TW200937507A - Wafer cleaning apparatus - Google Patents

Abstract

A wafer cleaning apparatus used for cleaning a first uncleaned surface of a wafer is provided. The wafer cleaning apparatus includes a case, a spin device, a cover, at least one first spray bar, and at least one exhaust device. The spin device is disposed in the case and used for carrying the wafer and spinning perpendicularly to the ground. The cover is disposed in the case and used for covering the spin device. The first spray bar is disposed at one side of the spin device and used for spraying a volatile cleaning solution onto the first uncleaned surface of the wafer, in which the sprayed volatile cleaning solution is of a bar shape. The exhaust device is disposed on the sidewall of the case.

Description

200937507 r ·, 24 26064twf.doc/n IX. Description of the invention: [Technical field to which the invention pertains]

The present invention is directed to a wafer cleaning machine. [Prior Art] The most frequent process step for the round wash is that the wafer η B is used for the subsequent process of attaching to the wafer surface after the process of performing the semiconductor process: the chemical mechanical polishing process. For the second production (four) & The pollution of metal impurities will cause the electricity, shrinkage, reduction of the life of the carrier, and the reduction of the polar oxide layer. The adhesion of the particles will affect the true dipole/tone of the lithography process pattern to cause a short circuit in the circuit structure. Therefore, in the wafer cleaning process, =: removal of organic compounds and metal impurities attached to the surface of the wafer. When cleaning the wafer, the wafer is placed on the substrate and paralleled to the ground (4). , - Rotate - use the injection mechanism to pour water onto the wafer for dissimilarity, and the wafer of the marriage wafer spins the water. However, after this cleaning step is completed, watermarks are often found on the surface, resulting in poor cleaning efficiency, ^ = quality and yield of semiconductor components. SUMMARY OF THE INVENTION In view of the above, the object of the present invention is to provide a wafer cleaning machine σ' which effectively improves the cleaning efficiency of the wafer. 5 200937507 ----------- .24 26064twf.doc/n ^ The present invention provides a wafer cleaning machine suitable for cleaning the first to be cleaned surface of a wafer. The wafer cleaning machine includes a housing, a rotating device, a cover, at least one first strip sprayer, and at least one venting device. The rotating device is disposed in the housing for carrying the wafer and rotating perpendicular to the ground. The cover is disposed in the housing and covers the rotating device. First strip sprayer = placed on one side of the rotating device to spray volatile cleaning solution to the wafer ^

The first surface to be cleaned, and the volatile cleaning liquid sprayed is in the form of a strip. The exhaust device is disposed on a side wall of the housing. According to an embodiment of the present invention, in the wafer cleaning machine described above, the rotating device includes a rotating table. According to an embodiment of the present invention, in the above wafer cleaning machine 2, a plurality of fixing mechanisms are further disposed on the rotating device for fixing the circle to the rotating device. Aa According to an embodiment of the present invention, the fixing mechanism in the wafer cleaning machine a described above includes a plurality of fixings. According to an embodiment of the present invention, the fixing mechanism in the above-described wafer cleaning machine Δ includes an adsorption device. Portion According to an embodiment of the present invention, the spraying method of the first strip sprayer in the above-described wafer washer 2 includes aligning the radial direction of the wafer: spraying.

According to an embodiment of the present invention, in the above-mentioned wafer cleaning machine table, when the number of the first strip-shaped sprinklers is plural, the arrangement of the first strip-shaped nozzles includes radial intersections with each other. arrangement. TO In accordance with an embodiment of the present invention, in the wafer cleaning machine 6 200937507 124 26064twf.doc/n, the first strip sprayer includes at least one row of spotted spray holes. According to an embodiment of the present invention, in the above wafer cleaning machine, the first strip sprayer includes at least one strip spray hole. In accordance with an embodiment of the present invention, in the wafer cleaning machine described above, the rotating device includes a plurality of rolling rollers. According to an embodiment of the present invention, the wafer cleaning machine includes at least one second strip sprayer disposed on the other side of the rotating device for spraying the volatile cleaning liquid to the crystal. The second second surface to be cleaned, and the volatile cleaning liquid sprayed is strip-shaped. According to an embodiment of the invention, in the wafer cleaning machine, the second surface to be cleaned is the opposite surface of the first surface to be cleaned. In accordance with an embodiment of the present invention, in the wafer cleaning machine described above, the spraying method of the second strip sprayer includes spraying in the radial direction of the wafer. According to an embodiment of the present invention, in the above wafer cleaning machine, when the number of the second strip sprayers is plural, the arrangement of the second strip sprayers 0 includes intersecting each other. Radial arrangement. According to an embodiment of the present invention, in the above wafer cleaning machine, the second strip sprayer includes at least one row of dot spray holes. According to an embodiment of the invention, in the above wafer cleaning machine, the second strip sprayer comprises at least one strip spray hole. According to an embodiment of the present invention, in the above wafer cleaning machine, the volatile cleaning liquid is isopropyl alcohol or acetone. According to an embodiment of the present invention, the above-mentioned wafer cleaning machine platform 200937507 ----------- .24 26064twf.doc/n further includes a water injection device disposed in the cover body. Used to supply water to the wafer. According to an embodiment of the invention, in the wafer cleaning machine described above, the water comprises deionized water. "" According to an embodiment of the present invention, in the wafer cleaning machine described above, when the number of exhaust devices is plural, the exhaust devices are disposed on the same side wall of the casing. According to an embodiment of the present invention, in the above wafer cleaning machine

