TW200939250A - Electrically conductive compositions - Google Patents

Abstract

Electrically conductive composition of the invention comprises base metal, a functional additive, and a resin binder. The electrically conductive compositions are particularly useful in packaging consumer products such as electronic devices and electronic components.

Description

200939250 VI. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a conductive composition. [Prior Art] Most commercially available conductive compositions use precious metals as the conductive layer 10 15

filler. Precious metals are resistant to corrosion or oxidation, and oxides formed on precious metals are electrically conductive. However, precious metals are costly and some metals such as silver may cause migration problems. There is a continuing need for conductive compositions that are low cost and non-destructive to the migration phenomenon. The present invention satisfies this need. SUMMARY OF THE INVENTION The addition of a functional additive to a conductive composition containing a non-noble metal, particularly a base metal, can provide electrical conductivity superior to those of the base metal charging composition that does not contain the functional additive. The electrically conductive compositions are consumer packaged products such as electronic devices and electronic components. For the purpose of use (4) the addition of lit energy additives to give better conductivity ^ for other work

St:, can be advantageously formulated to impart better initial conductivity and to exceed the attainment condition 'immediately and at least 400 hours (85t: /85RH). In addition, the selective composition of the conductive surname leads to the constitutive material of the initial I-additive additive under the aging condition (4) as a ^^; ^ sister and long-term in 3 20 200939250 a specific performance is related to a kind of base metal, function Conductive additive and conductive composition of resin binder. In another specific embodiment, the composition is directed to a conductive composition comprising a synergistic composition of steel, a functional additive, and a resin binder. Another specific manifestation of this composition relates to a conductive composition comprising a synergistic composition of copper, a functional additive or a functional additive, and a resin binder. In another specific embodiment, the functional additive of the electrically conductive composition is selected from the group consisting of reduced hydrazine, cyclic borane complex, aromatic sulfonic acid, phosphoric acid, long chain ascorbic acid ester, diketone, hydrazine, unary Acid, Schiff base and its derivatives; mixture of phenolic and alcoholic, mixture of organic 2G acid and alcohol, mixture of heterocyclic aromatic organic compound and alcohol, mixture of acid and alcohol and amino alcohol, and diketone and hydrazine The mixture is composed of a group to impart better conductivity. In another specific embodiment, the functional additive of the conductive binder is selected from the group consisting of long chain ascorbate, diketone, anthracene, monobasic acid, Sdiiff base, phosphoric acid and derivatives thereof, and a mixture of a phenolic group and an alcohol. a mixture of an organic dibasic acid and an alcohol, a mixture of a heterocyclic aromatic organic compound and an alcohol, a mixture of an acid sterol and an amino alcohol, and a mixture of a diketone and hydrazine to impart better conductivity and long-term presence. Stable conductivity is maintained under aging conditions. 2〇 In another specific embodiment, the conductive composition comprises a synergistic composition of a base metal, a functional additive or a functional additive, a wax binder, and optionally a solvent. Another specific manifestation of the composition relates to a synergistic composition comprising a base metal, a functional additive or a functional additive, a resin binder, and a conductive composition selected from the group consisting of a curing agent and/or a catalyst. Another specific manifestation of the composition is the conductive composition of a synergistic composition comprising a base metal, a functional additive or a functional additive, a resin binder, and optionally a viscosity modifier, a coupling agent and/or a curing accelerator. Composition. 5 In another specific embodiment of the composition, the electrically conductive composition comprises from about 20 to about 95 weight percent base metal, from about 0.01 to about 30 weight percent of a functional additive, or The total composition φ of the functional additive and from about 5 to about 90% by weight of the resin binder. In another embodiment, the conductive composition can be in the form of a coating, ink, paste, film, grease, adhesive, tape, sealant, and the like, and other technically known forms. Another specific embodiment provides articles made using the electrically conductive compositions of the present invention. Sealants include RFID tags, photovoltaic capacitors, lead-free solder replacements, printable electronics, thermal interface materials, multilayer ceramic capacitors, piezoelectric articles, 15 electromagnetic shielding components, and the like. Another aspect relates to a method of sealing and/or manufacturing or forming an electronic device and an electrical subassembly. These methods include the use of the electrically conductive composition of the present invention on an electronic device. 20 [Embodiment] The term "base metal" as used herein refers to a metal that is relatively easily oxidized or corroded and includes steel, iron, nickel, lead, zinc, tin, antimony, and alloys thereof. As used herein, "precious metal" refers to precious metals that are resistant to corrosion or oxidation and include metals such as gold, silver, group, platinum, and metal. 5 200939250

