TW200941053A - Coupling structure for optical module and method of manufacturing the same - Google Patents

Abstract

Provided is a coupling structure for an optical module and a method of manufacturing the same. The coupling structure for an optical module includes a first groove formed in a substrate to support an optical component, and a second groove formed to include the first groove within itself and make a space in which the optical component is mounted, wherein the optical component is guided by a line or point of a corner of the first groove when the optical component is mounted.

Description

* 200941053 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to an optical module coupling structure and a method of fabricating the same, particularly relating to optically alignable and coupling optical fibers or spherical mirrors to optical fibers, spherical mirrors, An optical module coupling structure of an optical component of an optical waveguide, a laser diode, a photodiode, a light emitting diode, a mirror, or the like, and a method of fabricating the same.

[Prior Art] A method of connecting an optical fiber to a planar optical module including an optical waveguide can be classified into an active connection method or a passive connection method. The active bonding method involves cutting and polishing an optical module such that the fiber optic block (or fiber) is brought into close proximity and optically aligned with the optical waveguide array (or waveguide) having the exposed profile, allowing light to pass through the fiber to the optical module. Optical waveguide, and adjust the position of the fiber block (or fiber) to fix or attach the fiber block (or fiber) to the optical module to maximize the brightness of the light emitted from the optical waveguide, thereby achieving optical waveguide and fiber The light is calibrated and fixed. Here, the fiber block is light which is both polished and parallel-aligned at both ends and is fixed to a v-shaped groove (hereinafter referred to as a "v-ditch") formed between a flat plate and a fiber plate. After confirming that the first drink was made into a rumor, Tian Tianshi formed a kind of face that was used to calibrate/gly fix the fiber on the body of the fiber module: no need for individual mechanisms like fiber blocks. And the entity formed on the optical module itself is calibrated to 200941053 in another slot to perform optical calibration and fixing between the optical waveguide and the optical fiber. Traditional fiber calibrating/coupling to the optical waveguide mainly uses the active connection method. The active connection method measures the brightness of the light passing through the optical waveguide, and fixes the optical fiber to the optimal position on the optical module, thus determining sufficient calibration accuracy ( 9μπ! Fiber core diameter is 1μηη or less). On the other hand, the active connection method has a poor calibration accuracy of several μm. However, because the active connection method must use expensive fiber optic blocks in each device, and use the calibrated equipment to calibrate/fix the light turtle block to each device, manufacturing the optical module is time consuming and costly. . In order to solve the problem of using the fiber block by the active connection method, many passive connection methods have been proposed. Japanese Patent No. 2982861 discloses a method for manufacturing an oxygen (four) optical waveguide on an active connection structure of an optical fiber of a "yttria" optical waveguide module using a "矽" substrate, and using an anisotropic crystal (4) (4) to form a V-ditch. (V-groove) to fix the fiber calibrated with the yttria optical waveguide. With this method, trenches can be formed relatively quickly to manually connect the fibers to the optical mode peak plate. However, it is difficult to put this method into practice because it is not possible to provide sufficient accuracy for Ιμηη or machi in the formation of the calibration structure based on many originals. Further, the ruthenium substrate suitable for this method has a thermal expansion coefficient of about 3xl 〇-6/C3C, which is far worse than the thermal expansion coefficient of the yttrium oxide material 〇5xl 〇-6/〇c which forms the optical waveguide. Therefore, 'stress is applied to the optical waveguide of the optical module, and birefringence is generated in the optical waveguide (that is, the reflection coefficient of the waveguide material changes between 0.0005 and 0 001 according to the direction of polarization of the light and the horizontal or vertical direction of the substrate). ). As a result, the characteristics of the optical module depend on the polarization state of the light, that is, the generated polarization* (PDL, “polarization dependent loss,”), etc. Therefore, recently, it is widely used in the oxidized hair substrate instead of the hair. A technique for fabricating optical waveguides on a substrate, such as an optical splitter used in a user's optical communication network. This network is called a fiber-to-the-home (FTTH, "fiber-t〇the_h_") network. In this month, When forming an optical waveguide on a non-crystalline dielectric substrate, such as a fused silica substrate such as yttria, it is difficult to form a v-channel using conventional methods. The key point is how to form a 0-fiber together with the optical waveguide on the optical module substrate. Fixing the trenches to manually connect the fibers. First, 'viewing the traditional method of forming the fiber-optic block V-ditch can be used to form trenches on the optical module substrate. You can use the Xixi or Oxide substrate to fabricate the traditional fiber-optic block. In the case of the Shixi fiber block, a semiconductor light lithography process is used to form a rectangular groove pattern for protecting the groove in the Shishi substrate 100 in the direction 110. And using the characteristics of the stone substrate to soak the substrate in the KOH (10) solvent (4) the rectangular groove pattern forms a groove (hereinafter referred to as "non-isotropic"), the groove stops at the surface (1) " The same can be used to quickly cut the base (4) to form the level guide and V groove, but when the substrate is formed by the oxidized stone eve, because the oxidized stone is a non-surnamed material, it is impossible to form the v-channel using the non-isotropic method; Therefore, when the oxidized stone fiber block is manufactured, a spin-on polishing tool having a V-shaped knife is used as the oxidized stone substrate polishing method of the V-ditch, which is not suitable for simultaneously forming the V-ditch and the optical waveguide. Because and: The rotating polishing tool of a certain radius rotates and moves within the movement (4) of the v-ditch, so the rotary-light tool can be polished on the V-ditch extension line: 200941053 The optical waveguide aligned with the v-ditch. A dry etching method using a semiconductor photolithography etching treatment of a hafnium oxide substrate can be considered for a solution other than the method of forming an alignment trench using a rotary polishing tool. Korean Patent Application No. 10-2005-23238, entitled "Fabrication Method of Optical Module for Enabling Passive Alignment Between Optical Waveguide and Optical F iber", in which the optical waveguide core pattern and the fiber alignment groove pattern are aligned on the same mask v such a fiber alignment trench is formed by the same process as forming the optical waveguide core 'by thereby automatically aligning the optical waveguide with the fiber alignment trench on the substrate surface. In this embodiment, the calibration trench uses a U-ditch, and the fiber inserted into the u-ditch is in contact with the left, right, and lower surfaces of the U-ditch at three points to dynamically secure the fiber. However, the allowable diameter of the fiber is ±1 μπ1, which results in a calibration error between the fiber and the U-ditch due to the vertical and lateral diameter tolerances in this method. In addition, when the fiber has been inserted into the U-channel, the channel must have a width greater than the diameter of the fiber, i.e., a fixed fiber tolerance. Further, although in the conventional method, the vertical alignment between the optical waveguide and the optical fiber is determined by the depth of the U-channel, so that during the silver engraving of the