TW201012580A - Laser processing device - Google Patents

Abstract

A laser process device is provided to irradiate a laser beam to a disc-like processing object to form processed part rows separated by a predetermined interval in a radial direction of the processing object. A main beam (MB), a sub beam (SB1) and a sub beam (SB2) are formed by branching a laser beam from a laser source and irradiated to a surface through the same optical system. A tracking control is performed to locate a central point of a beam spot of the sub beam (SB1) of the inner circumference at a central line (CLin) of the track of the most outer circumference of a processed area A, thereby a central point of a beam spot of the main beam (MB) located at a central line (CLout) of a track adjacent to the outer circumference. Accordingly, pit rows (track) separated by a track distance D are formed sequentially.

Description

201012580 31196pif.doc VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a type of laser (1_) plus [prior art] n previously, as a fabrication for semiconductor photomask or main light The reticle (4) laser processing device of the first army T f, tleie), the χν platform laser processing device is known, the lamp is flat-surface driven orthogonal 2 Sliders (slito) are placed on the flat: the processed member moves in the χ direction and the γ direction, and the f-plane is irradiated onto the object by the light material (four) f, and the beam spot is irradiated. The processed member is patterned 〇M ^ and is formed by 当 丝 平台 γ-platform f-processing device. For example, there is a problem that if the number of pixels is 夕, then XY The number of movements of the slider in the direction and the increase and decrease of the acceleration/deceleration are longer. In order to solve such a problem, a laser processing apparatus has been proposed which combines a rotating body and an optical system, and can shorten the drawing time and the forward precision even when the number of pixels is large. Laser processing. In a laser processing apparatus using a disk-type rotating body, the object to be processed is placed on a turntable, and the object to be processed is rotated, and the beam spot is moved in the radial direction. Thereby, high-speed laser processing can be performed. In other words, the laser light is recorded on the optical information recording medium 201012580 31196pif.doc of the Compact DiSC-Recordable (CD-R), and the laser light is irradiated onto the disk-shaped object to be processed. Putian. π work. In Japanese Patent Laid-Open Publication No. (10)-6, the disclosure of the Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. In this way, the object shape and the fine pattern (small concave portion row) which is smaller than or equal to the beam spot diameter are processed. Moreover, the object to be processed which forms such a fine pattern has been studied.

In the invention of the invention, a fine pattern having a heat-induced pattern (heatmGde) type is selected. The heat-induced pattern type of recording material layer causes a physical change or a chemical change by using (i) (iv) iphotothennd converse) by irradiation, and borrows a desired pattern. The λ thermal mode type recording material layer has low illuminance irregularity (in low illuminance, the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The heat generated will dissipate and require more energy. Therefore, when the laser is irradiated to the heat-mode type recording material layer to form a pattern, a fine pattern smaller than the beam spot diameter can be formed. However, unlike the optical information recording medium, a guide groove for traeking is not placed on the disc-shaped object to be processed. Therefore, there is a problem that it is difficult to form the concave row at a predetermined interval in the radial direction of the object to be processed in the form of a disk. Especially at high speed machining, it is easy to produce a shift in the machining position caused by the shaft vibration. In addition, if the overwriting (〇verwrite) of the processed area is repeated in 201012580 31196pif.doc, the correct pattern cannot be formed. In order to solve these problems, a dummy substrate provided with a guide groove for tracking is superposed on a disk-shaped object to be processed, and a technique is disclosed in Japanese Laid-Open Patent Publication No. 2008-93724. Tracking is performed according to the guide groove of the dummy substrate. However, there is also a problem that it is difficult to attach a dummy substrate, and there is a problem that versatility is poor. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a laser processing apparatus that can irradiate laser light to a disk-shaped object to be processed, and The processed portion row is formed at a predetermined interval in the radial direction of the object to be processed. In order to achieve the above object, a laser processing apparatus according to the present invention includes: an irradiation unit that includes at least (four) wires, and branches laser light emitted from the light source to include a tow (main beam). a smaller first beam (_beam) of a plurality of light beams, and a collecting optical system for concentrating the plurality of light beams on the surface of the workpiece of the new disk, so that the laser irradiation portion

