.200949846 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種資訊儲存記 於一種模組式可擴充儲存裝置。 【先前技術】 按，由於資訊科技的不斷進步， 術所製造出來之記憶卡已逐漸成為i ❹保全數位卡（Micro SD card)，其内部 以及記憶卡控制晶片，以供儲存大量 的傳輸並達到微小化尺寸要求。習知 以接觸方式達到對外電訊訊號傳輸， 内部之記憶卡控制晶片才能進行資剩 控制晶片在尺寸上小於記憶體晶片， 體晶片之可堆疊空間，而難以增加其 如第1圖所示，一種習知微型保 ❹ 包含一基板1 11、複數個記憶體晶片 制晶片11 8以及一封膠體11 3。該基 個接觸指114，其係設置於該基板1: 些§己憶體晶片11 2係堆叠設置在該基 並利用複數個第一銲線116電性連接 記憶卡控制晶片1 1 8亦設置在該基板 利用複數個第二銲線11 9電性連接至 該記憶卡控制晶片11 8可讀取或儲 112内的資料。複數個被動元件117 憶艘’特別係有關 沿用半導體封裝技 :流產品，例如微裂 係設有記憶體晶片 的資料與控制資料 微型保全數位卡係 且需要藉由設於其 -的傳輪，然記憶卡 也因此限制了記憶 記憶體容量。 全數位卡1 1 0主要 11 2、一記憶卡控 板1 1 1係具有複數 ί 1之外露表面。該 板111之内表面， 至該基板111。該 111之内表面’並 該基板1 1 1。利用 存該些記憶體晶片 亦可設置在該基板 5 200949846 111上。該封膠體i! 3栺 係^成於該基板111之内表面上 並密封該些記憶體晶κ 1 2以及該記憶卡控制晶片 118。由於該記憶卡控制曰η t 曰曰片11 8與該些記憶體晶片11 2 佔據該基板111之同—志& 衣面並且兩種晶片的尺寸與設 置尚度皆不相同，使續此4 ^ /二*己憶體晶片i ! 2之設置空間受 到限制，故無法在該基板丨丨 U1上設置大尺寸的記憶體晶 片，而難以增加其記憶體完县 篮I量。此外，該記憶卡控制晶 ❹ 片118的崎零配設亦影继#“ 刀〜響該封膠體11 3的模流填充，故 增加了該微型保全數11Λ 数位卡110的封裝製程困難度。 【發明内容】 有鑒於此’本發明之主要目的係在於提供一種模組 式可擴充儲存裝置，在活動式記憶體内裝設記憶卡控制 晶片，以便於控制微型保全數位卡（Micr〇 SD card)内之 資料讀存，以使微型保全數位卡内不需要設置記憶卡控 制B曰片，藉以增加5己憶體晶片之可堆疊空間並降低微型 〇 保全數位卡的封裝製程困難度。 本發明的目的及解決其技術問題是採用以下技術方 案來實現的。依據本發明所揭示之一種模組式可擴充儲 存裝置，主要包含至少—微型保全數位卡以及一具有記 憶卡控制晶片之活動式記憶體。該微型保全數位卡係包 5具有接觸指之基板、複數個堆疊於該基板上之第一 圮憶體晶片以及一密封該些第一記憶體晶片之第一封 膠體°亥活動式§己憶體係包含一本體、一電路板、複數 個第_ §己憶體晶片、一儲存控制晶片以及一記憶卡控制 6 ❹ 200949846 晶片。該太i 體係具有一接頭與至少一可供該微型保全 位卡插接$ ^ t ^憶卡插座。該電路板係設於該本體内， 内表面與一外表面。該些第二記憶體晶片係設 於該電路板 尤該内表面。該儲存控制晶片係設置於該 路板之該內矣^ 衣面’用以控制該些第二記憶體晶片至該 頭之電性傳於》 輸。该記憶卡控制晶片係設置於該電路板 該内表面，拍 欲1；性連接至該記憶卡插座，用以控制該 第一記憶體曰y γ 曰曰片至該活動式記憶體之電性傳輸。 本發明的 、目的及解決其技術問題還可採用以下技 措施進一步實現。 在前述之Μ 4 JU、 果組式可擴充儲存裝置中，該微型保全 位卡係可無内建 思5己憶卡控制晶片。 在蝻述之根知_4_、 ^、、、旦式可擴充儲存裝置中，該基板係可 有一記憶體晶Η < 曰 乃故置區，其係用以接置該些第一記憶 3 I中該憶體晶片設置區之尺寸與該基板之尺 係大致相同。 在前述之；b 曰 稱、且式可擴充儲存裝置中，該些第一記 體曰曰片之邊緣與該基板之邊緣之間的距離係可小於 記憶卡控制晶片。 在剛述之模組式可擴充儲存裝置中，該微型保全 位卡的所有„曰„ H k β ^ 數量係可等於該些第一記憶體晶片 數量。 在别述之模組式可擴充儲存裝置中，位於最上方 第°己憶體晶片與該第一封膠體之間的距離係可小 數 並 置 電 接 之 些 術 數 具 體 寸 憶 該 數 之 之 於 7 200949846 該些第一記憶體晶片其中之一之厚度。 在前述之模組式可擴充儲存裝置中，該些第一記憶 體晶片係可為快閃記憶體（Flash Memory)。 在前述之模組式可擴充儲存裝置中，該電路板之該 外表面係可形成有複數個外接墊與複數個記憶卡轉接 指。 在前述之模組式可擴充儲存裝置中，該些外接墊係 可電性連接至該接頭’該些記憶卡轉接指係延伸至該記 憶卡插座。 在前述之模組式可擴充儲存裝置中，該儲存控制晶 片係可對準於該些外接墊’該記憶卡控制晶片係可對準 於該些記憶卡轉接指。 在前述之模組式可擴充儲存裝置中，該記憶卡控制 晶片係可具有鎖碼功能。 在前述之模組式可擴充儲存裝置中，該活動式記憶 ❹體係可為USB隨身碟或可攜式硬碟。 在前述之模組式可擴充儲存裝置中，該接頭係可為 USB(通用串列匯流排’ Universai Serial Bus)介面或 SATA(序列先進技術附件，Adv_ed Techn〇i〇gy Attachment)介面 〇 在前述之模組式可摭 J擴充儲存裝置中’該活動式記憶 體可另包含一第二封朦触 了膠體’其係形成於該電路板之該内 表面，以密封該也第_ — &姑 一' δ己憶體晶片、該儲存控制晶片與 該記憶卡控制晶片。 8 200949846 由以上技術方案可以看出，本發明之模組式可擴充 儲存裝置及其製造方法，有以下優點與功效：、 -、在活動式記憶體内裝設記憶卡控制晶片，以便 存取微型保全數位卡内之資料。 二、 在微型保全數位卡内不需要設置記憶卡控制晶片， 可降低製造成本以及微型保全數位卡之封裝技術 ❹ Ο 難度並可增加記憶體晶片的堆疊空間與使用大尺 寸記憶體晶片，以增加記憶體容量。 三、 活動式記憶體可單獨使用，更可插接微型保全數位 卡，以增加記憶體容量，並能隨時替換微型保全數 位卡，以存取所需之資料。 四 記憶卡控制晶片係具有鎖碼功能以確保資料不會外 洩。 【實施方式】 依據本發明之一具體實施，_種模組式可擴充儲 存裝置舉例說明於第2圖之元件立體示意圖以及第5圖 之截面不意圖。該模組式可擴充儲存裝置2〇〇主要包含 至少一微型保全數位卡210(Micr〇 SD eard)以及一具有 記憶卡控制晶片之活動式記憶體22〇。其中，該微型保 全數位卡210係為可重複插拔方式結合於該活動式記 憶體220 。 該微型保全數位卡210舉例說明於第3圖之截面示 意圖以及第4圖透視封膠體之基板表面示意圖。該微型 保全數位卡210係包含一具有接觸指之基板211、複數 9 200949846 個堆疊於該基板211上之第一記憶體晶片212以及一密 封該些第一記憶體晶片212之第一封膠體213。如第4 圖所示，該基板211之内表面係可具有一記憶體晶片設 置區（即被該些第·一 s己憶體晶片212遮蓋的區域），甘得 用以接置該些苐一記憶體晶片2 1 2，其中該記憶體晶片 設置區之尺寸與該基板211之尺寸係大致相同。也就是 說，該微型保全數位卡210係為晶片尺寸封裝型態，該 些第一記憶體晶片2 1 2在該基板2 1 1上的記憶體晶片設 置區不小於該基板211之表面面積百分之七十以下。一 般而言，該基板211係為一微型印刷電路板。如第3圖 所示’該基板211具有不被該第一封膠體213覆蓋之一 外表面，其係設有複數個接觸指2 1 4，以作為對外接觸 用的電極。 該些第一記憶體晶片2丨2係可為快閃記憶體（FUsh Memory) ’不會因電源關閉而失去儲存資料。每一第一 Ο 記憶體晶片2 1 2係可具有複數個銲墊2 1 2 A，其係作為 該第一記憶體晶片212之電極。如第3圖所示，該些第 一 s己憶體晶片2 1 2係可利用一黏晶膠2丨5之黏貼而為立 體堆疊。該些第—記憶體晶片2 1 2能以打線或覆晶接合 方式電性連接至該基板2 11。