200909311 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種載置帶（carrier tape)用之覆蓋帶 (cover tape)及帶狀搬送體，係適用於搬送小型電子零件等。 【先前技術】 近年來為提高電子零件在電路基板之安裝效率，先將 電子零件以一定間距枝容於帶狀搬送體，於零件安裝裝置 係自此帶狀搬送體自動取出電子零件供安裝之用者己廣受 f 採用。 …又 此等帶狀搬送體，係由在長度方向以一定間距形成有 收容零件之凹部（口袋pocket)之載置帶，及在上述凹部收 容零件後黏貼於載置帶而封住上述口袋之覆蓋帶所構成。 在搬入安裝裝置時以將零件個別收容於各凹部之狀態將前 述帶狀搬送體捲取於捲取筒5於安裝裝置中，係以2捲= 筒逐次抽出帶狀搬送體，自載置帶剝離覆蓋帶，從载置帶 | :之凹部自動取出零件之方式使用。 在此，自載置帶剝離覆蓋帶時無法避免双方發生帶 電，且有隨安裝速度越快，其帶電量也越大的趨勢。此等 T電使原來應留在載置帶凹部之欲搬送至安裝裝置之電子 零件，會因附着於覆蓋帶而無法搬送至安裝裝置，帶電過 於激烈時更有载置帶與覆蓋帶之間發生放電而使電I零^ 文損傷之虞。於是，以往即有之防止帶電方法為：例如在 覆蓋帶與搬送帶之黏合面，設置滲有界面活性劑的層，以 圖去除因空氣中水分之帶電，或在熱封緘型覆蓋帶^熱封 320361 3 200909311 層使用氧化錫系，氧化㈣、氧化銦系等導電性微粒子者。 (例如夢照專利資料j) 但是’如上述之在覆蓋帶黏合㈣朗（熱封層_ ㈣添加界面活性劑時’當剝離覆蓋帶之場所之濕度 過低時則除電效應不佳，有過於依存濕、度之問題。又 又，在覆蓋帶黏附面之構成層添加導電性微粒子時， 為了可透過覆蓋帶確認零件而需要維持覆蓋帶之透明性， f ==微粒子之添加量不能過多，以致有無法獲得充 为抑制▼電影響效果之問題。 =決此等問題，在專利文獻2及專利文獻3，有由 南導電性之金屬蒸鑛層形成帶電防止層之提案。此不會因 濕度而降低除電效應並可確實防止帶電。又因厚度薄亦可 獲付充么之除電效應，故仍可確保視認性。 [專利文獻1]日本國特開平09-267450號公報 [專利文獻2]日本國特開2000_281983號公報 [專利文獻3]日本國特開2000-309761鞔公報 【發明内容】 之誤顳 但是’近來因電子零件小型化，故比以往對於除電效 應之要求更高，且有對電子零件少有影響之载置帶用覆蓋 帶之需求。 现 在此，如專利文獻2所示’在與載置帶之凹部相對的 面設有金屬蒸鍍層時，金屬蒸鍍層與以載置帶所搬送之電 子零件會接觸而有電子零件受影響之虞。而且，構成金屬 320361 4 200909311 蒸鍍層之金屬粉也有附着於電子零件之虞。 又，如專利文獻3之在覆蓋帶之熱封層上設金屬蒸鍍 層時，為確保與載置帶之接合性使金屬蒸鍍層較薄則除電 效應不足，另一方使金屬蒸鍍層較厚則與載置帶之接合性 降低。因此要接合性與除電效應並存實有困難。再者，為 確保接合強度而在高温下接合時，因接合時之熱影響而覆 蓋帶易受損傷，在剝離時會有由損傷處破裂之虞。 本發明係為了解決上述課題而研發者，其目的為提供 一種載置帶用之覆蓋帶及帶狀搬送體，其可獲得良好帶電 影響抑制效果，同時對載置帶之接合性及收容於載置帶之 電子零件少有影響。 解決課題之手段 本發明之第1方式為一種用以黏貼在載置帶上之載置 帶用覆蓋帶，係具備帶狀覆蓋帶主體與接合上述載置帶之 熱封層，而此等覆蓋帶主體與熱封層之間設有金屬蒸鏡層。 依據此構成之載置帶用覆蓋帶，在熱封層與覆蓋帶主 體之間設金屬蒸鍍層，因此金屬蒸鍍層與收容於載置帶之 凹部之電子零件不直接接觸，可抑制金屬粉等與電子零件 接觸之影響。 Γ 又，因熱封層係直接接合於載置帶，在低温度條件下 亦可確保載置帶與覆蓋帶之接合強度。因此可抑制接合之 熱損及覆蓋帶。 再者，可設定金屬蒸鍍層之厚度較自由，在確保載置 帶用覆蓋帶之視認性之同時，亦可有帶電影響之高抑制效 5 320361 200909311 應。 又，金屬蒸鍍層不露出在外，可防止金屬蒸鍍層因氧 化之劣化。 在此，上述覆蓋帶主體與上述熱封層之間，亦可連同 上述金屬蒸鍍層設由合成樹脂構成之中間層。 此時，可將覆蓋帶主體與熱封層之厚度散差(不均勻 之差距）可由中間層所吸收，可使載置帶用覆蓋帶整體之厚 度均句化。又，變更此中間層厚度可調整載置帶用覆蓋帶 " 之熱傳導，而可提供對應各種熱封緘温度之載置帶用覆蓋 帶。 另，上述金屬蒸鍍層可由I呂或铭合金構成。 在此時，因由高導電性I呂或銘合金構成金屬蒸鐘層， 因此可獲得良好而順暢之電荷移動之中和效應。[Invention] [Technical Field] The present invention relates to a cover tape for a carrier tape and a belt-shaped conveyance body, which is suitable for transporting small electronic parts and the like. [Prior Art] In recent years, in order to improve the mounting efficiency of electronic components on a circuit board, the electronic components are first accommodated in a strip-shaped transport body at a certain pitch, and the component mounting device automatically takes out electronic components from the strip-shaped transport body for installation. Users have been widely adopted by f. Further, the belt-shaped transporting body is a mounting belt in which a recessed portion (pocket pocket) for accommodating a component is formed at a constant pitch in the longitudinal direction, and the recessed portion is housed, and then adhered to the mounting tape to seal the pocket. Covered by a belt. When the mounting device is carried in, the tape-shaped conveying body is taken up in the winding device 5 in the mounting device in a state in which the components are individually accommodated in the respective recessed portions, and the tape-shaped conveying body is sequentially taken out by the two-volume = cylinder, and the self-loading tape is taken out. The cover tape is peeled off, and the parts are automatically taken out from the recessed portion of the mounting tape | :. Here, when the tape is peeled off from the tape, it is unavoidable that both of them are charged, and the charging speed is higher as the mounting speed is higher. These T electricity causes the electronic components that are to be carried to the mounting device to be carried in the recessed portion, and may not be transported to the mounting device due to adhesion to the cover tape. When the charging is too intense, there is more between the mounting tape and the cover tape. The discharge occurs and the electric I is damaged. Therefore, in the past, the method of preventing the charging is: for example, a layer in which a surfactant is impregnated on the bonding surface of the cover tape and the conveyor belt, in order to remove the charge due to moisture in the air, or to heat the heat-sealing type cover tape. Seal 320361 3 200909311 The layer is made of tin oxide, oxidized (tetra), indium oxide or other conductive particles. (For example, the dream patent document j) However, as described above, when the cover tape is bonded (four) lang (heat seal layer _ (four) when adding the surfactant), when the humidity of the place where the cover tape is peeled off is too low, the static elimination effect is not good, and there is too In addition, when the conductive fine particles are added to the constituent layer covering the adhesive surface, it is necessary to maintain the transparency of the cover tape in order to pass the cover tape, and f == the amount of the fine particles cannot be excessively increased. As a result of the above-mentioned problems, in Patent Document 2 and Patent Document 3, there is a proposal to form a charging prevention layer from a south-conducting metal vapor-evaporating layer. In the case of the humidity, the effect of the static electricity is reduced, and the charge is removed, and the charge is removed, and the charge-removing effect can be ensured, and the visibility can be ensured. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 09-267450 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-281983 (Patent Document 3) Japanese Patent Application Publication No. 2000-309761A (Summary of the Invention) However, since the electronic components have been miniaturized, the power consumption has been reduced. There is a demand for a tape for mounting tapes which has little influence on electronic components. Now, as shown in Patent Document 2, when a metal vapor deposition layer is provided on a surface opposite to the concave portion of the mounting tape. The metal vapor-deposited layer is in contact with the electronic component that is carried by the mounting tape, and the electronic component is affected. Moreover, the metal powder of the vapor-deposited layer of the metal 320361 4 200909311 is also attached to the electronic component. Further, as in the patent document (3) When a metal deposition layer is provided on the heat seal layer of the cover tape, in order to ensure adhesion to the mounting tape, the metal deposition layer is thin, the static elimination effect is insufficient, and the other metal deposition layer is thicker and the carrier tape is placed. The bonding property is lowered. Therefore, it is difficult to have the bonding property and the static elimination effect. Further, when bonding is performed at a high temperature in order to secure the bonding strength, the cover tape is easily damaged by the heat influence at the time of bonding, and there is damage during peeling. The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a cover tape for a mounting tape and a belt-shaped conveyance body, which can obtain a good charging effect suppression effect. At the same time, the bonding property of the mounting tape and the electronic component accommodated in the mounting tape are less affected. The first aspect of the present invention is a covering tape for a mounting tape to be attached to a mounting tape. A belt-shaped cover tape main body and a heat seal layer for joining the mounting tape are provided, and a metal vapor mirror layer is disposed between the cover tape main body and the heat seal layer. The cover tape for the mounting tape according to the structure is heat-sealed Since the metal vapor-deposited layer is provided between the layer and the cover tape main body, the metal vapor-deposited layer does not directly contact the electronic component housed in the recessed portion of the mounting tape, and the influence of contact with the electronic component such as metal powder can be suppressed. It is directly bonded to the mounting tape, and the bonding strength between the mounting tape and the cover tape can be ensured under low temperature conditions. Therefore, the heat loss and the cover tape of the bonding can be suppressed. Further, the thickness of the metal deposition layer can be set to be free. While ensuring the visibility of the tape for the tape, it is also possible to have a high effect of charging effects 5 320361 200909311. Further, the metal deposition layer is not exposed, and deterioration of the metal deposition layer due to oxidation can be prevented. Here, an intermediate layer made of a synthetic resin may be provided between the cover tape main body and the heat seal layer together with the metal vapor deposition layer. At this time, the thickness difference (uneven difference) between the cover tape main body and the heat seal layer can be absorbed by the intermediate layer, and the thickness of the entire cover tape for the tape can be made uniform. Further, by changing the thickness of the intermediate layer, the heat transfer of the tape for the mounting tape can be adjusted, and the tape for the mounting tape corresponding to various heat sealing temperatures can be provided. Further, the above metal vapor-deposited layer may be composed of ILu or Ming alloy. At this time, since the metal vapor layer is composed of the highly conductive Ilu or the alloy, a good and smooth charge-moving neutralization effect can be obtained.
