200914169 九、發明說明： 【發明所屬之技術領域】 本發明係有關均溫板之前段製程，特別地指一種以治具 一次操作步驟完成骨料定置之製程，及實現均溫板半成品量 產化之裝置。 【先前技術】 均溫板是利用工作介質的蒸發和冷凝來傳遞熱量，能夠 在大溫差、短距離的情況下傳遞大量的熱能，相對於熱導管 在小溫差、長距離的情況下傳遞熱能，均溫板則是將點的熱 傳導更進一步地變成面的熱傳導，具有更高效率的熱傳導特 性，未來可能被大量應用在熱傳導領域。 已知有許多相關均溫板製程之文獻被提出，例如第6a 及6b圖所示，係轉繪自台灣發明專利第1 24704 8號，揭示 一種「微量粉狀金屬薄膜之均勻塗佈製程」，其主要步驟包 括： 步驟一：以預定量之金屬粉末與預定量之液體混合； 步驟二：均勻攪拌該金屬粉混合液； 步驟三：將該金屬粉混合液充塡至工件之工作區； 步驟四：微量震動該工件之工作區； 步驟五：蒸發該金屬粉混合液之液體； 步驟六：使金屬粉末沉積於該工件之內底面，形成一 沉積厚度小於〇· 1mm之金屬粉沉積膜； 步驟七：將該金屬粉沉積膜與該工件工作區同時進行 燒結。 200914169 另外’例如台灣發明專利公開第200609478號，揭示 一種「微型均熱板的中間製品製造方法」，其主要利用沖壓 加工及蝕刻加工方式，分別完成微型均熱板之外型中間製 品及細微結構體的加工步驟等，進而完成可相互貼合成微 型均熱板的中間製品，以解決微型均熱板中間製品的細微 結構體不易利用沖壓加工方式製作成型，以及將蝕刻加工 應用在中間製品外型加工成本過高之問題。 目前之所以未被廣泛使用，乃因現階段技術常因毛細 組織之塗佈製程及骨料之定置等過程中，耗費大量的人 力’及人爲定置骨料定位不準確，使產品之穩定性及可靠 度增添了不確定之因素。另外，現階段技術不易以一貫自 動化量產設備取代人力，未能有效節省製造成本亦成爲另 一項瓶頸之一。 【發明內容】 本發明主要目的在於提供一種超導均溫板之噴塗及置 料製程，以改善傳統製程人爲骨料定置不準確、耗費人力及 量產不易之缺失。 爲了達成上述目的及其他目的’根據本發明之噴塗及置 料製程，其至少包括下列步驟： 步驟一：提供若千具有腔室之工件’經由一進給裝置以 —預定速率進給； 步驟二：在該工件進給行程之定點上，以一噴塗裝置在 該工件內部定量、定範圍噴塗金屬粉末’使該工件內部底面 附著一金屬粉末層； 200914169 步驟三：在該工件進給行程之另一定點上，經由一置料 治具將來自一粉末成型機所製成之多數個金屬粉錠一次投 遞，在該工件金屬粉末層上方之多數個定點上形成金屬粉錠 陣列。 根據本發明，以自動化噴塗及置料製程，使超導均溫板 半成品量產容易，及將製程中人爲之不確定因素及影響良率 的重要因素降至最低程度，及可大量節省人力及降低製造成 本。 本發明次要目的在於提供一種執行該製程之裝置，以實 現超導均溫板之量產化。其主要包括： 一進給裝置，用以將若干具有腔室之工件以一預定速率 進給，使其通過一噴塗站和一置料站。 一噴塗裝置，設置在該噴塗站中，用以在該工件內部定 量、定範圍噴塗金屬粉末，使在該工件內部底面附著一金屬 粉末層。 一置料治具，其連接在一粉末成型機之終端並設置在該 置料站中，該治具具有多數個投遞口，用以將該粉末成型機 所製成之多數個金屬粉錠一次投遞，在該工件金屬粉末層上 方之多數個定點上形成金屬粉錠陣列。 根據本發明，以自動化量產設備取代人力，利用治具一 次操作步驟可完成骨料準確定置，可連續產製出均溫板半成 品，以便後續之燒結後在工件內形成一毛細組織結構，可將 製程中人爲之不確定因素及影響良率的重要因素降至最低 程度，同時可大量節省人力及降低製造成本。 200914169 【實施方式】 首先說明，均溫板一般製程中，包括在模型內塗佈金屬 粉層、植佈金屬粉錠（業界習稱骨料）、燒結、封銲、真空 注液等步驟。本案技術即針對前段製程，即在工件內塗佈金 屬粉層及植佈金屬粉锭，提供自動化量產製程及設備以取代； 人力，以便後續之燒結後在工件內形成一毛細組織結構，可 將製程中人爲之不確定因素及影響良率的重要因素降至最 低程度。 ί 以下將配合實施例對本發明技術特點作進一步地說 明，該實施例僅爲較佳代表的範例並非用來限定本發明之實 施範圍，謹藉由參考附圖結合下列詳細說明而獲致最好的理 解。 第ί圖係根據本發明超導均溫板之噴塗及置料製程之 第一種實施例，其至少包括下列步驟： 提供若干具有腔室之工件，例如以導熱性金屬材料銅板 或鎳板等先經加工，分別沖製出一個可容許工作介質氣液相 I 變化的內部空間，然後經由一進給裝置以一預定的速率進 給。 在該工件進給行程之定點上，以一噴塗裝置在該工件內 部定量、定範圍乾噴例如銅或鎳等之金屬粉末，使該工件內 部底面附著一金屬粉末層。 在該工件進給行程之另一定點上’經由一置料治具將來 自一粉末成型機所製成之多數個金屬粉錠一次投遞’在該工 件金屬粉末層上方之多數個定點上形成金屬粉錠陣列等。 200914169 根據本發明，上述製程中又包括一預先步驟，即在乾噴 金屬粉末之前，預先在工件內部空間預定範圍表面以水或酒 精噴濕’使在該工件內部預定範圍表面具有附著力，然後再 乾噴金屬粉末。或者，在乾噴金屬粉末之前，即在工件沖製 加工成型之後，在工件內部預定範圍表面預先以高速噴砂裝 置衝擊或利用砂帶磨擦形成粗糙面，使在該工件內部預定範 圍表面具有較佳的附著力，然後直接在粗糙表面乾噴金屬粉 末。 根據本發明，執行上述超導均溫板噴塗及置料製程之裝 置1，誠如第2圖所示，其至少包括： 一進給裝置10,例如習知之輸送帶等，用來將若干具有 腔室之工件20以一預定速率進給，使其通過一噴塗站和一 置料站。其中’該進給裝置10在多數個預定區域上，形成 多數個可受作動而上升的被動升降區u，及分別設有若干定 位擋塊12可將該工件20定位在該被動升降區11上（成如 第2a圖所示）。 —噴塗裝置30’例如習知多料型粉體塗裝裝置（可選擇 地單獨噴塗多種材料或多種材料混合噴塗），設置在該噴塗 站中。該噴塗裝置30’例如固定在一升降機構35上可―受控 而升降（成如第3圖所示），及該噴塗裝置3〇具有一噴頭31， 可選擇地乾噴（金屬粉末）或濕噴（水或酒精）。又，一噴 塗治具32與該噴頭31啣接在一起’其具有一對應於該噴頭 31噴出角度的遮罩321’用以遮蔽在該工件2〇噴塗範圍之 外。該噴塗站上至少設有一例如定位桿36等，並透過電路 200914169 控制可使該工件2G進入噴塗位準時’暫時停止該進給裝置 1 〇進給；及’該噴塗站上至少設有一例如感測器裝置3 7， 可偵測該工件20是否到達噴塗位準，當該工件到達噴塗 位準時控制該升降機構3 5作動噴塗裝置3 〇，使該遮罩3 2 i 覆蓋在該工件20表面上，同時在該工件2〇內部表面定量、 定範圍噴塗例如銅或鎳等之金屬粉末等（成如第3a圖所 示），使在該工件20內部底面附著一金屬粉末層a(成如第 3 b圖所示）’可在該工件2 0噴塗完成之後恢復進給裝置j 0 之進給。根據本發明’上述噴塗裝置30依照該工件20加工 方式’不同批次量產而有不同的設定方式，例如表面未經粗 化加工之工件20的批次量產，經設定在噴塗金屬粉末之前， 預先在工件2 0內部空間預定範圍表面以水或酒精噴濕增加 附著力’然後再乾噴金屬粉末。另外，例如表面已經粗化加 工之工件2 0的批次量產’則經設定直接在粗糙表面乾噴金 屬粉末。 一置料治具40’連接在一粉末成型機5〇之終端並設置 、 在該置料站中。該置料治具4 0，例如由透明壓克力材料所構 成’其具有一頂板41和一底板42，兩者角隅之間經由多數 個螺栓兀件43連接在一起’並在該頂板41和底板43之間 維持一容許該進給裝置10通過的空間，且該頂板41蓄有穿 設在螺栓元件4 3上的若干彈性元件4 4之勢能，具有緩衝彈 性。