200939292 九、發明說明 【發明所屬之技術領域】 本發明是關於準分子燈及準分子燈的製造方法。尤其 是，關於在半導體基板或液晶基板等的製程中，被利用於 半導體基板或液晶基板的洗淨等的準分子燈及該準分子燈 的製造方法。 φ 【先前技術】 在最近的半導體基板或是液晶基板等的製程中，作爲 除去附著於半導體基板的矽晶圓或液晶基板的玻璃基板的 表面的有機化合物等的污垢的方法，廣泛地被利用著利用紫 外線的乾式洗淨方法。尤其是在使用從準分子燈所放射的真 空紫外光的臭氧或活性氧氣所致的洗淨方法中，有更有效率 且在短時間加以洗淨的各種洗淨裝置被提案，眾知有如專利 文獻1(日本特開2000-260396號）。 ❹ 表示於專利文獻1的紫外線照射處理裝置是準分子燈 連設複數於被處理體的搬運方向，而構成準分子照射面對於 被處理體成爲一定距離’一面朝所定方向搬運被處理體，一 面點燈驅動各個準分子燈，藉由將從各個準分子燈所放射的 準分子光照射到被處理體的表面，俾乾式洗淨被處理體的表 面。依照表示於同文獻的紫外線照射處理裝置，藉由氧氣使 得準分子光被吸收而爲了抑制準分子光被衰減的情形，在將 被處理體配置在距準分子照射面8 mm以內的狀態下，作成 將準分子光照射在被處理體的表面。 200939292 可是，習知的準分子燈是具備如專利文獻2(日本特開 2004-342369號）所示的饋電構造。第8圖是表示習知的準分 子燈的饋電構造的槪略圖式。 表示於同圖的準分子燈A是具備··在被形成於介質 材料所成的長方體形狀的放電容器B的內部的密閉空間s 封入有生成準分子分子的氣體，而且設置於隔著放電容器 B的密閉空間S相對的位置的一對電極C，D。各個電極 〇 C，D是藉由真空蒸鍍鎳或鉻等的金屬薄膜所形成，—方的 電極D是網目狀地形成除了爲了取出紫外線而附設引入 線的端部以外。在電極D的端部，藉由使用焊料F焊接有 解開成爲露出的複數條芯線的狀態的引入線E的芯線部 E a ° 專利文獻1 :日本特開2000-260396號 專利文獻2:日本特開2004-342369號 〇 【發明內容】 在專利文獻1的紫外線照射處理裝置中，因以下的理 由，判明了藉由氧化固定表示於第8圖的準分子燈A的 電極D與引入線E的芯線部Ea，有降低兩者的連接部的 機械性強度之虞。亦即，可能爲從準分子燈A所放射的 紫外線被吸收在存在於準分子燈周圍的氧氣而在準分子燈 的周圍生成臭氧，藉由所生成的臭氧會氧化焊料F的表面 而導致焊料F會劣化者。如此地，若劣化固定電極與引入 線的焊料，則在用來進行下一洗淨的被處理體被搬運爲止 -6- 200939292 的期間，熄燈準分子燈而待機時，或是點燈驅動準分子燈 來進行被處理體的洗淨時等把焊料破損而引入線從電極離 開’藉此，欲對於被處理體照射紫外線時成爲無法點亮準 分子燈，或是對於被處理體照射紫外線時，產生突然熄掉 準分子燈的不方便。 由以上，本發明的目的是在於提供一對電極隔著放電 容器的密閉空間相對所形成，而且藉由焊料固定著各個電 極與將電力供應於各個電極所用的引入線的準分子燈，可 抑制焊料的劣化的準分子燈及該準分子燈的製造方法。 本發明的準分子燈，是在被形成於由介質材料所構成 的放電容器內部的密閉空間封入有放電用氣體，金屬薄膜 所成的一對電極隔著上述密閉空間而被形成於上述放電容 器的外表面，用以饋電於各個電極的各個引入線經由焊料 被電性地連接於各個電極的準分子燈，其特徵爲：在上述 焊料的周圍形成有保護膜。 又，在上述引入線連接有板狀饋電端子，該饋電端子 與上述電極爲藉由上述焊料所連接，爲其特徵者。 又，在上述饋電端子的周圍形成有上述保護膜，爲其 特徵者。 又，上述保護膜爲二氧化矽所成’爲其特徵者。 又，上述保護膜爲塗佈聚矽氨烷溶液，而藉由轉化成 二氧化矽所形成’爲其特徵者。 又，上述電極是被連接有上述引入線的部位與其他以 外的部位分開，而且連接有該引入線的部位與其他以外的 200939292 部位藉由導電性糊電性地被連接，在該導電性糊的周圍形 成有上述保護膜，爲其特徵者。 又，本發明的製造方法，是在被形成於由介質材料所 構成的放電容器內部的密閉空間封入有放電用氣體，金屬 薄膜所成的一對電極隔著上述密閉空間而被形成於上述放 電容器的外表面，用以饋電於各個電極的各個引入線經由 焊料被電性地連接於各個電極的準分子燈的製造方法，其 @ 特徵爲：具備以下製程： 1·在放電容器的外表面形成金屬薄膜所成的電極的 製程， 2. 在1.的製程之後，藉由加熱熔融焊料，而經由焊 料電性地連接外部電極與引入線的製程， 3. 在2.的製程之後，在焊料的周圍塗佈聚矽氨烷溶 液，而使之乾燥，而在焊料的周圍形成保護膜的過程。 依照本發明的準分子燈，一對電極隔著放電容器的密 〇 閉空間而相對所形成，而且藉由焊料來固定各個電極與用 以將電力供應於各個電極的各個引入線者，在焊料的周圍 形成有保護膜之故，因而確實地可防止藉由發生在準分子 燈的周圍的臭氧把焊料氧化而劣化的情形。所以一直到下 一被處理體被搬運爲止的等待期間或在點燈驅動放電燈 時，焊料不會破損’引入線不會從電極離開的情形，因 此’欲點亮準分子燈時則確實地可點亮，又確實地可防止 對於被處理體照射紫外線來洗淨被處理體的期間不會突然 地熄熄滅準分子燈的情形。 -8 - 200939292 又，在上述引入線連接有饋電端子，而藉由上述焊料 固定有饋電端子與上述電極之故，因而可將饋電端子與外 部電極的連接作成更牢固。 又，在上述饋電端子的周圍形成有上述保護膜之故’ 因而確實地可防止藉由臭氧把饋電端子作成劣化的情形。 又，上述保護膜由二氧化矽所成者之故’因而更確實 地可防止焊料的劣化。 U 又，上述保護膜藉由塗佈乾燥聚矽氨烷溶液所形成之 故，因而不必進行高溫的加熱處理可形成保護膜。所以， 藉由焊料成爲焊料不會熔融程度的溫度的熱處理可形成保 護膜之故，因而具有避免焊料朝固定部以外的部位流動， 或是避免金屬電極分散於焊料中而被剝落的優點。 又，上述電極是被連接有上述引入線的部位與其他以 外的部位離開，而且連接有該引入線的部位與其他以外的 部位藉由導電性糊電性被連接，而在該導電性糊的周圍形 Φ 成有上述保護膜。因此，不會有電性地連接引入線的部位 與其他以外的部位的導電性糊藉由臭氧被劣化之虞。 還有，依照上述的本發明的製造方法，藉由使用聚矽 氨烷溶液，藉由以焊料不會熔解程度的溫度進行熱處理， 而可將二氧化矽所成的保護膜容易形成在焊料的周圍之 故’因而不會損及焊接部的可靠性地形成二氧化矽膜，而 具有可提昇焊接部的耐久性的優點。 【實施方式】 -9- 200939292 第1圖是表示本發明的準分子燈的全體構成的立體 圖。第2圖是表示擴大本發明的準分子燈的電極與引入線 的連接部的斷面圖。在第2圖中，爲了方便僅表示一方的 電極與一方的引入線的連接部分的構成。 準分子燈是由介質材料的矽玻璃所構成，具有在 四隅部具圓味的扁平的方筒形狀的放電容器1，在形成於 放電容器1的內部的密閉空間S，例如氯氣體等的稀有氣 φ 體，或是將氯氣體等的幽素氣體混合於稀有氣體者充塡作 爲放電氣體，藉由氣體的種類發生著不相同波長的準分子 光。放電氣體一般是以約10〜lOOKPa的壓力被塡充。 放電容器1是位於紙面的上方側的平坦壁1 1與位於 紙面的下方側的平坦壁1 2爲互相地隔開而平行地伸展， 而且在平坦壁11，12的各個寬度方向（對於管軸正交的方 向）的端部分別連續形成有彎曲部1 3。此種放電容器1是 在第1圖的紙面位於上下的平坦壁1 1 ,1 2的任一形成朝被 〇 處理體出射紫外線所用的光出射面。例如，在將被處理體 配置於放電容器1的下方時，位於下方側的平坦壁12成 爲光出射面。表示此種放電容器1的數値例，則管軸方向 的全長爲904mm，發光長（配設有電極的領域的管軸方向 的全長度）爲790mm，左右的寬度方向的長度爲43mm， 而上下的高度方向的長度爲15 mm。 在平坦壁11，12，分別配置有電極3,4。電極3，4是例 如將金、銀、銅、鎳、鉻等的耐蝕性金屬藉由進行印刷或 蒸鍍於平坦壁上’例如厚度形成成爲〇·ιμιη〜數十 -10- 200939292 ym。例如，如上述地位於下方側的平坦壁1 2成爲光出射 面時’電極4是將上述金屬藉由進行印刷或蒸鍍成爲格子 狀俾形成具有透光性。電極3是被連接於饋電裝置14的 高壓側的引入線15’而位於下方的電極4是被連接於接 地側的引入線1 6。 如第2圖所示地，引入線1 5是藉由絕緣材料被除去 而成爲露出的芯線部15a與以絕緣材料覆蓋芯線周圍的被 0 覆部15b所構成，芯線部15a爲使用焊料17被焊接於電 極3’藉此’電性及機械性地被固定於電極3。焊料17是 設置成可圍繞引入線15的芯線部15a的周圍。在焊料17 的周圍’形成有耐臭氧性材料所成的保護膜18成爲不會 把焊料17露出於外部。焊料17是例如有Sn-Pb、Sn-In 等’惟一般爲臭氧耐性低者。作爲形成保護膜18的耐臭 氧性材料’例如有二氧化矽、沃其滋莫（商品名稱），斯迷 世拉母（商品名稱）等，惟由下述理由特別以二氧化矽較 〇 佳。 第3圖是表示用以說明本發明的準分子燈的製造方法 的槪念圖。 <第1製程> 如第3 (a)圖所示地，將上述的金屬藉由印刷或蒸鍍於 位於合成石英玻璃所成的扁平筒狀的放電容器1的上方側 的平坦壁1 1上，俾形成金屬薄膜所成的電極3。 -11 - 200939292 <第2製程> 第1製程之後，如第3(b)圖所示地，將引入線15的 芯線部15a配置在電極3上的狀態下在兩者近旁配置焊料 17的塊體而以約300 °C的溫度來加熱焊料使之熔融。藉由 將經溶融的焊料自然冷卻到常溫來固定芯線部1 5a與電極 φ <第3製程> 如第3 (c)圖所示地，在第2製程之後，對於使用刷子 塗佈於焊料17周圍的聚矽氨烷溶液18’在大氣中以大約 90°C溫度進行1小時的熱處理。藉由將聚矽氨烷溶液18’ 自然冷卻到常溫經乾燥，如第3 (d)圖所示地，在焊料1 7 的周圍形成二氧化矽所成的保護膜1 8。 在上述的第3製程中，若將聚矽氨烷溶液予以乾燥， 則聚矽氨烷是與大氣中的水分或氧氣耦合，藉此轉化成二 〇 氧化矽，藉由使用聚矽氨烷溶液，即使來過度地進行高溫 的熱處理也可形成保護膜1 8。而且，藉由以液體狀態使用 聚矽氨烷，則可塗佈到表面形狀容易成爲不穩定的焊料 17的周圍每個角落之故，因而焊料17的外表面與外氣完 全地被遮斷的方式使得形成保護膜1 8成爲容易。 在上述第3製程中所使用的聚矽氨烷溶液，是如下地 被調配。混合原料的全氫化聚矽氨烷與溶媒的二甲苯’來 製作約10〜20 %的全氫化聚矽氨烷溶液。作爲溶媒使用二 丁醚，索爾別索（Solvesso，商品名稱），石油餾份等也可 -12- 200939292 以。對於所製作的全氟化聚矽氨烷溶液添加鈀系或胺系的 觸媒。藉由添加觸媒，以更低溫的熱處理就可形成二氧化 矽所成的保護膜。 