200904271 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種印刷線路板埋人式電容結構，尤指具有複 數個金屬區塊的印刷線路板埋入式電容纟士構。 【先前技術】 (Embedded capacit〇r), 印刷線路板之壓合雜’於原有的魏層或齡層加人介電層及 另層銅、洛，利用兩層緊鄰的銅箱面形成電容，此發明源於服 年美國的PCB製造廠商-Zyc〇n，曾在高階的多層板中，在原有電 源層或接地層旁，另加人極薄（2_4mil)的介f層與鋪，製作 成為整體㈣埋人式電容器，此商名稱為BuriedBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board buried capacitor structure, and more particularly to a printed circuit board embedded capacitor gentleman structure having a plurality of metal blocks. [Early technology] (Embedded capacit〇r), the printed circuit board is pressed and mixed with the original Wei or the aged layer plus the dielectric layer and the other layer of copper, Luo, using two layers of copper box surface to form a capacitor The invention originated from Zyc〇n, a PCB manufacturer in the United States. It used to be in the high-end multi-layer board, next to the original power layer or ground layer, and added a very thin (2_4mil) layer and layer. Become a whole (four) buried capacitor, the trade name is Buried
Capacitor(BC)。其優點為高頻操作下可降低雜訊，節省傳統電; 所佔面積。Zyc〇n公司也曾為此申請了數篇關於％的專利（即美丨 專利號5,079，_、5，161，_、5，155,655)。惟其電容量很小 一直未曾普及。 為了大幅提高印刷線路板埋人式電容的電容值，已有人利用 離2濺鍍法在錢㈣線路板電源極板或接地極板上先麟一層 :、mi貝¥數之;I I層’再利用離子減鑛法或無電解浸鑛法，在 該介電層上鍵-層金屬薄層，再以魏法加厚而形成另一電極， 200904271 材料作為介電 因以大幅度降低兩個電極的距離且選用高介電常數 層，故可大幅度提高電容值。 然而，技種方法中存在著可靠性問題，導致至今尚未被举界 所採用。線路板主要材獅_玻纖柄_服係數盘 鋪及介材·鱗脹係數不同，尤其是超過躺玻璃轉化 溫度以上時相差更大(依序分別約為13()、17、_。〇，這導致 在後續製程中帶進熱源時(例如組鱗的焊接製程），哪旨膨服 較大而帶給_及介騎域的力量，因介縣延祕不佳致使 介電層容易產生裂痕，並因銅_轉電性細絲物(⑽咖Capacitor (BC). The advantage is that the high frequency operation can reduce the noise and save the traditional electricity; Zyc〇n has also applied for several patents on this (ie, US Patent Nos. 5,079, _, 5, 161, _, 5, 155, 655). However, its small capacity has never been popular. In order to greatly increase the capacitance value of the buried circuit capacitor of the printed circuit board, the use of the two-sputter method on the power supply board or the grounding plate of the money (four) circuit board is first layered: The ion-mining method or the electroless leaching method is used to bond a thin layer of a metal layer on the dielectric layer, and then thicken the film to form another electrode, and the 200904271 material serves as a dielectric source to greatly reduce the two electrodes. The distance is also selected from the high dielectric constant layer, so the capacitance value can be greatly increased. However, there are reliability problems in the technical methods, which have not yet been adopted by the public. The main board of the circuit board _ _ glass fiber handle _ service coefficient plate and media · squash expansion coefficient is different, especially when the temperature exceeds the glass transition temperature is greater than the difference (in order of about 13 (), 17, _. This leads to the introduction of a heat source in the subsequent process (for example, the welding process of the group scales), which means that the expansion is large and brings the strength of the _ and the squad, and the dielectric layer is easily generated due to the poor retention of the county. Crack, and due to copper _ turn-on filaments ((10) coffee
Anodic Filaraent，⑽特性，介電層裂缝兩侧的域容易在使用 段時間後互相短路’造成埋入式電容及整個印刷電路板失效。 【發明内容】 本發明之主要目的在提供—種_鱗板埋人式電容結構， 藉著複數個金塊所組極板，可使因細旨熱雜而產生的 介電層_ ’只針發生在該騎區，而非整倾塊上，保持印 刷線路板埋入式電容的可靠性。 基於上述目的，本發明埋入式電容結構主要由電源極板、接 極板以及在電源極板與接地極板之間的介電層所構成。為了 $免因樹轉膨祕導龜人式餘結翻壞，本發日紐入式電 夺、、°構中的電源極板與接地極板均由複數個金屬區塊所組成。在 200904271 該些個金屬區塊之間且 屬區境彼此之間輯 讀的喊條溝槽，絲該些個金 少連接線。 ^ ’具有電性連接該些個金屬區塊的至 關於本發明之優 式得到進一步的瞭解。月神Ύ以藉由以下的發明詳述及所附圖 f實施方式】 請參閱第Μ〜1β圖，第1㈣圖為本發明印刷 入 電容結構之示意圖。 呢線路板埋入式 容主要由電祕^ _路板埋入式電 源極板1〇、接地極板+ 極板14之_介_… 及在电源極板10與接地 此》電層12構成。這其中，如第_所示，介電層 疋 1 離顿触錢雜板㈣接地極紹4之_成的 -有…丨貝讀之材料。電源極板1〇或接地極板14其中之一是 f層印刷線路板的電源層或接地層’另-層則是在介電層12二 完成後再在介電層12上以離子濺鍍及電鍍法所形成的金屬層，^ 是利用無電沉積(Electrolessdep〇si1：i〇n)以及電鑛法在介電層 12上所形成的金屬層。再透過印刷線路板布線設計接通另外—極。 