200938065 九、發明說明： 【發明所屬之技術領域】 … 本發明係有關於一種散熱技術，更詳而言之，係關於 • 一種應用於具有發熱元件之電路板中的散熱式殼體。 【先前技術】 按，常見諸如影音、視訊、監控儀器、交換機、伺服 器、電腦、等之電子設備中，皆設有各種元件及/或模組 於殼體内的電路板上，而其中包括許多運作中會產生熱量 ©之發熱元件。為了保持適當溫度，以使電子設備能穩定運 作，在殼體内之熱能能否有效散便格外重要，因爲散熱效 能不良的情況下，隨著電子設備的工作溫度提高，伴隨而 來的必然是發生運作不穩定的現象，遂會導致諸如當機之 問題，從而降低電子設備之使用壽命。 同時，現行電子設備多數採用成本低廉、導熱性卻不 高的塑膠材質之外殼，外殼内部諸如中央處理單元、記憶 體、北橋晶片、或電源供應器等發熱元件所散發的熱能， Ο 會受外殼本身材質之限制而無法逸散。尤其對於未設置散 熱風扇來強制導引熱能之電子設備來說，這些熱量會使得 外殼之溫度過高，特別是外殼中對應發熱元件的部分，用 手觸摸時甚至會有燙手的感覺。 惟，此種外殼溫度過高之現象，往往會連帶令使用者 擔憂外殼内部之溫度是否過高，造成對產品存在疑慮。因 此，有些電子設備會在外殼内增設散熱風扇，以將發熱元 件所產生之熱能導出至外殼之外，從而達到降低外殼内部 110741 200938065 \ 溫度之目的。此種做法雖可提昇散熱效果，然而，對於内 部空間狹小、且元件佈局密集的小型電子設備來説，殼體 内部之空間不足以設置散熱風扇之情況下，必須增大殼體 •以提供放置散熱風扇之空間。如此，便不符合此種電子設 備本身所須具備及提供之小型化特性。 再者，所有電子設備在運作時都會有間歇或者連續性 的電壓、電流或電場之變化，有時變化速率相當快，這將 導致在不同頻率（freqUency)或一個頻帶（band)間產 〇生電磁能量，而相應的電路則會將這種能量發射到周圍的 環境中，並產生所謂的電磁波干擾（Elec1;r〇magnetic Interference, EMI )。但是，以塑膠材質作為殼體之電子 設備顯然不能屏蔽該種電磁波干擾，故，電磁波干擾便會 影響到電子設備的穩定運作與傳輸功能，更甚者會造成對 人體上的危害。 為了解決電磁波干擾之問題，現行之技術中，有些設 ❹计人員直接將用金屬材料製成殼體以達到屏蔽電磁波干 擾之功忐，如第1圖所示之臺灣專利證書第M3〇〇〇27號新 型專利’即揭露一種金屬遮罩外殼。 如第1圖所示’該金屬遮罩外殼包含一上蓋及一 下蓋20,並藉由該上蓋10及該下蓋2〇結合後形成一金 屬遮罩外殼於一電路板上，藉以防止電磁波。然，該金屬 遮罩外殼雖可達到屏蔽電磁波干擾之目的，但卻未提出如 何解決上述之電子設備外殼溫度過高的狀況，且對於外殼 内部如何散熱亦未提出任何建議。所以，該金屬遮罩外殼 6 110741 200938065 之内部熱量同樣無法適當逸散，導致外殼局部溫度過高， 仍存在影響電子設備的穩定運作之隱患及外殼會烫手之 問題。 是故，如何降低外殼溫度，設計一種提供良好散熱效 果又兼具屏蔽電磁波干擾之散熱技術，確保電子設備的穩 =運作，以避免上述之種種缺失，實為相關領域之業者目 前亟待解決之課題。 【發明内容】 © 鑒於上述習知技術之缺點，本發明之一目的在於提一 種散熱式殼體，俾降低外殼溫度。 本發明之另一目的係在於提供一種散熱式殼體，俾提 供良好的散熱效果且兼具屏蔽電磁波干擾之效果。 本發明之再一目的係在於提供一種散熱式殼體，以確 保電子設備之穩定運作。 為達上述目的及其他相關目的，本發明提供一種散熱 ❹式设體，係應用於具有發熱元件之電路板，該散熱式殼體 包括金屬罩以及外殼。該金屬罩係具有容納該電路板之容 置空間；該外殼係包覆該金屬罩，並與該金屬罩之間保持 有間隙以形成空氣夾層。 前述本發明之散熱式殼體，其中，該金屬罩係包括第 一罩體及第二罩體，該第一罩體包括第一底面，複數第一 散熱孔係設於該第一底面；該第二罩體係用於結合該第一 罩體，包括第二底面，複數第二散熱孔係設於該第二底 面，且該第一罩體及第二罩體因為係金屬罩體，故具有防 7 110741 200938065 止電磁波干擾（EMI)之功效。 於一實施態樣中，該第一罩體包括沿該第一底面兩側 •延伸之複數折邊、及設於該第一底面上側之二卡鉤。該複 數折邊係彼此間隔而設置者，且該複數折邊係垂直於該第 一底面，一端連接該第一底面，另一端則具有朝外彎曲之 彈性卡固部。其中’各該彈性卡固部係例如朝外彎曲一角 度之彎鉤段。 該外殼係包括第一殼體及第二殼體，該第一殼體係包 ❸覆該第一罩體’並與該第一罩體之間保持有間隙以形成空 氣夾層；該第二殼體係包覆該第二罩體，並與該第二罩體 之間保持有間隙以形成空氣夾層。該第一殼體具有自頂侧 延伸之卡鉤，該第二殼體則具有設於頂侧下表面之凹部， 該凹部係對應該卡鉤而設置，以供卡固該第一與該第二殼 體之頂側。該第一殼體具有設於底面之開口，該第二殼體 則具有對應該開口而設於底面之卡鉤，由該開口外露出該 ❹卡鉤，以供卡固該第一與該第二殼體之下侧。此外，該第 一殼體可具有設於底面之複數第一散熱開口，且該第二殼 體可具有設於底面之複數第二散熱開口。 、如上所述，本發明之散熱式殼體可由外殼包覆金屬 罩，並令該金屬罩與該外殼之間保持有間隙以形成空氣夹 層，且該金屬罩與該外殼皆具有對應電路板中發熱元件之 複數散熱孔/散熱開口。如此，藉由該金屬罩與該空氣爽 層的存在，使得電子設備之發熱元件所產生之熱能得以更 好的逸散或減弱，藉此降低該外殼之溫度並且有效地屏蔽 110741 8 200938065 電磁波之干擾，以確保電子設備之穩定運 技術中之種種缺失。 服了習知 ‘【實施方式】 •、以下係藉由特定的具體實例說明本發明之每 式，熟悉此技藝之人士可由本說明書所揭示之内容= 瞭解本發明之其他優點與功效。 Λ 再者，以下圖式均為簡化之示意圖式，而僅 ，說明本發明之基本構想，遂圖式中僅顯示與本發明^關 製疋際實施時之元件數目、形狀及尺寸繪 =之二？Γ 之型態、數量及比例可為-種隨 W之支更，且其元件佈局型態可能更為複雜。 =閲第2圖’第2圖係為本發明之散熱式殼體一實 ^意圖。如圖所示，本發明係提供-種散孰式 ::，係應用於具有發熱元件（未圖示 ；;， 該電路板31係設於一電子 電子钟借Μ u 於本實施例中，該 «備3 #'為應用於—網路視頻會議服務系統中之影 備’但並非以此爲限’於其他實施例中之電子設 =可ΪΓ影音:視訊、監控儀器、交換機、飼服器、 31及他電子S又備而均適用於本發明；而電路板 一、之發熱兀件可為任何習知之結構，於此僅為例 不5明。該散熱式殼體則包括金屬罩4以及外殼5。 乃且=金屬罩4係具有容納該電路板31之容置空間40 4ΐΓ。社對應該電路板31中發熱元件之複數第-散熱孔 ”月配合參閲第3圖’第3圖係為本發明之散熱式殼 9 110741 200938065 c結構示意圖。於本實施例中，該金屬罩4係包 .覆正I電路板31，並且包括第—罩體41及第二罩體42, 該第一罩體41待0括·楚 、面41G、設於第—底面㈣ 之知數第-散熱孔41i、沿該第一底φ4ΐ〇 數折邊仍、及設於該第-底面41〇上側之二卡鉤^複 該複數第-散熱孔411係對應於該發熱元件而設於 該第一底面410，於本實施例中，該複數第-散熱孔411 係為圓孔並且呈陣列式排列配置於該第-底面41G較下 〇側之部分’但於其他實施例中，該複數第一散熱孔^ ^ 之形狀及排列配置亦可加以變化。該複數折邊4i2係垂直 J於該底面410，一端連接該第一底面41〇，另一端則具有 略朝外f曲之彈性卡固部412卜由於該複數折邊412、係 彼此間隔而設置者，故具有彈性變形能力。各該彈性卡固 部4121係朝外彎曲一角度之彎鉤段，可視實際使用需要 來改變為不同的彎曲角度。二該卡鉤413則係垂直於該第 ❾一底面410之上側。可於製造該第一罩體41時一併例如 衝壓形成該複數第一散熱孔411、該複數折邊412、該彈 性卡固部4121、以及二該卡鉤413，但非以此為限。 該第一罩體42用於結合該第一罩體41，並具有第二 底面420、沿第二底面420兩侧延伸之二側邊421、沿該 第二底面420上側延伸之頂邊422、及設於該第二底面42〇 之複數第二散熱孔423。