TW200903614A - Chemical-mechanical polishing pad, and chemical-mechanical polishing method - Google Patents

Chemical-mechanical polishing pad, and chemical-mechanical polishing method Download PDF

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Publication number
TW200903614A
TW200903614A TW97108871A TW97108871A TW200903614A TW 200903614 A TW200903614 A TW 200903614A TW 97108871 A TW97108871 A TW 97108871A TW 97108871 A TW97108871 A TW 97108871A TW 200903614 A TW200903614 A TW 200903614A
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Taiwan
Prior art keywords
groove
honing
grooves
chemical mechanical
pad
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TW97108871A
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Chinese (zh)
Inventor
Masahiro Yamamoto
Hiroyuki Miyauchi
Iwao Mihara
Masayuki Motonari
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Jsr Corp
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Publication of TW200903614A publication Critical patent/TW200903614A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Provided is a chemical-mechanical polishing pad having a polishing face comprising two groove groups of (1) a first groove group including a plurality of first grooves intersecting with one imaginary straight line extending from the center of the polishing face to the circumferential portion, but not intersecting with each other, and (2) a second groove group including a plurality of second grooves intersecting with one imaginary straight line extending from the center of the polishing face to the circumferential portion, but not intersecting with each other, the second grooves not intersecting with the first grooves but having a second groove width different from the first groove width, and the second grooves existing by one or a plurality in the clearance between the two first grooves adjoining each other on the polishing face.

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200903614 九、發明說明 【發明所屬之技術領域】 本發明係關於一種化學機械硏磨墊以及化學機械硏磨 方法。 【先前技術】 近幾年之半導體裝置的形成等中,就形成具有優異平 坦性表面之硏磨方法而言,大多使用化學機械硏磨方法( Chemical Mechanical Polishing,通常簡稱爲「CMP」)。 該化學機械硏磨方法中,已知化學機械硏磨墊之性質及特 性等對於硏磨結果影響相當大,過去已經提出各種化學機 械硏磨墊。 例如日本特表平8 -5 00622號公報以及特開2000-3 44 1 6 號公報中,就構成化學機械硏磨墊之材料進行檢討。又例 如特開平1 1 -70463號公報、特開平8_2 1 6029號公報以及 特表2004-507077號公報中已對硏磨墊表面(硏磨面)之 溝設計進行探討。 此等文獻中特開平1 1 -70463號公報中,提出爲了提高 被硏磨面之硏磨均勻性,而改變硏磨墊之每硏磨面區域之 溝寬、間距、深度或形狀(圓形溝及蛇形溝)之技術。另 外特表2004-507077號公報中詳細探討硏磨面之溝密度與 硏磨性能之關係。該相同公報中記載同心圓狀之溝可在硏 磨時發揮捕獲導入硏磨墊中心而藉離心力朝向硏磨墊外周 -5- 200903614 部移動之化學機械硏磨用水性分散體之角色。 然而該等公報中提及由上述槪念思考之溝設計之想法 ,但並未明確的指出對於實際生產狀況中實際所成之溝圖 案有用之具體指導。 一方面,在半導體製品之成本競爭日益劇烈之下’化 學機械硏磨時供給之化學機械硏磨用水性分散體使用量減 量被認爲是成本下降最有效的方法之一。然而,當化學機 械硏磨用水性分散體之供給量成爲少量時,就於硏磨墊硏 磨面整面上有效地供給水性分散體、實現高硏磨速度與被 硏磨面之高度均勻性觀點觀之,大部份未對溝設計進行檢 討。 【發明內容】 本發明鑒於上述狀況,其目的係提供一種即使化學機 械硏磨用水性分散體之供給量成爲少量,其硏磨速度亦優 異且被硏磨面之硏磨量的面內之均勻性優異之化學機械硏 磨墊以及化學機械硏磨方法。 依據本發明,本發明上述目的可藉由下列達成,即第 一,一種化學機械硏磨墊(以下稱爲「第一硏磨墊」), 其爲具有硏磨面以及背面之被硏磨面的化學機械硏磨墊, 上述硏磨面具有各由複數條溝所構成之至少2組溝群而成 ,上述2組溝群係由下列所構成: (1 )由與自硏磨面的中心朝向周邊部之一條假想直線 -6- 200903614 交叉之複數條第一溝所構成之第一溝群,該等複數條第一 溝彼此間不互相交叉且具有第一溝寬,以及 (2)由與自硏磨面的中心朝向周邊部之一條假想直線 交叉之複數條第二溝所構成之第二溝群,該等複數條第二 溝彼此間不互相交叉、各第二溝與上述第一溝彼此不交叉 ,且具有與上述第一溝寬不同之第二溝寬,因而於該硏磨 面上互爲相鄰之兩條第一溝的間隙中平均存在有一條或複 數條該第二溝。 本發明上述目的可由下列達成,即第二,一種化學機 械硏磨墊(以下稱爲「第二硏磨墊」),其係具有硏磨面 以及作爲其背面之非硏磨面之化學機械硏磨墊,上述硏磨 面至少具有一條第一溝以及一條第二溝,且 (1 )該第一溝係自硏磨面的中心朝向周邊部螺旋漸漸 擴大之一條螺旋狀溝且具有第一溝寬, (2 )該第二溝係自硏磨面的中心朝向周邊部螺旋漸漸 擴大之一條螺旋狀溝,該第二溝與上述第一溝彼此不交叉 ,且具有與上述第一溝寬不同之第二溝寬。 本發明上述目的可藉由下列達成’即第三’一種化學 機械硏磨方法,該方法係使用上述任一化學機械硏磨墊對 被硏磨體進行化學機械硏磨。 【實施方式】 本發明之化學機械硏磨墊之第一硏磨墊、第二硏磨墊 -7- 200903614 均具有硏磨面及其背面之非硏磨面。 本發明之化學機械硏磨墊之硏磨面及非硏磨面之形狀 並無特別限制,例如可爲圓形、多邊形(較好爲凸多邊形 、更好爲正多邊形)等,裝置有本發明化學機械硏磨墊而 使用之硏磨裝置中可適宜選擇。硏磨面之形狀與非硏磨面 之形狀較好爲相同。當硏磨面與非硏磨面均爲圓形時,硏 磨墊成爲圓盤狀之形狀,當硏磨面與非硏磨面均爲多邊形 時,硏磨墊呈爲多角柱狀之形狀。至於硏磨墊與非硏磨墊 之形狀最好爲圓形狀,據此,硏磨墊之形狀較好爲圓盤狀 〇 硏磨墊之尺寸並無特別限制,例如若爲圓盤狀化學機 械硏磨墊之情況,則直徑爲 150〜1,200mm,尤其是 500~8〇〇111111,厚度爲〇.5〜5.〇111111,尤其厚度爲1.〇~3.〇111111, 其中厚度較好爲1.5〜3.0mm。 以下依順序說明具有溝之本發明之第一硏磨墊以及第 二硏磨墊之構成。 第一硏磨墊中所謂之「溝群」意指具有幾何學上形狀 相似之複數個溝之集合。 第一硏磨墊之第一溝群之第一溝形狀並無特別限制, 例如可爲自硏磨面之中心部朝向周邊部依次擴大之2條以 上螺旋狀溝’或者彼此不交叉且呈同心狀或偏心狀配置之 複數條環狀溝之多邊形狀溝。環狀溝可爲例如圓形、橢圓 形等溝,多邊形狀溝可爲例如四邊形、五邊形以上之多邊 -8- 200903614 形狀溝。 該等第一溝係以與自硏磨面之中心朝向周邊部之1條 假想直線複數次交叉之方式設於硏磨面上。例如當溝形狀 係由複數個環狀溝所構成時,2個環狀溝之交叉點有2個, 3個環狀溝時有3個交叉點,同樣地,n個環狀溝具有n個 交叉點。當由複數個多邊形狀溝所構成時,與由複數個環 狀溝構成之情況相同。一方面,在2條螺旋狀溝之情況下 ’若以3 60°視爲一圈時,在進入第二圈之前之交叉點數成 爲2個’進入第二圏時之交叉點成爲3個,進入第η圈之 前爲(2η-2)個,進入第η圈時成爲(2η-1)個。 當上述第一溝群之第一溝係由複數個環狀溝或多邊形 溝所構成時,該等複數個環狀溝及多邊形狀溝以彼此不交 叉之方式配置。該配置可爲同心狀亦可爲偏心狀,但較好 爲同心狀。上述第一溝群之第一溝配置爲同心狀之硏磨墊 與配置爲非同心狀之硏磨墊相比較,當水性分散體之供給 量變少量時,硏磨速度更爲優異,且被硏磨面之硏磨量之 面內均勻性更優異。複數個環狀溝較好由複數個圓形狀溝 所構成,該等圓形狀溝較好配置爲同心狀。複數個圓形狀 溝藉由配置爲同心圓狀,進而具有該等機能優異,且更容 易形成溝之優點。 溝之寬度方向(溝之法線方向)之剖面形狀並無特別 限制,可爲例如矩形、由平坦側面與底面所形成之三面以 上之多面形狀、U字形狀等。至於多邊形,可舉例有例如 -9- 200903614 四邊形、五邊形等。 第一溝群之第一溝具有第一溝寬。此處之「溝寬」爲 溝的壁面與硏磨面所成之角間之最短距離。 第一硏磨墊中之第二溝群之第二溝形狀、第二溝彼此 之相對位置以及剖面形狀與上述第一溝群之第一溝相同。 第二溝之形狀較好爲與上述第一溝群之第一溝形狀相似之 形狀。再者,該第二溝與上述第一溝群之第一溝並不交叉 〇 第二溝群之第二溝具有與上述第一溝寬不同之第二溝 寬。 第二溝群之第二溝係在硏磨面上相互鄰接之二條第一 溝之間隙間存在一條或複數條。以下,對第一硏磨墊之進 而詳細溝構成,區分爲鄰接之二條第一溝之間隙中存在一 條第二溝之情況與鄰接之二條第一溝之間隙中存在複數條 第二溝之情況加以說明。 硏磨面上相互鄰接之二條第一溝之間隙中存在一條第 二溝之情況,在上述假想直線上’該假想直線與第一溝之 交叉點,及該假想直線與第二溝之交叉點交互出現。 第二溝所具有之第二溝寬與第一溝所具有之第一溝寬 不同,但例如第二溝寬可以比第一溝寬小。該情況下,第 一溝所具有之第一溝寬較好爲 0.5〜2.0mm,更好爲 0.6〜1 .8mm,又更好爲0.7~ 1.6mm ’特別好爲 〇.8〜1.4mm, 其中較好爲0.8〜1.2mm。藉由使第一溝寬在上述範圍內, -10- 200903614 可更有效地發揮本發明之效果。尤其是第一溝寬在〇.7mm 以上,更好在0.8mm以上,可顯著地展現該效果。 第一溝之間隙’亦即前述假想直線與前述第一溝之交 叉點中相鄰二交叉點間之距離,較好爲2.0〜8 · 0 m m,更好 爲3.0〜7.5mm’又更好爲3.5~7.〇mm,特別好爲4.5〜6_5mm ’其中以4.5〜6.0mm較好’最好爲5.0〜6.0mm。藉由使上 述第一溝之間距落在上述範圍中,可最有效發揮本發明之 效果。又此處中,假想直線與第一溝之交叉點,在微觀上 爲上述假想直線與上述第一溝之寬度方向之中心之交叉點 。假想直線與第二溝之交叉點亦同樣被理解。 第一溝之深度較好爲0.1mm以上,更好爲〇.丨〜2 5 mm ,又更好爲〇_2〜2.0mm。 一方面,第二溝所具有之第二溝寬較好爲0.2〜〇.5mm ,更好爲0_25〜0.45111111,又更好爲0.27~0.4111111,特別好爲 0_ 29〜0.3 5mm。藉由使第二溝寬在上述範圍內,可更有效發 揮本發明之效果。尤其是使第二溝寬在〇.4mm以下,更好 在0.35rnrn以下,可顯著地展現其效果。 第二溝較好位在相鄰2條第一溝之中心。亦即,在上 述假想直線上鄰接之交叉點間之距離較好爲相等。 第二溝之深度較好爲0.1mm以上’更好爲〇丨〜2 5mm ,又更好爲〇·2〜2.0mm。 此處參閱圖1,具體說明在硏磨面上相互鄰接之兩條第 一溝之間平均存在一條第二溝之情況下’第一溝與第二溝 -11 - 200903614 之較佳關係。圖1爲硏磨墊上沿著上述假想直線之於垂直 硏磨面之面切斷之剖面之部份放大槪略圖。 圖1之硏磨墊包括具有第一溝寬W1之第一溝與具有 比W1小之第二溝寬W2之第二溝,鄰接之2條第一溝之間 各存在1條第二溝。依據該態樣,第一溝之間距係以P1表 示。圖1之硏磨墊,在上述假想直線上,該假想直線與上 述第一溝之交叉點(C 1 )、及該假想直線與上述第二溝之 交叉點(C2 ),係以 C 1、C2、C 1、C2之順序交互存在。 圖1之硏磨墊中,第二溝配置於相鄰2條第一溝之中心( 由圖1中之長度D 1及D2相等可加以理解)。 接著,於硏磨面上相互鄰接之兩條第一溝之間隙中存 在複數條第二溝之情況,第二溝所具有之第二溝寬可以比 第一溝所具有之第一溝寬小,或者亦可比第一溝所具有之 第一溝寬大。 於第二溝所具有之第二溝寬比第一溝所具有之第一溝 寬小之情況,第一溝所具有之第一溝寬較好爲〇.6〜2.2mm ,第一溝之間距較好爲 4~12mm ’第二溝寬較好爲 0 . 1 〜0.5 mm。 第一溝所具有之第一溝寬及間距以及第二溝所具有之 第二溝寬之更佳値隨著相互鄰接之兩條第一溝之間隙中存 在之第二溝數而異。 例如,相互鄰接之兩條第一溝之間隙中存在2條第二 溝之情況下,第一溝所具有之第一溝寬較好爲〇. 8〜2.0 m m -12- 200903614 ’更好爲〇_9~1.8mm,又更好爲1.0〜l.6mm。藉由使第一溝 寬在上述範圍內,可更有效地發揮本發明效果。尤其是使 第一溝寬爲〇.8mm以上,更好爲〇.9mm以上,可顯著地展 現該效果。第一溝之間距,較好爲4〜8mm,更好爲 5〜7.5mm,又更好爲6〜7mm。藉由使上述第一溝之間距落 在上述範圍,可最有效發揮本發明效果。第二溝所具有之 第一溝寬較好爲0.1〜0.45mm,更好爲0.15~0.40mm,又更 好爲〇·2〇〜〇.35mm。藉由使第二溝寬在上述範圍內,可更 有效地發揮本發明效果。尤其是使第二溝寬爲〇 . 4mm以下 ’更好爲0.35mm以下,可顯著展現其效果。 又例如相互鄰接之兩條第一溝之間隙中存在3條第二 溝之情況’第一溝所具有之第一溝寬較好爲0.8〜2.2 mm, 更好爲1_0〜2_0mm,又更好爲1.2〜1.8mm。藉由使第一溝寬 在上述範圍內’可更有效地發揮本發明之效果。尤其是使 第一溝寬爲1.0mm以上,更好爲l.2mm以上,可顯著地展 現其效果。弟一溝之間距,較好爲6〜12 m m,更好爲 7〜11mm’又更好爲8~9mm。藉由使上述第一溝之間距落在 上述範圍’可最有效發揮本發明之效果。第二溝寬較好爲 0.1〜0.45mm,更好爲 0_15~0.40mm,又更好爲 0.20〜0.35mm 。藉由使第二溝寬在上述範圍內,可更有效地發揮本發明 之效果。尤其是使第二溝寬爲0.4mm以下,更好爲〇.35mm 以下,可顯著展現其效果。 一方面’於硏磨面上相互鄰接之兩條第一溝之間隙中 -13- 200903614 存在複數條第二溝之情況,於第二溝所具有之胃=丨冓胃& 第一溝所具有之第一溝寬大時,第一溝所具有之第一溝寬 較好爲 0.2〜0.5mm,更好爲 0 · 2 5〜0.4 5 mm,又更好爲 0.27〜0.4 mm。藉由使第二溝寬在上述範圍內’可更有效地 發揮本發明之效果。特別是藉由使第二溝寬爲〇.45mm以下 ,更好爲〇.4mm以下,可顯著地展現其效果。 第二溝所具有之第二溝寬比第一溝所具有之第一溝寬 大之情況下,第一溝之間距較好爲 2.0〜8.0mm ’更好爲 3.0〜7.5 mm,又更好爲3.5~7.0 mm。藉由使上述第一溝之間 距在上述範圍內,可最有效地發揮本發明之效果。 第二溝所具有之第二溝寬比第一溝所具有之第一溝寬 大之情況下’第二溝寬較好爲 0.6〜1.8 mm,更好爲 0.7〜1.6 mm,又更好爲〇·8〜1.4 mm。藉由使上述第二溝寬在 上述範圍內,可有效地發揮本發明之效果。特別是藉由使 第二溝寬爲〇.7mm以上’更好爲〇.8mm以上,可更顯著地 展現其效果。 硏磨面上相互鄰接之兩條第一溝之間隙中存在複數條 第二溝之情況下’鄰接之兩條第一溝之間隙中存在之複數 條第二溝較好均等地配置在鄰接之2條第一溝之間。亦即 ,在上述假想直線上之鄰接交叉點間之距離較好相等。第 二溝所具有之第二溝寬較好比第一溝所具有之第一溝寬小 。鄰接之2條第一溝之間隙中存在之第二溝數量較好爲 2〜5條,更好爲2〜3條,最好爲2條。 -14- 200903614 此處參閱圖2,具體說明在硏磨面上相互鄰接之兩條第 一溝之間隙中平均存在複數條第二溝之情況下,第一溝與 第二溝之較佳關係。圖2爲硏磨墊上,沿著上述假想直線 之垂直於硏磨面之面切斷之剖面之部份放大槪略圖。圖2 雖顯示第二溝所具有之第二溝寬比第一溝所具有之第一溝 寬小之硏磨墊,但對於第二溝寬比第一溝寬大之硏磨墊也 可同樣說明而獲得理解。 圖2之硏磨墊包括具有第一溝寬W1之第一溝與具有 比W1小之第二溝寬W2之第二溝,鄰接之2條第一溝之間 平均各存在2條第二溝。依據該態樣,第一溝之間距係以 P 1表示。圖2之硏磨墊,在上述假想直線中,該假想直線 與上述第一溝之交叉點(C 1 )、及該假想直線與上述第二 溝之交叉點(C2),係以 C1、C2、C2、C1、C2、C2、C1 之順序存在。圖2之硏磨墊中,2條第二溝均等地配置於相 鄰2條第一溝之中心(由圖2中之長度Dl、D2及D3均等 分可予以理解)。 再者,即使於上述任一情況下,硏磨面之中心附近或 外周端附近,在不是兩條第一溝之間隙之位置亦可存在一 條或複數條第二溝,且不會減損本發明之效果。例如,第 一溝及第二溝分別爲環狀溝或多邊形狀溝之情況’硏磨面 中最小第一溝之更內側或最大第一溝之更外側中’亦可存 在一條或複數條第二溝。 即使在上述任一情況,第一溝與第二溝之內面之表面 -15- 200903614 粗糙度(Ra)較好爲20μιη以下’更好爲0.05〜15μιη’又更 好爲0.05~10μιη。藉由使該表面粗糙度爲20μηι以下,可更 有效的防止化學機械硏磨步驟進行時’在被硏磨面上產生 刮痕。上述表面粗糙度(Ra )係以下式(i )定義。200903614 IX. Description of the Invention [Technical Field] The present invention relates to a chemical mechanical honing pad and a chemical mechanical honing method. [Prior Art] In the formation of semiconductor devices and the like in recent years, in order to form a honing method having an excellent flat surface, a chemical mechanical polishing method (hereinafter abbreviated as "CMP") is often used. In the chemical mechanical honing method, the properties and characteristics of the chemical mechanical honing pad are known to have a considerable influence on the honing result, and various chemical mechanical honing pads have been proposed in the past. For example, Japanese Laid-Open Patent Publication No. Hei 8-5-100622 and JP-A No. 2000-3 4416 disclose a review of materials constituting a chemical mechanical honing pad. Further, for example, the groove design of the surface of the honing pad (honing surface) has been examined in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the publication of Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Ditch and serpentine groove technology. Further, the relationship between the groove density of the honing surface and the honing performance is discussed in detail in the special publication No. 2004-507077. In the same publication, the concentric groove can be used to capture the water-based dispersion of the chemical mechanical honing which is introduced into the center of the honing pad and is moved toward the outer periphery of the honing pad by the centrifugal force during honing. However, these communiqués refer to the idea of the design of the above-mentioned mourning trenches, but do not clearly point out the specific guidance useful for the actual trench pattern in actual production conditions. On the one hand, the cost competition for chemical mechanical honing supplied by chemical mechanical honing is considered to be one of the most effective methods for cost reduction. However, when the supply amount of the chemical mechanical honing aqueous dispersion is small, the aqueous dispersion is effectively supplied on the entire surface of the honing pad honing surface, and the high honing speed and the height uniformity of the honed surface are achieved. From a point of view, most of the trench design has not been reviewed. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an in-plane uniformity in which a honing speed is excellent and a honing amount of a honing surface is uniform even if a supply amount of a chemical mechanical honing aqueous dispersion is small. Chemical mechanical honing pads and chemical mechanical honing methods. According to the present invention, the above object of the present invention can be attained by the first, a chemical mechanical honing pad (hereinafter referred to as "first honing pad"), which is a honed surface having a honing surface and a back surface. The chemical mechanical honing pad, wherein the honing surface has at least two groups of grooves composed of a plurality of grooves, and the two groups of grooves are composed of the following: (1) from the center of the self-grinding surface An imaginary straight line toward the peripheral portion -6-200903614 a first group of grooves formed by a plurality of first grooves intersecting, the plurality of first grooves do not intersect each other and have a first groove width, and (2) a second groove group formed by a plurality of second grooves intersecting one of the imaginary straight lines from the center of the honing surface toward the peripheral portion, the plurality of second grooves not intersecting each other, and each of the second grooves and the first groove The grooves do not intersect each other and have a second groove width different from the first groove width, so that one or a plurality of the second gaps are present in the gap between the two adjacent first grooves on the honing surface. ditch. The above object of the present invention can be attained by the second, a chemical mechanical honing pad (hereinafter referred to as "second honing pad") which has a honing surface and a chemical mechanical 硏 which is a non-honing surface of the back surface thereof. a sanding pad, the honing surface has at least one first groove and one second groove, and (1) the first groove is spirally enlarged from the center of the honing surface toward the peripheral portion and has a first groove Width, (2) the second groove is spirally enlarged from the center of the honing surface toward the peripheral portion, and the second groove and the first groove do not intersect each other and have a different width from the first groove The second groove width. The above object of the present invention can be achieved by the following "third" chemical mechanical honing method which chemically hones the honed body using any of the above chemical mechanical honing pads. [Embodiment] The first honing pad and the second honing pad -7-200903614 of the chemical mechanical honing pad of the present invention each have a honing surface and a non-honing surface thereof on the back side. The shape of the honing surface and the non-honing surface of the chemical mechanical honing pad of the present invention is not particularly limited, and may be, for example, a circle, a polygon (preferably a convex polygon, more preferably a regular polygon), etc., and the device has the present invention. The honing device used for the chemical mechanical honing pad can be suitably selected. The shape of the honing surface is preferably the same as the shape of the non-honing surface. When both the honing surface and the non-honing surface are circular, the honing pad has a disk-like shape. When both the honing surface and the non-honing surface are polygonal, the honing pad has a polygonal column shape. The shape of the honing pad and the non-honing pad is preferably a circular shape. Accordingly, the shape of the honing pad is preferably such that the size of the disk-shaped honing pad is not particularly limited, for example, if it is a disk-shaped chemical machine. In the case of the honing pad, the diameter is 150~1,200mm, especially 500~8〇〇111111, and the thickness is 〇.5~5.〇111111, especially the thickness is 1.〇~3.