TW200932516A - Sheet for absorbing impact and sealing comprising adhesive layer and method of preparing the same - Google Patents

Sheet for absorbing impact and sealing comprising adhesive layer and method of preparing the same Download PDF

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Publication number
TW200932516A
TW200932516A TW097150514A TW97150514A TW200932516A TW 200932516 A TW200932516 A TW 200932516A TW 097150514 A TW097150514 A TW 097150514A TW 97150514 A TW97150514 A TW 97150514A TW 200932516 A TW200932516 A TW 200932516A
Authority
TW
Taiwan
Prior art keywords
layer
film
adhesive
adhesive layer
foamed
Prior art date
Application number
TW097150514A
Other languages
Chinese (zh)
Inventor
Ho-Sung Yang
Original Assignee
Sk Utis Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sk Utis Co Ltd filed Critical Sk Utis Co Ltd
Publication of TW200932516A publication Critical patent/TW200932516A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/12—Coating on the layer surface on paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0214—Materials belonging to B32B27/00
    • B32B2266/0278—Polyurethane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate
    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2469/00—Presence of polycarbonate
    • C09J2469/006—Presence of polycarbonate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention relates to a sheet for absorbing impact and sealing comprising an adhesive layer. More specifically, it relates to a sheet for absorbing impact and sealing in which the adhesive layer, a supporting film layer and a polyurethane layer are laminated sequentially, and a method of preparing thereof. The sheet for absorbing impact and sealing of the present invention comprises the adhesive layer on one face of the supporting film layer used as a substrate. Thus, it has a relatively high thickness of the polyurethane layer within same thickness of the sheet. Therefore, when applying to an electronic device, it shows higher compressibility, and better ability of absorbing impact and sealing than a sheet in which a two-faces-tape is laminated on a substrate. Moreover, the preparation method of the present invention has merits to simplify the preparation process of the sheet, and to lower the loss of material and the incidence of poor quality because it can omit the laminating process.

Description

200932516 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種具有黏著層之用以吸收衝擊及 密封之膜片，且特別是有關於一種用以吸收衝擊與密封之 膜片及膜片之準備方法，且黏著層、支撐膜層及聚氨酯層 係依序形成於膜片中。 【先前技術】 ❹ 例如是行動電話、硬碟、電視及液晶螢幕之電子設備 係包括精密機械部分及電子裝置。此些電子設備容易因外 部衝擊而破裂或損壞。此外，例如是灰塵之外部污染物會 干擾電子設備内之氣流，造成電子裝置過熱，因而縮 子設備之壽命。 為了解決上述問題，電子設備通常具有用以密封之膜 片，用以吸收衝擊並封住間隙。 、 舉例來說’韓國專利字號2002_0015239中揭露用以 ❹ 於液晶顯示器中維持間隙並阻隔熱量之元件。此元件利用 液晶顯示器之引導面板（guide-panel)防止光學臈片a 或變皺、維持介於引導面板及導光板間之間隙、以及透員 間隙而阻隔熱量之匯集及外來物質。此元件係由矽材料$ 觀塾所形成。除此之外，韓國專利字號2〇〇5 〇〇58〇55中揭 露一種介於基板間之附加彈性層，用以防止液晶顯示器之 重力缺陷。彈性層係由聚氨酯橡膠所形成，且其形成方式 為塗佈塗料並將塗料固化於基板上。此塗料包括芳香族異 氰酸酯、聚醇及1，4 丁二醇。揭露於韓國專利字號 3 200932516 2002-0015239之元件或韓國專利字號2〇〇5 〇〇58〇55之掸 性層係藉由使用矽或聚氨酯而為家庭電子設備及電子裝 置提供彈性及良好的密封效果。 然而’在韓國專利字號2005-0058055之彈性層之製 造過程中’形成彈性層之混合塗料之後必須在彈性層上塗 佈一圖案’因而使得製造過程變得困難。另一方面，韓國 專利子號2002-0015239之矽襯墊之膜片配置使得此矽襯 墊具有易於應用於多種家庭電子設備或電子裝置之優 點。藉由放置雙面之黏著物於襯墊之一面可將例如是矽襯 替之膜片貼附於電子裝置上，或藉由塗佈丙稀酸黏著劑於 襯墊=Φ亦可將膜片貼附於電子裝置上。然而，襯墊之 ::料之表面張力低，且矽膜片與膠帶或黏著劑間之黏著 因此當矽膜片貼附於電子裝置之後，矽膜片會 發生剝落之問題。 塗佈：:::土迷:：，近來係將額外之底漆(Primer) τ V,, 雖…、此舉可達到良好的黏著強度，但卻 成本。此外 士 程變得f in 於增加了塗佈底漆之步驟，使得製 會造成雜。由於底漆之混合物中具有有機溶劑，亦 霄k成環境問題。 著劑或膠帶之材料 了使用底漆之外，㈣可做為黏 著劑間之黏著強料，以在不使用底漆之情況下改善矽與黏 加了製造成本度。然而，此方法不僅降低了黏著力亦增 為矽之替，聚氣乙歸（p〇iyvinyichi〇ride，pvc)可做 劑以提高彈而’聚氣乙烯之硬度高，必須添加塑化 在、封性質。隨著時間增加，塑化劑容易轉 200932516 移到電子裝置之表面，且塑化劑會污染裝置之内部 件，進而造成裝置之故障並縮短裝置之壽命。此 70 片係藉由塗佈黏著劑於石夕襯塾上而製成，或藉’發膜 於物墊上而製成。由於此些程序必須藉由手施壓積膠帶 成，因此無法以自動化製程生產，降低了生產之速=完 再者，在組裝或使用產品時，雙面膠帶 认八 上，且膜片係固定於電子裝置之貼附部分以維持其媒片 然而，雙面膠帶之使用增加了膜片整體之厚度。冬^置。 ©有限制時，雙面膠帶之使用亦減少了具壓縮性的；八度具 於不可壓縮之材料的部分減少，造成整個膜片之所 縮性降低’使得膜片無法制吸收衝擊及密封間隙之要 求。此外，增加貼附雙面膠帶之程序會造成產品材料 失，並使得劣質品之發生機率增加，並減少了產量。 【發明内容】 ❾ 為了解決上述問題，本發明提供一種用以吸 密封之膜片’此膜片包括支擇膜層及黏著層。本發明減： 了塗佈於膜片上之黏著層及支撐膜層之數量，並增加’4 =壓縮性之聚氨s旨層之厚度。因此，本發明之^衝= 之膜片具有較佳之吸收衝擊及密封之能力，且其製程 較為簡單。 儿具製程 本發明係有關於-種用以吸收衝擊及密封之膜 ==發泡層。細層係包括黏著層。發泡 另’本發明係有關於一種用以吸收衝擊及密封之膜片 5 200932516 之準備方法。 根據本發明之一方面’提供一種用以吸收衝擊及密封 之膜片’包括支撐膜層、黏著層及發泡層。黏著層係形成 於支撐膜層之一面。發泡層係用以吸收衝擊並形成於支樓 膜層之另一面。本發明之膜片可更包括層積於黏著層上之 離型膜層或離型紙層。 根據本發明之另一方面，提供一種用以吸收衝擊及密 封之膜片之準備方法，包括下列步驟。首先，藉由塗佈黏 著劑於支撐膜層之一面，而形成黏著層於支撐膜層上。接 著’藉由塗佈用以吸收衝擊之發泡材料於支撐膜層之另一 面’以形成用以吸收衝擊之發泡層。支撐膜層之另一面係 位於黏著層之相對一侧。然後，固化發泡材料。 根據本發明之再一方面’提供另一種用以吸收衝擊及 密封之膜片之準備方法，包括下列步驟。首先，藉由塗佈 用以吸收衝擊之發泡材料於支撐膜層之一面，以形成用以 吸收衝擊之發泡層。接著，固化發泡材料。然後，藉由塗 佈黏著劑於支撐膜層之另一面，以於支撐膜層之另一面形 成黏著層。支撐膜層之另一面係位於發泡層之另—侧。 膜片準備方法可更包括：在形成黏著層之後，藉由層 積離型膜或離型紙料著層上，以形成離韻層或離型紙 層。 為讓本發明之上迷内容能更明顯易懂，下文特舉-較 &實施例’並配合所_式，作詳細說明如下： 【實施方式】 200932516 以下參煦第1圖至第5圖詳細說明本發明。 第i _依照繪示習知用以吸收衝擊之膜片之製造流 程。第2圖嫁示依照本發明之包括黏著劑之用以吸收衝擊 之膜片之製造流程。習知用以吸收衝擊之膜片需經過使用 雙面膠帶之層積製程（laminating Process)，藉以於支樓層 上形成用來吸收衝擊之發泡層（foamed layer)及/或離型 膜層（release film layer)。然而，本發明中之黏著層係形 成於支撐膜層上，且本發明不需要額外之層積製程。因 ❹此，本發明具有簡化製程、降低材料損失及減少出現劣質 品之機率之優點。 第3圖緣示依照習知用以吸收衝擊之膜片之剖面結 構。第4圖繪示習知之用以吸收衝擊之膜片之剖面結構， 且雙面膠帶係層積於膜片上。第3 _示包括域膜層1〇 及聚氨醋層20之部分。第4圖％示包括離型膜層糾、黏 著層3〇、支樓膜層1〇甘及聚氨醋層2〇。如第3圖所示之結 〇 構僅有兩層，因此有其限制。此外，如第4圖所示之膜片 中，雙面卿偏靜Μ。由料可壓賴料之部分相 對較大’使其整體之壓縮性較低。因此，此膜片吸收衝擊 之能力低，且其密封效果差。 另-方面’第5_化照本發明之用以吸收衝擊之 膜片之剖面㈣。膜U括切膜層，且黏著層係形成於 支撐膜層上。此部分包括離型膜層40、黏著層3〇、支撐 膜層Η)及聚氨S旨層，第5圖中之標號22 (虛線中之部 分）顯示使用雙面膠帶時整體增加之厚度，或顯示當維持 整體厚度時，相對減少<聚氨_層之厚度。本發明保護電 200932516 子裝置之元件不受外力衝擊耐壞，且能有效地阻撐例如 是灰塵之污染物。此外，在膜層之厚度相同時，由於可將 不必要之不可壓縮材料層之部分降至最低，本發明之膜片 之聚氨㈣之厚度較大，因此本發明之膜片之_性較 高，且與習知之使用雙面膠帶層積於支制層上之膜片相 較，本發明之膜片之吸收衝擊及密封的能力較佳。 