200906701 九、發明說明： 【發明所屬之技術領域】 丨本發明制於—種妹騎單元，種可_基板之雷射 【先前技術】 習知雷卿P設備（如1射打印機）制來於—基板上執行 雷射刻印，其包含有-配送盒、—傳輸軌道、一雷射刻印單元， 以及-卸餘。誠送麵用絲絲經纽之絲。該傳輸執 道係用來傳送自該配送盒取出之基板。該雷射泰卩單元係用來在 沿著該傳触道傳送之基板上執行雷_印。該卸載盒係用來承 載已經過雷射刻印處理之基板。 在-基板之-表面執行雷射刻印後，财該基板之相關雷射刻 印流程就會視為已㈣束。細，树會树要在—基板上進行 雙面刻印的情況出現。用來在—基板上執行㈣雙關印的一雷 射刻印&備會另包含有—翻轉單域—倒轉單元，絲將該基板 翻轉180度。 該翻轉單元通常會設置在與該傳輸執道以及該雷射刻印單元 相距特定距離的位置上，也就是說，當該雷射刻印單元完成在 該基板之-表面上的#棚印後，該基板會被—握爪或一推桿傳 200906701 送至該翻轉^ 、 接者，該翻轉單元則會利用習知技術中常見之 方法（如真空吸附法）將該基板反轉180度，然後反轉過後的基 ^尤會再次被上述之握爪或轉送回·_印單元中，而開始 X板之另表面上執行雷射刻印，最後再將已完成雷射雙面 刻印之基板傳送至該卸載盒中。 /然而’在上述具有基板雙關印功能的雷綱印設備中，用來 執仃田射刻印之該雷糊印單福與該轉單元相距有一定的距 離因此’必須依序執行一系列相關流程以完成基板雙面刻印之 ，作’意即料雷_印單_賴基板錢娜單元、於轉 中翻轉4基板’以及從該翻轉單元回送絲板至該雷射刻印 單兀由上述可知，要在—基板上進行雙面雷_印需要耗費相 當多的時間。 、 此^外’由於上述雷射刻印設備必須額外包含有用來翻轉基板的 翻轉單7L，因此’上述雷侧印設備之安裝就會需要相當大的設 再者，因為上述翻轉單元係利用吸附住具有軌道之基板中央部 位之—真空吸盤，所以基板中央部位的軌道上往往會有污垢附著 於其上，此時就需額外增加—清糕絲清除基板上的污垢。此 1卜’由於該翻轉單元會使_真空賴，因此相備的配置就 會非吊地複雜也會出現許多設備控制上的_ (如真空壓 200906701 力、真空管線之開啟及_、真空管線之連接狀，連帶地降 低雷射刻印設備的操控穩定性。 【發明内容】 本發明係提供-種可翻轉基板之印單元，其解行於〆 傳輸軌道並讀-基板崎板上執行雜騎，雜輸執道 係用來沿者-基板之-傳輸方向傳輸該基板，該雷_印單元包 含有-驅練置，用來提供—旋轉力；—動力傳鱗元，用來傳 遞該驅動裝賊提供之該旋轉力；—基座，連接於該傳輸軌道並 支撐該動力觸單H及—絲战單元，雜_動力傳動 早疋且以微轉之方式絲於絲座上，祕缺料元用來於 執灯田射卿時切該基板；其巾該基板支料元係與該基板丘 同相對於該基錢轉，藉以於該基板之—第―表面以及相對於該 第一表面之一第二表面上執行雷射刻印。 【實施方式】 下文中將參照附圖更完整的敘述本發明，賴中係顯示本發明 之具體實施例。 第1圖為本發明—實施例一雷射刻印單元100以及一傳輸軌道 10之不忍圖。第2圖為第！圖移除傳輸軌道1〇後雷射刻印單元 100之不思圖。第3圖為第2圖一基板支標單元14〇旋轉一特定角 度之不思圖。第4圖為第2圖基板支撐單元140夾持-基板1之 200906701 兩側的峨圖。第5圖為第200906701 IX. Description of the invention: [Technical field to which the invention pertains] 丨 The invention is made in a kind of sister riding unit, and the laser can be _substrate [Prior technology] The conventional Leiqing P device (such as a 1-shot printer) is manufactured. - performing laser marking on the substrate, which includes a - delivery box, a transport track, a laser marking unit, and - a spare. Sincerely send the noodles with silk. The transmission channel is used to transport the substrate removed from the dispensing cassette. The laser baht unit is used to perform a thunderprint on a substrate that is transported along the pass. The unloading box is used to carry a substrate that has been subjected to laser marking processing. After the laser marking is performed on the surface of the substrate, the relevant laser marking process of the substrate is regarded as the (four) beam. Fine, the tree will appear on the substrate for double-sided marking. A laser marking & for performing a double seal on the substrate - further includes a flip single field - inverting unit, the wire flipping the substrate 180 degrees. The inverting unit is usually disposed at a certain distance from the transmission obstruction and the laser marking unit, that is, after the laser marking unit completes the #shed printing on the surface of the substrate, The substrate will be sent to the flipper by the gripper or a pusher pass 200906701. The flipper unit will reverse the substrate by 180 degrees using a method commonly used in the prior art (such as vacuum adsorption), and then reverse After the transfer, the base is again transferred to the _ printing unit by the above-mentioned gripper, and the laser marking is performed on the other surface of the X-plate, and finally the substrate on which the