TW200951178A - Polyimide material, polyimide film, method for producing the polyimide material and method for producing the polyimide film - Google Patents

Polyimide material, polyimide film, method for producing the polyimide material and method for producing the polyimide film Download PDF

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TW200951178A
TW200951178A TW98108946A TW98108946A TW200951178A TW 200951178 A TW200951178 A TW 200951178A TW 98108946 A TW98108946 A TW 98108946A TW 98108946 A TW98108946 A TW 98108946A TW 200951178 A TW200951178 A TW 200951178A
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group
film
polyimide
compound
polyimine
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TW98108946A
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Chinese (zh)
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Takashi Okada
Toshimitsu Kikuchi
Takaaki Uno
Igor Rozhanskii
Kohei Goto
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Jsr Corp
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Priority claimed from JP2008280604A external-priority patent/JP2009256589A/en
Priority claimed from JP2008280605A external-priority patent/JP2009256590A/en
Priority claimed from JP2008290392A external-priority patent/JP2010116476A/en
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200951178A publication Critical patent/TW200951178A/en

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Abstract

Disclosed is a low-cost polyimide film having excellent heat resistance, colorless transparency, formability and optical characteristics. The film contains a polyamic acid and/or a polyimide which is obtained by reacting (A) at least one acyl compound selected from the group consisting of 2,3,5-tricarboxycyclopentylacetic acid, 2,3,5-tricarboxycyclopentylacetic acid dianhydride and reactive derivatives of those, and (B) a specific aromatic imino-forming compound in such a manner that the molar ratio between (A) the acyl compound and (B) the aromatic imino-forming compound is within the range from 1.000:0.960 to 1.000:0.995.

Description

200951178 六、發明說明: 【發明所屬之技術領域】 本發明係關於聚醯亞胺系材料、聚醯亞胺薄膜及該等 " 之製造方法。 【先前技術】 一般而言,由芳香族四羧酸二酐與芳香族二胺獲得之 ❹ 全芳香族聚醯亞胺由於具有分子剛直性、或分子共振安定 化及強的化學鍵等,而具有優異之耐熱性、機械特性、電 氣特性、耐酸化·水解性,因此被廣泛使用在電氣、電池 、汽車及航空宇宙產業等之領域中做爲薄膜、塗覆劑、成 形零件、絕緣材料。另一方面,光學構件中使用之材料除 優異之耐熱性、機械特性等以外,亦需要優異之無色透明 性、易成形(成型)性、光學特性。其中,例如以Kapton (東麗杜邦公司製造)爲代表之全芳香族聚醯亞胺薄膜雖 Φ 如上述般具有優異之耐熱性等而適用於機械、電氣等領域 中,但由於著色性高或成形性低,因此作爲光學材料使用 時有受限之問題。亦即,上述薄膜因源自分子間或分子內 - 之電荷移動相互作用而吸收可見光領域,而會有著色成黃 . 色至褐色之問題。另外,上述薄膜由於成形成爲薄膜狀, 因此需要在高溫之熱處理等,而有製程負荷高且成形性低 之問題。具體而言,形成上述薄膜之聚醯亞胺對有機溶劑 之溶解性低,無法直接使用聚醯亞胺形成薄膜。因此,需 要使用上述聚醢亞胺之前驅物之聚醯胺酸溶液,對基板塗 -5- 200951178 佈成爲薄膜狀塗膜後,藉由使該塗膜在400°C左右之高溫 下進行熱處理,使塗膜中之聚醯胺酸醯亞胺化,獲得由聚 醯亞胺組成之薄膜。 爲了解決該等問題,提高非著色性及透明性,因而提 案有各種可賦予對於有機溶劑之可溶性且可提高成形性之 聚醯亞胺。例如提出由具有全氟烷基之特定重覆構造所構 成之(全芳香族)聚醢亞胺共聚物(專利文獻1)。另外 ,提案有由環丁烷四羧酸二酐及1,2,4,5-環己烷四羧酸二 酐與4,4’-二胺基二苯基醚等芳香族二胺獲得之聚醯亞胺 (非專利文獻1)。該等聚醯亞胺係合倂使用芳香族與脂 肪族之二酐所構成之半芳香族聚醯亞胺。另外,提案有由 選自由1,2,4,5-環己烷四羧酸、1,2,4,5-環己烷四羧酸二酐 及該等之反應性衍生物組成之群組之至少一種含有醯基之 化合物與以特定式表示之芳香族二胺反應而成之聚醯亞胺 樹脂(專利文獻2、3 )。 專利文獻1 :特許3 1 3 1 940號公報 專利文獻2:特開2006-199945號公報 專利文獻3 :特開2007-326962號公報 非專利文獻 1 : High Performance Polymer 19, p 17 5 -193 (2007) 【發明內容】 [發明欲解決之課題] 專利文獻1中所述之聚醯亞胺共聚物雖耐熱性優異, -6 - 200951178 且透明性或對於有機溶劑之溶解性獲得改良,但有耐光性 低且成本高的問題。非專利文獻1中所述之聚醯亞胺雖耐 熱性優異’且相較於過去之聚醯亞胺之透明性獲得改良, 但用做光學材料時仍有透明性不足之問題。另外,該聚醯 * 亞胺由於對有機溶劑之溶解性低,因此成形成薄膜狀時, 使用前驅物的聚醯亞胺酸必須在高溫下進行熱處理(熱醯 亞胺化)’而留下製程負荷大且成形性不良之課題。專利 〇 文獻2、3中所述之聚醯亞胺樹脂雖透明性獲得改良,但 由於所用之二胺單體之氧化,有引起薄膜初期或經時著色 之問題。就該點而言,由上述文獻中所述之聚醯亞胺樹脂 等構成之薄膜之任一種使用作爲光學構件時均有非著色性 不足之問題。而且,使用聚醯亞胺作爲光學構件之材料時 共通之課題爲由於所用之二胺單體之氧化,有引起薄膜初 期或經時著色之問題。就該點而言,由上述文獻中所述之 聚醯亞胺樹脂等構成之薄膜使用作爲光學構件時均有非著 〇 色性不足之問題。另一方面,光學特性優異之素材雖舉例 有聚芳酯、聚碳酸酯,但該等素材之玻璃轉移點爲200 °C 以下,耐熱性有其界限,而無法期待抗焊性,不具有可充 _ 分作爲印刷電路基板用材料之性能。另外,芳香族聚合物 . 以外之光學構件用材料雖提案有聚丙烯酸系樹脂、環氧系 樹脂或矽系樹脂,但任一種均無法滿足光學構件所要求之 上述特性。聚丙烯酸系樹脂或環氧系樹脂雖透明性、光學 特性優異,但有耐熱性低之問題。尤其近幾年來,隨著發 光二極體、太陽能電池、平面顯示器等之開發,而發展高 200951178 亮度或發光裝置之短波長化,使光學構件成爲更高溫度, 更高能量。該等樹脂並無法符合該等要求。另一方面,矽 系樹脂雖耐熱性優異,但與其它構件之密著性低,有因自 基板等剝離而造成裝置之信賴度降低之情況,又,有因折 射率低而引起光取出效率低之問題。本發明係有鑑於上述 問題而開發者,目的在於提供一種耐熱性、無色透明性( 非著色性、透明性)、成形性(成形爲薄膜狀時容易、製 程負荷小)、光學特性優異、低成本之聚醯亞胺系材料, 含有該聚醯亞胺系材料之組成物,由該聚醯亞胺系材料組 成之聚醯亞胺薄膜,及該聚醯亞胺系材料及該薄膜之製造 方法。 [解決課題之手段] 本發明者爲解決上述課題而積極檢討之結果,發現藉 由由含有特定之醯基化合物與特定之芳香族亞胺基形成化 合物(二胺及/或二異氰酸酯)獲得之聚醯胺酸及/或聚醯 亞胺之聚醯亞胺薄膜,可達成本發明之上述目的,因而完 成本發明。 亦即,本發明爲提供下列之[1]~[14]者。 [1] 一種聚醯亞胺系材料,其特徵爲由使下列反應獲 得之聚醯胺酸及/或聚醯亞胺所組成: (A)選自由以下述式(1)表示之2,3,5-三羧基環戊 基乙酸、以下述式(2)表示之2,3,5-三羧基環戊基乙酸 二酐,及該等之反應性衍生物組成之群組之至少一種醯基 -8 - 200951178 化合物’與(B)以下述式(3)表示之芳香族亞胺基形成 化合物, [化1]200951178 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a polyimide-based material, a polyimide film, and a method for producing the same. [Prior Art] In general, a wholly aromatic polyimine obtained from an aromatic tetracarboxylic dianhydride and an aromatic diamine has a molecular rigidity, a molecular resonance stability, a strong chemical bond, and the like. Excellent heat resistance, mechanical properties, electrical properties, acid resistance and hydrolysis, it is widely used as a film, coating agent, molded part, and insulating material in the fields of electric, battery, automotive, and aerospace industries. On the other hand, materials used in optical members require excellent colorless transparency, easy molding (forming) properties, and optical properties in addition to excellent heat resistance and mechanical properties. In particular, the wholly aromatic polyimide film represented by Kapton (manufactured by Toray Dupont Co., Ltd.) has excellent heat resistance and the like as described above, and is suitable for use in fields such as machinery and electrical, but has high colorability or The formability is low, so there is a problem in that it is limited when used as an optical material. That is, the above film absorbs the visible light field due to the charge-transfer interaction originating from the intermolecular or intramolecular - and has a problem of coloring yellow to color to brown. Further, since the film is formed into a film shape, heat treatment at a high temperature or the like is required, and the process load is high and the moldability is low. Specifically, the polyimine which forms the above film has low solubility in an organic solvent, and it is not possible to form a film directly by using polyimide. Therefore, it is necessary to use the polyaminic acid solution of the above polyimine precursor to coat the substrate to form a film-like coating film, and then heat-treat the coating film at a high temperature of about 400 ° C. The imide of the polyamidite in the coating film is imidized to obtain a film composed of polyimine. In order to solve such problems, non-coloring property and transparency are improved, and thus various polyimides which can impart solubility to an organic solvent and improve formability can be proposed. For example, a (all aromatic) polyimine copolymer composed of a specific repetitive structure having a perfluoroalkyl group is proposed (Patent Document 1). Further, it has been proposed to be obtained from an aromatic diamine such as cyclobutane tetracarboxylic dianhydride and 1,2,4,5-cyclohexanetetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether. Polyimine (Non-Patent Document 1). The polyamidene-based fluorene is a semi-aromatic polyimine composed of an aromatic and an aliphatic dianhydride. Further, proposals have been made from a group selected from the group consisting of 1,2,4,5-cyclohexanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, and the like. A polyimine resin obtained by reacting at least one compound containing a mercapto group with an aromatic diamine represented by a specific formula (Patent Documents 2 and 3). Patent Document 1: Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2007-1999. 2007) [Problems to be Solved by the Invention] The polyimine copolymer described in Patent Document 1 is excellent in heat resistance, -6 - 200951178, and transparency or solubility in an organic solvent is improved, but The problem of low light resistance and high cost. The polyimine described in Non-Patent Document 1 is excellent in heat resistance, and is improved in transparency compared with the conventional polyimine. However, when it is used as an optical material, there is still a problem of insufficient transparency. Further, since the polyfluorene* imine has low solubility in an organic solvent, when it is formed into a film form, the polyimine acid using the precursor must be subjected to heat treatment at a high temperature (thermally imidized) and left. The problem of large process load and poor formability. Patent Publications The polyimine resins described in Documents 2 and 3 have improved transparency, but the oxidation of the diamine monomers used causes problems in the initial or temporal coloration of the film. In this regard, any of the films composed of the polyimide resin or the like described in the above documents has a problem that the non-coloring property is insufficient when used as an optical member. Further, a common problem when using polyimine as a material for an optical member is a problem of causing initial or temporal coloration of the film due to oxidation of the diamine monomer used. In this regard, the film composed of the polyimide resin or the like described in the above documents has a problem that the color is insufficient when used as an optical member. On the other hand, although the material having excellent optical properties is exemplified by polyarylate or polycarbonate, the glass transition point of these materials is 200 ° C or less, and there is a limit in heat resistance, and solder resistance cannot be expected. Charges the performance of materials used as printed circuit boards. Further, a material other than the aromatic polymer is a polyacrylic resin, an epoxy resin or a fluorene resin, but none of the above properties required for the optical member can be satisfied. The polyacrylic resin or the epoxy resin is excellent in transparency and optical properties, but has a problem of low heat resistance. In particular, in recent years, with the development of light-emitting diodes, solar cells, flat-panel displays, etc., the development of high-intensity 200951178 brightness or short-wavelength of light-emitting devices has made optical components higher in temperature and higher in energy. These resins do not meet these requirements. On the other hand, the lanthanoid resin is excellent in heat resistance, but has low adhesion to other members, and the reliability of the device is lowered due to peeling from the substrate, and the light extraction efficiency is caused by the low refractive index. Low problem. The present invention has been made in view of the above problems, and an object of the present invention is to provide heat resistance, colorless transparency (non-coloring property, transparency), moldability (easily formed when formed into a film form, and low process load), and excellent optical characteristics and low. A polyimine-based material comprising a polyimine-based material, a polyimine film composed of the poly-imine-based material, and the polyimide-based material and the film. method. [Means for Solving the Problems] The present inventors have found out that the compound (polyamine and/or diisocyanate) is formed by containing a specific mercapto compound and a specific aromatic imine group in order to solve the above problems. The polyimine film of polyaminic acid and/or polyimine can reach the above object of the invention, and thus the present invention has been completed. That is, the present invention provides the following [1] to [14]. [1] A polyimine-based material characterized by comprising a polyamic acid and/or a polyimine obtained by the following reaction: (A) is selected from the group consisting of the following formula (1): , 5-tricarboxycyclopentylacetic acid, 2,3,5-tricarboxycyclopentyl acetic acid dianhydride represented by the following formula (2), and at least one mercapto group of the group consisting of such reactive derivatives -8 - 200951178 The compound ' and (B) form an aromatic imine group represented by the following formula (3), [Chemical Formula 1]

⑴ ❹(1) ❹

(2)

(式(3 )中,X 爲-NH2 或-N = C = 0、-Krjj (3) NHSl(R25)(R26)(R27) ,丫爲選自直接鍵、-ch2-、-0-、-S-、 、LH3)2_之一基,(In the formula (3), X is -NH2 or -N = C = 0, -Krjj (3) NHSl(R25)(R26)(R27), and 丫 is selected from a direct bond, -ch2-, -0-, -S-, , LH3) 2_ one base,

Z 爲選自直接鍵、-CH2-、-Ο-、-S-、-C(CH,、 3j2~ ' >C = 0 ' -S〇2- 之一基,R1〜R16各獨立爲選自氫、烷基、 乙烯基、芳基、 鹵素之基,R25〜R27各獨立爲碳數1~15之& 机基)。 [2] 如上述[1]所述之聚醯亞胺系材μ 丹’其中上述(Β )芳香族亞胺基形成化合物爲上述式(3) +Z is selected from the group consisting of a direct bond, -CH2-, -Ο-, -S-, -C(CH,, 3j2~ ' > C = 0 ' -S〇2-, and R1 to R16 are independently selected. From the hydrogen, alkyl, vinyl, aryl, halogen group, R25 to R27 are each independently a carbon number of 1 to 15 & [2] The polyimine-based material μ dan as described in the above [1], wherein the (Β) aromatic imine group-forming compound is the above formula (3) +

;中,鍵結基X 、Υ及Ζ全部爲以對位鍵結所成之化合物。 [3] 如上述[1]或[2]所述之聚醯亞胺系材_,#巾$ 醯胺酸及/或聚醯亞胺之換算成聚苯乙烯之 里量平均分子 量爲 50,000〜500,000° 200951178 [4] 如上述[1]〜[3]任一項所述之聚醯亞胺系材料,其 中聚醯胺酸及/或聚醯亞胺爲使(A)醯基化合物與(B) 芳香族亞胺基形成物之莫耳比((A)醯基化合物:(B) 芳香族亞胺基形成物)成爲1.000:0.960〜1.000:0.995之方 式反應而獲得。 [5] 如上述[1]~[4]中任一項所述之聚醯亞胺系材料, 其中聚醯胺酸及/或聚醯亞胺,係進而與由哈曼(Hammett )法則所得之取代基常數之合計σ (其中該合計σ係爲以 胺基作爲基準,不含胺基本身之取代基常數者)爲超過_ 0.11、2.0以下之範圍內之芳香族二胺化合物作爲芳香族 亞胺基形成化合物反應而得。 [6] —種聚醯亞胺系樹脂組成物,其特徵爲含有上述 [1]〜[5]中任一項所述之聚醯亞胺系材料及有機溶劑。 [7] —種聚醯亞胺薄膜,其特徵爲含有上述[1]~[5]之 任一項所述之聚醯亞胺系材料。 [8] 如上述[7]所述之聚醯亞胺薄膜,其係用於光學構 件。 [9] 如上述[7]所述之聚醯亞胺薄膜,其係用於印刷電 路用基板。 [10] —種聚醯亞胺系材料之製造方法,其特徵爲包 含下列步驟:使(Α)選自由以下述式(1)表示之2,3,5-三羧基環戊基乙酸、以下述式(2)表示之2,3,5-三羧基 環戊基乙酸二酐、及該等之反應性衍生物組成之群組之至 少一種醯基化合物,與 -10- 200951178 (B)以下述式(3)表示之芳香族亞胺基形成化合物 在有機溶劑中反應,獲得聚醯胺酸之步驟,及使該聚 醯胺酸之至少一部份醯亞胺化之步驟, [化1]In the middle, the bonding groups X, Υ and Ζ are all compounds formed by para-bonding. [3] The polyethylenimine series material according to the above [1] or [2], the amount of the phthalic acid and/or the polyimine is converted into a polystyrene having an average molecular weight of 50,000 〜 The polyimide-based material according to any one of the above-mentioned items [1] to [3] wherein the poly (a) thiol compound and (or) a fluorenyl compound are B) The molar ratio of the aromatic imine group former ((A) mercapto compound: (B) aromatic imine group former) is obtained by a reaction of 1.000:0.960 to 1.000:0.995. [5] The polyimide-based material according to any one of the above-mentioned [1] to [4] wherein polylysine and/or polyimine are further obtained by Hammett's law The total σ of the substituent constants (wherein the total σ is based on the amine group, and the substituent constant of the amine-free body is not included) is an aromatic diamine compound in an amount of more than _ 0.11 and 2.0 or less as an aromatic The imine group forming compound is obtained by reacting. [6] A polyimine-based resin composition according to any one of the above [1] to [5], wherein the polyimine-based material and the organic solvent are contained. [7] A polyimine-based film according to any one of the above [1] to [5]. [8] The polyimide film according to the above [7], which is used for an optical member. [9] The polyimide film according to the above [7], which is used for a substrate for a printed circuit. [10] A method for producing a polyimine-based material, comprising the step of: (Α) selected from 2,3,5-tricarboxycyclopentyl acetic acid represented by the following formula (1), The above formula (2) represents at least one mercapto compound of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, and a group of such reactive derivatives, and -10-200951178 (B) or less a step of reacting an aromatic imine group-forming compound represented by the formula (3) in an organic solvent to obtain a poly-proline, and a step of imidating at least a portion of the poly-proline ]

