200948235 九、發明說明： 【發明所屬之技術領域】 本發明涉及柔性電路板製作領域，尤其涉及柔性電路 板生產過程中使用之壓板裝置。 【先前技術】 電路板生產過程中，為保護插接端點（俗稱金手指） 及提供良好接通性能，通常需要於電路板之插接端點上形 成一層高硬度耐磨損之鎳層及高化學鈍性之金層，請參見 ❹ Yu Hin Chan等人發表於2002年電子材料與封裝第四次國 際論壇會會議記錄2002年12月69-76頁上之文章·· Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions 。 柔性電路板製程中，於金手指上形成鎳金層之方法一 般為鍍金與化金，實際生產中，電路板需置於鍍金或化金 之藥水中。因此於鍍金與化金之前，電路板表面需要覆蓋 0 防鍍膜，防止鎳金於無需形成鎳金層之區域沈積，造成成 本浪費。 柔性電路板於鍍金與化金後，進入至下一道工序之 前，防鍍膜需要人工撕下，由於柔性電路板較軟，撕防鍍 膜時，作業人員需要用一隻手固定柔性電路板，另一隻手 將防鍍膜慢慢撕下，極容易因用力不當使柔性電路板折 傷，造成產品不良，且撕下之防鍍膜通常褶皺，不易回收 利用。因此，人工撕防鍍膜既耗工費時，影響產品之良率， 又使得製作柔性電路板之成本增加。 7 200948235 有蓉於此’實屬必要提供—種可改善撕防鍵膜作業方 .式之裝置。 、 .【發明内容】 :㈣板裝置，其包括：一個機架，該機架包括載台 及^架，該支架位於載台之一侧；一個承載板，該承載板 固定於該載台個驅動裝置，該驅動裝置安裝於該支架； 個壓持件該壓持件連接於驅動裝置，藉由驅動裝置控 ❹制壓持件靠近或遠離承載板；一個控制器，該控制器與^ 驅動裝置相連，其用於控制驅動裝置驅動壓持件做靠近或 遠離該承載板之運動。 本技術方案中之愿板裝置，藉由控制器控制驅動件連 同壓持件移動’壓持件壓住承載板上放置之電路板一端， 使得撕防鍍膜時電路板能夠固定，作業人員可用雙手將防 鐘膜撕下，避免了撕防鑛膜作業過程中引起電路板之壓折 傷’撕下之防鍍膜平整，提高了防鍍膜再利用率。從而， ❹可減少製作電路板之物料成本，降低勞動強度與複雜程度。 【實施方式】 下面將結合附圖對本技術方案提供之壓板裝置作進一 步之詳細說明。 請參閱圖1及圖2’本技術方案實施例一提供一種壓板 裝置100，其包括機架11、承載板12、驅動裝置10、壓持 件14、和控制器16。該機架11包括載台ill和支架112， 該承載板12固定於載台111，該驅動裝置10安裝於支架 112 ’該壓持件14連接於驅動裝置13，控制器16與驅動裝 8 200948235 置10相連，以控制驅動裝置13之動作使壓持件14作靠近 .或遠離承載板12之運動。 . 該載台111具有大體呈矩形之承載面。該支架112包 括二個支撐板114、固持板113和安裝座115。該二支撐板 114位於載台111 一侧且固定於相對之兩端。本實施例中， 支撐板114與載台111垂直。該固持板113兩端分別固定 於兩支撐板114上。該安裝座115固定於固持板113上， 並與固定板113垂直向載台111方向延伸，安裝座115與 ^ 載台111相對。參閱圖3,安裝座115中心設置有通孔116。 通孔116之延伸方向與支撐板114之延伸方向相同。 請參閱圖1與圖4,該承載板12為一矩形平板，其具 有相對之第一表面121與第二表面122。第一表面121為一 矩形平面，第二表面122與載台111接觸。第一表面121 靠近支撐板113 —端之二個頂角處設置有定位銷123,定位 銷123呈圓柱形，自第一表面121垂直向上凸伸。 Q 承載板12固定於載台111，例如可焊接於載台111上。 承載板12還可與載台111 一體成型。本實施例中，為了承 載板12於工作過程中便於調整位置，藉由螺栓124將承載 板固定於載台上。具體地，於載台1Π設置有螺紋孔（圖 未示），該螺紋孔之螺紋與螺栓124之螺紋相配合，於承載 板12之對應位置上設置有狹長通孔125,承載板12藉由穿 過該通孔125之螺栓124固定於該載台111。使得承載板 12可於通孔125之長度範圍内調整位置。 請參閱圖3，該驅動裝置10包括動力源15和驅動件 9 200948235 13，驅動件13為一個氣缸，其包括缸體131、活塞132及 -活塞桿133。該缸體131内包括一圓筒狀腔體，該活塞132 .呈圓形，該活塞桿133呈圓柱形，具有相對之第一端134 和第二端135。該缸體131固定於安裝座115，缸體131之 延伸方向與支架112之延伸方向相同，該活塞132位於缸 體131之腔内，並與缸體131之内壁緊密接觸。該活塞桿 133之第一端134固定於活塞132，活塞桿133藉由安裝座 115之通孔116延伸過安裝座115。惟，可以理解，本實施 例中之活塞桿133為可動部分，驅動件亦可為依靠液壓、 磁場或其他能量為能源之運動系統，例如液麼缸、磁力致 動器等，其他驅動件亦應設置有可動部分。 該動力源15與驅動件13藉由導管相連，本實施例中， 動力源15為一空氣壓縮機，動力源15可向氣缸提供壓縮 氣體以驅動驅動件13運動。 該壓持件14包括支撐部141和壓合部142，該支撐部 ❹ 141具有相對之第一面143和第二面144。該支撐部141之 第一面143之中心與活塞桿133之第二端135相連接，支 撐部141延伸方向與活塞桿133垂直，並平行於承載板12。 壓合部142固定於支撐部141，並與支撐部141之第二面 144相接觸，與承載板12相對，該壓合部142由彈性材料， 例如聚氨基曱酸酯（PU)製成。 該控制器16内具有控制電路，控制器16與動力源15 相連，藉由控制器16控制動力源15是否向氣缸提供壓縮 空氣。優選地，為方便實際操作，將控制器16之開關設置 200948235 成腳踏式。 . 本實施例令，為了保持壓持件14之平衡，機架固持板 > 113上進一步設置了二個滑塊117。二個滑塊117位於安裝 座115之兩侧，該滑塊117設有導孔119，該導孔119之延 伸方向與活塞桿133之延伸方向相同。壓持件14上設置二 個導柱118，該導柱118之直徑與導孔119相配合，該導柱 118配合入導孔119中。二導柱118之一端固定於壓持件 14上。因此當壓持件14移動時，二導柱118可滑動之穿過 ® 該導孔119，由於二導柱118之限定作用，使得壓持件14 更具有壓持位置之穩定性。 請參閱圖1及圖5,該壓板裝置100進行工作時，首先， 確保壓持件14距離承載板12之一端有一定距離，即氣缸 之活塞132處於氣缸内遠離承載板12 —端，活塞桿133部 分於缸體121内，此狀態下，將覆蓋有防鍍膜之電路板放 置於承載板12第一表面121上，使電路板上之定位孔穿過 Q 定位銷123。之後，操縱控制器16，控制器16控制動力源 15向驅動件13提供壓縮氣體，使得氣缸之活塞132移至缸 體131内之下端，活塞桿133連同壓持件14下移，壓持件 14壓緊承載板12第一表面上之電路板一端。此時將電路板 之防鍍膜撕下，而無須借助人手工壓持。使用該壓板裝置 100時，可根據不同之電路板之大小調整承載板12之位 置，使得壓持件14下壓後，壓持件14下電路板之寬度小 於1厘米。 請參閱圖6,本技術方案第二實施例提供一種壓板裝 11 200948235 置’進-步包括-個防護罩17，該壓板裝置於壓持件i4 •移動之範圍設置防護罩17，防護罩17固定於機架n之支 .架112上。於使用時更加安*，增加了壓板裝置操作之安 全性。 本技術方案提供之壓板裝置，能夠避免撕防鍍膜作業 :產生電路板之壓折傷，撕下之防鑛膜平整，可回收利用， 痛約了物料成本’採用該裝置壓電路板，降低了作業員之 ❹勞動強度’提升了作業效率，節約了人力成本。 ^綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案實施例提供之壓板裝置正視圖。 © 圖2係本技術方案實施例提供之壓板裝置侧視圖。 圖3係圖2沿π-ll方向之剖視圖。 圖4係本技術方案實施例提供之壓板裝置俯視圖。 圖5係本技術方案實施例提供之壓板裝置壓持時之示 意圖。 圖6係本技術方案實施例提供之壓板裝置安裝防護罩 後正視圖。 【主要元件符號說明】 12 200948235 驅動裝置 10 . 機架 11 . 承載板 12 壓持件 14 控制動力源 15 控制器 16 防護罩 17 壓板裝置 100 ® 載台 111 支架 112 固持板 113 支撐板 114 安裝座 115 通孔 116 滑塊 117 q 導柱 118 導孔 119 第一表面 121 第二表面 122 定位銷 123 螺栓 124 狹長通孔 125 缸體 131 活塞 132 13 200948235 活塞桿 133 第一端 134 第二端 135 支撐部 141 壓合部 142 第一面 143 第二面 144 14200948235 IX. Description of the Invention: [Technical Field] The present invention relates to the field of flexible circuit board manufacturing, and more particularly to a pressure plate device used in the production process of a flexible circuit board. [Prior Art] In the production process of the circuit board, in order to protect the plug-in end point (commonly known as the gold finger) and provide good connection performance, it is usually necessary to form a high-hardness and wear-resistant nickel layer on the insertion end of the circuit board and For highly chemically blunt gold layers, see ❹ Yu Hin Chan et al., 2002, Electronic Materials and Packaging, Fourth International Forum Meeting, December 2002, pp. 69-76. Wire Bondability of Au/ Ni bond pads: effects of metallisation schemes and processing conditions. In the flexible circuit board process, the method of forming a nickel-gold layer on the gold finger is generally gold plating and gold plating. In actual production, the circuit board needs to be placed in a gold-plated or gold-plated syrup. Therefore, before gold plating and gold plating, the surface of the board needs to be covered with a 0-proof coating to prevent nickel gold from being deposited in areas where nickel-gold layers are not formed, resulting in waste of cost. After the flexible circuit board is gold-plated and gold-plated, before the next process, the anti-coating film needs to be manually torn off. Since the flexible circuit board is soft, when the anti-coating film is torn, the operator needs to fix the flexible circuit board with one hand, and the other It is easy to tear off the anti-coating film with only one hand, and it is easy to cause the flexible circuit board to be broken due to improper force, resulting in poor product, and the anti-coating film which is torn off is usually wrinkled and difficult to recycle. Therefore, the artificial tearing of the anti-coating film takes time and labor, affects the yield of the product, and increases the cost of manufacturing the flexible circuit board. 7 200948235 It is necessary to provide a device that can improve the operation of tear-proof film. [Summary]: (4) A board device comprising: a frame comprising a carrier and a frame, the bracket being located on one side of the carrier; a carrier plate, the carrier plate being fixed to the carrier a driving device, the driving device is mounted on the bracket; the pressing member is connected to the driving device, and the pressing device controls the pressing member to be close to or away from the carrier plate; a controller, the controller and the driving device The devices are connected for controlling the movement of the drive unit to drive the holding member toward or away from the carrier plate. In the technical solution, the controller device controls the driving member and the pressing member to move the pressing member to