誠如第4圖所示，該粉末成型機5 0例如習知之轉盤式 粉末成型機，基本上包括一轉盤51，沿此轉盤51的圓周配 置多數個壓錠模組5 2，及一餵料筒5 3連續地供應例如銅或 -10- 200914169 鎳等之金屬粉末給壓錠模組52，當該轉盤51運轉時不斷 從壓錠模組52壓製出金屬粉錠B，並排放至—出料端54 一分料裝置60’銜接在該粉末成型機5〇之出料端54,其 有多數個分料口 61用以分配該金屬粉錠b。根據本發明 該置料治具40之頂板41，對應於工件2〇之多數個定點 準’形成多數個對應的投遞口 45，且經由多數個軟管46 別承接在該分料裝置60之多數個分料口 6 1之末端。又， 括一釋放裝置80’介於該分料口 61與投遞口 45之間，阻 金屬粉錠B滑落。上述置料站上，至少設有一例如定位 47等，並透過電路控制可使該工件2〇進入置料位準時暫 停止該進給裝置10進給；及，該置料站上，至少設有一 如感測器裝置4 8等，可偵測該工件2 0是否到達置料位準（ 第4b圖所示）。另外，一升降機構7〇，位於該置料治具 之下方’及該置料治具40底板容許該升降機構70穿過， 受感測器裝置4 8控制可在該工件2 0到達置料位準時上升 作動該進給裝置10之被動升降區11連同該工件20上升 貼近在該置料治具40頂板41的投遞口 45下方；此時， 釋放裝置80受控在工件20上升時一次釋放出多數個金屬 錠B’經由該置料治具40頂板41之多數個投遞口 45 — 投遞到定點，使該工件20金屬粉末層A上方之多數個定 上形成金屬粉錠B陣列（成如第4a圖所示），該升降機 70可在工件20置料完成後下降恢復進給裝置1 0之進給_ 另外，第5圖係根據本發明超導均溫板之噴塗及置料 程之第二種實施例，其至少包括下列步驟： 地 〇 具 位 分 包 擋 桿 時 例 如 40 並 該 粉 次 點 構 製 -11- 200914169 提供若干具有腔室之工件，例如以導熱性金屬材料銅板 或鎳板等先經加工，分別沖製出一個可容許工作介質氣液牛目 變化的內部空間；然後，經由一進給裝置例如習知之輸送帶 等，以·· ·預定的速率進給。 在該工件進給行程之定點上，以一高速噴砂裝置在該工 件內部預定範圍表面上，衝擊成一佈滿毛孔之粗糙表面。 在該工件進給行程之另一定點上，經由一置料治具將來 自一粉末成型機所製成之多數個金屬粉錠一次投遞，在該工 件粗糙面上方之多數個定點上形成金屬粉錠陣列。 根據本發明，執行第二種實施例製程之裝置，基本上與 上述第2〜4b圖所示之裝置相同，因此簡略不重複贅述。唯 一不同的是，例如第5 a圖所示，在噴塗站中以一高速噴砂 裝置30’取代噴塗裝置30。 該高速噴砂裝置30’，例如固定在一升降機構35上可受 控而升降，其具有一噴頭31可高速噴射出砂粒衝擊工件20 表面。一衝擊治具32’與該噴頭31啣接在一起，其具有一對 應於該噴頭31噴射角度的遮罩321，用以遮蔽在該工件20 衝擊範圍之外’及該遮罩321表面與一能產生負壓的回收管 3 8連接在一起，用以回收砂粒和碎屑。該噴塗站上至少設有 一例如定位桿36等，並透過電路控制可使該工件20進入衝 擊位準時，暫時停止該進給裝置1〇進給；及，該噴塗站上 至少設有一例如感測器裝置3 7，可偵測該工件2 0是否到達 衝擊位準，當該工件2 0到達衝擊位準時控制該升降機構3 5 作動高速噴砂裝置30’，使該遮罩321覆蓋在該工件20表面 200914169 上，同時在該工件20內部表面噴砂衝擊，使在該工件20內 部底面形成具有毛細組織的粗糙面C，然後啓動該回收管3 8 回收清除砂粒和碎屑等。可在該工件2 0清除完成之後恢復 進給裝置1 〇之進給’使通過上述置料站在該工件20粗糙面 C上方之多數個定點上形成金屬粉錠陣列。 如此’以自動化量產製程及設備取代人力，可連續產製 出均溫板半成品’以便後續之燒結後在工件內形成一毛細組 織結構’可將製程中人爲之不確定因素及影響良率的重要因 素降至最低程度’同時可大量節省人力及降低製造成本。 以上僅爲本發明代表說明的較佳實施例，並不侷限本發 明實施範圍’即不偏離本發明申請專利範圍所作之均等變化 與修飾’應仍屬本發明之涵蓋範圍。 【圖式簡單說明】 第1圖爲本發明超導均溫板之噴塗及置料製程的第一 種實施例之流程方塊圖。 第2圖顯示本發明執行超導均溫板噴塗及置料製程之 裝置示意圖。 第2a圖顯示從第2圖2a-2a方向之視圖；其中顯示工 件配置在進給裝置之局部平面圖。 第3圖顯示從第2圖3-3方向之剖面圖；其中顯示噴塗 裝置之側面示意圖。 第3a圖顯示第3圖噴塗裝置噴塗過程之示意圖。 第3b圖爲噴塗完成之工件之局部剖面圖；其中，顯示 在工件內部底面附著一金屬粉末層。 200914169 第4圖顯示從第2圖4-4方向之剖面圖；其中顯示粉末 成型機連結置料治具之放大示意圖。 第4a圖顯示第4圖置料治具置料過程之示意圖。 第4b圖顯示從第4a圖4b-4b方向之剖面圖；其中顯示 置料治具之平面示意圖。 第5圖爲本發明超導均溫板之噴塗及置料製程的第二 種實施例之流程方塊圖。 第5a圖顯示本發明第二種實施例之高速噴砂裝置之作 1 動示意圖。 第6a圖及第6b圖爲習知技術，係轉繪自台灣發明專 利第1247048號；其中’第6a圖顯示其塗佈製程之方塊圖、 第6b圖顯示其工件之剖面圖。 【主要元件符號說明】 1 本發明噴塗及置料製程之裝置 10 進給裝置 11 被動升降區 1 2 定位擋塊 20 工件 30 噴塗裝置 30， 局速噴砂裝置 3 1 噴頭 32 噴塗治具 32， 衝擊治具 3 5 升降機構 -14- 200914169 36、4 7 定 位 桿 37、48 感 測 器 裝 置 3 8 回 收 管 40 置 料 裝 置 4 1 頂 板 42 底 板 43 螺 栓 元 件 44 彈 性 元 件 45 投 遞 □ 46 軟 管 50 粉 末 成 型 機 5 1 轉 盤 5 2 壓 錠 模 組 5 3 餵 料 筒 54 出 料 丄山 60 分 料 裝 置 6 1 分 料 P 70 升 降 機 構 8 0 釋 放 裝 置 32 1 遮 罩 A 金 屬 粉 末 層 B 金 屬 粉 錠 C 粗 糙 面200914169 IX. Description of the invention: [Technical field of the invention] The present invention relates to a process of the previous stage of the uniform temperature plate, in particular to a process for completing the setting of the aggregate in one operation step of the fixture, and realizing the mass production of the semi-finished product of the uniform temperature plate Device. [Prior Art] The temperature equalizing plate transfers heat by evaporation and condensation of the working medium, and can transfer a large amount of heat energy in a large temperature difference and a short distance, and transmits heat energy in a small temperature difference and a long distance with respect to the heat pipe. The temperature equalization plate is to further change the heat conduction of the point into the heat