200939517 九、發明說明： 【發明所屬之技術領域】 特別是關於一種具有良 本發明關於一種發光二極體封裝件及背光模組 好擴光角度之發光二極體封裝件及背光模組。 【先前技術】 ❹ ❹ 快、使用娜長雜點，故逐漸於多麵·域取代傳統統。然而，因為 LED為點光源’賴驗之發光肖度姆較為針，因而_ 了哪的應用 範圍’也因此改善LED的發辆度-直為業界主要的研發方向之一。， 圖1為-習知發光二極體封裝件之示意圖。如圖丨所示，led 12設置 於基座11上且基座11上設有電極(未圖示），如此LED 12即可以引線或導電 凸塊(未圖示)的方式與基座u之電極電性連接，且例如透明樹脂之封裝體 包覆LED 12、引線或導電凸塊以保護LED 12。# LED12發出的光線到達封 裝體13與空氣交界之擴光面131時即產生折射現象，使咖封裝件^ 較大的發光角度。 ” 於比較不同發光二極體封裝件之擴光能力時，可於相同環境條件下比較 各個封裝件的半強肖”量值差異。於此钱肢指以基座^上制咖a 之法線方向所測得之光強度為鲜，於相同_下測得腦基準光 Γ pn J. , 2之連線與法線兩者的夹角。如圖l所示之習知設計，哕 D封裝件1擴光面131為單一曲面的設計，可獲得僅約％度的半強 其擴光庇力仍有極大的改善空間。 【發明内容】 6 200939517 件的㈣描的在於提供—種發光二極體封裝件及包含該發光二極體封農 、'組’其具有良好的擴光效果且可有效降低背光模組的亮暗帶對比: 依本發明之-實施_ ’ —種發光二極體難件包含—基座、 ==封裝t基座之—表面上設有至少—電極，發光二極體設置於= 並與«極雜連I封裝難有—呈_且相對基座表面凸出之 光面，且擴光面設有至少—第—弧_槽。 擴200939517 Nine, the invention description: [Technical field of the invention] In particular, the invention relates to a light-emitting diode package and a backlight module which have good light-expanding angles of a light-emitting diode package and a backlight module. [Prior Art] ❹ ❹ Fast, using Na Changhe, so gradually replaced the traditional system in the multi-faceted domain. However, because the LED is a point source, the illumination is less than the needle, so the application range of the LED is improved, which is one of the main research and development directions of the industry. FIG. 1 is a schematic view of a conventional light emitting diode package. As shown in FIG. ,, the LED 12 is disposed on the pedestal 11 and the susceptor 11 is provided with an electrode (not shown), so that the LED 12 can be a lead or a conductive bump (not shown) and the pedestal u The electrodes are electrically connected, and a package such as a transparent resin encloses the LEDs 12, leads or conductive bumps to protect the LEDs 12. # The light emitted from the LED 12 reaches the light-emitting surface 131 at the boundary between the package body 13 and the air, and a refraction phenomenon occurs, so that the coffee package has a large illumination angle. When comparing the light-expanding capabilities of different light-emitting diode packages, the difference in the value of the semi-strongness of each package can be compared under the same environmental conditions. In this case, the light intensity measured by the normal direction of the base is the fresh, and the brain reference pupil pn J. , 2 is connected to the normal and the normal. Angle. As shown in the conventional design shown in FIG. 1, the illuminating surface 131 of the 哕D package 1 is a single curved surface design, and a half strength of only about 5% is obtained, and there is still a great room for improvement in the light illuminating. [Description of the Invention] 6 200939517 (4) describes the provision of a light-emitting diode package and the light-emitting diode package, the 'group' has a good light-expanding effect and can effectively reduce the brightness of the backlight module Dark-band contrast: According to the invention - the implementation _ '--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- «The extremely hybrid I package is difficult to have - and the light surface is convex with respect to the surface of the base, and the light-emitting surface is provided with at least - the first arc_slot. Expand
