TW200943402A - Method for forming adhesive dies singulated from a wafer - Google Patents

Method for forming adhesive dies singulated from a wafer

Info

Publication number
TW200943402A
TW200943402A TW97112546A TW97112546A TW200943402A TW 200943402 A TW200943402 A TW 200943402A TW 97112546 A TW97112546 A TW 97112546A TW 97112546 A TW97112546 A TW 97112546A TW 200943402 A TW200943402 A TW 200943402A
Authority
TW
Taiwan
Prior art keywords
adhesive layer
wafer
cut
dies
gap
Prior art date
Application number
TW97112546A
Other languages
Chinese (zh)
Other versions
TWI377614B (en
Inventor
Alex Liu
Chia-Chang Chang
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW97112546A priority Critical patent/TWI377614B/en
Publication of TW200943402A publication Critical patent/TW200943402A/en
Application granted granted Critical
Publication of TWI377614B publication Critical patent/TWI377614B/en

Links

Landscapes

  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Disclosed is a method for forming adhesive dies singulated from a wafer. A cut gap is formed between dies of the wafer. An adhesive layer formed on an extendable film is transfer-printed to the wafer. Aligned with the cut gap, a guiding groove for tearing is formed in the adhesive layer but not penetrate through. The extendable film is extended until the adhesive layer is torn into pieces along the guiding groove. Dies attached with the adhesive layer are picked up from the extendable film. Accordingly, the adhesive layer is free from cut burrs protruding from die-attaching plane at its edges, it can solve conventional problem of die-attached skew and remained gap caused by the cut burrs. Additionally, the adhesive layer is diced under low temperature to avoid improper curing at its edges.
TW97112546A 2008-04-07 2008-04-07 Method for forming adhesive dies singulated from a wafer TWI377614B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97112546A TWI377614B (en) 2008-04-07 2008-04-07 Method for forming adhesive dies singulated from a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97112546A TWI377614B (en) 2008-04-07 2008-04-07 Method for forming adhesive dies singulated from a wafer

Publications (2)

Publication Number Publication Date
TW200943402A true TW200943402A (en) 2009-10-16
TWI377614B TWI377614B (en) 2012-11-21

Family

ID=44869007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97112546A TWI377614B (en) 2008-04-07 2008-04-07 Method for forming adhesive dies singulated from a wafer

Country Status (1)

Country Link
TW (1) TWI377614B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896702A (en) * 2011-07-27 2013-01-30 隆达电子股份有限公司 Crystal grain separation process and device thereof
TWI614798B (en) * 2013-02-25 2018-02-11 Disco Corp Processing method of laminated wafer
TWI806982B (en) * 2018-03-09 2023-07-01 日商迪思科股份有限公司 Processing method of package substrate
TWI810429B (en) * 2019-01-30 2023-08-01 日商迪思科股份有限公司 How to register the origin position of the cutting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102896702A (en) * 2011-07-27 2013-01-30 隆达电子股份有限公司 Crystal grain separation process and device thereof
TWI614798B (en) * 2013-02-25 2018-02-11 Disco Corp Processing method of laminated wafer
TWI806982B (en) * 2018-03-09 2023-07-01 日商迪思科股份有限公司 Processing method of package substrate
TWI810429B (en) * 2019-01-30 2023-08-01 日商迪思科股份有限公司 How to register the origin position of the cutting device

Also Published As

Publication number Publication date
TWI377614B (en) 2012-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees