200909827 九、發明說明： 【發明所屬之技術領域】 本發明為一種測試系統與方法，特別是一穆具有自我 檢測功能之測試系統與方法。 【先前技術】 積體電路（Integral Circuit簡稱ic)的製造流程包含 有晶圓製造、晶圓針測（Chip Probing簡稱CP)、切割、 檢測及作記號、檢測通過之晶片進行封裝以及對封裝定戍 之積體電路作測試製程，該測試製程中又包含初步挪贫 (initial Test)與最終測試（Final Test)。其中，晶圓斜 測為晶圓製造完成後之一針對電性表現之測試步驟’其目 的在使晶圓進入切割、檢測及封裝階段前先行淘汰掉電性 功能不良的晶圓，如此則可減少成本的浪費。而測試製程 則為在積體電路封裝完成後，在包裝出貨前所對該積體電 路的電性特性等進行測試，以確保出貨之積體電路的品質。 第一圖為傳統的測試系統示意圖’由測試機台 UesterMOl傳送測試訊號至負載板（l〇ad board)102，該 剛試訊號再由該負載板1〇2傳送至一訊號分配裝置103， 而5亥訊號分配裝置與一待測元件連結，並依據所 接11欠到的測試訊號對該待測元件104進行測試。其中，該 现號分配裝置103會依據進行不同的測試而不同，於晶圓 200909827 針測時，該訊號分配裝置103可為一針測卡（probe card)， 而於測試製程中對積體電路進行測試時，該訊號分配裝置 103可為一插座板~(socket board)。再完成測試後，該測 試結果會直接回傳至該測試機台，並將該測試結果顯示於 螢幕上。 舉例來說，傳統上於晶圓針測的測試方法，如第二圖 所示，在一般情況下，測試機台會傳送測試訊號由負載板 及訊號分配裝置直接傳到待測元件後即執行測試的步驟， 步驟S201為測量待測元件之電壓值，步驟S202則根據測 得之電壓值進行修補，其中該修補的方法為雷射修補 (laser trimming)，而在完成修補後則結束該測試。然而， 若測試機台或配件出了問題，則會造成所測量的待測元件 之電壓值並不準確，而以此不準確之電壓值進行判斷並對 待測元件進行雷射修補後，則會使該測試元件受到不可修 復的影響甚至損壞。即便於測試後就發現測試機台或配件 有問題而進行檢查與修復，然而進行過雷射修補的元件已 無法復原，而導致產品的浪費。此外，若沒有即時發現測 試機台或配件有問題，將測量錯誤之待測元件進行後讀的 製造流程更會造成製程上的困擾。另外，在測試一些需要 精準數據以為後續製程使用的元件時，若量測的數值偏移 (shift)過多，也會造成產品的品質受到影響甚至損壞，而 6 200909827 造成浪費。 此外’於製程流程中的測試流財，、 機台對已封I完成之積體電路進行測試，將 測的積體電路包#甚 ’&有問題量 匕裝甚至出知 '，更會影響到客戶的權益。 更可以即 曰因此，亟需提出一種測試系統與方法，不但可 量之精準度及減少測試中由機台所造成之錯誤，…、1 時反映測試機台的問題之系統與方法。’‘a 【發明内容】 本發明的目的為於測試中提高待測元件之測量精準度 及減少測試中由機台所造成的錯誤，並可以即時反映測= 機台之問題。 為了達成上述之目的，本發明提供一種具有自我檢測 功能之測試系統，其中包含有：—轉換器，設置於一訊號 分配裝置上’該轉換器可接收由—職機台發出之一測試 訊號’並切換該輯訊號的行進路徑；以及_訊號模擬器， 與該訊號分配，裝置相連結，可接收由該轉換器傳來之該測 试訊號而產生一與待測元件相同之輸出訊號以檢驗該測試 機台。再以完成自我檢測之測試系統對待測元件進行測 試，則可使該待測元件之測量結果為正確的。而且，該轉 換器及訊號模擬器更可藉由一傳輸元件作為介面與測試機 200909827 台及配件連接，如此則不會於測量中對待試元件造成不良 的影響，以確保其電性之順暢度及品質。 此外，本發明提供一種具有自我檢測功能之測試方 法，其步驟包含：由一轉換器將由測試機台發出之一測試 訊號之行進路徑切換至一訊號模擬器；接收由該訊號模擬 器所傳回之訊號；確認該訊號是否正常；以及完成測試機 台之自我檢測，並以檢測完成之測試機台對待測元件進行 測試。以此方法對待測元件進行測試，則可使該待測元件 之測量結果為正確，如此，即便後續製程中依據測試結果 對該待測元件進行無法修復之製程，也因為測試結果為正 確的，而不會造成產品的損壞以及浪費。 為了讓本發明之目的、特徵和優點能更明顧易懂，下 文特舉較佳實施例，並配合所附圖示，作詳細說明如下： 【實施方式】 第三圖為本發明測試系統示意圖。於測試過程中，測 試訊號藉由測試機台310傳送至負載板312，再經由負載 板312將測試訊號傳送至訊號分配裝置314。一轉換器316 與該訊號分配裝置314相連接，該測試訊號會由該訊號分 配裝置314傳送至該轉換器316，其中該轉換器具有可切 換該測試訊號的行徑路線的功能。一訊號模擬器318，可 200909827 產生一與待測元件320相同輸出訊號以檢測該測試機台 310 ’其中該輸出訊號包含為一頻率訊號。當測試訊號傳送 至該轉換器316時，該轉換器316則可將該測試訊號傳送 至該訊號模擬器318，該訊號模擬器318會回傳一測試訊 號至該訊號分配裝置314，再由該訊號分配裝置314將該 回傳的測試訊號藉由該負載板312傳回至該測試機台 310 ’並藉此回傳的測試訊號來對該測試機台進行檢測。 另外’當測試系統要對待測元件320進行測試時，則 測試訊號會由測試機台31〇發出，並藉由負載板312和訊 號分配裝置314將該測試訊號傳送至該轉換器316，而因 為要進行待測元件的測試，轉換器316會將該測試訊號傳 送至该訊號分配裝置314，而再藉由該訊號分配裝置314 將測試訊號傳送至待測元件32〇進行測試。測試完成後， 會由待測元件320回傳一測試訊號藉由訊號分配裝置314 及負載板312傳回該測試機台31〇中。 轉換Is 316可以是線路轉換裝置’用以切換測試訊號 的行進路徑’選擇該測試訊號要傳至該訊號分配裝置 以進行待測元件320之測試或是將該測試訊號傳送至該訊 號模擬器318以進行對該測試機台31〇之檢測。其中該訊 號分配裝置314可依據進行不同的測試而不同，於晶圓針 測，该§fL號分配裝置314可為一針測卡，而於封裝製程 200909827 後之積體電路進行測試製程時，則該訊號分配裝置314可 為一插座板。 於本發明中一實施例，該訊號模擬器318可為一具有 可變電阻之電路裝置，使用者可依據其需求以改變該裝置 之電阻值，以使該訊號模擬器318所輸出之電壓值與待測 元件320正常的電壓值相同，進而可驗證該測試機台310 之測試功能。此處，僅需於進行測試前針對預測量之待測 元件320來設定該訊號模擬器318的電阻值，以使該訊號 模擬器318所輸出之電壓值與該待測元件320正常的電壓 值相同即可。 第四圖為本發明中之一實施例之硬體相關位置示意 圖。於一訊號分配裝置404上設置一傳輸元件403，該傳 輸元件則為一連結介面，用以使一轉換器401與一訊號模 擬器402可與該訊號分配裝置連結。如此，則可在不改變 該訊號分配裝置404之情況下來達成本發明之測試系統。 於此一實施例中，該傳輸元件403可以是一電路板，而該 訊號分配裝置404則可依據不同測試製程，分別為針測卡 或是插座板。此外，對於不同待測元件的不同規格及特性 也會使用不同的針測卡或是插座板，也因此，於不同的待 測元件的測試，也會使用相對應於該待測元件之訊號模擬 器402。雖然，於不同的待測元件需要變換不同的訊號模 10 200909827 擬器402，但是僅需於測試前針對欲測量之待測元件的正 常輸出值調整該訊號模擬器402的參數輸出值，以使該訊 號模擬器的輸出值與該待測元件之正常輸出值相同即可。 第五圖為本發明測試機台自我檢測的方法流程圖，在 此以配合一實施例來說明此流程圖。 於本發明之測試系統以進行測試機台自我檢測的方 法，依序包含：首先，步驟S501，由一轉換器轉將測試訊 號之路徑切換至一訊號模擬器；接著，步驟S502，接收由 該訊號模擬器所傳回之訊號；然後，步驟S503，確認該訊 號是否正常；若訊號正常，則進行步驟S504，測試機台自 我檢測完成；若訊號不正常，則進行步驟S505 ,停止測試 並進行測試機台及配件之檢修；完成測試機台之檢查與修 正的步驟後，再重複S501至S503之步驟，以確認該測試 機台的測試功能正常。再確認該待測機台之測試功能正常 後才以使之對待測元件進行測試。 步驟S501，由一轉換器將測試訊號之路徑切換至一訊 號模擬器。於本實施例中，測試訊號由測試機台發出，藉 由負載板及訊號分配裝置傳至一轉換器，其中該轉換器可 決定系統要進行機台自我檢測或是對待測元件進行測試。 而該轉換器的切換功能可藉由於測試程式中對測量該待測 元件之座標作定義來達成，於本實施例中，則定義當測量 11 200909827 待測70件之橫座標為任意數、縱座標為25時，則該轉換器 則會將測賴號之路細換至—訊號模㈣，並以該訊號 模擬器來對該測試機台進行檢測。 