200950617 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種軟性電路板結合結構，尤指一種 可降低軟性電路板焊接時對位時間，並可達到防止軟性電 路板紐路等雙重效果之軟性電路板結構。 ❹ ❹ 【先前技術】 請參閱第一圖所示一種習知軟性電路板，該第一軟性 電路板ίο可與第二圖所示之第二電路板2〇相互焊接，通 常’ 6玄第二電路板20也可為一軟性電路板；該第一軟性電 路板10及第二電路板20相對應處分別設有複數焊接部u 及焊墊21，為使該焊接部U及诨墊21準確對位於該第 -電路板2G上没有至少-第—對位線22，將該第一軟性 電路板U)之焊接部丨丨放置於該第二電路板2G對應之焊塾 21，且該第-軟性電路板10之頂緣與該第一對位線22對 齊後’即可進行_，使該第—軟性電路板1()鮮二電路 板20相互連結形成電性導通，如第三圖所示；其次，為避 免造成短路’㈣再於該焊接部u及焊墊21相互焊接之 =蓋絕緣膠帶’如第三圖所示’於該第二電路板2〇之 =外圍設有至少一第二對位線23，該第二對位㈣ 之机圍必須可完王覆蓋該焊接部u及焊墊21 ; 二對：線23之範圍剪裁相對應尺寸之絕緣膠帶 = 圖;I絕緣膠帶3G貼設於該焊接部11及焊 塾21上，即<避免該焊接部11及料21外露所可能導致 200950617 之短路問題，同時，亦可避免該焊接部n及焊墊21於客 戶端進行電子裝置（如手機）組裝時，與電子裝置内其他元 件接觸所產生之短路問題。根據上述步驟可知，該第一軟 ί·生電路板10與该第二電路板20之焊接及防止短路製程， 必頊經過兩次對位，以及花費裁切絕緣膠帶之時間，不僅 耗費工時及人力，生產效率無法有效提升，且因為製程繁 複’也使得生產不良率提高。 【發明内容】 有鑑於習知技術之缺失，本發明之目的在於提出一種 生電路板結合結構，可降低軟性電路板焊接時對位時 i並可達到防止軟性電路板短路等雙重效果，可降低作 茶時間’提升產品良率。 Ο ^達到上述目的’本發明提出一種軟性電路板結合結 拍却/、包含一第一軟性電路板、一第二軟性電路板及一反 且該第一軟性電路板與該第一軟性電路板相互焊 部知Γ該反折部連伸於該第—軟性電路板—侧’且該反折 2蓋於該第—軟性電路板與該第二軟性電路板相互 為使貴審查委員對於本發明之結構目的和功效有更 進—步之了解與認同，茲配合圖示詳細說明如后。 【實施方式】 以下將參照隨附之圖式來描述本發明為達成目的所使 200950617 用的技術手段與功效，而以下圖式所列舉之實施例僅為辅 助說明，以利貴審查委員瞭解，但本案之技術手段並不限 於所列舉圖式。 請參閱第五圖所示，本發明提供之軟性電路板結構 40，其包含一第一軟性電路板41以及一具透明性之反折部 42，該第一軟性電路板41與該反折部42之間可以晝線、 衝壓或破孔等方式形成一折線43，以利該反折部42以該 折線43為基準被翻折；該第一軟性電路板41具有至少一 ❹ 焊墊411以及一電路412;該反折部42除具有透明性之外， 也具有絕緣性，可採用Pl(Polyimide)塑膠薄膜，其係設 置於該第一軟性電路板41 一側，且於該反折部42外侧兩 端角處設有焊墊421，利用軟性電路板可彎折之特性，於 本實施例中，該反折部42係與該第一軟性電路板41 一體 成型，且該反折部42係該第一軟性電路板41之基板延伸 而出。此外，該軟性電路板結構40通常配合有一保護膜 50，如第六圖所示，該保護膜50為絕緣材質，其形狀及尺 ❹ 寸依實際所配合之軟性電路板尺寸，以需要覆蓋之電路範 圍所需而設計；如第七圖所示，將該保護膜50貼附於該軟 性電路板結構40上，可覆蓋該第一軟性電路板41之電路 412，以提供保護作用。 請參閱第八圖所示一種可與上述該軟性電路板結構40 相互焊接之第二軟性電路板之平面結構，該第二軟性電路 板60上設有複數焊墊61、62，其中該複數焊墊61係對應 於該第一軟性電路板41之焊墊411設置，至於其他複數焊 墊62之作用將說明於後。 200950617 如第九圖所示’將該軟性電路板結構40擺放於該第二 軟性電路板60上，該第一軟性電路板41之焊墊411可與 β亥第一軟性電路板6〇之焊墊61--對應；由於該反折部 42具有透明性，因此可透視到該第二軟性電路板上之 其他焊墊、元件或線路（圖中未示出），有利於對位，亦可 於°玄第—軟性電路板60上設置對位線，由於該軟性電路板 結構=係結合第一軟性電路板41及反折部“，因此僅需 要^人對位即可；當對位完成後，即可對坪墊411與對應 之焊塾61進行焊接，使該第—軟性電路板41與第二軟性 電路板60 SI定連接，如第九圖所示；接著再將該反折部 =以該折線43為基準朝向該第一軟性電路板41翻折，使 忒反折部42覆蓋該第一軟性電路板41與該第二軟性電路 板60相互焊接之部位，亦即該焊墊411與對應之焊墊61 上如第十圖所示，同時，該反折部42所設置之焊墊421 可對應貼靠於該第二軟性電路板之焊墊Μ上，即可將 該焊墊421、62相互焊接，使該反折部42被定位於該第二 ❹ 軟性電路板60上，不致被掀開。 必須說明的是，於本實施例中，該反折部42之外型概 成矩形，然實際並不限定於此，其設計原則在於能夠完全 覆盖§亥第一軟性電路板41與該第二軟性電路板6〇相互焊 接之部位即可；此外，該反折部42之焊墊421所設置之位 置及其數量亦不限，於本實施例中，該焊墊421係分別設 置於該反折部42外侧兩邊角上各一個，然可依實際該反折 部42之尺寸、形狀，以及該第二軟性電路板60之零件及 走線分佈狀況，設計所需之該焊墊421數量及位置。 200950617 綜上所述，本發明所提供之軟性電路板結合結構，於 軟性電路板延伸設置一塊反折片，即可降低軟性電路板焊 接時對位時間，並可達到防止軟性電路板短路等雙重效 果’更可降低作業時間，提升產品良率。 ❹ Ο 惟以上所述者，僅為本發明之實施例而已，當不能以 之限定本發明所實施之範圍。即大凡依本發明申請專利範 作之均㈣化與修飾，皆應仍屬於本發明專利涵蓋之 粑圍内’謹請貴審查委員明鑑，並祈惠准，是所至禱。 【圖式簡單說明】 ir圖係習知―種軟性電路板之平面結構示意圖。 面結構;習知—種可與第-圖相互焊接之電路板之平 板軟性電路板焊接於第二圖所示電路 示音圖。圖係於第所示結構貼設絕緣膠帶之平面結構 發軟性電路板實施例之立體結構圖。 第發明之保護膜實施例之立體結構圖。 性電ί板：==二示該保護膜貼附於第五圖所示該軟 示意=圖係本發明之第二軟性電路板實施例之平面結構 第九圖係本發明$ # ^ I, ^ , Λ 相互焊接之平面結軟性電路板與軟性電路板結構 墙 ^ 、思、圖。 圖係將將本發明之反折片翻折且與第八圖所示第 9 200950617 二軟性電路板相互焊接之平面結構示意圖。 【主要元件符號說明】 先前技術： ίο-第一軟性電路板 Π-焊接部 20- 第二電路板 21- 焊墊 ❿ 22-第一對位線 23-第二對位線 30-絕緣膠帶 本發明： 40- 軟性電路板結構 41- 第一軟性電路板 411- 焊墊 412- 電路 42- 反折部 421-焊墊 43_折線 50-保護膜 60-第二軟性電路板 61、62-焊墊200950617 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a flexible circuit board bonding structure, and more particularly to a method for reducing the alignment time of a flexible circuit board during soldering, and to prevent the soft circuit board from being doubled. The soft board structure of the effect.