TW200914155A - Nozzle cleaning device and cleaning method - Google Patents
Nozzle cleaning device and cleaning method Download PDFInfo
- Publication number
- TW200914155A TW200914155A TW097130366A TW97130366A TW200914155A TW 200914155 A TW200914155 A TW 200914155A TW 097130366 A TW097130366 A TW 097130366A TW 97130366 A TW97130366 A TW 97130366A TW 200914155 A TW200914155 A TW 200914155A
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- nozzle
- block
- slit
- cleaning block
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
Description
200914155 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種喷嘴清洗裝置，更詳細而言係關於一 種為了防止狹縫噴嘴排出清洗液的喷口（lip)部位被堵塞或 • 污染’而對其進行清洗的噴嘴清洗裝置及方法。 【先前技術】 - 於半導體裝置或平板顯示器（FPD ; flat panel display)之 製造步驟中，為了使被處理基板（矽晶圓或玻璃基板）上之 〇 發揮特定功能的薄膜，例如氧化薄膜、金屬薄膜、半導體 薄膜等，以所期望的形狀進行圖案化（patterning)，進行將 與光源反應之感光液（sensitive material)塗敷於上述薄膜上 的步驟。 如上所述，為了在被處理基板之薄膜上形成特定電路圖 案而塗敷感光液塗層感光臈，並相應於電路圖案曝光上述 感光膜，藉由對曝光部位或未曝光部位進行顯影處理而將 其去除。將上述一系列過程稱作照相步驟或光微影 〇 (Photolithography)步驟。 於照相步驟中，必須以特定厚度均勻形成感光膜，否則 ; 製造步驟中會產生不良。例如，於感光膜厚度大於標準值 _ ’無法#刻涛臈中所期望之部分，於感光膜厚度小於標 準值時，㈣量遠遠大於薄膜所期望之蚀刻量。如此為 了在被處理基板上形成厚度均勻的感光膜，重要的是首先 在被處理基板上以均勻厚度塗敷感光液。 因此’就玻璃基板而言，主要使用非旋轉塗敷 133731.doc 200914155 coating)法或狹縫塗敷（slit coating)法，其係於平板（surface Plate)上支撐基板之狀態下，使形成有沿橫跨基板方向排 出感光液之狹縫（slit)之狹縫喷嘴，沿垂直於形成有上述狹 縫方向的方向’在基板上移動’同時藉由上述狹縫向基板 表面塗敷感光液者。 圖1係依據非旋轉塗敷法之先前狹縫式塗敷機（slit coater)之立體略圖。 如圖1所示，先前用以塗敷感光液之裝置，即狹縫式塗BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle cleaning device, and more particularly to a nozzle portion for preventing a slit nozzle from discharging a cleaning liquid from being clogged or contaminated. A nozzle cleaning device and method for cleaning the same. [Prior Art] - a film for performing a specific function on a substrate to be processed (a wafer or a glass substrate), such as an oxide film or a metal, in a manufacturing process of a semiconductor device or a flat panel display (FPD) A film, a semiconductor film, or the like is patterned in a desired shape, and a photosensitive material that reacts with a light source is applied to the film. As described above, in order to form a specific circuit pattern on a film of a substrate to be processed, a photosensitive liquid coating photosensitive layer is applied, and the photosensitive film is exposed corresponding to the circuit pattern, by developing the exposed portion or the unexposed portion. It is removed. The above series of processes are referred to as a photo step or a photolithography step. In the photographic step, the photosensitive film must be uniformly formed with a specific thickness, otherwise, defects may occur in the manufacturing steps. For example, in the portion where the thickness of the photosensitive film is larger than the standard value _ Å, the amount of (4) is much larger than the desired etching amount of the film when the thickness of the photosensitive film is less than the standard value. Thus, in order to form a photosensitive film having a uniform thickness on the substrate to be processed, it is important to first apply the photosensitive liquid to the substrate to be processed with a uniform thickness. Therefore, in the case of a glass substrate, a non-rotation coating 133731.doc 200914155 coating method or a slit coating method is used, which is formed in a state in which a substrate is supported on a surface plate. a slit nozzle that discharges a slit of the photosensitive liquid in a direction across the substrate, moves along the direction perpendicular to the direction in which the slit is formed, and simultaneously applies a photosensitive liquid to the surface of the substrate by the slit . Figure 1 is a perspective view of a prior slit coater in accordance with a non-rotating coating process. As shown in Figure 1, the device previously used to apply the photosensitive liquid, that is, the slit coating
