in combination of plural kinds. The content of the component (B) is preferably from 2 to 95% by mass, more preferably from 30 to 85% by mass, based on the photosensitive resin composition. Borrowing. ... - . / .. --. . . - . By the above range 'can achieve a high adhesion to the glass panel and eclipse.. . . . . . . . Heat resistance at the time. Further, the blending amount of the components (b1), (b), and (b3) can be appropriately changed according to the value 22 201017331 required for the adhesion and the heat of the photosensitive fat-hanging composition. For example, the (bl) component is relatively The photosensitive resin composition is preferably 10 to 95% by mass, more preferably 15 to 85% by mass, and the (b 2 ) component is relative to _ _: optical tree. The fat composition is 1 5 to 70% by mass is preferably 'in the range of 2 0 to 6 5 mass%, and the component (b 3) is preferably 1 to 55 mass% with respect to the photosensitive resin composition, and 3 to 5 The range of 〇 mass % is better. Examples of the monomer constituting the component (B): (1) The case where only the (bl) component is formed ❹ (2) The case where only the component (b2) is composed (3) The (bl) component and (b2) (4) The case of (b) component and (b3) component (5) The component (b2) and (b3) component (6) The (bl) component, ( B2) In the case of the component and the component (b3), the above is good because the hydrogen fluoride resistance is good, and the balance between adhesion and heat is good, and (3) to (5) is preferable, and (3) or (5) is especially good. ❹ (3) ratio (bl) / (b2) is 1/99 to 99/1 隹, with 10/90 . . . . ~ 90/10 is better, 20/80~65/35 is more good. . . . ..... .... . . . (4) The ratio (bl) / (b3) is preferably 1799~99/1, with 10/90 --- .... ... :... . . ~ 90/10 is better, preferably 2〇/8〇~8〇/2〇. ' , . . . . . . . . . . . . . . . (5) The ratio (b2) / (b3) is preferably 1/99 to 99/1, with 5 /9 5~95/5 is better, preferably 10/90~90/10. ' .. . . . . . . . . . . (6) is the sum of [(b) and (b2)]/(b3) is 45/55 to 99/1. . . . . Further, the ratio of 'b1' to (b2) is the same as the case of the above (3). <Difunctional monomer (E)&gt; ' . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The difunctional monomer (E) (hereinafter also referred to as (E) component) which is a cyclic group of 6 to 20 is preferred. By containing the (E) component, the heat or the squeezing resistance is improved. The monofunctional monomer (E) is preferably a difunctional (fluorenyl) acrylate. The (E) component is preferably a difunctional (fluorenyl) acrylate (61) represented by the following formula (el).

R10 R8 Ο (In the formula (el), R8 is independently the same as the above R2. The RS system each independently represents an alkylene group having 1 to 3 carbon atoms. The γ-based carbon number is a divalent ring of &amp; R9, in the formula (el), specifically, there are methylene, ethyl, propyl, and exopropyl. In terms of heat resistance improvement, it is preferable to use a methylene group or an ethylidene group, and the compound ^ ^ f A 4 ^ ^ 〇 ^ (el 2 ^ ^ €^ ^ , the fat _ cyclic group is preferably "the cyclic group The number of carbon atoms is preferably from 7 to 15 and more preferably from 8 to 12. The cyclic group may have an alkyl group having a carbon number of 丨 to stone as a substituent. Examples of the cyclic group include a monocyclic alkane. Or a polycyclic alkane such as a bicycloalkane, a tricycloalkane or a tetracyclic chain is removed, and two or more hydrogen atoms are added to the base, and the like, and specifically, a cyclopentyl group, a cyclohexyl group, etc. Stretching-cycloalkyl, exo-adamantyl, stretching-and-decreasing base, stretching and extruding base, stretching tricyclic fluorene 24 201017331 alkyl, tetracyclododecyl, etc. For the improvement of the properties and the etching resistance, it is preferred to extend the