200908029 九、發明說明： 【發明所屬之技術領域j 本發明係有關於被動元件 <細囱電極製 有關於-種可簡化製程之被 表％特别係 r . 兀件之端面電極製葙。 【先前技術】 4 % 按，在被動元件之製造過裎中， ms „ . 有沾印金屬膏之步 Μ良b_ , 機在被動兀件之兩端塗佈一 金屬膏，經烘烤以形成端面電極。 第1圖係有關於習知被動元件 < h面電極製程之製 程之流程圖。首先，執行一「提供— 從供栽料膠板」之步驟 11，以直立方式將複數個被動元件 t拖入垓载料膠板之複 數個結合孔。接著，執行一吸附固定+ i 又之步驟12，將該 載料膠板置於一沾銀機之真空吸般 避工’該真空吸盤传以 真空作用吸附固定該載料膠板。 1係 接著，執行一「形成-厚膜金屬膏層於一短膏盤」 之步驟"’使一短膏盤往該載料膠板方向移動，並利 用—刮刀組在該短膏盤上刮印上—厚膜金屬膏層。接 :，執行-「第一次沾印」之步.驟14，該真空吸盤係 先將該載料膠板翻轉180度，使得該些被動元件朝下， 再向下移動使該些被動元件與該厚膜金屬膏接觸並沾 附金屬膏。在第一次沾印之後，將該栽料膠板向上升起 至原來高度。接著’執行-第-次收料㈣15，將該 短膏盤往該载料膠板之另一方向移動，使該刮刀組内部 w將亥短膏盤上之該厚膜金屬膏層到除並集中回收金 5 200908029 屬膏。 . 接著，執行一「形成一薄膜金屬膏層於該短膏 之步驟 1 6，使該短膏盤再往該載料膠板方向移動 利用該刮刀組在該短膏盤上刮印上一薄膜金屬膏層 著，執行一「第二次沾印」之步驟1 7，將該載料 向下移動至該短膏盤，以使已第一次沾印之該些被 件與該薄膜金屬膏層接觸並進行第二次沾印。在第 沾印之後，再將該載料膠板向上升起至原來高度 ( ' 後，執行一「第二次收料」之步驟 18，將該短膏 該載料膠板之另一方向移動，使該刮刀組内部可將 膏盤上之該薄膜金屬膏層刮除並集中回收金屬膏。 最後，執行一取出步驟1 9，將該些已經過第二 印之被動元件，利用該真空吸盤吸附該載料膠板並 1 80度，使該載料膠板朝上，解除真空狀態將已完 印動作之該載料膠板取出，以供替換另一載料膠板 ( 沾印動作。此製程雖然可將被動元件之兩端沾印 膏，但在形成金屬膏層時，係先形成厚膜金屬膏層 成薄膜金屬膏層各需要一次的刮印與收料的循環， 形成薄膜金屬膏之間須先進行厚膜金屬膏層之收申 得一沾銀機之沾印時間拉長，導致沾印的效率不召 【發明内容】 本發明之主要目的係在於解決上述問題，提供 被動元件之端面電極製程，利用可調控膜厚之刮刀 長膏盤可節省收料與薄膜金屬膏之形成，縮短被動 盤」 ，並 。接 膠板 動元 二次 。之 盤往 該短 次沾 翻轉 成沾 進行 金屬 再形 即在 •，使 〇 一種 組及 元件 6 200908029 沾銀時間，以達到提供沾銀機之使用效率。 本發明的目的及解決其技術問題是採用以下技術方 案來實現的。依據本發明揭示之一種被動元件之端面電 極製程，首先提供一具有複數個結合孔之載料膠板，複 數個被動元件係插接至該些結合孔，且該些被動元件之 一端係突出於該載料膠板。再吸附固定該載料膠板於一 真空吸盤。之後，利用一可調控膜厚之刮刀組，形成一 金屬膏層於一長膏盤上，該金屬膏層係具有一薄層區與 ζ 一厚層區。在形成該金屬膏層後，作動該真空吸盤，以 使該些被動元件之突出端沾印至該金屬膏層之厚層 區。最後，移動該長膏盤並作動該真空吸盤，以使該些 被動元件之突出端沾印至該金屬膏層之薄層區。另，揭 示一種用以塗佈金屬膏於該些被動元件之端面之沾銀 機。 本發明的目的及解決其技術問題還可採用以下技術 I: 措施進一步實現。 前述的被動元件之端面電極製程中，可另包含有一 烘烤步驟，以使沾印於該些被動元件之突出端之金屬膏 層形成為金屬電極。 前述的被動元件之端面電極製程中，該刮刀組之兩 側係可區分為一收料側與一沾印側，該真空吸盤係位於 該沾印側，該長膏盤係可活動在該收料側與該沾印側之 間。 前述的被動元件之端面電極製程中，在形成該金屬 7 200908029 膏層之過裎中’該長膏盤係可由該收料侧往該沾印側移 動其係以遑續方式先形成該薄層區再形成該厚層區^ 月j述的被動元件之端面電極製程中，上述移動該長 膏盤並作動该真空吸盤之過程中，該長膏盤係可由該沾 印側往該收料側移❺，以進行金屬膏之收料。 月j述的被動元件之端面電極製程中，該金屬膏係可 包含銀粉。 【實施方式] 依據本發明之一具體實施例，揭示一種被動元件之 知面電極製程以及所使用之沾銀機。第2圖係為該被動 元件之端面電極製裎之製程之流程圖，第3圖係為該沾 銀機之立體圖’第4圖係為該沾銀機之側視圖。 請參閱第3及4圖所示，該沾銀機係主要包含一真 空吸盤1 1 0、一可調控膜厚之刮刀組1 20以及一長膏盤 13 〇 °該真空吸盤1 1 〇係吸附固定一表面插接有複數個 被動元件2 2 〇之載料膠板2丨0。該真空吸盤1 1 〇係包含 一旋轉軸1 1 1，以使該载料膠板2 1 0可1 80度轉動。該 刮刀組1 2 0係可依該些被動元件2 2 〇預設定沾印之不同 厚度之一金屬膏層230作刮刀升降微調，以將兩（多）段 式金屬膏層230形成於該長膏盤130上，以供該些被動 元件220之沾印。此外，在本實施例中，該刮刀組1 2〇 之兩側係可區分為一收料側i 2 1與一沾印側1 22，該真 空吸盤1 1 0係位於該沾印側丨22，該長膏盤1 3 0係可活 動在該收料側1 2 1與該沾印側1 2 2之間。在本實施例 8 200908029 中，所指長膏盤i 3 0之長度係具有可連續沾印兩次或兩 次以上之長度，約為該載料膠板2〗〇(即沾銀盤）之四倍 長度。 第2圖係有關於該被動元件2 2 〇之端面電極製程之 製程之流程圖，並可配合參閱第5至1〇圖。首先，執 行一「提供一載料膠板」之步驟U ;請參閱第5圖所 示，一載料膠板210係具有複數個結合孔211，複數個 广 被動元件220係插接至該些結合孔2 1 1，且該些被動元 件220之一端22 1係突出於該載料膠板2 1 〇，以供進行 沾印動作。也就是說該些被動元件22〇係以直立方式插 入泫些結合孔2 1 1。接著，執行一吸附固定步驟2 2 ;請 參閱第6圖所示’吸附固定該載料膠板21〇於一真空吸 盤1 1 0。該真空吸盤1 1 〇係利用真空吸附作用將該載料 膠板2 1 0吸附住’使該載料膠板2 1 〇在翻轉時不會掉落。 接著’執行一「形成一兩（多）段膜差之金屬膏層」 I / 之步驟2 3，凊參閱第7圖所示，利用一可調控膜厚之 刮刀組120，形成一金屬膏層230於一長膏盤130上， 該金屬膏層230係具有一薄層區231與一厚層區232。 該長膏盤1 3 0係由該收料侧1 2 1往沾印側1 2 2移動，先 形成該薄層區23 1。在同一移動行程中，自動調整該刮 刀組120之刮印膜厚。請參閱第8圖所示，可形成該厚 層區232，該厚層區232係較厚於該薄層區23 1。