trench, a precision device with an accuracy of up to 2% is used, generating at least The etching allowance of 2 μm (conventionally, since the diameter of the optical fiber is 125 μm & and the thickness of the upper layer of the optical waveguide is 30 μm), the U ditch must be engraved to a depth of about ιοομιη. Therefore, the fiber in the U-groove has vertical and horizontal calibration errors corresponding to the tolerance of the fiber diameter, the insertion tolerance of the U-ditch, and the allowable value of the 200941053 due to the consistency of the surname. In addition, even when the depth of the ditch is compensated by chemical vapor deposition (CVD, "chemical deposition") or dry etching of the layer, the CVD layer can be deposited on both sidewalls of the U trench and narrow trenches, or The two trenches of the U trench are etched in a tilted manner at a predetermined angle to widen the u trench. That is, the conformal deposition or etch overcut can be broadened according to 1; the trench depth changes width, thus causing fiber alignment errors. Other patent applications PCT PCT/KR2()() 2/() 4 discloses a technique similar to the traditional method. SUMMARY OF THE INVENTION The object of the present invention is to provide an optical module that fits the structure and manufactures the material of the structure, and aligns the wire and _ or the surface to a fiber, a spherical mirror, an optical waveguide, etc. An optical component fabricated in the optical module on the substrate. Invented by the other η...-the wind cargo esthetic module coupling structure and the method of manufacturing the same, when the optical fiber is connected to the optical mode, the structure can improve the productivity and reduce the optical mode of the oxygen-cut substrate of the optical waveguide of the package 3 Group manufacturing costs. And the purpose of the other is to provide a horizontal calibration of the optical mode-combined optical waveguide, and the high-level system of the bauxite is high-fibre (the water-suppressed μ' is read, the sediment processing conditions are thousands (four) (four)) vertical calibration Still another object of the present invention is to provide a method for fabricating the structure that can withstand application to the trench structure when the fiber is inserted into the calibration trench. Pressure or shock. It is still another object of the present invention to provide an optical module coupling structure and a method of fabricating the same that avoids the deposition of an overlying plating layer in the alignment trench and reduces the depth of the trench that must be etched for vertical alignment, thereby increasing economic efficiency . Still another object of the present invention is to provide an optical module coupling structure and a method of fabricating the same that optically align and couple a fiber or a spherical mirror to a laser diode, a photodiode, or a light emitting diode Optical coupling elements such as mirrors. Still another object of the present invention is to provide a method of attaching a spherical mirror which can prevent epoxy from contaminating the surface of the spherical mirror by reducing the use of the epoxy resin when the spherical mirror is fixed to the alignment groove. A first aspect of the present invention provides an optical module coupling structure including a first trench formed in a substrate to support an optical component, and a second trench including a first trench therein The slot is spaced from the fixed optical component, wherein the optical component is guided by a line q or point of the first groove corner when the optical component is secured. Here, the "optical module" means a structure including an optical fiber or a spherical mirror, and optical devices used in optical communication, optical connection, optical sensor, and the like are configured in a single or plural configuration. Here, the "optical component" is an element optically calibrated with an optical module, and is formed by a combination of a unit optical device or a unit optical device. In a specific embodiment, the optical component comprises an optical fiber, a spherical mirror, an optical waveguide, a laser diode, a photodiode, a light emitting diode, a reflective surface, and the like. The optical components can be integrated on the substrate 10 200941053 or formed separately and fixed to the substrate. The "optical waveguide" indicates the first waveguide of the core of the reduced-surface semiconductor photolithography. The core has many sections, such as rectangular, convex, circular or elliptical. In addition, the optical waveguide may be a positive waveguide protruding from the surface of the substrate by a positive pattern, or a core may be formed in the underlying layer of the intaglio pattern to form a core layer in the intaglio pattern: a negative hole for recessing the optical waveguide into the substrate waveguide. The ruthenium substrate may be a semiconductor substrate, a dielectric substrate, a glass substrate, a polymer substrate, a crystal substrate or a composite substrate thereof, and particularly a ruthenium oxide substrate. The first groove may have at least one "angle line" or "bent point", which is a mechanical structure placed on the inner lower surface of the first groove for supporting/fixing the optical lens or the spherical mirror, thereby forming a double A trench in which the alignment position of the fiber or spherical mirror with respect to the optical component is provided. The trench for fiber alignment may have a structure in which a u trench is formed in the u trench (hereinafter referred to as a double U trench). Although a two-bend 10 corner line is typically used to support the fiber in a double u-groove, a fixed surface is needed to support the fiber when a single corner line is used to support the fiber. The fixed surface may be perpendicular to the substrate or inclined at a predetermined angle. Although the groove for spherical mirror calibration can use three corner lines or corner points, one or two fixed surfaces may be further required when one or two corner points or corner lines are used. The fixed surface can be perpendicular or oblique to the substrate. The first trench and/or the second trench may have a number of structures formed by semiconductor photolithography/etching, laser beam processing, stamping dies, etc., without regard to what processing technique is employed. 11 200941053 The second groove determines the depth of the first groove or the angle of the bend from the surface of the substrate. In addition, the second groove provides minimal space to accommodate the fiber or spherical mirror. The optical module may further comprise at least ~ sub-grooves that are spliced to the first trench or the second trench. The sub-grooves may connect the first trenches and the second trenches formed between the turns. The sub-trench can help remove the ash or contaminant that sticks the fiber to the corner line when the optical component is an optical fiber, and can be used as a flow path of the epoxy between the first groove and the second groove, such a ring The oxygen resin can be smoothly introduced into the trench and discharged from the trench to calibrate and fix the optical fiber with a minimum amount of cyclic epoxy resin at night. The second aspect of the present invention provides an optical module uncovering structure, and the package S is a first optical component connecting portion and a second optical component connecting portion formed on the substrate, each of the optical component connecting portions includes a first trench for supporting the optical button and a second trench, the second trench Forming to include a first groove therein and creating a space in which the optical component is fixed, wherein the optical component is guided by a line or a point of the first groove angle when the optical component is fixed, and the first optical The component connecting portion and the second optical component connecting portion are aligned with each other. The coupling structure of the optical module can further include a support frame to be coupled to other optical components. For example, the coupling structure of the optical mode may further comprise a support frame to be lighted to the light diode or the laser diode. In general, the surface of the substrate can be used to integrate the support frame on the substrate.

