TW200902193A - Method of producing fine particle copper powders - Google Patents

Method of producing fine particle copper powders Download PDF

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TW200902193A
TW200902193A TW97109099A TW97109099A TW200902193A TW 200902193 A TW200902193 A TW 200902193A TW 97109099 A TW97109099 A TW 97109099A TW 97109099 A TW97109099 A TW 97109099A TW 200902193 A TW200902193 A TW 200902193A
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Taiwan
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copper
finely divided
monoethanolamine
producing
alloy powder
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TW97109099A
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Chinese (zh)
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TWI359708B (en
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Gang Zhao
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Phibro Tech Inc
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Abstract

Methods for producing finely divided copper or copper alloy powders are described, from compositions containing metal ions and an alkanolamine, preferably monoethanolamine, wherein the alkanolamine acts as a primary reducing agent. In preferred embodiments the methods for producing micron and submicron copper powder utilize precursor compositions containing copper ions in the form of submicron particles of copper carbonate, copper hydroxide, copper oxides, or any combination thereof, and utilize monoethanolamine (or optionally but less preferably hydrazine), and preferably additionally containing caustic and a reducing sugar.

Description

200902193 九、發明說明 相關申請案 本申請案對2005年4月20日提出申 請案號60/672,979及2006年1月3 1日提 時申請案號11/342,605聲請其優先權,該 內容係全部倂入本文。 【發明所屬之技術領域】 本發明關於一種合成銅金屬粉末之方 磨銅鹽至所欲之粒子大小,轉化該經磨之 銅、氧化銅或彼等之混合物,及隨後於升 一較佳體系中於苛性劑、還原糖及還原劑 可爲單乙醇胺或肼)之存在下且較佳地於 子量還原有機酸(諸如甲酸鹽)之情況下 步轉化該等氧化銅粒子爲銅粉末。藉由例 合硫酸銅粒子、還原糖、苛性劑及1.5至 並維持溫度高於約1 0 0 r (例如介於i 〇 3 3 便地以批式實施該方法。 【先前技術】 微細銅(Cu)粉末有許多用途,例如 場發射顯示器、車燈及類似者。例如,銅 導電的金屬糊狀物質,其經壓縮或可替代 ,其中該糊狀物質係用於多層被動元件( 請之美國臨時申 出申請之美國臨 等文件所揭示之 法,其係藉由濕 銅鹽爲一氧化二 高之溫度下且於 (其於另一方面 不存在氨和低分 利用還原劑進一 如於反應器中摻 2 g之單乙醇胺 ^ 1 1 〇 °c ),可方 在電漿顯示板、 粉末係經調製成 地經燒結可導電 例如多層陶瓷晶 -4- 200902193 片電容器)中。通常’微米大小之粒子係用於導電糊狀物 ,諸如例如美國專利號4,735,676、美國專利號4,997,674 及美國專利號5,011,546所描述者。當代的多層積體電路 裝置較佳地係使用例如顆粒大小介於〇 · 8微米至約0.1微 米的次微米銅粉末以例如製造積體電路上內部電極的導電 物質。 對使用於上述之導電糊狀物中的銅粉末之合成,已提 出許多不同之方法,但該等方法通常被歸類爲氣相方法或 液相方法。製造金屬粉末的慣用方法存有許多問題,諸如 因顆粒大小分佈很寬、大顆粒、低球度及難以控制之氧化 程度而造成之低產量。 該氣相方法(亦已知爲氣體原子化方法)涉及強迫高 壓惰性氣體與熔融銅以足夠的速度通過噴嘴致使液態金屬 「原子化」,該液態金屬經冷卻而產生金屬粉末。雖然該 方法係適於大量製造,但難以藉由該方法以製造具有商業 上可接受產率之奈米大小的粉末(例如直徑等於或小於 0.15微米之粒子)。爲獲得商業上可接受的產物,過大之 顆粒必須與具有較佳範圍之直徑的粒子分離。因爲粉末常 呈不規則的形狀致使該方法具難度’因此難以分離。 亦有一種氣相熱分解方法’其中含銅之鹽在金屬與陰 離子之間有弱鍵結力,且使用氣體還原劑使該含銅之鹽熱 分解並經硏磨以獲得金屬粉末。該方法提供微細金屬粉末 。然而,該金屬粉末於熱處理期間可能會燃燒’且經燃燒 之粉末需經硏磨及分類。因此’該方法之產量比液相還原 -5- 200902193 方法爲低。 在氣相蒸發方法中,藉由於惰性氣體或諸如CH4和 NH4之活性氣體中加熱以使蒸發物質蒸發,且經蒸發之氣 體係經氫氣還原並經冷凝以獲得微細金屬粉末。該方法係 用於製備粒子大小爲5 nm至數微米之金屬粉末。