TW200929414A - Monitoring device, monitoring method, inspection device and inspection method - Google Patents

Abstract

A monitoring device is provided with an illuminating section (10) for irradiating the surface of a wafer (W) with illuminating light; an imaging section (25) for imaging the wafer (W) irradiated with the illuminating light (10); a recording section (32) for storing the image of the wafer (W) imaged by the imaging section (25); and a monitor (34) for displaying the image of the wafer (W) stored in the recording section (32). The still image of the wafer (W) irradiated with the illuminating light is imaged by the imaging section (25), irradiation of the illuminating light is stopped by the illuminating section (10) after the still image is acquired, and in a state where irradiation of the illuminating light is stopped, the image of the wafer (W) stored in the recording section (32) is displayed on a monitor (34).

Description

In the present invention, the present invention relates to an observation apparatus and an observation method, an inspection apparatus, and an inspection method for an inspection object such as a semiconductor wafer or a liquid crystal glass substrate. [Prior Art] Conventionally, the visual inspection of a semiconductor wafer is performed by using a microscope, and the operator visually observes the surface of the wafer illuminated by the visible light (for example, see Patent Document). When the operator observes the wafer in this manner, the observation time of the wafer cannot be specified to be the same. Patent Document 1: JP-A-2002-33365 SUMMARY OF THE INVENTION [Invention] Therefore, the operator takes time to observe the wafer and when the device is separated, the wafer is continuously illuminated by visible light. However, when a new material is used as the semiconductor product is increased, the visible light is deteriorated due to the long-term exposure of the visible light to the new material. As described above, if the illumination is continued for a long time, the surface of the wafer is formed. The material will be deteriorated due to the influence of illumination. The present invention has been made in view of such a problem, and an object of the invention is to provide an observation apparatus and an inspection method, an inspection apparatus, and an inspection method which are capable of deteriorating an inspection object and capable of visual inspection for a long period of time. In order to achieve such an object, the observation apparatus of the present invention includes: illumination for illuminating illumination light to an inspection object on which a circuit pattern is formed; imaging unit for photographing the inspection object illuminated by the illumination light; and storage unit for storing : 6 200929414 The image of the object to be inspected by the photographing unit; and a display unit for displaying the image of the object to be inspected stored in the storage unit; and the photographing unit in a state where the illumination unit is illuminated by the illumination unit After the object to be inspected is photographed, the image captured in this manner is stored in the storage port, and the illumination of the illumination portion is stopped, and the image of the object to be inspected stored in the storage portion is displayed on the display. unit. ❹ ❹ Preferably, the observation device includes: an operation unit that can perform an operation for changing a display area of the inspection object displayed by the display unit; and a display area changing unit that stores the storage area according to the storage unit The image of the object to be inspected generates an image of the object to be inspected corresponding to the change in the display area by the operation of the operation unit; and the change of the display area is caused by the operation of the operation unit, The image of the inspection object generated by the display area changing unit is displayed on the display unit, and the display area changing unit generates the inspection object corresponding to the change in the display area due to the operation of the operation unit. The image is stored on the surface of the object to be inspected by the illumination unit, and the image is inspected by the camera unit, and the desired portion of the file is stored in this manner. ...the storage portion, and the illumination of the illumination light of the illumination portion is suspended. Operation and 5 observation device # 'better system, # to be displayed in the display area of the operation unit _ the at least one part of the inspection object image: save == save: when the photography unit is shooting An image that is not stored in the portion of the day is included as an image of the desired portion. According to the "better" of the apparatus, the photographing position setting unit is provided, and the first human photographing position is set, and the photographing predetermined position after the second photographing of 7 200929414 is set; the display area changing unit is configured to generate The image of the object to be inspected corresponding to the change of the display area, if necessary, at the photographing position setting unit, the photographing unit advances the object to be inspected after the second time photography. In the observation apparatus, preferably, the display area changing unit performs control to determine that the image is in an arbitrary position in the display area when the image is generated corresponding to the change of the display area. Checking whether the object image is stored in the health care unit, and then setting the photographing area $ of the photographing unit according to the determination result, and photographing the photographing area set by the photographing unit by the photographing unit under illumination of the illumination unit $, storing the image captured in this manner in the storage portion, and suspending illumination of the illumination light of the illumination portion / # - in the above observation device, preferably by the display region changing portion It can be set in an area other than the image stored in the storage section. In the above observation apparatus, preferably, any position in the display area is an end portion of the display