Additives, reducing agents, and/or complexing agents that are used in the base gold shot to impart better conductivity and/or maintain stable conductivity are utilized herein. The conductive composition of the present invention comprises a base metal, a Wei additive, and a resin 5 binder. Any base metal can be used as the conductive filler in the conductive composition. Examples of the base metal include steel, iron, nickel, lead, zinc, tin, antimony, and alloys thereof. Φ In a specific performance, the base metal is a steel. Although the steel is highly conductive, the electrical conductivity of the copper oxide is not as high. Upon contact with the atmosphere, the copper oxide is salty on the copper surface and ultimately hinders the conductivity of the composition. The shape of the copper powder is not limited and the powder may take various forms such as a sheet, a tree or a sphere. It may be used alone in various steel powder forms or in combination of two or more different shapes. The particle size of the copper powder is selected depending on the specific purpose of the composition and the upper limit of the conductive composition is about 300 μm. In one embodiment, the steel filler has a particle size of from about 1 micron to about 100 microns. In another specific embodiment, the particle size ranges from about 3 micrometers to about 30 micrometers. In one aspect, the total amount of copper in the electrically conductive composition is from about 50% to about 95% by weight based on the total weight of the composition (without solvent). In another aspect, the total amount of copper 20 powder is from about 65% to about 95% by weight of the electrically conductive composition. It has been found that the addition of a functional additive to a conductive sheet containing a base metal provides better conductivity than the base metal-filled grade of the functional additive without the functional additive. The base metal oxide oxidized by the reduced ruthenium or mismatched with the base metal to form a soluble miscible 6 200939250 reduces the electrical resistance. Three different types of functional additives have been discovered. First, the functional additive type I imparts better initial conductivity. Second, the functional additive type π imparts better initial conductivity and maintains stable conductivity over long-term aging conditions (85 〇 c and 85% relative humidity), ie, "aging conditions" „ 5 third function The particular mixture of the additive type ΠΙ synergistically imparts better initial conductivity and maintains stable conductivity under aging conditions.

Functional Addition of Sword Type I Functional Additive Type I reducing agent and/or complexing agent improves the initial conductivity of the composition conditioned by the base metal. Non-functional additive type I, a composition containing a base 10 base metal results in high electrical resistance and cannot be used as a conductive composition. Exemplary functional additive types I include reducing sugars, cyclic borane complexes, aromatic sulfonic acids, phosphoric acid, and derivatives thereof. In one aspect, the functional additive is a reducing sugar and a derivative thereof. Exemplary reducing sugars include D-glucose, D-ribose, and the like. In another aspect, the functional additive is a cyclic borane complex and a derivative thereof. The cyclic side burn-in complex includes a cyclic boron-burning complex having I as a ring-forming member and a cyclic boron-burning compound having sulfur as a ring-forming member. In another aspect, the cyclic borane complex is borane _ phlooxime, borax-4-pyrufolium, shed scent 4-ethyl morphine, xiang _ 吼Bite, boron burned 20 diethyl aniline, shed-I, 4-oxo 琉p mountain, rotten bottom bite, borax-π bottom ρ well, nesane-2,6-dimercaptopyridine complex and analog. In another aspect, the functional additive is an aromatic acid and a derivative thereof, wherein the sulfonic acid functional group is attached directly to the aromatic ring. In a non-limiting aspect, the aromatic sulfonic acid is 4-dodecylbenzenesulfonic acid and derivatives thereof. 7 200939250 In another aspect, the functional additive is phosphoric acid and its derivatives. Non-limiting examples include streptophosphonic acid, 1-diphosphonic acid, phosphoric acid, short-chain phosphate esters, phosphate monomers with or without a hydrophilic extender, 丨_基乙乙烧_丨 and this type derivative. 5 ❹ 10

Functional Additives 剞II Functional Additives Type II reducing agents and/or complexing agents improve the initial conductivity of the base metal-containing composition and maintain stable conductivity over aging conditions for more than 400 hours. Exemplary functional additive types include Long chain ascorbate, diketone, hydrazine, Schiff base, phosphoric acid, monobasic acid and derivatives of this type. In one aspect, the functional additive is a long chain ascorbic acid vinegar of the formula:

Its center is H, saturated or unsaturated Ci_C3Q alkyl ^, heart and ^ system & ❹ 15 , and or unsaturated CrC3Q: ^ group or saturated or unsaturated Wei group ^ in - non-limiting form t ^ R2, R3 And Han 4 in the above formula is smooth H. In another non-limiting aspect, the long bond, ascorbic acid * * anti-defect * acid & shoot (four) @ purpose. The long chain ascorbic acid vinegar is cured and/or dried at a temperature similar to 18GC to activate the redox reaction between the metal halide and the additive. - 1 alternative sample towel 'The functional additive is a diketone and its derivatives. Non-limiting examples of complexes with = main include ethenylacetone, diethylidene, ethyl I, S, 2, 10, w, and the like. 200939250 In yet another aspect, the functional additive is two and its derivatives. The monthly deficiency has the general formula KR2-CNOH, wherein the system is saturated or unsaturated CrC3 () alkyl and the R2 is hydrazine, saturated or wood-saturated CpC3 fluorenyl" exemplary two-line dipyridyl hydrazine and its derivatives. 5 In another aspect, the functional additive is Schiff and its derivatives.

Non-limiting examples of Schiff bases include n,N-bis(arylene)-ethylenediamine, n,N-bis(arylene)-1,4-butanediamine, and the like. In another aspect, the functional additive is tannic acid and its derivatives. Non-limiting examples include vinylphosphonic acid, aqueous solutions of nitrogen tris(methylenephosphonic acid), phosphoric acid solutions, and derivatives of this type. In yet another aspect, the functional additive is a monobasic acid and a derivative thereof. The monobasic acid derivative is an unsubstituted guanamine, a substituted formamide, an unsubstituted formate, and a substituted formate. In a non-limiting embodiment, the monobasic acid is formic acid and a formic acid ester such as decyl carboxylate, ethyl formate, butyl citrate, ammonium decanoate, formamide, dimethylformamide and diethyl Base amine. Functional Additives Robbers A synergistic mixture of functional additive types that are used to formulate the electrically conductive compositions of the present invention. These particular mixtures synergistically impart a preferred initial conductivity to the composition comprising the base metal and maintain a stable electrical conductivity under aging conditions. Certain combinations have been shown to have better initial conductivity than their non-combined additives and stable conductivity under aging conditions. Exemplary functional additive-like plastic enamel composition is a combination of a phenolic-based alcohol, an organic dibasic acid and an alcohol, a heterocyclic compound, an organic compound and an alcohol, and an acid, an alcohol, and an amino alcohol. Composition 〇200939250 5 ❹ 10 15 ❹ In the a state t, the functional additive is a synergistic group of phenolic and alcoholic groups. The phenolic functional additive is an aromatic material having at least one hydroxyl group. Examples of non-limiting examples of oxime groups include poly(ethoxylated alcohol) and 1,4-benzene-diglycol alcohol, which respectively contain Ar-OH and Ar-CHrOH functional groups present in the phenolic resin. Non-limiting examples of two include glycerin. In another aspect, the functional additive is a synergistic combination of an organic dibasic acid and an alcohol. Exemplary organic dibasic acids have a boiling point above about 12 〇〇c and low volatility and are represented by T-Link A: ^ 'n QH where n> 0 Non-limiting examples of organic dibasic acids include oxalic acid, succinic acid And similar. Non-limiting examples of alcohols include glycerin. In another malarial sample, the functional additive is a synergistic combination of a heterocyclic aromatic organic compound and an alcohol. Non-limiting examples of heterocyclic aromatic organic compounds include 8-hydroxyporphyrins and derivatives thereof. Non-limiting examples of alcohols include glycerin. In yet another aspect, the functional additive is a synergistic combination of an acid, an alcohol, and an amino alcohol. Examples of the acid include acetic acid. Examples of alcohols include glycerin. Examples of the amino acid yeast include triethanolamine. In general, the total amount of functional additive used to prepare the electrically conductive composition is from about 0.01% to about 30% by weight based on the total weight of the composition (without solvent). in