21 strips are formed on the surface of the above-mentioned additive image by the processed portion=plus= region, and the main beam pair is subjected to the above-mentioned addition, and the unprocessed region where the I portion is not formed on the surface is U. a method of irradiating a plurality of branched light beams onto the object to be processed to cause the above-described object to be processed; and moving the portion of the laser irradiation unit to move relative to the radial direction of the object to be processed; more 201012580 31196pif. The doc ' is disposed for each of the plurality of branched light beams, and detects reflected light reflected from the surface of the upper two objects; and the tracking object is rotated by the rotating portion to rotate the object to be processed When the time is vertical, the system performs the above-described tracking control based on the intensity of the reflected light of the sub-beams irradiated by the photodetector and detected by the photodetector, and the position of the laser irradiation unit is adjusted. On the one hand, the main beam ❹ 对 the unprocessed area on the surface of the object to be processed, and the plurality of processed portions are formed on the surface of the object to be processed. In the above-described laser processing apparatus, the object to be processed may have a thermal pattern-type recording material layer on the surface, and a diameter smaller than a beam spot diameter of the main beam may be formed on the recording layer. Processing department. Further, it is preferable that the sub-beam has a light intensity of less than or equal to half of the main beam. In the laser processing apparatus described above, the tracking control unit can perform tracking and control so that the intensity of reflected light of the sub-beams subjected to the optical inspection is a predetermined value. Further, the reflected light that has passed through the sub-shot of the added region 1 is detected by the photodetector, and the beam spot formed by the reflection of the sub-beam irradiated onto the center line in the radial direction of the processed portion may be used. The bisector is divided into a first region and a second region, and the tracking control unit performs tracking control to detect the intensity of the reflected light detected in the i-th region and the second region. The difference in reflected light intensity is 0. In the above laser processing apparatus, the plurality of light beams may include at least sub-circumferential light, -1st-order diffracted light, and +1st-order diffracted light. Also, the plurality of beams may include a plurality of main beams for laser processing. [Effects of the Invention] The laser processing apparatus according to the present invention has an effect that the field object 1 and the object to be processed in the form of a disk are preliminarily in the direction of the object to be processed. The processed portion row is formed at a predetermined interval. The above described features and advantages of the present invention will be more apparent from the following description. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. TOP <Schematic configuration of the laser processing apparatus> First, the schematic configuration of the laser processing according to the embodiment of the present invention is performed. Fig. 1 is a perspective view showing a schematic configuration of a laser processing bag according to an embodiment of the present invention. As shown in Fig. 1, the laser processing apparatus includes a spindle motor 12 as a rotating portion for rotating a disk shape (disc shape) and an object to be processed, and an optical processing head (head) 14 A laser irradiation 峥 'stepping motor 16 ' that irradiates the laser beam to the surface 1 〇 a of the object 10 as a moving portion that moves the optical processing head with respect to the object 10 is used. In the present embodiment, a case where the optical processing head 14 side is moved will be described. Therefore, the stepping motor = a supporting member (not shown) mounted on the optical processing head 14. However, as long as the optical processing head 14 can be relatively moved with respect to the object 10 to be processed. When the object to be processed is moved, the stepping motor is attached to the spindle motor 12 side. '201012580 31196pif.doc A center hole 10b is formed in the center of the object 10 to be processed. The object 10 is attached to the turntable 1S by the center hole 10b being locked, and is rotated together with the turntable 18 by the spindle motor 12. The processing object 10 is rotated in a predetermined direction (the direction of the arrow X in Fig. 1) around the rotation axis L passing through the rotation center Q of the object 10 to be processed. The optical processing head 14 is moved by the stepping motor 16 in the radial direction of the object 1 ( (the direction of the arrow Y in FIG. 1 is moved from the center of rotation Q to a predetermined distance. ® Pulse-modulated laser light from The optical processing head 14 is irradiated onto the object 10 to be processed. A recording material layer is formed on the surface 10a of the object 10 (see FIGS. 2A to 2C), and the object to be processed is rotated while being pulsed. The variable laser light is irradiated onto the surface of the recording material layer, and the § recording material layer of the portion irradiated with the laser light is changed by the photothermal conversion caused by the laser irradiation. As described below, the recording material The portion of the layer irradiated with the laser light causes either or both of the chemical change and the physical change to form a laser processed portion. For example, after the recording material layer is removed by adding =, the formation is performed. The concave portion (pit) is used as the processing portion. Thus, a plurality of pit rows in which the pits P are arranged concentrically are formed on the surface 10a of the object 10 to be processed. Column of the pit In the case of (track), the processing is not limited to the concave portion. For example, the surface of the optical processing head 14 may be formed by modifying the material layer (chemical change, etc.). In the processing area of 1〇, along the semi-201012580 3H96pif.doc __outer side, each time a predetermined interval is moved. For each time, a concentric pit row is formed on the object 1〇. ^, " 形成 形成 形成 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 整个 整个 整个 整个 整个 整个 整个 整个 整个 整个 整个 整个 整个 整个It is called "Xunkeng". <Formation of tiny pits ❹ 沾 沾 、 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 1B is a partial cross-sectional view showing a state in which light is irradiated on the surface of the object to be processed. Fig. 2A is a partial cross-sectional view showing a state in which a pit is formed on the surface of the object to be processed. It is to be noted that the composition of the object to be processed includes the substrate 2〇, The recording material layer 22 is laminated on the surface of the substrate 2G. After the material to be recorded is dissolved or dispersed in the coating solution of the suitable coating, the coating is performed by spin coating (dip_), dip coating, (dip_), The coating liquid is applied to the surface of the substrate 20 by a coating method such as extinion eoat to form the recording material layer 22. Further, in the present embodiment, the pair is used for the substrate 20. The case where the object to be processed 1G of the recording material layer 22 is laminated is described. However, the processing of the image material 10 may be such that the outermost layer (fastening surface) has a recording material layer. For example, the object to be added is provided. 1G may be a configuration having only the recording material layer 22, or may be a layer including a layer other than the recording material layer 22. In addition to a plastic substrate, a glass (gj[ass] substrate, etc., a flat substrate such as a solar cell or a light emitting diode (LED), An optical element (a price & 1 device) having an interface for transmitting light is provided as a substrate 20 such as a flat panel display. With these optical elements, when the refractive index difference of the interface at which the emitted light is projected is large, the light emission efficiency is lowered by the interface reflection. In the present embodiment, a concave-convex pattern is formed on the surface of the optical element or the member constituting the surface of the optical element, whereby the reflection phenomenon can be suppressed to improve the south light emission efficiency. A heat-induced pattern type recording material can be used in the recording material layer 22. The heat-sensitive pattern type recording material layer 22 can cause the recording material to become a pit by the heat generated by the photothermal conversion in the irradiation. As a recording material of a heat-induced mode type, = recordable digital versatile disc (Ι^ΐν咖❿ = c-R with dable, DVD_R) # The various recording materials used in the recording layer of the optical information recording medium. For example, a recording material such as a flower bud, a Phthalocyanine system, a quin〇ne system, an azulenium " a salt system, or a 4 (mer〇eyanine) system can be used. The material of the recording material layer 22 is not limited to an organic material, and an inorganic material or a composite material of an inorganic material and an organic material may be used. However, by two: it is easy to form a film by spin coating, it is difficult to obtain a transfer temperature "material, and therefore, an organic material is preferably used. The material of the sinusoid is preferably set to contain a pigment material; f riding layer 22 Therefore, the shirt (four) heart, (four) pigment type recording material layer. As the recording material contained in the single layer 22, the organic 201012580 31196pif.doc pigment is preferably fine organic pigmented towel - gn) The light absorption amount is controlled twenty (the specific example of the recording material of the heat-induced mode type, the following conditions, etc.). The thickness of the formation layer 22 of the recorded material layer corresponds to the thickness to be formed in the Properly set at 1 m or less and small

(4). It is that if the layer 22 is formed, a shallow pit is formed, so that it is difficult to obtain an optical effect. The upper limit of j degree is preferably less than or equal to _ coffee, more preferably less than equal 'nm. The reason is that if the recording material layer 22 is too thick, congratulations are large: the shooting power is 0_one and it is difficult to form the upper = pits, and the speed of the work is lowered. In addition, the "power" per unit area corresponds to "irradiation intensity", but in this specification, "the meaning of laser work is the same as the "irradiation intensity". The thickness t of the recording material layer 22 and the diameter 0 of the pit are preferably in the following relationship. That is, the upper limit of the thickness 1 of the recording material layer 22 is preferably set to satisfy the value of t < i 〇 d, and more preferably set to satisfy the value of 1 < 5 (1, and more preferably set to satisfy t < 3d Further, the lower limit of the thickness 1 of the recording material layer 22 is preferably set to satisfy the value of t > d / ioo, more preferably set to satisfy the value of t > d / 1 ,, and more preferably set to satisfy 1; ><1/5. The reason for setting the upper limit and the lower limit of the thickness t of the rewritable material layer 22 in relation to the diameter d of the pit is the same as the above reason. As shown in Fig. 2B, the processing laser light 12 201012580 31196pif.doc used in the processing of the pit is condensed by the objective lens 24 and irradiated to the reading object 10 表 table® I 10a. The laser beam that forms the wavelength at which the recording material f 22 #recording material exhibits light absorptivity is emitted as laser light for processing. The laser light for processing refers to the irradiation intensity of the pit that can be formed in the lightning (four) emitted from the wire and Laser light of wavelength. The beam spot diameter of the laser beam is set to be buckled. The cross-section light intensity of the laser beam has a Gaussian distribution (Gaussian Dis-) 'The center of the private beam point, the light intensity becomes larger. ❹ ❹ Another surface, the heat-induced pattern type recording material has the "low illuminance irregular 2' speed becomes slower" The heat will dissipate, but the ",, and the energy of the light. With the low illumination irregularity, as shown in Figure 2C, tf 'when the riding layer 22 is deformed by absorbing heat, it is added to the object. 10 recording material riding beam point straight (diameter ds) smaller diameter dp of the pit pt into = force map ^ object K) shouting U job her money pit constructed by the ultra-fine official = such as = will add 1 (four) light When the slit wavelength is set to λ, the diameter or the groove width of each pit can be set to ~25 times the wavelength ^ in terms of a half width value. Preferably, 〇.〇25 times~1〇 times ‘more preferably 〇 〇5 times 〜2 5 times ^ is 0.2 5 times 〜2 times. The half of the center line between adjacent rows of pits: the distance of the direction (orbital interval) can be set to (10) times the wavelength λ, preferably 0.05 times to 2 times, more preferably 〇 1 times to 5 times times 2 times Times. For example, it is possible to use a laser beam having a wavelength of 4 〇 5 legs to be separated from each other by 0.1 mm in the longitudinal direction and in the circumferential direction to form a pit of #0·3 _. City (P1 Can) 13 201012580 31196pif.doc Recording material layer ° # 对 to absorb processing laser light. = = light: ' By the recording material layer 22 * The absorbed light is converted into heat, and the irradiation is::, :: rises. Thereby, the recording material layer 22 causes softening, liquid species change = two = chemical composition: Γ:: change and physical change _ movement and disappearance: various changes in the material cause movement to the heart... image or species phenomenon, thereby forming It’s awkward. The tomb, the fine pattern ' is preferably a large proportion of the change in the vaporization, sublimation, or decomposition of the recording material layer 22.