此外， 該真空吸盤1 1 0係具有一旋轉軸1 1 1 ’其係可轉動1 8〇 度使該戴料膠板2 1 0朝下，以供該些被動元件22〇進行 9200908029 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a passive element <semiconductor electrode system relating to a simplification of the process. [Prior Art] 4 % Press, in the manufacture of passive components, ms „ . There is a step of battering the metal paste b_ , the machine applies a metal paste on both ends of the passive element, baked to form The end face electrode. Fig. 1 is a flow chart of the process of the conventional passive component <h-side electrode process. First, a step 11 of "providing - from the material supply board" is performed, and a plurality of passives are performed in an upright manner. The component t is drawn into a plurality of bonding holes of the crucible carrier. Then, a step 12 of adsorbing and fixing + i is performed, and the carrier rubber sheet is placed in a vacuum suction machine of the dipsticking machine. The vacuum chuck is vacuum-adsorbed to fix and fix the carrier rubber sheet. 1 series, then, a step of "forming a thick film metal paste layer on a short paste plate" is performed. "A short paste plate is moved toward the carrier rubber plate, and a doctor blade is used on the short paste plate. Scratch on - thick film metal paste layer. Then: execute the "first dip" step. In step 14, the vacuum chuck first flips the carrier rubber sheet by 180 degrees so that the passive components face downward and then move downward to make the passive components. Contact the thick film metal paste and adhere to the metal paste. After the first smear, the slab is raised to its original height. Then, the 'execution-first-time receipt (four)15, the short paste tray is moved to the other direction of the carrier rubber sheet, so that the inner portion of the doctor blade group is to remove the thick metal paste layer on the short paste tray. Centralized recovery of gold 5 200908029 is a paste. Then, a step of forming a thin film metal paste layer on the short paste is performed, and the short paste paste is moved to the direction of the carrier rubber sheet. The film is scraped on the short paste plate by the doctor blade set. The metal paste is layered, and a "second smear" step 127 is performed to move the carrier downward to the short paste tray so that the first portion of the coated article and the thin film metal paste are applied. The layer is in contact and a second impression is applied. After the first printing, the carrier rubber sheet is raised to the original height (', after performing a "second receiving" step 18, the short paste is moved in the other direction of the loading rubber sheet. The inside of the doctor blade group can scrape the film metal paste layer on the paste pan and collect the metal paste in a concentrated manner. Finally, a take-out step 119 is performed to pass the passive components that have passed the second print, using the vacuum chuck The carrier rubber sheet is adsorbed at 180 degrees, the loading rubber plate is facing upward, and the vacuum loading state is released to take out the loading rubber sheet which has been printed to replace the other loading rubber sheet (staining action). Although the process can paste the paste on both ends of the passive component, when forming the metal paste layer, the thick metal paste layer is formed into a thin film metal paste layer, and each of the film scraping and receiving cycles is required to form a thin film metal. The thickness of the thick metal paste layer must be first obtained between the pastes, and the exposure time of a dilute silver machine is elongated, resulting in the efficiency of the imprinting. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems and provide passive The end face electrode process of the component can be adjusted The thick scraper long paste plate can save the formation of the material and the thin metal paste, shorten the passive disk, and the rubber plate is moved twice. The plate is turned into the dipping and the metal is reshaped. A group of components and components 6 200908029 are immersed in silver to achieve the efficiency of providing a silver staining machine. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. A passive component according to the present invention is disclosed. In the end face electrode process, a carrier rubber plate having a plurality of bonding holes is first provided, and a plurality of passive components are inserted into the bonding holes, and one of the passive components protrudes from the carrier rubber plate. The carrier rubber sheet is applied to a vacuum chuck. Thereafter, a metal paste layer is formed on the long paste tray by using a doctor blade group with a controllable film thickness. The metal paste layer has a thin layer region and a thick layer region. After forming the metal paste layer, the vacuum chuck is actuated to cause the protruding ends of the passive components to be applied to the thick layer of the metal paste layer. Finally, the long paste tray is moved and the vacuum is actuated. a disk for causing the protruding ends of the passive components to be applied to the thin layer region of the metal paste layer. Further, a dipstick for coating a metal paste on the end faces of the passive components is disclosed. Solving the technical problem can also be further implemented by the following technique I: measures. In the foregoing end face electrode process of the passive component, a baking step may be further included to form a metal paste layer which is printed on the protruding ends of the passive components. In the end face electrode process of the passive component, the two sides of the doctor blade group can be divided into a receiving side and a printing side, and the vacuum chuck is located on the printing side, and the long paste tray can be The activity is between the receiving side and the printing side. In the foregoing end face electrode process of the passive component, in the formation of the metal layer 7 200908029 paste layer, the long paste disk system can be moved from the receiving side to the side The printing side moves in the end face electrode process of forming the thin layer region in a subsequent manner to form the thick layer region, and in the process of moving the long paste tray and actuating the vacuum chuck, Long paste tray The coating side can be moved to the receiving side to carry out the receipt of the metal paste. In the end face electrode process of the passive component described in the month, the metal paste may contain silver powder. [Embodiment] According to an embodiment of the present invention, a known electrode process for a passive component and a dipstick used are disclosed. Fig. 2 is a flow chart showing the process of manufacturing the end face electrode of the passive component, and Fig. 3 is a perspective view of the dimming machine. Fig. 4 is a side view of the dipstick. Referring to Figures 3 and 4, the dip-coating machine mainly comprises a vacuum chuck 110, a doctor blade group 1 20 having a controllable film