M343532 八、新型說明·· 【新型所屬之技術領域】 本創作為提供一種表面披覆結構，尤指一種使電子裳置外殼表面 抗氧化且美觀之電子裝置外殼之表面披覆結構（四）。 【先前技術】 按’子裝置之外殼A多岐㈣料基本之材胃，但塑膠 見上㈣感上較差’而業者為了使電子裳置塑膠外殼產生士 第ΓΚΓίί在該娜外殼表面沉積—層金屬層’如 吴國專利第6，0 4 5，8 6 6所揭露。 狀塑膠電鍍方式所鍍上之金屬相僅能為銅、鎳等較 困ίΐϊίΖ且ΐ塑膠電鍍方式本身所經過之步驟較為複^ 、繁瑣，以至於生產上效率低且所耗費之成本高。 =疋就有業者為了提升電子裝置外殼的質感，偁 子產品的外殼，研發了以I呂質、錐質 。 >為電 裝置外殼，藉由金屬材質“子;ί =為電: 於各類電子裝置已經有非常廣泛的廍 二 ϋσ的貝感，目刖 殼等等。 〃〜用了，例如手機外殼或pda外 改進然上述奸錢攸贿科，為確實存在下觸贿缺失尚待 感，表面沒有随，且顏色過於物表面給人冰冷的觸 為接觸空氣導致氧化。 4咐域，並表面金屬材質容易因 是以，要如何解決上述習用 從事此行業之相關廠商所亟欲研究以=所::本案之創作人與 5 M343532 ._【新型内容】 考量故並搜集相關資料，經由多方評估及 設計出此種使^子裝置、嗜_試作及修改，始 披覆結構（四）新型專利者。 親之電子裝置外殼之表面 本創作之主要目的在於··本創作雷 表面設有一裝飾區域，該穿^卜凡又為一底材，該底材 具有凹凸不平的圖I ’姓刻可以使表面 刻，不同圖案，並於底材與裝飾區以莫板=M343532 VIII. New Description·· 【New Technical Fields of the Invention】 This work is to provide a surface covering structure, especially a surface covering structure (4) of an electronic device casing that makes the surface of the electronic device be anti-oxidation and beautiful. [Prior Art] According to the 'sub-device A's shell A (four) material basic material stomach, but the plastic sees (four) feels poor 'and the industry in order to make the electronic skirt plastic shell produced ΓΚΓ ί ίί deposition on the surface of the shell - layer metal The layer 'is disclosed in Wu Guo Patent No. 6, 0 4 5, 8 6 6 . The metal phase plated by the plastic plating method can only be made of copper, nickel, etc., and the steps of the plastic plating method itself are complicated and complicated, so that the production efficiency is low and the cost is high. = In order to improve the texture of the outer casing of the electronic device, the outer casing of the tweezers has been developed with Ilu and cone. > for the electrical device shell, by the metal material "child; ί = for electricity: in a variety of electronic devices have a very wide range of 廍 ϋ ϋ 的 , , , , , , 刖 刖 刖 刖 用 用 用 用 用 用 用 用 用 用 用 用 用 用Or pda outside the improvement of the above-mentioned money and bribery, for the existence of the lack of bribery still needs to be felt, the surface does not follow, and the color is too much surface to give people cold touch to contact the air leading to oxidation. 4 咐 domain, and surface metal The material is easy to use, how to solve the above-mentioned practices of the relevant manufacturers engaged in this industry to study: =: The creator of this case and 5 M343532._[New content] Consider and collect relevant information, through multi-party evaluation and Designing such a new type of patent device, _ _ test and modification, the first covering structure (four). The surface of the electronic device shell The main purpose of this creation is that the surface of the creation of the mine has a decorative area, The wearing ^ Bu Fan is also a substrate, the substrate has irregularities. I'm engraved to make the surface engraved, different patterns, and in the substrate and decorative area with Mo plate =
峨理、透明皮膜處理或陽極染色i理;以 ，處理、透明皮膜處理時既可以防止氧化又有=喷fV ϊϋ 色丄顏色具多樣二 破，達到電子裝=====— 【實施方式】 為達成上述目的及功效，本創作所採用之技術生 ^ mztjt 明參閱弟一圖及弟二圖所示，係為本創 丄解Treatment, clear film treatment or anodic dyeing; to, treatment, transparent film treatment can prevent oxidation and = spray fV ϊϋ color 具 color has a variety of two broken, reaching electronic equipment =====- In order to achieve the above objectives and effects, the technical student ^ mztjt used in this creation is shown in the picture of the younger brother and the second picture of the younger brother.