步驟S502 ’接收由該訊號模擬器所傳回之訊號。測試 Λ號傳至該訊號模擬器後，則該訊號模擬器會依該測試訊 號並模擬預測量之待測元件的正常測量數值以輸出一訊 號，該訊號會回傳至該訊號分配裝置及負載板，並由該負 載板將該訊號傳回至該測試機台。於本實施例中，將該測 試系統應用於晶圓針測時，該訊號可為一電壓值，而該訊 號核擬器可為-具有可變電阻之電路農置，視待測元件的 正常測量電壓值來調整其電阻值以使其輸出之電壓值與待 測元件的正常測量電壓值相同。 步驟S503 ’碟認該訊號是否正常。該訊號則相當於由 談測試機台對該訊號模擬器進行測試所得到之測試結果， 因此’右该訊號的數值在許可範圍内，則代表測試機台正 苇並進行步驟S504，測試機台自我檢測完成，即可以該 測試機台對待測元件進行測試。 若該訊號的數值不在許可範圍内，則該測試機台為異 常，即需進行步驟S505,停止測試並進行測試機台及配件 之檢彳> 於本發明糸統應用於晶圓針測的實施例中，當訊 唬模擬益所輸出之電壓值為2. 048±0. οοιν時，若測試機台 12 200909827 所測得的數值為2. 01IV，則代表該測試機台或是訊號分配 裝置等配件有異常情況發生，則測試機台會自動停止測試 動作並發出異常警報（a 1 arm)，以待相關人員處理及防止後 續錯誤測量。在測試機台停下後，相關人員便可以查驗以 找出造成異常之原因並將之修復，待相關人員處理後，則 可回到步驟S501，再此對測試機台進行自我檢測，直到確 認該測試機台及配件的測試功能無誤後，才結束對該測試 機台自我檢測的程序。 於本發明之測試系統中，在完成自我檢測步驟之測試 機台即可直接對待測元件進行測試。而完成自我檢測之測 試機台對待測元件的測試方法則如第六圖所示，包含下述 步驟：首先，步驟S601，將測試訊號傳至轉換器，該轉換 器將該測試訊號傳至訊號分配裝置；接著，步驟S602，由 該訊號分配裝置將該測試訊號傳至待測元件並進行測式； 最後，步驟S603 ,測試完成，所測得之測試結果為正確的 測試結果。 步驟S601，將測試訊號傳至轉換器，該轉換器將該測 試訊號傳至訊號分配裝置。於本實施例中，在測試機台完 成自我檢測的程序後，即可進行對待測元件之測試，也就 是說，測試機台在進行自我檢測後，確定該測試機台的測 試功能為正常後，不需停機，即可由該測試機台再發出測 13 200909827 試訊號並經由負載板及訊號分配裝置傳至轉換器，因為要 進行對待測元件之測試，所以該轉換器會將該測試訊號再 傳回該訊號分配裝置，以進行對待測元件之測試。 步驟S602，由該訊號分配裝置將測試訊號傳至待測元 件亚進行測試。其中，該訊號分配裝置可依據不同測試製 程而為不同之測試裝置，當測試系統用於晶圓針試時，則 遠訊就分配農置可為一針測卡，而當測試系統用於對已封 裝後之積體電路進行測試製程時，則該訊號分配裝置可為 一插座板。 步驟S603，測試完成’所測得之測試結果為正確的$ 試結果。舉本發明賴^料晶®針測的-實施例來影 明’於晶圓針測中’待測元件為晶圓，而測試系統則要董 待測晶圓進行其電性的測試，特別為該晶圓電壓的測試。 7咸祕對待測晶圓進行電壓的測量時，賴系統會读 =晶圓的測量而得到-電壓輸出值，由於本系統之卿 機°已完成自我檢測的程序，其測試功能正常，因此，夸 值。如此，再進行”曰=曰圓之正確的電壓輸出 丁對。亥日日0做的後續動 的電塵值來對該晶，行彳H則何 特定心m 田射修補’即利用雷射燒斷某些 程制上所需之特定通路等益法復 原的動作’卿料輯晶_職結果為正確线，= 14 200909827 不會造成不必要的浪費。 本發明之測試系統及方法的優勢即為可在對待測元件 進行測試時先對測試機台及配件進行檢測，若檢測結果為 異常時，可先對測試系統中的測試機台及配件進行檢查， 找出異常發生的原因並進行修正，直到確認測試系統的測 試功能正常後，再對待測元件進行測試。如此，可避免發 生由測試功能異常的測試機台及配件對待測元件進行測 試，而在測試的結果不正確的情況下，對該待測元件進行 不可復原的後續製程，而導致成本的浪費甚至影響客戶的 權益。 此外，由於本發明的訊號模擬器及轉換器可由如電路 板之傳輸元件來與訊號分配裝置結合，其線路外接且獨 立，只須於傳統的訊號分配裝置上外加該具有訊號模擬器 及轉換器的傳輸元件即可達成，不但方便而且不會對測試 機台或是待測元件造成損害或影響。 以上所述僅為本發明之較佳實施例而已，並非用以限 定本發明之申請專利範圍；凡其他未脫離發明所揭示之精 神下所完成之等效改變或修飾，均應包含在下述之申請專 利範圍内。 15 200909827 【圖式簡單說明】 第一圖為傳統測試系統示意圖。 第二圖為傳統晶圓針測方法流程圖。 第三圖為本發明測試系統示意圖。 第四圖為本發明之一實施例的硬體相關位置示意圖。 第五圖為本發明測試系統自我檢測的方法流程圖。 第六圖為本發明測試系統對待測元件進行測試的方法流程 圖。 【主要元件符號說明】 101 測試機台 . 102負載板 103 訊號分配裝置 104 待測元件 S201測量待測元件之電壓值 S202根據測得之電壓值進行修補 310 測試機台 312 負載板 314 訊號分配裝置 316 轉換器 318 訊號模擬器 320 待測元件 401 轉換器 16 200909827 402 訊號模擬器 403 傳輸元件 404 訊號分配裝置 S501由一轉換器將測試訊號之路徑切換至一訊號模擬器 S502接收由該訊號模擬器所傳回之訊號 S503確認該訊號是否正常 S504測試機台自我檢測完成 S505停止測試並進行測試機台及配件之檢修 S601將測試訊號傳至轉換器，該轉換器將該測試訊號傳至 訊號分配裝置 S 6 0 2由該訊號分配裝置將測試訊號傳至待測元件並進行 測試 S603測試完成，所測得之測試結果為正確的測試結果 17200909827 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention is a test system and method, and more particularly, a test system and method having a self-detection function. [Prior Art] The manufacturing process of Integral Circuit (IC) includes wafer fabrication, wafer probing (CP), cutting, inspection and marking, wafer inspection and packaging, and packaging. The integrated circuit of 戍 is used as a test process, and the test process includes preliminary initial test and final test (Final Test). Among them, the wafer skew test is one of the test steps for electrical performance after wafer fabrication is completed. The purpose is to eliminate the wafer with poor power failure before the wafer enters the cutting, detecting and packaging stages. Reduce the waste of costs. The test process is to test the electrical characteristics of the integrated circuit before the package is shipped after the integrated circuit package is completed to ensure the quality of the integrated circuit that is shipped. The first figure is a schematic diagram of a conventional test system. The test signal is transmitted from the test machine Uester MO1 to the load board 102, and the test signal is transmitted from the load board 1 to 2 to a signal distribution device 103. The 5th signal distribution device is connected