A second sorrow of the present invention provides an optical module coupling structure including an optical component connection portion and a V12 200941053 trench having a slope formed at a base (4), the optical component connection portion including a configuration to support an optical component within the substrate a first trench and a second trench, the second trench is formed to include the first trench and has a space in which the optical component is fixed, wherein the first trench is bent when the optical component is fixed A wire or a point guides the optical component, and the v-groove has a slope such that the optical component is attached to the optical component connection portion to be optically connected. The first trench or the second trench may be formed in a number of ways, such as a semiconductor light lithography, etching, laser beam processing or stamping die, and the first trench and the second trench when viewed from above the substrate The width of the grooves can be uniform, changed in stages or in a tapered manner, or continuously or intermittently changed in a triangular, rectangular or zigzag shape. That is, when the optical fiber forms the support surface of the groove, the first groove and the second groove may be straight grooves having a specific length. However, the shape of the groove support surface may vary depending on the shape of the supported optical device. For example, in the case of a spherical mirror, a specific part of each side of the triangle is a support structure. A fourth aspect of the present invention provides a method for fabricating an optical module coupling structure, comprising: forming a first trench in a substrate to support an optical component; and forming a second trench including the first A groove and a space therein for receiving the optical component, wherein the optical component is guided by a line or a point of the first groove to the corner when the optical component is fixed. The method further includes forming a third trench between the optical component and the optical waveguide, wherein the third trench is formed simultaneously with the first and second trenches. The method further includes forming a sub-groove in a longitudinal direction at an angle of the first trench. The third trench removes the obstruction of the fiber support structure, and the obstruction 13 200941053 may be formed between the optical waveguide and the light-fixing trench to ensure that the a end is as close as possible to the optical component or the optical waveguide. In addition, one of the two fibers: the tree, the main, the miscellaneous, to help the scorpion groove: = two Tianran, the % 氡 resin can be from the substrate of the second groove: % f rolling diameter may be affected by epoxy or fiber The second is due to the large epoxy resin covering the fiber or the ball on the substrate or when a small amount of the surface of the epoxy tree is passed through the third groove and the sub-groove. ❹ In this aspect, a 成-mask of a photo-optical structure for fabricating an optical mode-integrated structure is provided for using a core of an optical waveguide core layer-shaped waveguide and an optical component splicing: using the splicing a first trench; at least the J-conductor: the recording layer 4 and the second trench forming the first trench therein. The advancement of the method includes forming a third trench between the optical waveguide and the connecting portion of the optical component. On the other hand, although the mask is formed to form the first groove, a groove may be formed in the grass and in a corner in the longitudinal direction of the first groove. A sixth aspect of the present invention provides a method of fabricating an optical module coupling structure, comprising: forming a core-like pattern of an optical waveguide in a substrate in an intaglio pattern; and a first trench of the optical component connecting portion Forming a pattern, etching a first trench using the first trench forming pattern; forming an optical waveguide core material on the entire sample to fill at least the core forming pattern to form a first trench therein a second trench; and an overlying layer formed on a core of the optical waveguide of at least 14 200941053. Alternatively, although the optical waveguide core material is formed on the entire structure to fill at least the core forming pattern, the edge portion of the first trench may be filled. A seventh aspect of the present invention provides a method of fabricating an optical module coupling structure, comprising: forming a mask for forming a core of an optical waveguide and a portion of an optical component connecting portion using an optical waveguide core layer a trench; 'etching the first trench using the mask; forming an upper plating layer on at least the optical waveguide; and forming a second trench including the first trench therein. An eighth aspect of the present invention provides a method of fabricating an optical module coupling structure, comprising: integrating to form a first optical component connection portion having a second optical component connection portion, wherein each of the optical component connection portions includes a configured a first trench for supporting the optical component and a second trench formed to include the first trench and to form a space in which the optical component is fixed, when the optical component is fixed A line or point of a corner of the first groove is used to guide the optical component, and the first optical component connecting portion and the second optical component connecting portion are aligned with each other according to the etching depth of the groove. A ninth aspect of the present invention provides a method of fabricating an optical module coupling structure, comprising: forming a first trench in a substrate to support an optical component; and forming a second trench including the a first trench and a space in which the optical component is fixed, wherein the coupling structure of an optical module comprises an optical component connecting portion and a v-groove having a predetermined angle, wherein the optical component connecting portion comprises a configured Supporting a first trench of the optical component and a second trench in the substrate 15 200941053, the second trench is formed to include the first trench and to form a space in which the optical component is fixed, wherein Fixing the optical component, the optical component is guided by a line or a point of the first groove, and the v-groove has a slope, such that the optical component is fixed to the optical component connecting portion to be optically connected on. Although the above-described steps of the present invention correspond to the minimum amount of processing required to practice the invention, additional steps may be added and the order of steps may be varied without departing from the principles of the invention. The first, second and third trenches may be formed by dry etching, wet etching, laser beam processing, stamping, machining, or the like. The most efficient formation of the first and second trenches is dry etching using plasma, and the third trench is most efficiently formed by mechanical processing using spin polishing, laser beam processing or dry etching. Here, laser beam processing is a method of engraving a substrate using a high power pulsed laser. When the first, second, and third grooves are formed by dry etching, wet etching, mechanical machining, or the like, the corner line may be an acute angle. When a specific pressure is applied to the fiber optic line to insert the fiber into the substrate, the inserted fiber is rapidly broken when it is in full contact with the corner line. Therefore, non-isotropic plasma etching must be further performed on the formation of the second trench, or chemical vapor deposition must be used to round the corner line when the upper plating layer of the optical waveguide is formed. The conversion of the corner line can be performed in the process of the second aspect of the invention described above or simultaneously. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings, in which an exemplary embodiment of the invention will be shown. The invention may, however, be modified in many different forms and is not limited to the exemplary embodiments disclosed herein. Rather, these exemplary embodiments are provided so that the scope of the disclosure is more complete and the scope of the invention is fully disclosed to those skilled in the art. <First Exemplary Embodiment> The first figure is a perspective view of an optical module engagement structure according to a first exemplary embodiment of the present invention. The surface structure includes a first trench A formed to support the optical component and a second trench B formed to include the first trench and to form a space in which the optical component is fixed, wherein when fixed The optical component is guided by the line or point of the first groove A to the optical component. The optical component is guided by the angle of the second trench B when the optical component is secured, thereby effectively aligning the optical component with the core 102 of the optical waveguide. On the other hand, in the coupling structure of the optical module, the optical waveguide portion 20 can be effectively formed integrally with the optical fiber connecting portion 30 including the first trench A and the second trench B. Between the optical waveguide portion 20 and the fiber connecting portion 30, a criticality 409 (see the second D diagram) may be formed so that it is difficult for the optical fiber to be ideally completely close to the optical waveguide. In order to solve this problem, the dicing saw blade cuts the substrate surface to a specific depth along the boundary between the optical waveguide portion 20 and the optical fiber connecting portion 30 to form a third groove 501. 2A through 2F are perspective views for explaining an optical module manufacturing procedure according to the first example 17 200941053 embodiment of the present invention. Figure 2A is a perspective view of a first step of fabricating an optical module in accordance with a first exemplary embodiment of the present invention. Referring to FIG. 2A, the optical waveguide core layer 1〇3 (including 1〇2 and 1〇3 to cover the entire substrate) is deposited on the substrate 10. In this exemplary embodiment, 'using an oxidized stone substrate as an example' and using an oxidized oxidized substrate as a lower plating layer of the optical waveguide. When the substrate is formed of tantalum, the surface of the tantalum substrate may be oxidized to a thickness of about ΙΟμη to convert the surface of the substrate into a ruthenium oxide layer, or a layer of oxidized stone may be deposited on the substrate, and an optical waveguide core layer 103 may be deposited thereon. . Next, an etch mask layer (not shown) is deposited on the optical waveguide core layer 1〇3. In an exemplary embodiment, a yttria substrate having a thickness of tens of or more should be dry etched. Therefore, the etch mask must have sufficient residual selectivity' without the wattage being consumed by the enamel before completing the oxidized oxide trench structure side. The secret mask can be a metal layer formed of chrome, tungsten, chains, etc., and in the exemplary embodiment, the residual mask is formed of a network. The surname mask layer is formed by using a mask having a positive core pattern on the optical waveguide portion 2 and a mask having an intaglio first groove pattern on the optical component connecting portion 3A to form a photoresist through the light microscopic process (4). The pattern is converted into a chrome-etched mask layer, and the etched mask layer is used to surname the core layer 'by thereby forming the optical waveguide core transfer and the first-groove pattern 1〇4. The first diagram is a perspective view of a second step of fabricating a light module according to a first exemplary embodiment of the present invention. In the second step, the surname is overlaid on the substrate over the optical waveguide portion 28 200941053 20 except for the optical component connecting portion 3 , and the first trench A of the optical component connecting portion 3 is pasted. The method of covering the mask portion on the optical waveguide portion 2 can be performed by covering the entire substrate with the etching mask and removing only the etching mask of the optical component connecting portion 3〇 by photolithography, or The etching mask is covered only by the stripping treatment on the optical waveguide portion 20. In this process, the first trench A of the optical component connecting portion 30 is formed. Then, remove the remaining mask remaining on the substrate. *· ❹ The second C is a perspective view of a third step of fabricating an optical module in accordance with the first exemplary embodiment of the present invention. In the third step, the upper plating layer 3〇2 is deposited on the optical waveguide core w layer 1〇2. In this process, the upper plating layer 302 is also deposited on the optical component connecting portion 3, and the corner ridges of the first trench 会 are chamfered to support/fix optical components, such as optical fibers.

