TW200920715A - Polymer-ceramic composites with excellent TCC - Google Patents

Abstract

Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about -55 DEG C to about 125 DEG C. Specifically, these capacitor materials have a change in TCC ranging from about -5% to about +5%, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.

Description

200920715 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to the field of capacitors and printed circuit boards. ^ 于五的' The present invention relates to polymers for forming capacitors and printed circuit boards. The composite of the present invention exhibits a lower temperature coefficient of capacitance (TCC) change in response to temperature changes, and other Required characteristics. _Every [Prior Art] Since the circuit design of the central processing unit (CPU) seeks to achieve the speed of the nose, the performance of the integrated circuit becomes increasingly important. The printed circuit board on which these integrated circuits are mounted Circuit design is also extremely important. Electric Guchen is a printed circuit board and other microelectronics. The slings are used to stabilize the operating power of these devices. Capacitors are the energy storage capacity of capacitors. Capacitors introduce capacitance into a circuit and are primarily used to store electrical energy, block direct current or allow alternating current. Capacitors typically contain a dielectric material sandwiched between two layers of conductive metal, such as a copper box. The dielectric material and the conductive metal layer are bonded to each other via an adhesive layer by lamination or by vapor deposition. Previously, the capacitance arranged on the surface of the printed circuit board was In recent attempts to miniaturize capacitors, it is known to use a dielectric ceramic material having a high dielectric constant or to reduce the thickness of a dielectric ceramic layer. The capacitance is mainly determined by the shape and size of the electric layer and the dielectric constant of the insulating material. In a known arrangement, a "buried" capacitor comprising a thinner double-sided copper-clad laminate is formed in a multilayer circuit board layer to produce superior features. A printed circuit board having such embedded capacitors can be used in For other purposes, the board 133913.doc 200920715 maximizes the area and achieves an increased signal transmission speed. Capacitors with high capacitance density are particularly needed. The capacitance of the dielectric material can be increased by adding ceramic materials. High-loaded Tauman fillers in dielectric materials typically produce brittle and extremely low mechanical and processing properties. It is also known that high capacitance density materials such as §Hai exhibit large variations due to temperature enthalpy Capacitance changes. In addition, materials with high dielectric constants are also known to be sensitive to variations in the degree of change. Materials with such capacitance temperature dependence are known to have the same Valley temperature coefficient '' or " TCC Shu '. The material's TCC indicates its maximum capacitance change within the temperature range. Conventional dielectric composite capacitor materials having a TCC variation as low as ±1 5% to as low as ±10 〇/〇 in the range of about _ hunger to about > C have been developed. However, in the field of printed circuit boards, there is a need to develop a response of about -55. . Capacitor material having a very low TCC variation ranging from about -5% to about +5% and preferably as low as about _〇.5% to about +〇5%, to a temperature change in the range of about 125 Buried capacitor material. The present invention provides a unique polymer-ceramic composite that achieves this goal. The present invention also has excellent mechanical properties (such as good peel strength and no brittleness), electrical properties (such as high dielectric constant), and processing characteristics (such as ease of mixing). SUMMARY OF THE INVENTION - The present invention provides a composite comprising a blend of a polymer component and ferroelectric ceramic particles, the polymer component comprising from about 5 Wt% to about 95 wt% by weight of the polymer component At least one epoxy group-containing polymer, and at least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5 wt% to about 95 wt%, based on the weight of the polymer component. Wherein the composite J33913.doc 200920715 material exhibits a change in temperature coefficient of capacitance of from about -5% to about +5% in response to a temperature change in the range of from about -5 51 to about i 2 51. The present invention further provides a composite material comprising a blend of a polymer component and a ferroelectric ceramic powder, the polymer component comprising from about 5 Wt% to about 95 wt% by weight of the polymer component. At least one epoxy-containing polymer, and at least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5% by weight to about 3% by weight based on the weight of the polymer component;