然而, 產量極低並因此該金屬粉末極爲昂貴。 液相還原方法係製造金屬粉末之習知化學方法。該液 相還原方法可更易於控制粉末之形狀。典型上,製備金屬 粉末之方法包含1)生成可溶之第一中間產物,2)製造不 溶之中間產物,及3 )加入還原劑。用於製備銅粉末之慣 用液相還原方法首先係藉由添加氫氧化鈉(NaOH )至硫 酸銅水溶液中以使氧化銅(氫氧化銅隨後經脫水以形成 CuO )沈澱,並隨後過濾漿泥以自液體中分離顆粒。於第 二步驟中,藉由令該CuO與葡萄糖或其他含有6個碳和醛 基之單糖反應以獲得穩定之Cu20溶液。當所生成之溶液 的顏色因Cu20之生成而轉成暗紅色時,加入甘胺酸和阿 拉伯膠以控制最終銅粉末之大小和表面形狀。隨後,加入 還原劑(典型上爲福馬林或肼)以還原Cu20而獲得銅粉 末。銅粉末之粒子大小係隨許多試劑與添加劑各別加入時 存在之條件而改變,因此難以控制該粒子大小。 美國專利案號6,87 5,25 2教示一種製造銅粉末之方法 ,該銅粉末之平均粒徑係介於不小於0 · 1微米至低於1 ·5 微米(較佳地係介於至1.2微米)。然而’利用該專 利案所描述之方法’實例顯示所得之最小粒子大小實際上 -6- 200902193 係〇 . 8微米,而利用先前技藝之方法所得之最小粒子大小 係0.6微米。於氨或銨鹽之存在下,藉由濕式還原反應將 一氧化二銅還原爲金屬銅粉末以製造銅粉末。該銅粉末之 大小係與第一步驟中所生成之氫氧化銅的大小有關且亦與 第二個還原反應中所生成之氧化銅(I)的大小有關。特 別地,令銅鹽之水溶液與鹼反應以使氫氧化銅(II )沈澱 。隨後於懸浮液中進行第一個還原步驟以將所得到之氫氧 化銅(11 )還原爲一氧化二銅。經由慣用之方式,藉由將 作爲還原劑之葡萄糖加入至所得之氫氧化銅(II )懸浮液 中以實施該第一個還原步驟,藉以將氫氧化銅(II)還原 爲一氧化二銅。較佳地係於惰性氣體及升高溫度(5 0至 90 °C )下進行該第一個還原步驟。經由將含氧氣體吹入至 該第一個還原步驟所生成之一氧化二銅懸浮液中,粒徑增 加但顆粒大小分佈範圍變窄。隨後,於該懸浮液中進行第 二個還原步驟以將所得到之一氧化二銅還原爲金屬銅’其 中藉由加入約0.01至0.1莫耳氨/莫耳銅及1.1倍化學當 量之爲將一氧化二銅還原爲金屬銅所需的水合肼以起始該 第二個還原步驟。經由該方法所製造之高密度平滑表面的 金屬粒子可使電極經低溫下燒結成孔洞少之固態燒結體。 美國專利案號6,673,134教示一種製造具有平均主軸 直徑爲4至1〇微米及成片性爲2至20的片狀銅粉末之方 法,其中該片狀銅粉末之製造係藉由將分散於水中之平均 粒徑爲3至5微米的微細銅粒子之銅漿泥導入至含有直徑 爲0.3至1.0 mm之氧化鍩珠的珠磨機中並加以硏磨,進 200902193 而使該銅粉末變平。該專利案描述習知技藝:”濕式合成 法能提供經調節之平均粒徑爲介於約〇. 2至4微米且具有 窄顆粒大小分佈之銅粉末,但涉及高成本且存有經濟上之 問題"。該專利案教示經硏磨後,”磨成粉狀之銅粉末係經 分粒器分級(且)將所欲之微細銅粉末釋出並藉由旋風器 或內部表面刮濾器加以收集(同時)將粗銅粉末再餵給至 該硏磨室並再磨成粉狀"。該方法並未提供所欲之窄顆粒 大小且亦未提供通常所欲之固體(非片狀)粒子。 美國公開專利申請案號2004022 1 685 (現已被放棄) 描述一種藉由濕式還原法製造銅粉末之方法,其包含將適 量的氫氧化鈉和肼加入至氯化銅水溶液中以最終得到粒子 大小爲0.1微米之銅粉末。第一種製造該銅粉末之方法包 括下述之步驟:(1)將氫氧化鈉加入至氯化銅水溶液中 以生成含有氧化銅和氫氧化銅之水溶液;及(2)藉由將 肼加入至該水溶液中以將該氧化銅和氫氧化銅還原爲銅粉 末,其中該組成物係維持在介於40至8 0°C之溫度下。於 可替代之方法中,於中間步驟,令所得到之CuO與已醛醣 (含有6個碳和醛基之單糖;諸如葡萄糖)反應以得到安 定之Cu20溶液。將胺基酸(例如甘胺酸)和阿拉伯膠加 入至該Cu2Ο溶液中以控制最終銅粉末之大小和表面形狀 。此公開專利申請案亦描述生成肼(胺)與可溶性銅鹽之 錯合物及隨後藉由於其中混合鹼以沈澱銅粉末。 美國專利案號5,094,686教示一種製造粉末之方法, 其包含於介於150至3 00°C之溫度下且於非氧化氣體中令 200902193 固相之無水甲酸銅熱分解,因而生成具有主要粒徑介於 0.2至1微米、比表面積介於5至0.5 m2/g及小附聚性之 微細銅粉末。200902193 IX. INSTRUCTIONS RELATED APPLICATIONS This application filed the application No. 60/672,979 on April 20, 2005 and the application number of 11/342,605 on January 31, 2006. The content is all Break into this article. TECHNICAL FIELD OF THE INVENTION The present invention relates to a square copper salt of a synthetic copper metal powder to a desired particle size, converting the ground copper, copper oxide or a mixture thereof, and subsequently to a preferred system. The copper oxide particles are converted into copper powder in the presence of a caustic, a reducing sugar and a reducing agent in the presence of monoethanolamine or hydrazine, and preferably in the form of a sub-reducing organic acid such as a formate. The method is carried out batchwise by exemplifying copper sulphate particles, reducing sugars, caustic and 1.5 to maintain a temperature above about 1000 (for example, between i 〇 3 3 ). [Prior Art] Micro-copper ( Cu) powders have many uses, such as field emission