TW201008777A - Net material having through-holes and method for manufacturing thereof - Google Patents

Net material having through-holes and method for manufacturing thereof Download PDF

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Publication number
TW201008777A
TW201008777A TW098119863A TW98119863A TW201008777A TW 201008777 A TW201008777 A TW 201008777A TW 098119863 A TW098119863 A TW 098119863A TW 98119863 A TW98119863 A TW 98119863A TW 201008777 A TW201008777 A TW 201008777A
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TW
Taiwan
Prior art keywords
hot
adhesive film
substrate
melt adhesive
hole
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TW098119863A
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Chinese (zh)
Inventor
Toshimichi Harada
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Sony Chem & Inf Device Corp
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Publication of TW201008777A publication Critical patent/TW201008777A/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21Paper; Textile fabrics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/26Presence of textile or fabric
    • C09J2400/263Presence of textile or fabric in the substrate
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023Screens for loudspeakers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Disclosed is a porous net material for which fine adjustment of the aperture ratio is possible, thus enabling fine adjustments to the screening property and the sound-transmission property. The porous net material is comprised of a porous thermobonded sheet of a hot melt adhesive film (F) laminated to one side of a base material (B) which has fine through-holes. The through-holes of base material (B) are formed in a matrix shape, and the through-holes are formed in hot melt adhesive film (F) as the adhesive material thereof cross-links such and passes through the through-holes of base material (B).

Description

201008777 六、發明說明: 【發明所屬之技術領域】 本發明係關於-種具有微細透孔之透孔性 造方法。 不夂,、裂 【先前技術】 Ο 近年來,伴隨電視裝置之大型晝面化,以改善聲音特 性為目的之擴音器的大型化亦持續進展中。以往,各種擴 音器為了防止外部空氣中所含之塵埃或濕氣的侵入,皆配 設有設置多數個透孔之金屬製的衝孔片。近年來該衝孔 片,為了營造高級感而有光澤性(透明性)增高的傾向, 另外為了減低成本而有薄型化的傾向。 又,為了提昇補強性、並謀求隱藏擴音器本體的隱蔽 性、與使擴音器本體所輸出之聲音有效率地朝外部傳音的 透音性的平衡,6提出將橡膠系之液狀接著齊!以溶劑稀釋 塗佈於聚酿網孔材,並將其貼合於衝孔片所形成之透孔性 網材,但該透孔性網材具有貼合於衝孔片時之作業性差、 且對衝孔片之接著性弱、接著強度之變動亦多之問題。 對此,已提出一種技術,係將積層有具有透孔之基材 與熱熔性接著劑膜之透孔性熱接著片用作透孔性網材(例 如’參照專利文獻1等)。 專利文獻1 :曰本專利特開昭59_ 145272號公報。 【發明内容】 然而,隱蔽性或透音性,係視透孔性網材之透孔的開 口率而決定。換言之’為了實現既定之隱蔽性或透音性, 3 201008777 :能採用具有既定開口率之網材。因&,於製造透孔性網 ,時’因所採用之材料而大幅受限,且為了進行隱蔽性或 ,曰f之細微調整,而有難以微調整開口率之問題。 本發明,係有鑑於上述情事而完成者其目的在於提 $種可進仃開口率的微調整、而結果可進行隱蔽性或透 音性之細微調整的透孔性網材及其製造方法。 本發明人,針對利用接著劑之透孔性熱接著片所構成 之透孔性網材的構造,冑自研發出接著劑對基材之特殊附 著樣態,而完成本發明。 亦即,達成上述目的之本發明之透孔性網材,其特徵 在於,於具有微細透孔之基材之單面積層熱熔性接著劑膜 之透孔性熱接著>{所構成,該基材之透孔係形成為格子 狀’而於該熱溶性接著劑膜’隸著劑原㈣以橫越基材 之透孔的方式跨設而形成透孔。 如此之本發明之透孔性網材中,於基材所積層之熱熔 陡接著劑膜的透孔’係藉由接著劑原料以橫越該基材之透 孔的方式跨設而形成,故該基材之透孔的開口部分與該 熱熔性接著劑膜之透孔的開σ部分不—致而為相異者。因 此,本發明之透孔性網材中,係根據基材之開口率、與熱 熔性接著劑膜之開口率,來決定隱蔽性或透音性。亦即, 本發明之透孔性網材,即使使用單一數值之開口率的基 材’仍可藉由改變熱熔性接著劑膜之開口率調整整體之開 口率,從而具有對應該整體之開口率之隱蔽性或透音性。 因此,本發明之透孔性網材中,不需使用各種開口率 201008777 之基材’而僅使用單一數值之開口率的基材,即可進行開 口率之微調整’結果’可因應所需之規格進行隱蔽性或透 音性之細微調整。 又’本發明之透孔性網材之製造方法,係用以製造於 具有微細透孔之基材之單面積層有熱熔性接著劑膜之透孔 性熱接著片所構成之透孔性網材,具備下述步驟:將構成 該基材所通過之夹輥部的輥溫度設定在常溫的狀態下,使 ❹ 得由既定之熔融黏度所構成之該熱熔性接著劑膜之熔融 物,以較該熱熔性接著劑膜之軟化溫度高的溫度做層狀流 出,而供給至該夾輥部之步驟;驅動該夾輥部,將該熱熔 性接著劑膜均一地壓入該基材之單面同時進行塗佈的步 驟;將於該基材塗佈有該熱熔性接著劑膜而成之塗佈物, 藉由既定之乾燥裝置以既定溫度進行乾燥之步驟。 如此之本發明之透孔性網材之製造方法,可製造一種 透孔性網材,其於基材之單面積層有熱熔性接著劑膜,該 e 熱熔性接著劑膜,其接著劑原料係以橫越基材之透孔的^ 式跨設而形成透孔。 本發明之透孔性網材,可藉由改變熱熔性接著劑膜之 開口率,而不需使用各種開口率之基材,僅藉使用單一數 值之開Π率之基材’來進行整體之開口率的微調整,結果, 可因應所需之規格進行隱蔽性或透音性之細微調整。 又,本發明之透孔性網材之製造方法,可製造熱溶性 原料係以橫越基材之透孔的方式跨設而 化成透孔)積層於基材之單面之透孔性網材,故 201008777 ’藉此,可調整接著 以如此之本發明之透 網材’不需使用各種 開口率之基材,可進 因應所需之規格進行 炫性接著劑膜之軟化溫度及熔融黏度 劑之線寬及量’而可改變開口率。而 孔性網材之製造方法所製造之透孔性 開口率之基材,僅藉使用單一數值之 行整髏之開口率的微調整,結果,可 隱蔽性或透音性之細微調整。 【實施方式】 以下,參照圖式詳細說明使用纟發明之具體實施形態。 ^該實施形態,例如圖1所示,為了謀求隱藏被覆擴音 器本體1之共振膜(_e paper)而使塵埃或濕氣難以侵入内 部之隱蔽性、與使由擴音器本體1所輸出之聲音有效率地 發出至外部之透音性的平衡,而於擴音器本體i之正面la 一同配設金屬製之衝孔片2與透孔性網材。 透孔性網材10,係由尼龍紗等具有微細透孔之基材、 與積層有熱熔性接著劑膜之透孔性熱接著片所構成。 基材’例如圖2所示,將以尼龍、聚酯、嫘縈、聚胺 基甲酸酯等合成纖維之織布或不織布、薄毯、紗綸、木棉、 麻等之織布或不織布作為原料之線材3平織成格子狀而構 成。 1條之線材3’係將1條線材單元或複數條線材單元扭 轉成1條之線狀構件所構成,亦可視需要於其表面塗佈三 聚氰胺甲醛樹脂等而形成。 1條線材3之粗度’通常為95 以下。於本發明的情 況下’雖無特別限定,但由上述提高隱蔽性的觀點考量, 201008777 線材3較佳為黑色所構成。又,該線材3平織成格子狀所 形成之透孔4的大小,並無特別限定,但較佳為長徑及短 徑皆為100" m〜2mm。透孔4的大小若未滿i〇“m,則會 導致上述透音性之惡化,而透孔4的大小若超過2mm,則 會損及防塵效果。再者,雖無特別限定,基材每1英吋(ι 英吋約為2.54cm)之開口數,以5〇〜1〇〇為佳。當開口數 未滿50時,會導致透音性之惡化,開口數若超過1〇〇,則 會損及防塵效果。 另一方面,熱熔性接著劑臈,係於基材之單面以2〇vm 〜6〇vm左右的厚度所塗佈之形成有複數透孔之構造。該等 透孔,如後述,藉由控制接著劑之軟化溫度、熔融黏度、 對基材之量,可形成例如圖3所示之熱熔性接著劑膜之接 著劑原料5以橫越該基材之透孔4的方式跨設而分別形成 之大致菱形狀,而非如同基材中之格子狀透孔的形狀。 該熱熔性接著劑膜所使用之接著劑,較佳可使用軟化 _ 溫度為5 0〜6 5 °C者。201008777 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for producing a through-hole having a fine through-hole. In the past few years, the large-scale expansion of loudspeakers for the purpose of improving sound characteristics has continued to progress. In the past, various types of loudspeakers have been provided with a metal punching piece provided with a plurality of through holes in order to prevent the intrusion of dust or moisture contained in the outside air. In recent years, the punching sheet tends to have a high glossiness (transparency) in order to create a high-grade feeling, and it tends to be thinner in order to reduce the cost. In addition, in order to improve the reinforcement and to hide the concealability of the main body of the loudspeaker and the sound transmission of the sound output from the loudspeaker body to the outside, 6 is proposed to be a rubber-like liquid. Then Qi! Dilute and apply to the porous mesh material by solvent dilution, and attach it to the porous mesh material formed by the punching sheet, but the porous mesh material has poor workability when attached to the punching sheet, and There is a problem that the punching sheet has a weak adhesion and a large change in strength. On the other hand, a technique has been proposed in which a through-hole heat-resistant sheet in which a substrate having a through-hole and a hot-melt adhesive film are laminated is used as a transparent mesh material (for example, see "Patent Document 1"). Patent Document 1: Japanese Laid-Open Patent Publication No. SHO 59-145272. SUMMARY OF THE INVENTION However, concealability or transparency is determined by the opening ratio of the through-hole of the through-hole mesh. In other words, in order to achieve the established concealment or transparency, 3 201008777: A mesh material having a predetermined aperture ratio can be used. Because of &, in the manufacture of a transmissive mesh, the material used is greatly limited, and in order to perform concealment or fine adjustment of 曰f, it is difficult to finely adjust the aperture ratio. The present invention has been made in view of the above circumstances, and an object thereof is to provide a through-hole mesh material which can be finely adjusted in aperture ratio and which can be finely adjusted for concealability or transparency, and a method for manufacturing the same. The inventors of the present invention have completed the present invention by developing a special attachment state of an adhesive to a substrate by constructing a porous mesh material composed of a through-hole thermal adhesive sheet using an