明之另—實施樣態，—種背光模組包含—導光板及—發光二極體 义導光板具有-入光面，發光二極體封裝件則設置於該入光面側。兮 發^二極體封餅包含—基座、—發光二極體以及—封裝體。基座之一表面z 上設有至少-電極’發光二極體設置於該表面上並與該電極電性連接。封裝 體具有-呈弧形且相對基絲面凸出之_擴光面，且擴光面設有至少、 狐形凹槽。 币 藉由本發明各個實施例之設計，其於擴光面上設置至少—弧形凹槽，使 =二極體發H線能有較大的出光肖度且可提昇邊緣大角度方向出射的 、、里’並且能均勻化整體出光強度而有效降低背賴組的亮暗帶對比。 【實施方式】 以下將參照相關圖式，說明依本發明之發光二極體封裝件及背光模細， 、中相_元件將__參照舰純綱。 、、 月參照圖2a’本發明_實施例之發光二極體封裝件2包含—基座21、— 發光二極體22以及一封裝體Η。基座U之一表面叫上設有至少一電極(未 =不）’且發光二極體22設置於同一基座表面2ιι上。基座Μ上之電極以適 备方式與發光二極體22紐連接，以提供發光二極體22發絲需之電源。 發光—_ 22可糊㈣方式絲座2丨上的電極電㈣接，料限於此， 200939517 ㈣=_覆晶的方式設置於基座21上’並以導電凸塊與基座2ί上的電 極電性連接。封 ^ - 己覆發光二極體22以及其所在之表面211 ,藉以保 、，體22以及基座21表面211上之電極。於一實施例中，發光二極 體22可為紅光、綠光、藍光或白光發光二極體。 立 3具有一大致呈弧形且相對基座表面211凸出之擴光面231。需 •;〜該孤七擴光面231並不限定於部分圓形面或橢圓面，任何有助於光擴散 效果之弧面均包含於本發明之中，例如拋物面等。再者，擴光面况設有一 ©在基座表面211方向凹入之弧形凹槽24，使擴光面231具有一内凹之弧面 24卜 於一實施例中，弧形凹槽24設置的位置正對發光二極體22。於一實施 例中’孤形凹槽24任一侧的端點延伸至發光二極體22之連線、與基座表面 211法線Ν兩者的夾角Θ為大於或等於5度且小於或等於45度，以使孤形凹 槽24維持適當的開口大小。另外，弧形凹槽μ的深度以與封裝體厚度τ 的比值的一較佳範圍為〇〇% (D1/T) $ 〇7。再者，雖然圖2&之爽角Θ例 示為自5瓜幵/凹槽24之-端點延伸至發光二極體22之中心點，但夾角0的定 〇義亦可涵蓋第-弧形凹槽24之一端點延伸至發光二極體22之任一發光區域 .的連線與基座表面211之夾角。 — 請參照W 2b ’以發光二極體22中心點所發出的光線為例，說明圖％所 示實施例之光擴散效果。如圖2b所示，光線L1沿基板21之法線方向射出， 其路徑不會產生偏折，光線L2通過曲面241時則因折射效果使其路徑偏離曲 面241之法線方向。相較於習知的擴光面131設計，本發明之内凹弧面241 可使光線L2的光偏折角度纽光線L2’的光偏折角度；另一方面，内凹孤面 241的部分區域可使入射光線發生全反射’例如光線u遭遇内凹藏面發 生全反射’之後躲擴光面231折射後，使得光線L3峨原先為大的角度離 8 200939517 開擴光面231而有較大的出光角度。因此，本實施例於擴光面231上形成内 凹弧面241的設計，可大幅提升擴光效果。 π參照圖3，依本發明另一實施例之發光二極體封裝件2,，其擴光面故 除於正對發光二極體22位置設有一第一旅形凹槽24外，於兩側更設有第二 旅形凹槽25,且第：弧形凹槽25與第一弧形凹槽以之間以具有一間距較佳。 於-實施例中’第二弧形凹槽25的深度D2小於或等於第—卿凹槽^的 深度D1。 清參照圖4 ’顯示圖！所示之習知發光二極體封裝件i以及圖^所示本 發明實施例之發光二極體封件2於〇度平面之光強度分析圖。經比較習知之 發光極體封裝件1(如圖中之虛線所示)與本發明之發光二極體封裝件2(如 圖中之實線所示)之擴光效果可知，習知發光二極體封裝件i之半強角約為％ 度，而本發明之發光二極體封件2之半強角約為83度，因此本發明之發光 二極體封件2具有較佳的擴光效果，且提昇了邊緣出光能量。此外，如圖4 所示’本發明之發光二極體封裝件2可平均化±4〇度内之出光強度，因此當 搭配V光板顧於-背光模組時，可有效降低亮暗帶對比。 圖5a為依本發明一實施例之背光模組5的示意圖，背光模組$包含一導 光板4以及至少-發光二極體封裝件2,圖％為顯示圖％之發光二極體封裳 件2的封裝體23外形的立體示意圖。導光板4具有一入光面4ι，發光二極 體封裝件2則設置於人絲41對側。於本實施财，祕背賴組$賴裝 體23係為-城，故可配合導歧*的厚度並可使整贿光二鋪封襄件2 利於薄型化，且弧形凹槽24形成於練體賴面上。人絲4丨可為一平面 或是如圖5a所示之凹入狐面。此外，入光面41可設有多個擴光結構幻。如 圖5所示之實施例’擴光結構42可為相社小、相同形狀、連續排列且 之圓孤形，料限於此。請參照圖6a，各個擴光結構42，的外形亦可為圓弧 9 200939517 形、橢圓弧形、三角形、多邊形其中之—或至少兩種以上的組合。再者各 個擴光結構可具有相同尺寸(圖化所示），或具有;ϊ；同尺寸例&以一大一小之 排列順序組成(圖6a所示）。於圖6a所示之實施例中，擴光結構42,之寬度 W1與其尚度Η之比值大於2或小於2，但是不等於〉另外，請參照圖你， *擴光結構42，，亦可為往導光板4中心内凹的凹槽結構，而其寬度W2與深度 . D3之比值亦大於2或小於2，但是不等於2。 藉由前述各個實施例之設計，其於擴光面上設置至少—弧形凹槽，使發 ©光二極體發出之光線能有較大的出光角度且可提昇邊緣大角度方向出射的光 月b量，並且能均勻化整體出光強度而有效降低亮暗帶對比。 以上所述僅為舉例性，而非為限雛者。任何熟悉該項技術者均可依據 上述本發明之實施例進行等效之修改，而不脫離其精神與範嘴。故任何未脫 離本發明之精神與範而對其進行之等效修改或變更，均應包含於後附之 申請專利範圍中。 【圖示簡單說明】 _ 圖1為一習知之發光二極體封裝件之示意圖。 圖2a為本發明一較佳實施例之發光二極體封裝件。 圖2b為圖2a所示實施例之光路徑示意圖。 圖3為本發明另一較佳實施例之發光二極體封裝件。 圖4為圖1所示之發光二極體封裝件以及圖以所示之發光二極體封裝件 於〇度平面之光強度分析圖。 圖5a為依本發明—健實關之背紐組的示意圖。 圖5b為顯示圖5&之發光二極體封裝件的封裝體外形的立體示意圖。 圖6a及圖仙為顯示本發明形成於導光板上的擴光結構設計例的示意圖。 200939517 【主要元件符號說明】 I 發光二極體封裝件 II 基座 12 發光二極體 • 13 封裝體 131 擴光面 * 2、2’ 發光二極體封裝件 21 基座 211 表面 22 發光二極體 23 封裝體 231 擴光面 24 第一弧形凹槽 241 曲面 25 第二弧形凹槽 ❹4導光板 41 入光面 42、42’、42” 擴光結構 » 5 背光模組 D1 第一弧形凹槽深度 D2 第二弧形凹槽深度 D3 擴光結構深度 Η 擴光結構高度 U、L2、L2’、L3 光線路徑 11 200939517 N 法線 T 封裝件厚度 W1 ' W2 擴光結構寬度In the other embodiment, the backlight module includes a light guide plate and a light-emitting diode. The light guide plate has a light-incident surface, and the light-emitting diode package is disposed on the light-incident surface side.