TW201006597A - Beam processing apparatus, beam processing method and beam processed substrate - Google Patents

Abstract

Abeam processing apparatus which processes a layer to be processed 3 formed on a side of glass substrate 2 by beam irradiation is shown. An objective optical apparatus 51, which is in beam irradiating means 50, includes a conical lens as an axial light-condensing element 52 for irradiating Bessel beam. Bessel beam is axial light-condensing beam, and its diameter does not much vary especially in the center of the beam which is peak of beam strength, insofar as the conical lens is in close range. Consequently, the processing can be executed precisely even the point of beam irradiation against the objective optical apparatus 51 changes because of bending of the substrate, without controlling focal position during processing; because the bended position is still in the focal depth.

Description

201006597 VI. Description of the Invention: The present invention relates to a semiconductor device that is formed on a substrate such as a glass substrate as a power generation system using a photoelectric effect, and is suitable for use in a light beam (laser or the like). A beam processing device that forms a thin film of a semiconductor element or the like, a beam processing method, and a beam processing substrate having a processed layer (film) processed by the beam processing device. BACKGROUND OF THE INVENTION In the manufacture of the above-mentioned power generation system using bismuth-based amorphous materials, a layer of transparent electrodes (for example, indium oxide, tin oxide, oxidized, etc.) is first formed on a large glass substrate to be patterned, and then patterned. An amorphous germanium layer (photoelectric conversion layer) is formed on the glass substrate, patterned, and then a metal electrode is formed on the glass substrate to form a pattern. The method of performing laser patterning using a laser beam without using a wet type has been established. Here, the laser patterning is performed by sequentially forming grooves (slits) in the respective film layers formed on the glass substrate in sequence, and dividing the film layers into a plurality of battery cells. It is called a laser line. In such a laser scribing, a laser beam is irradiated from the glass substrate side to the transparent electrode layer formed on the glass substrate to form a groove (see Patent Document 1). That is, the laser beam is not irradiated from the surface side of the glass substrate on which the layer to be processed is formed, but the surface on the opposite side of K. At this time, when the structure of the laser beam is irradiated from the side of the glass substrate 3 201006597, the glass substrate is placed on the stage with the layer to be processed as a lower layer. At this time, since the layer to be processed contacts the upper surface of the stage, there is a possibility that the layer to be processed is damaged or processed, which is affected by the stage (for example, reflection of temperature or laser). Therefore, the operation of irradiating the laser from above in a state where the glass substrate is suspended in the peripheral portion of the supporting glass substrate is performed. At this time, the glass substrate is conveyed in one direction in a state of being suspended from the peripheral portion. The irradiation position of the laser is moved in a direction perpendicular to the direction in which the glass substrate is conveyed, and the layer to be processed on the glass substrate is grooved. Formed in stripes. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. 2006-54254 C. The present invention discloses a problem to be solved by the manufacture of a power generation system using photoelectric effect or the manufacture of a panel display such as a plasma display, etc., in order to reduce costs. The development of large-scale glass substrates. When the glass substrate is increased in size, since the glass substrate is not substantially thickened, when the glass substrate having a large size is supported by the peripheral portion, the glass substrate is largely deflected on the lower side. Thereby, the height position of the left and right side portions of the glass substrate is greatly different from the height position of the left and right central portions. Further, when the laser is irradiated, the laser is collected or imaged by the optical element on the layer to be processed. When the laser is irradiated from the upper side, as described above, when the height position thereof largely differs depending on the position of the glass substrate, the focus is deviated even when the position of the optical member is aligned at any position as the irradiation position. Therefore, it is known that in the laser beam processing apparatus for laser scribing, 201006597 - a laser irradiation mechanism for a substrate having a difficulty in flattening the glass substrate as described above. That is, the distance measured by the objective lens of the optical element is determined according to the measurement position (the objective lens is moved up and down from the workpiece, thereby causing the _^' to move as the optical element processing layer normally within the focus range of the optical element. In the left and right direction (1) and the thunder of the irradiation position where the glass substrate is bent and bent to deflect the glass substrate.

= Objective lens aging. Therefore, when the laser scribe line starts, the aligning objective lens does not change the height position of the objective lens, the helmet ^ ^ ..., and the laser scribe line continues. Due to the provision of such an autofocus mechanism, the structure of the laser beam for performing laser scribing is complicated and costly. At the same time, the height position of the workpiece is also changed. The change of the height position of the laser marking line becomes the bottleneck of the operation speed of the laser shooting material with the change of the objective lens. At this time, the speed of the laser scribing operation is hindered by the autofocus mechanism. In addition, when stripe or matrix processing is performed, the distance between the bundles and the spacers is "riding, and the laser beam can be shortened by the processing phase. At this time, the laser beam is irradiated at all of the plurality of different positions, and all the lasers are irradiated. Beam 'focusing with high precision is not easy, compared to! As described above, when the laser beam is processed by the autofocus mechanism, the processed greenness is lowered, so that the quality of the final product is lowered. For example, when the power generation system is used, there is a possibility that the power generation due to sunlight is low. > In addition, in order to illuminate a plurality of laser beams in a state of arrangement, and to arrange a plurality of objective optical devices (objective lenses), the interval X of each laser beam is limited only to the objective lens. It is not easy to reduce the spacing of the complex laser beams. In particular, when the focal length of the objective lens is long and the glass substrate can be used as opposed to the glass substrate, the diameter of the objective lens can be increased, and the interval between the plurality of t-beams cannot be reduced. II. The optical device with a plurality of pairs of objective lenses is enlarged, and the mechanism for moving the object device is also large. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a beam processing apparatus which does not use a beam such as a laser beam to process a processed layer formed on a substrate, and which does not constantly adjust the focus position of the beam by autofocus. A beam processing method and a beam processing substrate having a processed layer processed by the beam processing device. The means for solving the problem is to apply for a special observation. The first slave beam processing device is formed on the substrate and the surface is coated with a J1 layer illumination beam. The defender is characterized in that: the beam f mechanism is formed in The substrate-surface processed layer is irradiated with a light beam toward the upper side of the layer, and the processed layer is processed. The first beam irradiation mechanism has an axial collecting optical device for irradiating the axial collecting beam. . 〃彳集先 In the scope of patent application! According to the invention described in the invention, there is an optical device for shaft-shaped collecting light, and a mechanism for rotating a so-called Bezo beam. And irradiating the Besso light beam as the axial collecting beam, the rotation of the optical element is three to a certain distance 'to collect the light into the axis of the Besso beam, that is, the arbor-like collection, when the light is three State output. 201006597 In addition, the depth of focus differs depending on the optical components. The depth of the focus of the optical components such as the convex lens used for collecting the laser beam is several l〇〇"m, which is relative to the depth of the rotation of the three axes. _ Left and right, according to the beam diameter when collecting light, it can be about 10mm. Therefore, when the Bissau beam is irradiated with the rotation of the Bezo beam, as described above, the substrate supported by the left and right side edges can be deflected by its own weight, and the horizontal position of the processed layer formed on the substrate can be made. The difference in the vertical direction caused by the difference is within the depth of focus of the beam. Therefore, when the light beam is moved 'on the surface of the processed layer formed on the substrate in the left and right flexed state, it is not necessary to move the objective optical device up and down by the autofocus mechanism, even if the substrate for deflection is fixed. The height of the beam is illuminated, and the layer being processed is also within the depth of focus. Therefore, by using the axial collecting beam to collect the laser light, when the layer is irradiated, the autofocus mechanism can be omitted, and the cost of the beam processing device can be greatly reduced. At the same time, the beam processing device can be greatly The structure of the focus adjustment portion of the object optical device is simplified. Further, since there is no autofocus mechanism, the operation delay of the control of the autofocus mechanism is not caused, and the main cause of the obstacle to the increase in the speed of the work can be eliminated. The laser processing apparatus according to the second aspect of the invention is directed to irradiating a light beam on a processed layer formed on one side of the substrate, and is characterized in that the light beam irradiation means includes a processed layer formed on one side of the substrate facing upward 'Illuminating the light beam from the lower side of the other side of the substrate' to process the layer to be processed; the supporting mechanism for supporting the substrate from the lower side; and powder removal 7 201006597 Mechanism's attraction to the beam of the processed layer And, the powder produced by the processing; and the above-mentioned vesting mechanism has an optical device for axial light that collects light, and illuminates the axially shaped light beam. In the invention described in the second aspect of the invention, the axial light collecting optical beam is applied to the processed layer of the substrate by the optical device for axial collecting, and the effect of the application is the same as that of the application. The substrate is processed to face up, and the support mechanism is supported from the lower side of the substrate, thereby preventing damage to the processed layer from contacting other members, and the substrate is supported from the lower side to prevent the substrate from being weighted by itself. Flexed. In this way, it is possible to perform higher processing. That is, even if the deflection of the substrate is prevented, the irradiation position of the beam is slightly deviated due to the shaking or deformation of the thickness caused by the position of the substrate, and by using the axial collecting beam, the focus position of the micro focus can be deviated from the focus. Within the depth range, processing accuracy can be improved. In particular, as described in the third paragraph of the patent application, when the plurality of light beams are simultaneously irradiated, "the T can suppress the deflection of the substrate which is the main cause of the reduction in processing accuracy", and the improvement of the degree of emphasizing can be achieved, and the same can be achieved. The processing accuracy, while the number of beams that can be illuminated increases. Further, in a state in which the layer to be processed is facing upward, the powder (dust) generated by the processing of the layer to be processed is attached to the layer to be processed, and the powder generated by the powder removing mechanism is removed by suction. The problem caused by Pink Zhao. The beam processing device according to claim 3, wherein the beam moving device according to claim 1 or 2 includes a substrate moving mechanism 'system' for moving the substrate in at least the __ direction And the beam moving 4 movement mechanism is configured to move the axial light collecting optical device back and forth in a direction intersecting one of the moving directions of the 201006597 substrate; and the beam irradiation mechanism has a plurality of movements along the substrate The axial collecting optical device having different positions in the direction irradiates the plurality of axial collecting beams at the same time, and the processed layer can be processed into a stripe shape by scanning the axial collecting beam. In the invention described in the third aspect of the invention, when the plurality of laser beams are simultaneously irradiated, the position of the focus of each of the pair of optical devices (here, the optical device for shaft collecting) is shifted or the position of the substrate is horizontal. The position of the laser beam caused by the difference in the vertical direction is different, and the focus of each laser beam is lowered. Therefore, the processing accuracy is lowered. When the Besso beam is used, since the depth of focus is deep, the processing accuracy can be prevented from being lowered. That is, since the depth of focus is so deep that the deviation of the focus position of each Bezo beam can be sufficiently incorporated into the depth of focus, the processing accuracy can be maintained without a correlation between the deviation of the focus position and the reduction in processing accuracy. Therefore, even if the processed layer is processed by the plurality of beams at the same time, the processing accuracy can be prevented from being lowered, and the performance of the article manufactured by using the beam processing can be prevented from being degraded. For example, when the manufactured product is a power generation system using a photoelectric effect, it is possible to prevent a decrease in power generation efficiency caused by simultaneous processing of a plurality of beams. Further, the number of beams to be simultaneously irradiated can be increased within the range of necessary processing accuracy, and the processing time can be further shortened. There are a plurality of rotating prisms for the Bezo beam beam optical element, and the present invention uses a conical lens. The outer diameter of this conical lens is smaller than that of a general optical lens (e.g., a convex lens) for almost the same processing. Conical lens as described above 9 201006597 Because the original depth of focus is deep, no need to auto focus, so there is no need to increase the focal length, and the autofocus should be used to flex the above substrate without increasing the lens as in the case of a general lens. Focus distance and increase lens diameter. In addition, the processed layer located inside the substrate is from the surface of the substrate,

