TW200903854A - Package and manufacturing method thereof - Google Patents
Package and manufacturing method thereof Download PDFInfo
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- TW200903854A TW200903854A TW096125471A TW96125471A TW200903854A TW 200903854 A TW200903854 A TW 200903854A TW 096125471 A TW096125471 A TW 096125471A TW 96125471 A TW96125471 A TW 96125471A TW 200903854 A TW200903854 A TW 200903854A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
Description
200903854200903854
-' A vr / /jPA ' 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一種封裝件及其製造方法,且特別是 有關於一種具有透鏡層之封裝件及其製造方法。 【先前技術】 請參照第1A圖,其繪示傳統之封裝件之示意圖。封 裝件100包括一反射杯101、一晶片103及一封裝膠體 105。晶片103係置放於反射杯101内。封裝膠體105係 灌入反射杯101内,以覆蓋晶片103。 封裝膠體105係依據反射杯101之形狀成形。封裝 膠體105灌入反射杯101後,反射杯101係不會脫離封 裝膠體105以重複使用。因此,使得此種封裝件100之製 造成本提高。 請參照第1B圖,其繪示另一種傳統之封裝件之示意 圖。相較於第1A圖之封裝件100,第1B圖之封裝件150 更包括一凸狀膠體155。請參照第1C圖,其繪示一模具 之示意圖。凸狀膠體155(如第1B圖所示)之材料係灌入一 模具160之至少一凹穴161中,並固化成為凸狀膠體 155。然後,如第1B圖所示,凸狀膠體155再利用加熱 之方式黏合於封裝膠體105之表面157上,以形成封裝件 150 ° 雖然凸狀膠體155可用以改善封裝件150之光學特 性,然而,封裝件150之製造方法的步驟較為繁瑣,其步 200903854- 'A vr / /jPA ' IX. Description of the Invention: [Technical Field] The present invention relates to a package and a method of manufacturing the same, and more particularly to a package having a lens layer and a method of manufacturing the same. [Prior Art] Please refer to FIG. 1A, which shows a schematic view of a conventional package. The package 100 includes a reflective cup 101, a wafer 103, and an encapsulant 105. The wafer 103 is placed in the reflective cup 101. The encapsulant 105 is poured into the reflective cup 101 to cover the wafer 103. The encapsulant 105 is formed in accordance with the shape of the reflective cup 101. After the encapsulant colloid 105 is poured into the reflector cup 101, the reflector cup 101 does not escape from the encapsulant 105 for repeated use. Therefore, the manufacturing of such a package 100 is caused to increase. Please refer to FIG. 1B, which shows a schematic view of another conventional package. Compared with the package 100 of FIG. 1A, the package 150 of FIG. 1B further includes a convex colloid 155. Please refer to Fig. 1C, which shows a schematic view of a mold. The material of the convex colloid 155 (as shown in Fig. 1B) is poured into at least one of the recesses 161 of a mold 160 and solidified into a convex colloid 155. Then, as shown in FIG. 1B, the convex colloid 155 is then adhered to the surface 157 of the encapsulant 105 by heating to form a package 150°. Although the convex colloid 155 can be used to improve the optical characteristics of the package 150, The steps of the manufacturing method of the package 150 are cumbersome, and its step is 200903854
二遂綱航· i wj//3PA 驟包括第1A圖之封裝件100之步驟及製造凸狀膠體155 之步驟。此外,封裝件150於製造時需要模具160(如第 1C圖所示)做為形成凸狀膠體155之模具。因此,更加提 高封裝件150之製造成本。 【發明内容】 本發明係有關於一種封裝件及其製造方法,其利用一 附著力調整層調整一第一透鏡層之形狀,以使光線通過第 f 一透鏡層後控制形成不同之光場分佈。 根據本發明之第一方面,提出一種封裝件之製造方 法,此製造方法包括:首先,設置一晶片於一基板上,使 晶片與基板電性連接。接著,形成一附著力調整層於晶片 上。附著力調整層與晶片之間具有一第一附著力。然後, 形成一第一透鏡層於附著力調整層上。附著力調整層與第 一透鏡層之間具有一第二附著力。由於附著力調整層覆蓋 於晶片改變了表面態,使得第一透鏡層之材料的内聚力、 表面張力與第二附著力的交互作用,有助於第一透鏡層的 成形。 根據本發明之第二方面,提出一種封裝件。封裝件包 括一基板、一晶片、一附著力調整層及一第一透鏡層。晶 片係設置於基板上,且晶片係與基板電性連接。附著力調 整層係設置於晶片上並覆蓋部分基板。附著力調整層與晶 片之間具有一第一附著力。第一透鏡層係設置於附著力調 整層上。