❹ (式(3 )中,X 爲-NH2 或-N = C = 0、-NHSi(R25)(R26)(R27) ,丫爲選自直接鍵、-ch2-、-O-、-S-、-C(CH3)2-之一基, Z 爲選自直接鍵、-CH2-、-Ο-、-S-、-C(CH3)2-、>C = 0、_s〇2_ - 之一基,rLr 16各獨立爲選自氫、烷基、乙烯基、芳基、 鹵素之基,R25〜R27各獨立爲碳數1~15之烷基)。 [11] 如上述[1〇]所述之聚醯亞胺系材料之製造方法, 其中聚醯胺酸之至少一部份係在脂環族三級單胺之存在下 予以醯亞胺化。 [12] 如上述[11]所述之聚醯亞胺系材料之製造方法, -11 - 200951178 其中上述脂環族三級單胺爲以下述式(6)表示之化合物 mi 入 h2c ch2 (〇 (6) (式(6)中,R爲碳數1〜4之烷基,X爲氧原子或硫原 子,1爲〇或1’ m及η各獨立爲0〜2之整數)。 [13] 如上述[11]或[12]所述之聚醯亞胺系材料之製造 方法’其進而使用選自由乙酸酐、丙酸酐、苯甲酸酐之任 一種酸酐、相當於該等酸酐之醯氯類、及碳二醯亞胺化合 物組成之群組之至少一種脫水劑。 [14] 一種聚醯亞胺薄膜之製造方法,其特徵爲包含 將含有上述[10] ~[ 13]中任一項所述之方法獲得之聚醯亞胺 系材料及有機溶劑之溶液塗佈在基板上形成塗膜之步驟, 及自該塗膜藉由蒸發去除而除去上述有機溶劑,獲得聚醯 亞胺薄膜之步驟。 [發明效果] 由本發明之聚醯胺酸及/或聚醯亞胺(以下亦稱爲「 聚醯亞胺等」)組成之聚醯亞胺系材料由於係爲由特定之 醯基化合物與芳香族亞胺基形成化合物獲得之聚醯胺酸及 /或聚醯亞胺所組成,因此耐熱性、透明性優異,著色( 黃化)少,且爲低成本。又,本發明中由於由上述特定成 -12- 200951178 分獲得之聚醯亞胺等對於有機溶劑具有優異之溶解性,因 此可直接溶解於有機溶劑中,形成薄膜。該情況下,將含 有上述聚醯亞胺等及有機溶劑之溶液塗佈於基板等上形成 塗膜後,使塗膜中之溶劑在蒸發程度之溫度下加熱即可, ' 由於並無於如使用含有聚醯胺酸及有機溶劑之溶液進行熱 醯亞胺化時之在超過400 °C之高溫下熱處理之必要,因此 可達成製程負荷減低。本發明之聚醯亞胺系材料及含其之 〇 聚醯亞胺薄膜可使用於發光二極體之周邊材料、太陽能電 池之周邊材料、平面顯7K器周邊材料、電子電路之周邊材 料中。具體而言,可使用作爲耐熱透明薄膜、導電性透明 薄膜等之光學構件。又,平面顯示器之周邊材料舉例爲液 晶顯示器、電漿顯示器、有機電致發光顯示器、電子紙等 之透明可撓性顯示器用基板。另外,電子電路周邊材料可 舉例爲印刷電路基板形成用材料及印刷電路用基板。具體 而言可使用於撓性印刷電路用基板、硬式印刷電路用基板 Φ 、光電子印刷電路用基板、COF (覆晶膜)用基板、TAB (帶自動黏合)用基板等之中。 【實施方式】 本發明之聚醯亞胺系材料爲由(A)特定之醯基化合 物與(B)特定之亞胺基形成化合物獲得之聚醯胺酸及/或 聚醯亞胺構成者。首先,針對(A)成分及(B)成分加以 說明。[(A)成分](A)成分爲選自由以下述式(1)表 示之2,3,5-三羧基環戊基乙酸、以下述式(2)表示之 -13- 200951178 2,3,5·三羧基環戊基乙酸二奸’及該等之反應性衍生物組 成之群組之至少一種酶基化合物。經由使用該等醯基化合 物可獲得對有機溶劑之可溶性優異之聚酿亞胺等’而且可 獲得耐熱性高、著色少之薄膜。 [化4]❹ (In the formula (3), X is -NH2 or -N = C = 0, -NHSi(R25)(R26)(R27), and 丫 is selected from a direct bond, -ch2-, -O-, -S- And one of -C(CH3)2-, Z is selected from the group consisting of a direct bond, -CH2-, -Ο-, -S-, -C(CH3)2-, >C = 0, _s〇2_- a group, rLr 16 is independently selected from the group consisting of hydrogen, alkyl, vinyl, aryl, and halogen, and R25 to R27 are each independently an alkyl group having 1 to 15 carbon atoms. [11] The method for producing a polyimide-based material according to the above [1], wherein at least a part of the polyamic acid is ruthenium imidized in the presence of an alicyclic tertiary monoamine. [12] The method for producing a polyfluorene-based material according to the above [11], wherein the alicyclic tertiary monoamine is a compound mi represented by the following formula (6) into h2c ch2 (〇) (6) (In the formula (6), R is an alkyl group having 1 to 4 carbon atoms, X is an oxygen atom or a sulfur atom, and 1 is 〇 or 1' m and η are each independently an integer of 0 to 2). The method for producing a polyimide-based material according to the above [11] or [12], which further comprises an acid anhydride selected from the group consisting of acetic anhydride, propionic anhydride, and benzoic anhydride, and a chlorine equivalent to the acid anhydride. At least one dehydrating agent of the group consisting of: and a carbodiimide compound. [14] A method for producing a polyimide film, characterized by comprising any one of the above [10] to [13] The solution of the polyimide-based material and the organic solvent obtained by the method is coated on a substrate to form a coating film, and the organic solvent is removed by evaporation from the coating film to obtain a polyimide film. [Effect of the Invention] The polyglycine and/or polyimine (hereinafter also referred to as "polyimine, etc.") of the present invention are composed of the present invention. Since the quinone imine material is composed of a polyamic acid and/or a polyamidimide obtained by forming a compound of a specific mercapto compound and an aromatic imine group, it is excellent in heat resistance and transparency, and is colored (yellowed). In the present invention, since the polyimine obtained by the above specific -12-200951178 is excellent in solubility in an organic solvent, it can be directly dissolved in an organic solvent to form a film. In this case, a solution containing the above-mentioned polyimine or the like and an organic solvent is applied onto a substrate or the like to form a coating film, and then the solvent in the coating film is heated at a temperature of evaporation, and If heat treatment at a temperature exceeding 400 ° C is carried out by using a solution containing polyamic acid and an organic solvent, it is necessary to heat-treat at a high temperature of more than 400 ° C. Therefore, the process load can be reduced. The polyimide material of the present invention and The bismuth polyimide film can be used for the peripheral materials of the light-emitting diode, the peripheral materials of the solar cell, the peripheral material of the flat display, and the peripheral materials of the electronic circuit. Specifically, It is used as an optical member such as a heat-resistant transparent film or a conductive transparent film. The peripheral material of the flat-panel display is exemplified by a substrate for a transparent flexible display such as a liquid crystal display, a plasma display, an organic electroluminescence display, or an electronic paper. The electronic circuit peripheral material can be exemplified by a printed circuit board forming material and a printed circuit board. Specifically, it can be used for a flexible printed circuit board, a hard printed circuit board Φ, an optoelectronic printed circuit board, and COF (Crystal) The substrate for a film, the substrate for TAB (automatic bonding), and the like. [Embodiment] The polyimide-based material of the present invention is formed of (A) a specific mercapto compound and (B) a specific imine group. A compound of polyamine and/or polyimine obtained by the compound. First, the components (A) and (B) will be described. [Component (A)] The component (A) is selected from the group consisting of 2,3,5-tricarboxycyclopentyl acetic acid represented by the following formula (1), and -13, 51, 517, 178, 3, represented by the following formula (2). 5. At least one enzyme-based compound of the group consisting of tricarboxycyclopentyl acetic acid and a reactive derivative thereof. By using these thiol-based compounds, a polyacrylonitrile or the like which is excellent in solubility in an organic solvent can be obtained, and a film having high heat resistance and little coloration can be obtained. [Chemical 4]

(1) [化5](1) [Chemical 5]

(2) 至於上述反應性衍生物舉例爲2,3,5·三竣基環戊基乙 酸單甲酯、2,3,5-三羧基環戊基乙酸二甲酯、2,3,5-三羧基 環戊基乙酸三甲酯、2,3,5·三羧基環戊基乙酸四甲酯、 2,3,5-三羧基環戊基乙酸單乙酯、2,3,5-三羧基環戊基乙酸 二乙酯、2,3,5-三羧基環戊基乙酸三乙酯、2,3,5-三羧基環 戊基乙酸四乙酯,或上述之烷酯被置換成未取代之苯酯或 各種對位取代之苯酯之酯化物等。其他之反應性衍生物舉 例爲2,3,5·三羧基環戊基乙酸四氯、2,3,5-三羧基環戊基 乙酸二氯二酯(酯之醇或苯酚成分與上述相同)等之醯氯 。至於(Α)成分以使用2,3,5-三羧基環戊基乙酸二酐較 佳。使用爲酸酐之2,3,5-三羧基環戊基乙酸二酐作爲(Α )成分時,與未使用酸酐者相比較,可在低溫下合成聚醯 胺酸。而且,該等醯基化合物可單獨使用或兩種以上混合 使用。 -14- 200951178 [(B)成分](B)成分爲含有以下述式(3)表示之 芳香族亞胺基形成化合物作爲(B-1)成分。 [化6] R1 R2 R3 R4 R5 R6 R7 R8(2) The above reactive derivatives are exemplified by 2,3,5-trimethylcyclopentyl acetic acid monomethyl ester, 2,3,5-tricarboxycyclopentyl acetic acid dimethyl ester, 2,3,5- Trimethyl tricarboxycyclopentyl acetic acid, tetramethyl 2,3,5-tricarboxycyclopentylacetate, monoethyl 2,3,5-tricarboxycyclopentyl acetate, 2,3,5-tricarboxyl Diethyl cyclopentyl acetate, triethyl 2,3,5-tricarboxycyclopentyl acetate, tetraethyl 2,3,5-tricarboxycyclopentylacetate, or the above alkyl ester is replaced by unsubstituted a phenyl ester or an esterified product of various para-substituted phenyl esters. Other reactive derivatives are exemplified by 2,3,5-tricarboxycyclopentyl acetic acid tetrachloro, 2,3,5-tricarboxycyclopentyl acetic acid dichlorodiester (the ester alcohol or phenol component is the same as above) Wait for chlorine. As for the (Α) component, it is preferred to use 2,3,5-tricarboxycyclopentyl acetic acid dianhydride. When 2,3,5-tricarboxycyclopentyl acetic acid dianhydride which is an acid anhydride is used as the (Α) component, the polyamine acid can be synthesized at a low temperature as compared with the case where no acid anhydride is used. Further, these mercapto compounds may be used singly or in combination of two or more. -14-200951178 [Component (B)] The component (B) contains an aromatic imine group-forming compound represented by the following formula (3) as the component (B-1). [Chemical 6] R1 R2 R3 R4 R5 R6 R7 R8

(式(3)中,X 爲-NH2 或-N = C = 0、-NHSi(R25)(R26)(R27) φ ,Υ 爲選自直接鍵(單鍵)、-ch2-、-〇-、-s-、-c(ch3)2-之一基 ’ z 爲選自直接鍵、-ch2-、-〇-、-s-、-c(ch3)2-、 >C = 0、-S02-之一基,R1〜R16各獨立爲選自氫原子、烷基 、乙烯基、芳基、鹵素之基,R25〜R27各獨立爲碳數1~15 之烷基)。藉由使用以該等特定之式表示之具有4個苯環 之芳香族亞胺形成化合物,可獲得著色少之薄膜。其中, 所謂[亞胺基形成化合物]係指用以與(A)成分反應形成 亞胺基之之化合物。 φ 上述芳香族亞胺基形成化合物舉例爲雙[4- ( 3-胺基苯 氧基)苯基]碾、雙[4- ( 4-胺基苯氧基)苯基]楓、雙[4-( 3-胺基苯氧基)苯基]酮、雙[4- (4-胺基苯氧基)苯基]酮 . 、4,4’-雙(3-胺基苯氧基)聯苯、4,4,-雙(4-胺基苯氧基 )聯苯、雙[4_(3-胺基苯氧基)苯基]丙烷、雙[4_(4·胺 基苯氧基)苯基]丙烷、雙[4- (3-胺基苯氧基)苯基]醚、 雙[4- ( 4-胺基苯氧基)苯基]醚、2,2-雙[4- ( 3-胺基·α,α- 二甲基苄基)苯基]丙烷、2,2-雙[4-(4-胺基-α,α-二甲基 苄基)苯基]丙烷、2,2-雙[4-(3-異氰酸酯基二甲基 -15- 200951178 苄基)苯基]丙烷、2,2-雙[4- (4-異氰酸酯基-α,α-二甲基 苄基)苯基]丙烷、2,2-雙[4-(3·三甲基矽烷基胺基-α,α-二甲基苄基)苯基]丙烷、2,2·雙[4- (4-三甲基矽烷基胺 基-α,α-二甲基苄基)苯基]丙烷等。該等中,較好使用雙 [4-(3-胺基苯氧基)苯基]颯、雙[4-(4-胺基苯氧基)苯 基]颯、4,4’-雙(3-胺基苯氧基)聯苯、4,4’-雙(4-胺基 苯氧基)聯苯、雙[4-(3-胺基苯氧基)苯基]丙烷、2,2-雙 [4- (4-胺基苯氧基)苯基]丙烷、2,2-雙[4-(3-胺基-α,α-二甲基苄基)苯基]丙烷、2,2-雙[4-(4-胺基-α,α-二甲基 苄基)苯基]丙烷。 另外,(Β-1)成分較好爲上述式(3)中以X、Υ及 Ζ表示之鍵結基爲以對位鍵結所成之芳香族亞胺基形成化 合物,亦即以下述式(4)表示之芳香族亞胺基形成化合 物。藉由使用該等化合物,可獲得耐熱性更高且著色少之 薄膜。上述之芳香族亞胺基形成化合物中,更好使用雙[4-(4-胺基苯氧基)苯基]碾、4,4’-雙(4-胺基苯氧基)聯苯 、2,2-雙[4- ( 4-胺基苯氧基)苯基]丙烷、2,2-雙[4- ( 4-胺 基-α,α-二甲基苄基)苯基]丙烷。 [化7] R1 R2 R3 R4 R5 R6 R7 R8(In the formula (3), X is -NH2 or -N = C = 0, -NHSi(R25)(R26)(R27) φ , Υ is selected from a direct bond (single bond), -ch2-, -〇- , -s-, -c(ch3)2- one base 'z is selected from a direct bond, -ch2-, -〇-, -s-, -c(ch3)2-, >C = 0, - One of S02-, R1 to R16 are each independently selected from the group consisting of a hydrogen atom, an alkyl group, a vinyl group, an aryl group, and a halogen group, and each of R25 to R27 is independently an alkyl group having 1 to 15 carbon atoms. By forming a compound using an aromatic imine having four benzene rings represented by the above specific formula, a film having little coloration can be obtained. Here, the term "imine forming compound" means a compound which is reacted with the component (A) to form an imine group. φ The above aromatic imine group-forming compound is exemplified by bis[4-(3-aminophenoxy)phenyl]millate, bis[4-(4-aminophenoxy)phenyl] maple, bis[4] -(3-Aminophenoxy)phenyl]one, bis[4-(4-aminophenoxy)phenyl]one, 4,4'-bis(3-aminophenoxy) Benzene, 4,4,-bis(4-aminophenoxy)biphenyl, bis[4_(3-aminophenoxy)phenyl]propane, bis[4_(4.aminophenoxy)benzene Propane, bis[4-(3-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ether, 2,2-bis[4-(3 -amino-α,α-dimethylbenzyl)phenyl]propane, 2,2-bis[4-(4-amino-α,α-dimethylbenzyl)phenyl]propane, 2, 2-bis[4-(3-Isocyanate dimethyl-15- 200951178 benzyl)phenyl]propane, 2,2-bis[4-(4-isocyanate-α,α-dimethylbenzyl) Phenyl]propane, 2,2-bis[4-(3·trimethyldecylalkylamino-α,α-dimethylbenzyl)phenyl]propane, 2,2·bis[4- (4- Trimethyldecylamino-α,α-dimethylbenzyl)phenyl]propane, and the like. Among these, it is preferred to use bis[4-(3-aminophenoxy)phenyl]anthracene, bis[4-(4-aminophenoxy)phenyl]anthracene, 4,4'-bis ( 3-aminophenoxy)biphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, bis[4-(3-aminophenoxy)phenyl]propane, 2,2 - bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-amino-α,α-dimethylbenzyl)phenyl]propane, 2, 2-bis[4-(4-amino-α,α-dimethylbenzyl)phenyl]propane. Further, the (Β-1) component is preferably a compound in which the bond group represented by X, Υ and Ζ in the above formula (3) is an aromatic imine group formed by para-bonding, that is, a formula The aromatic imine group forming compound represented by (4). By using these compounds, a film having higher heat resistance and less coloration can be obtained. Among the above aromatic imine group-forming compounds, bis[4-(4-aminophenoxy)phenyl]millate, 4,4'-bis(4-aminophenoxy)biphenyl, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-amino-α,α-dimethylbenzyl)phenyl]propane . [Chemical 7] R1 R2 R3 R4 R5 R6 R7 R8

(式(4)中,R1〜R16、X、Y及Ζ係與上述式(3)中相 同)。 -16- 200951178 另外’該等亞胺形成化合物可單獨使用一種或組合兩 種以上使用。 本發明之聚醯亞胺系材料除以上述式(3)表示之化 合物((B-1)成分)作爲芳香族亞胺基形成化合物以外 ' ’亦可使用由哈曼(Hammett )法則所得之取代基常數之 合計σ (其中該合計σ係爲以胺基作爲基準,不含胺基本 身之取代基常數者)爲超過- 0.11、2.0以下之範圍內之芳 ® 香族二胺化合物((Β-2 )成分)。該芳香族二胺化合物 較好爲σ超過-0.11,且在1.6以下之範圍內之芳香族二胺 化合物’更好爲σ超過-〇_11且在〇.8以下之範圍內之芳 香族二胺化合物。 該情況下,係使用由哈曼法則所得之取代基常數之合 計σ (其中該合計σ係爲以胺基作爲基準,不含胺基本身 之取代基常數者)爲- 0.70以上、-0.11以下之範圍內之芳 香族二胺化合物作爲(Β-1)成分。 © ( Β-1)成分與和(Β·2)成分之上述合計σ之差較好 爲0.1以上,更好爲0.2以上。(Β-2)成分之適當例舉例 爲以下述式(5)表示之芳香族二胺化合物。 - [化 8](In the formula (4), R1 to R16, X, Y and an anthracene are the same as those in the above formula (3). Further, the imine forming compounds may be used alone or in combination of two or more. The polyimine-based material of the present invention may be obtained by a Hammert's rule, in addition to the compound ((B-1) component) represented by the above formula (3) as an aromatic imine group-forming compound. The total σ of the substituent constants (wherein the total σ is based on the amine group, and the substituent constant of the amine-free body is not included) is an aromatic aryl diamine compound in the range of -0.11 or less (( Β-2) Ingredients). The aromatic diamine compound preferably has an sigma of more than -0.11, and the aromatic diamine compound in the range of 1.6 or less is more preferably an aromatic two having a σ exceeding -〇_11 and being in the range of 〇.8 or less. Amine compound. In this case, the total σ of the substituent constants obtained by the Haman rule (wherein the total σ is based on the amine group and the substituent constant of the amine-free body is not included) is -0.70 or more and -0.11 or less. The aromatic diamine compound within the range is as the (Β-1) component. The difference between the total σ of the ( Β-1) component and the (Β·2) component is preferably 0.1 or more, more preferably 0.2 or more. A suitable example of the component (Β-2) is an aromatic diamine compound represented by the following formula (5). - [Chem. 8]

(式(5 )中’ X爲_Νη2 , γ爲選自直接鍵、>C = 0、-S02-、-C(CF3)2-之一基,Rl7〜R24各獨立爲選自氫原子、烷基 、氟化烷基、烷氧基、乙烯基、芳基、鹵素之基)。 -17- 200951178 (B-2)成分較佳之例舉例爲例如選自由2,2’-雙(三 氟甲基)聯苯胺、2,2’·二甲氧基聯苯胺、2,2’-二甲基聯苯 胺、3,3’-二胺基二苯基楓、4,4’-二胺基二苯基碾、3,3’-二胺基二苯甲酮、4,4,-二胺基二苯甲酮及1,1,3,3,3-六氟 異亞丙基聯苯胺組成之群組之至少一種芳香族二胺化合物 。最佳之例舉例爲例如2,2’-雙(三氟甲基)聯苯胺、 2,2,-二甲基聯苯胺、3,3’ -二胺基二苯基楓、4,4’ -二胺基 二苯基颯。(B-2)成分可單獨使用一種,或兩種以上混 合使用。 接著,就本發明之聚醯亞胺之製造方法加以說明。本 發明之聚醯亞胺系材料之製造方法包含下列步驟:(a) 使上述(A)醯基化合物與上述(B)芳香族亞胺形成化合 物在有機溶劑中反應,獲得聚醯胺酸之步驟’及(b)使 該聚醯胺酸之至少一部份醯亞胺化之步驟。 [步驟(a)]步驟(a)爲使上述(A)成分與上述(B )成分在有機溶劑中反應獲得聚醯胺酸之步驟。使(A) 成分與(B)成分反應時之具體方法爲使至少一種(B)芳 香族亞胺基形成化合物溶解於有機溶劑中後’於所得溶液 中添加至少一種(A)醯基化合物’且在0~100°C之溫度下 攪拌1〜6 0小時之方法。上述有機溶劑舉例爲例如N-甲基-2-吡咯啶酮、N,N-二甲基乙醯胺、N,N-二甲基甲醯胺、二 甲基亞楓、丁內酯、N,N’-二甲基咪唑啉酮、四甲基尿素 等非質子系極性溶劑;甲酚、二甲酚、鹵化苯酚等酚系溶 劑等。其中,以N-甲基-2-耻咯啶酮、N,N-二甲基乙醯胺 -18- 200951178 較佳。該等溶劑可單獨使用一種或兩種以上混合使用。另 外,反應液中之芳香族亞胺基形成化合物與醯基化合物之 合計量較好爲反應液總量之5〜30質量%。( A )醯基化合 物與(B)芳香族亞胺基形成化合物之比例較好爲每當量 ' 成分(B)之亞胺基或異氰酸酯基,成分(A)之酸酐成爲 0.8〜1.2當量之比例,更好爲1.0〜1 .1當量之比例。更具體 而言,可藉由使(A)醯基化合物與(B)芳香族亞胺基形 〇 成化合物之莫耳比成爲1.000:0.960〜1.000:0.995之方式予 以反應,較好成爲1.000-0.970〜1.000 :0.990之方式反應。 當(A)醯基化合物與(B)芳香族亞胺基形成化合物之莫 耳比在上述範圍內時,生成之聚合物之成膜性、力學特性 、透明性特別的優異。當使用(B-1)成分與(B-2)成分 作爲(B)芳香族亞胺基形成化合物時,(B-1)成分與( B-2)成分之莫耳比較好調配成(B-1) / ( B-2) >1。( B-1) :(B-2)之莫耳比以合計爲1時,較好爲0·60:0·40〜0.999:0.001 〇 ,更好爲 0·62:0·38~0·99:0.01,最好爲 0.65:0.35~0.96:0.〇4 。相對於(Β-1 )成分與(Β-2 )成分之合計1莫耳,(Β_ 2)成分之量在上述範圍內時,生成薄膜之成膜性、力學 - 特性、透明性特別優異。另外,聚醯胺酸係指使酸酐基與 胺基反應產生之具有含有-CO-NH-及-CO-OH之構造之酸 ,或者,其衍生物(具體而言爲例如具有含有CO-NH-及-CO-OR (其中,R爲烷基等)之構造者)。聚醯胺酸係藉 由加熱使-CO-NH-之Η與-CO-OH之ΟΗ脫水,成爲具有環 狀化學構造(-CO-N-CO-)之聚醯亞胺。 -19- 200951178(In the formula (5), 'X is _Νη2, γ is selected from a direct bond, > C = 0, -S02-, -C(CF3)2-, and each of Rl7 to R24 is independently selected from a hydrogen atom. , alkyl, fluorinated alkyl, alkoxy, vinyl, aryl, halogen based). Preferred examples of the component of -17-200951178 (B-2) are, for example, selected from the group consisting of 2,2'-bis(trifluoromethyl)benzidine, 2,2'-dimethoxybenzidine, 2,2'- Dimethylbenzidine, 3,3'-diaminodiphenyl maple, 4,4'-diaminodiphenyl milling, 3,3'-diaminobenzophenone, 4,4,- At least one aromatic diamine compound of the group consisting of diaminobenzophenone and 1,1,3,3,3-hexafluoroisopropylidenebenilidine. The most preferred examples are, for example, 2,2'-bis(trifluoromethyl)benzidine, 2,2,-dimethylbenzidine, 3,3'-diaminodiphenyl maple, 4,4' - Diaminodiphenylphosphonium. The component (B-2) may be used singly or in combination of two or more. Next, a method for producing the polyimine of the present invention will be described. The method for producing a polyimine-based material of the present invention comprises the steps of: (a) reacting the above (A) mercapto compound with the above (B) aromatic imine forming compound in an organic solvent to obtain a polylysine Steps ' and (b) the step of imidizing at least a portion of the polyamic acid. [Step (a)] The step (a) is a step of reacting the above component (A) with the above component (B) in an organic solvent to obtain a poly-proline. The specific method for reacting the component (A) with the component (B) is to add at least one (A) mercapto compound to the resulting solution after dissolving at least one (B) aromatic imine group-forming compound in an organic solvent. And stirring at a temperature of 0 to 100 ° C for 1 to 60 hours. The above organic solvent is exemplified by, for example, N-methyl-2-pyrrolidone, N,N-dimethylacetamide, N,N-dimethylformamide, dimethyl sulfoxide, butyrolactone, N. An aprotic polar solvent such as N'-dimethylimidazolidinone or tetramethylurea; a phenolic solvent such as cresol, xylenol or halogenated phenol. Among them, N-methyl-2-azolopropanone and N,N-dimethylacetamide -18-200951178 are preferred. These solvents may be used alone or in combination of two or more. Further, the total amount of the aromatic imine group-forming compound and the mercapto compound in the reaction liquid is preferably from 5 to 30% by mass based on the total amount of the reaction liquid. The ratio of the (A) mercapto compound to the (B) aromatic imine group-forming compound is preferably an imine group or an isocyanate group per equivalent of the component (B), and the acid anhydride of the component (A) is in a ratio of 0.8 to 1.2 equivalents. More preferably, it is a ratio of 1.0 to 1.1 equivalents. More specifically, it can be reacted by making the molar ratio of the (A) mercapto compound and the (B) aromatic imine-based chelate compound 1.000:0.960 to 1.000:0.995, preferably 1.000- 0.970~1.000: 0.990 way of reaction. When the molar ratio of the (A) mercapto compound to the (B) aromatic imine group-forming compound is within the above range, the resulting polymer is particularly excellent in film formability, mechanical properties, and transparency. When the (B-1) component and the (B-2) component are used as the (B) aromatic imine group-forming compound, the (B-1) component and the (B-2) component are preferably blended into (B). -1) / ( B-2) >1. (B-1) : When the molar ratio of (B-2) is 1, the value is preferably 0.60:0·40 to 0.999:0.001 〇, more preferably 0·62:0·38~0· 99:0.01, preferably 0.65:0.35~0.96:0.〇4. When the amount of the (Β-1) component and the (Β-2) component are in the above range, the film formation property, the mechanical properties, and the transparency of the film are particularly excellent. Further, polylysine refers to an acid having a structure containing -CO-NH- and -CO-OH which is produced by reacting an acid anhydride group with an amine group, or a derivative thereof (specifically, for example, having CO-NH-containing) And -CO-OR (where R is an alkyl group, etc.). Polylysine is dehydrated from -CO-NH- and -CO-OH by heating to form a polyimine having a cyclic chemical structure (-CO-N-CO-). -19- 200951178

驟 步 - I 驟 步 述 上 以 使 係 b /IV 驟 步 TJ \ly 聚 之 得 獲 醯胺酸之至少一部份經脫水閉環而醯亞胺化,獲得含有聚 醯亞胺與有機溶劑之溶液之步驟。具體之醯亞胺化之方法 爲使用脫水劑之方法(化學醯亞胺化),或在 160°C〜350°C (於溶液爲160〜220°C左右,於澆鑄薄膜一般 爲3 00°C以上)下經熱處理之方法(熱醯亞胺化)。化學 醯亞胺化中之脫水劑舉例爲乙酸酐、丙酸酐、苯甲酸酐等 酸酐,或者相對應之醯氯類,二環己基碳二醯亞胺等碳二 醯亞胺化合物等。脫水劑之添加量可依據目標之醯亞胺化 率適當變化,但通常相對於1莫耳之醯基化合物,爲1~10 莫耳之範圍,且以2〜10莫耳之範圍較佳。 另外,化學醯亞胺化可在l〇°C~120°C之溫度下進行, 且以在25°C~90°C之溫度下進行較佳。當溫度超過120°C時 ,有無法抑制著色之情況,當溫度低於l〇°C時,反應速度 低,會有醯胺化之時間長之問題。 熱醯胺化時,較好一邊進行將脫水反應產生之水去除 於系統外。此時,可使用苯、甲苯、二甲苯等共沸去除水 〇 醯亞胺化之方法就可在更低溫下加熱進行醯亞胺化而 言以化學醯亞胺化較佳。 另外,醯亞胺化時可依據需要使用吡啶、異喹啉、三 甲胺、三乙胺、N,N-二甲基胺基吡啶、咪唑、脂環族三級 單胺等鹼性觸媒。該等中,以脂環族三級單胺較適用。於 醯亞胺化時若使用脂環族三級單胺化合物則可促進醯亞胺 -20- 200951178 化反應,被認爲是脂環族三級單胺所具有之氮原子上之孤 立電子對具有高的親核性使然。 上述脂環族三級單胺較好使用以下述式(6)表示之 化合物。 [化6]Step-I step by step so that at least a part of the proline acid obtained by the system b / IV stepping TJ \ly is subjected to dehydration ring closure and imidization to obtain a polyimine and an organic solvent. The step of the solution. Specifically, the method of imidization is a method using a dehydrating agent (chemical imidization), or at 160 ° C to 350 ° C (in the solution of about 160 to 220 ° C, the casting film is generally 300 ° ° C or higher) The method of heat treatment (thermal imidization). The dehydrating agent in the chemical imidization is exemplified by an acid anhydride such as acetic anhydride, propionic anhydride or benzoic anhydride, or a corresponding carbodiimide compound such as ruthenium chloride or dicyclohexylcarbodiimide. The amount of the dehydrating agent to be added may be appropriately changed depending on the target imidization ratio, but it is usually in the range of 1 to 10 moles per 1 mole of the mercapto compound, and is preferably in the range of 2 to 10 moles. Further, the chemical imidization can be carried out at a temperature of from 10 ° C to 120 ° C, and preferably at a temperature of from 25 ° C to 90 ° C. When the temperature exceeds 120 ° C, the coloring cannot be suppressed. When the temperature is lower than 10 ° C, the reaction rate is low, and there is a problem that the length of the amidation is long. In the case of thermal amide amination, it is preferred to remove water generated by the dehydration reaction from the outside of the system. In this case, it is preferred to use a method such as azeotropic removal of water, hydrazine, xylene or the like to azeotropically remove the hydrazine imidization at a lower temperature, and it is preferred to carry out the hydrazine imidization. Further, an alkaline catalyst such as pyridine, isoquinoline, trimethylamine, triethylamine, N,N-dimethylaminopyridine, imidazole or alicyclic tertiary monoamine may be used as needed in the imidization. Among these, alicyclic tertiary monoamines are more suitable. The use of an alicyclic tertiary monoamine compound in the imidization of ruthenium promotes the quinone imine-20-200951178 reaction, which is considered to be an isolated electron pair on the nitrogen atom of the alicyclic tertiary monoamine. With high nucleophilicity. As the above alicyclic tertiary monoamine, a compound represented by the following formula (6) is preferably used. [Chemical 6]