The ferroelectric ceramic powder comprises barium titanate, barium titanate, barium titanate or a combination thereof; wherein the epoxy group-containing polymer comprises (iv) varnish epoxy (IV), has derived from double A or double hope? An epoxy resin, a butadiene-acrylic modified epoxy resin or a combination thereof, wherein the polymer having a plurality of epoxy-reactive groups comprises a poly-imine , polyamidoximine, polyvinyl butyral, polyether sulfone, reactive poly-broth or combinations thereof; and wherein the composite responds to about _55. 〇 to about 125t: temperature change in the range exhibits a change in the temperature coefficient of capacitance of about -5% to about +5%. The invention further provides a method of forming a capacitor comprising: a) providing a composite comprising a blend of a polymer component and a ferroelectric granule comprising 'the polymer component comprising about 5 (four) by weight of the polymer component Up to about 95 Wt% of the at least one epoxy-containing polymer, and at least one of a plurality of epoxy groups reactive in an amount of from about 5 wt% to about 95 wt%, based on the weight of the polymer component a polymer of a group, wherein the composite responds to a temperature change in the range of about hunger to about 12 rc 133913.doc 200920715 and exhibits a change in capacitance temperature coefficient of about -5% to about +5%; and b) attaching the composite layer Between the first conductive layer and the second conductive layer. [Embodiment] The composite material of the present invention comprises a polymer component and a ferroelectric m particle. The polymer component of the present invention comprises at least one epoxy-containing polymer and at least one polymer having a plurality of epoxy-reactive groups. The epoxy-containing polymer is preferably from about 5 to about 95 wt%, more preferably from about 20 wt% to about 8 μm, and most preferably from about 55 wt/〇, based on the weight of the polymer component. Present in the polymer component. Examples of suitable epoxy-containing polymers include non-exclusively including epoxy resins, epoxy resins having an aliphatic or aromatic hydrocarbon backbone derived from bisphenol A or bisphenol F, butadiene- A polymer of an acrylic modified epoxy resin or a combination thereof. The polymer having a plurality of epoxy-reactive groups is preferably from about 5 wt% to about 95 wt%, more preferably from about 2 wt% to about 8 wt%, based on the weight of the polymer component. And preferably present in an amount of from about 45 Wt% to about 55 wt%. Examples of the epoxy group-reactive group include an amine group, a hydroxyl group, a carboxyl group, and an active hydrogen group non-exclusively. Examples of materials suitable for use in polymers having a plurality of epoxy-reactive groups include non-exclusively including polyamidiamine, polyamidoximine, polyvinyl butyral, polyether oxime, reactive polyester or Its combination. In a preferred embodiment, the polymer having a plurality of epoxy-reactive groups comprises a reactive polyester having a plurality of hydroxyl groups. The polymer component of the composite of the present invention is preferably from about 10 wt% to about 99,5 wt%, more preferably from about 2 〇wt〇/〇 to about 95 wt%, based on the weight of the composite. The amount of the composite material is about 4% by weight to about 133913.doc -10- 200920715. The polymer component is preferably present in solid form at room temperature. Ferroelectric ceramic particles are used as the dielectric or electrical insulator in the material of the invention. & suitable for ferroelectric ceramic particles, examples of heart palpitations include barium titanate, barium titanate, titanium strontium, boron nitride, aluminum oxide or 1, , Λ 1 fly, and δ. The ferroelectric ceramic particles have a particle size in the range of preferably from about 0.1 μηι to about 2 μηι, more preferably from about η ς 乜. force from 0.5 μηι to about 1 μηι. Ferroelectric ceramic particles are preferably in the form of poplar. The powder is defined as having a solid particle of about 1 〇 or lower average diameter. In some embodiments, the average particle size of the titanium crucible is in the range of about 85, 85 Å to about Å. In certain embodiments, the average particle size of barium titanate is from about U to about 60 (four). The ferroelectric ceramic particles are preferably about 0.5 wt% based on the weight of the composite. /. Up to about 90 Wt%, more preferably from about 5% by weight to about 8% by weight of the composite, and most preferably from about 1% to about 6% by weight of the composite. Examples of the exact composition of certain embodiments of the invention are shown in Formulations A-K of Table 1 below and examples. The composite material of the present invention may optionally include additional components or additives, such as known curing agents, dispersants, mixtures, accelerators, hardeners, catalysts, solvents, and the like. Examples of suitable curing agents include non-exclusively including Amines, polybasic acids and anhydrides. Examples of suitable dispersing agents include non-exclusively including Shi Xi Yuan, neoalkoxy titanate, neoalkoxy zirconate, and copolymers with acid groups. Examples of suitable catalysts include non-exclusively including imidazole and triphenylphosphine (TPP). An example of a suitable commercially available catalyst is Curezol available from Shikoku Chemicals Corporation (Kagawa, Japan). Examples of suitable hardeners include non-exclusively diaminodiphenyl sulfone (DDS) and phenylenediamine. Examples of suitable solvents are non-discharged 133913.doc •11 · 200920715 Externally includes methyl ethyl ketone (sat), dimethylformamide (dmf), cyclohexanone (Cy曰H), and combinations thereof. In certain embodiments, the composite U3 of the present invention is present in an amount sufficient to form a sputum agent such that about 6% by weight of the total composite material is present in solid form. The composite of the present invention can be formed by a suitable combination such as mixing, blending or the like by any suitable combination known in the art. In a preferred embodiment, the polymeric material is blended with the ferroelectric particles to form a substantially uniform composite mixture. The composite mixture can be formed into any suitable desired shape and can be hardened into a composite layer or the like. In certain embodiments, the composite layer has a thickness ranging from about 4 μηη to about 1 μm, preferably from about 8 μηη to about 5 〇 _ and more preferably from about 1 〇 to about %. The main feature of the present invention is that the degree of change in the response of the composite in response to the range of from about -55 ° C to about 125 ° C preferably exhibits about -5. The capacitance temperature coefficient (TCC) varies to approximately +5%. The Tcc change of the composite of the present invention is preferably in response to a temperature change in this temperature range of from about _4% to about +4%, and responds to changes in this temperature range even better at about _25% to about + Within 2.5%. In a preferred embodiment, the response is about _55. (: to a temperature in the range of about 12 rc The TCC of the composite of the invention varies from about _ 〇 。 。 。 约 to about + 0.5%. Table 2 below shows the temperature coefficient of capacitance of the material of the invention in the formulation Α κ ( TCC) characteristics, which are also graphically represented in Figures 1-3 and detailed in the examples. The data in Table 2 shows _55. Percent change in capacitance of the formulation A_K at temperatures ranging from 〇 to 125〇C (△ Tcc). The composite material of the invention also has an excellent dielectric constant (DK) and a 1339I3.doc -12·200920715 2 dissipative factor at 4 MHz. (4) The formulation (10) and the properties of the inventive material Α·κ Shown in Table 2 below. The composite of the present invention preferably has a dielectric constant (DK) of from about 25 to about 5, more preferably from about 5 to about 50, even more preferably from about 1 to about the best (four) to (iv). The dissipation factor (df) is the power loss of the capacitor = where DF = 2 / Z / RC x 100%, where the equivalent of the R4f container: % resistance ' / is the frequency and c is the capacitance. Dissipation factor with frequency and Varying in temperature. The dissipation factor (DF) of the material of the invention is preferably about 1 MHz at about 1 MHz.