二該侧邊421係對應於該複數折 邊412，且該頂邊422具有對應該複數卡鉤413之複數卡 槽4221，其中’各該卡槽4221係呈凸字型卡槽，以供卡 10 110741 200938065 固各該卡鉤413’且設置數量係對應該卡釣413之數量； 換言之’亦可對應修改該卡鉤413與該卡槽4221之形狀 ’及數量，只要可結合該第一罩體41與該第二罩體42之上 •侧即可。該複數第二散熱孔423係對應於該發熱元件，於 本實施例中’該複數第二散熱孔423係為圓孔並且呈陣列 式排列配置於該第二底面420較下侧之部分；但於其他實 施例中之第二散熱孔423的形狀及排列配置亦可加以變 化。同時，亦可於製造該第二罩體42時一併例如衝壓形 〇成該側邊421、該頂邊422、該複數卡槽4221、及該複數 弟一散熱孔4 2 3，但非以此為限。 此外’該第一罩體41及第二罩體42均係為金屬材質 所製成之金屬罩體，可用以屏蔽電子設備内部元件工作時 產生之電磁波’故可防止電磁波干擾。 於本實施例中，該第一罩體41之尺寸係稍大於該第 二罩體42之尺寸，於該第一罩體41扣合於該第二罩體 42時，該複數折邊412係對應伸入於二該侧邊421内侧， 而則該彈性卡固部4121彈性卡摯二該侧邊421内側。然， 應知此種卡固結構為本發明之一實施態樣’而非以此為 限，所屬技術領域中具有通常知識者均可依實際需要加以 變化與修改成其他卡固結構、卡扣結構、鎖固結構、或其 他等效結構，而同樣適用於本發明。 如第2圖配合第4及第5圖所示，該外殼5係用於包 覆該金屬罩4,並與該金屬罩4之間保持有間隙A，以形 成空氣夾層。該外殼5係包括第一殼體51及第二殼體 110741 11 200938065 52’於本實施例中，該外殼5均係為塑膠材質所製成之外 殼，藉以降低製造成本，但並非以此為限。 .該第一殼體51係用於包覆該第-罩體41 ’並與該第 --罩體41之間保持有間隙（未圖示），以形成空氣夹層。 該第一殼體51具有對應該複數第一散熱孔411之複數第 一散熱開口 51卜自該第一殼體51頂側延伸之卡釣、 及設於該第一殼體51底面之開口 513。 該第二殼體52係用於包覆該第二罩體42，並與該第 ❹-罩體42之間保持有間隙A ’以形成线炎層。於本實 施例中，該第二殼體52具有設於頂侧下表面之凹部521、 設於底面之卡鉤522、及對應該複數第二散熱孔423之複 數第-散熱開口（未圖示）。該凹部521係對應該卡釣 5i2而設置，以供卡固該第一殼體51與該第二殼體”之 頂侧。該卡鉤522則係設於該第二殼體52接近下侧之底 面，可由該開口 513外露出該卡鉤522 ’以供卡固該第一 ❹成體、51與該第一殼體52之下側；換言之，從該外殼5 外部通過該開口 513來按麗該卡釣⑽，便可輕易地分離 該弟一殼體51與該第二殼體52。 —於具體實施樣悲巾’例如可於該第二殼體設置熱 溶支柱（未圖示），以熱炼固定該第二殼體52與該第二 罩f 42 ’並使該第一罩體41固定至該第二罩體42,該第 设體51與該第二殼體52之間則可利用該凹部52卜該 卡鉤512、及該卡鉤522而固定。當然，亦可利用對應之 卡釣與卡槽、凸榫與凹槽、或其他等效之結合結構來結合 12 110741 200938065 該第一殼體51與該第二殼體…而非揭限於本實施例’ 且亦可私熱仏以外之技術來固定該金屬罩4至該外殼卜 例如可於該外殼5及該金屬罩4設置對應之螺挺 .(Stand〇ff )與螺孔（均未圖示）；換言之，只要可八 該外殼5與該金料4之間保持有間隙之結合技術或： 構’均適用於本發明。而且，前述結合技術或結構可為所 屬技術領域中具有通常知識者所理解並據以實施，故在此 不再贅述。 〇 #如第4圖所示，例如可於該第二罩體^之内設置 對應該發熱元件上方設置散熱器33,以提昇散執效果。 該散熱器33可為薄型之散熱器，但亦可省略該散熱器 33’其中，該第二罩體42已熱溶固定至該第二殼體 當該電子設備3運行時，因爲該外殼5内具有該金屬罩 4’使得該電路板31之發熱元件散發之一部分熱量反射到 該金屬罩4與該外殼5之間的空氣夾層，而另一部份熱量 則透過對應該發熱it件/散熱器33之第—散熱孔411以 及第一散熱開口 511散發至該外殼5外（如第5圖所示）。 由於空氣之導熱係數很小，形成該空氣夾層可進一步減弱 該金屬罩4對該外殼5之導熱，因而避免埶能直接傳導至 該外般5,故可使該外殼5表面局部(㈣=:件 部分）溫度不致於過高，進而降低該外殼5表面之溫度。 再者，由於該金屬罩4係為金屬材質製成者，具有良好的 屏蔽電磁波干擾之效果，則更加確保了該電子設備3之穩 定運行。 13 110741 200938065 綜上所述’本發明之散熱式殼體可由外殼包覆金屬 .罩，該金屬罩與該外殼之間保持有間隙以形成空氣央層， 且該金屬罩與該外殼皆可具有對應電路板中發熱元件曰之 •散熱孔/散熱開口，由於該金屬罩與該空氣夾層的存在， 使得電子㈣中電路板之發熱㈣產生之熱能得以更好 的逸散’以避免電子設備外殼局部溫度過高，藉此降低外 设溫度’且有效地屏蔽電磁波之干擾，以達到確保電子設 備之穩定運作。因此，應用本發明可克服習知技術之前述 〇諸多缺點，而具高度產業利用價值。 上述實施例僅例示性說明本發明之原理及其功效，而 =用於限制本發明。任何熟習此項技藝之人士均可在不違 月本發明之精神及範_下，對上述實施例進行修飾與改 變。因此’舉凡所屬技術領域中具有通常知識者在未脫離 本發明所揭示之精神與技術思想下所完成之—切等效修 飾或改變，仍應由後述之申請專利範圍所涵蓋。 ❹【圖式簡單說明] 第1圖係顯示習知散熱技術之示意圖； 第2圖係顯示本發明之散熱式殼體一實施例之示意 圖； 〜 第3圖係顯示本發明之散熱式殼體一實施例中之金 屬罩結構之示意圖； 土-第4圖係顯示本發明之散熱式殼體一實施例中之局 4不思圖’其中第二罩體係結合第二殼體；以及 第5圖係顯示為本發明之散熱式殼體一實施例之外 14 110741 200938065 觀示意圖。 【主要元件符號說明】 •10 上蓋 • 20 下蓋 3 電子設備 31 電路板 33 散熱器 4 金屬罩 〇40 容置空間 41 第一罩體 410 第一底面 411 第一散熱孔 412 折邊 4121 彈性卡固部 413 卡鉤 42 第二罩體 ❹420 第二底面 421 側邊 422 頂邊 4221 卡槽 423 第二散熱孔 5 外殼 51 第一殼體 511 第一散熱開口 200938065 512 卡鉤 513 開口 ^ 52 第二 • 521 凹部 522 卡鉤 殼體200938065 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a heat dissipating technique, and more particularly to a heat dissipating housing for use in a circuit board having a heat generating component. [Prior Art] According to common electronic devices such as video and audio, video, monitoring instruments, switches, servers, computers, etc., various components and/or modules are provided on the circuit board in the housing, including Many of the heat components that generate heat in operation. In order to maintain proper temperature so that the electronic device can operate stably, whether the thermal energy in the casing can be effectively dissipated is particularly important. In the