TW200932932A - Surface treatment method for electronic apparatus casing (III) - Google Patents

Surface treatment method for electronic apparatus casing (III) Download PDF

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Publication number
TW200932932A
TW200932932A TW97102007A TW97102007A TW200932932A TW 200932932 A TW200932932 A TW 200932932A TW 97102007 A TW97102007 A TW 97102007A TW 97102007 A TW97102007 A TW 97102007A TW 200932932 A TW200932932 A TW 200932932A
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Taiwan
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layer
treatment method
electronic device
coating
surface treatment
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TW97102007A
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Chinese (zh)
Inventor
Cheng-Chien Hsu
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Cheng-Chien Hsu
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Priority to TW97102007A priority Critical patent/TW200932932A/en
Publication of TW200932932A publication Critical patent/TW200932932A/en

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Abstract

The present invention relates to a surface treatment method for an electronic apparatus casing (III). The surface of the transparent substrate is processed with a sputtering treatment to produce a sputtering layer, and the transparent substrate and the sputtering layer then are simultaneously processed with a spray painting to produce a cladding layer. Accordingly, the surface of the transparent substrate does not only have metallic feeling of the high compact thin film, but also has a visual effect of light transmittance.

Description

200932932 .九、發明說明: 【發明所屬之技術領域】 【先前技術】 採用二量化以及便於生產與製造’其外殼大多 成因ί塑概覺ί觸 5良好的視覺美感與質感,便透過塑膠電鍍的方J置 方ί上===6,=鑛方式在塑膠外殼表面產^金屬層的 式如吴国專利弟6,〇 4 5,8 6 6所揭露。 不节t Γί狀歸電鑛方式麟上之金屬勒僅能為銅、錄等較 ί ϊΐίΐγ”以塑膠電鑛方式上使用如链,等較活潑之金屬 才 _肢^又歸電財式本身所 、繁以至於生產上效率低且所耗f之成本高。心队為復雜 Ο 爲解決塑膠電錄方式之問題,因此美國專 4號,揭露了-種通過熱噴塗方式,在塑9 3 環境二接與外界環境相接觸’以至於容易與 揭 ί;;? 面具有紹或齡金塗層之塑膠殼體進行祕處理。層亚制表 缺失ϊΐίί熱喷塗或電料方式於賴時,為確實存在下列問題與 為金彥=質1熱噴塗或電鑛等方式後,整個塑膠材質—入志 而5上=式大多適用於不透光之塑膠材質, 著消費再者i j以及隧者電子產品市場的強烈鞔爭,單純多樣 200932932 .作的,屬表面已無法滿足消費者需求。 【發明内容】 、 明以:關資料,經由多 修改,始設計出此種使:子經由不斷試作及 的電子裝置外殼之表面 Λ启好ίί明之主要目的在於··透日材之表面進行麟處理,於透明 =,於透明底_層表面產生一層可 達丨兼/、金屬貝感與可透光之實用進步性。 【實施方式】 圖就的及功效’本發明所採用之技術手段及構造,齡 ίϊΓιΐ封清加朗其龍與摘如下,俾概全了解。 〇 圖、^程 二二四_示’係為本發明較佳實施例之流程 驟進士:,、一/、二,由圖中可清楚看出本發明係依照下列步 5|: f月底材Α表面以濺鍍處理Β產生濺鍍層c ; 於口^^與濺錄層C同時以噴漆處理D產生披覆層E。 ,時’首先針對透明底材A之頂面進行滅鑛處理B 屬之透明底材A,於透明底材A頂面便會形成具有金 貝感3 -,果之顯層c,該舰層。可為紅銅、黃銅、鈦合金 透先商標、圖形、文字或圖文的濺鑛層C,或賴 又处3L-1、-包圍有透光之商標、圖形、文字或圖文的顏層c ° 接者i過鱗處理D之方式,於透明紐A與麟層C表面產生 6 200932932 .一層可透光之彼覆層Ε,以 .避免遭灰塵、懸浮顆粒或異物& Ε保護透明底材Α以及贿層c, . 又上述步驟(1 0)之減梦. 鑛、三極式濺鍍、磁控機錢:ϋ可為真空賤錢、平面兩極式;賤 茲以真空濺鍍舉例說明如下··…’賤鍍、射頻濺鍍等濺鍍處理技術, 真空;賤鍍:將加速的離子轟擊 交換動量之後’就會期體表面^ 表面的原子 上裝載的是乾材,妹多為紅鋼、^子奸2成賤射,而通常陰極 ’而陽極上裝載的則是待_,待鑛物可銘、鎂等金屬材質 魯 其令,陰極所加之電壓對於=而二^陰極加,百伏特電壓, 加速往陰極表面飛去。的’因而游離的氬正離子被 原子被撞擊出而=置;;材表面 表面形成厚度最大為0 · 〇〇 i =二材,表面’以使基材 面產生金屬光澤與質感之視覺域,错此,可於基材表 塗料’針;;妙mu:,貝漆處理〇可為uv嘴漆或紫外線硬化 始上====說=内含=合物、單體、光聚合開 ο 黏度反應的-種稀釋劑,而光聚合 奸聚合反細過程級照射料_,找合開始劑就會變 基,這種回應接近於預聚合物、單體的聚合性雙重結合(不飽 =),錄重結合部分姓活性化魏㈣賴狀結合,連鎖聚合 形成了網目構造、達到了硬化的過程。 閱第一、五、六、七圖所示,係為本發明較佳實施例之流程 =、本發明再一較佳實施例之流程示意圖一、二與三,由圖中可清楚 看出本發明係依照下列步驟進行: (1〇)透明底材A表面以濺鍍處理B產生濺鍍層c ; (1 1)透明底材A與濺鍍層C同時以噴漆處理D產生彼覆層E。 200932932 .:針對透明底材A之底面進行濺咖 • “i屬效’於透明底材A底面便會形成具有金 :^峨層^可為紅銅、黃銅、欽合金 Τ可產生不透光之商標、圖形以 塵光=;:===生 避免遭灰塵、懸洋顆粒或異物刮傷。 ❹ 贫、(L〇)之截缝處理B可為真空舰、平面兩極式錢 ‘上ϊϊ二ivr Ί麵、反應麟、射頻錢鐘等麟處理技術, 另上述步驟(11)中,噴漆處可為uv喷漆或紫外線硬化塗料 ,由本發明較佳實施例之使用狀態示意圖一 内部具有料〜·!,2衣置F應用本發明之技術時,電子裝置F 述“方t外部為透明12,透明殼體1^ 2經由前 文字,則冬電;穿鍍層C與披覆層E ’而濺鍍層C不透光之200932932 . Nine, invention description: [Technical field of invention] [Prior technology] The use of two quantification and ease of production and manufacturing 'the majority of its shells are caused by the visual aesthetics and texture, and then through the plastic plating Fang J set square ί===6,=The type of metal produced on the surface of the plastic shell is the type of metal layer such as Wu Guo patent brother 6, 〇 4 5,8 6 6 exposed. Not t Γ 状 状 状 归 归 电 电 电 麟 麟 麟 麟 麟 麟 麟 麟 麟 麟 麟 麟 麟 麟 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属It is so efficient that it is inefficient in production and high in cost. The heart team is complicated. In order to solve the problem of plastic electric recording method, the United States specializes in No. 4, which exposes a kind of thermal spraying method in plastic 9 3 The second environment is in contact with the external environment, so that it is easy to be removed; the plastic case with the gold coating of Shao or age is used for secret treatment. The layer of the Asian watch is missing ϊΐίί thermal spraying or electric material method In order to have the following problems and the method of Jin Yan = quality 1 thermal spraying or electric ore, the entire plastic material - into the 5 