area. In the above observation apparatus, preferably, the display area is rectangular, and the arbitrary position is the four corners of the display area. The inspection apparatus of the present invention includes: an observation device for observing an object to be inspected having a circuit pattern; and a recording portion for recording the quality of the object to be inspected by observing the object to be inspected by the observation device The observation device is constituted by any of the above observation devices. Further, the observation method of the present invention includes: an i-th step of irradiating illumination light onto a surface of the inspection object on which the circuit pattern is formed; and a second step of photographing 8 200929414 the inspection object irradiated with the illumination light; The image of the object to be inspected in the second step is stored in the storage unit. In the fourth step, after the image is taken in the first step, the illumination light is stopped, and the object is inspected. And a fifth step of displaying the image of the object to be inspected in the storage unit on the display unit. Preferably, in the observation method, the sixth step is performed to perform the inspection on the display unit. The operation of changing the display area of the object; ❹ ❹ The first step is to generate the display area according to the image of the object to be inspected stored in the storage unit, and the insertion of the %### ^ The change produced corresponds to the shadow of the 5 hai test object, the Chu Q ten sleeps the Beijing image, and the eighth step, according to the operation of the sixth step, causes the change of the display area to be generated by the seventh step. The image of the object to be inspected is displayed on the display And the ninth step, in order to generate an image of the f-check object corresponding to the change in the display area due to the operation of the seventh step, as needed, by irradiating the illumination light to the detected object: The surface of the object 'and the required portion of the object to be inspected is stored in a desired portion of the image taken in this manner, and the illumination of the illumination light of the object to be inspected is suspended. In the ninth step, when at least a portion of the image to be detected in the display area that is to be changed by the operation of the step 6 is not stored in the storage portion, the photographing includes not being stored in the storage portion. In the present part of the storage unit, the image of the image. H (4) image as the required part: In the observation method, preferably, the 10th step, according to the 1st shooting position of the second step, the second time is set. The photographing predetermined position; 9 200929414 In the ninth step, if necessary, at any of the photographing predetermined positions to be set in the step ίο, the still image of the object to be inspected after the second time is photographed. Among the above observation methods, preferably In the seventh step, when the image of the object to be inspected corresponding to the change of the display area is generated, it is determined whether the image of the object in the arbitrary position in the area is stored in the storage. And setting an imaging area for acquiring the image of the object to be inspected according to the determination result, and in the ninth step, the imaging unit set the imaging area set in this manner by the imaging unit under illumination of the illumination unit The image captured in this manner is stored in the storage portion and the illumination of the illumination portion is stopped. ^ In the above observation method, preferably, the imaging region set according to the determination result can be set in addition to It is stored in an area other than the image of the storage unit. ^ In the above observation method, preferably, any position in the display area is an end portion of the display area. In the above observation method, the display area is rectangular, and the arbitrary position is the four corners of the display area. The inspection method of the present invention comprises: an observation step for observing an object to be inspected having a circuit pattern; and an observation result of the inspection object in (4), root (4) observation (4), and determining whether the object to be inspected is good or bad. The object to be inspected was observed using any of the above observation methods. According to the present invention, the illumination light that is irradiated onto the inspection object on which the circuit pattern is formed can be suppressed to a minimum, and the inspection object can be deteriorated and the appearance inspection can be performed for a long period of time. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Figure i shows an inspection apparatus provided with the observation apparatus of the present invention. As shown in FIG. 1, the inspection apparatus 1 of the present embodiment has a wafer stage 5 for supporting a semiconductor wafer w (hereinafter referred to as a wafer w) of a test object in which a circuit pattern is formed; The illumination system 10 illuminates the surface of the wafer w; the photographing system 20 for photographing the wafer w illuminated by the illumination light; and the control system 30 for controlling the operation of the device. The wafer stage 5 supports the wafer w so as to be movable in the x, y, and z axis directions orthogonal to each other. Further, it is assumed that the optical axis direction of the photographing system 20 is the z-axis direction. The illumination system has a light source ii composed of a white LED or the like, a lens 12, an illuminance equalizing unit 13 including an interference filter, an aperture beam 14, a field stop 15, and a lens 16. The light emitted from the light source u is transmitted through the lens 12 and the illuminance equalizing unit 13, passes through the aperture stop 14 and the field of view 阑15, and is transmitted through the lens 16 to become a parallel beam. In this manner, the parallel beam system emitted from the <, month system 1G is reflected by the half mirror and guided to the objective lens 18' to coaxially project the wafer mounted on the wafer stage 5.