adhesive. That is, the transmissive mesh material of the present invention which achieves the above object is characterized in that the perforated heat of the single-layer layer hot-melt adhesive film of the substrate having the fine through-holes is followed by The through-hole of the substrate is formed in a lattice shape, and the through-hole is formed so as to straddle the through hole of the substrate in the hot-melt adhesive film '4'. In the transmissive mesh material of the present invention, the through-holes of the hot-melt abrupt adhesive film deposited on the substrate are formed by arranging the adhesive raw material across the through-hole of the substrate. Therefore, the opening portion of the through hole of the substrate and the open σ portion of the through hole of the hot melt adhesive film are not different. Therefore, in the transmissive mesh material of the present invention, the concealing property or the sound transmission property is determined according to the aperture ratio of the substrate and the aperture ratio of the hot-melt adhesive film. That is, the perforated web of the present invention can adjust the overall aperture ratio by changing the aperture ratio of the hot-melt adhesive film even if a substrate of a single value of aperture ratio is used, thereby having an opening corresponding to the whole The rate of concealment or transparency. Therefore, in the perforated mesh material of the present invention, it is possible to perform the micro-adjustment of the aperture ratio without using a substrate having various aperture ratios 201008777 and using only a substrate having a single numerical aperture ratio. The specifications are subtly adjusted for concealment or transparency. Further, the method for producing a porous mesh material according to the present invention is a through-hole structure formed by a porous heat-producing sheet having a single-layered layer having a hot-melt adhesive film on a substrate having a fine through-hole. The mesh material has a step of setting a temperature of a roll constituting the nip portion through which the substrate passes, at a normal temperature, to obtain a melt of the hot-melt adhesive film composed of a predetermined melt viscosity. a step of flowing out at a temperature higher than a softening temperature of the hot-melt adhesive film to be supplied to the nip portion; driving the nip portion to uniformly press the hot-melt adhesive film into the nip roller portion a step of simultaneously applying a single side of the substrate; a coating obtained by applying the hot-melt adhesive film to the substrate, and drying at a predetermined temperature by a predetermined drying device. Thus, in the method for producing a porous mesh material of the present invention, a porous mesh material having a hot-melt adhesive film on a single-area layer of the substrate, the e-hot melt adhesive film, which is followed by The raw material of the agent is formed by traversing the through holes of the substrate to form a through hole. The perforated mesh material of the present invention can be made by changing the aperture ratio of the hot-melt adhesive film without using a substrate having various aperture ratios, and using only a substrate having a single value of opening ratio The fine adjustment of the aperture ratio results in fine adjustment of concealment or transparency through the required specifications. Further, in the method for producing a porous mesh material of the present invention, it is possible to produce a porous substrate in which a hot-melt raw material is formed so as to be traversed through a through-hole of a substrate to form a through-hole. Therefore, 201008777 'By this, the translucent mesh material of the present invention can be adjusted and the base material of various opening ratios is not required, and the softening temperature and the melt viscosity of the dazzling adhesive film can be carried out according to the specifications required for the reaction. The line width and amount 'can change the aperture ratio. On the basis of the aperture ratio of the substrate manufactured by the method for producing a porous mesh material, the fineness of the aperture ratio is adjusted by a single value, and as a result, the concealment or transparency can be finely adjusted. [Embodiment] Hereinafter, a specific embodiment using the invention will be described in detail with reference to the drawings. In the embodiment, for example, as shown in FIG. 1, in order to hide the resonance film (_e paper) of the covered loudspeaker main body 1, it is difficult to infiltrate dust or moisture into the interior, and to be output by the loudspeaker body 1. The sound is efficiently emitted to the balance of the external sound permeability, and the metal punching sheet 2 and the transparent mesh material are disposed on the front surface of the loudspeaker body i. The porous mesh material 10 is composed of a base material having a fine through hole such as a nylon yarn and a through-hole heat-producing sheet laminated with a hot-melt adhesive film. As shown in FIG. 2, the base material is made of a woven fabric of a synthetic fiber such as nylon, polyester, ray, or polyurethane, or a woven fabric or a non-woven fabric such as a non-woven fabric, a thin blanket, a yarn, a kapok, or a hemp. The wire 3 of the raw material is woven in a lattice shape. The one wire 3' is formed by twisting one wire unit or a plurality of wire units into one linear member, and may be formed by applying a melamine formaldehyde resin or the like to the surface thereof as needed. The thickness of one wire 3 is usually 95 or less. In the case of the present invention, although it is not particularly limited, it is considered that the wire 3 is preferably black in view of the above-described viewpoint of improving the concealability. Further, the size of the through hole 4 formed by arranging the wire 3 in a lattice shape is not particularly limited, but it is preferable that the long diameter and the short diameter are both 100 " m 2 mm. If the size of the through hole 4 is less than "m", the above-mentioned sound permeability is deteriorated, and if the size of the through hole 4 exceeds 2 mm, the dustproof effect is impaired. Further, the substrate is not particularly limited. The number of openings per 1 inch (1 inch is about 2.54 cm) is preferably 5 〇 to 1 。. When the number of openings is less than 50, the transparency is deteriorated, and the number of openings exceeds 1 〇〇. On the other hand, the hot-melt adhesive crucible is a structure in which a plurality of through holes are formed on a single surface of a substrate and has a thickness of about 2 〇vm to 6 〇vm. The through-hole, as will be described later, by controlling the softening temperature, the melt viscosity, and the amount of the substrate of the adhesive, an adhesive raw material 5 such as the hot-melt adhesive film shown in FIG. 3 can be formed to traverse the substrate. The through holes 4 are formed in a substantially rhombic shape which is formed instead of the shape of the lattice-like through holes in the substrate. The adhesive used for the hot-melt adhesive film preferably uses softening_temperature For 5 0~6 5 °C.

