TW201007562A - A copy system and method for IC - Google Patents

Abstract

The present invention relates to a copy system and method for IC, and particularly relates to a copy system and method for IC, which can copy a great deal of data into a great deal of ICs simultaneously. The present invention provides an additional controlling board for supplying the data in the copy system for IC. By this way, it is necessary to get the data from the memory of the copy system for IC. Therefore, the memory of the copy system for IC can not affect the copy process for IC.

Description

201007562 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer burning system and method, and more particularly to a wafer burning system and method capable of simultaneously burning a large amount of information into a wafer, in particular It is a wafer burning system and method for burning with an aging test machine. [Prior Art] In many electronic products, there are memory chips such as Flash, Flash Card or EEPROM. These memory chips need to carry out a series of tests before leaving the factory. Burned into the memory chip. Generally speaking, these memory chips are burned by means of a burning machine, which downloads the burned data to the memory of the burning machine itself, and then burns the data. The one-to-one method is burned in a memory chip. Usually, the number of memory chips in a batch is thousands or even tens of thousands. Therefore, this one-to-one burning method takes a lot of time, which results in a low overall burning performance, which in turn affects the throughput. In addition, with the advancement and multi-functionality of electronic products, the content of the required data for these memory chips has also increased, but it is limited by the memory capacity of the burning machine itself, which is often burned in a large amount. Burning data is not enough for use in a memory chip, and it is impossible to burn a large amount of data on a memory chip. In addition, the cost of replacing the memory of the burning machine itself is often huge, and the overall cost is greatly increased. Therefore, there is a need for a system and method that can simultaneously burn large amounts of data in a large number of wafers. In order to increase the burning efficiency and reduce the burning cost, the memory of the burning machine is not required to be replaced. 5 201007562 [Summary of the Invention] The problem of burning the 3rd and the second is the problem of the current burning machine and the way of burning the film, and the inability to burn the memory crystal due to the burning machine>1 The problem, as well as the cost of g with _ increased _. According to the above object, the present invention provides a technique for providing a wafer burning system for programming a burning main body of a burning command and an inspection command, a control crystal φ φ recording control panel, and a A programming device for accommodating the wafer and recording the recording. The wafer burning (10) is provided by burning the recording machine memory to provide the burning material, the material, and the material to be burned to the burning execution device, and the large amount specified by the burning body is limited by the burning station itself. The memory capacity and the wafer on the programming device can be burned at the same time. Several times, the present invention provides another technical hand P for solving the above problems, and a burning and burning control panel comprising at least one controller and a plurality of burning programs for storing and providing burned materials. Assets. The burning control board is burned by the controller on the controller to receive the burning data and the data in the t setting, and the second programming device needs to download the required burning data to the recording machine itself. Love and ^ record the memory capacity of the machine itself, and "the data extraction device has been burned with the required burning data or firmware, memory chip, and by which to provide burning data or firmware code,:记忆1 The memory chip required for burning data is the material that can be easily replaced by the soil to provide different memory chips. Therefore, this burning 6 201007562 control board can be used for burning any memory chip. The recording is not limited by the insufficient memory capacity. Day β The present invention provides another technical means for solving the above problems, which provides a method for burning a large number of wafers using an aging test system, and the following steps are first provided with at least a controller and one or more, the burning control board of the burning data providing device for recording the burning data, the connection, the electrical connection of the burning control panel and the aging test machine, and the electrical connection and aging test board, Next, the 老化 test is tested by the aging tester: the burned data of 曰η is simultaneously sent to each aaa=upper on the aging test board. Finally, the burned data is burned in the aging test system for burning. This method can be used for the aging test and the aging test. It can be provided before, after, or after the above-mentioned four techniques. Burning the recording machine) its own record of 'pity', without burning the main body (ie burning, therefore, there is no two-body to download and provide burning information to burn more because of burning control 1 Restricted to the memory capacity of the burning machine itself, the required burning data or the recording data provided by Yang in the device, the recorded data or firmware 5 horses, provided by the chip or memory chip The burning of the memory chip can be used for any purpose, and the above hand is not limited by the memory capacity. At the same time, a large number of crystals are used for one-to-many burning. Recording mode 'so you can burn the efficiency. Run the record' and save Recording time and adding 7 201007562 piece of wire ^, the effect of the present invention compared with the prior art is to provide a crystal, device and method, can simultaneously burn a large number of wafers for a large number of wafers and is not limited by burning Recording the memory capacity of the machine itself, and changing the memory of the burning machine itself, or even replacing the burning machine, increases at a cost. In addition, another effect of the present invention is to provide a sufficiency == The wafer rewriting device and method 'saving the burning time'. [Embodiment] 一些 细 f f 一些 一些 一些 一些 一些 一些 一些 一些 一些 一些 一些 一些 一些 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The