再者，蒸鍍鋁或鋁合金之PETP等對於空氣等有高阻 擋性，可確實防止收容於載置帶之電子零件之劣化。 f 更可將上述金屬蒸鍍層之厚度設定在20A以上150A 以下之範圍内。 在此，金屬蒸鑛層之厚度為20以上，因此可奏功良 好而順暢之因電荷移動之中和效應。又，金屬蒸鍍層之厚 度為150A以下時，可確保此載置帶用覆蓋帶之透明度， 提高視認性。 本發明之第2方式為一種帶狀搬送體，係具備：帶狀 載置帶，在其一面之長度方向留間隔形成有零件收容用之 凹部；與覆蓋帶，用以黏貼於上述載置帶以封閉上述凹部 6 320361 200909311 者，其中，上述覆蓋帶係具備：帶狀覆蓋帶主體，用以與 上述載置帶接合之熱封層，而在此等覆蓋帶主體與熱封層 之間設有金屬蒸鐘層，構成上述熱封層能加熱接合於上述 載置帶。 依據此構成之帶狀搬送體，在覆蓋帶與熱封層之間形 成金屬蒸鍍層，因此當自載置帶剝離覆蓋帶時，既使覆蓋 帶與載置帶帶電，可使金屬蒸鍍層接地而引導帶電電荷與 反極性之電荷中和，或金屬蒸鑑層作用為靜電屏蔽而可抑 制帶電之影響，得以防止電子零件被吸附於覆蓋帶之剝離 面之現象。又，可防止留存於覆蓋帶之電荷與載置帶間放 電而傷及電子零件。 發明效果 依據本發明，可提供一種載置帶用之覆蓋帶及帶狀搬 送體，其可獲得良好帶電影響抑制效果，同時與載置帶之 接合性及對收容於載置帶之電子零件之影響至少。 【實施方式】 參照圖式說明本發明之載置帶用之覆蓋帶及帶狀搬 送體之第1實施方式。帶狀搬送體1為如第1圖所示，係 具備：帶狀載置帶2，在長度方向留間隔地形成多數個可 收容零件用凹部6 ;及帶狀覆蓋帶4(載置帶用覆蓋帶），以 將凹部封閉的方式黏貼於載置帶2，而且，將電子零件w 個別放置於凹部後熱封覆蓋帶4而封閉凹部6以供使用。 載置帶2為具一定寬度之帶狀，在其上表面（指第2 圖之上下面，以下均同）之寬度方向中央部以留規定間隔的 7 320361 200909311 方式形成矩形狀凹部6，其下表面之對應於凹部的部分為 突出狀。又，載置帶2之寛度方向兩端部分別形成進給孔 8 ’進給機構與此進給孔繫合而得以有正確搬送。 於本實施方式’覆蓋帶4之寬度小於載置帶2之寛 度’而大於凹部6之寬度。藉此，凹部6可密閉封口，同 時不堵塞到進給孔8。 載置帶2之材質並不受限，例如：「聚對苯二甲酸乙 二酯（Polyethyleneterephthalate)、聚苯乙烯（Polystyrene)、 聚酯（Polyester)、聚碳酸酯（Polycarbonate)、聚氯乙烯Further, PETP such as aluminum or aluminum alloy which is vapor-deposited has high resistance to air or the like, and can reliably prevent deterioration of electronic components housed in the mounting tape. f The thickness of the metal vapor-deposited layer may be set to be in the range of 20 A or more and 150 A or less. Here, the thickness of the metallurgical layer is 20 or more, so that the effect of the charge movement neutralization effect is good and smooth. Further, when the thickness of the metal deposition layer is 150 A or less, the transparency of the cover tape for the mounting tape can be ensured, and the visibility can be improved. According to a second aspect of the present invention, in a belt-shaped carrier, a belt-shaped mounting belt is provided with a recess for receiving a component at a distance in a longitudinal direction of the one surface, and a cover tape for adhering to the mounting tape The cover tape includes: a belt-shaped cover tape main body, a heat seal layer joined to the mounting tape, and a cover between the cover tape main body and the heat seal layer. There is a metal vapor layer, and the heat seal layer is formed to be heatably bonded to the mounting tape. According to the belt-shaped conveying body configured as described above, the metal vapor-deposited layer is formed between the covering tape and the heat-sealing layer. Therefore, when the covering tape is peeled off from the mounting tape, the metal vapor-deposited layer can be grounded even if the covering tape and the mounting tape are charged. The conductive charge and the reverse polarity charge are neutralized, or the metal vaporization layer acts as an electrostatic shield to suppress the influence of charging, thereby preventing the electronic component from being adsorbed on the peeling surface of the cover tape. Further, it is possible to prevent the electric charge remaining between the cover tape and the mounting tape from being discharged and injuring the electronic component. Advantageous Effects of Invention According to the present invention, it is possible to provide a cover tape for a mounting tape and a belt-shaped conveyance body which can obtain a good effect of suppressing charging effects, and at the same time, bondability with a mounting tape and electronic components housed in the mounting tape. At least. [Embodiment] A first embodiment of a cover tape and a belt-shaped conveyance body for a mounting tape according to the present invention will be described with reference to the drawings. As shown in Fig. 1, the belt-shaped transporting body 1 includes a belt-shaped mounting belt 2, and a plurality of recesses 6 for accommodating components are formed at intervals in the longitudinal direction; and the belt-shaped covering tape 4 (for the mounting tape) The cover tape is adhered to the mounting tape 2 in such a manner that the concave portion is closed, and the electronic component w is individually placed in the concave portion, and the cover tape 4 is heat-sealed to close the concave portion 6 for use. The mounting tape 2 has a strip shape having a constant width, and a rectangular recessed portion 6 is formed in a central portion in the width direction of the upper surface (in the upper and lower surfaces of the second drawing, the same applies hereinafter) at a predetermined interval, 7 320361 200909311. The portion of the lower surface corresponding to the recess is protruded. Further, the feed holes 8' are formed in the feed holes 8' at both ends in the twist direction of the placing tape 2, and the feed mechanism is engaged with the feed holes to be correctly conveyed. In the present embodiment, the width of the cover tape 4 is smaller than the width of the placement tape 2 and larger than the width of the concave portion 6. Thereby, the recessed portion 6 can seal the seal while not blocking the feed hole 8. The material for mounting the tape 2 is not limited, for example, "polyethylene terephthalate, polystyrene, polyester, polycarbonate, polyvinyl chloride.
