TW200912041A - Regenerative method of processing fluid and reclaiming method of metals contained therein - Google Patents

Regenerative method of processing fluid and reclaiming method of metals contained therein Download PDF

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Publication number
TW200912041A
TW200912041A TW097114102A TW97114102A TW200912041A TW 200912041 A TW200912041 A TW 200912041A TW 097114102 A TW097114102 A TW 097114102A TW 97114102 A TW97114102 A TW 97114102A TW 200912041 A TW200912041 A TW 200912041A
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liquid
supply
eluent
treatment
container
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TW097114102A
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Chinese (zh)
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Katsutoshi Nakata
Yukio Tanaka
Toshihiko Kashiwai
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Sumitomo Precision Prod Co
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Publication of TW200912041A publication Critical patent/TW200912041A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Water Treatment By Sorption (AREA)
  • Weting (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • ing And Chemical Polishing (AREA)
  • Treatment Of Liquids With Adsorbents In General (AREA)

Abstract

The invention provides treating fluid reproducing method which is able to effectively remove the metal component contained in treating fluid for treating substrate by low cost. The method comprises: a treating fluid reproducing procedure: in the treating area for treating the substrate, the treating liquid passing through the movable container (1) filled with absorbing material inside for absorbing metallic ion; absorbing the metal component in the treating liquid in the absorbing material to separate and remove; a first transferring procedure of transferring the movable container (1) for the treating liquid to pass through to the area separated from the treating area that is absorbing material reproducing area of the reproducing absorbing material; an absorbing material reproducing procedure of in the absorbing material reproducing area, the eluant passing through the movable container (1) transferred from the treating area, eluting the metal absorbed in the absorbing material and reproducing the absorbing material; a second transferring procedure of returning the movable container (1) reproduced with absorbing material from the absorbing material reproducing area to the treating area; in the treating liquid reproducing procedure, using the movable container (1) after reproducing the absorbing material.

Description

200912041 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種處理液的再生方法,其係使用内部 填充有吸附金屬離子的吸附材料的可移式容器,將因基板 處理而含有金屬成分的處理液再生、及關於一種將因基板 處理而含於處理液中之金屬成分回收之方法。 【先前技術】200912041 IX. The invention relates to a method for regenerating a treatment liquid, which comprises using a movable container filled with an adsorption material for adsorbing metal ions, and containing a metal component due to substrate treatment. The treatment liquid is regenerated, and a method for recovering the metal component contained in the treatment liquid by the substrate treatment. [Prior Art]

例如,在製造半導體、(石夕)晶片、液晶玻璃基板、光 罩用玻璃基板、光碟用基板等各種基板的步驟中,有將蝕 刻液或顯影液、清洗液等各種處理液供給至該等基板以處 理邊基板之步驟。 作爲使用蝕刻液處理(蝕刻處理)之一例,可以舉出透 u下該之银刻裝置實施該餘刻處理者,~ :具備貯存餘 刻液的貯存槽、_基板的基板處理機構、將貯存槽内的 蝕刻液供給至基板處理機構,並將所供給之I虫刻液從該基 板=理機構回收’使㈣液在貯存槽和基板處理機構之間 循環之餘刻液循環播爐彳灸Q丄由 幾構U ‘忍日本專利特開2000-96264號 公報)。 該基板處理機槿&把.a 丄, 構括.具備封閉空間之處理腔室、配 設於處理腔室内且J}卑其去Gw ’土板水千搬運之多個搬運輥、和配設 於處理腔室内且朝侖其士G L φ 朝向基板上表面噴出蝕刻液之多個噴嘴 體’該触刻液循瑶德雄4 k . ± 味_ %機構包#•連接貯存槽Μ喷嘴體之供For example, in the steps of manufacturing various substrates such as a semiconductor, a liquid crystal glass substrate, a photomask glass substrate, and a disk substrate, various processing liquids such as an etching liquid, a developing solution, and a cleaning liquid are supplied thereto. The substrate is a step of processing the edge substrate. As an example of the etching treatment (etching treatment), the silver engraving apparatus that performs the etching process can be used, and the storage processing tank that stores the residual liquid, the substrate processing mechanism of the substrate, and the storage will be used. The etching liquid in the tank is supplied to the substrate processing mechanism, and the supplied I insect liquid is recovered from the substrate=the rational mechanism. The liquid is circulated between the storage tank and the substrate processing mechanism. Q丄 is a U.S. Patent No. 2000-96264. The substrate processing machine .&<a> includes a processing chamber having a closed space, a plurality of conveying rollers disposed in the processing chamber, and a plurality of carrying rollers a plurality of nozzle bodies disposed in the processing chamber and ejecting an etchant toward the upper surface of the substrate by the GL φ φ. The etchant is followed by Yao Dexiong 4 k. ± 味_%机构包#•Connecting the storage tank nozzle body For

給管、經由供給管供Α叙办丨γ A 供m蝕刻液至各噴嘴體之供給泵、和連 接處理腔室的底部和貯存槽之回收管。 200912041 根據該餘刻裝置可知,藉由搬運輥在既定方向上搬運 基板’並且,將藉由供給泵經供給管供給至各噴嘴體之貯 存槽内的蝕刻液係從該等各噴嘴體噴出至基板的上表面, 利用該蝕刻液蝕刻基板。然後,通過回收管,將噴出在基 板上表面之蝕刻液從處理腔室内回收至貯存槽内。 ,'、、:而例如,若對形成於基板上表面之氧化銦錫膜等 至屬膜進行蝕刻,則構成該金屬膜之所謂銦或錫等金屬溶 举;餘刻液中,因此,在構成為使钮刻液循環於貯存槽和 ^反處理機構間之上述㈣裝置中,貯存槽内之㈣液所 含之金屬成分逐漸增加,導致不能有效地實施姓刻處理的 問題、或發生得不到精度良好的蝕刻形狀的問題。 攸而’在上述姓刻裝置中,不得不定期更換貯存槽内 的蝕刻液,由於蝕刻液的更換所花的費用(所更換之蝕刻液 的廢棄處理費用或所要更換之姓刻液的麟入費用)而導致處 理成本增加。The supply pipe, the supply pump through which the γ γ is supplied with m etching liquid to each nozzle body, and the recovery pipe connecting the bottom of the processing chamber and the storage tank are provided. According to the remnant device, it is known that the substrate is transported in a predetermined direction by the transport roller, and the etching liquid supplied to the storage tank of each nozzle body by the supply pump through the supply pipe is ejected from the respective nozzle bodies to The upper surface of the substrate is etched with the etching solution. Then, the etching liquid sprayed on the surface of the substrate is recovered from the processing chamber into the storage tank through the recovery tube. For example, when an indium tin oxide film or the like formed on the upper surface of the substrate is etched, a metal such as indium or tin constituting the metal film is etched; in the residual liquid, therefore, In the above (4) device which circulates the button engraving liquid between the storage tank and the counter-processing mechanism, the metal component contained in the (IV) liquid in the storage tank gradually increases, resulting in the problem that the surname treatment cannot be effectively performed, or occurs. There is no problem with an etched shape with good precision. In the above-mentioned surname engraving device, the etching liquid in the storage tank has to be periodically replaced, and the cost of replacing the etching liquid (the disposal cost of the replaced etching liquid or the replacement of the surname engraving) Cost) resulting in increased processing costs.

曰因此,如曰本專利特開20〇5_325〇82號公報中的記載, 系提出了使用離子父換樹脂從貯存槽内的㈣液分離金屬 成分,將其除去後,再利用該㈣液的方法。 專利文獻1 :日本專利特開2000-96264號公報 專利文獻2:日本專利特開2〇〇5_325〇82號公報 沾入^ ’上述方法中’僅利用離子交換樹脂將触刻液中 離除去時,導致未回收所分離之金屬成分的 S、該金屬膜係使用例如銦等非常高價的金屬, %取好溶解於蝕刻液的金屬加以回收。 200912041 另外’進行從蝕刻潘八& 蚀到液分離、除去金屬成分的處理需要 相應的設備,因此,美 士二 ^ 基板製造人員不能容易地實施。另一 方面,在廢液處理 貝寻實施的情況下,也不得不透過油 w使〜1的银刻液從基板製造人員側搬運至廢液處理 貝二1並透過油罐車將處理後的廢液(能夠再利用的钱刻 液)彳之廢液處理人員側搬運5 1… _ 、彳搬運至基板製造人員側,導致搬運成 本尚的問題或不夠有效的問題。 主,1外在廢液處理人員回收溶解於蝕刻液中的金屬的 丨月況% & 了上述問題外,由於蝕刻液所含之金屬的濃度 低,因此,回收該姓刻液中的金屬成分並不容易,導致非 常花費勞力的問題。 【發明内容】Therefore, as described in the Japanese Patent Publication No. 20-325-82, it is proposed to separate the metal component from the (iv) liquid in the storage tank using the ion-parent resin, remove the metal component, and then use the (four) liquid. method. Patent Document 1: Japanese Patent Publication No. 2000-96264 Patent Document 2: Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. No. Hei. No. 2 _ _ 〇 〇 公报 沾 ' ' ' ' ' ' ' ' ' ' ' ' ' ' S is caused by not recovering the separated metal component, and the metal film is made of a very expensive metal such as indium, and % of the metal dissolved in the etching liquid is recovered. 200912041 In addition, the process of etching from Pan 8 & etching to liquid separation and removal of metal components requires corresponding equipment, and therefore, the manufacturer of the substrate can not be easily implemented. On the other hand, in the case where the waste liquid treatment is carried out, it is necessary to transport the silver engraving liquid of 〜1 from the substrate manufacturer side to the waste liquid processing shell 2 through the oil w and pass it through the tank truck. The waste liquid (the money engraving that can be reused) is handled by the waste liquid handling personnel side 5 1... _ and 彳 are transported to the side of the substrate manufacturer, which causes problems in transportation costs or is not effective enough. Mainly, 1 external waste liquid processing personnel recovers the metal dissolved in the etching liquid. % & In addition to the above problems, since the concentration of the metal contained in the etching liquid is low, the metal in the surname is recovered. The ingredients are not easy, resulting in a very labor intensive problem. [Summary of the Invention]