laser double-sided marking has been completed is transferred to the substrate. Unload the box. / However, in the above-mentioned Lei Gang printing equipment with double-printing function of the substrate, the raid-printing single used to perform the marking of the field has a certain distance from the rotating unit, so 'a series of related processes must be executed sequentially. In order to complete the double-sided engraving of the substrate, it is known from the above that the meaning is that the material is printed, the substrate is turned over, the substrate is turned over, and the wire is fed back from the inverting unit to the laser marking unit. It takes a considerable amount of time to perform double-sided ray printing on the substrate. Because the above-mentioned laser marking device must additionally include a flipping single 7L for flipping the substrate, the installation of the above-mentioned lightning-side printing device requires a considerable design because the above-mentioned inverting unit is adsorbed. The vacuum chuck has a central portion of the substrate of the track, so dirt tends to adhere to the track in the central portion of the substrate. At this time, it is necessary to additionally add the cake wire to remove dirt on the substrate. Since this flipping unit will make _ vacuum, so the configuration of the standby will be uncomfortable and there will be many equipment control _ (such as vacuum pressure 200906701 force, vacuum line opening and _, vacuum pipeline) The connection shape reduces the handling stability of the laser marking device. The invention provides a printing unit of a reversible substrate, which is solved on the 〆 transmission track and performs read riding on the read-substrate board. The miscellaneous input channel is used to transmit the substrate along the direction of the substrate-transfer, the lightning-printing unit includes a -drive unit for providing a rotational force; and a power transmission scale element for transmitting the drive The thief provides the rotation force; the pedestal is connected to the transmission track and supports the power contact H and the wire warfare unit, and the hybrid _ power transmission is early and slightly screwed on the wire seat, and the secret is lacking. The material element is used to cut the substrate when the lamp is lighted; the substrate support material element and the substrate mound are rotated relative to the substrate, whereby the first surface of the substrate and the first surface are opposite to the first surface Laser marking is performed on one of the second surfaces. The present invention will be described more fully hereinafter with reference to the accompanying drawings, in which: FIG. 1 shows a specific embodiment of the present invention. FIG. 1 is an embodiment of the present invention - a laser marking unit 100 and a transmission track 10 Fig. 2 is a diagram of the laser marking unit 100 after removing the transmission track 1〇. Fig. 3 is a second diagram of the substrate supporting unit 14 rotating at a specific angle. 2 is a diagram of the two sides of the substrate supporting unit 140 holding the substrate 209069061. FIG.