The wind "first" is a perspective view of a fourth step of manufacturing a light: iridium group according to the first exemplary embodiment of the present invention. In the fourth step, 're-depositing chrome fines using photolithography to form a second Trench_mask pattern, ^The second groove of the rear axis is prepared to form a second trench to form a second trench B, and a dry etching mask is formed by forming a first trench The method is the same. Because the first trench A is deposited in the trench B, the first trench a_ is maintained and the lower surface of the substrate is lowered when the first trench 3 is touched. Figure E is a perspective view of a fifth step of fabricating a dummy according to a first exemplary embodiment of the present invention. After the fourth step, an interface between the optical waveguide 200941053 portion 20 and the optical component connecting portion 3A A criticality 409 may be generated, making it difficult for the optical component to be ideally close to the optical waveguide. Therefore, in the fifth step, the 'cutting saw' cuts the substrate surface to a specific depth along the boundary between the optical waveguide portion 2 and the optical component connecting portion 30. Forming a third trench 501. Here The cutting saw blade may be a saw or a polishing ore having diamond particles, which is generally used for cutting a semiconductor substrate. Φ Second F is a perspective view of a sixth step of fabricating an optical module in accordance with a first exemplary embodiment of the present invention. Fig. In the sixth (four) #60 and aligned with the double U material (A and B), the condensate 6 〇 is fixed to the groove. The optical fiber uses a vacuum holder, etc. = two contact with the curved ridge of the double groove So, the second fiber [fiber, the second and third grooves A, B and 501 can penetrate the resin along the first and the second resin, so that the optical fiber 60 is fixed to the double groove and then the epoxy is cured by ultraviolet light.弯的弯角线。 〇&lt;Second exemplary embodiment&gt; The third figure is a perspective view of a second exemplary group-coupled structure according to the present invention. Unlike the optical/# The coupling structure of the specific embodiment comprises a second example pick C, and a second trench D containing a space of the first trench and the first trench assembly supporting the optical fiber. Here, in the $, a fixed light boxing is made to align with the core 702 of the optical waveguide. When learning the component, the component is learned, and the angle of the epoxy resin is adjusted to the angle of the groove 0 to guide the bow to the longitudinal angle of the first groove C. The angle is or is discharged from it. Forming the sub-grooves inward, guiding and fixing the optical parts to the first groove Μ corners at night with 20 200941053. For the example of manufacturing the optical mode, the first to third grooves are formed by dry silver etching. The groove and the 707, and the upper clock layer of the optical waveguide is selectively covered on the surface of the substrate other than the first to third grooves. The fourth to fourth" is for explaining the second example according to the present invention. Optical module manufacturing procedure of a specific embodiment: perspective view. Figure 4A is a perspective view of a first step of fabricating a diaphragm in accordance with a second exemplary embodiment of the present invention. First, the optical waveguide core layer 7〇3 is overlaid on the substrate 10, and an etch mask layer is deposited on the core layer. Next, a light-shield is formed by forming a mask having a positive-engraved optical waveguide pattern on the optical waveguide portion 2 and forming an inscribed first groove-forming pattern 7〇3 on the optical component connecting portion 30 to form a mask pattern. Processing, and the surname mask pattern is converted into a road mask layer. Then, the core layer is dry etched to form the optical waveguide core 7〇2 and the first trench is opened) pattern 7〇3. In the exemplary embodiment, 'when the first groove forming pattern 7〇3 has been formed, the outer sub-groove 705' is additionally formed in the longitudinal direction of the corner having the first groove so that the epoxy resin is smooth The first and second grooves are introduced or discharged to effectively align the optical components (e.g., optical fibers) with the angled ridges of the double grooves. Figure 4B is a perspective view of a second step of fabricating an optical module in accordance with a second exemplary embodiment of the present invention. In the second step, the etch mask is overlaid on the optical waveguide portion 20 to protect it, and the first trench forming pattern 7〇3 deposited on the optical component connecting portion 30 is additionally subjected to further dry etching. In this process, the first groove forming pattern 703 of the optical component connecting portion 3 is protected by the mask and the third trench 21 200941053 and the first trench c are etched together. Figure 4c is a perspective view of a third step of fabricating an optical module in accordance with a second exemplary embodiment of the present invention. In the third step, the etch mask used in the second step has been removed and a new etch mask layer is deposited. Then, an etch mask pattern is formed thereon by photolithography, and the etch mask pattern is converted into an etch mask layer to form an etch mask for forming the second trench D. Next, the second trench D and the third trench 7'' are etched to a specific depth in which the etch mask protects the second trench and the shoulder portion 703' of the optical waveguide portion 20. In this process, the first trench c is deposited in the second trench D, so that the shape of the first trench C is maintained and falls toward the lower surface of the substrate together with the second trench D. After the butterfly is finished, the unique mask is removed. The fourth D is a perspective view of a fourth step of fabricating an optical module in accordance with a second exemplary embodiment of the present invention. In the fourth step, in a state in which the first to third grooves C, D, and 707 are all protected, the upper bonding layer covers only the upper surface of the substrate. In the fourth D diagram, '(a) is a cross-sectional view of the optical component connecting portion 30 of the substrate during the third step. First, a photosensitive polymer material 1003 such as su_8 or photoresist is applied to the substrate (step (b)). Next, the substrate is exposed and exposed to remove the photopolymer material adjacent to the surface of the substrate. Except for the inside of the double groove 7 ((4) is in the shouting #巾, the focus is on adjusting the exposure time, so there is enough sensitivity The polymer material Hog is left in the double trench. Then, the overlying oxygen plating layer 1007 is deposited by flame deposition (FHD deposition) or plasma enhanced chemical vapor deposition (pEcvD, "22 200941053 enhanced chemical vapor deposition"). (d)). Shi Xi at this time 'deposition temperature is 120 to 250. (: When the deposition temperature is too high, it is difficult to remove the photopolymer. Next, the substrate is heated and then cooled, using the thermal expansion of the photopolymer Shrinking the upper ore layer 1〇〇7, and immersing the substrate in the thermal photoresist removal solvent to remove the double grooves and the polymer in the oxide layer (step (e)). ❹ ❹ 'The inside of the trench is protected by the photopolymer. The reason for using the sensitizer is that the polymer outside the trench in the substrate can be quickly removed by exposure. 