在本實施例中，可利用複 數個第一鲜線216電性連接該些銲墊212A至該基板 211’而忒些第一銲線216之弧高應不超過該黏晶膠215 之厚度，以使位於下方之該些第一銲線216不被位於上 方之§亥些第—記憶體晶片212壓觸。其中，在該些第一 10 200949846 記憶體晶片212之間的黏晶膠215係可密封該些第—銲 線216在該些銲墊212A上的一端。 如第3圖所示，該位於最上方之第一記憶體晶片 212’與該第一封膠體213之頂面之間的距離si係可小 於該些第—記憶體晶片212其中之一之厚度。如第3圖 所示，在最上方之第一記憶體晶片212，上已無法再堆疊 任一晶片（例如記愧體晶片或記憶卡控制晶片），使得該 〇微型保全數位卡210能達到在限定的封裝高度内堆疊 最多數量的記憶體晶片。 更進-步地’如第4圖所示，該些第一記憶體晶片 212之邊緣與該基板211之邊緣之間的距離s2係可小 於記憶卡控制晶片。也就是說，在該基板211之周邊'空 間拮据，已無法再配置任何記憶卡控制晶片。如第3 ^ 所示，該微型保全數位卡2丨〇的所有晶片數量係可等於 該些第一記憶體晶片212之數量。該基板211不需保留 ❷記憶卡控制晶片之設置區域，故能設置尺寸較大的記憶 體晶片，藉此使該微型保全數位卡21〇能達到高記憶體 容量之功效。因此，該微型保全數位卡21〇係無内建記 憶卡控制晶片’在該些第一記憶體晶片2 1 2之周圍與上 方不需要設置記憶卡控制晶片。 通常該第一封膠體213係由模封陣列處理（MAR， Map Array Process)製程製作，該第一封膠體213之四 周側面係為切割形成之垂直側壁並切齊於該基板2 1 1 之邊緣，而製成卡片型態。 200949846 較佳地，如第3圖的放大圖所示，該些第一銲線216 之弧高係應小於該位於最上方之第一記憶體晶片212, 與該第一封膠體2丨3之頂面之間的距離S1，以避免該 些第一銲線216外露出該第一封膠體213。 此外，該微型保全數位卡2 1 0係可另包含有複數個 第一被動元件217’其係設置於該基板211之内表面之 一側邊，以不影響該些第一記憶體晶片2 1 2設置空間為 較佳。 φ 如第2及5圖所示，該活動式記憶體220係包含一 本體230、一電路板24〇、複數個第二記憶體晶片25 i、 一儲存控制晶片2 5 2以及一記憶卡控制晶片2 5 3。該本 體230係具有一接頭231與至少一可供該微型保全數位 卡2 10插接之記憶卡插座232。 如第2圖所示，該記憶卡插座232之一端係可形成 微凹入接口或平切接口。該活動式記憶體22〇係可為 〇 USB隨身碟或可攜式硬碟。該接頭231係可為USB(通 用串列匯流排，Universal Serial Bus)介面或SATA(序列 先進技術附件，Serial Advanced Technology Attachment)介面，以使該接頭231可任意插接至一如電 腦主機或筆記型電腦等電子產品，在本實施例中，該活 動式記憶體220是以USB隨身碟具體例舉之。在該接 頭231内設有四個USB接指233。 如第5圖所示’該電路板24〇係設於該本體23〇内， 並具有一内表面241與一外表面242。如第5圖所示， 12 200949846 該電路板240之該外表面242係可形成有複數 243與複數個記憶卡轉接指244。如第5圖所 外接墊243係可電性連接至該接頭231内之1 接指233，該些記憶卡轉接指244係延伸至該 座232。故該些記憶卡轉接指244係為該些外 之擴充端子。而在配置數量上，該些記憶卡轉 係多於該些外接墊243。 該些第二記憶體晶片25 1係設置於該電路. 該内表面241 ’可藉由複數個第二銲線271電 該電路板240。該儲存控制晶片252係設置於 240之該内表面241，可藉由複數個第三銲線 連接至該電路板240，用以控制該些第二記 251至該接頭231之電性傳輸。故該儲存控制 係能控制該些第二記憶體晶片2 5 1内的資料 記錄資料於該些第二記憶體晶片25丨，使該活 ❹ 體220具有本身的記憶體儲存機構。 並且，該記憶卡控制晶片2 5 3係設置於該電 之該内表面241，藉由複數個第四銲線273電 該電路板240，並進—步電性連接至該記憶卡 内的該些記憶卡轉接指244，用以控制該些第 晶片2 1 2至該活動式記憶體22〇之電性傳輸。 較佳地，該儲存控制晶片252係可對準於 塾243 ’該記憶卡控制晶片253係可對準於該 轉接指244，藉以縮短電訊傳遞路徑。此外， 個外接墊 示，該些 I亥些USB 記憶卡插 接墊243 接指244 板240之 性連接至 該電路板 272電性 憶體晶片 晶片252 讀取或是 動式記憶 路板240 性連接至 插座232 一記憶體 該些外接 些記憶卡 在該電路 13 200949846 板240之該内表面241係可另設置有複數個第二被 件 280 ° 當該微型保全數位卡2 1 0插接至該記憶卡插座 時，該些接觸指214可與該些記憶卡轉接指2 44接 電性導通。該些第一記憶體晶片2 1 2内的資料係透 些記憶卡轉接指244以及該電路板240之内部線路 至該s己憶卡控制晶片253。藉由内部裝設有該記憶 制晶片253之該活動式記憶體220可控制該微型保 位卡210内的資料讀取與儲存。在該微型保全數 2 1 0内不需要設置任何記憶卡控制晶片，以使該些 記憶體晶片2 1 2有較佳的堆疊空間，藉以增加記憶 量並進一步降低製造成本以及微型保全數位卡之 技術難度’該微型保全數位卡210能夠使用大尺寸 體晶片’達到晶片尺寸封裝，以增加記憶體容量。男 該活動式記憶體220可單獨使用，亦可插接各種不 ❹ 憶體容量（例如5 12MB、1GB、2GB或更大）的微型 數位卡2 1 0作為延伸碟，以增加記憶體容量，並能 替換該微型保全數位卡2 1 0，以存取所需之資料。 較佳地’該記憶卡控制晶片253係可具有鎖 能。該記憶卡控制晶片253係可存取該些第一記憶 片212内的資料並可進行資料管理，如移動、複製 除資料。當要讀取或儲存該微型保全數位卡21〇内 料時’必須使用該記憶卡控制晶片253才能進行動 所以即使不小心將該微型保全數位卡2丨〇遺失時， 動元 232 觸而 過該 傳輸 卡控 全數 位卡 第一 體容 封裝 記憶 卜者， 同記 保全 隨時 碼功 體晶 或刪 的資 作。 也能 14 200949846 確保其内部資料不會輕易外电。 在一更具體結構中，該活動式記憶體220可另包含 一第二封膠體260，其係可形成於該電路板240之該内 表面24 1 ’以密封該些第二記憶體晶片25 1、該儲存控 制晶片252與該記憶卡控制晶片253。該第二封膠體26〇 係可為轉移成形（transfer molding)技術形成。因此，該 些第二記憶體晶片25 1、該儲存控制晶片252與該記憶 φ 卡控制晶片253係封裝於同一電路板240上，以降低封 裝成本，並可避免該記憶卡控制晶片253被強行更換。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，本發明技術方案範圍當依 所附申請專利範圍為準。任何熟悉本專業的技術人&可 利用上述揭示的技術内容作出些許更動或修飾為等a 變化的等效實施例，但凡是未脫離本發明技術方案的同 容，依據本發明的技術實質對以上實施例所作的任何内 ❹單*改' *㈤變化與修*，均仍屬於本發明:簡 範圍内。 不案的 【圖式簡單說明】 第1圖：為習知微型保全數位卡的截面示意圖。 第2圖：為依據本發明一具體實施例的一種模組式口 充儲存裝置的元件立體示意圖。 °擴 第 圖··為依據本發明一具體實施例的該 充 大 两式可擴 儲存裝置之-微型保全數位卡及其局 的截面示意圖。 15 200949846 第4圖：為依據本發明一具體實施例的該模組式可擴充 儲存裝置之該微型保全數位卡透視封膠體之 基板表面示意圖。 第5圖：為依據本發明一具體實施例的該模組式可擴充 儲存裝置的截面示意圖。 