W 此處,本說明書中,所謂「軟化溫度」,係指維卡軟 化皿度(Vicat Softening Temperature)。又,維卡軟化溫度, 係使用以島津製作所公司製之「島津流動試驗機cft 一 100C」所測定者。 當軟化溫度未滿5(rc時,由於蝕刻等其他之加工熱會 使接著劑再熔融,捲取時會產生結塊等問題。又,若軟化 溫度超過65°C,則於後述製程中除了冷卻熱熔性接著劑膜 時損及流動性而難以形成透孔,其貼合於被接著體之衝孔 7 201008777 片2之際因需要高溫,故該衝孔片2會產生熱變形之問題。 再者,接著劑,若其熔融黏度過高’則薄膜之形成能力會 降低而導致生產性之降低,故15〇 t環境下之熔融黏度以 200Pa · s以下為更佳。此外,熔融黏度若過低,則有時接著 劑容易流動、產生阻塞。 又,接著劑,可使用例如乙烯•乙酸乙烯共聚物、聚 乙烯、乙烯•丙烯酸酯共聚物、共聚合尼龍、聚醯胺樹脂、 丁路樹脂、聚醋樹脂、聚甲基丙烯酸甲酯樹脂等所構成者。 該等之中’由與尼龍等基材之密合性及熔融黏度調整 之容易度的觀點考量’特佳可使用乙烯•乙酸乙烯共聚物 所構成者。 又,於熱融性接著劑膜之積層時,為了延伸為薄,係 使用配合有聚氣乙烯、或聚氣乙烯之可塑劑或安定劑之接 著劑’但該聚氣乙烯,若進行不適當的處理有排出有害物 質的問題,而聚氣乙烯之可塑劑或安定劑,含有苯二甲酸 酯等,故須考慮對環境或人體的影響。因此,接著劑,較 佳為使用未配合該等聚氣乙烯、或聚氣乙烯之可塑劑或安 定劑者。 又’於熱融性接著劑膜,為了形成透孔,亦可視需要 與接著劑一同混合既定之發泡劑。該發泡劑,可使用偶氮 異丁腈、偶氮二曱醯胺等偶氮化合物、二硝酮五亞曱四胺 (dinitronepentamethylenetetramine)等硝酮化合物、對曱笨磺 醯醯肼(paratoluenesulfonylhydrazide)等醯肼化合物' EXPANCEL (日本Fillite公司製)、松本微球一 F (松本油 201008777 脂製藥公司製)$。熱融性接著劑膜,-般而言,厚度較 ㈣㈣㈣’故當厚度形成為4〇”以上 時,較佳為含有如此之發泡劑以使透孔容易形成。 又,雖無特別限定’發泡劑之混合量,相對於接著劑 100重量份’以1〜5重量份為佳。當發泡劑之混合量未滿 1重量份時,熱融性接著劑膜之透孔會難以形成而導致透音 ,而若發泡劑之混合量超過5重量份,則膜形: 〇 劑的延伸會消失而變得脆弱,難以形成薄膜。 再者,於熱融性接著劑膜,亦可視需要添加黏性賦予 :=氧化劑、者色劑等。黏性賦予劑,可使用萜·酚樹 曰^樹脂、«(pinene)樹脂、松香、加氫松香或加氯松 香知等松香衍生物等。 此處,黏性賦予劑,雖無特別限定,但當使用上述乙 稀•乙酸乙烯s旨共聚物所構成者作為接著劑時,由與乙稀· 2酸乙烯_共聚物之相溶性良好、且可更提昇與基材之密 e 合性的觀點,較佳為使用莊•酚樹脂。 又,抗氧化劑,可使用2,5—二一三級丁基氧酿、25 -二-三級戊基氫酿、2,2’,基一雙(4—f基—卜丄 級丁基齡)、4,4,一硫代雙(6—三級丁基—間甲紛)力―, 伸乙基~雙(4—乙基三級丁基紛)等。再者,雖無特 別限定,但由上述之提高隱蔽性 、 之著色劑。 ㈣點,較佳為使用黑色 ::之基材與熱炫性接著劑膜所構成之透孔性網材 ’藉由將基材與熱熔性接著_加以積層’接著劑會流 9 201008777 向基材之線材的周圍,而決定整體的厚度。例如,透孔性 網材10中备基材厚度為95^m時,積層3〇心〜卿m 厚度之熱溶性接著劑膜作成積層體時,整鱧係形成為1〇〇 //m〜105之厚度。而透孔性網材1〇,係藉由將執溶性 接著劑膜側以與衝孔片2接觸的狀態加熱,貼合於衝孔片2 來使用。 如此之透孔性網材1G中,積層於基材之熱雜接著劑 膜之透孔的形狀,係藉由接著劑原料以分別橫越該基材之 各透孔的方式跨設而形成為大致菱形狀,該基材之透孔之 開口部分、與該熱炫性接著劑膜之透孔的開口部分不一致 而成為相異者。因此’透孔性網材1〇令,係根據基材之開 口率、與㈣性接著劑膜之開㈠,來決定上述之 與透音性。 此處,基材之開口率,係藉由選定之該基材之原料而 決定其單-數值。例如,以使每1英时之開口數成為7〇、 100、150、16〇、18〇、、25〇 的方式將粗 之線材 平織為格子狀而構成之基材之開口率,分別如圖4所示為 65%、60%、49%、46%、41%、36%、24%之單一數值每 1英吋之開口數與開口率之間呈線性關係。相對於此,熱熔 性接著劑膜之開口率,可藉由調整形成透孔之接著劑之線 寬或量而任意改變。而該接著劑之線寬或量,可藉由控制 該接著劑之軟化溫度、㈣黏度、㈣於基材之量來調整。 因此,透孔性網材10中’藉由使用單—數值之開口率 的基材、並改變熱熔性接著劑膜之開口率,可調整整體之 201008777 開口率。透孔性網材10中,例如,當使用每i英吋之開口 數為70 (開口率65% )之基材時,可控制整體之開口率為 25%〜55%左右之範圍。其係與使用每吋之開口數為25〇 〜100之基材的情形相同。如此,透孔性網材中可不 需使用各種開口率之基材,僅使用單一數值之開口率的基 材,即可進行開口率之微調整,結果,可因應所需之規格 進行隱蔽性或透音性之細微調整。 參 接著’說明透孔性網材1 0之製造方法。 透孔性網材10,可藉圖5所示之製造裝置製造。首先, 熱熔性接著劑膜F,係將其接著劑原料投入既定之擠製機 21進行熔融混練,再將其熔融物透過設定為既定溫度之τ 模22,以例如3〇Mm〜4〇ym左右之厚度流出為層狀而成 形。 此處,T模22之設定溫度,係以使透過該τ模所流 出之熱熔性接著劑膜F之流出溫度較上述軟化溫度高出ιι〇 ❿ L〜120°C左右的方式,設定為14〇。(:〜180°C左右。 又,當含有發泡劑時,係將接著劑原料與發泡劑一同 杈入擠製機21進行熔融混練。此處,當含有發泡劑時,以 擠製機21將接著劑原料熔融混練之步驟、與將其熔融物透 過T模22流出之步驟,皆須以較發泡劑之分解溫度低之溫 度進行,較佳為較發泡劑之分解溫度低1(rc左右之溫度。 又’製造裝置’亦可為不使用藉M224^T模成型法而使 用充氣成形法者。 如此流出為層狀之熱熔性接著劑膜F,其保持既定張力 11 201008777 而到達有自捲出部23連續捲出之長方形之基材8通過之夾 輥部24。構成該夾輥部24之當中一輥24a,係使用矽酮橡 膠等高耐熱性之橡膠製輥,另一輥24b,其表面係由塗佈有 聚四氟乙烯樹脂等氟樹脂,例如鐵氟龍(註冊商標)之鉻 等金屬製輥所構成。夾輥部24,藉由將該等一對之輥24a、 24b於既定壓力抵接下旋轉驅動,而將熱熔性接著劑膜f均 勻地擠壓塗佈於基材B之單面。此處,夾輥部24係不經加 熱,並藉由溫度設定為17°C〜19°C之常溫的冷卻水冷卻, 以使熱熔性接著劑膜F不附著於輥24a、24b。亦即以ιι〇 C〜120°C左右之溫度流出之熱熔性接著劑膜F,藉由通過 該夾輥部24而被冷卻。又,夾輥部24之壓力,係設定為 使基材B塗佈有熱熔性接著劑膜?之狀態下整體厚度為1〇5W Here, in the present specification, the term "softening temperature" means Vicat Softening Temperature. In addition, the Vicat softening temperature is measured by the Shimadzu Flow Tester cft-100C manufactured by Shimadzu Corporation. When the softening temperature is less than 5 (rc, the other heat of processing such as etching may cause the adhesive to re-melt, and agglomeration may occur during winding. Further, if the softening temperature exceeds 65 ° C, in addition to the process described later, When the hot-melt adhesive film is cooled, the flowability is deteriorated, and it is difficult to form a through-hole. When it is bonded to the punched hole 7 201008777 of the bonded body, the hot plate is generated due to the high temperature, so the punching sheet 2 may be thermally deformed. Further, if the adhesive has a high melt viscosity, the film forming ability is lowered to cause a decrease in productivity, so that the melt viscosity in a 15 〇t environment is preferably 200 Pa·s or less. Further, the melt viscosity is further improved. If it is too low, the adhesive may easily flow and cause clogging. Further, as the adhesive, for example, ethylene/vinyl acetate copolymer, polyethylene, ethylene/acrylate copolymer, copolymerized nylon, polyamide resin, and butyl may be used. It is composed of a resin such as a resin, a polyester resin, or a polymethyl methacrylate resin. Among these, 'the compatibility with the adhesion to a substrate such as nylon and the ease of adjustment of the melt viscosity are considered. • B In the case of laminating a hot-melt adhesive film, in order to extend thin, an adhesive using a plasticizer or a stabilizer of polyethylene gas or polyethylene gas is used. Gas ethylene, if it is treated improperly, has the problem of discharging harmful substances, and the plasticizer or stabilizer of polyethylene gas contains phthalate ester, etc., so it is necessary to consider the influence on the environment or the human body. Therefore, the adhesive, It is preferred to use a plasticizer or a stabilizer which is not blended with the polyethylene or polyethylene gas. Also, in the hot melt adhesive film, in order to form a through hole, it may be mixed with the adhesive as needed. a foaming agent, such as an azo compound such as azoisobutyronitrile or azobisamine, a nitrone compound such as dinitronepentamethylenetetramine, or a sulfonamide. (paratoluenesulfonylhydrazide) is an indole compound 'ExpanceL (made by Nippon Fillite Co., Ltd.), Matsumoto Microsphere-F (made of Matsumoto Oil 201008777 Fat Pharmaceutical Co., Ltd.) $. Hot-melt adhesive film, in general, thickness is (4) (4) When the thickness is 4 Å or more, it is preferred to contain such a foaming agent to facilitate the formation of the through hole. Further, although the amount of the foaming agent is not particularly limited, 100 parts by weight relative to the adhesive. '1 to 5 parts by weight is preferred. When the mixing amount of the blowing agent is less than 1 part by weight, the through hole of the hot melt adhesive film may be difficult to form to cause sound transmission, and if the mixing amount of the blowing agent exceeds 5 parts by weight, the film shape: the elongation of the tanning agent is lost and becomes weak, and it is difficult to form a film. Further, in the hot-melt adhesive film, it is also possible to add a viscosity imparting: = an oxidizing agent, a coloring agent, or the like. As the viscosity imparting agent, a rosin derivative such as ruthenium phenolic resin, «pinene resin, rosin, hydrogenated rosin or chlorinated rosin can be used. Here, the viscosity-imparting agent is not particularly limited, but when it is used as a binder by using the ethylene-vinyl acetate s-copolymer, it has good compatibility with ethylene-2,2-ethylene copolymer. Further, it is preferable to use Zhuang·phenol resin from the viewpoint of further enhancing the adhesion to the substrate. In addition, antioxidants can be used in 2,5-two-three-stage butyl oxidizing, 25-di-tri-pentyl hydroxy hydrogen, 2,2', bis-bis (4-fyl-di-butyl-butyl) 4,4, monothio bis (6-tri-butyl-----------), ethyl, bis(4-ethyltributyl) and the like. Further, although not particularly limited, the coloring agent which enhances concealability as described above is used. (4) Point, preferably a transparent mesh material composed of a substrate of black:: and a heat-resistant adhesive film, by laminating the substrate and the hot-melt layer, the adhesive will flow 9 201008777 The thickness of the entire substrate is determined around the wire of the substrate. For example, when the thickness of the substrate in the transparent mesh material 10 is 95 μm, when the heat-soluble adhesive film having a thickness of 3 〇 〜 卿 卿 卿 作 作 作 作 作 作 作 , , , , , , , , , , 鳢 鳢 鳢 鳢 鳢105 thickness. On the other hand, the perforated web material is heated by being in contact with the punching sheet 2 in a state in which it is in contact with the punching sheet 2, and is bonded to the punching sheet 2. In the transmissive mesh material 1G, the shape of the through hole of the thermal adhesive film laminated on the substrate is formed by arranging the adhesive raw materials across the respective through holes of the substrate. In the substantially rhombic shape, the opening portion of the through hole of the substrate does not coincide with the opening portion of the through hole of the heat-resistant adhesive film, and is different. Therefore, the perforation network material 1 is determined based on the opening ratio of the substrate and the opening (1) of the (iv) adhesive film. Here, the aperture ratio of the substrate is determined by the material of the substrate selected to determine its single-value. For example, the aperture ratio of the base material formed by flattening the thick wire into a lattice shape so that the number of openings per 1 inch is 7〇, 100, 150, 16〇, 18〇, and 25〇 is as shown in the figure. 4 shows a linear relationship between the number of openings per 1 inch and the aperture ratio for a single value of 65%, 60%, 49%, 46%, 41%, 36%, and 24%. On the other hand, the aperture ratio of the hot-melt adhesive film can be arbitrarily changed by adjusting the line width or amount of the adhesive forming the through hole. The line width or amount of the adhesive can be adjusted by controlling the softening temperature of the adhesive, (4) viscosity, and (4) the amount of the substrate. Therefore, in the perforated web 10, the overall opening ratio of 201008777 can be adjusted by using a substrate having a single-value aperture ratio and changing the aperture ratio of the hot-melt adhesive film. In the perforated web 10, for example, when a substrate having an opening number of 70 (opening ratio: 65%) per i inch is used, the overall aperture ratio can be controlled to be in the range of about 25% to 55%. This is the same as the case of using a substrate having a number of openings of 25 Å to 100 per turn. In this way, in the transmissive mesh material, it is not necessary to use a substrate having various aperture ratios, and only a single value of the substrate having an aperture ratio can be used to perform fine adjustment of the aperture ratio, and as a result, it can be concealed according to the required specifications or Fine adjustment of transparency. Next, the manufacturing method of the transparent mesh material 10 will be described. The perforated web 10 can be manufactured by the manufacturing apparatus shown in FIG. First, the hot-melt adhesive film F is subjected to melt-kneading by applying the adhesive raw material to a predetermined extruder 21, and then passing the melt through a τ die 22 set to a predetermined temperature, for example, 3 〇Mm 〜4 〇. The thickness of about ym flows out into a layer shape and is formed. Here, the set temperature of the T-die 22 is set such that the outflow temperature of the hot-melt adhesive film F flowing through the τ mode is higher than the softening temperature by about 1 to 120 ° C. 14〇. (: about 180 ° C. Further, when a foaming agent is contained, the binder raw material is poured into the extruder 21 together with the foaming agent to perform melt-kneading. Here, when the foaming agent is contained, it is extruded. The step of melt-kneading the binder raw material by the machine 21 and the step of flowing the molten material through the T-die 22 must be carried out at a temperature lower than the decomposition temperature of the foaming agent, preferably lower than the decomposition temperature of the foaming agent. 