TW200907634A - Main board and socket thereof - Google Patents

Abstract

A socket for connected to an integrated circuit comprises a body, a plurality of socket holes and a plurality of spacers. The body comprises a hole area, wherein the socket holes are formed in the hole area. The spacers are disposed on the body out of the hole area. When the integrated circuit is disposed on the socket, the spacers is sandwiched between the integrated circuit and the body.

Description

200907634 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a slot structure, and more particularly to a slot structure for a central processor. [Prior Art] Referring to Fig. 1a, a conventional slot structure 10 is shown, including a body 11 and a plurality of jacks 12. The body 11 includes a receptacle region 13 in which the receptacles 12 are formed. Referring to Figure lb, there is shown a motherboard 1 to which a conventional slot structure is applied, including a circuit board 50, the socket structure 10, an integrated circuit component 30, a fixed component 20, and a cooling device 40. The socket structure 10 is disposed above the circuit board 50. The integrated circuit component 30 is inserted in the slot structure 10. The fixing member 20 is disposed on the circuit board 50 and surrounds the socket structure 10. The cooling device 40 is fixed to the fixing member 20 and contacts the integrated circuit component 30. Referring to FIG. 1c, which shows an I-Ι direction combined sectional view in FIG. 1b, wherein when the cooling device 40 is fixed on the fixing member 20, the circuit board 50 in the vicinity of the fixing member 20 is deformed. Therefore, the slot structure 10 and the integrated circuit component 30 are deformed. The integrated circuit component 30 includes the die 31 and the heat transfer cover 32. When the integrated circuit component 30 is deformed, since the deformation amount of the die 31 and the heat transfer cover 32 is different, the die 31 is separated from the heat transfer cover, thereby reducing the heat dissipation effect. The temperature of the integrated circuit component 30 is abnormally increased, which affects the operation of the motherboard. [Summary of the Invention]

Client's Docket No.: TW96051GU TT's Docket No: 〇932-A5ii28-TW/Draft-f/Lemon 5 200907634 Slot: i month::丄=Two knowledge technology issues provided - a variety of jacks and plural "chips The utility model comprises a body and a plurality of parts in the jack area. In the case of the jack-jack area, the jack is formed outside the area, wherein the body is placed on the body and located at the jack, The spacers are placed in the jacks, and the sluices are placed between the slots ^ and 脰 应用 in the integrated circuit. The integrated body name can effectively maintain the accumulation of integrated circuit components. The circuit components cannot be operated due to overheating. [Embodiment] Referring to Figures 2a and 2b, the slot structure of Gu Qiantai Gong Ha + ^ is rumored. (10), for plugging:: The brother of the present invention - the embodiment includes - the Benzi m Λ integrated circuit component. Slot structure _

The body 110 has a spoon/jack 120 and a plurality of spacers 130. The belly 110 includes a U-hole area (1) in the jack area. A spacer Hit is formed on the yoke 130 to be over the 5 hai body 110 and located outside the ^f hole m. When the integrated circuit component is inserted into the dedicated jack 120, the spacers 130 are interposed between the integrated circuit component and the body 110. The yokes 130 are disposed between the edge of the body 11 与 and the jack region. The jack area ln is substantially rectangular, and the spacers 13 are disposed along the edge of the jack area 111. In the first embodiment, the spacer 130 is substantially gate-shaped and is detachably disposed above the body (10). The material of the spacer 130 is a hard material. The body 110 further includes a first edge 1〇1, a second edge 102苐2 edge 103, and a fourth edge 104. The spacers are disposed along the second edge 102 and the fourth edge 1〇4. The first edge