polycycloalkyl group, and it is more preferable to extend the tricyclodecyl group and the tetracyclodene group. As the above-mentioned monofunctional (methyl-)-propylene. Acidic vinegar (e 1..), tricyclic fluorene dimethanol diacrylate, tricyclodecane diethanol diacrylate, tetracyclododecan dimethanol diacrylate is preferred as tricyclodecane Methanol diacrylate is particularly preferred. (E) Ingredients The content of the component (E) is in the range of 丄〇 50% by mass based on the photosensitive resin composition, and the heat resistance and the profit can be improved by the above range. When the component (E) is contained, the combination of the component (B) and the component (B) can be suitably used. (1) A case where only the (bl) component and the (el) component are formed (2') (b) component (el) component (3) consists of (b) component, (b2) component, and (el) component component. . . . ' . - ; .. ..... ... ' (4') is composed of (bl) component, (b3) component and (el) component.: The condition '(() is particularly good. - - - - . . . . : :- <Photopolymerization Initiator (c)&gt; ' . . . . . . . . . . . . . . The photopolymerization initiator (C) is not particularly limited to be dissolved in the above Monomers are preferred. The photopolymerization initiator (C) may, for example, be a cyclohexyl phenyl ketone or a 2-yl-2-methyl-1-phenyl propyl fluorene_ι_嗣, 25 201017331 l-[4-( 2-hydroxyethoxy)phenyl]_2-hydroxy-2-methyl-1-propane-butanone, 1-(4-isopropylphenyl)-2-hydroxy-2-indolyl-1 Ketone, ι_(4_dodecylphenyl)-2-yl-2-methylpropan-1-one, 2,2-dimethoxy-1,2-phenyl-ethene-1 Ketone, bis(4-dimethylaminophenyl)-, 2-mercapto-1-[4-(methylthio)phenyl]-2-sodium propane-1 -one, 2-pyr-2 -dimethylamino-1-(4-morpholinylphenyl)-butane-butanone, ^-[iethyl-6-(2- mercaptobenzoyl)-9H-carbazol-3-yl] - Ethylketone-i-(〇-acetamidine), 2, 4, 6-0 dimethylbenzimidyl diphenyl oxide scale, 4-phenylglycol-4,_methyldithiol sulfur Shout, 4-dimethylaminobenzoic acid, methyl 4-dimethylaminobenzoate, 4-diguanamine ethyl benzoate, butyl 4-diguanyl benzoate, 4-dimethylamino 2-ethylhexylbenzoic acid, 4-dimethylamino 2-isoamylbenzoic acid, benzyl-cold-methoxyethyl acetal, benzyl dimercapto ketal, Base - propanone-2-(0-ethoxycarbonyl) hydrazine, methyl hydrazinyl benzoate, 2, 4-diethyl thioxanthone, 2- thioxanthone, 2, 4 _Dimethyl sputum, Buqi-4-propoxy thioxanthone, thioxanthene, 2-gas thioxanthene, 2, 4_diethyl thioxanthene, Φ 2-methyl oxime, 2_ different Propyl thioxanthene 2 -ethyl onion, octamethyl onion, 1,2-benzopyrene, 2, 3-diphenylanthracene, azobisisobutyronitrile, benzammonium peroxide, Cumene peroxide, 2-hydrosulfanyl benzamidazole, 2-hydrosulfanyl stupid, salic, 2-hydrothiobenzothiazole, 2~(0-chlorophenyl)-4, 5-di (m-methoxyphenyl)-imidazolyl dimer, diphenylanthracene, 2-p-diphenyl ketone, p-p-bisdiaminoaminodiphenyl ketone, 4,4' bisdiethylamine Diphenyl-, 4,4-di-2-diphenyl ketone, 3,3-dimethyl-1,4-methoxydiphenyl hydrazine, acetoin, benzoin, benzoin decyl ether, benzene Acetone ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, benzophenone 201017331 butyl butyl, acetophenone, 2, 2 -diethoxy B-brewed benzene, p-dimethyl bromide. Benzene, p-diamine Acetophenone benzene, diacetophenone benzene, triethylene acetophenone benzene, p-tert-butyl acetophenone, p-dimethylamino acetamidine, p-butyl butyl triethylene benzene, third butyl Dioxabenzene, α,α-digas_4_phenoxyethylbenzene, thioxanthone, 2-methylthioxanthone, 2-isopropylthioxanthone, dibenzocycloheptazone , fluorenyl-methylamino benzene, formic acid vinegar, 9-phenyl "* bite, 1,7__ bis (9-» 丫) g), 1,5-bis (9-acridinyl) pentyl Alkane, bis(9^丫φ pyridine)propane, p-methoxy tri-, 2,4,6-parade (triseodecyl)_3_three', 2-mercapto-4,6-bis (three Gas )))-s-three-flavor, 2-[2-(5-fluorenyl hydrazin-2-yl)vinyl]-4,6-bis(trimethylmethyl)-8-three-flavor, 2_[2_ (吱-2-yl)vinyl]-4,6-bis(triseodecyl)-s-tris-, 