Wherein, when the number of exhaust devices is plural, the exhaust device is disposed on a plurality of side walls of the casing. Based on the above description, since the wafer cleaning machine of the present invention has the first strip sprayer and rotates the wafer by the rotating device, the flushing cleaning liquid can be more uniformly and quickly relied on the crystal face. Therefore, the cleaning efficiency can be improved. In addition, the wafer cleaning machine proposed by the present invention cleans and dissolves the wafer. Volatile in itself' • Use rotating wafers to keep things! The 'force drying speed' thus avoids leaving a residue on the wafer, which in turn can improve the quality and yield of the semiconductor component. Spray: The wafer cleaning machine proposed by the invention has a second strip to clean the second surface to be cleaned, and the b is more comprehensively cleaned. It is easy to understand and other purposes, features and advantages can be more clearly as follows. The cow embodiment, in conjunction with the drawing, is described in detail [Embodiment] 8 200937507 -----------, 24 26064twf.doc/n The first implementation of your 丨=1,% A top view of the wafer > month washing machine α of the first embodiment and the second embodiment of the present invention. Fig. 2 is a cross-sectional view showing the crystal circle of the first embodiment of the present invention = the washing machine table along the Α_Α in Fig. i. 3 and 4 are front views of the strip sprinkler of the first embodiment of the present invention. Fig. 5 is a schematic view showing the arrangement of the strip sprinklers of the first embodiment of the present invention.

μ Simultaneously referring to Figs. 1 and 2', the wafer cleaning machine is adapted to clean the surface to be cleaned of the wafer 200. The surface to be cleaned 2〇2 may be the front side or the back side of the wafer. In the present embodiment, the front side of the wafer to be cleaned is taken as an example of the front side of the wafer 200. The wafer cleaning machine table 100 includes a casing 102, a rotating device 1〇4, a fixing mechanism 1〇6, a cover 1〇8, a strip-shaped sprayer 11〇, an exhaust device 112, and a water injection device 114. The rotating device 104 is disposed in the housing 102 for carrying the wafer 2〇〇 and rotating perpendicular to the ground. The rotating device 1G4 is, for example, a rotary table driven by a motor. In addition, since the rotating device 104 in the wafer cleaning machine 1 is rotated perpendicular to the ground, the wafer cleaning machine 1 can be designed to be upright instead of the platform-type wafer cleaning in the prior art. Machine. Therefore, space utilization can be performed more efficiently and more flexibly. The fixing mechanism 106 is disposed on the rotating device 1〇4 for fixing the wafer 2〇〇 to the rotating device 104 to prevent the wafer 2 from being separated from the rotating device 104 during the rotation. The fixing mechanism 106 is, for example, a fixing clip. In other embodiments, the securing mechanism 106 can be an adsorption device. 9

Ο 200937507 ... one-one, ~, 24 26064twf.doc/n The cover 108 is disposed in the housing 102 and covers the rotating device 1〇4, which can be used to protect the components located therein and prevent the solution from being made during the cleaning process. Splash. The strip sprinkler 110 is disposed on one side of the rotating device 1〇4 for spraying the reversible cleaning liquid to the thin surface to be cleaned, and the sprayed volatile cleaning liquid is practiced, and can be evenly and Quickly clean the surface of the volatile cleaning, condensate, and crystal 2GG to be cleaned. The number 2 of the strip sprayers 11 is one or more. The strip-shaped spacer η (four) is applied, for example, to the radial direction of the wafer 200, and the volatile cleaning is more uniformly sprayed onto the surface to be cleaned of the wafer 200. The volatile cleaning liquid is, for example, a volatile liquid such as isopropyl alcohol or acetone. It is to be noted that, in the present embodiment, the surface to be cleaned 2〇2 is an opening which is sprayed toward the strip. In other embodiments, the strip spray 110 may be disposed on the other side of the rotating device 104 as the configuration is different. In addition, please refer to FIG. 3 and FIG. 4 at the same time, the reason why the cleaning liquid is bounded by the strip nozzle 11 is that the strip spray η can include at least the row of spray holes 116. (four rows as shown in Fig. 3) 3疋 to ^ strips of spray holes 118 (four as shown in Figure 4). Further, referring to Fig. 5, the number of strip sprinklers 11A, for example, four cores, is not intended to limit the present invention. At this time, the rows of the sprinklers are arranged in a radial arrangement, for example, intersecting each other. In this way, the spraying efficiency and uniformity of the volatile cleaning solution can be improved. 1 and 2, the exhaust device 112 is disposed in the housing 200937507 -----------.24 26064twf.doc/n

On the side wall of the crucible 102, the chamber in the casing 1〇2 can be evacuated. In this way, it is possible to prevent the volatile cleaning liquid from evaporating to the environment and causing contamination, which can also accelerate the drying speed of the wafer 200. The exhaust unit 112 is, for example, a vacuum pump. The number of exhaust devices 112 can be one or more. When the number of the exhausting devices 112 is plural, the exhausting devices 112 may be disposed on the same side wall of the housing 102 or on the plurality of side walls of the housing 1〇2. The two exhaust devices 112 in this embodiment are described by being disposed on the same side wall of the casing 1〇2 as an example. The water injection device 114 is disposed in the cover body 〇8 for providing water to the wafer 200' to assist in cleaning the wafer 2 to be cleaned surface 2〇2. Among them, the water used is, for example, deionized water. As can be seen from the above first embodiment, the wafer cleaning machine 100 has a strip sprinkler 110' and the wafer 200 is rotated by the rotating device 104, so that it is possible to improve the spraying of the volatile cleaning liquid on the wafer 200. The uniformity and the degree of catch on the face 2〇2 can improve the cleaning efficiency. In addition, in the wafer cleaning machine 1 〇〇 对 〇〇 = solution itself is volatile, and using the rotating wafer two times pumping (four), speed up the dry speed, thus avoiding leaving a residue on the crystal 2 (8) Further, the quality and yield of the semiconductor element can be improved. Figure 2 shows the second actual figure of Figure 2, Α·Α, section_profile i day 1U money station along with please refer to figure i, figure 2 and figure for material 曰® The Japanese yen π 冼 machine 100 is suitable for washing the surface to be cleaned and the surface to be cleaned on the day 0 0, 200937507 24 26064twf.doc/n. The surface to be cleaned 202 and the surface to be cleaned 204 are opposite to each other, and are respectively the front side or the back side of the wafer 200. The wafer cleaning machine 1 (8) includes a housing 102, a cover 108, a strip sprayer 110, an exhaust device 112, a water injection device 114, a rotating device 12A, and an f-shaped diverter 122. In Fig. 6, the same members as those in Fig. 2 are denoted by the same reference numerals and the description thereof will be omitted. Ο

Q = towel crystal cleaning machine, the wafer cleaning machine (8) of the Lang 2 towel = the sample is cleaned with a volatile cleaning solution, the difference between the two is: the rotating device 12 in Figure 6 〇 is different from the _ of FIG. 4; and the wafer cleaning machine in FIG. 6 includes the strip-shaped device (10) disposed on the side of the rotating device 12G, and further includes the other side disposed on the rotating device 12G. Strip sprinkler 122. The pass 120 is, for example, a plurality of rolling pinwheels </ RTI> for clamping the wafer and rotating the wafer 200. The standby 1! 122 is used to treat the volatile cleaning liquid to the surface of the wafer 200, and the volatile cleaning unit 122 may be one or more. Strip-like strip-like method and mode locker 11G is roughly (four), so it is no longer placed here. It is a 'water injection device 114, for example, a mobile water injection 褒 供 for the wafer to be cleaned surface 202 and to be cleaned ί : The main water device he implements the money, the crystal cleaning machine can include two water-making devices 114, and can supply water to the moving and to-be-cleaned surface 2〇4 at the same time. The round wash surface of the circle 200 200937507 t24 26064twfdoc/n According to the second embodiment, the wafer cleaning machine 1 has a strip nozzle 11 〇 and a strip spray on both sides of the rotating device 120 The sprinkler 122 can simultaneously clean the surface to be cleaned 2〇2 of the wafer 200 and the surface to be cleaned 2〇4, and can clean the wafer 2更 more comprehensively. In summary, the above embodiment has at least the following advantages:

1. Since the wafer cleaning machine of the present invention can more uniformly and quickly transfer the volatile cleaning liquid to the surface to be cleaned of the wafer, the generation of water marks can be avoided, and the cleaning efficiency can be greatly improved. 2. The wafer cleaning machine proposed by the present invention can avoid leaving residues on the wafer, thereby improving the quality and yield of the semiconductor device. 3. In the wafer cleaning machine of the present invention, when the strips are respectively provided on both sides of the rotating device, the wafer can be more comprehensively washed. / month - although the present invention is disclosed above, it is not intended to limit the invention to any skilled person, and may make some changes and refinements without departing from the spirit and scope of the invention. Therefore, the invention is defined as defined in the scope of the patent application. </ br> <br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> FIG. Fig. 6 is a cross-sectional view showing the wafer cleaning machine of the second embodiment of the present invention taken along line A-A' of Fig. 1. [Main component symbol description] 100: Wafer cleaning machine 102: Housing 0 104, 120: Rotating device 106: Fixing mechanism 108: Cover 110, 122: Strip sprinkler 112: Exhaust device 114: Water injection device 116: dot spray hole 118: strip spray hole 200 · wafer crucible 202, 204: surface to be cleaned 14

Claims (1)

200937507 24 26064twf.doc/n Patent application scope: The wafer cleaning machine is suitable for a wafer. The first to be cleaned the cleaning machine includes: washing the surface for cleaning, the day-day is a shell; a device disposed in the housing for carrying the wafer and rotating perpendicular to the ground; a cover 'disposed in the housing and covering the rotating device; at least one first strip sprayer disposed at One side of the rotating device for spraying a volatile cleaning liquid to the first to-be-cleaned surface of the wafer and the sprayed volatile cleaning liquid is strip-shaped; and at least one exhausting device disposed at the On the side wall of the housing. 2. The wafer cleaning machine of claim 1, wherein the rotating device comprises a rotary table. 8. The wafer cleaning machine of claim 2, further comprising a plurality of fixing mechanisms disposed on the rotating device for crystallizing the rotating device. 4. The wafer cleaning machine of claim 3, wherein the fixing mechanism comprises a plurality of fixing clips. 5. The wafer cleaning machine of claim 3, wherein the fixing mechanism comprises an adsorption device. § 6丨. The wafer cleaning machine according to claim 1, wherein the tilting mode of the first strip-shaped device comprises aligning the “k-direction spraying. 7. If the patent application scope is the first item The wafer cleaning machine, wherein 15 24 26064twf.doc/n 200937507 When the number of at least one first strip sprayer is plural, the first strip sprayers are arranged in such a manner that they intersect each other and are radially arranged. 8. The wafer cleaning machine of claim j, wherein the at least one strip-shaped sprayer comprises at least a row of dot-shaped sprinkling holes. 9. The wafer cleaning machine of claim 2, wherein the at least one strip-shaped blast comprises at least one strip-shaped sprinkling hole. 10. The wafer cleaning machine of claim i wherein the rotating device comprises a plurality of rolling pinch wheels. n. The wafer cleaning machine of claim 10, further comprising at least one second strip sprayer disposed on the other rotating device to spray the volatile cleaning liquid to the crystal A second cleaning surface to be cleaned, and the volatile cleaning liquid sprayed is strip-shaped. Zhonggu ^If you want to use the Crystal® cleaning machine mentioned in Item 11 of the full-time, the second cleaning surface of k is the opposite side of the first surface to be cleaned. 13. A wafer cleaning machine as described in claim 5, wherein the spraying of the second strip sprayer comprises spraying the alignment of the wafer. H. The wafer cleaning machine described in the scope of the patent application, in which the number of the _ &; 苐 苐 苐 喷 喷 , , , , , , Including the intersection of each other and radial arrangement. [#15] The wafer cleaning machine of claim 11, wherein the "second strip sprayer comprises at least one row of spotted spray holes." The wafer cleaning machine includes at least one strip spray nozzle. 16 200937507 24 26064twf.doc/n 17. The crystal according to the scope of the patent application a circular cleaning machine, wherein the volatile cleaning liquid is isopropyl alcohol or acetone. 18. The wafer cleaning machine according to claim 1, further comprising a water injection device disposed in the cover body. The crystal m cleaning machine according to claim 1, wherein the water comprises a deionized water. μ 20. The crystal according to the scope of claim i Round washing machine, When the number of the at least one venting device is plural, the vents are placed on the same side wall of the casing.义' Round cleaning machine, wherein the lining of the lining of the lining of the lining of the ninth aspect of the invention, the number of the at least one venting device is a plurality of On the side wall. 17