200948603 ,. 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種撓性覆銅羯積層體，且特別關於—種撓性覆銅落積 層體，其經由使用具有經最優控_氧氣穿透速率、減含量、密度和水 蒸氣穿透速率之聚醯亞胺膜而具有改良的黏著性能。 【先前技術】 是—觀來連接子組件的電線路排列，呈現為根據電路設 计的幾何形式。印刷電路板(PCB)或印刷線路板(PWB)為經由適當方法在絕 緣體或導電體上面形成印刷電路而製作成者。 PCB可促成在具有事先形成的電線路之基板上同時安裝電子組件，可 提供時_短，且因此麟大量製財。PCB具有電子設備的小型化和低 重量、低製作成本、及線路的高可靠性等優點。因此之故’最近的電子應 用設備通常都使用PCBs，不論該等設備是供家庭或工業用途者皆然。 ⑩ _，在電子設備諸如LCD監視器、PDPs (程式化資料處理 器)听(^11111^0&13?1^33(^)、筆記型電腦、行動電話，11]：)&個人數位 助理(Personal Digital Assistant)、視訊攝影機或電子曰記等朝向更小尺寸的 最近趨勢之下，也要求PCB的小型化。因此，撓性印刷電路板(FpCB)正被 逐增地使用’於其中PCB係由用撓性材料諸如聚酯(PET)或聚醯亞胺(ρι)製 成的耐熱性塑膠膜所形成。撓性PCB因其撓性而可屈曲、摺疊、彎曲、纏 繞或扭轉’且因而用於經小型化的電子設備或低重量的電子組件。 為了確保電子設備的高密度安裝’此類型的電路板變得愈薄，且對於 不用黏著劑就在塑膠基板與金屬薄膜之間形成黏著用的金屬層所用技術也 3 200948603 有某些討論。雛術係經由薄_成法諸如真空蒸鑛、雜或離子電鍍i〇n plating)等在塑膠基板上直接形成墊底金屬層，及經由電鍍在該金屬層上形 成金屬鍍層。 不過，雖然撓性覆金屬_層體制上述程序所製作成，黏結層會被 k聚酸亞胺層穿透的氧氣或魏所氧化，且其結果為在聚輕胺層與銅層 之間的黏著強度高溫可靠性檢驗巾可誠低。若在使用高電壓的設備中使 用具有上述問題的撓性覆金屬_層體時，就不能娜有長_連接可靠 性。 其-項解決之道為制-種增加聚醯亞闕的厚度雅止氧氣或濕氣 的滲透之方法4過，在此情況中，PCB的徺性會減低，且因此在彎曲 之時，線路層可能折斷。 【發明内容】 本發明係經輯來解決上述問題。所以，本發_—項目的為提供挽 性覆銅_層體’其經由使祕有經由最優控制聚胺層的氧氣穿透速 率濕氣含ϊ，密度和水蒸氣穿透速率而具有高可靠性黏著性能。 為了達到上述目的，該撓性覆銅箔積層體包括一聚醯亞胺膜，一黏結 層’—金屬晶種層和-金屬傳導層，其中該聚輕祕具有譲 ay或更低的氧氣穿透速率，2 〇%或更低的濕氣含量、559 吵或 ^低的水蒸《透速率、以及或更大的密度。並且該聚醯亞胺膜 -有5〇ί政米或更小的厚度，而該黏結層係由含有3至重量％ &的 Nl_Cr合金所製成，且具有50至300A的厚度。 200948603 【實施方式】 後文中，200948603,. VI. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a flexible copper-clad laminate, and in particular to a flexible copper-clad laminate, which is optimally controlled via use. _ Oxygen penetration rate, reduced content, density and water vapor transmission rate of the polyimide film with improved adhesion properties. [Prior Art] Yes - The arrangement of the electrical lines that connect the sub-assemblies is presented in a geometric form that is designed according to the circuit. A printed circuit board (PCB) or a printed wiring board (PWB) is fabricated by forming a printed circuit on an insulator or a conductor by an appropriate method. The PCB can facilitate the simultaneous mounting of electronic components on a substrate having pre-formed electrical lines, which can be provided in a short time, and thus a large amount of money can be made. The PCB has the advantages of miniaturization and low weight of electronic equipment, low manufacturing cost, and high reliability of the line. For this reason, the most recent electronic applications usually use PCBs, whether they are for home or industrial use. 10 _, in electronic devices such as LCD monitors, PDPs (programmed data processor) listening (^11111^0&13?1^33(^), notebook, mobile phone, 11]:) & personal digital PCBs are also being miniaturized under the recent trend toward smaller sizes, such as Personal Digital Assistants, video cameras, or electronic devices. Therefore, a flexible printed circuit board (FpCB) is being used in an increasing manner, in which a PCB is formed of a heat-resistant plastic film made of a flexible material such as polyester (PET) or polyimine (ρι). Flexible PCBs can flex, fold, bend, wrap, or twist due to their flexibility' and are therefore used in miniaturized electronic devices or low weight electronic components. In