thickness, and a long paste tray 13 〇° the vacuum chuck 1 1 〇 adsorption A plurality of passive components 2 2 载 of the carrier rubber plate 2 丨 0 are fixed on a fixed surface. The vacuum chuck 1 1 includes a rotating shaft 1 1 1 so that the carrier rubber plate 2 1 0 can be rotated by 180 degrees. The doctor blade set 120 can perform fine adjustment of the metal paste layer 230 of the different thicknesses of the passive components 2 2 沾 to form the two (multi) segment metal paste layer 230. The paste tray 130 is provided for the printing of the passive components 220. In addition, in this embodiment, the sides of the blade set 1 2 可 can be divided into a receiving side i 2 1 and a printing side 1 22, and the vacuum chuck 1 1 0 is located on the printing side 丨 22 The long paste tray 130 is movable between the receiving side 1 21 and the printing side 1 2 2 . In the embodiment 8 200908029, the length of the long paste tray i 3 0 has a length that can be continuously printed twice or more, which is about four of the carrier rubber sheet 2 (ie, the silver plate). Multiple length. Figure 2 is a flow chart showing the process of the end face electrode process of the passive component 2 2 ,, and can be seen in conjunction with Figures 5 to 1 . First, a step U of "providing a carrier rubber plate" is performed; as shown in FIG. 5, a carrier rubber plate 210 has a plurality of coupling holes 211, and a plurality of wide passive components 220 are plugged into the holes. The hole 2 1 1 is combined with the one end 22 1 of the passive components 220 protruding from the carrier rubber plate 2 1 供 for performing the squeezing action. That is to say, the passive components 22 are inserted into the coupling holes 2 1 1 in an upright manner. Next, an adsorption fixing step 2 2 is performed; please refer to Fig. 6 to adsorb and fix the carrier rubber sheet 21 to a vacuum chuck 110. The vacuum chuck 1 1 is used to adsorb the carrier rubber sheet 210 by vacuum adsorption so that the carrier rubber sheet 2 1 does not fall when it is turned over. Then, 'execute a "metal paste layer forming one or two (multiple) film gaps" I / step 2 3, as shown in Fig. 7, using a doctor blade group 120 of a controllable film thickness to form a metal paste layer 230 on a long paste pad 130, the metal paste layer 230 has a thin layer region 231 and a thick layer region 232. The long paste tray 130 moves from the receiving side 1 2 1 to the printing side 1 2 2, and the thin layer region 23 1 is formed first. The squeegee thickness of the squeegee set 120 is automatically adjusted during the same travel stroke. Referring to Figure 8, the thick layer region 232 can be formed. The thick layer region 232 is thicker than the thin layer region 23 1 . In addition, the vacuum chuck 110 has a rotating shaft 1 1 1 ' which is rotatable by 18 degrees so that the wearing rubber sheet 2 1 0 faces downward for the passive components 22 to perform.
