200945149 九、發明說明： 【發明所屬之技術領域】 本發明關於一種觸控面板，尤指一種電容式觸控面 板。 【先前技術】 習知電容式觸控面板可分為絕對位置式及矩陣式兩 種。請參考第五圖所示，絕對位置式的電容式觸控面板主 要由上而下堆疊有一保護層（50)、一觸控層（51)、_緩衝 〇 層（52)及一基板（53)。 其中，保護層（50)係透明絕緣且具有高硬度的防刮保 護作用，故位於最外層以供手指碰觸；進一步參考第六圖 所示，該觸控層（51)係包含複數透明感應電極（51〇)，一 般為氧化銦錫（I το)透明導電電極，各透明感應電極（51〇) 係依照需求而設計成不同形狀樣式以作為電容感測觸控按 鍵，由所有透明感應電極（510)共同形成的區域即為一可 視區（511)，且各透明感應電極（5〗〇 )分別自可視區（51丄） ©外圍經由一金屬訊號導線（512 )連接設在側邊的一電連接 用電路板（513)，透過該電連接用電路板（513)可連接一外 部的控制晶片（圖中未示）·，該緩衝層（52)係透明絕緣，係 供前述透明感應電極貼附，主要材質為二氧化矽，該基板 (53)—般則為玻璃材質。 關於矩陣式的電容式觸控面板，又可分為單層基板構 造及雙層基板構造，單層基板請參考第七圖所示，係由上 而下堆疊有一保護層（60)、一第一觸控層（61)、一第一緩 200945149 衝層（62)、一基板（63)、一第二緩衝層（64)、一第二觸控 層（65)以及一絕緣層（66);雙層基板構造請參考第八圖所 不，係由上而下依序堆疊有一保護層（7〇)、一第一基板 (71)、一第一緩衝層（72)、一第一觸控層（73)、一間隔層 (74)、一第二觸控層（75)、一第二緩衝層（76)及一第二基 板（77)，其中，進一步參考第九圖所示，前述單層或雙層 基板的矩陣式電容式觸控面板，其第一觸控層（61，73)及 第一觸控層（65, 75)，分別包含複數作為單軸的行電極（81) ©或列電極（80)，而成為上下交錯的χ軸與γ軸的電容感測 觸控按鍵，各列電極（80)亦同樣經由金屬訊號導線（82)連 接至一設於側邊的電連接用電路板（9〇)，而各行電極（81) 則因與電連接用電路板（90)的距離相近，所以個別以一透 明訊號電極（83)作為連接導線，一般為氧化銦錫（IT〇)透 明導電電極。 無論前述何種形式的觸控面板’連接觸控按鍵至電連 接用電路板之間線路其電阻值差異將影響電容式觸控面板 ®的感應能力，以現行控制晶片的能力，只可容許每條訊號 導線之間的最大電阻值相差在1〇〇歐姆以内，由於金屬材 料的電阻值極小，是以，現行皆以金屬線作為訊號傳輸的 導線，以避免最長導線與最短導線兩者之間的電阻值差異 過大’然而’使用金屬導線雖可解決電阻值差異過大的問 題，但其缺點在於製作金屬導線需要增購製程相關設備， 除耗費高額設備成本，在製程上更必須額外多增加數道金 屬線製作流程’所以亦使觸控面板的整體製作費時且降低 200945149 生產效率。 【發明内容】 由上述說明可知，習知電容式觸控面板上構成按鍵的 透明感應電極係透過金屬導線與電連接用電路板來和控制 晶片進行訊號傳輸，但金屬線材在製程上不僅耗費設備成 本’且多道製程更降低生產效率。 有蓉於此，本發明之主要目的係提供一電容式觸控面 〇 板之線路構造，可免去金屬導線的製作流程，而降低成本 以及提尚生產效能。 欲達成上述目的之主要技術手段’係令該電容式觸控 面板之線路構造應用於電容式觸控面板的至少一觸控層 上，係包含： 一電連接用電路板’係設於該觸控層之一側，可連接 一外部的控制晶片； 複數透明感應電極’係作為電容感測觸控按鍵而形成 ®該觸控層上，其中，各透明感應電極係分別經由一透明訊 號電極連接至該電連接用電路板，且各透明訊號電極之線 寬係根據該透明感應電極與電連接用電路板之間的距離而 成正比。 由於透明訊號電極的電阻值遠大於金屬導線的電阻 值，是以，本發明係以不同長度的透明訊號電極作為訊號 導線，以取代金屬導線而降低成本，並設計成不同的寬度， 使得各透明訊號電極線之間的電阻值差距縮小，而不致影 200945149 響電谷式觸控面板之感應能力。 【實施方式】 請參考第一圖所示，係本發明一較佳實施例，係應用 於一電容式觸控面板之至少一觸控層（1〇)上，其包含： 一電連接用電路板（2〇a) ’係設於該觸控層（丨〇)之一 側’可連接一外部的控制晶片（圖中未示），該電連接用電 路板（20a)可為一軟性電路板； β 複數透明感應電極（3 〇 )，係作為電容感測觸控按鍵而 形成該觸控層（1〇)上，各透明感應電極（3〇)係分別經由一 透明訊號電極（40)連接至該電連接用電路板（2〇a)，其中， 各透明訊號電極（4〇)之線寬係根據透明感應電極（3〇)與電 連接用電路板（2〇a)之間的距離而定，距離電連接用電路 板（20a)最短的透明感應電極（3〇)，其所連接的透明訊號 電極（40a)之線寬最小’反之’距離電連接用電路板（2〇a) 最遠的透明感應電極（3〇)，其所連接的透明訊號電極（4〇b) ®之線寬最大。 由於長度越長的透明訊號電極（4〇)，其電阻值也越 大’兩者呈正比關係；又電阻值與透明訊號電極（4〇)之寬 度呈反比’是以，長度越長的透明訊號電極（40)必須加大 其寬度’使得各透明訊號電極（4〇)之間的電阻值差異在現 行控制晶片所能容許的最大值，即電阻值差異為1 00歐姆 以内。 請參考第二圖所示’係本發明另一較佳實施例，係應 200945149 用於一電容式觸控面板之上、下觸控層（n，12)上，該上、 下觸控層（11，12)係上下相對設置，本實施例係包含： 一電連接用電路板（2 〇b)，係設於上、下觸控層（11，12) 之間而位於一側，可連接一外部的控制晶片（圖中未示）， η亥電連接用電路板（2〇b)可為一軟性電路板； 複數上透明感應電極（31)，係形成上觸控層（11)上， 其中，各上透明感應電極（31)係串接成複數條縱向平行的 行電極（310)，各行電極（310)並於一端連接至該電連接用 ® 電路板（2)，以構成縱軸的電容感測觸控按鍵； 複數下透明感應電極（32)，係形成下觸控層（12)上， 其中，各下透明感應電極（32)係串接成複數條橫向平行且 與前述行電極（310)交錯的列電極（320)，各列電極（32〇)並 於一端藉由一透明訊號電極（4〇)連接至該電連接用電路板 (2 0b) ’以構成橫軸的電容感測觸控按鍵；再者，距離電 連接用電路板（20b)最短的下透明感應電極（32)，其所連 接的透明訊號電極（4〇c)之線寬最小，反之，距離越遠則 線寬越大，故距離電連接用電路板（2〇b)最遠的下透明感 應電極（32) ’其所連接的透明訊號電極（4〇d)之線寬最大。 本實施例中’由於上觸控層（11)的上透明感應電極 係縱向串接而直接於一端連接至電連接用電路板（2 〇b)， 故連接每一串縱向上透明感應電極（31)的透明訊號電極 (40e)長度均相近；而下觸控層（12)之下透明感應電極（32) 係橫向串接，故必須分別藉由不同長度的透明訊號電極（4〇) 連接至電連接用電路板（20b)，並藉由前述的線寬變化原 200945149 則使各透明訊號電極（40)之間的電阻值差異在標準值内。 則述上觸控層（11 )的上透明感應電極（3丨）亦可以橫向 串接而以不同長度及線寬的透明訊號電極連接至電連接用 電路板（20b)，但相對地，下觸控層（12)的下透明感應電 極（32)串接方式則必須為縱向串接以與上透明感應電極交 錯開。 呀參考第二及第四圖所示，與前述各實施例不同處在 於，觸控層上的感應電極係經由透明訊號電極而直接連接 © 至一設於一側的控制晶片（21)。 综上所述，本發明藉由透明訊號電極作為訊號導線而 連接觸控層的透明感應電極與電連接用電路板，透過電連 接用電路板連接到外部的控制晶片，並令距離電連接用電 路板越遠的透明感應電極所連接的透明訊號電極的線寬越 大，使得各透明訊號電極之間的電阻值差異在標準值以 内，而不致影響電容式觸控面板的感應能力，故其可取代 習知金屬線材，免除增購金屬製程設備的成本，同時省去 ®多道金屬製程，使得生產效率大大提升。 【圖式簡單說明】 第一圖：本發明第一實施例之俯視圖。 第二圖：本發明第二實施例之俯視圖。 第三圖：本發明第三實施例之俯視圖。 第四圖：本發明第四實施例之俯視圖。 第五圖：習知絕對位置式的電容式觸控面板剖視圖。 200945149 第/、圖：係絕對位番 + 置式電谷式觸控面板的觸控層佈線 示意圖。 第七圖各知矩陣式電容式觸控面板的剖視圖。 第八圖1知矩陣式電容式觸控面板的剖視圖。