'But the invention is not limited to the use of a photopolymer. The polymer material is superior in heat resistance to the photopolymer, and the substrate is coated with the electric material (4) in addition to the outer layer (tetra) in the substrate. As a result of the ==, the optical waveguide is selectively accumulated. On the surface of the substrate, there is not a thickness of 20 μm or more in the trench. Because the first-specific deposit layer must be deposited in the double trench, unlike the second concrete example; the upper coating = the second trench must be (four) to the top The thickness of the ore layer, a 'so the second core is aligned. Therefore, in the second concrete = let the fiber and the light ^ reduce the second groove to the riding degree. - Γ fourth map It is a perspective view of the fifth step of the second exemplary module according to the present invention. Here, the embodiment method determines the very important parameters of the first woven material core in combination with the effective surface of the silk core. c. Come to:: Use a device such as a two-dimensional measuring instrument to measure the second groove ^ depth 23 200941053, then fine-tune the depth of the second groove D. When you want the groove to be deep, you can perform Dry etching using an isotropic plasma, and using a chemical vapor phase sink when it is desired that the second trench D is shallow The yttrium oxide layer is uniformly deposited. In this process, the corner line in which the optical fiber is fixed in the double groove is chamfered like the first embodiment. The fourth F picture is manufactured according to the second exemplary embodiment of the present invention. A perspective view of a sixth step of the optical module. In a sixth step, the optical fiber 60 is secured within the U-groove with epoxy, similar to the first embodiment. At this point, in the first and second trenches C Additional sub-channels 708 are etched into the D to help introduce epoxy resin to reduce the amount of epoxy resin used. <Third Exemplary Embodiment> The third exemplary embodiment pertains to forming light in an intaglio pattern. a waveguide and a double U trench to form an optical waveguide core in the optical core of the optical waveguide by FHD, and remove the optical waveguide core layer on the surface of the substrate except the optical waveguide trench, and deposit an optical waveguide on the optical waveguide to form an optical waveguide and a double Other methods of U-groove 用于 for manual fiber optic connections. Figs. 5A to 5F are perspective and cross-sectional views for explaining an optical module manufacturing process according to a third exemplary embodiment of the present invention. Fig. 5A is a perspective view showing a first step of manufacturing the optical module coupling structure of the third exemplary embodiment of the present invention. First, after depositing the etch mask layer onto the substrate 10, using a mask having an annealed optical waveguide forming pattern formed in the optical waveguide portion 20 and an intaglio first trench pattern formed in the optical component connecting portion 30 is performed. Light lithography to convert the 24 200941053 pattern into a chrome mask. Then, the oxidized stone substrate is dried to form an intaglio pattern F of the optical waveguide core and an intaglio pattern of the first trench. Fig. 5B is a perspective view showing a second step of manufacturing the optical module light-bonding structure of the third exemplary embodiment of the present invention. In the second step, the mask is covered to protect the optical waveguide portion 20, and the first trench pattern of the optical component 30 is additionally dry etched. Fig. 5C is a view showing a third step of the optical module coupling structure for manufacturing the third exemplary embodiment of the present invention. The third step is a process of filling the optical waveguide core material 131 into the intaglio trench of the optical waveguide formed in the first step. In the fifth C diagram, (1) to (4) are cross-sectional views showing the process of performing the third step in the optical waveguide portion 2'', and (1) in the fifth c-figure to the third step of performing the third step on the optical component connecting portion 30. Processing profile. Although the optical waveguide portion 20 and the optical component connecting portion 3 can be formed by individual processing, since the formation of the same processing is relatively simple, the third exemplary embodiment will be explained with reference to the same processing example. That is, ❹ fifth 0 (1) and fifth C (i) and fifth (7) and fifth c (9) are all performed in the same process. The fifth C diagram (1) is a cross-sectional view of the optical waveguide portion 20, and the fifth c diagram (1) is a cross section of the component connection portion 3G. First, in the fifth C diagram (1) and the fifth C diagram (1), the second is removed. The money used in the steps is engraved. Next, W-deposited oxidized stone particles (see Figure 5 (Fig. (2) and Figure 5 (ii)), and then heated to form a cerium oxide core layer (fifth (3) and fifth C) (lu)). Then, the core layer formed on the substrate is left to the thickness and removed (see fifth C_ and fifth C (iv)). 25 200941053 In this process, the yttrium oxide material filled in the core trench is the same as before. During the heat treatment, the thickness of the cerium oxide particle layer is reduced by two to one tenth, and the particles are melted and adhered to each other to form a cerium oxide layer. When the surface of the substrate under the particle layer has a step difference, such as a groove or a step 4, the two melted particles move smoothly in the longitudinal direction by the surface tension, so that the oxon layer is on the other hand, and therefore, yttrium oxide The thickness of the particles deposited on the optical component connecting portion 30 is minimized near the corner ridge where the fiber is fixed, such that the corner ridge is chamfered and the bottom corner of the first groove E is also dehorned and then, in the following Among the core layer removal processes (fifth c-picture (4) and fifth-degree diagram (iv)) 'because the optical waveguide portion 20 has removed the core layer other than the core trench f' and the optical component of the optical component connection portion 30 The fixed corner ridge 145 is etched along the shape of the ridge 145 of the fifth C-Fig. (iii), so the height of the ridge is lower than the surface of the substrate (not shown), and the velvet is less used to determine the vertical alignment of the fiber. The etching depth of the two trenches G. When the _light_corner ridge 145 is not required, only the etch mask of the optical waveguide portion can be removed in the second step, and the etch mask of the optical component connecting portion 3 of the second step can be performed. Remove after three steps. In this case, the surface of the yttrium oxide plate is protected by a planar state, as shown in Figure 5 (iv). The fifth step is a fourth step perspective view showing the 'pre-modulation coupling structure for manufacturing the third exemplary embodiment of the present invention. In the fourth step, after the mask layer is formed, the surname mask is formed on the (four) mask layer. She uses the mask processing to form the second trench 〇 'teaching _ mask pattern into Mask layer. Then, the second trench G is etched to a certain depth in the state in which the optical waveguide portion 2 is protected. After the etching is completed, the etch mask is removed. Fig. 6E is a perspective view showing the jade step of the optical module coupling structure for fabricating the third exemplary embodiment of the present invention. In the fifth step, similar to the fourth step of the second embodiment, the upper plating layer 179 is deposited in a state where the trench formed in the substrate is protected by the photoresist. The fifth F is a sixth step perspective view showing the coupling structure of the Q pre-learning module for manufacturing the third exemplary embodiment of the present invention. In the sixth step, similar to the first embodiment, a rotary polishing apparatus is used in the substrate. A third groove 181 is formed along a boundary between the optical waveguide portion 20 and the optical component connecting portion 30, and the double U-trenched optical fiber 60 is inserted to be fixed with an epoxy resin. Although the first to third embodiments are described with reference to a case in which a single fiber is used, a plurality of first trenches may be coupled to a single second trench. Fig. 6 is a perspective view showing the structure in which a plurality of optical module coupling structures according to the first to third exemplary embodiments of the present invention are integrated on a substrate. The structure will be described later with reference to a light distributor. The optical splitter has a single wheel-in interface and four output interfaces. The input interface is coupled to the single first trench and the single second trench, and the output interface is coupled to the four first trenches and the single second trench, ie, a multiple U trench structure in which a single trench is formed Four U grooves. Here, the diameter of the optical fiber is 125 