TW200918684A - Methods and apparatus for reducing the consumption of reagents in electronic device manufacturing processes - Google Patents

Abstract

A substrate coating system is provided which includes a substrate coating chamber; a gas box connected to the coating chamber and adapted to provide reagent gases to the coating chamber; and a reagent reclaim system connected to the substrate coating chamber and the gas box, wherein the reagent reclaim system includes a wet scrubber connected to the coating chamber; a polisher connected to the wet scrubber; and a dryer connected to the polisher and the gas box.

Description

200918684 IX. Inventor's Note: [Related Applications] US Patent Application No. 61/0521 64 (Procedure), filed on February 9, 2008, entitled "Methods and Equipment for Reducing Reagent Consumption in Electronic Device Manufacturing Processes" U.S. Patent Application Serial No. 11/565400 (Attorney Docket No. 11402) entitled "Recycling of Diluted Gases", November 30, 2006; U.S. Patent Application Serial No. 6 1 /03 9 1 0 1 (Attorney Docket No. 1 3226/L), entitled "Method of Deposition of Undefined Deuterium and Microcrystalline Bismuth Using Low Purity Decanane"; And U.S. Patent Application Serial No. 61/026,432 (Attorney Docket No. 1 3 20 8/L2), entitled "Decrementing System", filed on February 5, 2008, and hereby The entire disclosure of the above-identified patent application is hereby incorporated by reference. TECHNICAL FIELD OF THE INVENTION The present invention relates generally to electronic device fabrication techniques, and more particularly to the recovery and reuse of reagent gases used in substrate coating processes. [Prior Art] Some electronic device manufacturing processes may use a large amount of expensive reagents, and some of them may cause harm and danger if released into the atmosphere. These reagents and their by-products have been reduced using a reducing system that converts these reagents or their by-products into nociceptive and/or hazardous compounds. These agents and their by-products are reduced in order to address the nuisance and/or danger of these agents and their by-products. However, the amount of reduction may not solve the problem of requiring a large amount of expensive reagents to be purchased and the unconsumed reagents to be eventually wasted through the process chamber. It is therefore desirable to develop methods and apparatus that reduce the consumption of expensive reagents.

SUMMARY OF THE INVENTION In one aspect of the invention, a substrate coating system is provided that includes: 1) a substrate coating chamber; 2) a gas box coupled to the coating chamber to provide reagent gas to the a coating chamber; and 3) a reagent recovery system coupled to the substrate coating chamber and the gas tank, wherein the reagent recovery system comprises a) a scrubber coupled to the coating chamber, a connection to the A polisher of the scrubber, and a dryer connected to the scrubber and the gas box. In another aspect of the invention, there is provided a substrate coating system comprising: 1) a substrate coating chamber; 2) a gas box coupled to the coating chamber to provide reagent gas to the coating chamber And a reagent recovery system coupled to the substrate coating chamber and the gas tank, wherein the reagent recovery system comprises a) a reagent filter coupled to the coating chamber; and b) - connected to A dopant filter for the reagent filter. In another aspect of the invention, a method of operating a substrate coating system is provided, the method comprising: a) supplying more than one reagent to the substrate coating chamber