conduction of the surface, and has higher heat transfer characteristics, and may be widely applied in the field of heat conduction in the future. A number of related known homogenization plate processes have been proposed, for example, as shown in Figures 6a and 6b, which are reproduced in Taiwan Patent No. 1 24704 8 and disclose a "uniform coating process for micro-powdered metal films". The main steps include: Step 1: mixing a predetermined amount of metal powder with a predetermined amount of liquid; Step 2: uniformly stirring the metal powder mixture; Step 3: charging the metal powder mixture to the working area of the workpiece; Step 4: slightly shaking the working area of the workpiece; Step 5: evaporating the liquid of the metal powder mixture; Step 6: depositing metal powder on the inner bottom surface of the workpiece to form a metal powder deposition film having a deposition thickness less than 〇·1 mm Step 7: The metal powder deposited film is sintered simultaneously with the workpiece working area. 200914169 In addition, for example, Taiwan Patent Publication No. 200609478 discloses a method for manufacturing an intermediate product of a micro-smooth plate, which mainly uses a stamping process and an etching process to separately form an intermediate product and a fine structure of a micro-hydrogen plate. The processing steps of the body, etc., thereby completing the intermediate products which can be laminated to each other to form a micro-smooth plate, so as to solve the problem that the microstructure of the intermediate product of the micro-monothermal plate is not easily formed by the stamping process, and the etching process is applied to the intermediate product. The problem of excessive processing costs. At present, the reason why the technology is not widely used is that the technology at the current stage is often due to the coating process of the capillary structure and the setting of the aggregate, which consumes a large amount of manpower and the positioning of the artificially positioned aggregate is inaccurate, so that the stability of the product And reliability adds uncertainty. In addition, at this stage, it is not easy to replace manpower with consistent automatic mass production equipment. Failure to effectively save manufacturing costs has become another bottleneck. SUMMARY OF THE INVENTION The main object of the present invention is to provide a spraying and arranging process for a superconducting uniform temperature plate, so as to improve the inaccuracy of the conventional man-made aggregate, the labor and the lack of mass production. In order to achieve the above and other objects, the spraying and charging process according to the present invention comprises at least the following steps: Step 1: providing thousands of workpieces having chambers to be fed at a predetermined rate via a feeding device; : at a fixed point of the workpiece feeding stroke, a metal spraying device is quantitatively and uniformly sprayed inside the workpiece by a spraying device to adhere a metal powder layer to the inner bottom surface of the workpiece; 200914169 Step 3: another feeding stroke of the workpiece At a certain point, a plurality of metal powder ingots produced from a powder molding machine are delivered at a time through a feeding jig, and an array of metal