order to ensure high-density mounting of electronic devices, the thinner the circuit board of this type becomes, and the technique for forming a metal layer for adhesion between the plastic substrate and the metal film without using an adhesive is also discussed. In the case of a thin film, a bottom metal layer is directly formed on a plastic substrate by a thin film forming method such as vacuum distillation, impurity or ion plating, and a metal plating layer is formed on the metal layer by electroplating. However, in spite of the above procedure of the flexible metal-clad system, the adhesive layer is oxidized by oxygen or Wei which is penetrated by the k-polyimide layer, and the result is between the poly-light amine layer and the copper layer. Adhesive strength high temperature reliability test towel can be honest. If a flexible metal-clad layer having the above problems is used in a device using a high voltage, it is impossible to have a long connection reliability. The solution to this problem is to increase the thickness of the polythene, or to infiltrate oxygen or moisture. In this case, the conductivity of the PCB is reduced, and therefore, when bent, the line The layer may break. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. Therefore, the present invention provides for the provision of a copper-clad layer which has a high oxygen transmission rate, density and water vapor transmission rate through the optimal control of the polyamine layer. Reliability adhesive performance. In order to achieve the above object, the flexible copper-clad laminate includes a polyimide film, a bonding layer'-a metal seed layer and a metal conductive layer, wherein the poly-light has a 譲ay or lower oxygen permeability. Permeability, moisture content of 2% or less, 559 noisy or low water vaporization rate, and or greater density. And the polyimide film has a thickness of 5 Å or less, and the adhesive layer is made of an Nl_Cr alloy containing 3 to 5% by weight and has a thickness of 50 to 300 Å. 200948603 [Embodiment] In the following text,
面的意義與概念予以解釋。 必須了解者，在說明書與後附宇請^ 限於一般與字典中的意義，而是要名 語之原則上根據對應於本發明技術方 所以’本文中提㈣說明部份只為僅供闡述目用的較佳實施例 :口 π叼钗佳實施例，而非 可以對其做出其他的等效 思圖用來限制本發明的範圍，所以應該了解者， ® 物和修改而不違離本發明的旨意和範圍。 圖1為根據本發明-較佳具體實例的撓性覆_積層體之示意橫截面 參照圖1，根據本發明的撓性覆銅笛積層體包括一聚合物膜1〇，由金 屬所製成且在該聚合物膜H)上形錢—餘層2G，及在該黏結層上形 成的-金屬晶種層3〇和—金屬傳導層如。該聚合物具有適合挽性覆 銅猪積層酬㈣撓性(驗）。聚合滅1G較佳者為魏亞賴。聚酿亞 胺膜具有高耐熱性和撓性及優㈣機麵度，且具有類似於金屬的熱膨服 係數。因此，通常都使用聚醯亞胺膜做為該聚合物膜。本發明中，該聚醯 亞胺膜具有1410 erf(皿/rri day或更低的氧氣穿透速率，2.0%或更低的濕氣 含量、559 ci^m/m2 day或更低的水蒸氣穿透速率、以及丨.45岁“或更大 的密度。 為了將聚醯亞胺膜諸特性之一的撓性施加到本發明換性覆鋼羯積斧 體’該聚醯亞胺膜較佳地要具有50微米〇mi)或更小的厚度。其詳細說明將 透過下面的實施例和比較例予以完成。 5 200948603 黏結層20係經由真空膜形成法諸如濺鍍在聚合物膜ι〇的平坦表面上 形成’且經插置於該聚合物膜10與金屬晶種層3〇之間以建立彼等之間的 連接’藉此改良彼等之間的黏著性。此處’經覆著在該聚合物膜1〇上的黏 結層20較佳地具有50至300A的厚度。 若該黏結層20過於薄，該黏結層20會具有微弱的耐高溫性即不良的 耐腐蝕性。因而，黏結層20可能在高溫處理之後或在形成電路之中經由電 鍍溶液的滲透就剝離掉。因為該黏結層20是用來建立在聚合物膜1〇與金 屬晶種層30之間的堅固黏接，所以該黏結層2〇不需要過於厚。 0 較佳地，黏結層20是用具有對其他材料的良好黏结性和反應性之金屬 例如鉻ϋ或彼等的合金所製成，不過，在本發明中該黏結層較佳地係由 池心合金所製成。於Ni_Cr合金黏結層中，若&含量為抓或更低者，會 祕著磁性，導致不良的生產力。若Cr的含量為2〇%或更高者，會殘留許 多的硫。因此，該合金中較佳地含有3至20%的Cr。 /上面提及者，經由真空卿成法在聚合物膜1()上形成難結層 可增強聚合物膜10與金屬晶種層3〇之間的黏接，使得即使在高溫處理之 〇 後也能維持剝離強度。 