200910501 九、發明說明： 【發明所屬之技術領域3 發明領域 本發明係有關於一種部件轉送系統。尤其是，本發明 5 係有關於部件轉送系統的一饋入裝置，其在部件轉送系統 之操作中用以饋入薄且扁平的面板，如半導體封裝。 【先前技術3 發明背景 備有一拾取及置放機構的自動機器常使用真空吸盤拾 10 取部件及氣壓氣缸轉送部件至其他位置。基本上，拾取及 置放機構由一垂直行程氣缸及一水平轉送氣缸構成，其執 行拾取的動作，俾以接合及鬆卸部件並轉送部件。部件轉 送之速度藉由控制氣壓氣缸之節流閥而被控制。 使用拾取及置放機構有一些缺點。首先，拾取及置放 15 步驟之回程行程無法攜帶任何部件，因此，實際的工作僅 為工作週期的一半，因而造成整個工作效率之損失。第二 點，節流閥須要完全地被打開，俾以允許較足夠的空氣在 該機構以高速操作拾取及置放步驟之前進入，如此會在每 一個氣缸衝程結束時造成很大的衝擊。雖然吸震器備置在 20 氣缸之兩端，然而，高且長的衝擊會降低氣缸之壽命，以 及故障率之間的平均時間（MTBF)。第三點，在各衝程結束 時感受的突然之衝擊會傳遞至被拾取的部件，因而皮帶給 它們不良的影響。 一種習知的方法係使用以電腦輔助的製造（C A Μ)系統 5 200910501 驅動機構。在此種機構中亦使用真空吸盤拾取及轉送部 件。此種CAM系統驅動機構之轉送速度依據驅動CAM系統 的一馬達之速度而定。然而，在轉送部件中所執行的工作 亦為工作週期的一半，因為回程行程無法攜帶任何部件。 5 上述缺點在輸送十分堅硬且薄的部件，譬如半導體封 裝件的狀況下十分嚴重，因為其去框過程中，封裝件必須 被拾取及置放。此種部件大體上製造成具有一扁平頂表面 的薄板，且易遭受外力及衝擊的傷害。 美國專利6,733,006與用以經由負壓拾取封裝之可轉動 10 氣壓饋入頭有關。該種饋入頭備置一空氣閥，其可在氣壓 不再需要時開或關上負壓。然而，熟悉此技藝人士均知此 種配置係用以轉送具可撓性的薄片。 L發明内容；3 概要 15 依據一特徵，本發明備置用以饋入堅硬部件之一饋入 裝置，該裝置包括一滑輪，其可操作，俾以繞著一轴轉動； 以及經由一中空軸可轉動地架設在滑輪臂上的一套管，該 套管界定數個貫穿孔，俾以通過中空轴，為連續吸力提供 空氣通路，其中該套管被驅動，俾以被驅動器滑輪轉動， 20 其中滑輪臂可繞著與驅動器滑輪共軸的軸轉動，藉此，驅 動器滑輪的轉動獨立於滑輪臂的轉動之外。 依據一實施例，驅動器滑輪可為一驅動器馬達所驅 動。驅動器滑輪可經由一皮帶驅動套管以使其轉動。該皮 帶可為具有一體成型之齒輪的一正時皮帶。該正時皮帶可 200910501 具有數個孔，各對應於套管的一貫穿孔，且套管可為一其 上界定數個貫穿孔的滑輪。該皮帶亦可界定數個對應於滑 輪之貫穿孔的孔。在此實施例中，套管可以一滑輪連接， 而滑輪可操作，以經由皮帶被驅動器滑輪轉動而驅動。 5 依據另一實施例，用於備置連續吸力的空氣通路可調 整成面對堅硬的部件。此外，中空轴可靜止地連接至滑輪 臂。 依據另一實施例，中空轴連接至一真空泵，以備置吸 力。 10 依據另一實施例，備置自一位置轉送堅硬部件至另一 位置的一部件轉送系統，該裝置包括一部件裝載器，其用 以裝載擬轉送的堅硬部件；一輸送器，其輸送擬轉送之部 件至另一位置；以及一饋入總成，其自部件裝載器饋入擬 轉送的部件至輸送器。該饋入裝置包括一滑輪臂；架設在 15 滑輪臂上的一驅動器滑輪，該驅動器滑輪可操作，俾以繞 著一轴轉動；以及一套管，其可操作地經由一中空軸架設 在滑輪臂上，該滑輪界定數個貫穿孔，俾以備置通過中空 轴之連續吸力的空氣通路，其中套管被驅動器滑輪驅動， 俾以轉動；其中滑輪臂可繞著與驅動器滑輪共軸的轉動， 20 藉此，驅動器滑輪的轉動獨立於滑輪臂轉動之外。 依據一實施例，驅動器滑輪可被一驅動器滑輪驅動。 驅動器滑輪可經由一皮帶驅動套管。皮帶可為具有一體成 型之齒輪的一計時皮帶。該計時皮帶可具有數個孔，各孔 對應於套管的一貫穿孔，而套管可為其上界定數個的貫穿 7 200910501 孔一滑輪。皮帶亦可界定數個對應於滑輪之貫穿孔的孔。 在此實施例中，套管可與一滑輪連接，而滑輪可經由皮帶 被驅動器滑輪驅動而轉動。 依據—實施例，用以備置連續吸力的空氣通路可調整 5成面對堅硬部件。此外’中空轴可靜止地連接至滑輪臂。 依據一實施例，中空軸連接至一真空泵，以備置吸力。 圖式簡單說明 本發明將配合圖式及非限制性的實施例詳加說明。 第1圖顯示依據本發明的一實施例之一部件轉送系統 10 的橫截面側視圖；以及 ' '200910501 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a component transfer system. In particular, the present invention is directed to a feedthrough for a component transfer system for feeding a thin, flat panel, such as a semiconductor package, during operation of the component transfer system. [Prior Art 3 BACKGROUND OF THE INVENTION Automatic machines equipped with a pick-and-place mechanism often use a vacuum chuck to pick up components and pneumatic cylinder transfer components to other locations. Basically, the pick-and-place mechanism consists of a vertical stroke cylinder and a horizontal transfer cylinder that performs a picking action to engage and unload components and transfer the components. The speed at which the components are transferred is controlled by controlling the throttle of the pneumatic cylinder. There are some disadvantages to using pick and place mechanisms. First, the return stroke of the 15 steps of picking and placing cannot carry any parts, so the actual work is only half of the work cycle, resulting in a loss of overall work efficiency. Second, the throttle valve needs to be fully opened to allow more air to enter before the mechanism operates the pick and place step at high speed, which can cause a large impact at the end of each cylinder stroke. Although the shock absorber is placed at both ends of the 20 cylinders, high and long impacts reduce the life of the cylinder and the mean time between failures (MTBF). Third, the sudden impact felt at the end of each stroke is transmitted to the picked parts, and the belt gives them a bad influence. One conventional method uses a computer-aided manufacturing (C A Μ) system 5 200910501 drive mechanism. Vacuum chuck picking and transfer parts are also used in such organizations. The transfer speed of such a CAM system drive mechanism is dependent on the speed of a motor that drives the CAM system. However, the work performed in the transfer unit is also half the duty cycle because the return stroke cannot carry any parts. 