敷機包含：平台（1)’裝載支撐需進行感光液處理之基板 (S广狹縫噴嘴（2)，裝载於上述平板〇)上之基板（s)上塗敷 感光液；待機部（11)，於平板⑴之一側，等待上述狹縫喷 嘴⑺狹、縫喷嘴（2)具備長度與基板⑻之寬度（w)相應的 狹縫狀噴出口 ’於基板⑻上塗敷感光液之情形時，自待 機部⑴)向基板⑻前進’藉由狹縫(21)，向基板⑻表面噴 出感光液，於感光液塗㈣作結束後，返回待機部（， 進入待機模式。 精由上述狹縫噴嘴⑺之感光液塗敷後，有機絕緣物質 =分感光液殘留於喷出口周圍，若該狀態下一定時間暴 露在外部空惫φ，目丨丨山n 患，古道A ^現所殘留之感光液產生硬化之現 纟下次塗敷不良之虞。為了防止此現象 上述狹縫噴嘴⑺之噴口⑽)部 子 洗操作根據塗敷操作與下…丁心“洗。通常，清 行。_ ~ 次錄胸^待㈣間而進 仃因此，於上述平板⑴之待機部 縫噴嘴⑺m洗 、“洗上述狹 133731.doc 200914155 圖2係圖1所示之感光液塗敷裝置所包含之喷嘴清洗裝置 的剖面圖。 如圖2所示，上述喷嘴清洗裝置（3)包含沿狹縫喷嘴（2)之 狭縫長度方向移動的主體塊（30)。上述主體塊（30)包含： 第1狹縫（32)，向狹縫喷嘴（2)之喷口部位噴射清洗液；以 及’第2狹縫（33)，自上述第1狹缝（32)之上側，向狹縫喷 嘴（2)之喷口部位喷射乾燥空氣（Cda ; Clean Dry Air)。The coating machine comprises: a platform (1) 'loading a photosensitive liquid on a substrate (s) supported on a substrate (S wide slit nozzle (2), loaded on the flat plate) on which a photosensitive liquid treatment is required; a standby portion (11) On the side of one of the flat plates (1), waiting for the slit nozzle (7) slit and the slit nozzle (2) to have a slit-shaped discharge port having a length corresponding to the width (w) of the substrate (8), when the photosensitive liquid is applied onto the substrate (8) From the standby unit (1)) to the substrate (8), the photosensitive liquid is ejected onto the surface of the substrate (8) by the slit (21), and after the completion of the photosensitive liquid coating (4), it returns to the standby portion (to enter the standby mode. After the photosensitive liquid of the nozzle (7) is applied, the organic insulating material = the photosensitive liquid remains in the periphery of the discharge port, and if it is exposed to the external space φ for a certain period of time in this state, the sensitization of the old road A ^ is now residual. The liquid is hardened and the next coating is poor. In order to prevent this phenomenon, the nozzle (10) of the slit nozzle (7) is washed according to the coating operation and the next...", usually, clear. _ ~ The second recording chest is to wait for (four) to enter, so the above tablet (1) The standby nozzle nozzle (7) is washed and "washed". 133731.doc 200914155 Fig. 2 is a cross-sectional view showing the nozzle cleaning device included in the photosensitive liquid application device shown in Fig. 1. As shown in Fig. 2, the nozzle cleaning device (3) includes a body block (30) that moves in the slit longitudinal direction of the slit nozzle (2). The main body block (30) includes: a first slit (32) for ejecting a cleaning liquid to a nozzle portion of the slit nozzle (2); and a second slit (33) from the first slit (32) On the upper side, dry air (Cda; Clean Dry Air) is sprayed to the nozzle portion of the slit nozzle (2).
於上述主體塊（30)上，具備一面與狹縫喷嘴（2)之噴口部 位接觸，一面移動而去除異物的橡膠塊（31 ; Rubber block)。於上述橡膠塊（31)之一面設有v形槽（31a)，藉由壓 縮彈簧（34)彈性支撐於主體塊（3〇)上，從而與狹縫喷嘴（2) 之喷口部位緊密接觸。如此，於橡膠塊（3丨）與狭縫喷嘴（2) 之喷口部位緊密接觸之狀態下，一面以1〇〇〜3〇〇 111111/3速 度，橫跨狹縫噴嘴（2)之噴口部位移動，一面清洗上述喷口 部位。 然而，就上述先前之喷嘴清洗裝置而言，於塗敷感光液 後，為了防止殘留於噴出口周圍之藥液產生硬化，只能於 狹縫式塗敷機運轉時，進行週期清洗，從而無法從根本上 、、邑操作、，.。束後處於待機模式之狹縫嘴嘴$露於外部空氣 中的問題。因&，待機時間延長之情形時，狹縫喷嘴之噴 出口暴路於外部空氣中之時間亦自然而然相應延長，所 存在噴出口周圍之藥液產生硬化，下次塗敷操作時， 無法良好塗敷的問題。 又’於大面積基板之情形時，狹縫噴嘴之長度必須正比 133731.doc 200914155 於基板，然而，若狹縫嘴嘴寬度整體加長，則導致用以清 洗喷口 .ΙΜ立之橡夥塊移動所需之時間延長，故存在清洗所 需之時間也整體延長的問題。 【發明内容】 發明所欲解決之問題 為了解決上述問題點，本發明之目的在於提供—種喷嘴 月洗裝置及β洗方法’其係不僅具有對基板上喷出藥液之 狹縫噴嘴的清洗功能， Ο Ο 且’於長期不使用狹縫噴嘴時， 防止狹縫喷嘴之喷出口暴露於外部空氣中，可料清洗整 個喷口部位’故縮短清洗所需之時間。 解決問題之技術手段 作為實現上述目的之—能採 丄於 也樣，本發明提供一種噴嘴清洗 裝置及方法，盆孫^7人， .„ 3 對清洗塊，其長度與狹縫噴嘴 之寬度相應，並以狹縫喑嘧 噴嘴為中心對向配置；以及，移動 構件’使上述對向配置之_ 直之對清洗塊沿相互接觸或分離之 方向前移或後移。 、述'月洗塊由對外力具有彈性之橡膠（Rubber)材質構 成，具有®形或正方形之多邊形剖面。 較好的疋，對向配置之—對清洗塊形成為相向之一側上 部傾斜，以便相互接觸時， 町於該接觸部之上部形成越向下 邛寬度越小之V形凹槽。 應用於本發明之上述移動播彼4人.处士 I移動構件包含.使清洗塊前移或後 移之致動器；以及，彈、击 彈連接h洗塊與致動器之彈性部 件0 13373l.doc 200914155 本發明之噴嘴清洗裝置 清洗槿杜 匕3用以清洗上述清洗塊之 与洗構件，上述清洗構件較好之 ;先液之清洗液―…向清;塊:== 射喷嘴。藉由運轉部件，-一二: 々门移動，—面清洗清洗塊。 