Clients Docket No.: TW96051GU ΤΓ s Docket No: 〇 932-A5ii28-TW/Draft-f/Lemcm 200907634 101 is parallel to the third edge 103, the second edge 102 is parallel to the fourth edge 104, and the first The edge 101 is perpendicular to the second edge 102. Referring to Fig. 3, there is shown a motherboard 200 to which the slot structure of the present invention is applied, including a circuit board 50, the socket structure 100, an integrated circuit component 30, a fixing component 20, and a cooling device 40. The slot structure 100 is disposed above the circuit board 50. The integrated circuit component 30 is inserted in the slot structure 1 〇 . The fixing member 20 is disposed above the circuit board 50 and surrounds the socket structure 100. The cooling device 40 is fixed to the upper surface 5 of the fixing member 20 and contacts the integrated circuit component 30. The cymbals 130 are disposed between r 'the integrated circuit component 30 and the body 110. Referring to Fig. 4, there is shown a sectional view in the II-II direction in Fig. 3, in which when the cooling device 40 is fixed on the fixing member 20, the circuit board 50 in the vicinity of the fixing member 20 is deformed. The strap structure 100 is deformed. However, since the cymbal 130 is interposed between the integrated circuit component 30 and the body 110, most of the integrated circuit components 30 are suspended above the socket structure 100, so the deformation of the socket structure 100 cannot be It is completely transmitted to the integrated circuit component 30, and instead the amount of deformation is concentrated on the pin 33 of the integrated circuit component 30. Thereby, the amount of deformation of the die 31 and the heat transfer cover 32 of the integrated circuit component 30 is extremely small, so that the die 31 is not separated from the heat transfer cover 32, thereby ensuring a heat dissipation effect. In the above embodiment, the fixing member 20 includes two fixing portions 21, and the cooling device 40 includes a connecting member 41. The connecting member 41 is coupled to the fixing portions 21, and the fixing portions 21 are adjacent to the first edge 101 and the The third edge 103, it can be seen that when the circuit board 50 applies a stress to the slot structure 100 at the first edge 101 and the third edge 103, the spacers 130 are along the second edge 102. And the fourth edge 104 is provided

Clienfs Docket No.: TW96051GU TT’s Docket No: 〇932-A5ii28-TW/Draft-f/Lemon 7 200907634. Referring to FIG. 5, there is shown a slot structure 1'' of a second embodiment of the present invention, characterized in that the spacers 130' are substantially triangular and are disposed adjacent to the jack region 111. corner. Referring to Fig. 6, there is shown a socket structure 100" according to a third embodiment of the present invention, characterized in that the spacer 1'3"' is annular and surrounds the insertion hole region 111. In a modification The above-mentioned gasket can also be replaced by a convex structure which is integrally formed. By applying the slot structure of the invention, the heat dissipation capability of the integrated circuit component can be effectively maintained, and the integrated circuit component can be prevented from being operated due to overheating. The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.

Client's Docket No.: TW96051GU g TT's Docket No: 〇932-A5ii28-TW/Draft-f/Lemon 200907634 [Simplified Schematic] The first drawing shows the conventional slot structure; the lb shows the application of the conventional insertion The motherboard of the slot structure; the lc diagram shows the I-Ι direction combination sectional view in the lb diagram; the 2a and 2b diagrams show the slot structure of the first embodiment of the present invention; A motherboard having a slot structure is invented; FIG. 4 is a cross-sectional view showing a combination of II-II directions in FIG. 3; FIG. 5 is a view showing a slot structure of a second embodiment of the present invention; The slot structure of the three embodiments. 33~pin; 41~link; 100, 100', 100"~slot structure; 102~second edge; 104~4th edge; 111~jack area; 130, 130', 130''~ pad [Major component symbol description] 1~ motherboard; 11~ body; 13~ jack area; 21~ fixed part; 31~ die, 10~ slot structure; 12~ jack; 20~ fixed component; ~ Integrated circuit component 32 ~ heat transfer cover; 40 ~ cooling device; 50 ~ circuit board; 101 ~ first edge; 103 ~ third edge; 110 ~ body; 120 ~ jack; 200 ~ motherboard.