200918684; b) coating a substrate in the substrate coating chamber; c) discharging unused reagents from the substrate chamber; and d) recovering reagents to regenerate reagents for use in the substrate coating chamber . Various other aspects of the invention may be derived from the following detailed description, the appended claims and the appended claims. [Embodiment] An electronic device manufacturing process may use a large amount of reagents such as helium hydrogen. A large portion of these agents may be expensive and/or precious and may become waste through the process chamber without being used. In a typical substrate coating process prior to the present invention, it is possible to introduce helium hydrogen into the substrate coating chamber under substrate coating process conditions. Equivalent hydrogen and decane may pass through the substrate coating chamber without being used. These unused hydrogen and decane are treated as hazardous and/or hazardous emissions and this effluent is discharged to a suitable reduction. Such a reduction device may be a heat reduction device in which the discharge is heated and an oxidant is mixed to oxidize the discharge. The decane may not be expensive and may not be readily available in the future. In addition, the electronic device manufacturing equipment may be located at a relatively remote location and it is difficult to carry the reagent at the tube front, or the transportation is expensive. It is therefore desirable to be able to use these reagents so that fewer reagents are purchased from the supplier and less reagents are treated as waste. In one aspect, the present invention provides a method and apparatus for recovering hydrogen to be used again as a reagent in a substrate coating process. It can be done by coating from the second. The alkane and the test alkane with . Some of the chambers of the chamber are provided or re-supplied, and the unused reagent stream is discharged from the coating chamber of the substrate 7 200918684 and the reagent stream is washed to remove impurities. The washed unused reagent stream can then be passed through a cold trap or a refrigerated chiller' to purify the unused reagent stream in one step. The unused test stream can then be passed through a dryer' to remove water present in the unused reagent stream. The unused reagent stream is then sent back to a gas box' and the used reagent is supplied from the gas tank to the substrate coating chamber as a reagent. In another aspect, the present invention provides a method and apparatus for recovering hydrogen to reactivate a reagent in a substrate coating process and a method for recovering hydrazine to produce decane and then used as a reagent in a substrate coating process. With equipment. It can remove the unused agent flow from the substrate coating chamber and pass it through a filter to remove the dream, Shi Xizhuo, Er Mengzhuo, San Shi Xi from the unused reagent stream. Hyun and Ju Meng Xuan the reagent stream to remove impurities to achieve the method and equipment. Alternatively, the unused reagent can be passed through a dopant filter or an adsorption/absorption separation matrix to remove dopants present in the unused reagent stream. The main component of the unused reagent stream that has passed through the regulators is hydrogen' and is delivered to the gas box for reuse in the substrate coating chamber. FIG. 1 is a substrate coating of the present invention. A schematic of system 100 for recovering and reusing hydrogen as a reagent in a substrate coating process. The system 100 can include a substrate coating chamber 102 that can be used to coat a substrate. For example, in the manufacturing process of a solar panel, a germanium coating is usually formed on a substrate such as glass to form a polycrystalline germanium coating on the glass. In addition to glass, it is also not a nearby agent. In addition, it is not possible to remove the fluid. The application can be applied. 8 200918684 Other substrates, such as metal films, polymer substrates, etc., are used. In addition to being used to fabricate solar panels, system 100 can be used in other coating processes. The substrate coating chamber 102 is coupled to a throttle valve 106 via a conduit 104 and a throttle valve 106. The bellows group I 0 8 can contain multiple low pressure water cooled bellows' but non-water cooled bellows can also be used. The bellows are a low tolerance blower and have the advantage of requiring less energy to operate the bellows and less heat transfer to the gas when the bellows carries gas. In embodiments having more than one bellows (optional water-cooled) in the stack of bellows 108, the bellows are activated in batches to increase the pressure of the recovered gas stream while delivering less heat to the recovered gas stream. Any bellows or pump that increases the pressure of the recovery gas stream to, for example, between about 1 Torr and 40 psi, between about 20 and 30 p s i or between about 1 Torr and 20 p s i can be used. Also use higher or lower pressures. The bellows can reduce or eliminate any back pressure wave transfer from downstream to upstream of the bellows set 108. The bellows pack 108 is coupled to the wet scrubber 112 via a conduit u. The scrubber 112 can be, for example, a bubble column, a burr saddle, a packed bed column, or a scrub column. Any suitable wet scrubber can be used. The scrubber 112 is coupled to the condensation trap 116 via a conduit 114. Condensation trap II 6 may contain one or more cooling plates or other surfaces to condense gases to be removed from the gas stream. Condensation traps 16 can be isolated and bypassed for easy maintenance. The scrubber 112 and condensation trap H6 can be coupled via conduit 118 to a water treatment unit (not shown). The condensation trap 116 can be connected to the dry 200918684 dryer 122 via conduit 120. Dryer 122 can be a molecular sieve dryer or any other suitable dryer. Dryer 112 can be a single bed or multiple bed dryer. Dryer 122 can be coupled to bellows 126 via conduit 124. The bellows ι26 is similar to the bellows used in the bellows set 108. The bellows 126 can be connected to an oil filter 13 〇 by a conduit 1 28 . The oil filter 13 can be used to catch any oil, contaminants, lubricity reaction products and/or other high vapor pressure materials that may be present in the s-type flow from the bellows group. The oil filter 130 can be coupled to the air box 134 through a conduit 132. The gas box 134 can be used to mix reagents and other gases for introduction into the substrate coating chamber 102 through the conduit 136. The air box 丨 34 can be constructed such that it is connected to a plurality of reagent sources '(not shown) _ with it: gas: body source (not shown.). Reagents and other gases _ can be introduced into the gas tank through a mass flow controller (not shown) to deliver accurate mass flow rates of reagents and other gases. The substrate coating chamber 102 can also be connected to a pump stack 138 via a conduit 14 and/or an isolation valve 142. The pump cluster 138 can be connected to the decrementer 146 via a conduit 144. The reducer _146 may be a burn wet abatement tool or an electrothermal reducer or the like. Any reducer that can effectively reduce chamber cleaning can be used. The reducer 146 can be connected to a house exhaust system (not shown) via conduit 148 for further reduction or discharge to the atmosphere. The chamber pressure gauge 150 can be connected to the substrate coating chamber 1〇2 and can also be connected to the throttle valve 1〇6 via the communication line 152. The substrate coating chamber 1〇2 can be operated in two modes during operation. In the first mode of 10 200918684, the substrate coating chamber 102 can be performed, for example, to coat the substrate with a crucible. In the second mode, the plasma coating chamber 102 can be cleaned using a plasma. Hereinafter, the system will be described by taking enamel on a substrate as an example. However, it should be understood that the present invention is not limited to the use of reagents on a substrate through a process chamber device process, such as for solar panels, liquid crystal light-emitting diodes, thin films, and nanometer processes. In addition to deposition, etc., the invention can be applied to process patterns used to remove process chambers that are not desired or used to clean surfaces. In the first mode, i.e., the deposition mode, the gas box 134 supplies a gas to the substrate coating chamber 102. In the coating process, the meter 150 uses a combination of a throttle valve 106, a pump group 138, and an additive gas supplied to the process chamber 102 to control the pressure applied to the substrate. The bellows pack 108 can be provided through the conduit 1〇4 such that during the coating process, the tuyere gas stream can be pumped from the substrate coating chamber 102 via the throttle valve 106 and the conduit 110 using the bellows pack 1 〇8, And it is allowed to enter the scrubbing gas 1 丨 2 hydrogen and decane reagent can be contacted with water in the scrubber 112, removing decane, dioxane, trioxane and polydecane. The dopants in the gas stream can be removed from the scrubber by the conduits 随着 8 along with the sulphate medium. Subsequently, the remaining gas flows into the condensate fat 116. Condensation splicing 116 can remove residual gas in a coating process plasma (such as fluorine coating 10, any electronic display, there are applications. This material and / should be hydrogen · gas and hair. Available pressure • From air box 1 34 : Cover chamber 1 0 2 vacuum source. Catheter 104, excess hydrogen " unused from gas flow, wash.. sputum, trioxane, liquid ( Scrubber through the conduit 1 14 in the body flow of any of the 200918684 residual particles, moisture, 甲石夕烧, 二石夕院, 三; ^, dopant. Gas