根據本發明之一實施例，用以吸收衝擊及密封之膜片 之準備方法包括：藉由塗佈黏著劑於支撐膜層之一面以形 成黏著層於支撐膜層上、以及藉由塗佈用以吸收衝擊之發 泡材料於支撐膜層之另一面以形成用以吸收衝擊之發泡 層，並固化發泡材料。支撐膜層之另一面係位於相對於黏 著廣之一側。 本發明中，支撐膜層ίο係做為基板之用，且支撐膜 層10可包括任何通常用以吸收衝擊及密封之材料。舉例 來說’支樓膜層可為透明或白色塑膠膜。具體地來說，支 撐膜層可至少包括選自由聚對本二甲二乙g旨（polyethylene terephthalate，PET )、聚二甲酸乙二醇酯（polyethylene naphthalate, PEN)、聚酯纖維（polyester)、聚酿胺 (polyamide)、聚碳酸脂（polycarbonate)、乙稀醋酸乙稀 醋共聚物（ethylene vinyl acetate copolymer )、乙稀丙烯酸 乙醋共聚物（ethylene-ethyl acrylate copolymer )、乙稀丙 稀共聚物（ethylene-propylene copolymer)及聚氯乙稀 (polyvinylchloride)組合之群組中之一材料。然而’本 發明並不以此為限。為了改善基板與黏著層及聚氨酯層之 黏著性，支撐膜層較佳地進行電暈放電處理（corona 200932516 discharge treatment)、電襞處理（piasma的如则扮）、喷砂 (blasting treatment)、化學蝕刻處理（chemical etching treatment)及底塗處理（primertreatment)等。 支撐膜層10可提供膜片適當的支撐強度。由於黏著 層層積於產品上之形狀十分容易控制，使得支撐膜層具有 絕佳之可用性。本發明中，支撐膜層1〇之厚度可根據產 品之性質而決定。為了具有能維持形狀之最低支撐強度， 支#膜層之厚度較佳地不小於5μπι。為了避免整個膜片變 〇 得太厚，支撐膜層之厚度較佳地不大於125μιη。 黏著層30可為相關領域中經常使用之黏著材料。與 其他材料相較，此材料具有適當黏著強度，例如是不小於 每吋1 kgf，且其耐熱性不小於6〇。〇黏著材料之代表性 範例至少包括選自天然橡膠黏著劑、丁苯膠乳基黏著劑 (styrene-butadiene latex based adhesives)、ΑΒΑ 塊狀共聚 合物型熱塑性橡膠（ABA block copolymer-type thermoplastic rubber) (A代表熱塑性聚苯乙烯終端塊體， 0 B代表例如是聚異戊二烯、聚丁二烯或聚乙烯/聚丁烯之橡 膠中間塊體）、丁基橡膠（isobutylene-isoprene rubber)、 聚異丁烯（polyisobutylene)、丙婦酸黏著劑（acrylic adhesives)以及乙稀醚共聚合物（vinyl ether copolymer) 所組合之群組。丙烯酸黏著劑例如是聚丙烯酸酯 (polyacrylate )及乙烯醋酸/丙稀搭酯共聚合物。乙稀醚共 聚合物例如是聚乙烯甲醚（poly vinylmethylether )、聚乙稀 乙醚（polyvinylethylether)及乙烯基異丁謎 (polyvinylisobutylether )。較佳的範例至少包括選自由醋 9 200932516 酸乙稀（vinyl acetate )、曱基丙烯酸甲酯（methyi ' methacrylate)、乙酿丙烯酸乙酯（ethyl acetoacrylate)及 績酸聚苯乙稀（sulfonated polystyrene )之群組中之一黏著 劑。然而，本發明並不以此為限。本發明中，黏著層3〇 係用以於組裝或使用裝置時防止膜片與電子裝置之黏貼 部分脫離。因此，黏著層與支撐膜層間之剝離強度係較佳 地達到能使黏著層維持一段時間不與支撐膜層脫離之強 度，例如是不小於200 gr/cm。 此外，黏著層可包括黏著強度不小於5〇〇 gr/inch且 耐熱性不小於60 °C之材料’用以確保應用於行動顯示器 組件之產品耐久性。 黏著層30係藉由將塗佈支撐膜層之一面而形成。支 樓膜層係為透明或白色塑膠’例如是具有黏性之PET或 PEN。換句話說，可使用相關領域中通常使用之任何塗佈 方法’例如是凹版印刷（gravure )、微凹版印刷、模具式 塗佈（die coating)、刮刀式塗佈（c〇mma coating)、浸潰 塗佈（dip coating)等。然而，本發明並不以此為限。形 成於支撐膜層10之一面之黏著層厚度較佳地不小於 5μιη，以提供適當的黏著強度。此外，此厚度較佳地不大 於150μιη ’以避免成品過厚及湯姆森處理（Thoms〇n processing)中之意外事件發生，亦即，由於黏著層過厚使 得黏著劑推擠到邊緣並污染產品及機械。 本發明之用以吸收衝擊及密封之膜片可更包括層積 於黏著層上之離型膜層（release film layer)或離型紙層 (release paper layer )。離型膜層或離型紙層可為透明或白 200932516 色塑膠膜。詳細地來說，塑膠膜可至少包括選自由聚乙烯 (polyethylene，PE)、聚對苯二甲酸乙二酯、聚萘二曱酸 乙二酯等之群組中之一。然而，本發明並不以此為限。離 型膜層之厚度或離型紙層之厚度係較佳地介於5至 125μπι。當離型臈層或離型紙層太薄時，離型膜在使用時 很難被移除。當離型膜層或離型紙層太厚時，會影響產品 整體之厚度。因此，離型膜層或離型紙層較佳地具有上述 之厚度。此外，離型膜層或離型紙層與黏著層之剝離強度 〇 較佳地至少為5 gr/cm。當剝離強度低時，離型紙層很容易 在產品製造過程中與黏著層分離，造成製造或移動產品變 知相當困難。當剝離強度高時，在使用時移除離型膜層變 得困難。因此，剝離強度較佳地維持於一定範圍内。 本發明之用以吸收衝擊及密封之膜片包括由發泡材 料形成且用以吸收衝擊之發泡層。發泡層係塗佈於支撐膜 層之另一面，亦即位於與黏著層相對之另一侧。塗佈之用 以吸收衝擊之發泡層之厚度較佳地不小於0.05 mm，以維 持可接受之最低吸收衝擊效果。發泡層之厚度較佳地不大 於10mm，以維持與電子產品之粗糙表面之密封效果，並 用以避免成品變得太厚，以維持電子裝置之輕薄短小。 本發明之用以吸收衝擊之發泡材料可為發泡之聚氨 醋’並可依照需要進行靜電釋放處理（dectr〇_static discharge，ESD )。藉由聚醇（p〇ly〇1)與聚異氰酸酯 (poly isocyanate )反應而形成之發泡聚氨酯之比重可介於 3 gr/cm3與90 gr/cm3之間。聚醇可至少選自由聚醚多元 醇（polyether polyol)、聚酉旨多元醇（p〇lyesterp〇ly〇1)、聚 200932516 己内酯多元醇（caprolactone polyol)等組成之群組中之； 一。聚謎多元醇例如是聚乙二醇（poly ethylene glycol)、 聚丙二醇（polypropylene glycol)、聚_二醇 (polytetramethyleneglycol)等。此外，異氰酸酉旨 (isocyanate )’亦即聚異氰酸酯（polyisocyanate )之單體， 係至少選自由二苯基曱统二異氰酸醋（methylene-diphenyl diisocyanate)、聚二苯基甲烧二異氰酸酯（polymeric methylene-diphenyl diisocyanate)、修飾的二苯基甲烧二異 氰酸酯、二異氰酸甲苯（toluene diisocyanate )、二異氰酸 ❹ 異佛爾酮（isophorone diisocyanate)、六亞甲基二異氰酸 (hexamethylene diisocyanate)、異氰酸醋之修飾之碳二醯 胺（modified carbodiimide 0f the diisocyanate )、異氰酸醋 之二聚體（dimer of the diisocyanate )、異氰酸酯之三聚體 (trimer of the diisocyanate )、由異氰酸酯及聚醇反應形成 之預聚物（prepolymer)等組成之群組中之一。 催化劑常使用於聚醇及聚異氰酸酯之反應中。此催化 劑可至少選自由金屬催化劑及胺催化劑組成之群組中之 ❹ 一。金屬催化劑例如是二月桂酸二丁錫（dibutyltin dilaurate)、四丁氧基鈦（tetrabutyltitanate)等。胺催化 劑例如是三曱胺、三乙胺、三乙醇胺等。氟發泡劑、氣發 泡劑及碳氫化合物發泡劑可用以發泡發泡材料，或使用鈍 氣或水來發泡。此外，亦可使用少量之碎介面活性劑。在 均勻地混合例如是聚醚多元醇及聚異氰酸酯之材料及例 如是催化劑之添加劑之後，此混合物可塗佈於支撐膜層 上。舉例來說，可使用Oaks混合器以進行混合。發泡之 12 200932516 聚'氨酯係於上述範圍内塗佈，且係藉由將發泡之聚氨酯置 入連續設定之烤箱中且於不小於120〇C之溫度下固化，以 形成具有均勻厚度之發泡體。 本發明之發泡之聚氨酯較佳地具有下列性質。本發明 之發泡之聚氨酯具有適當的吸收衝擊之能力。此外，根據 ASTM D3574之球回彈測試（ball bound test)，本發明之 發泡之聚氨酯較佳地具有介於15至50%之排斥力。當本 發明之用以吸收衝擊及密封之膜片應用並組裝於產品上 ❹ 時，此膜片係稍微地被壓縮。當發泡之聚氨酯之抗壓強度 過大時’需要較強之力量以進行組裝，因而造成機械損害 或降低組裝之效率。因此’發泡之聚氨酯之抗壓強度需介 於適當之範圍内，在25%之壓縮性下，發泡之聚氨酯之抗 壓強度較佳地不大於5 kgf/cm2，更佳地介於〇.〇1至5 kgf/cm2。再者，發泡之聚氨酯之永久壓縮應變率較佳地介 於0.5至10%之間。如此一來，當應用膜片於產品上時可 防止膜片之應變。此外，發泡之聚氨酯之膨脹係數較佳地 ❹ 不小於1〇0%，用以黏合聚氨酯於裝置上。發泡材料之蕭 氏硬度（Shore hardness)較佳地不小於5,以避免機械材 料之劣化。發泡材料之蕭氏硬度較佳地小於8〇，以防止於 組裝過程中於電子裝置上施加過多應力，並使得發泡材料 具有適當之吸收衝擊之能力。基於與上述相同之原因，發 泡材料之拉力強度較佳地介於2至3 kgf/cm2。 根據本發明之另一實施例，用以吸收衝擊及密封之膜 片之準備方法可包括下列步驟。首先，藉由塗佈用以吸收 衝擊之發泡材料於支撐膜層之一面，以形成用以吸收衝擊 13 200932516 之發泡層。接著’固化發泡材料。然後， 於支揮膜層之另-面，以形成黏著層。切/佈黏著'劑 係位於與發泡層相對之一側。本發明之另〜督θ之另面 泡之材料與方法之每一個步驟係與上述之本=例中，發 例相同，但形成膜層之順序不同。本發明之=之實施 與本發明之實施例相似，但其發泡方法可更~ 一實施例係 著層之後，藉由層積離魏或離型紙純^括於形成黏 離型膜層或離型紙層。 上’以形成 如上所述，本發明之用以吸收衝擊及密 護電子裝置之元件不受外部衝擊之損壞，並 片可保 如是灰塵之外部污染物。由於將不且壓1有效阻隔例 必要部分降至最低，在膜層厚度相同之情材^層之非 膜片之聚氨㈣之厚度相對地較高。@此 ^明之 面膠帶層積於基板上之膜片相較，本發明具二= 性及較佳之吸收衝擊與密封之能力。此外，縮 準備方法可簡化膜片之準備製程。由於層=之 本發明之準備方法可減少材料損失及劣質品之=製程 二下更進-步敘述並舉例說明本發明。然而，本 之範圍並不以此為限。 範例一：形成黏著基板 使用刮刀式塗佈器將hiden〇l SA 33()a (HanSUng-polymer Ltd.)塗佈於透明之 ρΕτ 上，沉 SA-330A之厚度為50帅，且pET之厚度為5〇 μβι。塗佈 後之薄膜係於烤箱中放置趣烤5分鐘，且其溫度為12〇 200932516 至140°C。當烘乾之後，塗佈矽之離型PET膜立即層積於 薄膜上，且用一滚筒於薄膜上滾動。 