〇111111, wherein the thickness is better It is 1.5~3.0mm. The constitution of the first honing pad and the second honing pad of the present invention having the groove will be described below in order. The so-called "groove group" in the first honing pad means a collection of a plurality of grooves having geometrically similar shapes. The first groove shape of the first groove group of the first honing pad is not particularly limited, and may be, for example, two or more spiral grooves which are sequentially enlarged from the center portion of the honing surface toward the peripheral portion or are not intersected and concentric with each other. A polygonal groove of a plurality of annular grooves arranged in an eccentric or eccentric shape. The annular groove may be, for example, a circular or elliptical groove, and the polygonal groove may be, for example, a quadrilateral or a pentagon or more polygonal -8-200903614 shape groove. The first groove is provided on the honing surface so as to intersect the imaginary straight line from the center of the honing surface toward the peripheral portion. For example, when the groove shape is composed of a plurality of annular grooves, there are two intersections of the two annular grooves, and three intersections with three intersections. Similarly, n annular grooves have n intersections. intersection. When it is composed of a plurality of polygonal grooves, it is the same as the case of a plurality of annular grooves. On the one hand, in the case of two spiral grooves, 'when it is regarded as one circle at 3 60°, the number of intersections before entering the second circle becomes two, and the intersection point when entering the second turn becomes three. (2η-2) before entering the η-th turn, and (2η-1) when entering the η-th turn. When the first groove of the first groove group is composed of a plurality of annular grooves or polygonal grooves, the plurality of annular grooves and polygonal grooves are disposed so as not to intersect each other. The arrangement may be concentric or eccentric, but preferably concentric. When the first groove of the first groove group is arranged in a concentric shape, the honing pad is arranged in a non-concentric honing pad, and when the supply amount of the aqueous dispersion is small, the honing speed is more excellent and the squeezing speed is high. The in-plane uniformity of the honing amount of the grinding surface is more excellent. Preferably, the plurality of annular grooves are formed by a plurality of circular grooves, and the circular grooves are preferably arranged concentrically. The plurality of circular-shaped grooves are arranged in a concentric shape, and thus have the advantages of being excellent in such functions, and more easily forming grooves. The cross-sectional shape of the groove in the width direction (the normal direction of the groove) is not particularly limited, and may be, for example, a rectangular shape, a multi-faceted shape of three or more sides formed by a flat side surface and a bottom surface, a U-shape, or the like. As the polygon, for example, -9-200903614 quadrilateral, pentagon, and the like can be exemplified. The first groove of the first groove group has a first groove width. Here, the "groove width" is the shortest distance between the wall surface of the groove and the angle formed by the honing surface. The second groove shape of the second groove group in the first honing pad, the relative position of the second groove, and the cross-sectional shape are the same as the first groove of the first groove group. The shape of the second groove is preferably a shape similar to the shape of the first groove of the first groove group. Furthermore, the second groove does not intersect the first groove of the first groove group. The second groove of the second groove group has a second groove width different from the first groove width. The second groove of the second groove group has one or more strips between the gaps of the two first grooves adjacent to each other on the honing surface. Hereinafter, the detailed gully structure of the first honing pad is divided into a case where a second groove exists in the gap between the adjacent two first grooves and a plurality of second grooves exist in the gap between the adjacent two first grooves. Explain. a second groove exists in the gap between the two first grooves adjacent to each other on the honing surface, the intersection of the imaginary line and the first groove on the imaginary line, and the intersection of the imaginary line and the second groove Interaction appears. The second groove has a second groove width different from the first groove width of the first groove, but for example, the second groove width may be smaller than the first groove width. In this case, the first groove has a first groove width of preferably 0.5 to 2.0 mm, more preferably 0.6 to 1.8 mm, and even more preferably 0.7 to 1.6 mm, which is particularly preferably 〇.8 to 1.4 mm. Among them, it is preferably from 0.8 to 1.2 mm. By making the first groove width within the above range, -10-200903614 can more effectively exert the effects of the present invention. In particular, the first groove width is more than 77 mm, more preferably 0.8 mm or more, and the effect can be remarkably exhibited. The gap between the first groove', that is, the distance between the adjacent two intersections of the aforementioned imaginary straight line and the first groove, is preferably 2.0 to 8 mm, more preferably 3.0 to 7.5 mm. It is 3.5~7.〇mm, especially preferably 4.5~6_5mm 'where 4.5~6.0mm is better', preferably 5.0~6.0mm. The effect of the present invention can be most effectively exerted by causing the distance between the first grooves to fall within the above range. Here, the intersection of the imaginary straight line and the first groove is microscopically the intersection of the imaginary straight line and the center of the first groove in the width direction. The intersection of the imaginary line and the second groove is also understood. The depth of the first groove is preferably 0.1 mm or more, more preferably 〇.丨~2 5 mm, and even more preferably 〇_2 to 2.0 mm. On the one hand, the second groove has a second groove width of preferably 0.2 to 〇5 mm, more preferably 0_25 to 0.45111111, still more preferably 0.27 to 0.4111111, particularly preferably 0_29 to 0.35 mm. By making the second groove width within the above range, the effect of the present invention can be more effectively performed. In particular, the second groove width is 〇.4 mm or less, more preferably 0.35 rnrn or less, and the effect can be remarkably exhibited. The second groove is preferably located at the center of the adjacent two first grooves. That is, the distance between the adjacent intersections on the imaginary straight line is preferably equal. The depth of the second groove is preferably 0.1 mm or more, more preferably 〇丨 2 2 5 mm, and even more preferably 〇 2 to 2.0 mm. Referring to Fig. 1, a preferred relationship between the first groove and the second groove -11 - 200903614 in the case where there is an average second groove between the two first grooves adjacent to each other on the honing surface is specifically described. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially enlarged schematic view showing a section of the honing pad which is cut along the surface of the imaginary straight line on the vertical honing surface. The honing pad of Fig. 1 includes a first groove having a first groove width W1 and a second groove having a second groove width W2 smaller than W1, and a second groove is present between each of the adjacent first grooves. According to this aspect, the distance between the first grooves is represented by P1. In the imaginary straight line of FIG. 1, the intersection point (C 1 ) between the imaginary straight line and the first groove, and the intersection point (C2) between the imaginary straight line and the second groove are C 1 , The order of C2, C1, and C2 interacts. In the honing pad of Fig. 1, the second groove is disposed at the center of the adjacent two first grooves (the lengths D1 and D2 in Fig. 1 are equal). Then, a plurality of second grooves are present in the gap between the two first grooves adjacent to each other on the honing surface, and the second groove has a second groove width smaller than the first groove width of the first groove Or it may be wider than the first groove of the first groove. In the case where the second groove has a second groove width smaller than the first groove width of the first groove, the first groove has a first groove width of preferably 〇.6 to 2.2 mm, and the first groove The spacing is preferably 4~12mm', and the second groove width is preferably 0.1 to 0.5 mm. Preferably, the first groove width and the pitch of the first groove and the second groove width of the second groove vary depending on the number of second grooves existing in the gap between the two first grooves adjacent to each other. For example, in the case where there are two second grooves in the gap between the two first grooves adjacent to each other, the first groove has a first groove width of preferably 〇. 8~2.0 mm -12- 200903614 'better 〇_9~1.8mm, and more preferably 1.0~l.6mm. By making the first groove width within the above range, the effects of the present invention can be more effectively exhibited. In particular, the first groove width is 〇.8 mm or more, more preferably 〇.9 mm or more, and the effect can be remarkably exhibited. The distance between the first grooves is preferably 4 to 8 mm, more preferably 5 to 7.5 mm, and still more preferably 6 to 7 mm. The effect of the present invention can be most effectively exerted by setting the distance between the first grooves to the above range. The first groove has a first groove width of preferably 0.1 to 0.45 mm, more preferably 0.15 to 0.40 mm, and even more preferably 〇·2〇 to 〇.35 mm. By making the second groove width within the above range, the effects of the present invention can be exhibited more effectively. In particular, the second groove width is 〇. 4 mm or less ‘more preferably 0.35 mm or less, which can remarkably exhibit the effect. For example, if there are three second grooves in the gap between the two first grooves adjacent to each other, the first groove has a first groove width of preferably 0.8 to 2.2 mm, more preferably 1_0 to 2_0 mm, and even better. It is 1.2~1.8mm. The effect of the present invention can be more effectively exerted by making the first groove width within the above range. In particular, the first groove width is 1.0 mm or more, more preferably 1.2 mm or more, and the effect can be remarkably exhibited. The spacing between the dimples is preferably 6 to 12 m, more preferably 7 to 11 mm' and even more preferably 8 to 9 mm. The effect of the present invention can be most effectively exerted by making the distance between the first grooves fall within the above range. The second groove width is preferably from 0.1 to 0.45 mm, more preferably from 0 to 15 to 0.40 mm, still more preferably from 0.20 to 0.35 mm. By making the second groove width within the above range, the effects of the present invention can be exhibited more effectively. In particular, the second groove width is 0.4 mm or less, more preferably 〇.35 mm or less, and the effect is remarkably exhibited. On the one hand, in the gap between the two first grooves adjacent to each other on the honing surface - 13-200903614 There are a plurality of second grooves, and the stomach in the second groove is the stomach = the first groove When the first groove width is large, the first groove has a first groove width of preferably 0.2 to 0.5 mm, more preferably 0 · 2 5 to 0.4 5 mm, still more preferably 0.27 to 0.4 mm. The effect of the present invention can be more effectively exerted by making the second groove width within the above range. In particular, by making the second groove width 〇.45 mm or less, more preferably 〇.4 mm or less, the effect can be remarkably exhibited. When the second groove has a second groove width larger than the first groove width of the first groove, the distance between the first grooves is preferably 2.0 to 8.0 mm', more preferably 3.0 to 7.5 mm, and even more preferably 3.5~7.0 mm. The effect of the present invention can be most effectively exerted by making the distance between the first grooves described above within the above range. Where the second groove has a second groove width larger than the first groove width of the first groove, the second groove width is preferably 0.6 to 1.8 mm, more preferably 0.7 to 1.6 mm, and more preferably · 8 to 1.4 mm. By making the second groove width within the above range, the effects of the present invention can be effectively exhibited. In particular, by making the second groove width 〇.7 mm or more' more preferably 〇.8 mm or more, the effect can be more prominently exhibited. In the case where there are a plurality of second grooves in the gap between the two first grooves adjacent to each other on the honing surface, the plurality of second grooves existing in the gap between the two adjacent first grooves are preferably equally disposed adjacent to each other. 2 between the first ditch. That is, the distance between adjacent intersections on the above imaginary straight line is preferably equal. The second groove has a second groove width which is preferably smaller than the first groove width of the first groove. The number of second grooves present in the gap between the two adjacent first grooves is preferably 2 to 5, more preferably 2 to 3, and most preferably 2. -14- 200903614 Referring to Figure 2, a detailed description of the preferred relationship between the first groove and the second groove in the case where there are a plurality of second grooves in the gap between the two first grooves adjacent to each other on the honing surface . Fig. 2 is a partially enlarged plan view showing a section of the honing pad which is cut along a plane perpendicular to the honing surface of the imaginary straight line. 2 shows that the second groove has a second groove width smaller than the first groove width of the first groove, but the same applies to the second groove width larger than the first groove width. And get understanding. The honing pad of FIG. 2 includes a first groove having a first groove width W1 and a second groove having a second groove width W2 smaller than W1, and there are two second grooves on average between the two adjacent first grooves. . According to this aspect, the distance between the first grooves is represented by P 1 . In the imaginary straight line of FIG. 2, the intersection point (C 1 ) between the imaginary straight line and the first groove, and the intersection point (C2) between the imaginary straight line and the second groove are C1 and C2 The order of C2, C1, C2, C2, and C1 exists. In the honing pad of Fig. 2, the two second grooves are equally disposed at the center of the adjacent two first grooves (the lengths D1, D2, and D3 in Fig. 2 can be equally understood). Furthermore, even in any of the above cases, in the vicinity of the center of the honing surface or in the vicinity of the outer peripheral end, one or a plurality of second grooves may exist at a position other than the gap between the two first grooves, and the present invention is not impaired. The effect. For example, the first groove and the second groove are respectively an annular groove or a polygonal groove. The inner side of the smallest first groove or the outer side of the largest first groove in the honing surface may also have one or a plurality of grooves. Second ditch. Even in any of the above cases, the surface of the inner surface of the first groove and the second groove -15-200903614 has a roughness (Ra) of preferably 20 μm or less, more preferably 0.05 to 15 μm, and even more preferably 0.05 to 10 μm. By setting the surface roughness to 20 μm or less, it is possible to more effectively prevent the occurrence of scratches on the surface to be honed when the chemical mechanical honing step is performed. The above surface roughness (Ra ) is defined by the following formula (i).

Ra = Σ | Z-Zav I / N ( i ) (其中,上述式(i )中,N爲測定點數’ Z爲粗糙曲面之 高度,Zav爲粗糙曲面之平均高度)。 假想直線上與第一溝及第二溝之交叉點總數(當第一 溝及第二溝爲圓形溝、橢圓形溝或多邊形狀溝時,該交叉 點之總數與第一溝及第二溝之合計數一致),爲由上述第 一溝之間距及鄰接2條第一溝之間隙中存在之第二溝數目 以及硏磨面大小所計算之値。例如硏磨面直徑爲500mm之 硏磨墊時,交叉點總數可爲60〜25 0個,更好爲80〜170個 。又,例如硏磨面之直徑爲800mm之硏磨墊時,交叉點總 數可爲100〜3 5 0個,更好爲130〜270個。 硏磨面具有如上述之第一溝群及第二溝群,於化學機 械硏磨之際,即使化學硏磨用水性分散體之供給量成爲少 量,亦可以優異之硏磨速度且獲得被硏磨面之硏磨量之面 內均一性優異之化學機械硏磨用硏磨墊。 其次,第二硏磨墊具有自硏磨面中心部向周邊部依序 螺旋地擴大之一條螺旋狀溝之第一溝替代前述第一硏磨墊 -16- 200903614 之第一溝群,且具有自硏磨面中心部向周邊部依序螺旋地 擴大之一條螺旋狀溝之第二溝替代前述第一硏磨墊之第二 溝群。第二溝與前述第一溝並未交叉。 各爲螺旋狀溝之第一溝以及第二溝之迴圈數分別爲例 如20〜400,較好爲20〜300 ’更好爲20~200。其中’ 3 60°繞 一圈相當於迴圈數1。 第二硏磨墊之第一溝所具有之第一溝寬、間距以及深 度以及第二溝所具有之第二溝寬、間距以及深度’分別如 前述第一硏磨墊般,在硏磨面上鄰接之兩條第一溝之間隙 中存在有一條第二溝之情況下,第一溝所具有之第一溝寬 、間距以及深度以及第二溝所具有之第二溝寬、間距以及 深度與前述相同。又,第二硏磨墊之第一溝及第二溝內面 之表面粗糙度(Ra)之較佳範圍亦與前述第一硏磨墊之第 一溝及第二溝內面之表面粗糙度(Ra )之較佳範圍相同。 第二硏磨墊中未特別記載之事項,於第一硏磨墊中記 載之事項可直接或由熟知本技藝者自然明瞭之可變更之下 ,可理解亦適用於第二硏磨墊。 本發明之化學機械硏磨墊亦可具有與前述第一溝群集 第二溝群不同之第三溝群。前述第三溝群係自硏磨面中心 部朝向周邊部之方向延伸之複數條溝所構成。其中’所謂 中心部,係指以化學機械硏磨墊面上之重心作爲中心以半 徑50mm之圓所圍起來之區域。又,所謂周邊部’係指除 了中心部以外之區域。第三溝群所屬之各第三溝,只要自 -17- 200903614 此「中心部」中任意一點朝向周邊部方向延 狀可爲例如直線狀、虛線狀或圓弧狀或其等 。其中,所謂「虛線狀的溝」意指複數個線 凹部在假想線上於縱向排列之溝。若爲其他 狀之凹部與該線狀凹部之延長線上具有的非 其延長線上所具有之線狀凹部一起藉由線狀 重複構成之一條虛線狀之溝所構成。 虛線狀溝之各個線狀凹部之長度較好爲 好爲2 0〜1 0 0 m m。又,夾於兩條鄰接線狀凹部 長度較好爲5~100mm,更好爲15〜60mm。 第三溝可到達外周端,亦可未到達外周 少第三溝中之一條溝到達外周端,更好全部 達外周端。其中,所謂之外周端,係指化學 之端部。例如,複數條第三溝係由自中心部 部之直線狀溝之複數條所構成因而至少其內 達墊片之側面,或複數條第三溝自中心部開 之直線狀溝之複數條與自中心部與周邊部之 周邊部之直線狀溝之複數條所構成因而至少 可到達墊片之側面。再者,複數條之第三溝 並列之直線狀溝成對所構成。 第三溝群較好由在中心部區域中與其他 第三溝與在中心部區域中未與其他第三群之 溝所構成。此情況下,在中心部區域中未與 伸即可,其形 之組合之形狀 狀凹部介以非 方式,則爲線 凹部,進而於 凹部與非凹部 5~200mm,更 中之非凹部之 端,但較好至 之第三溝均到 機械硏磨墊面 開始朝向周邊 之一條溝可到 始朝向周邊部 中途開始朝向 其內之一條溝 分別可由兩條 第三溝相接之 溝相接之第三 其他第三溝相 -18- 200903614 接之第三溝存在於在中心部區域中與其他溝相 第三溝之間。屬於第三溝群之第三溝,即使與 群之其他溝相接之情況,相互間並未交叉。 至於第三溝群之條數,較好其總數爲6〜96 其他第三溝相接之第三溝條數爲2〜32條,未與 相接之第三溝條數爲 4-64條。更好的範圍 6〜48條,與其他第三溝相接之第三溝條數爲Ί 與其他第三溝相接之第三溝條數爲4〜32條。最 ,總數爲6〜3 6條,與其他第三溝相接之第三溝 條,未與其他第三溝相接之第三溝條數爲4〜3 2 第三溝群中,較好在中心部區域中未與其 接之第三溝條數多於在中心部區域中與其他第 第三溝條數。又,較好爲與其他第三溝相接之 ,存在有平均各相等條數之未與其他第三溝相 〇 於第三溝群之第三溝亦係自任何中心部開 部延伸之溝之情況時,在中心部區域中未與其 接之第三溝較好爲自距硏磨墊中心10~ 5 之 自其朝向周邊部之方向延伸之溝,更好係自距 20〜5 0mm之位置開始,自其朝向周邊部之方向 又,較好爲中心部區域中與其他第三溝相接之 硏磨墊中心開始朝向周邊部之方向延伸之溝。 另一方面,第三溝群係由複數條之自中心 接之複數條 屬於第三溝 條,其中與 其他第三溝 爲,總數爲 i〜1 6條,未 好的範圍爲 ;條數爲2-4 條。 他第三溝相 二溝相接之 第三溝之間 接之第三溝 始朝向周邊 他第三溝相 位置開始, 硏磨墊中心 延伸之溝。 第三溝係自 部開始朝向 -19- 200903614 周邊部之直線狀溝與複數條之自中心部與周邊部之中途開 始朝向周邊部之直線狀溝所構成之情況下,自中心部與周 邊部之中途開始之溝爲自連結硏磨墊中心與外周之假想直 線上之點開始,較好爲自位於硏磨墊中心部朝向外周之 20〜80%的位置上之點開始,更好自位於其40〜60%之位置之 點開始。即使在此情況,複數條自中心部開始朝向周邊部 之直線狀溝係由在中心部區域中未與其他第三溝相接之第 三溝條數與在中心部區域中與其他第三溝所構成,其中自 中心部開始之第三溝之較佳構成與第三溝群之第三溝任意 自中心部開始朝向周邊部延伸之溝之情況相同。 第三溝之溝寬較好爲0.1〜5.0mm,更好爲0.1〜4.0mm, 又更好爲0.2〜3.0mm。第三溝之深度與上述第一溝之深度 相同。又,第三溝之內面表面粗糙度(Ra )之較佳範圍亦 與上述第一溝之內面表面粗糙度(Ra )之較佳範圍相同。 此第三溝群之複數條第三溝在化學機械硏磨墊上較好 儘可能均等地配置。 以下,使用附圖對前述之化學機械硏磨墊之溝群構成 以具體例更進一步加以說明。 又’以下圖式中’第一溝與第二溝總數各爲1 0條左右 ’但該圖爲槪略圖,至於第一溝、第二溝之數量,可理解 爲較好是自上述第一溝之間距及鄰接之2條第一溝間隙中 存在之第二溝數以及硏磨面之大小加以計算所得之條數。 又’以下圖式雖係以各第一溝及第二溝爲圓形溝之第一硏 -20- 200903614 磨墊爲例,但所圖示之第一溝及第二溝分別替換爲橢圓形 狀溝或多邊形溝之第一硏磨墊以及圖3及圖4所圖示之使 第一硏磨墊之第一溝群及第二溝群替換爲2條螺旋狀溝t 第二硏磨墊亦同樣被揭示及理解。再者,圖5及圖6所圖 示之第一硏磨墊之第一溝之第一溝寬與第二溝之第二溝寬 交換之態樣之第一硏磨墊亦同樣被揭示及理解。 圖3中,硏磨墊1之硏磨面具有由直徑各異之5條同 心圓溝2所構成之第一溝群以及由直徑各異之4條同心圓 溝3所構成之第二溝群。鄰接之2條第一溝之間平均各存 在有1條第二溝,因此圖3之硏磨墊,於前述假想直線上 ,該假想直線與第一溝之交叉點以及該假想直線與第二溝 之交叉點交互出現。鄰接之2條第一溝之間存在之第二溝 分別位於鄰接之2條第一溝之中心位置。圖3之硏磨墊中 ,第二溝所具有之第二溝寬比第一溝所具有之第一溝寬小 〇 圖4中,硏磨墊1之硏磨面具有由直徑各異之5條同 心圓溝2所構成之第一溝群以及由直徑各異之4條同心圓 溝3所構成之第二溝群。鄰接之2條第一溝之間平均各存 在有1條第二溝,因此圖4之硏磨墊,於前述假想直線上 ,該假想直線與第一溝之交叉點以及該假想直線與第二溝 之交叉點交互出現。鄰接之2條第一溝之間存在之第二溝 分別位於鄰接之2條第一溝之中心位置。圖4之硏磨墊中 ,第二溝所具有之第二溝寬比第一溝所具有之第一溝寬小 -21 - 200903614 。圖4之硏磨墊進而具有由16條直線溝4所構成之第三溝 群。1 6條直線溝中每隔9 0 °角度存在之4條係自硏磨面之 中心開始於硏磨面之中心相互連接,相對地,其他1 2條直 線溝係自由自硏磨面中心朝周邊部後退幾分之部份(此部 份可判定爲中心部中第一溝群中最小的圓溝中與該直線溝 相接之部份)開始而未與其他第三溝相接。圖4之硏磨墊 之1 6條直線溝均到達硏磨墊之外周端。 圖5中,硏磨墊1之硏磨面具有由直徑各異之3條同 心圓溝2所構成之第一溝群以及由直徑各異之6條同心圓 溝3所構成之第二溝群。鄰接之2條第一溝之間平均各存 在有2條第二溝。鄰接之2條第一溝之間隙中存在之2條 第二溝均等配至於鄰接之2條第一溝間。又,硏磨面中最 小之第一溝之更內側存在有2條第二溝。圖5之硏磨墊中 ,第二溝所具有之第二溝寬比第一溝所具有之第一溝寬小 〇 圖6中,硏磨墊1之硏磨面具有由直徑各異之2條同 心圓溝2所構成之第一溝群以及由直徑各異之7條同心圓 溝3所構成之第二溝群。鄰接之2條第一溝之間存在有3 條第二溝。鄰接之2條第一溝之間隙中存在之3條第二溝 均等配至於鄰接之2條第一溝間。又’硏磨面中最小之第 一溝之更內側存在有3條第二溝’最大之第一溝更外側存 在有1條第二溝。圖6之硏磨墊中’第二溝所具有之第二 溝寬比第一溝所具有之第一溝寬小。 -22- 200903614 本發明之化學機械硏磨墊雖於硏磨面具有如 之複數溝群之硏磨墊,但可進而在非硏磨面上具 狀之溝或溝群或其他凹部。藉由具有如此溝或溝 凹部,可更提高被硏磨面之表面狀態。至於非硏 群形狀,可舉例有包含有例如同心之複數圓形溝 複數橢圓形溝、有共同重心之複數多邊形狀溝、2 螺旋狀溝或自硏磨墊中心部朝向外周部之複數條 含形成三角格子、正方格子或六方格子之複數條 至於非硏磨面之溝形狀,可舉例有例如1條螺旋 ,至於非硏磨面之其他凹部形狀’可舉例有例如 圓所圍繞之內部所成之形狀、多邊形狀溝以及以 狀溝所圍繞之內部所成之形狀等。 此非硏磨面之溝或溝群或其他凹部較好爲其 達外周端者。 又,具有圓以及以該圓所圍繞之內部所成之 邊形狀溝及以該多邊形狀溝所圍繞之內部所成之 部較好係非硏磨面之中央部所具有者。此處所謂 所具有」之槪念,除包含此凹部之重心於嚴格的 而言係與非硏磨面之重心一致之情況以外,也包 之非硏磨面重心位在前述凹部範圍內之情況。 本發明之化學機械硏磨墊亦可爲自非硏磨面 具有光學可通過之透光性區域者。藉由此具有透 之硏磨墊,在安裝使用於具有光學式硏磨終點檢 前述規定 有任意形 群或其他 磨面之溝 、同心之 條以上之 溝,或包 直線溝。 狀溝。又 圓或以該 該多邊形 各均未到 形狀或多 形狀之凹 「中央部 數學意涵 含硏磨墊 至硏磨面 光性區域 出器之化 -23- 200903614 學機械硏磨裝置之際,使光學硏磨終點的檢測成爲可能。 透光性區域之平面形狀並無特別限制,區域之外周形狀可 爲例如圓形、橢圓形、扇形、多邊形狀溝狀(正方形、長 方形)等。透光性區域之位置可爲適合於安裝且使用有本 發明之化學機械硏磨墊之化學機械硏磨裝置所具有之光學 硏磨終點檢出器位置之位置。透光性區域之數量可爲1個 或複數個。設有複數個透光性區域之情況下,其配置只要 符合則述位置關係,則無特別限制。 雖不論透光性區域之形成方法,但可爲例如應具有透 光性之硏磨墊區域以透光性構件構成之方法,或於硏磨墊 由具有某程度透光性之材料所構成之情況,硏磨墊之非硏 磨面中’於相當於應具有透光性之硏磨墊區域之部份形成 凹部’藉由使該區域變薄而確保硏磨終點檢出所需要之透 光性之方法亦可。於後者方法之情況下,該透光性區域兼 具有用以使前述被硏磨面之表面狀態更提高之凹部的角色 0 本發明之化學機械硏磨墊,只要具備前述之要件,而 可使作爲化學機械硏磨墊發揮機能者即可,而可由任何材 料構成。於作爲化學機械硏磨墊之機能中,尤其是具有在 化學機械硏磨時保持所供給之化學機械硏磨用水性分散體 (漿料),使硏磨屑短暫滯留等機能之孔洞較好在硏磨時 之前形成。因此,較好爲具備含有非水溶性部份及分散於 該非水溶性部份中之水溶性粒子之材料,或者含有非水溶 -24- 200903614 性部份及分散於該非水溶性部份中之孔洞之材料(例如發 泡體)。 其中’前者材料可藉由使水溶性粒子在硏磨時與化學 機械硏磨用水性分散體中所含之水性介質接觸而溶解或膨 潤脫離’使梁料保持在該因脫離所形成之孔洞中。另一方 面’後者材料可將發料保持在以空孔預先形成之孔洞內。 前者材料中’構成非水溶性部份之材料並無特別限制 ,但由可容易形成所需形狀、容易賦予適度硬度或適度彈 性等期望性質之觀點觀之,較好使用有機材料。作爲有機 材料,可單獨或組合使用例如熱可塑性樹脂、彈性體、橡 膠、硬化樹脂(熱硬化樹脂、光硬化樹脂等之藉由熱、光 等硬化之樹脂)等。 其中,作爲熱可塑性樹脂可列舉有例如1 , 2 _聚丁二烯 樹脂、聚烯烴樹脂、聚苯乙烯樹脂、聚丙烯酸樹脂、乙烯 酯樹脂(但相當於聚丙烯酸樹脂者除外)、聚酯樹脂、聚 醯胺樹脂、氟樹脂、聚碳酸酯樹脂 '聚乙縮醛樹脂等。可 分別列舉之上述聚烯烴樹脂有例如聚乙烯等,至於上述聚 丙烯酸樹脂有例如(甲基)丙丨希酸酯係樹脂等’至於上述 氟樹脂有例如聚偏氟乙嫌等。 至於彈性體可列舉有例如二烯彈性體、聚烯烴彈性體 (τρο)、苯乙烯系彈性體、熱可塑性彈性體、聚矽氧烷樹 脂彈性體、氟樹脂彈性體等。至於上述二燦彈性體可列舉 有例如1,2-聚丁二烯等。至於上述苯乙烯系彈性體可列舉 -25- 200903614 有例如苯乙烯-丁二烯-苯乙烯嵌段共聚物(S B S ),其氫化 嵌段共聚物(S EB S )等。至於上述熱可塑性彈性體可列舉 有例如熱可塑性聚胺基甲酸酯彈性體(TPU )、熱可塑性聚 酯彈性體(TPEE )、聚醯胺彈性體(TPAE )等。 至於橡膠可列舉有例如共軛二烯橡膠、腈橡膠、丙烯 酸系橡膠、乙烯-α-烯烴橡膠以及其他橡膠。至於上述共 轭二烯橡膠可列舉有例如丁二烯橡膠(高順式丁二烯橡膠 、低順式丁二烯橡膠等)、異戊二烯橡膠、苯乙烯-丁二烯 橡膠、苯乙嫌-異戊二烯橡膠等。至於上述腈橡膠列舉者爲 例如丙烯腈-丁二烯橡膠等。至於上述乙烯-α -烯烴橡膠可 列舉有例如乙烯-丙烯橡膠、乙烯-丙烯-非共軛二烯橡膠等 。至於上述其他橡膠可列舉有例如丁基橡膠、聚矽氧橡膠 、氟橡膠等。 至於硬化樹脂可列舉有例如胺基甲酸酯樹脂、環氧樹 脂、丙烯酸樹脂、不飽和聚酯樹脂、聚胺基甲酸酯-脲樹脂 、脲樹脂、砂樹脂、酣系樹脂、乙稀基酯樹脂等。該等有 機材料亦可爲藉由酸酐基、羧基、羥基、環氧基、胺基等 而變性者。藉由變性可調整與後述水溶性粒子或與漿料之 親和性。 該等有機材料可僅使用一種,亦可2種以上倂用。 再者’該等有機材料可爲其一部份或全部經交聯之交 聯聚合物’亦可爲非交聯聚合物。亦即,非水溶性部份可 僅由交聯聚合物所構成,亦可爲交聯聚合物與非交聯聚合 -26- 200903614 物之混合物,亦可爲僅由非交聯聚合物所構成。此等中’ 較好非水溶性部份僅由交聯聚合物所構成,或由交聯聚合 物與非交聯聚合物之混合物所構成。藉由使構成硏磨墊之 非水溶性部份含有交聯聚合物,可賦予非水溶性部份之彈 性回復力、使硏磨時因化學硏磨墊之壓靠應力之變位抑制 在小的程度。又,硏磨時以及打磨整修時非水溶性部份塡 滿因過度拉延而塑性變形之孔洞,或化學機械硏磨墊表面 過度起毛等之效果可獲得抑制。因此,可在打磨修飾時有 效率地形成孔洞、防止硏磨時漿料之保持性降低,而可實 現起毛量少之優異硏磨平坦性。 進行上述交聯之方法並無特別限制,例如可藉由使用 有機過氧化物、硫、硫化合物等之化學交聯、藉由電子線 照射等之放射線交聯等進行。 至於此交聯聚合物,可使用上述有機材料中之交聯橡 膠、硬化樹脂、經交聯之熱可塑性樹脂以及經交聯之彈性 體等。該等中,對大多數化學機械硏磨用水性分散體所含 之強酸或強鹼安定、且因吸水而軟化少觀之,較好爲交聯 熱可塑性樹脂及/或交聯彈性體。又,交聯熱可塑性樹脂以 及交聯彈性體中,最佳者爲使用有機過氧化物交聯者,進 而更好爲交聯之1,2 -聚丁二烯。 該交聯聚合物之含量並無特別限制,但較好爲非水溶 性部份全部之3 0體積%以上,更好爲5 0體積%以上,又更 好爲7 0體積%以上,亦可爲1 〇 〇體積%。藉由使非水溶性 -27- 200903614 部份中之交聯聚合物含量在3 0體積%以上,可充分發揮非 水溶性部份中含有交聯聚合物之效果。 爲了控制與水溶性粒子之親和性以及非水溶性材料中 水溶性粒子之分散性,上述非水溶性材料可含有與上述非 水溶性材料不同之相溶化劑。至於相溶化劑’除了例如藉 由酸酐基、羧基、羥基、環氧基、噁唑啉基、胺基等而變 性之聚合物、嵌段共聚物或無規共聚物等以外’可列舉有 各種非離子性界面活性劑、偶合劑等。 前者材料中之水溶性粒子可爲化學機械硏磨時藉由與 化學機械硏磨用水性分散體中所含之水性介質接觸自非水 溶性部份脫離之粒子。該脫離可爲藉由與水性介質接觸而 溶解所產生,亦可爲吸收水性介質中之水等而成爲膨潤膠 體狀所產生者。該溶解或膨潤若係可藉由水膨潤者,則無 限制,亦可爲與含有甲醇等醇系溶劑之水性混合介質接觸 而澎潤者。 構成水溶性粒子之材料並無特別限制,可列舉有例如 有機水溶性粒子及無機水溶性粒子。至於有機水溶性粒子 之材料可列舉有例如糖類(澱粉、糊精以及環糊精之類的 多糖類;乳糖;甘露糖等)、纖維素類(羥基丙基纖維素 、甲基纖維素等)、蛋白質、聚乙烯醇、聚乙烯吡咯啶酮 、聚丙烯酸、聚環氧乙烷、水溶性感光樹脂、磺化聚異戊 二烯、磺化異戊二烯共聚物等。再者,至於無機水溶性粒 子之材料可列舉有例如乙酸鈣、硝酸鈣、碳酸鈣、碳酸氫 -28- 200903614 銘、氯化鈣、溴化鈣、磷酸鈣、硝酸鎂等。該等水溶性粒 子可單獨使用上述各種材料或可組合2種以上使用。再者 ’亦可爲由特定材料所構成之1種水溶性粒子、亦可爲由 不同材料所構成之2種以上之水溶性粒子。 由使硏磨墊之硬度成爲適當値之觀點觀之,前者材料 中所含有之水溶性粒子最好爲實心體。 水溶性粒子之平均粒徑較好爲0. 1〜500μιη,更好爲 0.5〜100 μιη。藉由使水溶性粒子脫離而形成之孔洞大小,較 好爲〇_1〜500μιη,更好爲0.5〜ΙΟΟμιη。藉由使水溶性粒子之 平均粒徑在上述範圍,可成爲顯示高硏磨速度且機械強度 優異之化學機械硏磨墊。 於非水溶性部份與水溶性粒子之合計爲1 00體積%時之 水溶性粒子含量,較好爲1〜90體積%,更好爲1〜60體積% ,又更好爲1〜40體積%。藉由使水溶性粒子之含量在該範 圍,可成爲顯示高硏磨速度且具有適當硬度及機械強度之 化學機械硏磨墊。 又,較好水溶性粒子僅在於硏磨墊內之表層露出時被 水等溶解或膨潤,而在硏磨墊內部時則未吸濕進而不會膨 潤。爲此,水溶性粒子可具備有外殼以控制最外部份之至 少一部份的吸濕。該外殼可爲物理性吸附於水溶性粒子上 ,亦可與水溶性粒子進行化學鍵結,亦可藉由該兩種方法 與水溶性粒子相接。至於形成該等外殼之材料可列舉有例 如環氧樹脂 '聚醯亞胺、聚醯胺、聚矽酸酯、矽烷偶合劑 -29- 200903614 等。此情況下,水溶性粒子可由具有外殼之水溶性粒子與 沒有外殼之水溶性粒子所構成,有外殼之水溶性粒子即使 其表面未全部被外殼被覆亦可充分獲得上述效果。 一方面’至於構成化學機械硏磨墊具備後者之非水溶 性部份與含有分散於該非水溶性部份中之孔洞之材料之非 水溶性材料可列舉者爲例如聚胺基甲酸酯、三聚氰胺樹脂 、聚酯、聚楓、聚乙酸乙烯酯等。 分散於該等非水溶性部份中之孔洞大小以平均値計, 較好爲〇·1〜500μηι,更好爲0.5〜ΙΟΟμιη。 本發明之化學機械硏磨墊,除了上述材料以外,可任 意含有硏磨粒、氧化劑、鹼金屬氫氧化物、酸、pH調節劑 、界面活性劑等。此處,此等中,較好不含有硏磨粒及氧 化劑。 本發明之化學機械硏磨墊之蕭氏(Shore) D硬度較好 爲30以上,更好爲30〜100,又更好爲40〜90,特別好爲 40〜7 5。藉由成爲該蕭氏D硬度,可增大對被硏磨體之負荷 壓力,伴隨於此使硏磨速度更提高,進而除此之外,可獲 得更高之硏磨平坦性。 本發明之化學機械硏磨墊之製造方法並無特別限制, 形成化學機械硏磨墊之硏磨面上所具有之溝群之方法亦無 特別限制。例如,預先準備成爲隨後之化學機械硏磨墊的 化學機械硏磨墊用組成物,使該組成物成形爲所需輪廓後 ,可藉由切削加工形成溝群。或者,藉由使用具有與應形 -30- 200903614 成之溝群形狀相契合之突起部之模具使化學機械硏磨墊用 組成物經模具成形,可同時形成化學機械硏磨墊之輪廓及 溝群。使用具有與應形成溝群之一部份契合之突起部之模 具形成具有所需溝群之一部份之硏磨墊輪廓後,可藉由切 削加工形成溝群中之其餘部份。 本發明之化學機械硏磨墊爲在其非硏磨面具有溝或溝 群或其他凹部之情況下,此等溝或溝群或其他凹部可與前 述相同般形成。 獲得化學機械硏磨墊之方法並無特別限制。例如,可 藉由混練機等混練特定有機材料等必要材料而獲得。作爲 混練機可使用過去習知之混練機。可列舉有例如輥、捏合 機、班伯里混練機、押出機(單軸、多軸)等混練機。 再者,用以獲得含有水溶性粒子之化學機械硏磨墊之 含有水溶性粒子之化學機械硏磨墊用組成物,例如可將非 水溶性部份及水溶性粒子以及其他任意添加劑混練而獲得 。較好爲混練時加工容易般之加熱、混練。混練時之溫度 下水溶性粒子較好爲固體。使用預先分級爲前述較佳平均 粒徑範圍內之水溶性粒子,藉由使水溶性粒子爲固體之條 件下混練,不管水溶性粒子與非水溶性粒子之相容性程度 ,亦可使水溶性粒子以上述較佳之平均粒徑分散。 因此,較好依據所使用之非水溶性部份之加工溫度, 選擇水溶性粒子之種類。 本發明之化學機械硏磨墊亦可爲在上述般之硏磨墊之 -31 - 200903614 非硏磨面上設置支撐層之多層型硏磨墊。 上述支撐層爲以硏磨面之背面支撐化學機械硏磨墊之 層。該支撐層之特性並無特別限制,較好爲比硏磨墊本體 更軟質者。藉由設置更軟質之支撐層,即使硏磨墊本體之 厚度變薄時,硏磨時會使硏磨墊本體浮上來’可防止硏磨 層表面彎曲等,可進行安定之硏磨。該支撐層之硬度,以 蕭氏D硬度表示,較好爲硏磨墊本體之蕭氏D硬度的90% ,更好爲50〜90%,特別好爲50〜80%,其中以50〜70%最好 〇 支撐層既可爲多孔質體(發泡體),亦可爲非多孔質 體。進而,其平面形狀可爲例如圓形、多邊形狀溝等,但 較好爲與硏磨墊之平面形狀相同之平面形狀且具有相同大 小者。其厚度並無特別限制,較好爲 0.1〜5mm,更好爲 〇 . 5 〜2 m m 〇 構成支撐層之材料亦無特別限制,由容易形成特定形 狀及性狀、可賦予適當彈性等之觀點觀之,較好使用有機 材料。作爲有機材料,可使用構成本發明之化學機械硏磨 墊之非水溶性部份之材料所列示之有機材料。 本發明之化學機械硏磨方法之特徵爲使用如上述之本 發明化學機械硏磨墊對被硏磨面進行化學機械硏磨。本發 明之化學機械硏磨方法,除了在市售化學硏磨裝置上裝置 本發明之化學機械硏磨墊以外,其於藉由習知方法進行。 至於構成被硏磨面之材料,可列舉有由配線材料之金 -32- 200903614 屬、障壁金屬及絕緣體所構成以及其組合所構成之材料。 至於上述配線材料之金屬可列舉有例如鎢、鋁、銅及含有 該等之至少一種之合金。至於上述障壁金屬可列舉有鈦、 氮化鈦、鈮、氮化鈮等。至於上述絕緣體可列舉有例如 Si02、於Si〇2中添加少量硼及碟之硼磷矽酸鹽(bpsg)、 於Si02中摻雜氟之稱爲FSG (摻雜氟之矽酸鹽玻璃)之絕 緣體,以及低導電率之氧化矽系絕緣體等。至於Si02可列 舉有例如熱氧化膜、PETEOS (電漿所增進之-TE0S )、 HDP (高密度電漿所增進之-TEOS )、以熱CVD法製備之 Si02 等。 至於適用本發明之化學機械硏磨方法之被硏磨面較好 爲由絕緣體構成之被硏磨面、由絕緣體與銅或含銅之合金 所構成之被硏磨面、絕緣體與銅或含銅之合金及障壁金屬 所構成之被硏磨面。 本發明之化學機械硏磨墊及化學機械硏磨方法將由下 列所示之實施例可明瞭,即使化學機械研磨用水性分散體 之流量成爲少量,其硏磨速度亦優異,且於被硏磨面之硏 磨量面內均一性亦優異。此等優異性能之展機制尙不清楚 ’但推測係藉由採用如上述之特定溝設計,於進行化學機 械硏磨時’可同時確保有效地對硏磨面與被硏磨面之界面 供給水性分散體以及確保硏磨面與被硏磨面之接觸面積。 實施例 -33- 200903614 實施例1 (η 化學機械硏磨墊之製造 (1-1) 硏磨墊輪廓之製造 使70體積份之1,2-聚丁二烯(JSR (股)製’商品名 「JSR RB810」)與30體積份之/3-環糊精(鹽水港精糖( 股)製,商品名「迪克斯巴耳沒-100」’平均粒徑20μηι ) ,在1 6 0 °C下以L u d a r混練。隨後,相對於1 〇 〇質量份之 1,2 -聚丁二烯加入0.32質量份(換算成純的二異丙苯基過 氧化物相當於0.128質量份)之PERCUMYL D40 (商品名 ’日本油脂(股)製,含有40質量%之二異丙苯基過氧化 物),進而在1 20°C混練後成爲小顆粒。使該小顆粒在模具 中於180 °C下加熱並交聯1〇分鐘,獲得直徑840mm、厚度 3.0mm之成形體。隨後藉由以砂紙硏於成形體之兩面各硏 削除0.1mm而調整厚度成爲2.8mm,獲得硏磨墊之輪廓。 (1-2 ) 溝之形成 在市售切削加工機之機台上安裝該硏磨墊之輪廓,在 成形體之單面(硏磨面)上形成溝寬1 .5mm、溝間距 3.0mm、溝深1 . 4mm、剖面形狀爲矩形之同心圓溝作爲第一 溝群。接著,以使每1條第二溝位在前述第一溝群之第一 溝中鄰接之2條第一溝中心之方式形成溝寬0.5 mm、溝深 1.4mm、剖面形狀爲矩形之同心圓溝作爲第二溝群,而製造 化學機械硏磨墊。此處形成之第一溝群之溝中,最小圓形 -34- 200903614 狀溝半徑爲,最大圚形狀溝之半徑爲5 0 5mm,第二溝 群之溝中最小圓形狀溝半徑爲1 2mm ’最大圓形狀溝半徑爲 5 0 7mm ° 上述第一溝群與第二溝群之內面表面粗糙度以Laser Tech (股)製之「1LM21P」測定,二者均約爲7.0μηι。 (2 ) 化學機械硏磨墊之評價 (2-1 ) 圖案化Ρ Ε Τ Ε 0 S膜之化學機械硏磨試驗 將上述製造之化學機械硏磨墊安裝在硏磨裝置^ Mirra/Mesa」(商品名,Applied Material公司製造)之壓 盤上,以下列條件硏磨具有圖案化PETEOS膜之晶圓(在8 吋矽晶圓上設有膜厚1 0,00 0埃之PETEOS膜(以原矽酸四 乙酯(TEOS )作爲原料,利用電漿作爲促進條件以化學氣 相成長成膜之Si02膜)者)。 壓盤轉速:90rpm 硏磨墊轉速:85rpm 硏磨壓力:2psi 硏磨機械硏磨用水性分散體:將 JSR (股)製「 CMS 840 1」、「CMS 8452」以及離子交換水以質量比1:2 :3混合者。 硏磨機械硏磨用水性分散體供給速度:1 00毫升/分鐘 硏磨時間:1分鐘 又,本實施例中採用之化學機械硏磨用水性分散體之 -35- 200903614 流量爲所用硏磨裝置之標準流量之約一半。 (2-2 ) 圖案化PETE OS膜之硏磨速度評價 上述硏磨之被硏磨材之於附有PETEOS膜之每一 8吋 晶圓,在外周3 mm除外之於直徑方向均等分成4 9點決定 爲特定點,於該等特定點中,由硏磨前後之PETEOS膜之 厚度差與硏磨時間計算出各點之硏磨速度。 評估該等49點之硏磨速度之平均値作爲硏磨速度之結 果,爲47.3nm/分鐘。 再者,各點之PETEOS膜之厚度係以光學式膜厚計測 定。 (2-3) 圖案化之PETEOS膜之硏磨量之面內均— 性評價 使用上述49點之硏磨前後PETEOS膜之厚度差異(該 値稱爲「硏磨量」)以下列之計算式計算出硏磨量之面內 均一性。 硏磨量之面內均一性(% )=(硏磨量之標準偏差+硏磨量之平 均値)X 1 0 0 硏磨量之面內均一性爲9.8 %。 -36- 200903614 (2-4 ) 圖案化之PETEOS膜之刮傷評價 使用缺陷檢查裝置(KLA-TENCOR公司製造’ 「 KLA23 5 1」)對每一化學機械硏磨後之PETEOS膜進行缺 陷檢查。首先’在硏磨後之晶圓表面全部範圍內’在像素 尺寸0.62μιη、臨限値(threshold) 30之條件下計測缺陷檢 查裝置所計算之缺陷數。接著,隨機抽出1 00個該等缺陷 在裝置之顯示器上依序顯示並觀察,並釐清缺陷是爲刮傷 或爲附著之異物(化學機械硏磨用水性分散體中所含之硏 磨粒等),計算出100個缺陷中長度0.20微米以上之刮痕 所佔之比例,乘以缺陷檢查裝置所計算之缺陷總數,計算 出每晶圓全部表面之刮傷數。其結果,刮傷數爲24 5個/面 實施例2 - 8 如上述實施例1同樣地分別製造硏磨墊輪廓。 將該硏磨墊輪廓安裝在市售切削加工機之機台上,藉 由在成形體之單面(硏磨面)上分別形成表1中所示構成 之第一溝群及第二溝群(其剖面形狀各均爲矩形),製造 各化學機械硏磨墊。而且,於各實施例中,以使各每〜條 第二溝係位於各第一溝群之第一溝中相鄰之2條第一溝中 心之方式形成第二溝群之第二溝。又,於實施例7中,除 第一溝群及第二溝群以外,以市售切削加工機進而形成具 有由表1中記載之溝深及溝寬之8條放射狀直線溝(其剖 -37- 200903614 面形狀爲矩形)所構成之第三溝群。該放射狀溝 之2條溝所成之角度爲45度,每90度角度中存 溝於硏磨面之中心相互連接’其餘4條溝係自距 中心向外周後退1 5 111 111之位置開始。 使用該等化學機械硏磨墊’與實施例1同樣 案化之PETEOS膜之化學機械硏磨並評價。結果 中。 實施例9 (1) 化學機械硏磨墊之製造 (1-1 ) 硏磨墊輪廓之製造 將58質量份之4,4’-二苯基甲烷二異氰酸酯 耳胺基甲酸酯(股)製,商品名「Sumi Joule 44 S 反應器中,在60 °C下攪拌一邊添加5. 1質量份之 具有2個羥基之數平均分子量650之聚丁二醇( (股)製,品名「PTMG65 0」)與17.3質量份之 子量250之聚丁二醇(三菱化學(股)製, PTMG25 0」),一邊攪拌一邊在90°C保溫2小時 ,其冷卻後獲得末端異氰酸酯基之預聚物。該末 酯基預聚物含有;21質量%之未反應4,4’-二苯基甲 酸酯,剩餘之7 9質量%爲兩端異氰酸酯基預聚物 〇 使80.4質量份上述製備之末端裹氰酸酯基預 中鄰接 之4條 硏磨面 行各圖 於表1 住化拜 )注入 •子兩端 .菱化學 :平均分 品名 「 其反應 異氰酸 二異氰 混合物 物置入 -38- 200903614 攪拌容器中,使溫度維持在90。(:下,一邊於200rpm攪拌 ’一邊添加14.5質量份之/3-環糊精(鹽水港精糖(股)製 ’商品名「迪克斯巴耳卢-1 0 0」),經1小時混合分散後 藉由減壓去除氣泡’獲得分散有水溶性粒子之末端異氰酸 酯預聚物。 另外’使12_6質量份之末端具有2個羥基之1,4 -雙( 羥基乙氧基)苯(三井化學Fine (股)製,商品名「 BHEB」)在攪拌容器中於1 2〇t下加熱2小時熔解後,一 邊攪拌下添加7質量份之具有3個羥基之三羥甲基丙烷( BASF日本(股)製,商品名「TMP」),經10分鐘混合 溶解獲得鏈延長劑之混合物。 使94 · 9質量份之上述所得之分散有水溶性粒子之末端 異氰酸酯預聚物在AJITER ( AJITER,註冊商標,(股)島 津製作所)混合機中於90°C下加熱並攪拌,同時添加在 120°C下加溫之上述所得鏈延長劑19.6質量份,混合1分 鐘,獲得原料混合物。 使用具有直徑5 08mm、厚度2.8mm圓盤型孔洞之模具 ,注入使該空洞塡滿之量之上述原料混合物,在1 1 0°C下維 持3 0分鐘進行聚胺基甲酸酯化反應,經脫模。進而接著在 齒輪烘箱(g e a r 〇 v e η )中於1 1 0 °C下進行後硬化1 6小時, 獲得直徑5 0 8 mm、厚度2.8mm之分散有水溶性粒子之聚胺 基甲酸酯薄片。相對於全部薄片,水溶性粒子之體積分率 ,亦即相對於聚胺基甲酸酯基質與水溶性粒子之總計體積 -39- 200903614 之水溶性粒子的體積分率爲1 〇%。 (1 -2 ) 溝之形成 將上述製造之硏磨墊輪廓安裝於市售切削加工機之機 台上,藉由在成形體之單面(硏磨面)上,於硏磨面中心 部之30mm除外之全部硏磨面上形成表1中所示構成之第 一溝群及第二溝群(各剖面形狀均爲矩形),製造化學機 械硏磨墊。又,於本實施例中,以各每一條第二溝位在第 一溝群之第一溝相鄰2條第一溝中心之方式形成第二溝群 之第二溝。 (2 ) 化學機械硏磨墊之評價 使用上述製造之化學機械硏磨墊,與實施例1相同般 進行圖案化之PETEOS膜之化學機械硏磨,並評價,結果 列於表1。 實施例10〜17 與上述實施例1中相同般分別製造硏磨墊輪廓。 將該硏磨墊輪廓安裝在市售切削加工機之機台上,藉 由在成形體之單面(硏磨面)上分別形成表1中所示構成 之第一溝群及第二溝群(各剖面形狀均爲矩形),製造各 化學機械硏磨墊。又’各實施例中,係以各第一溝群之第 一溝中鄰接之2條第一溝間分別均等配置每2條第二溝之 -40- 200903614 方式,形成第二溝群之第二溝。又,實施例14 溝群及第二溝群以外,藉由市售之切削加工機 具有表1中所述之溝深以及溝寬之8條放射狀 剖面形狀爲矩形)所構成之第三溝群。該放射 接之2條溝所成角度爲45°,每90°角度中存在 於硏磨面中心相互連接,其餘4條溝係自距離 向外周後退1 5 m m之位置開始。 使用該等化學機械硏磨墊,與實施例1同 案化之PETEOS膜之化學機械硏磨,且評價。結 實施例1 8及1 9 與上述實施例1相同般分別製造硏磨墊輪扇 將該硏磨墊輪廓安裝在市售切削加工機之 由在成形體之單面(硏磨面)上分別形成表1 之第一溝群及第二溝群(各剖面形狀均爲矩形 化學機械硏磨墊。又,各實施例中,以各第一 溝中鄰接之2條第一溝間分別均等配置每3條 式,形成第二溝群之第二溝。又,實施例1 9中 群及第二溝群以外,藉由市售之切削加工機進 有表1所述之溝深以及溝寬之8條放射狀直線 形狀爲矩形)所構成之第三溝群。該放射狀溝群 條溝所成角度爲45°,每90°角度中存在之4條 中,除第一 進而形成由 直線溝(其 狀溝群中鄰 之4條溝係 硏磨面中心 樣進行各圖 i果列於表1 機台上,藉 中所示構成 ),製造各 溝群之第一 第二溝之方 ,除第一溝 而形成由具 溝(其剖面 〗中鄰接之2 溝於硏磨面 -41 - 200903614 中心相互連接,其餘4條溝係自距離硏磨面中心向外周後 退15mm之位置開始。 使用該等化學機械硏磨墊,與實施例1同樣般進行各 圖案化之PETEOS膜之化學機械硏磨,且評價。結果列於 表1中。 比較例1及2 與上述實施例1相同般分別製造硏磨墊輪廓。 將該硏磨墊輪廓安裝在市售切削加工機之機台±,藉 由在成形體之單面(硏磨面)上分別形成表1中 之第一溝群(其剖面形狀爲矩形)’製造各化學機械硏磨 墊。又,該等比較例中,並未形成第二溝群。 使用該等化學機械硏磨墊’與實施例1相同般 圖案化之PETEOS膜之化學機械硏磨,且評價。結果列於 表1 〇 -42- 200903614 I撇 實施例8 严η 〇 〇〇 Ο 1 * Ο ο 1—< g in Ο ^―« 00 1—Η d 14.41 502.41 〇 1 1 1 1 00 m Ό <N VO m 實施例7 巧 < 1 〇 ο » _ κ ο ο S iT) ο Ι> rn ο 12.85 507.85 〇 ο 00 (N 一 Ό m O L實施例ό 〇 χί- ΙΟ ο ο ο Τ' « ο 寸· Η Ο 1 12.415 1 507.415 〇 1 1 1 1 00 »—Η in ν〇 OO m oo <N 實施例5 寸· ψ 1 ο ο > Η ο ο s ο 寸· 寸· ο 00 oi Η 504.8 1 1 〇 1 1 1 1 in Os υ"ΐ OO 實施例4 寸· w 1 ο ο ο ο ί-Η s ο ΠΊ Ο 12.85 507.85 〇 1 1 1 1 o oo 00 in s CN 實施例3 寸· κη cn ο —< ο ο S ο … 寸· 守 ο 12.05 506.05 « < 〇 1 1 1 1 对 m vo 寸 實施例2 寸· ο r~! ο ο ο κη ο 卜· 寸· 1 一 κη Ο 11.75 506.75 1 1 ο 1 I 1 ! 寸 r4 ur» ON \ό CM (N 實施例1 寸· 1 ^ Ο ο ο s ο 寸· Ο ο CN 1 < 卜 ο kn ο 1 1 1 1 OO 〇\ vn 溝深(mm) 間距(mm) 溝寬(mm) 最小之第一溝半徑(mm) 最大之第一 _半徑(mm) 溝面內之表面粗糙度(Am) 溝深(mm) 溝寬(mm) 最小之第二溝半徑(mm) 最大之第二溝半徑(mm) 鄰接2條第一溝間之第二溝 數 溝面內之表面粗糙度(//m) 溝深(mm) 溝寬(mm) 條數 與其他第三溝相接之第三溝 條數 硏磨速度(nm/分鐘) 硏磨量之面內均一性(%) 刮痕數(個/晶圓) 1滥 派雜 « 第三 溝群 -43- 200903614 實施例16 t—< 〇 (N ο ο r Η Ο 〆 ·— (N 〇 rn 1 < 507.3 <Ν 〇 1 ! 1 1 1—^ \〇 <N m (N m 實施例15 寸· 〇 〇 r—« 寸 Ο Ο ο ο ιη Ο 寸· (N 〇 in rn »-< 503.5 (Ν 〇 1 1 1 1 寸 $ cn CM ΠΊ Γ^Ί L實施例14 P' 1 〇 r—l ο ο ιη ο 寸 o (N m 506.7 ΓνΙ 〇 T—^ ID Ο 00 寸 00 <> in 卜 iri m CN 實施例13 —t 〇 od 〇 1—H ο ο g κη ο ^t w < d 13.28 505.28 <Ν ο 1 1 1 1 η 00 Os m 實施例12 ο 卜^ \q ο ο ϊ—1 ο Γ· * rr o <N m w 1 506.7 1 CN ο 1 1 1 1 寸 〇6 m m ^sO CN 實施例11 〇 p |.一 ρ ο —— s IT) ο 卜: rr I—1 o 12.42 507.42 <Ν ο 1 1 1 1 r- κή κη 卜 (N 〇 Ο <N ρ CN ο 寸· s S ο I 1 1 | Ι> 卜 m 習 (N in d CO 1 H υο Κ <N OS 寸 ο 〇 ο KD ρ 寸 ro κη 00 00 ρ 1 l 1 1 卜 cn 00 辑 U 1 _ ο 1—^ κη ΧΓί 1 — I""·* o <N *—« δ l/Ί 1/Ί 1 -Η 1 1 1 1 雖 11 雜 111 5. 城 城 Β ε fe<" ε ε 制 N a m 靼 m m § 1 m 雛 塑 <R |ii| 赃 雜 1θ 雔 赃 1 阻 赃 e m5 1 1 11 1 1 城 嗽 11] c: 陌 V 濉 诚 ν ’g_ V 濉 濉 幾 V V 派 ki -Μ 建 ε 旦 β •Μ ε _^ε Μ •N (Ν ε 、s. 蹯 _ ,¾ ml DU 4< 胆 I κ 锻 is 赋 Μ 變 變 雜 Se 赃 囀 囀 霖 » 艘 酿 酿 雜 雜 雜 运(藏 1 11 1 1 ^ 礮睬 派赃 溉雜 城雜 -44 - 200903614Ra = Σ | Z-Zav I / N ( i ) (wherein, in the above formula (i), N is the number of measured points' Z is the height of the rough surface, and Zav is the average height of the rough surface). The total number of intersections between the imaginary straight line and the first groove and the second groove (when the first groove and the second groove are circular grooves, elliptical grooves or polygonal grooves, the total number of intersections and the first groove and the second groove The sum of the grooves is the same, which is calculated from the distance between the first grooves and the number of second grooves existing in the gap between the two first grooves and the size of the honing surface. For example, when the honing pad having a diameter of 500 mm is honed, the total number of intersections may be 60 to 25, more preferably 80 to 170. Further, for example, when the honing surface has a honing pad having a diameter of 800 mm, the total number of intersections may be 100 to 350, more preferably 130 to 270. The honing surface has the first groove group and the second groove group as described above, and in the case of chemical mechanical honing, even if the supply amount of the chemical honing aqueous dispersion is small, the honing speed can be excellent and the quilt can be obtained. A honing pad for chemical mechanical honing with excellent uniformity in the surface of the honing surface. Secondly, the second honing pad has a first groove which spirally expands one spiral groove from the center portion of the honing surface to the peripheral portion, and replaces the first groove group of the first honing pad-16-200903614, and has A second groove that spirally expands one of the spiral grooves from the center portion of the honing surface to the peripheral portion in place of the second groove group of the first honing pad. The second groove does not intersect the aforementioned first groove. The number of turns of the first groove and the second groove, each of which is a spiral groove, is, for example, 20 to 400, preferably 20 to 300 Å or more preferably 20 to 200. One of the '3 60° turns is equivalent to the number of turns. The first groove width, the spacing and the depth of the first groove of the second honing pad and the second groove width, the spacing and the depth of the second groove are respectively in the honing surface as in the first honing pad In the case where there is a second groove in the gap between the two adjacent first grooves, the first groove has a first groove width, a pitch and a depth, and the second groove has a second groove width, a pitch and a depth. Same as above. Moreover, the preferred range of the surface roughness (Ra) of the first groove and the second groove inner surface of the second honing pad is also the surface roughness of the first groove and the second groove inner surface of the first honing pad The preferred range of (Ra) is the same. What is not specifically described in the second honing pad, the matter recorded in the first honing pad may be changed directly or by a person skilled in the art to understand that it is also applicable to the second honing pad. The chemical mechanical honing pad of the present invention may also have a third groove group different from the first groove group second groove group. The third groove group is composed of a plurality of grooves extending from the center portion of the honing surface toward the peripheral portion. The term "center portion" refers to a region surrounded by a circle having a radius of 50 mm centered on the center of gravity of the chemical mechanical honing pad. Further, the term "peripheral portion" means an area other than the center portion. Each of the third grooves to which the third groove group belongs may be, for example, a linear shape, a broken line shape, an arc shape, or the like, extending from any one of the "central portions" of -17-200903614 toward the peripheral portion. Here, the "dashed-shaped groove" means a groove in which a plurality of line concave portions are arranged in the longitudinal direction on an imaginary line. The recessed portion of the other shape is formed by linearly repeating one of the linear recesses on the extension line of the linear recessed portion. The length of each linear recess of the dotted groove is preferably from 20 to 1 0 m m. Further, the length of the two adjacent linear recesses is preferably 5 to 100 mm, more preferably 15 to 60 mm. The third groove may reach the outer peripheral end, or may not reach the outer circumference, and one of the third grooves may reach the outer peripheral end, preferably all the outer peripheral end. The term "outer circumference" refers to the end of the chemical. For example, the plurality of third trenches are formed by a plurality of linear grooves from the central portion so that at least the side of the gasket or the plurality of linear grooves of the third groove from the central portion are A plurality of linear grooves from the central portion and the peripheral portion of the peripheral portion are formed so as to reach at least the side surface of the gasket. Further, the third groove in which the plurality of third grooves are arranged in parallel is formed in pairs. Preferably, the third group of grooves is formed by the other third grooves in the central portion and the grooves of the other third group in the central portion. In this case, in the central portion region, the shape-like concave portion may be a non-linear shape, and the concave portion may be a concave portion and a non-recessed portion 5 to 200 mm, and more preferably a non-recessed end. , but it is preferable that the third groove reaches the mechanical honing pad surface and starts to face one of the surrounding grooves, and can start from the middle toward the peripheral portion and one groove can be connected to the groove which can be connected by the two third grooves. The third other third ditch phase -18-200903614 is connected to the third ditch between the other ditch and the third ditch in the central portion. The third ditch belonging to the third ditch group does not cross each other even if it is connected to other ditches of the group. As for the number of the third groove group, the total number is preferably from 6 to 96. The number of the third groove that the third groove is connected to is 2 to 32, and the number of the third groove that is not connected is 4-64. . A better range is 6 to 48, and the number of third grooves that are in contact with the other third grooves is 4 and the number of third grooves that are in contact with the other third grooves is 4 to 32. The most, the total number is 6~3 6 , the third ditch connecting with the other third ditch, the third ditch not connected with the other third ditch is 4~3 2 The number of third grooves that are not attached to the central portion is greater than the number of other third grooves in the central portion. Further, it is preferable that the third groove is in contact with the other third groove, and the third groove which is equal to the other third groove and which is not in the third groove group is also a groove extending from any central portion. In the case of the third groove which is not connected to the center portion, it is preferably a groove extending from the center of the honing pad 10 to 5 from the direction toward the peripheral portion, preferably from a distance of 20 to 50 mm. The position starts from the direction toward the peripheral portion, and it is preferable that the center of the honing pad that is in contact with the other third groove in the central portion starts to extend toward the peripheral portion. On the other hand, the third groove group is composed of a plurality of strips from the center of the plurality of strips belonging to the third strip, wherein the other third grooves are, the total number is i~16, and the range is not good; the number is 2-4. The third ditch between the third ditch and the third ditch connected to the third ditch starts to face the periphery of the third ditch phase, and the center of the honing pad extends. The third groove is formed from the center portion toward the -19-200903614. The linear groove of the peripheral portion and the linear groove of the plurality of segments from the center portion and the peripheral portion toward the peripheral portion are formed from the center portion and the peripheral portion. The ditch starting from the middle starts from the point on the imaginary line connecting the center of the honing pad and the outer circumference, preferably from the point of the center of the honing pad toward the outer circumference of 20 to 80%, and is better located The point of its position of 40 to 60% begins. Even in this case, the linear groove from the center portion toward the peripheral portion of the plurality of strips is composed of the number of third grooves that are not in contact with the other third grooves in the central portion region and the other third grooves in the central portion region. In the configuration, the preferred configuration of the third groove from the center portion is the same as the case where the third groove of the third groove group is arbitrarily formed from the center portion toward the peripheral portion. The groove width of the third groove is preferably 0. 