powder ingots is formed at a plurality of fixed points above the metal powder layer of the workpiece. According to the present invention, it is easy to mass-produce semi-finished products of superconducting and tempering plates by automatic spraying and placing processes, and to minimize the human-induced uncertain factors and important factors affecting the yield, and to save a lot of manpower. And reduce manufacturing costs. A secondary object of the present invention is to provide an apparatus for performing the process for mass production of a superconducting temperature equalization plate. It mainly comprises: a feeding device for feeding a plurality of workpieces having chambers at a predetermined rate through a spraying station and a receiving station. A spraying device is disposed in the spraying station for uniformly and uniformly spraying the metal powder inside the workpiece to adhere a metal powder layer to the bottom surface of the workpiece. a feeding fixture connected to a terminal of a powder molding machine and disposed in the receiving station, the fixture having a plurality of delivery ports for using the plurality of metal powder ingots made by the powder molding machine once Delivery, forming an array of metal powder ingots at a plurality of fixed points above the metal powder layer of the workpiece. According to the invention, the automatic mass production equipment is used to replace the manpower, and the one-step operation step of the fixture can be used to complete the quasi-determination of the aggregate, and the semi-finished product of the uniform temperature plate can be continuously produced, so that a capillary structure can be formed in the workpiece after the subsequent sintering. Minimize man-made uncertainties and important factors affecting yield in the process, while saving a lot of manpower and reducing manufacturing costs. 200914169 [Embodiment] First, in the general process of the uniform temperature plate, the steps include coating a metal powder layer, a metal powder ingot (in the industry), sintering, sealing welding, vacuum injection, and the like in the model. The technology of this case is aimed at the front-end process, that is, coating metal powder layer and planting metal powder ingot in the workpiece, providing automatic mass production process and equipment to replace; manpower, so as to form a capillary structure in the workpiece after subsequent sintering, Minimize human-induced uncertainties and important factors affecting yield. The technical features of the present invention will be further described in conjunction with the embodiments, which are merely preferred examples and are not intended to limit the scope of the present invention. understanding. The first embodiment of the superconducting uniform temperature plate spraying and charging process according to the present invention comprises at least the following steps: providing a plurality of workpieces having chambers, for example, a thermally conductive metal material such as a copper plate or a nickel plate. After processing, an internal space that allows the change of the gas phase I of the working medium is separately processed, and then fed at a predetermined rate via a feeding device. At a fixed point of the workpiece feeding stroke, a metal powder such as copper or