The substrate is used as the medium to illuminate the Besso beam. Therefore, the processed object is sublimated by the processing of the processed layer, and the processed object is liquefied and then deuterated. The workpiece is located on the opposite side (opposite side) of the substrate with respect to the conical lens. Separating from the layer being protected, the re-solidified adherent does not adhere to the conical lens to bring the conical lens closer to the extent of non-contact deflection. Therefore, it is not necessary to increase the diameter of the Bezo beam, and it is possible to inspect a conical lens which is smaller than the -filament lens. By arranging a plurality of rotating triple-lens mirrors while illuminating the plurality of Besso beams, the distance between the Besso beams is reduced compared to the laser beam of the general-looking lens. Thereby, the degree of freedom in designing the Bezo beam can be increased. In addition, it is possible to have a head portion (optical optical device) with a plurality of pairs of optical elements. With the miniaturization and weight reduction of the head, the movement mechanism of the head is simplified, and the accuracy of movement or the secret increase can be easily sought.

The beam processing device according to claim 4, wherein the beam processing device according to any one of claims 1 to 3, further comprising: a substrate moving mechanism, wherein the substrate is at least - And the beam irradiation position moving mechanism causes the axial light collecting optical device to move back and forth in a direction parallel to a moving direction of the substrate, and the beam irradiation mechanism has a plurality of edges The axial light collecting optical device having different positions in the moving direction of the substrate is irradiated with a plurality of axial collecting beams at the same time, and the 10th 201006597 processed layer can be processed into a sweeping cat of the axially collecting light beam. Striped. In the beam processing apparatus according to the fourth aspect of the invention, when the processed layer beam of the substrate is processed, it is not necessary to repeatedly carry out the substrate transfer start and, in other words, the substrate can be transported at a constant speed. By performing light, it is possible to simplify the transportation mechanism and the conveyance control of the substrate, and to shorten the working time of the beam processing. Again, one

In the method of performing beam processing on the surface transfer, a method of using a broom beam is known. In this case, even if the foot lens is used, the substrate is not irradiated with a beam at a right angle, and the beam is obliquely irradiated to the substrate. At this time, the difference between the refractive index of the plate 2 and its air and the angle of the human beam are generated by the addition of the base (the fourth) to the opposite side of the added layer, and the processing is performed with a high precision. Here, it is extremely difficult to control the irradiation position of the control beam by the current mirror sweep or the like. According to the present invention, the beam is bundled, #0 & the substrate can be as close as possible to the vertical incident light of a very high 4 1 ... point, the degree of ice, so the precision - face 5th beam can be performed The processing method is to apply the axially-collected light to the surface-formed layer formed on the substrate processing layer, which is formed on the other surface side opposite to the processed layer on which the substrate facing the substrate is formed: ...the board of the processed layer is interposed, and the surface-processed layer is described by the above-mentioned axial-shaped light-collecting beam. In the light beam processing method described in item 6 of the patent application scope, the beam processing method described in claim 6 is formed by irradiating a light beam on a processed layer on one side of the substrate, and is formed from the image forming method. One of the processed layers is faced upward, and the substrate is supported from the lower side, and the lower surface of the substrate opposite to the surface on which the processed layer is formed is irradiated with the axially-shaped light collecting beam. The substrate is interposed, and the processed layer is processed by the axially shaped light beam, and is sucked and removed from the upper side of the substrate. The powder generated by processing the light beam of the processed layer is described. In the invention described in the sixth paragraph of the patent application, the same effects as those of the invention described in the second aspect of the application can be obtained. The beam processing substrate according to the seventh aspect of the invention is the processing layer processed by the beam processing apparatus according to any one of claims 1 to 4. In the invention described in the seventh aspect of the patent application, the same effects as those of the invention described in any one of the first to fourth aspects of the application of the patent application can be obtained. Advantageous Effects of Invention According to the beam processing apparatus, the beam processing method, and the beam processing substrate of the present invention, by using a Besso beam having a deep depth of focus, the substrate is suspended by the left side edge, and the processed layer is made lower. In the state, even if the substrate is deflected by its own weight, it is not necessary to adjust the focus of the light beam when the substrate is changed. In other words, in the state where the substrate is deflected, it is not necessary to move the focus with the irradiation position of the light beam, and the autofocus mechanism can be omitted from the beam processing device, thereby reducing the cost and simplifying the structure of the beam processing device. And the control of autofocus does not require time to shorten the guard time. Brief Description of the Drawings 12 201006597 Fig. 1 is a plan view showing the outline of a light beam adding device according to a first embodiment of the present invention. Fig. 2 is a front view showing the outline of the beam processing device. Fig. 3 is a side elevational view showing the outline of the above-described beam force division device. Fig. 4 is a plan view showing the outline of a beam processing apparatus according to a second embodiment of the present invention. Φ Fig. 5 is a cross-sectional view showing the outline of a beam processing apparatus according to a second embodiment. Fig. 6 is a plan view showing the outline of a beam processing apparatus according to a third embodiment of the present invention. Fig. 7 is a front elevational view showing the outline of a beam processing apparatus according to a third embodiment. Fig. 8(a) and Fig. 8(d) are diagrams for explaining the beam directing method of the third embodiment. Fig. 9(4) to Fig. 9(b) are schematic views showing a beam processing apparatus according to a fourth embodiment. ~ Fig. 1 is a schematic view showing a beam processing vibration of the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the third embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 to Fig. 3 are views showing a schematic configuration of a beam processing apparatus according to a first embodiment of the present invention. 13 201006597 The beam processing device of this example is suitable for manufacturing a thin film layer formed on a transparent substrate such as a glass substrate by a light beam (here, a laser beam) using a photovoltaic system or a plasma display. The thin film layer (the processed layer) on the substrate is irradiated with a laser beam to be sublimated, liquefied, and peeled off, thereby forming a groove, and the film layer is separated and broken by the groove, so that the film layer can be formed. Any shape of the person 'here' in the film will form a stripe & - matrix shape. In this case, the final product will be described as a case of using the above-mentioned power generation system of amorphous germanium. In the above-mentioned power generation system and system φ of the amorphous stone, since a strong voltage cannot be obtained, a plurality of batteries are formed in a stripe shape on a transparent substrate such as a glass substrate, and this is connected in series to output necessary The voltage. At the time of manufacture, first, since sunlight is used from the side of the glass substrate, a film of a transparent electrode is formed on the side of the glass substrate. The film of the transparent electrode is formed into a groove at a predetermined interval to form a stripe-shaped transparent electrode. Next, an amorphous tantalum film as a semiconductor element for photoelectric conversion is formed on the transparent electrode. In addition, this portion serves as a semiconductor element having a PN junction or a PIN junction. An amorphous germanium layer composed of a plurality of layers is formed as a photoelectric conversion layer on the thin film layer patterned into a stripe-shaped transparent electrode, and then a trench is formed by a laser beam. Further, the groove is formed adjacent to a groove formed in the thin film layer of the transparent electrode. Next, a thin film layer of a metal electrode is formed, and similarly, a groove is formed by a laser beam. At this time, the groove of the metal electrode is formed adjacent to the groove formed in the non-曰14 201006597 矽 layer, and at the same time, the groove formed on the transparent electrode adjacent to the groove formed in the amorphous layer is on the opposite side. The ditch of the amorphous bismuth layer is adjacent. In other words, the grooves of the respective layers are formed in a state in which the grooves of the transparent electrode layer, the grooves of the amorphous layer, and the grooves of the metal electrode layer are arranged adjacent to each other. The beam processing apparatus of the present invention is used for forming the grooves of the above respective films. As shown in FIGS. 1 to 3, the beam processing apparatus has a substrate moving mechanism 5 that supports the left and right side edges of the glass substrate 2 (substrate) 5 so as to be transportable in a transport direction (including a reverse direction). A light beam is irradiated onto the processed layer 3 on one surface of the glass substrate 2, and the beam processed by the processed layer 3 is irradiated to the mechanism 50. The substrate moving mechanism 5 is constituted by a driving mechanism (not shown) which is not shown in the drawing and which is held by the left and right side edge portions of the holding glass substrate 2, and which moves the holding slider portion along the guide rails 5a and 5a. Further, the drive mechanism is a mechanism such as a ball screw, a metal wire, a linear motor or the like which can generally be used to move the workpiece in one direction. The beam irradiation mechanism 50 has a laser light source device or the like in this example, and a laser generation unit (not shown) for generating a laser, and an optical system for irradiating the glass substrate 2 with a laser beam. The light source device may use at least one of a YAG laser, a C02 laser, another gas laser, a solid laser, a semiconductor laser, a liquid laser, a fiber laser, a thin disk laser, and the like as a laser. Here, the visible light laser uses a YAG laser having a wavelength of 532 nm. Further, the YAG laser has a wavelength of substantially 〇64 nm, and a technique of 532 nm is known, and the 532 nm visible light can efficiently penetrate the substrate. 15 201006597 In addition, the light source device is not limited to the YAG laser user, and the wavelength of the laser beam is not limited to 532 nm. The laser beam needs to pass through the wavelength of the substrate having the processed layer of the glass substrate 2, etc. In a substrate that is light and does not easily penetrate electromagnetic waves other than the visible light region, a beam of visible light is preferably used. Moreover, the beam of the processed layer 3' should be efficiently absorbed, and the beam can be efficiently processed. The wavelength of the electromagnetic wave of the beam needs to be easily penetrated by the substrate (absorption rate is low), and is easily absorbed by the processed layer 3. wavelength. When the substrate is transparent and the processed layer 3 is a transparent electrode, it can also be selected as visible light 'with no attraction peak on the substrate side', and has a wavelength of attraction peak value on the transparent electrode side, and can also be selected in the visible light region and its periphery. In the region, the near-infrared region, and the near-ultraviolet region, the substrate side is easily penetrated, and the wavelength on the side of the processed layer 3 is not easily transmitted. ' Again, the laser beam should be pulsed. Further, the optical system of the beam irradiation mechanism 5 has an objective optical device 51 that illuminates the light beam with the focal point of the objective optical device 51 collecting or aligning the image on the processed layer. In the present invention, the object optical device 51 uses a rotating triplet (axial optical collecting element optical element 52) for irradiating a Bezo beam as an axially shaped light beam. The three-turn rotation is a general term for an optical element capable of forming a Bezo beam, and a person having an annular slit or a ring shape is known in addition to the conical lens. A conical lens is used in this example. The shaft-shaped light collecting optical device (the vehicle-shaped light collecting optical element 52) of the pair of object optical devices 51 is not limited to the rotation of the optical element. It is also known that the optical element or the 16-dimensional element is used for the diffraction optical element or the 16 201006597 For the collection of light, it is also possible to use the rotating prisms 0 1 optical 1 piece 'output shaft beam. Further, the objective optical device 51 has a plurality of axial light collecting optical elements 52' and can simultaneously illuminate a plurality of axially shaped light beams. For example, as shown in FIG. 3, the plurality of axial light collecting optical elements 52 are arranged in a state parallel to the transport side B of the glass substrate 2 and arranged in a direction perpendicular to the moving direction of the objective optical device 51. In addition, in the objective optical device 5, the front end of the axial light collecting optical element 52 of the second figure and the third figure has a conical optical shape, and has a function of rotating three turns. Since each of the axial light collecting optical elements 52 has a small diameter, it is possible to reduce the size of the objective optical device 51 by using a general lens for collecting light. The objective optical device 51 is movable on the glass substrate 2 in a state in which the direction perpendicular to the direction in which the glass substrate 2 is perpendicularly conveyed is guided by the guide rail 53. Further, the objective optical device 51 can be moved back and forth along the guide rail 53 by a driving device not shown. In this case, the same driving mechanism as that of the substrate moving mechanism 5 of the glass substrate 2 may be used as the driving device. Further, the beam guiding position moving mechanism is constituted by the guiding track 53 and the driving means. A mirror or a prism is applied to the supply of the laser beam of the objective optical device 51, and the laser is irradiated toward the objective optical device 51 from the side of the light source device, so that the irradiation direction of the light beam is directed toward the glass substrate 2 side by the object optical device 51, and The glass substrate 2 is irradiated with a light beam. For example, a state in which a laser is irradiated along the above-described guide rail 53 by a light source device by a mirror or a prism is used to illuminate the objective optical device 51 moving along the guide track 53 in a state of being irradiated with a laser. Further, it is also a structure in which the laser is irradiated to the objective optical device 51 via the light 17 201006597. Further, each of the pair of optical devices 51 can adjust the focus position, such as a change in height position, without setting the auto focus function, and in the laser processing after adjusting the focus position once, there is no need to automatically change the laser beam. focus. The beam processing method using the beam processing device as above is used.