Mi與-第二元件142分:蚊撐早元⑽之-第-元件 元1㈣二元件H2之示意=第2圖基板支撐單 觸之-擒塊172之示意圖。$ 〇圖為弟2圖雷射刻印單元 請參閱第1圖至第4圖，為了 對於第-表面2之-第二表面3 ^之—第—表面2以及相 雷射列e卩罝_ inn h 執仃雷射刻印，本發明實施例 = 用來旋轉-基板支解元Μ。之一旋轉 旋轉裝ί =7° 14<>_來於執行雷射_時支撐基板 凝轉裝置110包含-驅動農置lu、 一 基座130、基板支撐單元14〇、一 70 位塊172,以及複數個感應器18〇。 右^動裝置⑴制來提供—_力賤轉基板支解元140， 有關基板支撐單元刚之描述將會在後續說明中提及。在此實施 :中:驅練置⑴雜佳鱗賴驅動之—汽缸，藉以將基板 支撐單元140旋轉180度。 動力傳動單元12G_來傳翻練置⑴所提供之旋轉力至 板支擇單元14〇 ’動力傳動單元U0包含有一傳動轴d、一從 動軸122、-傳動皮帶輪123、一從動皮帶輪124，以及一皮帶125。 傳動轴121係固定於驅動裝置ηι之一輸出軸112上並與輸出 軸U2 —起旋轉。傳動皮帶輪123係固定於傳動軸i2i上並與傳 10 200906701 動軸121 —起旋轉。在此實施例中，係會使用到兩個基板支撐單 元140以及兩個用來旋轉基板支撐單元14〇之傳動皮帶輪123。從 動軸122係以可旋轉之方式穿設於基座130,基座13()係利用軸承 來支撐從動軸122 ’基板支撐單元140亦連接於從動軸122並與從 動軸122 —起旋轉。從動皮帶輪124係固定於從動軸122上，且 由第2圖可知，在此實施例中，係會使用到兩個從動皮帶輪124， 藉以與兩個傳動皮帶輪123配合。此外，皮帶125係環繞設置於 傳動皮帶輪123以及從動皮帶輪124之間。 基座130係固疋於傳輸執道上，用來支撐從動轴I〕？以及 基板支撐單元140。 基板支撑單元140係連接於從動軸122並可相對於基座13〇旋 轉’基板支撐單元140係用來於執行雷射刻印時支撐基板丨，基板 支撐單元140包含-第一元件⑷、一第二元件142、複數個彈性 兀件143，以及複數個真空孔洞163 (如第1〇圖所示）。 第元件141係接觸於第一表面2 (即基板丨之上表面）並以 可旋轉之方式設置於一第一軸C1上。第二元件H2係、接觸於第二 表面3 (即基板1之下表面）並安裝在實質上與傳輪軌道ι〇等高 的位置上以支撐從傳輸執道1G傳來之基板1。如第2圖所示之彈 性凡件143係分別設置於第一元件141以及第二元件142上並且 用來彈性地驅動第—元件141以及第二元件142往第—元件⑷ 11 200906701 #近第-轉142之方向偏轉^接著請參閱第3圖，為了在完成 基板1之第—表面2的雷射刻印後可繼續在第二表面3上執行雷 .射刻印，基板1必須與基板讀單元140 -起進行旋轉，此時， 基板1與基板支撐單元14〇係在利用基板支撐單元⑽之第一元 件141、第二元件142以及彈性元件143之配合以上下失持住基板 1兩側的情況下相對於基座13G -起進行旋轉。 接著π參閱第7圖、第8圖以及第9圖，第8圖為第7圖第二 元件142之内側元件161的示意圖，第9圖為第7圖第二元件 I42之-外側疋件162的示意圖。真空孔洞⑹係用來提供一吸力 至基板1，藉以於基板i上執行雷射刻印時避免基板i產生移動， 且由第7圖可知，複數個真空孔洞163係形成於第一元件141以 及第-7G件142分別與基板i所接觸之表面上且沿著基板i之傳 輸，向設置。第二元件142包含_元件161以及外側元件162， 由第7圖、第8圖以及第9圖可知，内側元件161以及外側元件 162係互相連接以使内側元件161之—表面⑹&與外側元件162 之一表面162a彼此相對。 内側元件161包含沿著魏向方向*形成之複數個真空孔洞 163’真空孔洞163係與形成於内側元件161内之一第一真空部164 連接外側元件162包含有對應於第一真空部164之一第二真空 部165，當内側元件⑹與外側元件162連接日寺，第一真空部164 與第二真空部165就會軸-真空腔體，如此—來，該真空腔體 12 200906701 即可針對位於真空孔洞163處之基板丨提供一充足的吸力。複數 個抽氣孔166係形成於外側元件162之一下表面且連接於一真空 源（如一真空泵浦）’藉以使弟一真空部164與第二真空部165内 之空氣可從複數個抽氣孔166排出。 第一元件141以及第二元件142之結構係互相對稱。因此，當 第一元件141在位於第二元件142之上方的情況下翻轉18〇度後， 第-元件141就會位於第—元件142之下方且與未翻轉前的第二 元件142具有相同之功能，同理，第二元件142則是會改位於第 一元件141之上方且與未翻轉前之第一元件141具有相同之功能。 此外，雷射刻印單元100另包含有一氣缸151以及一凸輪152, 藉以防止基板1在旋轉期間脫離基板支撐單元140。 氣缸151係利用氣壓驅動且垂直於基座13〇，如此一來，由第 5圖可知，當氣缸⑸之-活塞⑸a向上移動時，活塞咖係會 垂直地向上推動凸輪152。 凸輪⑸之-中央部係安裝於_ 13()上以使凸輪152可以相 對於^第二軸C2旋轉。此外，—彈性元件154係連接於凸輪⑸ 之-第-端152a以及基座13〇 ’由於彈性元件154係可彈性地驅 動凸輪152之第-端152a往錢氣紅⑸之活塞⑸&之方向偏 轉，因此凸輪152之第—端咖係頂靠於氣缸151之活塞咖 13 200906701 上，而凸輪152之—钕 .1C_ „ 苐一知15此係可選擇性地接觸於第一元件 時凸幹152圖所示’當活塞仙向上推動凸輪152之第一端此 二，咖就會接—元件141且施壓並驅 以使第一元件141與第二元件142分離，反之， 則合滅-了以塞151a向下_時，凸輪152之第二端152b 二疋件141分離’如此一來’彈性元件143就會驅動第 -兀件141再次往接近第二元件142之方向偏轉。 。接著請參閱第1()圖，第1〇圖為第2圖雷射刻印單元觸之一 擒塊172之示輯。擒塊172制來防止基板支撐單幻40相對 於基座130旋轉之一角度大於一預設角度，也就是說，由第10圖 可知’一突出部171係連接於第-树⑷（亦可改連接於第二元 >)匕來，在第一元件與第二元件142相對於基座 30旋轉q 180度後’擔塊172就會止抵住突出部Π1，藉以防止基 板支撐單元140相對於基座13〇旋轉的角度大於⑽度。此外， ^第U)騎7F ’ —避震單元173 (其内設有—彈簧）係設置於擔 y 之伯！肖來減緩當突出部171碰撞撞塊I72 a寺所產生的 衝擊力。 ' ^述之複數個感應器勘係用來谓測基板1是否位於-邊界區 域，該邊界區域係介於基板支料元】彻及傳輸軌道之間。 由弟1圖可知，複數個感應器⑽係分別設置於基板支撐單元14〇 相對基板1之傳輸方⑽—前端部分以及—後端部分，當複數個 200906701 感應器180偵測到基板1不是位於基板支撐單元14〇上，而是位 於上述之該邊界區域内時，感應器⑽就會發送出—訊號以阻止 基板支撐單元140進行旋轉。 。。以下係藉由第1圖至第1Q圖以針對具有上述配置之一雷射刻 印單元之作動流程進行詳細的描述。 在將基板1從傳輪轨道1〇傳送至基板支撐單元⑽之前，用 來接觸基板1的第二元件142之表聽平行於基板丨之第二表面 而第元件141則疋相對於第一軸〇1而往遠離第二元件⑷ 之方向偏轉（如第5圖所示）。 此時’氣缸151之活塞151&係向上推動凸輪152之第一端 以使凸輪152相對於第二軸C2旋轉，而凸輪152之第二端 咖就會隨之施壓並驅動第一元件⑷，如此一來，第一元件⑷ 即可相對於第-軸α而往遠離第二元件142之方向偏轉，故第一 兀件141係與第二树1<42呈現分離之狀態（如第5圖所示）。 ，而在使用-握爪或—推桿將基板丨放置於基板支撐單元_ 2會開始在第一表面2(即基板1之上表面）上執行雷射刻印， 此時’第-元件141係與第二元件142分離。 然若要在第二表面3(即基板1之下表面）上進行雷射刻印的 15 200906701 :兒則，基板1之前，須先上下娜基板1之兩側，也就 ^ " 魏151a^頂靠而隨之娜性元件I54之彈力所 Γ _二㈣她方崎，㈣，凸㈣之 弟:=办就會與第一元件141分離（如第6圖所示）。接著第 7件1就會因彈性元件⑷而往接近第二元請之方向偏 ’進而與第二树142共同夾持住基板1之兩側。 而在第-元件⑷與第二元件142分別失持住基板i之兩側後 第圖所示）’驅動裝置ln以及動力傳動單元⑽就會帶動 土板1相對於基座13Q旋轉18()度，以使第二表面3 (即基板1 之下表面）朝上。而在完成第二表面3上的雷射刻印後，一握爪 或-推桿就切已完成雷射雙關印之餘丨傳送至下— 〜由上述可知，本發明實施例之一雷射刻印單元包含有用來於執 行雷射刻印時支撐—基⑽—基板支料元以及聽旋轉該基板 支禮單7L之-旋轉裝置’如此—來，即可節省在習知技術中因具 有與雷射辦單元相距—段距狀_單元减生喊板往返運 送時間’進而驗在—基板上執行雷侧印的魏製程時間。 Θ此外’本發明係利用内建於雷射刻印單元内之旋轉裝置來取代 驾知技術巾軸雷賴印單元相距—段距離的翻轉單元，因此， 16 200906701 有效地降低雷射事卩設備物尺相端目_钱空 麟-提岐’由於树__住基 仃基板之翻轉，因此，相軔 疋万式以進 之真空吸盤來娜板之::技術利用附著於基板中央部上 地改善基板上污輯留的約/卩早_可大大 的“，故可省略後續清糕板的流程。 範 圍所Γ上所述僅為本發明之較佳實施例，凡依本發明申請專利 之均㈣化與修飾1觸本㈣之涵蓋範圍。 【圖式簡單說明】 圖 第1圖為本發明實施例1射刻印單元以及—傳輸軌道之示意 第2圖為第i圖移除傳輸軌道後雷射刻印單元之示意圖。 第3圖為第2圖基板支撐單域轉—特定角度之示意圖。 第4圖為第2圖基板支撐單元夾持基板兩側之側視圖。 .元件分離之示 第5圖為第2圖基板支撐單元之第一元件與第 意圖 意圖 第6圖為第2 ®基板支撐單ϋ之第—元件向第二元件靠 近之示 第7圖為第2圖基板支撐單元之第二元件之示意圖 第8圖為第7圖第二元件之内側元件之示意圖。 17 200906701 第9圖為第7圖第二元件之外側元件之示意圖。 第10圖為第2圖雷射刻印單元之擋塊之示意圖。 【主要元件符號說明】 1 基板 2 第一表面 3 第二表面 10 傳輸軌道 100 雷射刻印單元 110 旋轉裝置 111 驅動裝置 112 輸出軸 120 動力傳動單元 121 傳動軸 122 從動軸 123 傳動皮帶輪 124 從動皮帶輪 125 皮帶 130 基座 140 基板支撐單元 141 第一元件 142 第二元件 143、 彈性元件 151 氣缸 154 151a 活塞 152 凸輪' 152a 第一端 152b 第二端 161 内側元件 161a、 表面 162a 162 外側元件 163 真空孔洞 164 第一真空部 165 第二真空部 166 抽氣孔 171 突出部 172 擔塊 173 避震單元 18 200906701 180 感應器 C2 第二軸 ci 第一軸 19Mi and - second element 142 points: mosquito support early element (10) - element - element 1 (four) two elements H2 schematic = Figure 2 substrate support single touch - block 172 schematic. $ 为 图 为 为 2 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图h Performing laser marking, embodiment of the invention = for rotating - substrate support element. One of the rotating rotating devices ί = 7° 14<>> is used to perform the laser _ when the supporting substrate condensing device 110 includes - driving the agricultural device lu, a susceptor 130, the substrate supporting unit 14 〇, a 70-bit block 172 , and a plurality of sensors 18 〇. The right-hand device (1) is provided to provide a substrate transfer unit 140, and the description of the substrate support unit will be mentioned in the following description. In this embodiment, the cylinder is supported by the (1) miscellaneously driven cylinder to rotate the substrate supporting unit 140 by 180 degrees. The power transmission unit 12G_ transmits the rotational force provided by the reversing device (1) to the plate selection unit 14''. The power transmission unit U0 includes a transmission shaft d, a driven shaft 122, a transmission pulley 123, and a driven pulley 124. And a belt 125. The drive shaft 121 is fixed to an output shaft 112 of the drive unit η and rotates together with the output shaft U2. The drive pulley 123 is fixed to the transmission shaft i2i and rotates together with the transmission shaft 01 200906701. In this embodiment, two substrate supporting units 140 and two driving pulleys 123 for rotating the substrate supporting unit 14 are used. The driven shaft 122 is rotatably disposed on the base 130. The base 13 supports the driven shaft 122 by bearings. The base