5 The above disadvantages are severe in the case of very hard and thin components, such as semiconductor packages, because the package must be picked up and placed during the frame removal process. Such a component is generally fabricated as a thin plate having a flat top surface and is susceptible to external forces and impacts. U.S. Patent 6,733,006 relates to a rotary 10 air pressure feed head for use in a vacuum pick-up package. The feed head is provided with an air valve that opens or closes the negative pressure when the air pressure is no longer needed. However, those skilled in the art are aware that such a configuration is used to transfer a flexible sheet. According to a feature, the present invention provides a feeding device for feeding a rigid member, the device comprising a pulley operable to rotate about an axis; and via a hollow shaft a sleeve rotatably mounted on the pulley arm, the sleeve defining a plurality of through holes for providing an air passage for continuous suction through the hollow shaft, wherein the sleeve is driven to be rotated by the drive pulley, 20 The pulley arm is rotatable about an axis coaxial with the drive pulley whereby the rotation of the drive pulley is independent of the rotation of the pulley arm. According to an embodiment, the drive pulley can be driven by a drive motor. The drive pulley can be rotated by a belt drive sleeve. The belt may be a timing belt having integrally formed gears. The timing belt 200910501 has a plurality of holes, each corresponding to a consistent perforation of the sleeve, and the sleeve can be a pulley on which a plurality of through holes are defined. The belt can also define a plurality of apertures corresponding to the through holes of the runner. In this embodiment, the sleeves can be connected by a pulley and the pulleys are operable to be driven by the drive pulleys via the belt. According to another embodiment, the air passage for providing continuous suction can be adjusted to face a hard component. In addition, the hollow shaft can be statically coupled to the pulley arm. According to another embodiment, the hollow shaft is coupled to a vacuum pump for suction. 10 According to another embodiment, a component transfer system for transferring a rigid component from one location to another is provided, the device comprising a component loader for loading the hard component to be transferred; and a conveyor for transporting the intended transfer The component is moved to another location; and a feed assembly that feeds the component to be transferred from the component loader to the conveyor. The feedthrough device includes a pulley arm; a driver pulley erected on the 15 pulley arm, the driver pulley is operable to rotate about an axis; and a sleeve operatively mounted on the pulley via a hollow shaft On the arm, the pulley defines a plurality of through holes for arranging an air passage through the