金屬晶種層30是在黏結層20上經由騎銅或銅合金革巴而形成者。而 ^屬傳導層4〇疋在金屬晶種層3〇的平坦表面上使用電鍍溶液經由電鑛法 形成。 又 ，同時’要透過更多的具體實施例和比較例更詳細地說明本發明。不 具,細叫且可以在崎料利範圍之範 U出各種具體實例。僅做述者，下面的具體實例係經提出以完 6 200948603 成本發明的揭示且同時，讓諳於此技藝的一般人可以容易地實施本發明。 [聚醯胺酸溶液之製備] 聚醯胺酸溶液係經由將芳族二胺與酸酐在有機溶劑之内聚合而得。 芳族二胺包括對苯二胺(PPD)、對苯胺(benzidine)或3,4，_二胺基二苯基 鍵。酸if包括苯均四酸酐、3,3，，4,4，_聯苯四敌酸、2,3，,3,4，_聯苯四M酸、3,3，， 4,4’-二苯甲酮四羧酸、2,3,6,7-萘二羧酸、2,2-雙(3,4-二羧基苯基)醚、吡啶 -2,3,5,6-四羧酸或彼等的醯胺形成性衍生物。 _ 而在聚合反應中使用的有機溶劑包括選自由亞砜基溶劑諸如二甲亞砜 或二乙亞颯’·醯胺基溶劑諸如n，n-二甲基甲醯胺或n，N-二乙基甲醯胺；及 溶劑諸如N，N-二甲基乙醯胺所組成的群組中至少一者。 特別者，本發明係經由將N，N_二甲基乙醯胺(DMAC)與對苯二胺 (PPD)、4,4 氧基二苯胺(4,4’ -〇DA)、3,3’ 4,4’ -聯笨四叛酸二酐(BPDA) 和苯均四酸二酐(PMDA)在常溫下搜動和反應而製備聚醯胺酸溶液。 [聚醢亞胺膜之形成] 1) 添加二甲基乙醯胺於製備好的聚醯胺酸溶液，然後將彼等攪動。 2) 於需要時，可將該聚醯胺酸溶液冷卻，然後經由與酸酐和聚万_甲 基吼啶混合予以醯亞胺化(imidized)。 3) 於實施2)程序的情況中，將聚醯亞胺聚合物在9{rc下冷卻以得到 凝膠膜，且在100°C下加熱將該凝膠膜固定，在270。(：下拉伸並在380°C熱 處理，使聚醯亞胺膜得以形成。 同時’於不實施2)程序的情況中’係將一部份的DMAC在1〇〇。(：下揮 發掉以形成膜’且將該膜依序在270°C和380°C下加熱醯亞胺化同時膨脹以 7 200948603 期增加該膜的機械強度。 [撓性覆銅箔積層體之製造] 撓性覆銅箔積層體係在上面形成的聚醯亞胺膜之上經由實施下列程序 而製造成。 1) 聚醯亞胺膜的表面處理 2) 在表面處理過的聚醯亞胺膜上形成黏結層 3) 在黏結層上形成金屬晶種層 © 4) 在金屬晶種層上經由電鍍形成金屬傳導層。 [剝離強度之測量] 經由上述方法製造出具有圖2和3中所顯示的特性之撓性覆銅箔積層 體樣品，且對每一樣品檢驗剝離強渡。 ❹ 於圖2和3中，氧氣穿透速率為每一天穿透過每i平方米(my微米的 厚度之氧氣體積(ASTM D-3985)。濕氣含量為聚醯亞胺(ρι)的最大濕氣含量 (IPC-TM-65〇，Meth.2.6·2)。水蒸氣穿透速率為每一天穿透過每1平方米⑽】 微米的厚度之濕氣(蒸氣)體積(ASTME-96)。 而且’在常溫下的剝離強度檢驗是在__寬度為丨絲且用$毫 米/分鐘的頭速度(head speed)施加荷重之條件下實施。常溫下的剝離強度係 用根據肌綱標準的設備測量。導計算低输對平均值比例一 peak-to-avemgeratio)。此時，測量範圍為1〇毫米至⑼毫米。 在將撓性覆銅箔積層體樣品置於15〇。 C 168小時後實施HTS(高溫儲 存)後的剝離強度檢驗。如同在常溫下的 叫離強度者，HTS厚的剝離強渡 (kgf/cm)係用根據JIS C 6471標準的今偌^ 又備在鋼圖案的寬度為^毫米且用5毫 8 200948603 米/分鐘的頭速度施加荷重之條件下實施。然後，計算在ι〇毫米至6〇毫米 的測量範圍内之低峰值-對平均值比例。 圖2和3為闡_撓性覆鋪積層體的娜強度隨著雜亞胺膜的特 性諸如氧氣穿透速率、濕氣含量、密度和水蒸氣穿透速率而變化之視圖。 如圖2和3巾雌不者’可以經由在紐額紐紐的製造巾變異聚 醯亞胺膜雜結層的厚度，錢醯亞賴和觀層的組成_，而控制參 數諸如氧氣穿透速率、濕氣含量、密度和水蒸氣穿透速率。 >Q 2和3 ’於氧氣牙透速率超過1410 CI^皿/m2 day的情況中（比較 例1、2、9和12) ’常溫剝離強度沒有特性變化，但HTS後的剝離強度則 為低於標準值之下的〇.25 kgf/cm或更低者。而於濕氣含量高於2 〇%的情況 中（比較例3、4、9和10)，常溫剝離強度沒有特性變化，但HTS後的剝離 強度則為低於標準值之下的〇.22kgf/cm或更低者。 另外’於密度低於1.45 g/cd的情況令（比較例5、6、10和11)，常溫 剝離強度沒有特性變化，但腦後_軸度則為低於鮮值之下的〇18 kgf/cm或更低者。於水蒸氣穿透速率高於Mg CI]^m/m2 day的情況中（比較例 7、8、11和12)，常溫剝離強度沒有特性變化，但HTS後的剝離強度則為 低於標準值之下的0.25 kgf/cin或更低者。 所以，如同實施例1至36者，撓性覆銅箔積層體的聚醯亞胺膜應該具 有1410 ci^m/m2 day或更低的氧氣穿透速率、2·〇%或更低的濕氣含量、559 αημηι/πί day或更低的水蒸氣穿透速率、以及145 g/cd或更大的密度，以 期在HTS之後得到優良的剝離強度以及在常溫下的優良剝離強度。 圖4為闡明MIT而ί折強度(folding endurance)隨著PI(聚醯亞胺)膜的厚 9 200948603 度而變化之視圖。减圖4，於PI膜的厚度超過5Q微米的情況中(比較例^ 至3)，Mrm折強度為低於標準值之下的92循環或更少者。所以，如同實 施例1至5者，PI膜的厚度較佳地應鶴％微米献小，簡得到優良的 撓性特性。 本發明撓性覆銅箱積層體可經由防止因氧氣或濕氣參透所的 層之氧化而具有改進的長誠接可靠性，且因此適合用於f要高電壓的電 子設備諸如高性能數位產品。 綜上所述’本案不但在技術思想上確屬創新，並能較制物品增進上 Q ^夕項功效’應以充分符合新穎性及進步性之法紐明專利要件，麦依法 提出申請，懇請貴局核准本件發明專利申請案，以勵發明，至感德便。 【圖式簡單說明】 毛月車乂佳具脰實例的此等和其他特性、方面和優點都要在下面的詳 兒月中伴Ik著圖式予以更完整地說明。於該等圖式中： 圖1 ·艮據本發明-較佳具體實例的撓性覆銅箱積層體之示意橫截自 圖。 』圖2和3為闡明該撓性覆銅荡積層體的剝離強度隨著聚酿亞胺膜的特 "'氣穿透速率、濕氣含量、密度和水蒸氣穿透速率而變化圖表。 圖為閣明MIT耐折強度(脇㈣如加紐贿著聚醯亞胺膜的厚度而 變化圖表。 ;文中6’經參照所附圖式詳細說明過本發明較佳具體實例。不過， 恃44細„兄明與具體實施例，在指出本發明較佳具體實例之同 10 200948603 時，係僅做為闡述方式而給出，因為諳於此技者可從此詳細說明明白在本 發明旨意和範圍之内的各種改變和修飾。 