support unit 140 is also coupled to the driven shaft 122 and to the driven shaft 122. Rotate. The driven pulley 124 is fixed to the driven shaft 122, and as can be seen from Fig. 2, in this embodiment, two driven pulleys 124 are used to cooperate with the two drive pulleys 123. Further, a belt 125 is circumferentially disposed between the drive pulley 123 and the driven pulley 124. The base 130 is fixed on the transmission lane to support the driven shaft I]? And a substrate supporting unit 140. The substrate supporting unit 140 is coupled to the driven shaft 122 and rotatable relative to the base 13. The substrate supporting unit 140 is configured to support the substrate when performing laser marking. The substrate supporting unit 140 includes a first component (4), a The second member 142, the plurality of elastic members 143, and the plurality of vacuum holes 163 (as shown in FIG. 1). The first member 141 is in contact with the first surface 2 (i.e., the upper surface of the substrate) and is rotatably disposed on a first axis C1. The second member H2 is in contact with the second surface 3 (i.e., the lower surface of the substrate 1) and is mounted at a position substantially equal to the height of the transfer track ι to support the substrate 1 transferred from the transfer path 1G. The elastic members 143 as shown in FIG. 2 are respectively disposed on the first member 141 and the second member 142 and are used to elastically drive the first member 141 and the second member 142 to the first member (4) 11 200906701 #近- deflection in the direction of the turn 142. Then, referring to Fig. 3, in order to perform the laser marking on the second surface 3 after the laser marking of the first surface 2 of the substrate 1 is completed, the substrate 1 and the substrate reading unit must be The substrate 1 and the substrate supporting unit 14 are detached from each other on the both sides of the substrate 1 by the cooperation of the first member 141, the second member 142, and the elastic member 143 of the substrate supporting unit (10). In this case, the rotation is performed with respect to the susceptor 13G. Next, referring to FIG. 7, FIG. 8, and FIG. 9, FIG. 8 is a schematic view of the inner member 161 of the second member 142 of FIG. 7, and FIG. 9 is the outer member 162 of the second member I42 of FIG. Schematic diagram. The vacuum hole (6) is used to provide a suction force to the substrate 1 to prevent the substrate i from moving when performing laser marking on the substrate i. As can be seen from FIG. 7, a plurality of vacuum holes 163 are formed in the first element 141 and the first The -7G members 142 are respectively disposed on the surface in contact with the substrate i and along the substrate i. The second member 142 includes an element 161 and an outer member 162. As can be seen from FIGS. 7 , 8 and 9 , the inner member 161 and the outer member 162 are interconnected such that the inner member 161 - the surface (6) & the outer member One of the surfaces 162a is opposed to each other. The inner member 161 includes a plurality of vacuum holes 163 formed along the direction of the weft*. The vacuum hole 163 is connected to one of the