The light system illuminated by the coaxial epi-illumination on the wafer w is reflected by the wafer w, returned to the objective lens 18, transmitted through the half mirror 17, and then incident on the imaging system 2A. In the photography system, the first 20 series is composed of a lens 21, a half turn 22, and a photographing unit 25, and the reflected light from the wafer w transmitted through the half mirror 17 is transmitted through the lens illusion and the half turn 22 to reach the photographing unit. On the imaging surface, an image of the wafer W is formed on the imaging surface of the imaging unit. The photographing unit 25 is constituted by a CCD 11 200929414 photographing 7L or the like (not shown), and performs the photoelectric conversion of the reflected image of the wafer w formed on the photographing surface, and then outputs the image data to the CPU 3 of the control system 30. It is also possible to use the eyepiece 23 to guide the light reflected by the half turn 22 to the outside of the apparatus, whereby the surface of the wafer w can also be observed with the naked eye. The control system 30 includes a CPU 3 recording unit 32, an image acquisition table 33, a monitor 34, and an operation unit 35. The cpU 31 is electrically connected to the recording unit 32, the image capturing table 33, the monitor 34, the operation unit 35, the wafer stage 5, the illumination system ι, and the photographing system 20, etc., for integrating the operations of the control unit. When the image data of the wafer W is input from the photographing unit 25 to the cpU 31, the image data of the round W is stored in the recording unit 32 via the CPU 31. In the recording unit 32, in addition to the image data of the recording wafer W, the wafer W determined by the inspection apparatus i is observed to be good or bad. Further, in the recording unit 32, the position of the observation point on the surface of the wafer is registered in advance. Further, the image acquisition table 33 is for confirming that the still image of the wafer W is imaged and stored in the recording unit 32. Further, the monitor 34 displays the image of the wafer W photographed by the photographing °P 25, and the image of the wafer W displayed on the monitor can be observed by the operator to observe the surface of the wafer W. The operation 35 is constituted by a joystick (not shown), a keyboard, or the like. When the operator tilts the joystick of the operating portion 35, the tilting of the joystick=signal is input to the CPU 31, and the CPU 31 outputs a driving signal according to the tilting operation signal D5 to perform the wafer on the wafer carrier 5. W moves to Yushi & . for control. Further, the operator inputs the operation keyboard to register the position of the observation point in the wafer w or the input of the wafer w in the view of 200929414. In the operation unit 35, as will be described later, the mechanism for operating the lower-observation point in the step S107 of the flow is included. # Referring to the flowchart shown in FIG. 2, a method of observing and inspecting the wafer W using the above-described inspection apparatus will be described. First, the wafer W to be inspected is transported to the wafer stage 5 by a transport device (not shown) (step Si〇i). After the wafer W is transferred, the CPU 31 reads the position of the first observation point © registered in the recording unit 32, and outputs a driving signal to the wafer stage 5 to move the wafer w so that the observation point on the surface of the wafer w is located at the objective lens 18. Near the bottom (steps so that the observation point on the surface of the wafer w is located near the objective lens 18, cpim outputs a lighting signal to the light source u (white LED) of the illumination system, and causes the light source 11 to light up ( Step S103) At this time, the light emitted from the light source u is transmitted through the lens 12 and the illuminance equalizing unit 13, passes through the aperture stop 14 and the field stop 15, and is transmitted through the lens 16 to form a parallel beam. After the mirror 17 reflects and transmits the objective lens 18, the coaxial epi-illumination device mounts the wafer W on the wafer stage 5. The light reflected by the wafer W is transmitted through the objective lens 18, the half mirror 17, the lens 21, and The imaging unit 25 captures the image of the wafer w imaged on the imaging surface as a still image (step S104). At this time, the imaging unit 25 is formed in the image. The reflection of the wafer w on the surface is photoelectrically converted to output image data to The CPU 31 of the system 3, after the photographing unit 25 photographs the wafer w in this manner, the CPU 31 immediately outputs a light-off signal to the light source 11 (white LED) to turn off the light source u (step 13 200929414 step S105). Fig. 3 showing the central oblique line indicates that the crystal image taken for a certain observation point is not in the display area of the monitor 34. In Fig. 3, 1 image is taken by the photographing unit 25. Next, the quadrilateral system is used. The image captured in step S104 is indicated.