範例二：用以吸收衝擊之膜片之準備200932516 VI. Description of the Invention: [Technical Field] The present invention relates to a film having an adhesive layer for absorbing impact and sealing, and more particularly to a film and film for absorbing impact and sealing The preparation method of the sheet, and the adhesive layer, the support film layer and the polyurethane layer are sequentially formed in the film. [Prior Art] 电子 Electronic devices such as mobile phones, hard disks, televisions, and LCD screens include precision mechanical parts and electronic devices. These electronic devices are susceptible to breakage or damage due to external impact. In addition, external contaminants such as dust can interfere with the airflow inside the electronic device, causing the electronic device to overheat and thus shorten the life of the device. In order to solve the above problems, an electronic device usually has a film for sealing to absorb an impact and seal a gap. For example, the Korean Patent No. 2002_0015239 discloses an element for maintaining a gap and preventing heat insulation in a liquid crystal display. This element utilizes a guide-panel of the liquid crystal display to prevent the optical cymbal a or wrinkles, maintain a gap between the guide panel and the light guide plate, and a gap between the heat shield and the foreign matter. This component is formed by the 矽 material $ 塾. In addition, Korean Patent No. 2〇〇5 〇〇 58〇55 discloses an additional elastic layer interposed between the substrates to prevent gravity defects of the liquid crystal display. The elastic layer is formed of a urethane rubber and is formed by applying a coating and curing the coating on the substrate. This coating includes aromatic isocyanates, polyalcohols, and 1,4 butanediol. The elastic layer disclosed in Korean Patent No. 3 200932516 2002-0015239 or Korean Patent No. 2〇〇5〇〇58〇55 provides elasticity and good sealing for household electronic devices and electronic devices by using tantalum or polyurethane. effect. However, in the manufacturing process of the elastic layer of Korean Patent No. 2005-0058055, it is necessary to apply a pattern on the elastic layer after forming the mixed coating of the elastic layer, thereby making the manufacturing process difficult. On the other hand, the diaphragm configuration of the cymbal pad of Korean Patent No. 2002-0015239 makes this lining pad advantageous in that it can be easily applied to various home electronic devices or electronic devices. The film can be attached to the electronic device by placing a double-sided adhesive on one side of the pad, or by applying an acrylic adhesive to the pad = Φ. Attached to an electronic device. However, the surface tension of the pad is low, and the film between the film and the tape or the adhesive is adhered. Therefore, when the film is attached to the electronic device, the film of the film may be peeled off. Coating::::Tumes::, recently, the additional primer (Primer) τ V, although... This can achieve good adhesion strength, but at a cost. In addition, the lesson has become a step in the process of applying a primer, which causes the process to cause impurities. Since the mixture of primers has an organic solvent, it is also an environmental problem. The material of the agent or tape is used as a primer, and (4) can be used as an adhesive between the adhesives to improve the manufacturing cost and the manufacturing cost without using the primer. However, this method not only reduces the adhesion but also increases the enthalpy, and the gas can be used to improve the elasticity of the gas, and the plasticity must be added. Sealing properties. As time increases, the plasticizer easily turns to 200932516 and moves to the surface of the electronic device, and the plasticizer can contaminate the internal parts of the device, causing device failure and shortening the life of the device. The 70 sheets are made by applying an adhesive to the lining of the lining, or by applying a film to the mat. Since these procedures must be made by applying pressure tape, it is impossible to produce in an automated process, which reduces the speed of production. If the product is assembled or used, the double-sided tape is recognized and the film is fixed. The attachment portion of the electronic device maintains its media. However, the use of double-sided tape increases the overall thickness of the diaphragm. Winter ^ set. © When there is a limit, the use of double-sided tape also reduces the compressibility; the octave has a reduced portion of the incompressible material, resulting in a reduction in the shrinkage of the entire diaphragm - making the diaphragm unable to absorb shock and seal gaps Requirements. In addition, the addition of a procedure for attaching double-sided tape results in loss of product material and increases the chances of inferior quality and reduces production. SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a diaphragm for sucking and sealing. The diaphragm includes a selective film layer and an adhesive layer. The present invention reduces the number of adhesive layers and support film layers applied to the film and increases the thickness of the layer of the polyamine s layer of '4 = compressibility. Therefore, the diaphragm of the present invention has a better ability to absorb impact and seal, and the process is relatively simple. CHILDREN PROCESS The present invention relates to a film for absorbing impact and sealing == a foamed layer. The fine layer includes an adhesive layer. Foaming The present invention relates to a method of preparing a diaphragm 5 200932516 for absorbing impact and sealing. According to an aspect of the invention, there is provided a diaphragm for absorbing impact and sealing, comprising a support film layer, an adhesive layer and a foam layer. The adhesive layer is formed on one side of the support film layer. The foam layer is used to absorb the impact and is formed on the other side of the film layer of the branch. The film of the present invention may further comprise a release film layer or a release paper layer laminated on the adhesive layer. According to another aspect of the present invention, there is provided a method of preparing a diaphragm for absorbing impact and sealing, comprising the following steps. First, an adhesive layer is formed on the support film layer by applying an adhesive to one side of the support film layer. Next, the foamed layer for absorbing the impact is formed by coating the foamed material for absorbing the impact on the other side of the support film layer. The other side of the support film layer is on the opposite side of the adhesive layer. Then, the foamed material is cured. According to still another aspect of the present invention, there is provided another method of preparing a diaphragm for absorbing impact and sealing, comprising the following steps. First, a foamed material for absorbing impact is applied to one side of the support film layer to form a foamed layer for absorbing impact. Next, the foamed material is cured. Then, an adhesive layer is formed on the other side of the support film layer by applying an adhesive to the other side of the support film layer. The other side of the support film layer is located on the other side of the foam layer. The film preparation method may further include: forming a delamination layer or a release paper layer by laminating the release film or the release paper layer after forming the adhesive layer. In order to make the content of the present invention more obvious and easy to understand, the following specific descriptions of the &&embodiment' and the formula are as follows: [Embodiment] 200932516 The following reference figures 1 to 5 The present invention will be described in detail. The i-th is based on the manufacturing process of the diaphragm for absorbing shock. Figure 2 illustrates the manufacturing process of a film comprising an adhesive for absorbing impact in accordance with the present invention. Conventionally, a diaphragm for absorbing impact is subjected to a laminating process using double-sided tape, whereby a foamed layer and/or a release film layer for absorbing impact are formed on the support floor ( Release film layer). However, the adhesive layer of the present invention is formed on the support film layer, and the present invention does not require an additional lamination process. Because of this, the present invention has the advantages of simplifying the process, reducing material loss, and reducing the chance of inferior quality. Fig. 3 shows the cross-sectional structure of a diaphragm which is conventionally used for absorbing impact. Figure 4 is a cross-sectional view showing a conventional diaphragm for absorbing impact, and a double-sided tape is laminated on the diaphragm. The third embodiment includes a portion of the domain film layer 1 and the polyurethane layer 20. Fig. 4% shows the release film layer, the adhesive layer 3〇, the support film layer 1 and the polyurethane layer 2〇. The structure shown in Figure 3 has only two layers and therefore has its limitations. In addition, in the diaphragm shown in Fig. 4, the double-sided cleavage is quiet. The portion of the material that can be pressed against is relatively large, making the overall compressibility low. Therefore, the diaphragm has a low ability to absorb impact and has a poor sealing effect. The other aspect is the fifth section of the present invention for absorbing the impact of the diaphragm (4). The film U includes a slit film layer, and an adhesive layer is formed on the support film layer. This portion includes the release film layer 40, the adhesive layer 3, the support film layer, and the polyurethane layer, and the reference numeral 22 (the portion in the broken line) in Fig. 5 shows the overall thickness increase when the double-sided tape is used. Or it is shown that when the overall thickness is maintained, the thickness of the <polyammonium layer is relatively reduced. The device of the present invention protects the components of the 200932516 sub-device from external force impact and is effective in blocking contaminants such as dust. In addition, when the thickness of the film layer is the same, since the portion of the unnecessary incompressible material layer can be minimized, the thickness of the polyurethane (4) of the film of the present invention is large, and therefore the film of the present invention is more sturdy. The membrane of the present invention is superior in its ability to absorb impact and seal as compared to conventional membranes which are laminated on a support layer using double-sided tape. According to an embodiment of the present invention, a method for preparing a diaphragm for absorbing impact and sealing includes: applying an adhesive to one side of a support film layer to form an adhesive layer on the support film layer, and coating The foamed material is absorbed on the other side of the support film layer to form a foamed layer for absorbing impact, and the foamed material is cured. The other side of the support film layer is located on one side with respect to the adhesion. In the present invention, the support film layer is used as a substrate, and the support film layer 10 may include any material generally used for