200933850 26542twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種導線架以及封裝結構，且特別是 有關於一種可改善溢膠問題的導線架以及封裝結構。 【先前技術】 在半導體產業中，積體電路(integrated circuits，1C)的 生產主要可分為三個階段：積體電路的設計(jC design)、 積體電路的製作（IC process)及積體電路的封裝（ic package) ° 在積體電路的封裝令，裸晶片是先經由晶圓(wafer)製 作、電路設計、光罩製作以及切割晶圓等步驟而完成，而 每一顆由晶圓切割所形成的裸晶片，經由裸晶片上之銲墊 (bonding pad)與封褒基材(substrate)電性連接’再以封裝膠 體(molding compound)將裸晶片加以包覆，以構成一晶片封 裝(chip package)結構。封裝的目的在於，防止裸晶片受到 外界溫度、濕氣的影響以及雜塵污染，並提供裸晶片與外 部電路之間電性連接的媒介。 ^ 請參考圖1，其繪示習知之一種晶片封裝結構的剖面 示意圖。習知晶片封裝結構1〇〇包括一晶片11〇、_導線 架(lead frame)120、多個焊線(bonding wire)130 與一封裝膠 體140。導線架120具有一晶片座(die pad)122與多個引腳 (lead)124 ’且晶片11〇配置於晶片座122上。另外，晶片 110可猎由這些焊線130的其中之一而電性連接至導線竿 5 26542tw£doc/n 200933850 120之這些⑽124的其中之一。封裝膝體14〇則包覆晶 片110、這些焊線130、晶片座122與各個引腳124之一部 分，而且晶片座122的下表面12ι裸露於封襞膠體14〇的 底部。此種封裝結構為利用使晶片座122外露，來提高散 熱效果。 然而’在實際注入封膠而完成晶片封裝結構時，封裝 膠體140容易會在晶片座122的下表面121上形成溢膠 ❹ （flush)現象(如圖2所示），使得在晶片座122的下表面121 會附著有多餘的封膠材料，而其不僅會影響散熱效果，且 因而必須另外耗費去除溢膠的步驟與時間。 由上述可知’習知晶片封裝結構100實有改進之必要 性。 【發明内容】 有鑑=此’本發明的目的就是在提供一種導線架，具 有防溢膠環以避免封裝膠體在裸露出的晶片承載板表面上 產生溢膠污染的現象。 本發明的又—目的是提供一種封裝結構，能夠避免習 知封裝結構的鄉問題，錢散熱功解受到影響。 本發明的另一目的是提供一種封裝結構，能夠避免產 生溢膠且可具有優異的散熱功效。 基於上述目的，本發明提出一種導線架’包括：一晶 片座以及多個弓丨腳。晶片座包含一承載板與一防溢膠環， 其中承載板具有用以承載晶片的一上表面與相對應的一下 6 200933850 26542twf.doc/n 表面，而防溢膠環配置在承載板的下表面的外圍。 腳為環繞在晶片座的周圍。 一 依照本發明的實施例所述之導線架，上述之 防溢膠環的材質為金屬。 、 Ο 依照本發明的實施例所述之導線架，上述之 ，材質為高分子材料。此時’防鱗環是_黏貼方^固 者於承載板上。而且，承載板的材質為金屬。 依照本發明的實施例所述之導線架，上述的這些引腳 的材質為金屬。 一基於上述目的，本發明另提出一種封裝結構，包括· 一晶片座、環繞在晶片座的周圍的多個引腳、一曰 一封裝膠體。其中，晶片座包含一 日日月以及 承載板的外圍。晶片配置在相對應防溢 則並電性連接至這些引腳。封裝膠體 則疋至V包覆4、至少部分的這些引腳與至 片座’且稞露出防溢膠環所圍出之區域内的承 = 依照本發明的實施例所述之封裝結構，i之承載板 與防溢膠環的㈣為金屬。 4之承載板 π依，本發明的實施例所述之封裝結構，上述之防溢膠 %的材質為南分子材料。防溢膠環的材質為高 / ===綱糊祕細上。而且， 料綱紅封裝賴，均的這些引 7 26542twf.doc/nBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame and a package structure, and more particularly to a lead frame and a package structure which can improve the problem of overflow. [Prior Art] In the semiconductor industry, the production of integrated circuits (1C) can be mainly divided into three stages: design of integrated circuits (jC design), fabrication of integrated circuits (IC processes), and integrated circuits. Circuit package (ic package) ° In the package of the integrated circuit, the bare die is completed by the steps of wafer fabrication, circuit design, mask fabrication, and wafer dicing, and each wafer is processed. Cutting the formed bare wafer, electrically connecting to the sealing substrate via a bonding pad on the bare wafer, and then coating the bare wafer with a molding compound to form a chip package (chip package) structure. The purpose of the package is to protect the bare wafer from external temperature, moisture, and dust contamination, and to provide a medium for electrical connection between the bare die and the external circuitry. Please refer to FIG. 1, which is a cross-sectional view showing a conventional chip package structure. The conventional chip package structure 1 includes a wafer 11A, a lead frame 120, a plurality of bonding wires 130, and an encapsulant 140. The lead frame 120 has a die pad 122 and a plurality of leads 124' and the wafer 11 is disposed on the wafer holder 122. In addition, the wafer 110 can be electrically connected to one of the wires (10) 124 of the wire 竿 5 26542 tw/n 200933850 120 by one of the bonding wires 130. The package body 14 is then covered with the wafer 110, the wire 130, the wafer holder 122 and a portion of each of the leads 124, and the lower surface 12 of the wafer holder 122 is exposed to the bottom of the sealant 14". Such a package structure is used to expose the wafer holder 122 to improve the heat dissipation effect. However, when the encapsulation structure is actually injected to complete the wafer package structure, the encapsulant 140 tends to form a flood phenomenon on the lower surface 121 of the wafer holder 122 (as shown in FIG. 2), so that the wafer holder 122 is The lower surface 121 is attached with excess sealant material, which not only affects the heat dissipation effect, but must additionally consume steps and time to remove the glue. From the above, it is known that the conventional chip package structure 100 is in need of improvement. SUMMARY OF THE INVENTION It is an object of the present invention to provide a lead frame having an anti-overflow rubber ring to prevent the encapsulant from being contaminated on the surface of the exposed wafer carrier. Still another object of the present invention is to provide a package structure that avoids the problems of the conventional package structure and that the heat dissipation solution is affected. Another object of the present invention is to provide a package structure capable of avoiding the occurrence of overflow and having excellent heat dissipation. Based on the above object, the present invention provides a lead frame 'includes: a wafer holder and a plurality of arch legs. The wafer holder comprises a carrier plate and an anti-overflow rubber ring, wherein the carrier plate has an upper surface for carrying the wafer and a corresponding surface of the third layer 200933850 26542twf.doc/n, and the anti-overflow rubber ring is disposed under the carrier plate The periphery of the surface. The feet are wrapped around the wafer holder. A lead frame according to an embodiment of the present invention, wherein the anti-overflow rubber ring is made of metal. The lead frame according to the embodiment of the present invention is made of a polymer material. At this time, the anti-scaling ring is _sticking on the carrier board. Moreover, the material of the carrier plate is metal. According to the lead frame of the embodiment of the invention, the pins are made of metal. In view of the above, the present invention further provides a package structure comprising: a wafer holder, a plurality of pins surrounding the wafer holder, and a package encapsulant. The wafer holder includes a day and a month and a periphery of the carrier board. The wafer is configured to be over-cored and electrically connected to these pins. The encapsulant colloids to the V-clad 4, at least some of these pins and the package to the pedestal 'and the exposed area of the anti-overfill rubber ring. </ RTI> according to the embodiment of the present invention, i The (four) of the carrier plate and the anti-overflow rubber ring are metal. The carrier structure of the embodiment of the present invention is characterized in that the material of the above-mentioned anti-overfilling material is a south molecular material. The material of the anti-overflow rubber ring is high / ===. Moreover, the material red package Lai, the average of these cited 7 26542twf.doc / n