⑹ (通式(6)中,R爲碳數1〜4之烷基,X爲氧原子或硫 原子,1爲〇或l,m及η各獨立爲0〜20之整數)。 式(6)中,R較好爲甲基或乙基,最好爲甲基。又 ,m、η較好爲0或1。再者,m + n較好爲1〜3)。 以上述式(6)表示之化合物之較佳實例舉例爲N-甲 基哌啶、N-甲基吡咯啶、N-甲基嗎啉等。 藉由使用脂環族三級單胺作爲醯亞胺化觸媒,即使使 用脂肪族化合物作爲(A )成分,亦可以高的反應性(醯 亞胺化反應速度)進行醯亞胺化,且可達到在較低溫下之 醯亞胺化或縮短醯亞胺化所需之時間。因而,結果爲可減 低所得聚醯亞胺之著色。又,當使用具有六員環酸酐骨架 之化合物,或構成橋接環構造之至少兩個碳爲形成酸酐骨 架之化合物,尤其是易進行醯胺化之化合物作爲成分(A )時,即使在低溫下亦可達到過去所無法達成之高醯亞胺 化率。 上述鹼觸媒相對於1莫耳醯基化合物較好分別在 -21 - 200951178 0.01〜10莫耳之範圍內使用,最好在〇·1~5莫耳之範圍內 使用。又,醯亞胺化爲使聚醯胺酸之至少一部份,較好75 莫耳%以上’更好85莫耳%以上,最好90莫耳%以上進行 醯亞胺化。所得之含有聚醯胺酸及/或聚醯亞胺與有機溶 劑之溶液可直接使用,或亦可將聚醯亞胺等單離出固體成 分後,再溶解於有機溶劑中使用。而且,再溶解之有機溶 劑舉例爲與上述有機溶劑相同者。使聚醯亞胺等單離之方 法爲將含有聚醯亞胺等及有機溶劑之溶液倒入甲醇等之對 於聚醯亞胺爲弱溶劑中使聚醯亞胺等沉澱,經過濾.洗淨 •乾燥等使聚醯亞胺等分離成固體成分之方法。藉由該等 操作,亦可實現去除醯亞胺化過程中使用之脫水觸媒(醯 亞胺化觸媒)。 所得聚醯胺酸及/或聚醯亞胺換算成聚苯乙烯之重量 平均分子量爲 50,000〜500,000,較好爲100,〇〇〇〜400,〇〇〇 。本發明中以聚醯胺酸及聚醯亞胺之合計爲100莫耳%中 ,聚醯亞胺之比例爲75莫耳%以上,較好爲85莫耳%以 上,最好爲90莫耳%以上。當聚醯亞胺之比例未達75莫 耳%時,薄膜之吸水率變高,有耐久性降低之問題》 以下就本發明薄膜製造方法加以說明。本發明之薄膜 製造方法爲包含將含有使上述(Α)醯基化合物與上述(Β )芳香族亞胺基形成化合物反應獲得之聚醯胺酸及/或聚 醯亞胺及有機溶劑之溶液塗佈於基板上形成塗膜之步驟( c),及使上述有機溶劑自該塗膜蒸發去除獲得薄膜之步 驟(d)者。[步驟(c)]步驟(c)爲將含有上述聚醯亞胺 -22- 200951178 等及有機溶劑之溶液塗佈於基板上形成塗膜之步驟。上述 基板舉例爲聚對苯二甲酸乙二酯(PET)薄膜、SUS板、 銅箔等。將含有聚醯亞胺等及有機溶劑之溶液塗佈於基板 上之方法可使用輥塗法、凹版塗佈法、旋轉塗佈法、使用 ' 刮板之方法等。塗膜之厚度並無特別限制,可爲例如 1 〜2 5 0 μπι 0 [步驟(d)]步驟(d)爲使上述有機溶劑自上述塗膜 © 蒸發去除獲得薄膜之步驟。具體而言,係藉由將塗膜加熱 ,使該塗膜中之有機溶劑蒸發去除。上述加熱條件只要可 使有機溶劑蒸發則無特別限制,可爲例如在60〜25 0°C下 1~5小時。另外,加熱亦可以兩階段進行。例如,在 l〇〇°C下加熱30分鐘後,在150°C下加熱1小時等。又, 亦可依據需要在氮氣氛圍氣體下,或在減壓下進行乾燥。 本步驟中,若可去除有機溶劑,則無進行醯亞胺化之必要 ,因此可在相較於以往技術更低溫下獲得薄膜。因此,即 〇 使形成光學構件之其他構件爲耐熱性低者,亦可在該構件 上直接塗佈含上述聚醯亞胺等及有機溶劑之溶液,藉由蒸 發去除有機溶劑形成薄膜。所得薄膜自支撐基板剝離,或 - 可未經剝離而就此使用。 . 本發明之薄膜係以使上述(A)成分與(B)成分反應 獲得之聚醯亞胺等作爲主體。其中,使成分(A)與成分 (B )反應而成之聚醯胺酸爲例如具有以下述式(7 )〜式 (10)表示之重複單位之至少一個者。 -23- (7) 200951178 [化 16](6) (In the formula (6), R is an alkyl group having 1 to 4 carbon atoms, X is an oxygen atom or a sulfur atom, 1 is ruthenium or 1, and m and η are each independently an integer of 0 to 20). In the formula (6), R is preferably a methyl group or an ethyl group, and is preferably a methyl group. Further, m and η are preferably 0 or 1. Further, m + n is preferably from 1 to 3). Preferred examples of the compound represented by the above formula (6) are N-methylpiperidine, N-methylpyrrolidine, N-methylmorpholine and the like. By using an alicyclic tertiary monoamine as the ruthenium amide catalyst, even if an aliphatic compound is used as the component (A), ruthenium imidization can be carried out with high reactivity (醯 imidization reaction rate), and The time required for the imidization or shortening of the imidization at lower temperatures can be achieved. Thus, as a result, the coloration of the obtained polyimine can be reduced. Further, when a compound having a six-membered cyclic acid anhydride skeleton or at least two carbons constituting a bridged ring structure is used as a compound forming an acid anhydride skeleton, particularly a compound which is easily subjected to amide amination as a component (A), even at a low temperature It can also achieve the high imidization rate that could not be achieved in the past. The above base catalyst is preferably used in the range of -21 - 200951178 0.01 to 10 moles per mole of the 1 molar base compound, and is preferably used in the range of 〇·1 to 5 moles. Further, the ruthenium is imidized to at least a part of the polyamic acid, preferably 75 mol% or more, more preferably 85 mol% or more, and most preferably 90 mol% or more. The obtained solution containing polylysine and/or polyimine and an organic solvent may be used as it is, or may be obtained by separately separating the solid component such as polyimine and then dissolving it in an organic solvent. Further, the redissolved organic solvent is exemplified by the same as the above organic solvent. The method of separating the polyimine or the like is to pour a solution containing a polyimine or the like and an organic solvent into methanol or the like. The polyimine is precipitated in a weak solvent, and the polyimine or the like is precipitated and filtered. • A method of separating a polyimine or the like into a solid component, such as drying. By such operations, it is also possible to remove the dehydration catalyst (醯i-imidation catalyst) used in the oxime imidization process. The obtained polyaminic acid and/or polyimine is converted to polystyrene in a weight average molecular weight of 50,000 to 500,000, preferably 100, 〇〇〇 to 400, 〇〇〇. In the present invention, the total amount of polyaminic acid and polyamidene is 100 mol%, and the ratio of polyimine is 75 mol% or more, preferably 85 mol% or more, preferably 90 mol%. %the above. When the ratio of the polyimide to less than 75 mol%, the water absorption rate of the film becomes high and the durability is lowered. Hereinafter, the film production method of the present invention will be described. The method for producing a film of the present invention comprises applying a solution containing a polyamic acid and/or a polyamidimide obtained by reacting the above (indenyl)-based compound with the above-mentioned (indenyl) aromatic imine-forming compound and an organic solvent. The step (c) of forming a coating film on the substrate, and the step (d) of removing the organic solvent from the coating film to obtain a film. [Step (c)] The step (c) is a step of applying a solution containing the above polyimine -22-200951178 or the like and an organic solvent to a substrate to form a coating film. The above substrate is exemplified by a polyethylene terephthalate (PET) film, a SUS plate, a copper foil or the like. A method of applying a solution containing a polyimine or the like and an organic solvent to a substrate can be carried out by a roll coating method, a gravure coating method, a spin coating method, a method using a "squeegee", or the like. The thickness of the coating film is not particularly limited and may be, for example, 1 to 2 50 μm 0 [Step (d)] The step (d) is a step of removing the organic solvent from the coating film by evaporation to obtain a film. Specifically, the organic solvent in the coating film is removed by evaporation by heating the coating film. The heating conditions are not particularly limited as long as the organic solvent can be evaporated, and may be, for example, 1 to 5 hours at 60 to 25 °C. In addition, heating can also be carried out in two stages. For example, after heating at 100 ° C for 30 minutes, heating at 150 ° C for 1 hour or the like. Further, it may be dried under a nitrogen atmosphere or under reduced pressure as needed. In this step, if the organic solvent can be removed, it is not necessary to carry out the ruthenium imidization, so that the film can be obtained at a lower temperature than the prior art. Therefore, even if the other member forming the optical member has low heat resistance, a solution containing the above-mentioned polyimine or the like and an organic solvent may be directly applied to the member, and the organic solvent may be removed by evaporation to form a film. The resulting film is peeled off from the support substrate, or - it can be used without being peeled off. The film of the present invention is mainly composed of a polyimine obtained by reacting the above component (A) with component (B). In particular, the polyamic acid obtained by reacting the component (A) with the component (B) is, for example, at least one of repeating units represented by the following formulas (7) to (10). -23- (7) 200951178 [Chem. 16]

R1 R2 R3 R4 R5 R6 R7 R8R1 R2 R3 R4 R5 R6 R7 R8

⑻ R9 R10 R11 R12 R13 R14 R15 R16(8) R9 R10 R11 R12 R13 R14 R15 R16

R9 R10 R11 R12 R13 R14 R15 R16 R1 R2 R3 R4 R5 R6 R7 R8R9 R10 R11 R12 R13 R14 R15 R16 R1 R2 R3 R4 R5 R6 R7 R8

(9)(9)

R1. R2 R3 R4 R5 R6 R7 R8 々微2發Y' R9 R10 R^R14 R15 R16R1. R2 R3 R4 R5 R6 R7 R8 々微2 发 Y' R9 R10 R^R14 R15 R16

(10) (式(7) ~( 10)中,RLR16、X、Y及Z係與上述式(3 )中相同,R17~R24各獨立表示氫原子或烷基)。另外, 成分(A)與成分(B)反應而成之聚醯亞胺爲例如具有以 下述式(11)或(12)表示之重複單位者。 [化 17](10) In the formulae (7) to (10), the RLR16, X, Y and Z systems are the same as those in the above formula (3), and R17 to R24 each independently represent a hydrogen atom or an alkyl group). Further, the polyimine which is obtained by reacting the component (A) with the component (B) is, for example, a repeating unit represented by the following formula (11) or (12). [Chem. 17]