From 0.003 to about 0.03, more preferably from about 〇〇.〇〇4 to about 〇 〇2 and most preferably from about ·(iv) to about 0·0 1 5 . π The composite of the present invention can be used in a variety of applications, such as for forming capacitors, printed circuit boards, electronic devices, and the like. In certain embodiments, the present invention provides articles comprising a conductive layer and a composite layer of the present invention on a conductive layer. The articles may comprise: a capacitor, a printed circuit board comprising the capacitor of the invention, an electronic device comprising the capacitor of the invention, an electronic device comprising the printed circuit board of the invention, and the like. An embodiment of the invention includes a capacitor comprising a first conductive layer, a second conductive layer, and a composite layer of the invention attached between the first conductive layer and the first conductive layer. The composite material is directly attached to the surface of each conductive layer. Another embodiment includes a first article (the first article comprising a first conductive layer on which the composite layer is invented) and a second article (the second article comprising a second conductive layer 9°) An electro-division device having a composite material layer of the present invention on a conductive layer, wherein the object-object and the second object are attached to each other such that their composite layers are in contact with each other. Conductive layers are well known in the art. Examples of conductive layers are not exclusive 133913.doc -13· 200920715 Sexually includes metal layers such as metal pavilions. Examples of suitable materials for a specific conductive layer include non-exclusively including copper, aluminum, cans, silver, iron-nickel alloys or the like; & Preferred materials comprise copper. If more than one conductive layer is present, the layers of material are independently selected and may comprise the same material or may comprise different materials. The conductive layer preferably has a thickness in the range of from about 1 to about 1 Torr, more preferably from about 5 Å to about 7 Å, and most preferably from about 35 Å. As noted above, the composite tantalum layer preferably has a yield in the range of from about 4 to about 100 Å, more preferably from about 8 to about 5 Å μΐΏ, and most preferably from about 1 〇 μηι to about 3 5 μηι. For the purposes of the present invention, unless otherwise stated, the term "coating" or "attached" refers to any well-known method of depositing, attaching or joining a layer to a lower layer, which non-exclusively includes simultaneously Or sequentially coating, dipping, spraying, sputtering, laminating, vapor deposition, electrodeposition, electrominening, printing, evaporation, and combinations thereof. In some embodiments, the composite layer is coated by coating. Covering the metal layer i. In some embodiments, attaching two or more materials is performed by layer reading to form a capacitor, and the laminate is performed at a temperature, a pressure, and a time of the selected material. Wherein, the lamination can be carried out in an extruder at a temperature of from about 15 (rc to about 31 (rc, more preferably about 16 Torr. Torr to about 2 Torr. The lamination can be carried out for about 3 minutes to about i2). Preferably, the extruder is maintained at a vacuum of at least 7 〇cm (28 Torr) of mercury and maintained at about 3 5 kgf/cm 2 (5 〇 ps!). ) to a pressure of about 28 kgf/cm2 (400 psi), preferably about 49 kgf/cm2 (7 〇 (4)) to about 14 kgf/cm2 (200 psi). Any conventional curing process to carry out the curing step. In some embodiments, the composite can be subjected to a temperature of about 93 〇C (20 (TF) to about 316 t (600 T), 1339 I3.doc -14 - 200920715 degrees The curing step is carried out for about 1 minute to about 120 minutes. The present invention further relates to a method of forming an electrical enthalpy, which comprises providing a composite material as described above and 1) a layer of a composite material Attached between the first conductive layer and the second conductive layer. The composite is a mouth material. The layer is preferably directly attached to the surface of each conductive layer. The capacitor formation can be performed in various ways. In some embodiments, by combining the present invention The material layer is coated on the conductive layer to form an object.