2-[2-(4-diethylamino-2-methylphenyl)ethene Base]-4,6-bis(tri-gasmethyl)_8_triple,2-[2-(3,4-dimethoxyphenyl)ethenyl]_4,6-bis (trimethyl fluorenyl) -s-Tris, 2-(4-methoxyphenyl)-4,6-bis(trimethylsulfonyl)-s_triterpene, 2-(4-ethoxyphenyl)-4,6-double (three gas methyl)-s-three flavors, • 2~(4~n-butoxyphenyl)-4,6_bis(trimethylsulfonyl)_s_tris, 2, 4_bis-di- gas methyl-6-(3-bromo-4-methoxy Phenyl-3-tris, 2,4-bis-dimethylmethyl-6-(2-bromo-4-methoxy)phenyl-s-tris, 2, 4-bis-tris. ..... . . . . . . . . . methyl-6-(3-bromo-4-methoxy) stupid vinyl stupyl-s-trisole, 2, 4-dual- Trichloromethyl-6-(2-bromo-4-indolyloxy)styrylphenyl-S-tri"anthracene and the like. Among them, in terms of the degree of sensibility, it is particularly preferable to use a saccharin-based photopolymerization initiator. These photopolymerization initiators may be used singly or in combination with a re-educational species. The content of the photopolymerization initiator (C) is based on the composition of the photosensitive resin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . In the above range, it is possible to obtain sufficient heat resistance and to improve the photohardening resistance to hydrofluoric acid and water resistance. <Colorant (D)&gt; The photosensitive resin composition of the present invention further contains (hereinafter also referred to as "(8) ingredient") is preferred. When the photosensitive resin composition of the present invention is applied to the surface of the glass panel by the coloring, the amount of penetration of the coated portion and the inside of the glass panel can be easily visually observed. Such a coloring agent is not particularly limited, and it can be dissolved in a photosensitive resin group without using a solvent, and it is preferable that it does not fade over time and does not overlap with the absorption wavelength of the photopolymerization initiator (component (c)). . Among them, organic dyes are preferred. The organic dye may be used singly or in combination of two or more kinds as necessary. The organic dye, which is added to the wavelength of the maximum absorbance of the photosensitive resin composition, is preferably 450 to 750 nm, and is 6 to 75 Å.

The range of Nai is better as i. For this kind of organic dye, 〇IL

❹ YELLOW#101, OIL YELLOW#130, OIL PINK#312, OIL GREENIBG &gt; OIL BLUEIBOS &gt; OIL BLUE#603 ' OIL BLUE #613 ' OIL BLACK BY, OIL BLACK BS, OIL BLACK T 505 (above, ORIENT Chemistry Industrial Co., Ltd.), Victoria Pure Blue, Crystal Violet (CIC Color Index Number) 42555), Methyl Violet (CI42535), Rhodamine B (CI45170B), Malachite Green (CI42000), Methylene Blue (CI52〇15 ). The organic dye can be suitably dissolved by a known method in the composition of the photosensitive resin. As a method of this type, A method of using a high-speed mixer such as a dissolver, etc., an additive of an organic dye, ..... .... &quot; .. . . 28 . 201017331 The amount may be adjusted according to the environment (conditions and uses) of the photosensitive resin composition, and the mass of the photosensitive resin composition is preferably 1 to 1% by mass. 〇5 〇. 5 The % by mass is more. <Other components> The photosensitive resin composition of the present invention can contain an additive as necessary. Examples include thermal polymerization inhibitors, antifoaming agents, sensitizers, hardening accelerators, photocrosslinking agents, photosensitizer dispersing agents, dispersing aids, fillers, adhesion promoters, antioxidants, UV absorbers, Anti-agglomerating agent, etc. In the photosensitive resin composition of the present invention, an organic solvent may be suitably used in order to improve the solubility of each component and to assist in the uniformity of dissolution. Glycol monomethyl ether, ethylene glycol ethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol methyl ether, diethylene glycol monoethyl ether, diethylene