continuous suction of the hollow shaft, wherein the sleeve is driven by the drive pulley to rotate; wherein the pulley arm is rotatable coaxially with the drive pulley, 20 Thereby, the rotation of the drive pulley is independent of the rotation of the pulley arm. According to an embodiment, the drive pulley can be driven by a drive pulley. The drive pulley can drive the sleeve via a belt. The belt can be a timing belt with integrally formed gears. The timing belt can have a plurality of apertures, each aperture corresponding to a consistent perforation of the sleeve, and the sleeve can define a plurality of pulleys therethrough through the holes of 200910501. The belt may also define a plurality of apertures corresponding to the through holes of the pulley. In this embodiment, the sleeve can be coupled to a pulley that can be rotated by the drive pulley via the belt. According to the embodiment, the air passage for preparing the continuous suction can be adjusted to face the hard part by 50%. Furthermore, the hollow shaft can be statically connected to the pulley arm. According to an embodiment, the hollow shaft is coupled to a vacuum pump to provide suction. BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in detail in conjunction with the drawings and non-limiting embodiments. 1 shows a cross-sectional side view of a component transfer system 10 in accordance with an embodiment of the present invention; and ' '
第2圖顯示幻圖之部件轉送系統的部份的—放 【實施方式;J 實施例之詳細說明 15 依據上逑簡要說明，以下說明本發明的數個特定及可 選擇的實關，藉以瞭解本發明的新穎特徵。_，㈣ 此技藝人士騎在不_料些特定㈣下實施本發^ 該些細節中的-些細節未詳細地朗，俾以模糊化本發 明。為便於，，圖式巾使料同的標號代表共同或類似 的裝置。 2〇 讀明備置用於—部件轉送系統的饋人裝置。入 裝置包括用以架設-驅動滑輪以及一真空滑輪的一可_ 臂。可選擇地，該驅動滑輪驅動真空滑輪轉動。該真空滑 輪備置一連續的真空吸力，以靠著它升高擬傳送的部Γ 而真空滑輪的轉動自-位置拉動至另—位置。在操作時， 200910501 臂可維持在饋入裝置上枢轉。本發明特別適於饋入易於受 撞擊的堅硬部件。 第1圖顯示依據本發明的一實施例的一部件轉送系統 100之一橫截面圖。該饋入裝置適於輸送半導體封裝件101 5 至一切割裝置（未顯示），以便去框。為方便起見，在以下說 明中，半導體封裝件101以可稱為''部件〃。部件轉送系統 100包括一部件裝載器110、一輸送器120以及一饋入總成 130。部件裝載器110包括用以裝載一疊半導體封裝件101的 一室112，以及用以升高半導體封裝件101，以自室112中彈 10 出的一升高器114，室112具有一頂開口 113，而頂開口 113 的邊緣之一界定一通路，該通路允許半導體封裝件101藉由 相對於室112的一大體水平移動自其中彈出。升高器114可 在室112中，以一控制器（未顯示）所控制的一預定速度垂直 地移動。當升高器114向上移動時，裝載的半導體封裝件101 15 朝向開口 113向上升起，以自室112中彈出。半導體封裝件 101藉由替換裝載半導體封裝件101的另一室112再裝載至 部件裝載器110上。輸送器120為部件裝載器110所定位，其 中輸送器120之一端載室112的通路115之前方，半導體封裝 件101自室112彈出，通過通路115，並輸送至輸送器120的 20 另一端。輸送器120包括兩個可選擇地以同一方向轉動的兩 個滑輪122，以及形成繞著滑輪122轉動的一連續環的一輸 送皮帶121。當輸送器120開起後，滑輪122(以及輸送皮帶） 以順時鐘方向轉動，在輸送皮帶121上的物品（即此實施例 的半導體封裝件101)向前移動（第1圖中自左向右）。 9 200910501 再參看第1圖，饋入總成130包括一滑輪臂本體Hi、一 驅動滑輪132、一拉緊器133、一正時皮帶134以及一真空滑 輪150。饋入總成130大體上架設在輸送器120上’而輸送器 120具有稍許地在開口 133的通路115上延伸的一部份，俾以 5 允許與半導體封裝件101之接觸。滑輪臂本體131作為用以 支撐驅動滑輪132、一拉緊器133以及真空滑輪150於部件轉 送系統100上的一架設框架。滑輪臂本體131在部件轉送系 統100上枢轉，俾以允許饋入總成130的該延伸部份繞著一 柩軸轉動。驅動滑輪132可轉動地與枢軸共軸地架設，使得 10 滑輪臂本體131的轉動獨立於驅動滑輪132轉動之外。驅動 滑輪132連接至一驅動馬達（未顯示）。一止擋器136備置在滑 輪臂本體131的底部’用以限制饋入總成130的轉動，使得 饋入總成130可靜止在一適當位置，以操作部件轉送系統 100。止擋器136亦可阻止饋入總成130過度的擺動。真空滑 15輪150自在滑輪臂130的延伸部上（以及滑輪臂本體131)，經 由一中空軸152轉動。真空滑輪150的轉動經由正時皮帶 134 ’為驅動滑輪132所遙遠地驅動。另在驅動滑輪132及真 空滑輪150之間備置一拉緊器133，其用以拉緊正時皮帶134 熟悉此技藝人士可瞭解到驅動滑輪132及真空滑輪15〇具有 20 一體成型的齒部丨38、154,且其輪廓可與正時皮帶134連接。 第2圖顯示第1圖之真空滑輪150的一放大截面圖。真空 滑輪150在滑輪臂本體131上樞轉，而其本體的部份自滑輪 臂本體131暴露出，使得當饋入總成no在一靜止位置時， 真空滑輪150(正時皮帶134)與半導體封裝件101接觸。樞轉 10 200910501 真工/月輪150的中空轴152具有向下面對室ιΐ2的一空氣通 路155。二氣通路155面對的方向亦面對真空滑輪150的暴露 4伤在真空滑輪150的一體成型的齒部丨54之間的各切口 156界定用以與空氣通路⑸對齊的—貫穿孔157。依據空氣 5通路155的尺寸，同時可備置與空氣通路155對齊的數個貫 穿孔157對應地，在正時皮帶134的各一體成型的齒部139 上備置一孔，使得當一體成型的齒部154與一體成型的齒部 139嚙接時’它自中空軸152通過空氣通路155，以及對齊的 貝牙孔157及正時皮帶134的孔形成一空氣通路。