press the end of the circuit board placed on the carrier board, so that the circuit board can be fixed when the coating is torn, and the operator can use the double The hand peels off the anti-clock film, avoiding the crushing of the circuit board caused by the tearing of the anti-mineral film operation. The anti-coating film is peeled off and the anti-coating film is reused. Therefore, the material cost of manufacturing the circuit board can be reduced, and the labor intensity and complexity can be reduced. [Embodiment] Hereinafter, a detailed description will be given of a pressure plate device provided by the present technical solution in conjunction with the drawings. Referring to FIG. 1 and FIG. 2', a first embodiment of the present invention provides a platen device 100 including a frame 11, a carrier plate 12, a driving device 10, a pressing member 14, and a controller 16. The rack 11 includes a stage ill and a bracket 112. The carrier board 12 is fixed to the stage 111. The driving device 10 is mounted on the bracket 112. The holding member 14 is connected to the driving device 13, and the controller 16 and the driving device 8 200948235 The connection 10 is connected to control the movement of the holding member 14 to move closer to or away from the carrier plate 12. The stage 111 has a generally rectangular carrying surface. The bracket 112 includes two support plates 114, a holding plate 113, and a mount 115. The two support plates 114 are located on one side of the stage 111 and are fixed at opposite ends. In this embodiment, the support plate 114 is perpendicular to the stage 111. Both ends of the holding plate 113 are respectively fixed to the two supporting plates 114. The mounting seat 115 is fixed to the holding plate 113 and extends perpendicularly to the fixing plate 113 in the direction of the stage 111. The mounting seat 115 is opposed to the mounting table 111. Referring to FIG. 3, the mounting seat 115 is centrally provided with a through hole 116. The extending direction of the through hole 116 is the same as the extending direction of the support plate 114. Referring to Figures 1 and 4, the carrier plate 12 is a rectangular plate having opposite first and second surfaces 121, 122. The first surface 121 is a rectangular plane, and the second surface 122 is in contact with the stage 111. The first surface 121 is provided with a positioning pin 123 at two corners of the end of the support plate 113. The positioning pin 123 has a cylindrical shape and protrudes vertically upward from the first surface 121. The Q carrier plate 12 is fixed to the stage 111 and can be soldered to the stage 111, for example. The carrier plate 12 can also be integrally formed with the stage 111. In this embodiment, in order to facilitate the adjustment of the position of the carrier plate 12 during operation, the carrier plate is fixed to the stage by bolts 124. Specifically, the loading block 1 is provided with a threaded hole (not shown), and the thread of the threaded hole is matched with the thread of the bolt 124. The corresponding position of the carrier plate 12 is provided with a long and narrow through hole 125. A bolt 124 passing through the through hole 125 is fixed to the stage 111. The carrier plate 12 is positionally adjustable within the length of the through