又 嘴二Π實:上述目的之另—態樣’本發明提供-種噴The main body block (30) is provided with a rubber block (31) which is moved in contact with the nozzle portion of the slit nozzle (2) to remove foreign matter. A v-shaped groove (31a) is provided on one surface of the rubber block (31), and is elastically supported on the main body block (3) by a compression spring (34) so as to be in close contact with the nozzle portion of the slit nozzle (2). In this way, in the state in which the rubber block (3丨) is in close contact with the nozzle portion of the slit nozzle (2), the nozzle portion of the slit nozzle (2) is traversed at a speed of 1 〇〇 3 〇〇 111111/3. Move and clean the above nozzle part. However, in the above-described nozzle cleaning device, after the application of the photosensitive liquid, in order to prevent the chemical solution remaining around the discharge port from being hardened, it is only possible to perform periodic cleaning when the slit coater is operated, thereby failing to perform the periodic cleaning. Fundamentally, 邑 operation, ,. The problem that the slit nozzles in the standby mode are exposed to the outside air after the bundle. Due to the &, when the standby time is extended, the time when the discharge port of the slit nozzle is violently in the outside air is naturally extended accordingly, and the liquid medicine around the discharge port is hardened, and the next coating operation is not good. The problem of coating. In the case of a large-area substrate, the length of the slit nozzle must be proportional to the surface of the 133731.doc 200914155. However, if the width of the slit nozzle is lengthened as a whole, it is required to clean the nozzle. Since the time is prolonged, there is a problem that the time required for cleaning is also extended as a whole. SUMMARY OF THE INVENTION Problems to be Solved by the Invention In order to solve the above problems, an object of the present invention is to provide a nozzle monthly washing device and a β washing method which not only have a cleaning of a slit nozzle for discharging a chemical liquid on a substrate Function, Ο 且 and 'When the slot nozzle is not used for a long time, the nozzle of the slit nozzle is prevented from being exposed to the outside air, and the entire nozzle portion can be cleaned', so the time required for cleaning is shortened. Technical Solution for Solving the Problem As a matter of achieving the above object, the present invention provides a nozzle cleaning device and method, the basin-children, and the „3 pairs of cleaning blocks whose length corresponds to the width of the slit nozzle And the opposite direction is arranged with the slit sulfonium nozzle as the center; and the moving member 'move the above-mentioned opposite arrangement to move the cleaning block forward or backward in the direction of mutual contact or separation. It is made of rubber material with elastic force and has a polygonal section of a shape of a square or a square. A better 疋, which is arranged in the opposite direction - when the cleaning block is formed to be inclined toward one side of the opposite side so as to be in contact with each other, The upper portion of the contact portion is formed with a V-shaped groove whose width is smaller as the width of the downward sill is applied. The above-mentioned mobile broadcaster is applied to the present invention. The moving member includes a actuator for advancing or relocating the cleaning block; And the elastic member of the elastic block and the actuator and the actuator. 0 13373l.doc 200914155 The nozzle cleaning device of the present invention cleans the cuckoo 3 to clean the cleaning member of the cleaning block, and the cleaning structure It is better; the first liquid cleaning liquid - ... clear; block: = = spray nozzle. By running the parts, - one two: the door moves, the surface cleans the cleaning block. - the aspect of the present invention - a spray