Th— Analy:;s is greater than the reduction rate, preferably greater than or equal to the grip, and more preferably the gasification, sublimation, or decomposition of the material of the material layer 22 is reduced by the slope (the center of gravity t of each temperature increase ratio, and further More preferably, it is greater than or equal to 〇.4%/. 〇. More preferably equal to or greater than 0 (10) ❹ Further, softening, liquefaction, gasification, sublimation, and physical change of at least one change in chemical change and: equal to 2_. More preferably, it is less than or equal to; Ϊ: is small::WC. The reason is that if the transfer temperature is too high, the rate is required. Further, the lower limit of the transfer temperature is preferably: the shot is greater than or equal to the boot, and thus more If the transfer temperature is too low, the shape will be clear with the surrounding temperature ladder. 14 <Processing Laser Light> Recording of the recording material layer 22 The material used is that the absorption rate of the wavelength of the laser light is more ancient than that of the other wavelengths. The wavelength of the absorption peak of the recording material is not necessarily limited = where == the wavelength in the long region is also For processing laser light in the ultraviolet region or red ❹ The wavelength may be any wavelength that can be obtained by recording the laser power to the extent that the pit is formed. For example, when the pigment is used in the recording material, it is preferably small: equal to: ί. According to the recording material. The pigment source can be a laser source that oscillates at a wavelength of nm > 〇 nm , 266 nm > 365 nm ^ 405 nm > 488 nm > 650 coffee, _la, 7δ 〇 belly, 830 (10), etc. The source is a laser source such as a gas laser ((4)), a solid state laser (J state laser), a semiconductor laser (semie〇nd (10) sink _ Γ). It is preferable to use a laser light source that can freely change the light-emitting interval. For example, a semiconductor laser is preferably employed. (4) For the (10) work catching 'the laser power of the light when processing (the illumination is better than the power of X. However, the higher the laser power, the faster the scanning laser light must be used to scan the recording material layer 22 ^ For example, 'the rotation speed of the object to be processed must be increased. Considering the square, the upper limit of the speed 'the upper limit of the laser power is preferably (8) w, more preferably low' and even more preferably 5w, The best is 1W. Again, the laser power 15 201012580 31196pif.doc

The lower limit value is preferably o.l mW, more preferably 0.5 mW, and still more preferably J mW. <Configuration of Optical Processing Head> Next, the configuration of the optical processing head according to the present embodiment will be described. Fig. 3 is a schematic view showing a configuration of an optical processing head constituting a laser processing apparatus. As shown in Fig. 3, the optical processing head η is provided with a laser light source 26 that emits laser light. In the present embodiment, a semiconductor laser (Lee diode: LEK Laser Diode) that oscillates at a predetermined wavelength is used as the laser light source 26. On the light exit side of the laser light source 26, a diffraction grating 28 for diffracting incident light is arranged in order from the side of the laser light source 26, and polarized light in a predetermined direction is transmitted and orthogonal to the polarized light. A polarization beam splitter (polarizad〇n b_ splitter) 30 that reflects in the direction of polarization. The diffraction grating 28 may be any optical element having a function of dividing the incident laser light into a plurality of laser beams by diffraction. For example, a grating, a full picture (h〇l〇gram), or the like can be used. On the light transmission side of the polarization beam splitter 30, a collimating lens (c〇llimat〇rlens) 32 is sequentially arranged from the side of the polarization beam splitter 3, and linearly polarized light is converted into circularly polarized light or circularly polarized light is converted into linearly polarized light. The 1⁄4 wavelength plate 34 and the objective lens 24. On the other hand, on the light reflection side of the polarization beam splitter 3A, a cylindrical lens 36 is arranged in this order from the side of the polarization beam splitter 30, and the received light is converted into an electric light corresponding to the amount of light. Light detecting element 38 of the signal. Further, the objective lens 24 is movably held by a holding member (not shown) 16 201012580 31196pif.doc. A focus actuator (focus actuat C) 104 and a tracking actuator (tracking actuat) 42 are disposed in the vicinity of the objective lens 24. The focus actuator moves the objective lens 24 in the optical axis direction. Further, the tracking actuator 42 moves the objective lens 24 in the radial direction of the object 10. Further, the optical processing head 14 is provided with a supporting member (not shown) such as a support substrate. The above-described respective members constituting the optical processing head 14 are supported by the supporting member (not shown). Further, referring to Fig. 7, the laser light source 26 is connected to a laser driver 50, and is driven by the laser driver 5''. The photodetecting element 38 is connected to an amplifying circuit 58 and outputs an electrical signal to the amplifying circuit 58. Further, the electric signal amplified by the amplifying circuit 58 is input to a servlet circuit 6〇. Each of the focus actuator 4'' and the tracking actuator 42 is connected to the servo circuit 6''. Here, the operation of the optical processing head 14 will be described. The laser source 26 is driven by the laser driver 5 to emit laser light. The laser light emitted from the lightning source 26 is diffracted by the diffraction grating 28, and is branched into a horizontal laser beam including a pop beam and a sub-beam. In the present embodiment, the branch has a different traveling direction. The three beams of laser light, that is, the secondary diffracted light, _, 1, the diffracted light 'αχ and the +1st-order diffracted light are explained. The sub-diffraction is the main beam MB of the processing laser light. The diffracted light and +1: the human diffracted light is the sub-beam SB and the sub-beam SB2 which become the tracking laser light. The three laser beams branched by the diffraction grating 28 are respectively transmitted through the partial mirror 3 〇 'Becomes parallel light in the collimator lens 32, converts from linearly polarized light to circularly polarized light at 1/4 wavelength 34, and then strikes the objective lens ^. The three laser beams that are incident on the objective lens 24 are focused on the object to be processed 10 17 201012580 31196pif.doc The surface 10a is condensed and irradiated onto the object to be processed. As described below, 'the main beam and the sub-beam SB are formed on the surface 10a of the object 10 to be processed. And three beam spots corresponding to the sub-beam sb2. On the other hand, three laser beams that are irradiated onto the object to be processed A part of the laser beam is reflected on the surface 10a of the object 10. The reflected laser light (reflected light) becomes parallel light in the objective lens 24, and is converted from circular polarization to linear polarization in the 1⁄4 wavelength plate 34. The light is collected by the collimator lens 32, and then incident on the polarization beam splitter 30. The reflected light whose polarization direction is reversed is reflected in the polarization beam splitter 30, and then astigmatism is generated in the lenticular lens 36, and then emitted. The light-detecting element 38 side is reflected by the light detecting element 38, and each of the reflected light that is reflected and returned on the surface 1〇& of the object 10 is detected by the light detecting element 38. It is converted into an electric signal and output to the amplifier circuit 58. The electric signal amplified by the amplifier circuit 58 is supplied to the servo circuit 6A. Next, the irradiation position and irradiation of the laser light irradiated on the surface 1〇a of the object 1〇 are irradiated. Fig. 4 is a schematic view showing a state in which laser light is irradiated onto the surface of the object to be processed. X indicates a rotation direction, and Y indicates a radial direction. As shown in Fig. 4, the diffraction grating 28 branches. The three laser beams, that is, the main beam MB, the sub-beam SB, and the sub-beam SB are respectively incident on the objective lens 24 via the optical system, and are collected by the objective lens 24 and then irradiated onto the object 10 The surface l〇ae is formed on the surface 10a of the object 10, and three beam spots are formed corresponding to the respective beams of the main beam MB, the sub-beam SB, and the sub-beam SB. In the order of the sub-beams 18 201012580 31196pif.doc SB], the main beam MB, and the sub-beam SB2, the three beam spots are arranged in a one-dimensional shape along the radial direction of the object 10 from the inner peripheral side. . Further, the sub-beam SB] and the sub-beam SB2 are formed to be spaced apart from each other by a predetermined interval with respect to the main beam MB. In the present embodiment, a case will be described in which a pit row (orbit) arranged in a concentric shape is sequentially formed from the inner peripheral side to the outer peripheral side in the processed region of the processed object 10 in the form of a disk. ). The distance in the radial direction (the lane interval) between the center lines of the adjacent pit rows is set to "D". As described below, in the present embodiment, the control is performed such that the track interval D is always kept constant. In Fig. 4, the processed region A is on the inner peripheral side, and the unprocessed region ^ is on the outer peripheral side. In the "additional area B" between the processed area A and the unprocessed area c, the processing laser light is irradiated to form a pit. Each optical system is adjusted such that the center point of the beam spot of the sub-beam SB on the inner circumference side is located on the center line CLin of the outermost track of the processed area A, so that the center of the beam spot of the main beam MB The point is located on the center line CL〇m of the track adjacent to the outer peripheral side, thereby determining the reference position of the beam spot. Each of the main beam MB, the sub-beam SB, and the sub-beam SB2 is a beam generated by branching the laser light emitted from the two laser light sources 26, and is irradiated to the processing object via the same optical system. The surface of the object 10 is l〇a. Therefore, the positional relationship of the three beam spots is always kept fixed. When the positional deviation is generated, the three beam points are moved by the same distance in the same direction. Tracking control is performed using the above-described fixed positional relationship such that the center point of the beam spot of the sub-beam side SB] is always located on the center line CLin of the outermost track of the processed area 19 201012580 31196pif.doc A . That is, the position of the objective lens 24 in the radial direction is adjusted by the tracking actuator 42. Thereby, the center point of the beam spot of the main beam MB is always located on the center line CL〇ut of the obedience in processing. In other words, the main beam MB is irradiated onto the object 1 while the sub-beam SB! is irradiated onto the outermost periphery of the processed area a to detect the reflected light of the sub-beam SB1 and perform tracking control. The formation of the singer = column. Thereby, a plurality of pit trains (tracks) arranged in a circular shape can be sequentially formed by the fixed track pitch D. Further, the tracking control is performed along the processed lane adjacent to the track in the process. Therefore, even at the time of high-speed machining, the offset of the machining position due to the shaft vibration is less likely to occur. Moreover, it is possible to prevent the processing of the processed area from being repeated, that is, to prevent overwriting. Further, the reflected light of the main beam MB is detected and subjected to focus control, which will be described hereinafter. Road