本發明係鑒於以上的實際情況而做成的,纟目的在於 提供一種處理液再生方法,其能夠以低成本有效除去含於 基板處理用處理液的金屬成分,並將該處理液再生,對環 境保護有貢獻、及提供一種處理液所含金屬的回收方法, 能夠以低成本有效回收含於基板處理用處理液的金屬成 分。 爲了實現上述目的,本發明係關於一種處理液再生方 法或一種含於處理液中的金屬的回收方法, 其使用内部填充有吸附金屬離子的吸附材料的可移式 容器;且 在進行基板處理的處理區域和從與處理區域分隔之區 域(即將吸附了處理液中金屬成分的吸附材料加以再生之吸 200912041 附材料再生區域或回收吸附於吸附材料之金屬的回收區域 之間,搬運該可移式容器而進行。 還有,該處理液再生方法包括下列步驟: 處理液再生步驟,係在該處理區域中叫吏因基板處理 而含有金屬成分的處理液通過該可移式容器内,將該處理 液中的金屬成分吸附於該吸附材料以分離、除去; ^第一搬運步驟,係將經通過該處理液的可移式容器(使 用後的可移式容器即在吸附材料吸附有金屬的可移式容器) 從該處理區域搬運至該吸附材料再生區域; 吸附材料再生步驟’係在該吸附材料再生區域中,使 洗提液通過從該處理區域所搬運出的可移式容器θ,對吸 附於D亥吸附材料之金屬進行洗堤,將該吸附材料再生; 第二搬運步,驟,係將再± 了該吸附材料的可移式容器 (再生後的可移式容器即吸附材料未吸附金屬的可移式容器) 從該吸附材料再生區域返送至該處理區域; σ —在該處理液再生步驟中,使用吸附材料再生後的可移 弋今™還有,亦可根據需要,從通過可移式容器内的洗 提液將洗提的金屬加以回收。 從而,根據本發明的處理液再生方法可知,在處理區 域中將處理液中的金屬成分吸附於可移式容器内的吸附材 料以除去之,將使用後的可移式容器搬運至吸附材料再生 區域以將再生吸附材料再生,將再生後的可移式容器返送 至處理區域以再使用,因此,在處理區域側僅設置使處理 液通過可移式容器内,且將該處理液中的金屬成分吸附於 200912041 吸附材料的設備即可, 液(形成爲能夠再利用之狀態)。*且廉價的設備再生處理 另外,搬運對象不是相液本身,而是 因此,重量輕且容易接 移式谷裔, 非常低,能夠以通常的卡車搬運罐車相比爲 生後的可移式容器返详由於進一步將再 口这送至處理區域 使用可移式容器(吸附# ,故能夠反復 (及附材科)。由於該等原因, 本有效地再生因基板處理而含有金屬成分的處理液。 另外,藉由這樣再生声扭y 盘 化’能夠延長其更換周期二::節液的壽命延長 m ^ 卽嚙新處理液的購入費 用或已使用之處理液的廢棄 暦棄費用荨,抑制處理液所花費的 費用,或不需爲了更換虚 κ換處理液而停纟,可連續地進行基板 處理’能夠將基板處理所花費 叮化賈的成本抑制爲低的成本。另 外,能夠減少欲廢杳廬w m、士 人曆索處置之處理或纟新處理液能夠只 需要基板處理所減少之量,因此,還能夠對環境保護具有 貢獻作用。 另一方面,在該處理液所含金屬的回收方法中,在該 處理區域中]吏因基板處理而含有金屬成分的處理液通過 該可移式容ne ’將該處理液甲的金屬成分吸附於該吸附 材料,接著,將該可移式容器(吸附後的可移式容器即在吸 附材料吸附有金屬的可移式容器)搬運至該回收區域,然 後,在該回收區域中,使洗提液通過該可移式容器(從處理 區域所搬運的可移式容器),對吸附於該吸附材料進行洗提 的處理、和從通過的洗提液回收洗提的金屬的處理,然後, 200912041 將該可移式容器(回收後的可移式容器即吸附材料未吸附金 屬的可移式容器)返送至該處理區域而再使用。 從而,根據本發明的處理液中含有的金屬的回收方法 可知’在處理區域中將處理液中的金屬成分吸附於可移式 容器内的吸附材料上’將吸附後的可移式容器搬運至回收 區域’回收吸附於吸附材料之金屬,冑回收後的可移式容The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a method for regenerating a treatment liquid which can efficiently remove a metal component contained in a treatment liquid for substrate processing at a low cost and regenerate the treatment liquid to the environment. A method of recovering the metal contained in the treatment liquid and contributing to the recovery of the metal component contained in the treatment liquid for substrate processing at a low cost. In order to achieve the above object, the present invention relates to a treatment liquid regeneration method or a method for recovering a metal contained in a treatment liquid, which uses a movable container which is internally filled with an adsorption material for adsorbing metal ions; and is subjected to substrate treatment. The treatment area is transported between the treatment area and the recovery area of the 200912041 attached material regeneration area or the recovery area of the metal adsorbed to the adsorption material by reclaiming the adsorption material of the metal component in the treatment liquid. Further, the treatment liquid regeneration method includes the following steps: a treatment liquid regeneration step in which the treatment liquid containing a metal component is treated in the treatment area, and the treatment liquid containing the metal component is passed through the movable container. The metal component in the liquid is adsorbed to the adsorbent material to be separated and removed; ^ The first transport step is a movable container that passes through the treatment liquid (the removable container after use is a metal adsorbed on the adsorbent material) Transfer container) transported from the treatment area to the adsorbent regeneration zone; adsorbent material regeneration step ' In the adsorbent regeneration zone, the eluent is subjected to washing the metal adsorbed to the DH adsorbent material through the movable container θ transported from the treatment zone, and the adsorbent is regenerated; a removable container of the adsorbent material (a removable movable container, that is, a removable container in which the adsorbent material does not adsorb metal) is returned from the adsorbent material regeneration region to the treatment region; σ — In the treatment liquid regeneration step, the removable metal after regeneration using the adsorbent material may be used, and the eluted metal may be recovered from the eluent in the transferable container as needed. In the treatment liquid regeneration method of the present invention, it is understood that the metal component in the treatment liquid is adsorbed to the adsorption material in the movable container in the treatment region, and the movable container after use is transported to the adsorption material regeneration region to be regenerated. Regenerating the adsorbent material, returning the regenerated transportable container to the treatment area for reuse, therefore, only the treatment liquid is placed in the movable container on the treatment area side, and The metal component in the treatment liquid can be adsorbed to the equipment of the adsorbent material of 200912041, and the liquid can be formed into a state that can be reused. * The equipment is regenerated in an inexpensive manner, and the object to be transported is not the phase liquid itself, but is therefore light in weight. It is easy to transfer, and it is very low. It can be transported in a normal truck. It can be transported to the processing area using a removable container. Repeatedly (and attached materials). For these reasons, the treatment liquid containing a metal component due to the substrate treatment is effectively regenerated. Further, by repeating the acoustic torsion y disk, the replacement cycle can be extended: The life extension is m ^ The cost of purchasing the new treatment liquid or the disposal waste of the used treatment liquid 荨, the cost of suppressing the treatment liquid, or the need to stop the replacement of the virtual κ change treatment liquid, continuous The substrate processing is performed to reduce the cost of the substrate processing to a low cost. In addition, it is possible to reduce the amount of processing to be disposed of, or to treat the new processing liquid, which can reduce the amount of substrate processing, and therefore contribute to environmental protection. On the other hand, in the method for recovering the metal contained in the treatment liquid, in the treatment region, the treatment liquid containing the metal component due to the substrate treatment adsorbs the metal component of the treatment liquid through the removable volume In the adsorbent material, the movable container (the movable container after adsorption, that is, the movable container in which the adsorbent is adsorbed with metal) is transported to the recovery area, and then, in the recovery area, the washing is performed. The liquid is passed through the movable container (the movable container carried from the processing area), the treatment of eluting the adsorbed material, and the treatment of recovering the eluted metal from the passed eluate, and then, 200912041 The portable container (removed removable container, that is, a removable container in which the adsorbent material does not adsorb metal) is returned to the processing area for reuse. Therefore, according to the method for recovering metal contained in the treatment liquid of the present invention, it is known that 'the metal component in the treatment liquid is adsorbed on the adsorption material in the movable container in the treatment zone', and the adsorbed movable container is transported to The recovery area 'recovers the metal adsorbed on the adsorbent material, and the removable capacity after the recovery