R1 R2 R3 R4 R5 R6 R7 R8 *ζΛν-R1 R2 R3 R4 R5 R6 R7 R8 *ζΛν-

(11) '、〇 r9 > R13 R13 RU R15 R16 (式(1 1 )中,RLr16、X、Y及Z係與上述式(3)中相 同)。 (12) 200951178 [化 18] n 〇 R1 R2 R3 R4 R5 R6 R8 " '0 r9 V0 R^R14 R15 R16 (式(12)中’ R1〜Ri6、X、γ及z係與上述式(3)中相 同)。 ❹ ❹ 本發明之薄膜厚度爲1~2 5 0μιη,較好5~200μιη。又, 使用本發明之薄膜作爲基材時最好爲10〜150μιη。本發明 之薄膜厚度爲20μίη時,較好具有80%以上,更好具有 85%以上,又更好具有89%以上之全光線透過率。本發明 之薄膜厚度爲20 μιη時,ΥΙ値(黃色指數)以2.5以下較 佳,更好爲1.4以下。本發明之薄膜相對於波長63 3 nm之 光較好具有1·58〜1.66,更好1.60~1.64之折射率。本發明 之薄膜之玻璃轉移溫度(Tg)以250°C以上較佳,更好爲 280 °C以上。藉由具有該等玻璃轉移溫度,可獲得優異之 耐熱性。本發明之薄膜之拉伸強度以80MPa~300MPa較佳 ,更好爲100MPa~300MPa。本發明薄膜之拉伸強度以 10%~200%較佳,更好爲20%〜150%。本發明薄膜之拉伸彈 性率以2.2GPa以上較佳,更好爲2.5GPa以上。 本發明之薄膜可使用於發光二極體之周邊材料、太陽 能電池之周邊材料、平面顯示器周邊材料、電子電路之周 邊材料中。具體而言,可使用作爲耐熱透明薄膜、導電性 透明薄膜等之光學構件。又,平面顯示器之周邊材料舉例 子材 電邊 、 周 器路 示電 顯子 B 獨 發, 致外 8 H.D 調 機。 有板 、 基 器用 示器 顯示 漿顯 電性 ' 撓 器可 示明 顯透 晶之 液等 爲紙 -25- 200951178 料爲可作爲印刷配線基板用基板者,舉例爲撓性印刷電路 用基板、硬式印刷電路用基板、光電子印刷電路用基板、 COF (覆晶膜)用基板、TAB (帶自動黏合)用基板。作 爲印刷電路基板用時,可設置例如配線用銅層。在薄膜上 設置銅層之印刷電路用基板之製造方法可舉例爲澆鑄法、 層合法、金屬線法等。澆鑄法可例如將上述步驟(b)中 使用之基板變成銅箔達成。具體而言,可將含有聚醯亞胺 等及有機溶劑之溶液塗佈於銅箔上形成塗膜後,自上述塗 膜去除有機溶劑而製造在薄膜上設置有銅層之印刷電路用 基板。於本發明薄膜上設有銅層之方法爲層合法時,可例 如以層合法將銅箔熱壓著在所得之本發明薄膜上,可製造 設有銅層之印刷電路用基板。於層合法之情況下,可例如 將銅箔熱壓著於本發明之薄膜上製造設有銅層之印刷電路 用基板。金屬線法之情況爲例如對本發明之薄膜進行用以 展現與金屬之親和性之表面改質後,藉由蒸鍍法或濺射法 ,形成與聚醯胺鍵結之Ni系金屬層及濕式電鍍所需之薄 片層。因此,可藉由濕式電鍍法設有既定膜厚之銅層而製 造設有銅層之印刷電路用基板。 另外,以步驟(a) 、(b)獲得之含有聚醯亞胺等及 有機溶劑之聚醯亞胺系溶液可作爲聚醯亞胺系樹脂組成物 用於發光二極體之周邊材料、太陽能電池之周邊材料、平 面顯示器之周邊材料、電子電路之周邊材料中。具體而言 可用於密封劑、透鏡材料、印刷電路基板形成用材料等。 例如,使用作爲印刷電路基板形成用材料時,可藉由澆鑄 200951178 法製造印刷電路用基板。具體而言,可於銅笛上塗佈上述 聚醯亞胺系樹脂組成物後,經熱處理,製造設有銅層之印 刷電路用基板。 又’上述聚醯亞胺系樹脂組成物中可使用沸點150 以下之有機溶劑作爲共溶劑。該有機溶劑舉例爲例如甲醇 、乙醇、異丙醇、四氫呋喃、1,3-二噁烷' i,4-二噁烷等 〇 〇 該等溶劑可單獨使用一種或兩種以上混合使用。 又,聚醯亞胺系樹脂組成物中之聚醯胺酸及/或聚醯 亞胺濃度較好爲反應液總量之5〜30質量%。 實施例 以下以實施例具體說明本發明。 [實施例1]首先,於配置有溫度計、攪拌機、氮氣導 入管及冷卻管之3 00毫升4頸燒瓶中添加9.88克(22.8 〇 毫莫耳)之雙[4-(3-胺基苯氧基)苯基]颯。接著’燒瓶 內經氮氣置換後,添加N-甲基-2-吡咯陡酮(以下稱爲 NMP ) (60毫升)且攪拌至均勻。在室溫下將5·12克( - 22.8毫莫耳)2,3,5 -三羧基環戊基乙酸二酐添加於所得溶 液中,且在該溫度下繼續攪拌12小時進行反應’獲得含 有聚醯胺酸之溶液。於含有所得聚醯胺酸之溶液中添力卩 NMP(75毫升)稀釋後,添加吡啶(7.4毫升)'乙酸酐 (6.5毫升),且於110。(:下攪拌6小時進行醯亞胺化’獲 得聚合物。隨後,冷卻至室溫後,倒入大量甲醇中’藉由 -27- 200951178 過濾單離出聚合物。所得聚合物在60°C下真空乾燥隔夜, 成爲白色粉末(產量13.4克,產率94.5%)。 接著’使所得聚合物再溶解於N,N-二甲基乙醯胺( DMAc )中’獲得20質量%之樹脂溶液。使用刮板( ΙΟΟμιη間距)將該樹脂溶液塗佈於由聚對苯二甲酸乙二酯 (PET )構成之基板上,且在100°C下乾燥30分鐘,再於 150°C下乾燥60分鐘成爲薄膜後,自pet基板剝離。隨後 ,使薄膜在150°C、減壓下乾燥3小時,獲得膜厚20μιη 之薄膜。以下述方法,對上述聚合物進行構造分析、重量 平均分子量及醯亞胺化率之測定。結果,羰基之特性吸收 爲1739cm·1及1698cm·1 (參照圖1),重量平均分子量爲 1 74,000。所得聚合物之醯亞胺化率(全部醯胺酸中經脫 水閉環之醯胺酸比例)爲93%。又,以下述方法評價聚合 物對有機溶劑之溶解性、薄膜之全光線透過率、YI値、 折射率、玻璃轉移點、耐熱試驗後之YI値。結果列於表 1中。(1 )構造分析以IR ( KBr法)進行,(2 )重量平 均分子量重量平均分子量係使用TOSOH製造之HCL-8 020型GPC裝置測定。溶劑係使用添加溴化鋰及磷酸之 N-甲基-2-吡咯啶酮(NMP ),測定溫度40 °C,求得換算 成聚苯乙烯之分子量,(3)閉環率(醯亞胺化率)聚醯 亞胺之閉環率係使用1H-NMR測定。溶劑係使用d-DMSO 。由醯胺酸部分之醯亞胺之峰積分値(9.8~l〇.3ppm)與 芳香族二胺之峰積分値(6.5〜7.5ppm)之比率計算出閉環 率。(4)對有機溶劑之溶解性將聚合物溶解於Ν,Ν·二甲 -28- 200951178 基乙醯胺中,調整成20質量%溶液’評價於室溫下之溶解 性。完全溶解之情況記爲「〇」,膨潤或不溶聚合物之情 況記爲「X」。(5)全光線透過率YI以JIS K7105透明 — 度試驗法爲準測定。具體而言,係使用SUGA試驗機股份 ' 有限公司製造之SC-3H型霧濁計測定薄膜之全光線透過率 、YI値(黃色指數)。(6 )折射率使用Metricon公司製 造之20 10型稜鏡偶光計測定所得薄膜於波長6 33 nm之折 Φ 射率。再者,測定係在23°C、50%RH下使用矽晶圓基板 進行。(7 )玻璃轉移溫度(Tg )使用RJgaku公司製造之 8230型DSC測定裝置,於20 °C/min之升溫速度下測定。 (8)耐熱試驗後之YI値使所得薄膜(邊長50cm)於維 持在150°C之熱風式乾燥機中放置24小時,進行耐熱加速 試驗。以與上述(5)相同之方法測定該試驗後之薄膜之 YI値。(9 )拉伸特性測定所得薄膜之力學強度、以JIS K7 1 27爲準測定室溫之拉伸強度、拉伸及拉伸彈性率。 〇 [實施例2]除使用雙[4-(4 -胺基苯氧基)苯基]碾代替 雙[4- ( 3-胺基苯氧基)苯基]礪以外,餘與實施例1相同 ,獲得白色粉末之聚合物(產量13.8克,產率97.3%), - 並獲得薄膜。以與實施例1相同之方法,對所得聚合物進 行構造分析、重量平均分子量及醯亞胺化率之測定。結果 ,羰基之特性吸收爲1739cm·1及1696cm·1 (參照圖2), 重量平均分子量爲3 3 9,000。所得聚合物之醯亞胺化率爲 94%。又,如實施例1般評價所得聚合物及薄膜之各種物 性。結果列於表1中。 -29- 200951178 [實施例3]除使用9.33克(25.3毫莫耳)雙(4-胺基 苯氧基)聯苯代替雙[4- (3-胺基苯氧基)苯基]颯,且將 2,3,5-三羧基環戊基乙酸二酐、吡啶及乙酸酐之調配量分 別改變成5.67克(25.3毫莫耳)、8.2毫升、7.2毫升以 外,餘與實施例1相同,獲得白色粉末之聚合物(產量 13.2克,產率94.0%),並獲得薄膜。以與實施例1相同 之方法,對所得聚合物進行構造分析、重量平均分子量及 醯亞胺化率之測定。結果,羰基之特性吸收爲1 73 8cm·1 及 1 695 (^^(參照圖 3),重量平均分子量爲292,000。 所得聚合物之醯亞胺化率爲9 3 %。又,以如實施例1般評 價所得聚合物及薄膜之各種物性。結果列於表1。 [實施例4]除使用9.70克(23.6毫莫耳)2,2-雙[4-( 4-胺基苯氧基)苯基]丙烷代替雙[4- (3-胺基苯氧基)苯 基]碾,且將2,3,5-三羧基環戊基乙酸二酐、吡啶及乙酸酐 之調配量分別改變成5.30克(23.6毫莫耳)、7.5毫升、 6.7毫升以外,餘與實施例1相同,獲得白色粉末之聚合 物(產量13.5克,產率95.3%),並獲得薄膜。以與實施 例1相同之方法,對所得聚合物進行構造分析、重量平均 分子量及醯亞胺化率之測定。結果,羰基之特性吸收爲 1 73 5cm·1及1 682(^^(參照圖4),重量平均分子量爲 320,000。所得聚合物之醯亞胺化率爲93%。又,以如實 施例1般評價所得聚合物及薄膜之各種物性。結果列於表 1 °(11) ', 〇 r9 > R13 R13 RU R15 R16 (In the formula (1 1 ), the RLr16, X, Y and Z systems are the same as in the above formula (3)). (12) 200951178 [化18] n 〇R1 R2 R3 R4 R5 R6 R8 " '0 r9 V0 R^R14 R15 R16 (in equation (12) 'R1~Ri6, X, γ and z are the above formula (3 ) the same). ❹ ❹ The film thickness of the present invention is from 1 to 2500 μm, preferably from 5 to 200 μm. Further, when the film of the present invention is used as a substrate, it is preferably 10 to 150 μm. When the film thickness of the present invention is 20 μί, it is preferably 80% or more, more preferably 85% or more, and still more preferably has a total light transmittance of 89% or more. When the film thickness of the present invention is 20 μm, the yttrium (yellow index) is preferably 2.5 or less, more preferably 1.4 or less. The film of the present invention preferably has a refractive index of from 1.58 to 1.66, more preferably from 1.60 to 1.64, with respect to light having a wavelength of 63 3 nm. The glass transition temperature (Tg) of the film of the present invention is preferably 250 ° C or higher, more preferably 280 ° C or higher. By having these glass transition temperatures, excellent heat resistance can be obtained. The tensile strength of the film of the present invention is preferably from 80 MPa to 300 MPa, more preferably from 100 MPa to 300 MPa. The tensile strength of the film of the present invention is preferably from 10% to 200%, more preferably from 20% to 150%. The tensile elastic modulus of the film of the present invention is preferably 2.2 GPa or more, more preferably 2.5 GPa or more. The film of the present invention can be used in the peripheral material of the light-emitting diode, the peripheral material of the solar cell, the peripheral material of the flat display, and the peripheral material of the electronic circuit. Specifically, an optical member such as a heat-resistant transparent film or a conductive transparent film can be used. In addition, the peripheral materials of the flat panel display are as follows: the electric side, the peripheral circuit, the electric indicator B, and the external 8 H.D adjustment. A plate and a base device are used to display the sensibility of the slurry. The liquid can be used as a substrate for a printed wiring board. For example, a substrate for a flexible printed circuit board or a hard type can be used as a substrate for a printed wiring board. A substrate for a printed circuit, a substrate for an optoelectronic printed circuit, a substrate for COF (Crystalline), and a substrate for TAB (with automatic bonding). When used as a printed circuit board, for example, a copper layer for wiring can be provided. The method for producing a substrate for a printed circuit in which a copper layer is provided on a film can be exemplified by a casting method, a lamination method, a wire method, and the like. The casting method can be achieved, for example, by changing the substrate used in the above step (b) into a copper foil. Specifically, a solution containing a polyimine or the like and an organic solvent is applied onto a copper foil to form a coating film, and then an organic solvent is removed from the coating film to produce a substrate for a printed circuit having a copper layer provided on the film. When the method of providing a copper layer on the film of the present invention is a lamination process, for example, a copper foil is heat-pressed on the obtained film of the present invention by lamination, and a substrate for a printed circuit provided with a copper layer can be produced. In the case of lamination, for example, a copper foil may be heat-pressed on the film of the present invention to produce a substrate for a printed circuit provided with a copper layer. In the case of the metal wire method, for example, after the surface of the film of the present invention is subjected to surface modification for exhibiting affinity with a metal, a Ni-based metal layer bonded to a polyamide bond and a wet film are formed by a vapor deposition method or a sputtering method. The sheet layer required for electroplating. Therefore, a substrate for a printed circuit provided with a copper layer can be produced by providing a copper layer having a predetermined film thickness by a wet plating method. Further, the polyimide-based solution containing the polyimine or the like and the organic solvent obtained in the steps (a) and (b) can be used as a polyimide composition for a peripheral material of a light-emitting diode, solar energy. The surrounding material of the battery, the surrounding material of the flat display, and the surrounding materials of the electronic circuit. Specifically, it can be used for a sealant, a lens material, a material for forming a printed circuit board, and the like. For example, when a material for forming a printed circuit board is used, a substrate for a printed circuit can be produced by casting the method of 200951178. Specifically, the polyimine-based resin composition can be applied to a copper flute, and then a substrate for a printed circuit provided with a copper layer can be produced by heat treatment. Further, an organic solvent having a boiling point of 150 or less can be used as a co-solvent in the above polyimine-based resin composition. The organic solvent is exemplified by, for example, methanol, ethanol, isopropanol, tetrahydrofuran, 1,3-dioxane 'i,4-dioxane, etc. 〇 〇 These solvents may be used alone or in combination of two or more. Further, the concentration of the polyamic acid and/or the polyamidene in the polyimine-based resin composition is preferably from 5 to 30% by mass based on the total amount of the reaction liquid. EXAMPLES Hereinafter, the present invention will be specifically described by way of examples. [Example 1] First, 9.88 g (22.8 〇 mmol) of bis[4-(3-aminophenoxy) was added to a 300 ml 4-necked flask equipped with a thermometer, a stirrer, a nitrogen introduction tube, and a cooling tube. Base) phenyl] hydrazine. Then, after replacing the inside of the flask with nitrogen, N-methyl-2-pyrroledrone (hereinafter referred to as NMP) (60 ml) was added and stirred until homogeneous. 5·12 g (-22.8 mmol) of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride was added to the obtained solution at room temperature, and stirring was continued at this temperature for 12 hours to carry out the reaction. A solution of polylysine. After diluting with a solution of the obtained poly-proline acid, NMP (75 ml), pyridine (7.4 ml) of acetic anhydride (6.5 ml) was added, and at 110. (: stirring for 6 hours to carry out hydrazine imidization 'to obtain a polymer. Then, after cooling to room temperature, pour into a large amount of methanol', the polymer was isolated by filtration from -27 to 200951178. The obtained polymer was at 60 ° C. The mixture was vacuum dried overnight to give a white powder (yield: 13.4 g, yield: 94.5%). Then, the obtained polymer was redissolved in N,N-dimethylacetamide (DMAc) to obtain a 20% by mass resin solution. The resin solution was coated on a substrate composed of polyethylene terephthalate (PET) using a squeegee (ΙΟΟμιη pitch), and dried at 100 ° C for 30 minutes and then dried at 150 ° C. After the film became a film, it was peeled off from the pet substrate. Then, the film was dried at 150 ° C for 3 hours under reduced pressure to obtain a film having a film thickness of 20 μm. The structure analysis, weight average molecular weight and enthalpy of the polymer were carried out by the following method. The imidization ratio was measured. As a result, the characteristic absorption of the carbonyl group was 1739 cm·1 and 1698 cm·1 (refer to Fig. 1), and the weight average molecular weight was 174,000. The yield of the obtained polymer was imidized (all the proline acids) Dehydration closed loop lysine ratio) 93%. Further, the solubility of the polymer in the organic solvent, the total light transmittance of the film, the YI 値, the refractive index, the glass transition point, and the YI 后 after the heat resistance test were evaluated by the following methods. The results are shown in Table 1. 1) The structural analysis was carried out by IR (KBr method), and (2) the weight average molecular weight weight average molecular weight was measured using a HCL-8 020 GPC apparatus manufactured by TOSOH. The solvent was N-methyl-2-added with lithium bromide and phosphoric acid. Pyrrolidinone (NMP), the temperature was measured at 40 ° C, and the molecular weight converted to polystyrene was determined. (3) The closed-loop ratio of the closed-loop ratio (醯i-imidization ratio) of polyimine was determined by 1H-NMR. The d-DMSO was used, and the closed-loop ratio was calculated from the ratio of the peak integral 値 (9.8~l〇.3ppm) of the guanidine imine moiety to the peak integral 値 (6.5 to 7.5 ppm) of the aromatic diamine. 4) Solubility to organic solvent The polymer was dissolved in hydrazine, Ν·dimethyl -28-200951178 acetamidine, adjusted to 20% by mass solution, and evaluated for solubility at room temperature. For "〇", the case of swelling or insoluble polymer is recorded as "X". (5) Full light The over-rate YI is determined by the JIS K7105 transparency test method. Specifically, the total light transmittance, YI 値 (yellow index) of the film is measured using the SC-3H type haze meter manufactured by SUGA Test Machine Co., Ltd. (6) Refractive index The refractive index of the obtained film at a wavelength of 6 33 nm was measured using a 20 10 type 稜鏡 illuminometer manufactured by Metricon Co., Ltd. Further, the measurement system was used at 23 ° C and 50% RH. The wafer substrate is processed. (7) The glass transition temperature (Tg) was measured at a temperature increase rate of 20 ° C / min using a Model 8230 DSC measuring apparatus manufactured by RJgaku Co., Ltd. (8) YI 后 after the heat resistance test The obtained film (side length 50 cm) was allowed to stand in a hot air dryer maintained at 150 ° C for 24 hours to carry out a heat resistance accelerated test. The YI 薄膜 of the film after the test was measured in the same manner as in the above (5). (9) Tensile properties The mechanical strength of the film was measured, and the tensile strength at room temperature, tensile strength and tensile modulus were measured in accordance with JIS K7 1 27 . 〇 [Example 2] Except that bis[4-(4-aminophenoxy)phenyl]roll was used instead of bis[4-(3-aminophenoxy)phenyl]fluorene, the same as in Example 1 In the same manner, a white powder polymer (yield 13.8 g, yield 97.3%) was obtained, and a film was obtained. The obtained polymer was subjected to structural analysis, weight average molecular weight, and oxime imidization ratio in the same manner as in Example 1. As a result, the characteristic absorption of the carbonyl group was 1739 cm·1 and 1696 cm·1 (refer to Fig. 2), and the weight average molecular weight was 3 3 9,000. The obtained imidization ratio of the polymer was 94%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. The results are shown in Table 1. -29- 200951178 [Example 3] except that 9.33 g (25.3 mmol) of bis(4-aminophenoxy)biphenyl was used instead of bis[4-(3-aminophenoxy)phenyl]indole, Further, the blending amounts of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, pyridine, and acetic anhydride were changed to 5.67 g (25.3 mmol), 8.2 ml, and 7.2 ml, respectively, and the remainder was the same as in Example 1. A white powder polymer (yield 13.2 g, yield 94.0%) was obtained, and a film was obtained. The obtained polymer was subjected to structural analysis, weight average molecular weight, and oxime imidization ratio in the same manner as in Example 1. As a result, the characteristic absorption of the carbonyl group was 1 73 8 cm·1 and 1 695 (refer to Fig. 3), and the weight average molecular weight was 292,000. The yield of the obtained polymer was 93%. Further, as in the examples The physical properties of the obtained polymer and film were evaluated in general. The results are shown in Table 1. [Example 4] Except that 9.70 g (23.6 mmol) of 2,2-bis[4-(4-aminophenoxy) group was used. Phenyl]propane replaces bis[4-(3-aminophenoxy)phenyl], and the amount of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, pyridine and acetic anhydride is changed to 5.30 g (23.6 mmol), 7.5 ml, 6.7 ml, and the same as in Example 1, a white powder polymer (yield: 13.5 g, yield: 95.3%) was obtained, and a film was obtained. In the method, the obtained polymer was subjected to structural analysis, weight average molecular weight, and ruthenium imidation rate. As a result, the characteristic absorption of the carbonyl group was 173 5 cm·1 and 1 682 (refer to FIG. 4), and the weight average molecular weight was determined. It was 320,000. The obtained imidization ratio of the obtained polymer was 93%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. Listed in Table 1 °