1~5. 0mm, better 0. 1~4. 0mm, and better 0. 2~3. 0mm. The depth of the third groove is the same as the depth of the first groove. Further, the preferred range of the surface roughness (Ra) of the inner surface of the third groove is also the same as the preferred range of the surface roughness (Ra) of the inner surface of the first groove. The plurality of third grooves of the third groove group are preferably disposed as uniformly as possible on the chemical mechanical honing pad. Hereinafter, the configuration of the groove group of the above-described chemical mechanical honing pad will be further described with reference to the drawings. In the following figure, the total number of the first groove and the second groove is about 10, but the figure is a schematic diagram. As for the number of the first groove and the second groove, it can be understood that it is preferably from the above first. The number of second grooves existing in the gap between the grooves and the adjacent two first groove gaps and the size of the honing surface are calculated. In addition, the following figure is based on the first 硏-20-200903614 grinding pad in which the first groove and the second groove are circular grooves, but the first groove and the second groove are replaced by elliptical shapes. The first honing pad of the groove or the polygonal groove and the first groove group and the second groove group of the first honing pad are replaced by two spiral grooves t and the second honing pad are also illustrated in FIGS. 3 and 4 It is also revealed and understood. Furthermore, the first honing pad of the first groove width of the first groove of the first honing pad illustrated in FIGS. 5 and 6 and the second groove width of the second groove are also disclosed. understanding. In Fig. 3, the honing surface of the honing pad 1 has a first groove group composed of five concentric grooves 2 having different diameters, and a second groove group composed of four concentric grooves 3 having different diameters. . There is one second groove on each of the two adjacent first grooves. Therefore, the honing pad of FIG. 3 is on the imaginary straight line, the intersection of the imaginary line and the first groove, and the imaginary line and the second The intersection of the grooves interacts. The second groove existing between the two adjacent first grooves is located at the center of the adjacent two first grooves. In the honing pad of FIG. 3, the second groove has a second groove width smaller than the first groove width of the first groove. In FIG. 4, the honing surface of the honing pad 1 has a diameter of 5 A first groove group formed by the concentric grooves 2 and a second groove group composed of four concentric grooves 3 having different diameters. There is one second groove on each of the two adjacent first grooves. Therefore, the honing pad of FIG. 4 is on the imaginary straight line, the intersection of the imaginary line and the first groove, and the imaginary line and the second The intersection of the grooves interacts. The second groove existing between the two adjacent first grooves is located at the center of the adjacent two first grooves. In the honing pad of Fig. 4, the second groove has a second groove width smaller than the first groove width of the first groove - 21 - 200903614. The honing pad of Fig. 4 further has a third groove group composed of 16 straight grooves 4. The four lines that exist at every 90° angle in the 6 straight grooves are connected to the center of the honing surface from the center of the honing surface. In contrast, the other 12 straight grooves are free from the center of the honing surface. A portion of the peripheral portion receding (this portion can be determined as the portion of the smallest groove in the first groove group in the center portion that is in contact with the straight groove) starts without being connected to the other third groove. Each of the six straight grooves of the honing pad of Fig. 4 reaches the outer end of the honing pad. In Fig. 5, the honing surface of the honing pad 1 has a first groove group composed of three concentric grooves 2 having different diameters, and a second groove group composed of six concentric grooves 3 having different diameters. . On average, there are two second grooves between the two adjacent first grooves. The two second grooves existing in the gap between the two adjacent first grooves are equally matched between the adjacent two first grooves. Further, there are two second grooves on the inner side of the smallest first groove in the honing surface. In the honing pad of FIG. 5, the second groove has a second groove width smaller than the first groove width of the first groove. In FIG. 6, the honing surface of the honing pad 1 has a diameter different from each other. A first groove group formed by the concentric grooves 2 and a second groove group composed of seven concentric grooves 3 having different diameters. There are three second grooves between the two adjacent first grooves. The three second grooves existing in the gap between the two adjacent first grooves are equally matched between the adjacent two first grooves. Further, there are three second grooves on the inner side of the smallest first groove in the honing surface. The first groove having the largest one has a second groove on the outer side. In the honing pad of Fig. 6, the second groove has a second groove width which is smaller than the first groove width of the first groove. -22- 200903614 The chemical mechanical honing pad of the present invention has a honing pad of a plurality of groove groups on the honing surface, but may further have a groove or a groove group or other concave portion on the non-honing surface. By having such a groove or a groove, the surface state of the surface to be honed can be further improved. As for the non-defective group shape, for example, a plurality of circular grooves having a plurality of circular grooves, a plurality of polygonal grooves having a common center of gravity, two spiral grooves, or a plurality of portions from the center portion of the sanding pad toward the outer periphery may be exemplified. The plurality of triangular lattices, the square lattices, or the hexagonal lattices may be formed as a groove shape of the non-honing surface, for example, one spiral, and the other concave shape of the non-honing surface may be exemplified by, for example, a circle surrounded by a circle. The shape, the polygonal groove, and the shape formed by the inside surrounded by the groove. The groove or group of grooves or other recesses of the non-honing surface are preferably those having an outer peripheral end. Further, a portion having a circle and an inner shape groove formed by the inside surrounded by the circle and a portion surrounded by the inner portion of the polygonal groove is preferably a central portion of the non-honing surface. The commemoration here is that the center of gravity of the concave portion is strictly the same as the center of gravity of the non-honing surface, and the center of gravity of the non-honing surface is also within the range of the concave portion. . The chemical mechanical honing pad of the present invention may also be a light transmissive region that is optically permeable from a non-honed surface. By means of the honing pad which is permeable, it is installed in a groove having an arbitrary shape group or other grinding surface, a groove above the concentric strip, or a straight groove. Groove. Further rounded or concave in the shape or shape of the polygon, "the central part of the mathematical meaning contains the honing pad to the honing surface area of the -23-200903614 mechanical honing device, The detection of the end point of the optical honing is possible. The planar shape of the light-transmitting region is not particularly limited, and the outer peripheral shape of the region may be, for example, a circular shape, an elliptical shape, a fan shape, a polygonal groove shape (square shape, rectangular shape), or the like. The position of the sexual region may be the position of the optical honing end detector position of the chemical mechanical honing device suitable for mounting and using the chemical mechanical honing pad of the present invention. The number of the light transmissive regions may be one. In the case where a plurality of light-transmitting regions are provided, the arrangement thereof is not particularly limited as long as it conforms to the positional relationship. However, the method of forming the light-transmitting region may be, for example, light transmissive. The honing pad area is formed by a translucent member, or the honing pad is made of a material having a certain degree of light transmissivity, and the non-honing surface of the honing pad is equivalent to The method of forming the concave portion in the region of the honing pad region can also ensure the light transmittance required for the detection of the honing end point by thinning the region. In the case of the latter method, the light transmissive region A character having a concave portion for improving the surface state of the surface to be honed. The chemical mechanical honing pad of the present invention can be used as a chemical mechanical honing pad as long as it has the above-described requirements. It can be composed of any material. In the function as a chemical mechanical honing pad, especially for the chemical mechanical honing aqueous dispersion (slurry) that is supplied during chemical mechanical honing, the squeegee is temporarily retained. The pores are preferably formed before the honing. Therefore, it is preferably a material having a water-insoluble particle containing a water-insoluble portion and dispersed in the water-insoluble portion, or a non-aqueous solvent -24-200903614 portion And a material (for example, a foam) dispersed in the pores in the water-insoluble portion. wherein the former material can be used in the hydrating and chemical mechanical honing aqueous dispersion by honing The aqueous medium contained in contact is dissolved or swelled away to keep the beam material in the hole formed by the detachment. On the other hand, the latter material can hold the hair material in the hole previously formed by the void. The material constituting the water-insoluble portion is not particularly limited, but an organic material is preferably used from the viewpoint of easily forming a desired shape and easily imparting desired properties such as moderate hardness or moderate elasticity. As an organic material, it can be used alone. Alternatively, for example, a thermoplastic resin, an elastomer, a rubber, a cured resin (a resin which is cured by heat, light, or the like) such as a heat-curable resin or a photo-curable resin may be used in combination. Among them, as the thermoplastic resin, for example, 1 and 2 may be mentioned. _ Polybutadiene resin, polyolefin resin, polystyrene resin, polyacrylic resin, vinyl ester resin (except for polyacrylic resin), polyester resin, polyamide resin, fluororesin, polycarbonate resin 'Poly acetal resin and the like. The above-mentioned polyolefin resin may be, for example, polyethylene or the like, and the polyacrylic resin may have, for example, a (meth)propionate-based resin or the like. The above-mentioned fluororesin may be, for example, polyvinylidene fluoride. The elastomer may, for example, be a diene elastomer, a polyolefin elastomer (τρο), a styrene elastomer, a thermoplastic elastomer, a polyoxyalkylene resin elastomer, a fluororesin elastomer or the like. The above-mentioned di-can beomer may, for example, be 1,2-polybutadiene or the like. As the above styrene-based elastomer, for example, -25 to 200903614, for example, a styrene-butadiene-styrene block copolymer (S B S ), a hydrogenated block copolymer (S EB S ) or the like can be given. The thermoplastic elastomer may, for example, be a thermoplastic polyurethane elastomer (TPU), a thermoplastic polyester elastomer (TPEE) or a polyamidamine elastomer (TPAE). As the rubber, for example, a conjugated diene rubber, a nitrile rubber, an acrylic rubber, an ethylene-α-olefin rubber, and other rubbers can be cited. Examples of the conjugated diene rubber include butadiene rubber (high cis-butadiene rubber, low cis-butadiene rubber, etc.), isoprene rubber, styrene-butadiene rubber, and styrene. Suspected-isoprene rubber and the like. The nitrile rubber is exemplified by, for example, acrylonitrile-butadiene rubber. The ethylene-α-olefin rubber may, for example, be an ethylene-propylene rubber or an ethylene-propylene-nonconjugated diene rubber. As the