nickel is dry-sprayed in a predetermined range within the workpiece by a spraying device to adhere a metal powder layer to the bottom surface of the workpiece. At another fixed point of the workpiece feed stroke, 'a plurality of metal powder ingots from a powder molding machine are delivered at a time through a feeding fixture' to form a metal at a plurality of fixed points above the metal powder layer of the workpiece Powder ingot array, etc. According to the present invention, the above process further includes a pre-step of pre-wetting the surface of the workpiece with a predetermined range of surface water or alcohol prior to dry spraying of the metal powder to provide adhesion to a predetermined range of surfaces inside the workpiece, and then Dry the metal powder. Alternatively, before the dry spraying of the metal powder, that is, after the workpiece is punched and formed, the surface of the predetermined range inside the workpiece is previously impacted by a high-speed blasting device or rubbed with a belt to form a rough surface, so that a predetermined range of surfaces inside the workpiece is better. The adhesion is then sprayed directly onto the rough surface of the metal powder. According to the present invention, the apparatus 1 for performing the above-described superconducting temperature equalizing plate spraying and placing process, as shown in Fig. 2, comprises at least: a feeding device 10, such as a conventional conveyor belt, etc. The workpiece 20 of the chamber is fed at a predetermined rate through a spray station and a loading station. Wherein the feeding device 10 forms a plurality of passive lifting zones u that can be actuated and raised on a plurality of predetermined areas, and a plurality of positioning stops 12 are respectively disposed to position the workpiece 20 on the passive lifting zone 11. (As shown in Figure 2a). A spraying device 30', such as a conventional multi-component powder coating device (optionally sprayed with a plurality of materials or a mixture of materials), is disposed in the spraying station. The spraying device 30' is fixed, for example, to a lifting mechanism 35, which can be controlled to be raised and lowered (as shown in FIG. 3), and the spraying device 3 has a nozzle 31, optionally dry sprayed (metal powder) or Wet spray (water or alcohol). Further, a spray coating 32 is coupled to the spray head 31. It has a mask 321' corresponding to the discharge angle of the spray head 31 for shielding from the spray range of the workpiece. The spraying station is provided with at least one positioning rod 36, etc., and is controlled by the circuit 200914169 to temporarily stop the feeding device 1 when the workpiece 2G enters the spraying position; and 'the spraying station has at least one sense of The detector device 3 7 can detect whether the workpiece 20 reaches the spraying level, and when the workpiece reaches the spraying level, control the lifting mechanism 35 to actuate the spraying device 3, so that the mask 3 2 i covers the surface of the workpiece 20 At the same time, a metal powder such as copper or nickel is sprayed on the inner surface of the workpiece 2 in a predetermined range (as shown in FIG. 3a), so that a metal powder layer a is adhered to the inner surface of the workpiece 20. Figure 3b shows that 'feeding of the feed