[實施例5]如實施例4般調配聚醯胺酸後,添加NMP -30- 200951178 (75毫升)稀釋,且添加二甲苯(12毫升)、異唼啉(1 滴;7毫升),在180°C下攪拌6小時進行醯亞胺化,獲 得聚合物。隨後,如實施例1般單離聚合物,獲得白色粉 末(產量13.2克,產率93.3%),使用所得聚合物,如實 - 施例1般獲得薄膜。以與實施例1相同之方法,對所得聚 合物進行重量平均分子量及醯亞胺化率之測定。結果,重 量平均分子量爲1 90,000,醯亞胺化率爲89%。又,以如 φ 實施例1般評價所得聚合物及薄膜之各種物性。結果列於 表1。 [實施例6] 首先,於配置有溫度計、攪拌機、氮氣導入管及冷卻 管之300毫升4頸燒瓶中添加雙[4- ( 4-胺基苯氧基)苯基 ]颯(9.75克,22.54毫莫耳)。接著,燒瓶內經氮氣置換 後,添加N-甲基-2-吡咯啶酮(以下稱爲NMP ) ( 60毫升 )且攪拌至均勻。在室溫下將2,3,5-三羧基環戊基乙酸二 0 酐(5.12克,22.84毫莫耳·,酸酐:胺=1:0.987)添加於 所得溶液中,在該溫度下繼續攪拌12小時進行反應,獲 得含有聚醯胺酸之溶液。於含有所得聚醯胺酸之溶液中添 . 力□ NMP ( 75毫升)稀釋後,添加吡啶(7.4毫升)、乙酸 酐(6.5毫升),且於1 l〇°C下攪拌6小時進行醯亞胺化, 獲得聚合物。隨後,冷卻至室溫後’倒入大量甲醇中,藉 由過濾單離出聚合物。所得聚合物在60°C下真空乾燥隔夜 ,成爲白色粉末(13.4克,95.0% )。接著,使所得聚合 物再溶解於Ν,Ν-二甲基乙醯胺(DMAc)中,獲得20質 -31 - 200951178 量%之樹脂溶液。使用刮板(ΙΟΟμιη間距)將該樹脂溶液 塗佈於由聚對苯二甲酸乙二酯(PET )構成之基板上,且 在100°C下乾燥30分鐘,再於150°C下乾燥60分鐘成爲薄 膜後,自PET基板剝離。隨後,使薄膜在150°C、減壓下 乾燥3小時,獲得膜厚20μιη之薄膜》 以與實施例1相同之方法,對上述聚合物進行構造分 析、重量平均分子量及醯亞胺化率之測定。結果,羰基之 特性吸收爲1 740CHT1及1 695cm·1 (醯亞胺基)、1 892CUT1 (末端基)(參照圖5 ),重量平均分子量爲149,000。 所得聚合物之醯亞胺化率(全部醯胺酸中經脫水閉環 之醯胺酸比例)爲94%。 又,如實施例1般評價所得聚合物及薄膜之各種物性 。結果列於表1。 [實施例7] 除將雙[4-(4-胺基苯氧棊)苯基]碾之量變更成9.51 克(21.99毫莫耳;酸酐:胺=1:0.963)以外,餘與實施例 6相同,獲得白色粉末之聚合物(產量13.1克’產率 94.6%),並獲得薄膜。 以與實施例1相同之方法,對所得聚合物進行構造分 析、重量平均分子量及醯亞胺化率之測定。結果’羰基之 特性吸收爲1 740CHT1及1 695CHT1 (醯亞胺基)、189201^1 (末端基)(參照圖6),重複單位數爲55,重量平均分 子量爲66,000。 所得聚合物之醯亞胺化率爲93%。 200951178 又,以如實施例1般評價所得聚合物及薄膜之各種物 性。結果列於表1。 [實施例8 ] 除使用9.58克(23_34毫莫耳,酸酐:胺=1:〇.987 ) - 2,2-雙[4- ( 4-胺基苯氧基)苯基]丙烷代替雙[4_ ( 4_胺基 苯氧基)苯基]颯以外,餘與實施例1相同,獲得白色粉 末之聚合物(產量13.3克,產率95·〇 % ),並獲得薄膜。 φ 以與實施例1相同之方法’對所得聚合物進行構造分 析、重量平均分子量及醯亞胺化率之測定。結果,羰基之 特性吸收爲1737cm-1及1680cm·1 (醯亞胺基)、1892cm·1 (末端基)(參照圖7),重複單位數爲160,重量平均 分子量爲1 83,000。 所得聚合物之醯亞胺化率爲95%。 又,以如實施例1般評價所得聚合物及薄膜之各種物 性。結果列於表1。 〇 [實施例9 ] 首先,於配備有溫度計、攪拌機、氮氣導入管及冷卻 管之3 00毫升4頸燒瓶中添加2,2-雙[4- ( 4-胺基苯氧基) . 苯基]丙烷(9.24克,22_5毫莫耳;(B-1)成分)、2,2’- 雙(三氟甲基)聯苯胺(0.38克,1.2毫莫耳;(B-2)成 分)。接著,燒瓶內經氮氣置換後,添加N-甲基-2-吡咯 啶酮(以下稱爲NMP) (135克)且攪拌至均勻。在室溫 下將2,3,5-三羧基環戊基乙酸二酐(5.38克,24.0毫莫耳 ;(A )成分)添加於所得溶液中,且在該溫度下繼續攪 -33- 200951178 拌24小時進行反應,獲得含有聚醯胺酸之溶液。於含有 所得聚醯胺酸之溶液中添加N-甲基吡咯啶(2.7毫升)、 乙酸酐(6.7毫升),且在75 °C下攪拌3小時進行醯亞胺 化。冷卻至室溫後,倒入大量甲醇中,藉由過濾單離出聚 合物。所得聚合物在60°C下真空乾燥隔夜’成爲白色粉末 (13.1克,93% )。接著,使所得聚合物再溶解於N,N-二 甲基乙醯胺(DM Ac )中,獲得20質量%之樹脂溶液。使 用刮板(1 〇〇μηι間距)將該樹脂溶液塗佈於由聚對苯二甲 酸乙二酯(PET)構成之基板上,在100 °C下乾燥30分鐘 ,再於150°C下乾燥60分鐘成爲薄膜後,自PET基板剝離 。隨後,使薄膜在1 5 0 °C、減壓下乾燥3小時,獲得膜厚 20μπι之薄膜。 以與實施例1相同之方法,對所得聚合物進行重量平 均分子量及醯亞胺化率之測定。所得聚合物之重量平均分 子量爲104,000,醯亞胺化率(全部醯胺酸中經脫水閉環 之醯胺酸比例)爲95%。 對所得薄膜,藉由IR ( ATR法:薄膜)進行構造分 析。結果,羰基之特性吸收爲1 73 5cm·1及1 684cm·1 (參 照圖8)。又,如實施例1般評價聚合物對有機溶劑之溶 解性、薄膜之全光線透過率、YI値、玻璃轉移點。耐熱 試驗後之YI値爲使所得薄膜(邊長5cm)於維持在175°c 之熱風式乾燥機中放置12小時,進行耐熱加速試驗,且 以與上述(5 )相同之方法測定該耐熱試驗後之薄膜之YI 値。結果列於表1。 -34- 200951178 [實施例ι〇]除使用9.36克(22·8毫莫耳)2,2_雙[4_ (4-胺基苯氧基)苯基]丙烷作爲(B_1)成分’ 〇·26克( 1.2毫莫耳)2,2,-二甲基聯苯胺作爲(B·2)成分,5.38克 - (24.0毫莫耳)2,3,5-三羧基環戊基乙酸二酐作爲(A)成 - 分以外,餘與實施例9相同,獲得白色粉末之聚合物(產 量13.2克,產率94%)及薄膜。以與實施例9相同之方 法,對所得聚合物進行構造分析、重量平均分子量及醯亞 0 胺化率之測定。結果,羰基之特性吸收爲173 km·1及 1683cm_1(參照圖9),重量平均分子量爲183,000’醯亞 胺化率爲97%。又,如實施例9般評價所得聚合物及薄膜 之各種物性。結果列於表1。 [實施例11]除使用9.32克(22.7毫莫耳)2,2-雙[4-(4-胺基苯氧基)苯基]丙烷作爲(B-1)成分,0.25克( 1.2毫莫耳)2,2’-二甲基聯苯胺作爲(B-2)成分,5.43克 (24.2毫莫耳)2,3,5-三羧基環戊基乙酸二酐作爲(八)成 〇 分以外,餘與實施例9相同,獲得白色粉末之聚合物(產 量13.2克,產率94% )及薄膜。以與實施例1相同之方 法,對所得聚合物進行構造分析、重量平均分子量及醯亞 , 胺化率之測定。結果,羰基之特性吸收爲1 73 5cm·1及 1 683(^^(參照圖1〇),重量平均分子量爲 1 3 8,000,醯 亞胺化率爲93 %。又,如實施例9般評價所得聚合物及薄 膜之各種物性。結果列於表1。 [實施例12]除使用9.19克(22.4毫莫耳)2,2-雙[4-(4-胺基苯氧基)苯基]丙烷作爲(Ed)成分,〇·25克( -35- 200951178 1.2毫莫耳)2,2’-二甲基聯苯胺作爲(B-2)成分,5.56克 (24.8毫莫耳)2,3,5-三羧基環戊基乙酸二酐作爲(人)成 分以外,餘與實施例9相同’獲得白色粉末之聚合物(產 量12.8克,產率91%)及薄膜。以與實施例1相同之方 法,對所得聚合物進行構造分析、重量平均分子量及醯亞 胺化率之測定。結果,羰基之特性吸收爲1 73 5cm·1及 1684cm·1 (參照圖11),重量平均分子量爲52,000,醯亞 胺化率爲95%。又,如實施例9般評價所得聚合物及薄膜 之各種物性。結果列於表1。 [實施例13] 於配置有溫度計、攪拌機、氮氣導入管及冷卻管之 300毫升4頸燒瓶中添加2,2-雙[4- ( 4-胺基苯氧基)苯基] 丙烷(6.47克,15.8毫莫耳)。接著,燒瓶內經氮氣置換 後,添加N-甲基-2-吡咯啶酮(以下稱爲NMP ) ( 90.0克 )且攪拌至均勻。在室溫下將2,3,5-三羧基環戊基乙酸二 酐(3.53克,15.8毫莫耳)添加於所得溶液中,且在該溫 度下繼續攪拌24小時進行反應,獲得聚醯胺酸溶液。 接著,於所得聚醯胺酸溶液中添加N-甲基吡咯啶( 1-9毫升)、乙酸酐(4.5毫升),在75°C下攪拌4小時進 行醯亞胺化。冷卻至室溫後,倒入大量甲醇中,藉由過濾 單離出聚合物。所得聚合物在60°C下真空乾燥隔夜,獲得 白色粉末(產量9.20克,產率97.5質量%)。 接著,使所得聚合物再溶解於N,N-二甲基乙醯胺( DMAc)中,獲得20質量%之樹脂溶液。接著,使用刮板 200951178 (ΙΟΟμηι間距)將該樹脂溶液塗佈於由聚對苯二甲酸乙二 酷(PET)構成之基板上,且在1〇〇 °C下乾燥30分鐘,再 於150 °C下乾燥60分鐘後,自PET基板剝離。隨後,在 180°C、減壓下乾燥8小時,獲得膜厚20μπι之薄膜。 ' 以與實施例1相同之方法評價上述聚合物之閉環率( 醯亞胺化率)及聚醯胺酸與上述聚合物(醯亞胺化後之聚 合物)之重量平均分子量。所得聚合物之醯亞胺化率爲 φ 98%。又,聚醯胺酸之重量平均分子量爲4.0Χ105,所得聚 合物(醯亞胺化後之聚合物)之重量平均分子量爲5.2χ 105。 薄膜之全光線透過率、ΥΙ値(初期)係以與實施例1 相同之方法評價。又,以下述方法評價ΥΙ値(耐UV試 驗後)及吸水性。有關耐熱試驗後之ΥΙ値,係將所得薄 膜(邊長5cm)置於保持在150°c之熱風式乾燥機中100 小時,進行耐熱加速試驗,且以與上述(5 )相同之方測 ❹ 定該耐熱試驗後之薄膜之YI値。結果列於表1。 (10 )耐UV試驗後之YI値 將所得薄膜(邊長5cm)置於以紫外線螢光燈UVA-. 3 5 1作爲光源之QUV試驗機(加速耐候性試驗機)中1週 ,進行耐UV加速試驗。以與上述(5 )相同之方法測定 該試驗後之薄膜之YI値。 (1 1 )吸水試驗 將所得薄膜切割成3片3cmx4cm大小’於減壓乾燥 下於18(TC乾燥8小時。測定薄膜質量後,將薄膜浸漬於 -37- 200951178 25 °C之蒸餾水中24小時。去除浸漬後之薄膜表面之水滴 ’且由浸漬前後之質量變化計算出吸水率(質量% )。 吸水率之計算式如下: 吸水率(%)={[(浸漬後之質量)+ (浸漬前之質量)]_1}χ100 [實施例14] 除使醯胺化反應溫度成爲40°C,反應時間成爲48小 時以外,餘與實施例1相同,獲得由白色粉末組成之聚合 物(產量9.20克,產率97.5質量% )及薄膜。 以與實施例1相同之方法評價所得聚合物之閉環率( 醯亞胺化率)及重量平均分子量。所得聚合物之醯亞胺化 率爲95%。又,聚醯胺酸之重量平均分子量爲4. Ox 105, 所得聚合物(醯亞胺化後之聚合物)之重量平均分子量爲 5.6x10s ° 另外,如實施例13般評價薄膜之全光線透過率、YI 値(初期、耐熱試驗後、耐UV試驗後)及吸水性。結果 列於表1。 [比較例1]除使用7.08克(35_3毫莫耳)4,4’-二胺基 二苯基醚取代雙[4-(3-胺基苯氧基)苯基]颯,且將 2,3,5-三羧基環戊基乙酸二酐、吡啶及乙酸酐之調配量分 別變更成7.92克(35.3毫莫耳)、11.4毫升、10.0毫升 以外,餘與實施例1相同,獲得淺褐色粉末之聚合物(產 量12.7克,產率92.7%)及薄膜。以與實施例1相同之方 法,針對所得聚合物進行構造分析及重量平均分子量之測 定。結果,羰基之特性吸收爲1 739cm·1及1 689 cnT1 (參 200951178 照圖12),重量平均分子量爲295,000。所得聚合物之醯 亞胺化率爲92%。又,醯亞胺化率係由1H-NMR之醯胺酸 N-H訊號與芳香環氫訊號比算出。另外,如實施例1般評 ' 價所得聚合物及薄膜之各種物性。結果列於表1。 - [比較例2]除使用4.88克(24.6毫莫耳)丁烷四羧酸 二酐取代實施例4中使用之2,3,5-三羧基環戊基乙酸二酐 ,且將2,2·雙[4- (4-胺基苯氧基)苯基]丙烷、吡啶及乙 φ 酸酐之調配量分別變更爲10.12克(24.6毫莫耳)、8.0 毫升、7.0毫升以外,餘與實施例4相同,獲得白色粉末 之聚合物(產量13.3克,產率94.0%)及薄膜。以與實施 例1相同之方法,對所得聚合物進行構造分析及重量平均 分子量之測定。結果,羰基之特性吸收爲ITSIcrrr1及 1705(^^(參照圖13),重量平均分子量爲120,000。所 得聚合物之醯亞胺化率爲96%。又,醯亞胺化率係由1H-NMR之醯胺酸N-H訊號與芳香環氫訊號比算出。另外, φ 如實施例1般評價所得聚合物及薄膜之各種物性。結果列 於表1。 [比較例3]除使用4.85克(24.7毫莫耳)環丁烷四羧 . 酸二酐取代實施例4中使用之2,3,5-三羧基環戊基乙酸二 酐,且將2,2-雙[4- ( 4-胺基苯氧基)苯基]丙烷、吡啶及 乙酸酐之調配量分別變更爲10.15克(24.7毫莫耳)、8.0 毫升、7.0毫升以外,餘與實施例4相同調製聚合物,但 由於醯亞胺化中析出聚合物,因此未進行以上之構造解析 -39- 200951178 [表1】 溶解性 全光線 透過率 (%).. Υΐ値 折射率 Tg ΓΟ 耐熱試 驗後之 YI値 耐UV試 纖之 γι値 拉伸 強度 (MPa) 拉伸 伸長率 (%) 拉伸 彈性率 (GPa) 吸水率 (%) 資施例1 〇 89.9 1.0 1.602 259 1.3 - 95 20 2.6 實施例2 〇 88.9 0.6 1.604 326 0.8 - 112 68 2.7 實施例3 〇 88.9 0.8 1.605 300 1.0 - 103 34 2.7 - 實施例4 〇 89.1 0.9 1.605 280 1.2 - 127 100 2.7 - 實施例5 〇 89.1 1.1 1.604 275 1.4 - 107 95 2.6 - 實施例6 〇 89.2 0.5 1.604 325 0.6 - 108 66 2.7 - 實施例7 〇 89.1 0.5 1.603 325 0.7 - 105 59 2.7 - 實施例8 〇 89.5 0J 1.605 282 0.9 - 132 101 2.7 - 實施例9 〇 90 0.4 - 277 0.7*1 - - - - - 實施例10 〇 89 0.6 - 280 1.1*1 - - - - - 實施例11 〇 89 0.5 - 280 0.9*1 - - - - - 實施例12 〇 89 0.6 - 277 1.0*1 - - - - 参 實施例13 - 89 0.9 - 1.8*2 1.8 - - - 2.4 實施例14 - 89 0.9 - - 2.0*1 2.0 - - - 2.7 比較例1 〇 87.8 3.0 1.604 >350 3.6 - 93 42 2.7 - 比較例2 〇 88.0 1.5 1.608 232 2.1 - 100 5 3.4 - 比較例3 X - 奶耐熱纖條件(i75r,12小時) ※之耐熱試驗條件(15〇°C,100小時) 由表1,可了解依據本發明,由於聚醯亞胺對有機溶 劑具有優異之溶解性,且不須在高溫(例如,400°c左右 )下進行熱處理即可形成薄膜(具有優異之成形性),另 -40- 200951178 外,所得薄膜之全光線透過率(透明性)高,YI値(黃 色度)於耐熱試驗後亦低,具有高的折射率,Tg高而爲 耐熱性優異。由表1之實施例6〜8,可了解依據本發明, ' 以特定莫耳比之特定單體合成之聚醯亞胺等爲全光線透過[Example 5] After the poly-proline was prepared as in Example 4, it was diluted with NMP-30-200951178 (75 ml), and xylene (12 ml) and isoporphyrin (1 drop; 7 ml) were added. The mixture was stirred at 180 ° C for 6 hours to carry out hydrazine imidation to obtain a polymer. Subsequently, the polymer was isolated as in Example 1 to obtain a white powder (yield: 13.2 g, yield: 93.3%), and the obtained polymer was used to obtain a film as in Example 1. The obtained polymer was subjected to measurement of a weight average molecular weight and a ruthenium imidation ratio in the same manner as in Example 1. As a result, the weight average molecular weight was 1 90,000, and the oxime imidization ratio was 89%. Further, various physical properties of the obtained polymer and film were evaluated in the same manner as in Example 1 of φ. The results are shown in Table 1. [Example 6] First, bis[4-(4-aminophenoxy)phenyl]anthracene (9.75 g, 22.54) was added to a 300 ml 4-necked flask equipped with a thermometer, a stirrer, a nitrogen introduction tube, and a cooling tube. Millions of ears). Next, after replacing the inside of the flask with nitrogen, N-methyl-2-pyrrolidone (hereinafter referred to as NMP) (60 ml) was added and stirred until homogeneous. 2,3,5-Tricarboxycyclopentyl acetic acid bis-anhydride (5.12 g, 22.84 mmol, anhydride: amine = 1:0.987) was added to the resulting solution at room temperature, and stirring was continued at this temperature. The reaction was carried out for 12 hours to obtain a solution containing polyamic acid. After diluting with a solution of the obtained poly-proline acid, the residue was diluted with NMP (75 ml), pyridine (7.4 ml), acetic anhydride (6.5 ml) was added, and stirred at 1 l ° C for 6 hours. Amination, obtaining a polymer. Subsequently, after cooling to room temperature, it was poured into a large amount of methanol, and the polymer was separated by filtration. The obtained polymer was vacuum dried overnight at 60 ° C to give a white powder (13.4 g, 95.0%). Next, the obtained polymer was redissolved in hydrazine, hydrazine-dimethylacetamide (DMAc) to obtain a resin solution of 20 mass - 31 - 200951178% by weight. The resin solution was applied onto a substrate composed of polyethylene terephthalate (PET) using a squeegee (ΙΟΟμιη pitch), and dried at 100 ° C for 30 minutes and then at 150 ° C for 60 minutes. After being a film, it is peeled off from the PET substrate. Subsequently, the film was dried at 150 ° C under reduced pressure for 3 hours to obtain a film having a film thickness of 20 μm. In the same manner as in Example 1, the polymer was subjected to structural analysis, weight average molecular weight, and oxime imidization ratio. Determination. As a result, the characteristic absorption of the carbonyl group was 1 740 CHT1 and 1 695 cm·1 (indenylene group), 1 892 CUT1 (end group) (refer to Fig. 5), and the weight average molecular weight was 149,000. The ruthenium imidation ratio of the obtained polymer (the ratio of lysine which was subjected to dehydration ring closure in all lysines) was 94%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. The results are shown in Table 1. [Example 7] Except that the amount of bis[4-(4-aminophenoxypurine)phenyl] was changed to 9.51 g (21.99 mmol; anhydride: amine = 1:0.963), In the same manner, a white powdery polymer was obtained (yield: 13.1 g, yield 94.6%), and a film was obtained. The obtained polymer was subjected to measurement of structure analysis, weight average molecular weight, and ruthenium imidation ratio in the same manner as in Example 1. As a result, the characteristic absorption of the carbonyl group was 1 740 CHT1 and 1 695 CHT1 (indenylene group), 189201^1 (end group) (refer to Fig. 6), the number of repeating units was 55, and the weight average molecular weight was 66,000. The obtained imidization ratio of the polymer was 93%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. The results are shown in Table 1. [Example 8] In addition to using 9.58 g (23-34 mmol, anhydride:amine = 1: 〇.987) - 2,2-bis[4-(4-aminophenoxy)phenyl]propane instead of double [ A polymer of a white powder (yield: 13.3 g, yield: 95.%) was obtained in the same manner as in Example 1 except for 4-(4-aminophenoxy)phenyl]indole, and a film was obtained. φ The structure of the obtained polymer was measured by the same method as in Example 1 to measure the weight average molecular weight and the ruthenium iodide ratio. As a result, the characteristic absorption of the carbonyl group was 1737 cm-1 and 1680 cm·1 (indenylene group), 1892 cm·1 (end group) (refer to Fig. 7), the number of repeating units was 160, and the weight average molecular weight was 183,000. The obtained imidization ratio of the polymer was 95%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. The results are shown in Table 1. 〇 [Example 9] First, 2,2-bis[4-(4-aminophenoxy). phenyl was added to a 300 ml 4-necked flask equipped with a thermometer, a stirrer, a nitrogen introduction tube, and a cooling tube. Propane (9.24 g, 22-5 mmol; (B-1) component), 2,2'-bis(trifluoromethyl)benzidine (0.38 g, 1.2 mmol; (B-2) component). Next, after replacing the inside of the flask with nitrogen, N-methyl-2-pyrrolidone (hereinafter referred to as NMP) (135 g) was added and stirred until homogeneous. 2,3,5-Tricarboxycyclopentyl acetic acid dianhydride (5.38 g, 24.0 mmol; component (A)) was added to the resulting solution at room temperature, and stirring was continued at this temperature -33-200951178 The reaction was carried out for 24 hours to obtain a solution containing polyamic acid. N-methylpyrrolidine (2.7 ml) and acetic anhydride (6.7 ml) were added to the solution containing the obtained polyamic acid, and the mixture was stirred at 75 ° C for 3 hours to carry out hydrazine imidization. After cooling to room temperature, it was poured into a large amount of methanol, and the polymer was separated by filtration. The obtained polymer was vacuum dried overnight at 60 ° C to become a white powder (13.1 g, 93%). Next, the obtained polymer was redissolved in N,N-dimethylacetamide (DM Ac ) to obtain a resin solution of 20% by mass. The resin solution was applied onto a substrate composed of polyethylene terephthalate (PET) using a squeegee (1 〇〇μηι pitch), dried at 100 ° C for 30 minutes, and dried at 150 ° C. After being used as a film for 60 minutes, it was peeled off from the PET substrate. Subsequently, the film was dried at 150 ° C under reduced pressure for 3 hours to obtain a film having a film thickness of 20 μm. The obtained polymer was subjected to measurement of a weight average molecular weight and a ruthenium iodide ratio in the same manner as in Example 1. The obtained polymer had a weight average molecular weight of 104,000, and the ruthenium iodide ratio (the ratio of lysine which was subjected to dehydration ring closure in all lysines) was 95%. The obtained film was subjected to structural analysis by IR (ATR method: film). As a result, the characteristic absorption of the carbonyl group was 1 73 5 cm·1 and 1 684 cm·1 (refer to Fig. 8). Further, as in Example 1, the solubility of the polymer in the organic solvent, the total light transmittance of the film, the YI 値, and the glass transition point were evaluated. The heat resistance test was carried out by subjecting the obtained film (side length 5 cm) to a hot air dryer maintained at 175 ° C for 12 hours, and performing a heat resistance accelerated test, and measuring the heat resistance test in the same manner as in the above (5). YI 値 of the film after. The results are shown in Table 1. -34- 200951178 [Example 〇] except that 9.36 g (22·8 mmol) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane was used as the component (B_1)' 〇· 26 g (1.2 mmol) of 2,2,-dimethylbenzidine as (B.2) component, 5.38 g-(24.0 mmol) of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride as The polymer (yield 13.2 g, yield 94%) and a film of a white powder were obtained in the same manner as in Example 9 except for (A). The obtained polymer was subjected to structural analysis, weight average molecular weight, and oxime amination rate in the same manner as in Example 9. As a result, the characteristic absorption of the carbonyl group was 173 km·1 and 1683 cm_1 (refer to Fig. 9), and the weight average molecular weight was 183,000 Å, and the amination ratio was 97%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 9. The results are shown in Table 1. [Example 11] except that 9.32 g (22.7 mmol) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane was used as the component (B-1), 0.25 g (1.2 mmol) Ear) 2,2'-dimethylbenzidine as component (B-2), 5.43 g (24.2 mmol) of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride as (eight) The same procedure as in Example 9 was carried out to obtain a white powdery polymer (yield: 13.2 g, yield: 94%) and a film. The obtained polymer was subjected to structural analysis, weight average molecular weight, and measurement of amination rate in the same manner as in Example 1. As a result, the characteristic absorption of the carbonyl group was 173 5 cm·1 and 1 683 (see Fig. 1A), the weight average molecular weight was 13 8,000, and the oxime imidization ratio was 93%. Further, evaluation was carried out as in Example 9. The physical properties of the obtained polymer and film were as follows. The results are shown in Table 1. [Example 12] except that 9.19 g (22.4 mmol) of 2,2-bis[4-(4-aminophenoxy)phenyl] was used. Propane as (Ed) component, 〇·25g (-35- 200951178 1.2 mM) 2,2'-dimethylbenzidine as component (B-2), 5.56 g (24.8 mmol) 2,3 5-methoxytricyclocyclopentyl acetic acid dianhydride was used as the (human) component, and the same as in Example 9 was used to obtain a white powder polymer (yield 12.8 g, yield 91%) and a film. The same as in Example 1. In the method, the obtained polymer was subjected to structural analysis, weight average molecular weight, and oxime imidization ratio. As a result, the characteristic absorption of the carbonyl group was 173 5 cm·1 and 1684 cm·1 (refer to FIG. 11), and the weight average molecular weight was 52,000. The oxime imidization ratio was 95%. Further, various physical properties of the obtained polymer and film were evaluated as in Example 9. The results are shown in Table 1. [Example 13] 2,2-bis[4-(4-aminophenoxy)phenyl]propane (6.47 g, 15.8 mmol) was added to a 300 ml 4-neck flask of a meter, a stirrer, a nitrogen inlet tube and a cooling tube. Next, after replacing the inside of the flask with nitrogen, N-methyl-2-pyrrolidone (hereinafter referred to as NMP) (90.0 g) was added and stirred until homogeneous. 2,3,5-tricarboxycyclopentyl group was allowed at room temperature. Acetic acid dianhydride (3.53 g, 15.8 mmol) was added to the obtained solution, and stirring was continued at this temperature for 24 hours to obtain a polyaminic acid solution. Next, N- was added to the obtained polyaminic acid solution. Methyl pyrrolidine (1-9 ml) and acetic anhydride (4.5 ml) were stirred for 5 hours at 75 ° C to carry out hydrazine imidization. After cooling to room temperature, pour into a large amount of methanol and separate by filtration. The polymer was vacuum dried overnight at 60 ° C to obtain a white powder (yield 9.20 g, yield: 97.5 mass%). Next, the obtained polymer was redissolved in N,N-dimethylacetamide ( In DMAc), a resin solution of 20% by mass was obtained. Next, the resin solution was applied using a squeegee 200951178 (ΙΟΟμηι pitch). The film was coated on a substrate made of polyethylene terephthalate (PET), dried at 1 ° C for 30 minutes, and then dried at 150 ° C for 60 minutes, and then peeled off from the PET substrate. The film was dried at 180 ° C for 8 hours under reduced pressure to obtain a film having a film thickness of 20 μm. 'The ring closure ratio (the imidization ratio) of the above polymer and the polyglycine and the above polymer were evaluated in the same manner as in Example 1. (weight average molecular weight of the polymer after hydrazide). The obtained imidization ratio of the polymer was φ 98%. Further, the weight average molecular weight of the polyamic acid was 4.0 Χ 105, and the weight average molecular weight of the obtained polymer (the polymer after hydrazide) was 5.2 χ 105. The total light transmittance and enthalpy (initial) of the film were evaluated in the same manner as in Example 1. Further, ΥΙ値 (after UV test) and water absorption were evaluated by the following methods. After the heat resistance test, the obtained film (side length 5 cm) was placed in a hot air dryer maintained at 150 ° C for 100 hours, and subjected to a heat resistance accelerated test, and measured in the same manner as in the above (5). Determine the YI値 of the film after the heat resistance test. The results are shown in Table 1. (10) YI 耐 after UV resistance test The obtained film (side length 5 cm) was placed in a QUV tester (accelerated weather resistance tester) using a UV fluorescent lamp UVA-.35 1 as a light source for 1 week. UV acceleration test. The YI 薄膜 of the film after the test was measured in the same manner as in the above (5). (1 1 ) Water absorption test The obtained film was cut into 3 pieces of 3 cm x 4 cm size 'under drying under reduced pressure at 18 (TC dried for 8 hours. After measuring the film quality, the film was immersed in distilled water of -37-200951178 at 25 ° C for 24 hours. The water droplets on the surface of the impregnated film are removed and the water absorption rate (% by mass) is calculated from the mass change before and after the impregnation. The water absorption rate is calculated as follows: Water absorption rate (%) = {[(mass after impregnation) + (impregnation) The former mass)]_1}χ100 [Example 14] A polymer composed of a white powder was obtained in the same manner as in Example 1 except that the amidation reaction temperature was 40 ° C and the reaction time was 48 hours (yield 9.20).克, yield: 97.5 mass%) and film. The ring closure ratio (醯imination rate) and weight average molecular weight of the obtained polymer were evaluated in the same manner as in Example 1. The yield of the obtained polymer was 95%. Further, the weight average molecular weight of the polyamic acid is 4. Ox 105, and the weight average molecular weight of the obtained polymer (the polymer after hydrazide) is 5.6 x 10 s. Further, the total light of the film is evaluated as in Example 13. Transmittance, YI 値 (initial The results after the heat resistance test, after the UV test, and the water absorption. The results are shown in Table 1. [Comparative Example 1] In addition to using 7.08 g (35_3 mmol) of 4,4'-diaminodiphenyl ether to replace the double [4] -(3-Aminophenoxy)phenyl]anthracene, and the amount of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, pyridine and acetic anhydride was changed to 7.92 g (35.3 mmol), respectively. The polymer obtained in a light brown powder (yield: 12.7 g, yield: 92.7%) and a film were obtained in the same manner as in Example 1 except for 11.4 ml and 10.0 ml. The structure of the obtained polymer was carried out in the same manner as in Example 1. The analysis and the measurement of the weight average molecular weight. As a result, the characteristic absorption of the carbonyl group was 1 739 cm·1 and 1 689 cnT1 (see Fig. 12 of 200951178), and the weight average molecular weight was 295,000. The yield of the obtained polymer was 92%. Further, the ruthenium iodization ratio was calculated from the ratio of the sulphonic acid NH signal of 1H-NMR to the aromatic ring hydrogen signal. Further, various physical properties of the obtained polymer and film were evaluated as in Example 1. The results are shown in Table 1. - [Comparative Example 2] In place of the use of 4.88 g (24.6 mM) butane tetracarboxylic dianhydride instead of Example 4 2,3,5-tricarboxycyclopentyl acetic acid dianhydride, and the amount of 2,2·bis[4-(4-aminophenoxy)phenyl]propane, pyridine and ethylene φ anhydride The polymer was white powder (yield 13.3 g, yield 94.0%) and a film was obtained in the same manner as in Example 4 except that it was changed to 10.12 g (24.6 mmol), 8.0 ml, 7.0 ml, and was obtained in the same manner as in Example 1. In the method, the obtained polymer was subjected to structural analysis and measurement of weight average molecular weight. As a result, the characteristic absorption of the carbonyl group was ITSIcrrr1 and 1705 (refer to Fig. 13), and the weight average molecular weight was 120,000. The obtained imidization ratio of the polymer was 96%. Further, the oxime imidization ratio was 1H-NMR. The kinetic acid NH signal was calculated from the aromatic ring hydrogen signal ratio. Further, φ was evaluated for various physical properties of the obtained polymer and film as in Example 1. The results are shown in Table 1. [Comparative Example 3] except that 4.85 g (24.7 m) was used. Mole) cyclobutane tetracarboxylic acid. The acid dianhydride replaces the 2,3,5-tricarboxycyclopentyl acetic acid dianhydride used in Example 4, and 2,2-bis[4-(4-aminobenzene) The compounding amount of oxy)phenyl]propane, pyridine, and acetic anhydride was changed to 10.15 g (24.7 mmol), 8.0 ml, and 7.0 ml, respectively, and the polymer was prepared in the same manner as in Example 4, but the oxime imidization was carried out. The polymer was precipitated, so the above structural analysis was not carried out -39- 200951178 [Table 1] Solubility total light transmittance (%): Υΐ値Refractive index Tg Y YI値 after UV test γι値Tensile strength (MPa) Tensile elongation (%) Tensile modulus (GPa) Water absorption (%) Example 1 〇89.9 1.0 1.602 259 1.3 - 95 20 2.6 Example 2 〇 88.9 0.6 1.604 326 0.8 - 112 68 2.7 Example 3 〇 88.9 0.8 1.605 300 1.0 - 103 34 2.7 - Example 4 〇 89.1 0.9 1.605 280 1.2 - 127 100 2.7 - Example 5 〇89.1 1.1 1.604 275 1.4 - 107 95 2.6 - Example 6 〇89.2 0.5 1.604 325 0.6 - 108 66 2.7 - Example 7 〇89.1 0.5 1.603 325 0.7 - 105 59 2.7 - Example 8 〇89.5 0J 1.605 282 0.9 - 132 101 2.7 - Example 9 〇90 0.4 - 277 0.7*1 - - - - - Example 10 〇89 0.6 - 280 1.1*1 - - - - - Example 11 〇89 0.5 - 280 0.9*1 - - - - - Example 12 〇89 0.6 - 277 1.0*1 - - - - Reference Example 13 - 89 0.9 - 1.8*2 1.8 - - - 2.4 Example 14 - 89 0.9 - - 2.0*1 2.0 - - - 2.7 Comparative Example 1 〇87.8 3.0 1.604 >350 3.6 - 93 42 2.7 - Comparative Example 2 〇88.0 1.5 1.608 232 2.1 - 100 5 3.4 - Comparative Example 3 X - Milk heat-resistant fiber condition (i75r, 12 hours) * Heat resistance test conditions (15 〇°C, 100 hours) From Table 1, it can be understood that according to the present invention, polyimine has excellent solubility in organic solvents, and does not need to be A film (having excellent formability) can be formed by heat treatment at a temperature (for example, about 400 ° C), and the total light transmittance (transparency) of the obtained film is high, and YI 値 (yellowness) is obtained in addition to -40 to 200951178. It is also low after the heat resistance test, has a high refractive index, and has a high Tg and is excellent in heat resistance. From Examples 6 to 8 of Table 1, it can be understood that, according to the present invention, 'polyimine synthesized by a specific monomer of a specific molar ratio is a full light transmission.