【主要元件符號說明】 10 聚合物膜 20 黏結層 30 金屬晶種層 ❿ 40 金屬傳導層The meaning and concept of the face are explained. It is necessary to understand that in the manual and the post-attachment, please limit it to the meaning of the general and the dictionary, but the principle of the name should be based on the technical method corresponding to the present invention, so the description in this article is only for the purpose of illustration. Preferred Embodiments for Use: The embodiment is not intended to limit the scope of the present invention, so it should be understood, ® and modified without departing from the present invention. The spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a flexible overlayer body according to the present invention - a preferred embodiment. Referring to Figure 1, the flexible copper clony laminate according to the present invention comprises a polymer film 1 made of metal. And on the polymer film H), the surface layer 2G, and the metal seed layer 3〇 and the metal conductive layer formed on the bonding layer are formed. The polymer has a flexibility (test) for the coating of copper-coated pigs. The preferred one for the polymerization to kill 1G is Wei Yalai. The polyimide film has high heat resistance and flexibility, and excellent (4) machine surface, and has a thermal expansion coefficient similar to that of metal. Therefore, a polyimide film is usually used as the polymer film. In the present invention, the polyimide film has a vapor permeability of 1410 erf (distillation/rri day or lower, a moisture content of 2.0% or less, water vapor of 559 ci^m/m2 day or less). Penetration rate, and 密度.45 years old "or greater density. In order to apply the flexibility of one of the properties of the polyimide film to the flexible steel hoarding axe of the present invention, the polyimine film is more Preferably, the thickness is 50 μm )mi) or less. The detailed description will be completed by the following examples and comparative examples. 5 200948603 The adhesive layer 20 is formed by a vacuum film formation method such as sputtering on a polymer film 〇 Formed on the flat surface and inserted between the polymer film 10 and the metal seed layer 3A to establish a connection between them' thereby improving the adhesion between them. The adhesive layer 20 on the polymer film 1b preferably has a thickness of 50 to 300 A. If the adhesive layer 20 is too thin, the adhesive layer 20 may have weak high temperature resistance, that is, poor corrosion resistance. The bonding layer 20 may be stripped after penetration by a plating solution after high temperature processing or in forming a circuit. Since the bonding layer 20 is used to establish a strong bonding between the polymer film 1 and the metal seed layer 30, the bonding layer 2 does not need to be too thick. 0 Preferably, the bonding layer 20 is It is made of a metal having good adhesion and reactivity to other materials such as chrome or an alloy thereof, but in the present invention, the adhesive layer is preferably made of a pool core alloy. Ni_Cr alloy In the bonding layer, if the content of the & is scratched or lower, the magnetic property will be secreted, resulting in poor productivity. If the content of Cr is 2% or more, a lot of sulfur will remain. Therefore, in the alloy, Preferably, it contains 3 to 20% of Cr. / As mentioned above, the