In addition to the base metal and functional additives, the conductive composition also contains a resin. The term resin as used herein refers to SNb/adhesive base metal indirect with viscous and bulk materials. (IV) Application for feed application 20 200939250 5

G 10 15 Ο 20 polymer. The end use application can be in the form of coatings, inks, pastes, films, greases, adhesives, tapes, sealants, and other forms known in the art. The exemplary resins include epoxy-based, mainly in B-country, mainly in the brewing of the main W-futosan acid, mainly poly-imine, and polyaminocarbic acid as the main H-cyanamide. Mainly, mainly urea, brewed with polycarbonic acid, mainly, polyallyl hard, amino-based n-cellulose, phenoxy-based, melamine-based, __ The main resin and its mixture. Typically, S, the total amount of resin used to prepare the electrically conductive composition is from about 5% by weight to about 9% by weight of the total weight of the composition (excluding (iv)). The resin comprises from about 10% by weight to about 50% by weight, based on the total weight of the conductive composition (4) conductive composition, in a particular embodiment. The above resins may be used in combination with an organic solvent to prepare a conductive composition. Non-limiting examples of such solvents include aromatic compounds, m-gool. For example, '^diol or diethylene glycol derivatives such as ethylene glycol monomethyl mycolic acid vinegar, hexanediol monoethyl acetal vinegar, ethylene glycol monobutyl hydrazine acetate, ethylene glycol soap fine, Ethylene glycol monoethylene, ethylene glycol monobutyl, ethylene glycol dimethyl ether, ethyl alcohol monoethyl ether, ethylene glycol dibutyl ether, diethylene glycol monomethyl it acetic acid Ethylene glycol monoethyl ether acetate vinegar, diethylene glycol monobutyl sulphate - ethyl ketone monodecyl _, diethylene glycol monoethyl phthalate, diethylene glycol monobutyl hydrazine - ethyl alcohol dioxime Base, diethylene glycol di 6-base puzzle, diethylene glycolate-butylit and the like; g is as for example, acetic acid, acetonitrile, cyclohexyl acetate, methyl acetate, ethyl acetate Ester, dimethyl adipate, glutaric acid monomethyl ketone, valeric acid and analogs; _ such as methyl ethyl ketone, cyclohexanthene, 11 200939250 methylcyclohexanone, diisobutyl Ketones, isophorones and the like. These solvents may be used singly or in combination. The resin can also be blended with water in the emulsion. 5 Ο 10 15

In general, the total amount of solvent and/or water can be up to about 60% by weight of the electrically conductive composition. In a non-limiting aspect, the conductive composition may additionally contain a curing agent and/or a catalyst. Non-limiting examples of curing agents and/or catalysts include acid-based, anhydride-based, amine (including aliphatic, aromatic, and modified amines), and tertiary and secondary amines. It is mainly composed of polyamido, mainly β-sodium, mainly composed of polythiol, mainly amine-decylamine, mainly boron trifluoride-amine complex, and mainly composed of dicyanoquinone It is based on organic acid bismuth and derivatives of this type. Generally, the curing agent and/or catalyst will be the one that is known to catalyze or catalyze the self-opening reaction of the compound. & Oxygen · The total amount of curing agent and/or catalyst used to prepare the conductive composition is about 10% by weight of the conductive composition of the past. » Ada. These conductive compositions may additionally contain other slaves as the case may be. The mouth is required to not damage the nature of the composition. Such components may include viscosifying/reducing agents, titanic acid coupling agents, aluminum coupling agents, and curing accelerators such as heat such as amines and aromatic polyamines.矣 矣 该 该 该 该 该 该 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合 结合Drying forms a shaped article #. Or the temperature of the curing or money toucher, Wei Shulin mixture and the type of the agent 12200939250 and the intended purpose of the composition, but usually in the temperature range from room temperature to 350 ° C, preferably from Room temperature to 25 〇 <>c. The composition can be coated or printed on a thin sheet or sheet such as polyester or polyallyl resin, a phenolic resin laminate, an epoxy laminate or a polyimide film, 5 A method of curing or drying or a method of pouring the composition into a mold and curing therein to cure and/or dry the composition of the present invention. The electrically conductive composition may also be pre-coated on the substrate and subjected to a B stage for later reactivation by heat or radiation. The conductive composition can be used in a variety of consumer products such as electronic devices and electronic components. Non-limiting examples of such electronic components include RFID tags, photovoltaic capacitors, lead-free solder replacements, printable electronics, thermal interface materials, multilayer ceramic capacitors, piezoelectric components, electromagnetic shielding assemblies, and the like. A method of sealing and/or fabricating an electronic device includes coating a conductive composition on a joint speed line and curing and/or drying the rainbow. It is contemplated that a precoating step is where the conductive composition is coated and B-staged for later reactivation by heat or radiation. The invention is further illustrated by the following non-limiting examples. EXAMPLES These formulations were prepared by first preparing a mixture of a resin and a solvent. Part 20 of the resin is not easily dispersed in the solvent and requires partial heat. Add the remaining group and stir until a homogeneous mixture is obtained under the chamber. Each formulation was then coated onto a substrate of 5-1 〇 χ 5 cm χ 15 〇〇 〇〇 micrometer (typical thickness after curing/drying of 30 〇 5 〇 米). Then, the formulations are cured and/or dried according to a curing/drying method. Unless otherwise indicated 13 200939250 : and ::f t into. Cured/dry input d () = 11 micro ohm meter 11 measured. Wei _ Indignation micro-measurement thickness. _ MitutQyG read mm 5