Table dry: Two defines three coordinate systems, the first one is the base station coordinate, which is used for the loading platform: the driving position of the second. Will be in the step _ filming at the time of the film; like the word "Ssx, Ssy". In the second image constellation, each of the images captured by the inter-material photographing unit 25 is a still image taken in step S1G4 (the image is quiet except for the image). In addition, the steps taken in the 'steps are taken as needed, and the stage is not photographed. In the back step, the image is taken by the photography department 25

Mitt is connected in the xy direction, so when ❹W(10) = ..., the photographing predetermined position (stage coordinates) after the second time is recorded based on the ith photograph. The pixel coordinates on the upper left of the still image captured in step S104 (in addition, in the square shape of Fig. 3 Φ Ding) are set to (〇, 〇). This also indicates the coordinate axis (four) and 7-axis of the pixel coordinates for the captured image. Also, the pixel coordinates of the four corners of each of the still images captured by the upper left image are set to U ^ Pl ', and the upper right pixel is defined as Ρ 2, the lower left ruler is set; I/3 is defined, and the lower right pixel is defined. For Ρ4, and set each pixel, (pixel), the vertical size is Height (pixel), then the pixel coordinates of the four corners of the still image taken in step sl〇4 200929414 can use the pixel coordinates of P1 = (0, 0) ), P2 pixel coordinates = (width - 1, 0), P3 pixel coordinates = (〇, Hight - 1), P4 pixel coordinates = (Width - l, Height - 1) to Table 7J * \ 〇 However, When the still image data of the wafer w imaged in step S104 is input from the photographing unit 25 to the CPU 31, the still image data of the wafer hip is stored in the recording unit 32 via the CPU 31. At this time, the image 33 is initialized, and the image coordinates (0, 0) are registered in the image acquisition table 33. The still image data of the wafer w taken in step S104 is stored in the recording unit 32, and the CPU 31 displays the still image of the wafer w stored in the recording unit 32 on the monitor 34 (step S106). Thereby, in a state where the illumination of the illumination light is turned off and the illumination of the illumination light is stopped, the still image of the wafer W imaged by the imaging unit 25 is displayed on the monitor 34, and not only the deterioration of the wafer w but also the operator can be suppressed. The still image of the wafer w displayed on the monitor 34 can be observed, whereby the surface of the wafer W can be observed. Further, the operator can input the quality of the wafer W determined by the observation wafer w using the keyboard of the operation unit 35, and the operator records the quality of the observed wafer W in the recording unit 32. When the still image of the wafer W is displayed on the monitor 34, the cpu3 i determines whether the observation of the wafer w by the operator has ended, and whether the operator has instructed to move to the next observation point (step S107V when the determination is (Yes), the process returns to step S102, and if the determination is NO (N0), the process goes to step S108e. In step S108, it is determined whether the operator instructs manual movement of the wafer w. When the determination is No (No), Returning to step_, when the determination is Yes, the process proceeds to step. In step S108, when the operator wants to manually move 15 200929414 to move the wafer W to observe the periphery of the observation point, the operation operation unit 35 is tilted. The joystick is used to indicate the moving direction and the amount of movement of the wafer W. In step S109, the moving direction ' is calculated according to the tilting direction of the joystick and the amount of movement is calculated according to the tilting amount of the joystick and the tilting time, according to the calculated moving direction and The amount of movement is reset according to the coordinates (Spx, Spy) of the wafer stage 5 as instructed by the operator. Thus, for example, in the case shown in FIG. 4, the observation of the area indicated by the oblique line is intended to be the monitor 34. The display area shown is surrounded by PI, P2, P3, and P4. Ο Therefore, the CPU3 calculates the pixel coordinates of the pixels P1 to P4 in the four corners of the display area manually moved by the operator. The pixel coordinates of pi are ( P_Plx, P—Ply)' Let P2's pixel coordinates be (ρρ2χ, pp2y), let p3's pixel coordinates be (P_P3x, P_P3y) 'Set P4's pixel coordinates to (ρ_ρ4χ, P_P4y), set pixel coordinates and stage coordinates When the converted value am/pixel is (SiZe_x, Size_y), the parameters constituting the pixel coordinates of P1 to P4 can be expressed by the following formulas (1) to (8). ...(1) ...(2) ...(3) ...(4) ...(5) ...(6) ...(7) ...(8) P_Plx=(Spx_ Ssx)/Size_x O P_Ply=(Spy- Ssy)/Size_y P_P2x=P_Plx+Width - 1 P_P2y=P_Ply P_P3x=P_Plx P_P3y=P_Ply+Height- 1 P_P4x=P_P2x P_P4y=P_P3y At this point, 'images containing four corners to the image of 1豕素P1~p4 200929414 like coordinates are calculated in advance. Let the image coordinates of the image containing P1 be (I_Plx, 〗 〖!»&), set the image coordinates of the image containing P2 as (I_P2x, I jP2y), and set the image coordinates of the image containing P3 as (I_P3x, I- P3y) 'Set the image coordinates of the image containing P4 to (I-P4x, I_P4y)'. The parameters of the image coordinates constituting the image containing pi~p4 can be expressed by the following formulas (9) to (16). In the formula, INT is a function that returns the integer part of the subtraction and returns a negative number. If there is a fractional part, it returns 1 from the integer part and returns. ...(9) ...(10) ...(11) ...(12) ...(13) ...(14) ...(15) ...(16)