器返送至處理區域*再使用,m夠有效地回收因基 板處理而溶解於處理液的金屬。 另外,僅在處理區.域側使處理液通過可移式容器内, 將該處理液中的金屬成分吸附於吸附材料上即可,因此, 能夠以簡單且廉價的設備應對。另外,使處理液中的金屬 成分吸附於可移式容器内的吸附材料,藉此能夠將該金屬 士分以i縮的狀態集聚在可移式容㈣,能夠容易地回收 轉於處理液的金屬。另外,搬運對象不是處理液本身, 而是可移式容器’因此’重量輕且容易操#,而且搬運成 本與油罐車相比爲非常低,能夠以通常的卡車搬運。另外, 進-步將时後的可移式容器返送至處理區域以再使用, 因此,能多句反復使用可移式容器(吸附材料)。自於 :全:夠以低成本有效地再生因基板處理而溶解^理液 <金屬。 還有,在前述處理液再生方法、或處_ 的回收方法中,在該吸附材料再生步驟或回收區域中:: 忒洗提液通過後,使清洗液通過該可 时 、奋器内,清法贫 可移式容器的内部亦可。 ^ 10 200912041 若可移式容器的内部殘留有洗提液,則在處理區域中 通液有處理液時,處理液和洗提液混合,可能對使用該處 理液的基板處理産生不良影響,但藉由使洗提液通過後, 再使清洗液通過,能夠防止殘留於可移式容器内的洗提液 流出而發生如上所述之不良情況。 另外,在該處理液再生方法或處理液所含金屬的回收 方法中,在該吸附材料再生步驟或回收區域清洗液不通過 可移式容器内的情時,亦可以: 在该可移式容器形成:用於將該處理液及洗提液供給 至内部之供給部、和用於將從該供給部供給至内部的處理 液及洗提液排出至外部之排出部;且 在該處理液再生步驟或處理區域中,使用第i通液裝 置α亥第1通液裝置具備··以能夠裝卸的方式連接於該可 移式容器供給部並供給該處理液的處理液供給管、和以能 夠裝卸的方式連接於該可移式容器排出部並回收該處理液 之處理液回收管; 並且,使S亥處理液供給管與該供給部連接,使誃严理 液回收管與該排出部連接後,使該處理液以從該供;;部流 入至該可移式容器的内部而從該排出部排出的方式通液, 然後’從該供給部知下該處理液供給管,從該排出下 該處理液回收管; 在該吸附材料再生步驟或回收區域中,使用第2通液 = 二液装置具備:以能夠袭卸的方式連接於該 〇 >谷裔八、、、°部並供給該洗提液的洗提液供給管、和以 200912041 能夠裝卸的方式連接於該可移 液的洗提液回收管; " 部並回收該洗提 並且,使該洗提液供給管與 液回收管與該排出部連接後,使連接,使該洗提 1埂接後,使垓洗提液以從該 入至該可移式容器的内部而從該排出部排出的方^液了 然後,從该供給部卸下該洗提液供給管 該洗提液回收管,然後,可 出』卸下 ^ ^ An 供、、、° °卩卸下該洗提液供 f 、.口 &,伙該排出部卸下該洗提液回收管。 藉此,能夠有效率地利用第丨通液裝置實施使含有金 屬成分的處理液通過可移式宏恶向 ' 移式谷器内的處理’利用第2通液 衣置貫施使洗提液通過可移式容 處理,該可移式容 器吸附材料吸附有金屬。 另一方面’在該處理液* 狀丹生方法或處理液所含金屬的 回收方法中,在該吸附材料再生步驟或回收區域清洗液不 通過可移式容器内的情況時,亦可以: 在該可移式容器形成:用於將該處理液、洗提液及清 洗液供給至㈣之供給部、和用於將從該供給部供給至内 部的處理液、洗提液及清洗液排出至外部之排出部;且 在該處理液再生步驟或處理區域中,❹帛2通液裝 置’該第2通液裝置具備:以能夠裝卸的方式連接於該; 移式容器供給部並供給該洗提液及清洗液的供給管、和以 能夠裝卸的方式連接於該可移式容器排出部並回收該洗提 液及清洗液之回收管; 並且,使該供給管與該供給部連接,使該回收管與該 12 200912041 =繼,使該洗提液以從該供給部流 肩部而從該排出部排出 移式- 液以從該供給部流入至該可移…夜接者,使該清洗 排出方式通液,缺後,從,供卜的内部而從該排出部 出部卸下該回收管、; 給部卸下該供給管,從該排 或者’使用第2通液裝置’該第2通液 嶋卸的方式連接於該可移式容器 並二二 r 液之洗提液供給管、和以鲊釣壯* 彳八、'口邊洗k 容器排出部並回收該洗提液^洗提m接於該可移式 供給管、和以能夠裝卸的方式連接二;洗液之清洗液 並回收該清洗液之清洗液回收管〆該可移式容器排出部 首先’使該洗提液供給管與該供給部連 液回收管與該排出部連接後 使省冼如 入至,可移λ使為棱液以從該供給部流 移式…内部而從該排出部排出的方式通液, 然後,從該供給部卸下該洗提液供給管, 該洗提液回收管,接著,#1生 以纟出。Ρ卸下 接者使該清洗液供給管 :二::::回收管與該排㈣連接,使該清 該供給部卸下該清洗液供給管 後從 回收管。藉此,能夠有效率地利用第下該清洗液 液通液後之可移式容器内部二。通液裝置實施洗提 還有,作爲該處理液,例如,可以舉出_液、㈣ 13 200912041 液及清洗液等,但不限定於該等。另外,作爲吸附於可移 式容器内的吸附材料的金屬,例如,可以舉出銦等,不限 疋於此。另外,作爲該吸附材料,例如,可以舉出螯合材 料或離子交換樹脂等’但不限定於該等。另外,作爲吸附 材料,使用螯合材料時,該洗提液可以採用鹽酸或硫酸或 氫氧化鈉等,該清洗液可以採用純水等,作爲吸附材料使 用離子交換樹脂時,該洗提液可以採用鹽酸或氫氧化鈉 等,該清洗液可以採用純水等。 如上所述,根據本發明的處理液再生方法可知,使用 内部填充有吸附材料的可移式容器,將該可移式容器在回 收區域和吸附材料再生區域之間搬運,因此,能夠以低成 本有效地除去基板處理用處理液中含有的金屬成分,再生 該處理液,能夠對環境保護具有貢獻作用。另外,根據本 發明的處理液中所含金屬的回收方法可知,使用内部填充 有吸附材料的可移式容器,將該可移式容器在回收區域和 吸附材料再生區域之間搬運,因此,能夠以低成本有效地 回收含於基板處理用處理液中的金屬成分。 【實施方式】 (第一實施方式) 首先,基於附圖,對本發明的第一實施方式的蝕刻液 再生方法進行說明。在該第一實施方式中,說明將因蝕刻 基板而含有金屬成分的蝕刻液再生之方式。另外,圖1係 用以說明本發明第一實施方式之蝕刻液再生方法,圖2係 用以說明第-實施方式的蝕刻液再生方法的流程圖,圖3 14 200912041 係表示第一實施方式中的基板處理裝置等之概略結構,圖 4係表示第一實施方式中的吸附材料再生裝置等之概略結 構。 首先,基於圖1、圖3及圖4,對用於吸附蝕刻液[ 中的金屬成分的可移式容器1進行說明。該可移式容器^ 在内部填充有吸附金屬離子(如後所述,銦離子或錫離子) 的、作爲吸附材料的螯合材料(未圖示),具有移動性。另 外,可移式容器1構成爲能夠相對於基板處理裝置丨〇(利 用蝕刻液L處理基板K)、及用以將螯合材料(未圖示)再生 之吸附材料再生裝置40進行裝卸。進而,在可移式容器丄 的上端部形成有:用於將蝕刻液L或後述的洗提液或清洗 液向内部供給的供給部(未圖示)、和將從該供給部(未圖示) 供給至内部的蝕刻液L或洗提液、清洗液向外部排出的排 出部(未圖示)。 >該螯合材料(未圖示)通常爲有機系的氨基羧酸鹽的總 稱,具備吸附金屬離子,利用特定的溶液洗提被吸附的金 屬的性質。具體來說,作爲—例,可以舉丨edta(乙二胺 四醋酸)、NTA(次氮基三醋酸)、DTPA(二亞乙基三胺五醋 酸)、glda(l—谷氨酸二醋酸)、HEDTA(羥基乙基亞乙基 二胺三醋酸)、GEDTA(二醇醚二胺四醋酸)、TTHA(三亞乙 基四胺六醋酸)、HIDA(羥基乙基亞氨基二醋酸)、及 DHEG(經基乙基甘氨酸)等,但不限定於該等。 然後,基於圖3,對該基板處理裝置1〇進行說明。該 基板處理裝置10如該圖3所示,包括例如:貯存草酸濃 15 200912041 度(重量%)爲約3%的蝕刻液L之 ㈣基板κ之基板處理機構12、使㈣液L .σ « # ϊ¥ ,. , 〇 使蝕刻液L在貯存槽i ;[ =基板處理機構12之間循環之_液循環機構20、使貯 存於貯存槽11的蝕刻液L通過 '1 ^ Μ on 移式合15 1内之蝕刻液 通^構30、控制基板處理機構12與㈣液循環機構加 及蝕刻液通液機構30運行之控制 ^ ^ S 1 Λ 衣置25等’且該基板處 理褎置10係配置於處理區域(參照圖丨)。 該基板處理機構12包括:具備封閉空間之處理腔室 I3、配設於處理腔室13的下邱,抝t ^ 丁 方向(箭討向)·運上表切並在既定 |面1成有氧化錮錫膜(金屬膜)的 基板K之多個搬運輥14、配設於處理腔室13的上部,且 使由蝕刻液循環機構20供給的蝕刻液l流通的 15、 固定設置於流通管15,且朝向由搬運輥14所搬運的基板 K上表面噴出蝕刻液L的多個喷嘴體16等,·且處理俨室u 内的㈣夜L從形成於該處理腔室13底 向外部排出。 β % ua 該蝕刻液循環機構2〇包括:一端側與貯存槽u連接, 且另-端側與流通f 15連接之供給管21、經由供給管Η 向;^通管15内供給银刻液L之供給栗22、-端側與處理 腔室13的排出口 13a連接,且另一端側與貯存槽 之回收管23等。 * °亥银刻液通液機構30包括:將可移式容器1以能夠穿 卸的方式安裝之第-安裝部31及第二安裝部32、_端側 與貯存槽U連接,且另一端側能夠分支而與各可移式容 16 200912041 T〗的供給部(未圖示)連接之敍刻液供給t 33、—端 貝丁存槽u連接,且另—端側能夠分支而與各可移式容器、1 ==未圖示)連接之钱刻液回收f 34、經由钱刻液供 、B向可移式谷器!的内部供給蝕刻液£之供給泵Μ、 /刀別設置於敍刻液供給管33的另一端側之第一供給 換閥36及第二供給側切換閥37、 瞢 刀別0又置於敍刻液回收 間叶=之第一排出側切換閥38及第二排出側切換 ―二=Γ容器1安裝於各安裝部31,, 圖示二: 與各可移式容器1的供給部(未 Ώ丁)連接’钮刻液回收管34的另 1的排出部(未圖示)連接。 谷了移式谷益 =切換間36、37、38、39由控制裝置25控制如下, .在弟一供給側切換閥36及第一排出側切換閥 1第關供給側切換閥37及第二排出側切換閥39: 仏給側切換閥37及第二排出側切換閥39打門睹 關閉第-供給側切換閥36及第-排出側切換閥38。 在該蝕刻液通液機構3〇中,利用供终 液供給管33向可移式容器工的任—林由姓刻 银刻液L。即,在第一供給側切換間36打。門丁子槽11内的 側切換閥37關閉時,向第一安裝部二且第二供給 供給,峨L,在第一供給側切換:移式容器! 側切換…開時,向第二安裝部32::且第二供給 供給餘刻液L。 2側的可移式容器丨 然後,供給至可移式容器1的任-方,且在該可移式 17 200912041 二益1内流通之蝕刻液L係經蝕刻液回 存槽以。這樣,㈣液L在貯存34回收於貯 之任一方之間循環。 和可移式容器1 該控制装置25進行下列處理: 刻液L在貯在拇,】4^上 仏〜栗22 ’使蝕 *貯存槽11和基板處理機構!2之 在運行供給㈣的情況下,控制供給n的處理、 37、38、39,以箱^ 及各切換閥36、 内的ρ㈣Γ1的時間間隔即推斷可移式容器1 ㈣口材枓(未圖示)達到大致 換供給有姓刻液[的可移式容器i,同=間隔,交替切 内的㈣“通入可移式容…:—時:::貯存槽11 1 )。 方之處理(參照圖 :::樣構成的基板處理裝置i。可知, ,存於貯存槽u的姓刻液£經由供給管21The device is returned to the processing area* for reuse, and m is effective for recovering the metal dissolved in the treatment liquid by the substrate treatment. Further, the treatment liquid can be passed through the movable container only on the processing area side, and the metal component in the treatment liquid can be adsorbed on the adsorption material. Therefore, it can be handled by a simple and inexpensive apparatus. Further, by adsorbing the metal component in the treatment liquid to the adsorbent in the movable container, the metal element can be collected in the movable state (4), and the transfer to the treatment liquid can be easily recovered. metal. Further, the object to be transported is not the processing liquid itself, but the portable container is therefore light in weight and easy to operate, and the transportation cost is extremely low compared to the tank truck, and can be carried by a normal truck. Further, the movable container after the time is returned to the processing area for reuse, so that the movable container (adsorbing material) can be repeatedly used in multiple sentences. Since: All: It is possible to efficiently regenerate the liquid to be treated by the substrate treatment at a low cost. Further, in the method for regenerating the treatment liquid or the method for recovering the treatment liquid, in the adsorption material regeneration step or the recovery region: after the leaching solution is passed, the cleaning liquid is passed through the aging device The interior of the depleted portable container is also available. ^ 10 200912041 If the eluent remains in the interior of the removable container, the treatment liquid and the eluent may be mixed when the treatment liquid is passed through the treatment area, which may adversely affect the substrate treatment using the treatment liquid, but By passing the eluent and then passing the cleaning liquid, it is possible to prevent the eluent remaining in the portable container from flowing out to cause the above-described problem. Further, in the treatment liquid regeneration method or the method for recovering metal contained in the treatment liquid, when the adsorption material regeneration step or the recovery region cleaning liquid does not pass through the movable container, the movable container may be: Forming a supply unit for supplying the treatment liquid and the eluent to the inside, and a discharge unit for discharging the treatment liquid and the eluent supplied from the supply unit to the outside; and regenerating the treatment liquid In the step or the processing area, the first liquid-passing device of the first liquid-passing device is provided with a processing liquid supply pipe that is detachably connected to the movable container supply unit and supplies the processing liquid, and a processing liquid recovery pipe that is connected to the movable container discharge unit and collects the treatment liquid; and connects the S-processing liquid supply pipe to the supply unit, and connects the sturdy liquid recovery pipe to the discharge unit Thereafter, the treatment liquid is passed through the supply unit; the inside of the portable container is discharged from the discharge unit, and then the treatment liquid supply tube is known from the supply unit. Next a treatment liquid recovery pipe; in the adsorption material regeneration step or the recovery region, the second liquid supply=two-liquid device is provided to be detachably connected to the 〇> The eluent supply pipe of the eluent is connected to the liquid-repellent eluent recovery pipe in a detachable manner in 200912041; and the eluent is recovered and the eluent supply pipe and the liquid are recovered. After the tube is connected to the discharge portion, the connection is made, and after the elution is performed, the eluent extract is discharged from the discharge portion from the inside of the transfer container, and then, The eluent supply pipe is removed from the supply unit, and then the eluent recovery pipe is removed, and the eluent is removed for f, port & The dispenser discharge unit removes the eluent recovery tube. Thereby, it is possible to efficiently perform the eluent by using the second liquid-coating method by performing the treatment of the metal-containing treatment liquid into the 'transfer type trough by the third-pass liquid-repellent treatment using the third-pass liquid-passing device. The removable container adsorbent material is adsorbed with metal by a removable volumetric treatment. On the other hand, in the method of recovering the metal contained in the treatment liquid* method or the treatment liquid, in the case where the adsorption material regeneration step or the recovery region cleaning liquid does not pass through the movable container, the The movable container is formed by supplying the treatment liquid, the eluent and the cleaning liquid to the supply unit of (4), and discharging the treatment liquid, the eluent and the cleaning liquid supplied from the supply unit to the outside a discharge unit, wherein the second liquid passage device includes: detachably connected to the transfer container supply unit and supplies the elution a supply pipe for the liquid and the cleaning liquid, and a recovery pipe that is detachably connected to the removable container discharge unit and collects the eluent and the cleaning liquid; and the supply pipe is connected to the supply unit to The recovery pipe and the 12 200912041 = next, the eluent is discharged from the supply portion from the supply portion, and the liquid is discharged from the supply portion to flow from the supply portion to the movable ... night cleaning Discharge method through the liquid, lack of The collection pipe is detached from the discharge portion of the discharge portion, and the supply pipe is detached from the discharge portion, and the second liquid transfer device is connected from the row or the "second liquid supply device" In the movable container, the eluent supply tube of the second and second liquids, and the sputum-washing k-container discharge portion and the recovery of the eluent and the eluent m are attached to the movable portion. a supply pipe, and a cleaning liquid recovery pipe that is detachably connected to the cleaning liquid of the washing liquid and recovers the cleaning liquid, and the discharge container discharge portion first "connects the eluent supply pipe to the supply portion" After the liquid recovery pipe is connected to the discharge portion, the liquid is removed, and the liquid is transferred to the liquid from the supply portion to be discharged from the supply portion, and then discharged from the supply portion. The eluent supply pipe was removed, and the eluent recovery pipe was then taken out. ΡRemove the cleaning liquid supply pipe: The second::::reporting pipe is connected to the row (4), and the cleaning supply unit removes the cleaning liquid supply pipe and then recovers the pipe. Thereby, it is possible to efficiently utilize the inside of the movable container after the first cleaning liquid is passed through. In addition, as the treatment liquid, for example, _ liquid, (d) 13 200912041 liquid, washing liquid, etc. are mentioned, but it is not limited to these. Further, examples of the metal adsorbing the adsorbent in the movable container include indium or the like, and are not limited thereto. Further, the adsorbent material may, for example, be a chelate material or an ion exchange resin, but is not limited thereto. Further, when a chelating material is used as the adsorbent, the eluent may be hydrochloric acid, sulfuric acid or sodium hydroxide, and the cleaning solution may be pure water or the like. When an ion exchange resin is used as the adsorbent, the eluent may be used. The hydrochloric acid or sodium hydroxide or the like may be used, and the cleaning liquid may be pure water or the like. As described above, according to the processing liquid regeneration method of the present invention, it is known that the movable container is transported between the recovery region and the adsorbent material regeneration region by using a movable container filled with an adsorbent material, thereby enabling low cost. The metal component contained in the processing liquid for substrate processing can be effectively removed, and the treatment liquid can be regenerated to contribute to environmental protection. Further, according to the method for recovering metal contained in the treatment liquid of the present invention, it is understood that the movable container is transported between the recovery region and the adsorbent recovery region by using a movable container in which the adsorbent is filled. The metal component contained in the processing liquid for substrate processing is efficiently recovered at low cost. [Embodiment] (First Embodiment) First, an etching liquid regeneration method according to a first embodiment of the present invention will be described based on the drawings. In the first embodiment, a mode in which an etching liquid containing a metal component by etching a substrate is reproduced will be described. 1 is a flowchart for explaining an etching solution regeneration method according to a first embodiment of the present invention, and FIG. 2 is a flowchart for explaining an etching solution regeneration method according to a first embodiment, and FIG. 3 14 200912041 shows a first embodiment. FIG. 4 is a schematic view showing a schematic configuration of a substrate processing apparatus and the like in the first embodiment. First, the movable container 1 for adsorbing the metal component in the etching liquid will be described based on FIG. 1, FIG. 3 and FIG. The portable container is internally filled with a chelating material (not shown) as an adsorbent for adsorbing metal ions (indium ions or tin ions, which will be described later), and has mobility. Further, the portable container 1 is configured to be attachable and detachable to the substrate processing apparatus (the substrate K is treated with the etching liquid L) and the adsorbent regenerating device 40 for regenerating the chelating material (not shown). Further, a supply unit (not shown) for supplying the etching liquid L or an eluent or a cleaning liquid to be described later to the inside is formed at the upper end portion of the movable container cassette, and the supply unit (not shown) The discharge portion (not shown) that is supplied to the inside of the etching liquid L or the eluent and the cleaning liquid is discharged to the outside. > The chelating material (not shown) is generally a general term for an organic aminocarboxylic acid salt, and has a property of adsorbing metal ions and eluting the adsorbed metal with a specific solution. Specifically, as an example, 丨 edta (ethylenediaminetetraacetic acid), NTA (nitrilotriacetic acid), DTPA (diethylenetriamine pentaacetic acid), glda (l-glutamic acid diacetic acid) ), HEDTA (hydroxyethyl ethylenediamine triacetic acid), GEDTA (glycol ether diamine tetraacetic acid), TTHA (triethylenetetramine hexaacetic acid), HIDA (hydroxyethyl iminodiacetic acid), and DHEG (transethylethylglycine) or the like, but is not limited thereto. Next, the substrate processing apparatus 1A will be described based on FIG. As shown in FIG. 3, the substrate processing apparatus 10 includes, for example, a oxalic acid rich 15 200912041 degrees (% by weight) of about 3% of the etching liquid L. (4) Substrate processing substrate 12 of the substrate κ, and (4) liquid L. σ « # ϊ¥ ,. , 蚀刻 etching liquid L in storage tank i; [ = liquid circulation mechanism 20 circulating between substrate processing mechanisms 12, passing etchant L stored in storage tank 11 through '1 ^ Μ on shifting The etching solution 30 in the combination 15 , the control substrate processing mechanism 12 and the (4) liquid circulation mechanism plus the control of the operation of the etching liquid through mechanism 30 ^ ^ S 1 Λ the clothes 25 and the like and the substrate processing device 10 It is placed in the processing area (see Figure 丨). The substrate processing mechanism 12 includes a processing chamber I3 having a closed space, and a lower chamber disposed in the processing chamber 13, and the 拗t ^ ding direction (arrow pointing) is transported to the table and is formed in the predetermined | surface 1 The plurality of conveyance rollers 14 of the substrate K of the antimony oxide film (metal film) are disposed on the upper portion of the processing chamber 13, and the etching liquid 1 supplied from the etching liquid circulation mechanism 20 is fixedly disposed in the flow tube. And a plurality of nozzle bodies 16 and the like for ejecting the etching liquid L to the upper surface of the substrate K conveyed by the conveyance roller 14, and the (four) night L in the processing chamber u is discharged from the bottom of the processing chamber 13 to the outside. . β % ua The etching liquid circulation mechanism 2 includes: a supply pipe 21 connected to the storage tank u at one end side, and a supply pipe 21 connected to the flow f 15 on the other end side, and a silver engraving liquid is supplied through the supply pipe The supply pump 22 of L, the end side is connected to the discharge port 13a of the processing chamber 13, and the other end side is connected to the recovery pipe 23 of the storage tank or the like. * °Haiyin liquid-liquid-passing mechanism 30 includes: the first mounting portion 31 and the second mounting portion 32, which are detachably mounted to the movable container 1, and the end side is connected to the storage tank U, and the other end The side can be branched and connected to the supply unit (not shown) of each of the movable containers 16 (not shown), and the end can be branched and connected to each other. Removable container, 1 == not shown) Connected money engraving recovery f 34, via money engraving, B to removable trough! The supply pump 内部 of the internal supply etching liquid, the first supply switching valve 36 and the second supply side switching valve 37 provided on the other end side of the etchant supply pipe 33, and the knives are placed in the The first discharge side switching valve 38 and the second discharge side switching "two = helium container 1 are attached to the respective mounting portions 31, and FIG. 2: the supply portion of each of the movable containers 1 (not The other discharge unit (not shown) connected to the 'button engraving tube 34 is connected. The shifting type of the valleys = the switching rooms 36, 37, 38, 39 are controlled by the control device 25 as follows: the first supply side switching valve 36 and the first discharge side switching valve 1 are connected to the supply side switching valve 37 and the second The discharge side switching valve 39: The 仏 supply side switching valve 37 and the second discharge side switching valve 39 close the first supply side switching valve 36 and the first discharge side switching valve 38. In the etching liquid passage mechanism 3, the silver-filled liquid L is ejected to the portable container by the supply of the final liquid supply pipe 33. That is, the first supply side switching room 36 is hit. When the side switching valve 37 in the door sump 11 is closed, the first supply unit 2 and the second supply are supplied, 峨L, and the first supply side is switched: the shift container! When the side switching is ON, the second mounting portion 32: and the second supply is supplied with the residual liquid L. The movable container 丨 on the 2 side is then supplied to any side of the movable container 1, and the etching liquid L circulating in the movable type 17 200912041 is supplied through the etching liquid recovery tank. Thus, the (iv) liquid L is circulated between the storage 34 and the storage. And the movable container 1 The control device 25 performs the following processing: The engraving liquid L is stored in the thumb, 4^ 仏 栗 栗 栗 22 ‘ eclipse * Storage tank 11 and substrate processing mechanism! In the case of the operation supply (4), the process of supplying n, 37, 38, and 39 is controlled, and the movable container 1 (four) of the material is inferred at the time interval between the box and each of the switching valves 36 and ρ(4)Γ1 (not The figure shows that the movable container i with the surname engraving is provided, the same as the interval, and the alternately cut (4) "passing the portable capacity...: - time::: storage tank 11 1). Processing (refer to the substrate processing apparatus i of the figure::), it can be seen that the surname of the deposit in the storage tank u is via the supply pipe 21

