TW200951449A - Test system and probe device - Google Patents
Test system and probe deviceInfo
- Publication number
- TW200951449A TW200951449A TW098113186A TW98113186A TW200951449A TW 200951449 A TW200951449 A TW 200951449A TW 098113186 A TW098113186 A TW 098113186A TW 98113186 A TW98113186 A TW 98113186A TW 200951449 A TW200951449 A TW 200951449A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- probe
- several
- wiring substrate
- probe device
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/058143 WO2009130793A1 (ja) | 2008-04-25 | 2008-04-25 | 試験システムおよびプローブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200951449A true TW200951449A (en) | 2009-12-16 |
TWI391672B TWI391672B (zh) | 2013-04-01 |
Family
ID=41216542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098113186A TWI391672B (zh) | 2008-04-25 | 2009-04-21 | 測試系統以及探針裝置 |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI391672B (zh) |
WO (1) | WO2009130793A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI710768B (zh) * | 2019-09-04 | 2020-11-21 | 創意電子股份有限公司 | 測試裝置及使用其的測試流程 |
CN112444723A (zh) * | 2019-09-04 | 2021-03-05 | 创意电子股份有限公司 | 测试装置及使用其的测试流程 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3214100U (ja) * | 2017-10-06 | 2017-12-21 | ワイエイシイガーター株式会社 | 測定装置、及び分類装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3865115B2 (ja) * | 1999-09-13 | 2007-01-10 | Hoya株式会社 | 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード |
JP2002139540A (ja) * | 2000-10-30 | 2002-05-17 | Nec Corp | プローブ構造体とその製造方法 |
JP3891798B2 (ja) * | 2001-06-19 | 2007-03-14 | 松下電器産業株式会社 | プローブ装置 |
US7066707B1 (en) * | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
JP2004053409A (ja) * | 2002-07-19 | 2004-02-19 | Matsushita Electric Ind Co Ltd | プローブカード |
TWI236723B (en) * | 2002-10-02 | 2005-07-21 | Renesas Tech Corp | Probe sheet, probe card, semiconductor inspection device, and manufacturing method for semiconductor device |
JP4521611B2 (ja) * | 2004-04-09 | 2010-08-11 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP5008005B2 (ja) * | 2006-07-10 | 2012-08-22 | 東京エレクトロン株式会社 | プローブカード |
-
2008
- 2008-04-25 WO PCT/JP2008/058143 patent/WO2009130793A1/ja active Application Filing
-
2009
- 2009-04-21 TW TW098113186A patent/TWI391672B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI710768B (zh) * | 2019-09-04 | 2020-11-21 | 創意電子股份有限公司 | 測試裝置及使用其的測試流程 |
CN112444723A (zh) * | 2019-09-04 | 2021-03-05 | 创意电子股份有限公司 | 测试装置及使用其的测试流程 |
Also Published As
Publication number | Publication date |
---|---|
WO2009130793A1 (ja) | 2009-10-29 |
TWI391672B (zh) | 2013-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |