200934323 九、發明說明： 【發明所屬之技術領域】 " 本發明涉及電路板技術領域，特別涉及一種用於電路 板濕處理之濕製程系統。 【先前技術】 濕製程（Wet Process)作為製作電路板過程中之製作 工序，係將處理液，如各種化學藥液或水喷灑於電路基板 ®表面，以實現鑛通孔、鍵銅、餘刻、顯影、剝膜、鑛有機 保護膜、表面改性或清洗等工藝流程。文獻K. W. Lee，A.200934323 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to the field of circuit board technology, and in particular to a wet process system for wet processing of a circuit board. [Prior Art] Wet Process is used as a manufacturing process in the process of making a circuit board by spraying a treatment liquid such as various chemical liquids or water on the surface of a circuit board to realize a mine through hole, a key copper, and the like. Process processes such as engraving, developing, stripping, mineral protective film, surface modification or cleaning. Literature K. W. Lee, A.
Viehbeck, Wet Process Surface Modification of DielectricViehbeck, Wet Process Surface Modification of Dielectric
Polymers, IBM J. Research & Development, 1994，38(4)介 紹一種藉由濕製程對電路板中之絕緣層與膠黏層進行表面 改性方法，以提高電路板中絕緣層與金屬層間之結合力。 目前，電路板製作中通常使用水平濕製程裝置，其原 Λ理為：根據製作需要，各濕處理裝置向水平通過該濕處理 ❹ 裝置之電路板表面噴灑不同之化學藥液或水，以完成電路 板相應之濕製程製作。如圖1所示，為先前技術中一種水 平濕製程裝置10,其包括喷液裝置110、與喷液裝置110 相對設置之處理槽120及與處理槽120相連通之處理液輸 入裝置130。當電路板由平行設置於喷液裝置110與相應處 理槽120之間之複數排滾輪（圖未示）傳送至水平濕製程 裝置10，處理液輸入裝置130向處理槽120注入處理液， 並由抽液裝置（圖未示）從處理槽120抽取處理液並喷向 200934323 電路板表面，以達到藥液處理或清洗效果。另外，有些水 平/”、、衣耘裝置10為達到省水目的，其包含複數處理槽 12〇’將相鄰設置之處理槽12〇料管相連通，使處理液^ 入襞置130輸入之處理液可流經複數處理 〇， 處理槽⑽㈣設置之錢裝置·.錢於㈣板 乂使輸入處理液能被複數次利用從而進行電路板製作。 惟，由於電路板進入水平濕製程裝置1〇進行濕製程之Polymers, IBM J. Research & Development, 1994, 38(4) describes a method for surface modification of an insulating layer and an adhesive layer in a circuit board by a wet process to improve the gap between the insulating layer and the metal layer in the board. Binding force. At present, horizontal wet processing devices are generally used in circuit board manufacturing. The original processing principle is: according to the production requirements, each wet processing device sprays different chemical liquid or water horizontally through the surface of the circuit board of the wet processing device to complete The board is made by the corresponding wet process. As shown in Fig. 1, a horizontal wet processing apparatus 10 of the prior art includes a liquid ejecting apparatus 110, a processing tank 120 disposed opposite the liquid ejecting apparatus 110, and a processing liquid input apparatus 130 in communication with the processing tank 120. When the circuit board is transferred to the horizontal wet processing device 10 by a plurality of rows of rollers (not shown) disposed between the liquid ejecting device 110 and the corresponding processing tank 120, the processing liquid input device 130 injects the processing liquid into the processing tank 120, and A liquid pumping device (not shown) draws the processing liquid from the processing tank 120 and sprays it onto the surface of the 200934323 circuit board to achieve a liquid chemical treatment or cleaning effect. In addition, some levels/", the clothing device 10 is for water saving purposes, and includes a plurality of processing tanks 12" to connect adjacent processing tanks 12 of the processing tank 12, so that the processing liquid is input into the apparatus 130. The treatment liquid can flow through the plurality of treatments, and the treatment tank (10) (4) is provided with the money device. The money is used in the (four) plate so that the input treatment liquid can be used in multiple times to perform circuit board production. However, since the circuit board enters the horizontal wet process device 1〇 Wet process
，間取决於刖一工序之完成情況，故電路板進行濕製程之 時間不連續，即有部分時間沒有電路板進入該水平濕製程 裝置10進行操作。此時水平濕製程裝置1〇系統並未關閉， 仍然繼續喷灑處理液，而處理液會繼續依次流過各處理槽 並排出。這樣既浪費電又㈣處理液，不能滿足現於電路 板製作中之環保要求。 【發明内容】 o S鑑於此，提供一種濕製程系、統，以節約f源，滿足 環保要求實屬必要。 以下將以實施例說明一種濕製程系統。 该濕製程系統，至少一濕處理裝置、至少一感應器及 至少一控制器，·該感應器用於感應待濕處理物體是否通過 該濕製程系統，並向控制器發出訊號；該控制器與濕處理 裝置及感應器電連接，用於接收感應器發出之訊號，並根 據5亥5fL遠控制濕處理裝置進行濕處理。 與先前技術相比，該濕製程系統設置之感應器感應待 200934323 _ 濕處理物體是否進入濕製程系統，以藉由控制器控制濕處 理裝置開啟與關閉，使濕製程系統於沒有待濕處理物體進 行濕處理時，處於關閉狀態。使用該濕製程系統對待濕處 理物體進行濕處理，可節約資源，滿足環保要求。 【實施方式】 下面將結合附圖及複數實施例對本技術方案實施例提 供之濕製程系統作進一步詳細說明。 ® 請參閱圖2,為本技術方案第一實施例提供之濕製程系 統20，其包括濕處理裝置210、控制器220及感應器230。 該控制器220分別與濕處理裝置210及感應器230電連接。 該濕處理裝置210用於對電路板進行濕製程處理，其 包括喷液裝置211、與喷液裝置211相對設置之處理槽212 及處理液輸入裝置213。該喷液裝置211用於向待濕處理物 體（如：電路板）之表面喷灑由處理液輸入裝置213輸入 ❹之處理液。本實施例中，處理液輸入裝置213將處理液輸 入處理槽212後，喷液裝置211藉由抽液裝置（圖未示） 從處理槽212抽取處理液，利用喷口向待濕處理物體一表 面噴灑處理液進行濕處理，處理後之液體可流回處理槽 212。當然，該喷液裝置211亦可具有相對設置之噴口（圖 未示），用於向待濕處理物體相對兩表面喷灑處理液進行濕 處理。 該處理槽212用於收容處理液，其一側壁設有出液口 2121。該出液口 2121用於排出使用後之廢液，並經過導管 200934323 輸送至廢液處理廠，以防止廢液污染環境。本實施例中， 處理槽212還設有進液口 2122,進液口 2122設於與出液口 2121相對之一侧壁。當然，處理槽212開設進液口 2122 之位置可根據生產需要自由設計，不限於本實施例。 該處理液輸入裝置213可與處理槽212相連通，將處 理液輸入處理槽212;亦可直接與喷液裝置211相連通，使 處理液輸入裝置213直接將處理液輸送至喷液裝置211。本 實施例中，處理液輸入裝置213與處理槽212之進液口 2122 相連通，將處理液輸入處理槽212,以供喷液裝置211藉由 抽液裝置（圖未示）從處理槽212抽取處理液喷灑於待濕 處理物體表面。其中，處理液輸入裝置213内設一進液電 磁閥（圖未示），用於藉由電磁感應使閥門開啟與關閉以控 制處理液輸入裝置213之進液時間與流量。 電路板製作過程中，濕製程可為蝕刻、顯影、鍍金屬、 表面處理或清洗等各種不同之濕處理過程，因此根據不同 0之製作需要，處理液輸入裝置213輸入處理液可為不同濃 度或酸鹼度（即：PH值）之溶液，如鍍液、蝕刻液、顯影 液或其他濕處理所需溶液，亦可為純水、去離子水或其他 清洗需要之處理液，只要能達到製作要求即可。於使用上 述不同溶液進行濕製程時，隨著濕製程進行處理槽212中 溶液之濃度或PH值會發生變化，而濕製程中溶液濃度或 PH值直接影響濕製程之成品率。故該濕製程系統20還可 進一步包括監測系統（圖未示）。該監測系統置於每個處理 槽212中之處理液中，並與控制器220電連接，用於對處 9 200934323 理槽212中之處理液濃度或PH值進行監測，根據監測結果 調整與控制處理液輸入裝置213之處理液輸入參數及喷液 裝置211之喷液參數，如流量，壓力等，以確保濕製程產 品之工藝參數。 該控制器220與濕處理裝置210之喷液裝置211及處 理液輸入裝置213電連接，用於接收感應器230之訊號， 根據訊號控制處理液輸入裝置213之電磁閥與喷液裝置211 開啟與關閉，以及處理液流量與喷灑處理液壓力等。具體 地，該控制器220可根據待濕處理物體之運動速度、濕製 程系統20之長度、濕處理裝置210之長度等數據，計算出 待濕處理物體到達或離開濕製程系統20與濕處理裝置210 之所需時間，並於待濕處理物體到達或離開濕製程系統20 時開啟或關閉處理液輸入裝置213之電磁閥，於待濕處理 物體到達或離開濕處理裝置210時開啟或關閉濕處理裝置 210之喷液裝置211。 該感應器230與控制器220電連接，用於藉由感應判 斷待濕處理物體是否通過感應器230所處於之位置，並發 訊號給控制器220,使控制器220控制喷液裝置211與處理 液輸入裝置213。感應器230為光學感應器、光電感應器或 其他可感應是否有物體通過之感應器。本實施例中，感應 器230為光學感應器，即：藉由感應光學感應器發出之光 束是否改變光路，從而判斷待濕處理物體是否進入或離開 濕製程系統20。本實施例中，濕製程系統20包括一感應器 230，該感應器230設置於濕製程系統20之待濕處理物體 10 200934323 進入端，並與一控制器220電相連，用以感應待濕處理物 體是否進入濕製程系統20。此時，該待濕處理物體離開濕 製程系統20之時間可根據濕製程系統20之長度藉由控制 器220計算出。當然，濕製程系統20還可包括相對設置於 濕製程系統20之待濕處理物體之進入端與離開端之兩感應 器230，分別用於感應待濕處理物體是否進入或離開濕製程 系統20。 如果製作中希望實現以上提到各種不同濕製程連續生 ®產，可連續設置複數濕處理裝置210使其與控制器220電 連接，只要使不同濕處理裝置210之處理液輸入裝置213 根據需要輸入不同處理液，以使待濕處理物體於不同濕處 理裝置210完成不同之濕處理製作。此外，如果濕製程系 統20包括複數濕處理裝置210，該複數濕處理裝置210亦 可使用複數感應器230及控制器220，即：除了於濕處理系 統20之待濕處理物體進入端或離開端設置感應器230以 ◎外，還可於相鄰兩濕處理裝置210之間設置感應器230，以 感應待處理物體進入或離開濕處理系統20及濕處理裝置 210之時間。並且，該感應器230可與一或複數控制器220 電連接，使複數濕處理裝置210藉由同一控制器220控制 或複數控制器220分別控制。 請參閱圖3，為本技術方案第二實施例提供之濕製程系 統30,其結構與第一實施例提供之濕製程系統20之結構基 本相同，其區別在於濕處理裝置310。該濕處理裝置310 包括複數喷液裝置311、與複數喷液裝置311相對設置之複 11 200934323 . 數處理槽312及一處理液輸入裝置313。該複數處理槽312 中相鄰之兩處理槽312藉由導管314相連通，使處理液輸 入裝置313輸入處理液依次流過相連通之各處理槽312,用 於採用相同溶質之溶液對待濕處理物體進行複數次相同溶 液之濕處理操作。相應地，控制器320還可根據濕處理裝 置310之喷液裝置311之長度，計算出待濕處理物體到達 或離開喷液裝置311所需時間，並於待濕處理物體到達或 離開喷液裝置311時開啟或關閉喷液裝置311。 〇 為更準確感應待濕處理物體進入與離開每個喷液裝置 311之時間並控制喷液裝置311，可於相鄰喷液裝置311之 間設置感應器330，即可感應待濕處理物體是否進入或離開 每個喷液裝置311。當然，濕製程系統30還可包括複數控 制器320與感應器330相連分別控制每個或複數喷液裝置 311 ° 本實施例中，濕處理裝置310包括三個喷液裝置311、 ❹與三個喷液裝置311中每個喷液裝置311相對設置之處理 槽312及一感應器330。該喷液裝置311中每個喷液裝置 311於控制器320之控制下，從其對應之處理槽312中抽取 處理液，喷灑於待濕處理物體表面。三個喷液裝置311從 待濕處理物體進入端向離開端依次排列為第一喷液裝置 311a、第二喷液裝置311b與第三喷液裝置311c。