^各喷嘴體16供給,從該等各噴 S 面喑屮,, 寸分1驚體16向基板K的上表 的排°、在基板K上表面的㈣液L從處理腔室13 口 13a流通至回收管23内而回收在貯存槽丨丨内。 喷嘴=基板κ藉由搬運輥14在既定方向上搬運,並由各 理 所噴出之钱刻液L飾刻。還有,由於該韻刻處 土板K的氧化銦錫膜溶解於蝕刻液L ,導致銦離子或 錫離子含於該蝕刻液L·中。 另卜以預先设定的時間間隔交替切換作爲通液對象 之可蒋々六。„ ^ 工奋益,同時使貯存於貯存槽11的蝕刻液L·選擇 ::經由供給& 35、各切換閥36、37、38、39、蝕刻液 仏、。s 33及蝕刻液回收管34通過可移式容器工的任一方, 200912041 :二利用可移式容器1内的螯合材料(未圖示)吸附蝕刻 攻中的作爲金屬成分的銦離子或錫離子。 接著’基於圖4,說明該吸附材料再生裝£ 附材料再生裝置40如相同圖 及 r, λ„ ^ J a括•可移式容器i /夠裝卸的方式安裝之安裝部41、使洗提料過 谷器1内之洗提液通液機構42、使清洗液通過可移式容琴 二内:清洗液通液機構52、從在可移式容器!内流通的洗 :=銦或錫以回收之金屬回收部(未圖示)、控制洗提 q液機構42與清洗液通液機構52及金屬回收部(未圖示) ^運仃的控制裝置65等;且吸附材料再生裝置如係配置 與職理區域分隔之吸附材料再生區域(參照冑…此^ Each of the nozzle bodies 16 is supplied, and from the respective S-surfaces, the array of the first object 16 is directed to the upper surface of the substrate K, and the liquid (4) on the upper surface of the substrate K is circulated from the processing chamber 13 opening 13a. It is collected into the recovery tank 23 and recovered in the storage tank. The nozzle = substrate κ is conveyed in a predetermined direction by the conveyance roller 14, and is embossed by the money L which is ejected from each of the chambers. Further, since the indium tin oxide film of the earth plate K is dissolved in the etching liquid L, indium ions or tin ions are contained in the etching liquid L·. In addition, the switch can be alternately switched at a preset time interval. „ ^Working effort, at the same time, the etching liquid L· stored in the storage tank 11 is selected: via the supply & 35, each switching valve 36, 37, 38, 39, etching liquid 仏, s 33 and etching liquid recovery tube 34 passes through either of the movable container workers, 200912041: The chelating material (not shown) in the movable container 1 is used to adsorb the indium ions or tin ions as the metal component in the etching attack. It is to be noted that the adsorbent material regenerating device 40 is attached to the material regenerating device 40 as shown in the same figure and r, λ„^ J a includes a removable container i/mountable mounting portion 41, and the eluting material barter 1 The eluent liquid passing mechanism 42 is arranged to pass the cleaning liquid through the movable type Rongqin 2: the cleaning liquid through mechanism 52, and the movable container! In-line washing: = indium or tin to recover metal recovery unit (not shown), control elution q liquid mechanism 42 and cleaning liquid through mechanism 52 and metal recovery unit (not shown) 65, etc.; and the adsorbent material regeneration device is configured to separate the adsorbent material from the occupational area (see 胄...

外,安裝# 41、洗提液通液機構42、清洗液通液機構U 及控制裝i 65發揮作爲申請專利範圍中之第2 的作用。 ☆ f洗提液通液機構42具備:供給用於洗提吸附於可移 式各益1内螯合材料(未圖示)的銦或錫的洗提液之洗提液 供給機構43、從可移式容器i内回收洗提液之洗提液回收 機構/8。此外,洗提液例如由鹽酸或硫酸或氫氧化鋼構成。 該洗提液供給機構43包括:貯存該洗提液之洗提液貯 子桶44、一 i而側與洗提液貯存桶44連接,且另一端側能 夠與可移式容器丨供給部(未圖示)連接之洗提液供給管 45、經由洗提液供給管45向可移式容器丨内部供給洗提 液之供給泵46、設置於洗提液供給管45的一端側即供給 泵46的下游側之洗提液供給閥47等;且其中,在可移式 200912041 谷器1安裝於安裝邻4± 盘可移洗提液供給管45的另一端侧 了移式谷盗1的供給部(未圖示)連接。 該洗提液回收機構 提液49 # 以.貯存所时之洗提液的洗 桶9、—端側與洗提液回收桶49連接,且另一 端側能夠與可移式容器1 按且另 收其排出0P (未圖示)連接之洗提液回 收s 50、5又置於洗提液回收普山, 51 ^ . θ # ^ 收s 50 —鳊侧之洗提液回收閥 51 4,且其中,在 六 移式谷态1女裝於安裝部41時,洗 收管50的另-端側與可移式容器!的排出部(未圖 不)運接。 在該洗提液供給機構43及洗提液回收機構48中,藉 ^共給泵將料於洗提㈣_ 44㈣提液經Μ 才疋液供給管4 5供給至可移式交哭]& J移式谷3 1内。此外,利用洗提 液回收管50將被供給至可移式 土』秒式谷器1内且在該可移式容 器1内流通的洗提液回收於洗提液回收桶㈣。此外, 此時’洗提液供給閥47及洗裎饬π 士日日 光钕液回收閥5 1控制爲打開的 狀態,後述的清洗液供給閥57及清洗液回㈣Η控制爲 關閉的狀態。 ' 該清洗液通液機構52具備:供給用於清洗可移式容器 1内部之清洗液的清洗液供給機構53、從可移式容器丄内 回收清洗液的清洗液回收機才冓58。其中,清洗液例如由純 水構成。 該洗提液供給機構53包括:貯存該清洗液之清洗液貯 存桶54、一端側與清洗液貯存桶54連接,且另—端側在 洗提液供給閥47的下游側與洗提液供給管45連接,經由 20 200912041 該洗提液供給管4 5 ’能夠與可 幻兴·)移式容器1供給部(灰 連接之清洗液供給管5S、姆ώ生山 、衣圖不) 經由清洗液供給管55向可斂* 容器i的内部供給清洗液之供給栗%、$琶 了移式 管55供給泵56下游側之·生 又^月;液供给 训之π洗液供給閥57等;且1 在可移式容器i «於安裝部41時,清洗液供、k 另-端側經由洗提液供給管45與可移式容器 : 圖示)連接。 、、〜#(未 該清洗液回收機構5 8包括.p六& ^ L牯.冑了存所回收之清洗液 洗液回收桶59、-端侧與清洗液回收桶Μ連接,且^ 端側在洗提液回收閥51上游側與洗提液回收管5 經由該洗提液回收管50,能夠與可移式容器i排 去 =示)連接之清洗液回收管6〇、設置於清洗液回收管的 清洗液回收閥61等,在可銘彳六„„ 寻在T移式容自!安裝於安裝部* 清洗液回收管60的另一戚如破山、, 力鈿側經由洗提液回收管50與可銘 式容器1的排出部(未圖示)連接。 、 在該清洗液供給機構53及清洗液回收機構Μ中 存於清洗液貯存槽54之清洗液係藉由供給泵% 洗液供給管55及洗提液供給管45,供給至可移式容器 内。此外,利用洗提液回收管5〇及清洗液回收管的將 供給至可移式容器卜且在該可移式容器1内流通的清洗 液回收在清洗液回收桶59内。還有,此時,清洗液卜 閥57及清洗液回收閥61控制爲打開的狀態,洗提液供哈 閥47及洗提液回收閥51控制爲關閉的狀態。 該金屬回收部(未圖示)構成爲從貯存於洗提液回收桶 21 200912041 49内的洗提液取出銦或錫而將其回收。 該控制裝置65進行下列處理··控制供給系μ、洗提 液供給閥47及洗提液回收間51,使洗提液貯存桶扨 洗提液向可移式容B !内通過似時間之處理、在洗提液 的通液處理後’控制供給泵56、清洗液供給閥57及主洗 液回收閥61,使清洗液貯存桶54内的清洗液向可移式容 器1内通過既定時間之處理、利用金屬回收部(未圖示卜In addition, the mounting #41, the eluent liquid-passing mechanism 42, the cleaning liquid-passing mechanism U, and the control device i 65 function as the second in the scope of the patent application. ☆ f eluent liquid passage mechanism 42 is provided with an eluent supply mechanism 43 for supplying an eluent for eluting indium or tin adsorbed to a removable chelating material (not shown) The eluent recovery mechanism/8 for recovering the eluent in the removable container i. Further, the eluent is composed of, for example, hydrochloric acid or sulfuric acid or steel hydroxide. The eluent supply mechanism 43 includes: an eluent storage bucket 44 for storing the eluent, a side connected to the eluent storage tank 44, and the other end side capable of being connected to the portable container 丨 supply unit ( (not shown) the connected eluent supply tube 45, the supply pump 46 that supplies the eluent to the inside of the removable container via the eluent supply tube 45, and the supply pump that is provided at one end of the eluent supply tube 45. The eluent supply valve 47 and the like on the downstream side of 46; and wherein, in the movable type 200912041, the trough 1 is mounted on the other end side of the mounting adjacent 4± disc removable eluent supply tube 45. A supply unit (not shown) is connected. The eluent recovery mechanism extracting liquid 49 is connected to the eluent recovery tank 49 of the eluent at the time of storage, and the other end side can be connected with the movable container 1 and the other end The eluent recovery s 50, 5, which is connected to the effluent 0P (not shown), is placed in the eluent to recover the Pushan, 51 ^ . θ # ^ to receive the s 50 - the eluent recovery valve 51 4 on the 鳊 side, And, in the case of the six-shift type 1 state in the mounting portion 41, the other end side of the washing tube 50 and the movable container! The discharge section (not shown) is transported. In the eluent supply mechanism 43 and the eluent recovery mechanism 48, the pump is fed by the pump (4) _ 44 (four), and the sputum supply tube 4 5 is supplied to the portable crying & J moves in the valley 3 1 inside. Further, the eluent recovery pipe 50 is supplied to the eluate recovery tank (4) by the eluent recovery pipe (4) which is supplied into the movable earth quaternary granulator 1 and circulated in the detachable container 1. Further, at this time, the eluent supply valve 47 and the washing liquid ray recovery valve 51 are controlled to be in an open state, and the cleaning liquid supply valve 57 and the cleaning liquid return (four), which will be described later, are controlled to be in a closed state. The cleaning liquid passage mechanism 52 is provided with a cleaning liquid supply mechanism 53 for supplying the cleaning liquid for cleaning the inside of the portable container 1, and a cleaning liquid recovery machine 58 for recovering the cleaning liquid from the movable container. Among them, the cleaning liquid is composed of, for example, pure water. The eluent supply mechanism 53 includes a cleaning liquid storage tank 54 that stores the cleaning liquid, one end side connected to the cleaning liquid storage tank 54, and the other end side on the downstream side of the eluent supply valve 47 and the eluent supply. The tube 45 is connected, and the eluent supply tube 4 5 ' can be connected to the supply unit (the ash-connected cleaning liquid supply tube 5S, the Mt. The liquid supply pipe 55 supplies the supply of the cleaning liquid to the inside of the container*, and the supply of the pump 55 to the downstream side of the pump 56, and the supply of the liquid to the π lotion supply valve 57. And 1 when the portable container i is "on the mounting portion 41, the cleaning liquid supply, the k-end side is connected to the movable container (illustrated) via the eluent supply tube 45). ,,~# (The cleaning liquid recovery mechanism 5 8 does not include .p six & ^ L牯. The cleaning liquid washing liquid recovery tank 59, the end side is connected with the cleaning liquid recovery tank, and ^ The upstream side of the eluent recovery valve 51 and the eluent recovery pipe 5 are connected to the eluent recovery pipe 50 via the eluent recovery pipe 50, and the cleaning liquid recovery pipe 6 can be connected to the movable container i. The cleaning fluid recovery valve 61 of the cleaning liquid recovery pipe, etc., can be clarified in six... The other part of the cleaning liquid recovery pipe 60, which is attached to the mounting portion*, is broken, and the force-receiving side is connected to the discharge portion (not shown) of the instructable container 1 via the eluent recovery pipe 50. The cleaning liquid stored in the cleaning liquid storage tank 54 in the cleaning liquid supply mechanism 53 and the cleaning liquid recovery mechanism 藉 is supplied to the movable container by the supply pump % washing liquid supply pipe 55 and the eluent supply pipe 45. Inside. Further, the cleaning liquid which is supplied to the movable container by the eluent recovery tube 5 and the cleaning liquid recovery tube and which flows through the portable container 1 is recovered in the cleaning liquid recovery tank 59. Further, at this time, the cleaning liquid valve 57 and the cleaning liquid recovery valve 61 are controlled to be in an open state, and the eluent supply valve 47 and the eluent recovery valve 51 are controlled to be in a closed state. The metal recovery unit (not shown) is configured to take out indium or tin from the eluate stored in the eluent recovery tank 21 200912041 49 and collect it. The control device 65 performs the following processes: controlling the supply system μ, the eluent supply valve 47, and the eluent recovery chamber 51, and passing the eluent storage tank eluent to the movable volume B! After the liquid-repellent treatment of the eluent, the control supply pump 56, the cleaning liquid supply valve 57, and the main washing liquid recovery valve 61 are controlled to pass the cleaning liquid in the cleaning liquid storage tank 54 to the movable container 1 for a predetermined period of time. Treatment and utilization of metal recycling department (not shown)