case of poor heat dissipation performance, as the operating temperature of the electronic device increases, it is inevitable that Unstable operation can lead to problems such as crashes, which can reduce the service life of electronic devices. At the same time, most of the current electronic devices are made of plastic materials with low cost and low thermal conductivity. The heat generated by the heating elements inside the casing, such as the central processing unit, the memory, the north bridge chip, or the power supply, will be affected by the outer casing. It is impossible to escape due to the limitations of its own material. Especially for electronic devices that do not have a heat-dissipating fan to force the conduction of heat, this heat can make the temperature of the case too high, especially in the part of the case corresponding to the heating element, and even feel a hot hand when touched by a hand. However, the phenomenon that the temperature of the casing is too high often causes the user to worry about whether the temperature inside the casing is too high, causing doubts about the product. Therefore, some electronic devices add a cooling fan in the outer casing to discharge the heat generated by the heating element to the outside of the casing, thereby reducing the internal temperature of the casing 110741 200938065 \ temperature. Although this method can improve the heat dissipation effect, however, for small electronic devices with small internal space and dense component layout, if the space inside the casing is insufficient to set the cooling fan, the casing must be enlarged to provide placement. Space for the cooling fan. In this way, it does not meet the miniaturization characteristics required and provided by such electronic devices. Furthermore, all electronic devices operate intermittently or continuously with changes in voltage, current, or electric field, sometimes at a relatively fast rate, which can result in twins between different frequencies (freqUency) or one band. Electromagnetic energy, and the corresponding circuit emits this energy into the surrounding environment and produces so-called electromagnetic interference (Elec1; r〇magnetic Interference, EMI). However, the electronic device with the plastic material as the casing obviously cannot shield the electromagnetic wave interference. Therefore, the electromagnetic wave interference will affect the stable operation and transmission function of the electronic device, and even worse, it may cause harm to the human body. In order to solve the problem of electromagnetic interference, in the current technology, some design personnel directly use metal materials to form a housing to achieve the function of shielding electromagnetic interference, such as the Taiwan Patent Certificate No. M3〇〇〇 shown in Figure 1. The new patent No. 27 discloses a metal cover shell. As shown in Fig. 1, the metal mask cover comprises an upper cover and a lower cover 20, and the upper cover 10 and the lower cover 2 are joined to form a metal mask cover on a circuit board to prevent electromagnetic waves. However, although the metal mask casing can achieve the purpose of shielding electromagnetic interference, it does not propose how to solve the above-mentioned condition that the temperature of the electronic device casing is too high, and no suggestion is made on how to dissipate heat inside the casing. Therefore, the internal heat of the metal