=;至待機部，自該位置下降而置於-對清洗塊之間 對向之-對清洗塊，以藉由移動 噴嘴為中心，相互黏著；置於相互㈣移動之上述狹縫 上述狹縫喷嘴一面上升Γ 對清洗塊間之 清洗殘留於狹縫噴嘴之噴出：用清洗塊之彈性加壓， 於狹縫噴嘴上升後二=圍:異物及藥液;以及， 互分離。 —者之對清洗塊被移動構件相 上述喷嘴清洗方法， 相互分離之清洗塊之間 驟。對於清洗塊之清洗 洗構件沿清洗塊之長度 嘴射清洗液之過程及向 本發明之效果 較好的是進而包含：清洗構件進入 ，清洗對向配置之清洗塊一側之步 ，較好的是藉由運轉部件使上述清 方向移動，此時連續進行向清洗塊 清洗塊喷射乾燥空氣之過程。 根據上述構成，本發明^僅發揮對於向基板噴出藥液之 狹縫喷嘴的清洗功能，同時’於長期不使用狹縫噴嘴時， 亦可發揮防止狹縫噴嘴之喑 噴出口暴露於外部空氣中之密封 構件的作用。目此’即便長期不使用狹縫噴嘴，亦不會發 133731.d〇, 200914155 生喷出口被堵塞等缺陷，社 了狹縫噴嘴之性 、、、°果不僅提高 能，而且具有延長使用壽命之效果。 另一方面，藉由長度與狹縫 為中心對向配置的一對清洗塊 因此具有縮短清洗所需之操作 的效果。 【實施方式】 噴嘴寬度相應並以狹縫噴嘴 ，同步清洗整個噴口部位， 時間，並縮短整個步驟時間 以下’參照隨附圖式，詳细今=; to the standby portion, descending from the position and placed in the opposite direction between the cleaning blocks - the cleaning block to be adhered to each other by moving the nozzle; the slits are placed in the slits which are moved to each other (four) The nozzle is raised on one side Γ The cleaning between the cleaning blocks remains in the slit nozzle: the elastic pressure is applied by the cleaning block, and after the slit nozzle is raised, the second nozzle: foreign matter and liquid medicine; and, separated from each other. - The cleaning block is moved by the moving member. The nozzle cleaning method is used to separate the cleaning blocks from each other. Preferably, the cleaning cleaning member of the cleaning block sprays the cleaning liquid along the length of the cleaning block and the effect of the present invention further includes: the cleaning member enters and cleans the opposite side of the cleaning block disposed on the opposite side, preferably The moving direction is moved by the running member, and at this time, the process of spraying the dry air to the cleaning block cleaning block is continuously performed. According to the above configuration, the present invention provides only a cleaning function for the slit nozzle for ejecting the chemical liquid to the substrate, and at the same time, when the slit nozzle is not used for a long period of time, the sprue discharge port of the slit nozzle can be prevented from being exposed to the outside air. The role of the sealing member. Therefore, even if the slit nozzle is not used for a long time, it will not produce 133731.d〇, 200914155. The nozzle of the raw nozzle is blocked, and the properties of the slit nozzle are not only improved, but also have an extended service life. The effect. On the other hand, a pair of cleaning blocks disposed opposite to each other with the length and the slit thus have an effect of shortening the operation required for cleaning. [Embodiment] The nozzle width is corresponding to the slit nozzle, and the entire nozzle portion is synchronously cleaned, time, and the entire step time is shortened.
說明本發明之較佳實施例。 圖3及圖4係概略說明依據本 斗I /3貫轭例之噴嘴清洗 之結構的側視圖及立體圖。 、置 二圖二圖4所示’上述喷嘴清洗裝置包含：一對清洗塊 (5〇)、、長度與狹縫喷嘴（2〇)之寬度相應，並且，對向配 置；以及’移動構件其使_對清洗塊⑽前移或後 退。藉由上述移動構件（60)之運轉，上述一對清洗塊⑽ 以狹縫喷嘴（2G)為中心被相互緊密地彈性黏著，進行對於 狹縫噴嘴（20)之接觸式清洗。 八體而5，上述清洗塊（5〇)為一對，其以狹縫喷嘴（2〇) 為中心對向配置。上述—對清洗塊（5())單獨利用對外力具 有彈性且密封性優異之橡膠（Rubber)材質，例如Perfl〇ui^ 發泡性橡膠EPDM ’或利用將其混合而成之合成原材料。 為了確保與狹縫噴嘴（2〇)之良好接觸特性，上述一對清洗 塊（50)具有圓形或正方形之多邊形剖面。 較好的是上述一對清洗塊（50)於相向之一側上部具有傾 斜面（5〇a)。因此，於一對清洗塊（5〇)以狹縫噴嘴（2〇)為中 I33731.doc -10- 200914155 心相互對向而接觸時，該接觸面上部形成有越向下部寬度 越小之V形凹槽。一對清洗塊（50)相互接觸時，上述凹槽 防止彈性加壓力過度施加於狹縫喷嘴（20)之喷口部位，引 導狹縫喷嘴（20)易於置於清洗塊（50)之間。A preferred embodiment of the invention is illustrated. Fig. 3 and Fig. 4 are a side view and a perspective view schematically showing the structure of the nozzle cleaning according to the embodiment of the bucket I / 3 yoke. The second nozzle cleaning device includes: a pair of cleaning blocks (5 〇), a length corresponding to the width of the slit nozzle (2 〇), and an opposite arrangement; and a 'moving member thereof Let _ move the cleaning block (10) forward or backward. By the operation of the moving member (60), the pair of cleaning blocks (10) are elastically adhered to each other