Further, for the track originally formed (hereinafter referred to as "reference track"), the above-described method cannot be used to form the pit train. Therefore, it is preliminarily shaped by another method which is less likely to cause a shift in the I position caused by the shaft vibration, and the reference is executed. For example, another high-precision laser processing with small shaft vibration is prepared, and other laser processing devices are used to shape the quasi-track. Alternatively, the laser processing apparatus according to the embodiment may form a reference trajectory at a low speed at which the shaft vibration is small. For example, when the inner circumference side of the object 10 is sequentially formed on the second side, the innermost circumference reference rail 20 is formed in advance. 201012580 31196pif.doc Regarding the irradiation intensity and wavelength of the main beam MB, such as "plus As described in the light, the "irradiation intensity and wavelength" suitable for forming a pit on the heat-induced layer is appropriately selected. For example, when the recording material for recording the layer is used, the wavelength of the tow_ is preferably faintly equal to the wavelength of 1_rnn. The irradiation intensity of the main beam MB is preferably 〇1 mW to 1 (8) in consideration of the K degree of the object to be processed.

On the other hand, the "irradiation intensity and wavelength" of the laser beam, that is, the sub-beams SBi and SB2, are adjusted to the "irradiation intensity and wavelength" of the pit on the recording layer of the thermal mode. As described below, the irradiation intensity of L = MB, the sub-beam SB, and the sub-beam % is completely transmitted via the laser driver 50 by the control unit 44 (see Fig. 7). The adjustment of the ratio of the main beam MB, the sub-beam SB], and the irritating intensity of the sub-beams, and the adjustment of the wavelength are performed by the diffraction grating 28. If the main beam MB and the sub-beam SB are assumed And the sub-beam SB2 is the same wavelength of the laser light', it is preferable to adjust the irradiation intensity of each of the sub-beam SBi and the sub-beam 2si to be half of the irradiation intensity of the main beam MB, so that the sub-beam is not The beam is used to form a pit. More preferably, the irradiation intensity of each of the sub-beam and the sub-beam SB2 is adjusted to be 10% to 15% of the irradiation intensity of the main beam MB. In the present embodiment, the case where a plurality of tracks are sequentially formed on the inner peripheral side and the outer peripheral side of the object to be processed is described. However, the outer peripheral side to the inner peripheral side of the processed object 10 may be used. A plurality of tracks are formed in sequence. At 21 201012580 31196pif.doc, in the case of '- facing the reflected light of the sub-beam on the outer circumference side and performing tracking control, the main beam MB is measured to form a signal (4). ",,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, = The three beam points (four) are arranged obliquely to the half of the additive object 1Q. In this case, the _ odor arranged along the radial direction Y can narrow the track spacing D and form a finer In addition, in the figure 5, the X also indicates the direction of rotation. In addition, the added area is in the inner system, and the unprocessed area C is on the outer peripheral side. The processed area has been processed between the area Α and the unprocessed area c. Control and Focus Control> Next, a description will be given of a method of tracking control and focus control. Fig. 6 is a plan view showing a configuration of a light detecting element which is not provided to the optical head. As shown in Fig. 6, the light detecting element is %. The photodetector 7 对 for detecting the reflected light of the main beam excitation is provided, and the reflected light of the sub-beam is reflected

The photodetector 72 and the photodetector 74 that detects the reflected light of the sub-beam %. (Focus Control) The detection of the reflected light of the main beam mb is performed by a four-divided photodiode photochode which divides the rectangular light receiving region by four. Each of the four divided regions is set as a sensor a, a sensor b, a sensor c, and a sensor d. The position of the lenticular lens 36 is sensed such that when the main beam is focused on the surface 10a of the object 10 as indicated by the dotted line, that is, when the focus is uniform, the beam of the reflected light The point MBr is a perfect circle and is located at the center of the 4-divided photodiode. In this case, if the electrical signals output from the respective sensors are set to a, b, c, and d, Bellow J (a + d) - (b + c) =0.

The astigmatism is generated by the light of the lenticular lens 36. Therefore, at the focus position of the lenticular lens 36, the beam spot MBr of the reflected light is a perfect circle, but if it deviates from the focal position of the lenticular lens 36, the beam spot MBr of the reflected light is elliptical or oblong. When the main beam MB is not focused on the surface i〇a of the object 1〇, the beam spot MBr of the reflected light is an ellipse or an oblong, and (a+d)−(b + c) is turned off. The value of "(a+d) _ (b + c)" is called focus residual. The electrical signals a, b, c, and d detected by the photodetector 70 are amplified in the amplifying circuit 58. It is then supplied to the servo circuit 6A. A focus error signal is generated in the servo circuit such that (a + d) ~ + 〇 = 〇. Based on the focus error signal, the focus actuator 4〇 = the position of the objective lens 24 disposed in the optical processing head 14 in the optical axis direction. In other words, the objective lens 24 is moved toward the first direction in such a manner that the concave surface of the surface 1〇a corresponding to the object 1〇 is placed on the surface. Thereby focus control is performed. Glaze side (tracking control) The photodetector 72 θ ^ that detects the reflected light of the beam SB1, and the rectangular light-receiving area is divided into two sub-divisions, two sub-divisions: Ϊ 2 divided regions are used as sensors The photodetector 74 that detects the reflected light of L1, the sensor d, and SB2 is composed of a two-divided photodiode that divides the light receiving region of the moment 23 201012580 31196pif.doc. Each of the divided regions is set as the sensor L2 and the sense 痣R2. Since the photodetector π has the same configuration and the same function as the photodetector 74, the following description will be made on the case where the tracking control based on the reflected light detected by the photodetector 72 is performed.

The position of the lenticular lens 36 is adjusted so that the light beam of the reflected light is reflected when the center point of the beam spot of the sub-beam SB is located on the center line CLin of the outermost circumference of the processed region as indicated by the dotted line. Point 86^ is a perfect circle and is located at the center of the 2-divided photodiode. In this case, if the electrical signals output from the respective sensors are set to L!, R, then h - on the other hand, the center point of the beam spot of the sub-beam SB is located at the center line CLin away from the obedience The position of the beam SBlr of the reflected light is elliptical or oblong, and L] - Yin Hao.