200933850 依照本發明的實施例所述之封裝結構， 線，其分接晶片與這些⑽的1。l括夕條悍 依照本發明的實施例所述之封裝結構，一— 層，其配置於晶片與承載板之間。 一黏者 基於上述目的，本發明另提出一種封裝結構， 一晶片座、環繞在晶片座的周圍的多個引腳、一曰 一封裝勝體。晶片座包含-承載板，而晶片^ 防溢膠環-侧的承載板上，並電性連接至這4b^相= 膠體則是至少包覆晶片、至少部分的這钟腳*至 的晶片座’且封裝㈣暴露出承載板的下表面，且 體的下表面與承載板的下表面具有一高度差。 t， 依照本發明的實施例所述之封裝結構，上述之 與防溢膠環的材質為金屬。 秋敗 依照本發明的實施例所述之封裝結構，上述的 腳的材質為金屬。 1 依照本發明的實施例所述之封裝結構，更包括多條焊 線其刀別連接晶片與這些引腳的一端。 依照本發明的實施例所述之封裝結構，更包括一黏著 層，其配置於晶片與承載板之間。 本發明的結構可藉由防溢膠環的設計，以有效改善習 知封裝結構的溢膠現象，而不需耗費額外的時間來清除溢 出的封膠材料。另外’由於本發明可避免所謂的溢膠現象， 因此可確保整個結構的散熱功效不會因溢膠問題而受到影 200933850 26542twf.doc/n 明如下 為讓本發明之上述和其他目的、特徵和優點 易懂’下靖舉較佳實關，並配合所_式”，作 【實施方式】 以下將列舉多個封裝結構以進一步說明本發明，但這 些例子並非用以限定本發明的範圍。 ❹-圖3為依照本發明之一實施例所繪示的封裝結構的剖 面示意圖，此封裝結構内含本發明的導線架。 請參照圖3，封裝結構300包括導線架31〇、晶片312 以及封裝膠體314。其中，導線架310包含一晶片座3〇6 以及多個引腳308，而這些引腳308環繞在晶片座3〇6的 周圍。引腳308的材質例如是銅或其他合適之金屬。 本實施例的晶片座306包令—承載板304與一防溢膠 環302。承載板304具有用以承載晶片的一上表面3〇5&與 相對應的一下表面305b’而防溢膠環302則配置在承載板 〇 304的下表面305b的外圍。承上述，承載板304與防溢膠 環302的材質為相同的金屬材料，其可例如是利用沖壓成 型方式所製成，以形成一體成型的結構，或是由化學钮刻 方式形成。另外，晶片座306可以是藉由將防溢膠環302 以黏貼方式固著於承載板304上而構成，此時承載板304 的材質可為金屬材料，而防溢膠環302的材質可例如是聚 醯亞胺(poly-imide，PI)或環氧樹腊(epoxy resin)等高分子材 料。 26542twf.doc/n 200933850 本實施例的晶片312上可配置有多個焊塾 311(bonding pad)，而晶片M2是配置在相 302 —侧的承載板304上，亦即是配置在承載板3〇4的上 表面305a。在一實施例中，在晶片3U與承載板3〇4之門 可配置有一黏著層3Π ’而晶片312可藉由此黏著層3^ 而貼附在承載板304上。此黏著層313的材料例如是銀膠 (silverpaste)。另外，本實施例的封裝結構3〇〇還可更包括 多條焊線316。每一條烊線316為連接晶片312的烊墊3n 與這些引腳308的一端，以使晶片312電性連接這些引腳 308的其中之一。焊線316的材質例如是金或其他;適之 導電材料。 另外，封裝膠體314則是至少包覆晶片312、至少部 分的這些引腳308與至少部分的晶片座306。而且，封裝 膠體314還裸露出防溢膠環302所圍出之區域内的承載板 304的表面(下表面305b)。封裝膠體314的材質為環氧樹 脂或其他合適之高分子材料。 特別要說明的是，本實施例的結構可藉由防溢膠環 302的設計，而其可使得習知封裝結構會產生溢膠的問題 獲得改善，且可幫助提高散熱的功效。 詳言之，請參照圖4，其為圖3之封裝結構的底部示 意圖。如圖4所示，在注入封裝膠體時，防溢膠環3〇2可 具備阻擋封裝膠體溢出的功能，而可避免封裝膠體污染承 載板304表面’且可提高散熱功效。當然’在實際應用時， 防溢膠環302的表面或許會附著有相當稀少的膠體材料， 26542twf.d〇c/i ❹ 〇 200933850 然其並不會造成封裝膠體污染承載板304表面的問題。 另一方面，請參照圖5，其為依照本發明之另一實施 例所繪示的封裝結構的到面示意圖。在圖5中，與圖4中 相同之構件給予相同之標號，並省略可能重覆之說明。若 ，溢膠環如2是以黏貼方式而固著於承載板3〇4上，則在 完成封裝後亦可將防溢膠環3〇2自承載板綱上移除。如 圖5所不，在移除防溢膠環302之後，封裝結構500的封 裝膠體314的下表面與承载板3〇4的下表面3〇外具有 度差h。 細上所述，本發明的結構藉由防溢膠環的設計，可以 有效改善f知封餘構的祕現象，因而不需再另外耗費 時間來清除溢出的封膠材料。另外，由於本發明的結構可 改善所謂觀| ’目此可確絲舰 會因溢膠問題而受到影響。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離 和範圍内1可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 ， 【圖式簡單說明】 之-種晶片封襄結構的剖面示意圖。 圖2為圖1之封裝結構的底部示意圖。 圖3為依照本發明之一實施例 一 面示意圖。 冰—的封裝結構的剖 11 26542twf.doc/n 200933850 圖4為圖3之封裝結構的底部示意圖。 圖5為依照本發明之另一實施例所繪示的封裝結構的 剖面示意圖。 【主要元件符號說明】 100 :晶片封裝結構 110、312 :晶片 120、310 :導線架 ® 121、305b :下表面 122、306 :晶片座 124、308 :引腳 130、316 :焊線 140、314 :封裝膠體 300、500 :封裝結構 302 :防溢膠環 304 :承載板 G 305a:上表面 311 :焊墊 313 :黏著層 12200933850 A package structure, line according to an embodiment of the invention, which taps the wafer with one of these (10). A package structure according to an embodiment of the invention, a layer disposed between the wafer and the carrier. A Sticker Based on the above object, the present invention further provides a package structure, a wafer holder, a plurality of pins surrounding the wafer holder, and a package. The wafer holder comprises a carrier plate, and the wafer is on the side of the adhesive tape-side carrier, and is electrically connected to the 4b^ phase=colloid is at least partially covered by the wafer, at least part of the foot* And the package (4) exposes the lower surface of the carrier plate, and the lower surface of the body has a height difference from the lower surface of the carrier plate. According to the package structure of the embodiment of the present invention, the material of the anti-overflow rubber ring is metal. Autumnal Failure According to the package structure of the embodiment of the present invention, the above-mentioned