to a device to be tested, and the device under test 104 is tested according to the test signal owed by the terminal 11. The current number distribution device 103 may be different according to different tests. When the wafer 200909827 is tested, the signal distribution device 103 may be a probe card, and the integrated circuit in the test process. When the test is performed, the signal distribution device 103 can be a socket board. After the test is completed, the test result is directly transmitted back to the test machine and the test result is displayed on the screen. For example, the test method traditionally used for wafer needle testing, as shown in the second figure, in general, the test machine transmits test signals to be transmitted by the load board and the signal distribution device directly to the device under test. The step of testing, step S201 is to measure the voltage value of the component to be tested, and step S202 is to repair according to the measured voltage value, wherein the repairing method is laser trimming, and the testing is ended after the repair is completed. . However, if there is a problem with the test machine or the accessories, the measured voltage value of the device under test will be inaccurate. If the voltage value is determined by the inaccurate voltage and the device to be tested is laser repaired, The test component is subject to irreparable effects or even damage. That is, after the test is easy, the test machine or the accessory is found to be inspected and repaired, but the component that has been subjected to the laser repair cannot be recovered, resulting in waste of the product. In addition, if there is no problem in the immediate detection of the test machine or the accessories, the manufacturing process of measuring the wrong component to be tested will cause troubles in the process. In addition, when testing some components that require accurate data for subsequent processes, if the measured value shifts too much, the quality of the product may be affected or even damaged, and 6 200909827 is wasteful. In addition, the test flow in the process flow, the machine test the integrated circuit completed by the sealed I, the measured integrated circuit package #very '& problematic amount of equipment even knows', more will Affect the interests of customers. Therefore, it is urgent to propose a test system and method that not only can be accurate and reduce the errors caused by the machine during the test, and the system and method for reflecting the problem of the test machine. ‘a [Summary of the Invention] The object of the present invention is to improve the measurement accuracy of the device to be tested and to reduce errors caused by the machine during the test, and to immediately reflect the problem of the test machine. In order to achieve the above object, the present invention provides a test system having a self-detection function, comprising: a converter disposed on a signal distribution device, the converter can receive a test signal issued by the service machine. And switching the path of the signal; and the signal simulator is coupled to the signal distribution device to receive the test signal transmitted by the converter to generate an output signal identical to the component to be tested to verify The test machine. Then, the test component to be tested by the test system that completes the self-test can make the measurement result of the test component correct. Moreover, the converter and the signal simulator can be connected to the test machine 200909827 and the accessories through a transmission component as an interface, so that the test components are not adversely affected during the measurement to ensure the smoothness of the electrical properties. And