200908029 5占印動作。 較佳地，在形成該金屬膏層23 0之過程 盤1 3 0係由該收料側1 2 1往該沾印側1 2 2移 續方式先形成該薄層區2 3 1再形成該厚層區 需要分為兩個步驟故具有簡化製程之功效。 中’該刮刀組1 2 0係可設定該長膏盤1 3 0上 膏之厚度’俾提供針對不同被動元件沾附上 樘厚度之金屬膏。 在形成該金屬膏層230後，執行一「 之步驟24 ;請參閱第9圖所示，該厚層丨 該真空吸盤1 1 〇下方，以旋轉方式作童 1 1 〇 ’將該載料膠板2 1 〇朝下並往下朝該 動，以使該些被動元件22〇之突出端22 i 膏層230之厚層g 232。在第一次沾印之 空吸盤1 1 0之吸附力將該載料膠板2丨〇向 當高度。接著，執行-「移動該長膏盤並 、步驟25，清參閱第10圖所示，移動該 乂其局部退回至該收料側丨2 i，以使該薄 該真空吸M U0下方；之後，並作動該真 將叇載料膠板210向下往該長膏# 130移 破動元件220之突出端221沾印至該金屬 :區231。由於上述移動該長膏盤13。並 :110之過程中，該長膏盤U0係可由該 。收料側121移動，可同時進行該金屬膏 中，該長膏 動，且以連 2 3 2，而不 在本實施例 所鋪置金屬 對應所需各 一次沾印」 232係位於 漆真空吸盤 膏盤1 3 0移 印至該金屬 ，保持該真 移動至一適 —次沾印」 膏盤1 30， 區2 3 1位於 吸盤1 1 0， ，以使該些 層2 3 0之薄 動該真空吸 印側1 2 2往 230之該厚 10 200908029 層區232之收料。在該長膏盤13〇往該收料側i2i移 時，該刮刀組1 20之内部係可刮除該長膏盤丨3〇上之 金屬膏層23〇之厚層區232,並推至金屬膏回收槽集 回收。 當該些被動元件220之突出端22丨沾印至該厚層 232時，所沾印之金屬膏222係為較飽滿（請參考第 圖所示）’其主要用意在於界定端面電極之形成區域 ^ 但膜厚較無法控制。藉由第二次沾印於該薄層區23 i 修正該沾印之金屬膏222 (請參考第10圖所示），使已 印之金屬膏222具有更為一致均勻之膜厚。 之後，執行一收料步驟26，移動該長膏盤丨3〇使 往該收料側1 2 1移動，使該刮刀組丨20之内部係可刮 該長膏盤130上之該金屬膏層230之薄層區231，以 行該金屬膏層230之薄層區231之收料《最後，執行 「取出載料膠板」之步驟2 7，利用該真空吸盤丨j 〇 〔 附該載料膠板2 1 0並翻轉1 8〇度’使該載料膠板2 j 〇 上’解除真空狀態將已完成二段沾印動作之該載料膠 2 1 0取出。另可替換另一載料膠板2丨〇進行沾印動作 其中’該刮刀組1 2 0係以連續方式先形成該金屬 層230之該薄層區23丨再形成該金屬膏層23〇之該厚 區232在同一長膏盤1 3 〇上，在一次刮印與收料過 中’完成兩（多）段式沾印’不同於習知—次刮印與收 僅能一次沾印的製程，相對於習知兩（多）次的短膏盤 復移動，能進一步減少製程的複雜性。此外，在第一 動 該 中 區 9 可 沾 其 除 進 一 · 吸 朝 板 0 膏 層 程 料 往 次 200908029 沾印後僅須將該長膏盤1 3 0往該收料側1 2 1移動即可進 行第二次沾印，而在該長膏盤1 3 0移動之過裎中，該刮 刀組120係可同時進行該金屬膏層230之該厚層區232 之收料。因此，製程的簡化有助於操作更簡便及縮短製 程時間，進而提昇經濟效益。 在本實施例中，該些被動元件之端面電極製程係可 另包含有一烘烤步驟，以使沾印於該些被動元件2 2 0之 突出端221之金屬膏222形成為金屬電極。該金屬膏 r - k 2 22係可包含銀粉以及連結料，俗稱為銀膏。該金屬膏 222包含之金屬顆粒亦可為鈀合金粒子。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，雖然本發明已以較佳實施 例揭露如上，然而並非用以限定本發明，任何熟悉本專 業的技術人員，在不脫離本發明技術方案範圍内，當可 利用上述揭示的技術内容作出些許更動或修飾為等同 變化的等效實施例，但凡是未脫離本發明技術方案的内 容，依據本發明的技術實質對以上實施例所作的任何簡 單修改、等同變化與修飾，均仍屬於本發明技術方案的 範圍内。 【圖式簡單說明】 第1圖：一種習知被動元件之端面電極製程之製程之流 程圖。 第2圖：依據本發明之一具體實施例，一種被動元件之 端面電極製程之製程之流程圖。 12 200908029 第3圖：依據本發明之一具體實施例，一種用以塗佈金 屬膏於被動元件之端面之沾銀機之立體圖。 第4圖：依據本發明之一具體實施例，該沾銀機之側視 圖。 第5圖：依據本發明之一具體實施例，繪示一載料膠板 表面插接有複數個被動元件之截面示意圖。 第6圖：依據本發明之一具體實施例，繪示一真空吸盤 於吸附該載料膠板之截面示意圖。 (' 第7圖：依據本發明之一具體實施例，繪示一金屬膏層 之薄層區形成於一長膏盤之側面示意圖。 第8圖：依據本發明之一具體實施例，繪示該長膏盤形 成有該金屬膏層之薄層區與一厚層區之側面 示意圖。 第9圖：依據本發明之一具體實施例，繪示該些被動元 件於第一次沾銀之側面示意圖。 ί, 第1〇圖：依據本發明之一具體實施例，繪示該些被動 元件於第二次沾銀之側面示意圖。 【主要元件符號說明】 11 提供一載料膠板 12 吸附固定該載料膠板 13 形成一厚膜金屬膏層於一短膏盤 14 第一次沾印 15 第一次收料 1 6 形成一薄膜金屬膏層於該短膏盤 13 200908029200908029 5 accounted for the action. Preferably, in the process of forming the metal paste layer 230, the disk 130 is formed by the receiving side 1 2 1 to the printing side 1 2 2, and then the thin layer region 2 3 1 is formed. The thick layer area needs to be divided into two steps so that it has the effect of simplifying the process. The 'scraper set 1 2 0 can set the thickness of the paste on the long paste plate 130' to provide a metal paste to which the upper passive thickness of the passive component is adhered. After the metal paste layer 230 is formed, a "step 24" is performed; as shown in Fig. 9, the thick layer is under the vacuum chuck 1 1 〇, and the carrier is rotated 1 1 〇 ' The plate 2 1 is moved downwards and downwards so that the passive elements 22 are protruded from the protruding end 22 i of the thick layer g 232 of the paste layer 230. The adsorption force of the first suction cup 1 1 0 The carrier rubber sheet 2 is turned to the height. Then, "moving the long paste tray, step 25, as shown in Fig. 10, moving the crucible to partially return to the receiving side 丨 2 i So that the vacuum is sucked under the U U0; after that, the 叇-loaded rubber sheet 210 is moved down to the protruding end 221 of the long paste #130 to break the moving member 220 to the metal: the area 231 Because of the above movement of the long paste tray 13 and