從洗提液回收_ 49内的洗提液取出銦或錫而將其回 處理。 根據這樣構成的吸附材料再生裝置4〇可知,首先,利 用供給泵46、洗提液供給閥47、洗提液回收閥51、洗提 液供給管45 A洗提液回收管5〇,使貯存於洗提液貯存桶 料的洗提液通過可移式容器i内…,吸附於螯合材料 (未圖示)的銦或錫被該洗提液洗提,含有洗提的銦離子或 錫離子的洗提液被回收在洗提液回收桶49内。 一The indium or tin is taken out from the eluent in the eluent recovery _49 and returned to the treatment. According to the adsorbent recovery device 4 configured as described above, first, the supply pump 46, the eluent supply valve 47, the eluent recovery valve 51, and the eluent supply pipe 45A eluent recovery pipe 5〇 are used for storage. The eluent in the eluent storage tank material passes through the movable container i, and the indium or tin adsorbed on the chelating material (not shown) is eluted by the eluent, and contains the eluted indium ion or tin. The ion eluate is recovered in the eluent recovery tank 49. One

^後,貯存於清洗液貯存槽54的洗提液係經由供給泵 56、J#洗液供給閥57、清洗液回收閥6][、清洗液供給管Η、 洗提液供給管45、清洗液回收管6〇及洗提液回收管5〇, 通過可移式容器1内。藉此,由該清洗液沖洗殘留於可移 式令益1的内部的洗提液,將含有殘留洗提液的清洗液回 收於清洗液回收桶59内。 另外,藉由金屬回收部(未圖示),從貯存於洗提液回 收桶49内的含有銦離子或錫離子的洗提液取出銦或錫, 將其回收。藉此’回收吸附於可移式容器1螯合材料(未圖 22 200912041 示)的銦或錫即由於基板處理機構12中的钮刻 於蝕刻液L的銦或錫。 阳/合解 還有,取後,基於圖!〜圖4,說明再生因 溶解並含有所謂銅或錫等金屬之蚀刻液l之方法。“理而 在基板處理機構12巾,在利用转槽u内的韻列液 對基板K進行㈣處理的期間,以預纽定的時間間隔 父#切換作爲通液對象的可移式容器丨,同時使貯存 ㈣钱㈣L選擇性地通過安裝於第—絲部31的曰可移 ^容器i或安裝於第二安裝部32的可移式容器 方(步驟S1)。藉此,在可移式容器!内的螯合材料(未圖干) :附㈣…的金屬成分(銦離子或錫離子)而除去,將 L再生。此外’在第—安裝部31及第二安裝部32 預先安裝有未使用的填充容器丨(螯合 义 銦或錫的可移式容器”。 〆"不)未吸附 若切換作爲通液對象的可移 可移式容H 1(在螯合材料(未圖;卜則將使用後的 OV 不)吸附有姻或錫的可移式 m更換爲未使料可移式容 少驟S2)。卽, 弟—安裝部31的可移式容器i切 在從 移式容器"夺,從第—安裝、爲第二安…2的可 器卜安裝未使用的可移式容与】卸下使用後的可移式容 可移式m㈣爲第-安;V3,錢第二安裝部32的 從第二安裝部32卸下使用後的;二的二移式…時, 的可移式容器1。此外,上述步工谷益1’文裝未使用 利範圍中之處理液再生步驟。 1及S2相畲於申請專 23 200912041 然後,利用例如卡車2等搬運機構,將從第一安裝部 31或第二安裝部32卸下之使用後的可移式容器1從處理 區域側向吸附材料再生區域側搬運(步驟s 3)。 然後,在將搬運至吸附材料再生區域側之使用後的可 移式谷器1安裴於安裝部41後,使洗提液通過可移式容 二1内(步驟S4)。藉此,將吸附於螯合材料(未圖示)的銦 〆.先提再生该螯合材料(未圖示),並且,將含有所洗 fAfter that, the eluent stored in the cleaning liquid storage tank 54 passes through the supply pump 56, the J# washing liquid supply valve 57, the cleaning liquid recovery valve 6] [, the cleaning liquid supply pipe, the eluent supply pipe 45, and the cleaning liquid. The recovery pipe 6〇 and the eluent recovery pipe 5〇 pass through the movable container 1. Thereby, the eluent remaining in the inside of the transfer type 1 is washed by the cleaning liquid, and the cleaning liquid containing the residual eluent is recovered in the cleaning liquid recovery tank 59. Further, indium or tin is taken out from the eluent containing indium ions or tin ions stored in the eluent recovery tank 49 by a metal recovery unit (not shown), and is recovered. Thereby, indium or tin adsorbed to the chelating material of the movable container 1 (not shown in Fig. 22 200912041) is recovered, that is, indium or tin engraved in the etching liquid L by the button in the substrate processing mechanism 12. Yang/Combination Also, after taking, based on the map! Fig. 4 shows a method of regenerating the etching liquid 1 which dissolves and contains a metal such as copper or tin. In the substrate processing mechanism 12, during the (four) processing of the substrate K by the rhyme liquid in the rotary groove u, the movable container 作为, which is the liquid-passing target, is switched at the time interval of the predetermined time. At the same time, the storage (4) money (4) L is selectively passed through the 曰 removable container i attached to the first wire portion 31 or the movable container side mounted to the second mounting portion 32 (step S1). The chelating material in the container (not shown) is removed by the metal component (indium ion or tin ion) of (4), and L is regenerated. Further, the first mounting portion 31 and the second mounting portion 32 are preliminarily mounted. Unfilled filled container 丨 (removable container for chelated indium or tin.) 〆"not) unadsorbed if switched to transferable volume H 1 (in chelating material (not shown) ; 卜 will be used after the OV does not) the adsorption of the marriage or tin removable m replaced with no material transferable capacity less S2).卽, 弟—The removable container i of the mounting portion 31 is cut in the detachable container, and the unloadable capacity and the detachable device are removed from the first installation and the second installation. The movable removable type m (four) after use is a first-amp; V3, the removable second container 32 is detached from the second mounting portion 32; the second movable type is a movable container 1. In addition, the above-mentioned step-by-step Gu Yi 1' textbook does not use the treatment liquid regeneration step in the range of use. 1 and S2 are related to Application No. 23 200912041. Then, the movable container 1 after being used, which is detached from the first mounting portion 31 or the second mounting portion 32, is adsorbed from the processing region side by the transport mechanism such as the truck 2 The material regeneration area side is conveyed (step s 3). Then, after the movable type hopper 1 that has been transported to the side of the adsorbent recovery area is placed in the mounting portion 41, the eluent is passed through the movable container 1 (step S4). Thereby, the indium ruthenium adsorbed to the chelating material (not shown) is first regenerated to regenerate the chelating material (not shown), and will contain the washed f

提之銦離子或錫離子的洗提液回收於洗提液回收桶钧内。 然後,從洗提液回收桶49内的洗提液取出銦或錫以回 收之(步驟S5)。藉此,回收可移式容器i螯合材料(未圖示) 上所吸附之(在基板處理機構12中的㈣處理中溶解於姓 刻液L的)銦或錫。 另外,在洗提液通過後,使清洗液通過可移式容器i 内’從安裝部41卸下(步驟S6)。藉此,利用該清洗液沖 洗殘留於可移式容H !内部之洗提液,將含有殘留之洗提 液的清洗液回收於清洗液回收桶59内。而上述步驟“及 S6的處理相#於巾請專利範圍中之吸附材料再生步驟。 此外,利用例如卡車2等搬運機構,將經過了步驟S4 及S6之再生後的可移式容器K螯合材料(未圖示)未吸附銦 =的可移式容器υ從吸附材料再生區域側返送至處理區 域側(步驟S7),保管在處理區域側(步驟S8)。然後, 驟Μ所保管之再生後(未使用)的可移式容器!在步驟S2 中與使用後的可移式容器1交換。 ’ 如以上所詳述,根據本例之敍刻液再生方法可知,在 24 200912041 處理區域中,使蚀刻& L中的姻或錫吸附於可 内的螯合材料(未圖示)而除去,將使用後的可移::器】 搬運至吸附材料再生區域以再生f合材料(未圖示),將再 ^後的可移式容器1返送至處理區域以再使用,因此,在 處理區域側僅設置使姓刻液L通過 ,虫刻液L中的銦或錫吸附於整合材料(未圖示)的設備即 :=簡單且廉價的設備再一咖成爲能夠再 —另外门所搬運之對象不是银刻液L本身,而是可移式 ^ 因此,重量輕且容易操作,而且搬運成本與油罐 比爲非常低’能夠以通常的卡車搬運。另外,由於進 二=:Γ移式容器1返送至處理區域而再使用, ^夠反魏用可移式容器丨(螯合材料(未圖示))。由於, 因’能夠以低成本有效地再生由於钮刻處理有姻乂 或錫的蝕刻液L。 有姻 .人=藉由如此般再生崎L,可實現餘刻… ::Γ:而延長其更換周期’因此,節省新餘刻液[ 液L所二吏用,刻液L的廢棄費用等’抑制钱刻The elution solution of indium ion or tin ion is recovered in the eluent recovery barrel. Then, indium or tin is taken out from the eluent in the eluent recovery tank 49 to be recovered (step S5). Thereby, indium or tin which is adsorbed on the removable container i chelating material (not shown) (which is dissolved in the surname L in the (four) treatment in the substrate processing mechanism 12) is recovered. Further, after the eluent is passed, the cleaning liquid is removed from the mounting portion 41 through the inside of the portable container i (step S6). Thereby, the eluent remaining in the transferable volume H! is washed with the cleaning liquid, and the cleaning liquid containing the remaining eluent is recovered in the cleaning liquid recovery tank 59. In the above-mentioned step "and the treatment phase of S6, the adsorption material regeneration step in the scope of the towel application. In addition, the transportable container K after the regeneration of steps S4 and S6 is sequestered by a transport mechanism such as a truck 2, for example. The movable container (not shown) in which the indium is not adsorbed is returned to the processing region side from the side of the adsorbent material regeneration region (step S7), and stored in the processing region side (step S8). The rear (unused) removable container! is exchanged with the disposable container 1 after use in step S2. ' As described in detail above, according to the method of reclaiming the liquid in this example, it is known in the processing area of 24 200912041 The chelating material in the etching & L is adsorbed to the internal chelating material (not shown) and removed, and the movable device after use is transported to the adsorbent material regeneration region to regenerate the material (not As shown in the figure, the removable container 1 is returned to the treatment area for reuse. Therefore, only the surname L is passed through the treatment area side, and the indium or tin in the insect engraving liquid L is adsorbed to the integrated material. (not shown) equipment: = simple and cheap The equipment can be reused again - the other object is not the silver engraving liquid L itself, but is movable. Therefore, it is light and easy to operate, and the handling cost is very low compared to the tank. The truck is transported. In addition, because the feed container 1 is returned to the treatment area for reuse, it is sufficient to use the removable container 螯 (chelating material (not shown)). Efficiently regenerate the etching solution L with inscriptions or tins due to the button engraving. There is a marriage. People = by regenerating the K in such a way, the remaining moments can be achieved... ::Γ: and the replacement cycle is extended', therefore, Save new residual engraving [Liquid L is used for the second time, the waste cost of the engraving L, etc.]