absorbing impact and sealing. For example, the floor film can be a transparent or white plastic film. Specifically, the support film layer may include at least selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyester, poly Polyamide, polycarbonate, ethylene vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene propylene copolymer One of a group of ethylene-propylene copolymer and a combination of polyvinyl chloride. However, the invention is not limited thereto. In order to improve the adhesion of the substrate to the adhesive layer and the polyurethane layer, the support film layer is preferably subjected to corona discharge treatment (corona 200932516 discharge treatment), electrothermal treatment (such as piasma), blasting treatment, chemistry Chemical etching treatment, primer treatment, and the like. The support film layer 10 provides the appropriate support strength of the film. Since the shape of the adhesive layer deposited on the product is very easy to control, the support film layer has excellent usability. In the present invention, the thickness of the support film layer 1 can be determined depending on the nature of the product. In order to have the lowest support strength capable of maintaining the shape, the thickness of the support layer is preferably not less than 5 μm. In order to prevent the entire film from becoming too thick, the thickness of the support film layer is preferably not more than 125 μm. The adhesive layer 30 can be an adhesive material that is often used in the related art. Compared with other materials, this material has a suitable adhesive strength, for example, not less than 1 kgf per 吋, and its heat resistance is not less than 6 〇. Representative examples of the adhesive material include at least a natural rubber adhesive, styrene-butadiene latex based adhesives, and ABA block copolymer-type thermoplastic rubber ( A represents a thermoplastic polystyrene terminal block, 0 B represents a rubber intermediate block such as polyisoprene, polybutadiene or polyethylene/polybutylene, butyl rubber (isobutylene-isoprene rubber), poly A group of combinations of polyisobutylene, acrylic adhesives, and vinyl ether copolymer. Acrylic adhesives are, for example, polyacrylates and ethylene acetate/propylene ester copolymers. The ethene ether copolymer is, for example, a poly vinylmethylether, a polyvinylethylether, and a polyvinylisobutylether. Preferred examples include at least selected from the group consisting of vinegar 9 200932516 vinyl acetate, methyi 'methacrylate, ethyl acetoacrylate, and sulfonated polystyrene. One of the groups of adhesives. However, the invention is not limited thereto. In the present invention, the adhesive layer 3 is used to prevent the film from being detached from the adhesive portion of the electronic device when the device is assembled or used. Therefore, the peel strength between the adhesive layer and the support film layer is preferably such that the adhesive layer can be maintained for a period of time without being detached from the support film layer, for example, not less than 200 gr/cm. Further, the adhesive layer may include a material having an adhesive strength of not less than 5 〇〇 gr/inch and a heat resistance of not less than 60 °C to ensure durability of the product applied to the mobile display module. The adhesive layer 30 is formed by coating one side of the support film layer. The film of the floor is made of transparent or white plastic, for example, PET or PEN with adhesiveness. In other words, any coating method commonly used in the related art can be used, such as gravure, micro gravure printing, die coating, c〇mma coating, dipping Dip coating, etc. However, the invention is not limited thereto. The thickness of the adhesive layer formed on one side of the support film layer 10 is preferably not less than 5 μm to provide an appropriate adhesive strength. In addition, the thickness is preferably not more than 150 μm to avoid excessive thickness of the finished product and unexpected events in Thoms〇n processing, that is, the adhesive layer is pushed too thick to the edge and contaminates the product due to the excessive thickness of the adhesive layer. And machinery. The film for absorbing impact and sealing of the present invention may further comprise a release film layer or a release paper layer laminated on the adhesive layer. The release film or release paper layer can be a transparent or white 200932516 color plastic film. In detail, the plastic film may include at least one selected from the group consisting of polyethylene (PE), polyethylene terephthalate, polyethylene naphthalate, and the like. However, the invention is not limited thereto. The thickness of the release film layer or the thickness of the release paper layer is preferably from 5 to 125 μm. When the release liner or release liner is too thin, the release liner is difficult to remove when in use. When the release film layer or the release paper layer is too thick, it will affect the overall thickness of the product. Therefore, the release film layer or the release paper layer preferably has the above thickness. Further, the release strength 〇 of the release film layer or the release paper layer and the adhesive layer is preferably at least 5 gr/cm. When the peel strength is low, the release paper layer is easily separated from the adhesive layer during the manufacturing process, making it difficult to manufacture or move the product. When the peel strength is high, it becomes difficult to remove the release film layer at the time of use. Therefore, the peel strength is preferably maintained within a certain range. The diaphragm for absorbing impact and sealing of the present invention comprises a foamed layer formed of a foamed material and used to absorb impact. The foamed layer is applied to the other side of the support film layer, i.e., on the opposite side from the adhesive layer. The thickness of the foamed layer for coating to absorb impact is preferably not less than 0.05 mm to maintain an acceptable minimum absorption shock effect. The thickness of the foamed layer is preferably not more than 10 mm to maintain the sealing effect with the rough surface of the electronic product, and to prevent the finished product from becoming too thick to maintain the lightness and thickness of the electronic device. The foaming material for absorbing impact of the present invention may be foamed polyurethane ‘and can be subjected to electrostatic discharge treatment (ESD) as needed. The foamed polyurethane formed by reacting a polyalcohol (p〇ly〇1) with a polyisocyanate may have a specific gravity of between 3 gr/cm 3 and 90 gr/cm 3 . The polyalcohol may be at least selected from the group consisting of polyether polyol, polyfluorene polyol (p〇lyester p〇ly〇1), poly 200932516 caprolactone polyol, and the like; . The poly-myster polyol is, for example, polyethylene glycol, polypropylene glycol, polytetramethylene glycol or the like. In addition, isocyanate, that is, a monomer of polyisocyanate, is at least selected from the group consisting of methylene-diphenyl diisocyanate and polydiphenylcarbamate. Isocyanate (polymeric methylene-diphenyl diisocyanate), modified diphenylmethane diisocyanate, toluene diisocyanate, isophorone diisocyanate, hexamethylene diisocyanate Acid (hexamethylene diisocyanate), modified carbodiimide 0f the diisocyanate, dimer of the diisocyanate, trimer of the diisocyanate One of a group consisting of a prepolymer formed by reacting an isocyanate and a polyalcohol. Catalysts are often used in the reaction of polyalcohols and polyisocyanates. The catalyst may be at least selected from the group consisting of a metal catalyst and an amine catalyst. The metal catalyst is, for example, dibutyltin dilaurate, tetrabutyltitanate or the like. The amine catalyst is, for example, tridecylamine, triethylamine, triethanolamine or the like. The fluorine blowing agent, the air foaming agent and the hydrocarbon blowing agent may be used as a foamed foaming material, or may be foamed using blister gas or water. In addition, a small amount of a fragmented surfactant can also be used. After uniformly mixing materials such as polyether polyols and polyisocyanates and additives such as catalysts, the mixture may be applied to the support film layer. For example, an Oaks mixer can be used for mixing. Foaming 12 200932516 Poly' urethane is coated in the above range, and is formed by placing the foamed polyurethane in a continuously set oven and curing at a temperature of not less than 120 ° C to form a uniform thickness. Foam. The foamed polyurethane of the present invention preferably has the following properties. The foamed polyurethane of the present invention has an appropriate ability to absorb impact. Further, the foamed polyurethane of the present invention preferably has a repulsive force of 15 to 50% in accordance with the ball bound test of ASTM D3574. When the diaphragm for absorbing shock and sealing of the present invention is applied and assembled on a product, the diaphragm is slightly compressed. When the compressive strength of the foamed polyurethane is too large, a strong force is required for assembly, thereby causing mechanical damage or reducing the efficiency of assembly. Therefore, the compressive strength of the 'foamed polyurethane needs to be within an appropriate range. Under the compressibility of 25%, the compressive strength of the foamed polyurethane is preferably not more than 5 kgf/cm 2 , more preferably 〇 .〇1 to 5 kgf/cm2. Further, the permanent compression strain rate of the foamed polyurethane is preferably between 0.5 and 10%. As a result, the strain of the diaphragm can be prevented when the diaphragm is applied to the product. Further, the foamed polyurethane preferably has a coefficient of expansion of not less than 1% by weight for bonding the polyurethane to the device. The Shore hardness of the foamed material is preferably not less than 5 to avoid deterioration of the mechanical material. The foamed material preferably has a Shore hardness of less than 8 Torr to prevent excessive stress from being applied to the electronic device during assembly and to impart a suitable shock absorbing ability to the foamed material. For the same reason as described above, the tensile strength of the foaming material is preferably from 2 to 3 kgf/cm2. According to another embodiment of the present invention, a method of preparing a film for absorbing impact and sealing may include the following steps. First, a foamed layer for absorbing the impact 13 200932516 is formed by coating a foamed material for absorbing impact on one side of the support film layer. Next, the foamed material is cured. Then, the other side of the film layer is supported to form an adhesive layer. The cut/cloth adhesion agent is located on the side opposite to the foamed layer. Each