mask casing 6 110741 200938065 cannot be properly dissipated, resulting in excessive local temperature of the casing, and there are still hidden dangers that affect the stable operation of the electronic device and the problem that the casing is hot. Therefore, how to reduce the temperature of the casing, design a heat dissipation technology that provides good heat dissipation and shields electromagnetic interference, and ensures the stability of the electronic equipment to avoid the above-mentioned various defects, which is an urgent problem for the industry in related fields. . SUMMARY OF THE INVENTION In view of the above-described disadvantages of the prior art, it is an object of the present invention to provide a heat-dissipating housing that reduces the temperature of the housing. Another object of the present invention is to provide a heat-dissipating casing which provides a good heat-dissipating effect and has the effect of shielding electromagnetic interference. It is still another object of the present invention to provide a heat dissipating housing to ensure stable operation of the electronic device. To achieve the above and other related objects, the present invention provides a heat sink type housing for a circuit board having a heat generating component including a metal cover and a housing. The metal cover has a receiving space for receiving the circuit board; the outer cover encloses the metal cover and maintains a gap with the metal cover to form an air interlayer. The heat dissipation type housing of the present invention, wherein the metal cover comprises a first cover body and a second cover body, the first cover body includes a first bottom surface, and the plurality of first heat dissipation holes are disposed on the first bottom surface; The second cover system is configured to be coupled to the first cover body, and includes a second bottom surface, wherein the plurality of second heat dissipation holes are disposed on the second bottom surface, and the first cover body and the second cover body have a metal cover body Protection 7 110741 200938065 The effect of electromagnetic interference (EMI). In one embodiment, the first cover includes a plurality of flanges extending along both sides of the first bottom surface, and two hooks disposed on an upper side of the first bottom surface. The plurality of flanges are spaced apart from each other, and the plurality of flanges are perpendicular to the first bottom surface, one end of which is connected to the first bottom surface, and the other end has an elastically bent portion that is curved outward. Wherein each of the elastic fastening portions is, for example, a bent hook portion bent outwardly by an angle. The outer casing includes a first casing and a second casing, the first casing covering the first casing and maintaining a gap between the first casing and the first casing to form an air interlayer; the second casing The second cover is covered and a gap is maintained between the second cover to form an air interlayer. The first housing has a hook extending from the top side, and the second housing has a recess disposed on the lower surface of the top side, the recess being disposed corresponding to the hook for securing the first and the first The top side of the two housings. The first housing has an opening disposed on the bottom surface, and the second housing has a hook corresponding to the opening provided on the