foot is made of metal. A package structure in accordance with an embodiment of the present invention further includes a plurality of solder wires that connect the wafer to one end of the pins. The package structure according to the embodiment of the present invention further includes an adhesive layer disposed between the wafer and the carrier. The structure of the present invention can be designed to effectively improve the overflow of the conventional package structure by the design of the anti-overfill rubber ring, without requiring extra time to remove the overflow sealant material. In addition, since the present invention can avoid the so-called overflow phenomenon, it can be ensured that the heat dissipation effect of the entire structure is not affected by the problem of overflowing glue. The above and other objects, features and the like of the present invention are as follows. Advantages and advantages of the present invention are set forth in the following description, and are not intended to limit the scope of the present invention. - Figure 3 is a cross-sectional view of a package structure in accordance with an embodiment of the present invention, the package structure including the lead frame of the present invention. Referring to Figure 3, the package structure 300 includes a lead frame 31, a wafer 312, and a package. The lead frame 310 includes a wafer holder 3〇6 and a plurality of pins 308 surrounded by the wafer holder 3〇6. The material of the lead 308 is, for example, copper or other suitable metal. The wafer holder 306 of the present embodiment includes a carrier plate 304 and a spill-proof rubber ring 302. The carrier plate 304 has an upper surface 3〇5& and a corresponding lower surface 305b' for carrying the wafer. The overflow rubber ring 302 is disposed on the outer periphery of the lower surface 305b of the carrier plate 304. The above-mentioned carrier material 304 and the anti-overflow rubber ring 302 are made of the same metal material, which can be formed, for example, by stamping. To form an integrally formed structure, or to form a chemical button. Alternatively, the wafer holder 306 may be formed by attaching the anti-overflow rubber ring 302 to the carrier plate 304 by adhesive bonding. The material may be a metal material, and the material of the anti-overflow rubber ring 302 may be, for example, a polymer material such as poly-imide (PI) or epoxy resin. 26542twf.doc/n 200933850 This embodiment The wafer 312 of the example may be provided with a plurality of bonding pads 311, and the wafer M2 is disposed on the carrier plate 304 on the side of the phase 302, that is, disposed on the upper surface 305a of the carrier plate 3〇4. In one embodiment, an adhesive layer 3' can be disposed on the gate of the wafer 3U and the carrier 3〇4, and the wafer 312 can be attached to the carrier 304 by the adhesive layer 3. The material of the adhesive layer 313 is, for example, It is a silver paste. In addition, the package structure 3 of this embodiment The wire may further include a plurality of bonding wires 316. Each of the wires 316 is a pad 3n for connecting the wafer 312 and one end of the pins 308, so that the wafer 312 is electrically connected to one of the pins 308. The material of 316 is, for example, gold or other; suitable conductive material. In addition, the encapsulant 314 is at least partially covered with the