In the embodiments, the above attachment step (b) comprises: forming a first object comprising the first conductive layer and the composite layer on the first conductive layer; ii) forming a layer comprising the k (four) layer and the second conductive layer The second object of the composite layer and the llimp object (four) are joined to each other to form a composite layer of the first object in contact with the composite layer of the second object. Optionally, but preferably, step Hi) comprises laminating the first article with the second article and/or rinsing the composite layer. The above provides suitable conductive layer materials and details regarding lamination and curing. The resulting capacitor structure has a metal-composite_complex metal array. In another embodiment, the attaching step (b) comprises: applying a composite layer to the f-th electrical layer, and u) applying the second conductive layer to the layer of the overlying material on the first conductive layer And affixing the first conductive layer to the composite material layer and the second conductive layer, as appropriate, and/or curing the composite material layer. The resulting capacitor structure has a metal composite-metal arrangement. In a further example, the attaching step (b) comprises: applying a composite layer to the first conductive layer; ii) curing the composite layer; and then 133913.doc •15·200920715), via It is desirable to form a second guide (4) on the surface of the composite material that is opposite the first metal layer. The resulting capacitor structure also has a metal-composite-gold layer arrangement. Further, after forming the capacitor of the present invention, a circuit pattern can also be produced in the conductive layer using a known etching technique. The capacitors formed by the polymer of the present invention are also required to exhibit several desired characteristics in addition to the above-mentioned required TCC, DK and DF characteristics. For example, the polymer ♦ optical composite of the invention on a conductive layer (such as steel swash)