1 (temperature of about rc. The 'manufacturing device' may also be an aerated molding method that does not use the M224^T molding method. The layered hot-melt adhesive film F thus flows, which maintains a predetermined tension 11 201008777, the nip roller portion 24 having the rectangular base material 8 continuously wound out from the take-up portion 23 is passed. One of the rollers 24a constituting the nip portion 24 is made of a rubber roller having high heat resistance such as an anthrone rubber. The other roller 24b is formed of a fluororesin coated with a fluororesin such as a polytetrafluoroethylene resin, for example, a metal roll such as Teflon (registered trademark). The nip portion 24 is made of the same. The rollers 24a, 24b are rotationally driven under a predetermined pressure, and the hot melt is followed. The film f is uniformly extrusion-coated on one side of the substrate B. Here, the nip portion 24 is cooled without being heated, and is cooled by a cooling water having a temperature set to a normal temperature of 17 ° C to 19 ° C. The hot-melt adhesive film F does not adhere to the rolls 24a and 24b. That is, the hot-melt adhesive film F which flows out at a temperature of about 0.25 ° C to about 120 ° C is cooled by the nip portion 24 . Further, the pressure of the nip portion 24 is set such that the substrate B is coated with the hot-melt adhesive film in a state where the overall thickness is 1〇5.

Mm以下,而成為100//m左右之厚度時,壓力為3 cm2左右。 而於基材B塗佈有熱熔性接著劑膜F而成之塗佈物, 係搬入烘箱或乾燥機等乾燥裝置25以既定溫度乾燥,藉由 積層該等基材B與熱熔性接著劑膜F,製造透孔性網材1〇。 此時,於熱熔性接著劑膜F若含有發泡劑,發泡劑會因乾 燥裝置25之加熱而發泡。無論如何,熱熔性接著劑膜f之 透孔,係藉此步驟而形成。特別是,該透孔,係如圖6(A) 至圖6(D)所示,係形成於如下區域:亦即形成於構成該基 材之線材中,相對於該熱熔性接著劑膜在該基材之塗佈方 向朝水平方向延伸之線材’位於該基材中之該熱熔性接著 劑膜之塗佈面側的區域。換言之,熱熔性接著劑膜f,係於 12 201008777 構成基材B之朝水平方向及垂直方向延伸之線材交差的區 域中,相對於熱熔性接著劑膜F在基材B之塗佈方向朝水 平方向延伸之線材與基材B之熱熔性接著劑膜F塗佈面呈 反面側的區域附近,直接殘存於基材B上而形成大致菱形 狀之透孔的頂點,其餘區域則形成為開口。又,圖6(a)至 圖6(D),係顯示對同一規格所構成之基材B塗佈不同物性 之熱熔性接著劑膜F所製造之透孔性網材丨〇之具體例。透 ❺孔性網材10,由会等圖6(A)至圖6(D)可知,即使使用不同 物性之熱熔性接著劑膜F,熱熔性接著劑膜F之透孔,亦同 樣地係藉由該接著劑原料以橫越該基材B之透孔的方式跨 設而形成為大致菱形狀。 而製造裝置,將如此形成有透孔之長方形透孔性網材 10以捲取部26加以捲取,而結束一系列之製程。以捲取部 26所捲取之長方形之透孔性網材1〇,依據被接著體之衝孔 片2之尺寸裁切成既定的大小來使用。 藝 如以上之說明,透孔性網材1〇,即使使用單一數值之 開口率之基材B ’仍可藉由改變熱熔性接著劑膜F之開口率 來微調整整體之開口率,結果,可因應所需之規格進行隱 蔽性或透音性之細微調整。因此,透孔性網材1 〇,與準備 各種開口率之基材以調整開口率的情況相比,亦可期待製 造成本的減低。又,透孔性網材10,由於係使用藉夾輥部 24均勻地積層之熱熔性接著劑膜F,故與以往之使用液狀 接著劑貼合於衝孔片之透孔性網材相比,其貼合於衝孔片2 時之作業性良好,且具有對衝孔片2之接著性強、接著強 13 201008777 度之偏差亦少之優點。 又’本發明並不限於上述之實施形態。 例如,於上述之實施形態,係針對擴音器所使用之網 材說明,而本發明亦可使用於麥克風等其他音響機器之外 箱裝置,又,亦可使用於空調機器等各種過濾器。 如此,本發明,於不脫離其主旨之範圍内可進行適當 地變更。 w 【實施例】 以下,基於實驗結果,說明使用本發明之透孔性網材 之具體實施例。 首先,本發明人,為了以熱熔性接著劑膜之物性的差 異比較特性,而使用下述表丨所示之物性的熱熔性接著劑 膜來製作透孔性網材’評價其隱蔽性及透音性。 [表1] 軟化溫度 150°C熔融黏度 可見光穿锈盎 實施例1 60°C 150Pa·s 45% 比較例1 60°C 250Pa * s 15% 比較例2 — 70°C 150Pa·s 5% 具體而言,實施例1之透孔性網材,係於每丨英吋之 開口數為70(開口率65%)之基材,積層軟化溫度為6(rc、 且於15(TC環境下之熔融黏度為15〇Pa.s之不含發泡劑之熱 ,性接著劑膜而製得。又,比較例1之透孔性網材,係於 每1英吋之開口數為70 (開口率65%)之基材,積層軟化 201008777 溫度為6(TC、且於150°C環境下之熔融黏度為250Pa.s之熱 溶性接著劑膜而製得。再者,比較例2之透孔性網材,係 於每1英吋之開口數為7〇 (開口率65%)之基材,積層軟 化溫度為70°C、且於15CTC環境下之熔融黏度為i5〇pa.s 之熱溶性接著劑膜而製得。又,測定可見光之穿透率來作 為隱蔽性及透音性之指標。 此時’可見光之穿透率’係使用Suga Test Instrument 0 公司之「可見光穿透率•反射率計ηα-tr」測定。 其結果如上述表1所示,實施例1所製作之透孔性網 材之可見光之穿透率為45%,得到對於一般製品之所需之 規格之40%以上之特性。又,將貼合於既定衝孔片之透孔 性網材,使用既定之180。剝離機以拉伸速度300imn/分剝 離所求得之接著力為14N/ 2cm,與使用液狀接著劑貼合衝 孔片之透孔性網材之接著力6N/ 2cm相比更為良好。另一 方面,比較例1所製作之透孔性網材,與實施例1相比由 Q 於熔融黏度高因而無法形成足夠之透孔,故可見光之穿透 率降低’又,比較例2所製作之透孔性網材,與實施例1 相比由於軟化溫度高因而幾乎無法形成透孔,故觀察到可 見光之穿透率大幅降低。 又’求得熱熔性接著劑膜對加熱溫度之熔融黏度的變 化。具體而言,實施例2之熱熔性接著劑膜,係準備軟化 溫度為61.71者。為了與該實施例2進行比較,係準備軟 化溫度為88.4°C者作為比較例3之熱熔性接著劑膜、軟化 溫度為52。(:者作為比較例4之熱溶性接著劑膜、軟化溫度 15 201008777 為85.3°C者作為比較例5之熱熔性接著劑膜。該等比較例3 至比較例5之熱熔性接著劑膜,皆具有不形成透孔之物性。 而加熱該等熱熔性接著劑膜求出各溫度下之熔融黏度,得 到如圖7所示之結果。 如圖7所示,比較例5之熔融黏度曲線,雖與實施例2 之熔融黏度曲線相似,但比較例5之熱熔性接著劑膜之軟 化溫度較實施例2者高,故結果未形成足夠之透孔。因此, 僅將熔融黏度曲線之物性控制得宜亦無法得到適宜之熱熔 性接著劑膜,可知軟化溫度與熔融黏度的組合為重要。 〇 【圖式簡單說明】 圖1,係說明使用本發明之實施形態之透孔性網材之擴 音器之構成之立體圖。 圖2,係說明使用於本發明之實施形態之透孔性網材之 基材之具體例之圖。 圖3 ’係說明本發明之實施形態之透孔性網材之構成之 圖,其說明於圖2所示之基材積層有熱熔性接著劑膜之情 形之圖。 @ 圖4,係說明每1英吋之開口數與開口率之關係之圖。 圖5 ’係說明製造本發明之實施形態之透孔性網材之製 造裝置之構成之圖。 圖6(A) ’係說明本發明之實施形態之透孔性網材之構 成之圖,其說明使用既定物性之熱熔性接著劑膜之透孔性 網材之構成之圖。 圖6(B) ’係說明本發明之實施形態之透孔性網材之構 16 201008777 成之圖,其㈣制與® 6(A)所*之透隸網材所使用之 熱熔性接㈣膜不同物性之㈣性接著劑膜之透孔性網材 之構成之圖。 圖6(C)’係說明本發明之實施形態之透孔性網材之構 成之圖,係說明使用與圖6(A)與圖6(B)所示之透孔性網材 所使用之熱熔性接著劑膜不同物性之熱嫁性接著劑膜之透 孔性網材之構成之圖。When the thickness is about 100/m, the pressure is about 3 cm2. The coating material obtained by applying the hot-melt adhesive film F to the substrate B is carried in a drying device 25 such as an oven or a dryer, and dried at a predetermined temperature, by laminating the substrates B and hot melt. The film F was made to produce a transparent mesh material. At this time, if the hot-melt adhesive film F contains a foaming agent, the foaming agent is foamed by the heating of the drying device 25. In any case, the through hole of the hot melt adhesive film f is formed by this step. In particular, the through hole, as shown in FIGS. 6(A) to 6(D), is formed in a region formed in a wire constituting the substrate with respect to the hot-melt adhesive film. A wire rod 'stretched in the horizontal direction in the coating direction of the substrate is located in a region on the coated surface side of the hot-melt adhesive film in the substrate. In other words, the hot-melt adhesive film f is in the coating direction of the substrate B with respect to the hot-melt adhesive film F in the region where the wires B of the substrate B which extend in the horizontal direction and the vertical direction are formed in 12 201008777. The wire extending in the horizontal direction is in the vicinity of the region on the opposite side of the coated surface of the hot-melt adhesive film F of the substrate B, and directly remains on the substrate B to form a vertex of a substantially rhombic through-hole, and the remaining regions are formed. For the opening. 