tightly around the slit nozzle (2G), and contact cleaning with respect to the slit nozzle (20) is performed. In the eighth body, the cleaning block (5 turns) is a pair, and is disposed opposite to the slit nozzle (2〇). In the above-mentioned cleaning block (5()), a rubber material which is elastic and has excellent sealing properties, such as Perfl〇ui^ foaming rubber EPDM', or a synthetic raw material obtained by mixing them, is used alone. In order to ensure good contact characteristics with the slit nozzles (2 turns), the pair of cleaning blocks (50) have a circular or square polygonal cross section. Preferably, the pair of cleaning blocks (50) have a sloped surface (5〇a) on one of the opposite side faces. Therefore, when a pair of cleaning blocks (5〇) are in contact with each other with the slit nozzle (2〇) as the middle I33731.doc -10- 200914155, the contact surface is formed with a V which is smaller in width toward the lower portion. Shaped groove. When the pair of cleaning blocks (50) are in contact with each other, the grooves prevent the elastic pressing force from being excessively applied to the nozzle portion of the slit nozzle (20), and the guiding slit nozzle (20) is easily placed between the cleaning blocks (50).
移動構件（60) ’使對向配置之上述一對清洗塊（5〇)沿相 互接觸或分離之方向前移或後移。上述移動構件（6〇)包 含：使清洗塊（50)前移或後移之致動器（62);以及，彈性 連接清洗塊（50)與致動器（62)之彈性部件（64)，例如壓縮彈 簧。於適用壓縮彈簧之情形時，較好的是藉由應用具有適 宜彈性係數之壓縮彈簧，將清洗塊對狹縫喷嘴之加廢力調 整為最佳。 ，狹縫噴嘴㈣…部位二二 M 〇〇為中心，相互緊密彈性 狀態下，狹縫嘴嘴(2°)上升，則進行對狹縫喷 嘴（）之接觸式清洗，於長期待機時，藉由使清 維持對狹縫㈣⑽）之㈣㈣，防 口部位200暴露於外部空氣中。 ㈣萬(20)之喷 洗二:面”本發明之噴嘴清洗裝置進而包含清洗上述清 現的由狹縫噴嘴㈣之上升而實 ⑽之-面的異物及藥巧洗構件（7〇)清洗附著於清洗塊 洗綱喷射清洗液：二，構件⑽包含:向清 塊（5〇)嗔射乾燥空氣之乾操嘴（72)，以及，向清洗 喷射嘴嘴(未㈣）。清洗液 噴嘴&狹縫喷嘴之進入方向 133731.doc 200914155 依次形成’並且在運轉部件（74)之作 ㈤之長度方向移動，-面清洗清洗塊⑼）。^先塊 二：洗清洗塊⑽之上述清洗液，必須於接觸式清洗 u王H戈去除殘留於對向配 液及異物，因此，較好的是使用：塊面上的藥 (solvent) 〇 吏用稀釋劑（thin—等溶劑 ^本㈣之動作’說明藉由上述結構之本發明之清洗 裝置而進行的狹縫喷嘴之清洗過程。The moving member (60)' advances or moves the pair of cleaning blocks (5''' of the opposite arrangement forward or backward in the direction of mutual contact or separation. The moving member (6〇) includes: an actuator (62) that advances or moves the cleaning block (50); and an elastic member (64) that elastically connects the cleaning block (50) and the actuator (62) , for example, a compression spring. In the case of a compression spring, it is preferred to adjust the scraping force of the cleaning block to the slit nozzle by applying a compression spring having a suitable modulus of elasticity. The slit nozzle (4) is the center of the second and second M 〇〇. When the slit nozzle (2°) rises in a tightly elastic state, the contact cleaning of the slit nozzle () is performed, and during long-term standby, The mouth preventing portion 200 is exposed to the outside air by keeping the cleaning (4) (4) of the slit (4) (10). (4) 10,000 (20) of the spray two: surface" The nozzle cleaning device of the present invention further comprises cleaning the above-mentioned cleaned foreign matter and the medicated washing member (7 〇) of the surface of the slit nozzle (4) Attached to the cleaning block wash jet cleaning solution: Second, the component (10) includes: a dry nozzle (72) that sprays dry air to the clear block (5〇), and a spray nozzle (not (four)) to the cleaning nozzle. & slit nozzle entry direction 133731.doc 200914155 sequentially formed 'and moves in the length direction of the moving part (74) (5), - surface cleaning cleaning block (9)) ^ first block 2: wash cleaning block (10) of the above cleaning Liquid, must be removed in the contact cleaning u Wang H Ge residual in the opposite dosing and foreign matter, therefore, it is better to use: the solution on the block (solvent) use thinner (thin - such solvent ^ (4) The operation 'described the cleaning process of the slit nozzle by the cleaning device of the present invention structured as described above.