10

2 calipers measure the width. Then calculate the volume resistivity (Vr) at room temperature using the following formula to indicate conductivity:

Vr = ( RXWXT ) / L, where R = the track resistance expressed in Ω of the length; the track width in centimeters; the thickness in the centimeter after curing / drying; L = the track length in centimeters · As demonstrated in Table I, the use of functional additive type I resulted in better initial conductivity than the control A formulation. --Ref. I. Formulation with functional addition type I. Compounding functional additive (g) Other components (g) Curing/drying method-*--------- Initial Vr (Q, cm , Control A No 65.403 All dry conditions No conductivity 11.50b (N2 and air) '---- 23.10° 1 3.06 36.09* 150C/30 minutes 6.5x10-3 Ribose 1 14.48b _____ 46.37c 2 1.53 68.008 100C/30 Minute 1-2x10-3 Boraxo? Fusin 1 7.13b ----- 21.37C --------——__ 14 200939250

1.97d 3 2.27 56.08a 100C/15 minutes 5.9x10-3 borane-4-methyl-frozen 9.62b brown 1 32.03° 4 2.28 67.68a 180C/15 minutes 1.1x10-3 BIOSOFT S1001 7.03b 21.04c 1.97d 5 3.21 69.70a RT overnight 2.9x10-4 phenylphosphonic acid 2 9.02b 18.07° 6 3,41 72.10* RT overnight 5.1x10-4 phosphoric acid 2 9,32b 15.17° 7 3.26 72.00a RT overnight 2.3x10-4 HordaphosCC3 9.40b 15.34° 8 3.07 65.183 RT overnight 8.3x10-4 PAM1004 5 8.44b 23.31° 15 1