The invention relates to a touch panel, and more particularly to a capacitive touch panel. [Prior Art] Conventional capacitive touch panels can be classified into absolute position type and matrix type. Referring to FIG. 5, the absolute position capacitive touch panel is mainly provided with a protective layer (50), a touch layer (51), a buffer layer (52) and a substrate (53). ). Wherein, the protective layer (50) is transparent and has a high hardness scratch protection function, so it is located at the outermost layer for the finger to touch; further referring to the sixth figure, the touch layer (51) includes a plurality of transparent sensing The electrode (51〇) is generally an indium tin oxide (I το) transparent conductive electrode, and each transparent sensing electrode (51〇) is designed into different shapes according to requirements as a capacitive sensing touch button, and all transparent sensing electrodes are used. (510) The commonly formed area is a visible area (511), and each of the transparent sensing electrodes (5 〇) is respectively connected to the side of the visible area (51丄) from the periphery via a metal signal wire (512). An electrical connection circuit board (513) through which an external control chip (not shown) can be connected through the electrical connection circuit board (513). The buffer layer (52) is transparently insulated for the aforementioned transparent sensing. The electrode is attached, the main material is cerium oxide, and the substrate (53) is generally made of glass. The matrix type capacitive touch panel can be further divided into a single-layer substrate structure and a two-layer substrate structure. For the single-layer substrate, please refer to the seventh figure, and a protective layer (60) is stacked from top to bottom. a touch layer (61), a first buffer layer 20096149, a substrate (63), a second buffer layer (64), a second touch layer (65), and an insulating layer (66) For the double-layer substrate structure, please refer to the eighth figure. A protective layer (7〇), a first substrate (71), a first buffer layer (72), and a first touch are sequentially stacked from top to bottom. a control layer (73), a spacer layer (74), a second touch layer (75), a second buffer layer (76), and a second substrate (77), wherein, further referring to the ninth figure, The first capacitive layer (61, 73) and the first touch layer (65, 75) of the matrix capacitive touch panel of the single-layer or double-layer substrate respectively comprise a plurality of row electrodes as a single axis (81 ) or the column electrode (80), which becomes the capacitive sensing touch button of the χ axis and the γ axis which are staggered up and down, and the column electrodes (80) are also connected to the one via the metal signal wire (82). The circuit board (9〇) for electrical connection on the side, and the row electrode (81) of each row are similar to the circuit board (90) for electrical connection, so a transparent signal electrode (83) is used as the connecting wire, generally Indium tin oxide (IT〇) transparent conductive electrode. Regardless of the type of touch panel described above, the difference in resistance between the touch buttons and the circuit board for electrical connection will affect the sensing capability of the capacitive touch panel®. With the current ability to control the chip, only per The maximum resistance between the signal wires is within 1 〇〇 ohm. Since the resistance of the metal material is extremely small, the current wire is used as the signal transmission wire to avoid between the longest wire and the shortest wire. The difference in resistance value is too large. 