scope of the present invention is not limited by the scope of the present invention, and the scope of the patent is subject to the scope of the invention. Secondly, the spirit and application scope of the present invention can be pushed or Structure and method of coexistence. Furthermore, the different parts of ^, ί are not completely in accordance with the size of the green, and the upper scale is exaggerated or simplified in comparison with his relevant scale to enhance the understanding of this issue. ":==Technology' is only a key reference here to help "if the second ,, which is a wafer burning system according to an embodiment of the present invention! σ does not mean that the wafer burning system includes _ The recording body 1〇, the programming control board 2G, and the programming execution device 3G, wherein the programming main 351〇 and the programming execution device 3 are electrically connected. The burning main body 10 is used for the summer J2 electric After entering the programming command or the level 4 command, the supervisor 20 issues a check with the wheel to make the wafer burning system burn 201007562 ΐί. The programming control board 2G Qing receives the programming command or the inspection issued by the burning body 10. The instructions are programmed to be burned or inspected, and the required burning data is provided. The burning gf 30 is used to accommodate the wafer, and the burning data provided by the programming control board 20 is burned on the wafers placed thereon. Recorded on the wafer, the second, referring to the first A picture and the second picture, the programming control board 2 控制器 控制器 controller 22 and one or more programming data providing devices, wherein the controller 22 is used to receive the burning body 1烧 的 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The wafer is burned or inspected, and the burn-in data is provided to store or provide the required burn-in data. The controller 22 and the supply device 26 are electrically connected by the electrical diagram on the burn-in control board 20. 22 is a control chip, for example, the above figure can be used to control the wafer, but not limited thereto, the upper = destination controller or control wafer can be used. Each = ΐ 包含 includes a pedestal 24 and - The data chip 25: the m is mounted on the control panel 2 (the connection is shown in FIG. c, and the susceptor 24 is also electrically connected to the data chip 25, so that the burned material in the slab 25 can be burned via the pedestal 24. The circuit is transferred to the controller 22. The data chip is a chip that records the data or the firmware code, or the difference between the requirements for the burned chromium and the burned data, and the second == wafer burn-in replacement. The squeezing control board 20 has a command transmission line 27, and 9 201007562 is located between the burning body 10 of the programming control board 2, and is used for burning. The control board 20 and the programming body 10 are connected to each other, and the programming control boards 20 and 20 have a data transmission line yH. H. In addition, the electrical connection of the control panel is programmed, and the command and programming between the board 20 and the programming execution device 30 = J: 〇 and the programming device 3 〇❹ the test block diagram 3, OK There is a large amount of programming on the device 30. The wafers 34 of the test sockets are limited to the same time, and can be arranged in a daily array, but not in the form. In addition, in the burning: the need for burning The other arrays are shown in the display; the set 30 also has a transmission circuit (the catalogue data is: electrical connection, used to transmit the command and the burner 32 for burning or burning after the inspection. ; _ This ^ month, the burning control panel 20 and the burning execution device i 30 can be separated from each other, such as the first a picture and the m3 〇 烧 burning control board 2G and the record execution ί set and it The data transmission line 28 on the programming control board 2G is connected to the second display. The electric control panel 20 is directly installed in the burning control panel 20 as part of the locking device 30. Execute the sizzling sizzle is the first - Α 或是 or the 所示 所示 ® shows the wafer by doing the following: "When burning" Will be commanded transmission line 27, and input or release - burning command to ^ 201007562 recording control panel 2 〇 or 2 〇, in the controller J recorded command 'controll controller 22 received the order specified burn Recording capital ###^=,,|*:^;^7, reading burning data or insulting i:/: burning in the chip 25 ^ 28 and burning the execution of the seven devices 30 or 30 '中,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Data or _ code, so no ===== = Therefore, the memory chip that can be used to burn the data can be easily replaced with the data chip 25 or the memory chip sample 2 to provide the same memory chip. The burning data, so it is 1 ΐ ^ ^ ^ t , 4 ^ ^ in the burning body or the burning body 10 memory capacity is insufficient. + _When the wafer is burned and the inspection is to be performed after burning, the programming body 10 inputs or issues a command ▲ 11 201007562 to the programming control board 20 or 20 by means of the command transmission line 27 . When the controller 2 receives the inspection command, the controller 22 obtains the data providing device, the burned data or the firmware code, and the programming device 30 or 30. The burned data read by the instruction is checked, and the two are compared. Whether the burned data in the film 34 and the burning data provide the burning data in the inner film 25 of the mounting ^_34 Or the firmware code is the same, and the data in the 资科晶34 is correct. Burning to the wafer ❹ Similarly, since the programming data supply device 26 is placed on its pedestal 24, it has been burned with the required burning f = First, the wafer 25 or the dragon wafer sample is used to provide the code for burning the ^ ^, and is not limited to the six-toner of the burning body 10 itself. In addition, the present invention further provides a burning control panel 2 ( If not, it can be applied to a variety of different burning devices, Insufficient memory capacity caused by the problem = even the problem can be modified by burning the control panel 20 or the Bum In System into a = just wafer, such as the first c picture Ίί The similar structure of the first B picture, what is not the case is the wafer burning system itself shown in Figure _C:

Test system' and the main body 10 is an aging test device J or J ί ί f test? (Burn Ι 〇 ) ven) for accommodating the burning control panel 2 〇盥 environment and providing test signals for aging testing.

Set 30 is an aging test board (Burn In B〇a • such as J test board) with dozens or even hundreds of test seats 12 201007562 34 (such as the first A picture and the first B, even the number A hundred wafers 34 sockets 32 can accommodate a large number of wafers, and can be burned for dozens of rows at the same time. The aging test system shown in Figure C is generally SC = i = old: test There is more between the furnace 1 and the burn-in test board 30 - the burn-in control board 20 is provided for the control of the burn-in 'without the provision of the burn-in test system itself, and thus is not limited to the burn-in test system: Remember yourself =

The amount of φ can be changed by replacing the burning data in the burning control panel 2, without having to consider the capacity of the dragon. In addition, it is not necessary to provide a wafer burning method, and the memory needs to be considered. The limit of Rong #. Referring to the third figure, a flow chart of a wafer burning method of the present embodiment is shown. First, the board (step outline), the burn-in control board has at least "control" and one or more of the burn-in materials of the burn-in data 1 as described above, or the -A map, The first place is not strictly described here. Then, by burning the controller, the green 5, the bearer, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip, the chip And every place where you want to burn the 曰 film. After the connection, the control room according to the burning of the current, the Japanese film supply device 'and read the 'recorded data supply device in the burning two: Miscellaneous 304): Then, turn out the read burn to each H shell 3 〇6) 'The receiver burns the burned data in each wafer (step ^ 3 〇 (8) step 13 201007562

Therefore, the above-mentioned wafer burning method can be performed after the completion of the burning: 2, and the fourth drawing is the inspection S after the completion of the burning of the present invention. First, after the burning is completed, the input-inspection ii information refers to f 400) 'This inspection command contains the reading instructions;: ΐ 丄, data command, and each device to be checked: 11"Read the specified data (steps) according to the inspection instructions, and the controller checks

Step 402 and step - can be step by step; advanced is step = 〇 4 first, and even step moves with step 4 () 4 dozen. Finally, comparing the burning data in the burning data providing device to whether the burning data in the wafer is the same or not, and in addition to the chip burning method, the first C is further used. The wafer firing system disclosed in the figure, while performing a heating step to heat the wafer, and performing an aging test on each wafer (Burning