In this example, as described above, the present invention is applied to the production of the above-described power generation system using amorphous stone, and the beam processing is performed every time a transparent electrode layer, a photoelectric conversion layer, and a metal electrode layer are formed on a glass substrate. In the beam processing, the left and right edge portions of the glass substrate 2 are held by the substrate moving mechanism 5, and the glass substrate 2 can be suspended in the transport direction while the glass substrate 2 is suspended by the left and right side edges. At this time, the glass substrate 2 is deflected by its own weight. Further, when the glass substrate 2 is placed on the substrate moving mechanism 5, the processed layer 3 such as the transparent electrode layer, the photoelectric conversion layer, and the metal electrode layer is made lower.

side. That is, the surface of the glass substrate 2 on which the layer to be processed 3 is formed faces the lower side, and the other surface faces the upper side. Then, the glass substrate 2 is transported by the substrate moving mechanism 5 in a transport direction perpendicular to the moving direction of the objective optical 51. The end of the glass as the end portion on the leading end side in the conveying direction reaches the beam of the object optical device 51, and the conveyance of the surface substrate 2 is stopped. In the state where the laser (besof beam) is output, the objective optical device 51 is continued along the guide track 53 from the side of the processed layer 3,

The air edge of the Mi to the other side moves in one direction, and the groove is formed, and the groove is used to divide and fracture the layer 3 to be processed. 18 201006597 At this time, a plurality of Bezo beams are simultaneously irradiated, and a plurality of grooves are simultaneously formed by the mutually set intervals. When this beam processing is performed, the glass substrate 2 may have a state in which the right and left side edge portions and the center P are wound by about several mm or so. On the other hand, since the depth of focus of the Besso beam can be about several tens or more, the deviation of the upper and lower height positions of the additive 3 caused by the glass substrate 2 can be made within the depth of the beam.