bottom surface, and the hook is exposed from the opening to secure the first and the first The lower side of the second housing. In addition, the first housing may have a plurality of first heat dissipation openings disposed on the bottom surface, and the second housing may have a plurality of second heat dissipation openings disposed on the bottom surface. As described above, the heat-dissipating casing of the present invention may be covered with a metal cover by the outer casing, and a gap is formed between the metal cover and the outer casing to form an air interlayer, and the metal cover and the outer casing have corresponding circuit boards. A plurality of heat dissipation holes/heat dissipation openings of the middle heating element. Thus, by the presence of the metal cover and the air cooling layer, the thermal energy generated by the heating element of the electronic device is better dissipated or weakened, thereby lowering the temperature of the outer casing and effectively shielding 110741 8 200938065 electromagnetic wave Interference to ensure the absence of various technologies in the stability of electronic equipment. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Furthermore, the following drawings are simplified schematic diagrams, and only the basic concept of the present invention will be described. In the drawings, only the number, shape and size of components in the implementation of the present invention are shown. two? The type, quantity, and proportion of Γ can be more varied with W, and the component layout can be more complicated. = see Fig. 2, Fig. 2 is a schematic view of the heat dissipating casing of the present invention. As shown in the figure, the present invention provides a diverging type:: applied to a heating element (not shown;; the circuit board 31 is provided in an electronic electronic clock, in this embodiment, The "preparation 3 #" is applied to the video backup service system in the network video conferencing service system 'but not limited to this'. In other embodiments, the electronic device = video and audio: video, monitoring equipment, switches, feeding clothes The device, 31 and the electronic device S are both suitable for use in the present invention; and the heat-generating component of the circuit board can be any conventional structure, which is merely an example. The heat-dissipating housing includes a metal cover. 4 and the outer casing 5. The metal cover 4 has a receiving space 40 4 accommodating the circuit board 31. The plurality of first heat dissipation holes of the heat generating elements in the circuit board 31 are matched with the monthly matching. 3 is a schematic structural view of the heat-dissipating case 9 110741 200938065 c of the present invention. In the embodiment, the metal cover 4 is wrapped with a positive I circuit board 31, and includes a first cover 41 and a second cover 42. The first cover body 41 is to be etched, the surface 41G, and the first heat dissipation hole 41i provided in the first bottom surface (fourth). The first bottom φ4 turns the flange and the two hooks disposed on the upper side of the first bottom surface 41〇, and the plurality of heat dissipation holes 411 are disposed on the first bottom surface 410 corresponding to the heat generating component. In this embodiment, the plurality of first heat dissipation holes 411 are circular holes and are arranged in an array on the lowermost side of the first bottom