other rubber mentioned above, for example, butyl rubber, polyoxyethylene rubber, fluororubber or the like can be cited. Examples of the hardening resin include, for example, a urethane resin, an epoxy resin, an acrylic resin, an unsaturated polyester resin, a polyurethane-urea resin, a urea resin, a sand resin, an anthraquinone resin, and an ethylene group. Ester resin and the like. These organic materials may also be those which are denatured by an acid anhydride group, a carboxyl group, a hydroxyl group, an epoxy group, an amine group or the like. The affinity with the water-soluble particles or the slurry described later can be adjusted by denaturation. These organic materials may be used alone or in combination of two or more. Further, 'the organic material may be a partially or wholly crosslinked crosslinked polymer' or a non-crosslinked polymer. That is, the water-insoluble portion may be composed only of a cross-linked polymer, or may be a mixture of a cross-linked polymer and a non-cross-linked polymer -26-200903614, or may be composed only of a non-cross-linked polymer. . The preferred water-insoluble portion of these is composed only of a crosslinked polymer or a mixture of a crosslinked polymer and a non-crosslinked polymer. By making the water-insoluble portion constituting the honing pad contain a cross-linked polymer, the elastic restoring force of the water-insoluble portion can be imparted, and the deformation of the chemical honing pad by the stress can be suppressed at the time of honing. Degree. Further, the effect of the water-insoluble portion of the water-insoluble portion being excessively stretched during honing and polishing, or excessively fluffing on the surface of the chemical mechanical honing pad can be suppressed. Therefore, the holes can be efficiently formed during the polishing modification, and the retention of the slurry during honing can be prevented from being lowered, and the excellent honing flatness with less hair growth can be achieved. The method for carrying out the above crosslinking is not particularly limited. For example, it can be carried out by chemical crosslinking using an organic peroxide, sulfur, a sulfur compound or the like, radiation crosslinking by electron beam irradiation or the like. As the crosslinked polymer, a crosslinked rubber, a hardened resin, a crosslinked thermoplastic resin, a crosslinked elastomer, or the like in the above organic materials can be used. Among these, a strong acid or a strong base contained in most of the chemical mechanical honing aqueous dispersions is stable and softened by water absorption, and is preferably a crosslinked thermoplastic resin and/or a crosslinked elastomer. Further, among the crosslinked thermoplastic resin and the crosslinked elastomer, it is preferred to use an organic peroxide crosslinker to further crosslink the 1,2-polybutadiene. The content of the crosslinked polymer is not particularly limited, but is preferably 30% by volume or more, more preferably 50% by volume or more, and still more preferably 70% by volume or more. It is 1 〇〇 vol%. By making the content of the crosslinked polymer in the water-insoluble portion -27-200903614 portion at 30% by volume or more, the effect of containing the crosslinked polymer in the water-insoluble portion can be sufficiently exerted. In order to control the affinity with the water-soluble particles and the dispersibility of the water-soluble particles in the water-insoluble material, the water-insoluble material may contain a compatibilizing agent different from the above-described water-insoluble material. As the compatibilizing agent 'except for example, a polymer, a block copolymer or a random copolymer which is denatured by an acid anhydride group, a carboxyl group, a hydroxyl group, an epoxy group, an oxazoline group or an amine group, etc. Nonionic surfactants, coupling agents, and the like. The water-soluble particles in the former material may be particles which are separated from the non-water-soluble portion by contact with an aqueous medium contained in the aqueous dispersion of the chemical mechanical honing during chemical mechanical honing. The detachment may be caused by dissolution in contact with an aqueous medium, or may be caused by swelling of water or the like in an aqueous medium. The dissolution or swelling may be carried out by contact with an aqueous mixed medium containing an alcohol solvent such as methanol, if it is swellable by water. The material constituting the water-soluble particles is not particularly limited, and examples thereof include organic water-soluble particles and inorganic water-soluble particles. Examples of the material of the organic water-soluble particles include saccharides (polysaccharides such as starch, dextrin, and cyclodextrin; lactose; mannose, etc.), and cellulose (hydroxypropylcellulose, methylcellulose, etc.). , protein, polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene oxide, water-soluble photosensitive resin, sulfonated polyisoprene, sulfonated isoprene copolymer, and the like. Further, examples of the material of the inorganic water-soluble particles include calcium acetate, calcium nitrate, calcium carbonate, hydrogen carbonate -28-200903614, calcium chloride, calcium bromide, calcium phosphate, magnesium nitrate and the like. These water-soluble particles may be used singly or in combination of two or more kinds thereof. Further, 'a water-soluble particle composed of a specific material may be used, or two or more kinds of water-soluble particles composed of different materials may be used. From the viewpoint of making the hardness of the honing pad suitable, the water-soluble particles contained in the former material are preferably solid bodies. The average particle size of the water-soluble particles is preferably 0.  1~500μιη, preferably 0. 5 to 100 μιη. The pore size formed by detaching the water-soluble particles is preferably 〇_1 to 500 μmη, more preferably 0. 5~ΙΟΟμιη. By setting the average particle diameter of the water-soluble particles to the above range, it is possible to obtain a chemical mechanical honing pad which exhibits a high honing speed and is excellent in mechanical strength. The content of the water-soluble particles when the total of the water-insoluble portion and the water-soluble particles is 100% by volume is preferably from 1 to 90% by volume, more preferably from 1 to 60% by volume, still more preferably from 1 to 40% by volume. %. By setting the content of the water-soluble particles in this range, it is possible to obtain a chemical mechanical honing pad which exhibits a high honing speed and has appropriate hardness and mechanical strength. Further, the water-soluble particles are preferably dissolved or swollen by water or the like when the surface layer in the honing pad is exposed, and are not hydrated and do not swell when inside the honing pad. To this end, the water soluble particles may be provided with a casing to control at least a portion of the moisture absorption of the outermost portion. The outer shell may be physically adsorbed on the water-soluble particles, or may be chemically bonded to the water-soluble particles, or may be attached to the water-soluble particles by the two methods. As the material for forming the outer casing, for example, an epoxy resin 'polyimine, polyamine, polyphthalate, decane coupling agent -29-200903614 and the like can be cited. In this case, the water-soluble particles may be composed of water-soluble particles having a shell and water-soluble particles having no outer shell, and the water-soluble particles having the outer shell may sufficiently achieve the above effects even if the surface thereof is not completely covered by the outer shell. On the one hand, the water-insoluble material constituting the chemical mechanical honing pad having the latter water-insoluble portion and the material containing the pores dispersed in the water-insoluble portion may be, for example, a polyurethane or a melamine. Resin, polyester, poly maple, polyvinyl acetate, and the like. The pore size dispersed in the water-insoluble portions is, on average, 〇·1~500μηι, more preferably 0. 5~ΙΟΟμιη. The chemical mechanical honing pad of the present invention may optionally contain honing particles, an oxidizing agent, an alkali metal hydroxide, an acid, a pH adjuster, a surfactant, and the like in addition to the above materials. Here, in this case, it is preferred that the honing particles and the oxidizing agent are not contained. The Shore D hardness of the chemical mechanical honing pad of the present invention is preferably 30 or more, more preferably 30 to 100, still more preferably 40 to 90, particularly preferably 40 to 7 5 . By setting the Shore D hardness, the load pressure on the object to be honed can be increased, and the honing speed can be further improved, and in addition, higher honing flatness can be obtained. The method for producing the chemical mechanical honing pad of the present invention is not particularly limited, and the method for forming the groove group on the honing surface of the chemical mechanical honing pad is not particularly limited. For example, a composition for a chemical mechanical honing pad which is prepared as a subsequent chemical mechanical honing pad is prepared in advance, and after the composition is formed into a desired contour, a groove group can be formed by cutting. Alternatively, the chemical mechanical honing pad composition can be formed into a mold by using a mold having a protrusion corresponding to the shape of the groove group formed by the shape of the groove -30-200903614, and the contour and groove of the chemical mechanical honing pad can be simultaneously formed. group. After forming the profile of the pad having one of the desired groups of grooves using a mold having a projection that conforms to a portion of the groove group, the remainder of the groove group can be formed by cutting. In the case of the chemical mechanical honing pad of the present invention, in the case where the non-honed surface has grooves or grooves or other recesses, the grooves or groups of grooves or other recesses may be formed in the same manner as described above. The method of obtaining the chemical mechanical honing pad is not particularly limited. For example, it can be obtained by kneading a necessary material such as a specific organic material by a kneading machine or the like. As a kneading machine, a conventional kneading machine can be used. For example, a kneader such as a roll, a kneader, a Banbury kneader, or an extruder (single-axis, multi-axis) may be mentioned. Further, a chemical mechanical honing pad composition containing water-soluble particles for obtaining a chemical mechanical honing pad containing water-soluble particles, for example, can be obtained by kneading a water-insoluble portion and water-soluble particles and any other additives. . It is better to heat and knead as easily as it is processed during kneading. The water-soluble particles are preferably solid at the temperature at the time of kneading. By using water-soluble particles which have been previously classified into the above-mentioned preferred average particle size range, by mixing the water-soluble particles as a solid, the water-soluble particles can be made water-soluble regardless of the degree of compatibility with the water-insoluble particles. The particles are dispersed in the above preferred average particle diameter. Therefore, it is preferred to select the type of water-soluble particles depending on the processing temperature of the water-insoluble portion to be used. The chemical mechanical honing pad of the present invention may also be a multilayer honing pad provided with a support layer on the non-honing surface of the above-mentioned honing pad -31 - 200903614. The support layer is a layer that supports the chemical mechanical honing pad on the back side of the honing surface. The characteristics of the support layer are not particularly limited, and it is preferably softer than the body of the honing pad. By providing a softer support layer, even if the thickness of the honing pad body is thinned, the honing pad body can be floated during honing to prevent the surface of the honing layer from being bent, etc., and the honing can be performed. The hardness of the support layer is expressed by Shore D hardness, preferably 90% of the Shore D hardness of the lining pad body, more preferably 50 to 90%, particularly preferably 50 to 80%, of which 50 to 70% The % 〇 support layer may be either a porous body (foam) or a non-porous body. Further, the planar shape may be, for example, a circular shape or a polygonal groove, but it is preferably a planar shape having the same planar shape as the honing pad and having the same size. The thickness thereof is not particularly limited, and is preferably 0. 