of the steps of the material and method of the other surface of the present invention is the same as that of the above-described example, but the order of forming the film layer is different. The implementation of the present invention is similar to the embodiment of the present invention, but the foaming method can be further formed by laminating the Wei or the release paper to form a viscous film layer or Release paper layer. The upper portion is formed as described above, and the member for absorbing and protecting the electronic device of the present invention is not damaged by an external impact, and the sheet can be protected from external contaminants of dust. Since the necessary portion of the effective barrier is not minimized, the thickness of the non-membrane polyurethane (4) in the layer of the same thickness is relatively high. Compared with the diaphragm laminated on the substrate, the present invention has the ability to absorb shock and seal. In addition, the shrink preparation method simplifies the preparation process of the diaphragm. Since the layer = the preparation method of the present invention can reduce material loss and inferior quality = process 2, further describe and exemplify the invention. However, the scope of this document is not limited to this. Example 1: Forming an Adhesive Substrate The hidenl SA 33()a (HanSUng-polymer Ltd.) was coated on a transparent ρΕτ using a doctor blade applicator. The thickness of the SA-330A was 50, and the thickness of the pET was It is 5〇μβι. The coated film was placed in an oven for 5 minutes and the temperature was 12〇 200932516 to 140 °C. After drying, the release PET film coated with ruthenium was immediately laminated on the film, and a roll was rolled on the film. Example 2: Preparation for the diaphragm to absorb the impact

當混合下列之表2中除了 ISONATE™ 143L以外之材 料後，此混合物係利用Oaks混合器而與DONATE™ 143L 混合。然後，使用刮刀式塗佈器塗佈上述混合物於範例一 之黏著基板之PET膜上，且此混合物之厚度為Q 5_、i © mm及2 mm。塗佈之材料係於丨咖至·。c之溫度下固 化12分鐘’並於連續自動化製程中準備，在準備之後立 即以滚筒滚動。 表二 — 一 材料 一重量份數（parts by weight) 100 —--- YUK0L 3553 (聚乙二醇，SKC Ltd.) —--- 二丙二醇 --S_ 15 碳酸鈣 --- Niax L-5309 (界面活性劑， GE silicone Ltd.) ------ 110 —--------- 0.5 '— 辛酸亞錫 ----— 0.005 ISONATE™ 143L 修飾之 MDI (Dow Ltd.) 47 200932516 範例三：準備後之用以吸收衝擊之膜片之性質 上述範例二中所準備之能夠密封及吸收衝擊之膜片 具有下列性質。 表三 球回彈率 抗壓強度 黏著強度 黏著劑财 25% 熱性 厚度0.5mm 20% 0.07 kgfi^cm2 1.3 kg/inch 1mm 厚度1 .Omm 21% 0.11 kgf/ cm2 1.3 kg/inch 1mm 厚度2.0mm 21% 0.11 kg 位 cm2 1.3kg/inch 2 mm 測量方法 ASTM D3574 ASTM D3574 ASTM D2314 ※註記 ※（註記）黏著劑耐熱性：當貼附於不鏽鋼測試樣品後， 膜片於溫度85°C及載重500gr/inch的條件下所量測到之移 動距離。 綜上所述，雖然本發明已以一較佳實施例揭露如上， 然其並非用以限定本發明。本發明所屬技術領域中具有通 常知識者，在不脫離本發明之精神和範圍内，當可作各種 之更動與潤飾。因此，本發明之保護範圍當視後附之申請 專利範圍所界定者為準。 【圖式簡單說明】 第1圖依照繪示習知用以吸收衝擊之膜片之製造流 程； 第2圖繪示依照本發明之包括黏著劑之用以吸收衝 16 200932516 擊之膜片之製造流程； 第3圖繪示依照習知用以吸收衝擊之膜片之剖面結 構； 第4圖繪示習知之用以吸收衝擊之膜片之剖面結 構，且雙面膠帶係層積於膜片上；以及 第5圖繪示依照本發明之用以吸收衝擊之膜片之剖 面結構。 _ 【主要元件符號說明】 10 :支撐膜層 20 :聚氨酯層 22 :厚度 30 :黏著層 40 :離型膜層 17When mixing materials other than ISONATETM 143L in Table 2 below, the mixture was mixed with DONATETM 143L using an Oaks mixer. Then, the above mixture was applied to the PET film of the adhesive substrate of Example 1 using a doctor blade coater, and the thickness of the mixture was Q 5_, i © mm and 2 mm. The coated material is from 丨 到 to . Cured at a temperature of c for 12 minutes' and prepared in a continuous automated process, immediately rolling off the drum after preparation. Table 2 - Part 1 by parts by weight 100 —--- YUK0L 3553 (polyethylene glycol, SKC Ltd.) —--- Dipropylene glycol--S_ 15 Calcium carbonate --- Niax L-5309 (Interacting Agent, GE silicone Ltd.) ------ 110 —--------- 0.5 '- Stannous octoate----- 0.005 ISONATETM 143L Modified MDI (Dow Ltd.) 47 200932516 Example 3: Properties of the membrane for absorbing impact after preparation The membranes prepared in the above Example 2 capable of sealing and absorbing impact have the following properties. Table 3 Ball Rebound Rate Compressive Strength Adhesive Strength Adhesive 25% Thermal Thickness 0.5mm 20% 0.07 kgfi^cm2 1.3 kg/inch 1mm Thickness 1. Omm 21% 0.11 kgf/ cm2 1.3 kg/inch 1mm Thickness 2.0mm 21 % 0.11 kg Bit cm2 1.3kg/inch 2 mm Measurement method ASTM D3574 ASTM D3574 ASTM D2314 ※Note ※ (Note) Adhesive heat resistance: When attached to a stainless steel test sample, the diaphragm is at a temperature of 85 ° C and a load of 500 gr / The measured moving distance under the condition of inch. In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a manufacturing process for a diaphragm for absorbing impact according to the drawing; FIG. 2 is a view showing the manufacture of a diaphragm for absorbing a punch 16 200932516 in accordance with the present invention. Figure 3 is a cross-sectional view of a diaphragm for absorbing impact according to a conventional method; Figure 4 is a cross-sectional view of a conventional diaphragm for absorbing impact, and a double-sided tape is laminated on the diaphragm. And Figure 5 illustrates a cross-sectional structure of a diaphragm for absorbing impact in accordance with the present invention. _ [Main component symbol description] 10 : Support film layer 20 : Polyurethane layer 22 : Thickness 30 : Adhesive layer 40 : Release film layer 17

Claims (1)