The capacitor formed by U preferably exhibits an excellent 9G peel strength of 〇5 kN/m or more and preferably i _ or more. Further, the capacitor of the present invention is at about (10).展现 Extremely high thermal stability at soldering temperatures. In one embodiment, a capacitor laminate of the present invention comprising a polymer of the present invention on a copper metallurgy is formed, wherein the composite material comprises 2% by weight of a polymer component and rib-electric ceramic particles. The capacitor laminate of this example passed the (7) float test under 288. The invention further provides a method of forming a printed circuit board comprising incorporating a capacitor formed as described above into a printed circuit board. Other Embodiments of the Invention U Non-Exclusive J. The ground includes a printed circuit board comprising the capacitor of the present invention, an electronic device comprising the printed circuit board of the present invention, an electronic device comprising the capacitor of the present invention, and the like. The following non-limiting examples are illustrative of the invention. It will be appreciated that ratio changes and alternatives to the 7L of the components of the present invention will be apparent to those skilled in the art and are within the scope of the invention. Example 1 Table 1 below shows the formulations A-K of the present invention. Formulation A was used as a control material 1339\3.doc -16- 200920715 and was composed entirely of the polymer component of the present invention. The formulation Β Κ is related to the various combinations of the polymer component and the ferroelectric ceramic particles. In Table 1, titanate is abbreviated to the term "ST" and barium titanate is abbreviated as the term "BT", followed by its average particle size and its weight in grams. Table 1 ·Composite formulation materials----... A (control) BCD Vi E Γ _ GHIJK polymer component wt, g 100.0 20.0 22.0 45.0 30.0 22,0 22.0 22.0 22.0 20.0 20.0 ST 1 (0.85 μηι ) wt,g ·- 80.0 -- — — — — — — — ol I^Ul) Wt,g 一 — — — — — 48.0 43.2 ST 3(0.95 μιη) wt,g 33.0 42.0 23.4 42.1 46.8 54.6 « 131 ( 0.59 μηι) wt * g 78.0 22.0 28.0 54.6 Γ 35.9 31.2 23.4 32.0 36.8 Dispersant Wt * g 0.12 0.11 0.11 0.06 0.11 0.08 0.00 0.14 0.12 0.11 Table 2 shows the characteristics of the formulation AF of the present invention. In particular, Table 2 shows the DK and DF characteristics of the formulations A-F and the percent change in capacitance (Δ TCC) of each formulation at temperatures ranging from _55 ° C to 125 ° C. The data for Table 2 on TCC is graphically represented in Figures 1-3. Table 2: Characteristics of composites 3 Formulations _ ---- A (control) BCDEFGHIJK DK — 28 21 8 12 IS 21 22 21 25 27 DF (1 MHz) " 0.003 0.009 0.004 0.007 0.008 0.005 0.008 0.008 0.004 TCC change %(-55°α 2.6 -4.5 -0.7 -0.3 -2.4 0.1 -0.7 -0.4 0.3 -0.2 TCC % change (125〇C) -3.4 4.8 0.2 •0,6 2.1 •0.7 0.3 0.2 -0.4 0.1

Formulation A The composite of the present invention comprises a blend of a polymer component and a ferroelectric ceramic particle. 17·133913.doc 200920715 The following composition 1 and composition. The polymer components of these examples were formed by blending Material 2 in a weight ratio of 75:25. Composition 1 : 9.0 g The product of this and the family of cigarettes - children u < pepper emulsion copolymer 28 g by elastomer tough servant TS &, the initial epoxidized novolac resin 7.2 g bisphenol F epoxy 74.8 g of resin having a functional group polymerizable with an epoxy resin; 65% in toluene

6.8 g Polyethylene butyral 0.5 g 2-Phenyl-4-methyl-5-hydroxymethylimidazole 123.9 g 80% methylethyl _ and 2 〇% decyl decylamine solvent mixture composition 2 : 20 g epoxidized copolymer of benzene age and aromatic hydrocarbons 15 g epoxy polymer · oxygen p element, 2, 2'-[[l-[4-[l-methyl-l-[4- [( Oxy-P-methoxymethyl)phenyl]ethyl]phenyl]ethylidene]bis(4,1-phenyleneoxyindenyl)]bis 15 g bisphenol A epoxy resin 4 8 g Shouting stone wind 0.30 g 2-phenyl-4-mercapto-5-hydroxymethylimidazole 1.5 g diaminodiphenyl hard 0.20 g triphenylphosphine 150 g 23 ° / mercapto ethyl ketone, 62% cyclohexyl Solvent mixture of ketone and 1 5% decylguanamine 133913.doc -18- 200920715 Formulation A of Table 1 contains loo g obtained polymer component. Example 2