Therefore, even in the state in which the surface substrate is deflected due to its own weight, it is not necessary to perform focusing in the shape of the "St" movement, but the deflection "^ the mouth layer 3 is within the range of the depth of focus. Beam processing: Beam intensity: When the beam is deflected up and down as the position of the focal distance, that is, the position of the light-processed layer 3, the beam == the beam is within the depth of focus of the section, The characteristic, as a part of the peak, is not greatly changed within the range of 隹, - degrees. The right is in focus, the point is ice, the Besso beam is in the state of collecting light on the axis, and the rotation of the beam Three 稜鏡, even if the processed object is in the far and near direction ^ If the Besso is within the depth of focus, the force α precision will move slightly, and the intensity of the beam will be above the predetermined depth _ 'Below the focus on the layer 3 to be processed When the position is slightly changed, the broken processing layer is arranged, and finally, the above-mentioned _^=machining accuracy is improved, and the power generation efficiency can be improved. That is, the processing accuracy can be improved, and the device can be formed by processing. Wait, class ^ seek processing accuracy and When the structure of the complex laser is irradiated for the purpose of rotating the complex three-turned =[=高门19 201006597, each of the three rotating objects has a positional deviation of 'the object or deflects or bends at the irradiation position of the plurality of lasers on the glass substrate. For example, the distance between each of the rotating optical elements 51 of the objective optical device 51 and the glass substrate 2 is different, and if it is within the range of the depth of focus of the Besso beam, it is not related to the reduction of the processing precision, and can be sufficiently processed. Accurate beam processing. In this case, the number of beams irradiated at the same time can be increased while maintaining sufficient processing accuracy, and the processing time can be greatly shortened. Next, the present invention will be described with reference to FIGS. 4 and 5. In the second embodiment, the substrate moving mechanism of the first embodiment is changed, and the light beam irradiation unit 50 is basically the same as that of the first embodiment. Therefore, the description of the light beam irradiation unit 50 is omitted or The simplification is mainly described with respect to the substrate moving mechanism 5. The substrate moving mechanism 5 has a gas floating mechanism 1 that supports a state in which the substrate is flatly floated by ejecting gas. The body floating mechanism 1 has a gas ejecting mechanism (such as a gas ejecting plate 12) that ejects a gas, and has a stage u that supports the substrate floating in a flat state, and the glass substrate 2 is at least one of the stage 11 In other words, the gas floating mechanism 10 has a plate-like shape, and a table u that extends in the direction in which the glass substrate 2 is described later, and a plurality of rolling body discharge plates that are disposed to be evenly spread on the stage 11 12. The moving mechanism 14 is disposed on both sides of the table and is engaged with the left and right sides of the glass substrate 2 and transports the glass substrate 2 in a transport direction. The stage 11 is substantially plate-shaped, for example, Alternatively, the plurality of plates extending in the conveying direction may be in a stripe-like structure. Further, the table u is in the direction of the traveling direction of the object optical device 51 after the beam irradiation mechanism 50 along the light 20 201006597 The portion of the beam irradiation position is divided into a state of the rear side (near side) and the front side (distal side) of the laser beam irradiation position in the transport direction, and a gap is formed between the table j ia on the rear side and the table 11 b on the front side. between The slit portion 11 c. The slit portion 11c is formed between the stages 11a and the table lib in a state in which the rear side table 11a and the front side table lib are divided. Further, a slit-shaped opening portion may be provided at a position where the laser beam is not irradiated, and the slit portion may be provided as a slit portion. The gas ejecting plate 12 is disposed on the stage 11. Further, the gas ejection plate 12 is made of a porous ceramic plate or a metal plate or a resin plate provided with a large number of holes. On the inner side of the gas discharge plate 12, in addition to the side of the gas discharge plate 12, a container-shaped inner member (not shown) which is in a sealed state is attached, and a pipe for supplying a compressed gas is connected, and the pipe is connected to a compressor of a compressed gas supply mechanism. , gas cylinders to supply compressed gas. The gas ejecting plate 12, a compressed gas supply means for supplying compressed gas to the gas ejecting plate 12, a pipe connecting the compressed gas supply means and the gas ejecting plate 12, and the like form a gas ejecting means. Further, it is preferable to use a gas which does not affect the processed layer 3 to be processed, such as air or nitrogen, for the compressed gas. For example, when the layer to be processed is oxidized by oxygen, an inert gas such as nitrogen or nitrogen is preferably used. Further, the gas ejecting plate 12 may have a structure in which a discharge port for ejecting gas and a suction port for attracting gas are provided, or a gas suction plate 15 may be provided in addition to the gas ejecting plate. & 21 201006597 This is to control the gas ejection 1 and the gas suction at least at the same time, and control the gas ejection 1 to maintain the temperature of the glass substrate 2 in a floating state. structure. Only the gas out of the mouth can adjust the floating southness of the glass substrate 2 to a certain degree, in order to control the floating southness of the glass substrate 2 with high precision and rapidity, because not only the gas is ejected, but also the attraction is simultaneously performed. When the glass substrate 2 is moved upwards, not only does the amount of gas ejection decrease, but the glass substrate 2 can be quickly returned to the lower side by the attraction gas. At this time, it is preferable that the gas ejection plate 12 and the gas suction plate 15 are dispersedly arranged to be shifted. It is also possible to have a structure in which the gas suction plate 15 is smaller than the gas ejection plate π. Further, it is preferable that the gas suction plate 15' is not disposed in a portion near the beam processing position of the glass substrate 2 so that the gas suction plate 15 does not attract the powder generated when the beam is processed. Further, in the present invention, as will be described later, the suction portion 13 which attracts the powder generated by the laser beam processing in the slit portion 11c as the laser irradiation position, and the suction amount of the gas of the suction mechanism 13 can be controlled. The height of the glass substrate 2 at the laser irradiation position is kept approximately constant with the amount of gas discharged from the gas ejection plate 12 disposed near the laser irradiation position. Further, the height position of the glass substrate 2 is measured at or near the portion on the straight line as the laser irradiation position by the height adjustment of the glass substrate 2 for ejecting and sucking the gas (for example, toward the lower side) The height position is controlled to adjust the amount of gas to be ejected and the amount of gas to be attracted, depending on the height of the glass substrate 2 as a result of the measurement. Basically, when the height position of the glass substrate 2 is rising, the amount of gas ejected is reduced, and the amount of gas suction is increased. When a tendency to fall is formed, the amount of gas ejected is increased to reduce the amount of attraction of the gas 201006597. The moving mechanism 14 is engaged with the left and right side edge portions of the glass substrate 2 to move the glass substrate 2 in the transport direction. Further, the moving method may be a mechanism such as a ball screw mechanism, a wire user, or a linear motor, which generally moves the workpiece in one direction. That is, it is possible to have the same configuration as the substrate moving mechanism 5 of the second embodiment. Since the glass substrate 2 is floated by the gas floating mechanism 10 having the above-described stage, the moving mechanism 14 does not need to completely complete the glass substrate 2. It can be held in a suspended state and maintained in a structure that can be pushed or pulled in the conveying direction. The stage 11 is provided with a powder removing mechanism 16 for attracting a moving range of the light beam irradiation position of the light beam irradiation unit 50, and sucking the powder generated by the processing of the light beam of the processed layer 3. The powder removing mechanism 16 has a slit portion 11c provided in the stage 11, and a suction mechanism 13 provided in the slit portion 11c to attract the powder. That is, the slit portion 11c is formed to attract the powder and remove it, and is a part of the powder removing mechanism 16. The suction mechanism 13 has a suction port 13a disposed in the slit portion 11c, a compressor for suction, a pipe connecting the compressor and the suction port 13a, and is disposed in the pipe for solid-gas separation (powder separation) Cyclone device (omitted from the figure). The suction port 13a is arranged in plural in the longitudinal direction of the slit portion 11c, that is, in a direction perpendicular to the direction in which the glass substrate 2 is conveyed. The powder attracted to the suction port 13a is powdered. The former sublimation gas or liquefied gas (solidified in the suction), the stripper is attracted by the compressor, 23 201006597 and reaches the cyclone device. The cyclone device is known as a cyclone for powder separation, and the solid is spiraled The gas is almost separated from the gas, and the gas is discharged to the compressor. The solid recovered by the cyclone is reused or discarded. The beam irradiation mechanism 50 is the same as the above-described first embodiment. The light processing method of the beam processing apparatus according to the second embodiment. In the second embodiment, the present invention is directed to the manufacture of the above-described power generation system of the above-described amorphous material, which is used for beam processing. The transport path of the same gas floating mechanism ίο is carried out by the mechanism, and the glass substrate 2 is carried into the beam processing device. At this time, the laser light is used. The processed layer 3 is formed on the lower side of the glass substrate 2 - that is, the glass substrate 2 is placed on the stage 11 of the gas floating mechanism 10 with the surface on which the layer to be processed is formed, and the glass substrate 2 is in a state of being floated. In the beam processing device, the gas floating mechanism 1 is connected to the moving device 14' in a transport direction perpendicularly intersecting the moving direction of the objective optical device 51. The glass substrate 2 serves as a front end side in the transport direction. When the end portion reaches the slit portion 11c of the stage 11, the groove forming portion formed on the processed layer 3 (for example, the transparent electrode) of the glass substrate 2 reaches the objective optical device 51 supported by the guide rail 53, and the conveyance is stopped. In the state of outputting the laser (Beso beam), the objective optical device 51 to the bow guide track 53 are moved from one side edge of the processed layer 3 to the other side edge in a direction 24 201006597 to form a groove. In the state in which the processed layer 3 is divided and fractured by the groove, the suction mechanism 13 of the powder removing mechanism 16 is actuated, and is suctioned and disposed on the upper side of the slit portion 11c provided on the lower side of the moving range of the objective optical device 51. 3 the gas side of the glass substrate 2 of the processing layer. Thereby, the laser beam is irradiated because it is a gas or sublimation of the powder layer 3 of the processing mechanism 13 for attracting attracted.

Thus, even if the powder is produced by the laser beam processing, it does not scatter due to the gas ejected from the powder, and pollutes the beam processing device or its surroundings to maintain a clean state. Further, in a state where the stage 11 is separated from the glass substrate 2 by a slight distance, in other words, the stage 11 and the glass substrate 2 are close to each other, the processed layer from the slit portion 11c of the stage 11 toward the slit portion 11c side of the glass substrate 2 can be attracted. 3 The gas or powder of the layer to be processed 3 is produced, so that the gas or powder can be efficiently attracted. That is, the powder can be surely removed. Next, the glass substrate 2 is transported by the moving mechanism 14, and is stopped until the next groove forming position is the laser beam irradiation position. Then, while the laser beam is output, the objective optical device 51 is moved along the guide track in a direction opposite to the moving direction of the previous laser irradiation, and a groove is formed in the processed layer 3. By repeating the above operations, all the portions of the processed layer 3 to be grooved are formed into grooves, and grooves corresponding to one of the processed layers 3 are formed. Next, after the next processed layer 3 is formed on the layer to be processed 3, the above-described beam processing is performed. Then, as described above, a transparent electrode layer, a photoelectric conversion layer (amorphous 25 201006597 : layer), a metal electrode layer are formed, and at the same time, grooves are formed by beam processing in all of the layers. Thereby, it can be manufactured by dividing a plurality of cells on a glass substrate, and synthesizing the above-described power generation system in series. At this time, since the glass substrate 2 is in a state in which the gas of the material is floating, it is not deflected. Therefore, since the effect of multiplying the depth of the impurity is deep, the addition of high precision = I can be performed. Because the number of beams irradiated at the same time increases, the beam of the material beam is deviated from the focus or the thickness caused by the position of the glass substrate is different or the focus is slightly different in each beam, and the beam can be in the Besso beam.

Within the depth of focus. Thereby, the processing accuracy can be maintained or improved even if the number of beams simultaneously irradiated increases. In addition, since the conical lens (the shaft-shaped light collecting wire member 52) which is a rotating triplet which generates the Besso beam is small, the y-shaped lens is added, and when the number of beams is increased, the conical lens can be prevented. The objective optical device 51 is enlarged. From these, it is possible to increase the number of beams that are simultaneously irradiated, and to seek more

