TW200903854A - Package and manufacturing method thereof - Google Patents

Abstract

A package and a manufacturing method thereof are provided. The manufacturing method comprises following steps. First, a chip is disposed on a substrate and is electrically connected to the substrate. Then, an adhesive-force adjusting layer is formed on the chip. A first adhesive-force is formed between the adhesive-force adjusting layer and the chip. Afterwards, a first lens layer is formed on the adhesive-force adjusting layer. A second adhesive-force is formed between the first lens layer and the adhesive-force adjusting layer. The surface state of the chip is changed because of covering the adhesive-force adjusting layer. The interactive effect between the cohesion and the surface tension of the first lens layer and the second adhesive-force is helpful to the forming of the first lens layer.

Description

200903854

- 'A vr / /jPA ' IX. Description of the Invention: [Technical Field] The present invention relates to a package and a method of manufacturing the same, and more particularly to a package having a lens layer and a method of manufacturing the same. [Prior Art] Please refer to FIG. 1A, which shows a schematic view of a conventional package. The package 100 includes a reflective cup 101, a wafer 103, and an encapsulant 105. The wafer 103 is placed in the reflective cup 101. The encapsulant 105 is poured into the reflective cup 101 to cover the wafer 103. The encapsulant 105 is formed in accordance with the shape of the reflective cup 101. After the encapsulant colloid 105 is poured into the reflector cup 101, the reflector cup 101 does not escape from the encapsulant 105 for repeated use. Therefore, the manufacturing of such a package 100 is caused to increase. Please refer to FIG. 1B, which shows a schematic view of another conventional package. Compared with the package 100 of FIG. 1A, the package 150 of FIG. 1B further includes a convex colloid 155. Please refer to Fig. 1C, which shows a schematic view of a mold. The material of the convex colloid 155 (as shown in Fig. 1B) is poured into at least one of the recesses 161 of a mold 160 and solidified into a convex colloid 155. Then, as shown in FIG. 1B, the convex colloid 155 is then adhered to the surface 157 of the encapsulant 105 by heating to form a package 150°. Although the convex colloid 155 can be used to improve the optical characteristics of the package 150, The steps of the manufacturing method of the package 150 are cumbersome, and its step is 200903854

The second step ii · i wj / / 3PA step includes the steps of the package 100 of FIG. 1A and the steps of manufacturing the convex colloid 155. In addition, the package 150 requires a mold 160 (as shown in Fig. 1C) as a mold for forming the convex colloid 155 during manufacture. Therefore, the manufacturing cost of the package 150 is further enhanced. SUMMARY OF THE INVENTION The present invention relates to a package and a method of fabricating the same, which utilizes an adhesion adjusting layer to adjust the shape of a first lens layer to control light to form different light field distributions after passing through the f-th lens layer. . According to a first aspect of the present invention, a method of fabricating a package is provided, the method comprising: first, disposing a wafer on a substrate to electrically connect the wafer to the substrate. Next, an adhesion adjusting layer is formed on the wafer. The adhesion adjustment layer has a first adhesion to the wafer. Then, a first lens layer is formed on the adhesion adjusting layer. There is a second adhesion between the adhesion adjusting layer and the first lens layer. Since the adhesion adjusting layer covers the wafer to change the surface state, the cohesive force of the material of the first lens layer, the interaction of the surface tension and the second adhesion contribute to the formation of the first lens layer. According to a second aspect of the invention, a package is presented. The package includes a substrate, a wafer, an adhesion adjusting layer, and a first lens layer. The wafer is disposed on the substrate, and the wafer is electrically connected to the substrate. The adhesion adjustment layer is disposed on the wafer and covers a portion of the substrate. The adhesion adjusting layer has a first adhesion to the wafer. The first lens layer is disposed on the adhesion adjusting layer. a second attachment between the adhesion adjusting layer and the first lens layer 7 200903854

