TW200947278A - Touch panel - Google Patents

Touch panel Download PDF

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Publication number
TW200947278A
TW200947278A TW97116568A TW97116568A TW200947278A TW 200947278 A TW200947278 A TW 200947278A TW 97116568 A TW97116568 A TW 97116568A TW 97116568 A TW97116568 A TW 97116568A TW 200947278 A TW200947278 A TW 200947278A
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Taiwan
Prior art keywords
layer
touch panel
conductive film
conductive layer
circuit board
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TW97116568A
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Chinese (zh)
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TWI363988B (en
Inventor
Wei-Long Huang
yun-yu Kang
Tai-Yi Guo
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Mildex Optical Inc
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Priority to TW97116568A priority Critical patent/TW200947278A/en
Publication of TW200947278A publication Critical patent/TW200947278A/en
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Publication of TWI363988B publication Critical patent/TWI363988B/zh

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Abstract

The present invention relates to a touch panel, comprising a lower conducting layer, a spacing layer, an upper conducting thin film and a soft circuit board. The spacing layer is disposed on the lower conducting layer and a notch is formed on one side of the spacing layer. The upper conducting thin film is disposed on the spacing layer. The soft circuit board comprises a connecting terminal clipped between the upper conducting thin film and the lower conducting layer corresponding to the notch. The area of the upper thin film is greater than the side edge area extended partially from the spacing layer to the lower conducting layer. When a protection layer with a large area is pasted on the upper conducting layer, the surface of the protection layer is not likely to form an obvious crease along the side edge of the lower layer, such as the spacing layer and the lower conducting layer, due to the extended area of the upper conducting layer.