Formulation B The composite material of the present invention according to Formulation B is obtained by blending a polymer component of a core example with 8 〇g 酸酸华_particles and 〇. 2 2 dispersant as shown in Table (10). Formed together. As shown in Table 2, Formulation 8 exhibited a variation of capacitance temperature coefficient of 28 degrees and DF ’ at 1 MHz and 2.6% at -55t and _3 4% at 1 pit. Example 3

Formulation C The composite of the present invention according to Formulation C was formed by blending 22 g of the polymer component blend of Example 1 with 78 g of barium titanate and 11 g of a dispersant as shown in Table 。. As shown in Table 2, the formulation c exhibited a DF of 21 at 1 and 1 MHz at 1 MHz, and a capacitance temperature coefficient change of 4.8% at -5 5 <^125t; Example 4

Formulation D The composite of the invention according to Formulation D was obtained by as shown in Table 4 4 5 g of the polymer component blend of Example 1 with 33 g of barium titanate (95 μηη particles), 22 g of titanic acid钡 and OU g dispersant are blended to form. As shown in Table 2, Formulation D exhibited DK of 8 and DF of 0.004 at 1 MHz, and -55T: -〇.7% and 125. 〇下为〇.2% of the capacitor temperature coefficient 133913.doc -19- 200920715

Variety. Formulation E The composite of the invention according to Formulation E is obtained by combining 30 g of the polymer component blend of Example 1 with 42 g of titanic acid granules, 28 g of barium titanate and 0.06 g as indicated by W. The dispersant is formed by blending. As shown in Table 2, the formulation is initially shown as OK for 丨2 and 0.007 f at 1 MHz.

The DF, and -55 〇C are _〇.3% and Ding and 12.5 C are -0.6% of the capacitance temperature coefficient change. Example 6

Formulation F The composite of the invention according to Formulation F is obtained by the combination of 22 § polymer component of Example 1 with 23.4 g of the acid chain (95 (tetra) particles), 54.6 g of barium titanate and strontium. · 11 g of dispersant is formed by blending. As shown in Table 2, Formulation F exhibits a £18)1 (: and 0 at 0 MHz and -55 at 1 MHz (the following is -2.4./. and 125.) 2.1% of the temperature coefficient of capacitance changes. Example 7

Formulation G The composite of the present invention according to Formulation G was obtained by as shown in Table 22 22 g of the composition of the composition of Example 1 and 42.1 g of titanic acid (95 μηι particles), 3 5.9 g of titanium. The acid bismuth and 0.08 g of a dispersant were blended to form. As shown in Table 2, 'Formulation G is shown as DK of 21 and DF of 005.005 at 1 MHz and 0.1% at -55 °C and -0.7% at 125 °C. 133913.doc •20· 200920715 Number change. Example 8 Formulation Η The composite of the present invention according to the formulation 2 was obtained by adding 2 2 g of the polymer component blend of Example 1 and 46 8 g of barium titanate (95 μηι particles) and 3 as shown in Table 丨1.2 g of barium titanate is blended to form. As shown in Table 2, the formulation η is shown as 22 〇 and 1 MHz is 〇·〇〇8

The DF, and -55 C are -0.4% and the capacitance temperature coefficient is 0.2% at 125 °C. Example 9

Formulation I The composite of the invention according to Formulation I was obtained by as shown in Table 2, 22 g of the polymer component blend of Example 1 and 54 6 g of barium titanate (95 μM particles), 2 3.4 g of titanium. The acid bismuth and 0.14 g of a dispersant were blended to form. As shown in Table 2, the formulation ϊ is shown as 21 〇 and DF of 0.008 at 1 mHz, and -〇, 4 at -55 C. /〇 and 0.2 ° / at 125 ° C. The capacitance temperature coefficient changes. Example 10