I_Plx=INT (P_Plx/Width) I_Ply=INT (P_Ply/Height) I_P2x=INT (P_P2x/Width) I_P2y=INT (P_P2y/ Height) I_P3x=INT (P_P3x/Width) I_P3y=INT (P_P3y/ Height) I_P4x= INT (P_P4x/Width) I_P4y=INT (P_P4y/ Height) In the next step S110, the CPU 31 refers to the image acquisition table 33 and determines that the calculation includes the step 嶋. Image coordinates of a still image (I-Piy), image coordinates of a still image containing P2 (Ι ρ2χ Ι p2y), image coordinates containing a still image with μ (Ι_Ρ3χ, 丨-P3y), and containing Whether the image coordinates (I_P4x, L%) of the still image are registered in the image acquisition: 33 '(4), and whether the still image corresponding to the image coordinate of the still image containing (4) has been captured is stored in the recording portion 32, and when it contains 4 still If the image coordinate of the image is registered, if the process proceeds to the step where the image is not registered, the process proceeds to step S11. 17 200929414 From the discussion of I. In the image of the partner, in order to capture the still image of the image coordinate of the still image, the CPU 31 loads the crystal: 5 outputs the driving signal to move the wafer w. In this case, if the image coordinates of the image to be captured are (Ix, Iy), the coordinates (Sx, Sy) of the wafer stage $ at the time of shooting can be obtained by the following formulas and formulas.

Sx=IxxSize—x + Ssx ...(17)

Sy=IyxSize y+Ssy j y (18) In the next step S112, the CPU 31 turns on the light source 11 in the light-off state from f... f* from a... 野, the original 11 output lighting signal '^. # a Lamp At this time, the illumination light is again irradiated onto the wafer w, ξ, 丨Α on the wafer stage 5, and the light reflected on the wafer W reaches the imaging surface of the imaging unit 25. In the next step S113, the image of the Japanese yen W imaged on the photographic surface is taken as a still shadow, and the image of the image coordinates (Ix, Iy) is captured by the photographing unit 25 at this time. The round w anus is like a tribute system stored in the recording unit 32 through the CPU 3 1 , and the image coordinates (ΐχ, iy) of the singer's call at this time are registered in the 〇33 ° photographing unit 25 in this manner. Immediately after the 贞® w is captured as a still image, the light source u is output and the light is turned off again (step S114). % < 吏 light source π light source 11 after the gun light, return to step s〗. Silly sho, after obtaining the desired still image, repeat steps S111 to S114e, if the image acquisition is completed, P1~p ^ If the unsense image coordinates are registered in the image acquisition 矣3 3, then move to step s 115. In step S115, the image of the wafer W of the coordinate image of the CPU 13 is formed by using the images stored in the recording unit 32 to synthesize the image to be displayed by manual movement. The 200929414 system represents the image of the composite source, and FIG. 6 is the image of the composite source. The image of the display area area shown in FIG. 4 is enlarged. Here, the image of the composite end is shown. Further, the port 0 is, for example, 'when there are four kinds of synthesized source images, the data is divided into four regions, and the pixel data is copied from the respective images of the composite source to the respective regions of the synthesizing end. Therefore, the area of the upper-side synthesized source image is taken as the first area A1', the area of the upper right composite source image is taken as the second area A2', and the area of the lower left composite source image is regarded as the third area a), and the right is The area of the composite source image under © is treated as the 4th area A4. As shown in Figure 5, set the number! The relative pixel coordinates of the upper left part of the composite source image (image coordinates (Ι_Ρ1χ, I-Ply)) of the area A1 are (Pllx, Piiy), and the composite source image of the second area A2 (image coordinates (Ι-Ρ2χ, I_P2y) The relative pixel coordinates of the upper left part of the )) are (ρ2ΐχ, ρ2ι phantom the composite image of the third area A3 (the relative pixel coordinates of the upper left part of the image coordinates (Ι-ρ3χ, I_p3y) are (Ρ31χ, P31y), If the relative image of the upper left part of the composite source image (image coordinates (I_P4x, I_P4y)) of the fourth area A1 is (P41x, P41y), the relative pixel coordinates of the upper left part of each synthesized source image can be used. The following equations (19) to (26) are obtained. PI lx=P_Plx—(I_PlxxWidth) (19) PI ly=P_Ply- (I_P 1 yxHeight) (20) P21x=0 (21) P21y=P11y (22) P31x=P11x (23) P31y=0 •..(24) 200929414 P41x=0 (26) P41y=0 (26) Also, set the image width of the first area A1 to PIw, the image height of the first area A1 is Plh, the image width of the second area A2 is P2w, and the image height of the second area A2 is P2h, The image width of the area A3 is P3w, the image height of the third area A3 is P3h, the image width of the fourth area A4 is P4w, and the image height of the fourth area A4 is P4h, the image width and height of each area. It can be obtained by the following formula (27) to (34) Ο.