quality. In addition, the present invention provides a test method with a self-detection function, the method comprising: switching a path of a test signal sent by a test machine to a signal simulator by a converter; and receiving the signal returned by the signal simulator The signal; confirm whether the signal is normal; and complete the self-test of the test machine, and test the test device to be tested. By testing the device to be tested in this way, the measurement result of the device to be tested can be made correct. Therefore, even if the process to be tested cannot be repaired according to the test result in the subsequent process, the test result is correct. It will not cause damage and waste of the product. In order to make the objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. . During the test, the test signal is transmitted to the load board 312 via the test machine 310, and the test signal is transmitted to the signal distribution unit 314 via the load board 312. A converter 316 is coupled to the signal distribution device 314. The test signal is transmitted by the signal distribution device 314 to the converter 316, wherein the converter has the function of switching the path of the test signal. A signal simulator 318, which can generate the same output signal as the device under test 320 to detect the test machine 310', wherein the output signal is included as a frequency signal. When the test signal is transmitted to the converter 316, the converter 316 can transmit the test signal to the signal simulator 318, and the signal simulator 318 can return a test signal to the signal distribution device 314, and then The signal distribution device 314 transmits the returned test signal to the test machine 310 by the load board 312 and detects the test machine by the returned test signal. In addition, when the test system is to be tested by the device to be tested 320, the test signal is sent by the test machine 31, and the test signal is transmitted to the converter 316 by the load board 312 and the signal distribution device 314, because To test the device under test, the converter 316 transmits the test signal to the signal distribution device 314, and the test signal is transmitted to the device under test 32 by the signal distribution device 314 for testing. After the test is completed, a test signal is transmitted back from the device under test 320 to be transmitted back to the test machine 31 by the signal distribution device 314 and the load board 312. The conversion Is 316 may be a line switching device's path for switching the test signal. The test signal is transmitted to the signal distribution device for testing the device under test 320 or the test signal is transmitted to the signal simulator 318. The detection of the test machine 31 is performed. The signal distribution device 314 can be different according to different tests. In the wafer pin test, the §fL number distribution device 314 can be a pin test card, and when the integrated circuit after the package process 200909827 is tested. The signal distribution device 314 can be a socket board. In an embodiment of the present invention, the signal simulator 318 can be a circuit device having a variable resistor, and the user can change the resistance value of the device according to the requirement, so that the voltage value output by the signal simulator 318 is The normal voltage value of the device under test 320 is the same, and the test function of the test machine 310 can be verified. Here, it is only necessary to set the resistance value of the signal simulator 318 for the predicted amount of the device under test 320 before the test, so that the voltage value output by the signal simulator 318 and the normal voltage