相應地， 與三個噴液裝置311相對應設置之三個處理槽312，分別為 第一處理槽312a、第二處理槽312b與第三處理槽312c， 用於收容待喷灑處理液。其中，處理液輸入裝置313與第 12 200934323 .一處理槽312a之進水口 3122相連通，第一處理槽312a與 第二處理槽312b及第二處理槽312b與第三處理槽312c藉 由導管314相連通，使處理液輸入裝置313輸入第一處理 槽312a之處理液依次流經第二處理槽312b與第三處理槽 312c，再經第三處理槽312c之第三出液口 3121排出。該 感應器330設置於濕處理系統30之待濕處理物體進入端。 考慮到許多產品於製作過程中均會用到濕製程，如電 路板製作、半導體晶圓之製作等，為更清楚說明濕製程方 ®法，請參閱圖4，以下將以使用濕製程系統30清洗電路板 40為例進一步詳細說明本實施例提供之濕製程系統30之 使用方法。 首先，根據電路板40之清洗需要、電路板40傳送速 度及路程以及濕製程系統30之長度，向濕處理裝置30之 處理液輸入裝置313輸入裝置注入軟水，並設置控制器320 之參數，以控制處理液輸入裝置313之開與關、軟水輸入 ©量以及喷液裝置311喷灑軟水之時間、壓力等參數。當然， 如果電路板40需要蝕刻、顯影等其他濕處理時，只要根據 濕處理需要設置控制器320對應參數，並將濕處理所需蝕 刻液、顯影液或其他對應處理液注入處理液輸入裝置313 即可。 然後，電路板40傳送至濕製程系統30之感應器330 下方，感應器330感應到電路板40進入濕製程系統30並 向控制器320發出訊號，由控制器320打開處理液輸入裝 置313之電磁閥，使處理液輸入裝置313向第一處理槽311a 13 200934323 . 輸送軟水，並使軟水依次流入第二處理槽311b與第三處理 槽 311c 。 接著，電路板40繼續向前傳送，控制器320根據預設 參數計算出電路板40到達各喷液裝置311下方之時間，以 及離開各喷液裝置311之時間，於電路板40依次被送至第 一喷液裝置311a、第二喷液裝置311b與第三喷液裝置311c 下方時，控制器320分別控制第一喷液裝置311a、第二喷 液裝置311b與第三喷液裝置311c分別抽取收容於第一處 ®理槽312a、第二處理槽312b與第三處理槽312c中之軟水 向電路板40表面喷灑軟水並控制喷灑持續時間，對電路板 40進行濕處理使用後之廢水經第三處理槽312c之出液口 3121排至廢水處理廠。於電路板40分別離開第一喷液裝置 311a、第二喷液裝置311b與第三喷液裝置311c時，關閉相 應之喷液裝置311。 最後，電路板40離開第三喷液裝置311c時，控制器 ◎ 320同時關閉處理液輸入裝置313。 隨後，電路板40可經烘乾以待後續加工使用。當然， 電路板40亦可不烘乾繼續進行下一步濕製程加工，如鍍金 屬、顯影等，可根據生產需要設計。 本實施例僅以濕製程系統30為例介紹其使用方法。可 理解，電路板40亦可使用本技術方案提供之第一實施例之 濕製程系統20進行製作。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 14 200934323 .^获自不能以此限制本案之中請專利範圍。舉凡熟悉本案 •技*之人純依本發明之精神所作之等效修㈣變化 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係先前技術提供之水平濕製程系統之立體結 意圖。 圖2係本技術方案第一實施例提供之濕製程系統之立 體結構示意圖。 圖3係本技術方案第二實施例提供之濕製程系統之立 體結構示意圖。 圖4係本技術方案第二實施例提供之濕製程系統之使 用狀態示意圖。 【主要元件符號說明】 水平濕製程裝置 10 濕製程裝置 20，30 濕處理裝置 210， 310 喷液裝置 110， 211 ， 311 第—噴液裝置 311a 第二噴液裝置 311b 第三噴液裝置 311c 處理; 120， 212 ， 312 第—處理槽 312a 第一處理槽 312b 15 200934323 第三處理槽 312c 出液口 2121 進液口 2122 導管 314 處理液輸入裝置 130， 控制器 220， 感應器 230， 電路板 40 ，3121 ，3122 213 ， 313 320 330 ❹ 〇 16Between the completion of the process, the time during which the board performs the wet process is discontinuous, that is, there is no time for the board to enter the horizontal wet process device 10 for operation. At this time, the horizontal wet process apparatus 1〇 system is not closed, and the treatment liquid is still sprayed, and the treatment liquid continues to flow through the treatment tanks in sequence and is discharged. This wastes electricity and (4) treatment liquid, and cannot meet the environmental protection requirements currently in the production of circuit boards. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a wet process system and system to save f source and meet environmental protection requirements. A wet process system will be described below by way of example. The wet processing system, the at least one wet processing device, the at least one sensor, and the at least one controller, the sensor is configured to sense whether the object to be wet processed passes through the wet processing system, and sends a signal to the controller; the controller and the wet The processing device and the sensor are electrically connected for receiving the signal from the sensor, and performing wet processing according to the 5H 5fL remote control wet processing device. Compared with the prior art, the sensor of the wet process system senses that the 200934323 _ wet processing object enters the wet process system to control the wet processing device to be turned on and off by the controller, so that the wet process system has no object to be wetted. When wet processing is performed, it is turned off. Using