又，在上述第3製程中，對於塗佈於焊料周圍的聚矽 氨烷溶液進行熱處理，乃爲了將聚矽氨烷在短時間內使之 轉化成二氧化矽。變更熱處理爲進行加濕處理，也在短時 間內可使之轉化成二氧化矽，若不必縮短轉化成二氧化矽 @ 的時間，則不必進行熱處理等。 第4圖是表示具備本發明的準分子燈的紫外線照射處 理裝置的構成的槪略槪念圖。 紫外線照射處理裝置是將從配置於氮氣等惰性氣體所 塡充的筐體40內的準分子燈100所放射的紫外線，對於 藉由複數滾子42朝水平方向被搬運在筐體40下方的被處 理體W施以照射，來進行該被處理體W的表面洗淨等的 處理者，被處理體W是矽晶圓基板，液晶顯示器製造用， 〇 電漿顯示面板製造用等的平面顯示器製造用的玻璃基板 等。此些基板的表面，是依各製程經過而狀態不相同，作 爲施以光阻，透明導電膜、電路等的狀態。 收容準分子燈100的筐體40，是相對於被處理體W 的下方側被開放，而在筐體40內部有準分子燈1 00配置 於距被處理體W約數mm的位置，而且在該準分子燈100 的上方側配置具有氣體噴出口 4 1 a的惰性氣體放出機構 41。筐體40的內部，是不會因藉由從準分子燈1〇〇所放 射的紫外線被氧氣吸收而有衰減的方式，以氮氣體等惰性 -13- 200939292 氣體所置換，尤其是在準分子燈100與被處理體w間被 置換成反應所必須的最低限的氧氣濃度。作爲惰性氣體， 除了氮氣以外，也可使用氦、Μ、氖等。 此種紫外線照射處理裝置，是當藉由所搬運來的被處 理體w使得筐體40的下方使開口成爲幾乎關閉的狀態’ 則來自惰性氣體放出機構4 1的惰性氣體充滿於筐體40內 而降低內部的氧氣濃度，例舉一例，在被處理體W的寬 @ 度爲1100mm，準分子燈100的全長度爲1 300mm，筐體 40的全長度爲1500mm，高度爲50mm’寬度爲150mm， 從惰性氣體放出機構4 1所放出的惰性氣體的流量爲 3 00L/分的情形，則在被處理體W幾乎塞住筐體40下方 側的開口時，筐體40內的氧氣濃度是成爲大約0.5%。 在表示於以上的第4圖的紫外線照射處理裝置中，筐 體40內部未完全地密閉之故，因而成爲氧氣容易殘留在 筐體40內部的環境。然而，本發明的準分子燈是在如此 〇 地藉由殘留著氧氣而容易發生臭氧的環境化下即使進行點 燈驅動，耐臭氧性材料所成的保護膜18被形成在固定電 極3與引入線15的芯線部15a的焊料17的周圍之故，因 而藉由發生在準分子燈100的周圍的臭氧也不會使得焊料 1 7氧化而被劣化的情形。所以，一直到下一洗淨所用的 被處理體被搬運爲止的等待期間或是對於被處理體照射紫 外線而正進行洗淨被處理體的期間，確實地可防止引入線 15的芯線部15a從電極3離開的情形。因此，不會產生 欲點亮準分子燈時無法點亮，或是在正對於被處理體照射 -14- 200939292 紫外線的期間突然地熄滅準分子燈的不方便。 又’依照本發明的準分子燈的製造方法，如上述的第 3製程所示地爲了形成保護膜18而使用聚矽氨烷溶液之 故，因而不必過度地進行高溫的熱處理就可形成保護膜 18。所以，藉由第3製程的熱處理就可避免焊料17過度 地成爲高溫狀態，又可確實地避免焊料1 7再度熔融的情 形。在第3製程中，若焊料再度熔融，則焊料會流到固定 0 部以外的部位，或是有金屬電極被分散於焊料中產生被剝 落的不方便之虞。又，液體的聚矽氨烷被塗佈到焊料17 的外表面各個角落之故，因而焊料17的外表面從外氣完 全地被遮斷的方式成爲容易形成保護膜18。 第5圖至第7圖是表示用以說明本發明的準分子燈的 其他實施形態的主要部分擴大圖。在第5圖至第7圖中， 針對於與第1圖，第2圖共通的部位給予與在第1圖，第 2圖所給予的符號同一符號而省略了說明。 φ 依照表示於第5圖的形態，引入線15是除了芯線部 15a，被覆部15b以外，還具備：捆紮芯線部15a的鎳製 套管19與被焊接於該套管19的板狀饋電端子20。引入 線15是板狀饋電端子20藉由焊料17被固定於電極3’ 藉此經由饋電端子20被電性地連接於電極3。套管19及 饋電端子20是防止隨著藉由發生在準分子燈的周圍的臭 氧而被氧化成爲劣化之故，因而藉由耐臭氧性材料分別所 構成。例如套管19是藉由鎳’而饋電端子20是藉由鎳所 構成。 -15- 200939292 依照表示於此種第5圖的實施形態’可期待如以下所 說明的實用上的效果。引入線1 5的芯線部1 5a是爲了具 有柔軟性而分成複數細線之故，因而很難焊接於饋電端子 20的表面，或是複數細線容易鬍鬚狀地鼓出之故，因而 接觸於其他週邊機器而成爲誤動作的原因之虞。因此，藉 由將套管19安裝於複數細線所成的芯線部15a而可將套 管19容易地焊接於饋電端子20，而且可避免細線鬍鬚狀 〇 地鼓出之故，因而可減低準分子燈對於週邊機器的不良影 響。 又，藉由設置薄板狀饋電端子20，與將芯線部15a 或是捆紮芯線部1 5 a的套管1 9直接地焊接於電極3的情 形相比較，則可確保與電極3的接觸面積，而且可將熱容 量近似於電極3之故，因而容易地可進行依焊料17之固 定。所以，饋電端子20與電極3的機械性連接強度會變 高，而可將引入線15與電極3的電性連接的可靠性作成 © 高者。板狀饋電端子20是其熱容量接近於電極3的熱容 量較佳。 又，套管19，饋電端子20是並一定藉由耐臭氧性材 料所構成也可以。如第6圖所示地，在焊料1 7，導電性 套管19及板狀饋電端子20的周圍，也可形成有保護膜 成爲此些的外表面不會觸及外氣。依照表示於第6圖 的實施形態’即使套管1 9，饋電端子20爲耐臭氧性低的 材料，也不會藉由臭氧來氧化此些之虞。 依照表示於第7圖的實施形態，電極3是被分離成藉 -16- 200939292 由焊料17固定有引入線15的芯線部15&的引入線固定部 3 a ’及引入線固定部3 a以外的放電形成部3 b，而引入線 固定部3a與放電形成部藉由不同體的導電性糊2ι被 確保導通。導電性糊21是例如使用著在環氧樹脂混合銀 或鎳塡隙料者’ 一般藉由臭氧耐性低的材料所構成。又， 在焊料17及導電性糊21的周圍形成有二氧化矽所成的保 護膜18，藉由保護膜18從外氣來遮斷焊料17及導電性 φ 糊21的外表面。 依照表示於此時種第7圖的實施形態，可期待如下的 實用性的效果。在上述的本發明的準分子燈的製造方法的 第2製程’若爲了短時間熔融焊料17而以高溫過度地加 熱焊料17，則藉由電極3成爲高溫狀態，也有構成電極3 的金屬有熔入在經熔融的焊料的情形。在此種情形，如第 7圖所示地，電極3是會被分離或引入線固定部3a與其 他以外的放電形成部3 b，會產生對於放電形成部3 b的饋 〇 電成爲不可能的不方便之虞。因此，在第2過程中，即使 引入線固定部3a與放電形成部3b被分離的情形，藉由導 電性糊21使得引入線固定部3a與放電形成部3b被導通 之故，因而成爲也確實地可點亮準分子燈。 又，除了焊料17的周圍以外，在導電性糊21的周圍 也形成著保護膜18之故，因而不會有藉由耐臭氧性低的 材料所構成的導電性糊21藉由發生在準分子燈周圍的臭 氧被氧化而劣化之虞。 以上，針對於本發明的準分子燈的各種實施形態加以 -17- 200939292 說明，惟本發明是並不被限定於上述的實施形態者。放電 容器的形狀是並不限定在扁平的方筒狀者，例如也可適用 圓筒狀者，又，也可適用在同軸地配置內徑互相不相同的 兩支直管，而且藉由密封各個直管的端部而在內部形成氣 密空間的雙重圓筒管構造者。 【圖式簡單說明】 〇 第1圖是表示本發明的準分子燈的全體構成的立體 圖。 第2圖是表示本發明的準分子燈的主要部分擴大斷面 圖。 第3(a)圖至第3(d)圖是表示說明本發明的準分子燈的 製造方法的槪念圖。 第4圖是表示具備本發明的準分子燈的紫外線照射處 理裝置的構成的槪略槪念圖。 ® 第5圖是表示本發明的準分子燈的其他實施形態的主 要部分擴大斷面圖。 • 第6圖是表示本發明的準分子燈的其他實施形態的主 要部分擴大斷面圖。 第7圖是表示本發明的準分子燈的其他實施形態的主 要部分擴大斷面圖。 第8圖是表示習知的準分子燈的構成的槪略斷面圖。 【主要元件符號說明】 -18- 200939292 1 0 0 :準分子燈 1 :放電容器 3 :電極 3a :引入線固定部 3 b :放電形成部 4 :電極 1 1,1 2 :平坦壁 0 1 3 :彎曲部 14 :饋電裝置 15,16 :引入線 1 5 a :芯線 15b :被覆部 1 7 :焊料 18 :保護膜 1 9 :套管 〇 20 :饋電端子 21 :導電性糊 -19200939292 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a method for producing an excimer lamp and an excimer lamp. In particular, in the process of a semiconductor substrate, a liquid crystal substrate, or the like, an excimer lamp used for cleaning a semiconductor substrate or a liquid crystal substrate, and a method of manufacturing the excimer lamp. φ [Prior Art] A method for removing dirt such as organic compounds on the surface of a glass substrate attached to a tantalum wafer or a liquid crystal substrate of a semiconductor substrate is widely used in a process such as a semiconductor substrate or a liquid crystal substrate. A dry cleaning method using ultraviolet rays. In particular, in the cleaning method using ozone or active oxygen derived from vacuum ultraviolet light emitted from an excimer lamp, various cleaning apparatuses which are more efficiently and washed in a short period of time are proposed, and are known as