'However, the use of metal wires can solve the problem of excessive difference in resistance value, but the disadvantage is that the production of metal wires requires the purchase of process-related equipment. In addition to the high equipment cost, it is necessary to increase the number in the process. The production process of the metal wire is therefore making the overall production of the touch panel time-consuming and reducing the production efficiency of 200945149. SUMMARY OF THE INVENTION It can be seen from the above description that the transparent sensing electrode constituting the button on the conventional capacitive touch panel transmits signal transmission through the metal wire and the electrical connection circuit board and the control chip, but the metal wire not only consumes equipment in the process. Cost 'and multiple processes reduce production efficiency. In view of this, the main object of the present invention is to provide a circuit structure of a capacitive touch panel, which can eliminate the manufacturing process of the metal wires, thereby reducing the cost and improving the production efficiency. The main technical means for achieving the above purpose is to apply the circuit structure of the capacitive touch panel to at least one touch layer of the capacitive touch panel, comprising: an electrical connection circuit board is disposed on the touch One of the control layers can be connected to an external control chip; the plurality of transparent sensing electrodes are formed as capacitive sensing touch buttons on the touch layer, wherein the transparent sensing electrodes are respectively connected via a transparent signal electrode To the circuit board for electrical connection, the line width of each transparent signal electrode is proportional to the distance between the transparent sensing electrode and the circuit board for electrical connection. Since the resistance value of the transparent signal electrode is much larger than the resistance value of the metal wire, the present invention uses different lengths of transparent signal electrodes as signal wires to replace the metal wires to reduce the cost and design different widths, so that the transparent The difference in resistance between the signal electrode lines is reduced, so as not to affect the sensing capability of the 200945149 ring-type touch panel. [Embodiment] Referring to the first embodiment, a preferred embodiment of the present invention is applied to at least one touch layer (1) of a capacitive touch panel, and includes: an electrical connection circuit The board (2〇a) 'connected to one side of the touch layer (丨〇) can be connected to an external control chip (not shown), and the circuit board (20a) for electrical connection can be a flexible circuit a plurality of transparent sensing electrodes (3 〇) are formed as capacitive sensing touch buttons to form the touch layer (1 〇), and each transparent sensing electrode (3 〇) is respectively passed through a transparent signal electrode (40) Connected to the electrical connection circuit board (2〇a), wherein the line width of each transparent signal electrode (4〇) is based on the transparent sensing electrode (3〇) and the electrical connection circuit board (2〇a) Depending on the distance, the shortest transparent sensing electrode (3〇) from the electrical connection board (20a) has a minimum line width of the transparent signal electrode (40a) connected to the circuit board (2〇a). The farthest transparent sensing electrode (3〇), the transparent signal electrode (4〇b) ® connected to it has the most line width . Due to the longer length of the transparent signal electrode (4〇), the resistance value is larger, 'there is a proportional relationship between the two; and the resistance value is inversely proportional to the width of the transparent signal electrode (4〇). The signal electrode (40) must be increased in width so that the difference in resistance between the transparent signal electrodes (4 turns) is the maximum allowable value of the current control wafer, that is, the difference in resistance value is within 100 ohms. Referring to the second embodiment, another preferred embodiment of the present invention is applied to the upper and lower touch layers (n, 12) of a capacitive touch panel and 200945149. The (11, 12) is disposed above and below. The embodiment includes: an electrical connection circuit board (2 〇b) disposed between the upper and lower touch layers (11, 12) and located on one side. Connecting an external control chip (not shown), the circuit board (2〇b) can be a flexible circuit board; the plurality of transparent sensing electrodes (31) form an upper touch layer (11) The upper transparent sensing electrodes (31) are connected in series to a plurality of longitudinally parallel row electrodes (310), and the row electrodes (310) are connected at one end to the electrical connection® circuit board (2) to form a capacitive sensing touch button on the vertical axis; a plurality of transparent sensing electrodes (32) are formed on the lower touch layer (12), wherein each of the lower transparent sensing electrodes (32) is connected in series to form a plurality of horizontal parallel lines and The row electrodes (320) are staggered by the row electrodes (320), and the column electrodes (32 〇) are connected to each other by a transparent signal electrode (4). Connected to the electrical connection circuit board (20b)' to form a capacitive sensing touch button on the horizontal axis; further, the shortest transparent sensing electrode (32) from the electrical connection circuit board (20b), The connected transparent signal electrode (4〇c) has the smallest line width. On the contrary, the farther the distance is, the larger the line width is, so the lower transparent sensing electrode (32) which is farthest from the electrical connection circuit board (2〇b) The connected transparent signal electrode (4〇d) has the largest line width. In this embodiment, since the upper transparent sensing electrodes of the upper touch layer (11) are vertically connected in series and directly connected to the electrical connection circuit board (2 〇b) at one end, each vertical longitudinal transparent sensing electrode is connected ( The transparent signal electrodes (40e) of 31) are all similar in length; and the transparent sensing electrodes (32) under the lower touch layer (12) are connected in series, so they must be connected by transparent signal electrodes (4〇) of different lengths respectively. To the electrical connection board (20b), and by the aforementioned line width change original 200945149, the difference between the resistance values of the transparent signal electrodes (40) is within the standard value. The upper transparent sensing electrodes (3) of the touch layer (11) may also be connected in series to the horizontal connection and connected to the electrical connection circuit board (20b) with transparent signal electrodes of different lengths and line widths, but relatively The lower transparent sensing electrodes (32) of the touch layer (12) must be connected in series to be vertically