value of the device under test 320 are The same can be. The fourth figure is a schematic view of the hardware-related position of one embodiment of the present invention. A transmission component 403 is disposed on the signal distribution device 404. The transmission component is a connection interface for coupling a converter 401 and a signal simulator 402 to the signal distribution device. Thus, the test system of the present invention can be achieved without changing the signal distribution device 404. In this embodiment, the transmission component 403 can be a circuit board, and the signal distribution device 404 can be a test card or a socket board according to different test processes. In addition, different pin test cards or socket boards are used for different specifications and characteristics of different components to be tested. Therefore, for different test components to be tested, signal simulation corresponding to the components to be tested is also used. 402. Although different signal modules 10 200909827 are required to be converted in different components to be tested, it is only necessary to adjust the parameter output value of the signal simulator 402 for the normal output value of the component to be measured before the test, so that The output value of the signal simulator is the same as the normal output value of the device under test. The fifth figure is a flow chart of the method for self-detection of the test machine of the present invention, and the flow chart is explained in conjunction with an embodiment. In the test system of the present invention, the method for performing self-test of the test machine includes: first, in step S501, a path of the test signal is switched from a converter to a signal simulator; then, in step S502, receiving The signal sent back by the signal simulator; then, step S503, confirm whether the signal is normal; if the signal is normal, proceed to step S504, the test machine self-test is completed; if the signal is not normal, proceed to step S505, stop the test and proceed Inspection and repair of the test machine and accessories; after completing the steps of inspection and correction of the test machine, repeat the steps of S501 to S503 to confirm that the test function of the test machine is normal. After confirming that the test function of the machine under test is normal, the test component is tested. In step S501, the path of the test signal is switched to a signal simulator by a converter. In this embodiment, the test signal is sent by the test machine and transmitted to the converter through the load board and the signal distribution device, wherein the converter determines whether the system is to perform self-test of the machine or test the component to be tested. The switching function of the converter can be achieved by defining a coordinate for measuring the component to be tested in the test program. In this embodiment, it is defined that when measuring 11 200909827, the horizontal coordinate of 70 pieces to be tested is an arbitrary number, vertical When the coordinate is 25, the converter will change the path of the measuring number to the signal mode (4), and the signal simulator will be used to detect the test machine. Step S502' receives the signal returned by the signal simulator. After the test nickname is transmitted to the signal simulator, the signal simulator will output a signal according to the test signal and simulate the normal measurement value of the predicted component to be tested, and the signal will be transmitted back to the signal distribution device and the load. The board, and the signal is transmitted back to the test machine by the load board. In this embodiment, when the test system is applied to the wafer needle test, the