Description

200947278 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種觸控面板,其上導電 層的下導電層及基板相比,具有較大的面積。、彳於下 【先前技術】 一般觸控面板係包含一上導電層及一下 控面板的製程良率好壞係與其上、 ,而觸 Τ电增之透明壤曾 料是否塗佈均勾有關,·再者,當上 導電材 材料塗佈完成後,在上、下層的透明::電層的透明導電 卜層的透明導電材料週 的導線成形區域尚需經印刷導線、上膠的動作,最後再二 軟性電路板壓合於上、下導電層—側邊之間。 然而軟性電路㈣具有厚度,將會改變觸控 精费塗佈完成的透明導電材料厚度,尤Α是將雷爲本 透明導電材料往上推擠,造成 、導電層之 影響整體平坦度。 成上導電層-側邊的隆起,而 ο 為解決上述缺點,係可於上導電層再設— :該保護層藉由一黏膠層貼附於該上導電薄膜上’,、且黏膠 層對應軟性電路板位置形成-黏膠缺口,以容置上導= 膜受軟性電路板推擠而向上隆起的部分。 電溥 然而’實際應用於一般消費性 單一整體平面效杲,係讜思 马求達到 呆護層之面積往往涵蓋超出觸浐面柘 的可視區及作動區的範圍,但由㈣護層 觸控結構以外的鄰近區媸 等電層與 保護層表面在觸控結構的邊2於相同平面’將可能造成 、邊緣處形成摺痕,影響整體平面 4 200947278 的外觀。 【發明内容】 有鑑於此,本發明之主要目的係提供一種觸控面板, 其上導電層與位於下層的下導電層及基板相比,具有較大 的面積,降低保護層表面於觸控結構邊緣產生摺痕的情 欲達上述目的所使用之主要技術手段,係令該觸控面 φ 板包含: 一下導電層; 一間隔層,係設於該下導電層上且其—側邊形成缺 Π ; 一上導電薄膜,係設於該間隔層上,該上導電薄膜之 面積係大於間隔層與下導電層而部分延伸出間隔層之側 邊; 一軟性電路板,係具有一連接端,該連接端係對應該 ®缺口而夾設於該下導電層與上導電薄膜之間。 前述上導電層可為一導電玻璃基板,或是由一基板及 一設於基板的上導電薄膜所構成。 本發明可進一步包含一保護層,其面積形狀係對應上 導電薄膜,該保護層係藉由一黏膠層貼附於該上導電薄膜 上,且黏膝層對應軟性電路板位置形A一讓膠σ,以容納 上導電薄膜受軟性電路板推擠而向上隆起的部分。 、 再者,為使保護層貼附於上導電薄膜時,讓膠口内的 5 200947278 空氣可順利排出,本發明進一步於上導電薄膜對應讓膠口 之位置形成開孔,以助於讓膠口内受到保護層貼附時所排 擠的空氣得以經由該開孔排出。 當以較大面積的上導電薄膜設於下層的下導電層及基 板上方,使得保護層在貼附於上導電薄膜時,因上導電薄 膜面積的延伸,保護層表面較不易沿著下方之間隔層與下 導電層等下層堆疊結構的側邊形成明顯摺痕。 ® 【實施方式】 明參閱第一圖及第二圖所示,係本發明一較佳實施例 之立體分解圖以及部分剖視圖,其包含: 下導電層(1 〇),本實施例中,該下導電層(1 〇)係包含一塑膠基板(1 1 )及一設於該塑膠基板(1 1)之下導電薄膜(12),其亦可為單一的Ιτ〇(氧 化姻锡)導電玻璃基板,下導電層(10)上係形成有導 電線路; ❹ _ 間隔層(2 0)(見第二圖),係設於該下導電層 (1 0)上,其包含有間隙子(2 〇 〇 )及設於四周側邊 而圍繞該些間隙子(2 〇 〇 )的雙面膠(2 〇丄),該雙 面膠(2〇1)係於-側邊形成一缺口(202); •^導電薄膜(3〇),其表面形成有導電線路,該 上導電薄膜(30)係設於該間隔層(20)上,該上導 電薄膜f Q 、 之面積係大於間隔層(2〇)與下導電層 (1 〇 )而部分延伸出間隔層(2 0 )之側邊,再者,該 6 200947278BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a touch panel having a larger area than a lower conductive layer of a conductive layer and a substrate. [Previous technology] Generally, the touch panel includes an upper conductive layer and a lower control panel, and the process yield is good or bad, and the transparent transparent soil that has been touched by electricity is related to whether or not the coating is coated. · Furthermore, after the coating of the upper conductive material is completed, the conductive forming of the upper and lower layers of the transparent conductive layer of the transparent layer of the electrical layer requires the printing of the wires and the sizing action, and finally The second flexible circuit board is pressed between the upper and lower conductive layers - between the sides. However, the soft circuit (4) has a thickness, which will change the thickness of the transparent conductive material coated by the touch precision, especially pushing the lightning-based transparent conductive material upward, resulting in the influence of the conductive layer on the overall flatness. Forming a conductive layer-side ridge, and ο to solve the above disadvantages, the upper conductive layer can be further disposed - the protective layer is attached to the upper conductive film by an adhesive layer, and the adhesive The layer corresponds to the position of the flexible circuit board - a gap in the adhesive to accommodate the upper portion of the film that is pushed up by the flexible circuit board. Electricity is actually applied to the general consumption of a single overall planar effect. It is the range of the visible area and the active area that the smuggling layer of the smuggling layer is beyond the reach of the squatting surface, but by (4) the touch layer of the protective layer The adjacent regions outside the structure, the isoelectric layer and the surface of the protective layer on the side 2 of the touch structure in the