【主要元件符號說明】 S1最上方第一記憶體晶片與第一封膠體頂面的距離BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an information storage recorded in a modular expandable storage device. [Prior Art] According to the continuous advancement of information technology, the memory card manufactured by the company has gradually become a micro SD card, which is internally and memory card control chip for storing a large number of transmissions and reaching Miniaturized size requirements. It is known that the external telecommunication signal transmission is achieved by contact, and the internal memory card control chip can perform the residual control. The size of the wafer is smaller than the stackable space of the memory chip and the body wafer, and it is difficult to increase it as shown in FIG. The conventional micro-protection includes a substrate 1 11 , a plurality of memory wafer wafers 11 8 and a colloid 11 3 . The base contact fingers 114 are disposed on the substrate 1 : some § memory chips 11 2 are stacked on the base and electrically connected to the memory card by a plurality of first bonding wires 116 to control the wafer 1 1 8 The substrate is electrically connected to the memory card control wafer 11 to read or store the data in the substrate 112 by using a plurality of second bonding wires 11 9 . A plurality of passive components 117 recalled that 'specially related to the use of semiconductor packaging technology: streaming products, such as micro-cracking data and control data with a memory chip micro-preservation digital card system and need to be set by its -, However, the memory card thus limits the memory memory capacity. Full digital card 1 1 0 main 11 2. A memory card control board 1 1 1 has multiple ί 1 exposed surfaces. The inner surface of the plate 111 is to the substrate 111. The inner surface of the 111' and the substrate 1 1 1 . The storage of the memory chips may also be provided on the substrate 5 200949846 111. The encapsulant i! 3 is formed on the inner surface of the substrate 111 and seals the memory crystal κ 1 2 and the memory card control wafer 118. Since the memory card controls the 11n 曰曰 11 11 8 and the memory chips 11 2 occupy the same substrate as the substrate 111 and the dimensions and settings of the two wafers are different, The installation space of the 4 ^ / 2 * memory chip i ! 2 is limited, so that it is impossible to provide a large-sized memory chip on the substrate 丨丨 U1, and it is difficult to increase the memory of the memory basket. In addition, the memory card controls the subsequent arrangement of the wafer 118 to follow the mold flow filling of the sealant 11. Therefore, the packaging process difficulty of the micro-protection number 11 is increased. SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a modular expandable storage device in which a memory card control chip is mounted in a movable memory to facilitate control of a micro-preserved digital card (Micr〇SD card). The data in the memory is read so that the memory card control B chip does not need to be set in the micro security digital card, thereby increasing the stackable space of the 5 memory chips and reducing the packaging process difficulty of the micro memory card. The purpose and solution of the technical problem are achieved by the following technical solutions. A modular expandable storage device according to the present invention mainly comprises at least a micro-preserved digital card and a movable memory with a memory card control chip. The micro-preserved digital card package 5 has a substrate with a contact finger, a plurality of first memory chips stacked on the substrate, and a seal The first encapsulant of the first memory chip includes a body, a circuit