200908439 九、發明說明： 【發明所屬之技術領域】 本發明所屬之技術領域為通訊系統用的一種晶片型超寬頻天線，可應用於行 動通訊系統、無線網路、超寬頻網路、802 11a、UWB高頻段及更高的頻帶中。 【先前技術】 近年來無線通訊元件之需求’隨著各種消費性電子產品之開發，發展迅速及 多樣化’此些電子產品包括手機、PDA、藍芽耳機、車用電視及導航系統、無 線滑鼠、無線鍵盤、無線稱卡等，各觀費性電子產品使㈣通訊頻率大都 不同’故適用於不關帶或系統之天線也陸續被開發出來。目前主要之產品包 括· 1.行動通訊系.统，主要應用頻率範圍為824_1990MHz。2.無線網路，主要 應用頻率範圍為2.4G±l_Hz，3.超寬頻網路，主要應用頻率範圍為 3GHZ-4. 2GHP4. 802.11a，主要應用頻率範圍為5 2GHz_5.職。5.麵高頻段， 主要應㈣率細為6ΰίίΖ-·ζ。目前已帛發之天線產品大都只_於某頻帶， 而無法涵蓋所有鮮’且目前已開發之天線產品主要適祕3 以下，如美 國專利US7176838、US20070069954，某些天線產品只適用於單一頻帶，如美國 專利US7119747。而使用於消費性電子產品中天線之尺寸也很重要，目前大部 刀同頻天線均有尺寸過大整合不易等缺點，如中華民國專利1283柳。目前眾多 的無線產品’如使用頻率不同，即需使用各種不同之天線，且如某電子產品需 涵蓋多種通赠統，即需喊多種天線，因此造成組件設計困難度及製造成本 之增加。 其次’利时電材觀作成的電容結構，早已被廣泛運用在各類型的產業 上，舉凡半導體相關的運算處理元件，記憶相關元件，或是高頻通訊元件，都 需要大量的電#結構。而在㈣元件部分，仰賴電磁波的傳播來做訊號的傳輸， 200908439 其傳播特性深受媒介物質的材料特性或_結_響n有相當大量的研 九集中在探討及開發適當的材料上。目前應胁碰通訊巾*廣泛被研究的介 電材料，包括了鈦義（SrTi03)、鈦酸鋇（BaTi〇3)、鈦酸鑛（臉Ti〇3) (Pb&™3)等等°鈦_鋇雖然在美國專利US 5,427,998中已被 應用在微波7L件上，但是介電損及其他性質仍有改善空間；而美國專利⑽ 5’427,988辦同時混和鈦酸鳃鋇及氧化鎮（Mg〇)可具有低的介電損以及高的 調變1±質n巾數不南。峨而言，此類介電性質的改善，通常都會伴隨 著另ί生質的劣化，因此如何降低材料之介電損耗、穩定並提高材料之調變性， 是當前研究開發所需克服的一大難題。 近年來由於無線傳輸功能大量應用在各種消費性電子產品上，市場需求不 斷擴大，然在各種電子產品尺寸之縮小、髓f及化及組件度提高之要求 下，為因應消費性電子產品此—發展趨勢，急需研發—種尺寸體積小、適用於 多頻帶及敎性高之通訊天線，以符合时料性電子產品無線傳輸之需求。 發明人爰因與此’本於積極發明之精神，亟思一種可以解決上述問題之 種晶片型超寬頻天線」’幾經實驗終至完成此項嘉惠無線通訊產業之發明。 【發明内容】 本發明係提出應用於消費性電子產品通訊系統用的一種晶片型超 1 ’此天線本難以鐵氧磁體及麵鮮材料駐，加上平減多層式電路讯 计所組成，本發明的晶片型超寬頻天線是將各種頻段整合在 2 用多舊及m 早—紐之磁。歧線具有體積小、適 2多頻帶及叙_伽，可祕行_，行_纽 = 頻網路、脱Ua及_高頻段等頻帶 «路超寬 此天線製作方式是细多層鐵氧磁體及玻璃鱗材料為主，經㈣當粉末調 200908439 配、漿體研磨、烘乾、刮刀成型及打孔製作成生胜，鐵氧磁體可為錦辞鐵氧磁 體、錦銅鋅鐵氧磁趙、銅鋅鐵氧磁體、鎂銅辞鐵氧磁體、輯辞鐵氧磁體、破 璃粉、氧化錄、氧化錯粉等鳴料，必射可添加各翻燒劑如氧化銷、 氧化鶴、氧縫、氧她、氧蝴、氧化銅、氧化缺氧切縣降低燒結溫 度。利用多層平面式(pw)共雜es_ete)原理，使每一層各諸振於不同頻帶， 針對各種通訊元件之需求，層數轉以4層(含)以上為主，在各層網印不同譜振 的朽瓣狀金屬電路，此電路組成可以一種或一種以上添加選自金、銀、纪、 銅、鉬、鎢、鎳、鉻、鋁、鈕、鉑、鎊、銻、鳃、釩、銦、錫、辞、鈦、磷、 鈮、鎖、錢、釕、妖、錯、鐵、給'銖、鎮、叙、碳等不同元素所形成之單一 金屬或合金’在元件中經由適當連結匹配而成，多層喊生胚及平板狀電路， 經由低溫共燒(LTCC)方式’壓合燒結成型，形成單一的被動元件，通常燒結溫 度介於SOOtMlOOt。此天線不需以接頭連接，可以表面黏著(SMD)方式内建在 各種母板上。本發明之晶片型超寬頻天線經由全頻段的測試顯示，能適用於 O.MOGHz範圍。如無線產品有多種通訊系統，過去需使用多種天線，使用本發 明的晶片型超寬頻天線，僅需-種天線’即可涵蓋全部㈣，大幅降低通訊組 件設計困難度及製造成本，是-種非常先進的無線通訊元件，目前尚無相類似 功能及設計之產品被提出。 本發明突破現有技術瓶頸，極具新穎性及市場競爭力，由於確有增進功效， 故依法申請發明專利。 【實施方式】 【實施例一】 本發明利用鐵氧磁體及玻璃粉等材料為例，陶瓷胚體以 (CuOMNiOnZnCW WFeaO3)^加3%玻璃粉經由適當粉末調配，濕式漿體研磨2〇 8 200908439 小時混合均勻後，於2〇〇。〇以下溫度烘乾及過篩備用，最後刮刀成型及打孔製作 成生胚，生胚尺寸為5xl2x〇.5mm。本發明基本架構如圖一共八層(L1-L8)，每一 層陶曼胚體均以鐵氧磁體加玻璃粉為主，在各層網印不同諧振的planar狀金屬電 路，此電路組成以銀膠為主，在元件中經由如圖一之連結匹配而成，多層陶瓷 生胚及平板狀電路經由疊壓及網印成型，經由低溫共燒方式，壓合燒結成型， 燒結溫度為85(TC，形成單一的被動元件。L1-L5層為諧振於各頻帶平板層，L6-L7 為匹配電路，L8為底層的連接層，基本上各有3輸入及輸出端，可以不需以接頭 連接而内建在PCB板陶瓷板及其他母板上。此天線經由全頻段的測試，如第二圖 顯示此天線在0.1-8GHZ均能正常運作。 【實施例二】 本發明利用鐵氧磁體及玻璃粉等材料為例，陶瓷胚體以 (CuChoNiC^ZnC^oWFe2。3；^·5加10%玻璃粉經由適當粉末調配，濕式衆體研磨2〇 小時混合均勻後，於2〇(TC以下溫度烘乾及過篩備用，最後刮刀成型及打孔製作 成生胚，生胚尺寸為5x15x0.5mm。本發明基本架構如圖一共八層，每一 層陶瓷胚體均以鐵氧磁體加玻璃粉為主，在各層網印不同諧振的朽如叮狀金屬電 路，此電路組成以銀膠為主，在元件中經由如圖一之連結匹配而成，多層陶瓷 生胚及平板狀電路經由疊壓及網印成型，經由低溫共燒方式，壓合燒結成型， 燒結溫度為850°C ’形成單-的被動元件。U_L5層麟振於各頻帶平板層，L6_L7 為匹配電路’ L8為底層的連接層’基本上各有3輸入及輸出端，可以不需以接頭 連接而内建在PCB板及其他母板上。此天線經由全頻段制試，如第三圖、第四 圖及第五醜示此天線在G.1-8GHz、G.l-2GGhz及G. 1-4GGHZ均能正常運作。 表τ、上所述，本發明於習知技術領域上無相關之技術揭露，已具新穎性；本 發明之技抽容可確倾決該領域之醜，且方法原理非屬根卿知技藝而易 於完成者’不論在目的、製程、效用及市場競爭力上，皆有別於原有之技術， 實具進步性，誠已符合專利法中所規定之發明專利要件。 