the wet process system to wet the wetted objects can save resources and meet environmental requirements. [Embodiment] Hereinafter, a wet process system provided by an embodiment of the present technical solution will be further described in detail with reference to the accompanying drawings and the embodiments. ® Referring to FIG. 2, a wet processing system 20 according to a first embodiment of the present technology includes a wet processing device 210, a controller 220, and an inductor 230. The controller 220 is electrically coupled to the wet processing device 210 and the inductor 230, respectively. The wet processing apparatus 210 is for performing a wet process on a circuit board, and includes a liquid discharge device 211, a processing tank 212 disposed opposite to the liquid discharge device 211, and a processing liquid input device 213. The liquid ejecting apparatus 211 is for spraying the surface of the object to be wet-treated (e.g., a circuit board) with the treatment liquid input from the treatment liquid input unit 213. In this embodiment, after the processing liquid input device 213 inputs the processing liquid into the processing tank 212, the liquid discharging device 211 extracts the processing liquid from the processing tank 212 by using a liquid discharging device (not shown), and uses the nozzle to a surface of the object to be wetted. The treatment liquid is sprayed for wet treatment, and the treated liquid can be returned to the treatment tank 212. Of course, the liquid ejecting device 211 can also have oppositely disposed nozzles (not shown) for spraying the treatment liquid on the opposite surfaces of the object to be wetted. The treatment tank 212 is for accommodating the treatment liquid, and one side wall thereof is provided with a liquid outlet 2121. The liquid outlet 2121 is used for discharging the used waste liquid, and is sent to the waste liquid treatment plant through the conduit 200934323 to prevent the waste liquid from polluting the environment. In the embodiment, the processing tank 212 is further provided with a liquid inlet 2122, and the liquid inlet 2122 is disposed at a side wall opposite to the liquid outlet 2121. Of course, the position at which the processing tank 212 opens the liquid inlet 2122 can be freely designed according to the production needs, and is not limited to the embodiment. The treatment liquid input device 213 can communicate with the treatment tank 212, and can input the treatment liquid into the treatment tank 212. Alternatively, the treatment liquid input device 213 can directly communicate the treatment liquid to the liquid discharge device 211. In this embodiment, the processing liquid input device 213 is in communication with the liquid inlet 2122 of the processing tank 212, and the processing liquid is input into the processing tank 212, so that the liquid discharging device 211 is discharged from the processing tank 212 by a liquid discharging device (not shown). The extraction treatment liquid is sprayed on the surface of the object to be wetted. The processing liquid input device 213 is provided with an inlet solenoid valve (not shown) for opening and closing the valve by electromagnetic induction to control the timing and flow rate of the processing liquid input device 213. During the manufacturing process of the circuit board, the wet process can be various wet processing processes such as etching, developing, metallizing, surface treatment or cleaning. Therefore, according