displays, lights, and the like. For example, copper conductive metal pastes that are compressed or replaceable, wherein the paste is used in multilayer passive components (please require the United States) The method disclosed in the US Provisional Application for Temporary Application is based on the fact that the wet copper salt is at a temperature of osmium oxide and on the other hand (there is no ammonia and low concentration on the other hand, the reducing agent is used in the reactor) 2 g of monoethanolamine ^ 1 1 〇 °c ) can be used in the plasma display panel, the powder is prepared into a sintered, electrically conductive, for example, a multilayer ceramic crystal-4-200902193 chip capacitor. Usually 'micron size The particles are used in a conductive paste, such as those described in, for example, U.S. Patent No. 4,735,676, U.S. Patent No. 4,997,674, and U.S. Patent No. 5,011,546. A submicron copper powder having a size of from 8 μm to about 0.1 μm is used, for example, to produce a conductive material for internal electrodes on an integrated circuit. Many differences have been made in the synthesis of copper powder used in the above-mentioned conductive paste. Methods, but such methods are generally classified as gas phase processes or liquid phase processes. Conventional methods of making metal powders have many problems, such as wide particle size distribution, large particles, low sphericity, and uncontrolled oxidation levels. The gas phase process (also known as gas atomization) involves forcing a high pressure inert gas and molten copper to "atomicize" the liquid metal through the nozzle at a sufficient velocity, and the liquid metal is cooled to produce a metal. Powder. Although the method is suitable for mass production, it is difficult to produce a nanometer-sized powder having a commercially acceptable yield (e.g., particles having a diameter of 0.15 micrometer or less) by the method. The product, the oversized particles must be separated from the particles of the preferred range, because the powder often has an irregular shape. The method is difficult 'so difficult to separate. There is also a gas phase thermal decomposition method' in which a copper-containing salt has a weak bonding force between a metal and an anion, and a gas reducing agent is used to thermally decompose the copper-containing salt and Honing to obtain a metal powder. The method provides a fine metal powder. However, the metal powder may burn during heat treatment and the burned powder needs to be honed and classified. Therefore, the yield of the method is lower than liquid phase reduction-5 - 200902193 The method is low. In the vapor phase evaporation method, the evaporation substance is evaporated by heating with an inert gas or an active gas such as CH4 and NH4, and the evaporated gas system is reduced by hydrogen and condensed to obtain a fine metal powder. This