and = most of the application is suitable for opaque plastic materials, consumption and then ij and tunnel The strong competition in the electronic product market, purely diverse 200932932. The surface is no longer able to meet the needs of consumers. [Invention content], Ming: The data, through multiple modifications, began to design such a Trial and electronic device housing The main purpose of Λ Λ ί ί ί ί ί ί 透 透 ί ί ί ί ί ί ί ί ί 主要 主要 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί [Embodiment] The technology and structure used in the present invention, the age of ϊΓ ϊΓ ΐ ΐ 加 加 加 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 与 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The process of the preferred embodiment of the present invention is as follows: , , / / 2, it can be clearly seen from the figure that the present invention is according to the following step 5 |: the surface of the substrate is sputtered to produce a sputter layer c; The mouth ^^ and the splatter layer C simultaneously produce the coating layer E by painting D. When the 'top surface of the transparent substrate A is first subjected to the blasting treatment B, the transparent substrate A is on the top surface of the transparent substrate A. It will form a layer with a golden jewel 3 -, a layer of fruit c, the ship layer. It can be a copper, brass, titanium alloy through the trademark, graphics, text or graphic splash layer C, or 3L-1,- a layer of c ° that surrounds the trademark, graphic, text or graphic of light transmission. New A and lining C surface generation 6 200932932. A layer of light transmissive coating to avoid dust, suspended particles or foreign matter & Ε 透明 透明 透明 Α Α Α Α Α Α Α Α Α Α Α Α Α Α Ε Ε Ε 0) Dream reduction. Mine, three-pole sputtering, magnetic control machine money: ϋ can be vacuum saving, flat two-pole type; 贱 以 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空Sputtering treatment technology, vacuum; 贱 plating: after the accelerated ion bombardment exchange momentum, 'will be the surface of the surface ^ the surface of the atom is loaded with dry materials, the sister is mostly red steel, ^ traitor 20% shot, and Usually the cathode 'and the anode is loaded with _, to be minerals, magnesium and other metal materials Lu Qiling, the voltage applied by the cathode for = and two ^ cathode plus, 100 volts voltage, accelerate to the surface of the cathode. Therefore, the free argon positive ions are struck by the atoms and are placed; the surface of the material is formed with a thickness of at most 0 · 〇〇i = two materials, and the surface is a visual field that causes the substrate surface to produce metallic luster and texture. Wrong, can be used in the substrate surface coating 'needle;; wonderful mu:, shell paint treatment can be uv mouth paint or UV curing start ==== say = embedded = compound, monomer, photopolymerization Viscosity reaction - a thinner, and photopolymerization polymerization of the fine process level irradiation _, the start of the combination will be rebase, this response is close to the prepolymer, monomer polymerization dual combination (not full = ), the recording weight combined with the surname of the active Wei (four) Lai-like combination, chain polymerization formed the mesh structure, reached the process of hardening. Referring to the first, fifth, sixth and seventh figures, the flow of the preferred embodiment of the present invention is shown in the first, second and third flowcharts of a further preferred embodiment of the present invention. The invention is carried out in accordance with the following steps: (1) The surface of the transparent substrate A is sputtered to form a sputter layer c; (1) the transparent substrate A and the sputter layer C are simultaneously sprayed to form a coating E. 200932932 .: Splashing on the bottom surface of the transparent substrate A • “i is effective” on the bottom surface of the transparent substrate A will form gold: ^ 峨 layer ^ can be red copper, brass, alloy, can not be transparent Light trademarks, graphics with dust =;: === students to avoid being scratched by dust, suspended particles or foreign objects. ❹ Poor, (L〇) slitting treatment B can be vacuum ship, flat two-pole money In the above step (11), the lacquering portion may be a uv paint or an ultraviolet hardening paint, and the inside of the preferred embodiment of the present invention has an internal material. ~·!, 2 clothing F When applying the technology of the present invention, the electronic device F states that "the outside of the square t is transparent 12, the transparent casing 1^2 passes through the front text, then the winter electricity; the plating layer C and the cladding layer E' The sputter layer C is opaque

G 光線將由1發光時’發1發出之 。U對外投射’形成光線包_鍍層c之視覺態樣 ,由==示電===;使_示意圖二 樣,出之樣將由透明殼體F 2對外投射,形成發歧字之 裝置再二上=電T裝置F可為個人電腦、筆記型電腦、11腦週邊 裝置、2士、ί' 網路攝影機、行動通訊裝置、手持式電子 J產品;而!述之用品、有線電話、電視、數位電視等3 光二極體燈板、冷以i可為發光二極體、發光二極體模組、發 8 200932932 上所述僅為本發明之較佳實施例而已,非因此即拘限本發 -及等運用本發明說明書及圖式内容所為之簡易修飾 及寻t、,.、D構产化,均應同理包含於本發明之專利範圍内,合予陳明。 方法全部附圖所示,本發明之電子裝置外殼之表面處理 二法1二)為可改善習用之技術關鍵在於; 处 於透明底材A表面上形成賴層c,且濟鍍層c之 薄G金屬S感?0lmm ’以令透明底材厶表面具有高度緻密 二、透,底材A經靖處_產生續層c之後,仍可 保^透光的特性,則當電子裝置F之透明殼體F 2紐上'^理,会 ° 2=裝以==光則1發出之光線,可經忒 _達=;子=外效果》 時’為確實能達到其功效及目的,於使用 ,為符合發明專利之_請要件,爰依法提出㈡二,優異之發明 不吝來函指示,發合=感=審委有任何稽疑,請G light will be emitted by 1 when it emits light. U external projection 'formation of the light envelope _ plating c visual aspect, by == indicating electricity ===; so that the _ schematic is the same, the sample will be projected by the transparent shell F 2 externally, forming a device for generating ambiguous words The upper=electric T device F can be a personal computer, a notebook computer, a 11 brain peripheral device, a 2 s, a ί' network camera, a mobile communication device, a handheld electronic J product; and a description of the article, a wired telephone, a television, A three-dimensional diode lamp panel such as a digital television, a cold LED, a light-emitting diode, a light-emitting diode module, and a hairpin 8 200932932 are only preferred embodiments of the present invention, and thus are not limited to this. The simple modification and the t-, D, and D construction of the present invention and the contents of the drawings are included in the scope of the patent of the present invention and are combined with Chen Ming. The method is as shown in all the drawings, the surface treatment of the electronic device casing of the present invention is the second method (1). The key to improving the conventional technology is that the layer C is formed on the surface of the transparent substrate A, and the thin layer G of the coating layer c is formed. The metal S sense? 0lmm 'so that the surface of the transparent substrate is highly dense, transparent, and the substrate A can still maintain the characteristics of light transmission after passing through the layer C, and then the transparent shell of the electronic device F Body F 2 New Zealand's ^^, will ° 2 = loaded with == light then 1 light, can pass 忒_达 =; child = external effect" when it is indeed able to achieve its efficacy and purpose, in use, for In accordance with the invention patent _ request elements, 提出 according to the law (two) two, excellent inventions do not send a letter instructions, hair, = sense = the audit committee has any doubts, please