wafer 312, at least part of the pins 308 and at least part of the wafer holder 306. Moreover, the encapsulant 314 is also exposed. The surface (lower surface 305b) of the carrier plate 304 in the area enclosed by the overflow resistant rubber ring 302. The encapsulant 314 is made of epoxy resin or other suitable polymer material. In particular, the structure of the present embodiment can be improved by the design of the anti-overflow rubber ring 302, which can improve the problem that the conventional package structure can produce glue overflow, and can help improve the heat dissipation effect. In detail, please refer to FIG. 4, which is a bottom view of the package structure of FIG. As shown in Fig. 4, when the encapsulant is injected, the anti-overflow rubber ring 3〇2 can have the function of blocking the overflow of the encapsulant, and the encapsulant colloid can be prevented from contaminating the surface of the carrier plate 304 and the heat dissipation effect can be improved. Of course, in practical applications, the surface of the anti-overfill rubber ring 302 may be attached with a relatively rare colloidal material, 26542 twf.d〇c/i ❹ 〇 200933850, but it does not cause the encapsulant to contaminate the surface of the carrier plate 304. On the other hand, please refer to FIG. 5, which is a schematic cross-sectional view of a package structure according to another embodiment of the present invention. In FIG. 5, the same members as those in FIG. 4 are given the same reference numerals, and the description of the possible repetition is omitted. If the adhesive ring is adhered to the carrier plate 3〇4 by means of adhesive bonding, the anti-overflow rubber ring 3〇2 can also be removed from the carrier plate after the package is completed. As shown in FIG. 5, after the anti-overfill rubber ring 302 is removed, the lower surface of the encapsulant 314 of the package structure 500 has a degree difference h from the lower surface 3 of the carrier plate 3〇4. As described in detail, the structure of the present invention can effectively improve the secret phenomenon of the residual structure by the design of the anti-overflow rubber ring, so that no additional time is required to remove the overflow sealing material. In addition, since the structure of the present invention can improve the so-called view, it is believed that the ship will be affected by the overflow problem. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the scope and scope of the invention. The scope defined in the appended patent application shall prevail. [Simplified illustration of the drawing] A schematic cross-sectional view of a wafer sealing structure. 2 is a bottom schematic view of the package structure of FIG. 1. Figure 3 is a schematic illustration of an embodiment of the invention. Ice-packaged structure section 11 26542twf.doc/n 200933850 Figure 4 is a bottom schematic view of the package structure of Figure 3. FIG. 5 is a cross-sectional view of a package structure in accordance with another embodiment of the present invention. [Main component symbol description] 100: chip package structure 110, 312: wafer 120, 310: lead frame® 121, 305b: lower surface 122, 306: wafer holder 124, 308: pins 130, 316: bonding wires 140, 314 : encapsulant 300, 500: package structure 302: anti-overflow rubber ring 304: carrier plate G 305a: upper surface 311: pad 313: adhesive layer 12