Two violating muscles · a w _j / /3PA force. The change in the surface state of the wafer contributes to the formation of the first lens layer. In order to make the above-mentioned contents of the present invention more comprehensible, the following detailed description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] For the first embodiment, please refer to FIG. 2 and FIG. 3A simultaneously. 3C, FIG. 2 is a flow chart showing a method of manufacturing a package according to a first embodiment of the present invention, and FIGS. 3A to 3C are views showing a flow chart of the manufacturing method of FIG. First, as shown in Figs. 2 and 3A, in step 301, a wafer 220 is disposed on a substrate 210. The wafer 220 is electrically connected to the substrate 210 by, for example, at least one wire 215. Next, as shown in Figs. 2 and 3B, in step 303, an adhesion adjusting layer 230 is formed on the wafer 220. The adhesion adjusting layer 230 and the wafer 220 have a first adhesion. Then, as shown in Fig. 3C, a first lens layer 240 is formed on the adhesion adjusting layer 230 to form a package member 200. The adhesion adjusting layer 230 and the first lens layer 240 have a second adhesion. The adhesion of the first lens layer 240 is facilitated by the adhesion of the adhesion adjusting layer 230 over the wafer 220 to change the surface state such that the cohesive force of the material of the first lens layer 240, the interaction of the surface tension and the second adhesion. Adhesion is the molecular attraction between two substances. That is, the smaller the adhesion, the smaller the molecular attraction between the two substances, and the greater the attachment force, the greater the molecular attraction between the two substances. In this implementation 8 200903854

-· i J / / 3PA In the example, since the adhesion adjusting layer 230 covers the wafer 220 to change the surface state, the cohesive force of the material of the first lens layer 240, the surface tension and the second adhesion between the adhesion adjusting layers interact. The effect contributes to the formation of the first lens layer 240 compared to the first adhesion. Moreover, in the embodiment, the wafer 220 is, for example, a Light Emitting Diode (LED), and the substrate 210 is, for example, a Printed Circuit Board (PCB). Please refer to FIG. 4, which is a schematic diagram showing the light emitted from the wafer of FIG. 3C. When the wafer 220 is illuminated /, the light 400 passes through the adhesion adjusting layer 230 and the first lens layer 240, respectively. Since the adhesion adjusting layer 230 can adjust the shape of the first lens layer 240, the light field 400 can be controlled to form a different light field distribution 410 after passing through the first lens layer 240. Preferably, in the present embodiment, the first lens layer 240 is permeable to a half sphere by appropriately adjusting. As shown in FIG. 3B, when the adhesion adjusting layer 230 covers the wafer 220, the adhesion adjusting layer 230 is relatively flat. Thus, the adhesion adjusting layer 230 covers only a portion of the wire 215, and the other portion of the wire 215 is exposed outside the adhesion adjusting layer 230. As shown in Fig. 3C, when the first lens layer 240 covers the adhesion adjusting layer 230, the first lens layer 240 is more convex. Thus, although the adhesion adjusting layer 230 can cover only a portion of the wire 215, and the other portion of the wire 215 is exposed outside the adhesion adjusting layer 230, the first lens layer 240 can cover the exposed wire. Further, as shown in Fig. 3C, the adhesion adjusting layer 230 of the present embodiment covers the portion of the substrate 210 in addition to the wafer 220. However, the adhesion adjusting layer 230 can cover all the substrates 200903854

—* a j / 73PA 210. This section looks at the needs of the process. The adhesion adjusting layer 230 can be formed on the wafer 220 and the substrate 210 by spin coating, brushing, spraying, dipping or spotting. In the present embodiment, the first lens layer 240 is formed by spotting. On the adhesion adjusting layer 230. The material of the adhesion adjusting layer 230 is, for example, Teflon, epoxy or smcon. The material of the first lens layer 24 is, for example, epoxy or silicone. The material of the first lens layer 240 and the material of the adhesion adjusting layer 230 may be the same material or may be different materials. In the present embodiment, the adhesion adjusting layer 230 and the first lens layer 24 are made of the same material, such as an epoxy resin. That is, the first adhesion is formed by the wafer 220 or the printed circuit board (substrate 21 〇) and the epoxy resin (adhesion adjusting layer 230), and the second adhesion is made of epoxy resin (adhesion adjusting layer 230). ) formed with an epoxy resin (first lens layer 24A). According to the experimental result, since the surface state of the substrate 21 and the wafer 220 is changed, the cohesion of the material of the first lens layer 240, the surface tension and the second adhesion between the adhesion adjusting layers interact to facilitate the first lens. Forming of layer 24〇. In the present embodiment, as shown in Figs. 2 and 3C, between steps 303 and 305, the manufacturing method preferably further includes the step of hardening the adhesion adjusting layer 230. This step is to harden the adhesion adjusting layer 230 to a non-flowing state so that the second slitting layer 240 is firmly formed on the adhesion adjusting layer 230. Among them, the method of breaking is, for example, heating or ultraviolet light irradiation to harden the adhesion adjusting layer 230. 200903854