to different manufacturing requirements, the processing liquid input device 213 can input different processing liquids or A solution of pH (ie, pH), such as a plating solution, an etching solution, a developing solution, or other solution required for wet processing, may also be pure water, deionized water, or other treatment liquid required for cleaning, as long as the production requirements are met. can. When the wet process is carried out using the above different solutions, the concentration or pH of the solution in the treatment tank 212 changes as the wet process progresses, and the solution concentration or pH value in the wet process directly affects the yield of the wet process. Therefore, the wet processing system 20 can further include a monitoring system (not shown). The monitoring system is placed in the processing liquid in each processing tank 212, and is electrically connected to the controller 220 for monitoring the concentration or pH of the treatment liquid in the processing unit 2009 200934323, and adjusting and controlling according to the monitoring result. The treatment liquid input parameters of the treatment liquid input device 213 and the liquid discharge parameters of the liquid discharge device 211, such as flow rate, pressure, etc., are used to ensure the process parameters of the wet process product. The controller 220 is electrically connected to the liquid discharging device 211 and the processing liquid input device 213 of the wet processing device 210 for receiving the signal of the sensor 230, and is connected to the electromagnetic valve and the liquid discharging device 211 according to the signal control processing liquid input device 213. Shutdown, as well as treatment fluid flow and spray treatment fluid pressure. Specifically, the controller 220 can calculate, according to data such as the moving speed of the object to be wet processed, the length of the wet processing system 20, the length of the wet processing device 210, etc., the wet processing object arrives or leaves the wet processing system 20 and the wet processing device. The required time of 210, and the electromagnetic valve of the processing liquid input device 213 is turned on or off when the object to be wetted reaches or leaves the wet processing system 20, and the wet processing is turned on or off when the object to be wetted reaches or leaves the wet processing device 210. The liquid discharge device 211 of the device 210. The sensor 230 is electrically connected to the controller 220 for determining whether the object to be wet processed passes through the position of the sensor 230 by sensing, and sends a signal to the controller 220, so that the controller 220 controls the liquid discharging device 211 and the processing liquid. Input device 213. The sensor 230 is an optical sensor, a photoelectric sensor or other sensor that senses the passage of an object. In this embodiment, the sensor 230 is an optical sensor, that is, whether the light beam emitted by the sensing optical sensor changes the optical path, thereby determining whether the object to be wet processed enters or leaves the wet processing system 20. In this embodiment, the wet processing system 20 includes a sensor 230 disposed at the inlet end of the wet processing system 20 to be wet processed object 10 200934323, and electrically connected to a controller 220 for sensing the wet processing. Whether the object enters the wet process system 20. At this time, the time