signal can be a voltage value, and the signal optimizer can be a circuit with a variable resistance, depending on the normality of the component to be tested. The voltage value is measured to adjust its resistance so that the voltage value of its output is the same as the normal measured voltage value of the component to be tested. In step S503, the disc recognizes whether the signal is normal. The signal is equivalent to the test result obtained by testing the signal simulator on the test machine. Therefore, if the value of the right signal is within the allowable range, the test machine is in the process and the step S504 is performed. After the self-test is completed, the test device can be tested. If the value of the signal is not within the permitted range, the test machine is abnormal, that is, step S505 is required to stop the test and perform inspection of the test machine and the accessories. In the present invention, the system is applied to the wafer needle test. In the embodiment, when the voltage value output by the signal simulation is 2. 048±0. οοιν, if the value measured by the test machine 12 200909827 is 2. 01IV, it represents the test machine or signal distribution. If an abnormality occurs in the accessories such as the device, the test machine will automatically stop the test action and issue an abnormal alarm (a 1 arm) to be processed by the relevant personnel and prevent subsequent error measurement. After the test machine is stopped, the relevant personnel can check to find out the cause of the abnormality and repair it. After the relevant personnel have processed it, return to step S501, and then perform self-test on the test machine until confirmation. After the test function of the test machine and accessories is correct, the program for self-test of the test machine is terminated. In the test system of the present invention, the test device can be directly tested on the test machine that completes the self-test step. The test method for the self-testing test machine to be tested is as shown in the sixth figure, and includes the following steps: First, in step S601, the test signal is transmitted to the converter, and the converter transmits the test signal to the signal. The device is distributed; then, in step S602, the test signal is transmitted to the device under test by the signal distribution device and the measurement is performed; finally, in step S603, the test is completed, and the measured test result is the correct test result. In step S601, the test signal is transmitted to the converter, and the converter transmits the test signal to the signal distribution device. In this embodiment, after the test machine completes the self-testing procedure, the test component can be tested, that is, after the test machine performs self-test, it is determined that the test function of the test machine is normal. Without any downtime, the test machine can re-issue the test 13 200909827 test signal and transmit it to the converter via the load board and the signal distribution device. Because the test component is to be tested, the converter will test the test signal again. The signal distribution device is returned for testing the component under test. In step S602, the test signal is transmitted to the device under test by the signal distribution device for testing. Wherein, the signal distribution device can be different test devices according to different test processes. When the test system is used for a wafer needle test, the remote information can be allocated as a test card, and when the test system is used for When the packaged integrated circuit is tested, the signal distribution device can be a socket board. In step S603, the test is completed, and the measured test result is the correct result of the test. The embodiment of the present invention is used to demonstrate that the component to be tested is a wafer in the wafer needle test, and the test system is required to test the wafer for electrical testing, in particular Test for this wafer voltage. 