主圖5表示藉由本發明之㈣清洗裝置而進行的狹縫噴嘴 清洗過程。 土板上塗敷樂液 '例如感光液之狹縫 噴嘴（20)，為了連續逸 堤躓進仃之下一次塗敷中形成良好塗敷 塗敷過程中必須對狹縫噴嘴噴出口進行不間斷清洗。 月洗通*依據塗敷後準備下__次塗敷的待機時間而進行。 為進行上料洗，狹縫噴嘴（2G)在上料機時㈣移向本 1 I之清洗裝置側’對狹縫喷嘴（2G)進行正式清洗操作。 ’月洗操作’自移送至待機部之狹縫喷嘴（2q)由該位置向 下移動並置於對向配置之—對清洗塊（5Q)之間時，方能開 始（參照圖5(a))。 若狹縫噴嘴（20)置於對向配置之—對清洗塊⑼)之間， 則=移動構件（6〇)之作用下，上述—對清洗塊⑽以狹縫 噴觜，具體而言以狹縫噴嘴（2〇)之喷口部位（2〇〇)為中心沿 黏著之方向移動’從而相互接觸。清洗塊（5G)本身具有彈 性，同時藉由彈性部件（64)彈性支撐於致動器（62)。因 133731.doc 200914155 此，上述清洗塊（50)藉由該彈性與狹縫噴嘴（2〇)之喷口部 位（200)緊密接觸（參照圖5(b))。 上述狀態下，置於相互黏著之一對清洗塊（5〇)間之狹縫 喷嘴（20)上升。該過程中，藉由清洗塊（50)之彈性加壓， 對殘留於狹縫噴嘴（20)之喷口部前端噴出口周圍的異物及 藥液進行清洗（參照5(c))。 於狹縫喷嘴（20)上升後，相互黏著之一對清洗塊（5〇)在 移動構件（6G)之作用下相互分離，清洗構件（7())進入相互 刀離之π洗塊（5〇)之間，一面沿清洗塊（5〇)移動，一面對 ^留於對向g己置之清洗塊（5G)之—面上的藥液及異物進行 清洗，從而完成對狹縫喷嘴（20)之清洗（參照圖5(d))。Main diagram 5 shows a slit nozzle cleaning process by the (4) cleaning apparatus of the present invention. Applying the liquid solution on the soil plate, such as the slit nozzle (20) of the photosensitive liquid, in order to form a continuous coating, the coating nozzle must be continuously cleaned during the coating process. . The monthly wash-through* is performed in accordance with the standby time of the __ application after preparation. In order to carry out the washing, the slit nozzle (2G) is moved to the cleaning device side of the first in the loading machine (4) to perform a formal cleaning operation on the slit nozzle (2G). The 'moon washing operation' can be started by moving the slit nozzle (2q) sent to the standby section downward from the position and placed between the oppositely disposed cleaning blocks (5Q) (refer to Fig. 5(a) ). If the slit nozzle (20) is placed between the oppositely disposed pair of cleaning blocks (9), then the moving member (6〇) is squirted by the slit to the cleaning block (10), specifically The nozzle portion (2〇〇) of the slit nozzle (2〇) moves in the direction of adhesion in the center to contact each other. The cleaning block (5G) itself is elastic while being elastically supported by the actuator (62) by the elastic member (64). According to 133731.doc 200914155, the cleaning block (50) is in close contact with the nozzle portion (200) of the slit nozzle (2) by the elasticity (see Fig. 5(b)). In the above state, the slit nozzles (20) which are placed between the cleaning blocks (5 〇) which are adhered to each other are raised. In this process, the foreign matter and the chemical solution remaining around the tip end of the nozzle portion of the slit nozzle (20) are cleaned by the elastic pressurization of the cleaning block (50) (refer to 5 (c)). After the slit nozzle (20) rises, one of the mutually adhered cleaning blocks (5〇) is separated from each other by the moving member (6G), and the cleaning member (7()) enters the mutual π-washing block (5 〇), while moving along the cleaning block (5〇), the liquid and the foreign matter on the surface of the cleaning block (5G) that is placed on the opposite side are cleaned, thereby completing the slit nozzle. (20) Cleaning (refer to Figure 5 (d)).