at which the object to be wetted away from the wet process system 20 can be calculated by the controller 220 according to the length of the wet process system 20. Of course, the wet processing system 20 can also include two sensors 230 disposed opposite the inlet and exit ends of the wet processing system 20 to be wet-processed, respectively, for sensing whether the object to be wet-processed enters or exits the wet processing system 20. If it is desired to realize the various wet process continuous productions mentioned above in the production, the plurality of wet processing devices 210 may be continuously disposed to be electrically connected to the controller 220, as long as the processing liquid input devices 213 of the different wet processing devices 210 are input as needed. Different treatment liquids are used to complete the wet processing of the objects to be wet treated in different wet processing apparatuses 210. In addition, if the wet process system 20 includes a plurality of wet processing devices 210, the plurality of wet processing devices 210 can also use the plurality of sensors 230 and the controller 220, that is, the inlet or exit end of the object to be wet-processed except for the wet processing system 20. The inductor 230 is disposed to be disposed outside the adjacent wet processing device 210 to sense the time when the object to be processed enters or leaves the wet processing system 20 and the wet processing device 210. Moreover, the sensor 230 can be electrically coupled to the one or more controllers 220 such that the plurality of wet processing devices 210 are controlled by the same controller 220 or by the plurality of controllers 220, respectively. Referring to FIG. 3, a wet process system 30 according to a second embodiment of the present invention has the same structure as that of the wet process system 20 provided in the first embodiment, and is different in the wet processing device 310. The wet processing apparatus 310 includes a plurality of liquid ejecting apparatuses 311, a plurality of processing units 312 opposed to the plurality of liquid ejecting apparatuses 311, and a processing liquid input unit 313. The two adjacent processing tanks 312 of the plurality of processing tanks 312 are connected by a conduit 314, so that the processing liquid input device 313 inputs the processing liquid to sequentially flow through the respective processing tanks 312 for treating the wet treatment with the same solute solution. The object is subjected to a plurality of wet processing operations of the same solution. Correspondingly, the controller 320 can also calculate the time required for the object to be wetted to reach or leave the liquid discharging device 311 according to the length of the liquid discharging device 311 of the wet processing device 310, and reach or leave the liquid discharging device at the object to be wet processed. At 311 hours, the liquid discharge device 311 is turned on or off. 