first vacuum portions 164 formed in the inner member 161. The outer member 162 includes a portion corresponding to the first vacuum portion 164. a second vacuum portion 165, when the inner member (6) and the outer member 162 are connected to the temple, the first vacuum portion 164 and the second vacuum portion 165 are shaft-vacuum chambers, so that the vacuum chamber 12 200906701 can A sufficient suction force is provided for the substrate 位于 at the vacuum hole 163. A plurality of air vents 166 are formed on a lower surface of the outer member 162 and connected to a vacuum source (such as a vacuum pump) so that the air in the vacuum portion 164 and the second vacuum portion 165 can be exhausted from the plurality of air vents 166. . The structures of the first element 141 and the second element 142 are symmetrical to each other. Therefore, when the first element 141 is flipped 18 degrees above the second element 142, the first element 141 will be located below the first element 142 and have the same condition as the second element 142 before the inversion. Functionally, the second component 142 will be located above the first component 141 and have the same function as the first component 141 before it is flipped. In addition, the laser marking unit 100 further includes a cylinder 151 and a cam 152 to prevent the substrate 1 from being detached from the substrate supporting unit 140 during rotation. The cylinder 151 is driven by air pressure and is perpendicular to the base 13 〇. Thus, as can be seen from Fig. 5, when the piston (5)a of the cylinder (5) moves upward, the piston and the cradle push the cam 152 vertically upward. The central portion of the cam (5) is mounted on _ 13 () so that the cam 152 can be rotated relative to the second axis C2. In addition, the elastic member 154 is coupled to the first end 152a of the cam (5) and the base 13''. The elastic member 154 elastically drives the first end 152a of the cam 152 to the direction of the piston (5) & Deflection, so the first end of the cam 152 is against the piston coffee 13 200906701 of the cylinder 151, and the cam 152 - 钕.1C_ 苐 知 15 15 this system can selectively contact the first element when the convex 152 is shown in the figure 'When the piston fairy pushes the first end of the cam 152 to the second end, the coffee is connected to the element 141 and is pressed and driven to separate the first element 141 from the second element 142, and vice versa. When the plug 151a is turned down, the second end 152b of the cam 152 is separated by the second member 141. Thus, the elastic member 143 drives the first member 141 to deflect again toward the second member 142. Please refer to FIG. 1( ), which is a representation of the laser marking unit touch block 172 of FIG. 2. The block 172 is configured to prevent the substrate from supporting the single magic 40 to rotate relative to the base 130. More than a predetermined angle, that is, as shown in FIG. 10, a protrusion 171 is connected to - the tree (4) (may also be connected to the second element >), after the first element and the second element 142 are rotated by 180 degrees with respect to the base 30, the load block 172 will stop against