Test), wherein the s burning step and the aging test step can be performed simultaneously according to requirements, or the burning step can be performed before or after the aging test step. In addition, referring to the fifth figure, the present invention further provides a method of burning a large number of wafers using an aging test system. First, a burn-in control panel is provided (step 500). The burn-in control panel has at least one controller, and one or more burn-in data providing devices for burning the burned materials, and the structure is as described above. I will not repeat them here. Then, the burn-in control board and the burn-in test machine (or the burn-in test furnace) are electrically connected, and the burn-in control board and the burn-in test board are electrically connected (step 502). Then, the controller of 201007562 confirms whether there is a wafer in each position on the aging test board or whether the wafer on each position on the aging test board is electrically connected to the controller, so as to facilitate the burning process. Then, a burning command is input to the controller by the aging test machine (step 504), wherein the programming command includes specifying the programming data providing device to perform the reading command, and 'reading the specified burning data providing device. In the burning data index, 曰: and ^ a bit to be burned on the aging test board and each subsequent, the controller selects the burning data providing device according to the burning command 'and reads the specified burning The data is provided in the device (step / step 506), and then the read burned data is output to the wafer on the aged I (plate) (step 508), and finally, the transferred data is transferred to the wafer. The burned material is burned into the wafer (step 510). Similarly, the above method of burning a large number of wafers using the aging test system can input the inspection command by the aging test machine after the completion of the burning, and the controller reads the burning data in the burning data providing device according to the inspection instruction. The controller reads the programming in the wafer that has been burned on the aging test board according to the inspection instruction, and performs the comparison steps, and performs the inspection steps disclosed in the fourth figure to confirm whether the programming is successful. I will not repeat them here. The 'inspection command includes reading the burn-in data command in the specified burn-in data providing device, reading the burn-in data command in the wafer that has been burned, and the wafer to be inspected on the burn-in test board. position. In addition, the method of burning a large number of wafers using the burn-in test system may include an aging test step. Refer to the sixth figure for a flow chart of the aging test procedure. First, the wafer on the burn-in test board is heated by an aging test machine (or an aging test furnace) to provide a high temperature environment (step 600). Next, the aging K is input per wafer (step), and then the test is performed according to the test (step 604). The method of programming the mother-in-one crystal can be performed with the method of aging test step, after the step (4). Same as or at the same time as the old test steps, or 'in the aging test ; 的 ; = = = = = = = = = = = = = = = = = = = = = = = = = 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供 提供Burning data or firmware code, therefore, the burning of this memory chip is not limited by the memory capacity. Because of the above methods, one-to-many burning method is used, *11 simultaneously for a large number of wafers. Burning, which saves burning time and increases burning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS A is a schematic view showing the structure of a wafer burning system according to an embodiment of the present invention. The first B diagram is a schematic diagram of the structure of a wafer burning system according to another embodiment of the present invention. 16 201007562 The first c-picture is a schematic diagram of the structure of a wafer burning system according to still another embodiment of the present invention. The second figure is a schematic structural view of the burning control panel of the present invention. The third figure is a flow chart of the wafer burning method of the present invention. The fourth figure is a flow chart of the inspection steps in the wafer burning method of the present invention. The fifth figure is a flow chart of the method for burning a large number of wafers using the burn-in test system of the present invention. The sixth figure is a flow chart of the aging test procedure in the method of burning a large number of wafers using the burn-in test system of the present invention. [Main component symbol description] 10 burning main body 20, 20' burning control board 22 controller

24 pedestal 25 data chip 26 burning data providing device 27 command transmission line 28 data transmission line 30, 30' burning execution device 32 test socket 34 wafer 300 provides a burning control panel step 302 input a burning command to the controller Step 17 201007562 304 reads the burn data in the burn data providing device. Step 3: 6 outputs the burn data to each wafer. Step 308: Burn the data to the wafer step 400 and input a check command to the controller. The burning data in the burning data providing device step 404 reads the burning data in the burned wafer, and compares the burning data in the burning data providing device with the burned data in the wafer. Whether the burning data is the same step 500 provides a burning control panel step

The 502 is electrically connected to the aging test machine, the burn-in control board, and the burn-in test board step. 504: inputting an inspection command to the controller by the aging test machine step: capturing the burning data in the burning data providing device, stepping out the burning data to the aging test board, and performing the wafer processing step on the aging test board The wafer is subjected to a heating step on the final aging test board, and an aging test signal is sent to the aging test board for each wafer step 604 to perform a test step.