中空軸152 10通過一具可撓性管直接連接至一真空產生器。 再參看第2圖，完全地裝載在室112中的半導體封裝件 101定位在部件裝載器110上。當部件轉送系統100起動後， 驅動滑輪132轉動’俾以經由正時皮帶134驅動真空滑輪 150。真空產生器藉由通過真空滑輪150的空氣通路撤出空 15氣而形成一負壓。同時，升高器114朝向室112的開口113升 起成疊的半導體封裝件101。當最高的半導體封裝件101升 起’至通路115所界定的一高度時，真空滑輪15〇與最高的 半導體封裝件1〇1接觸。真空滑輪150開始饋入半導體封裝 件101至輸送器12〇的另一側，以便去框。當真空滑輪15〇轉 20動時，正時皮帶134藉由摩擦力饋入半導體封裝件101，俾 以引導半導體封裝件101至輸送器120。負壓（吸力）另靠著 正時皮帶134升起半導體封裝件1〇1，以在部件轉送時備置 一較佳的握力。在操作時，饋入總成130可繞著與驅動滑輪 13 2共袖的柩抽維持轉動。 200910501 再參看第2圖，真空滑輪150適於在整個操作過程中備 置連續的沒力。因此，中空軸152的空氣通路155須要相對 於孔157的_大的開σ，俾以在真空滑輪i5G轉動時提供連 續的空氣通路。如圖中所示，空氣通路155的週邊同時涵蓋 5大約四個貫穿孔157，亦即，當真空滑輪15〇轉動，而真空 滑輪150保持靜止時。為在整個操作過程中，維持持續的汲 力’以升起擬傳送的部件，中空軸⑸靜態地連接至滑輪臂 本體13卜使得中妹152的空氣通路155大體上面向下;9亦 即，朝向部件裝載器no。此外，真空滑輪15〇的饋入速度， 1〇以及升高器114的升起速度被控制，以備置一平順的轉換。 再參看第1圖，部件轉送系統⑽構形成可儘可能地減 加在半導體封裝件1G1上的重量，以防止部件之受損。 因此，饋入總成130的各構件由輕的材料，譬如，鋁製成。 此外，由於驅動馬達非直接地連接至真空滑輪15Q，施加在 15 j導體封裝件⑻上的重量可維持十分地小。在操作時升 高器機114構形成可以—連續方式升起半導體封裂件10卜 由於饋入總成130在部件轉送系統1〇〇上枢轉，當升高器ιΐ4 升起半導體封裝件101時，饋入總成13〇不會在半導體封裝 件101上施加額外的力量。當升高器114升起，若真空滑輪 2〇⑽無法饋入半導體封裝件1〇1至輸送器⑵，以造成半導體 封裝件1011集在部件裝載器nG上時’真空滑輪⑼因此升 ，，以阻止額外的力量施加在半導體封裝件如上。因此， 當升尚器114之升起速度超過平順的轉換所須的速度，真空 ⑺輪H0因而升起。相似地，當饋入速度下降至平順的轉換 12 200910501Figure 2 shows the part of the component transfer system of the magic map. [Embodiment; Detailed Description of the J embodiment 15 According to the brief description of the above, the following describes several specific and optional realities of the present invention, so as to understand A novel feature of the invention. _, (d) The skilled person rides on the specifics of the present invention. The details are not detailed in detail to obscure the present invention. For convenience, the reference numerals of the drawings represent the same or similar devices. 2〇 Read the feeder for the component transfer system. The entry device includes an arm for erecting the drive pulley and a vacuum pulley. Optionally, the drive pulley drives the vacuum pulley to rotate. The vacuum pulley is provided with a continuous vacuum suction to raise the portion to be conveyed by it and the rotation of the vacuum pulley is pulled from the position to the other position. In operation, the 200910501 arm can remain pivoted on the feedthrough. The invention is particularly suitable for feeding hard components that are susceptible to impact. 1 shows a cross-sectional view of a component transfer system 100 in accordance with an embodiment of the present invention. The feedthrough is adapted to transport the semiconductor package 101 5 to a cutting device (not shown) for de-frame. For the sake of convenience, in the following description, the semiconductor package 101 may be referred to as a ''component". Component transfer system 100 includes a component loader 110, a conveyor 120, and a feed assembly 130. The component loader 110 includes a chamber 112 for loading a stack of semiconductor packages 101, and a riser 114 for raising the semiconductor package 101 to be ejected from the chamber 112. The chamber 112 has a top opening 113. One of the edges of the top opening 113 defines a via that allows the semiconductor package 101 to be ejected therefrom by a substantial horizontal movement relative to the chamber 112. The riser 114 is vertically movable in the chamber 112 at a predetermined speed controlled by a controller (not shown). When the riser 114 moves upward, the loaded semiconductor package 101 15 rises toward the opening 113 to be ejected from the chamber 112. The semiconductor package 101 is loaded onto