7 When the measurement of the voltage of the wafer is measured, the system will read the measurement of the wafer and obtain the voltage output value. Since the system has completed the self-test procedure, the test function is normal. Therefore, Quark. In this way, the correct voltage output is 曰 曰 曰 曰 。 。 。 。 。 。 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥 亥The action of recovering the specific path required for some processes, such as the recovery of the special method, is the correct line, = 14 200909827 does not cause unnecessary waste. Advantages of the test system and method of the present invention That is, the test machine and accessories can be tested first when testing the component to be tested. If the test result is abnormal, the test machine and accessories in the test system can be inspected first to find out the cause of the abnormality and carry out the test. Correction, until the test function of the test system is confirmed, and then test the component to be tested. This can prevent the test machine and the component to be tested from being tested abnormally, and the test result is not correct. The non-recoverable subsequent process of the component to be tested causes waste of cost and even affects the customer's rights and interests. Furthermore, since the signal simulator and converter of the present invention can be The transmission component of the circuit board is combined with the signal distribution device, and the circuit is externally connected and independent, and only needs to be added to the traditional signal distribution device to add the transmission component with the signal simulator and the converter, which is convenient and does not test. The above-mentioned machine or component under test causes damage or influence. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention; Equivalent changes or modifications shall be included in the scope of the following patent application. 15 200909827 [Simple description of the diagram] The first diagram is a schematic diagram of a traditional test system. The second diagram is a flow chart of a conventional wafer probe method. The figure is a schematic diagram of a hardware related position according to an embodiment of the present invention. The fifth figure is a flow chart of a method for self-detection of a test system of the present invention. Flow chart of the method of testing. [Main component symbol description] 101 Test machine. 102 load board 103 signal distribution 104 The device under test S201 measures the voltage value of the device under test S202 and repairs according to the measured voltage value. 310 Test machine 312 Load plate 314 Signal distribution device 316 Converter 318 Signal simulator 320 Component under test 401 Converter 16 200909827 402 Signal Simulator 403 Transmission Element 404 The signal distribution device S501 switches the path of the test signal to a signal simulator S502 by a converter to receive the signal S503 returned by the signal simulator to confirm whether the signal is normal. S504 Test machine self-test completion S505 stops the test and performs inspection of the test machine and accessories. S601 transmits the test signal to the converter, and the converter transmits the test signal to the signal distribution device S 6 0 2, and the test signal is transmitted to the device under test by the signal distribution device. And the test S603 test is completed, and the test result is the correct test result. 17