6(a) to 6(D) show specific examples of the porous mesh material 制造 produced by applying the hot-melt adhesive film F having different physical properties to the base material B of the same specification. . As shown in Fig. 6(A) to Fig. 6(D), it is understood that the through holes of the hot-melt adhesive film F are the same even if the hot-melt adhesive film F of different physical properties is used. The ground material is formed into a substantially rhombic shape by spanning the through-holes of the substrate B so as to straddle the through holes of the substrate B. In the manufacturing apparatus, the rectangular through-hole mesh material 10 thus formed with the through holes is taken up by the winding portion 26 to end a series of processes. The rectangular perforated web 1 entangled by the winding unit 26 is cut into a predetermined size according to the size of the punched sheet 2 of the adherend. As described above, the through-hole mesh material can be used to finely adjust the overall aperture ratio by changing the aperture ratio of the hot-melt adhesive film F even if a substrate B' having a single value of aperture ratio is used. The subtle adjustment of concealment or transparency can be made according to the required specifications. Therefore, the perforated mesh material 1 〇 can be expected to be reduced in comparison with the case where the substrate having various aperture ratios is adjusted to adjust the aperture ratio. In addition, since the fusible web material 10 is a hot-melt adhesive film F which is uniformly laminated by the nip roller portion 24, it is bonded to a through-hole mesh material which is conventionally bonded to a punched sheet using a liquid adhesive. In contrast, when it is bonded to the punching sheet 2, the workability is good, and the adhesion of the punching sheet 2 is strong, and the deviation of the strong 13 201008777 degree is also small. Further, the present invention is not limited to the above embodiments. For example, the above embodiments are described for the mesh used in the loudspeaker, and the present invention can also be applied to other acoustic device enclosures such as microphones, and can also be used in various filters such as air conditioners. As described above, the present invention can be appropriately modified without departing from the spirit and scope of the invention. [Examples] Hereinafter, specific examples of using the perforated web of the present invention will be described based on experimental results. First, the inventors of the present invention used a hot-melt adhesive film of the physical properties shown in the following Table to prepare a transparent mesh material to evaluate the concealability in order to compare characteristics with respect to the physical properties of the hot-melt adhesive film. And transparency. [Table 1] Softening temperature 150 ° C Melt viscosity visible light penetration rust Example 1 60 ° C 150 Pa·s 45% Comparative Example 1 60 ° C 250 Pa * s 15% Comparative Example 2 - 70 ° C 150 Pa·s 5% Specific The perforated mesh material of Example 1 is a substrate having an opening number of 70 (opening ratio: 65%) per inch, and the laminate softening temperature is 6 (rc, and 15 (in the TC environment). The melt viscosity is 15 〇Pa.s, which is not contained in the heat of the foaming agent, and is formed by the adhesive film. Further, the porous mesh material of Comparative Example 1 is 70 openings per 1 inch (opening) The substrate having a rate of 65%) was obtained by laminating softening of a hot-melt adhesive film having a temperature of 6 (TC and having a melt viscosity of 250 Pa.s in an environment of 150 ° C. Further, the through hole of Comparative Example 2 was obtained. The net material is a substrate with a number of openings of 7〇 (opening ratio of 65%) per 1 inch, the softening temperature of the laminate is 70 ° C, and the melt viscosity in the 15 CTC environment is heat of i5〇pa.s. A soluble adhesive film is produced. Further, the transmittance of visible light is measured as an indicator of concealability and transparency. At this time, the 'visible transmittance' is obtained by the Suga Test Instrument 0 company. The rate/reflectance meter ηα-tr" was measured. As a result, as shown in the above Table 1, the transmittance of visible light of the transparent mesh material produced in Example 1 was 45%, and the required specifications for general products were obtained. 