200932516 ^ · 七、申請專利範圍： 1· 一種用以吸收衝擊及密封之膜片，該膜片包括： 一支撐膜層； 一黏著層’形成於該支撐膜層之一面；以及 一發泡層’用以吸收形成於該支撐膜層之另一面之衝 擊。 2. 如申請專利範圍第1項所述之膜片，其中該支撐 膜層之厚度係介於5μιη至125μιη。 3. 如申請專利範圍第1項所述之膜片，其中該支撐 β 膜層係由一透明或白色之塑膠膜形成。 4. 如申請專利範圍第1項所述之膜片，其中該支撐 膜層至少包括選自由聚對苯二曱二乙醋（polyethylene terephthalate，PET )、聚二甲酸乙二醇醋（polyethylene naphthalate，PEN)、聚醋纖維（polyester)、聚醯胺 (polyamide)、聚碳酸脂（polycarbonate)、乙浠醋酸乙稀 S旨共聚物（ethylene vinyl acetate copolymer)、乙烯丙烯酸 乙醋共聚物（ethylene-ethyl acrylate copolymer)、乙稀丙 ❹ 稀共聚物（ethylene-propylene copolymer )及聚氯乙稀 (polyvinylchloride)組合之群組中之一材料。 5. 如申請專利範圍第1項所述之膜片，其中該黏著 層係至少包括選自由丁苯膠乳基黏著劑（styrene-butadiene latex based adhesives)、ΑΒΑ塊狀共聚合物型熱塑性橡膠 (ABA block copolymer-type thermoplastic rubber) ( Α 代 表熱塑性聚苯乙烯終端塊體，且B代表橡膠中間塊體）、 丁基橡膠（isobutylene-isoprenerubber)、聚異丁烯 18 200932516 (polyisobutylene )、丙烯酸黏著劑（acrylic adhesives )以 及乙晞醋共聚合物（vinyl ester copolymer)所組合之群組 中之一黏著劑。 6. 如申請專利範圍第1項所述之膜片，其中該黏著 層之厚度介於5μιη至150μιη之間。 7. 如申請專利範圍第1項所述之膜片，其中該黏著 層由該支撐膜層剝離之剝離強度係不小於200 gr/cm。 8. 如申請專利範圍第1項所述之膜片，其中用以吸 ® 收衝擊之該發泡層係由發泡之聚氨酯所形成。 9. 如申請專利範圍第8項所述之膜片，其中發泡之 聚氨酯具有一排斥力，且根據球回彈測試，該排斥力係介 於至50% ’在25%之壓縮性下，發泡之聚氨酯之抗 壓強度係介於0.01至5kgf/cm2之間。 10·如申請專利範圍第8項所述之膜片，其中發泡之 聚氣自旨係經過靜電釋放處理（electro-static discharge， BSD)。 〇 11.如申請專利範圍第1項所述之膜片更包括層積於 該勘著層上之一離型膜層或一離型紙層。 12·如申請專利範圍第11項所述之膜片，其中該離 型媒層或該離型紙層之厚度係介於5μιη至125μιη之間。 13. 如申請專利範圍第11項所述之膜片，其中該離 型膜層或該離型紙層由該黏著層剝離之剝離強度係不小 於 5 gr/cm。 14. 一種如申請專利範圍第1項至第^項所述之膜 片之準備方法包括： 19 200932516 藉由塗佈一黏著劑於一支撐膜層之一面，以於該支樓 膜層上形成一黏著層；以及 藉由塗佈用以吸收衝擊之一發泡材料於該支撐膜層 之另一面以形成用以吸收衝擊之一發泡層，並固化該發泡 材料，其中，該支撐膜層之該另一面係位於與該黏著層相 對之一側。 15. 如申請專利範圍第14項所述之方法更包括： 當形成該黏著層之後，藉由層積一離型膜或一離型紙 於該黏著層上，以形成一離型膜層或一離型紙層。 ❹ 16. —種如申請專利範圍第1項至第11項所述之膜 片之準備方法包括： 藉由塗佈用以吸收衝擊之一發泡材料於一支撐膜層 之一面以形成一發泡層，並固化該發泡材料；以及 藉由塗佈一黏著劑於該支撐膜層之另一面，以形成一 黏著層，且該支撐膜層之該另一面係位於該發泡層相對之 一侧。 17. 如申請專利範圍第16項所述之方法更包括： ❹ 當形成該黏著層之後，藉由層積一離型膜或一離型紙 於該黏著層上，以形成一離型膜層或一離型紙層。 20200932516 ^ · VII. Patent application scope: 1. A diaphragm for absorbing impact and sealing, the diaphragm comprising: a supporting film layer; an adhesive layer formed on one side of the supporting film layer; and a foam layer 'To absorb the impact formed on the other side of the support film layer. 2. The film of claim 1, wherein the support film layer has a thickness of from 5 μm to 125 μm. 3. The membrane of claim 1, wherein the support beta membrane layer is formed from a transparent or white plastic film. 4. The membrane of claim 1, wherein the support film layer comprises at least one selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (polyethylene naphthalate). PEN), polyester, polyamide, polycarbonate, ethylene vinyl acetate copolymer, ethylene-ethyl acrylate copolymer One of a group of acrylate copolymer, ethylene-propylene copolymer and polyvinyl chloride. 5. The film of claim 1, wherein the adhesive layer comprises at least a styrene-butadiene latex based adhesives, a lumps-like polymer thermoplastic rubber (ABA). Block copolymer-type thermoplastic rubber) ( Α stands for thermoplastic polystyrene terminal block, and B stands for rubber intermediate block), butyl rubber (isobutylene-isoprenerubber), polyisobutylene 18 200932516 (polyisobutylene), acrylic adhesives And an adhesive in the group of combinations of vinyl ester copolymers. 6. The film of claim 1, wherein the adhesive layer has a thickness of between 5 μm and 150 μm. 7. The film of claim 1, wherein the adhesive layer is peeled off from the support film layer by a peel strength of not less than 200 gr/cm. 8. The film of claim 1, wherein the foam layer for absorbing the impact is formed of foamed polyurethane. 9. The film of claim 8, wherein the foamed polyurethane has a repulsive force, and according to a ball rebound test, the repulsive force is between 50% and 25% compressibility. The compressive strength of the foamed polyurethane is between 0.01 and 5 kgf/cm2. 10. The film of claim 8, wherein the foamed gas is subjected to an electro-static discharge (BSD). 11. The film of claim 1, further comprising a release film layer or a release paper layer laminated on the distribution layer. The film of claim 11, wherein the release medium layer or the release paper layer has a thickness of between 5 μm and 125 μm. 13. The film of claim 11, wherein the release film layer or the release paper layer is peeled off from the adhesive layer by a peel strength of not less than 5 gr/cm. 14. A method for preparing a film according to any one of claims 1 to 4, comprising: 19 200932516 forming an adhesive on one side of a support film layer to form a film on the support layer An adhesive layer; and a foamed layer formed by absorbing an impact foaming material on the other side of the support film layer to absorb an impact, and curing the foamed material, wherein the foamed material is cured The other side of the layer is on one side opposite the adhesive layer. 15. The method of claim 14, further comprising: after forming the adhesive layer, by depositing a release film or a release paper on the adhesive layer to form a release film layer or a Release paper layer. ❹ 16. A method for preparing a membrane according to any one of claims 1 to 11 includes: forming a hair by coating one of the foamed materials on one side of a support film layer by coating Foaming layer and curing the foamed material; and forming an adhesive layer by coating an adhesive on the other side of the support film layer, and the other side of the support film layer is located opposite to the foamed layer One side. 17. The method of claim 16, further comprising: ❹ forming a release film or a release paper on the adhesive layer after forming the adhesive layer to form a release film layer or A release paper layer. 20
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CN101918213A (en) 2010-12-15

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