另—方面，於不對狹縫喷嘴（20)進行週期性清洗，而是 長期待機時，維持圖5(b)所示狀態，，維持清洗塊（5〇) 與狹縫噴嘴（20)之黏著狀態。於該情形時，狹縫喷嘴⑽ 之噴口部位（2GG)周圍被上述-對清洗塊⑼)密封。因此， 防止狹縫噴嘴（20)之噴口部位（2〇〇)暴露於外部空氣中，社 ^ =形成於噴口部位_)前端之噴出口因長時間暴㈣ 外。Ρ二氣中而被堵塞之現象。 :據上述本發明之實施例’藉由以狹縫噴嘴㈣為中心 置之-對清洗塊⑽，進行對狹縫噴嘴㈣之接觸 自身彈性於長期待機時’上述—對清洗塊（5〇)利用 (2〇)之，出二密接觸之狀態’從而根本上杜絕狹縫噴嘴 轉時，=1:外部空氣中。即，於狹縫式塗敷機運 為確保良好地塗敷藥液’進行週期性清洗，而且視 133731.doc 13 200914155 需要具有長期待機功能’以便防止狹縫噴嘴⑽之喷出口 因長時間暴露於外部空氣中而造成噴出口被堵塞。 上述說明内容僅為本發明之—個實施例，本發明並未限 定於此。#申請專利範圍所述’只要具備本發明所屬領域 常識’均可在不脫離本發明要旨之範圍内進行各種變更， 但上述變更仍屬於本發明技術内容。 【圖式簡單說明】 圖1係根據非旋轉塗敷法之先前狹縫式塗敷機的立體略 圖。 圖2係圖1之狹縫式塗敷機所包含之先前喷嘴清洗裝置的 剖面圖。 圖3係概略表示本發明之噴嘴清洗裝置之結構的側視 圖。 圖4係概略表不本發明之喷嘴清洗裝置之結構的立體 圖。 圖5係表示藉由本發明之噴嘴清洗裝置進行之狹縫噴嘴 清洗過程的圖。 【主要元件符號說明】 1 平台 2 狹縫喷嘴 3 噴嘴清洗裝置 11 待機部 20 狹縫噴嘴 21 狹縫 133731.doc 200914155 30 主體塊 31 橡膠塊 31a v形槽 32 第1狹縫 33 第2狹縫 34 壓縮彈簧 50 清洗塊 50a 傾斜面 〇 60 移動構件 62 致動器 64 彈性部件 70 清洗構件 72 清洗液喷射喷嘴 74 運轉部件 200 噴口部位 S 基板 O w 寬度 133731.doc -15-On the other hand, when the slit nozzle (20) is not periodically cleaned, the state shown in Fig. 5(b) is maintained while standing for a long period of time, and the adhesion between the cleaning block (5〇) and the slit nozzle (20) is maintained. status. In this case, the periphery of the nozzle portion (2GG) of the slit nozzle (10) is sealed by the above-mentioned pair of cleaning blocks (9). Therefore, the nozzle portion (2〇〇) of the slit nozzle (20) is prevented from being exposed to the outside air, and the discharge port formed at the front end of the nozzle portion _) is exposed to a long period of time (four). The phenomenon of being blocked in the second gas. According to the embodiment of the present invention described above, by the slit nozzle (four), the cleaning block (10) is placed on the cleaning nozzle (10), and the contact with the slit nozzle (4) is elastic for long-term standby. By using (2〇), the state of the two-dense contact is made to completely eliminate the slit nozzle rotation, = 1: in the outside air. That is, in the slit coater, it is ensured that the chemical solution is applied satisfactorily for periodic cleaning, and 133731.doc 13 200914155 is required to have a long-term standby function 'to prevent the slit of the slit nozzle (10) from being exposed for a long time. The outlet is blocked in the outside air. The above description is only an embodiment of the present invention, and the present invention is not limited thereto. Various changes may be made without departing from the spirit and scope of the invention, and the above modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a prior slit coater according to a non-rotation coating method. Figure 2 is a cross-sectional view of a prior nozzle cleaning apparatus included in the slit coater of Figure 1. Fig. 3 is a side view schematically showing the structure of a nozzle cleaning device of the present invention. Fig. 4 is a perspective view schematically showing the structure of the nozzle cleaning device of the present invention. Fig. 5 is a view showing a slit nozzle cleaning process by the nozzle cleaning device of the present invention. [Description of main component symbols] 1 Platform 2 Slot nozzle 3 Nozzle cleaning device 11 Standby unit 20 Slit nozzle 21 Slit 133731.doc 200914155 30 Body block 31 Rubber block 31a V-shaped groove 32 First slit 33 Second slit 34 Compression spring 50 Cleaning block 50a Inclined surface 〇 60 Moving member 62 Actuator 64 Elastic member 70 Cleaning member 72 Cleaning liquid spray nozzle 74 Operating member 200 Spout portion S Substrate O w Width 133731.doc -15-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070080381A KR100893670B1 (en) | 2007-08-10 | 2007-08-10 | Nozzle cleaning device and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200914155A true TW200914155A (en) | 2009-04-01 |
| TWI368542B TWI368542B (en) | 2012-07-21 |
Family
ID=40388833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097130366A TWI368542B (en) | 2007-08-10 | 2008-08-08 | Nozzle cleaning device and cleaning method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100893670B1 (en) |
| CN (1) | CN101362123B (en) |
| TW (1) | TWI368542B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202087472U (en) * | 2011-05-10 | 2011-12-28 | 深圳市华星光电技术有限公司 | Cleaning device for spray nozzle of slit coating machine |