J材Β可為鋁質、鎂質或鋁鎂合金 ^ ϊί ίΓίΐ—裝飾區則1，且該底材6上财：=42 =裝Ϊ2裝ί:卜2可腦外殼、筆記型電腦外r:、I 2剖視圖’由圖中可清楚看出，本創作電j子乍圖； 材B，該;^士 R ΈΓ炎力口新 u e L、k 双Λ匕括有一底 腦週邊裝置外殼、滑鼠外殼、鍵盤外殼、伽γ外殼 3動通訊裝置外殼、手持式電子裝置外殼、數位相機外 =用品外殼、有線電話外殼、電視外殼、數位電視外殼等3 其中魏飾區域B 1可核顺理技術，該_處理 處理、乾_處理其中之一者，餘刻技術（E t c h i則 h η o i 〇 g y )是將材料制化學反應或物理撞擊伽而移除^ 6 M343532 -術，蝕刻技術可以分為『濕蝕刻』（Wet etchin ^)『 乾蝕刻』（…etching)兩類。在濕蝕刻中么:二 •溶液，經由化學反應以達到侧的目的，而乾侧通常是一匕二 刻（plasma etching)，電漿侧中的姓刻 ^ 的i:。) ‘片表面原子間的化學反應，甚至也可 禮ϋ空、，巧、化學工業中，蝕刻技術廣泛地被使用於減_重量 導體製程上，姓刻更是不可或缺的技術。之料工件4之加工。在半 下，第組_本創作之使用作動情形說明如 L盖2 ί二圖第八圖所示，係為本創作較佳實施例之 外令理以產生裝飾區域" =二換即可，_靈;，再於將 作用有=染，_層金屬的金屬片 金屬離子。某些情、又下蚀田β的金屬再办解，提供電解液更多的 充鍍著金屬離^，可以使得^^^’電鑛時需添加新群電解液補 惟，以上所得到多樣化的顏色。 作之專利範圍，故舉凡運用^^圭=例而已’非因此即侷限本創 請參閱全部圖創作之專利範圍内，合予陳明。 «丁本創作使用時，與習用技術相較，著實存在下 7 M343532 .列優點:J material can be aluminum, magnesia or aluminum-magnesium alloy ^ ϊί ίΓίΐ - decorative area is 1, and the substrate 6 on the wealth: = 42 = decoration 2 installed ί: Bu 2 brain shell, notebook computer outside r :, I 2 sectional view 'It can be clearly seen from the figure, this creation electric j 乍 ;; material B, the; ^ 士 R ΈΓ 力 力 新 new ue L, k double Λ匕 includes a bottom brain peripheral device shell, Mouse housing, keyboard housing, gamma gamma housing 3 mobile communication device housing, handheld electronic device housing, digital camera outside = product housing, wired telephone housing, TV housing, digital TV housing, etc. 3 Wei Wei area B 1 can be shun Technology, the _ processing, dry _ processing one of them, the remaining technique (E tchi h η oi 〇 gy ) is to remove the material chemical reaction or physical impact gamma ^ 6 M343532 - surgery, etching technology Can be divided into "wet etching" (Wet etchin ^) "dry etching" (...etching) two categories. In wet etching: two solutions, through a chemical reaction to achieve the side of the purpose, while the dry side is usually plasma etching, the surname of the plasma side of the i:. ‘The chemical reaction between the atoms on the surface of the film can even be emptied. In the chemical industry, etching technology is widely used in the process of reducing the weight, and the surname is an indispensable technology. Processing of the workpiece 4. In the second half, the use of the first group _ this creation is illustrated as the eighth cover of the L cover 2 ί 2, which is the reason for the creation of the preferred embodiment of the creation of the decorative area " = two replacement , _ Ling;, and then will have the effect of = dye, _ layer metal sheet metal ions. In some cases, the metal of the etched field β is re-solved to provide more electrolyte plating of the metal, which can make the new group of electrolytes be added to the ^^^' electric ore. Color. As for the scope of patents, the use of ^^圭=examples has not been limited to the original. Please refer to the patents of all the drawings, and give them to Chen Ming. « When Dingben used it, compared with the conventional technology, there is a real existence of 7 M343532. Column advantages:
•鮮^表面精_處理產絲舰則1，於底材R 有f 覆層B 2覆蓋，其中峨理可以使 2案’亚披覆層β 2可為喷塗U V漆處理B 3、二2 J表面具 =極染色處理B5，當噴塗uv漆處理 時即可以使得電子裝置外殼A抗氧化，處 4 當陽極染色—5時，可使電子裝置外=多=5 ，為符合新型專利之中請要件，爰依法提出申請，A j之創作 2 ’ :乂保障創作人之辛苦創作’ 釣局審委二曰：准 吝來函指不，創作人定當竭力配合，實感德便。 曰是，叫不 M343532 ^ 【圖式簡單說明】 第一圖係為本創作較佳實施例之立體圖。 第二圖係為本創作較佳實施例之局部剖視圖。 ^ 第三圖係為本創作較佳實施例之組構示意圖一。 ^ 第四圖係為本創作較佳實施例之組構示意圖二。 • 第五圖係為本創作較佳實施例之組構示意圖三。 第六圖係為本創作較佳實施例之組構示意圖四。 第七圖係為本創作較佳實施例之組構示意圖五。 第八圖係為本創作較佳實施例之組構示意圖六。• Fresh ^ surface fine _ treatment of the silk ship is 1, in the substrate R has f coating B 2 cover, which can make the case 2 sub-coating β 2 can be sprayed UV paint treatment B 3, two 2 J surface with extreme dyeing treatment B5, when spraying uv paint treatment can make the electronic device shell A anti-oxidation, where 4 when the anode is dyed -5, the electronic device can be outside = more = 5, in line with the new patent In the middle of the request, 提出 提出 提出 提出 , , A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A A曰 , 叫 叫 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 343 The second drawing is a partial cross-sectional view of a preferred embodiment of the present invention. The third figure is a schematic diagram of the structure of the preferred embodiment of the present invention. The fourth figure is a schematic diagram 2 of the structure of the preferred embodiment of the present invention. • The fifth figure is a schematic diagram of the structure of the preferred embodiment of the present invention. The sixth figure is a schematic diagram of the structure of the preferred embodiment of the present invention. The seventh figure is a schematic diagram of the structure of the preferred embodiment of the present invention. The eighth figure is a schematic diagram of the structure of the preferred embodiment of the present invention.
【主要元件符號說明】 電子裝置外殼··· • A 底材....... • B 裝飾區域..... • B 1 彼覆層...... • B 2 喷塗UV漆處理·· • B3 透明皮膜處理··· • B4 陽極染色處理· · · • B 5[Description of main component symbols] Electronic device housing··· • A Substrate....... • B Decorative area..... • B 1 Cover... • B 2 Spray UV Paint treatment·· • B3 clear film treatment··· • B4 anode dyeing treatment · · · • B 5