board, a plurality of _ _ ** memory chips, a memory control chip, and a memory card control 6 ❹ 200949846 wafer The tai system has a connector and at least one socket for the micro-preservation card, and the circuit board is disposed in the body, the inner surface and an outer surface. The second memory The memory chip is disposed on the inner surface of the circuit board. The memory control chip is disposed on the inner surface of the circuit board to control the electrical transmission of the second memory chip to the head. The memory card control chip is disposed on the inner surface of the circuit board, and is connected to the memory card socket for controlling the first memory 曰 y γ 曰曰 to the movable memory Electrical transmission. The invention, the object and the technical problem of the invention can be further realized by the following technical measures. In the foregoing JU 4 JU, fruit group expandable storage device, the micro-preservation card system can be built without thinking 5 memory card control chip. In the _4_, ^, , and denier expandable storage device, the substrate may have a memory crystal < 曰 故 故 , , 接 接 接 接 接 接 接 接 接 接 接The size of the memory chip setting area is substantially the same as the size of the substrate. In the foregoing, the nickname and the expandable storage device, the edge of the first recording piece and the edge of the substrate The distance between the two can be smaller than the memory card control chip. In the modular expandable storage device just described, the number of all the 保 H H k β ^ of the micro-preserving card can be equal to the first memory chips. In the modular expandable storage device described above, the distance between the topmost memory cell and the first sealant at the top is a fractional number and the number of the electrical components is electrically connected to the number. And 7 200949846 the thickness of one of the first memory chips. In the above modular expandable storage device, the first memory chips may be flash memories. In the above modular expandable storage device, the outer surface of the circuit board may be formed with a plurality of external pads and a plurality of memory card transfer fingers. In the aforementioned modular expandable storage device, the external pads are electrically connected to the connector. The memory card transfer fingers extend to the memory card socket. In the aforementioned modular expandable storage device, the storage control wafer can be aligned with the external pads. The memory card control chip can be aligned with the memory card transfer fingers. In the aforementioned modular expandable storage device, the memory card control chip system can have a lock code function. In the aforementioned modular expandable storage device, the removable memory system can be a USB flash drive or a portable hard drive. In the foregoing modular expandable storage device, the connector may be a USB (Universal Serial Bus) 'Universal Serial Bus' interface or a SATA (Adv_ed Techn〇i〇gy Attachment) interface. In the modular expansion device, the movable memory can further comprise a second seal that is formed on the inner surface of the circuit board to seal the same. A memory cell of the δ ** memory, the memory control chip and the memory card control chip. 8 200949846 It can be seen from the above technical solution that the modular expandable storage device and the manufacturing method thereof have the following advantages and effects: - installing a memory card control chip in the movable memory for access Micro-preservation of information in the digital card. Second, there is no need to set the memory card control chip in the micro-preservation digital card, which can reduce the manufacturing cost and the packaging technology of the micro-preserving digital card. 