The electrical signal L and the heart detected by the photodetector 72 are amplified in the amplifying circuit 58, and then supplied to the servo circuit 60. A tracking error signal is generated in the servo circuit 6A so that ^1^^=0. Based on the tracking error signal, the position of the objective lens 24 provided in the optical processing head 14 in the radial direction is adjusted by the tracking actuator 42. That is, the objective lens 24 is moved in the radial direction so that the center point of the beam spot of the sub beam SB^ is located on the center line CLin of the outermost track of the processed region. This allows tracking control. > Further, in the above description, the case where the tracking control is performed based on the difference signal "L] - heart" has been described, but the tracking control may be performed based on the sum signal "L] + "". That is, the tracking control can be performed based on the total amount of reflected light of the 24 201012580 31196pif.doc beam SB! detected by the photodetector 72. When the center point of the beam spot of the sub-beam SBi is located on the center line CLin of the outermost track of the processed region, the light intensity of the reflected light detected by the photodetector 72 is maximum. The maximum value of the light intensity of the reflected light of the sub-beam SB!, that is, the maximum value of the sum signal "L] + R]" can be obtained in advance. Therefore, a tracking error signal is generated in the servo circuit so that the value of the sum signal "L] + Ri" becomes

The maximum value obtained first. Based on the tracking error signal, the position of the objective lens 24 placed in the optical processing head 14 in the radial direction is adjusted by the tracking actuator 42. <Overall Configuration of Laser Processing Apparatus> Next, the overall configuration of a control system including the laser processing apparatus will be described. Fig. 7 is a block diagram showing the overall configuration of a laser processing apparatus according to the present invention. As shown in Fig. 7, the spindle motor 12 includes a spindle motor 12 for rotating the object 10; the optical processing head 14 irradiates the laser beam to the surface 1Qa of the image-reading object 1G; the stepping motor 16, and the optical processing head 14 is opposed to The object to be processed 1Q is moved and the control unit 44 controls each part of the laser processing apparatus. A frequency generator material is mounted on the spindle motor 12, and this frequency produces a frequency-generated 'FG) pulse signal at a frequency corresponding to the number of revolutions of the spindle motor 12. The frequency generator is connected to the servo circuit 6G and is connected to the control unit 44. The stepping motor 48 is connected to the control unit 44 by a motor controller (m〇t〇r driver) that drives the stepping motor 16 to control the motor driver 48 (Foot 25 201012580 31196pif.doc controller) 46. The laser light source 26 of the optical processing head 14 is connected to the control unit 44 via a field drive benefit 50 that is driven by the laser light source 26. A countermeasure circuit for adjusting the irradiation waveform of the field light is connected to the laser driver 5''''''''''''''''''''''' Generated part%. Each of the countermeasure circuit 52, the laser power control circuit 54, and the pulse generation unit % is connected to the control unit 44. The light detecting element 38 of the optical processing head 14 is connected to an amplifying circuit 58 that amplifies the input electric ® . The amplifying circuit % is connected to the control station 44 via a decoding WdeeGdeO 62 which decodes the electrical signal into a computer (c〇mputer) readable data (her). Further, the amplification circuit 58 is connected to the feeding circuit 6A, which generates a focus error signal and a tracking error signal based on the amplified electric energy. Each of the focus actuator 40 of the optical processing head 14 and the tracking actuator 42 is connected to a focus error signal and a tracking error output switching circuit 6A. Further, the servo circuit 60 is connected to the control unit 44 and is also connected to the spindle motor 12. ❹ Control unit 44 includes a central processing unit (Central pr〇cessing)

Unit CPU), read only s remembrance (Rea (j 〇niy Memory, R〇M), and random access δ 忆 Access (Rand〇m Access Memory, RAM). Control. 卩 44 is stored in r〇 The program of m (pr〇gram) controls each part of the laser processing apparatus' and mainly controls the laser processing of the object to be processed. The control unit 44 is connected to the memory processing 26 201012580 31196pif. A memory (such as doc data) 66. Further, a control unit 44 is connected to: a person: (pers0nal Computer, Pc) 68 as a data input unit for inputting a processing material. <Laser processing Program> Next, the procedure of the laser processing of the laser processing apparatus shown in Fig. 7 will be described. The control unit 44 controls each part of the laser processing apparatus in accordance with the program stored in R〇M. In addition, the laser processing for the opening and closing of the object is performed on the processing object. In addition, the processing object for forming the plurality of pit rows on the object 1 is pre-memorized to process the object 1G. a rotating core mounted to a laser processing device ( With reference to =1), it is in a processable state, and a switch (not shown) of the f-processing device is operated to supply electric power to the device and the portion. Thereby, the memory is read and stored in the control unit 44. R0: A program for performing a laser processing process (Cong ine) = This is a laser processing process in which the above-described processing method of the laser processing is performed. The laser light source 26 is made at the same time as the power supply. The lamp will not be able to form a shape of 1〇5. The laser light of the irradiation intensity and wavelength will be irradiated to the object to be processed, and the processed material will be read from the δ-remembered body 66 first. Information on the pits of the Xun Hang. The information on the pits includes information on the position of the coordinates of the position on the object 10 and the shape information of the pit, size, depth, etc. Secondly, based on the self-memory 66 The processing data is obtained from the rotation center Q on the object 10 to be processed from each of the 27 201012580 31196pif.doc pits. The rotation center Q can be calculated based on the position information contained in each pit information. The distance is again based on reading from the 5th memory 66 The processing data is used to derive the irradiation waveform and the irradiation intensity of the laser light irradiated to the object to be processed for forming each pit for each pit, and generate pit formation information for each pit (irradiation waveform information and Radiation intensity information • Then 'sort the pit formation information of all pits according to the order in which the pits are formed. Also 'calculate the distance between the adjacent pits in the circumferential direction (the pit spacing). The distance calculated by the center Q, the pit _ formation information (irradiation waveform information and illumination intensity information), and the pit interval are memorized in the memory 66. The information on the irradiation intensity is information indicating the intensity of the processing light to be irradiated in order to form a desired long product (length of rotation), depth, and shape of the pit. The irradiation time and the irradiation intensity are determined by the amount of irradiation (irradiation energy) necessary for the formation of the pit, based on the processing data;

The information of the pit is calculated to calculate the irradiation time and the intensity of the irradiation. 'S in the illumination intensity information' includes the strong value of the bee value in the illumination waveform

The ratio of Pn to the bias intensity Tn (hereinafter referred to as "irradiation 〇 Τ Τ Τ Τ η value"). In order to form a fixed pit which is independent of the distance from the center of rotation q' and the pick-up, the Pn/Tn value of the illumination waveform is calculated corresponding to the distance from the center of rotation #.V. The 越η/Τη value of the irradiation waveform becomes smaller as the pit is formed on the side. The illuminating waveform is a waveform indicating the irradiation rate of the processing laser light. The time from the rise to the fall of the illumination waveform is $ 28 201012580 31196pif.doc , which corresponds to the length of the (four) pit that f forms (four) the number of pulses "Μ" and determines that the change of β will correspond to the illumination waveform. The processing rate is such that the irradiation light for processing the irradiation intensity is irradiated to the object 1 (), thereby forming the irradiation time of the laser light for irradiation and the length corresponding to the irradiation intensity, The shape and the depth of the pit. Actually, the 'irradiation waveform is output in synchronization with the clock signal, and therefore, the illumination waveform input to the laser light source 26 becomes a waveform that is circulated in synchronism with the clock signal. The irradiation waveform is corrected based on the value of ρη/τη of the irradiation waveform, and the irradiation intensity of the processing laser light is adjusted. Further, there is a case where the desired pit shape cannot be obtained by irradiating the waveform. In the pattern type recording material layer, there is usually a tendency that the pit formed by the formation of the end point is compared with the formation start point of each pit. Further, there is an object 1 by adding 1 object. Rotation speed And the intensity of the irradiated laser light causes the adjacent pits to be connected. Therefore, in order to obtain the desired pit shape, a one pulse type, a multipulse type, and an L shape () are appropriately selected. Irradiation waveforms such as a scorpion type, a castle type, etc. The irradiation waveform information indicating the irradiation waveform may correspond to the distance between the pits to be formed, the rotation speed of the object to be processed, and the irradiation intensity for forming each pit. The information is pre-memorized in the memory 66. For example, when the distance between the pits, the rotational speed of the object to be processed, and the irradiation intensity are specific set values, it is possible to determine in advance by experiments. The illumination waveform of the pit shape memorizes the illumination waveform information indicating the obtained illumination waveform in association with the set value. 29 201012580 31196pif.doc Next, the pulse frequency information indicating the frequency of the clock signal used as the synchronization signal is generated" . The clock signal is a signal for timing adjustment and illumination time adjustment when the laser beam is irradiated from the optical processing head 14. Specifically, the solution of the clock signal generated by the crystal oscillator (not shown) of the control unit 44 is read, and the read frequency is determined as the reference clock frequency of the optical processing head 14. . The clock frequency corresponding to the change in the distance from the rotation center Q is derived from the reference clock frequency, and is stored in the memory 66 as the clock frequency information.