device j 0 can be resumed after the workpiece 20 has been sprayed. According to the present invention, the above-mentioned spraying device 30 has different setting modes according to the processing mode of the workpiece 20, and the mass production of the workpiece 20 whose surface is not roughened is set before the metal powder is sprayed. , pre-spraying the surface of the workpiece 20 with a predetermined range of surface water or alcohol to increase the adhesion' and then dry-spraying the metal powder. In addition, for example, the batch mass production of the workpiece 20 whose surface has been roughened is set to dry-spray the metal powder directly on the rough surface. A feed fixture 40' is attached to a terminal of a powder molding machine 5 and is disposed in the storage station. The receiving fixture 40 is formed, for example, of a transparent acrylic material having a top plate 41 and a bottom plate 42 joined between the corners via a plurality of bolt members 43 and on the top plate 41. A space for allowing the feeding device 10 to pass is maintained between the bottom plate 43 and the top plate 41 stores the potential energy of the plurality of elastic members 44 that are passed through the bolt member 43 to have cushioning elasticity. As shown in FIG. 4, the powder molding machine 50, for example, a conventional rotary disk type powder molding machine basically includes a turntable 51, and a plurality of presser modules 52 are disposed along the circumference of the turntable 51, and a feeding cylinder 5 3 continuously supplying metal powder such as copper or -10 200914169 nickel to the tablet module 52, and continuously pressing the metal powder ingot B from the tablet module 52 while the turntable 51 is in operation, and discharging to the discharge end 54 A dispensing device 60' is coupled to the discharge end 54 of the powder molding machine 5, and has a plurality of dispensing ports 61 for dispensing the metal powder ingot b. According to the top plate 41 of the placing fixture 40 of the present invention, a plurality of corresponding delivery ports 45 are formed corresponding to a plurality of fixed points of the workpiece 2, and the majority of the dispensing device 60 is received via a plurality of hoses 46. The end of the distribution port 61. Further, a releasing device 80' is interposed between the dispensing opening 61 and the delivery port 45, and the metal powder ingot B is slipped. The above-mentioned receiving station is provided with at least one positioning 47 and the like, and the workpiece 2 is temporarily controlled to stop feeding the feeding device 10 when entering the loading position through the circuit control; and the receiving station is provided with at least one For example, the sensor device 48 or the like can detect whether the workpiece 20 reaches the loading level (shown in Fig. 4b). In addition, a lifting mechanism 7 is located below the placing fixture and the bottom plate of the receiving fixture 40 allows the lifting mechanism 70 to pass through, and is controlled by the sensor device 48 to reach the workpiece at the workpiece 20 The passive lifting zone 11 of the feeding device 10 rises close to the delivery opening 45 of the top plate 41 of the feeding fixture 40; the release device 80 is controlled to release once when the workpiece 