先前 ❹ [Prior Art] Please refer to the conventional flexible circuit board shown in the first figure. The first flexible circuit board can be soldered to the second circuit board 2 shown in the second figure, usually '6 Xuan second. The circuit board 20 can also be a flexible circuit board; the first flexible circuit board 10 and the second circuit board 20 are respectively provided with a plurality of soldering portions u and pads 21, so that the soldering portions U and the mats 21 are accurate. The soldering portion 将该 of the first flexible circuit board U) is placed on the first circuit board 2G, and the soldering portion 21 corresponding to the second flexible circuit board 2G is placed on the first circuit board 2G. - the top edge of the flexible circuit board 10 is aligned with the first pair of bit lines 22, and then the first flexible circuit board 1 can be electrically connected to each other, as shown in the third figure. Secondly, in order to avoid causing a short circuit '(4) and then the soldering portion u and the bonding pad 21 are soldered to each other = the cover insulating tape 'as shown in the third figure' is provided on the second circuit board 2 a second pair of bit lines 23, the machine of the second pair (4) must be covered by the soldering portion u and the pad 21; In the range of 23, the corresponding size of the insulating tape is cut = Fig. 1; the insulating tape 3G is attached to the welded portion 11 and the soldering iron 21, that is, <preventing the soldering portion 11 and the material 21 from being exposed may cause a short circuit problem of 200950617, At the same time, it is also possible to avoid the short circuit problem caused by the soldering portion n and the solder pad 21 contacting the other components in the electronic device when the electronic device (such as a mobile phone) is assembled at the client. According to the above steps, the soldering of the first flexible circuit board 10 and the second circuit board 20 and the short circuit prevention process must be performed twice, and the time required for cutting the insulating tape is not only time-consuming. And manpower, production efficiency can not be effectively improved, and because of the complicated process, it also increases the production defect rate. SUMMARY OF THE INVENTION In view of the lack of the prior art, the object of the present invention is to provide a raw circuit board bonding structure, which can reduce the double effect of the flexible circuit board when it is aligned, and can prevent the short circuit of the flexible circuit board, and can reduce the double effect. Tea time 'improves product yield. Ο ^To achieve the above objective' The present invention provides a flexible circuit board combined with a slap but/including a first flexible circuit board, a second flexible circuit board, and a first flexible circuit board and the first flexible circuit board The mutual soldering portion knows that the folding portion extends to the first flexible circuit board side, and the folding portion 2 covers the first flexible circuit board and the second flexible circuit board to make the review board for the present invention The purpose and function of the structure have a more in-depth understanding and recognition, as detailed in the diagram below. [Embodiment] The technical means and effects of the present invention for the purpose of achieving the purpose of 200950617 will be