method is used to prepare metal powders having a particle size of 5 nm to several micrometers. However, the yield is extremely low and therefore the metal powder is extremely expensive. The liquid phase reduction method is a conventional chemical method for producing metal powder. This liquid phase reduction method makes it easier to control the shape of the powder. Typically, the method of preparing a metal powder comprises 1) forming a soluble first intermediate product, 2) producing an insoluble intermediate product, and 3) adding a reducing agent. A conventional liquid phase reduction method for preparing a copper powder is first carried out by adding sodium hydroxide (NaOH) to an aqueous copper sulfate solution to precipitate copper oxide (the copper hydroxide is subsequently dehydrated to form CuO), and then filtering the slurry. The particles are separated from the liquid. In the second step, a stable Cu20 solution is obtained by reacting the CuO with glucose or another monosaccharide containing 6 carbons and aldehyde groups. When the color of the resulting solution turned dark red due to the formation of Cu20, glycine and arabic gum were added to control the size and surface shape of the final copper powder. Subsequently, a reducing agent (typically, formalin or hydrazine) is added to reduce Cu20 to obtain a copper powder. The particle size of the copper powder varies depending on the conditions under which a plurality of reagents and additives are added, and thus it is difficult to control the particle size. U.S. Patent No. 6,87 5,25 2 teaches a method of making a copper powder having an average particle size of from not less than 0. 1 micron to less than 1.5 micron (preferably between 1.2 microns). However, the example described by the method described in the patent shows that the minimum particle size obtained is actually -6-200902193 〇 8 μm, and the minimum particle size obtained by the prior art method is 0.6 μm. The copper oxyhydroxide is reduced to a metallic copper powder by a wet reduction reaction in the presence of ammonia or an ammonium salt to produce a copper powder. The size of the copper powder is related to the size of the copper hydroxide formed in the first step and also to the size of the copper (I) oxide formed in the second reduction reaction. Specifically, an aqueous solution of a copper salt is reacted with a base to precipitate copper (II) hydroxide. The first reduction step is then carried out in the suspension to reduce the resulting copper oxyhydroxide (11) to copper pentoxide. This first reduction step is carried out by a conventional method by adding glucose as a reducing agent to the obtained suspension of copper (II) hydroxide, thereby reducing copper (II) hydroxide to copper pentoxide. This first reduction step is preferably carried out under an inert gas and an elevated temperature (50 to 90 °C). By blowing