〇 In order to more accurately sense the time when the wet processing object enters and leaves each liquid ejecting device 311 and controls the liquid ejecting device 311, an inductor 330 may be disposed between the adjacent liquid ejecting devices 311 to sense whether the object to be wet processed is Enter or leave each spray device 311. Of course, the wet processing system 30 may further include a plurality of controllers 320 coupled to the inductors 330 to control each of the plurality of liquid ejecting devices 311 °. In this embodiment, the wet processing device 310 includes three liquid ejecting devices 311, ❹ and three Each of the liquid ejecting devices 311 is disposed opposite to the processing tank 312 and an inductor 330. Each of the liquid ejecting devices 311 in the liquid ejecting apparatus 311 is controlled by the controller 320 to extract the processing liquid from the corresponding processing tank 312 and spray it on the surface of the object to be wetted. The three liquid ejecting devices 311 are sequentially arranged from the entry end to the exit end of the object to be wet treated into a first liquid ejecting apparatus 311a, a second liquid ejecting apparatus 311b, and a third liquid ejecting apparatus 311c. Correspondingly, the three processing tanks 312 disposed corresponding to the three liquid ejecting devices 311 are respectively a first processing tank 312a, a second processing tank 312b and a third processing tank 312c for receiving the liquid to be sprayed. The processing liquid input device 313 is in communication with the water inlet 3122 of the processing zone 312a of the 12th 200934323. The first processing tank 312a and the second processing tank 312b and the second processing tank 312b and the third processing tank 312c are connected by the conduit 314. In parallel, the processing liquid input into the first processing tank 312a by the processing liquid input device 313 sequentially flows through the second processing tank 312b and the third processing tank 312c, and is discharged through the third liquid discharging port 3121 of the third processing tank 312c. The inductor 330 is disposed at the entry end of the wet processing system 30 to be wet treated. Considering that many products use wet processes in the manufacturing process, such as circuit board fabrication, semiconductor wafer fabrication, etc., to more clearly illustrate the wet process method, please refer to Figure 4, the following will use the wet process system 30 The cleaning circuit board 40 is taken as an example to further explain the method of using the wet processing system 30 provided by the embodiment. First, according to the cleaning needs of the circuit board 40, the transmission speed and distance of the circuit board 40, and the length of the wet processing system 30, soft water is injected into the input device of the processing liquid input device 313 of the wet processing device 30, and the parameters of the controller 320 are set to The parameters of the opening and closing of the processing liquid input device 313, the amount of soft water input, and the time and pressure at which the liquid discharging device 311 sprays soft water are controlled. Of course, if the circuit board 40 needs other wet processing such as etching, development, etc., the corresponding parameters of the controller 320 are set according to the wet processing requirements, and the etching liquid, the developing solution or other corresponding processing liquid required for the wet processing is injected into the processing liquid input device 313. Just fine. Then, the circuit board 40 is transferred to the underside of the sensor 330 of the wet process system 30. The sensor 330 senses that the circuit board 40 enters the wet process system 30 and sends a signal to the controller 320. The controller 320 turns on the electromagnetic of the process liquid input device 313. The valve causes the treatment liquid input device 313 to deliver soft water to the first treatment