same plane 'will be likely to cause creases at the edges, affecting the appearance of the overall plane 4 200947278. SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a touch panel having a conductive layer having a larger area than a lower conductive layer and a substrate disposed on the lower layer, and reducing the surface of the protective layer on the touch structure. The main technical means used for the purpose of the crease of the crease is that the touch surface φ plate comprises: a lower conductive layer; a spacer layer is disposed on the lower conductive layer and the side thereof is formed with a defect An upper conductive film is disposed on the spacer layer, the upper conductive film has a larger area than the spacer layer and the lower conductive layer and partially extends from a side of the spacer layer; and a flexible circuit board has a connection end, The connection end is sandwiched between the lower conductive layer and the upper conductive film corresponding to the gap. The upper conductive layer may be a conductive glass substrate or a substrate and an upper conductive film disposed on the substrate. The present invention may further comprise a protective layer having an area shape corresponding to the upper conductive film, the protective layer being attached to the upper conductive film by an adhesive layer, and the adhesive knee layer corresponding to the position of the flexible circuit board Glue σ to accommodate the portion of the upper conductive film that is pushed up by the flexible circuit board. Furthermore, in order to attach the protective layer to the upper conductive film, the air in the rubber port can be smoothly discharged. The present invention further forms an opening in the upper conductive film corresponding to the position of the rubber mouth to help the inside of the rubber mouth. The air displaced by the protective layer is discharged through the opening. When a large area of the upper conductive film is disposed on the lower conductive layer and the upper layer of the lower layer, when the protective layer is attached to the upper conductive film, the surface of the protective layer is less likely to be spaced along the lower surface due to the extension of the area of the upper conductive film. The side edges of the lower layer stack structure such as the lower conductive layer form a significant crease. EMBODIMENT OF THE INVENTION Referring to the first and second figures, a perspective exploded view and a partial cross-sectional view of a preferred embodiment of the present invention include: a lower conductive layer (1 〇), in this embodiment, The lower conductive layer (1 〇) comprises a plastic substrate (1 1 ) and a conductive film (12) disposed under the plastic substrate (1 1 ), which may also be a single Ιτ〇 (oxidized sulphur) conductive glass. a conductive line is formed on the substrate and the lower conductive layer (10); ❹ _ spacer layer (20) (see FIG. 2) is disposed on the lower conductive layer (10) and includes a spacer (2) 〇〇) and a double-sided tape (2 〇丄) disposed around the side edges and surrounding the gaps (2 〇〇), the double-sided tape (2〇1) is formed on the side to form a notch (202) • The conductive film (3〇) has a conductive line formed on its surface, and the upper conductive film (30) is disposed on the spacer layer (20), and the area of the upper conductive film f Q is larger than the spacer layer (2) 〇) and the lower conductive layer (1 〇) partially extend out of the side of the spacer layer (20), and further, the 6 200947278