hole 125. Referring to FIG. 3, the driving device 10 includes a power source 15 and a driving member 9 200948235 13, and the driving member 13 is a cylinder including a cylinder 131, a piston 132 and a piston rod 133. The cylinder body 131 includes a cylindrical cavity. The piston 132 has a circular shape. The piston rod 133 has a cylindrical shape with opposite first ends 134 and second ends 135. The cylinder block 131 is fixed to the mounting seat 115. The cylinder 131 extends in the same direction as the extending direction of the bracket 112. The piston 132 is located in the cavity of the cylinder block 131 and is in close contact with the inner wall of the cylinder block 131. The first end 134 of the piston rod 133 is fixed to the piston 132, and the piston rod 133 extends through the mounting seat 115 through the through hole 116 of the mounting seat 115. However, it can be understood that the piston rod 133 in this embodiment is a movable portion, and the driving member can also be a motion system that relies on hydraulic pressure, magnetic field or other energy as an energy source, such as a liquid cylinder, a magnetic actuator, etc., and other driving components are also A movable part should be provided. The power source 15 is connected to the driving member 13 by a conduit. In this embodiment, the power source 15 is an air compressor, and the power source 15 can supply compressed gas to the cylinder to drive the driving member 13 to move. The holding member 14 includes a support portion 141 and a nip portion 142 having opposite first and second faces 143, 144. The center of the first face 143 of the support portion 141 is coupled to the second end 135 of the piston rod 133. The support portion 141 extends in a direction perpendicular to the piston rod 133 and is parallel to the carrier plate 12. The nip 142 is fixed to the support portion 141 and is in contact with the second face 144 of the support portion 141, opposite to the carrier plate 12, which is made of an elastic material such as polyurethane (PU). The controller 16 has control circuitry therein, and the controller 16 is coupled to the power source 15 by which the controller 16 controls whether the power source 15 provides compressed air to the cylinders. Preferably, in order to facilitate the actual operation, the switch of the controller 16 is set to 200948235 into a pedal type. In this embodiment, in order to maintain the balance of the holding member 14, two sliders 117 are further disposed on the frame holding plate > 113. Two sliders 117 are located on both sides of the mounting base 115. The slider 117 is provided with a guide hole 119 extending in the same direction as the extending direction of the piston rod 133. Two guide posts 118 are disposed on the holding member 14, and the diameter of the guiding post 118 is matched with the guiding hole 119, and the guiding post 118 is fitted into the guiding hole 119. One end of the two guide posts 118 is fixed to the holding member 14. Therefore, when the holding member 14 moves, the two guide posts 118 can slide through the guiding hole 119, and the pressing member 14 has more stability of the pressing position due to the defining action of the two guiding columns 118. Referring to FIG. 1 and FIG. 5, when the platen device 100 is in operation, firstly, it