glycol N-propyl propyl, di-glycol-alcohol-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl bond, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether , propylene glycol mono-n-butyl ether, di-propylene glycol monomethyl ether, di-extension propylene glycol monoethyl propionate-propanyl-propanyl group, phenanthrene, di-extension, propylene glycol-n-butyl ether, tri-extension Alcohol-methyl mystery, tri-propylene glycol-ethyl ether, diethylene glycol dimercapto, diethylene glycol diethyl ether (poly)alkylene glycol-based ethers; ethylene glycol monomethyl ether acetate S, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate vinegar, diethylene glycol Monoethyl ether acetate, propylene glycol monomethyl carboxylic acid vinegar (PGMEA), propylene glycol monoethyl ether acetate, etc. (poly) 29 201017331 alkyl diol monoalkyl ether acetate; Other ethers such as glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl mystery, tetrahydrofuran, etc.; acetone methyl isobutyl hydrazine, methyl ethyl net, cyclohexyl, 2 a ketone such as heptanone or 3-heptanone; an alkyl lactic acid lactic acid such as 2-hydroxypropionic acid methyl vinegar or 2-hydroxypropionic acid;

2-hydroxy-2-methylpropionic acid ethyl vinegar, methyl 3-methoxypropionate, 3-methoxypropionic acid vinegar, 3-ethoxypropionic acid methyl vinegar, 3-ethoxypropionic acid Ethyl acetate, ethyl ethoxyacetate, ethyl hydroxyacetate, 2-hydroxy-3-methylbutyric acid methyl hydrazine, acetic acid 3-decyl butyl acetonate (MA), acetic acid 3-methyl _3 methoxy Keding series, 3-methyl_3_methoxybutyl propionate, propylene glycol monomethyl propyl vinegar, propylene glycol monoethyl vinegar vinegar, ethyl acetate, acetic acid, acrylic acid, isopropyl acetate , n-butyl acetate, isobutyl acetate, formic acid, isoamyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl succinate, Pyruvate vinegar, propylene vinegar, propylene vinegar, propylene vinegar, vinegar, vinegar, vinegar, vinegar, vinegar, acetoacetate, acetoacetate, acetonate Other vinegars such as propyl acrylate, butyl carbonate, etc.; aromatics of the present, a benzoyl, and a hydrazine: a hydrocarbon: class; N-methylpyrrolidone, R, N-dimethyl Amidoxime, and amides such as N, n-dimethylacetamide, and diterpenoid hard C DMS0), methanol, ethanol, propanol butanol, di-methoxybutanol (BM), hexanol, cyclohexanol, ethylene glycol, glycol, glycerin, r-butyrolactone, α_boxol (Onion alcohol) and so on. 201017331 The amount of organic solvent used is not limited to the special name of the thief, and the concentration that can be applied is also considered to be β. It is composed of a photosensitive resin from the viewpoint of maintaining the hardness of the resin component and maintaining the hydrogenation resistance after curing. The mass % or less is preferably one, and the following is more preferably 5% by mass or less, more preferably 5% by mass. In the present invention, it is composed of substantially 0% by mass (that is, a solvent-free photosensitive resin) Things) are the best. <Modulation Method of Photosensitive Resin Composition>

The photosensitive tree composition of the present invention can be obtained by mixing all of the above components using a machine. Further, the obtained photosensitive resin composition may be used to have a viscosity of 0.5 to Pa s, preferably having a viscosity of 0.5 to Pa s. The viscosity is better 'to have 1. 