40% or more of the characteristics. Further, the through-hole mesh material of the predetermined punching sheet is used, and the predetermined 180 is used. The peeling machine has a bonding force of 14 N/ 2 cm at a stretching speed of 300 imn/min. It is more excellent than the adhesion force of 6N / 2cm of the porous mesh material which is bonded to the punching sheet by using a liquid adhesive agent. On the other hand, the porous mesh material produced in Comparative Example 1 is the same as that of the first embodiment. Compared with Q, the melt viscosity is high, so that sufficient pores cannot be formed, so the transmittance of visible light is lowered. Moreover, the porous mesh material produced in Comparative Example 2 is almost incomparable with Example 1 because of the high softening temperature. Since the through hole is formed, it is observed that the transmittance of visible light is greatly lowered. Further, the change in the melt viscosity of the hot-melt adhesive film to the heating temperature is determined. Specifically, the hot-melt adhesive film of Example 2 is The softening temperature is prepared to be 61.71. For comparison with the second embodiment, The softening adhesive film of Comparative Example 3 was prepared at a softening temperature of 88.4 ° C, and the softening temperature was 52. (: as a hot-melt adhesive film of Comparative Example 4, softening temperature 15 201008777 was 85.3 ° C as a comparison The hot-melt adhesive film of Example 5, the hot-melt adhesive films of Comparative Example 3 to Comparative Example 5 all have physical properties in which no through-holes are formed. The heat-fusible adhesive films are heated to obtain respective temperatures. The next melt viscosity gives the result shown in Figure 7. As shown in Fig. 7, the melt viscosity curve of Comparative Example 5 was similar to the melt viscosity curve of Example 2, but the softening temperature of the hot-melt adhesive film of Comparative Example 5 was higher than that of Example 2, so that the result was not formed. A sufficient through hole. Therefore, it is only possible to obtain a suitable hot-melt adhesive film by controlling the physical properties of the melt viscosity curve, and it is understood that the combination of the softening temperature and the melt viscosity is important. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the configuration of a loudspeaker using a transmissive mesh material according to an embodiment of the present invention. Fig. 2 is a view showing a specific example of a substrate used in a porous mesh material according to an embodiment of the present invention. Fig. 3 is a view showing the configuration of a porous mesh material according to an embodiment of the present invention, and is a view showing a state in which a heat-fusible adhesive film is laminated on a substrate shown in Fig. 2; @ Figure 4 is a graph showing the relationship between the number of openings per 1 inch and the aperture ratio. Fig. 5 is a view showing the configuration of a manufacturing apparatus for producing a transparent mesh material according to an embodiment of the present invention. Fig. 6(A) is a view showing the constitution of a porous mesh material according to an embodiment of the present invention, and shows a configuration of a porous mesh material using a hot-melt adhesive film of a predetermined physical property. Fig. 6(B)' is a view showing the structure of the perforated mesh material of the embodiment of the present invention, which is shown in Fig. 6 (2010), which is made of (4) and the fusible link used in the permeable mesh material of the -6(A)*. (4) A diagram showing the composition of the transmissive mesh material of the (4) adhesive film of different physical properties. Fig. 6(C) is a view showing the configuration of a transmissive mesh material according to an embodiment of the present invention, and is used for the use of the transmissive mesh material shown in Figs. 6(A) and 6(B). A diagram showing the composition of a porous mesh material of a heat-bonding adhesive film having different physical properties of a hot-melt adhesive film.

圖6(D),係說明顯示本發明之實施形態之透孔性網材 之構成之圖,係說明使用與圖6(A)至圖6(c)所示透孔性網 材所使用之熱熔性接著劑膜不同物性之熱熔性接著劑膜之 透孔性網材之構成之圖。 圖7,係說明求得之熱溶性接著劑膜對加熱溫度之溶融 黏度變化之結果之圖。 【主要元件符號說明】 1 擴音器本體 2 衝孔片 10 透孔性網材 21 擠製機 22 T模 23 捲出部 24 夾輥部 24a、24b 輥 25 乾燥裝置 26 捲取部 ❹ 17 201008777 B 基材 F 熱溶性接著劑膜Fig. 6(D) is a view showing the configuration of a transparent mesh material according to an embodiment of the present invention, which is used for the use of the porous mesh material shown in Figs. 6(A) to 6(c). A diagram showing the constitution of a porous mesh of a hot-melt adhesive film having different physical properties of a hot-melt adhesive film. Fig. 7 is a graph showing the results of the change in the melt viscosity of the hot-melt adhesive film obtained at the heating temperature. [Description of main components] 1 Loudspeaker body 2 Punching sheet 10 Perforated web 21 Extrusion machine 22 T-die 23 Winding portion 24 Pinch portion 24a, 24b Roller 25 Drying device 26 Winding unit 2010 17 201008777 B substrate F hot soluble adhesive film

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Claims (1)

201008777 七、申請專利範圍: 種透孔/·生網材’其係由在具有微細透孔之基材之單 面積層有熱熔性接著㈣之透孔性熱接著片所構成, 該基材之透孔,係形成為格子狀, 於該熱炫!生接著劑媒,其接著劑原料係以橫越該基材 之透孔的方式跨設而形成透孔。 ::如申請專利範圍第!項之透孔性網材,其,,該熱熔 性接著劑膜之透孔,係藉由該接著劑原料以橫越該基材之 透孔的方式跨設而形成為大致菱形狀。 3.如申請專利範圍第1項之透孔性網材,其中, 該基材,係既定之線材平織而成者, ,該熱熔性接著劑膜之透孔,係形成於如下區域·亦即 形成於構成該基材之線材中,相對於該熱熔性接著劑膜在 #基材之塗佈彳向朝水平方向延伸之線# ’位於該基材中 之該熱溶性接著劑膜之塗佈面侧的區域。 4.如申請專利範圍第1項之透孔性網材,其t,該熱熔 性接著劑膜’係以軟化溫度》5G〜65<t之接著劑作為原料 者。 5·如申請專利範圍第4項之透孔性網材,其中,該熱熔 性接著劑膜,係以15(rc環境下之熔融黏度為2〇〇Pa.s以下 之接著劑作為原料者。 6.如申請專利範圍第1至5項中任一項之透孔性網材, 其中,於該熱熔性接著劑膜之接著劑原料,含有既定之發 泡劑。 201008777 7.如申請專利範圍 所形成之透孔每1英忖 8.如申請專利範圍第 材’係由粗95"!!!以下之 第1項之透孔性網材,其中, 之開口數為50〜1〇〇。 該基材 7項之透孔性網材,其中, 線材構成。 該基 9.如申請專利範圍第 係由黑色所構成者。 項之透孔性網材,其中,該線材 10 · —種透孔性網材之姻 矸展坆方法,其係用以製造於具有 微細透孔之基材之嚴而接+201008777 VII. Patent application scope: The type of through-hole/·sheng net material is composed of a single-area layer having a micro-perforated substrate and having a hot-melt property followed by a perforated thermal adhesive sheet (4). The through holes are formed in a lattice shape for the heat! The adhesive medium is formed by interposing the through-holes so as to straddle the through-holes of the substrate. :: As claimed in the scope of patents! The through-hole mesh of the item, wherein the through-hole of the hot-melt adhesive film is formed in a substantially rhombic shape by traversing the through-hole of the substrate so as to traverse the through hole of the substrate. 