flow through the condensation trap 116 via the conduit 12 122 122 The gas stream is dried to a moisture content in the dryer 112. Ppm. The bellows 126 is then activated to deliver the gas tube 124, the conduit 128 and the oil filter 130 from the dryer, and the oil filter 13 is arable. Any oil or sub-volume and/or high vapor pressure species in the gas stream of 6 and/or wind phase 12. At this stage, the gas stream can be (and a hydrogen gas stream) and can then be fed The air box 丨 34, and the test in the substrate coating process for the substrate coating chamber 102 is in the first mode, that is, In the cleaning mode, the substrate can be cleaned using a plasma from a far (not shown). The plasma cleaning can be used to transport the plasma cleaning agent through the conduit 14 and the isolation conduit 144 into the reducer 146. And the material is washed in the reducer. The depleted electric charge cleaning material is passed from the reducer 146 to a factory scrubber (not shown) for further reduction to the atmosphere. G Figure 1A is the first A schematic diagram of another arrangement 100A of the substrate coating system 100. The system i〇〇a is similar to the figure: only except between the bellows group 108 and the substrate coating chamber 1〇2. A control system is included. Instead of connecting the bellows to the substrate coating chamber 1〇2 as in Figure 1, the bellows pack 108 is coupled to the conduit 40 via conduit 154 156. The conduit 140 can be connected by a group 138 a vacuum line to the substrate coating chamber 1〇2. The control signal line 160 is connected to the gas box 134, the substrate coating chamber is gathered and the drying is less than about 2, and the flow is removed from the other high-energy energy. It is high purity again as a cut. End plasma source Pu group 1 3 8 valve 142 with less electricity Clear conduit 148 or discharge system with Qin system 1 0 0, connection mode group 1Q8 straight and three-way valve is to help the pump 158 102 and three 12 200918684 to the valve 1 5 6. When operating, the system 100A operates similarly In the system of Figure 1, except that in the coating or deposition mode, the unused reagent gas does not enter the conduit i 〇 4 as the reagent gas in the system 100 of Figure i, but enters the conduit 140. It is then turned via valve 156 to enter windbox group 108 via conduit 154. In the chamber cleaning mode, valve} $6 is designed to allow the chamber purge stream to enter the pump group 38 via conduit 140. The p controller 1 5 8 determines that the substrate coating chamber 102 is in the cleaning mode and the deposition mode ' and the three-way valve 156 can be appropriately controlled. 2 is a schematic view of a substrate coating system 200 in accordance with another embodiment of the present invention. System 200 can include a substrate coating chamber 202 that can be used to coat a substrate. Substrate coating chamber 202 is similar to substrate chamber 102 in Figure 1. The substrate coating chamber 202 is coupled to the bellows set 208 through a conduit 204 and a throttle valve 206. The bellows group 2 0 8 may be similar to the bellows group 1 0 8 in Figure 1. The bellows set 2 0 8 is connected to the separation system 214, 214 through the conduit 2 1 0, 2 1 〇 'and the oil filter 2 1 2, 2 1 2, I), and the oil filter 212, 212 'is similar to the 1 oil filter 13 0. Although two separation systems 2 1 4, 2 1 4 are depicted in Figure 2, it is to be understood that fewer or more separation systems can be used, for example > 1, 3, 4, etc. The separation system 2 1 4 includes isolation valves 2 16 and 2 18 , a dopant separator 220, and a helium separator 222. Isolation valves 2 1 6 and 2 1 8 isolate separation system 214 from system 200. The dopant separator 220 may be an absorption separation substrate or an adsorption separation substrate. Alternatively, the dopant separator 220 may be replaced with a dopant filter (not shown in 2009-18684). Similarly, the helium separator is an absorption separation matrix or an adsorption separation matrix, or helium is separated into a helium filter. A suitable filter, such as a honeycomb coated honeycomb, may be a ytt alumina doped separation system 2丨4' similar to the separation system 2丨4. To the systems 214 and 214, a bellows 224 can be coupled. The wind is connected to the air box 230 by a conduit 226 and an oil filter 228. The gas ζ superconductor 232 is connected to the substrate coating chamber 202. The substrate coating chamber 202 can also be isolated from the pump cluster 238 via conduit 234. The pump cluster 238 is connected 242 via conduit 240. The reducer 242 can be connected to the plant row via conduit 244; shown) for further down-treatment' or discharge to the atmosphere. The pressure gauge 2 4 6 is connected to the substrate coating chamber 2 〇 2 and is connected to the throttle valve 2〇6. Although not shown in the figure, the system can be modified in the same way as the system is repaired iOOA. This modification is replaced by C/, which determines the diversion of the airflow to the pump cluster 238 or group 208 depending on whether the chamber is in the helium deposition mode. It is also possible to use a controller as shown in the system i〇〇a _. The operation of the substrate coating chamber 202 in a similar manner to the operation of the substrate coating chamber 1〇2 during operation, except that the reagent used in the deposition mold may not be as wet as the system of FIG. The scrubber, the condensing trap and the dryer, but not any white dopants are used) from the bellows group 208 via the conduits 21, 21, 222, 222, 222, ceramic ria doped boxes, 2 2 4 tanks 23 0 through 23 6 connected to the reducer & system (unused signal line & system to three-way valve cleaning mode to turn the bellows in the first figure, does not show the general pass 9 reagent (and and filter oil 14 2009 18684 2 1 2, 2 1 2, and into the separation system 2 1 4 and 2 1 4 '. Separation system 2 1 4 ' 2 1 4 ' by the dopant separator 220, 220 'unused reagent The dopant is removed from the gas stream, and as described above, the dopant separator 220, 220' can be a absorbing or adsorbing separation matrix. If desired, the dopant can be separated and collected to serve as a dopant again. The separation system 214, 214' utilizes the helium separators 222, 222' to never use the gas stream.矽Compound. 矽Separator 2 2 2, 2 2 2 'The 吸, methoxy, dioxin, trioxane and polydecane can be removed by absorption, adsorption and/or filtration mechanisms. The ruthenium, decane, dioxane, trioxane and polydecane removed in the stream are collected and sent directly to the brothel manufacturing apparatus to provide the decane gas supply tank 230 as a reaction in the substrate coating chamber 202. Reagents. By separating the system 2 1 4, 2 1 4, the unused unused reagent gas stream may be a high purity gas and flowing out of the separation system 2 1 4, 2 1 4 into the bellows 2 2 4 Southern purity hydrogen can flow through conduit 2 2 6 and oil filter 2 2 8 , at tanker 228 any bellows 224 can be introduced into the hydrogen or its I) high molecular weight contaminants are removed, The second portion of the system 2 is operated in a manner similar to the system 100 of the first embodiment. - The third circle shows a schematic view of the substrate coating system 300 of the present invention, which includes a symbiosis Equipment 3. System 3 00 can contain air box 3〇2, air box 3〇2 is connected through conduit 304 To the substrate coating chamber 3〇6. The substrate coating chamber to 306 is similar to the substrate coating chamber previously described with reference to the various figures. The substrate coating chamber 3〇6 is connected to the gang 15 via the conduit 3〇8. 200918684 Puqun 310. The pump cluster 310 can be coupled to the reducer 314 via conduit 312. The reducer 314 is coupled to the steam generator 318 by conduit 316. The steam generator 318 is coupled to the cooling tower 324 by a conduit 322. The hot gas generator can also be connected to a power grid or a power grid. Cooling tower 324 is connected by conduit 326 to a reducer 314» reducer 314 via conduit 3 28 to a plant exhaust system (not shown) for further step-down processing or chamber discharge to the atmosphere. The pressure gauge 330 is coupled to the substrate coating chamber 306 and is coupled to the throttle valve 3 3 2 via a signal line 3 3 4 . In operation, the gas box 302 provides reagent and other gases to the substrate coating chamber 306 via conduit 304. The operation of the substrate coating chamber 306 is similar to that of the prior reference: the base plate described in the various figures: the coating chamber. In the deposition and chamber cleaning mode, the pump cluster 306 and the throttle valve 323 are used to extract emissions from the substrate coating chamber 306 via conduit 308 that may contain high levels of hydrogen and helium. The effluent stream is then passed through conduit 3 1 2 into a reducer 3 1 4 and the effluent is combusted in a reducer 314. In addition, the combusted emissions are contacted with cold water in the reducer to produce steam and discharged from conduit 316 into steam generator 318. Steam generator 318 can generate electricity and be transmitted via line 320 to a power plant (not shown) or a power storage device (not shown). The steam generator 318 utilizes a conduit 322 to deliver hot water (containing condensed vapor) and vapor to the cooling tower 324 to cool the hot water and steam to cold water. The cold water can be returned from the cooling tower 324 via conduit 326 to the reducer 3丨4, and in the reducer 3 14 to cool the burned emissions and again generate steam. The effluent from the reducer 314 and possibly containing the oxidized unused reagent and the oxidized chamber wash is sent to the plant row via conduit 3 2 8