μm, and the interval of the optical fibers is 126 μm. &lt;Fourth Exemplary Embodiment&gt; In this embodiment, a mechanism for optically aligning and fixing the optical component on a flat substrate using a spherical mirror, and manufacturing the optical transmission/reception module using the mechanism will be described. Methods. Although the following description illustrates the use of a spherical mirror to connect a laser diode to an optical fiber, this embodiment of the invention is applicable to the pairing of optical fibers, optical waveguides, light-emitting diodes, photodiodes, laser diodes, etc., and Limited by the pairing of the laser diode and the fiber. This embodiment is particularly useful in the case of using a ruthenium oxide substrate. The seventh figure is a perspective view of the optical module #1 group consumable structure according to the fourth exemplary embodiment of the present invention. The optical module coupling structure according to the fourth exemplary embodiment of the present invention includes a first optical component connecting portion L and a second optical component connecting portion Μ which are connected to each other. The optical component connecting portion includes first trenches L-1 and Μ-1 formed to support the optical component, and second trenches L-2 and Μ-2 including therein the first trench and making a space for fixing the optical component . When the optical component is fixed, the optical components are guided by points or lines of the first grooves L-1 and Μ-1. The first optical component connecting portion L and the second optical component ❹ connecting portion 对准 are aligned with each other. Moreover, such a structure can be a continuous repeating structure and can have a support frame 201 coupled to an optical component such as other light sources, photodiodes, and the like. In the fourth embodiment, the first optical component connecting portion L is a fiber and the second optical component connecting portion Μ is a spherical mirror as shown in the drawing, and a structure in which the laser diode is connected to the optical mirror will be explained. The optical fiber 70, the spherical mirror 80 and the laser diode 235 are optically connected to each other, and the optical axes of the optical fiber 70 and the spherical mirror 80 should be placed in a straight line, 28 200941053 to optimize the optical connection. Further, the spherical mirror 80 is spaced apart from the optical fiber 70 by a predetermined distance in the optical axis direction. The position of the optical component in the direction parallel to the substrate is determined by the horizontal position of the calibration structure made by the mask pattern, that is, the position of the spherical mirror 80 is determined by three corner lines 226, and the position of the optical fiber 70 is composed of two curved lines. The 228 (showing only one corner line) and the fiber stop threshold 229 are determined, and the position of the laser diode 235 is determined by the metal calibration pattern 236 (see Figure 7). 〇 The metal calibration pattern 236 (see Figure 7) can be used as an electrode to supply current to the laser diode 235. Since the laser diode 235 releases appreciable heat, it is necessary to increase the thickness of the laser diode 235 for efficient heat dissipation, and a layer of germanium having good conductivity can be placed between the metal layer and the substrate. Next, the vertical height of the spherical mirror 80 with respect to the laser diode 235 is determined by the height of the three corner lines 226 in the connecting portions of the grooves M-1 and M-2, and the vertical direction of the optical fiber 70 with respect to the spherical mirror 80 The height is determined by the corner line 228 of the groove L-1 (only one is shown). Here, the position of the spherical mirror 80 can be determined by the corner point and is not limited to the corner line 226. In addition, the portion of the wire can be a surface that is perpendicular to the substrate, which can be tilted at a particular angle to the substrate. The two bottom end surfaces of the groove L-2 determine the gap between the two corner lines 228 (only one corner line is displayed) and the height of the fiber. The three bottom surfaces of the groove M-2 determine the gap between the three corner lines 226 and the height of the spherical mirror 80. 29 200941053 The bottom surface of the groove L-2 may have the same depth as the bottom surface of the groove M-2. . In this case, the height of the central axis of the optical fiber 70 and the spherical mirror 80 from the surface of the substrate can be set differently between the gap between the two corner lines supporting the optical fiber and the three curved lines supporting the spherical mirror when the mask is designed. Decide. Next, a method of manufacturing an optical module according to a fourth exemplary embodiment of the present invention will be explained. 8A to 8D are perspective views for explaining an optical module manufacturing process according to a fourth exemplary embodiment of the present invention. Figure 8A is a perspective view showing a first step of fabricating the coupling structure of the optical module of the fourth exemplary embodiment of the present invention. The grooves L-1 and M-1 are formed in the substrate by photolithography and dry etching, similar to the first to third embodiments. Figure 8B is a perspective view showing a second step of fabricating the coupling structure of the optical module of the fourth exemplary embodiment of the present invention. After the completion of the first step, the trench M-2 is formed by photolithography and dry etching, similar to the first to third embodiments. In this process, the depths of the grooves L-1 and M-1 from the surface of the substrate are increased. The eighth C is a perspective view showing a third step of manufacturing the optical module coupling structure of the fourth exemplary embodiment of the present invention. After the completion of the second step, the trenches L-2 are formed by photolithography and dry etching, similar to the first to third embodiments. In this process, the depths of the trenches L-1, M-1, and M-2 from the surface of the substrate are increased. The eighth D is a perspective view showing a fourth step of the 30 200941053 optical module coupling structure for manufacturing the fourth exemplary embodiment of the present invention. First, the metal mask is calibrated in the base laser diode. The calibration metal can be said to have an individual calibration pattern to facilitate placement of the laser diode 235 in a horizontal position. Next, the laser diode 235 is placed in the calibration position and fixed thereto. Then, the spherical mirror 80 is fixed to the three corner lines 226 and attached to the three angle lines 226 by CVD. Here, the spherical mirror is attached to the three corners by depositing a layer of oxidized stone deposited by CVD in the gap between the spherical mirror and the three corner lines and on the front surface of the substrate. In this case, when the oxidized hair layer is not deposited on the grooves ^ and L_2 to fix the optical fiber, the method of the second embodiment can be used to fill the optical fiber fixing groove with a photoresist to protect the groove. 9 Spherical mirrors can be formed from materials that provide the same coefficient of thermal expansion as the substrate, preventing the spherical mirror from rupturing and separating from the substrate due to the high temperatures generated by the laser diode. For example, when the substrate is formed by a stone eve, the spherical mirror is formed of ex, and when the substrate is formed of quartz glass, the spherical mirror is also formed of quartz glass φ glass. In addition to the method of fixing a spherical mirror by CVD, a method of injecting an epoxy resin into a groove and irradiating with ultraviolet rays to solidify may be used. Next, the optical fiber 70 is inserted into the fixing grooves L-1 and l_2 and injected with epoxy resin, and then 'post-solidified to fix the optical fiber. &lt;Fifth Exemplary Embodiment> In this embodiment, a mechanism for optically aligning and fixing an optical component on a flat substrate using a 45-degree mirror, and manufacturing using the mechanism will be described. 