9 200932932 【圖式簡單說明】 •第一圖係為本發明較佳實施例之流程圖。 第二圖係為本發明較佳實施例之流程示意圖一。 第三圖係為本發明較佳實施例之流程示意圖二。 第四圖係為本發明較佳實施例之流程示意圖三。 第五圖係為本發明再一較佳實施例之流程示意圖—。 第六圖係為本發明再一較佳實施例之流程示意圖二。 第七圖係為本發明再一較佳實施例之流程示意圖三。 第八圖係為本發明較佳實施例之使用狀態示意圖一。 第九圖係為本發明較佳實施例之使用狀態示意圖二。 【主要元件符號說明】9 200932932 [Simple Description of the Drawings] • The first drawing is a flow chart of a preferred embodiment of the invention. The second drawing is a schematic diagram 1 of a preferred embodiment of the present invention. The third figure is a schematic diagram 2 of the flow of the preferred embodiment of the present invention. The fourth figure is a schematic diagram 3 of the flow of the preferred embodiment of the present invention. The fifth figure is a schematic flow chart of still another preferred embodiment of the present invention. The sixth figure is a schematic diagram 2 of a flow chart according to still another preferred embodiment of the present invention. Figure 7 is a third schematic diagram of a flow of still another preferred embodiment of the present invention. Figure 8 is a first schematic view of the state of use of the preferred embodiment of the present invention. The ninth drawing is a schematic diagram 2 of the state of use of the preferred embodiment of the present invention. [Main component symbol description]