為了避免因樹酯熱膨脹而導致埋入式電容結構損壞，本發明 電容結構中的電源極板10與接地極板14均由複數個金屬區塊 l〇a l〇b、14a〜14b所組成，如第1A圖所示。在該些個金屬區塊 10之間具有彼此交錯的複數條溝槽’並在該些個金屬區塊 200904271 他〜⑽、14a〜14b彼此之間的溝槽5中，具有電性連接紗個金 屬區塊l〇a〜1〇b、.Ub的連接線1〇c、14c。如此一來，就能利 用金屬區塊1〇a與連接線1〇c之間寬度上較大的差显，當樹 醋玻纖布遇熱膨脹時，金屬區塊1〇a〜勘及·祕之間的介電 層12 ’因其兩侧銅箱完整，而具有較強之抗拉長性，而溝槽5區 的2電層只有連接線10c及14c偕同抗拉長，相對力量弱很多， 使得介電層12因樹酯熱膨脹所可能產生賴縫，㈣集中在溝槽 5中，而非金屬區塊l〇a〜l〇b。 需特別注意的是，金屬區塊.1Gb、14a〜14b、溝槽5及連 接線10c、14c之長寬及其之間的長寬比例，將因印刷線路板所用 樹酯，厚度及布線而有所不同。 由於介電層12的裂缝都將集中在溝_ 5發生，為了避免銅 ^^^t^^^^CConductive Anodic Filament, CAF),^^， 而導致電祕板1G與接地極板14之連接線此及…被導通， 因此在設置連接線1Gc、14c時，需設置在不同位置，如第Μ或 1B圖所不。透過本結構設計，可將樹醋熱膨服所產生之力，引導 至溝槽5.在溝槽5可能產生之介電層12裂縫，因其兩側不會同時 土見連接線l〇c及14c’自然無短路之虞而可保持埋入式電容之可 靠性。 雖然；丨电層12的裂縫都將集中在溝槽區5發生，且連接線 及14c已安排在不同位置，但是若裂缝报長仍可能橫跨不同位置 200904271 的連接線10c及14c。為增加可靠性，可在電源極板1〇與接地極 板14中的該些個金屬區塊10a〜1〇b、⑷〜地及連接、線l〇c及 與介電層12之間形成鎳層16或其他不易長枝(dendrite)及不出 現陽極導電性細絲物(Conductive A_c⑴棚邮caf)之金屬 層，如第二圖所示。 此外’除了如第1A〜1B、2圖中的實施範例，電性連接至該些 個金屬區塊l〇a〜l〇b、14a〜14b的連接線1〇c、⑷，可依據實際佈 線需要，設置有複數條，不見得只是單—條，同時連接線此、说 也可是直線或彎線。連接線此、⑷可將金屬區塊全部連成一片， 構成單個埋入式電容使用，也可連成數片區塊，構成多個埋入式 電容使用。 藉由以上較佳具體實施例之詳述，係、希望能更加清楚描述本 7之特徵與精神，而並非以上述所揭露的較佳具體實施例來對 7明之範私嫌制。相反地，其目的是希望能崎各種改變 及具相等性的安排於本發騎欲申請之專·_鱗内。 【圖式簡單說明】 入式電容結構之示意圖 電容結構之另—示意圖 第1A〜1B圖為本發明印刷線路板埋 第2圖為本發明印刷線路板埋入式 200904271 【主要元件符號說明】 5溝槽 10電源極板 10a〜10b、14a~14b金屬區塊 10c、14c連接線 12介電層 14接地極板 16鎳層Anodic Filaraent, (10), the domains on both sides of the dielectric layer crack are prone to short-circuit each other after a period of use, resulting in failure of the buried capacitor and the entire printed circuit board. SUMMARY OF THE INVENTION The main object of the present invention is to provide a squaring-buried capacitor structure, which can be formed by a plurality of plates of a plurality of gold nuggets. The reliability of the printed circuit board buried capacitor is maintained in the riding zone, rather than on the tilting block. Based on the above objects, the buried capacitor structure of the present invention is mainly composed of a power supply plate, a contact plate, and a dielectric layer between the power supply plate and the ground plate. In order to avoid the damage caused by the tree, the power supply plate and the grounding plate in the structure are composed of a plurality of metal blocks. In 200904271, the strips of the strips between the metal blocks and between the regions are read by each other. Further understanding of the advantages of the present invention is obtained by electrically connecting the metal blocks. The following is a detailed description of the invention and the accompanying drawings. Please refer to the Μ1~1β diagram, and the first (fourth) diagram is a schematic diagram of the printed capacitor structure of the present invention. The embedded capacity of the circuit board is mainly composed of the electric secret ^ _ road board buried power supply plate 1 接地, the ground plate + the plate 14 _ _ _ ... and the power plate 10 and the grounding of the electric layer 12 . Among them, as shown in the _th, the dielectric layer 疋 1 is separated from the money board (4), the grounding pole is 4, and the material is read. One of the power supply plates 1 or the ground plates 14 is a power layer or a ground layer of the f-layer printed circuit board. The other layer is ion-sputtered on the dielectric layer 12 after the dielectric layer 12 is completed. And the metal layer formed by the electroplating method is a metal layer formed on the dielectric layer 12 by electroless deposition (Electroless dep〇si1: i〇n) and electro-mineralization. The additional-pole is then connected through the printed circuit board wiring design. In order to avoid damage of the buried capacitor structure due to thermal expansion of the resin, the power supply plate 10 and the ground plate 14 of the capacitor structure of the present invention are composed of a plurality of metal blocks l〇al〇b, 14a~14b, such as Figure 1A shows. Between the plurality of metal blocks 