刻處理’能夠將基板處理所花費的 J 低的成本。另外’能夠減少欲廢棄處 制爲 蝕刻液L能夠只需要蝕刻處理 因:L ’或新 對環境保護具有貢獻作用。進而=刻處:還能夠 使蝕刻液L·總是通過可移式容 、期間, 移式各器1内,因此,能夠將貯存 25 200912041 槽11内的I虫勿丨 A 士 含有的銦離子的濃度或錫離子的濃 度時常維持在—^ y ^ 疋水平以下的狀態,能夠將蝕刻液L時常 保持爲與新品相同的狀態。 夕卜 e 由於在洗提液通過後使清洗液通過,並沖洗殘 列:移式谷态1内部的洗提液,因此,能夠有效防止下 二月况·在基板處理裝置1〇中通液有蝕刻液L時,蝕刻 (L和洗提液混合而導致㈣液L的成分變化,對餘刻處 理產生不良影響。 夕卜 错由使钱刻液L中的銦或錫吸附於可移式容器 =Μ合材料(未圖示)’能夠將該銦或錫集聚爲濃縮於 可移式^:哭、1 A , ° 的狀態,能夠容易地回收溶解於姓刻液L· (第二實施方式) 然後’基於附目,對本發明的第二實施方式的金屬回 收方法進行說明。在該第_ 其拉 隹袭弟—貫施方式中,利用蝕刻液蝕刻 土 ,回收含於該姓刻液的金屬成分,對此進行說明。圖 6係用於說明本發明的第二實施方式的金屬回收方法的, θ 7係用於說明第二實施方式的金屬回收方法的流程圖。 此外,如圖3、圖4、圖6及圖7所示,該可移式容考 1構成爲能_對於該基板處理裝置1G、及金屬回收裝置 7〇(用以回收溶解於蝕刻液L之金屬)進行裝卸以外,具備 =述相同的結構。另外,該金屬回收裝£ 7〇具備與如 圖4所示之該吸附材料再生裝置4〇相同的結構作在配 置於與處理區域分隔之回收區域這一點上不同(參照叫 26 200912041 對基ΓΛ處::12中,貯存槽11 —刻液卜 交替切換作爲通液對象的可移式容器貝^疋的時間間隔, 11内的敍刻液l選擇性地通過安裝於第_^時’使貯存槽 移式容器i或安裝於第 、*裝部31的可 圖示)_刻液L中的金屬成分(銦離:螯=(未 在第一安梦邱X踢離子)。此外, 充容器材m安裝部32預先安裝有未吸附的填 1)〇 科(未圖不)未吸附銦或錫的可移式容器 可移爲通液對象的可移式容11卜則將吸附後的 =)::;Γ合材料(未圖 第-安的可移式容器1(步驟Sl2)。即’在從 移式容二二:式:二1切換爲第二安裝部32的可 υ 器i,安裝h 破部31卸下吸附後的可移式容 可移式☆哭°及附的可移式容器1,在從第二安裝部32的 1切換爲第—安裝部31的可移式容器1時, 弟-安裝部32卸下吸附後的可移式容器 的可移式容器丨。 女裝未吸附 然,’利㈣如卡車2等搬運機構將從第_安袭部h —文裝部32卸下之吸附後的可移式容器1從處理 或側向回收區域側搬運(步驟S13)。 ^ 〜壯然後,將搬運至回收區域側之吸附後的可移式容器1 女衣於女裂部41後’使洗提液通過可移式容器1内(步驟 27 200912041 S14)。藉此,對吸附於罄入奸姐一、 w於蝥σ材料(未圖不)之銦或锡進行洗 ’將含有所洗提之銦離子或錫離子的洗提液回收在洗提 液回收桶49内。 然後’從洗提液回收桶49内的洗提液取出銦或錫以回 收(步驟S15)。藉此,回收吸附於可移式容器工聲合Engraving 'the cost of being able to process the substrate is low. Further, it is possible to reduce the amount of the etching liquid to be etched, and it is only necessary to perform etching treatment because: L ' or new contributes to environmental protection. Further, the engraving: the etching liquid L can always be moved into the movable device 1 by the movable type, and therefore, the indium ions contained in the I and the insects in the tank 12 of the 200912041 can be stored. The concentration or the concentration of tin ions is always maintained at a level below -^ y ^ ,, and the etching liquid L can be kept in the same state as the new product. In the case of passing the eluent, the washing liquid is passed, and the residue is washed out: the eluent inside the shifting trough state 1, so that it can effectively prevent the next two months and the liquid in the substrate processing apparatus 1 When there is an etchant L, the etching (L and the eluent are mixed to cause a change in the composition of the liquid (4), which adversely affects the residual processing. The inaccuracy is caused by the adsorption of indium or tin in the engraving liquid L to the movable type. Container = chelating material (not shown) 'The indium or tin can be concentrated to be concentrated in a movable type: crying, 1 A, ° state, and can be easily recovered and dissolved in the surname L · (second implementation) EMBODIMENT] Next, the metal recovery method according to the second embodiment of the present invention will be described based on the attached item. In the method of etching the soil, the soil is etched by the etching solution, and the engraving liquid is recovered. Fig. 6 is a view for explaining the metal recovery method according to the second embodiment of the present invention, and θ 7 is a flowchart for explaining the metal recovery method of the second embodiment. 3. As shown in FIG. 4, FIG. 6 and FIG. 7, the movable type test 1 constitutes In addition, the substrate processing apparatus 1G and the metal recovery apparatus 7 (for recovering the metal dissolved in the etching liquid L) are attached and detached, and the structure is the same as that described above. The same structure of the adsorbent recovery device 4 as shown in FIG. 4 is different in that it is disposed in a recovery area separated from the treatment area (refer to 26 200912041 for the base: 12, the storage tank 11 is engraved) The liquid cloth alternately switches the time interval of the movable container as the liquid-passing object, and the engraving liquid 1 in the 11 is selectively installed by the storage tank to be mounted on the first container * (the illustration of the mounting portion 31) - the metal component in the engraving liquid L (indium separation: chelation = (not in the first Anthony X kick ion). Further, the filling material m mounting portion 32 is preliminarily mounted without adsorption. Filled in 1) 〇 ( (not shown) a removable container that does not adsorb indium or tin can be moved to a removable volume of the liquid object 11 will be adsorbed =)::; composite material (not shown) The first-amplitude portable container 1 (step S12). That is, the switch from the transfer type two-two: type: two-one to the second mounting part 32 The device i is mounted, the h-shaped portion 31 is removed, and the movable removable container ☆ can be removed, and the attached movable container 1 is switched from 1 of the second mounting portion 32 to the first mounting portion 31. In the case of the movable container 1, the younger-mounting portion 32 removes the movable container 吸附 of the detachable movable container. The women's clothing is not adsorbed, and the profit mechanism (such as the truck 2) will be removed from the _attack unit. H— The transportable container 1 that has been removed after the document loading unit 32 is removed is transported from the side of the processing or the side of the collection area (step S13). ^ 壮 Then, the adsorbed movable container that is transported to the side of the recovery area 1 After the female garment is in the female split 41, the eluent is passed through the removable container 1 (step 27 200912041 S14). In this way, the indium or tin adsorbed on the material of the sputum, the yttrium material (not shown) is washed, and the eluent containing the eluted indium ion or tin ion is recovered in the eluent recovery. Inside the bucket 49. Then, indium or tin is taken out from the eluent in the eluent recovery tank 49 to be recovered (step S15). Thereby, recycling and adsorbing in the movable container

=)之《板處理機構12中的#刻處理_溶解於银刻液L 的)鋼或錫。 另外,在洗提液通過後,使清洗液通過可 :殘:Γ部41卸下(步驟SI6)。藉此,利用該清繼 洗殘留於可移式容器i内部之洗提液,將含有殘留之洗提 液的清洗液回收於清洗液回收桶59内。 丨 及=外’利用例如卡車2等搬運機構,將經過了步驟S14 處理的回收後的可移式容ii 1(螯合材料(未圖示) ==或錫的可移式容_ υ從回收區域側向處理區域側 ^驟S17),保管在處理區域側(步驟。 ::::::所保管之回咖 v驟2中與吸附後的可移式容器1交換。 如以上所詳述,根據本例之金 理區域中,使㈣液…銦或錫吸附於可移 的螯合材料(未圖示)’將吸附後的可移式容器」搬運至口 收區域,时錢於整合材料(未心)之銦或錫 後之可移式容n 1返送至處理區域因- 收由㈣刻處理而溶解於㈣液km 另外,僅在處理區域側使㈣液[通過可移式容器1 28 200912041 内’使該蝕刻》夜L中的銦或錫吸附於螯合材料(未圖示)即 可’因此,能夠以簡單且廉價的設備應對。另外,藉由使 蝕刻液L中的銦或錫吸附於可移式容器i内的螯合材料(未 ,示能夠將油或錫集聚爲濃縮於可移式容器i内的狀 態’能夠容易地回收溶解於蝕刻& L的銦或錫。另外,搬 運對象不是敍刻液L本身,而是可移式容器i,因此,重 量輕且容易操作,而且搬運成本與油罐車相比爲非常低, 能夠以通常的卡車搬運。另彳,由於進—步將回收後的可 移式容H丨返送至處理區域以再制,因此,能夠反復使 用可移式谷益1(螯合材料(未圖示))。由於該等原因,能夠 以低成本有效地再生由於_處理而溶解於㈣液l的姻 另外,藉由使蝕刻液L中的銦或錫吸附於可移式容器 1内的螯合材料(未圖示)’能夠將該銦或錫集聚爲濃縮於 "移式谷器1内的狀態,能夠容易地回收溶解於蝕刻液[ 的銦或锡。 另外’由於在洗提液通過後使清洗液通過,並沖洗殘 召於可移式容器1内部之洗提液,因此,能夠有效防止下 歹J h况.在基板處理裝置丨〇中通液有蝕刻液l時,蝕刻=) "Steel processing in the plate processing mechanism 12 - steel or tin dissolved in the silver engraving liquid L". Further, after the eluent has passed, the cleaning liquid is removed by the detachable portion 41 (step SI6). Thereby, the eluent remaining in the inside of the portable container i is washed by the cleaning, and the washing liquid containing the remaining eluent is recovered in the washing liquid recovery tank 59.丨 and = outside 'Using a transport mechanism such as a truck 2, the recovered removable capacity ii 1 (chelating material (not shown) == or tin removable capacity _ υ from the step S14 The recovery area side processing area side step S17) is stored in the processing area side (step: :::::: stored in the returning coffee v step 2 and exchanged with the adsorbed movable container 1 as described above. According to the gold-based region of the present example, the (four) liquid...indium or tin is adsorbed to the movable chelating material (not shown), and the adsorbed movable container is transported to the oral region. The transferable capacity of the indium or tin after the integration of the material (unintentional) n 1 is returned to the treatment area due to - (4) processing and dissolved in (4) liquid km. In addition, only the treatment area side makes the (four) liquid [through the movable type In the container 1 28 200912041, indium or tin in the "etching" night L can be adsorbed to a chelating material (not shown). Therefore, it can be handled by a simple and inexpensive device. Indium or tin adsorbed to the chelating material in the movable container i (not shown, capable of collecting oil or tin into the concentrated container i The state 'can easily recover indium or tin dissolved in the etching & L. In addition, the object to be transported is not the imprinting liquid L itself, but the movable container i, and therefore, is light in weight and easy to handle, and the handling cost and the oil tank The car is very low in comparison and can be transported by ordinary trucks. In addition, since the recovered removable H丨 is returned to the processing area for re-production, the movable type can be reused. (chelating material (not shown)). For these reasons, it is possible to efficiently reproduce the insoluble matter of the (iv) liquid 1 by the treatment at a low cost, and to adsorb indium or tin in the etching liquid L. The chelating material (not shown) in the shift container 1 can concentrate the indium or tin in a state of being concentrated in the "shift barn 1, and can easily collect indium or tin dissolved in the etching liquid. In addition, since the washing liquid is passed after the eluent is passed, and the eluent that is trapped inside the movable container 1 is washed, the squeaking of the squeezing container can be effectively prevented. Etching with etchant l