兮 Hair diodes contain a pedestal, a light-emitting diode, and a package. At least one of the electrodes z is provided on the surface z of the pedestal. The illuminating diode is disposed on the surface and electrically connected to the electrode. The package has a _light-emitting surface that is curved and protrudes from the base surface, and the light-emitting surface is provided with at least a fox-shaped groove. By the design of each embodiment of the present invention, at least the arc-shaped groove is disposed on the light-expanding surface, so that the H-line of the diode can have a large light-emitting irradiance and can be raised at a large angle. , and can evenly equalize the overall light intensity and effectively reduce the contrast between the bright and dark bands of the backing group. [Embodiment] Hereinafter, a light-emitting diode package and a backlight module according to the present invention will be described with reference to the related drawings, and the middle-phase element will be referred to as a ship. Referring to FIG. 2a', the light-emitting diode package 2 of the present invention includes a susceptor 21, a light-emitting diode 22, and a package body. One surface of the susceptor U is said to have at least one electrode (not = no) and the illuminating diode 22 is disposed on the same pedestal surface 2 ι. The electrodes on the susceptor are connected to the LEDs 22 in a suitable manner to provide the power required for the LEDs of the LEDs 22. Illumination - _ 22 can be paste (four) way wire holder 2 丨 electrode electric (four) connection, limited to this, 200939517 (four) = _ flip chip is set on the pedestal 21 'and the conductive bump and the electrode on the pedestal 2 Electrical connection. The sealing surface of the light-emitting diode 22 and the surface 211 on which it is placed serves to protect the body 22 and the electrode on the surface 211 of the susceptor 21. In one embodiment, the light emitting diode 22 can be a red, green, blue or white light emitting diode. The stand 3 has a light-expanding surface 231 which is substantially curved and protrudes from the base surface 211. It is necessary to: • the solitary light-increasing surface 231 is not limited to a partial circular surface or an elliptical surface, and any curved surface which contributes to light diffusion effect is included in the present invention, such as a paraboloid or the like. Furthermore, the light-expanding surface condition is provided with an arc-shaped recess 24 recessed in the direction of the surface 211 of the base, so that the light-expanding surface 231 has a concave curved surface 24. In an embodiment, the curved recess 24 The position is set to face the light-emitting diode 22. In an embodiment, the angle between the end point of either side of the isolated groove 24 extending to the light emitting diode 22 and the normal line of the base surface 211 is greater than or equal to 5 degrees and less than or Equal to 45 degrees to maintain the orphan groove 24 at an appropriate opening size. Further, a preferred range of the depth of the curved groove μ to the thickness τ of the package is 〇〇% (D1/T) $ 〇7. Moreover, although the refreshing angle of FIG. 2 & is exemplified as extending from the end point of the 5 幵 / groove 24 to the center point of the light-emitting diode 22, the definition of the angle 0 may also cover the first-curve The end of one of the grooves 24 extends to an angle between the line connecting the light-emitting region of the light-emitting diode 22 and the surface 211 of the base. — Refer to W 2b ' for the light emitted from the center point of the light-emitting diode 22 as an example to illustrate the light diffusion effect of the embodiment shown in Fig. %. As shown in Fig. 2b, the light ray L1 is emitted along the normal