the component loader 110 by replacing another chamber 112 in which the semiconductor package 101 is loaded. The conveyor 120 is positioned for the component loader 110, wherein one of the conveyors 120 is in front of the passage 115 of the carrier 112, the semiconductor package 101 is ejected from the chamber 112, passes through the passage 115, and is delivered to the other end of the conveyor 120. The conveyor 120 includes two two pulleys 122 that are selectively rotatable in the same direction, and a conveyor belt 121 that forms a continuous loop that rotates about the pulley 122. When the conveyor 120 is opened, the pulley 122 (and the conveyor belt) is rotated in the clockwise direction, and the article on the conveyor belt 121 (i.e., the semiconductor package 101 of this embodiment) is moved forward (from left to right in Fig. 1) right). 9 200910501 Referring again to FIG. 1, the feed assembly 130 includes a pulley arm body Hi, a drive pulley 132, a tensioner 133, a timing belt 134, and a vacuum pulley 150. The feed assembly 130 is generally mounted on the conveyor 120 and the conveyor 120 has a portion that extends slightly over the passage 115 of the opening 133 to permit contact with the semiconductor package 101. The pulley arm body 131 serves as an erecting frame for supporting the drive pulley 132, a tensioner 133, and the vacuum pulley 150 on the component transfer system 100. The pulley arm body 131 pivots on the component transfer system 100 to allow the extended portion of the feed assembly 130 to rotate about a yoke. The drive pulley 132 is rotatably rotatably mounted with the pivot such that rotation of the 10 pulley arm body 131 is independent of the rotation of the drive pulley 132. Drive pulley 132 is coupled to a drive motor (not shown). A stop 136 is provided at the bottom of the roller arm body 131 to limit rotation of the feed assembly 130 such that the feed assembly 130 can be stationary in an appropriate position to operate the component transfer system 100. The stopper 136 also prevents excessive swinging of the feed assembly 130. The vacuum slide 15 wheel 150 is rotated by a hollow shaft 152 from the extension of the pulley arm 130 (and the pulley arm body 131). The rotation of the vacuum pulley 150 is remotely driven by the drive pulley 132 via the timing belt 134'. Further, a tensioner 133 is provided between the driving pulley 132 and the vacuum pulley 150 for tensioning the timing belt 134. It is known to those skilled in the art that the driving pulley 132 and the vacuum pulley 15 have 20 integrally formed teeth. 38, 154, and its contour can be connected to the timing belt 134. Fig. 2 is an enlarged cross-sectional view showing the vacuum pulley 150 of Fig. 1. The vacuum pulley 150 pivots on the pulley arm body 131, and a portion of the body thereof is exposed from the pulley arm body 131 such that when the feed assembly no is in a rest position, the vacuum pulley 150 (timing belt 134) and the semiconductor The package 101 is in contact. Pivoting 10 200910501 The hollow shaft 152 of the real/moon wheel 150 has an air passage 155 facing downwardly to the chamber ι2. The direction in which the two gas passages 155 face also faces the exposure of the vacuum pulley 150. Each of the slits 156 between the integrally formed toothed turns 54 of the vacuum pulley 150 defines a through hole 157 for alignment with the air passage (5). Depending on the size of the