Formulation J The composite of the invention according to Formulation J is obtained by as shown in Table 2g 2 〇g of the polymer component blend of Example 1 with 48 g of barium titanate (87 μηη particles), 32 g of acid The lock is formed by blending 0. 12 g of dispersant. As shown in Table 2, the formulation j exhibited a DF of 0.004 and a DF of 0.004 at 1 mHz, and 0.3% at -55 C and -0.4 at 125 °C. /. Capacitance temperature 133913.doc 21 200920715 Degree coefficient change Example 11

Formulation K The composite material of the present invention according to Formulation K is obtained by phantom indicating that the polymer component blend of Example 1 and 43 2 g of titanic acid are separated from the particles, and 36.8 g of barium titanate. And ο.] g dispersant is formed by blending. As shown in Table 2, the formulation κ exhibited a ratio of 27 to DF ‘ and -55 at MHz5 at 1 MHz. . Next 4_〇2% and 125. . The lower is the capacitance temperature coefficient change of 〇1%. The present invention has been particularly shown and described with reference to the preferred embodiments thereof, and those skilled in the art are susceptible to various changes and modifications. The scope of the patent application is intended to be interpreted as covering the embodiments disclosed, the alternatives discussed above, and all equivalents thereof. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 provides a graphical representation of the TCC characteristics of a particular formulation of the composite of the present invention. The formulation shown in this figure exhibits a TCC change of from about _5% to about +5% in response to temperature changes ranging from about -55 °C to about 1251. Figure 2 provides a TCC profile of a particular formulation of the composite of the present invention. The formulation shown in this figure responds to approximately -55. A temperature change in the range of about 125 °C exhibits a TCC change of about -2.5% to about +2.5%. Figure 3 provides a TCC profile of a particular formulation of the composite of the present invention. The formulations shown in this figure exhibit a TCC change of from about -0.5% to about +0.5% in response to temperature changes ranging from about -55 °C to about 125 °C. 133913.doc -22-

Claims (1)