难度 Difficulty and increase the stacking space of the memory chip and use the large-sized memory chip to increase Memory capacity. Third, the active memory can be used alone, and the micro-protected digital card can be plugged in to increase the memory capacity, and the micro-preservation digital card can be replaced at any time to access the required data. Four memory card control chipset has a lock code function to ensure that data is not leaked. [Embodiment] According to one embodiment of the present invention, a modular expandable storage device is exemplified by a perspective view of the components of Fig. 2 and a cross-sectional view of Fig. 5. The modular expandable storage device 2 mainly includes at least one micro-preserved digital card 210 (Micr〇 SD eard) and a removable memory 22 with a memory card control chip. The micro-preservation digital card 210 is coupled to the movable memory 220 in a re-pluggable manner. The micro-reserved digital card 210 is illustrated in the cross-sectional view of Fig. 3 and the schematic view of the substrate surface of the see-through encapsulant of Fig. 4. The micro-reserved digital card 210 includes a substrate 211 having contact fingers, a plurality of 9 200949846 first memory chips 212 stacked on the substrate 211, and a first encapsulant 213 sealing the first memory chips 212. . As shown in FIG. 4, the inner surface of the substrate 211 may have a memory chip setting area (ie, an area covered by the first suffix wafers 212), which is used to connect the 苐. A memory chip 2 12, wherein the size of the memory chip mounting region is substantially the same as the size of the substrate 211. That is, the micro-reserved digital card 210 is in a chip-size package type, and the memory chip setting area of the first memory chip 2 1 2 on the substrate 21 is not less than the surface area of the substrate 211. Less than seventy. In general, the substrate 211 is a micro printed circuit board. As shown in Fig. 3, the substrate 211 has an outer surface which is not covered by the first encapsulant 213, and is provided with a plurality of contact fingers 2 1 4 as electrodes for external contact. The first memory chips 2丨2 can be a flash memory (FUsh Memory) ‘no loss of stored data due to power off. Each of the first memory chips 2 1 2 may have a plurality of pads 2 1 2 A as electrodes of the first memory chip 212. As shown in Fig. 3, the first s-resonant wafers 2 1 2 can be stacked by a paste of adhesive 2 丨 5 . The first memory wafers 2 1 2 can be electrically connected to the substrate 2 11 by wire bonding or flip chip bonding. In this embodiment, the plurality of first fresh wires 216 can be electrically connected to the pads 212A to the substrate 211', and the arc heights of the first bonding wires 216 should not exceed the thickness of the die bond 215. The first bonding wires 216 located below are not pressed by the upper memory cell 212. The adhesive 215 between the first 10 200949846 memory chips 212 can seal one end of the first solder wires 216 on the pads 212A. As shown in FIG. 3, the distance si between the uppermost first memory chip 212' and the top surface of the first encapsulant 213 may be smaller than