air passage 155, a plurality of through holes 157 aligned with the air passage 155 can be provided, and a hole is formed in each integrally formed tooth portion 139 of the timing belt 134 so that the integrally formed tooth portion When 154 is engaged with the integrally formed tooth portion 139, it forms an air passage from the hollow shaft 152 through the air passage 155, and the aligned bead holes 157 and the timing belt 134. The hollow shaft 152 10 is directly connected to a vacuum generator by a flexible tube. Referring again to FIG. 2, the semiconductor package 101 fully loaded in the chamber 112 is positioned on the component loader 110. When the component transfer system 100 is activated, the drive pulley 132 is rotated '俾 to drive the vacuum pulley 150 via the timing belt 134. The vacuum generator forms a negative pressure by withdrawing air through the air passage of the vacuum pulley 150. At the same time, the riser 114 rises into the stacked semiconductor package 101 toward the opening 113 of the chamber 112. When the highest semiconductor package 101 rises to a height defined by the via 115, the vacuum pulley 15 is in contact with the highest semiconductor package 1〇1. Vacuum pulley 150 begins to feed the semiconductor package 101 to the other side of the conveyor 12 to deframe. When the vacuum pulley 15 is rotated 20, the timing belt 134 is fed into the semiconductor package 101 by friction to guide the semiconductor package 101 to the conveyor 120. The negative pressure (suction) is further raised by the timing belt 134 to lift the semiconductor package 1〇1 to provide a better grip force when the parts are transferred. In operation, the feed assembly 130 can maintain rotation about the squeezing of the sleeve that is co-sliding with the drive pulley 132. 200910501 Referring again to Figure 2, the vacuum pulley 150 is adapted to provide continuous forcelessness throughout the operation. Therefore, the air passage 155 of the hollow shaft 152 needs to have a large opening σ with respect to the hole 157 to provide a continuous air passage when the vacuum pulley i5G rotates. As shown in the figure, the periphery of the air passage 155 simultaneously covers 5 about four through holes 157, that is, when the vacuum pulley 15 turns, and the vacuum pulley 150 remains stationary. In order to maintain a constant force during the entire operation to raise the component to be transported, the hollow shaft (5) is statically coupled to the pulley arm body 13 such that the air passage 155 of the middle sister 152 is substantially facing downward; Facing the component loader no. In addition, the feed speed of the vacuum pulley 15 ,, 1 〇 and the raising speed of the riser 114 are controlled to provide a smooth transition. Referring again to Fig. 1, the component transfer system (10) is configured to reduce the weight on the semiconductor package 1G1 as much as possible to prevent damage to the components. Thus, the components of the feed assembly 130 are made of a lightweight material, such as aluminum. Furthermore, since the drive motor is not directly connected to the vacuum sheave 15Q, the weight applied to the 15 j conductor package (8) can be kept very small. In operation, the elevator machine 114 is configured to raise the semiconductor seal member 10 in a continuous manner as the feed assembly 130 pivots on the component transfer system 1 when the lifter ι 4 lifts the semiconductor