73PA Second Embodiment Referring to Figure 5, there is shown a schematic view of a package in accordance with a second embodiment of the present invention. The package 300 of the present embodiment is different from the package 200 of the first embodiment in that a plurality of second lens layers 340 are formed on a first lens layer 240 to further adjust the shape of the second lens layer 340. The package disclosed in the above embodiments of the present invention and the method of manufacturing the same, wherein the shape of the first lens layer is adjusted by the adhesion adjusting layer to substantially control the formation of different light field distributions after the light passes through the first lens layer. Furthermore, (the adhesion adjusting layer and the first lens layer completely cover the wires to protect the wires. In addition, the package of the embodiment and the manufacturing method thereof can reduce the manufacturing cost and reduce the volume of the package. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the invention. It is intended to be a matter of ordinary skill in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. 11 200903854

—' a ” -w ί”PA [Simple description of the diagram] Figure 1A shows a schematic diagram of a conventional package. FIG. 1B is a schematic view showing another conventional package. Figure 1C shows a schematic view of a mold. Fig. 2 is a flow chart showing a method of manufacturing a package in accordance with a first embodiment of the present invention. 3A to 3C are schematic views showing the flow of the manufacturing method of FIG. 2. Figure 4 is a schematic view showing the light emitted from the wafer of Figure 3C. Fig. 5 is a schematic view showing a package according to a second embodiment of the present invention. [Description of main component symbols] 100, 150, 200, 300 101: Reflector cup 105: encapsulant 157: surface 161: recess _215: wire 230: adhesion adjusting layer 340: second lens layer 410: light field distribution: Package 103: Wafer 155: convex colloid 160: mold 210: substrate 220: wafer 240: first lens layer 40 0 : light 12

Claims (1)

200903854 _. i- ντ -J , /3PA &quot; X. Patent application scope: 1. A method for manufacturing a package, comprising: (a) arranging a wafer on a substrate to electrically connect the wafer to the substrate (b) forming an adhesion adjusting layer on the wafer, the adhesion adjusting layer and the wafer having a first adhesive force; and (c) forming a first lens layer on the adhesion On the adjustment layer, the adhesion adjustment layer and the first lens layer have a second adhesion. 2. The manufacturing method of claim 1, wherein after the step (c), the manufacturing method further comprises: forming at least one second lens layer on the first lens layer. 3. The manufacturing method according to claim 1, wherein the step (b) forms the adhesion adjusting layer on the wafer by spin coating, brushing, spraying, dipping or spotting. 4. The manufacturing method according to claim 1, wherein the step (c) forms the first lens layer on the adhesion adjusting layer by means of spot bonding. 5. The manufacturing method according to claim 1, wherein after the step (b) and before the step (c), the manufacturing method further comprises: hardening the adhesion adjusting layer. 6. The manufacturing method of claim 1, wherein the step (a) further comprises electrically connecting the wafer to the substrate by using a wire. 7. The method of manufacturing of claim 6, wherein the step (b) further comprises covering the portion of the wire such that the other portion of the wire is exposed 13 200903854 - λ vvj / /JPA for The adhesion is adjusted outside the layer. 8. The method of manufacturing of claim 7, wherein the step (c) further comprises covering the wire with the other portion exposed. 9. The method of manufacturing of claim 1, wherein the first lens layer is substantially a half sphere. 10. The method of manufacturing of claim 1, wherein the wafer is a Light Emitting Diode (LED) wafer. 11. The manufacturing method of claim 1, wherein the substrate is a Printed Circuit Board (PCB). 12. The manufacturing method of claim 1, wherein the first lens layer and the adhesion adjusting layer are substantially the same or different materials. 13. A package comprising: a substrate; a wafer disposed on the substrate, wherein the wafer is electrically connected to the substrate; an adhesion adjusting layer disposed on the wafer and covering a portion of the substrate The adhesion adjusting layer and the wafer have a first adhesion; and a first lens layer is disposed on the adhesion adjusting layer, and the adhesion adjusting layer and the first lens layer have a Second adhesion. 14. The package of claim 13, further comprising: at least one second lens layer, the second lens layer being superposed on the first lens layer. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> The wire is exposed outside the adhesion adjusting layer, and the first lens layer covers the exposed wire. 16. The package of claim 13 wherein the substrate is a printed circuit board. 17. The package of claim 13 wherein the wafer is a light emitting diode wafer. 18. The package of claim 13 wherein the first lens layer is substantially a half sphere. 19. The package of claim 13, wherein the adhesion adjusting layer is made of Teflon, epoxy or silicon. 20. The package of claim 13, wherein the material of the first lens layer is epoxy or silicone. 15