〇~! The viscosity of 8Pa · s is particularly good. By having the viscosity in this range, the permeability to the inside of the glass panel is improved, and the glass panel after the etching is prevented from being damaged. In addition, depending on the gap size between the glass panels, the viscosity of the photosensitive resin composition can be maintained well by the viscosity of 0.5 Pa·s or more, and the glass panel can be sufficiently sealed 'with a distance of 3.0 Pa·s or less. The permeability to the inside of the glass panel can be satisfactorily maintained and the glass panel can be prevented from being damaged. Further, in the photosensitive resin composition of the present invention, the density of the resin component does not decrease after the curing, and the hydrogen acid resistance does not decrease. [Method of Sealing Glass Panel] The following is an application example of a sealant as a photosensitive resin composition of the present invention, 31 201017331 2 sheets of a glass panel having a thickness of 0.5 to 1 mm, to form 2 20 μm. The gap is applied in such a manner that the photosensitive resin composition is applied to the outer portion by using a coating device such as a manual or a dispenser. In this case, the amount of penetration of the photosensitive resin composition is preferably from 1 to 10 mm from the outer peripheral portion. In the preferred embodiment of the present invention, the amount of permeation can be easily visually confirmed because the photosensitive resin composition contains a coloring agent. Next, the applied photosensitive resin composition is exposed to an active energy ray such as excimer laser light. The energy ray to be irradiated differs depending on the composition of the photosensitive resin composition, and is preferably, for example, 200 to 500 〇mj/cmf2. Next, a hydrofluoric acid-based etching solution such as hydrofluoric acid or ammonium fluoride is used, and the glass panel is pasted at 20 to 8 (TC is immersed or immersed for 30 to 200 minutes. The overall thickness of the glass panel is reduced by 2. 2 to 1. 0 mm. When using the previous photosensitive resin composition for sealing treatment, because of the viscosity of the @\ photosensitive resin composition (for example, _6 __ 〇pa · _ .s left and right. Method: The photosensitive resin composition that completely penetrates into the interior is outside the glass panel. . . -- --- -. ... - --.- Side bulge and frame convex Therefore, after the etching, the convex bulging becomes thicker than the glass panel, and the glass panel is likely to be damaged. However, the invention is The photosensitive resin composition has a low viscosity, so that the permeability is high, and it is less likely to cause a convex bulge. Therefore, the possibility of breakage of the glass panel is greatly reduced. And because the photosensitive resin of the present invention The composition contains a specific monomer (B), and the effect of lowering the hardening shrinkage and improving the adhesion and heat resistance can be achieved, 32 [Examples] Hereinafter, the present invention will be described in detail with reference to examples, and the present invention is not limited to the examples. <Examples 1 to 12, Comparative Examples 1 to 5> (A) Ingredients, (B) Each of the components and the components (C) is prepared by blending the compounds described in Table 1 with the ratios described in Table 1. The viscosity (25 ° C) at this time is shown in the table. Further, (A)-l in the table indicates EBECRYL 3701: modified epoxy acrylate having a bisphenol A skeleton (manufactured by DAICEL-CYTEC), and (A)-2 indicates CNUVE151: polyester-based acrylic acid. Ester (manufactured by SART0MER). M140 represents N-propylene methoxyethyl hexahydro hydrazine (made by East Asia Synthetic), and GBLMA represents α-mercapto propylene methoxy-r-butyrolactone (Osaka has a mechanism) HEMA stands for hydroxyethyl methacrylate, PHA stands for 3-phenoxy-2- methacrylate, and MAHP stands for hexahydrophthalic acid-propylene methoxyethyl ester. The body (E), SR833 is a tricyclodecane di Φ methanol diacrylate (manufactured by SART0MER). . . . . . . . . For the initiator (C), ir907 (manufactured by CIBA SPECIALTY CHEMICALS) was used. As the colorant (D), (D) to 1 indicates oil BLUE-613 (manufactured by ORIENT Chemical Co., Ltd.). Indicates the mass %. 