Client's Docket No.: TW96051GU TT^s Docket No: 〇932-A5H28-TW/Draft-f/Lemon

Claims (1)

200907634 X. Patent application scope: A slot structure for inserting an integrated circuit component, including: a body including a jack area; a plurality of jacks formed in the jack area; In addition, Cf is disposed on the body, and is located in the jack region: when the ti integrated circuit component is inserted in the jacks, the clip s is in the integrated circuit component and the Between the ontology. : The pad structure according to the first item of the second aspect, wherein the '° is between the edge of the 5 hai limb and the jack area. The heart I 3 "^ material range 帛 1 item slot structure, wherein 哼 = area is rectangular, the 塾 片 is located adjacent to the jack area 2: equal to the slot structure described in item 3 Wherein, the 6·Shen 2 pieces are arranged along the edge of the jack area. The spacers are large: the slot structure described in the 5th item, wherein the 笙埶^ patent application scope item 1 The slot structure of the slot structure is detachably disposed on the body. The slot structure of the slot according to the first aspect of the patent is set in a body-forming manner. Above the body. Wei lin towel, please refer to the slot structure temple gasket described in the first item of the patent scope including a hard material. #1〇' kind of motherboard, including: a circuit board; a slot structure, located in the Above the board, including: 10 claws D〇Cket N〇N〇°933SSVD 'f/Lem〇n 200907634 A body including a jack area; a plurality of jacks formed in the jack area; a plurality of spacers disposed on the body and located in the jack region Inserted in the slot structure, wherein the spacers are sandwiched between the integrated circuit component and the body; and a fixing member is disposed on the circuit board and surrounds the slot a structure, and a cooling device circuit component. is fixed on the fixing component and contacts the integrated body, wherein the gasket such as the motherboard as described in claim 10 is disposed at the edge of the body and Between the jack regions. 12. The motherboard of claim 1, wherein the S region has a rectangular shape, and the spacers are disposed adjacent to the jack region. The motherboard of claim 12, wherein the shimming is substantially triangular. 14. The motherboard of the first aspect of the patent application, i, the jack area is rectangular, The spacer is disposed along the edge of the jack area / equipotential m. Please refer to the motherboard of the general specification (4), wherein the shimming is substantially gate-shaped. Among them, the original I6. The gasket such as the motherboard described in the item is detachably provided in the book In the above, the slab of the motherboard such as the above-mentioned claim 10 is provided on the body in a body-formed manner. The gasket such as the motherboard mentioned in the item includes a hard material. Client's Docket No.: TV\796〇5iGU TT^s Docket No: 〇932-A5H28-THVDraft-f/Lem〇200907634 19. If the patent application scope is 10th The motherboard includes a first edge, a second edge, a third edge, and a fourth edge. The fixing component includes two fixing portions, and the cooling device includes a connecting component. The connecting member is coupled to the fixing portions, the fixing portions are adjacent to the first edge and the third edge, and the spacers are disposed along the second edge and the fourth edge. 20. The motherboard of claim 19, wherein the first edge is parallel to the third edge, the second edge is parallel to the fourth edge, and the first edge is perpendicular to the first edge Two edges. The motherboard of claim 10, wherein the body includes a first edge, a second edge, a third edge, and a fourth edge, the circuit board being at the first edge And the third edge applies a stress to the slot structure, the spacers being disposed along the second edge and the fourth edge. 22. The motherboard of claim 21, wherein the first edge is parallel to the third edge, the second edge is parallel to the fourth edge, and the first edge is perpendicular to the second edge . 23. A slot structure for inserting an integrated circuit component, comprising: , a body comprising a jack region; a plurality of jacks formed in the jack region; and a spacer Is disposed on the body and located outside the jack region, wherein when the integrated circuit component is inserted into the jacks, the spacer is sandwiched between the integrated circuit component and the body between. 24. The socket structure of claim 23, wherein the spacer is annular. Client's Docket No.: TW96051GU TT’s Docket No: 〇932_A5ii28-TVV7Draft>f/Lemon 12