the thickness of one of the first memory chips 212. . As shown in FIG. 3, on the first memory chip 212 at the top, it is no longer possible to stack any wafer (such as a memory chip or a memory card control chip), so that the 〇 mini-preserved digital card 210 can reach A maximum number of memory chips are stacked within a defined package height. Further, as shown in Fig. 4, the distance s2 between the edge of the first memory chip 212 and the edge of the substrate 211 can be smaller than that of the memory card control chip. That is to say, at the periphery of the substrate 211, it is no longer possible to configure any memory card control wafer. As shown in Fig. 3^, the number of all wafers of the micro-reserved digital card 2 can be equal to the number of the first memory chips 212. The substrate 211 does not need to be retained in the setting area of the memory card control chip, so that a large-sized memory chip can be disposed, thereby enabling the micro-preserving digital card 21 to achieve a high memory capacity. Therefore, the micro-reserved digital card 21 has no built-in memory card control chip. It is not necessary to provide a memory card control chip around and above the first memory chips 2 1 2 . Generally, the first encapsulant 213 is fabricated by a MAR (Map, Array Process) process, and the sides of the first encapsulant 213 are cut into vertical sidewalls and are aligned on the edge of the substrate 2 1 1 . And made into a card type. Preferably, as shown in the enlarged view of FIG. 3, the arc height of the first bonding wires 216 should be smaller than the first memory chip 212 located at the top, and the first sealing body 2丨3 The distance S1 between the top surfaces prevents the first bonding wires 216 from exposing the first sealing body 213. In addition, the micro-reserved digital card 2 1 0 may further include a plurality of first passive components 217 ′ disposed on one side of the inner surface of the substrate 211 so as not to affect the first memory chips 2 1 . 2 setting space is better. φ As shown in FIGS. 2 and 5, the movable memory 220 includes a body 230, a circuit board 24, a plurality of second memory chips 25 i, a storage control chip 2 5 2, and a memory card control. Wafer 2 5 3 . The body 230 has a connector 231 and at least one memory card socket 232 that can be inserted into the micro security digital card 2 10 . As shown in Fig. 2, one end of the memory card socket 232 can form a micro-recessed interface or a flat-cut interface. The removable memory 22 can be a USB flash drive or a portable hard drive. The connector 231 can be a USB (Universal Serial Bus) interface or a SATA (Serial Advanced Technology Attachment) interface, so that the connector 231 can be arbitrarily plugged into a computer host or a note. In the embodiment, the mobile memory 220 is specifically exemplified by a USB flash drive. Four USB fingers 233 are provided in the connector 231. As shown in FIG. 5, the circuit board 24 is disposed in the body 23, and has an inner surface 241 and an outer surface 242. As shown in FIG. 5, 12 200949846 the outer surface 242 of the circuit board 240 can be formed with a plurality of 243 and a plurality of memory card transfer fingers 244. The external pad 243 is electrically connected to the finger 233 in the connector 231, and the memory card adapter 244 extends to the holder 232. Therefore, the memory card transfer fingers 244 are the external expansion terminals. In terms of the number of configurations, the