20 is raised. A plurality of metal ingots B' are delivered to a fixed point through a plurality of delivery ports 45 of the top plate 41 of the placing fixture 40, so that a plurality of metal powder layers A above the workpiece 20 are fixed to form an array of metal powder ingots B. As shown in Fig. 4a, the elevator 70 can be lowered to resume the feeding of the feeding device 10 after the workpiece 20 is completed. Further, Fig. 5 is a spraying and placing process of the superconducting uniform temperature plate according to the present invention. The second embodiment comprises at least the following steps: when the mantle is equipped with a bar, for example 40 and the powder is arranged at a point -11-200914169, a plurality of workpieces having a chamber, such as a copper plate with a thermal conductive metal material or Nickel plates, etc. are processed first, and Punching an inner space allowable working cattle liquid medium mesh change; then, through a feed device of a conventional conveyor belt, for example, at a predetermined rate ·· · feed. At a fixed point of the workpiece feed stroke, a high-speed blasting device is impacted on a predetermined surface of the workpiece to form a rough surface covered with pores. At another fixed point of the workpiece feeding stroke, a plurality of metal powder ingots produced from a powder molding machine are delivered at a time through a feeding jig, and metal powder is formed on a plurality of fixed points above the rough surface of the workpiece. Ingot array. According to the present invention, the apparatus for performing the process of the second embodiment is basically the same as the apparatus shown in the above-mentioned second to fourth embodiments, and therefore the description thereof will not be repeated. The only difference is that, for example, as shown in Fig. 5a, the spraying device 30 is replaced by a high speed blasting device 30' in the spraying station. The high-speed blasting apparatus 30' is, for example, fixed to a lifting mechanism 35 to be lifted and lowered, and has a head 31 for jetting sand at a high speed to impact the surface of the workpiece 20. An impact fixture 32' is coupled to the spray head 31, and has a mask 321 corresponding to the spray angle of the spray head 31 for shielding the surface of the workpiece 20 from the impact range and the surface of the mask 321 A recovery tube 38 capable of generating a negative pressure is connected to recover sand and debris. The spraying station is provided with at least one positioning rod 36, etc., and is controlled by the circuit to temporarily stop the feeding device 1 when the workpiece 20 enters the impact level; and the spraying station is provided with at least one sensing, for example. The device device 3 7 can detect whether the workpiece 20 reaches the impact level, and when the workpiece 20 reaches the impact level, the lifting mechanism 3 5 is controlled to actuate the high-speed sand blasting device 30 ′, so that the mask 321 covers the workpiece 20 . On the surface 200914169, a sandblasting impact is simultaneously applied to the inner surface of the workpiece 20 to form a rough surface C having a capillary structure on the inner surface of the workpiece 20, and then the recovery pipe 38 is activated to recover sand particles and debris. The feeding