formation of a difficult layer on the polymer film 1 () by vacuum forming can enhance the adhesion between the polymer film 10 and the metal seed layer 3 The bonding strength is maintained even after the high temperature treatment. The metal seed layer 30 is formed on the bonding layer 20 by riding copper or copper alloy. The conductive layer 4 is in the metal crystal. The flat surface of the seed layer is formed by electroplating using a plating solution. The present invention will be described in more detail by way of more specific examples and comparative examples. It is not intended to be exhaustive, and various specific examples can be made in the range of the raw material range. The only specific examples below are presented. 6 200948603 The disclosure of the invention and at the same time, the invention can be easily implemented by the average person skilled in the art. [Preparation of poly-proline solution] The poly-proline solution is obtained by passing an aromatic diamine and an acid anhydride in an organic solvent. The aromatic diamine includes p-phenylenediamine (PPD), benzidine or 3,4,-diaminodiphenyl bond. The acid if includes pyromellitic anhydride, 3,3, 4,4,_Biphenyl tetracarboxylic acid, 2,3,,3,4,_biphenyl tetra M acid, 3,3,, 4,4'-benzophenone tetracarboxylic acid, 2,3,6 , 7-naphthalenedicarboxylic acid, 2,2-bis(3,4-dicarboxyphenyl)ether, pyridine-2,3,5,6-tetracarboxylic acid or their guanamine-forming derivatives. And the organic solvent used in the polymerization reaction includes a solvent selected from a sulfoxide-based solvent such as dimethyl sulfoxide or diethyl hydrazide, such as n, n-dimethylformamide or n, N-di Ethylcarbamide; and at least one of the group consisting of a solvent such as N,N-dimethylacetamide. In particular, the present invention is based on the combination of N,N-dimethylacetamide (DMAC) with p-phenylenediamine (PPD), 4,4-dihydroxydiphenylamine (4,4'-〇DA), 3,3 The '4,4'-linked streptozoic acid dianhydride (BPDA) and pyromellitic dianhydride (PMDA) were searched and reacted at room temperature to prepare a polyaminic acid solution. [Formation of Polyimine Film] 1) Dimethylacetamide was added to the prepared polyamic acid solution, and then they were agitated. 2) The polyaminic acid solution may be cooled as needed, and then imidized by mixing with an acid anhydride and a polymethyl- acridine. 3) In the case of the procedure of 2), the polyimine polymer was cooled at 9 {rc to obtain a gel film, and the gel film was fixed by heating at 100 ° C at 270. (: The lower stretching and heat treatment at 380 ° C allowed the polyimide film to be formed. Meanwhile, in the case where the 2) procedure was not carried out, a part of the DMAC was set at 1 Torr. (: volatilizes to form a film' and the film is sequentially heated at 270 ° C and 380 ° C to heat iodide while expanding to increase the mechanical strength of the film by 7 200948603. [Flexible copper clad laminate Manufacture] A flexible copper-clad laminate system is fabricated on the polyimine film formed above by performing the following procedure: 1) Surface treatment of the polyimide film 2) Surface-treated polyimine A bonding layer is formed on the film 3) A metal seed layer is formed on the bonding layer © 4) A metal conductive layer is formed on the metal seed layer via electroplating. [Measurement of Peel Strength] A flexible copper-clad laminate sample having the characteristics shown in Figs. 2 and 3 was produced by the above method, and peeling strongness was examined for each sample.