Plw=Width- PI lx ...(27)

Plh=Height— PI ly -..(28) P2w=Width- Plw .--(29) P2h=Plh -..(30) P3w=Plw (31) P3h=Height- Plh (32) P4w= P2w ...(33)

P4h=P3h ". (34) Further, the relative pixel coordinates of the upper left portion in the synthesized end image of the first region A1 are (P12x, P12y), and the relative upper left portion of the composite end image of the second region A2 is set. The pixel coordinates are (P22x, P22y), and the relative pixel coordinates of the upper left portion in the composite end image of the third region A3 are (P32x, P3 2y), and the relative pixels of the upper left portion in the composite end image of the fourth region A4 are set. When the coordinates are (P42x, P42y), the relative pixel coordinates of the upper left portion in each synthesized image can be obtained by the following equations (35) to (42). 200929414 P12x=〇...(35) P12y=0 -(36) P22x=P1w (37) P22y=〇...(38) P32x=0 (39) P32y=Plh ... (40 P42x=P22x ..•(41) P42y=P32y (42) Next, according to the parameters obtained by the equations (19) to (42), the still image is reproduced while being displayed. The synthesis of still images in the area. For the third area A, the relative pixel coordinates (ριΐχ, puy) are taken as the coordinates of the upper left part of the synthesized source image, and the relative pixel coordinates (ρΐ2χ, W2y) are taken as the coordinates of the upper left part of the synthesized end image, and the image coordinates are reproduced ( The area of the image width Plw and the image height pih in the image of UMx, I-ply).

For the second area A2, copying is performed when the image coordinates P1 X) of the image containing P1 are different from the image coordinates (I_P2x) of the x side of the image containing P2. When making a complex number, the relative pixel coordinates (p21x, p2iy) are used as the coordinates of the upper left part of the composite source image, and the relative pixel coordinates (pm, p kiss) are combined into the coordinates of the upper left part of the image. In the image of ρ2χ, ~P2y), the image width is ~, and the image height is 卩31. For the third region Α3, #&^γ * the image coordinate on the y side of the image containing Pi (I-Ply) is different from the image coordinate (I_P3y) on the y side containing the image of P3. For the reissue, the relative pixel coordinates (P31x, P31y) are taken as the coordinates of the upper left part of the 21 200929414 composite source image, and the relative pixel coordinates (P32x, P32y) are used as the coordinates of the upper left part of the composite end image. , copy the area of the image width P3w and the image height P3h in the image of the image coordinates (I_P3x, I_P3y). For the fourth region A4, the image coordinates (Ι_Ρ1χ) on the X side of the image containing P1 are different from the image coordinates (I_P4x) on the X side of the image containing P4, and the image coordinates on the y side of the image containing P1 (I_Ply) Copying is performed when the image coordinate (I_P4y) on the y side of the image containing P4 is different. When copying, © use the relative pixel coordinates (P41x, P41y) as the coordinates of the upper left part of the composite source image, and the relative pixel coordinates (P42x, P42y) as the coordinates of the upper left part of the composite end image, copy the image coordinates (I_P4x) , I_P4y) The image width P4w and the image height P4h in the image. Thereby, it is possible to synthesize a still image by moving the area to be displayed manually. As described above, by synthesizing the still image of the area to be displayed, the synthesized image can be displayed on the monitor 34 (step 116), and then the flow returns to step S107. According to the present embodiment, in the state where the irradiation of the wafer W by the illumination light is suspended, the still image of the wafer W stored in the recording unit 32 is displayed on the monitor 34, and the wafer can be irradiated onto the wafer. The illumination light suppression of W is minimized, the wafer W is not deteriorated, and a long-term visual inspection can be performed. Further, as described above, in order to generate an image of the wafer W corresponding to the change of the display area, the illumination system 10 illuminates the surface of the wafer W as needed, and the photographing unit 25 is to be The wafer W irradiated with the illumination light is captured as a still image, and when the imaging unit 25 captures the circle 22 200929414 illuminated by the illumination light, the illumination system 10 stops the illumination of the illumination light. According to this aspect, the display area of the image of the wafer W can be changed while minimizing the illumination light irradiated on the wafer W. In this case, it is preferable to carry out the imaging of the wafer w after the second and subsequent times by the imaging unit 25, if necessary, the stage coordinates (photographing predetermined position) set by the CPU 31. According to this aspect, since the number of times of photographing after the second and subsequent times can be minimized, it is possible to suppress the illumination light irradiated on the wafer to a minimum.