tank 311a 13 200934323. The soft water is sequentially flowed into the second treatment tank 311b and the third treatment tank 311c. Then, the circuit board 40 continues to transmit forward, and the controller 320 calculates the time when the circuit board 40 reaches the respective liquid ejecting devices 311 according to the preset parameters, and the time of leaving the respective liquid ejecting devices 311, and is sequentially sent to the circuit board 40 to the circuit board 40. When the first liquid ejecting apparatus 311a, the second liquid ejecting apparatus 311b, and the third liquid ejecting apparatus 311c are below, the controller 320 controls the first liquid ejecting apparatus 311a, the second liquid ejecting apparatus 311b, and the third liquid ejecting apparatus 311c, respectively. The soft water contained in the first treatment tank 312a, the second treatment tank 312b and the third treatment tank 312c sprays soft water on the surface of the circuit board 40 and controls the spraying duration, and the wastewater after the wet treatment of the circuit board 40 is used. The liquid outlet 3121 of the third treatment tank 312c is discharged to the wastewater treatment plant. When the circuit board 40 leaves the first liquid ejecting apparatus 311a, the second liquid ejecting apparatus 311b, and the third liquid ejecting apparatus 311c, respectively, the corresponding liquid ejecting apparatus 311 is closed. Finally, when the circuit board 40 leaves the third liquid ejecting apparatus 311c, the controller ◎ 320 simultaneously turns off the processing liquid input unit 313. Subsequently, the circuit board 40 can be dried for use in subsequent processing. Of course, the circuit board 40 can also be subjected to the next wet process without drying, such as metal plating, development, etc., and can be designed according to production needs. This embodiment only describes the method of using the wet processing system 30 as an example. It will be appreciated that the circuit board 40 can also be fabricated using the wet process system 20 of the first embodiment provided by the present technical solution. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention 14 200934323 . ^ can not be used to limit the scope of the patent in this case. Any changes made in the spirit of the invention in accordance with the spirit of the present invention should be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a horizontal wet process system provided by the prior art. Fig. 2 is a schematic view showing the structure of a wet process system according to a first embodiment of the present technical solution. Fig. 3 is a schematic view showing the structure of a wet process system according to a second embodiment of the present technical solution. Fig. 4 is a schematic view showing the state of use of the wet process system provided by the second embodiment of the present technical solution. [Main component symbol description] Horizontal wet processing device 10 Wet processing device 20, 30 Wet processing device 210, 310 Liquid discharging device 110, 211, 311 First liquid discharging device 311a Second liquid discharging device 311b Third liquid discharging device 311c Processing 120, 212, 312 first processing tank 312a first processing tank 312b 15 200934323 third processing tank 312c liquid outlet 2121 liquid inlet 2122 conduit 314 processing liquid input device 130, controller 220, sensor 230, circuit board 40 ,3121,3122 213 , 313 320 330 ❹ 〇16