is ensured that the pressing member 14 is at a certain distance from one end of the carrier plate 12, that is, the piston 132 of the cylinder is located in the cylinder away from the end of the carrier plate 12, and the piston rod The portion 133 is in the cylinder 121. In this state, the circuit board covered with the anti-plating film is placed on the first surface 121 of the carrier board 12, so that the positioning hole on the circuit board passes through the Q positioning pin 123. Thereafter, the controller 16 is operated, and the controller 16 controls the power source 15 to supply the compressed gas to the driving member 13, so that the piston 132 of the cylinder is moved to the lower end of the cylinder 131, and the piston rod 133 is moved downward together with the pressing member 14, the holding member 14 compresses one end of the circuit board on the first surface of the carrier board 12. At this point, the anti-coating of the board is torn off without manual pressing. When the platen device 100 is used, the position of the carrier plate 12 can be adjusted according to the size of the different circuit boards, so that the width of the lower circuit board of the holding member 14 is less than 1 cm after the pressing member 14 is pressed down. Referring to FIG. 6, a second embodiment of the present invention provides a press plate assembly 11 200948235. The step-by-step includes a protective cover 17 which is provided with a protective cover 17 in the range of the holding member i4. The protective cover 17 It is fixed on the frame 112 of the rack n. It is safer to use during use, which increases the safety of the operation of the platen unit. The pressure plate device provided by the technical solution can avoid the tearing and anti-coating operation: the crushing injury of the circuit board is generated, the anti-mine film which is torn off is smooth, can be recycled, and the material cost is reduced, and the device is used to press the circuit board to reduce The labor intensity of the workers has improved work efficiency and saved labor costs. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a platen device provided by an embodiment of the present technical solution. FIG. 2 is a side view of a platen device provided by an embodiment of the present technical solution. Figure 3 is a cross-sectional view taken along line π-ll of Figure 2. 4 is a top plan view of a platen device provided by an embodiment of the present technical solution. Fig. 5 is a schematic view showing the pressing of the pressure plate device provided by the embodiment of the present technical solution. Figure 6 is a front elevational view showing the mounting of the pressure plate device provided by the embodiment of the present technical solution. [Main component symbol description] 12 200948235 Drive unit 10. Rack 11. Carrier plate 12 Pressing member 14 Control power source 15 Controller 16 Shield 17 Platen device 100 ® Stage 111 Bracket 112 Retaining plate 113 Support plate 114 Mounting seat 115 through hole 116 slider 117 q guide post 118 guide hole 119 first surface 121 second surface 122 positioning pin 123 bolt 124 narrow through hole 125 cylinder 131 piston 132 13 200948235 piston rod 133 first end 134 second end 135 support Portion 141 nip 142 first side 143 second side 144 14