附著力調整層與第一透鏡層之間具有一第二附著 7 200903854The second step ii · i wj / / 3PA step includes the steps of the package 100 of FIG. 1A and the steps of manufacturing the convex colloid 155. In addition, the package 150 requires a mold 160 (as shown in Fig. 1C) as a mold for forming the convex colloid 155 during manufacture. Therefore, the manufacturing cost of the package 150 is further enhanced. SUMMARY OF THE INVENTION The present invention relates to a package and a method of fabricating the same, which utilizes an adhesion adjusting layer to adjust the shape of a first lens layer to control light to form different light field distributions after passing through the f-th lens layer. . According to a first aspect of the present invention, a method of fabricating a package is provided, the method comprising: first, disposing a wafer on a substrate to electrically connect the wafer to the substrate. Next, an adhesion adjusting layer is formed on the wafer. The adhesion adjustment layer has a first adhesion to the wafer. Then, a first lens layer is formed on the adhesion adjusting layer. There is a second adhesion between the adhesion adjusting layer and the first lens layer. Since the adhesion adjusting layer covers the wafer to change the surface state, the cohesive force of the material of the first lens layer, the interaction of the surface tension and the second adhesion contribute to the formation of the first lens layer. According to a second aspect of the invention, a package is presented. The package includes a substrate, a wafer, an adhesion adjusting layer, and a first lens layer. The wafer is disposed on the substrate, and the wafer is electrically connected to the substrate. The adhesion adjustment layer is disposed on the wafer and covers a portion of the substrate. The adhesion adjusting layer has a first adhesion to the wafer. The first lens layer is disposed on the adhesion adjusting layer. a second attachment between the adhesion adjusting layer and the first lens layer 7 200903854
二违綱肌· a w _j / /3PA 力。晶片之表面態的改變,有助於第一透鏡層的成形。 為讓本發明之上述内容能更明顯易懂,下文特舉較佳 實施例,並配合所附圖式,作詳細說明如下: 【實施方式】 第一實施例 請同時參照第2圖及第3A〜3C圖,第2圖繪示根據 本發明第一實施例之封裝件之製造方法的流程圖,第 r 3A〜3C圖繪示第2圖之製造方法之流程示意圖。 首先,如第2圖及第3A圖所示,於步驟301中,設 置一晶片220於一基板210上。晶片220例如是利用至 少一導線215與基板210電性連接。 接著,如第2圖及第3B圖所示,於步驟303中,形 成一附著力調整層230於晶片220上。附著力調整層230 與晶片220之間具有一第一附著力。 然後,如第3C圖所示,形成一第一透鏡層240於附 著力調整層230上,以形成一封裝件200。其中,附著力 調整層230與第一透鏡層240之間具有一第二附著力。由 於附著力調整層230覆蓋於晶片220上改變了表面態,使 得第一透鏡層240之材料的内聚力、表面張力與第二附著 力的交互作用,有助於第一透鏡層240的成形。 附著力係為兩種物質之間的分子吸引力。也就是說, 當附著力越小時,兩種物質之間的分子吸引力越小,當附 著力越大時,兩種物質之間的分子吸引力越大。於本實施 8 200903854Two violating muscles · a w _j / /3PA force. The change in the surface state of the wafer contributes to the formation of the first lens layer. In order to make the above-mentioned contents of the present invention more comprehensible, the following detailed description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] For the first embodiment, please refer to FIG. 2 and FIG. 3A simultaneously. 