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Claims (1)

201007562 X. Patent application scope: 1. A wafer burning system, comprising: a burning main body for inputting a burning command or an inspection command for burning or checking; a burning control panel for controlling Each wafer is burned and a burn-in material is provided; and a burn-in execution device for accommodating the wafer 'on which the burn-in is performed on the wafer. 2. The BB chip burning system according to claim 1, wherein the programming control board comprises at least one controller for controlling the transfer and burning of the burning data, and the result of the chip and the burning. Checking, and one or more programming data providing devices for storing it to provide programming data, wherein the controller and the programming data providing device are electrically connected to each other. ❹ 曰 3. The wafer burning system of claim 2, wherein the controller is a control wafer. 4. The wafer burning system of claim 2, wherein the controller is provided with a base and a data sheet, wherein the base is electrically connected to the controller. The wafer burning system of claim 4, wherein the data chip is a wafer on which the burning data or the firmware code is burned, or is burned with the burning. A sample of the memory chip of the data or firmware code. 6. The wafer burning system of claim 2, wherein when the programming body inputs a programming command to the controller, the controller reads the programming data providing device according to the programming command. Burning the data, and transmitting the burning command and the burning data to the burning execution device. 7. The wafer burning system according to claim 6, wherein the programming execution device receives the programming command and the programming data, and the programming device according to the programming command The burned material is burned into the wafer. 8. The wafer burning system according to claim 7, wherein when the beta burning body inputs an inspection command to the controller, the controller acquires the burning data providing device according to the programming index The burned data and the burned data in the wafer are compared with each other. 9. If the wafer of the first aspect of the patent application is programmed to burn green, the burning control strip further includes a 3 & transmission circuit for electrically connecting to the programming body* as the main body of the burning. The instruction 20 201007562 is transmitted with the programming control board. 10. The wafer burning system of claim 1, wherein the programming control board further comprises a data transmission circuit for electrically connecting to the programming device for use as the programming device. Recording data transfer between the control board and the programming execution device. Φ 11. The wafer burning system of claim 1, wherein the programming control panel and the programming execution device are separable from each other. 12. The wafer burning system of claim 1, wherein the programming control panel is part of the programming execution device and is disposed on the upper programming actuator. The wafer programming system of claim 1, wherein the programming body can provide a wafer for heating to provide a high temperature environment. 14. The wafer burning system of claim 13, wherein the burning body can perform an aging test on the wafer. 15. The wafer burning system of claim 14, wherein the 21 201007562 burning main system is a Burn In apparatus. The wafer burning system of claim 15, wherein the programming device is an Burn In Board having a plurality of test sockets for accommodating the wafer for burning. Record or test. a burning control panel comprising: 至少 at least one controller for controlling the transmission and burning of the burning data, and checking the wafer and the burning result; and one or more burning data providing devices for The storage data is stored and provided, wherein the controller and the programming data providing device are electrically connected to each other. 18. The burning control panel of claim 17, wherein the control device is a control wafer. 19. The programming control board of claim 19, wherein the control chip is a programmable gate array (FPGA) control chip. 20. The wafer burning control panel of claim 17, wherein the controller is provided with a base and a data chip, 22 201007562 wherein the base and the controller are electrically exchanged γ 所述 之 之 之 晶片 其中 其中 其中 其中 其中 其中 其中 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如A sample of the memory wafer recorded with the burned material or firmware code. 22. The wafer burning control board according to claim n, wherein when the controller receives the programming command, the controller reads the burning in the burning data providing device according to the burning signal. Record the data for burning. The chip burning control board according to claim 17, wherein when the controller receives the inspection instruction, the controller reads the burning data in the burning data providing device according to the programming command. And the burned data in the wafer that has been burned and compared with the two. 24. The wafer programming control board of claim 17, wherein the programming control board further comprises an instruction transfer circuit for inputting a programming command and an inspection command. 25. The wafer burning control board according to claim 17, wherein the programming control board further comprises a credit transmission circuit for performing the programming instruction 23 201007562, the inspection instruction, and the burning data. Transmission. 