液L和洗提液混合而導致蝕刻液L的成分變化,對蝕刻 理產生不良影響。 X 在進行蝕刻處理的期間,使蝕刻液L總是通過可移式 谷益1内’因此’能夠將貯存槽11内的蝕刻液L中含有 的銦離子的濃度或锡離子的濃度時常維持在一定水平以下 29 200912041 的狀恶,能夠將蝕刻液L時常保持爲與新品相同的狀態。 以上,對本發明的一例進行了說明,但本發明可採用 的具體的方式並不限定於該等。 在上例令,係在洗提液通過後,使清洗液通過可移式 容器1内,但省略該處理也可。但是,在這種情況下殘 留於可移式容器1内部的洗提液可能導致貯存槽u内的 钱刻液L的成分變化。 另外,在上述步驟S3或步驟S13中搬運可移式容器 時,若適當抽出可移式容器丨内的蝕刻液L,則可減輕可 移式谷器1的重量而容易搬運。 另外,該吸附材料再生裝置40及金屬回收裝置7〇還 可以構成爲如圖5所示之吸附材料再生裝置66及金屬回 收裝置71,該吸附材料再生裝置66及金屬回收裝置7ι具 備:在洗提液通過時,使可移式容器丨以能夠襞卸的方式 安裝之安裝部67、在洗提液通過時,使可移式容器i以能 夠裝卸的方式安裝之安裝部68。 在這種情況下,洗提液供給機構43及洗提液回收機構 48在可移式容器【安裝於安裝部67時,洗提液供給管^ 的另一端侧及洗提液回收管50的另一端側分別與可移式 容器1的供給部(未圖示)及排出部(未圖示)連接。另外,洗 提液供給機構53及清洗液回收機構58在可移式容器丨安 裝於安裝部68時,清洗液供給管55的另一端側及清洗液 回收管60的另一端侧分別與可移式容器丨的供給部(未圖 示)及排出部(未圖示)連接。另外,可以省略洗提液供給間 30 200912041 47、洗提液回收閥51、清洗液供仏 61。另外,安褒部67、洗提、夜诵:及清洗液回收閥 /无知液通液機構42 係發揮巾請專利範圍巾之第2it I裝置65 清洗液通液機構52及控制裝置…置之作用’安裝部68、 之第3職裝置之作用。 係發揮申請專利範圍中 退有,在上述步驟S4或步驟Sm中,在將 域搬運的可移式容器i安裝 °° ^ ^ 女裝邛67後,使洗提液通 為1内,從安裝部67卸下。另外,在上述步 驟S6或步驟Sl6中,在安裝 哀使洗如液通過的可 移式W i後,使洗提液通過可移式容器丨内,從安 6 8卸下。 另外,在上例中,㈣裝i 25亦可如以下方式構成. :預先設定的時間間隔交替更換可移式容_ i,同時,使 貯存槽11内的蝕刻液L通過可移式容器丨的任—方,但 不限定於此,亦可基於例如在基板處理機構12中所蝕刻 之基板K的片數或在貯存槽n内的蝕刻液L中所含有之 銦離子或錫離子的濃度,來切換欲使蝕刻液L通過之可移 式容器1。 在基於基板K的蝕刻片數進行切換控制的情況時,該 基板處理機構12還具備:例如感測器(未圖示),其係配設 於處理腔室13的外部或内部等適當位置,且檢測搬運至 處理腔室13内之基板K或從處理腔室13所搬運出之基板 K ;該控制裝置25基於從該感測器(未圖示)得到的輸出訊 號’計數搬運至處理腔室13内之基板K的片數或從處理 31 200912041The mixture of the liquid L and the eluent causes a change in the composition of the etching liquid L, which adversely affects the etching. X During the etching process, the etching liquid L is always passed through the movable type, so that the concentration of indium ions or the concentration of tin ions contained in the etching liquid L in the storage tank 11 can be constantly maintained. Below a certain level, 29 200912041, the etching liquid L can be kept in the same state as the new product. Although an example of the present invention has been described above, the specific embodiment that can be employed in the present invention is not limited to these. In the above example, after the eluent is passed, the washing liquid is passed through the portable container 1, but the treatment may be omitted. However, the eluent remaining in the inside of the portable container 1 in this case may cause a change in the composition of the money in the storage tank u. Further, when the transferable container is transported in the above-described step S3 or step S13, if the etching liquid L in the movable container is appropriately taken out, the weight of the movable type container 1 can be reduced and the conveyance can be easily performed. Further, the adsorbent recovery device 40 and the metal recovery device 7 may be configured as an adsorbent recovery device 66 and a metal recovery device 71 as shown in FIG. 5, and the adsorbent recovery device 66 and the metal recovery device 7I are provided: When the liquid is passed, the movable container 丨 is detachably attached to the mounting portion 67, and when the eluent passes, the detachable container i is detachably attached to the mounting portion 68. In this case, the eluent supply means 43 and the eluent recovery means 48 are attached to the mounting portion 67, the other end side of the eluent supply tube ^ and the eluent recovery tube 50. The other end side is connected to a supply unit (not shown) and a discharge unit (not shown) of the movable container 1 respectively. Further, when the eluent supply unit 53 and the cleaning liquid recovery unit 58 are attached to the mounting unit 68, the other end side of the cleaning liquid supply tube 55 and the other end side of the cleaning liquid recovery tube 60 are separately movable. A supply unit (not shown) of the container hopper is connected to a discharge unit (not shown). Further, the eluent supply chamber 30 200912041 47, the eluent recovery valve 51, and the cleaning liquid supply port 61 may be omitted. In addition, the ampoule 67, the elution, the nightingale: and the cleaning liquid recovery valve/ignorance liquid-passing mechanism 42 are used as the second-input device 65 of the patent-supplied towel, the cleaning liquid-passing mechanism 52 and the control device. It acts as the third device of the mounting unit 68. In the above-mentioned step S4 or step Sm, after the movable container i that has been transported in the domain is installed, the eluent is passed into the inside, from the mounting portion. 67 removed. Further, in the above step S6 or step S16, after the portable type W i through which the washing liquid passes is installed, the eluent is passed through the movable container and is removed from the mounting. Further, in the above example, the (iv) mounting i 25 may be constructed as follows: The movable capacity _ i is alternately replaced at a predetermined time interval, and at the same time, the etching liquid L in the storage tank 11 is passed through the movable container 丨The present invention is not limited thereto, and may be based on, for example, the number of substrates K etched in the substrate processing mechanism 12 or the concentration of indium ions or tin ions contained in the etching liquid L in the storage tank n. To switch the movable container 1 through which the etching liquid L is to pass. When switching control is performed based on the number of etching sheets of the substrate K, the substrate processing mechanism 12 further includes, for example, a sensor (not shown) disposed at an appropriate position such as outside or inside the processing chamber 13. And detecting the substrate K transported into the processing chamber 13 or the substrate K transported from the processing chamber 13; the control device 25 carries the output signal to the processing chamber based on the output signal obtained from the sensor (not shown) The number of substrates K in the chamber 13 or from the processing 31 200912041

腔室13所搬運中夕I 機構12中所桃 的片數、亦即計數在基板處理 枝構12中所蚀刻之基板K的片數,並且在計數的片數 :j預先設定的片數時,交替切換作爲通液對象二= 器1,同時,使貯左她tJ』移式谷 的任-方。二的韻刻液Lit過可移式容器1 ^ 控制裝置25在計數的片數達到預先# :數:重置4數值,再次計數至預先設Μ片數。 右㈣設置,則在計數的片數達到預先 亦即蝕刻片數達到中y虹 幻月数時, 片數,從而蝕刻片數達到既定片數 而達到推斷爲螯合材料(未 片數 時,切換各切換閥36、3 / ;飽和狀態的片數 過之可移式容器丨。 39,切㈣刻液L所要通 從而’即使這樣,也將 爲恒定,刻液L中含有二:的吸附能力維持 爲-定水平以下。 彳的銦離子或錫離子的濃度抑制 ” ’在基於銦離子濃度或錫離子濃度進行切換 :峨况時’該基板處理裝置1〇還具 檢测感測器(去m m 雕于/辰度The number of pieces of the peach in the I-mechanism 12 in the chamber 13 is counted, that is, the number of sheets of the substrate K etched in the substrate processing structure 12 is counted, and when the number of sheets counted is j: the number of sheets set in advance Alternately switch as the liquid-passing object II = device 1, and at the same time, make the left-side of her tJ"-shift valley. The second rhyme liquid Lit over the movable container 1 ^ The number of pieces counted by the control device 25 reaches the pre-#: number: resets the 4 value, and counts again to the preset number of pieces. In the right (four) setting, when the number of counted pieces reaches the number of pieces in advance, that is, when the number of etched pieces reaches the middle y rainbow, the number of etched pieces reaches a predetermined number of sheets and is inferred to be a chelating material (when the number of pieces is not Switching each of the switching valves 36, 3 / ; the number of sheets in the saturated state passes through the movable container 丨 39. The cutting (four) etched liquid L is to be passed, so that even if it is, it will be constant, and the immersion liquid L contains two: adsorption. The ability to maintain is below -the level. The concentration of indium or tin ions is suppressed. 'When switching based on indium ion concentration or tin ion concentration: the substrate processing device 1〇 also has a detection sensor ( Go to mm

中所a有Η π ’、W檢測貯存槽11内的蝕刻液L 在由:Ϊ 子濃度及/或錫離子濃度;該控制裝置25 由孟屬離子濃度檢測感測器 产月/忐組触ν V圖不)檢測出之姻離子濃 又及/或錫離子濃度比預先設 爲通液對象之可移式容器,,同時,::=替切換作 液L通過可移式容器i的任—方。子槽η内的敍刻 態,設置,則在螯合材料(未圖示)達到大致包含狀 離子或錫離子的吸附能力降低,且貯存槽" 32 200912041 _液L中所含之銦離子或錫離子漠度上 ^檢測感測器(未圖示)檢測的銦離子濃度金: 子浪度大於既定的基準值時,切換各切換間36、37、38 39,切換蝕刻液L所要通過之可移式容器1。 :二即使這樣’也將可移式容…吸附能 刻液"中含有的鋼離子或錫離子的濃度抑制 …水平以下。另外,在利用經過時間或钮刻片數進」 ::式容器1的切換控制的情況時,因基板處理機構:丁2 條件或作純刻對象之基板κ的種類等而溶解於 =液£的鋼或錫的溶解量會不同,因此,難以設定可移 式谷益1的螯合材料(未圖示)達到大致飽 間或钱刻片數’但通過基於貯存槽u ㈣爲=時 人—門的蚀刻液L中戶斤 ^鋼離子濃度及/或錫離子濃度進行可移式容^的切換 拴制,能夠高精度地實施該切換控制。 、 方通Γ二刻液/所要通過之可移式容〜不是僅任-方通液,而疋可以在安裝於第—安裝部31的可移式容 和安;於第二安裝部32的可移式容器丨兩者同時通液/ 的期n外’在上例中在基板處理機構12中姓刻基板K 為 1,使㈣液L不斷通過可移式容器H不限定於 ,亦可例如,在開始蝕刻處理後的 、 P弓η主 113呀間達到既定0# 二·、或基板Κ的餘刻片數成爲既定片、 内的麵刻液L中含有的銦離子或踢:貝丁存槽11 度時,使酿L通過應吸附细離子二=過既定濃 器”。另外,基板處理裝41。構成=離子的可移式容 再战爲犯夠安裝三個以上可 33 200912041 移式容器1的裝置亦可。 另外,在上例中,可移式容器1以能夠裝卸的方式安 裝於基板處理裝置10,但不限定於此,將可移式容器1以 能夠裝卸的方式安裝於包括該貯存槽11、蝕刻液通液機構 3〇及控制裝置25等之蝕刻液處理装置亦可。在該钮刻液 裝置中,蝕刻處理所使用之蝕刻液L從多個適當的槽(tank) 集聚於貯存槽11内後,吸附該貯存槽n内之蝕刻液L中 的金屬成分。而金屬成分吸附後之蝕刻液L係返回該各槽 内。 【圖式簡單說明】 圖1係用於說明本發明第一實施方式之蝕刻液再生方 法。 圖2係用於說明第一實施方式之蝕刻液再生方法的流 程圖。 圖3係表示第一實施方式中之基板處理裝置等的概略 結構。 圖4係表示第一實施方式中之吸附材料再生裝置等的 概略結構。 圖5係表示本發明其他實施方式中之吸附材料再生裝 置(金屬回收裝置)等的概略結構。 圖6係用於說明本發明第二實施方式之金屬回收方 法。 圖7係用於說明第二實施方式之金屬回收方法的流程 圖0 34 200912041 【主要元件符號說明】 I 可移式容器 10 基板處理裝置 II 貯存槽 12 基板處理機構 13 處理腔室 14 搬運輥 15 流通管 16 喷嘴體 20 蝕刻液循環機構 21 供給管 22 供給泵 23 回收管 25 控制裝置 30 蝕刻液通液機構 31 第一安裝部 32 第二安裝部 33 蝕刻液供給管 34 蝕刻液回收管 40 吸附材料再生裝置 41 安裝部 42 洗提液通液機構 43 洗提液供給機構 44 洗提液貯存桶 35 200912041 45 洗提液供給管 46 供給泵 48 洗提液回收機構 49 洗提液回收桶 50 洗提液回收管 52 清洗液通液機構 53 清洗液供給機構 54 清洗液貯存桶 55 清洗液供給管 56 供給泵 58 清洗液回收機構 59 清洗液回收桶 60 清洗液回收管 65 控制裝置 K 基板 L 名虫刻液 36In the middle, a has Η π ', W detects the etching liquid L in the storage tank 11 by: Ϊ concentration and/or tin ion concentration; the control device 25 is touched by the Meng ion concentration detecting sensor ν V diagram does not detect the concentration of the ion and/or the tin ion concentration ratio of the movable container previously set as the liquid-passing object, and at the same time::= for the switching liquid L through the movable container i -square. The etched state in the sub-slot η is set to reduce the adsorption capacity of the chelating material (not shown) to substantially contain ions or tin ions, and the indium ions contained in the storage tank " 32 200912041 _Liquid L Or the tin ion concentration on the detection sensor (not shown) detects the concentration of indium ions. Gold: When the sub-wavelength is greater than the predetermined reference value, the switching chambers 36, 37, 38 39 are switched, and the etching liquid L is switched. Removable container 1. :2 Even if this is the case, the concentration of steel ions or tin ions contained in the removable energy solution can be suppressed. In addition, in the case of switching control using the elapsed time or the number of button-cuts in the container type, the substrate processing mechanism is dissolved in the liquid solution by the condition of the substrate 2 or the type of the substrate κ which is a pure object. The amount of steel or tin dissolved will be different. Therefore, it is difficult to set the chelating material (not shown) of the movable gluten to reach a substantially saturated or money-sliced number but by the storage tank u (four) = In the etching liquid L of the door, the steel ion concentration and/or the tin ion concentration are switched, and the switching control can be performed with high precision. , Fang Tongyu 2 engraved liquid / removable capacity to be passed ~ not only - square liquid, and the crucible can be installed in the first mounting portion 31 of the removable capacity and the second mounting portion 32 In the above example, the substrate K is 1 in the substrate processing mechanism 12, and the (4) liquid L is continuously passed through the movable container H, and may be For example, after the etching process is started, the P-rug main 113 reaches a predetermined 0#2, or the number of the remaining sheets of the substrate 成为 becomes indium ions or kicks contained in the surface engraving liquid L in the predetermined sheet. When the Ding Slot is at 11 degrees, the brewing L is passed through the fine ion to be adsorbed by the second concentrator. In addition, the substrate processing device 41. The transferable structure constituting the ion is enough to install more than three. 33 200912041 In the above example, the portable container 1 is detachably attached to the substrate processing apparatus 10, but the present invention is not limited thereto, and the portable container 1 is detachably mounted. The etching liquid processing apparatus installed in the storage tank 11, the etching liquid liquid passage mechanism 3, the control device 25, and the like may be In the button engraving device, the etching liquid L used in the etching process is collected from the plurality of appropriate tanks in the storage tank 11, and then the metal component in the etching liquid L in the storage tank n is adsorbed. The etching liquid L after the adsorption of the metal component is returned to the respective grooves. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view for explaining an etching liquid regeneration method according to a first embodiment of the present invention. Fig. 2 is a view for explaining the first embodiment. Fig. 3 is a schematic view showing a configuration of a substrate processing apparatus and the like in the first embodiment. Fig. 4 is a view showing a schematic configuration of an adsorbent regenerating apparatus and the like in the first embodiment. Fig. 6 is a view for explaining a metal recovery method according to a second embodiment of the present invention. Fig. 7 is a view for explaining metal recovery according to a second embodiment of the present invention. Flow chart of the method 0 34 200912041 [Explanation of main component symbols] I Removable container 10 Substrate processing apparatus II Storage tank 12 Substrate processing mechanism 13 Processing chamber 14 Transport roller 15 Flow Pipe 16 nozzle body 20 etching liquid circulation mechanism 21 supply pipe 22 supply pump 23 recovery pipe 25 control device 30 etching liquid liquid passage mechanism 31 first mounting portion 32 second mounting portion 33 etching liquid supply pipe 34 etching liquid recovery pipe 40 adsorption Material regeneration device 41 Mounting portion 42 Eluent liquid supply mechanism 43 Eluent supply mechanism 44 Eluent storage tank 35 200912041 45 Eluent supply pipe 46 Supply pump 48 Eluent recovery mechanism 49 Eluent recovery tank 50 Wash Liquid recovery pipe 52 cleaning liquid liquid supply mechanism 53 cleaning liquid supply mechanism 54 cleaning liquid storage tank 55 cleaning liquid supply pipe 56 supply pump 58 cleaning liquid recovery mechanism 59 cleaning liquid recovery tank 60 cleaning liquid recovery pipe 65 control device K substrate L name Insect fluid 36