200918684 The discharge system (not shown) is further reduced, or discharged to the available pressure gauge 330. Combined with the throttle valve 3 3 2. The pump group controls the chamber coating chamber force by adding gas from the air box 302. FIG. 4 is a schematic view showing the substrate coating system 400. System 1 0 0 similar to Figure 1, except for the following differences. The system oil filter 130 is not connected to the air box 134 by the cymbal as shown in the system 100 of Fig. 1. Instead, the oil skimmer 130 is connected to the separation unit 402. Separation unit 402 can separate the hydrogen and inert gas for the membrane. Any suitable separator can be used to connect to the cassette 134 via conduit 404 and to the inert gas source 4 0 8 . When the inert gas source 4 0 8 is operated by the conduit 4 10 0 134 °, the operation of the system 400 is similar to that of Fig. 1 except that the difference has been made. In system 400, inert gas is introduced into gas box 134 from inert gas source 408 4 1 0. The inert gas may be hydrogen, gas or other suitable inert gas. Inert gas can be used to cool the substrate 102. An additional benefit is the efficient use of such solvents as decane. The inert gas and the unused reagent will flow through the system until the purity hydrogen enters the conduit 132. The inert gas/hydrogen mixture is then fed to element 402 to separate the inert gas from the hydrogen. Thereafter, hydrogen gas is separated from the gas inlet 134 via conduit 404. The inert gas then enters the inert gas source 408 from the separation unit conduit 406. The inert gas source 408 is then sent to the gas box 1 3 4 via inert gas. In the air. 3 10 and the operating pressure system 400,400, the conduit 1 32: the conduit 132 is used, with . The separation single conduit 406 is connected to the gas box system 100, and the test inert gas and the high separation separation unit unit 402 4 02 through the conduit helium gas, the argon coating chamber hydrogen gas, etc., through the conduit 41 0 17 200918684, FIG. A schematic diagram of the overlay system 500. System 5000 is similar to system 200 of Figure 2 except for the following differences. In system 500, the oil filter 2 28 is not connected to the air box 230 by the conduit 2 26 as shown in the system 2000 of Figure 2. Instead, the oil filter 228 is connected to the separation unit 504 through a conduit 502. The separation unit 504 is similar to the separation unit 402 in Fig. 4. Separation unit 504 can be coupled to air box 230 via conduit 506. Separation unit 504 is also coupled to inert gas source 510 via conduit 508. The inert gas source 5 10 is connected to the gas box 2 3 0 by means of a conduit 5 1 2 .