(Polyvinyl chlovide)、聚丙烯腈(p0lyacryl0nitrite)」、ABS 樹脂之單層或積層薄膜均可使用。載置帶2之尺寸及口袋 之大小並無限制，但是通常所使用之例為，帶寬度約為 5mm以上120 mm以下，帶厚度12/z m以上50# m以下左 右’凹部6之尺寸為約（imin以上90皿1以下）x(lmm以 上90mm以下）x(〇.5以上3mm以下）。 載置帶2之欲熱封緘面16可為平滑面或經過打粗之 面。 覆蓋帶4係如第3圖所示，由有一定宽度的帶狀覆蓋 帶主體10，與在覆蓋帶主體1〇下表面側（與載置帶2之相 對面側）所形成的熱封層12之間所設之金屬蒸鍍層14及中 間層15所構成。於本實施例，金屬蒸鍍層14、中間層15、 熱封層12分別整面布置在覆蓋帶主體1〇之下表面。 本發明使用之覆蓋帶主體1〇之材質並不受限，例如 T使用I對本一曱酸乙二醋、聚醋、聚丙晞(p〇iypr〇pylene) 8 320361 200909311 等聚稀烴(Polyolefin)、聚酸胺(Polyamide)系合成纖維等之 聚醯胺、聚碳酸酯」等形成之單軸或双轴延伸薄片等，亦 可以單層或多種積層狀態使用。覆蓋帶主體10之厚度亦不 受限，但是以12/zm以上50/zm以下為宜。如為12/zm 以上25/z m以下則最佳。過厚則製造成本高，過薄則強度 不足，硬度差而使用不方便。 熱封層12，只要含有能藉加熱暫時軟化後硬化而發揮 黏附力之熱封劑即可，而此等熱封劑有「聚酯系樹脂、聚 驗系樹脂、聚胺酯（Urethan)系樹脂、乙嫦-乙烯酯共聚物、 乙烯-不飽和羧酸共聚物、乙烯-烯烴共聚物等之聚烯烴系 樹脂，（曱基）丙烯酸系樹脂、苯乙烯系嵌段聚合物」、合成 橡膠或天然橡膠等中選擇一種或二種以上等。 熱封層12之厚度並不受限，約5/zm以上60/zm以 下為佳。過薄時黏合力不足，過厚則恐從黏合部溢出。較 佳之熱封層12之厚度為10//m以上50//m以下，最好則 為25 /z m以上35 /z以下。 金屬蒸鍍層14之種類並不受限，可選擇鋁、金、銀、 銅，鋅、或此等之合金等，較好為蒸鍍於熱封層12上者。 其中鋁較低廉而且電傳導性及耐蝕性佳，並可打薄至不阻 碍視認性之程度。再者，蒸鍍鋁之PETP等對空氣有高屏 障性。 至於金屬蒸鍍層14之厚度，可設定在20A以上150A 以下之範圍内。 中間層15之材質並不受限，例如可使用PE、PP等 9 320361 200909311 高分子聚合體合成樹脂等，其係加熱熔融於覆蓋帶主體ίο 與熱封層12之間而有接合覆蓋帶主體10與熱封層12之功 效。中間層15之厚度並無限制，但是以10 // m以上3 0 m以下為宜。 本實施方式之覆蓋帶4之製造方法如下。 首先，在覆蓋帶主體10之下表面側（與載置帶2相對 面侧）蒸鍵铭或銘合金形成金屬蒸鐘層14。在形成金屬蒸 鍍層14之覆蓋帶主體10與熱封層12之間以加熱溶融狀態 熔入構成中間層15的合成樹脂（PE、PP等之高分子聚合 物合成樹脂）壓接覆蓋帶主體10與熱封層12。如此以所 謂擠壓叠層方式製造載置帶用覆蓋帶（覆蓋帶4)。 依據本實施方式之載置帶用之覆蓋帶（覆蓋帶4)及具 備前者之帶狀搬送體1，因在覆蓋帶主體10與熱封層U 之間形成金屬蒸鍍層14，可如第4圖所示，當自載置帶2 剝離覆蓋帶4時，既使覆蓋帶4與載置帶2有帶電，亦可 通過金屬蒸鍍層14引導帶電t荷之反極性電荷而可中和 靜電，如是可防止如第4圖在覆蓋帶4之剝離面吸附電子 零件之現象。又，可防止因留存於覆蓋帶4之電荷與載置 帶4之間放電而損傷電子零件w。 又，金屬蒸鍍層14不必接地，亦可因金屬蒸鍍層14 本體之屏蔽功效而可抑制帶電之影響。 熱封層12與覆蓋帶主體10之間因設有金屬蒸鍍層 12，因此收容於載置帶2的凹部6之電子零件w與金屬蒸 鍍層14不直接接觸，可抑制金屬粉等附着於電子零件之影 10 320361 200909311 響。 又，熱封層12因直接接合於載置帶2，在低温條件下 亦可確保載置帶2與覆蓋帶4之接合強度，因此接合時之 温度條件可設定在較低，而可大幅減低對覆蓋帶4本體之 熱損傷。 再者，金屬蒸鑛層14之厚度，可較自由設定而無需 考慮接合性，在可確保視認性之同時亦可得到高抑制帶電 影響之效果。於本實施方式，金屬蒸鍍層14之厚度設定在 ί 20A以上與150A以下之範圍内，可確實奏效因電荷移動 之中和效應，而且，可確保覆蓋帶4之透明度提高視認性。 又，因金屬蒸鍍層14不露出在外，故亦可防止金屬 蒸鍍層14因氧化而劣化。 又，因金屬蒸鍍層14係由鋁或鋁合金所構成，可得 因電荷移動良好且順暢之中和效應。又，蒸鍍鋁或鋁合金 之ΡΕΤΡ等對空氣有高屏障性，可確實防止收容於載置帶 γ 之電子零件等之劣化。 t.. 於本實施方式，因在覆蓋帶主體10與熱封層12之間 設有由合成樹脂所構成之中間層15，可由此中間層15吸 收覆蓋帶主體10與熱封層12之厚度散差，而使覆蓋帶4 整體之厚度均句。又，可改變此中間層15之厚度來調整覆 蓋帶4之熱傳導率，而可提供對應各種熱封温度之覆蓋帶 4 ° 又，於本實施方式之覆蓋帶4，係在形成金羼蒸鍍層 14之覆蓋帶主體10與熱封層12之間熔入加熱熔融之合成 11 320361 200909311 樹脂接合構成之中 此在成形時不易森三9 5，即所謂擠壓叠層法所成形，因 而大幅提高作業效’亦可抑制因帶電發生敏紋， 再太餘 亦即連與载置册:知方式’覆蓋帶主體10之背面整面， *易發生未二:接合部亦形成有金屬蒸錄層14,因此 丨* f電之局部領域， 時，亦少有被覆蓋帶4无使在電子零件W微小 Μ之局~電領域吸附之虞。 f有金屬蒸心蓋帶主體1〇之背面整面形成 層之情形工之接合部省略金屬蒸鏟 提高覆蓋帶2之良品率:㈣續部分進行遮罩，故亦有 至於在金屬蒸鍍層14所產 丄 在捲取帶狀搬送體i之捲取筒邊;：：除方法為: 在剝離過之覆芸帶4之餘如-屬魏層14接地，或 一 邊經過除電輥筒使金屬墓㈣ Μ接地亦可，或在任意處由除電針=金屬剩 〇亦可，或在任何處利較流”放連接 層Μ供給異極性離子使令和之方法亦可除電盗對金屬蒸鑛 身有以==不接地時，因金屬蒸_本 负1屏敝之作用而可抑制帶電之影響。 ♦ 其次，參照第5圖說明本發明3… 第2實施方式，其特徵為覆蓋帶4之只知方式。於此 金屬蒸錢層Μ而宽度方向兩㈣央部加厚 此在金屬蒸鍍層14之中央㈣ =層14。如 零件相對布置之中央部，可有良好且順 320361 12 200909311 以提高中和效應。薄料部14B與厚料部14A個別之厚度並 無限制，具體的例為：厚料部14 A為7 0 A以上15 0 A以下， 薄料部14B為20A以上100A以下為宜。 其次，參照第6圖說明第3實施方式。此第3實施方 式與第2實施方式相反，其特徵為覆蓋帶4之寬度方向中 央部削薄金屬蒸鍍層14而寬度方向兩端部加厚金屬蒸鍍 層14。若如此地在金屬蒸鍍層14之中央部形成薄料部 14B，則流經覆蓋帶4長度方向之電流多在遠離電子零件w 之厚料部14A流過，因此有可降低電子零件受異常電流之 影響的優點。厚料部14A與薄料部14B個別之厚度並無限 制，具體的例為：厚料部14A為70A以上150A以下，薄 料部14B為20A以上100A以下為宜。 其次，參照第7圖說明本發明之第4實施方式。於此 第4實施方式，其特徵為設在覆蓋帶4之金屬蒸鍍層14 係在覆蓋帶4之長度方向區劃為多數個區域14C，相隣之 各區域14C係由相同之金屬蒸鍍層14所成之保險絲（易溶 絲fuse)部14D互相導通。具體而言，於此實施方式，在 帶子長度方向之每一定間隔形成向金屬蒸鍍層14之寬度 方向延伸而相對之多數成對之邊緣(margin)20，且構成為 在各對邊緣20之間留有保險絲部14D。 如此形成保險絲部14D時，當電荷異常累積於金屬蒸 鍍層14，而於帶子長度方向瞬間流過大電流時，總會有某 一保險絲部14D熔斷，而可限制損傷僅在局部產生。另， 自外部（例如捲取筒方，或安裝裝置方）流入異常高電流至 13 320361 200909311 金屬蒸鍍層14時，保險絲14D亦會熔斷而控制損傷之發 生。 區域14C之長度並無限制，一般為約30匪至1 m左 右為宜。當區域14C過長時則形成保險絲之效果不佳，但 過短時製造成本高，且效果又不因此而提高。 保險絲14D(於帶子之長度方向）之長度並無限制，但 是通常為0.2mm.以上3臟以下即可。最好是0.4腿以上0.8 mm以下。保險線部14D如過長則邊緣20之面積會增加而 有恐影響電荷之良好順暢移動而致之中和效應之虞，過短 則難於形成。又，保險絲部14D(於帶子之寬度方向）之寬 度並無限制，但是一般為0.2醒以上3醒以下即可。最好 是0.3腿以上0.7 mm以下。寬度如過大則遇異常電流時也 難以熔斷，寬度過小則遇不致有壤影響之微弱電流也會熔 斷。.. 形成邊緣20之方法，可考慮雷射法、油邊緣（Oil Margin)法、帶子邊緣(Tape Margin)法等。雷射法係在中間 層15蒸鍍帶狀之金屬蒸鍍層14之後，對此金屬蒸鍍層14 一邊掃描一邊照射雷射光，而使照射部分之金屬蒸鍍層14 蒸發以作成邊緣20之方法。對應保險絲14D之部分可事 先用遮光體遮住即可。油邊緣法為在中間層15之該形成邊 緣部分附着微量氟系油後，蒸鍍成金屬蒸鍍層14，利用氟 系油妨碍蒸鍍現象之方法。帶子邊緣法係在欲形成邊距20 之部分貼上細帶子作為遮罩而進行蒸.鑛之方法。 其次，參照第8圖說明本發明之第5實施方式。於此 14 320361 200909311 第5貫施方式，其特徵為於覆蓋帶*之宽度方向中央 ^金屬威層14(14A)，而寛度方向兩端部削薄金 層14(14B)，再在宽度方向中央部形成保險絲部14Dj :::金屬瘵鍍層14之中央部形成厚料部14A’及保險絲部 1在與電子零件相對布置之中央部，可有良好且順 ㈣荷移動而可以提高中和效應，而且，萬—沿金屬篡 錢層14流過異常電流時，保險絲部md㈣斷而可減低 ..損害。 ' …1第5實施方式之變形例，可如f 8圖中括弧内所示覆 盍之寬度方向中央部之金屬蒸鍵層 14削薄（14B)，宽 =向㈣部加厚金屬蒸· 14(14A)，再在寬度方向中 邮抑成保險絲14D亦可。如此在金屬蒸錢部14之中央 =薄料部14B與保險絲部⑽，可使保險絲 異常電流敏銳反應。 「施方照第^說明本發明第6實施方式。此第6實 、藉由:此構:為;；^帶4之一側緣形成保險絲部14D。 區域⑽之邊緣部流過之優點。^不相對布置之 其次參照第10圖說明太旅叩 — 徵為Up 4 月本發明之第7實施方式。其特 屬錢々14,更在薄料部j 妨之區域加尽金 成，由厚料部UA可提高電子愛件成保險絲部由此構 荷移動所致之中和效應，而保險好而順暢之因電 版乐口丨14D在薄料部14B内 320361 15 200909311 則可使保險絲效應敏鋭。 第7實施方式亦可有變形例，沿覆蓋帶4之一侧緣部 之狹窄帶狀部分加厚金屬蒸鍍層14(14A)，而在沿覆蓋凹 部6之另一側緣部方之區域削薄金屬蒸鍍層14,更在厚料 部14A形成保險絲部14D亦可。由此構成，可有於與電子 零件w不相對布置之厚料部14A集中通過電流並可得保險 絲效應之優點。 以上說明載置帶用之覆蓋帶及帶狀搬送體，但是本發 明並不受上述說明之限制，在不脱離本發明之技術思維之 範圍内可適當變更。 例如設於載置帶之凹部形狀、大小或布置等並不受限 於本實施方式。 【圖式簡單說明】 第1圖係本發明第1實施方式之備有載置帶用覆蓋帶 之帶狀搬送體之平面圖。 