,該開孔(3 1 (4 1 )可供連接上、 ,係具有一連接端(41) 十應前述缺口(202)而設於該上 7導電薄骐(1 2)之間,該連接端 、下導電薄膜(30)(12)上的 導電線路; 保護層(5 〇 ),係面積形狀對應上導電薄膜(3 〇),該保護層(50)藉由—黏膠層(60)貼附於該 上導電薄膜(3 0 上’該黏膠層(6 0 )對應軟性電路 板(40)之連接端(41)位置形成一讓膠口(61), 以谷納上導電薄膜(3〇)受軟性電路板(4〇)推擠而 向上隆起的部分,該讓膠口(6 1 )並與前述上導電薄媒 (3 0 )之開孔(3 1 )連通。 該保護層(50)對應間隔層(20)周邊之雙面膠 (201)的位置以及軟性電路板(4〇)之連接端(4 丄)位置形成有色漆(500),用以遮蔽上導電薄膜 〇)、下導電層(10)之導電線路與軟性電路板(4〇) 的夾設部位所構成的觸控面板作動區,藉以維持美觀。 由於前述讓膠口(6 1)與上導電薄膜(3〇)之開 孔(3 1 )連通,當保護層(5 ◦)貼附在上導電薄膜(3 0)時,於黏膠層(60)之讓膠口(6 1)所排擠的空 氣得以經由開孔(3 1 )排出,使得讓膠口( 6 1 )不會 因空氣無法排出造成保護層(50)在此位置產生隆起。 7 200947278 综上所述,本發明之上導電薄膜係設計以較大面積, 當一保護層#自一黏膠層設於其上日夺,由^電薄膜的 面積延伸,可使保護層表面不易沿著下方間隔層與下導電 層等下層堆疊結構的側邊形成明顯摺痕;再者,令該黏膠 層對應軟性電路板之夾設位置形成有一讓膠口,以容置上 導電薄膜受軟性電路板推擠的隆起部分,同時於上導電薄 膜形成連通讓膠口的開孔,使貼設保護層於黏膠層上時, 不會因為上導電薄膜的隆起以及讓膠口内空氣而影響平坦 〇度,進而使整個觸控面板達到全平面。 【圖式簡單說明】 第一圖:係本發明一較佳實施例之立體分解圖。 第二圖:係本發明一較佳實施例之部分剖視圖。 【主要元件符號說明】 (1 0 )下導電層 (1 2 )下導電薄膜 (2 0 〇 )間隙子 (2 〇 2 )缺口 (3 1 )開孔 (4 1 )連接端 (5 〇 0 )色漆 (6 1 )讓膠口 (11)塑膠基板 (2 0 )間隔層 (2 0 1 )雙面膠 (3 0 )上導電薄膜 (4 0 )軟性電路板 (5 0 )保護層 (6 0 )黏膠層The opening (3 1 (4 1 ) is connectable, and has a connecting end (41) disposed between the upper 7 conductive thin rafts (12) according to the notch (202), the connection Conductive lines on the end and lower conductive films (30) (12); protective layer (5 〇), the area shape corresponding to the upper conductive film (3 〇), the protective layer (50) by the adhesive layer (60) Attached to the upper conductive film (the upper adhesive layer (60) corresponds to the connection end (41) of the flexible circuit board (40) to form a glue mouth (61), and the upper conductive film ( 3)) a portion which is raised upward by a flexible circuit board (4 turns), and the glue port (6 1 ) is communicated with the opening (31) of the upper conductive thin medium (30). (50) forming a colored lacquer (500) corresponding to the position of the double-sided tape (201) around the spacer layer (20) and the connection end (4 丄) of the flexible circuit board (4) for shielding the upper conductive film 〇) The touch panel actuating area formed by the conductive line of the lower conductive layer (10) and the sandwiched portion of the flexible circuit board (4〇) is used to maintain the aesthetic appearance. The rubber port (6 1) and the upper conductive layer are formed as described above. The opening (3 1 ) of the film (3 〇) is connected, and when the protective layer (5 ◦) is attached to the upper conductive film (30), the glue port (6 1) is squeezed at the adhesive layer (60). The air can be discharged through the opening (3 1 ) so that the rubber (6 1 ) does not cause the protective layer (50) to bulge at this position due to the inability to discharge the air. 7 200947278 In summary, the upper surface of the present invention is electrically conductive. The film system is designed to have a large area. When a protective layer is disposed on the surface of an adhesive layer, the surface of the protective layer is extended, so that the surface of the protective layer is not easily along the lower layer of the lower spacer layer and the lower conductive layer. The side of the stacked structure forms a clear crease; further, the adhesive layer is formed with a glue opening corresponding to the position of the flexible circuit board to accommodate the raised portion of the conductive film pushed by the flexible circuit board, and The upper conductive film forms an opening for connecting the adhesive opening, so that when the protective layer is applied on the adhesive layer, the flatness of the upper conductive film is not affected by the bulging of the upper conductive film and the air in the rubber mouth, thereby achieving the entire touch panel Full plane. [Simple description of the diagram] The first picture: the present invention A perspective view of a preferred embodiment of the present invention. Fig. 2 is a partial cross-sectional view of a preferred embodiment of the present invention. [Description of main component symbols] (10) A conductive film under the conductive layer (12) (20 〇 ) gap (2 〇 2 ) notch (3 1 ) opening (4 1 ) connection end (5 〇 0 ) color paint (6 1 ) to allow glue (11) plastic substrate (20) spacer layer (2 0 1 Double-sided adhesive (30) on the conductive film (40) flexible circuit board (50) protective layer (60) adhesive layer