31 200941053 Optical module coupling structure The method. In this embodiment, although the use of a 45 degree mirror to connect the optical diode to the optical fiber is illustrated, the optical diode can be optically connected to other angles of the optical fiber, and the specific embodiment can be applied to the optical fiber, the optical waveguide, Pairing of illuminators - polar bodies, laser diodes, etc., and is not limited to pairing of photodiodes and optical fibers. Again, this particular embodiment is particularly useful in the case of using an oxidized stone substrate. The ninth drawing is a perspective view of an optical module in accordance with a fifth exemplary embodiment of the present invention. Referring to the ninth drawing, the coupling structure of the optical module includes an optical component connecting portion and a -v groove having a predetermined angle, the optical component connecting portion including a first portion formed in the substrate to support the optical component a trench K-1 and a second trench κ_2, the second trench includes the first trench Κ-1 and a space in which the optical component is fixed, wherein the optical component is fixed by the first A line or point of a groove and an angle guides the optical component. The V-groove has a predetermined tilt angle to be optically coupled to the fixed fiber within the connecting portion of the optical component. For example, fiber 70 is optically coupled to photodiode 279 through a 45 degree mirror 277 (see Figure 10D). The parallel position of the optical fiber 70 and the photodiode 279 with respect to the substrate is determined by the horizontal position of the calibration structure made of the mask pattern, and is rotated by using a rotary polishing apparatus including a V-shaped blade perpendicular to the substrate and having two jersey surfaces. A ruthenium oxide substrate is used to fabricate a 45 degree mirror. The position of the fiber is determined by two corner lines 263 (only one angle line is shown) and an optical component connection portion 264, and the position of the 32 200941053 light diode 279 is determined by the metal calibration pattern 258. The metal calibration pattern 258 can be used as the electrode 279 of the photodiode. Next, a method of manufacturing an optical module coupling structure will be explained. 10A to 10D are perspective views for explaining an optical module manufacturing process according to a fifth exemplary embodiment of the present invention. Figure 10A is a perspective view of a first step of fabricating an optical module in accordance with a fifth exemplary embodiment of the present invention. The trench K-1 is formed in the 'substrate by photolithography and dry etching, similar to the first to third embodiments. Figure 10B is a perspective view of a second step of fabricating an optical module in accordance with a fifth exemplary embodiment of the present invention. After the completion of the first step, the second trench K-2 is formed by photolithography and dry etching, similar to the first to third embodiments. In this process, the depth of the first trench K-1 from the surface of the substrate increases. Next, an electrode metal layer 258 for photodiode calibration is deposited. 0 C is a perspective view of a third step of fabricating an optical module in accordance with a fifth exemplary embodiment of the present invention. In this step, the V-grooves 266 are polished using a rotary polishing tool to form a 45-degree reflective surface. A dielectric or metal reflective layer 267 is then applied over the 45 degree surface. The tenth D is a perspective view of a fourth step of fabricating an optical module in accordance with a fifth exemplary embodiment of the present invention. First, the photodiode is placed in the calibration position and fixed here. To help position the photodiode in an accurate horizontal position, the calibrated metal mask can have individual calibration patterns. Next, the optical fiber 70 is inserted into the grooves K-1 and K-2 and an epoxy resin is injected into the groove, and then 33,410,53, and then solidified to fix the optical fiber. As can be understood from the foregoing, the effects of the present invention are as follows: (1) Since the optical fiber is not directly connected to the optical module, the manufacturing cost can be reduced. (2) Since the μ fiber is used for the two _ alignments in the double trench, a stable fiber connection can be determined. (3) Since the spherical mirror is fixed by two fixed lines in the double groove, the stable calibration spherical mirror can be determined. (4) In addition, because the fixed line or the solid point can be converted into a round surface, the possibility of damage to the calibration structure due to compression to a fixed line or a fixed point when the fiber or the spherical mirror is inserted can be eliminated. (5) The fiber or the spherical mirror is automatically calibrated in the horizontal direction of the substrate, so that the height of the fiber or the spherical mirror is adjusted in the vertical direction of the substrate, regardless of the horizontal direction. That is, the height of the fiber or the spherical mirror can be increased by depositing a CVD layer in the calibration trench, or the alignment of the trench can be reduced by dry etching to reduce the southness of the light or the spherical mirror. (6) The upper coating of the optical waveguide can be prevented from depositing in the alignment trench of the fiber or the spherical mirror, thereby reducing the calibration trench etching time of the fiber or the spherical mirror. (7) Using a CVD method, the spherical mirror can be removed into the spherical mirror calibration groove without using epoxy resin. While exemplifying the exemplary embodiments of the present invention, those of ordinary skill in the art will appreciate that many modifications, additions and substitutions can be made without departing from the spirit and scope of the invention disclosed in the application. . BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and other advantages of the present invention will become more apparent from the aspects of the appended claims. The first figure is a perspective view of a coupling structure of an optical module according to a first exemplary embodiment of the present invention; the second to second figures F are diagrams for explaining optical according to a first exemplary embodiment of the present invention A perspective view of a module manufacturing process; ❹ The third drawing is a perspective view of an optical module facing structure according to a second exemplary embodiment of the present invention; and FIGS. 4A to 4F are for explaining the present invention. A perspective view of an optical module manufacturing program of the second exemplary embodiment; FIGS. 5A to 5F are perspective views for explaining an optical module manufacturing program according to a third exemplary embodiment of the present invention, and 6 is a perspective view of an optical module of a neon light distributor according to first to third exemplary embodiments of the present invention; and a seventh embodiment is an optical module according to a fourth exemplary embodiment of the present invention; A perspective view of a synthesizing structure; FIGS. 8A to 8D are perspective views for explaining an optical module manufacturing procedure according to a fourth exemplary embodiment of the present invention; and a ninth drawing is a fifth example according to the present invention Specific embodiment A perspective view of an optical module; and a tenth through tenth Dth are perspective views for explaining an optical module manufacturing procedure according to a fifth exemplary embodiment of the present invention. 35 200941053 [Description of main component symbols] 10 Substrate 20 Optical waveguide part 30 Optical component connection part 60 Optical fiber 70 Optical fiber 80 Spherical mirror 102 Core 103 Optical waveguide core layer 104 First groove pattern 131 Optical waveguide core material 145 Optical fiber fixed angle ridge 179 Upper dressing layer 181 Third groove 201 Support frame 226 Angle line 228 Corner line 229 Fiber stop critical 235 Laser diode 236 Metal calibration pattern 258 Metal calibration pattern 263 Corner line 264 Optical component connection part 266 V groove Groove

36 200941053 267 Metal Reflective Layer 277 45 Degree Mirror 279 Light Diode 302 Upper Coating 409 Critical 501 Third Groove 702 Core 703 Optical Waveguide Core Layer