memory cards are more transferred than the external pads 243. The second memory chips 25 1 are disposed on the circuit. The inner surface 241 ′ can be electrically connected to the circuit board 240 by a plurality of second bonding wires 271. The storage control chip 252 is disposed on the inner surface 241 of the 240, and is connected to the circuit board 240 by a plurality of third bonding wires for controlling electrical transmission of the second pads 251 to the connector 231. Therefore, the storage control system can control the data recording materials in the second memory chips 251 to the second memory chips 25, so that the living body 220 has its own memory storage mechanism. Moreover, the memory card control chip 253 is disposed on the inner surface 241 of the electric circuit, and the circuit board 240 is electrically connected to the plurality of fourth bonding wires 273, and is electrically connected to the memory card. The memory card transfer finger 244 is configured to control the electrical transmission of the first chip 2 12 to the movable memory 22 . Preferably, the storage control chip 252 is alignable with the 塾 243 ′. The memory card control chip 253 is alignable with the transfer finger 244 to shorten the telecommunications transmission path. In addition, an external pad indicates that the USB memory card plug pads 243 are connected to the circuit board 272, and the memory board wafer 252 is read or the dynamic memory board 240 is Connected to the socket 232, a memory, and some external memory cards are disposed on the inner surface 241 of the circuit 13 200949846. The second surface of the board 240 is further provided with a plurality of second objects 280 ° when the micro security digital card 2 1 0 is plugged into In the memory card socket, the contact fingers 214 can be electrically connected to the memory card transfer fingers 2 44. The data in the first memory chips 2 1 2 is through the memory card transfer fingers 244 and the internal lines of the circuit board 240 to the suffix card control chip 253. The data storage and storage in the micro-storage card 210 can be controlled by the removable memory 220 in which the memory chip 253 is mounted. It is not necessary to provide any memory card control chip in the micro-protection number 210, so that the memory chips 2 12 have a better stacking space, thereby increasing the memory and further reducing the manufacturing cost and the micro-preserving digital card. Technical difficulty 'The micro-reserved digital card 210 can use a large-sized body wafer' to achieve a wafer-scale package to increase the memory capacity. The mobile memory 220 can be used alone, or a micro-digital card 2 1 0 that does not have a memory capacity (for example, 5 12 MB, 1 GB, 2 GB or more) can be inserted as an extended disc to increase the memory capacity. And can replace the micro-preservation digital card 2 1 0 to access the required information. Preferably, the memory card control chip 253 can have a lock capability. The memory card control chip 253 can access the data in the first memory chips 212 and can perform data management, such as moving and copying data. When the micro-preservation digital card 21 〇 internal material is to be read or stored, 'the memory card control chip 253 must be used to move. Therefore, even if the micro-preserving digital card 2 is lost accidentally, the moving element 232 passes over. The transmission card controls the first-person package of the full-digit card, and the