33 201017331 [Table 1] Example (8) (B) (E) (C) (D) Viscosity Pa · s (bl) (b2) (b3) Example 1 (AH (40) - GBLMA (57 ) - - IR907 (3) (DH (0.1) 1.3 Example 2 (VIII)-1 (17) M140 (80) -. - - IR907 (3) (D)-l (0.1) 1.3 Example 3 (A)-l ( 38) M140 (16) GBLMA (43) - - IR907 (3) (D)-l (0.1) 1.2 Example 4 (AH (37) M140 (20) GBLMA (40) - - IR907 (3) (D)-l (0.1) 1.2 Example 5 (A)-l (34) M140 (26) GBLMA (36) - - IR907 (3) (D)-l (0.1) 1.3 Example 6 (VIII)-1 (37) M140 (20 ) - HEMA (40) - IR907 (3) (DH (0.1) 1.2 Example 7 (VIII)-1 (47) - GBLMA (43) HEMA (6) - IR907 (3) (D)-l (0.1) 1.2 Example 8 (A)- l (50) - GBLMA (36) HEMA (ID - IR907 (3) (D)-l (0.1) 1.2 Example 9 (A)-l (27) M140 (35) - SR833 (35) IR907 (3) (D)- l (0.1) 1.4 Example 10 (A)-l (28) GBLMA (27) MAHP (42) - IR907 (3) (D)-l (0.1) 1.4 Real Example 11 (A)-l (35) - GBLMA (28) PHA (34) - IR907 (3) (D)-l (0.1) 1.2 Example 12 (A)-2 (37) M140 (20) GBLMA (40) - - IR907 (3) (D)-l (0.1) 1.4 Comparative Example 1 (A)-l (70) - - HEMA (27) IR907 (3) (D)-l (0.1) 1.2 Comparative Example 2 (A )-l (35) - - - SR833 (62) IR907 (3) (D)-l (0.1) 1.2 Comparative Example 3 (A)-l (10) - - MAHP (87) - IR907 (3) (D)- l (0.1) 1.4 Comparative Example 4 (A)-l (25) - - HEMA (22) SR833 (50) IR907 (3) (D)-l (0.1) 1.2 Comparative Example 5 (A)-l (30) - - PHA (67) -. IR907 (3) (D)-l (0.1) 1.2 34 201017331 <Evaluation> . Coating properties, hardenability, adhesion, heat resistance, etching resistance and the like of the prepared sample The peeling after drying was evaluated in the following manner. '^ ^ ^ ^ ^ ^ ^ ^ [Coating property] 2 sheets of glass plate having a thickness of 0.7 m are attached so as to form a gap of about 2 μm, and manual use is performed on the outer peripheral portion. The sample was coated, and it was visually confirmed whether or not the sample penetrated into the gap of the glass plate. It will be confirmed that the infiltrant is marked as 〇, and the unidentified one is χ ^ [Surface hardening property] On a glass plate having a thickness of 0.7 mm, a sample is made into a 12 μm using a spin coater (manufactured by MIKASA Co., Ltd.). It was applied in a thickness manner, and then it was hardened by irradiating ultraviolet rays with an exposure amount of 2000 niJ/cm 2 . With or without hardening by hand touch. The hardened material that is completely non-adhesive when touched is marked as 〇, and the adherent is X. [Adhesiveness] On a glass plate having a thickness of 0.7 mm, a tester was applied in a thickness of 12 μm using a spin coater (manufactured by MIKASA) to subsequently irradiate ultraviolet rays at an exposure amount of 2000 mJ/cm 2 . To harden it. Subsequently, a relative comparison was made in accordance with JIS K5600-5-7. The evaluation criteria are as follows. ◎ : 110 or more '〇: 80 or more, △ : 4 〇 or more ”: less than ^. [Heat resistance] The above-prepared sample was used, and the ultraviolet ray was irradiated with an exposure amount of 2 〇〇〇 mJ/cm 2 to cure it. A test film of 25 mm 2010 3 χ 2 〇〇 micro 35 201017331 m was produced. The test film was subjected to a tensile test method using a thermomechanical analysis device (manufactured by SEIKO), and has a softening point at ~C. 5厘米。 The mark marked as 〇, will have a softening point in the 25~6〇〇c is marked as X. [Resistance] _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The four-way method uses a dispenser (Mu Zang Φ ENGINEERING) to spit out, and then, it is hardened by irradiating ultraviolet rays with an exposure amount of 2〇〇〇mj/cm2. Subsequently, the glass plate is immersed in 25-force, 20-mass. In the % hydrofluoric acid, the peeling of the cured product was visually observed, and the time until partial peeling occurred was measured. The mark was marked as ◎ for 55 minutes or longer, and the mark was marked as 〇 for 40 minutes or longer and less than 55 minutes, and 3 minutes or longer. , less than 40 minutes marked as △ 'will be less than 3 〇 In the minute, the peeling mark is marked as X 〇 [peeling after drying] 瘳 After the above-mentioned squeezing resistance test, it is dried, and the peeling is visually observed. The person who does not peel off is marked as 〇, and even if a part is peeled off, 36. 