3. The perforated mesh material according to claim 1, wherein the substrate is a flat wire woven fabric, and the through hole of the hot melt adhesive film is formed in the following region. That is, it is formed in the wire constituting the substrate, and the hot-melt adhesive film is placed on the base of the hot-melt adhesive film in the direction in which the coating of the substrate is extended in the horizontal direction. The area on the side of the coated surface. 4. The perforated web of claim 1, wherein the hot-melt adhesive film is a material having a softening temperature of 5G to 65<t. 5. The through-hole mesh material of claim 4, wherein the hot-melt adhesive film is a material having a melt viscosity of 2 〇〇Pa.s or less in a rc environment. 6. The through-hole mesh material according to any one of claims 1 to 5, wherein the adhesive material of the hot-melt adhesive film contains a predetermined foaming agent. 201008777 7. Application The through hole formed by the patent range is 1 inch per inch. 8. If the patent application is the first material of the first item, the number of openings is 50~1〇. The perforated mesh material of the substrate of the seventh item, wherein the wire material is composed of the base material. The base material of the invention is composed of black. The perforated mesh material of the item, wherein the wire material 10 · A method for infiltrating a porous mesh material, which is used for manufacturing a substrate with a fine through hole + ^ 單面積層有熱熔性接著劑膜之透孔性熱 接著片所構成之透孔性網材, 具傷下述步驟: 將構成該基材所通過之夾輥部的輥溫度設定在常溫的 狀態下,使得由既定之熔融黏度所構成之該熱熔性接著劑 膜之溶融物,以較該熱㈣接著劑膜之軟化溫度高的溫度 做層狀流出而供給至該夾輥部之步驟,· 驅動該夾輥部,將該熱溶性接著劑膜均一地壓入該基 材之單面同時進行塗佈的步驟; 將該基材塗佈有該熱熔性接著劑膜而成之塗佈物,藉 由既定之乾燥裝置以既定溫度進行乾燥之步驟。 U.如申請專利範圍第10項之透孔性網材之製造方 法,其中,該熱熔性接著劑膜,係以軟化溫度為5〇〜65t: 之接著劑作為原料者。 12.如申請專利範圍第u項之透孔性網材之製造方 法,其中,該熱熔性接著劑膜,係以15〇力環境下之熔融黏 度為200Pa.s以下之接著劑作為原料者。 20 201008777 13. 如申請專利範圍第10至12項中任一項之透孔性網 材之製造方法,其中,於該熱熔性接著劑膜之接著劑原料, 含有既定之發泡劑。 14. 如申請專利範圍第1〇至13項中任一項之透孔性網 材之製造方法,其中,該基材所形成之透孔每1英吋之開 口數為50〜1〇〇。^ The single-area layer has a through-hole dielectric material composed of a through-hole heat-producing film of a hot-melt adhesive film, and has the following steps: setting the temperature of the roller constituting the nip portion through which the substrate passes is at room temperature In a state in which the melt of the hot-melt adhesive film composed of a predetermined melt viscosity is discharged in a layered manner at a temperature higher than a softening temperature of the heat (four) adhesive film, and supplied to the nip portion. a step of: driving the nip portion, uniformly applying the hot-melt adhesive film to one side of the substrate, and applying the same; applying the hot-melt adhesive film to the substrate The coating is a step of drying at a predetermined temperature by a predetermined drying device. U. The method for producing a porous mesh material according to claim 10, wherein the hot-melt adhesive film is a material having a softening temperature of 5 〇 to 65 t: as a raw material. 12. The method for producing a porous mesh material according to the invention of claim 5, wherein the hot-melt adhesive film is a raw material having a melt viscosity of 200 Pa.s or less in a 15 〇 environment. . The method for producing a porous mesh material according to any one of claims 10 to 12, wherein the adhesive material of the hot-melt adhesive film contains a predetermined foaming agent. The method for producing a porous mesh material according to any one of claims 1 to 13, wherein the number of openings per 1 inch of the through hole formed by the substrate is 50 to 1 Torr. 15.如申請專利範圍第14項之透孔性網材之製造方 法’其中’該基材,係由粗95/zm以下之線材構成。 1 6.如申叫專利範圍第丨5項之透孔性網材之製造方 法,其中,該線材係由黑色所構成者。 17.如申請專利範圍第1〇至16項中任一項之透孔性網 材之製造方法,其中,該熱溶性接著劑膜,係以流出溫度 成為110°C〜120°C之古4 & L , 方式々IL出供給至該夾輥部, 構成該夾概部之輕,总,、, 视係以溫度設定為1 7〇c〜19°C之溫 度的冷卻水冷卻。 、18·如申請專利範圍第17項之透孔性網材之製造方 务其中#成該失輥部之當中一輥,係既定之橡膠製輥, 另一輥,係既定之金屬製輥。 19_如申請專利範圍笛s 祀固第18項之透孔性網材之製造方 法,其中,於該金屬製鲒矣 表裩之表面,塗佈有氟樹脂。 、圖式· (如次頁) 2115. The method for producing a porous mesh material according to claim 14 of the patent application, wherein the substrate is composed of a wire having a thickness of 95/zm or less. 1 6. The method for manufacturing a transmissive mesh material according to Item 5 of the patent application, wherein the wire is composed of black. The method for producing a porous mesh material according to any one of claims 1 to 16, wherein the hot-melt adhesive film is an ancient one having an outflow temperature of 110 ° C to 120 ° C & L, the mode 々IL is supplied to the nip roller portion, and the light constituting the sandwich portion is cooled by the cooling water having a temperature set at a temperature of 17 ° C to 19 ° C. 18. The manufacturing process of the through-hole mesh material of claim 17 of the patent application, wherein one of the rolls of the lost roll portion is a predetermined rubber roll, and the other roll is a predetermined metal roll. 19_ The method for producing a through-hole mesh material according to claim 18, wherein the surface of the metal enamel is coated with a fluororesin. , schema · (such as the next page) 21
TW098119863A 2008-06-13 2009-06-15 Net material having through-holes and method for manufacturing thereof TW201008777A (en)

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