patents. Document 1 (Japanese Patent Laid-Open No. 2000-260396). In the ultraviolet irradiation processing apparatus of the patent document 1, the excimer lamp is connected to the conveyance direction of the object to be processed, and the excimer irradiation surface is placed at a predetermined distance to the object to be processed, and the object to be processed is conveyed in a predetermined direction. Each of the excimer lamps is driven by one side of the lamp, and the surface of the object to be processed is dry-washed by irradiating the surface of the object to be treated with the excimer light emitted from each of the excimer lamps. According to the ultraviolet irradiation processing apparatus shown in the same document, excimer light is absorbed by oxygen, and in order to suppress the excimer light from being attenuated, the object to be processed is placed within 8 mm from the excimer irradiation surface. The excimer light is irradiated onto the surface of the object to be processed. 200939292 However, the conventional excimer lamp is provided with a feed structure as shown in Patent Document 2 (JP-A-2004-342369). Fig. 8 is a schematic diagram showing a feed structure of a conventional quasi-molecular lamp. The excimer lamp A shown in the same figure is provided with a gas that generates excimer molecules in a sealed space s inside a discharge vessel B formed in a rectangular parallelepiped shape formed of a dielectric material, and is provided with a discharge vessel A pair of electrodes C, D at positions opposite to the sealed space S of B. Each of the electrodes 〇 C, D is formed by vacuum-depositing a metal thin film such as nickel or chromium, and the electrode D is formed in a mesh shape except for the end portion to which the lead wire is attached for taking out ultraviolet rays. In the end portion of the electrode D, a core portion E a ° which is a lead wire E in a state in which a plurality of exposed core wires are unwound is welded by using a solder F. Patent Document 1: JP-A-2000-260396 Patent Document 2: Japan In the ultraviolet irradiation processing apparatus of the patent document 1, the electrode D and the lead-in line E of the excimer lamp A shown in FIG. 8 are fixed by oxidation for the following reasons. The core portion Ea has a mechanical strength that reduces the connection strength between the two. That is, it is possible that ultraviolet rays emitted from the excimer lamp A are absorbed in the oxygen existing around the excimer lamp to generate ozone around the excimer lamp, and the generated ozone oxidizes the surface of the solder F to cause solder. F will deteriorate. When the solder of the fixed electrode and the lead-in wire is deteriorated, the excimer lamp is turned off while the target object to be processed for the next cleaning is being transported, -6-200939292, or the lamp is driven. When the molecular lamp is used to clean the object to be processed, the solder is broken and the lead-in wire is separated from the electrode. Thus, it is impossible to illuminate the excimer lamp when the object to be processed is irradiated with ultraviolet rays, or to irradiate the object to be irradiated with ultraviolet rays. It is inconvenient to suddenly extinguish the excimer lamp. In view of the above, an object of the present invention is to provide an excimer lamp in which a pair of electrodes are formed opposite to each other through a sealed space of a discharge vessel, and each electrode and a lead wire for supplying electric power to each electrode are fixed by solder. An excimer lamp for deteriorating solder and a method of manufacturing the same. In the excimer lamp of the present invention, a discharge gas is sealed in a sealed space formed inside a discharge vessel formed of a dielectric material, and a pair of electrodes formed of a metal thin film are formed in the discharge vessel via the sealed space. The outer surface of the excimer lamp for electrically feeding the respective lead-in wires of the respective electrodes to the respective electrodes via solder is characterized in that a protective film is formed around the solder. Further, a plate-shaped feed terminal is connected to the lead-in wire, and the feed terminal and the electrode are connected by the solder. Further, the protective film is formed around the feed terminal and is characterized by the above. Further, the protective film is characterized by being formed by ruthenium dioxide. Further, the protective film is characterized by being coated with a polyamidane