201027331 [Table 2] Example of coating surface-hardening adhesive heat resistance Peeling after chain-like drying Example 1 〇〇 △ 〇 ◎ X Example 2 〇〇 ◎ X △ X Example 3 〇 〇〇〇 ◎ 〇 Example 4 〇〇〇〇 ◎ 〇 Example 5 〇〇〇〇 ◎ 〇 Example 6 〇〇〇 X △ X Example 7 〇〇 Δ 〇〇〇 Example 8 〇〇〇〇 ◎ 〇 Example 9 〇〇〇〇◎ 〇 Example 10 〇〇〇X △ X Example 11 〇〇Δ X △ X Leanity Example 12 〇〇〇〇〇〇Comparative Example 1 〇〇◎ XX Comparative Example 2 〇_ 〇 X Comparative Example 3 〇〇 ◎ XX Comparative Example 4 〇〇X 〇 - Comparative Example 5 〇〇〇 XX - Evaluation, the adhesion was too poor, and the etch resistance evaluation was not possible as "_"" Sexual outcome In the case of the poor, the peeling after drying was not confirmed, so it was not evaluated as "_". From Table 2, it was found that in order to improve the coating property, the photosensitive resin composition has a low viscosity and can maintain the hardenability. The etching resistance can be improved (Examples 1 to 12). It is found that both (bi> and (b2) have good evaluation items (Examples 3 to 5 and Example 12). Moreover, good characteristics can also be obtained by combining the component (E) (Example 9). In addition, in the case of the third and the ninth, the 5% of the PGMEA was further added to the mass ratio of the components, and the result of the same evaluation was also performed. 201017331

[Simple description of the diagram] None [Main component symbol description

Claims (1)

201017331 VII. Patent Application Range: 1. A photosensitive resin composition comprising: a terminal (meth) acrylate oligomer (A) selected from the group consisting of the following formula (1) ( Bl) one or more monomers (B) composed of the monomer (b2) represented by the formula (2), and a photopolymerization initiator (C), [Chem. 1] (1) (wherein A is a group having a cyclic guanamine group or a cyclic quinone imine group) and the nitrogen atom is bonded to a residue in the formula (1), and R1, R1 and !^ is a hydrogen atom or a methyl group independently, and a and b are independently an integer of 丨~3) [Chemical 2] ❹ (2) . . . . . . ' (In the formula, 'R is not a gas atomic formula, its Γ / / 于 于 于 于 于 于 于 于 Β Β Β Β Β 表示 表示 表示 表示 表示 表示 表示The extension of the base of the 5th R4 system 私 + the private soil ty ning, the surface does not remove a gas atom bonded to the carbon atom of the ring-shaped internal vinegar compound of a single gas 戍 polycyclic ring) 39 201017331 2 The photosensitive resin composition as described in claim 1 has a viscosity of 〇·5~3. OPa·S. The photosensitive resin composition as described in claim 1 further contains: a difunctional monomer (E) having a cyclic group having a carbon number of 6 to 20 〇0 4. The photosensitive resin composition according to claim 1, further comprising: a hydroxyl group-containing (meth) acrylate (b3). 5. The photosensitive resin composition according to claim 1, which further comprises a coloring agent (D). A sealant which is obtained by using the photosensitive resin composition according to any one of claims 1 to 5. 201017331 (2) (wherein R3 represents a hydrogen atom or a methyl group, and B represents a single bond or an alkyl group having a carbon number of i 5 'R is a list of $ Λ one bonded to a monocyclic or polycyclic ring a residue formed by a hydrogen atom on a carbon atom of a cyclic vinegar compound). ❹ Third, English invention summary: None Fourth, the designated representative map: ❿ (1) The representative representative map of the case is: None (2) The symbol of the representative figure is a simple description: None Five, when the style is ‘Please reveal the best display invention