Claims (1)

200947278 十、申請專利範圍: 1 ‘ 一種觸控面板,係包含: 一下導電層; 一間隔層,係設於該下導電層上且其—側邊形成缺 口; ' 一上導電薄膜,係設於該間隔層上,該上導電薄膜之 -面積係大於間隔層與下導電層而部分延伸出間隔層之側 邊; ® 一軟性電路杈,係具有一連接端,該連接端係對應該 缺口而夾設於該下導電層與上導電薄膜之間。 " 2 .如申請專利範圍第丄項所述之觸控面板,係進一 部包含一保額’丨面積形狀係對應電薄膜,該保護 層係藉由一黏膠層貼附於該上導電薄膜上,且黏膠層對應 軟性電路板位置形成一讓膠口,以容納上導電薄膜受軟性 電路板推擯·而向上隆起的部分。 3·如申請專利範圍第2項所述之觸控面板,該上導 ®電薄膜具有一開孔,係對應軟性電路板之連接端位置而與 前述黏膠層之讓谬口連通。 4 .如申請專利範圍第丄、2或3項所述之觸控面板, 該間隔層包含有間隙子及設於四周側邊而圍繞該些間隙子 的雙面膠,前述缺口即形成於該雙面膠上。 5 .如申請專利範圍第4項所述之觸控面板,該保護 層對應間隔層周邊之雙面膠的位置以及軟性電路板之連接 端位置形成有色漆。 200947278 申=利範圍第卜2或3項所述之觸控面板, b下導電層係包含一塑塍其*5 It 启膠基板及一下導電薄膜。 兮如二請專利範圍第!、2或3項所述之觸控面板, 該下導電層係為一I To r备儿 υ (氧化銦錫)導電玻璃。 8如申請專利範圍第4項所述之觸控面板,該下導 電層係包含一塑膠基板及一Τ導電薄膜。 9·如中請專利範圍第4項所述之觸控面板,該下導 電層係為一 I TO (氧化銦錫)導電玻璃。 Ο 1 ◦.如申凊專利範圍第5項所述之觸控面板,該下 導電層係包含一塑膠基板及一下導電薄膜。 1 1 ·如申請專利範圍第5項所述之觸控面板,該下 導電層係為一 I TO (氧化銦錫)導電玻璃。 ^ 、圖式: 如次頁200947278 X. Patent application scope: 1 ' A touch panel comprising: a conductive layer; a spacer layer disposed on the lower conductive layer and having a side-side gap; 'an upper conductive film is provided on In the spacer layer, the upper conductive film has an area larger than the spacer layer and the lower conductive layer and partially extends from the side of the spacer layer; a soft circuit has a connection end, and the connection end corresponds to the gap The interlayer is disposed between the lower conductive layer and the upper conductive film. " 2 . The touch panel of claim 2, wherein the touch panel comprises a protective film having an area corresponding to an area, wherein the protective layer is adhered to the conductive layer by an adhesive layer. On the film, the adhesive layer forms a glue mouth corresponding to the position of the flexible circuit board to accommodate the upper conductive film which is pushed up by the flexible circuit board. 3. The touch panel of claim 2, wherein the upper conductive film has an opening that communicates with the mouth of the adhesive layer corresponding to the position of the connecting end of the flexible circuit board. 4. The touch panel of claim 2, 2 or 3, wherein the spacer layer comprises a spacer and a double-sided tape disposed around the side edges and surrounding the spacers, wherein the gap is formed in the Double-sided tape. 5. The touch panel of claim 4, wherein the protective layer forms a colored lacquer corresponding to the position of the double-sided tape around the spacer layer and the position of the connecting end of the flexible circuit board. 200947278 The touch panel of the second or third aspect of the invention, the conductive layer of the b layer comprises a plastic substrate and a conductive film. For example, please ask for the scope of the patent! The touch panel of claim 2 or 3, wherein the lower conductive layer is an I To 备 (indium tin oxide) conductive glass. 8. The touch panel of claim 4, wherein the lower conductive layer comprises a plastic substrate and a conductive film. 9. The touch panel of claim 4, wherein the lower conductive layer is an I TO (indium tin oxide) conductive glass. The touch panel of claim 5, wherein the lower conductive layer comprises a plastic substrate and a lower conductive film. 1 1 The touch panel of claim 5, wherein the lower conductive layer is an I TO (indium tin oxide) conductive glass. ^, schema: as the next page 1010
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8937610B2 (en) 2010-05-11 2015-01-20 Tpk Touch Solutions Inc. Dual-substrate capacitive touch panel
US8947399B2 (en) 2010-05-11 2015-02-03 Tpk Touch Solutions Inc. Dual-substrate capacitive touch panel
US9116589B2 (en) 2010-01-26 2015-08-25 Tpk Touch Solutions Inc. Single-layer projected capacitive touch panel and method of manufacturing the same
US9395857B2 (en) 2007-12-24 2016-07-19 Tpk Holding Co., Ltd. Capacitive touch panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9395857B2 (en) 2007-12-24 2016-07-19 Tpk Holding Co., Ltd. Capacitive touch panel
US9116589B2 (en) 2010-01-26 2015-08-25 Tpk Touch Solutions Inc. Single-layer projected capacitive touch panel and method of manufacturing the same
US8937610B2 (en) 2010-05-11 2015-01-20 Tpk Touch Solutions Inc. Dual-substrate capacitive touch panel
US8947398B2 (en) 2010-05-11 2015-02-03 Tpk Touch Solutions Inc. Dual-substrate capacitive touch panel
US8947399B2 (en) 2010-05-11 2015-02-03 Tpk Touch Solutions Inc. Dual-substrate capacitive touch panel

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