The driving method for rotationally driving the object 10 is a motor that is rotationally driven at a constant linear velocity (the linear velocity (c Velocity 'CLV) method) and is rotationally driven at a fixed angular velocity. The way (Constant Angular Velocity (CAV)). In the case of the CLV mode, regardless of the distance from the spin centroid, the clock frequency is fixed and the same as the base pulse. In contrast to the case of the CAV method, the time lapse rate changes in accordance with the change in the distance from the rotation center Q. If the innermost peripheral side is in the processing area

When the clock frequency is set to the reference clock frequency, the clock frequency becomes higher on the outside of the off-side. Further, the "moving start signal" for instructing the optical processing head 14 to move to the predetermined position is output to the motor controller 46. The movement start signal includes the amount of movement and the direction of movement of the optical processing head 14. After the movement is started to the controller 46, the motor controller 46 generates a pulse signal corresponding to the movement amount and the moving direction based on the movement, and outputs the pulse signal to the motor driver 48. The motor driver 48 corresponds to a pulse signal supplied from the motor 30 201012580 31196pif.doc controller 46 to cause (4) = 6 rotational drive by the motor crane H 48. 14 is processed along the radial direction toward the first step. The horse violates the 16 drive and the optical processing head moves. For example, when moving from the inner peripheral side to the position corresponding to "^, the machining head U is moved to the position of the machining target, the machining area of the light side corresponds to the position. 9 machining area The reference trajectory is formed in advance on the innermost circumference of the object. The above-mentioned processing is performed on the processing target, and the processing target signal is output to the next. Servo circuit 6〇. The "rotation start path 6" of the rotation is started to start the rotation of the spindle motor === the rotation of the electric object 10 is started. In addition, the "by" is used to make the machining CLV method and the CAV method include The driving method is __/方^ mode information. The rotation is controlled so that the machining is performed on the air speed of the spindle motor 12. The object 1 is started at a fixed angular velocity or a fixed signal focus control. "The light of the control processing head u ^r3mm: the person has the light to make a lack of light, the mouth is full and judged and amplified by the amplifier circuit 58. The input is from the frequency generator 64. The service circuit 6 〇 is based on the self-light detection component 3^^FG pulse charm and the wheel 的 俨 + + + + + + + + + + + + + + + + + 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由 经由The servo circuit 6 阳 is based on the self-frequency pulse signal to control the rotation of the main fine motor U. 31 31 201012580 31196pif.doc Then 'about the one pit to be formed, read from the memory 66 The pulse frequency information ' is output to the pulse generating portion 56. The portion 56 generates a clock signal serving as a synchronization signal based on the input clock frequency information, and outputs it to the laser driver 50. °1 Φ Next, regarding the one pit to be formed, the self-recording body The illumination waveform information and the illumination intensity information are read out, the illumination waveform is output to the countermeasure circuit 52, and the illumination intensity information is output to the lightning protection control circuit 54. The countermeasure circuit 52 selects the illumination corresponding to the input illumination waveform. The waveform is output to the laser driver 5. In turn, the radiation power control circuit 54 outputs the peak intensity information and the bias strength information contained in the input illumination intensity information to the laser driver 5〇 to process the $ The irradiation intensity of the light is adjusted to a desired value. The laser drive 1150 is based on the irradiation waveform information supplied from the self-operated circuit 52, the irradiation intensity information supplied from the laser power control circuit 54, and the synchronization signal supplied from the pulse generation unit 56. The laser source 26 of the optical boring head 14 is driven. That is, the laser driver % is based on: ❹ = (irradiation waveform information, illumination intensity information, and light processing) The light source 26 is driven. In detail, the laser driver 5 is based on the self-radiation degree reduction test = # message, the material circuit 52 and the upper ϊΐ ΐ 修正 correction ' and generates a corrected illumination waveform to obtain a signal surface. The ♦ (four) degree and the deviation = the corrected illumination, *r * and the radiation-driven state 50 ' 'the skin-shaped and timely pulse signal is taken out to the optical processing head 14. The laser light source of 14 uses laser light and clock =::: 32 201012580 31196pif.doc The object to be processed 10 corresponds to the voltage of the processing laser beam that changes in accordance with the corrected illumination waveform. Thereby, the first force of the object 10 is secured. In the region, a concentric pit row (the first debut) is formed. 〇

G, after forming one crater, the light is added: the head 14 is moved to a predetermined position corresponding to the second processing area. The second processing area is a guarding area on the adjacent side of the i-th processing area along the radial direction with respect to the i-th processing area 1G. Then, about the next to be formed! _ „fL pit, read clock frequency information, illumination waveform information, and radiation intensity information from & memory 66. Based on the information to generate laser processing information. Next, the laser driver 50 is based on the generated lightning The processing information is used to drive the laser light source 26 of the pre-processing head 14 to irradiate the jade with the laser light to irradiate the object 10 to be processed. The scale is guided along the first formed first track to track and control the '-surface processing. The second processing region of the object to be processed by the laser beam is formed to form a concentric pit row (second track). By this, the adjacent third track and the second track are separated by the entire circumference. The upper portion is kept fixed. The optical processing head 14 is repeatedly moved and repeatedly formed into a track ' until all the signals contained in the processed material are formed, and multiple tracks are formed in the entire processing region of the object 10 to be processed. Tracking control is performed along a track adjacent to the inner circumference side, and a lower track is formed in the area of the surface, whereby a plurality of tracks can be formed by a predetermined fixed angular interval of the track. Type of recording material > 3 3 201012580 31196pif.doc As the recording material of the heat-induced mode type, a dye-type recording material which has been previously used for a recording layer of an optical recording disk or the like can be used. As a preferable example of the pigment-type recording material, a methine pigment can be cited. (methine dye) (flowering pigment, hemicyaninedye, styryi dye, oxono dye, nectarine, etc.), macrocychc dye (酞Cyanine dye (phthaine dye), naphthalocyanine dye, porphyrin dye, etc., azo dye (including azo metal chelate pigment), alkenylene Allylide dye, c〇mplex _ dye, eoumarin dye, „az〇ie derivative, triazine derivative, 1-aminobutadiene derivative, cinnamicaddderivative^quinophthalone series dye, etc. Among the above materials, "recording" can be recorded only once by laser light. The recording material of the dye type used in the above is preferable because the recording material of the organic compound can be dissolved in a solvent and formed into a film by spin coating or spray mating, and thus the productivity is excellent. The recording material layer preferably contains a secreting element in the recording wave field. In particular, the upper limit of the value of the extinction coefficient k indicating the absorption amount of light is preferably 1 小于 or less, more preferably 5 or less, still more preferably 3 or less, and most preferably 小于'. The reason is that if the extinction coefficient k is too high, the light cannot reach the opposite side from the incident side of the light of the recording material layer, and a uniform pit p of wood is formed. Further, the lower limit value of the extinction coefficient k is preferably greater than or equal to _〇ι, and further 34 201012580 31196pif.doc is greater than or equal to 〇. deleted, and more preferably greater than or equal to. "." The reason is that, in the case where the extinction coefficient k is too low, the amount of light absorption becomes ^, and accordingly, a large laser power is required, resulting in a decrease in processing speed. Further, as described above, the recording material layer must have light and retractability with respect to the recording wavelength. From this viewpoint, the coloring can be appropriately selected or the structure can be changed in accordance with the wavelength of the light source from which the laser light is emitted. For example, when the oscillation wavelength of the laser light source is around 780 nm, it is advantageous that the pigment is selected from the group consisting of pentamethine cyanine dye, oxon〇i dye, and five. Human pentamethine oxon pigment (pentamethine oxon〇i dye), phthalocyanine pigment, naphthalocyanine pigment, and the like. Moreover, when the vibration wavelength of the light source is around 660 nm, the favorable anthraquinone pigment is selected from the group consisting of triacetin cyanine dye, five sulfhydryl quinone pigments, azo pigments, and even An azo metal complex dye, a pyrromethene complex dye, or the like. Furthermore, when the oscillation wavelength of the light source is around 405 nm, the advantageous anthraquinone pigment is selected from the group consisting of a monomethine cyanine dye, a m〇nomethine oxonol dye, Zero 曱 〇 〇 〇 花 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 , η than ί, each bamboo organism, diazine bamboo organism, benzoquinone triterpenoid derivative (benzotriazole 35 201012580 31196pif.doc amin butadiene derivative, quinophthalone pigment, etc. inch, the oscillation wavelength of the light source is near 780nm The case of the case, the case where there is no closeness, and the case of the case where the sample is near 405 nm. A preferred compound of the material of the recording material. Here, the compound represented by '^1 2 (1-1~1- 10) When the oscillation wavelength of the light source is at 780 nm_, the compound (I〗 〖~ιι_8) shown in Chemical Formula 3 is a light source.