solution and formed by conversion into cerium oxide. Further, the electrode is separated from the other portion by the portion to which the lead-in wire is connected, and the portion to which the lead-in wire is connected is connected to the other portion of 200939292 by a conductive paste, and the conductive paste is electrically connected. The protective film described above is formed around it. Further, in the manufacturing method of the present invention, a discharge gas is sealed in a sealed space formed in a discharge vessel formed of a dielectric material, and a pair of electrodes formed of a metal thin film are formed in the discharge via the sealed space. The outer surface of the container, the manufacturing method of the excimer lamp for electrically feeding the respective lead-in wires of the respective electrodes via the solder to the respective electrodes, the feature of which is: having the following processes: 1. outside the discharge vessel a process for forming an electrode formed by a metal thin film on the surface, 2. a process of electrically connecting the external electrode and the lead wire via solder by heating the molten solder after the 1. process, 3. after the 2. process, A process in which a polyamidane solution is applied around the solder to dry it to form a protective film around the solder. According to the excimer lamp of the present invention, a pair of electrodes are formed opposite to each other via a closed space of the discharge vessel, and each electrode is fixed by solder and each of the lead wires for supplying electric power to the respective electrodes is soldered. A protective film is formed around the periphery, and thus it is possible to surely prevent deterioration of the solder by oxidation of ozone generated around the excimer lamp. Therefore, the solder does not break until the waiting period until the next object to be processed is being transported or when the discharge lamp is driven by the lamp, and the lead-in wire does not leave the electrode. Therefore, when the excimer lamp is to be turned on, it is surely It is possible to illuminate and reliably prevent the target body from being suddenly extinguished during the period in which the object to be processed is irradiated with ultraviolet rays to clean the object to be processed. -8 - 200939292 Further, a feed terminal is connected to the lead-in wire, and the feed terminal and the electrode are fixed by the solder, so that the connection between the feed terminal and the external electrode can be made stronger. Further, since the protective film is formed around the feed terminal, it is possible to surely prevent the feed terminal from being deteriorated by ozone. Further, since the protective film is made of ruthenium dioxide, it is possible to more reliably prevent deterioration of solder. U Further, since the above protective film is formed by applying a dried polyamidene solution, it is not necessary to carry out heat treatment at a high temperature to form a protective film. Therefore, since the protective film can be formed by the heat treatment in which the solder becomes a temperature at which the solder does not melt, there is an advantage that the solder is prevented from flowing toward a portion other than the fixed portion, or the metal electrode is prevented from being scattered in the solder and peeled off. Further, the electrode is separated from the other portion by the portion to which the lead-in wire is connected, and the portion to which the lead-in wire is connected is connected to the other portion by conductive paste, and the conductive paste is The surrounding shape Φ is formed with the above protective film. Therefore, there is no possibility that the conductive paste of the portion other than the lead-in wire and the other portion is deteriorated by ozone. Further, according to the above-described production method of the present invention, the protective film formed of cerium oxide can be easily formed on the solder by using the polyamidane solution and heat-treating at a temperature at which the solder does not melt. There is an advantage that the ruthenium dioxide film can be formed without damaging the reliability of the welded portion, and the durability of the welded portion can be improved. [Embodiment] -9- 200939292 Fig. 1 is a perspective view showing the overall configuration of an excimer lamp of the present invention. Fig. 2 is a cross-sectional view showing a portion in which the electrode of the excimer lamp of the present