图 In Figures 2 and 3, the oxygen transmission rate is per hour per square meter (my micron thickness of oxygen volume (ASTM D-3985). The moisture content is the maximum wetness of polyimine (ρι) Gas content (IPC-TM-65〇, Meth.2.6·2). The water vapor transmission rate is the volume of moisture (vapor) per metre (10) μm per day (ASTME-96). 'The peel strength test at normal temperature is carried out under the condition that the width is 丨 and the load is applied with a head speed of $ mm/min. The peel strength at normal temperature is measured by a device according to the muscle standard. The derivative calculates the low-to-average ratio to a peak-to-avemgeratio). At this time, the measurement range is from 1 mm to (9) mm. The flexible copper clad laminate sample was placed at 15 Torr. Peel strength test after HTS (high temperature storage) was performed after 168 hours. Like the strength at room temperature, the HTS thick peeling strong (kgf/cm) is based on the JIS C 6471 standard. The width of the steel pattern is 2 mm and 5 mbar 200948603 m/min. The head speed is applied under the condition that the load is applied. Then, calculate the low peak-to-average ratio over the measurement range from ι mm to 6 mm. Figures 2 and 3 are views showing that the intensity of the _ flexible coated laminate varies with the characteristics of the heteroimine film such as oxygen breakthrough rate, moisture content, density, and water vapor transmission rate. As shown in Figures 2 and 3, the female is not able to make the thickness of the polyamid film heterojunction layer, the composition of the Qianyi Yalai and the observation layer, and the control parameters such as oxygen penetration. Rate, moisture content, density, and water vapor transmission rate. >Q 2 and 3 'in the case where the oxygen tooth penetration rate exceeds 1410 CI^dish/m2 day (Comparative Examples 1, 2, 9 and 12) 'The normal temperature peel strength has no characteristic change, but the peel strength after HTS is Below the standard value of 〇.25 kgf/cm or lower. In the case where the moisture content is higher than 2% (Comparative Examples 3, 4, 9, and 10), there is no characteristic change in the peel strength at room temperature, but the peel strength after HTS is below the standard value of 〇.22 kgf. /cm or lower. In addition, in the case where the density is lower than 1.45 g/cd (Comparative Examples 5, 6, 10 and 11), there is no characteristic change in the peeling strength at room temperature, but the post-brain _ axis is lower than the 〇18 kgf under the fresh value. /cm or lower. In the case where the water vapor permeation rate is higher than Mg CI]^m/m2 day (Comparative