10, there are a plurality of trenches 'interlaced with each other' and in the trenches 5 between the metal blocks 200904271 and (10), 14a to 14b, respectively, having electrically connected yarns The connecting lines 1〇c and 14c of the metal blocks l〇a~1〇b and .Ub. In this way, the difference between the width of the metal block 1〇a and the connecting line 1〇c can be utilized. When the tree vinegar fiberglass cloth is in thermal expansion, the metal block 1〇a~ exploration and secret The dielectric layer 12' between the two sides has a strong tensile strength due to the complete copper box on both sides, and the two electrical layers of the trench 5 area have only the connecting wires 10c and 14c which are tensile strength and relatively weak. , the dielectric layer 12 may be caused by thermal expansion of the resin, and (4) concentrated in the trench 5 instead of the metal blocks l〇a~l〇b. It should be noted that the length and width of the metal blocks .1Gb, 14a~14b, the trenches 5 and the connecting lines 10c, 14c and the length to width ratio between them will be due to the resin used in the printed circuit board, thickness and wiring. And it is different. Since the cracks of the dielectric layer 12 will concentrate on the trench _ 5, in order to avoid the copper ^^^t^^^^CConductive Anodic Filament, CAF), ^^, the connection of the secret board 1G and the grounding plate 14 is caused. The line and the ... are turned on, so when setting the connecting lines 1Gc, 14c, it is necessary to set them at different positions, such as the first or the 1B. Through the design of the structure, the force generated by the thermal expansion of the vinegar can be guided to the trench 5. The dielectric layer 12 crack may be generated in the trench 5, because the two sides do not simultaneously see the connecting line l〇c And 14c' naturally without short circuit to maintain the reliability of the buried capacitor. Although the cracks in the tantalum layer 12 will concentrate in the trench region 5, and the connecting lines and 14c have been arranged at different locations, the crack length may still span the connecting lines 10c and 14c of the different positions 200904271. In order to increase the reliability, the metal plates 10a to 1b, (4) to ground and the connection, the line l〇c and the dielectric layer 12 may be formed between the power supply plate 1 and the ground plate 14. The nickel layer 16 or other metal layer which is not easily dendritic and does not have an anode conductive filament (Conductive A_c (1) shed) is as shown in the second figure. In addition, except for the embodiment shown in FIGS. 1A to 1B and 2, the connection lines 1〇c and (4) electrically connected to the metal blocks l〇a to l〇b, 14a to 14b may be based on actual wiring. Need to set up a plurality of bars, not necessarily a single-strip, at the same time the connection line, said to be a straight line or a curved line. The connection line (4) can connect all the metal blocks into one piece, which can be used as a single buried capacitor, or can be connected into several blocks to form a plurality of buried capacitors. The features and spirit of the present invention are more clearly described in the above detailed description of the preferred embodiments, and are not to be construed as a preferred embodiment. On the contrary, the purpose is to hope that the various changes and equal arrangements can be arranged in the special scale of the application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to 1B are diagrams showing a printed circuit board embedded in the present invention. FIG. 2 is a printed circuit board embedded type of the present invention 200904271 [Explanation of main component symbols] 5 Trench 10 power supply plates 10a 10b, 14a-14b metal blocks 10c, 14c connection line 12 dielectric layer 14 ground plate 16 nickel layer