The shortening of the processing time of the step can be achieved by cutting the cost of the manufacturing process including the beam processing step, for example, the aforementioned power generation system or the electric paddle display. Fig. 6 and Fig. 7 are views showing a schematic configuration of a beam processing apparatus according to a third embodiment of the present invention. Further, Fig. 8 is a diagram for explaining the movement of the head of the illumination beam. In the first and second embodiments, the beam processing is performed while the glass substrate 2 is stopped. In the third embodiment, the substrate 1〇1 which is the same as the glass substrate 2 is held and conveyed. In the state in which it is not stopped, the processing of the beam processing of the light beam irradiation means is different from the second embodiment. The other components are substantially the same as those of the second embodiment, and the description of the same components will be simplified. The beam processing apparatus according to the third embodiment can be used in the same manner as the first and second embodiments, and the same processing can be performed, and a power generation system using photoelectric effect similarly to the first embodiment can be manufactured. As shown in FIGS. 6 and 7, the beam processing apparatus irradiates the processed layer 102 (thin film layer) formed on one surface of the substrate J 〇1 with the light beam 103, and the substrate 101 is transported in one direction. The transport mechanism (moving mechanism) 1〇4, the other layer side of the substrate 1〇1 transported to the transport mechanism 1〇4 penetrates the substrate 1〇1 by the processed layer 102 formed on one surface of the substrate 101, and is irradiated At the same time, when the light beam 103 is irradiated, the light beam irradiation device 111 (beam irradiation mechanism) that irradiates the light beam head 101 perpendicularly to the substrate 1〇1 is provided, and the head 110 is moved along the substrate ιοί which is transported by the transport mechanism 104. The head moving device 12 is moved simultaneously in parallel with the two sides that cross each other. The substrate 101 and the processed layer 1〇2 of the substrate 101 in this example are the same as those in the first embodiment. Further, the conveying mechanism 104 is the same as the moving mechanism 14 of the gas floating mechanism 10 of the second embodiment. Further, in the third embodiment, the 飘> body floating mechanism 1 亦 is used, and the substrate 101 is floated by using the same 141 ′ as the stage 11 of the second embodiment. Further, the conveyance direction of the substrate of the conveyance mechanism 104 is a direction in which the direction of the groove of the layer to be processed 1 2 formed in a stripe shape by the substrate ιοί is perpendicularly intersected. That is, the substrate 101 needs to be placed on the transport mechanism 104 to be vertically intersected with respect to the direction of the groove formed by the shape of 2010 201006597. Further, the substrate transfer mechanism 5' similar to the first embodiment can be used to transport the substrate. The beam irradiation device I11 having the head 110 has a light source device 112 for generating a laser and a beam guiding system for guiding the laser light from the light source device 112 to the head 110. The light source device 112 outputs the same laser as in the first embodiment. Further, in this example, the head 110 simultaneously irradiates a plurality of laser beams to the processed layer 102, and a plurality of counter optical devices 113, here four φ object optical devices 113, are provided. Further, four light beams are also outputted in the light source device 112 corresponding to the number of beams irradiated. Further, the objective optical device 113 uses the axial light collecting optical element 52 similar to the objective optical device 51 of the first embodiment. The beam guiding system that directs the laser light from the light source device 112 to the head 110 is constructed in this example by a plurality of mirrors 115, 116, 117, 128, 129. Further, the beam guiding system of the beam irradiation device 111 is provided with an optical path length adjusting device 114 that maintains the optical path length from the light source device 112 to the head 110 substantially constant regardless of the moving position of the head 110. In this example, the head 110 moves at a distance of about the width of the substrate 101 in the X-axis direction in the width direction of the substrate 101 perpendicularly intersecting the Y-axis direction of the substrate 101 transport direction, when the substrate 101 is a large glass substrate. The distance from the light source device 112 to the head 110 largely varies due to the movement of the head 110. Here, the laser beam outputted from the light source device 112 is converted into parallel light by the collimator lens as incomplete parallel light, and the beam diameter is gradually increased by diffraction or the like. Therefore, when the laser beam is guided to the head 11 by using the mirror, the head 110 is incident to the objective optical device 113 when it is away from or close to the light source device 112. The beam path of the laser beam produces a distinct difference 'by this' resulting in a change in focus position or a change in beam intensity that impedes precision machining. Therefore, in this example, the laser beam is guided around to the optical path length adjusting device 114. Further, the beam guiding system basically has a first mirror 115 that guides a laser beam output from the light source device 112 to the X-axis direction, and is disposed to move in the X-axis direction integrally with the head 110, not in the Y-axis direction. The X-axis slider 122 will be described later, and the laser beam from the first mirror 115 may be guided to the second mirror 116 of the head 110 by bending 9 degrees along the γ-axis direction. The optical path length adjusting device 114 is disposed in the optical path of the laser beam between the first mirror 115 and the second mirror 116. Further, in this example, the optical path length adjusting means 114 is disposed beside the light source means 112 in which the optical axis is arranged along the Y-axis direction, and the optical path length is adjusted with respect to the movement of the head 110 in the X-axis direction, and incident to the optical path. The direction of the laser beam emitted from the length adjusting device 114 and the laser beam emitted from the optical path length adjusting device 114 is not the X-axis direction but the Y-axis direction. Further, the optical path length adjusting device 114 is not disposed between the first mirror 115 and the second mirror 116, and is disposed on the outer side and at the position on the first mirror 115 side. Therefore, the first mirror 115 causes the laser beam in the X-axis direction from the first mirror 15 toward the second mirror 116 to be reflected toward the opposite side without being directed toward the second mirror 116 side. Further, the laser beam reflected from the first mirror 115 is bent from the X-axis direction by 90 degrees to the Y-axis direction, and is incident on the third mirror 29 201006597 128 of the optical path length adjusting device 114 and the optical path length adjusting device. 114 is emitted, and the laser beam along the Y-axis direction is curved in the X-axis direction and reflected to the fourth mirror 129 of the second mirror 116. The optical path length adjusting means 114 is provided with mirrors 117, 117 for reflecting and outputting the laser beam to a direction parallel to the direction of the laser beam which is guided and incident. The mirrors 117, 117 are provided with two faces, the incident laser beam is bent by 90 degrees, and the mirror 117 for reflection is bent by a total of 180 degrees with the aforementioned mirror 117 which bends the bent laser beam by another 90 degrees. Therefore, the incident laser beam can be reflected and returned in a direction parallel to the incident laser beam. In addition, the position of the incident laser beam and the position of the laser beam which is reflected in parallel and reflected therefrom are staggered, and the incident laser beam is sequentially reflected by the first mirror 115 and the third mirror 128 on the side of the light source device 112. The emitted laser beam is directed by the fourth mirror 129 toward the second mirror 116 of the X-axis slider 122 of the support head 110. Further, here, the dihedral mirror of the laser beam of the reflected optical path length adjusting means U4 is 'in the optical path length adjusting means 114' along the optical axis of the laser beam incident parallel to each other and the optical beam of the emitted laser beam The laser beams move in a direction parallel to the optical axis, that is, in the direction of the optical axis. In other words, the optical path adjusting device 114 has a slider portion 118 on which the two mirrors ip and 117 are mounted, and the slider portion 118 is guided to be movable in the optical axis direction (γ-axis direction). The above-described slider portion 118 moves along the rail portion 119 in the drawing of the driving source. Further, the drive source may be a rotary motor or a linear motor having a drive mechanism that converts a rotary motion of a belt, a metal wire, or a ball screw into a linear motion, and the sliding portion (10) may be moved in a linear direction. The beam bow with this optical path adjustment device 114! The guiding system has a laser beam outputted from the light source 30 201006597 source device 112 to the x-axis direction, and a first mirror 115 and a first mirror 117 of one of the aforementioned two mirrors in, 117 of the optical path length adjusting device H4 The mirror 128 directs the laser beam output from the optical path length adjusting device 114 toward the second mirror 116 and the fourth mirror 129 of the objective optical device 113. In addition, when the laser beam incident on the optical path length adjusting device 114 and the laser beam emitted from the optical path length adjusting device 114 are along the x-axis direction, the optical path length adjusting device 114 is not required. And the third mirror 128 and the fourth mirror 129 that convert the laser beam between the γ-axis direction and the ruthenium direction. Further, the mirrors η and 117 may be replaced by retroreflection such as a corner prism or a retroreflector. Further, actually, the light reflected by the second mirror II6 is reflected by the mirror (not shown) provided in the above-mentioned object 'optical device 113 to the two-axis direction, and is incident on the objective lens of the objective optical device 113. In addition, in FIG. 6, only the optical path of one laser is displayed. Here, in the z-axis direction, a plurality of, for example, four laser beams pass through the same optical path, and are guided from the light source device 112 to the objective optical. The device 113 converts the four objective optical devices 113 φ into the X-axis direction. Further, a laser beam which is at a position lowest in the z-axis direction (twist direction) among the light reflected by the second mirror 116 is incident on the objective optical device 113 closest to the second mirror 116, in order from which the laser beam is increased It is incident on the objective optical device 113 far from the second mirror 116. Further, the head moving device 120 has a size slightly larger than that along the substrate 1〇1.