200908439 【圖式簡單說明】 第一圖係本發明晶片型超寬頻天線結構示意圖。 第二圖係實施例一於0.1-8GHZ全頻段的測試圖。 第三圖係實施例二於0.1-8GHZ全頻段的測試圖。 第四圖係實施例二於0.1-20GHZ全頻段的測試圖。 第五圖係實施例二於0.1 -40GHz全頻段的測試圖。 【主要元件符號說明】 L1 :第一層陶瓷本體示意圖 L2 :第二層陶瓷本體示意圖 L3 :第三層陶瓷本體示意圖 L4 :第四層陶瓷本體示意圖 L5 :第五層陶瓷本體示意圖 L6 :第六層陶瓷本體示意圖 L7 :第七層陶瓷本體示意圖 L8 :第八層陶瓷本體示意圖 (1) 平板狀金屬電路 (2) 各層連接金屬線路 (3) 輸出入端金屬電極200908439 IX. Description of the Invention: [Technical Field] The technical field to which the present invention pertains is a wafer type ultra-wideband antenna for a communication system, which can be applied to a mobile communication system, a wireless network, an ultra-wideband network, an 802 11a, UWB high frequency band and higher frequency band. [Prior Art] In recent years, the demand for wireless communication components has been rapidly developed and diversified with the development of various consumer electronic products. These electronic products include mobile phones, PDAs, Bluetooth headsets, car TVs and navigation systems, and wireless slides. Rats, wireless keyboards, wireless weighing cards, etc., all of which are cost-effective electronic products make (4) communication frequencies are different. Therefore, antennas that are not suitable for use or system are also being developed. At present, the main products include: 1. Mobile communication system, the main application frequency range is 824_1990MHz. 2. Wireless network, the main application frequency range is 2.4G ± l_Hz, 3. Ultra-wideband network, the main application frequency range is 3GHZ-4. 2GHP4. 802.11a, the main application frequency range is 5 2GHz_5. 5. Face high frequency band, the main should be (four) rate is fine 6 ΰ ίίΖ-·ζ. At present, most of the antenna products that have been produced are only in a certain frequency band, and cannot cover all the fresh and currently developed antenna products mainly suitable for the following 3, such as US patents US7176838, US20070069954, some antenna products are only applicable to a single frequency band. For example, U.S. Patent No. 7,119,747. The size of the antenna used in consumer electronics is also very important. At present, most of the same-frequency antennas have the disadvantages of oversize and integration, such as the Republic of China patent 1283. At present, many wireless products use different antennas, such as different frequency of use, and if an electronic product needs to cover multiple kinds of gifts, it is necessary to call a variety of antennas, resulting in difficulty in designing components and increasing manufacturing costs. Secondly, the capacitance structure made by Lee's Electric Materials has been widely used in various types of industries. For semiconductor-related arithmetic processing components, memory-related components, or high-frequency communication components, a large number of electrical structures are required. In the (4) component part, relying on the propagation of electromagnetic waves to transmit signals, 200908439 its propagation characteristics are deeply influenced by the material properties of the media or _ knots. There are quite a lot of researches