an oxygen-containing gas into one of the copper oxide suspensions produced by the first reduction step, the particle diameter is increased but the particle size distribution range is narrowed. Subsequently, a second reduction step is carried out in the suspension to reduce the obtained copper oxide to metal copper ' by adding about 0.01 to 0.1 mol ammonia/mole copper and 1.1 times the chemical equivalent. The bismuth oxyhydroxide is reduced to the hydrazine hydrate required for the metallic copper to initiate the second reduction step. The high-density smooth surface metal particles produced by this method allow the electrode to be sintered at a low temperature into a solid sintered body having few voids. U.S. Patent No. 6,673,134 teaches a method of producing a sheet-like copper powder having an average major axis diameter of 4 to 1 micron and a sheeting property of 2 to 20, wherein the sheet-like copper powder is produced by being dispersed in A copper slurry of fine copper particles having an average particle diameter of 3 to 5 μm in water is introduced into a bead mill containing cerium oxide beads having a diameter of 0.3 to 1.0 mm and honed to 200902193 to flatten the copper powder. . This patent describes the prior art: "The wet synthesis method provides a copper powder having an adjusted average particle size of between about 2 and 4 microns and having a narrow particle size distribution, but involves high cost and economics. The problem is that the patent teaches that after honing, "the powdered copper powder is graded by a classifier (and) to release the desired fine copper powder and by a cyclone or internal surface scraper. The blister copper powder is collected (at the same time) and fed to the honing chamber and pulverized again. This method does not provide the desired narrow particle size and does not provide the desired solid (non-flake) particles. US Published Patent Application No. 2004022 1 685 (now abandoned) describes a method of producing a copper powder by a wet reduction method comprising adding an appropriate amount of sodium hydroxide and hydrazine to an aqueous solution of copper chloride to finally obtain particles Copper powder of 0.1 micron size. The first method for producing the copper powder comprises the steps of: (1) adding sodium hydroxide to an aqueous solution of copper chloride to form an aqueous solution containing copper oxide and copper hydroxide; and (2) adding ruthenium To the aqueous solution, the copper oxide and copper hydroxide are reduced to copper powder, wherein the composition is maintained at a temperature of from 40 to 80 °C. In an alternative method, in the intermediate step, the obtained CuO is reacted with an aldose (a monosaccharide containing 6 carbons and aldehyde groups; such as glucose) to obtain a stabilized Cu20 solution. An amino acid (e.g., glycine) and gum arabic are added to