surface 41G. However, in other embodiments, the plurality of first heat dissipation holes ^ ^ The shape and arrangement may also be changed. The plurality of flanges 4i2 are perpendicular to the bottom surface 410, one end of which is connected to the first bottom surface 41〇, and the other end has an elastic portion 412 slightly outwardly curved. The plurality of flanges 412 are arranged to be spaced apart from each other, so that they have elastic deformation capability. Each of the elastic fastening portions 4121 is bent outwardly at an angle of the hook segments, and can be changed to different bending angles according to actual needs. The hook 413 is perpendicular to the upper side of the first bottom surface 410. The plurality of first heat dissipation holes 411, the plurality of flanges 412, and the elastic fastening portion can be formed by stamping, for example, when the first cover body 41 is manufactured. 4121, and 2, the hook 413, but not limited thereto. The first cover 42 is configured to be coupled to the first cover 41 and has a second bottom surface 420, two side edges 421 extending along two sides of the second bottom surface 420, and a top edge 422 extending along an upper side of the second bottom surface 420. And a plurality of second heat dissipation holes 423 disposed on the second bottom surface 42. The side edges 421 correspond to the plurality of flanges 412, and the top edge 422 has a plurality of card slots 4221 corresponding to the plurality of hooks 413, wherein 'The card slot 4221 is a embossed card slot for the card 10 110741 200938065 to fix the hook 413' and the number of the card 413 is correspondingly set; in other words, the hook 413 can also be modified correspondingly. The shape and number of the card slot 4221 may be combined with the upper side of the first cover 41 and the second cover 42. The plurality of second heat dissipation holes 423 correspond to the heat generating elements. In the embodiment, the plurality of second heat dissipation holes 423 are circular holes and are arranged in an array on the lower side of the second bottom surface 420; The shape and arrangement of the second heat dissipation holes 423 in other embodiments may also be changed. At the same time, when the second cover 42 is manufactured, for example, the side 421, the top edge 422, the plurality of card slots 4221, and the plurality of heat dissipation holes 4 2 3 are formed by stamping, but not This is limited. Further, the first cover 41 and the second cover 42 are made of a metal cover made of a metal material, and can be used to shield electromagnetic waves generated when the internal components of the electronic device operate. Therefore, electromagnetic wave interference can be prevented. In the embodiment, the size of the first cover 41 is slightly larger than the size of the second cover 42 . When the first cover 41 is fastened to the second cover 42 , the plurality of flanges 412 are Correspondingly extending into the inner side of the side edge 421, the elastic fastening portion 4121 elastically engages the inner side of the side edge 421. However, it should be understood that such a stuck structure is an embodiment of the present invention, and is not limited thereto, and those having ordinary knowledge in the technical field can be changed and modified into other fastening structures and buckles according to actual needs. Structures, locking structures, or other equivalent