Stepan Co 2

Sigma-Aldrich 3

Clariant Pigment 4

Rhodia 5a is available from Ferro, OH, Cu RD88 200939250 b. Tree wax: DIACON MG 102 (Lucite International, ΤΝ); PKHC (Incherarez, SC); A-ll acrylic resin (Rohm & Haas, PA); VAGH Copolymer (DOW Chemical, MI) c Solvent: butyl acetoacetate (Eastman Chemical Co., TN); 2-butoxyethyl acetic acid 5 (Sigma-Aldrich); or 2-butanone (Sigma- Aldrich) d Curing catalyst: Cymel 301 (Cytec Industries, NJ) and/or Nacure 5414 (King Industries, CT) ❹ It should be understood that if the resulting formulation has a volume resistance of less than 6,5x10-3 n.cm, the rate 'type The phosphoric acid functional additive of I is not limited to the above examples. It should also be understood that the phosphoric acid functional additive does not include 1-hydroxyethylidene-diphosphonic acid, dibutyl sulphate, vinyl phosphonic acid di-f ester, triphenyl phosphite, triphenyl phosphate, phosphate Polymer of monomer and hydrophobic extender (PAM 200, Rliodia) and polymer of phosphate monomer and hydrophobic monomer (PAM300, Rh〇dia), because the formulation obtained by 15 has more than 6.5χ1〇-3Ω. <?πι volume resistivity. As demonstrated in Table II, the use of a functional additive of Type II imparts better initial conductivity and stable electrical conductivity under aging conditions over the control oxime formulation.调 Formulation functional additive (g) Other components (g) 9 2.69 67.15" Ascorbic acid 6-wheat 14.48b Palmitic acid ester 13. 13.73° 1.95d Curing/drying method 180C/15 minutes initial Vr (Ω-cm 8.64x10-4 aging Vi· (Q.cm)/hour 2.75x10-3/600 hours 16 200939250 10 3.31 Acetylacetone 1 69.63 9.01b 18,08c RT overnight 2.4x10-4 7.8x10^4/500 hours 11 3.53 74.933 RT overnight 8.2x10-4 2.2x10-2/500 diacetic acid 9.67b hour ethyl ester 11. 11.87° 12 3.3 69.7a RT overnight 3.7x10-4 3.0x10-2/500 2- 嗔 醯 醯 醯 醯 醯Hg trifluoroacetone 1 18.0. 13 3.3 69.7a RT overnight 3.6x10-4 6.2x10-4/400 Dimethylolethyl 9.0b hour dialdehyde oxime 1 18.0° 14 3.53 67.408 RT overnight 2.6x10-4 1.2x10-3/500 N, N-double (Sub-8.74b hour liuji E2 20.33° Amine 1 15 3.17 60.10a RT overnight 5.10x10-4 1.90x10-2/500 N,N-double (Asian 7.78b hour liuji)** 1 28.95° phenylenediamine 1 16 2.83 69.708 180C/30 min 3.0x10-4 4.4x10-4/500 Vinyl.phosphonic acid 9'02b Hour 5 18.45c 17 6.34 67.443 RT Overnight 2.4x10-4 5.1x10-4/600 17 200939250 50%H2O Aqueous solution of nitrogen tris(methylenephosphonic acid) 1. 8.73b 17.49c hour 18 3.25 50% H2O aqueous solution of squaric acid 1 69.808 9.00b 17.95° RT overnight 4.7x10-4 7.1x10-4/400 hours 19 11.99 citric acid 1 78.408 4,80b 4.81c Cured by IR in N2 for 30 minutes / 180C 4.8x10-5 1.5x10-4/1000 hours

1 Sigma-Aldrich 5 BASF a Cu RD88 available from Ferro, OH

b Resin: DIACON MG 102 (Lucite International, TN); PKHC (Inchemrez, 5 SC); A-il Acrylic Resin (Rohra & Haas, PA); or VAGH Copolymer (DOW Chemical, MI) 〇C Solvent: Celluloid butyl acetate (Eastman Chemical Company, TN); 2-butoxyethyl acetate (Sigma-Aldrich); or 2-butanone (Sigma-Aldrich) d curing catalyst · Cymel 301 (Cytec Industry, NJ) and/or Nacure 5414 (King Industry, CT) It should be understood that if the resulting formulation has a volume resistivity of less than 6.5 x 10-3 Q.cm and maintains stable conductivity under aging conditions, the type The diketone functional additive is not limited to the above examples. It should also be understood that the type of diketone additive does not include 18 200939250 5 ❹ 10 15 ❹ 20 hexafluorovinylacetone; D-tartaric acid, 2-thiophene guanidine trifluoropropene 1, imine diacetic acid, 1,4- Butanediol bis(3-amino crotonate), dimethyl acetamidine solution, phenylmalonic acid, indanone, 4-hydroxy_4_methyl_2_pentan , allyl acetoxyacetate, deprotonated allyl acetoxyacetate, ethyl mercapto acetoxyacetate ethyl acetate, N, N'-(1,4-extended base) double (B Ethylamine, 1,4-butanediol diethylacetate, 1,5-diphenylpentane, and 2,2,6,6-tetramethyl-3,5-heptane Ketones because the resulting formulation does not have stable electrical conductivity under aging conditions. It should be understood that the Schiff test functional additive of the type Η is not limited to the above examples if the resulting formulation has a volume resistivity of less than 6.5 x 1 〇 -3 Q.cm and maintains enthalpy conductivity under aging conditions. It should also be understood that the type π test does not include bis(arylene)-ethylenediamine, hydrazine, hydrazine-bis (arylenediamine and N,N-bis(arylene)-i,4-butanediamine. Because the resulting formulation has no stable conductivity under aging conditions. It should be understood that if the resulting formulation has a volume resistivity of less than 6.5 x 10 -3 Q.cm and maintains stable conductivity under aging conditions, the type II phosphoric acid functional additive It is not limited to the above examples. It should also be understood that the functional phosphoric acid functional additive does not include 1-hydroxyethylidene-diphosphonic acid, dibutyl phosphate, dimethyl vinylphosphonate, triphenylphosphite, and three. a polymer of a stearyl phosphate, a phosphate monomer and a hydrophobic extender (PAM 200, Rhodia) and a polymer of a phosphate monomer and a hydrophobic monomer (pAM300, Rhodia) because the resulting formulation is under aging conditions No stable conductivity. The use of specific combinations of Type III functional additives results in better initial conductivity and stability conductivity under aging conditions than the control examples. Synergy is shown in Table 19 200939250. Functional additive (control Β-ι).