package 101 The feed assembly 13 does not exert additional force on the semiconductor package 101. When the riser 114 is raised, if the vacuum pulley 2〇(10) cannot feed the semiconductor package 1〇1 to the conveyor (2) to cause the semiconductor package 1011 to be collected on the component loader nG, the vacuum pulley (9) rises, To prevent additional force from being applied to the semiconductor package as above. Therefore, when the rising speed of the riser 114 exceeds the speed required for the smooth transition, the vacuum (7) wheel H0 is thus raised. Similarly, when the feed rate drops to a smooth transition 12 200910501
所須的速度時’真空滑輪150亦會升起D 依據另一實施例，部件轉送系統100另包括用以控制部 件轉送系統100之操作的-控制器及感應器。該控制器控制 整個操作的速度，以備置一平順的轉換。當控制器經:感 應器制岀在部件轉送线⑽上的不良魏時，控制糾 切斷操作。以上述實例為例，當真空滑輪150無法操作，見 感應器偵測出饋入總成13〇已達到某一高度的臨界點時，控 制器切斷整個操作，以防止造料導體縣件⑻之受損。 依據另-實施例，饋入總成13〇的暴露部份可調整成見 有在較靜止_最高铸❹裝件1_高處的真空滑輪 150。此點可藉由婦止擋器136或連接在饋人總成⑽下的 任何止撞裝置而達成。在操作時，t成疊的半導體封裝件 在/、罪近至112之開口升起而升起時，真空滑輪⑼經由 道空吸力靠著它升起半導體封裝㈣卜然後，最頂上的半 導體封裝件⑻藉由真空滑輪15Q之轉動朝向輪送器12〇拉 動。在此構形下，在饋人過程中大體上無力量施加至半導 體封裝件101上。 在第1圖的實施例中，一正時皮帶m作為驅動真空滑 輪15〇的㈣皮▼。辦解的是任何其他有/無—體成型 的齒輪的驅動皮ΊΤ亦可用於滑輪驅動系統。譬如，亦可使 用備有一V字形真空滑輪的—V字形皮帶。 依據本4 Θ ,驅動皮帶可構形成在不阻礙空氣通路， 因而可省去驅動皮可上的孔的狀況下，驅動真空滑輪。在 實施例巾真〜月輪150包括與__v字形滑輪連接的一套 13 200910501 及V字適於固定在-中空軸上。該套管 面界定的〜 中料轉動。套管具有沿著其圓形表 路。-驅二:二。中空輛亦界定與貫穿孔對齊的-空氣通 動真空滑輪150。套管t 滑輪V字形皮帶驅 繞，以 的圓形表面亦可以適當的橡膠材料包 輪可具有:：：寸依據不同的需要，套管B字形滑 件。裝載，用以裝載擬轉送的部 10 ⑴。須睁姐：備置用以裝載部件的-分開的室 諸、「瞭解的是依據擬轉送的部件_，可使用任何雜 比或類似物。 X上實把例備置快速且有效的部件轉送。馬達的單— 1:2起動以及通過孔而呈現的真空有助於部件自-個位 .至另一位置。部件轉送的速度可通過控制驅動滑輪 15系:的馬達之一變速控制器而調整。由於操作速度係依據 真空滑輪的轉速而定，在擬轉送的部件上不會有額外的（或 十分小的）物理衝擊力。 一 此外’上述實施例備置的饋入方法幾乎無停工的時 間’因為不須回程的衝程以拾取下一部件。部件連續地被 20驅動，至一位置，而不會承受習知轉送機構所帶來的衝擊 力0 在上述實施例中，半導體封裝件101例示地而非限制地 用來作為擬轉送的部件。由以上不同實施例之構形及結構 可瞭解到，本發明適用於任何扁平且薄，且在工業過：中 14 200910501 易於遭受外界壓力的堅硬部件。 特定實施例已說明如上，但須瞭解的是在不脫離本發 明之範圍下本發明可作許多改變、改良及替換。 t圖式簡單說明3 5 第1圖顯示依據本發明的一實施例之一部件轉送系統 的橫截面側視圖；以及 第2圖顯示第1圖之部件轉送系統的部份的一放大圖。 【主要元件符號說明】 100···部件轉送系統 132…驅動滑輪 10l···半導體封裝件 133…拉緊器 110···部件裝載器 134…正時皮帶 112…室 136…止擋器 113..·頂開口 138…一體成型的齒部 114…升高器 139…一體成型的齒部 115…通路 150…真空滑輪 120…輸送器 152…中空軸 121…輸送皮帶 154…一體成型的齒部 122…滑輪 155…空氣通路 130…饋入總成 157…孔 131…滑輪臂本體 15At the required speed, the vacuum pulley 150 will also rise. According to another embodiment, the component transfer system 100 further includes a controller and an inductor for controlling the operation of the component transfer system 100. The controller controls the speed of the entire operation for a smooth transition. When the controller passes the sensor to make a bad Wei on the component transfer line (10), the control cut-off operation is controlled. Taking the above example as an example, when the vacuum pulley 150 is inoperable, and the sensor detects that the feed assembly 13 has reached a critical point of a certain height, the controller cuts off the entire operation to prevent the material conductor (8). Damaged. According to another embodiment, the exposed portion of the feed assembly 13A can be adjusted to see a vacuum pulley 150 at a higher level than the stationary_highest casting assembly. This can be achieved by the female stopper 136 or any anti-collision device attached to the feeder assembly (10). In operation, when the stack of semiconductor packages rises and rises up to the opening of 112, the vacuum pulley (9) raises the semiconductor package via the suction of the space (4). Then, the topmost semiconductor package The member (8) is pulled toward the carrier 12 by the rotation of the