invention and the inlet are enlarged. In Fig. 2, for the sake of convenience, only the configuration of the connection portion between one of the electrodes and one of the lead-in wires is shown. The excimer lamp is composed of a bismuth glass of a dielectric material, and has a flat rectangular tube-shaped discharge vessel 1 having a rounded taste in the four sides, and a rare space such as chlorine gas formed in the sealed space S formed inside the discharge vessel 1. The gas φ body or a mixture of a gas such as a chlorine gas and a rare gas is used as a discharge gas, and excimer light having a different wavelength is generated by the type of the gas. The discharge gas is generally charged at a pressure of about 10 to 10 Å. The discharge vessel 1 is a flat wall 11 located on the upper side of the paper surface and a flat wall 12 located on the lower side of the paper surface, which are spaced apart from each other and extend in parallel, and in the respective width directions of the flat walls 11, 12 (for the tube axis) The ends of the orthogonal directions are continuously formed with the curved portions 13 respectively. The discharge vessel 1 is a light-emitting surface for forming an ultraviolet ray to be emitted from the ruthenium-treated body in any of the flat walls 1 1 and 1 2 on the upper and lower sides of the paper surface of Fig. 1 . For example, when the object to be processed is placed under the discharge vessel 1, the flat wall 12 located on the lower side becomes a light exit surface. In the example of the discharge vessel 1, the total length in the tube axis direction is 904 mm, the light emission is long (the full length in the tube axis direction in the field in which the electrode is disposed) is 790 mm, and the length in the left and right width directions is 43 mm. The length of the upper and lower height directions is 15 mm. Electrodes 3, 4 are disposed on the flat walls 11, 12, respectively. The electrodes 3, 4 are, for example, printed or vapor-deposited on a flat wall of a corrosion-resistant metal such as gold, silver, copper, nickel or chromium. For example, the thickness is formed to be 〇·ιμιη to tens of -10-200939292 ym. For example, when the flat wall 12 located on the lower side is the light-emitting surface as described above, the electrode 4 is formed of a light-transmitting property by printing or vapor-depositing the metal into a lattice shape. The electrode 3 is connected to the lead-in line 15' on the high voltage side of the power feeding device 14, and the electrode 4 located below is the lead-in line 16 connected to the ground side. As shown in Fig. 2, the lead-in wire 15 is formed by removing the core portion 15a which is exposed by the insulating material and covering the periphery of the core wire with an insulating material, and the core portion 15a is made of the solder 17 Soldering on the electrode 3' is electrically and mechanically fixed to the electrode 3. The solder 17 is provided around the core portion 15a which can surround the lead-in wire 15. The protective film 18 formed by forming an ozone-resistant material around the solder 17 does not expose the solder 17 to the outside. The solder 17 is, for example, Sn-Pb, Sn-In or the like, but generally has low ozone resistance. As the ozone-resistant material forming the protective film 18, for example, there are ruthenium dioxide, Woqizimo (trade name), and Smecta (trade name), but it is preferable to use cerium oxide for the following reasons. . Fig. 3 is a view showing a method for explaining the method of manufacturing the excimer lamp of the present invention. <First Process> As shown in Fig. 3(a), the above-described metal is printed or vapor-deposited on the flat wall 1 on the upper side of the flat cylindrical discharge vessel 1 formed of synthetic quartz glass. On the 1st, the crucible forms an electrode 3 made of a metal thin film. -11 - 200939292 <Second Process> After the first process, as shown in Fig. 3(b), the core portion 15a of the lead-in wire 15 is placed on the electrode 3, and the solder 17 is disposed in the vicinity of the both. The block heats the solder at a temperature of about 300 ° C to melt it. The core portion 15a and the electrode φ are fixed by naturally cooling the melted solder to a normal temperature; the third process is as shown in Fig. 3(c), and after the second process, it is applied to the brush by using The polyaminan solution 18' around the solder 17 was heat-treated in the atmosphere at a temperature of about 90 ° C for 1 