direction of the substrate 21, and the path is not deflected. When the light ray L2 passes through the curved surface 241, the path is deviated from the normal direction of the curved surface 241 by the refraction effect. Compared with the conventional design of the light-increasing surface 131, the concave curved surface 241 of the present invention can deflect the light of the light L2 by the angle of the light of the angle light L2'; on the other hand, the portion of the concave surface 241 The area can cause the incident light to be totally reflected, for example, the light u is totally reflected by the concave surface, and then the light refracting surface 231 is refracted, so that the light L3 is originally a large angle from the opening angle 231 of 200939517. Large angle of light. Therefore, the design of the concave curved surface 241 on the light-increasing surface 231 of the present embodiment can greatly enhance the light-expanding effect. Referring to FIG. 3, in a light-emitting diode package 2 according to another embodiment of the present invention, the light-expanding surface of the light-emitting diode package 2 is disposed at a position adjacent to the light-emitting diode 22, and is provided with a first traveling-shaped recess 24, The second side is provided with a second bridging groove 25, and the arcuate groove 25 and the first arcuate groove are preferably spaced apart from each other. In the embodiment, the depth D2 of the second curved groove 25 is less than or equal to the depth D1 of the first groove. Refer to Figure 4' for a clear picture! The light intensity analysis of the conventional light-emitting diode package i and the light-emitting diode package 2 of the embodiment of the present invention shown in the second embodiment is shown. The light-emitting effect of the conventional light-emitting polar package 1 (shown by a broken line in the figure) and the light-emitting diode package 2 of the present invention (shown by the solid line in the figure) is known. The half-height angle of the polar package i is about %, and the half-brightness angle of the light-emitting diode package 2 of the present invention is about 83 degrees, so that the light-emitting diode package 2 of the present invention has a better expansion. Light effect, and increased edge light energy. In addition, as shown in FIG. 4, the light-emitting diode package 2 of the present invention can average the light intensity within ±4 degrees, so that when the V-light board is used with the backlight module, the contrast of the light and dark bands can be effectively reduced. . FIG. 5 is a schematic diagram of a backlight module 5 according to an embodiment of the present invention. The backlight module $ includes a light guide plate 4 and at least a light-emitting diode package 2, and the figure shows a light-emitting diode package of % of the display. A perspective view of the outer shape of the package 23 of the piece 2. The light guide plate 4 has a light incident surface 4i, and the light emitting diode package 2 is disposed on the opposite side of the human filament 41. In the implementation of this financial, the secret back of the group of the reliance on the body 23 is - city, so can match the thickness of the guide * and can make the entire bribe 2 package for the thinning, and the curved groove 24 is formed in Practice on the face. The filament 4 can be a flat surface