When the image of the inspection object corresponding to the change of the display area is generated, the following control is performed: it is determined whether or not the still image at any position in the display area is stored in the recording unit 32, and the photographing unit is set to photograph according to the determination result. In the area, the photographing and illumination system of the photographing unit 25 in the area is performed, and the exposed light of the illumination light can be set to a minimum at any position of the wafer i. Any position in the display area, especially when the display area is rectangular, it is preferable to determine whether there is a still image at its four corner positions. Further, in the above-described embodiment, the inspection apparatus for performing the appearance inspection of the wafer evaluation is described as an example. However, the present invention is not limited thereto, and the present invention can also be applied to an observation apparatus for observing the wafer W. Further, the object to be inspected is not limited to the wafer w, and may be, for example, a liquid crystal glass substrate. Further, in the above-described embodiment, the images captured by the photographing unit 25 may be connected to the monitor 34 at the same time as the display area 2, as shown in Fig. 3; According to this aspect, the vicinity of the display area can be observed at the same time. At this time, for example, an image of an unrecorded image 23 200929414 image may be displayed in a gray area (Gray z〇ne). Further, in the above-described embodiment, it is also possible to perform distortion correction or shading correction on the still image of the image capturing unit 2s to obtain a seam generated when the image is synthesized. Further, in the above embodiment, the image captured by the imaging unit 25 may be manipulated without using the side 1 of the photographing unit h and the full range ’. In this way, the effects of distortion or shading can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the entire configuration of an inspection apparatus including the observation apparatus of the present invention. Fig. 2 is a flow chart showing the observation method and inspection method of the present invention. Fig. 3 is a view showing a display area of an image coordinate system when moving to an observation point. Figure 4 is a schematic diagram showing the display area of the image coordinate system and the monitor when the display area is changed by manual movement. Figure 5 is a schematic diagram showing a composite source image. Fig. 6 is a schematic view showing a composite end image. [Description of main component symbols] V Wafer (inspected object) Inspection device (observation device) Wafer table ° Illumination system (illumination unit) 24 200929414 ❹ 11 Light source 12 Lens 13 Illumination uniformization unit 14 Aperture stop 15 Field of view light阑16 Lens 17 Half mirror 18 Objective lens 20 Photosystem 21 Lens 22 Half 稜鏡 23 Eyepiece 25 Photographing unit 30 Control system 31 CPU (display area change unit, etc.) 32 Recording unit (memory unit) 33 Image acquisition table 34 Monitor ( Display unit) 35 operation unit 25

Claims (1)