Examples 7, 8, 11 and 12), there is no characteristic change in the peeling strength at room temperature, but the peel strength after HTS is lower than the standard value. Below 0.25 kgf/cin or lower. Therefore, as in Examples 1 to 36, the polyimide film of the flexible copper-clad laminate should have an oxygen permeability of 1410 ci^m/m2 day or less, a wetness of 2·〇% or less. The gas content, the water vapor transmission rate of 559 αημηι/πί day or lower, and the density of 145 g/cd or more, in order to obtain excellent peel strength after HTS and excellent peel strength at normal temperature. Fig. 4 is a view showing the MIT and the folding endurance as a function of the thickness of the PI (polyimine) film 9 200948603. Subtracting Fig. 4, in the case where the thickness of the PI film exceeds 5 Q μm (Comparative Examples ^ to 3), the Mrm folding strength is 92 cycles or less below the standard value. Therefore, as in the first to fifth embodiments, the thickness of the PI film is preferably small, and the thickness of the PI film is small, and excellent flexibility characteristics are obtained. The flexible copper-clad laminate of the present invention can have improved long-lasting reliability by preventing oxidation of a layer that is permeable to oxygen or moisture, and thus is suitable for use in an electronic device such as a high-performance digital product that requires high voltage. . In summary, 'this case is not only innovative in terms of technical thinking, but also able to improve the effectiveness of the products on the basis of the Q-Eight items' should be in full compliance with the novelty and progressiveness of the law of the New Zealand patent requirements, Mai filed an application, please You have approved this invention patent application, in order to invent invention, to the sense of virtue. [Simple description of the drawings] These and other features, aspects and advantages of the example of the Maoyue 乂 脰 都要 will be more fully explained in the following detailed months with the Ik diagram. In the drawings: Fig. 1 is a schematic cross-sectional view of a flexible copper clad laminate according to the present invention - a preferred embodiment. Figures 2 and 3 are graphs showing the peel strength of the flexible copper-clad laminate as a function of the air permeability, moisture content, density, and water vapor transmission rate of the polyaniline membrane. The figure shows the variation of the strength of the MIT flexural strength (the threat (4) such as the thickness of the polyimine film in Canada. The text 6' has been described in detail with reference to the accompanying drawings. However, 恃And the detailed description of the preferred embodiment of the present invention, which is the same as the preferred embodiment of the present invention, is given by way of explanation only, as the details of the present invention will be apparent from the following description. Various changes and modifications within the range. [Main component symbol description] 10 Polymer film 20 Bonding layer 30 Metal seed layer ❿ 40 Metal conducting layer