Table III. Formulations containing functional additive type III

Formulation Functional Addition Other Group Curing/Drying Initial Vr Aging Vr Additive (grams) Minutes (grams) Method (Ω-cm) (H-cm)/hour Control B 5.24 51.423 In N2 2.48x10-3 4.32/ 1008 hours glycerol 1 12.57b 30-220C@5C/ 30.77° minute control C 5.2 59.0a 200C/30 minutes 4.0x10-3 non-conductive glycerol 1 6.0b 27.7C 2.1d control D 5 58a 30-220C@5C/ Conductive non-conductive polyethylene 27b min phenol 1 10° Control E 5 58a 30-220C@5C / non-conductive non-conductive 1,4-benzene-two 27b minutes methanol 1 10° Control F 4.0 56.6a at N2 Conductive non-conductive oxalic acid 1 12.6b 30-220C@5C/ 26.8C Minute control G 9.2 59.0a 200C/30 min 8.79x10+2 Non-conductive 8-hydroxy 6.0b 喳喵1 23.7C 20 200939250

2.1d Control Η 2.68 67.20s 150C/30 minutes non-conducting non-conductive acetic acid 1. 9.92b 20.20° Control I 2.68 67.203 150C/30 minutes non-conducting non-conductive triethanolamine 1 9.92b 2O.20c 20 4.56 54.69a 30 -220C@5C/ 2.55x10-4 9.6x10-2/1200 Polyvinyl 8.21b Minutes Phenol 1 26.08° 6.46 Glycerin 1 21 5.09 55.273 30-220C@5C/ 3.15x10-4 3.4x10-3/1008 1, 4~ Benzene-two 10.68b minutes methanol 1 22.71. 6.25 Glycerin 1 22 5.17 54.853 30-220C@5C/ 2.00x10-4 6.5x10-4/1056 Oxalic acid 1. 10.89b mins hour 5.95 23.14° Glycerin 1 23 2.3 59.0s 200C/30 min 4.48x10-4 9.1x10-4/ 1000 8-permeate 6.0b hour 喳喵1 23.7° 21 200939250 6.9 Glycerin 1 2.1d 24 6.15 61.403 150C/10 min 1.3x10-4 2.4x10-4/400 Acetic acid 1 9.06b hour 2.46 18.47c • Glycerin 1 2.46 III Ethanolamine 1 1 Sigma-Aldrich a Cu RD88 b resin available from Ferro, OH: DIACON MG 102 (Lucite International, TN); PKHC (Inchemrez, SC); A-11 Acrylic resin (Rohm & Haas, PA) Or VAGH Copolymer (DOW 5 Chemistry, MI) c Solvent: butyl acetoacetate (Eastman Chemical Company, TN); 2-butoxyethyl acetate Sigma-Aldrich; or 2-butyl I (Sigma-Aldrich) d Curing catalyst: Cymel 301 (Cytec Industries, NJ) and/or Nac\ire54I4 (King Industry, CT) 10 [Simple description of the diagram] No [Main component symbol description] 15 No 22