or a concave fox surface as shown in Fig. 5a. In addition, the light incident surface 41 may be provided with a plurality of light-emitting structures. The embodiment of the light-emitting structure 42 as shown in Fig. 5 may be of a small, identical shape, continuous arrangement and rounded shape, which is limited thereto. Referring to FIG. 6a, each of the light-expanding structures 42 may have an outer shape of an arc 9 200939517, an elliptical arc, a triangle, a polygon, or a combination of at least two. Further, each of the light-enhancing structures may have the same size (shown in the figure) or have; ϊ; the same-size examples & are arranged in a large one and a small order (shown in Fig. 6a). In the embodiment shown in FIG. 6a, the ratio of the width W1 of the light-expanding structure 42 to the 尚 Η is greater than 2 or less than 2, but not equal to 〉 In addition, please refer to the figure, * the light-emitting structure 42, or The groove structure is concave toward the center of the light guide plate 4, and the ratio of the width W2 to the depth D3 is also greater than 2 or less than 2, but not equal to 2. According to the design of each of the foregoing embodiments, at least the arc-shaped groove is disposed on the light-enhancing surface, so that the light emitted by the light-emitting diode can have a larger light-emitting angle and can enhance the light-emitting direction of the edge at a large angle. b amount, and can equalize the overall light intensity and effectively reduce the contrast of light and dark bands. The above description is for illustrative purposes only and is not intended to be limiting. Anyone skilled in the art can make equivalent modifications in accordance with the embodiments of the present invention described above without departing from the spirit and scope of the invention. Therefore, any equivalent modifications or alterations may be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional light-emitting diode package. 2a is a light emitting diode package according to a preferred embodiment of the present invention. Figure 2b is a schematic illustration of the optical path of the embodiment of Figure 2a. 3 is a light emitting diode package according to another preferred embodiment of the present invention. 4 is a light intensity analysis diagram of the light emitting diode package shown in FIG. 1 and the light emitting diode package shown in the drawing. Figure 5a is a schematic illustration of a back-to-back group in accordance with the present invention. FIG. 5b is a perspective view showing the outline of a package of the light emitting diode package of FIG. 5 & 6a and FIG. 1 are schematic diagrams showing a design example of a light-expanding structure formed on a light guide plate of the present invention. 200939517 [Description of main components] I LED package II pedestal 12 LEDs • 13 Package 131 Dimming surface * 2, 2' LED package 21 Base 211 Surface 22 LED Body 23 Package 231 Light-emitting surface 24 First curved groove 241 Curved surface 25 Second curved groove ❹4 Light guide plate 41 Light-incident surface 42, 42', 42" Light-emitting structure » 5 Backlight module D1 First arc Groove depth D2 Second arc groove depth D3 Diffusion structure depth 扩 Dimming structure height U, L2, L2', L3 Ray path 11 200939517 N Normal line T Package thickness W1 ' W2 Dimming structure width
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