hour. The polyimide film 18' is naturally cooled to a normal temperature and dried, and as shown in Fig. 3(d), a protective film 18 made of ruthenium dioxide is formed around the solder 17. In the third process described above, if the polyamidane solution is dried, the polyamidane is coupled with moisture or oxygen in the atmosphere, thereby being converted into dioxins, by using a polyamidane solution. The protective film 18 can be formed even if the heat treatment at a high temperature is excessively performed. Further, by using the polyamidane in a liquid state, it can be applied to every corner around the solder 17 whose surface shape is liable to become unstable, so that the outer surface of the solder 17 and the outside air are completely blocked. The manner makes it easy to form the protective film 18. The polyamitane solution used in the above third process was formulated as follows. A fully hydrogenated polyalkane of the starting material and xylene' of the solvent are mixed to prepare a solution of about 10 to 20% of the perhydropolyamine. Dibutyl ether is used as a solvent, Solpesso (trade name), petroleum fraction, etc. may also be -12-200939292. A palladium-based or amine-based catalyst is added to the produced perfluoropolyamidane solution. By adding a catalyst, a protective film made of ruthenium dioxide can be formed by heat treatment at a lower temperature. Further, in the third process described above, the polyazane solution applied around the solder is heat-treated in order to convert the polyamidane into cerium oxide in a short time. The heat treatment is changed to humidification treatment, and it can be converted into cerium oxide in a short period of time. If it is not necessary to shorten the time for conversion to cerium oxide @, heat treatment or the like is not necessary. Fig. 4 is a schematic view showing the configuration of an ultraviolet irradiation treatment apparatus including the excimer lamp of the present invention. The ultraviolet irradiation treatment device is an ultraviolet ray that is emitted from the excimer lamp 100 placed in the casing 40 that is placed in an inert gas such as nitrogen, and is transported to the lower side of the casing 40 by the plurality of rollers 42 in the horizontal direction. The processing body W is irradiated to perform processing such as cleaning the surface of the object W, and the object to be processed W is a wafer substrate, and a flat panel display for manufacturing a liquid crystal display or a plasma display panel is manufactured. A glass substrate or the like used. The surfaces of the substrates are in a state in which the processes are different depending on the respective processes, and the photoresist, the transparent conductive film, the circuit, and the like are applied. The casing 40 accommodating the excimer lamp 100 is opened to the lower side of the object W, and the excimer lamp 100 is disposed inside the casing 40 at a position of about several mm from the object W, and An inert gas discharge mechanism 41 having a gas discharge port 4 1 a is disposed on the upper side of the excimer lamp 100. The inside of the casing 40 is not replaced by inert gas-13-200939292 gas such as nitrogen gas, because it is attenuated by absorption of ultraviolet rays from the excimer lamp 1 ,, especially in the excimer. The lamp 100 and the object to be processed w are replaced with the minimum oxygen concentration necessary for the reaction. As the inert gas, in addition to nitrogen, ruthenium, osmium, iridium or the like can also be used. In such an ultraviolet irradiation treatment apparatus, when the object to be processed w is conveyed so that the opening of the casing 40 is almost closed, the inert gas from the inert gas discharge mechanism 4 1 is filled in the casing 40. The internal oxygen concentration is lowered. For example, the width W of the object to be processed W is 1100 mm, the full length of the excimer lamp 100 is 1 300 mm, the full length of the casing 40 is 1500 mm, and the height of the housing 40 is 50 mm' width is 150 mm. When the flow rate of the inert gas discharged from the inert gas discharge mechanism 4 1 is 300 L/min, when the object to be processed W almost closes the opening on the lower side of the casing 40, the oxygen concentration in the casing 40 becomes About 0.5%. In the ultraviolet irradiation processing apparatus shown in Fig. 4 of the above, the inside of the casing 40 is not completely sealed, so that oxygen is likely to remain in the interior of the casing 