the process of 110, the long paste tray U0 can be moved by the receiving side 121, and the metal paste can be simultaneously performed, and the long paste is moved, and the connection is made. 2, instead of the metal coating required in this embodiment, the 232 is located in the paint vacuum cup paste tray 130 to the metal, to keep the Move to a suitable one-time impression" paste plate 1 30, zone 2 3 1 is located on the suction cup 1 1 0, so that the layers 2 3 0 thin move the vacuum side 1 2 2 to 230 of the thickness 10 200908029 Receipt of layer 232. When the long paste tray 13 is moved toward the receiving side i2i, the inside of the doctor set 120 can scrape the thick layer region 232 of the metal paste layer 23 on the long paste tray 3, and push it to The metal paste recovery tank is collected for recycling. When the protruding ends 22 of the passive components 220 are printed on the thick layer 232, the printed metal paste 222 is relatively full (please refer to the figure). The main purpose is to define the formation area of the end electrodes. ^ But the film thickness is less controllable. The imprinted metal paste 222 is corrected by a second application to the thin layer region 23 i (refer to Fig. 10) so that the printed metal paste 222 has a more uniform and uniform film thickness. Thereafter, a receiving step 26 is performed to move the long paste tray 3 to move to the receiving side 1 2 1 so that the inside of the doctor set 20 can scrape the metal paste layer on the long paste tray 130. The thin layer region 231 of 230 is used for the receipt of the thin layer region 231 of the metal paste layer 230. Finally, the step 2 of performing the "removal of the carrier rubber sheet" is performed using the vacuum chuck 丨j 〇 [attached to the loading material The rubber sheet 2 1 0 and flipped 1 8 ' 'to make the carrier rubber sheet 2 j 〇 'de-vacuum state to take out the carrier glue 2 1 0 that has completed the two-stage printing operation. Alternatively, another carrier rubber sheet 2 can be replaced to perform a printing operation, wherein the doctor blade group 120 forms the thin layer region 23 of the metal layer 230 in a continuous manner, and then forms the metal paste layer 23 The thick region 232 is on the same long paste plate 1 3 ,, and completes two (multiple) segmental printing in one squeegeeing and receiving over-different from the conventional one-time squeegee printing and receiving only one time. The process can further reduce the complexity of the process compared to the conventional two (multiple) times of short paste disk movement. In addition, in the first movement, the middle zone 9 can be removed from the suction plate 0 paste layer material to the next 200908029 after the printing, only the long paste plate 1 130 is moved to the receiving side 1 2 1 A second smear can be performed, and the squeegee set 120 can simultaneously perform the receipt of the thick layer region 232 of the metal paste layer 230 during the movement of the long paste platter 130. As a result, the simplification of the process facilitates easier operation and shorter process times, which in turn increases economic efficiency. In this embodiment, the end face electrode processes of the passive components may further comprise a baking step to form the metal paste 222 imprinted on the protruding ends 221 of the passive components 220 into metal electrodes. The metal paste r - k 2 22 system may contain silver powder and a binder, commonly known as silver paste. The metal particles contained in the metal paste 222 may also be palladium alloy particles. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. It is still within the scope of the technical solution of the present invention to make any simple modifications, equivalent changes and modifications to the above embodiments. [Simple description of the drawing] Fig. 1 is a flow chart showing the process of the end face electrode process of the conventional passive component. Fig. 2 is a flow chart showing the process of the process of the end face electrode of a passive component in accordance with an embodiment of the present invention. 12 200908029 FIG. 3 is a perspective view of a dipstick machine for coating a metal paste on the end face of a passive component in accordance with an embodiment of the present invention. Figure 4 is a side elevational view of the dipsticker in accordance with an embodiment of the present invention. Figure 5 is a cross-sectional view showing a plurality of passive components inserted into a surface of a carrier rubber sheet according to an embodiment of the present invention. Figure 6 is a cross-sectional view showing a vacuum chuck for adsorbing the carrier rubber sheet according to an embodiment of the present invention. (FIG. 7 is a schematic view showing a thin layer region of a metal paste layer formed on a side of a long paste paste according to an embodiment of the present invention. FIG. 8 is a schematic view showing an embodiment of the present invention The long paste plate is formed with a side view of a thin layer region and a thick layer region of the metal paste layer. FIG. 9 is a side view showing the passive components on the side of the first silver stain according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view showing the passive components in the second silver stain according to an embodiment of the present invention. [Main component symbol description] 11 providing a carrier rubber plate 12 for adsorption and fixation The carrier rubber sheet 13 forms a thick film metal paste layer on a short paste tray 14 for the first time. 15 The first time the material is collected 1 6 to form a thin film metal paste layer on the short paste tray 13 200908029
17 第二次沾印 18 第二次收料 19 取出該载料膠板 21 提供一載料膠板 22 吸附固定該載料膠板 23 形成一兩（多）段膜差之金屬膏層於一 長膏盤 24 第一次沾印 25 移動該長膏盤並第二次沾印 26 收料 27 取出該載料膠板 110 真空吸盤 111 旋轉轴 120 刮刀組 121 收料側 122 沾印側 130 長膏盤 210 載料勝板 211 結合孔 220 被動元件 221 一端 222 沾印之金屬膏 230 金屬膏層 231 薄層區 232 厚層區 1417 second smear 18 second receiving material 19 take out the carrier rubber sheet 21 to provide a carrier rubber sheet 22 to adsorb and fix the carrier rubber sheet 23 to form a two (multi) section of the film metal paste layer Long paste tray 24 first time stamping 25 moving the long paste tray and second printing 26 receiving material 27 removing the carrier rubber sheet 110 vacuum suction cup 111 rotating shaft 120 scraper group 121 receiving side 122 sealing side 130 long Paste plate 210 Loading plate 211 Bonding hole 220 Passive component 221 One end 222 Imprinted metal paste 230 Metal paste layer 231 Thin layer area 232 Thick layer area 14