The X-axis direction width of the groove processing direction of the processing layer 102 is such that the X-axis moving mechanism 123 for moving the head HQ and the x-axis slider 122' provided for the X-axis moving mechanism 123 can make the head 11 沿 along the γ The γ-axis moving mechanism that moves in the axial direction 124 ° 31 201006597 In this example, the X-axis moving mechanism 123 and the Y-axis moving mechanism 124 are constituted by a linear motor 'by using a linear servo motor or a linear stepping motor, the head can be precisely controlled 110 moves. The X-axis moving mechanism 123 has an X-axis guide 125 having a stator of a linear motor extending in the X-axis direction and an X-axis slider 122 having a mover moving along the stator. The X-axis guide portion 125 guides the X-axis slider 122 in the X-axis direction, and the stator drives the mover in the X-axis direction. The x-axis moving mechanism 124 provided to the X-axis slide 122 has a guide portion 127 having a stator of a linear motor extending in the direction of the y-axis, and a head 110 having a mover moving along the stator. According to the above configuration, the head 110 can be moved in the X-axis direction within a range including the width of the processed layer 102 formed on the substrate 1?. Further, when the distance between the head 11 可 in the γ-axis direction and the distance between the respective beam emitting portions of the head 110 is equal to the interval between the grooves formed on the substrate 101 of the substrate 101, the beam is emitted to the object. The number of devices 113) is multiplied by the distance of the groove spacing. For example, when four grooves are simultaneously formed by four light beams, the substrate 1〇1 is required to end the distance along the processed layer before the distance between the grooves in the z-axis direction multiplied by the distance of the number of beams irradiated at the same time. The movement of the head 11 degrees in the X-axis direction ends the processing of the four grooves. Therefore, basically, the moving distance of the head 110 in the γ-axis direction is not necessarily the length of the interval between the number of beams emitted from the head 110 multiplied by the groove to be processed. Further, as will be described later, the moving speed of the head 110 in the x-axis direction is controlled to be equal to the moving speed of the substrate 101 32 201006597 in the γ-axis direction, and the head 110 is moved to each other to form a groove with respect to the continuous movement of 1〇1. Stopping in the opposite direction; and starting to move in the x-axis direction (positive direction), it is necessary to accelerate the moving speed of the head (10) in the x-axis direction to the acceleration speed of the moving speed of the base (four) 1. When the groove formed by the operation for making the primary groove of the head 110 advances the interval between the grooves by the substrate, it is not possible to make the groove below the head 11G, so the moving distance of the head U0 in the Y-axis direction is at most the above distance. That is enough. Therefore, the movement distance of the head 110 of the y-axis moving mechanism U4 in the direction of the ¥ axis is much shorter than the size of the substrate 101. A beam processing method accompanying the movement of the head 110 of the head moving device 120 having such an X-axis moving mechanism 123 and a spindle moving mechanism 124 will be described. Further, the head movement control is performed by a movement control device (movement control mechanism) not shown. The movement control device controls the X-axis moving mechanism 123 and the Y-axis moving mechanism 124 constituted by the linear motor to be basically controlled by well-known servo motor control or stepping motor control. In the beam processing method, first, the substrate 101 is moved by the transport mechanism 1〇4 at a predetermined speed SK. The light beam irradiation start position is set on the substrate 101 in accordance with each of the grooves corresponding to the number of beam irradiations of the head 110. Further, the beam irradiation start position is interactively set to the left side edge side and the right side edge side of the processed layer 102. Then, when the beam irradiation start position is the beam irradiation position of the light beam irradiation portion of the light beam irradiation portion of the head 110 which is the last side of the substrate 101, the irradiation of the light beam of the head 110 is started. In addition, the laser beam is irradiated only when the processed layer 102 is processed. When the head 11 is moved, the lens may be in a state of stopping the irradiation, or may be in a state where the processed layer 1〇2 is not processed. The laser beam is directly outputted to stabilize the laser beam. At this time, the moving speed of the head 110 in the γ-axis direction and the moving speed of the substrate 1〇1 in the γ-axis direction are the same, and are synchronized. Therefore, in the movement control, first, the head 11 is located on the left side of the substrate 101 which is moved in the transport direction, and the beam irradiation start position of the lower substrate to be irradiated with the light beam 1 〇1 is located on the left side. The head 110 is located at the origin of the Y-axis direction and is basically located on the last side of the transport direction. The head 11 is located at the origin position of either of the left and right in the X-axis direction. In addition, regarding the direction of the x-axis, when the head 11 is moved, it is the leftmost origin position and the rightmost origin position. The origin position does not need to be the starting point of the movable range of the head 110, and it is only necessary to start in the range of movement during the groove processing. At this time, the movable range of the configuration of the head 110 is larger than the range of movement of the head 110 when the groove is processed. At the stage where the beam irradiation start position of the substrate 101 is closer to the front predetermined distance than the beam irradiation position of the beam emitting portion on the last side of the transport direction of the head 110, the movement of the head 110 in the γ-axis direction is started, and the moving speed of the head 110 is accelerated to When the transfer speed is equal to the substrate 101, the speed is constant when they are equal. Further, when the speed is constant, the beam irradiation start position of the substrate 101 and the beam irradiation position of the head 110 are required to be equal. As shown in Fig. 8(a), the beam irradiation position of the head 11〇 is accelerated along the Y-axis direction along the arrow Y1. The moving speed of the head 110 is equal to the transport speed of the substrate 101, and at the time point when the beam irradiation start position is equal to the beam irradiation position, the beam irradiation is started, and the head no is moved in the z-axis direction. Thereby, 34 201006597 As shown in Fig. 8(a), the irradiation position of the four beams irradiated from the head cymbal is in a state of being moved obliquely forward in the right direction along the arrow Υ2. Since the acceleration period is required to move in the x-axis direction, the movement of the head 110 in the X-axis direction is actually started before the beam irradiation start position is equal to the beam irradiation position. At this time, the movement in the X-axis direction is basically a constant-speed movement, as the above-mentioned initial acceleration is required, and finally the deceleration is required. In particular, when the speed caused by the acceleration or deceleration is different, when the processing of the laser beam is affected, the start position and the stop position of the x-axis movement are outside the left and right side edges of the processed layer 102, and the head is moved at the start position of the x-axis. The plane 110 is accelerated in the direction of the x-axis, and the surface starts to move. At the stage from the outer side of the side edge of the processed layer 102 to the side edge, the moving speed in the X-axis direction reaches a predetermined speed SX, and then the beam is irradiated to While being processed on the layer 102, it moves at a constant speed at a predetermined speed. Further, acceleration in the x-axis direction is performed simultaneously with acceleration in the X-axis direction outside the processed layer 102. Here, the stage in which the head 110 is accelerated in the x-axis direction and the X-axis direction is a side edge side acceleration step (left side edge side acceleration step). As described above, the head 110 moves at a constant speed in the z-axis direction at the transport speed SK of the substrate 101, and moves at a constant speed SX at the predetermined speed in the X-axis direction as a forward direction constant velocity machining step. When the irradiation position of the laser beam reaches the side edge of the opposite side of the processed layer 102, the speed of the movement of the head 110 in the X-axis direction is decelerated and stopped. At the stage where the constant velocity movement in the x-axis direction is completed, that is, the constant velocity movement in the γ-axis direction is also completed, the head 110 is moved in the direction of the x-axis in the direction of the x-axis in the opposite direction. At this time, the head is decelerated in the movement in the γ-axis direction. 35 201006597 Stops and then moves in the reverse direction. At this time, the movement in the x-axis direction also slows down and stops. The step of returning to the origin position of this head no is the other-side edge side origin reply step. Further, at this time, the substrate 101' is moved at the predetermined transport speed SK by the lower beam irradiation start position as the above-described beam irradiation start position at which the laser beam is irradiated. On the other hand, the head 110 is moved in the reverse direction of the conveyance direction in the γ-axis direction, and is returned to the original position. In the X-axis direction, there is an origin position on the left and right, and the head 110 is stopped at the right origin position opposite to the left origin position. At this time, as indicated by the arrow Y3 of Fig. 8(a), the head 11 () is returned to the origin position of the Y-axis direction along the γ-axis direction, and at this time, the light beam of the substrate 1〇1 is irradiated. The starting position needs to be rearward than the aforementioned beam irradiation position of the head 110. As described above, when the head 110 starts moving to a predetermined speed, the beam irradiation start position of the substrate 1〇1 is caught in the state of the beam irradiation position of the head 110. Further, if acceleration or deceleration is not considered, in this state, the lower beam irradiation start position of the substrate 101 is aligned with the beam irradiation position of the head 11 ,, and actually, the second owing is passed along the X-axis direction and the γ-axis. The direction causes the head 11 〇 to start moving, and the accelerated other side edge side acceleration step causes the beam irradiation start position to align with the beam irradiation position of the head 110. Then, the other side edge side origin returning step and the other side edge side accelerating step are combined to constitute the other side edge side irradiation position alignment step. Further, in the other side edge side acceleration step, basically the same processing as the above-described side edge side force idling step is performed except that the left and right positions are reversed. That is, it is accelerated in the γ-axis direction as indicated by the arrow of Fig. 8(b). 36 201006597 Further, in the x-axis direction, the left origin position 'starting with respect to the movement in the x-axis direction is accelerated in the same manner except that the right original position is moved from the right to the left opposite to the above. Then, in the other side edge side acceleration step, the moving speed in the γ-axis direction is the transport speed SK of the substrate 101, and the moving speed in the X-axis direction is also a predetermined speed, and the beam irradiation start position of the substrate 101 becomes the head 11 At the irradiation start position, the reverse-direction constant-speed machining step is performed by moving the laser beam at a constant speed in the direction opposite to the forward direction constant-speed machining step and moving at the same speed in the γ-axis direction. That is, it moves in the direction of the arrow γ in the figure 8(b). Then, in the same manner as described above, the one-edge-side origin returning step is performed, and the constant-speed movement in the X-axis direction and the Υ-axis direction is completed, the vehicle is decelerated and stopped in the χ-axis direction, and is decelerated and stopped in the Υ-axis direction to cause the head 11 〇 Return to the origin position as indicated by arrow Υ6 along the γ axis. Then, the head 110 is returned to the reverse direction of the transport direction in the x-axis direction, and after the origin position, the first step is returned. Then, the one side edge origin returning step and the first one side edge side accelerating step are a side edge irradiation position alignment step of aligning the beam irradiation position of the head 110 with the beam irradiation start position of the substrate 101. In the above beam processing method, the movement of the head 110 is substantially in the form of a bow tie as shown in Fig. 8(c). That is, after moving obliquely from the left side to the right side, the pen returns straight to the rear side, and then moves obliquely from the right side to the left front side, and the pen returns straight to the rear side, whereby the moving shape is a bow tie shape. Further, in such a movement, the movement speed from the left side to the front side of the front side, 37 201006597, that is, the movement speed in the γ-axis direction coincides with the conveyance speed of the substrate 1〇1 from the right side to the front side of the left front side, that is, Since the moving speed in the z-axis direction is the same as the transport speed of the substrate 101, the processed shape of the processed layer 102 of the substrate 101 is arranged in a stripe shape at equal intervals. Further, in the eighth (a)th to eighth (d)th drawings, the solid line indicates the processing in the positive direction (here, from left to right), and the broken line indicates the processing in the reverse direction (here, from right to left). . The movement control of the head 11 for performing such a beam processing method is performed by the above-described movement control device while performing the processing in the γ-axis direction and the Χ-axis direction, and is controlled in the approximate steps shown below. The position of the head 110 is the γ-axis origin position and the X-axis left origin position (may also be the right origin position). Further, in the servo control, the x-axis moving mechanism 123 and the Y-axis moving mechanism 124 are provided on the stator side to measure the position of the moving sub-position, and the sensor moves the mechanism 124 and the γ in the γ-axis. The axis moving mechanism 123 measures the position of each mover, and the position of the head can be measured. When not in the predetermined head position, it moves in the head 11〇. Further, during the first 11 〇 operation, feedback control is performed by the position obtained by the above-described sensor. The transfer mechanism 104 is interlocked to carry the substrate 101, and the substrate 1〇1 is accelerated to a predetermined speed SK and transported at a predetermined speed SK. When the beam irradiation start position of the processed layer of the substrate reaches a predetermined position, that is, when the beam irradiation start position is at a predetermined distance L1 from the beam start position of the head 110 located at the origin position, the following processing is performed. . That is, the acceleration of the predetermined speed SK is set by the Υ-axis moving mechanism 124 accelerating the moving member from the speed 〇 to the predetermined speed 38 201006597 degrees sk ' while the acceleration at this time is predetermined during the predetermined period in which the moving sub-movement moves. Here, the predetermined speed SK is the same speed as the transport speed SK of the transport mechanism 104. Further, at this time, in addition to the predetermined distance, the substrate 101 moves the distance of the substrate 101 at a predetermined speed SK in the predetermined period. At this time, the beam start position is set to the head beam irradiation position. Further, in the X-axis moving mechanism 123, the moving member is accelerated from the speed 〇 to the predetermined speed SX°. At this time, the beam irradiation position of the head 110 reaches the beam irradiation start position from the outer side of the processed layer 102 to the side edge of the processed layer 102. . In this state, the moving sub-speed of the γ-axis moving mechanism 丨24 is the predetermined speed SK'. The moving sub-speed of the X-axis moving mechanism 123 is the predetermined speed SX, and the beam irradiation position at the position of the head 110 is the substrate 1〇1. The beam is illuminated at the start position. This control step is a side edge side acceleration control step. While maintaining the above state, the moving member of the X-axis moving mechanism 123 and the moving member of the Y-axis moving mechanism 124 continue to move to the processing end position of the other side edge of the processed layer 102 in this state. This is the forward constant speed machining control step. When the machining end position is reached, the movement of the Y-axis moving mechanism 124 is rapidly decelerated, and after stopping, it is rapidly accelerated in the opposite direction, and returns to the Y-axis origin position, and then rapidly decelerates near the Y-axis origin position. Stop at the Y-axis origin position. Similarly, in the X-axis moving mechanism 123, the mover is also decelerated rapidly, and stops at the origin position on the right side of the X-axis. This is the other side edge origin return control step. 39 201006597 Next, the acceleration step of the mover of the γ-axis moving mechanism 124 and the step of accelerating the mover of the X-axis moving mechanism 123 are performed. That is, another side edge side acceleration control is performed. In addition, the step of combining the above-mentioned other side edge origin return control step and the other side edge side acceleration control step is another side edge illumination position alignment control (4), and the side edge side illumination position alignment control step is on the substrate The other side edge side of the added jade layer 1 () 2 of the HU is controlled so that the head 110 moves in the opposite direction to the transport direction of the substrate 1 () 1, and the forward direction of the substrate 1G1 in the transport is equally fastened. In the control step, the light beam emitted from the light beam emitting portion on the foremost side in the transport direction of the head 11 is illuminably moved to a portion processed by the light beam emitting portion (the object optical device 113) on the rear side in the transport direction of the head 110. The location of the scheduled interval. Further, the traveling direction of the 'X-axis moving mechanism 123' is the opposite direction to the above-described acceleration step. The moving speed of the moving object of the γ-axis moving mechanism 124 is the predetermined speed SK, and the moving speed of the movement of the X-axis moving mechanism 123 is the predetermined speed 8 again. The beam irradiation position of the head 110 moving by the head moving device 120 is the next beam irradiation start position of the substrate 101. At this stage, the reverse isotropic machining control step opposite to the traveling direction in the X-axis direction is performed in the same manner as the above-described forward constant-speed machining control step. That is, the head 110-surface irradiates the laser beam while moving at a predetermined speed SK in the γ-axis direction and at a predetermined speed SX in the X-axis direction. Then, when the beam irradiation position of the head 110 reaches the beam irradiation end position of one side edge of the processed layer 102 of the substrate 101, one side edge side origin return control is performed in the same manner as the other side edge side origin return control step. step. This 40 201006597 outer (fourth) moving mechanism 123, the other side edge side is just right and the origin of the left and right positions opposite to the previous one. Return to the left origin position of the original x-axis moving mechanism 123. You can continue to add 2 = and at the same time, repeat the above steps, and 盥 the most mouth and the origin side return control step