of the feed device 1 can be resumed after the completion of the cleaning of the workpiece 20, so that an array of metal powder ingots is formed on a plurality of fixed points above the rough surface C of the workpiece 20 by the above-mentioned receiving station. In this way, by replacing the manpower with automated mass production processes and equipment, it is possible to continuously produce a semi-finished product of the uniform temperature plate so that a capillary structure can be formed in the workpiece after subsequent sintering, which can cause uncertainties in the process and affect the yield. The important factors are minimized' while saving a lot of manpower and reducing manufacturing costs. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, i.e., the equivalent changes and modifications made without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing the first embodiment of the spraying and placing process of the superconducting temperature equalizing plate of the present invention. Fig. 2 is a view showing the apparatus for carrying out the superconducting uniform temperature plate spraying and the placing process of the present invention. Fig. 2a shows a view from the direction of Fig. 2a-2a; showing a partial plan view of the workpiece disposed in the feed device. Fig. 3 is a cross-sectional view taken in the direction of Fig. 3-3; showing a side view of the spraying device. Figure 3a shows a schematic view of the spraying process of the spraying device of Figure 3. Figure 3b is a partial cross-sectional view of the finished workpiece; wherein a metal powder layer is attached to the underside of the workpiece. 200914169 Figure 4 shows a cross-sectional view from the direction of Figure 4-4 of Figure 2; showing an enlarged schematic view of the powder forming machine joining the placement fixture. Figure 4a shows a schematic view of the loading process of the feeding fixture of Figure 4. Figure 4b shows a cross-sectional view from the 4a to 4b-4b direction; showing a plan view of the placement fixture. Fig. 5 is a block diagram showing the flow of a second embodiment of the spraying and placing process of the superconducting uniform temperature plate of the present invention. Fig. 5a is a schematic view showing the operation of the high-speed blasting apparatus of the second embodiment of the present invention. Figures 6a and 6b are conventional techniques and are reproduced in Taiwan Patent No. 1247048; wherein Figure 6a shows a block diagram of the coating process and Figure 6b shows a cross-sectional view of the workpiece. [Main component symbol description] 1 The spraying and feeding process device 10 The feeding device 11 The passive lifting zone 1 2 The positioning block 20 The workpiece 30 The spraying device 30, the local velocity sand blasting device 3 1 The nozzle 32 The spraying fixture 32, Impact Fixture 3 5 Lifting mechanism-14- 200914169 36,4 7 Positioning rod 37, 48 Sensor device 3 8 Recovery tube 40 Loading device 4 1 Top plate 42 Base plate 43 Bolt element 44 Elastic element 45 Delivery □ 46 Hose 50 Powder Molding machine 5 1 Turntable 5 2 Pressing bar module 5 3 Feeding cylinder 54 Discharging Lushan 60 Dispensing device 6 1 Dispensing P 70 Lifting mechanism 8 0 Release device 32 1 Mask A Metal powder layer B Metal powder ingot C Rough surface