1~5mm, better for 〇.  5 to 2 m m 材料 The material constituting the support layer is not particularly limited, and an organic material is preferably used from the viewpoint of easily forming a specific shape and properties, imparting appropriate elasticity, and the like. As the organic material, an organic material exemplified as a material constituting the water-insoluble portion of the chemical mechanical honing pad of the present invention can be used. The chemical mechanical honing method of the present invention is characterized by chemical mechanical honing of the surface to be honed using the chemical mechanical honing pad of the present invention as described above. The chemical mechanical honing method of the present invention is carried out by a conventional method, except that the chemical mechanical honing pad of the present invention is applied to a commercially available chemical honing device. The material constituting the honed surface may be a material composed of a wiring material of the metal type - 32-200903614, a barrier metal and an insulator, and a combination thereof. The metal of the wiring material may, for example, be tungsten, aluminum, copper or an alloy containing at least one of these. Examples of the barrier metal include titanium, titanium nitride, tantalum, tantalum nitride, and the like. Examples of the insulator include, for example, SiO 2 , a small amount of boron and a borophosphonate (bpsg) added to Si 2 , and a fluorine doped with SiO 2 (referred to as fluorine-doped silicate glass). Insulators, and low-conductivity yttria-based insulators. As for the SiO 2 , for example, a thermal oxide film, PETEOS (plasma enhanced - TEOS), HDP (high density plasma enhanced - TEOS), SiO 2 prepared by thermal CVD, and the like can be cited. As for the chemical mechanical honing method to which the present invention is applied, the honed surface is preferably a honed surface composed of an insulator, a honed surface composed of an insulator and copper or a copper-containing alloy, an insulator and copper or copper. The honed surface of the alloy and the barrier metal. The chemical mechanical honing pad and the chemical mechanical honing method of the present invention will be clarified by the following examples, and even if the flow rate of the aqueous dispersion for chemical mechanical polishing is small, the honing speed is excellent and the surface is honed. The uniformity of the honing amount is also excellent. The mechanism for the development of these excellent properties is unclear 'but it is speculated that by using the specific groove design as described above, when performing chemical mechanical honing, it can simultaneously ensure the effective supply of water to the interface between the honing surface and the surface to be honed. The dispersion and the area of contact between the honing surface and the surface to be honed. Example-33-200903614 Example 1 (Manufacture of η chemical mechanical honing pad (1-1) Manufacture of honing pad profile 70 parts by volume of 1,2-polybutadiene (made of JSR) Name "JSR RB810") and 30 parts by volume of /3-cyclodextrin (manufactured by Saline Port Refined Sugar (trade name), trade name "Dicks Barre no-100" 'average particle size 20μηι), at 160 °C Under the L udar kneading. Subsequently, relative to 1 〇〇 parts by mass of 1,2-polybutadiene added to 0. 32 parts by mass (converted to pure dicumyl peroxide equivalent to 0. 128 parts by mass of PERCUMYL D40 (trade name: manufactured by Nippon Oil & Fats Co., Ltd., containing 40% by mass of dicumyl peroxide), and further kneaded at 1200 ° C to become small particles. The small particles were heated and crosslinked in a mold at 180 ° C for 1 minute to obtain a diameter of 840 mm and a thickness of 3. 0 mm shaped body. Then, by smashing the two sides of the formed body with sandpaper, each side is removed by 0. 1mm and the thickness is adjusted to 2. 8mm, the contour of the honing pad is obtained. (1-2) Formation of groove A profile of the honing pad was attached to a machine of a commercially available cutting machine to form a groove width 1 on one side (honing surface) of the formed body. 5mm, groove spacing 3. 0mm, groove depth 1 .  A concentric circular groove having a cross-sectional shape of 4 mm is used as the first groove group. Next, the groove width is formed such that each of the second groove positions is adjacent to the center of the two first grooves in the first groove of the first groove group. 5 mm, groove depth 1. A chemical mechanical honing pad was fabricated as a second groove group of 4 mm and a concentric circular groove having a rectangular cross section. In the groove of the first groove group formed here, the radius of the smallest circular -34-200903614 groove is, the radius of the largest circular groove is 505 mm, and the radius of the smallest circular groove of the groove of the second groove group is 12 mm. 'The radius of the largest circular groove is 5 0 7 mm ° The surface roughness of the inner surface of the first groove group and the second groove group is measured by "1LM21P" manufactured by Laser Tech Co., Ltd., both of which are about 7. 0μηι. (2) Evaluation of chemical mechanical honing pad (2-1) Patterning Ρ Τ Τ Ε 0 S film chemical mechanical honing test The chemical mechanical honing pad manufactured above was installed in the honing device ^ Mirra/Mesa" On the platen of the product name, manufactured by Applied Material, the wafer with the patterned PETEOS film was polished under the following conditions (a PETEOS film with a film thickness of 100 Å on the 8 吋矽 wafer) Tetraethyl phthalate (TEOS) is used as a raw material, and a plasma is used as a SiO 2 film in which a plasma is grown in a chemical vapor phase. Platen speed: 90 rpm Honing pad speed: 85 rpm Honing pressure: 2 psi Honing mechanical honing water-based dispersion: JSR (stock) "CMS 840 1", "CMS 8452" and ion-exchanged water in mass ratio 1 : 2 : 3 Mixer. Honing mechanical honing water-based dispersion supply speed: 100 ml / min honing time: 1 minute, the chemical mechanical honing aqueous dispersion used in this embodiment -35- 200903614 The flow rate is the honing device used About half of the standard flow. (2-2) Evaluation of the honing speed of the patterned PETE OS film The honed honed material is applied to each of the 8 吋 wafers with the PETEOS film, and is equally divided into 4 9 in the diameter direction except for the outer circumference of 3 mm. The point is determined as a specific point at which the honing speed of each point is calculated from the difference in thickness of the PETEOS film before and after honing and the honing time. The average of the honing speeds of these 49 points was evaluated as the result of the honing speed, which was 47. 3 nm / min. Further, the thickness of the PETEOS film at each point was measured by an optical film thickness meter. (2-3) In-plane uniformity of the honing amount of the patterned PETEOS film. The thickness difference of the PETEOS film before and after honing using the above 49 points (this nickname "honing amount") is calculated by the following formula Calculate the in-plane uniformity of the amount of honing. The in-plane uniformity of the honing amount (%) = (the standard deviation of the honing amount + the average enthalpy of the honing amount) X 1 0 0 The in-plane uniformity of the honing amount is 9. 8 %. -36- 200903614 (2-4) Scratch evaluation of patterned PETEOS film Defect inspection was performed on each chemical mechanically honed PETEOS film using a defect inspection device (manufactured by KLA-TENCOR Corporation, "KLA23 5 1"). First, 'in the full range of the wafer surface after honing' in pixel size 0. The number of defects calculated by the defect inspection device is measured under conditions of 62 μm and threshold 30. Then, randomly extracting 100 such defects are sequentially displayed and observed on the display of the device, and clarifying that the defect is scratched or attached to foreign matter (chemical mechanical honing of the abrasive particles contained in the aqueous dispersion) ), calculate the length of 100 defects in 0. The proportion of scratches above 20 microns is multiplied by the total number of defects calculated by the defect inspection device to calculate the number of scratches on all surfaces of each wafer. As a result, the number of scratches was 24 5 /surface. Examples 2 - 8 The honing pad profile was produced in the same manner as in the above-described Example 1. The honing pad profile is mounted on a machine of a commercially available cutting machine, and the first groove group and the second groove group formed as shown in Table 1 are respectively formed on one side (the honing surface) of the formed body. (The cross-sectional shapes are each rectangular), and each chemical mechanical honing pad is manufactured. Further, in each of the embodiments, the second groove of the second groove group is formed such that each of the second grooves is located in the center of the two adjacent first grooves in the first groove of each of the first groove groups. Further, in the seventh embodiment, in addition to the first groove group and the second groove group, eight radial straight grooves having the groove depth and the groove width described in Table 1 are further formed by a commercially available cutting machine (the cross section) -37- 200903614 The third groove group formed by the rectangular shape. The two grooves of the radial groove are formed at an angle of 45 degrees, and the grooves are connected to each other at the center of the honing surface at an angle of 90 degrees. The remaining four grooves are from the center to the outer circumference and retreat from the position of 1 5 111 111. . Chemical mechanical honing and evaluation of the PETEOS film similar to that of Example 1 was carried out using these chemical mechanical honing pads. In the result. Example 9 (1) Manufacture of chemical mechanical honing pad (1-1) Manufacture of honing pad profile 58 parts by mass of 4,4'-diphenylmethane diisocyanate urethane (manufactured) In the product name "Sumi Joule 44 S reactor, add 5. at 60 °C.  1 part by mass of polybutanediol having an average molecular weight of 650 having two hydroxyl groups (manufactured by the company, product name "PTMG65 0") and 17. 3 parts by mass of a polybutanediol (manufactured by Mitsubishi Chemical Corporation, PTMG25 0) having a mass of 250 was kept at 90 ° C for 2 hours while stirring, and after cooling, a terminal isocyanate-based prepolymer was obtained. The terminal ester-based prepolymer contains 21% by mass of unreacted 4,4'-diphenyl formate, and the remaining 79% by mass of isocyanate-based prepolymer 〇 80. 4 parts by mass of the above-mentioned prepared terminal isocyanate group pre-adjacent to the four honing surfaces are shown in Table 1. Ling Chemical: Average product name "The reaction isocyanate diisocyanate mixture is placed in -38- 200903614 in a stirred vessel to maintain the temperature at 90. (:, while stirring at 200 rpm, add 14. 5 parts by mass of /3-cyclodextrin (trade name "Dicks Barre - 1 0 0" made by brine port (sweet)), dispersed and dispersed after 1 hour, and bubbles are removed by decompression. A terminal isocyanate prepolymer of water soluble particles. Further, '1,4-bis(hydroxyethoxy)benzene (manufactured by Mitsui Chemical Fine Co., Ltd., trade name "BHEB") having 2 hydroxy groups at the end of 12-6 parts by mass in a stirred vessel at 12 °t After heating for 2 hours, 7 parts by mass of trimethylolpropane (manufactured by BASF Japan Co., Ltd., trade name "TMP") having 3 hydroxyl groups was added thereto with stirring, and a mixture of chain extenders was obtained by mixing and dissolving in 10 minutes. . 94. 9 parts by mass of the above-mentioned terminal isocyanate prepolymer having the water-soluble particles dispersed therein was heated and stirred at 90 ° C in an AJITER (AJITER, registered trademark, Shimadzu Corporation) mixer while being added thereto. The above-mentioned chain extender obtained by heating at 120 ° C. 6 parts by mass, mixed for 1 minute, to obtain a raw material mixture. Use with a diameter of 5 08mm and a thickness of 2. The mold of the 8 mm disc-shaped hole was filled with the above-mentioned raw material mixture in an amount sufficient to fill the void, and subjected to a polyurethane hydrolysis reaction at 110 ° C for 30 minutes to release the mold. Then, post-hardening was carried out in a gear oven (g e a r 〇 v e η ) at 110 ° C for 16 hours to obtain a diameter of 5 0 8 mm and a thickness of 2. 