In operation, the system 500 operates in a similar manner to the system 2 0 0 of Figure 2, except that it has been different. In system 500, inert gas is introduced into gas box 230 from gas source 510 through conduit 512. As described in System 400 of Figure 4, the inert gas may be hydrogen, helium, argon or other suitable inert gas. The effect of inert gas in system 500 is the same as that of inert gas in system 400 of Figure 4. In system 400, inert gas and unused reagents will flow through the system until inert gas and high purity hydrogen enter conduit 50. The inert gas/hydrogen mixture then enters the separation unit 504 to separate the inert gas from the hydrogen. Thereafter, hydrogen gas enters the gas tank 230 from the separation unit 504 via the conduit 506. The inert gas then enters the inert gas source 5 1 0 from the separation unit 504 via the conduit 50S. The inert gas is then transferred from the inert gas source 5 1 0 to the gas tank 23 via the conduit 5 1 2 . The above description discloses only a few exemplary embodiments of the invention. Variations of the above-described apparatus and methods can be readily made without departing from the scope of the invention. For example, in systems 400 and 5000, unused reagent gases may flow through a vacuum line and a three-way valve as shown in System 100. Such a modified system can have a control system, 18 200918684 to determine whether to recycle or reduce emissions from the process chamber depending on whether the process system is in a deposition mode or a chamber cleaning mode. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a substrate coating system suitable for recovering hydrogen according to the present invention; Fig. 1A is a schematic view showing another embodiment of the system of Fig. 1;