on the development and development of appropriate materials. At present, the dielectric materials that should be widely used in communication, including titanium (SrTi03), barium titanate (BaTi〇3), titanate (face Ti〇3) (Pb&TM3), etc. Although titanium has been used in microwave 7L parts in U.S. Patent No. 5,427,998, there is still room for improvement in dielectric loss and other properties; while U.S. Patent (10) 5'427,988 is also mixing barium titanate and oxidized town (Mg). 〇) can have low dielectric loss and high modulation 1 ± quality n towel number is not south. In the case of 峨, the improvement of such dielectric properties is usually accompanied by the degradation of other biomass. Therefore, how to reduce the dielectric loss of the material, stabilize and improve the variability of the material is a major need for current research and development. problem. In recent years, due to the large-scale application of wireless transmission functions in various consumer electronic products, the market demand has been expanding. However, in response to the reduction in the size of various electronic products, the improvement of the size of the electronic products and the improvement of the components, it is in response to consumer electronic products. Development trend, urgent need for research and development - small size, suitable for multi-band and high-power communication antennas, in order to meet the needs of wireless transmission of electronic products. The inventor, in response to this, was in the spirit of active invention, and thought of a wafer-type ultra-wideband antenna that could solve the above problems. SUMMARY OF THE INVENTION The present invention is directed to a wafer type super 1 'this antenna which is difficult to use in ferromagnetic magnets and fresh materials, and is composed of a flat multi-layer circuit signal, which is used in a communication system for a consumer electronic product. The invention of the wafer type ultra-wideband antenna integrates various frequency bands into two types of old and m-new magnetic. The line has a small size, suitable for more than 2 frequency bands and _ _ gamma, secret line _, line _ 纽 = frequency network, off Ua and _ high frequency band, etc. «Road wide This antenna is made by fine multi-layer ferrite And glass scale material-based, by (4) when the powder is adjusted to 200908439, slurry grinding, drying, scraper forming and drilling to make a success, ferrite magnets can be Jinxi ferrite magnets, Jintong copper ferrite magnetic Zhao , copper-zinc ferrite magnets, magnesium-copper-iron ferrite magnets, rhetoric magnets, broken glass powder, oxidation records, oxidized powders, etc., must be added to each smoldering agent such as oxidation pin, oxidized crane, oxygen Sew, oxygen her, oxygen butterfly, copper oxide, oxidized anoxic cut county to reduce the sintering temperature. Using the principle of multi-layer planar (pw) common es_ete), each layer is oscillated in different frequency bands. For the needs of various communication components, the