透明底材· • A 濺鍍處理· • B 濺鍍層.· • C 噴漆處理· • D 披覆層.. .E 電子裝置· • F 發光體·· • F 透明殼體· • F 10Transparent substrate · • A sputter treatment · • B sputter layer ·· • C paint treatment · D D coat layer .. .E electronic device · • F illuminator ·· • F transparent case · • F 10

Claims (1)

200932932 十、申請專利範圍: 該方法為依照下列步 子裝置外殼之表面處理方法(三) 驟進行: 面以濺鍍處理產生濺鍍層; 2 、_以噴漆處理產生坡覆層。 )口,圍第1項所述之電子裝置外殼之表面處理方法(三 _理可表面以雜處理產生_層之步驟卜_ 3 或反應鍍、平面兩極式麵、三極式猶、磁控減鍍 1 鍍射頻濺鍍或相關濺鍍處理技術其中之一者。 ίΐΟΐ’1項所述之電子裝置外殼之表面處理方法(三 4 鍍層同時以噴漆產生披覆層之步驟中, “貝q、處理可為υν喷漆或紫外線硬化塗料。 b 21項所述之電子裝置外殼之表面處理方法(三 )其中§亥披覆層為可透光形式。 6 、=申2利範_1顧述之電子裝置外殼之表錢理方法(三 中趙明紐表面⑽贿理產线鍍層之步驟t,該藏 鍍層為不透光之之商標、圖樣、文字或圖文。 ⑩ 、,申請專利範圍第1項所述之電子裝置外殼之表面處理方法(三 ’其中該_底材表面峨麟理產生職層之步驟中, 鍍層包圍有透光之商標、圖樣、文字或圖文。 、如申請專利第1綱述之電子裝置外殼之表面處理方法(三 )’其中該透明底材表面以缝處理產生藏鍍層之步驟中,該;賤 鍍層為紅銅、黃鋼、鈦合金、鋁、鎂等金屬材質豆 、如申請專利翻第1項所述之電子裝置外殼之表’面處理方法(三 ),其中該濺鍍層可設於該透明底材之頂面或底面。 7200932932 X. Patent application scope: This method is carried out according to the surface treatment method (3) of the following step device housing: the surface is sputtered to produce a sputter layer; 2, _ is sprayed to produce a slope coating. Port, the surface treatment method of the electronic device casing described in item 1 (the third surface is produced by the impurity treatment _ layer step _ 3 or reaction plating, planar two-pole surface, three-pole type, magnetic control One of the techniques for the plating of RF plating or related sputtering. 表面 ΐΟΐ ΐΟΐ 1 1 1 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子The treatment may be υν painting or ultraviolet curing coating. b Surface treatment method of the electronic device casing according to item 21 (3) wherein §Hai coating is permeable form. 6、=申2利范_1顾述之The method of the electronic device casing (the third step Zhao Ming New surface (10) bribes the production line coating step t, the Tibetan coating is the opaque trademark, pattern, text or graphic. 10,, the scope of patent application The surface treatment method of the electronic device casing according to the above-mentioned item (the third step in which the surface of the substrate is produced by the lining of the substrate), the plating layer is surrounded by the trademark, pattern, text or graphic of the light transmission. Electronic device of the first profile The surface treatment method of the shell (3), wherein the surface of the transparent substrate is treated by a seam treatment to produce a Tibetan coating layer; the ruthenium plating layer is a copper material such as copper, yellow steel, titanium alloy, aluminum or magnesium, as claimed The surface treatment method (3) of the electronic device casing according to Item 1, wherein the sputtering layer is disposed on a top surface or a bottom surface of the transparent substrate.
TW97102007A 2008-01-18 2008-01-18 Surface treatment method for electronic apparatus casing (III) TW200932932A (en)

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