2 is a schematic view of another apparatus for recovering hydrogen and helium according to the present invention; FIG. 3 is a schematic view of a substrate coating system including a symbiosis apparatus of the present invention; and FIG. 4 is another embodiment of the system of FIG. Figure 5 is a schematic view of another embodiment of the system of Figure 2. [Main component symbol description] 100, 100A, 200, 300, 400, 500 system 102, 202, 306 substrate coating chambers 104, 110, 114, 118, 120, 124 conduits 1 0 6 , 2 0 6 , 3 3 2 throttle valve 1 0 8 , 2 0 8 bellows group 112 wet scrubber 116 condensation trap 122 dryer 126, 224 bellows 128, 132, 136, 154 conduit 130 oil filter 134, 230, 302 gas box 138 , 23 8 , 3 1 0 pump group 140, 144, 148 duct 142 isolation valve 19 200918684

146, 242, 314 reducer 1 5 2 communication line 1 5 8 controllers 204, 210, 21 (Γ conduit 21 4, 2 1 4 'separation system 216, 216, 218, 218, 220, 220' dopant separation 226, 232 '234 conduit 248, 334 signal line 150' 246, 330 pressure gauge 1 5 6 three-way valve 1 6 0 signal line 2 1 2, 2 1 2 ', 2 2 8 oil filter 2 3 6 isolation valve 222, 222' 矽 separator 240, 244 conduit 304 ' 308, 312, 316, 322, 326, 328 conduit 320 wire 4 0 2 separation unit 408 inert gas source 5 0 4 separation unit 3 1 8 steam generator 3 24 cooling Tower 404, 406, 410 conduit 502, 506, 50, 512 conduit 5 10 inert gas source