memory of the memory card is deleted or deleted. It can also be 14 200949846 to ensure that its internal data will not be easily external. In a more specific configuration, the movable memory 220 can further include a second encapsulant 260 formed on the inner surface 24 1 ' of the circuit board 240 to seal the second memory chips 25 1 . The storage control chip 252 and the memory card control wafer 253. The second encapsulant 26 can be formed by a transfer molding technique. Therefore, the second memory chip 25 1 , the memory control chip 252 and the memory φ card control chip 253 are packaged on the same circuit board 240 to reduce the packaging cost, and the memory card control chip 253 is prevented from being forced. replace. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the scope of the appended claims. Any person skilled in the art can use the technical content disclosed above to make some modifications or modifications to the equivalent embodiment of the a change, but the technical essence of the present invention is not related to the technical solution of the present invention. Any of the intrinsic singles*changes*(5) changes and repairs made in the above embodiments are still within the scope of the present invention. No case [Simplified illustration] Figure 1: Schematic diagram of a cross-section of a conventional micro-preservation digital card. Figure 2 is a perspective view of the components of a modular port-filled storage device in accordance with an embodiment of the present invention. The first embodiment is a cross-sectional view of a miniature-preserved digital card and its office in accordance with an embodiment of the present invention. 15 200949846 FIG. 4 is a schematic view showing the surface of a substrate of the micro-preserved digital card fluoroscopic encapsulant of the modular expandable storage device according to an embodiment of the present invention. Figure 5 is a cross-sectional view of the modular expandable storage device in accordance with an embodiment of the present invention. [Main component symbol description] The distance between the first memory chip at the top of S1 and the top surface of the first sealant
S2第一記憶體晶片之邊緣與基板邊緣之間的距離 110微型保全數位卡 1丨 113封膠體 11 7被動元件 119第二銲線 211基板 212A锌墊 213第一封膠體 216第一銲線 2 3 2記憶卡插座 242外表面 252儲存控制晶片 112記憶體晶片 114接觸指 116第一銲線 11 8記憶卡控制晶片 200模組式可擴充儲存裝置 210微型保全數位卡 2 1 2第一記憶體晶片 212’第一記憶體晶片 2 14接觸指 2 1 5黏晶膠 2 1 7第一被動元件 220活動式記憶體 230本體 231接頭 233 USB接指 mu冤路板 243外接墊 244記憶卡轉 251第二記憶體晶片 16 200949846 253記憶卡控制晶片 260 271第二銲線 272第三銲線 273 280第二被動元件 第二封膠體 第四銲線S2 The distance between the edge of the first memory chip and the edge of the substrate 110 Miniature security digital card 1丨113 sealing body 11 Passive component 119 Second bonding wire 211 Substrate 212A Zinc pad 213 First sealing body 216 First bonding wire 2 3 2 memory card socket 242 outer surface 252 storage control chip 112 memory chip 114 contact finger 116 first bonding wire 11 8 memory card control chip 200 modular expandable storage device 210 micro security digital card 2 1 2 first memory Wafer 212' first memory chip 2 14 contact finger 2 1 5 adhesive glue 2 1 7 first passive component 220 movable memory 230 body 231 connector 233 USB interface finger board 243 external pad 244 memory card turn 251 Second memory chip 16 200949846 253 memory card control chip 260 271 second bonding wire 272 third bonding wire 273 280 second passive component second sealing body fourth bonding wire
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