Compounds with a vibrational i-wavelength around 660 nm. Further, the compounds (ni-1 to nI-l4) which are not in the chemical formulas 5 and 6 are compounds in which the oscillation wavelength of the light source is in the vicinity of 4 〇 5 nm. Further, the present embodiment is not limited to the case where these compounds are used for the recording material layer. The following 'an example of a compound which forms a recording material layer when the oscillation wavelength of the light source is around 780 nm.

36 201012580 31196pif.doc

37 201012580 31196pif.doc [Chemical 2]

Hereinafter, an example of a compound constituting a recording material layer when the oscillation wavelength of the light source is around 660 nm will be described. 38 201012580 31196pif.doc [Chemical 3]

39 201012580 31196pif.doc [Chemical 4]

Hereinafter, an example of a compound constituting the recording material layer when the oscillation wavelength of the light source is around 405 nm will be described.

40 201012580 31196pif.doc [Chemical 5]

(111-4)

41 201012580 31196pif.doc [Chem. 6]

(111-13) (ΠΙ-14)

Further, it is also possible to use Japanese Patent Laid-Open No. Hei 4-74690 < Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei.

11 334206 Γ Μ 34205, Japanese Patent Laid-Open No. H Patent, Japanese Patent Laid-Open No. (10) No. 4207, 丨, 碉 2000-43423 | A search for special publications 2000-158818 No. 7 42 201012580 31196pif.doc The pigments disclosed in the report. After the coating film is dried, it is dried: this === ^ is equal to the order and - (10). under

Preferably, the upper limit of 15C' is greater than or equal to hunger, and thus more preferably greater than or equal to 27. Hey. Thus, if the coated surface temperature is compensated, uneven coating or coating failure can be prevented, and the thickness of the coating film can be adjusted to be uniform. Further, the above upper limit value and lower limit value may be arbitrarily combined. This = the recording material layer may be a single layer or a jersey layer, and in the case of a multilayer structure, the coating step is performed by a plurality of lower positions to form the multilayer structure. The degree of agroin of the pigment in the eight coating liquid is generally greater than or equal to the weight ratio of G.G1 and "," in a range equal to a percentage of f, preferably greater than or equal to .1 by weight of summer and less than or equal to 1〇. The range of the weight percentage is more preferably a range of G.5 by weight or more and 5% by weight or less, and most preferably a range of 5% by weight or more and 3% by weight or less. Examples of the solvent of the coating liquid include esters such as butyl acetate, ethyl lactate (ethyl), and cellosolve acetate (ceii〇sive coffee); butanone ( Methyl ethyl ketone), cycl〇hexanone, methyl isobutyl ketone, etc. _ (ketone); dichloromethane (diehlGn) methane), 43 201012580 31196pif.doc a chlorinated hydrocarbon such as 1,2-dichloroethane or chloroform; an amide such as dimethyiformamide; methylcyclohexane a chlorinated hydrocarbon such as a methyl cyclohexane; a guanamine such as a dimethyl carbamide; a hydrocarbon such as methylcyclohexane; a tetrahydrofuran, an ethyl ether or a dioxane (dioxane) et al (); alcohol, ethanol, n-propanol, isopropanol, n-butanol diacetone alcohol, etc. ; a fluorine-based solvent such as 2,2,3,3-tetrapropofol (2,2,3,3-tetrafluoropropanol); ethylene glycol monomethy l ether), ethylene glycol monoethyl ether, propylene glycol monomethyl ether, etc., such as glycol ether (giyC〇i ether). The above solvent may be used singly or in combination of two or more kinds of solvents in consideration of the solubility of the dye to be used. Further, various additives such as an antioxidant, an ultraviolet (ultravi〇let) absorbent, a plasticizer, and a lubricant may be further added to the coating liquid depending on the purpose. Examples of the coating method include a spray method, a spin coating method, a dipping method, a roll coating method, a blade coat method, and a doctor blade method. Doct〇r roll method ), doctor blade method, screen printing method (screenprint shouting ^), etc. This is considered to be excellent in productivity and easy to control the film thickness, and it is preferable to use a spin coating method. r, the repellent J is formed by the spin coating method, the recording material layer 44 201012580