200920715 X. Patent application Fan Park·· 1. A composite material comprising a blend of a polymer component and a ferroelectric pottery particle, the polymer component comprising about 5 by weight of the polymer component At least one epoxy-containing polymer in an amount of from wt% to about 95% by weight, and from about 5 wt% to about 95 wt%, based on the weight of the polymer component, to N, having a plurality of epoxy A polymer of a reactive group, wherein the composite exhibits a change in temperature coefficient of capacitance of from about -5% to about +5% in response to a temperature change in the range of from about _55t to about 125t. 2. The composite material of claim 1, wherein the epoxy-containing polymer comprises a novolac epoxy resin, an epoxy resin having an aliphatic or aromatic hydrocarbon main chain derived from bisphenol A or bisphenol F, Butadiene-acrylic modified epoxy resin or a combination thereof. 3. The composite material of claim 1, wherein the polymer having a plurality of epoxy-reactive groups comprises polyimine, polyamidimide, polyethylene terbene, polyethersulfone, reactivity Polyester or a combination thereof. 4. A composite material as claimed in claim 1, wherein the polymer having a plurality of epoxy groups comprises a polyester having a plurality of hydroxyl groups. 5. The composite of claim 1 wherein the ferroelectric ceramic particles comprise titanium & L, titanate, barium titanate or combinations thereof. 6. The composite of claim 1, wherein the ferroelectric ceramic particles are present in powder form. 7. If you are looking for something! The composite material, which responded to about _55. 〇 to about 125. The variation in calories within the range of 〇 shows about -2.5°/. The temperature coefficient of the capacitance to about +2.5% is changed to 0 133913.doc 200920715 ° The composite material of the item 1 is responsive to about _55 〇c to about i25. The variation in the temperature coefficient of the capacitor is about _0.5% to about +0.5%. 9. The composite material of claim 1, which has a dielectric constant of about 15 to about 30. a composite comprising a blend of a polymer component and a ferroelectric ceramic powder, the polymer component comprising about 5 by weight of the polymer component At least one epoxy-containing polymer in an amount of up to about 95% by weight, and at least one of a plurality of epoxy-reactive groups in an amount of from about 5 wt% to about 95 wt%, based on the weight of the polymer component The polymer of the group '4' is a barium titanate, a titanate pin, a titanate locker or a combination thereof; wherein the epoxy group-containing polymer comprises (iv) varnish epoxy resin, which is derived from the double A or an epoxy resin of a fatty or aromatic hydrocarbon backbone of F, a butadiene-acrylic modified epoxy resin or a combination thereof; wherein the plurality of epoxy-reactive groups are present The polymer comprises polyimine, polyamidimide, polyvinyl butyral, polyethersulfone, reactive polyester, or a combination thereof; and wherein the composite is responsive to from about _5 5 °C to about 1.25. Wide r in + L Wang Θ C temperature variation within the dry circumference exhibits a change in the temperature coefficient of capacitance of about -5% to about +5%. 11. An object, a layer of a composite material thereof, comprising a conductive layer and the conductive layer As claimed in claim 1, an electric valley includes a first conductive layer, the first conductive layer, and the second conductive a second conductive layer between the layers and a layer attached to the composite material of claim 133913.doc 200920715. 13. The capacitor of claim 12 wherein the first conductive layer and the second conductive layer independently comprise copper, A capacitor of claim 12, wherein the first conductive layer and the second conductive layer comprise copper. 15. A capacitor comprising: a) An object comprising: a first conductive layer and a layer of a composite material of the first conductive layer as claimed in claim 1; and b) a second object comprising a second conductive layer and the second conductive layer as requested a layer of composite material of item 1; 4 the first article and the second article are attached to each other such that their composite layers are in contact with each other. 16. A printed circuit board comprising a capacitor as claimed in claim 12. 1 7' electronic device, A printed circuit board as claimed in claim 18. 18. An electronic device 'comprising a capacitor as claimed in claim 12. {) 19. A method of forming a capacitor comprising: a) providing a polymer component and iron Blending of electroceramic particles The polymer component comprises at least one epoxy-containing polymer in an amount of from about 5 wt/〇 to about 95 wt%, based on the weight of the polymer component, and " At least one polymer having a plurality of epoxy-reactive groups in an amount of from about 5 wt% to about 95 wt%, wherein the composite responds to temperature changes in the range of from about -55 ° C to about 1251: And exhibiting a change in the temperature coefficient of capacitance of about -5% to about +5%; and b) attaching a layer of the composite material between the first conductive layer and the second conductive layer 133913.doc 200920715. 20. The method of claim 19, wherein the attaching step (b) comprises: i) forming a first object comprising the first conductive layer and a layer of the composite material on the first conductive layer; II) forming an inclusion a second object of the second conductive layer and the layer of the composite material on the second conductive layer; and III) joining the first article to the second article such that the composite layer of the first article is in contact with the composite layer of the second article. 21. The method of claim 2, wherein step in) comprises laminating the first article with the second article and/or curing the composite layer. The method of claim 19, wherein the attaching step (b) comprises: applying a layer of 3 kel composite to the first conductive layer; and n) applying the second conductive layer to the first And superposing the first conductive layer with the composite material layer and the second conductive layer and/or curing the composite material layer on the surface of the composite material layer on the conductive layer; and optionally. 23. The method of claim 19, wherein the attaching step 包含) comprises: i) applying a layer of the composite to the first conductive layer; then u) curing the composite layer; and then Du Tian will: The surface of the man-to-conductive layer formed on the surface of the composite material is opposite to the first metal layer. The method of claim 19, wherein the epoxy-containing polymer scooped eight-coat epoxy resin, an epoxy resin having a quinone=3 phenol backbone derived from bisphenol A or bisphenol F, butadiene _ propylene oxime, or aromatic, toxic epoxy I33913.doc 200920715 or a combination thereof. 2 5. As claimed in the method of q, #i 贝 None of the ferroelectric ceramic particles comprise barium titanate, barium titanate, barium titanyl titanate or combinations thereof. 26. The method of claim 19, wherein the polymer having a plurality of epoxy-reactive groups comprises polyamidiamine, polyamidoximine, polyvinyl butyral, polyether oxime, reactive poly Ester or a combination thereof. 27. A method of forming a printed circuit board comprising incorporating a capacitor formed as claimed in claim n into a printed circuit board. ^ 133913.doc