Claims (1)

200912041 十、申請專利範困: 人右^種處理液再生方法’其係用以再生因基板處理而 3有金屬成分之處理液,其特徵在於,包括: 處理液再生步驟’係在進行該基板處理的處理區域中, 使該處理液通過内部填充有吸附金屬離子的吸附材料的可 移式容器1 ’將該處理液中的金屬成分吸附於該吸 以進行分離、除去; f \200912041 X. Patent application: The method for regenerating a human right treatment liquid is used to regenerate a treatment liquid having a metal component due to substrate processing, and is characterized in that: the treatment liquid regeneration step is performed on the substrate In the treated treatment zone, the treatment liquid is passed through a movable container 1' filled with an adsorption material for adsorbing metal ions, and the metal component in the treatment liquid is adsorbed to the suction to be separated and removed; 第一搬運步驟,係將經通過該處理液的可移式容器搬 運至與該處理區域分隔之區域、即再生該吸附材料 材料再生‘區域; ’ 吸附材料再生步驟,係在該吸附材料再生區域中,使 洗提液通過從該處理區域所搬運出的可移式容器内,對吸 附於該吸附材料之金屬進行洗提,將該吸附材料再生; 第二搬運步驟,係將再生了該吸附材料的可移式容器 k S玄吸附材料再生區域返送至該處理區域, 在該處理液再生步驟中,使用吸附材料再生後的可移 式容器。 2. 如申請專利範圍第1項之處理液再生方法,其中, 在该吸附材料再生步驟中,使該洗提液通過後,使清 洗液通過該可移式容器内以清洗其内部。 3. 如申請專利範圍第1項之處理液再生方法,其中, 在該可移式谷器形成:用於將該處理液及洗提液供給 至内部之供給部、和用於將從該供給部供給至内部的處理 液及洗提液排出至外部之排出部;且 37 200912041 在該處理液再生步財,使料1通液裝置,該第! 通液裝置具備:以能夠裝卸的方式連接於該可移式容器供 給部並供給該處理液之處理液供給管、和以能夠裝卸的方 式連接於該可移式容器排㈣並回㈣處理液 收管; 並且,使該處理液供給管與該供給部連接、使該處理 液回收管與該排出料接後,使該處理液以從該供給部向 遠可移式容器的内部流入而從該排出部排出的方式通液, 然後’從該供給部卸下該處理液供給管、從該排出部奸下 该處理液回收管; 2 =吸附材料再生步驟中,使用,2通液褒置,該第 u &置具備•以能夠&卸的方式連接於該可移式容器 供給部並供給該洗提液之洗提液供 _ι,^ M旎夠裝卸的 式連接於該可移式容器排出部並 回收管; "^文忒洗提液的洗提液 並且,使該洗提液供給管與該供給部連接 液回收管與該排出部連接後,使該洗提液 = 後,而從該排出部排出方式通液,缺 “ 、、。部卸下該洗提液供給管、從該排出呷卸下兮 洗提液回收管。 钟®邛卸下该 4·如申請專利範圍第2項之處理液再生方法,, 在該可移式容器形成:用於將該處理 洗液供給至内邱夕# π A 冼k液及清 t、給、和用於將從該供 部的處理液、法媳% ± 、D 4供給至内 夜洗棱夜及清洗液排出至外部之排出部;且 38 200912041 在該處理液再生步驟中,使用第1通液裝置,該第【 通液裝置具備:以能夠裝卸的方式連接於該可移式容器供 給部並供給該處理液之處理液供給管、和以能夠裝:的; 式連接於該可移式容器排出部並回收該處理液之處 收管; 液口 該處理液供給管與該供給部連接,使該處理 與錢出部連接後,使該處理液以從該供給部向 二入而從該排出部排出的方式通液, 該處理該處理液供給管’從該排出部卸下 ==再生步驟中,使用第2通液裂置,該第 仏給部並供給該洗提 移式谷态 的方式連接給管、和以能夠裝卸 液之回收管可移式容器排出部並回收該洗提液及清洗 v 排二接管㈣供給部連接,使該回收管與該 的内部流入而從該::提液以從該供給部向該可移式容器 洗液以從該供給部排出的方式通液,接著,使該清 部排出的方式通液以了移式谷益的内部流入而從該排出 收:後,從該供給部卸下該供給管,從 5.如申請專利範圍第 在該可移式容器形成:用;U虚生方法,其令, 洗液供給至内部之將該處理液、洗提液及清 卜和用於將從該供給部供給至内 39 200912041 部的處理液、洗提液及清洗液排出至外部之 在該處理液再生步驟中,使用第】通液裝置,, 通液裝置具備··以能夠褒卸的方式連接於該 : 給部並供給該處理液之 式合器供 式連接於該可移式容,排出、和以能夠裝卸的方 收管; “排出部並回收該處理液之處理液回 並且,使該處理液供給管與該供給部 液回收管與該排出部連接後,使該處理液以從談理 該可'式容器的内部流入而從該排出部排出的二;=向 該處理液回收管; “、給e,從該排出部卸下 在該吸附材料再生步驟中,係使用第 第3通液裝置’該第2通液襄置具備:以能夠:f置以及 連接於該可移式容器供給部並供給該洗提液^2的方式 管、和以能夠裝卸的方式連接於該可移式容器排::給 收該洗提液之洗提液回收管; 纟出邛並回 該第3通液裝置具備:以能夠裝却 移式容器供給部並供給該清洗液之清洗液供:其於該可 夠裝卸的方式連接於該可移式容器排出部二二i口以能 之清洗液回收管; 收該h洗液 首先,使該洗提液供給管與該供給 液回收管與該排出部連接,使該洗提U從洗提 可移式容器的内部流入而從該排出部排出的;:::向該 後,從a亥供給部却下該洗提液供 7、,然 從4排出部卸下該 200912041 洗提液回收官’接著’使該清洗液供給管與該供給部連接, 使該清洗液回收管與該排出料接,使該清洗液以從該供 給部向内部流入而從該排出部排出的方式通液後,從該供 給部卸下該清洗液供給管,從該排出部卸下該清洗液回收 管。 , 6.—種處理液所含金屬之回收方法,其係用以回收因 基板處理而含於處理液中之金屬成分,其特徵在於: 使用内部填充有吸附金屬離子的吸附材料的可移式容 在進行該基板處理之處理區域中’使該處理液通過該 可移式谷器内’將遠處理液中的金屬成分吸附於該吸附材 料; 接著,將a亥可移式容器搬運至與該處理區域分隔之回 收該金屬成分的回收區域; 接著’在該回收區域中,進行使洗提液通過該可移式 谷器内並對吸附於該吸附材料的金屬進行洗提之處理、和 從通過的洗提液回收洗提的金屬之處理, 然後,將該可移式容器從該回收區域返送至該處理區 域以再使用。 十一、圖式: 如次頁 41The first transporting step is carried out by transporting the transportable container through the treatment liquid to a region separated from the treatment region, that is, regenerating the adsorbent material material regeneration region; 'the adsorbent material regeneration step is in the adsorbent material regeneration region The eluent is eluted from the metal adsorbed on the adsorbent by a removable container transported from the treatment zone to regenerate the adsorbent; and the second transport step regenerates the adsorbent The material-transportable container k S meta-adsorbed material regeneration region is returned to the treatment region, and in the treatment liquid regeneration step, the movable container after regeneration using the adsorbent material is used. 2. The treatment liquid regeneration method according to claim 1, wherein in the adsorption material regeneration step, after the eluent is passed, the cleaning liquid is passed through the movable container to clean the inside. 3. The treatment liquid regeneration method according to the first aspect of the invention, wherein the movable type tank is formed with: a supply unit for supplying the treatment liquid and the eluent to the inside, and for supplying from the supply The processing liquid and the eluent supplied to the inside are discharged to the external discharge unit; and 37 200912041 In the process liquid regeneration, the material 1 is passed through the liquid, and the first! The liquid-passing device includes a processing liquid supply pipe that is detachably connected to the movable container supply unit and supplies the processing liquid, and is detachably connected to the movable container row (four) and returned to the (four) processing liquid. Further, after the processing liquid supply pipe is connected to the supply unit and the processing liquid recovery pipe is connected to the discharge material, the processing liquid flows from the supply unit to the inside of the remotely movable container. The discharge portion is discharged to discharge the liquid, and then the treatment liquid supply pipe is removed from the supply portion, and the treatment liquid recovery pipe is scraped from the discharge portion. 2 = the adsorbent material regeneration step is used, and the 2 liquid supply device is used. The first u & is provided with an eluent that can be connected to the portable container supply unit and can be supplied to the removable container supply unit, and is attached to and detachable from the eluent Disposing the container discharge portion and collecting the tube; "^ the eluent of the eluate eluate and connecting the eluent supply tube and the supply portion connection liquid recovery tube to the discharge portion, and then eluent After the discharge from the discharge section In the absence of the ",", the eluent supply pipe is removed, and the eluent recovery pipe is removed from the discharge port. The clock® is removed. The process liquid regeneration method according to item 2 of the patent application scope is Forming in the movable container: for supplying the treatment liquid to the inner qi # A 冼 k liquid, clearing, giving, and processing liquid for the supply from the supply portion, % D 4 is supplied to the inner night washing edge and the discharge portion discharged to the outside by the cleaning liquid; and 38 200912041 in the processing liquid regeneration step, the first liquid passing device is used, and the [liquid discharging device is provided in a detachable manner a treatment liquid supply pipe connected to the movable container supply unit and supplying the treatment liquid, and a tube that can be attached to the movable container discharge unit and collect the treatment liquid; The treatment liquid supply pipe is connected to the supply unit, and after the treatment is connected to the money discharge unit, the treatment liquid is passed through the supply unit to be discharged from the discharge unit, and the treatment liquid supply tube is processed. 'Removal from the discharge section==Regeneration step, use the second The liquid is cleaved, the third feeding portion is connected to the pipe and supplied to the pipe, and the discharge pipe removable container discharge portion is capable of loading and unloading the liquid, and the eluent and the cleaning v row are taken over. (4) the supply unit is connected, and the collection pipe and the inside of the collection pipe are flowed in from the :: the liquid is supplied to the movable container from the supply portion to be discharged from the supply portion, and then the liquid is discharged. In the method of discharging the portion, the liquid is discharged from the supply portion by the internal inflow of the transfer type, and the supply tube is removed from the supply portion, and is formed in the movable container as in the patent application scope: The U-deficiency method, which supplies the treatment liquid, the eluent, and the cleaning liquid to the inside, and supplies the treatment liquid, the eluent, and the cleaning liquid for supplying the liquid to the inside from the supply unit. In the process liquid regeneration step, the first liquid supply device is used, and the liquid supply device is provided with a detachable connection to the donor unit and the supply unit. For the removable capacity, discharge, and for loading and unloading "Receiving the pipe; and collecting the treatment liquid of the treatment liquid, and connecting the treatment liquid supply pipe and the supply portion liquid recovery pipe to the discharge portion, and then making the treatment liquid The inside of the container flows in and is discharged from the discharge portion; = to the treatment liquid recovery pipe; ", e is removed from the discharge portion, and the third liquid supply device is used in the adsorbent regeneration step" The second liquid passing device includes a tube that can be placed in the movable container supply unit and supplied to the removable container supply unit, and is detachably connected to the movable container row: : an eluent recovery pipe for receiving the eluent; and the third liquid transfer device is provided with: a cleaning liquid capable of loading the transfer container supply unit and supplying the cleaning liquid: The cleaning liquid recovery pipe is connected to the movable container discharge portion and the cleaning liquid recovery pipe; the h washing liquid is firstly connected, and the eluent supply pipe and the supply liquid recovery pipe are connected to the discharge portion. , allowing the elution U to flow from the interior of the eluting portable container After the discharge portion is discharged::: After that, the eluent supply unit 7 is removed from the a-hai supply unit, and the 200912041 eluent recovery unit is then removed from the 4 discharge unit. The supply unit is connected to the discharge unit, and the cleaning liquid is connected to the discharge material, and the cleaning liquid is discharged from the supply unit to be discharged from the discharge unit, and then the cleaning unit is detached from the supply unit. The liquid supply pipe removes the cleaning liquid recovery pipe from the discharge portion. 6. A method for recovering a metal contained in a treatment liquid for recovering a metal component contained in a treatment liquid by a substrate treatment, characterized in that: a movable type using an adsorption material internally filled with adsorbed metal ions Having the metal component in the remote treatment liquid adsorbed to the adsorption material in the treatment region where the substrate treatment is performed, and then transferring the metal component in the remote treatment liquid to the adsorption material; The treatment area separates the recovery area of the metal component; and then 'in the recovery area, the eluent is passed through the movable trough and the metal adsorbed to the adsorbent is eluted, and The treatment of the eluted metal is recovered from the passed eluate, and then the removable container is returned from the recovery area to the treatment area for reuse. XI. Schema: as the next page 41
TW097114102A 2007-05-10 2008-04-18 Regenerative method of processing fluid and reclaiming method of metals contained therein TW200912041A (en)

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