structures are equally applicable to the present invention. As shown in Fig. 2 in conjunction with Figs. 4 and 5, the outer casing 5 is used to cover the metal cover 4, and a gap A is maintained between the metal cover 4 to form an air interlayer. The outer casing 5 includes a first casing 51 and a second casing 110741 11 200938065 52'. In the embodiment, the casing 5 is made of a plastic material to reduce the manufacturing cost, but not limit. The first casing 51 is used to cover the first cover 41' and maintain a gap (not shown) between the first cover 41 to form an air interlayer. The first housing 51 has a plurality of first heat dissipation openings 51 corresponding to the plurality of first heat dissipation holes 411, a card fishing extending from the top side of the first housing 51, and an opening 513 provided on the bottom surface of the first housing 51. . The second casing 52 is used to cover the second casing 42 and maintain a gap A' with the first weir-cover 42 to form a lining layer. In this embodiment, the second housing 52 has a recess 521 disposed on the lower surface of the top side, a hook 522 disposed on the bottom surface, and a plurality of first heat dissipation openings corresponding to the plurality of second heat dissipation holes 423 (not shown ). The recess 521 is disposed on the top side of the first housing 51 and the second housing to match the card fishing 5i2. The hook 522 is disposed on the lower side of the second housing 52. The bottom surface of the first housing 40 and the lower side of the first housing 52 may be exposed by the opening 513; in other words, the outside of the housing 5 is pressed through the opening 513. The Lika card fishing (10) can easily separate the brother-seat 51 and the second casing 52. In the specific embodiment, for example, a hot-melting pillar (not shown) can be disposed in the second casing. The second housing 52 and the second cover f 42 ′ are fixed by heat sealing, and the first cover 41 is fixed to the second cover 42 , between the first body 51 and the second housing 52 . The recessed portion 52 can be fixed by the hook 512 and the hook 522. Of course, the corresponding card fishing and card slot, the tongue and the groove, or other equivalent combination structure can also be used to combine 12 110741 200938065 The first housing 51 and the second housing are not limited to the embodiment ′ and the metal cover 4 can be fixed to the outer casing by a technique other than private enthalpy For example, the outer casing 5 and the metal cover 4 may be provided with corresponding studs (Stand〇ff) and screw holes (none of which are not shown); in other words, as long as there is a gap between the outer casing 5 and the gold material 4 The combination of the technology or the structure is applicable to the present invention. Moreover, the foregoing bonding technology or structure can be understood and implemented by those skilled in the art, and therefore will not be described herein. 