Side Irradiation Position Alignment (4) Step Phase n just m position alignment = step. Further, on the other side edge side irradiation position alignment control step, the side edge side irradiation position alignment control step is performed, and the left and right positions of the x-axis direction are opposite. According to the beam processing method of the beam processing device, the head 110 is moved as described above, and the groove can be formed in the processed layer 102 without being stopped by the substrate 1G1. Therefore, the power generation system can be manufactured. Significantly shortened during the work period. Further, in the transport mechanism 104 of the substrate 101, acceleration, deceleration, and stop are not frequently performed. Therefore, even if the substrate 101 to be transported is large and heavy, the transport mechanism 104 is not required to have a large strength, and the transport mechanism 1 can be realized. The cost of 〇4 is reduced. Further, it is possible to prevent a large load from being applied to the substrate 101 to be transported. Further, since the head 110-plane can be moved along the shape shown by the outer circumference of the bow tie, and the laser beam is irradiated perpendicularly to the substrate 101, the layer to be processed is irradiated to the processed layer from the other side of the substrate 1〇1. When the beam is processed, a current mirror is used, obliquely irradiated, and the reflectance or the irradiation angle of the refractive index at the interface between the substrate 101 and the surrounding ambient air or other gas does not change as compared with the case where the irradiation angle is changed. It is possible to carry out the processing of the precision and roughly the 201006597, whereby the power generation efficiency can be expected in the manufacture of the aforementioned power generation system. Since the axial light collecting optical element 52 is used, when the structure of the plurality of light beams is simultaneously irradiated, the Z-axis of the processed layer side due to the difference in the focus of the objective optical device 113 of each light beam or the difference in the irradiation position of the light beam is used. The deviation of the direction or the like can make the respective irradiation positions on the processed layer of the complex beam within the depth of focus, and even if the structure of the plurality of beams is simultaneously irradiated, the processing accuracy can be prevented from being lowered, and the processing quality can be maintained while being maintained. Increase the number of laser beams that can be illuminated simultaneously. With this, it is possible to further shorten the processing time. In addition, when a plurality of linear processes are repeatedly performed at a narrow interval to form a stripe structure, the moving speed of the head 110 in the X-axis direction and the γ-axis direction, and the above-described deceleration and origin return steps, the moving speed is relatively The transport speed of the substrate is required to be relatively fast, and the plurality of laser beams are used at a time to process the plurality of grooves, and when the transport speed of the substrate 101 is constant, the moving speed of the head 11 χ in the axial direction can be reduced, and the γ-axis direction can be reduced. The long-term period of the period required for deceleration, stop, and acceleration can be reduced by the cost of the head mobile device 12 . On the contrary, the transport speed of the substrate 101 can be increased, and the processing time can be further shortened. Further, in the beam processing substrate manufactured by the beam processing method of the beam processing apparatus, the cost reduction of the manufacturing equipment of the above-mentioned beam-shaping device and the cost reduction of the manufacturing time can be reduced. In this way, even if the cost is reduced, a precise and stable beam processing can be performed to form a high-quality beam processing substrate, which can be used as a panel for a power generation system using photovoltaics, and has high power generation efficiency. In addition, since the beam irradiation position moves in a bow-tie shape, the gap portion where the suction mechanism is disposed on the stage 141 corresponds to the butterfly collar and the social "beam irradiation position. °" Fig. 9(a), ninth (b) and Fig. 10 are views showing the outline of a beam processing apparatus according to a fourth embodiment of the present invention. In the first to third embodiments, the laser beam is irradiated from the upper side of the substrate 2 (101) with the substrate (1〇2) side of the substrate 2 (1〇1) as the lower side, and the second embodiment is used. In the middle, the laser beam is irradiated from the lower side of the substrate 101 with the substrate 1〇2 (shown on the seventh drawing) side of the substrate 1 as the upper side. In the fourth embodiment, the structure of the transport mechanism 2〇4 is different from the first to third embodiments, and the head 210 of the light beam irradiation mechanism that is different from the first to third embodiments is disposed on the substrate on the transport mechanism 204. The lower side of the 1〇1, the moving mechanism of the head 21〇 or the beam guiding system for guiding the laser beam to the head 21 is disposed on the lower side with respect to the substrate ι1 on the transport mechanism 204, except for the position of the substrate 101 A beam irradiation mechanism (beam irradiation device 211) similar to that of the third to third embodiments can be used. The beam processing apparatus according to the fourth embodiment can be used in the same manner as in the third to third embodiments, and the same processing can be performed, and a photovoltaic power generation system similar to that of the first embodiment can be manufactured. The conveying mechanism 2〇4 of the fourth embodiment does not have the gas floating mechanism 10, but has a roller 2〇3 as a supporting mechanism. The roller 203 is rotatably supported by the roller support mechanism 205. Further, the rotation center of the roller 2〇3 is disposed in a direction perpendicular to the conveyance direction of the substrate 101 of the conveyance mechanism 204 43 201006597, and the substrate 101 is supported to be movable in the conveyance direction. Further, the rollers 203 are arranged in a plurality of rows in the transport direction, and are arranged in a plurality of rows in the width direction perpendicular to the transport direction, and the substrate 1〇1 is supported from the lower side so that the substrate 101 is not bent. That is, the transport mechanism 204 supports the substrate 1〇1 in a flat state. Further, the roller 203 may be arranged in a plurality of rows in the width direction of the substrate 1 (1 in a direction perpendicular to the direction in which the substrate 1 1 is conveyed), and the roller 2 〇 3 may be the same as the substrate 101. The length of the degree prevents the deflection of the substrate 1〇1. The roller 203 is in contact with the lower surface of the substrate 1〇1, and since the substrate 1〇1 faces the processed layer 102 toward the upper side and is disposed on the transport mechanism 2〇4, the processed layer 1〇2 does not contact the roller 203, and the processed layer 1〇2 does not cause Damaged by contact with the roller 203. Further, all of the upper end portions of the rollers 203 are disposed in almost flat planes, and can be supported in a state in which the substrate 101 is hardly deflected. Further, the roller 203 basically supports the substrate 101 so as to be movable in the transport direction similarly to the gas floating mechanism 1A, and the movement of the substrate 101 is performed by a moving mechanism not shown in the figure, similarly to the second embodiment and the second embodiment. . The moving mechanism is the same as that of the moving mechanism 14 of the first embodiment. Further, the conveying mechanism 204 has the slit portion 2 similarly to the gas floating mechanism 1 (Π. The slit portion 201 intersects the conveying direction perpendicularly and has a length equal to or greater than the width of the substrate 1〇1. In the slit portion 201 On the lower side, as will be described later, the head 21 is movable in the x-axis direction of the transport direction of the substrate 1〇1 and the x-axis direction perpendicularly intersecting the transport direction. The upper side of the slit portion 201 is provided substantially the same as the second embodiment. 44. The suction mechanism 207 of the structure of 201006597. The suction mechanism 207 is a powder removing mechanism of the fourth embodiment.