26. A wafer burning method, comprising: providing a programming control panel having at least one controller, and one or more programming data providing devices for burning the burning data; Burning a command to the controller; the controller selects a burn data providing device according to the programming command, and reads the burned data in the burned data providing device; outputs the burned data to each wafer; and burns The burned material is recorded in the wafers. 27. The wafer burning method of claim 26, further comprising a confirmation step, wherein the controller confirms whether the wafers are present or is electrically connected to the controller to facilitate burning Going on. Φ 28. The wafer burning method according to claim 26, wherein the programming command includes specifying a programming data providing device to perform a reading instruction, and reading the burning in the designated burning data providing device. Record data instructions, and the location of each wafer to be burned. 29. The wafer burning method of claim 26, wherein the further 24 201007562' includes an inspection step for confirming the result of the burning. 30. The wafer burning method of claim 29, wherein the checking step comprises: inputting an inspection command to the controller; and the controller reads the burning in the burning data providing device according to the inspection instruction Recording data; Q the controller reads the burned data in the burned wafer according to the check instruction; and compares the burned data in the burned data providing device and the burned wafer Whether the burning data is the same, and confirm whether the burning is successful. 31. The wafer burning method of claim 30, wherein the inspection instruction comprises reading a burn data command in the burn data providing device specified by the read command read, and reading the burned completion. The burn data command in the wafer and the position of each wafer to be inspected. 32. The wafer burning method of claim 26, further comprising a heating step for heating the wafer. 33. The wafer burning method of claim 32, wherein 25 201007562 ' includes an aging test step for performing a Burn In Test on each of the wafers. 34. The wafer burning method of claim 33, wherein the burning step and the aging test step can be performed simultaneously or before or after the aging test step. Φ 35. A method for burning a large number of wafers using an aging test system, comprising: providing a burn-in control panel having at least one controller and one or more burns with burned data Recording data providing device; electrically connecting the programming control board and the aging test machine, and electrically connecting the programming control board and the aging test board; and inputting a programming command to the controller by the aging test machine; The controller selects the burn-in data providing device according to the programming command, and reads the burn-in data in the burn-in data providing device; outputs the burned data to the wafer on the burn-in test panel; and burns the burn-in Data on the wafer on the burn-in test board. 36. The method of burning a large number of wafers using an aging test system according to claim 35, further comprising a confirmation step, by which the controller confirms whether a wafer exists at each position on the aging test board, Or 26 201007562 The wafer on each position of the aging test board is electrically connected to the controller to facilitate the burning process. 37. The method of burning a large number of wafers by using an aging test system according to claim 35, wherein the programming command includes specifying a programming data providing device to read a command, and reading the designated burning. Recording data is provided in the device to program the data, and the position of each wafer to be burned on the aging 0 test board. 38. The method of burning a large number of wafers using an aging test system as described in claim 35, further comprising an inspection step for confirming the results of the burning. 39. The method of using a burn-in test system to burn a large number of wafers according to claim 38, wherein the checking step comprises: inputting a check command to the controller by the burn-in test machine; The checking instruction reads the burning data in the burning data providing device; the controller reads the burning data in the burned wafer on the aging test board according to the checking instruction; and comparing the burning data The burning data in the device and the burning data in the wafer recorded on 27 201007562 are provided, and it is determined that the two are the same and the burning result is determined. 40. The method of burning a large number of wafers using an aging test system according to claim 39, wherein the inspection instruction comprises reading a programmed data command in the specified programming data providing device, and reading the burned data. The burn-in data command in the completed wafer and the position of each wafer to be inspected on the burn-in test 0 board. 41. A method of burning a plurality of wafers using an aging test system as described in claim 35, further comprising an aging test step. 42. The method of burning a large number of wafers using an aging test system according to claim 41, wherein the aging test step comprises: φ heating the wafer on the aging test board by the aging test machine to Providing a high temperature environment; inputting an aging test signal to each wafer on the aging test board; and testing each of the wafers according to the test signal. 43. A method of burning a plurality of wafers using an aging test system as described in claim 42 wherein the inspection step can be performed concurrently with the aging test step 28 201007562 or before or after the aging test step. 44. The method of burning a large number of wafers using an aging test system as described in claim 42 wherein the step of burning the wafers on the aging test board can be performed simultaneously with the aging test step, or The aging test step is performed before or after. 29