vacuum pulley 15Q. In this configuration, substantially no force is applied to the semiconductor package 101 during the feeding process. In the embodiment of Fig. 1, a timing belt m is used as the (four) skin ▼ for driving the vacuum pulley 15〇. The solution is that any other drive shaft with/without body-formed gears can also be used for the pulley drive system. For example, a V-shaped belt provided with a V-shaped vacuum pulley can also be used. According to the present invention, the drive belt can be configured to drive the vacuum pulley without obstructing the air passage, thereby eliminating the need to drive the hole in the skin. In the embodiment, the true-to-moon wheel 150 includes a set of 13 200910501 and V-shaped connected to the __v-shaped pulley for attachment to the hollow shaft. The sleeve surface defines the ~ material rotation. The casing has a circular path along its circumference. - Drive two: two. The hollow vehicle also defines an air-driven vacuum pulley 150 that is aligned with the through-hole. Casing t pulley V-shaped belt drive, the circular surface can also be suitable rubber material wheel can have::: inch according to different needs, casing B-shaped slider. Loaded to load the part 10 (1) to be transferred. Suzuki Sister: Separate room for loading parts, "Understanding that according to the part to be transferred _, any ratio or the like can be used. X is used to set up fast and efficient parts transfer. Motor The single - 1:2 starting and vacuum present through the hole contributes to the component from one position to the other. The speed at which the component is transferred can be adjusted by controlling one of the motors of the drive pulley 15 :. Since the operating speed is based on the speed of the vacuum pulley, there is no additional (or very small) physical impact on the part to be transferred. In addition, the feeding method provided in the above embodiment has almost no downtime. Since the stroke of the return stroke is not required to pick up the next component, the component is continuously driven by 20 to a position without suffering the impact force brought about by the conventional transfer mechanism. In the above embodiment, the semiconductor package 101 is exemplarily It is intended to be used as a component to be transferred, and is not limited thereto. It can be understood from the configuration and structure of the above various embodiments that the present invention is applicable to any flat and thin, and in the industry: 14 200910501 The present invention has been described above, but it is to be understood that the invention may be modified, modified and replaced without departing from the scope of the invention. A cross-sectional side view of a component transfer system according to an embodiment of the present invention; and a second view showing an enlarged view of a portion of the component transfer system of Fig. 1. [Main component symbol description] 100···Component transfer System 132... drive pulley 10l... semiconductor package 133... tensioner 110·· component loader 134... timing belt 112... chamber 136... stopper 113.. top opening 138... integrally formed tooth 114: riser 139... integrally formed tooth portion 115... passage 150... vacuum pulley 120... conveyor 152... hollow shaft 121... conveyor belt 154... integrally formed tooth portion 122... pulley 155... air passage 130...feed total 157... hole 131... pulley arm body 15