The 丨 mechanism 207 is the same as the second embodiment, and is not a substrate 101, but a processed layer, a row, and a bow of the substrate 101 from the upper side of the substrate 101. The suction mechanism 207 is disposed on the slit portion 201 so as to be disposed on the slit portion 201' with the laser beam from the lower side and covering the entire portion of the force-receiving layer 102 to be processed by the light beam. Thereby, the laser beam is irradiated, and the powder (dust) generated as described above is sucked and removed, and the β-side dust adheres to the processed layer 102 of the substrate 1〇1 or is in a state of being processed. Further, the suction mechanism 207 is fixedly disposed so as to attract the powder in the entire range of movement of the head 210 (the range in which the substrate 〇1 of the transport mechanism 204 is irradiated with laser light), and the suction mechanism 207 may also correspond to the irradiation of the laser. The mover of the location. The beam irradiation device 211 of the fourth embodiment is basically the same as the beam irradiation device 111 of the third embodiment, and has a light source device 212 that generates a laser beam, and a light beam that guides the laser beam from the light source device 212 to the head 210. Boot the system. In addition, the beam guiding system will be described with reference to the schematic diagrams shown in FIG. 9 and FIG. 1 , and the laser beam irradiated from the light source device 212 in the X-axis direction is guided to the third embodiment by the mirror 215 toward the x-axis direction. The state of the optical path length adjusting device 214 of the optical path length adjusting device 114 of the form is the same. The laser beam introduced into the optical path length adjusting means 214 is changed in the X-axis direction by the mirror 216 from the x-axis direction. The retroreflector 217 of the optical path length adjusting device 214 is movably disposed on the front side of the mirror 216 in the X-axis direction in the X-axis direction. The retroreflective mirror 217 45 201006597 is supported on the optical path length adjusting table 213 so as to be movable in the X-axis direction. The retroreflective mirror 217 is provided in place of the two mirrors 117 and 117 of the optical path length adjusting device 114 of the first embodiment. When light is incident from a predetermined direction, light is reflected and emitted in a state parallel to the incident light. The retroreflector 217 cooperates with the movement of the head 210 to move in the direction of the light (light emitted) incident on the retroreflector 217 to maintain the optical path length of the laser beam approximately constant. The light emitted from the retroreflective mirror 217 is irradiated to the mirror 219 by the mirror 218, and the mirror 219 irradiates the light to the head 210 in the X-axis direction. The head 210 is supported by the cymbal stage 209 provided on the lower side of the slit portion 2〇1 of the conveying mechanism 204 so as to be movable in the X-axis direction. The head 21〇 moves in the direction of the other axis on the lower side of the slit portion 201 of the transport mechanism 204, and maintains the state in which the laser beam is irradiated from the mirror 219 to the head 210. In addition, the light beam irradiation device 211 which is configured by the above-described components is placed on the susceptor 220, and is placed in the inside of the transport mechanism 2〇4 as described above, and the head 210 is moved in the X-axis direction. 2〇9 is disposed directly below the slit portion 201 of the conveying mechanism 204. Further, in the same manner as in the third embodiment, the head 210 is also slightly moved by a slight distance in the γ-axis direction, and the structure in the γ-axis direction is omitted in the ninth and third aspects. Further, the head 21G can simultaneously illuminate a plurality of laser beams. At this time, the laser beams are arranged in the Y-axis direction. In the head 210, the axial light collecting optical element is used, and the axial light collecting optical element having a deep depth of focus is obtained as in the first to third embodiments. The beam processing method of the beam processing apparatus of this example is disposed on the lower side of the substrate 101 with the substrate 110 facing upward from the substrate 1〇1 at 46 201006597, and the laser beam is irradiated upward from the lower side of the substrate 101. The rest is performed in the same manner as in the first to third embodiments. In other words, in the same manner as in the first and second embodiments, the transport mechanism 104 is in a state in which the substrate 101 is repeatedly stopped and transported, and the substrate 101 is stopped while moving in a direction perpendicular to the transport direction of the substrate 101. The laser beam is irradiated, whereby the groove can be formed in a stripe shape on the processed layer 102 of the substrate 101. Further, similarly to the third embodiment, the configuration may be such that the substrate 1 is transported at a constant speed by the transport mechanism 104, and the substrate is moved in the same manner as described above. The position moves into a bow tie. In this example, by arranging the substrate 101 with the processed layer 102 as the upper side, the substrate 101 can be supported from the lower side without damaging the processed layer 102, and the deflection of the substrate 101 can be prevented. Further, by irradiating the laser beam from the lower side of the substrate 101, the processed layer 102 can be processed by the laser beam of the substrate 101. Therefore, since the substrate 101 is supported from the lower side, the laser processing can be performed while the substrate 1〇1 is kept flat. Therefore, the focus range of the optical element for the shaft-shaped collecting light is increased, and the processing accuracy can be further improved. It is improved, and the number of laser beams that can be irradiated can be increased without reducing the processing precision, and the manufacturing time can be shortened. Further, when the processed layer 102 is used as the upper layer, the powder generated by the processing of the processed layer 102 adheres to the substrate 101, and the powder is removed from the upper side of the substrate 101 to prevent the powder from being removed on the substrate 101. The processing of the processing layer 102 and the adhesion of the powder produced by 47 201006597. Thereby, even if the processed layer on the upper side of the substrate ιοί is processed from the lower side of the substrate, no problem occurs, and the processing of the processed layer 102 is performed. Further, the same effects as those of the third embodiment can be exhibited by using the same beam processing method as in the third embodiment. In addition, the member on the lower side of the support substrate 101 can be prevented from being bent by the substrate 101, and can be smoothly moved in the transport direction without damaging the substrate 1〇1, and may be any member, or may be a belt transport structure. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the outline of a beam processing apparatus according to a first embodiment of the present invention. Fig. 2 is a front view showing the outline of the beam processing device. Fig. 3 is a side elevational view showing the outline of the above-described beam processing apparatus. Fig. 4 is a plan view showing the outline of a beam processing apparatus according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view showing the outline of a beam processing apparatus according to a second embodiment. Fig. 6 is a plan view showing the outline of a beam processing apparatus according to a third embodiment of the present invention. Fig. 7 is a front elevational view showing the outline of a beam processing apparatus according to a third embodiment. Figs. 8(a) to 8(d) are diagrams for explaining the beam irradiation method of the third embodiment. 201006597 Fig. 9(a) to Fig. 9(b) are schematic views showing a beam processing apparatus according to a fourth embodiment. Fig. 10 is a schematic view showing a beam processing apparatus according to a fourth embodiment. [Main component symbol description]

2...glass substrate 101...substrate 3...processed layer 102...processed layer 5...substrate moving mechanism 103...light beam 5a··.guide rail 104...transport mechanism 5a ...guide track 110...head 10...gas float mechanism 111...beam illumination mechanism 11...stage 112...light source device 11a...back side table 113...object optics Lib...front side table 114... optical path length adjusting device 11c... slit portion 115" mirror 12... gas ejection plate 116. mirror 13... suction mechanism 117... mirror 13a... suction port 118...slider portion 14...moving mechanism 119...track portion 15...gas suction plate 120...head moving device 16...powder removing mechanism 122.. .X-axis slide 50···beam irradiation mechanism 123...X-axis moving mechanism 51...object optics 124...Y-axis moving mechanism 52·.·axis-shaped collecting optical element 125.. X-axis guide portion 53... Guide rail 127... Guide portion 49 201006597 128...Mirror 212...Light source device 129...Mirror 213... Optical path length adjustment table 141."Table 214...Light The path length adjusting device 201...the slit portion 215··.the mirror 203...the roller 216··the mirror 204...the transport mechanism 217...the retroreflection Mirror 205...roll support member 218."mirror 207...suction mechanism 219···mirror 209 ...X-axis table 220...base 210.··head Y1-Y6...arrow 211...beam irradiation device

50

Claims (1)

201006597 VII. Patent application scope: 1. A beam processing device is a processor that irradiates a light beam on a processed layer formed on one side of a substrate, and is characterized in that: a beam irradiation mechanism is formed on the substrate-surface Processing, the layer facing downwards, the light beam is emitted from the other surface of the substrate, and the processed layer is processed; and the beam irradiation mechanism has a shaft-shaped collection of axial light collection. The axial collecting beam is illuminated. 2. A beam-lifting device for processing a light beam formed on a substrate-to-surface processed layer, comprising: Γ a beam irradiation mechanism for forming a layer formed on one side of the substrate Upwardly, the beam is processed from the lower side of the substrate, and the support layer is supported by the lower side; and the powder removing mechanism attracts the light beam due to the processed layer. The light beam irradiation means has a shaft-shaped light collecting optical device that performs axial concentrating, and illuminates the axially-shaped light collecting beam. 3. The beam processing apparatus according to claim 2 or 2, further comprising: a substrate moving mechanism for moving the substrate in at least one direction; and a beam irradiation position moving mechanism for causing the axial light collecting The optical device moves back and forth in a direction intersecting one of the moving directions of the substrate; 51 201006597 and the 'beam irradiation mechanism has a plurality of axial light collecting optical devices having different positions along the moving direction of the substrate, Irradiating a plurality of axially-collected beams of light, the broom of the axially-shaped collecting beam, can process the aforementioned layer to be striped. 4. The beam processing apparatus according to any one of claims 1 to 3, wherein: the substrate moving mechanism is configured to move the substrate in one direction; and the beam irradiation position moving mechanism is The movement of the substrate is the same as the step of moving the optical device for axial concentrating in the moving direction of the substrate, and the optical device for axial concentrating is placed in a direction parallel to the moving direction of the substrate. The mover is ' and 'the processed layer of the substrate is processed by irradiating the light beam of the light beam irradiation means in a state where the substrate is transported by the moving mechanism. A method for processing a beam by irradiating a beam formed on a layer to be processed on one side of a substrate, wherein the substrate is formed from the substrate on which one of the processed layers is formed facing downward, and the processed layer is formed. The other side of the opposite surface is irradiated with the axially-shaped light-collecting beam, whereby the processed layer is processed by the axially-collected light beam based on the substrate. 6. A method of processing a beam of light, in which a beam is irradiated onto a layer to be processed formed on one side of a substrate, and is processed from a state in which one of the processed layers is formed to face upward and is supported from below. The lower side of the substrate opposite to the surface on which the layer to be processed is formed is irradiated with the axial collecting light 52 201006597 The beam is formed by the processing of the processed layer by the axially-shaped light collecting beam, and the powder generated by the processing of the light beam of the processed layer is sucked and removed from the upper side of the substrate. 7. A beam processing substrate, which is a processed layer processed by a beam processing apparatus according to any one of claims 1 to 4. 53