40. However, the excimer lamp of the present invention is formed in the fixed electrode 3 and introduced by the ozone-resistant material even if the lighting is driven by the environment in which ozone is easily generated by the residual oxygen. Since the solder 17 of the core portion 15a of the wire 15 is surrounded by the ozone which is generated around the excimer lamp 100, the solder 17 is not oxidized and deteriorated. Therefore, it is possible to surely prevent the core portion 15a of the lead-in wire 15 from being waited until the object to be processed for the next cleaning is transported or when the object to be processed is being irradiated with ultraviolet rays. The case where the electrode 3 is separated. Therefore, there is no inconvenience that the excimer lamp is suddenly turned off when the excimer lamp is to be turned on, or the excimer lamp is suddenly extinguished while the object to be processed is being irradiated with ultraviolet rays of -14-200939292. Further, the method for producing an excimer lamp according to the present invention uses a polyamidane solution for forming the protective film 18 as shown in the third process described above, so that a protective film can be formed without excessively heat-treating at a high temperature. 18. Therefore, by the heat treatment of the third process, the solder 17 can be prevented from being excessively heated to a high temperature, and the solder 17 can be surely prevented from melting again. In the third process, if the solder is remelted again, the solder may flow to a portion other than the fixed portion 0, or the metal electrode may be dispersed in the solder to cause an inconvenience of being peeled off. Further, the liquid polyamidane is applied to each corner of the outer surface of the solder 17, so that the outer surface of the solder 17 is completely blocked from the outside air, and the protective film 18 is easily formed. Figs. 5 to 7 are enlarged views of main parts for explaining another embodiment of the excimer lamp of the present invention. In the fifth to seventh embodiments, the same portions as those in the first and second figures are given the same reference numerals as those in the first and second figures, and the description thereof is omitted. φ According to the form shown in Fig. 5, the lead-in wire 15 includes, in addition to the core portion 15a and the covering portion 15b, a nickel sleeve 19 that binds the core portion 15a and a plate-shaped feed that is welded to the sleeve 19. Terminal 20. The lead-in wire 15 is such that the plate-shaped feed terminal 20 is fixed to the electrode 3' by the solder 17, whereby it is electrically connected to the electrode 3 via the feed terminal 20. The sleeve 19 and the feed terminal 20 are prevented from being oxidized and deteriorated by the ozone generated around the excimer lamp, and are thus composed of ozone-resistant materials. For example, the sleeve 19 is made of nickel and the feed terminal 20 is made of nickel. -15- 200939292 According to the embodiment shown in Fig. 5, practical effects as described below can be expected. The core portion 15a of the lead-in wire 15 is divided into a plurality of thin wires for flexibility, so that it is difficult to solder to the surface of the feed terminal 20, or a plurality of thin wires are easily burled in a whisker shape, and thus contact with other wires. The peripheral machine has become a cause of malfunction. Therefore, the sleeve 19 can be easily welded to the feed terminal 20 by attaching the sleeve 19 to the core portion 15a formed by the plurality of thin wires, and the thin wire whisker can be prevented from being swelled, thereby reducing the accuracy. The adverse effects of molecular lamps on peripheral machines. Further, by providing the thin plate-shaped feed terminal 20, the contact area with the electrode 3 can be ensured as compared with the case where the core portion 15a or the sleeve 19 of the bundled core portion 15a is directly welded to the electrode 3. Moreover, the heat capacity can be approximated to the electrode 3, so that the fixing by the solder 17 can be easily performed. Therefore, the mechanical connection strength between the feed terminal 20 and the electrode 3 is increased, and the reliability of the electrical connection between the lead wire 15 and the electrode 3 can be made. The plate-shaped feed terminal 20 is preferably a heat capacity whose heat capacity is close to that of the electrode 3. Further, the sleeve 19 and the feed terminal 20 may be