8 mm of a polyurethane sheet having water-soluble particles dispersed therein. The volume fraction of the water-soluble particles, that is, the volume fraction of the water-soluble particles relative to the total volume of the polyurethane substrate and the water-soluble particles -39 to 200903614, is 1% by mole relative to the entire sheet. (1 - 2 ) Formation of the groove The profile of the honing pad manufactured as described above is mounted on a machine table of a commercially available cutting machine, on the one side (honored surface) of the formed body, at the center of the honing surface A first groove group and a second groove group (each having a rectangular shape) formed as shown in Table 1 were formed on all the honing surfaces except for 30 mm, and a chemical mechanical honing pad was produced. Further, in the present embodiment, the second groove of the second groove group is formed so that each of the second groove positions is adjacent to the center of the two first grooves in the first groove of the first groove group. (2) Evaluation of chemical mechanical honing pad Chemical mechanical honing of the patterned PETEOS film was carried out in the same manner as in Example 1 using the chemical mechanical honing pad manufactured as described above, and the results are shown in Table 1. Examples 10 to 17 The honing pad profiles were separately produced in the same manner as in the above Example 1. The honing pad profile is mounted on a machine of a commercially available cutting machine, and the first groove group and the second groove group formed as shown in Table 1 are respectively formed on one side (the honing surface) of the formed body. (Each cross-sectional shape is rectangular), and each chemical mechanical honing pad is manufactured. In each of the embodiments, the second groove group is formed by equally arranging each of the two second grooves in the first groove adjacent to the first groove of each first groove group. Second ditch. Further, in the fourth embodiment, in addition to the groove group and the second groove group, the third groove formed by the commercially available cutting machine having the groove depth described in Table 1 and the eight radial cross-sectional shapes of the groove width is rectangular) group. The two grooves of the radiation are formed at an angle of 45°, and the center of the honing surface is connected to each other at an angle of 90°, and the other four grooves are separated from the outer periphery by a distance of 15 m. The chemical mechanical honing of the PETEOS film of the same manner as in Example 1 was carried out using these chemical mechanical honing pads, and evaluated. EMBODIMENT EXAMPLES 1 and 9 9 respectively, the honing pad wheel fan is manufactured in the same manner as in the above-described first embodiment, and the honing pad profile is mounted on a commercially available cutting machine by one side (honing surface) of the formed body. The first groove group and the second groove group of Table 1 are formed (each of the cross-sectional shapes is a rectangular chemical mechanical honing pad. Further, in each of the embodiments, the first grooves are adjacent to each other in the first groove. Each of the three strips forms a second groove of the second groove group. Further, in addition to the group of the first embodiment and the second group of grooves, the groove depth and the groove width described in Table 1 are obtained by a commercially available cutting machine. The third groove group formed by the eight radial straight lines in a rectangular shape. The radial groove group groove is formed at an angle of 45°, and among the four of the 90° angles, the first one is formed by a straight groove (the four grooved honing surfaces in the vicinity of the groove group) The figures in Figure 1 are listed on the machine table of Table 1, and the side of the first and second grooves of each group of grooves are formed, and the groove is formed by the groove (the section adjacent thereto is 2) The groove is connected to the center of the honing surface -41 - 200903614, and the other four grooves are started from the center of the honing surface by 15 mm from the center of the honing surface. Using these chemical mechanical honing pads, the patterns are carried out in the same manner as in the first embodiment. The chemical mechanical honing of the PETEOS film was evaluated and the results are shown in Table 1. Comparative Examples 1 and 2 The honing pad profile was separately produced in the same manner as in the above Example 1. The honing pad profile was mounted on a commercially available cutting. The machine table of the processing machine manufactures each chemical mechanical honing pad by forming a first groove group (the cross-sectional shape of which is rectangular) in Table 1 on one side (honing surface) of the formed body. In the comparative example, the second groove group is not formed. Using these chemical mechanical honing 'The same as in Example 1. The chemical mechanical patterned PETEOS film of mill WH, and the evaluation results are shown in Table 1 billion -42- 200903614 I-left Example 8 billion thousand and strict η Ο 1 * Ο ο 1- < g in Ο ^―« 00 1—Η d 14.41 502.41 〇 1 1 1 1 00 m Ό <N VO m Example 7 < 1 〇ο » _ κ ο ο S iT) ο Ι> rn ο 12.85 507.85 〇ο 00 (N Ό m OL embodiment 〇χ -ί- ΙΟ ο ο ο Τ' « ο inch · Η Ο 1 12.415 1 507.415 〇1 1 1 1 00 »—Η in ν〇OO m oo <N Example 5 inch · ψ 1 ο ο > Η ο ο s ο 寸 · inch · ο 00 oi Η 504.8 1 1 〇 1 1 1 1 in Os υ"ΐ OO Example 4 inch · w 1 ο ο ο ο ί-Η s ο ΠΊ Ο 12.85 507.85 〇1 1 1 1 o oo 00 in s CN Example 3 inch·κη cn ο — < ο ο S ο ... inch · 守 ο 12.05 506.05 « < 〇1 1 1 1 to m vo inch embodiment 2 inch · ο r~! ο ο ο κη ο 卜 · inch · 1 κη Ο 11.75 506.75 1 1 ο 1 I 1 ! inch r4 ur» ON \ό CM (N Example 1 inch · 1 ^ Ο ο ο s ο 寸 · Ο ο CN 1 < οο kn ο 1 1 1 1 OO 〇\ vn groove depth (mm) spacing (mm) groove width (mm) minimum first groove radius (mm) maximum first _ radius (mm) Surface roughness (Am) Ditch depth (mm) Groove width (mm) Minimum second groove radius (mm) Maximum second groove radius (mm) Adjacent to the second groove between the two first grooves Surface roughness (//m) Ditch depth (mm) Groove width (mm) Number of third grooves connected to other third grooves Number of honing speed (nm/min) In-plane uniformity of honing amount ( %) Number of scratches (pieces/wafer) 1Indiscriminately « Third ditch group-43- 200903614 Example 16 t— < 〇 (N ο ο r Η Ο 〆 ·—(N 〇 rn 1 < 507.3 <Ν 〇 1 ! 1 1 1—^ \〇 <N m (N m Example 15 inch · 〇 〇 r—« inch Ο Ο ο ο ιη Ο inch · (N 〇 in rn »- < 503.5 (Ν 〇 1 1 1 1 inch $ cn CM ΠΊ Γ^Ί L Example 14 P' 1 〇 r—l ο ο ιη ο 寸 o (N m 506.7 ΓνΙ 〇 T—^ ID Ο 00 inch 00 <> in 卜 iri m CN Example 13 —t 〇 od 〇 1—H ο ο g κη ο ^t w < d 13.28 505.28 <Ν ο 1 1 1 1 η 00 Os m Example 12 ο 卜 ^ \q ο ο ϊ —1 ο Γ· * rr o <N m w 1 506.7 1 CN ο 1 1 1 1 inch 〇6 m m ^sO CN Example 11 〇 p |. a ρ ο —— s IT) ο 卜: rr I-1 o 12.42 507.42 <Ν ο 1 1 1 1 r- κή κη Bu (N 〇 Ο <N ρ CN ο 寸 · s S ο I 1 1 | Ι> 卜 m 习 (N in d CO 1 H υο Κ <N OS inch ο 〇 ο KD ρ inch ro κη 00 00 ρ 1 l 1 1 卜 cn 00 series U 1 _ ο 1—^ κη ΧΓί 1 — I""·* o <N *—« δ l/Ί 1/Ί 1 -Η 1 1 1 1 Although 11 杂 111 5. City Β ε fe <" ε ε system N a m 靼 m m § 1 m <R |ii| Noisy 1θ 雔赃1 Obstruction e m5 1 1 11 1 1 City 嗽 11] c: 陌 V 濉 ν ' 'g_ V 濉濉 V V V ki Μ Μ Μ ε ε Μ Μ Μ Μ ε _^ε Μ •N (Ν ε , s. 蹯 _ , 3⁄4 ml DU 4 < 胆 I κ 锻 is 赋 Μ 变 » » » » » » » » » » » » » » » » » » » » » » » » 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏 藏

-45- 200903614 【圖式簡單說明】 圖1爲說明本發明之化學機械硏磨墊之第一溝與第11 溝關係之一例之簡略圖。 圖2爲說明本發明之化學機械硏磨墊之第一溝與第二 溝關係之一例之簡略圖。 圖3爲顯示本發明之化學機械硏磨墊實施樣態之一例 之簡略圖。 圖4爲顯示本發明之化學機械硏磨墊實施樣態之一例 之簡略圖。 圖5爲顯示本發明之化學機械硏磨墊之實施樣態之一 例之簡略圖。 圖6爲顯示本發明之化學機械硏磨墊之實施樣態之一 例之簡略圖。 【主要元件符號說明】 1 :硏磨塾 2 :同心圓溝 3 :同心圓溝 4 :直線溝 -46 --45-200903614 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of the relationship between the first groove and the eleventh groove of the chemical mechanical honing pad of the present invention. Fig. 2 is a schematic view showing an example of the relationship between the first groove and the second groove of the chemical mechanical honing pad of the present invention. Fig. 3 is a schematic view showing an example of the embodiment of the chemical mechanical honing pad of the present invention. Fig. 4 is a schematic view showing an example of the embodiment of the chemical mechanical honing pad of the present invention. Fig. 5 is a schematic view showing an example of the embodiment of the chemical mechanical honing pad of the present invention. Fig. 6 is a schematic view showing an example of the embodiment of the chemical mechanical honing pad of the present invention. [Main component symbol description] 1 : 硏 塾 2 : Concentric circular groove 3 : Concentric circular groove 4 : Straight groove -46 -

Claims (1)

200903614 十、申請專利範圍 1 · 一種化學機械硏磨墊,其係具有硏磨面以及作爲其 背面之非硏磨面者,其特徵爲上述硏磨面具有各由複數條 溝所構成之至少2組溝群而成,上述2組溝群係由下列所 構成: . (1 )與自硏磨面的中心朝向周邊部之一條假想直線 交叉之複數條第一溝所構成之第一溝群,該等複數條第一 溝彼此間不互相交叉且具有第一溝寬,以及 (2 )與自硏磨面的中心朝向周邊部之一條假想直線 交叉之複數條第二溝所構成之第二溝群,該等複數條第二 溝彼此間不互相交叉、各第二溝與上述第一溝彼此不交叉 ,且具有與上述第一溝寬不同之第二溝寬,且於該硏磨面 上互爲相鄰之兩條第一溝的間隙中各存在有一條或複數條 該第二溝。 2 .如申請專利範圍第1項之化學機械硏磨墊,其中上 述第二溝群之第二溝於在硏磨面上互爲鄰接之兩條第一溝 之間隙中係存在有一條。 3 .如申請專利範圍第2項之化學機械硏磨墊,其中上 述第一溝寬係〇.5~2.0mm’且上述第二溝寬係0.2〜0.5mm 〇 4 .如申請專利範圍第1項之化學機械硏磨墊,其中上 述第二溝群之第二溝於在硏磨面上互爲鄰接之兩條第一溝 之間隙中係存在有複數條。 5 .如申請專利範圍第4項之化學機械硏磨塾,其中上 -47- 200903614 述第二溝之第二溝寬係小於上述第一溝之第一溝寬。 6.如申請專利範圍第5項之化學機械硏磨墊’其中上 述第一溝寬係0.6〜2.〇mm,且上述第二溝寬係0.2〜0_5mm 〇 7 .如申請專利範圍第4項之化學機械硏磨墊,其中上 述第二溝之第二溝寬係大於上述第一溝之第一溝寬。 8 .如申請專利範圍第7項之化學機械硏磨墊’其中上 述第一溝寬係0.2〜0.5mm,且上述第二溝寬係〇·6~2.0mm ο 9. 一種化學機械硏磨墊,其係具有硏磨面以及作爲其 背面之非硏磨面者,其特徵爲上述硏磨面至少具有一條第 一溝以及一條第二溝,且 (1 )該第一溝係自硏磨面的中心朝向周邊部螺旋漸 漸擴大之一條螺旋狀溝且具有第一溝寬,以及 (2 )該第二溝係自硏磨面的中心朝向周邊部螺旋漸 漸擴大之一條螺旋狀溝,該第二溝與上述第一溝彼此不交 叉,且具有與上述第一溝寬不同之第二溝寬。 1 〇 ·如申請專利範圍第9項之化學機械硏磨墊,其中 上述第一溝寬係 0.5~2.〇mm,且上述第二溝寬係 0 2 〜0.5 m m 〇 1 1 · 一種化學機械硏磨方法,其特徵爲使用如申請專 利範圍第1至1 0項中任一項之化學機械硏磨墊對被硏磨 體進行化學機械硏磨者。 -48-200903614 X. Patent Application No. 1 · A chemical mechanical honing pad having a honing surface and a non-honing surface as a back surface thereof, characterized in that the honing surface has at least 2 each composed of a plurality of grooves The group of trenches is composed of the following groups: (1) a first group of grooves formed by a plurality of first grooves intersecting with an imaginary straight line from the center of the honing surface toward the peripheral portion, The plurality of first grooves do not intersect each other and have a first groove width, and (2) a second groove formed by a plurality of second grooves intersecting an imaginary straight line from a center of the honing surface toward a peripheral portion The plurality of second grooves do not intersect each other, the second grooves and the first grooves do not intersect each other, and have a second groove width different from the first groove width, and on the honing surface One or a plurality of the second grooves are respectively present in the gaps of the two first grooves adjacent to each other. 2. The chemical mechanical honing pad of claim 1, wherein the second groove of the second groove group is present in a gap between the two first grooves adjacent to each other on the honing surface. 3. The chemical mechanical honing pad according to claim 2, wherein the first groove width is 55~2.0 mm' and the second groove width is 0.2~0.5 mm 〇4. The chemical mechanical honing pad of the item, wherein the second groove of the second groove group has a plurality of strips in the gap between the two first grooves adjacent to each other on the honing surface. 5. The chemical mechanical honing tool of claim 4, wherein the second groove width of the second groove is less than the first groove width of the first groove. 6. The chemical mechanical honing pad of claim 5, wherein the first groove width is 0.6 to 2. mm, and the second groove width is 0.2 to 0 mm 5 〇 7. If the patent application is the fourth item The chemical mechanical honing pad, wherein the second groove width of the second groove is greater than the first groove width of the first groove. 8. The chemical mechanical honing pad of claim 7, wherein the first groove width is 0.2 to 0.5 mm, and the second groove width is 66 to 2.0 mm. 9. A chemical mechanical honing pad And having a honing surface and a non-honing surface as a back surface thereof, wherein the honing surface has at least one first groove and one second groove, and (1) the first groove is self-grinding surface The center of the spiral is gradually enlarged toward the peripheral portion and has a first groove width, and (2) the second groove is spirally enlarged from the center of the honing surface toward the peripheral portion, and the second groove The groove and the first groove do not intersect each other and have a second groove width different from the first groove width. 1 〇 · The chemical mechanical honing pad of claim 9 wherein the first groove width is 0.5 to 2. mm, and the second groove width is 0 2 to 0.5 mm 〇 1 1 · a chemical machine A honing method characterized by chemical mechanical honing of a honed body using a chemical mechanical honing pad as claimed in any one of claims 1 to 10. -48-
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