TW200943501A - Forming integrated circuit module with temperature compensation crystal oscillator - Google Patents

Forming integrated circuit module with temperature compensation crystal oscillator

Info

Publication number
TW200943501A
TW200943501A TW097112770A TW97112770A TW200943501A TW 200943501 A TW200943501 A TW 200943501A TW 097112770 A TW097112770 A TW 097112770A TW 97112770 A TW97112770 A TW 97112770A TW 200943501 A TW200943501 A TW 200943501A
Authority
TW
Taiwan
Prior art keywords
integrated circuit
circuit module
crystal oscillator
temperature compensation
compensation crystal
Prior art date
Application number
TW097112770A
Other languages
Chinese (zh)
Inventor
Zhong-E Huang
Jian-Yu Huang
Original Assignee
Azurewave Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azurewave Technologies Inc filed Critical Azurewave Technologies Inc
Priority to TW097112770A priority Critical patent/TW200943501A/en
Publication of TW200943501A publication Critical patent/TW200943501A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)

Abstract

A integrated circuit module with temperature compensation crystal oscillator (TCXO) applying for an electronic comprises: one substrate with one top surface; one temperature compensation crystal oscillator disposed on the top surface; at least one chip disposed on the top surface; one encapsulant formed on the top surface wherein covering with the TCXO and the chip to form the integrated circuit module.
TW097112770A 2008-04-09 2008-04-09 Forming integrated circuit module with temperature compensation crystal oscillator TW200943501A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097112770A TW200943501A (en) 2008-04-09 2008-04-09 Forming integrated circuit module with temperature compensation crystal oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097112770A TW200943501A (en) 2008-04-09 2008-04-09 Forming integrated circuit module with temperature compensation crystal oscillator

Publications (1)

Publication Number Publication Date
TW200943501A true TW200943501A (en) 2009-10-16

Family

ID=44869023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112770A TW200943501A (en) 2008-04-09 2008-04-09 Forming integrated circuit module with temperature compensation crystal oscillator

Country Status (1)

Country Link
TW (1) TW200943501A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8827550B2 (en) 2009-12-23 2014-09-09 Intel Corporation Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
TWI614922B (en) * 2014-10-22 2018-02-11 應達利電子股份有限公司 Piezoelectric quartz crystal resonator and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8827550B2 (en) 2009-12-23 2014-09-09 Intel Corporation Thermal sensor using a vibrating MEMS resonator of a chip interconnect layer
TWI614922B (en) * 2014-10-22 2018-02-11 應達利電子股份有限公司 Piezoelectric quartz crystal resonator and manufacturing method thereof

Similar Documents

Publication Publication Date Title
GB2475658B (en) Mainboard assembly including a package overlying a die directly attached to the mainboard
TW200727461A (en) Semiconductor device and production method thereof
TW200802782A (en) Chip module for complete power train
ATE550671T1 (en) ARRANGEMENTS FOR AN INTEGRATED SENSOR
HK1149631A1 (en) Wafer level packaging using flip chip mounting
WO2012048137A3 (en) Flexible circuits and methods for making the same
WO2011137733A3 (en) Power supply module and packaging and integrating method thereof
TW200705621A (en) Interposer and semiconductor device
WO2010002969A3 (en) Flip chip overmold package
TW200715514A (en) Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
TW200729436A (en) Integrated circuit device
WO2011003997A3 (en) Thermally mounting electronics to a photovoltaic panel
TW200739841A (en) Semiconductor device with a heat sink and method for fabricating the same
TW200709774A (en) Printed circuit board with improved thermal dissipating structure and electronic device with the same
GB2510300A (en) Heatsink attachment module
TW200719468A (en) Package, package module and manufacturing method of the package
TW200801697A (en) Liquid crystal display and electronic apparatus
TW200703523A (en) Semiconductor device with low CTE substrates
TW200746482A (en) Chip-type LED package and light emitting apparatus having the same
TW200616241A (en) Substrate design to improve chip package reliability
WO2008093549A1 (en) Substrate module
TW200943501A (en) Forming integrated circuit module with temperature compensation crystal oscillator
TW200733030A (en) Light source driving device with light sensor module and electronic device using the same
MY167837A (en) Integrated circuit film and method of manufacturing the same