第2圖係第1圖所示之帶狀搬送體之側面圖。 第3圖係第1圖所示之帶狀搬送體之剖面放大圖。 第4圖係第1圖所示之帶狀搬送體之載置帶用覆蓋帶 與載置帶之剝離狀態說明圖。 第5圖係本發明第2實施方式之載置帶用覆蓋帶之平 面圖。 第6圖係本發明第3實施方式之載置帶用覆蓋帶之平 面圖。 第7圖係本發明第4實施方式之載置帶用覆蓋帶之平 16 320361 200909311 面圖。 第8圖係本發明第5實施方式之載置帶用覆蓋帶之平 面圖。 第9圖係本發明第6實施方式之載置帶用覆蓋帶之平 面圖。 第10圖係本發明第7實施方式之載置帶用覆蓋帶之 平面圖。 【主要元件符號說明】 1 帶狀搬送體 2 載置帶 4 覆蓋帶（載置帶用覆蓋帶） 6 凹部 8 進給孔 10 覆蓋帶主體 12 熱封層 14 金屬蒸鍍層 14A 厚層部 14B 薄層部 14C 領域 14D 保險絲部 15 中間層 16 熱封緘面 w 電子零件 17 320361A single layer or a laminate film of (Polyvinyl chlovide), polyacrylonitrile (p0lyacryl0nitrite), or ABS resin can be used. The size of the mounting tape 2 and the size of the pocket are not limited, but generally, the tape width is about 5 mm or more and 120 mm or less, and the tape thickness is 12/zm or more and 50 or less or less. The size of the concave portion 6 is about (imin above 90 dishes 1 or less) x (lmm or more and 90 mm or less) x (〇.5 or more and 3 mm or less). The heat sealing surface 16 on which the tape 2 is placed may be a smooth surface or a roughened surface. As shown in Fig. 3, the cover tape 4 is a heat-sealing layer formed of a belt-shaped cover tape main body 10 having a certain width and a lower surface side of the cover tape main body 1 (on the side opposite to the mounting tape 2). The metal vapor-deposited layer 14 and the intermediate layer 15 are provided between the two. In the present embodiment, the metal deposition layer 14, the intermediate layer 15, and the heat seal layer 12 are respectively disposed on the entire surface of the cover tape main body 1 . The material of the cover tape main body 1 used in the present invention is not limited. For example, T uses a pair of polyether (Polyolefin) such as ethyl acetoacetate, polyacetic acid, polyacrylic acid (p〇iypr〇pylene) 8 320361 200909311. A uniaxial or biaxially stretched sheet formed of a polyamide or a polycarbonate such as a polyamide-based synthetic fiber may be used in a single layer or in a plurality of layers. The thickness of the cover tape main body 10 is also not limited, but it is preferably 12/zm or more and 50/zm or less. If it is 12/zm or more and 25/z m or less, it is the best. If the thickness is too thick, the manufacturing cost is high, if the thickness is too thin, the strength is insufficient, the hardness is poor, and the use is inconvenient. The heat seal layer 12 may contain a heat sealant which can be temporarily softened by heating and then hardened to exhibit an adhesive force. These heat sealants include "polyester resin, polymer resin, and Urethan resin. Ethylene-vinyl ester copolymer, ethylene-unsaturated carboxylic acid copolymer, polyolefin-based resin such as ethylene-olefin copolymer, (fluorenyl) acrylic resin, styrene-based block polymer, synthetic rubber or natural One or two or more types of rubber and the like are selected. The thickness of the heat seal layer 12 is not limited, and is preferably about 5/zm or more and 60/zm or less. When the thickness is too thin, the adhesion is insufficient. If it is too thick, it may overflow from the adhesive portion. The thickness of the heat seal layer 12 is preferably 10/m or more and 50/m or less, and more preferably 25/z m or more and 35/z or less. The type of the metal deposition layer 14 is not limited, and aluminum, gold, silver, copper, zinc, or the like may be selected, and it is preferably deposited on the heat seal layer 12. Among them, aluminum is cheaper and has good electrical conductivity and corrosion resistance, and can be thinned to the extent that it does not hinder visibility. Furthermore, PETP such as aluminum vapor deposition has high barrier to air. The thickness of the metal deposition layer 14 can be set in the range of 20 A or more and 150 A or less. The material of the intermediate layer 15 is not limited. For example, PE, PP, etc. 9 320361 200909311 polymer synthetic resin or the like can be used, which is heated and melted between the cover tape main body ίο and the heat seal layer 12 to have a joint cover tape main body. The effect of 10 and heat seal layer 12. The thickness of the intermediate layer 15 is not limited, but it is preferably 10 // m or more and 30 m or less. The manufacturing method of the cover tape 4 of this embodiment is as follows. First, the metal vapor layer 14 is formed by steaming a key or a metal on the lower surface side of the cover tape main body 10 (on the side opposite to the mounting tape 2). The synthetic resin (polymer synthetic resin such as PE or PP) constituting the intermediate layer 15 is melted and melted between the cover tape main body 10 forming the metal vapor-deposited layer 14 and the heat seal layer 12, and the cover tape main body 10 is crimped. With the heat seal layer 12. Thus, the cover tape for the mounting tape (covering tape 4) is manufactured by a so-called extrusion lamination method. According