| JP2013094685A (en) * | 2011-10-28 | 2013-05-20 | Tokyo Electron Ltd | Nozzle maintenance apparatus and coating treatment apparatus using the same |
| KR101578368B1 (en) * | 2014-12-04 | 2015-12-18 | 주식회사 디엠에스 | Apparatus for cleaning nozzle lip and Slit coater using the same |
| KR102324882B1 (en) * | 2014-12-08 | 2021-11-12 | 주식회사 디엠에스 | Unit for cleaning nozzle lip cleaner |
| US10086543B2 (en) * | 2016-08-09 | 2018-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Auto catch apparatus and method of use in making chemical mechanical polishing pads |
| CN106076744B (en) * | 2016-08-26 | 2018-11-23 | 武汉华星光电技术有限公司 | Light blockage coating equipment and coating apparatus nozzle |
| CN106733440B (en) * | 2016-12-02 | 2019-06-07 | 信利（惠州）智能显示有限公司 | A kind of gluing head cleaning device |
| CN106733463A (en) * | 2016-12-29 | 2017-05-31 | 成都国珈星际固态锂电科技有限公司 | Coating die head Wiping mechanism and coating machine and the method for wiping coating die head |
| JP6860414B2 (en) * | 2017-05-11 | 2021-04-14 | 株式会社Ｓｃｒｅｅｎホールディングス | Nozzle cleaning device, coating device and nozzle cleaning method |
| CN107413747A (en) * | 2017-09-22 | 2017-12-01 | 武汉华星光电技术有限公司 | A kind of cleaning device and clean method |
| CN107716170B (en) * | 2017-11-29 | 2019-12-17 | 南通贝思特机械工程有限公司 | self-drying spraying device |
| CN110237971A (en) * | 2019-05-31 | 2019-09-17 | 溧阳嘉拓智能设备有限公司 | The on-line Full cleaning device of lithium battery slot die coating die head and method |
| CN113492080B (en) * | 2020-04-01 | 2022-11-18 | 阳程科技股份有限公司 | Coating machine capable of slowing down solvent backflow into coating head and soaking method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4451175B2 (en) * | 2004-03-19 | 2010-04-14 | 大日本スクリーン製造株式会社 | Nozzle cleaning apparatus and substrate processing apparatus |
| JP4489480B2 (en) * | 2004-03-25 | 2010-06-23 | 東京応化工業株式会社 | Slit nozzle cleaning device |
| JP4792787B2 (en) * | 2005-03-31 | 2011-10-12 | 凸版印刷株式会社 | Coating device with cleaning device |
-
2007
- 2007-08-10 KR KR1020070080381A patent/KR100893670B1/en active IP Right Grant
-
2008
- 2008-08-06 CN CN2008101313489A patent/CN101362123B/en active Active
- 2008-08-08 TW TW097130366A patent/TWI368542B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI368542B (en) | 2012-07-21 |
| CN101362123B (en) | 2011-10-12 |
| CN101362123A (en) | 2009-02-11 |
| KR100893670B1 (en) | 2009-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200914155A (en) | Nozzle cleaning device and cleaning method | |
| JP3245769B2 (en) | Liquid treatment method and apparatus | |
| KR100365078B1 (en) | Coating method and apparatus | |
| JP4563349B2 (en) | Printing apparatus for liquid crystal display element and pattern forming method using the same | |
| TWI300594B (en) | ||
| TWI327488B (en) | ||
| JPH09223664A (en) | Cleaning device for semiconductor wafer | |
| TWI531411B (en) | Coating apparatus and maintenance method of the nozzle | |
| KR20120049808A (en) | Substrate processing method, computer storage medium, and substrate processing apparatus | |
| JP3946999B2 (en) | Fluid discharge nozzle, substrate processing apparatus and substrate processing method using the fluid discharge nozzle | |
| TW201503227A (en) | Substrate liquid processing apparatus, and substrate liquid processing method | |
| KR102035329B1 (en) | Template manufacturing apparatus and template manufacturing method for imprint | |
| KR100688142B1 (en) | Device for washing nozzle and method | |
| TW201945867A (en) | Developing method | |
| JP4108940B2 (en) | Substrate processing method and substrate processing apparatus | |
| JP5039457B2 (en) | Substrate cleaning device | |
| JP2001009387A (en) | Substrate washing apparatus | |
| KR20070122332A (en) | Slit coater | |
| JPH0430521A (en) | Rotary type apparatus for surface treatment for substrate | |
| TW473780B (en) | Post-plasma processing wafer cleaning method and system | |
| KR101060932B1 (en) | Heat treatment equipment | |
| KR102683846B1 (en) | Restoration apparatus and method of elastic thin membrane for chemical mechanical polishing | |
| JP2002273285A (en) | Wiping apparatus for liquid agent applying apparatus | |
| TWI291373B (en) | Nozzle cleaning device | |
| KR20230075151A (en) | Restoration apparatus and method of elastic thin membrane for chemical mechanical polishing |