率(透明性)高,Tg高而耐熱性優異,耐熱試驗後之YI 値(黃色度)亦低而非著色性極爲優異。又,由表1之實 施例9〜12,可了解依據本發明,使(A)特定之醯基化合 φ 物與(B)特定之芳香族二胺化合物(反應性不同之兩種 芳香族二胺化合物)反應而成之聚醯亞胺等由於對有機溶 劑具有優異之溶解性,因此不須在高溫(例如,400°C左 右)下進行熱處理即可形成薄膜(具有優異之成形性), 又’所得薄膜爲全光線透過率(透明性)高,Tg高而耐 熱性優異,即使比實施例1~8進行更高溫之耐熱試驗後, ΥΪ値(黃色度)亦低,而非著色性極爲優異。尤其,使 (A)成分與(B)成分在特定之莫耳比反應而成之聚醯亞 Ο 胺等(進而爲使(B-1 )成分與(B-2 )成分之莫耳比在特 定範圍內而成之聚醯亞胺等)可獲得耐熱性或耐熱試驗後 之YI値優異之結果。又,自表1之實施例13、14,可了 - 解依據本發明,由於使用特定之觸媒,因此可在比以往低 之溫度下進行醯亞胺化。又,所得聚醯亞胺由於對有機溶 劑具有優異之溶解性,因此不須在高溫(例如,40(TC左 右)下進行熱處理即可形成薄膜。而且,由表1,可了解 本發明之薄膜(實施例1〜4 )爲透明性(全光線透過率) 高’又,薄膜剛形成時及耐UV試驗後之黃變均少,而且 -41 - 200951178 吸水率低。再者,可了解即使比實施例1〜8進行更長時間 之耐熱試驗後,YI値(黃色度)亦低而非著色性極爲優 異。另一方面,使用4,4’-二胺基二苯基醚替代(B)成分 之比較例1在薄膜剛形成後,以及耐熱試驗後之YI値均 高,可知並不適用於光學構件。使用環丁烷四羧酸二乾替 代(A)成分之比較例3爲醯亞胺對有機溶劑之溶解性低 ,溶劑中析出聚醯亞胺,可知無法形成薄膜。比較例2中 可知雖可形成薄膜,但所得薄膜之Tg低,且耐熱性不良 【圖式簡單說明】 圖1顯示以實施例1獲得之聚合物之IR光譜圖。 圖2顯示以實施例2獲得之聚合物之IR光譜圖。 圖3顯示以實施例3獲得之聚合物之IR光譜圖。 圖4顯示以實施例4獲得之聚合物之IR光譜圖。 圖5顯示以實施例6獲得之聚合物之IR光譜圖。 圖6顯示以實施例7獲得之聚合物之IR光譜圖。 圖7顯示以實施例8獲得之聚合物之IR光譜圖。 圖8顯示以實施例9獲得之聚合物之IR光譜圖。 圖9顯示以實施例10獲得之聚合物之IR光譜圖。 圖10顯示以實施例11獲得之聚合物之IR光譜圖。 圖11顯示以實施例12獲得之聚合物之IR光譜圖。 圖12顯示以比較例1獲得之聚合物之IR光譜圖。 圖13顯示以比較例2獲得之聚合物之IR光譜圖。 -42 -The rate (transparency) is high, the Tg is high, and the heat resistance is excellent, and the YI 値 (yellowness) after the heat resistance test is also low, and the coloring property is extremely excellent. Further, from Examples 9 to 12 of Table 1, it is understood that (A) a specific thiol compound φ substance and (B) a specific aromatic diamine compound (two kinds of aromatic two having different reactivity) according to the present invention Since the polyimide compound obtained by the reaction of the amine compound has excellent solubility in an organic solvent, it is not necessary to heat-treat at a high temperature (for example, about 400 ° C) to form a film (having excellent formability). Further, the obtained film had high total light transmittance (transparency), high Tg, and excellent heat resistance, and even after heat resistance test at a higher temperature than Examples 1 to 8, the ΥΪ値 (yellowness) was low, and the coloring property was not. Extremely excellent. In particular, a polyaryleneamine obtained by reacting the component (A) with the component (B) at a specific molar ratio (further, the molar ratio of the component (B-1) to the component (B-2) is A polyimine or the like which is formed within a specific range) is excellent in heat resistance or YI値 after heat resistance test. Further, from Examples 13 and 14 of Table 1, it can be understood that according to the present invention, since a specific catalyst is used, oxime imidization can be carried out at a lower temperature than in the prior art. Further, since the obtained polyimine has excellent solubility in an organic solvent, it is not necessary to heat-treat at a high temperature (for example, about 40 (TC or so)). Further, from Table 1, the film of the present invention can be understood. (Examples 1 to 4) The transparency (total light transmittance) was high, and the yellowing of the film immediately after formation and after the UV test was small, and the water absorption rate was low from -41 to 200951178. Further, it can be understood that even if it is implemented After the heat resistance test for a longer period of time in Examples 1 to 8, the YI 値 (yellowness) was also low rather than the coloring property. On the other hand, the (B) component was replaced with 4,4'-diaminodiphenyl ether. Comparative Example 1 was found to be not suitable for optical members immediately after the formation of the film and after the heat resistance test, and Comparative Example 3 using the cyclobutane tetracarboxylic acid as the dry component instead of the component (A) was ruthenium imine. The solubility in an organic solvent was low, and polyimine was precipitated in a solvent, and it was found that a film could not be formed. In Comparative Example 2, it was found that a film could be formed, but the obtained film had a low Tg and poor heat resistance [Simplified illustration] Fig. 1 The polymer obtained in Example 1 is shown IR spectrum chart Figure 2 shows an IR spectrum of the polymer obtained in Example 2. Figure 3 shows an IR spectrum of the polymer obtained in Example 3. Figure 4 shows the IR spectrum of the polymer obtained in Example 4. Fig. 5 shows an IR spectrum of the polymer obtained in Example 6. Fig. 6 shows an IR spectrum of the polymer obtained in Example 7. Fig. 7 shows an IR spectrum of the polymer obtained in Example 8. Figure 8 shows an IR spectrum of the polymer obtained in Example 9. Figure 9 shows an IR spectrum of the polymer obtained in Example 10. Figure 10 shows an IR spectrum of the polymer obtained in Example 11. Figure 11 The IR spectrum of the polymer obtained in Example 12 is shown. Figure 12 shows the IR spectrum of the polymer obtained in Comparative Example 1. Figure 13 shows the IR spectrum of the polymer obtained in Comparative Example 2. -42 -