to the cover tape (covering tape 4) for mounting a tape according to the present embodiment, and the tape-shaped conveyance body 1 having the former, the metal vapor-deposited layer 14 is formed between the cover tape main body 10 and the heat seal layer U, and the fourth layer can be formed as the fourth As shown in the figure, when the cover tape 4 is peeled off from the mounting tape 2, even if the cover tape 4 and the mounting tape 2 are charged, the reverse polarity charge charged by the t-charge can be guided by the metal deposition layer 14 to neutralize the static electricity. Therefore, the phenomenon of adsorbing electronic parts on the peeling surface of the cover tape 4 as shown in Fig. 4 can be prevented. Further, it is possible to prevent the electronic component w from being damaged by the discharge between the electric charge remaining on the cover tape 4 and the mounting tape 4. Further, the metal deposition layer 14 does not have to be grounded, and the influence of charging can be suppressed by the shielding effect of the body of the metal deposition layer 14. Since the metal vapor-deposited layer 12 is provided between the heat seal layer 12 and the cover tape main body 10, the electronic component w accommodated in the recessed portion 6 of the mounting tape 2 does not directly contact the metal vapor-deposited layer 14, and the adhesion of metal powder or the like to the electrons can be suppressed. The shadow of the part 10 320361 200909311 is ringing. Further, since the heat seal layer 12 is directly bonded to the mounting tape 2, the bonding strength between the mounting tape 2 and the cover tape 4 can be ensured under low temperature conditions, so that the temperature condition at the time of bonding can be set low, and the temperature can be greatly reduced. Thermal damage to the body of the cover tape 4. Further, the thickness of the metallized layer 14 can be set freely without considering the bonding property, and the effect of suppressing the influence of charging can be obtained while ensuring visibility. In the present embodiment, the thickness of the metal deposition layer 14 is set to be in the range of ί 20A or more and 150A or less, and the effect of neutralizing the charge movement can be surely effected, and the transparency of the cover tape 4 can be ensured to improve the visibility. Further, since the metal deposition layer 14 is not exposed, it is possible to prevent the metal deposition layer 14 from being deteriorated by oxidation. Further, since the metal deposition layer 14 is made of aluminum or an aluminum alloy, it is possible to obtain a smooth and moderate effect due to the charge movement. Further, the vapor-deposited aluminum or aluminum alloy has a high barrier property against air, and can reliably prevent deterioration of electronic components and the like housed in the mounting tape γ. In the present embodiment, since the intermediate layer 15 composed of synthetic resin is provided between the cover tape main body 10 and the heat seal layer 12, the intermediate layer 15 can absorb the thickness of the cover tape main body 10 and the heat seal layer 12 The dispersion is made, and the thickness of the cover tape 4 as a whole is uniform. Moreover, the thickness of the intermediate layer 15 can be changed to adjust the thermal conductivity of the cover tape 4, and the cover tape 4° corresponding to various heat-sealing temperatures can be provided. In the cover tape 4 of the present embodiment, the gold-plated vapor deposition layer is formed. 14 The cover tape main body 10 and the heat seal layer 12 are melted and melted by fusion. 11 320361 200909311 Among the resin joint structures, it is difficult to form at the time of forming, which is a so-called extrusion lamination method, thereby greatly improving The operation effect can also suppress the occurrence of sensitive lines due to electrification, and even if it is too much, it is connected to the mounting book: the known method is to cover the entire surface of the back side of the main body 10, and it is easy to occur: the metal vapor layer is also formed at the joint portion. 