Claims (1)

200939250 5 ❹ 10 15 ❿ 20 VII. Scope of application: 1. A conductive composition comprising: (a) a base metal; (b) a functional additive; and (c) a resin; wherein the composition has a lower than 6.5 X10-3 D.cm initial volume resistivity. 2. The electrically conductive composition of claim 1, wherein the base metal is copper, iron, nickel, germanium, tin, zinc, and alloys thereof. 3. The electrically conductive composition of claim 2, wherein the base metal is a steel. 4. The conductive composition of claim 1, wherein the functional additive is selected from the group consisting of a reducing sugar, a ring-cut complex, an aromatic acid, a squaric acid, a long-chain ascorbic acid vinegar, a diketone. , hydrazine, monobasic acid, Schiff test, a mixture of a functional group and an alcohol, a mixture of a carbitol type functional group and an alcohol, a mixture of an organic dibasic acid and an alcohol, a mixture of a heterocyclic aromatic organic compound and an alcohol, an acid A mixture with an alcohol and an amino alcohol, a mixture of a diketone and an anthracene, and a derivative thereof. 5. The conductive composition of claim 1, wherein the resin is selected from the group consisting of epoxy-based, vinyl-based, polyester-based, phenol-based or acrylic-based. It is mainly composed of polyamidiamine, mainly polyurethane, melamine-based, urea-based, polycarbonate-based, polyallylsulfone-based, and amine-based. A group of cellulose-based, phenoxy-based, melamine-based, anthrone-based resins and mixtures thereof. 23 200939250 6. If you apply for the conductive composite of item i of the patent garden, it additionally contains a solvent. 7. If the conductive composition of claim 1 of the patent application is applied, it additionally contains a curing agent and/or a catalyst. 8. If the conductive composition of the first application of the patent garden is applied, it additionally contains a viscous agent, a coupling agent and/or a curing accelerator. * 9. An electrically conductive composition comprising: (a) a base metal; (b) a functional additive; and Φ (c) a resin; 1) wherein the composition has an initial volume resistivity and is 85 ° C / 85 Under %RH, the volume resistivity of the drop below 6.5xl〇-3 Q'cm is at least 4 hours. 1(). The conductive composition of claim 9, wherein the base metal is copper, iron, nickel, lead and zinc. 11. The conductive composition of claim 9, wherein the base metal is copper. The conductive composition according to claim 9 wherein the functional addition is selected from the group consisting of long-chain ascorbic acid. Ester, diketone, hydrazine, monobasic acid, Schiff test, acid, mixture of phenolic and alcohol, mixture of organic dibasic acid and alcohol, mixture of heterocyclic aromatic organic compound and alcohol, acid and alcohol and amine A mixture of alcohols, a mixture of diterpenes and anthracenes, and a mixture thereof. 13. The conductive composition of claim 9, wherein the resin is selected from the group consisting of a cyclodecyl group, a vinyl group, a polyester group, a phenol group or acrylic acid. Mainly, mainly polyamidiamine, mainly amino phthalate, mainly melamine, mainly urea, mainly polycarbonate, with 24 200939250 polyallyl i wind, amine The main group is based on fiber, and the main group is melamine, which is mainly composed of bismuth: 'Resin and mixture thereof 14. The conductive composition of claim 9 is 5 Ο 10 15 15. If the conductive composition of claim 9 is applied, the solvent is included. And / or catalyst. , additionally contains a curing agent. 16. If you apply for a patent, please refer to her, a good agent, a coupling agent and/or a curing accelerator. # Η : An electronic device comprising a conductive composition as in claim 1 of the patent application. 18. An electronic device comprising the conductive composition as in claim 9 of the patent application. 19. A method of sealing and/or manufacturing or forming an electronic device and an electronic component, comprising coating a conductive composition as in claim 1 of the patent application on the bonding interconnect and curing and/or drying the composition. Ο 25 200939250 IV. Designated representative map: (1) The representative representative of the case is: (No). (2) A brief description of the symbol of the representative figure: 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: ❹ 2