Claims (1)

200951178 七、申請專利範圍: 1.一種聚醯亞胺系材料,其特徵爲由使下列反應獲得 之聚醯胺酸及/或聚醯亞胺所組成: (A) 選自由以下述式(1)表示之2,3,5-三羧基環戊 基乙酸、以下述式(2)表示之2,3,5-三羧基環戊基乙酸 二酐,及該等之反應性衍生物組成之群組之至少一種醯基 化合物,與 (B) 以下述式(3)表示之芳香族亞胺基形成化合物 [化1]200951178 VII. Patent application scope: 1. A polyamidene-based material characterized by polyamic acid and/or polyimine obtained by the following reaction: (A) is selected from the following formula (1) And 2,3,5-tricarboxycyclopentyl acetic acid, 2,3,5-tricarboxycyclopentyl acetic acid dianhydride represented by the following formula (2), and a group consisting of the reactive derivatives a group of at least one mercapto compound, and (B) an aromatic imine group represented by the following formula (3) to form a compound [Chemical Formula 1] ⑴ [化2](1) [Chemical 2] ⑵ [化3](2) [Chemical 3] ⑶ (式(3)中,X 爲-NH2 或-N = C = 0、-NHSi(R25)(R26)(R27) ,Y 爲選自直接鍵、-CH2-、-0-、-S-、-C(CH3)2-之一基, Z 爲選自直接鍵、-CH2-、-〇_、-s-、-C(CH3)2-、>C = 0、-S02- 之一基,R1〜R1 6各獨立爲選自氫、烷基、乙烯基、芳基' 鹵素之基’R25~R27各獨立爲碳數1~15之烷基)。 -43- 200951178 2.如申請專利範圍第1項之聚醯亞胺系材料,其中上 述(Β)芳香族亞胺基形成化合物爲上述式(3)中,鍵結 基X、Υ及Ζ全部爲以對位鍵結所成之化合物。 3_如申請專利範圍第1或2項之聚醯亞胺系材料,其 中聚醯胺酸及/或聚醯亞胺之換算成聚苯乙烯之重量平均 分子量爲50,000〜500,000。 4. 如申請專利範圍第1至3項中任一項之聚醯亞胺系 材料,其中聚醯胺酸及/或聚醯亞胺爲使(Α)醯基化合物 與(Β)芳香族亞胺基形成物之莫耳比((Α)醯基化合物 :(Β )芳香族亞胺基形成物)成爲1.000:0.960-1.000:0.995 之方式反應而獲得。 5. 如申請專利範圍第1至4項中任一項聚醯亞胺系材 料,其中聚醯胺酸及/或聚醯亞胺,係進而與由哈曼( Hammett)法則所得之取代基常數之合計σ (其中該合計σ 係爲以胺基作爲基準,不含胺基本身之取代基常數者)爲 超過-0.11、2.0以下之範圍內之芳香族二胺化合物作爲芳 香族亞胺基形成化合物反應而得。 6. —種聚醯亞胺系樹脂組成物,其特徵爲含有申請專 利範圍第1至5項中任一項之聚醯亞胺系材料及有機溶劑 〇 7. —種聚醯亞胺薄膜,其特徵爲含有申請專利範圍第 1至5項中任一項之聚醯亞胺系材料。 8. 如申請專利範圍第7項之聚醯亞胺薄膜,其係用於 光學構件。 -44- 200951178 9·如申請專利範圍第7項之聚醯亞胺薄膜,其係用於 印刷電路用基板。 10.—種聚醯亞肢系材料之製造方法,其特徵爲包含 下列步驟:使(Α)選自由以下述式(;!)表示之2,3,5_三 - 羧基環戊基乙酸、以下述式(2)表示之2,3,5 -三羧基環 戊基乙酸二酐、及該等之反應性衍生物組成之群組之至少 一種醯基化合物,與 0 (Β)以下述式(3)表示之芳香族亞胺基形成化合物 9 在有機溶劑中反應,獲得聚醯胺酸之步驟’及使該聚 醯胺酸之至少一部份醯亞胺化之步驟, [化1] H〇〇C^/\^COOH ΛΤ (l) HOOC^一\^-co〇H [化2](3) (In the formula (3), X is -NH2 or -N = C = 0, -NHSi(R25)(R26)(R27), Y is selected from a direct bond, -CH2-, -0-, -S- And one of -C(CH3)2-, Z is one selected from the group consisting of a direct bond, -CH2-, -〇_, -s-, -C(CH3)2-, >C = 0, -S02- The groups R1 to R1 6 are each independently selected from the group consisting of hydrogen, an alkyl group, a vinyl group, and an aryl group "R25 to R27, each independently having an alkyl group having 1 to 15 carbon atoms". -43-200951178 2. The polyimide-based material according to claim 1, wherein the (in) aromatic imine group-forming compound is in the above formula (3), and the bonding group X, hydrazine and hydrazine are all It is a compound formed by a para-bonding. 3_ A polyimide-based material according to claim 1 or 2, wherein the polyamine and/or the polyimine are converted to polystyrene having a weight average molecular weight of 50,000 to 500,000. 4. The polyimide-based material according to any one of claims 1 to 3, wherein the poly-proline and/or the polyimine are (使) mercapto compounds and (Β) aromatic sub- The molar ratio of the amine group formation ((Α) mercapto compound: (Β) aromatic imine group former) is obtained by reacting in a manner of 1.000:0.960 to 1.000:0.995. 5. A polyimide-based material according to any one of claims 1 to 4, wherein the polyaminic acid and/or polyimine is further substituted with a substituent constant obtained by Hammett's law. The total σ (wherein the total σ is an amine group as a reference, and the substituent constant of the amine-free body is not included) is an aromatic diamine compound in an amount exceeding -0.11 and 2.0 or less as an aromatic imine group. The compound is obtained by reaction. 6. A polyimine-based resin composition, characterized by comprising the polyimide-based material of any one of claims 1 to 5 and an organic solvent 〇. It is characterized by containing the polyimide-based material of any one of claims 1 to 5. 8. A film of a polyimide film according to item 7 of the patent application, which is used for an optical member. -44- 200951178 9. The polyimine film according to item 7 of the patent application is used for a substrate for a printed circuit. 10. A method for producing a polythene sublimine material, characterized by comprising the step of: (Α) selected from 2,3,5-tris-carboxycyclopentylacetic acid represented by the following formula (;!), The at least one mercapto compound of the group consisting of 2,3,5-tricarboxycyclopentyl acetic acid dianhydride represented by the following formula (2) and the reactive derivative thereof, and 0 (Β) are represented by the following formula (3) a step of reacting the aromatic imine group forming compound 9 in an organic solvent to obtain a polyproline, and a step of imidating at least a portion of the polyamic acid, [Chemical Formula 1] H〇〇C^/\^COOH ΛΤ (l) HOOC^一\^-co〇H [Chemical 2] ❿ 1 ⑵ β [化3]❿ 1 (2) β [Chemical 3] (式(3 )中,X 舄·Νη2 或 _N = C = 〇、_NHSi(R2 5)(R26)(R2 7) ,Y 爲選自直接鍵、_CH2_、-〇-、-s-、-C(CH3)2-之一基, Z 爲選自直接鍵、、ch2_、_〇_、-S-、-C(CH3)2-、>c = 0、-S〇2- -45- 200951178 之一基,rLr1 6各獨立爲選自氫、烷基、乙烯基、芳基、 鹵素之基,R25〜R27各獨立爲碳數1~15之烷基)。 11. 如申請專利範圍第10項之聚醯亞胺系材料之製造 方法,其中聚醯胺酸之至少一部份係在脂環族三級單胺之 存在下予以醯亞胺化。 12. 如申請專利範圍第11項之聚醯亞胺系材料之製造 方法,其中上述脂環族三級單胺爲以下述式(6)表示之 化合物: [化4](In equation (3), X 舄·Νη2 or _N = C = 〇, _NHSi(R2 5)(R26)(R2 7) , Y is selected from direct bonds, _CH2_, -〇-, -s-, - C(CH3)2- is a group selected from the group consisting of a direct bond, ch2_, _〇_, -S-, -C(CH3)2-, >c = 0, -S〇2- -45- 200951178 One of the groups, rLr1 6 is independently selected from the group consisting of hydrogen, alkyl, vinyl, aryl, and halogen, and R25 to R27 are each independently an alkyl group having 1 to 15 carbon atoms. 11. The method of producing a polyimide-based material according to claim 10, wherein at least a portion of the poly-proline is ruthenium imidized in the presence of an alicyclic tertiary monoamine. 12. The method for producing a polyimide-based material according to claim 11, wherein the alicyclic tertiary monoamine is a compound represented by the following formula (6): [Chemical 4] (式(6)中,R爲碳數1~4之院基,X爲氧原子或硫原 子,1爲0或l,m及η各獨立爲0〜2之整數)。 13. 如申請專利範圍第11或12項之聚醯亞胺系材料 之製造方法,其進而使用選自由乙酸酐、丙酸酐、苯甲酸 〇 酐之任一種酸酐、相當於該等酸酐之醯氯類、及碳二酸亞 胺化合物組成之群組之至少一種脫水劑。 14. 一種聚醯亞胺薄膜之製造方法,其特徵爲包含將 - 含有申請專利範圍第10至13項中任—項之方法獲得之聚 ' 醯亞胺系材料及有機溶劑之溶液塗佈在基板上形成塗膜& 步驟,及自該塗膜藉由蒸發去除而除去上述有機溶劑,獲 得聚醯亞胺薄膜之步驟。 -46 -(In the formula (6), R is a hospital group having a carbon number of 1 to 4, X is an oxygen atom or a sulfur atom, 1 is 0 or 1, and m and η are each independently an integer of 0 to 2). 13. The method for producing a polyimide-based material according to claim 11 or 12, which further comprises using an acid anhydride selected from the group consisting of acetic anhydride, propionic anhydride, and phthalic anhydride, and hydrazine chloride corresponding to the acid anhydride At least one dehydrating agent of the group consisting of: and a carbodiimide compound. A method for producing a polyimide film, comprising: coating a solution of a poly' fluorene-based material obtained by the method of any one of claims 10 to 13 and an organic solvent; A coating film & step is formed on the substrate, and the organic solvent is removed from the coating film by evaporation to obtain a polyimide film. -46 -
TW98108946A 2008-03-19 2009-03-19 Polyimide material, polyimide film, method for producing the polyimide material and method for producing the polyimide film TW200951178A (en)

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CN112048062A (en) * 2019-06-05 2020-12-08 河北寰烯科技有限公司 Preparation of polyimide by catalyzing dehydration of polyamic acid with choline chloride-urea eutectic solvent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112048062A (en) * 2019-06-05 2020-12-08 河北寰烯科技有限公司 Preparation of polyimide by catalyzing dehydration of polyamic acid with choline chloride-urea eutectic solvent
CN112048062B (en) * 2019-06-05 2022-05-06 河北寰烯科技有限公司 Preparation of polyimide by catalyzing dehydration of polyamic acid with choline chloride-urea eutectic solvent

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