14, therefore, the local area of 丨*f electricity, when there is little coverage of the belt 4 does not make the electronic parts W tiny Μ Μ ~ ~ ~ ~ ~ 虞 虞 虞. f There is a metal vapor core cover with the main surface of the main body 1 形成 the entire surface of the layer is formed. The joint portion of the metal shovel is omitted to improve the yield of the cover tape 2: (4) the continuation of the mask, so there is also a metal deposition layer 14 The sputum produced is wound on the side of the take-up reel of the belt-shaped transport body i;:: The method of removal is: after the stripped strip 4 is grounded, such as the Wei layer 14 is grounded, or the metal tomb is passed through the de-energized roller (4) Μ grounding can also be used, or at any place by removing the electric needle = metal remaining, or at any place, the flow can be connected to the connection layer, and the method of supplying the opposite polarity can also be used to remove the metal from the metal. When the == is not grounded, the influence of charging can be suppressed by the action of the metal steaming_negative negative screen. ♦ Next, the third embodiment of the present invention will be described with reference to Fig. 5, which is characterized by covering the belt 4. Only know the way. The metal steaming layer is Μ and the width direction of the two (four) central part is thickened in the center of the metal evaporation layer 14 (four) = layer 14. If the central part of the relative arrangement of the parts, there is good and smooth 320361 12 200909311 Improve the neutralization effect. There is no limit to the thickness of the thin portion 14B and the thick portion 14A. Specifically, the thick portion 14 A is 70 A or more and 150 A or less, and the thin portion 14B is preferably 20 A or more and 100 A or less. Next, a third embodiment will be described with reference to Fig. 6. This third embodiment and the third embodiment In the second embodiment, the metal vapor-deposited layer 14 is thinned at the central portion in the width direction of the cover tape 4, and the metal vapor-deposited layer 14 is thickened at both end portions in the width direction. Thus, a thin material is formed in the central portion of the metal deposition layer 14 in this manner. In the portion 14B, since the current flowing in the longitudinal direction of the cover tape 4 flows mostly in the thick portion 14A away from the electronic component w, there is an advantage that the electronic component can be affected by the abnormal current. The thick portion 14A and the thin portion 14B The specific thickness is not limited, and specific examples include that the thick portion 14A is 70 A or more and 150 A or less, and the thin portion 14B is preferably 20 A or more and 100 A or less. Next, a fourth embodiment of the present invention will be described with reference to Fig. 7. In the fourth embodiment, the metal deposition layer 14 provided on the cover tape 4 is divided into a plurality of regions 14C in the longitudinal direction of the cover tape 4, and the adjacent regions 14C are formed by the same metal deposition layer 14. Fuse (easy-dissolving wire fuse) part 14D mutual Specifically, in this embodiment, a plurality of pairs of edges 20 extending in the width direction of the metal deposition layer 14 are formed at a constant interval in the longitudinal direction of the tape, and are formed at each pair of edges 20 When the fuse portion 14D is formed as described above, when the electric charge is abnormally accumulated in the metal vapor-deposited layer 14 and a large current flows instantaneously in the longitudinal direction of the tape, a certain fuse portion 14D is always blown, and the damage can be restricted. It is only generated locally. In addition, when an abnormally high current flows into the metal vapor-deposited layer 14 from the outside (for example, the winding cylinder or the mounting device), the fuse 14D is also blown to control the occurrence of damage. The length of the region 14C is not limited, and is generally about 30 匪 to 1 m. When the region 14C is too long, the effect of forming a fuse is not good, but when it is too short, the manufacturing cost is high, and the effect is not improved. The length of the fuse 14D (in the longitudinal direction of the tape) is not limited, but it is usually 0.2 mm or more and 3 or less. It is preferably 0.4 or more and 0.8 mm or less. If the fuse portion 14D is too long, the area of the edge 20 increases, and there is a fear that the charge is smoothly moved smoothly and the neutralization effect is too short to be formed. Further, the width of the fuse portion 14D (in the width direction of the tape) is not limited, but it is generally 0.2 or more and 3 awake or less. It is preferably 0.3 or more and 0.7 mm or less. If the width is too large, it will be difficult to fuse when it encounters an abnormal current. If the width is too small, the weak current will not be melted if it does not affect the soil. .. The method of forming the edge 20 may be a laser method, an oil margin method, a tape margin method, or the like. The laser method is a method in which the metal vapor-deposited layer 14 is vapor-deposited in the intermediate layer 15, and the metal vapor-deposited layer 14 is irradiated with the laser light while scanning, and the metal vapor-deposited layer 14 of the irradiated portion is evaporated to form the edge 20. The part corresponding to the fuse 14D can be covered