20

Claims (1)

200918684 X. Patent Application Range: 1. A substrate coating system comprising: a substrate coating chamber; a gas tank connected to the substrate coating chamber to provide reagent gas to the substrate coating chamber; a reagent recovery system coupled to the substrate coating chamber and the gas box, and the reagent recovery system comprises: a wet scrubber coupled to the substrate coating chamber; a scrubber coupled to the wet a scrubber; and a dryer connected to the scrubber and the gas box. 2. The substrate coating system of claim 1, further comprising a bellows set between the substrate coating chamber and the wet scrubber. 3. The substrate coating system of claim 1, wherein the finisher comprises a condensed odor. 4. The substrate coating system of claim 1, wherein the finisher comprises a cooler. 5. The substrate coating system of claim 1, wherein the dryer comprises a molecular sieve dryer. The substrate coating system of claim 1, further comprising a bellows and an oil filter between the dryer and the air box. The substrate coating system of claim 1, further comprising a pump group connected to the substrate coating chamber, and a reducer connected to the pump group. 8. The substrate coating system of claim 7, wherein the wet scrubber is coupled to the substrate coating chamber through a vacuum line, and the vacuum line connects the pump group to the substrate Coating the chamber. 9. A substrate coating system comprising: a substrate coating chamber; a gas box coupled to the substrate coating chamber to provide reagents to the substrate coating chamber; and a reagent recovery system coupled to The substrate coating chamber and the gas tank, wherein the reagent recovery system comprises: a reagent filter; and a dopant filter. The substrate coating system of claim 9, wherein the reagent filter comprises one of: a ruthenium filter, an adsorption separation substrate, and an absorption separation substrate. The substrate coating system of claim 10, wherein the reagent filter is heated. The substrate coating system of claim 9, wherein the dopant filter comprises an adsorptive separation matrix and an absorption separation matrix. The substrate coating system of claim 12, wherein the dopant transitioner is heated. The substrate coating system of claim 9, further comprising a bellows set between the reagent filter and the substrate coating chamber. 1. The substrate coating system of claim 9, further comprising a bellows and an oil filter between the dopant filter and the gas box. A method of operating a substrate coating system, comprising: supplying more than one reagent to the substrate coating chamber; coating a substrate in the substrate coating chamber; discharging unused reagents from the substrate coating chamber And recovering unused reagents again as reagents for use in the substrate coating chamber. The method of claim 16, wherein the recovering the unused reagent to serve as the reagent for the substrate coating chamber again comprises: washing the unused reagent to Remove impurities. 1 8. The method of claim 17, further comprising using a condensate trap to remove impurities remaining in the unused reagent after washing. 19. The method of claim 17, further comprising drying the washed unused reagent. The method of claim 19, further comprising supplying the dried and washed unused reagent to a gas tank, the gas tank being adapted to supply more than one reagent to the substrate coating chamber . The method of claim 16, wherein the recovering the unused reagent to serve as the reagent for the substrate coating chamber again comprises: filtering the hydrazine from the unused reagent. 2 2. The method of claim 21, further comprising filtering the dopant from the unused reagent. 23. The method of claim 21, further comprising using the filtered ruthenium to produce decane as a test agent for use in the substrate coating chamber. 24. The method of claim 21, further comprising delivering the unused reagent that has been filtered out to a gas box to serve again as a reagent for use in the substrate coating chamber. 25