705 sub-trench 707 third trench 708 sub-trench 1003 photo-polymer layer 1007 coated with yttrium oxide layer A first trench B second trench C first trench D second trench E negative pattern F intaglio pattern G Second groove K-1 First groove K-2 Second groove L First optical component connection portion L-1 First groove 37 200941053 L-2 Second groove Μ Second optical component connection portion M1 First trench M-2 second trench

Q 38

Claims (1)

200941053 X. Patent Application Range: 1. An optical module coupling structure comprising: a first trench formed in a substrate to support an optical component; and a second trench formed therein The first trench and a space in which the optical component is secured, wherein the optical component is guided by a point or line of an angle in the first trench when the optical component is secured. 2. The optical module coupling structure of claim 1, wherein an optical waveguide is integrated to optically communicate with the optical component. 3. The optical module coupling structure of claim 2, further comprising a third trench formed between the optical component and the optical waveguide. 4. The optical module coupling structure of claim 1, further comprising a sub-groove formed in a longitudinal direction in a corner of the first trench or the second trench. Q 5. An optical module coupling structure comprising: a first optical component connecting portion and a second optical coupling connecting portion formed on a substrate, each optical component connecting portion comprising a configured to support the optical component a first trench, and a second trench formed therein including the first trench and a space in which the optical component is fixed, wherein when the optical component is fixed, one of the first trench is utilized A point or line of the corners guides the optical component, and the first optical component connection portion and the second optical component connection portion are aligned with each other. 39 200941053 6. The optical module coupling structure of claim 5, further comprising a support frame to be joined to another optical component. 7. The optical module coupling structure of claim 6 further comprising a calibration mask on the support frame. 8. An optical module coupling structure comprising: an optical component connection portion and a V-groove having a predetermined ramp formed in a substrate, the optical component connection portion including a optical component configured to support the optical component in the substrate a first trench, and a second trench formed therein including the first trench and a space in which the optical component is fixed, wherein when the optical component is fixed, one of the first trench is utilized A point or line of the corners guides the optical component, and the V-groove has a ramp such that the optical component is attached to the optical component connection portion to which the optical component is to be optically coupled. 9. The optical module coupling structure of claim 8 wherein the ramp is actually inclined by 45°. 10. The optical module coupling structure of claim 8, wherein an optical transmission device or a light receiving device is placed on the V-groove. 11. The optical module coupling structure of claim 8, wherein the ramp is coated with a dielectric or a metal reflective layer. 12. The optical module coupling structure of any one of claims 1 to 11, wherein the substrate is formed of yttrium oxide. 13. The optical module coupling structure of any one of claims 1 to 11, wherein the first trench or the second trench is etched by a semiconductor photolithography and 200941053 etched, laser beam processed or stamped. form. The optical module coupling structure according to any one of claims 1 to 11, wherein the width of the first groove and the second groove are uniform, stepped or gradually reduced when viewed from above the substrate. The way to change, or to change continuously or intermittently in a triangle, rectangle or zigzag. 15. The optical module coupling structure of any one of claims 1 to 11, wherein the plurality of coupling structures are integrated in the substrate. 16. A method of fabricating an optical module assembly structure comprising:: forming a first trench in a substrate to support an optical component; and forming a second trench including the first trench therein The slot and a space in which the optical component is secured, wherein the optical component is guided by a point or line of an angle in the first trench when the optical component is secured. 17. The method of claim 16, further comprising forming a third trench between the optical component ❿ and an optical waveguide. 18. The method of claim 17, wherein the third trench and the first trench are formed simultaneously. 19. The method of claim 16, further comprising forming a sub-groove at a corner in a longitudinal direction of the first trench. 20. A method of fabricating an optical module coupling structure, comprising: forming a mask for forming a core of an optical waveguide and a portion of an optical component connection portion in a substrate using an optical waveguide core layer a trench; 41 200941053 etching the first trench using the mask; forming an upper plating layer on at least the optical waveguide; and forming a second trench including the first trench therein. 21. The method of claim 20, further comprising forming a third trench between the optical waveguide and the optical component connection portion. 22. The method of claim 20, wherein the mask is formed to form the first trench, and a corner H in the mask and in a longitudinal direction of the first trench forms a sub- Groove. 23. A method of fabricating an optical module coupling structure, comprising: forming a core forming pattern of an optical waveguide and a first trench forming pattern of an optical component connecting portion in an undercut pattern in a substrate; Forming, by the first trench forming pattern, a first trench; forming an optical waveguide core material on the entire structure to fill at least the core forming pattern to form a second trench including the first trench; And forming an upper plating layer on at least one core of the optical waveguide. 24. The method of claim 23, wherein the optical waveguide core material is formed on the entire structure to fill at least the core forming pattern, and the bottom surface of the first trench may be filled . 25. The method of claim 23, further comprising forming a third trench between the optical waveguide and the optical component connection portion. 26. A method of fabricating an optical module coupling structure, comprising: integrating a first 42 200941053 optical component connection portion having a second optical component connection portion, wherein each of the optical component connection portions includes a configuration to support a first trench of the optical component, and a second trench, the second trench includes the first trench and a space in which the optical component is fixed, when the optical component is fixed by the first A line or point of a corner of the groove guides the optical component. 27. The method of claim 26, wherein the first optical component connecting portion and the second optical component connecting portion are aligned with each other by changing an etching depth of the trench. 28. The method of claim 26, further comprising forming a support frame to be coupled to other optical components. 29. The method of claim 28, further comprising forming a calibration mask on the support frame. 30. A method of fabricating an optical module coupling structure, comprising: forming a first trench in a substrate to support an optical component; and forming a second trench therein, including the first trench Forming a space in which the optical component is fixed, wherein the coupling structure of an optical module includes an optical component connecting portion and a V-groove having a predetermined angle, the optical component connecting portion including a configured to support the substrate a first trench of the optical component and a second trench including the first trench and a space for fixing the optical component, and when the optical component is fixed, a bend is utilized in the first trench The corner 43 200941053 guides the optical assembly point or line and the v-groove has a bevel such that the optical component is attached to the optical component connection portion to be optically coupled. 31. The method of claim 30, further comprising forming an optical transmission device or a light receiving device disposed on the V-groove. 32. The method of claim 30, further comprising applying a dielectric or a metallic reflective layer to the ramp. 44