°C and less than or equal to 5〇〇t:, preferably with respect to the organic solvent, greater than or equal to 〇3 to 30, Jinshigong μμ &,, π, , ..., owing to the horse, greater than or equal to 150, more preferably greater than Equal to 200. (: and less than or equal to. The temperature of the coating liquid at the time of coating is preferably greater than or equal to the range of hunger and small cockroaches, more preferably 2 generations or more and 40 or less, of which, particularly preferably 25 or more. C is in the range of 3 〇 ° C or less. When the coating liquid contains a coupling agent, examples of the coupling agent include gelatin, ceUul〇se derivative, and polydextrose ( Natural organic polymer substances such as dextran), rosin, rubber, etc.; polyethylene (p〇lyethylene), polypropylene (polypropylene), polystyrene (p〇iyStyrene), polyisobutylene (polyisobutylene) Hydrocarbon-based resin, such as polyvinyl alcohol (p〇lyvinyl ❹ chloride), polyvinylidene chloride (p〇iyVinyiidene chloride), polyvinyl chloride-polyethyl acetate copolymer, etc. , polymethyl acrylate, polymethyl methacrylate, etc., acrylic resin, polyvinyl alcohol, polyethylene chlorid e), epoxy resin, butyral resin, rubber derivative, phenol-formaldehyde resin, etc. 45 201012580 31196pif.doc Initial In the case where a synthetic organic polymer such as a primary condensation is used as a material of a recording material layer, in general, the amount of the coupling agent used is 大于1 or more and 50 times or less with respect to the pigment. The range of the amount (weight ratio) is preferably in the range of more than 0.1 times and less than or equal to 5 times (weight ratio), preferably in the range of 大于.1 times 4 and less than #5 times (weight ratio). Scope. In order to improve the light resistance of the recording material layer, the recording layer may also contain various anti-fading agents. In general, smglet oxygen qUencher is used as an anti-fading agent. The single bear has been disclosed in the publication of a known patent specification, etc.: In the above, the dissolution of the recording material layer is a dye-type recording layer, but the physical properties of the recorded material f can also be used. = Forging (Sp_ing), chemical vapor deposition (Mang gamma ㈣_ Deposition, CVD) or the like film forming method to form the recording material Lo. In addition, in the above embodiment, the following description is made on the case where the laser beam emitted from the laser light source is three laser lights by the diffraction grating, and the diffracted light is set. The sub-beams================================================================================================ 3 There are two or more sub-beams that can be used as tracking laser light. For example, as shown in Fig. 8, the yung-blue mountain source also emits five laser beams by the diffraction grating to project the field shot from the laser light. In this case, 〇46 201012580 川 y〇pif.doc, light can be set as the tracking laser beam: two = beam bundle beam 2, main beam = beam = beam c beam (4) The adjustment of the ratio of the incident intensity, wave·FW e is performed by diffractive grating. In addition, in Fig. 8, ^ is the whole direction, Y is also early, and _ Τ 表 also does not rotate the square table + stupid direction. Further, the protected area Α is on the inner circumference side, and the unprocessed area C is on the outer circumference side. There is a processing area B between the processed C. [The case where the domain A and the unprocessed area ^ are as follows, gp, in the processing region of the object 10 which is the same as the above-described embodiment, is formed in a concentric pattern from the inner peripheral side to the outer peripheral side in order. Pit column (track). The sub-beam SB, the main beam _, the main beam _2, the main beam MB3, and the sub-beam sb2 are respectively adjusted by the diffraction grating and other optical systems to make adjacent beam spots The distance between the centers is the orbital interval D. 0, while detecting the reflected light of the sub-beam SBJ? and the orbital track 'the sub-beam SB' of the outermost circumference of the processed area eight, and controlling the tracking, the three beams, that is, the main beam MB], The main beam should be 2, and the main beam MB3 will be incident on the surface l〇a of the object 10 to form a pit train. Thereby, a plurality of pit trains (tracks) can be sequentially formed at a fixed track interval D. Further, the insect irradiates the main beam mb, the main beam mb2, and the main beam mb3, and simultaneously forms three tracks, so that the speed of the laser processing is improved. Further, similarly to the above-described embodiment, a plurality of tracks may be sequentially formed from the outer peripheral side to the inner peripheral side of the object 10 to be processed. In this case, one side 47 201012580 31196pif.doc detects the reflected light of the sub-beam SB2 on the outer peripheral side and performs tracking control, and irradiates the main beam MB], the main beam MB2, and the main shot to the processing. The object 1 is 〇 and forms a pit train. Further, similarly to the above-described embodiment, as shown in Fig. 5, the beam spot can be arranged obliquely with respect to the half control direction of the object 1〇. ...% hooking as above, but not limiting, the present invention, any person having ordinary knowledge in the technical field, can make some changes and refinements within the spirit and scope of the present invention;

The scope of the invention is defined by the scope of the appended claims. [FIG. 1] FIG. 1 is a perspective view showing a schematic configuration of a laser processing according to an embodiment of the present invention. 2A is a partial cross-sectional view showing an example of a layer configuration of an object to be processed. The figure is a partial cross-sectional view showing the addition. Fig. 2c is a partial cross-sectional view showing the addition. The surface of the object on the surface of the object is irradiated with laser light, and a pit is formed on the surface of the object.

FIG. 3 is a schematic view showing a state in which the outline of the optical processing head constituting the laser processing apparatus is arranged on the surface of the object to be protected. . 6疋 shows the configuration of the photodetecting element provided in the optical processing head, which is shown in Fig. 201012580 jnyopif.doc. Fig. 7 is a block diagram showing the overall configuration of a laser processing apparatus according to an embodiment of the present invention. 8 is a schematic view showing another example of arrangement of beam spots. [Main component symbol description]

10 : object to be processed 10 a : surface 10 b : center 孑 L 〇 12 : spindle motor 14 : optical processing head 16 : stepping motor 18 : rotary table 20 : base material 22 : recording material layer 24 : objective lens 26 : laser light source q 28: diffraction grating 30: polarization beam splitter 32: collimator lens 34: quarter wave plate 36: lenticular lens 38: light detecting element 40: focus actuator 42: tracking actuator 49 201012580 31196pii.doc 44 : Control unit 46 : Motor controller 48 : Motor driver 50 : Laser driver 52 : Countermeasure circuit 54 : Laser power control circuit 56 : Pulse generating unit 58 : Amplifying circuit 60 : Servo circuit

62: Decoder 64: Frequency generator 66: Memory 68: PC 70, 74: Photodetector A: Processed areas a, b, c, d, L], L2, Ri, R2: Sensor B: Processing area ◎ C : Raw area CLin, CLQUt: Center line D: Orbital spacing dp, cis: Diameter L: Rotation axis MB, MB, MB!, MB2, MB3: Main beam P: Xunkeng 50 201012580 jnyopif.doc Q: Center of rotation SB!, SB2: sub-beam SBir, SB21·: beam point X: direction of rotation Y: radius direction

51

Claims (1)

201012580 31196pif.doc VII. Patent application scope: 1. A laser processing apparatus, comprising: a laser irradiation unit, the laser irradiation unit at least comprising a laser light source, and branching the laser light emitted from the laser light source into a main body a diffraction grating having a plurality of beams of a sub-beam having a smaller beam and light intensity than the main beam, and a collecting optical system for collecting the plurality of beams on the surface of the object to be processed in the form of a disk In the laser beam, the strip in the sub-beam is irradiated to the protected region on the surface of the object to be processed, and the main beam is placed on the surface of the object to be processed. a plurality of branched light beams are irradiated onto the object to be processed so that the unprocessed region having the processed portion is not formed; the rotating portion 'rotates the object to be rotated around the rotation axis of the disk; The laser irradiation unit is relatively moved in the radial direction of the object to be processed; and the plurality of light detections H′ are provided for each of the plurality of branched light beams. The reflected reflected light is detected; and the Q tracking control unit performs tracking control when the object to be processed is rotated by the rotating portion, and the tracking control is based on the irradiation detected by the photodetector The intensity of the reflected light of the sub-beam in the I region is adjusted, the position of the laser irradiation portion in the radial direction is adjusted, and the surface is subjected to the tracking control, and the surface of the object to be processed is used by the main beam. The unprocessed area is irradiated, and a plurality of processed portions are formed on the surface of the object to be processed. 52 201012580 jiivopif.doc 2 Bu as patent application scope! The laser processing described in the item is set to ^, the object to be processed has a thermally induced pattern on the surface, and the smaller diameter of the layer is smaller than the beam diameter of the main beam. The laser beam processing according to Item 1 or Item 2, wherein the sub-beam has a light intensity of - half of the upper beam. Q Heart 4. The laser processing apparatus according to any one of Items 1 to 3 of the patent scope, wherein the above-mentioned tracking control unit performs tracking control so that the sub-detection test is performed. The intensity of the beam of the county has become a mosquito test. , TO 5 · such as the scope of patent application! The apparatus for processing according to any one of item 3, wherein the photodetector for detecting the reflected light of the sub-beam irradiated to the processed region is irradiated to a center line in a radial direction of the processed portion The beam point formed by the reflected light of the sub-beam is divided into a 苐1 region and a second region, and the tracking control unit performs tracking control so that the reflection detected in the first region The difference between the light intensity and the intensity of the reflected light detected in the second region is zero. 6. The laser processing apparatus according to any one of claims 1 to 5, wherein the plurality of light beams of the field include at least zero-order diffracted light, -1st-order diffracted light, and +1st-order diffracted light. . The laser processing apparatus according to any one of claims 1 to 6, wherein the plurality of light beams comprise a plurality of main beams for laser processing. 54