the protrusion Π1, Thereby, the angle at which the substrate supporting unit 140 is rotated relative to the base 13 is prevented from being greater than (10) degrees. In addition, the ^Uth riding 7F'-shocking unit 173 (with the spring provided therein) is disposed on the y; To mitigate the impact force generated when the protruding portion 171 collides with the collision block I72 a. ' ^The plurality of sensor surveys are used to determine whether the substrate 1 is located in the - boundary region, which is interposed between the substrate support elements Between the transmission track and the transmission track. It can be seen from the figure of the brother 1 that a plurality of sensors (10) are respectively disposed on the transmission side (10) of the substrate supporting unit 14 to the substrate 1 - the front end portion and the rear end portion, when a plurality of 200906701 sensors are used. 180 detects that the substrate 1 is not located on the substrate supporting unit 14 , but is located in the boundary region, the sensor ( 10 ) sends a signal to prevent the substrate supporting unit 140 from rotating. Figures 1 to 1Q are intended to have the above The operation flow of one of the laser marking units is described in detail. Before the substrate 1 is transferred from the transfer track 1〇 to the substrate supporting unit (10), the surface of the second element 142 for contacting the substrate 1 is parallel to the substrate. The second surface and the first element 141 are deflected away from the second element (4) with respect to the first axis 1 (as shown in Fig. 5). At this time, the piston 151& of the cylinder 151 pushes the cam 152 upward. The first end rotates the cam 152 relative to the second axis C2, and the second end of the cam 152 presses and drives the first component (4), so that the first component (4) can be opposite to the first component The axis α is deflected away from the second element 142, so that the first element 141 is in a separated state from the second tree 1 < 42 (as shown in Fig. 5). And placing the substrate 于 on the substrate supporting unit _ 2 using the gripper or the push rod starts to perform laser marking on the first surface 2 (ie, the upper surface of the substrate 1), at which time the 'first element 141 is Separated from the second element 142. However, if laser marking is to be performed on the second surface 3 (ie, the lower surface of the substrate 1), 2009-09-01: Before the substrate 1, the two sides of the substrate 1 must be lifted, that is, ^ " Wei 151a^ The top and the elastic element I54's elastic force Γ _ two (four) her Fang Qi, (four), convex (four) brother: = will be separated from the first component 141 (as shown in Figure 6). Then, the seventh member 1 is biased toward the second member by the elastic member (4), thereby holding the both sides of the substrate 1 together with the second tree 142. And after the first element (4) and the second element 142 are respectively held on both sides of the substrate i, the driving device ln and the power transmission unit (10) drive the soil plate 1 to rotate relative to the base 13Q (). Degrees such that the second surface 3 (i.e., the lower