number of layers is changed to 4 layers or more, and different spectral vibrations are printed on each layer. a slab-shaped metal circuit, the circuit composition may be one or more added from the group consisting of gold, silver, gold, copper, molybdenum, tungsten, nickel, chromium, aluminum, button, platinum, pound, ruthenium, osmium, vanadium, indium, Tin, rhetoric, titanium, phosphorus, antimony, lock, money, scorpion, demon, wrong, iron, a single metal or alloy formed by different elements such as '铢, town, Syria, carbon' are matched in the component through appropriate connections The multilayer, shouting embryo and flat circuit, is pressed and sintered by low temperature co-firing (LTCC) method to form a single passive component, usually with a sintering temperature of SOOtM100t. This antenna does not need to be connected by a joint, and can be built into various motherboards by surface adhesion (SMD). The wafer type ultra-wideband antenna of the present invention is tested in the full frequency band and can be applied to the O.MOGHz range. For example, wireless products have a variety of communication systems. In the past, a variety of antennas were used. With the wafer-type ultra-wideband antenna of the present invention, only one type of antenna can be used to cover all (4), which greatly reduces the design difficulty and manufacturing cost of the communication component. Very advanced wireless communication components, and no similar products and designs have been proposed. The invention breaks through the bottleneck of the prior art, is very novel and has market competitiveness, and therefore applies for invention patents according to law because it has the effect of improving. [Embodiment] [Example 1] The present invention uses a material such as a ferrite magnet and a glass powder as an example. The ceramic body is prepared by adding (3%) 3% glass powder with a suitable powder, and wet slurry grinding 2〇8 200908439 hours after mixing evenly, at 2〇〇.烘干The following temperature is dried and sieved for use. Finally, the doctor blade is formed and punched to form a raw embryo. The size of the raw embryo is 5xl2x〇.5mm. The basic structure of the present invention is as shown in the figure of eight layers (L1-L8). Each layer of Tauman embryos is mainly made of ferrite magnets and glass powder. The planar resonant metal circuits of different resonances are printed on each layer. The circuit is composed of silver glue. Mainly, the components are matched by the connection as shown in Fig. 1. The multilayer ceramic green embryo and the flat circuit are formed by lamination and screen printing, and are pressed and sintered by a low-temperature co-firing method, and the sintering temperature is 85 (TC, A single passive component is formed. The L1-L5 layer is a resonant layer in each frequency band, L6-L7 is a matching circuit, and L8 is a bottom layer connection layer, basically having three input and output ends, which can be connected without a joint. Built on PCB board ceramic board and other motherboards. This