3C, FIG. 2 is a flow chart showing a method of manufacturing a package according to a first embodiment of the present invention, and FIGS. 3A to 3C are views showing a flow chart of the manufacturing method of FIG. First, as shown in Figs. 2 and 3A, in step 301, a wafer 220 is disposed on a substrate 210. The wafer 220 is electrically connected to the substrate 210 by, for example, at least one wire 215. Next, as shown in Figs. 2 and 3B, in step 303, an adhesion adjusting layer 230 is formed on the wafer 220. The adhesion adjusting layer 230 and the wafer 220 have a first adhesion. Then, as shown in Fig. 3C, a first lens layer 240 is formed on the adhesion adjusting layer 230 to form a package member 200. The adhesion adjusting layer 230 and the first lens layer 240 have a second adhesion. The adhesion of the first lens layer 240 is facilitated by the adhesion of the adhesion adjusting layer 230 over the wafer 220 to change the surface state such that the cohesive force of the material of the first lens layer 240, the interaction of the surface tension and the second adhesion. Adhesion is the molecular attraction between two substances. That is, the smaller the adhesion, the smaller the molecular attraction between the two substances, and the greater the attachment force, the greater the molecular attraction between the two substances. In this implementation 8 200903854
-· i J / / 3PA 例中,由於附著力調整層230覆蓋於晶片220上改變了表 面態,使得第一透鏡層240之材料的内聚力、表面張力與 附著力調整層間的第二附著力交互作用,相較於第一附著 力而言,有助於第一透鏡層240的成形。 再者,於本實施例中,晶片220例如是一發光二極體 (Light Emitting Diode,LED),且基板 210 例如是一印刷 電路板(Printed Circuit Board,PCB)。請參照第 4 圖,其 繪示第3C圖之晶片射出光線之示意圖。當晶片220發光 / 時,光線400係分別通過附著力調整層230及第一透鏡層 240。由於附著力調整層230係可調整第一透鏡層240之 形狀,因此當光線400通過第一透鏡層240後係可控制形 成不同之光場分佈410。較佳地,於本實施例中,第一透 鏡層240係可透過適當地調整,而成為一半球體。 如第3B圖所示,當附著力調整層230覆蓋晶片220 時,附著力調整層230較為平坦。如此,附著力調整層 230僅覆蓋部分之導線215,另一部份之導線215則係露 出於附著力調整層230外。如第3C圖所示,當第一透鏡 層240覆蓋於附著力調整層230時,第一透鏡層240較 為凸出。如此,雖然附著力調整層230僅可覆蓋部分之導 線215,另一部份之導線215則係露出於附著力調整層 230外,但第一透鏡層240係可覆蓋露出之導線。 此外,如第3C圖所示,本實施例之附著力調整層230 除了覆蓋晶片220之外,附著力調整層230更覆蓋部分之 基板210。然而,附著力調整層230更可覆蓋全部之基板 200903854-· i J / / 3PA In the example, since the adhesion adjusting layer 230 covers the wafer 220 to change the surface state, the cohesive force of the material of the first lens layer 240, the surface tension and the second adhesion between the adhesion adjusting layers interact. The effect contributes to the formation of the first lens layer 240 compared to the first adhesion. Moreover, in the embodiment, the wafer 220 is, for example, a Light Emitting Diode (LED), and the substrate 210 is, for example, a Printed Circuit Board (PCB). Please refer to FIG. 4, which is a schematic diagram showing the light emitted from the wafer of FIG. 3C. When the wafer 220 is illuminated /, the light 400 passes through the adhesion adjusting layer 230 and the first lens layer 240, respectively. Since the adhesion adjusting layer 230 can adjust the shape of the first lens layer 240, the light field 400 can be controlled to form a different light field distribution 410 after passing through the first lens layer 240. Preferably, in the present embodiment, the first lens layer 240 is permeable to a half sphere by appropriately adjusting. As shown in FIG. 3B, when the adhesion adjusting layer 230 covers the wafer 220, the adhesion adjusting layer 230 is relatively flat. Thus, the adhesion adjusting layer 230 covers only a portion of the wire 215, and the other portion of the wire 215 is exposed outside the adhesion adjusting layer 230. As shown in Fig. 3C, when the first lens layer 240 covers the adhesion adjusting layer 230, the first lens layer 240 is more convex. Thus, although the adhesion adjusting layer 230 can cover only a portion of the wire 215, and the other portion of the wire 215 is exposed outside the adhesion adjusting layer 230, the first lens layer 240 can cover the exposed wire. Further, as shown in Fig. 3C, the adhesion adjusting layer 230 of the present embodiment covers the portion of the substrate 210 in addition to the wafer 220. However, the adhesion adjusting layer 230 can cover all the substrates 200903854