surface of the substrate 1) faces upward. After the laser marking on the second surface 3 is completed, a gripper or a pusher is cut to complete the laser double-printing and the ember is transferred to the lower side - as can be seen from the above, one of the embodiments of the present invention is laser-engraved. The unit includes a support-base (10)-substrate support element for performing laser marking and a rotating device for rotating the substrate support 7L so that the conventional technology can be saved with the laser The unit distance - the segment distance _ unit reduction shout board round-trip transport time 'and then on the substrate - the implementation of the lightning side of the Wei process time. In addition, the present invention utilizes a rotating device built into the laser marking unit to replace the inverting unit of the distance between the distances of the technology and the printing device. Therefore, 16 200906701 effectively reduces the laser equipment.尺相端目_钱空麟-提岐' Due to the flipping of the substrate __ 仃 仃 , , , , , , , , , , , , , 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空The process of improving the stain on the substrate can be greatly improved, so that the flow of the subsequent cake board can be omitted. The scope is only the preferred embodiment of the present invention, and the patent application according to the present invention is The scope of coverage (4) and the modification 1 (4). [Fig. 1] Fig. 1 is a schematic diagram of the first embodiment of the present invention, and the schematic diagram of the transmission track is shown in Fig. 2, after the transmission track is removed. Schematic diagram of the laser marking unit. Fig. 3 is a schematic view showing the single-domain rotation of the substrate supporting the specific angle in Fig. 2. Fig. 4 is a side view showing the two sides of the substrate supporting unit of the substrate supporting unit in Fig. 2. Figure 5 is the first of the substrate support unit of Figure 2. Fig. 6 is a view of the second component of the second substrate support unit, and the second component is shown in Fig. 7. Fig. 8 is a schematic view of the second component of the substrate supporting unit of Fig. 2. A schematic diagram of the inner component of the second component. 17 200906701 Figure 9 is a schematic diagram of the outer component of the second component of Fig. 7. Fig. 10 is a schematic view of the stopper of the laser marking unit of Fig. 2. [Description of main component symbols] 1 substrate 2 first surface 3 second surface 10 transmission track 100 laser marking unit 110 rotating device 111 driving device 112 output shaft 120 power transmission unit 121 transmission shaft 122 driven shaft 123 transmission pulley 124 driven pulley 125 belt 130 base 140 substrate support unit 141 first element 142 second element 143, elastic element 151 cylinder 154 151a piston 152 cam ' 152a first end 152b second end 161 inner element 161a, surface 162a 162 outer element 163 vacuum hole 164 first vacuum 165 second vacuum portion 166 air suction hole 171 protruding portion 172 load block 173 shock absorber unit 18 200906701 180 sensor C2 A first two-axis shaft 19 ci