with a light shielding body. The oil edge method is a method in which a trace amount of fluorine-based oil is adhered to the edge portion of the intermediate layer 15 and then vapor-deposited to form the metal vapor-deposited layer 14 to prevent vapor deposition by the fluorine-based oil. The tape edge method is a method in which a thin band is attached as a mask to form a portion of the margin 20 to be steamed. Next, a fifth embodiment of the present invention will be described with reference to Fig. 8. The 14th embodiment of the present invention is characterized in that the metal layer 14 (14A) is covered in the width direction of the cover tape*, and the gold layer 14 (14B) is thinned at both ends in the twist direction, and then in the width. The central portion of the direction forms a fuse portion 14Dj ::: the central portion of the metal ruthenium plating layer 14 forms a thick portion 14A ′ and the fuse portion 1 is disposed at a central portion opposite to the electronic component, and can have a good and smooth movement to improve neutralization. The effect, and, if the abnormal current flows through the metal money layer 14, the fuse portion md (4) is broken and the damage can be reduced. In the modification of the fifth embodiment, the metal vapor-bonding layer 14 in the central portion in the width direction of the cover shown in the parentheses in the figure f 8 is thinned (14B), and the width = the thickened metal in the (four) portion. 14 (14A), and then in the width direction, the fuse 14D can also be. Thus, in the center of the metal steaming portion 14 = the thin portion 14B and the fuse portion (10), the fuse abnormal current can be reacted sharply. The sixth embodiment of the present invention will be described. The sixth embodiment is characterized in that: the side of one of the strips 4 forms a fuse portion 14D. The advantage of the edge portion of the region (10) flows. The relative arrangement is described next with reference to Fig. 10, which illustrates the seventh embodiment of the present invention. The special embodiment is Qian Qian 14, and the gold material is added to the area of the thin material portion. UA can improve the neutralization effect caused by the movement of the electronic love parts into the fuse part, and the insurance is smooth and smooth. The electric version of the music port 14D is in the thin material part 14B 320361 15 200909311, which can make the fuse effect sensitive. In the seventh embodiment, a modified portion may be used in which the metal vapor-deposited layer 14 (14A) is thickened along the narrow band portion of one side edge portion of the cover tape 4, and the region along the other side edge portion of the cover recess portion 6 is formed. The metal vapor-deposited layer 14 may be thinned, and the fuse portion 14D may be formed in the thick portion 14A. Thus, the current may be concentrated by the thick portion 14A disposed opposite the electronic component w, and the fuse effect may be obtained. The cover tape and the belt-shaped transport body for mounting the tape are described above, but the present invention is not The limitations of the above description can be appropriately changed without departing from the technical scope of the present invention. For example, the shape, size, arrangement, and the like of the concave portion provided on the mounting tape are not limited to the present embodiment. 1 is a plan view of a belt-shaped conveyance body provided with a cover tape for a mounting tape according to a first embodiment of the present invention. Fig. 2 is a side view of the belt-shaped conveyance body shown in Fig. 1. Fig. 4 is an enlarged cross-sectional view showing the strip-shaped conveying body shown in Fig. 1. Fig. 4 is a view showing a state in which the tape for the tape-shaped conveying body shown in Fig. 1 is peeled off from the mounting tape. Fig. 6 is a plan view of a cover tape for a mounting tape according to a third embodiment of the present invention. Fig. 7 is a plan view of a mounting tape according to a fourth embodiment of the present invention. Fig. 8 is a plan view of a cover tape for a mounting tape according to a fifth embodiment of the present invention. Fig. 9 is a plan view showing a cover tape for a mounting tape according to a sixth embodiment of the present invention. Figure 10 is a cover tape for a mounting tape according to a seventh embodiment of the present invention. Fig. [Description of main component symbols] 1 Ribbon conveyor 2 Mounting tape 4 Cover tape (covering tape for mounting tape) 6 Concave portion 8 Feed hole 10 Cover tape body 12 Heat seal layer 14 Metal deposition layer 14A Thick layer Portion 14B Thin layer portion 14C Field 14D Fuse portion 15 Intermediate layer 16 Heat sealing surface w Electronic parts 17 320361