—* a j / 73PA 210。此部分端視製程之需求。附著力調整層230係可以 旋轉塗抹、刷塗、喷塗、浸沾或點沾之方式形成於晶片220 及基板210上》在本實施例中’第一透鏡層240係以點沾 之方式形成於附著力調整層230上。 附著力調整層230之材料例如是鐵氟龍(Teflon)、環 氧樹脂(epoxy)或矽膠(smcon) ’第一透鏡層24〇之材料則 例如是環氧樹脂或矽膠。第一透鏡層240之材料及附著力 調整層230之材料係可為相同之材料,或可為相異之材 料。於本實施例中,附著力調整層230與第一透鏡層24〇 係選用相同之材料,例如是環氧樹脂。也就是說,第一附 著力係由晶片220或印刷電路板(基板21 〇)與環氧樹脂(附 著力調整層230)所形成,第二附著力係由環氧樹脂(附著 力調整層230)與環氧樹脂(第一透鏡層24〇)所形成。依據 實驗結果,由於基板21〇輿晶片220之表面態的改變,使 得第一透鏡層240之材料的内聚力、表面張力與附著力調 整層間的第二附著力交互作用後,有助於第一透鏡層24〇 的成形。 於本實施例中’如第2圖及第3C圖所示,於步驟303 及步驟305之間,製造方法較佳地更包括硬化附著力調整 層230之步驟。此步驊係為了使附著力調整層230硬化至 不流動狀態,以使第〆透缝層240穩固地形成於附著力調 整層230上。其中,破化之方式例如是利用加熱或以紫外 線(UV Light)照射,以使附著力調整層230硬化。 200903854—* a j / 73PA 210. This section looks at the needs of the process. The adhesion adjusting layer 230 can be formed on the wafer 220 and the substrate 210 by spin coating, brushing, spraying, dipping or spotting. In the present embodiment, the first lens layer 240 is formed by spotting. On the adhesion adjusting layer 230. The material of the adhesion adjusting layer 230 is, for example, Teflon, epoxy or smcon. The material of the first lens layer 24 is, for example, epoxy or silicone. The material of the first lens layer 240 and the material of the adhesion adjusting layer 230 may be the same material or may be different materials. In the present embodiment, the adhesion adjusting layer 230 and the first lens layer 24 are made of the same material, such as an epoxy resin. That is, the first adhesion is formed by the wafer 220 or the printed circuit board (substrate 21 〇) and the epoxy resin (adhesion adjusting layer 230), and the second adhesion is made of epoxy resin (adhesion adjusting layer 230). ) formed with an epoxy resin (first lens layer 24A). According to the experimental result, since the surface state of the substrate 21 and the wafer 220 is changed, the cohesion of the material of the first lens layer 240, the surface tension and the second adhesion between the adhesion adjusting layers interact to facilitate the first lens. Forming of layer 24〇. In the present embodiment, as shown in Figs. 2 and 3C, between steps 303 and 305, the manufacturing method preferably further includes the step of hardening the adhesion adjusting layer 230. This step is to harden the adhesion adjusting layer 230 to a non-flowing state so that the second slitting layer 240 is firmly formed on the adhesion adjusting layer 230. Among them, the method of breaking is, for example, heating or ultraviolet light irradiation to harden the adhesion adjusting layer 230. 200903854