described with reference to the accompanying drawings, and the embodiments listed in the following figures are only for the purpose of explanation, but are appreciated by the reviewing committee, but The technical means of this case are not limited to the illustrated figures. Referring to FIG. 5, the flexible circuit board structure 40 of the present invention comprises a first flexible circuit board 41 and a transparent reverse-folding portion 42, the first flexible circuit board 41 and the reverse folding portion. A fold line 43 may be formed between the 42 by twisting, stamping or breaking holes, so that the folded portion 42 is folded over the fold line 43; the first flexible circuit board 41 has at least one solder pad 411 and a circuit 412; the inflection portion 42 is insulative in addition to transparency, and a Pl (Polyimide) plastic film is disposed on the side of the first flexible circuit board 41, and the reverse portion is 42 is provided with a soldering pad 421 at the outer end corners, and the flexible circuit board can be bent. In the embodiment, the folding portion 42 is integrally formed with the first flexible circuit board 41, and the folding portion is formed. 42 is a substrate from which the first flexible circuit board 41 extends. In addition, the flexible circuit board structure 40 is generally provided with a protective film 50. As shown in the sixth figure, the protective film 50 is made of an insulating material, and its shape and size are in accordance with the actual flexible circuit board size. The circuit range is designed as needed; as shown in the seventh figure, the protective film 50 is attached to the flexible circuit board structure 40 to cover the circuit 412 of the first flexible circuit board 41 to provide protection. Referring to FIG. 8 , a planar structure of a second flexible circuit board that can be soldered to the flexible circuit board structure 40 is provided. The second flexible circuit board 60 is provided with a plurality of pads 61 , 62 , wherein the plurality of solders are The pads 61 are disposed corresponding to the pads 411 of the first flexible circuit board 41, and the functions of the other plurality of pads 62 will be described later. 200950617 As shown in the ninth figure, the flexible circuit board structure 40 is placed on the second flexible circuit board 60, and the pad 411 of the first flexible circuit board 41 can be combined with the first flexible circuit board 6. Solder pad 61--corresponding; since the folded-back portion 42 has transparency, it can see through to other pads, components or lines (not shown) on the second flexible circuit board, which is advantageous for alignment, The alignment line can be disposed on the sinusoidal-flexible circuit board 60. Since the flexible circuit board structure is combined with the first flexible circuit board 41 and the reverse folding portion, only the alignment is required; when the alignment is performed After completion, the pad 411 and the corresponding soldering iron 61 can be soldered to connect the first flexible circuit board 41 with the second flexible circuit board 60, as shown in the ninth figure; The portion is folded toward the first flexible circuit board 41 with reference to the fold line 43 so that the folded portion 42 covers the portion where the first flexible circuit board 41 and the second flexible circuit board 