200929414 X. Patent application plane: 】 An observation apparatus comprising: an illumination unit illuminating an illumination object and an inspection object formed with a circuit pattern; and a photographing unit for photographing the illumination light a storage unit for storing an image of the object to be inspected by the photographing unit; and a display unit for displaying the image of the object to be inspected stored in the storage unit; In the state of light, 'the photographing unit photographs the © object to be inspected', and stores the image photographed in this manner in the storage portion, and stops the illumination of the illumination light of the illumination portion, so that the image stored in the storage portion is A photographic image of the inspection object is displayed on the display unit. 2. The observation apparatus according to claim 2, further comprising: an operation unit configured to perform an operation for changing a display area of the inspection object displayed on the display unit; and a display area changing unit to be stored according to The image of the object to be inspected in the storage unit generates an image of the object to be inspected corresponding to the change in the display area by the operation of the operation unit; the display area is generated according to the operation of the operation unit And changing the image of the object to be inspected generated by the display area changing unit to the display unit; the display area changing unit is configured to generate a change corresponding to the display area due to the operation of the operation unit The image of the object to be inspected is irradiated with illumination light on the surface of the object to be inspected by the illumination unit, and the desired portion of the object to be inspected is photographed by the photographing unit, and will be photographed in this manner 26 200929414 Part of the image is stored in the illumination of the illumination. . 'And suspend the illumination unit 3. If the application is for the second item, the diagnostic turtle, which is changed by the operation of the operation unit, wherein at least a part of the image to be displayed is not stored in the storage=domain: The test object includes an image of the at least one photographing portion that is not stored in the storage portion. ° image of the minute as the need 4. The position setting unit according to the second or third item of the patent application, according to the observation device of the second or subsequent imaging position of the first imaginary portion of the photographing unit, the photographing position of the second photographing position is set, and the photographing area is set. In order to capture the image of the object to be inspected for the change of the display area, the change department selects any of the photographing positions that have been set in the photographing position setting unit. The photography department performs the photography of the object to be inspected for the second time. 5: The observation device of claim 2, wherein the display area 1 is controlled to generate an image of the object corresponding to the change of the display area, and determine whether the display area is arbitrary Whether the image of the object to be inspected is stored in the storage unit, and then the image capturing area of the photographing unit is set according to the determination result, and the photographing unit is configured to photograph the image in the manner of illumination by the photographing unit In the photographing area, an image photographed in this manner is stored in the storage portion, and illumination of the illumination light of the illumination portion is suspended. 6. The observation apparatus of claim 5, wherein the photographing area set by the display area changing unit can be set in an area other than the image stored in the storage portion of the 27 200929414. 7. The observation device of claim 5, wherein any position in the display area is the end of the display area. The viewing device of claim 7, wherein the display area is rectangular, and the arbitrary position is the four corners of the display area. 9. An inspection apparatus comprising: an observation device for observing an object to be inspected having a circuit pattern; and a recording unit for recording the object to be inspected by observing the object to be inspected by the observation device Good or bad; it is characterized by: The observation device is patented! ^ ^ The observation device of any of the 8 brothers. 10. The observation method according to the invention, comprising: the first step of irradiating the illumination light to the surface of the inspection object on which the circuit pattern is formed; and the second step of photographing the inspection object irradiated with the illumination light; Q 帛[Step 3] storing the image of the object to be inspected in the second step in the storage unit; and in the fourth step, after the object is imaged in the second step, the illumination of the object to be inspected is stopped; In the fifth step, the image of the object to be inspected stored in the storage unit is displayed on the display unit. 11. The observation method of claim 10, comprising: the step of: performing an operation for changing a display area of the inspection object displayed by the display unit; 28 200929414, step 7, according to the library The image of the object to be inspected in the storage unit generates an image of the object to be inspected corresponding to the change in the display area by the operation of the sixth step; the eighth step is based on the sixth step and the sixth step The operation causes the display area to change, and the image of the object to be inspected generated in the seventh step is displayed on the display unit; In the ninth step, in order to generate an image of the object to be inspected corresponding to the change in the display VII domain by the operation of the seventh step, the illumination light is irradiated onto the surface of the object to be inspected, if necessary. And taking a desired portion of the object to be inspected 'the desired portion of the image captured in this manner is stored, and the illumination of the illumination light of the object to be inspected is suspended. 12. The method of observation of claim U, wherein in the ninth step, at least a portion of the image of the object to be inspected in the region to be displayed as a function of the operation of the sixth step is not stored In the storage unit, an image containing the image 0 that is not stored in the at least one portion of the storage portion is taken as the desired portion. 13. The observation method of item n or 12 of the patent application has the first step, and according to the first photographing position in the second step, the photographing predetermined position after the second time is set; in the ninth step, It is necessary to perform the photographing of the still image of the object to be inspected after the second time at any of the photographing predetermined positions to be set in the first step. 14. The observation method of claim 2, wherein in the seventh step, 'the 29 ❹ ❹ 200929414 β image corresponding to the change of the display area is generated. In the position of the object to be inspected in the position of the object to be inspected, and in accordance with the result of the determination, the image capturing area of the image of the object to be inspected is obtained; J. In the ninth step, the illumination is performed by the illumination unit. In the photographing area set in such a manner, the observation method of the photographing range of the photographing range of the photographing unit of the photographing unit and the illumination unit of the illumination unit is suspended in this manner, wherein . Therefore, the shooting area can be set in an area other than the image of the storage unit. Stored in the store 16. The method of observation as in the scope of patent application ,14, in which any position within the area is the end of the display area. , Π. For example, in the method of observation of the scope of the patent item 16, wherein the rectangle is a rectangle, the arbitrary position is the four corners of the display area - a method of inspection, and the inspection of the circuit pattern; : observation step for observing the formation of 2 inspection steps 'According to the test result in the observation step, determining whether the test object is good or bad; the feature is: observation knot use Shen Sing patent scope j j Λ s + Check the inspection object. Observation method of any one of 1〇~17 XI. Schema: If the next page 30