73PA 第二實施例 請參照第5圖,其繪示根據本發明第二實施例之封裝 件之示意圖。本實施例之一封裝件300與第一實施例之封 裝件200不同之處在於多個第二透鏡層340係形成於一第 一透鏡層240上,更進一步調整第二透鏡層340之形狀。 本發明上述實施例所揭露之封裝件及其製造方法,其 利用附著力調整層調整第一透鏡層之形狀,以使光線通過 第一透鏡層後實質上可控制形成不同之光場分佈。再者, ( 附著力調整層及第一透鏡層係完全地覆蓋導線,以保護導 線。此外,本實施例之封裝件及其製造方法係可降低製造 成本及縮減封裝件之體積。 综上所述,雖然本發明已以較佳實施例揭露如上,然 其並非用以限定本發明。本發明所屬技術領域中具有通常 知識者,在不脫離本發明之精神和範圍内,當可作各種之 更動與潤飾。因此,本發明之保護範圍當視後附之申請專 利範圍所界定者為準。 11 20090385473PA Second Embodiment Referring to Figure 5, there is shown a schematic view of a package in accordance with a second embodiment of the present invention. The package 300 of the present embodiment is different from the package 200 of the first embodiment in that a plurality of second lens layers 340 are formed on a first lens layer 240 to further adjust the shape of the second lens layer 340. The package disclosed in the above embodiments of the present invention and the method of manufacturing the same, wherein the shape of the first lens layer is adjusted by the adhesion adjusting layer to substantially control the formation of different light field distributions after the light passes through the first lens layer. Furthermore, (the adhesion adjusting layer and the first lens layer completely cover the wires to protect the wires. In addition, the package of the embodiment and the manufacturing method thereof can reduce the manufacturing cost and reduce the volume of the package. The present invention has been described above by way of a preferred embodiment, and is not intended to limit the invention. It is intended to be a matter of ordinary skill in the art without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. 11 200903854
—' a ” -w ί」PA 【圖式簡單說明】 第1A圖繪示傳統之封裝件之示意圖。 第1B圖繪示另一種傳統之封裝件之示意圖。 第1C圖繪示一模具之示意圖。 第2圖繪示根據本發明第一實施例之封裝件之製造 方法的流程圖。 第3A〜3C圖繪示第2圖之製造方法之流程示意圖。 第4圖繪示第3C圖之晶片射出光線之示意圖。 第5圖繪示根據本發明第二實施例之封裝件之示意 圖。 【主要元件符號說明】 100、150、200、300 101 :反射杯 105 :封裝膠體 157 :表面 161 :凹穴_ 215 :導線 230 :附著力調整層 340 :第二透鏡層 410 :光場分佈 :封裝件 103 :晶片 155 :凸狀膠體 160 :模具 210 :基板 220 :晶片 240 :第一透鏡層 40 0 :光線 12—' a ” -w ί”PA [Simple description of the diagram] Figure 1A shows a schematic diagram of a conventional package. FIG. 1B is a schematic view showing another conventional package. Figure 1C shows a schematic view of a mold. Fig. 2 is a flow chart showing a method of manufacturing a package in accordance with a first embodiment of the present invention. 3A to 3C are schematic views showing the flow of the manufacturing method of FIG. 2. Figure 4 is a schematic view showing the light emitted from the wafer of Figure 3C. Fig. 5 is a schematic view showing a package according to a second embodiment of the present invention. [Description of main component symbols] 100, 150, 200, 300 101: Reflector cup 105: encapsulant 157: surface 161: recess _215: wire 230: adhesion adjusting layer 340: second lens layer 410: light field distribution: Package 103: Wafer 155: convex colloid 160: mold 210: substrate 220: wafer 240: first lens layer 40 0 : light 12
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TW096125471A TWI347690B (en) | 2007-07-12 | 2007-07-12 | Package and manufacturing method thereof |
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TW096125471A TWI347690B (en) | 2007-07-12 | 2007-07-12 | Package and manufacturing method thereof |
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TW200903854A true TW200903854A (en) | 2009-01-16 |
TWI347690B TWI347690B (en) | 2011-08-21 |
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TW096125471A TWI347690B (en) | 2007-07-12 | 2007-07-12 | Package and manufacturing method thereof |
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TW (1) | TWI347690B (en) |
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TWI347690B (en) | 2011-08-21 |
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