formed of an ozone-resistant material. As shown in Fig. 6, a protective film may be formed around the solder 17 and the conductive sleeve 19 and the plate-like feed terminal 20. The outer surface of the solder may not touch the outside air. According to the embodiment shown in Fig. 6, even if the casing 19 and the feed terminal 20 are made of a material having low ozone resistance, the ozone is not oxidized by the ozone. According to the embodiment shown in Fig. 7, the electrode 3 is separated from the lead wire fixing portion 3a' and the lead wire fixing portion 3a which are separated by the core portion 15& which is fixed with the lead wire 15 by the solder 17-16-200939292 The discharge forming portion 3b and the lead wire fixing portion 3a and the discharge forming portion are ensured to be electrically connected by the conductive paste 2ι of a different body. The conductive paste 21 is made of, for example, a material in which silver or nickel crepe is mixed with an epoxy resin, which is generally low in ozone resistance. Further, a protective film 18 made of ruthenium dioxide is formed around the solder 17 and the conductive paste 21, and the outer surface of the solder 17 and the conductive φ paste 21 is blocked by the protective film 18 from the outside air. According to the embodiment shown in Fig. 7 at this time, the following practical effects can be expected. In the second process of the method for producing an excimer lamp of the present invention described above, when the solder 17 is excessively heated at a high temperature in order to melt the solder 17 for a short period of time, the electrode 3 is heated to a high temperature, and the metal constituting the electrode 3 is also melted. In the case of molten solder. In this case, as shown in Fig. 7, the electrode 3 is separated or introduced into the wire fixing portion 3a and the other discharge forming portion 3b, which makes it impossible to feed the discharge forming portion 3b. Inconvenient. Therefore, in the second process, even if the lead wire fixing portion 3a and the discharge forming portion 3b are separated, the lead wire fixing portion 3a and the discharge forming portion 3b are electrically connected by the conductive paste 21, and thus The ground can illuminate the excimer lamp. Further, in addition to the periphery of the solder 17, the protective film 18 is formed around the conductive paste 21, so that the conductive paste 21 composed of a material having low ozone resistance does not occur in the excimer. The ozone around the lamp is oxidized and deteriorates. The above description of the various embodiments of the excimer lamp of the present invention is described in -17-200939292, but the present invention is not limited to the above embodiments. The shape of the discharge vessel is not limited to a flat rectangular tube shape. For example, a cylindrical shape may be applied. Alternatively, two straight tubes having mutually different inner diameters may be disposed coaxially, and each of them may be sealed by sealing. A double cylindrical tube builder that forms an airtight space inside the end of the straight tube. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the overall configuration of an excimer lamp of the present invention. Fig. 2 is an enlarged cross-sectional view showing the main part of the excimer lamp of the present invention. 3(a) to 3(d) are views showing a method of explaining the method of manufacturing the excimer lamp of the present invention. Fig. 4 is a schematic view showing the configuration of an ultraviolet irradiation treatment apparatus including the excimer lamp of the present invention. Fig. 5 is an enlarged cross-sectional view showing the main part of another embodiment of the excimer lamp of the present invention. Fig. 6 is a partially enlarged sectional view showing another embodiment of the excimer lamp of the present invention. Figure 7 is a cross-sectional view showing the main part of another embodiment of the excimer lamp of the present invention. Fig. 8 is a schematic cross-sectional view showing the structure of a conventional excimer lamp. [Description of main component symbols] -18- 200939292 1 0 0 : Excimer lamp 1: discharge vessel 3: Electrode 3a: lead wire fixing portion 3 b: discharge forming portion 4: electrode 1 1, 1 2 : flat wall 0 1 3 : bending portion 14 : feeding device 15 , 16 : lead-in wire 1 5 a : core wire 15b : covering portion 1 7 : solder 18 : protective film 1 9 : casing 〇 20 : feed terminal 21 : conductive paste -19