〇#如图4 As shown, for example, a heat sink 33 disposed above the heat generating component may be disposed in the second cover body to enhance the dissipation effect. The heat sink 33 may be a thin heat sink, but the heat sink 33 may be omitted. Wherein the second cover 42 has been thermally fused to the second housing. When the electronic device 3 is in operation, because the metal cover 4' is provided in the outer casing 5, the heat generating component of the circuit board 31 dissipates a part of the heat. The air interlayer is reflected between the metal cover 4 and the outer casing 5, and the other part of the heat is radiated to the outer casing 5 through the first heat dissipation hole 411 corresponding to the heat generating member/heat sink 33 and the first heat dissipation opening 511. Outside (as shown in Figure 5). Due to the air The thermal conductivity is small, and the formation of the air interlayer can further weaken the heat conduction of the metal cover 4 to the outer casing 5, thereby preventing the crucible from being directly transmitted to the outer portion 5, so that the surface of the outer casing 5 can be partially ((4) =: part) The temperature is not too high, and the temperature of the surface of the outer casing 5 is lowered. Further, since the metal cover 4 is made of a metal material and has a good effect of shielding electromagnetic interference, the stability of the electronic device 3 is further ensured. 13 110741 200938065 In summary, the heat-dissipating casing of the present invention may be covered with a metal cover by the outer casing, and a gap is maintained between the metal cover and the outer casing to form an air central layer, and the metal cover and the outer casing are both The heat dissipation hole/heat dissipation opening of the corresponding heating element in the circuit board may be provided. Due to the presence of the metal cover and the air interlayer, the heat generated by the circuit board in the electronic (4) is better dissipated to avoid electrons. The local temperature of the device casing is too high, thereby reducing the peripheral temperature' and effectively shielding the electromagnetic wave from interference to ensure the stable operation of the electronic device. Therefore, the application of the present invention can overcome the aforementioned shortcomings of the prior art and has a high industrial utilization value. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are used to limit the invention. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the invention. Therefore, those skilled in the art should be able to carry out the equivalent modification or modification without departing from the spirit and the invention of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a conventional heat dissipating technique; Fig. 2 is a view showing an embodiment of a heat dissipating casing of the present invention; ~ Fig. 3 is a view showing a heat dissipating casing of the present invention A schematic view of a metal cover structure in an embodiment; a soil-fourth diagram showing an embodiment of the heat-dissipating housing of the present invention in which the second cover system is combined with the second housing; and the fifth The figure shows a schematic view of 14 110741 200938065 in addition to an embodiment of the heat-dissipating housing of the present invention. [Main component symbol description] • 10 upper cover • 20 lower cover 3 electronic device 31 circuit board 33 heat sink 4 metal cover 40 housing space 41 first cover 410 first bottom surface 411 first heat dissipation hole 412 flange 4121 elastic card Solid part 413 hook 42 second cover body 420 second bottom surface 421 side 422 top side 4221 card slot 423 second heat dissipation hole 5 housing 51 first housing 511 first heat dissipation opening 200938065 512 hook 513 opening ^ 52 second • 521 recess 522 hook housing