60 are welded to each other, that is, the solder The pad 411 and the corresponding pad 61 are as shown in the tenth figure, and at the same time, the pad of the folding part 42 is provided. The 421 can be placed on the solder pad of the second flexible circuit board, and the pads 421 and 62 can be soldered to each other, so that the folded portion 42 is positioned on the second flexible circuit board 60. It should be noted that, in this embodiment, the shape of the folded-back portion 42 is rectangular, but the actual design is not limited thereto, and the design principle is that the first flexible circuit board 41 can be completely covered. The portion of the second flexible circuit board 6 焊接 is soldered to each other; the position and the number of the pads 421 of the folded portion 42 are not limited. In the embodiment, the pads 421 are respectively The one of the two corners of the outer side of the reflexing portion 42 is disposed, and the required welding is designed according to the size and shape of the reflexing portion 42 and the distribution of the components and the wiring of the second flexible circuit board 60. The number and position of the pads 421. 200950617 In summary, the flexible circuit board combined structure provided by the present invention can reduce the alignment time of the flexible circuit board when the flexible circuit board is extended with a reverse folding piece, and can prevent the prevention. Double effect of soft circuit board short circuit 'It can reduce the working time and improve the product yield. ❹ 惟 However, the above is only the embodiment of the present invention, and the scope of the present invention cannot be limited thereto. The average (four) and the modification should still belong to the scope of the patent covered by the invention. 'Please ask your review board member for the examination, and pray for it. It is the prayer. [Simple diagram] ir diagram is a customary Schematic diagram of the planar structure of the flexible circuit board. Surface structure; conventionally, a flat flexible circuit board of a circuit board that can be soldered to the first figure is soldered to the circuit diagram shown in the second figure. A perspective view of a structure of a flexible circuit board having a planar structure of an insulating tape. A perspective view of a protective film embodiment of the first invention. The electric board:==2 shows the protective film attached to the soft figure shown in the fifth figure=Fig. The second structure of the second flexible circuit board embodiment of the present invention is the ninth figure of the present invention, $#^I, ^ , 平面 Welded planar junction soft circuit board and flexible circuit board structure wall ^, thinking, diagram. The figure is a schematic view of a planar structure in which the anti-folding sheet of the present invention is folded and welded to the second flexible circuit board of the 9th 200950617 shown in FIG. [Main component symbol description] Prior art: ίο-first flexible circuit board Π-welding portion 20-second circuit board 21-pad ❿ 22-first pair of bit lines 23-second alignment line 30-insulation tape Invention: 40- Flexible circuit board structure 41 - First flexible circuit board 411 - Solder pad 412 - Circuit 42 - Reflexed portion 421 - Pad 43_ Polyline 50 - Protective film 60 - Second flexible circuit board 61, 62 - Solder pad