connected in series to be interleaved with the upper transparent sensing electrodes. Referring to the second and fourth figures, the difference from the foregoing embodiments is that the sensing electrodes on the touch layer are directly connected to the control wafer (21) disposed on one side via the transparent signal electrodes. In summary, the present invention connects the transparent sensing electrode of the touch layer and the circuit board for electrical connection by using the transparent signal electrode as a signal wire, and is connected to the external control chip through the circuit board for electrical connection, and makes the distance electrical connection The farther the transparent sensing electrode of the circuit board is connected, the larger the line width of the transparent signal electrode is, so that the difference between the resistance values of the transparent signal electrodes is within the standard value, so as not affecting the sensing capability of the capacitive touch panel, It can replace the conventional metal wire, eliminating the cost of adding metal processing equipment, and eliminating the need for multiple metal processes, which greatly improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS First FIG.: A plan view of a first embodiment of the present invention. Second Figure: A plan view of a second embodiment of the present invention. Third Figure: A plan view of a third embodiment of the present invention. Fourth Figure: A plan view of a fourth embodiment of the present invention. Figure 5: A cross-sectional view of a conventional capacitive touch panel. 200945149 No. /, Fig.: Absolute position + Schematic diagram of the touch layer wiring of the placement type touch panel. FIG. 7 is a cross-sectional view of a matrix capacitive touch panel. FIG. 1 is a cross-sectional view showing a matrix capacitive touch panel.
第九圖S知矩陣式電容式觸控面板的上、下觸控層 俯視的佈線示意圖DThe ninth figure S knows the upper and lower touch layers of the matrix capacitive touch panel.
【主要元件符號說明】 (10)觸控層 (11)上觸控層 (12)下觸控層 (20a)電連接用電路板 (20b)電連接用電路板 (21)控制晶片 (30)透明感應電極 (31)上透明感應電極 (310)行電極 (32)下透明感應電極 (320)列電極 (40)透明訊號電極 (40a，40b，40c，40d，40e)透明訊號電極 (50)保護層 (51)觸控層 (510)透明感應電極 (511)可視區 (512)金屬訊號導線 (513)電連接用電路板 (5 2)緩衝層 (53)基板 (60)保護層 (61)第一觸控層 (62)第一緩衝層 (63)基板 (64)第二緩衝層 (65)第二觸控層 (6 6)絕緣層 (70)保護層 (71)第一基板 200945149 (72)第一缓衝層 (74)間隔層 (76)第二缓衝層 (8 0)列電極 (82)金屬訊號導線 (90)電連接用電路板 (73)第一觸控層 (75)第二觸控層 (77)第二基板 (81)行電極 (83)透明訊號電極[Description of main component symbols] (10) Touch layer (11), touch layer (12), touch layer (20a), electrical connection circuit board (20b), electrical connection circuit board (21), control chip (30) Transparent sensing electrode (31) transparent sensing electrode (310) row electrode (32) transparent sensing electrode (320) column electrode (40) transparent signal electrode (40a, 40b, 40c, 40d, 40e) transparent signal electrode (50) Protective layer (51) touch layer (510) transparent sensing electrode (511) visible area (512) metal signal wire (513) electrical connection circuit board (52) buffer layer (53) substrate (60) protective layer (61 First touch layer (62) first buffer layer (63) substrate (64) second buffer layer (65) second touch layer (6 6) insulating layer (70) protective layer (71) first substrate 200945149 (72) first buffer layer (74) spacer layer (76) second buffer layer (80) column electrode (82) metal signal wire (90) electrical connection circuit board (73) first touch layer ( 75) second touch layer (77) second substrate (81) row electrode (83) transparent signal electrode
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