antenna is tested in the full frequency band. As shown in the second figure, the antenna can operate normally at 0.1-8 GHz. [Embodiment 2] The present invention utilizes ferrite magnets and glass powder. For example, the material of the ceramic body is (CuChoNiC^ZnC^oWFe2.3;^·5 plus 10% glass powder is prepared by appropriate powder, wet body grinding is mixed for 2 hours, and then mixed at 2 〇 (temperature below TC) Drying and sifting for spare, finally scraping and forming The hole is made into a raw embryo, and the size of the raw embryo is 5x15x0.5mm. The basic structure of the invention is as shown in the figure of eight layers. Each layer of ceramic body is mainly made of ferrite magnet and glass powder, and different resonances are printed on each layer. Metal circuit, the circuit consists of silver glue, which is formed by matching the components in Figure 1. The multilayer ceramic green and flat circuit are laminated and laminated by low temperature co-firing. Sintering molding, sintering temperature is 850 °C 'forms a single-passive component. U_L5 layer is oscillated in each band plate layer, L6_L7 is the matching circuit 'L8 is the bottom layer connection layer' basically has 3 inputs and outputs, respectively It does not need to be connected by a connector to be built on the PCB board and other motherboards. This antenna is tested in full frequency band, such as the third, fourth and fifth ugly antennas at G.1-8GHz, Gl-2GGhz And G. 1-4GGHZ can operate normally. Table τ, above, the present invention has no related art disclosure in the prior art, and has been novel; the technical drawing capacity of the present invention can definitely determine the field Ugly, and the principle of the method is not easy to complete 'No matter in the purpose, process, utility and market competitiveness, it is different from the original technology, and it is progressive. It has already met the requirements of the invention patents stipulated in the Patent Law. 200908439 [Simplified illustration] The figure shows the structure of the wafer type ultra-wideband antenna of the present invention. The second figure is the test chart of the whole frequency band of 0.1-8 GHZ in the first embodiment. The third figure is the test chart of the whole frequency band of 0.1-8 GHZ in the second embodiment. The second embodiment is a test chart of the whole frequency band of 0.1-20 GHz. The fifth figure is a test chart of the whole frequency band of 0.1 to 40 GHz. [Explanation of main component symbols] L1: Schematic diagram of the first layer of ceramic body L2: second layer ceramic Schematic diagram of the body L3: schematic diagram of the third layer ceramic body L4: schematic diagram of the fourth layer ceramic body L5: schematic diagram of the fifth layer ceramic body L6: schematic diagram of the sixth layer ceramic body L7: schematic diagram of the seventh layer ceramic body L8: schematic diagram of the eighth layer ceramic body (1) Flat metal circuit (2) Metal wiring for each layer (3) Metal electrode for input and output