the Cu2 solution to control the size and surface shape of the final copper powder. This published patent application also describes the formation of a complex of hydrazine (amine) with a soluble copper salt and subsequent precipitation of copper powder by mixing a base therein. U.S. Patent No. 5,094,686 teaches a method of making a powder comprising thermally decomposing anhydrous copper formate having a solid phase of 200,902,193 in a non-oxidizing gas at a temperature between 150 and 300 ° C, thereby producing a primary particle size. A fine copper powder having a specific aforesaid surface area of 5 to 0.5 m 2 /g and a small agglomerability of 0.2 to 1 μm.

Kimchenko, Y.I.等人於文獻 Poroshkovaya Metallurgiya, No_ 5 ( 245 ),14-19 頁(1 983 年 5 月;標 題爲”藉由甲酸銅單乙醇胺錯合物之熱分解以製備極微細 分散的銅"(Preparation of Very Finely Divided Copper By The Thermal Decomposition Of Copper Formate Monoethanolamine Complexes))中描述並比較藉由甲酸 銅之熱分解對銅-單乙醇胺甲酸根錯合物之熱分解以製造 銅粉末之方法。單乙醇胺(MEA )係生成水溶性銅錯合物 之氨的習知替代物。爲獲得溶液中高濃度之溶解錯合物, 應供應用於生成安定之銅-MEA-陰離子錯合物的陰離子, 且商業上該陰離子係碳酸根、氯離子、硝酸根、硼酸根、 檸檬酸根、硫酸根、乙酸根或類似者。低分子量有機酸( 諸如甲酸和草酸)係習知之還原劑。於該文獻中,當甲酸 銅二水合物溶於直鏈MEA中以生成起始混合物時,組成 物不包含多量之水。藉由甲酸銅二水合物(或可替代地自 草酸銅)之熱分解以生成金屬銅係爲習知。當甲酸銅分解 時,示差熱分析顯示存有二條等溫線。第一條等溫線(達 最高溫約3 80°K ( 107t ))係對應該二水合物之脫水, 而第二條等溫線(達最高溫約453°K ( 180t ))係對應 甲酸鹽之分解及金屬銅之生成。當使用銅-單乙醇胺-甲酸 鹽溶液時,示差熱分析顯示5種吸熱效應。在38CK ( -9- 200902193 1 1 1 °C )的第一條等溫線係與脫水有關,在4 0 5。Κ ( )的第二條等溫線係與丨莫耳MEA的脫離與去除;f 且在419°K ( 146°C )的第三條等溫線係與錯合物5 與金屬銅之生成(在溫度低至1391下生成)有關 之等溫線係與殘留之有機物的沸騰去除/凝結有關。 該方法係有用的,但是使用甲酸銅作爲前驅物係昂 再者’該文獻註明所生成之銅粉末因未補償之表面 的結果而含有處於不平衡狀態之晶格,其內含有巨 觀之應力。 對製備安定之銅粉末需要具成本效益之方法, 一或多種低分子量有機酸(例如甲酸根及/或草酸 )或對每個銅離子爲昂貴且不安定之還原劑(諸如 【發明內容】 發明簡述 本發明描述製備銅金屬之微米至次微米粒子( 銅粉末)之新穎方法。不同顆粒大小之銅粉末係用 之產物,且對降低該銅粉末之製造成本存有相當的 高度需要具有極窄之顆粒大小分佈的銅粉末,且具 介於0.04至0.2微米之窄顆粒大小分佈(總顆粒質 粒大小)之銅粉末(較佳地係平均粒徑介於〇.〇4 微米、0,07至0.095微米、0.1至0.15微米及0.1 微米之銅粉末)係存有其他優點。藉由窄顆粒大小 吾人測得各別樣品中90重量% (較佳地94重量今 1 3 2〇C ί關’ :分解 。其餘 雖然 貴的。 作用力 觀和微 其毋需 根離子 肼)。 統稱爲 於不同 1壓力。 有中心 =量對顆 至 0.07 5 至 0.2 '分佈, i )之銅 -10- 200902193 粉末粒子具有落入平均直徑之30% (較佳地20% )的有效 直徑。 藉由摻合氧化銅(較佳地一氧化二銅)之微米至次微 米粒子的漿泥與還原劑以生成銅粉末。該還原劑可爲單乙 醇胺及/或肼,但是單乙醇胺能提供相當之成本優勢。於 將氧化銅粒子轉化爲銅粉末之前’藉由濕磨該氧化銅粒子 可進一步精煉銅顆粒大小、顆粒大小分佈及顆粒形態。然 而,吾人已發現最終銅金屬粉末產物之最小顆粒大小係受 限於在轉化一氧化二銅爲銅粉末之最終還原步驟期間所發 生之粒子生長/附聚作用。 藉由此技藝所習知之方法(例如藉由令硫酸銅與苛性 溶液反應並隨後藉由加入葡萄糖以將該氫氧化銅漿泥轉化 爲一氧化二銅)可製備一氧化二銅。有利的是該反應係於 還原氣體或惰性氣體下進行。於本發明之一較佳體系中, 將一氧化二銅漿泥加入至含有熱(>100°C )單乙醇胺溶液 之反應器中,且於該加入之30分鐘內該單乙醇胺將作爲 還原劑以生成銅粉末。於前述之反應中,所加入之單乙醇 胺量係至少3 (較典型地係至少3 · 5 )莫耳單乙醇胺/莫耳 銅(其係約相等於g單乙醇胺/g銅)。吾人業已注意到利 用單乙醇胺進行簡單之轉化反應需要高溫及約3 0分鐘之 反應時間,且無視於起始之氧化銅的顆粒大小(其平均直 徑係粒子重量之一半的直徑大於該平均値且粒子重量之一 半的直徑小於該平均値),很難得到顆粒大小小於0. 1 5 微米之銅粉末。明顯地,令顆粒經溶解及再沉澱將會使總 -11 - 200902193 平均粒徑增加。 然而,吾人已意外地發現若於還原糖(諸如葡萄糖) 及少量苛性劑之存在下令平均直徑介於例如0.05至0.4微 米之一氧化二銅粒子進行反應,則僅需要約1 .5至2 g ( 例如1·6至2 g或1.7至1.8 g,較典型地僅1.75 g)單乙 醇胺以完全還原1 g銅。氧化銅與單乙醇胺之反應(其中 單乙醇胺係還原劑;即低分子量還原酸、肼及類似者並不 存在,且其中糖和苛性劑亦不存在)需要高於1 20°C之溫 度以達到產業上有用之反應速率。另外,該反應需費時20 至3 0分鐘以至完全。然而,於1.75 g單乙醇胺/g銅、還 原糖(諸如葡萄糖)及少量苛性劑之存在下,該次微米之 一氧化二銅的還原反應係於僅101至106°C之溫度下迅速 進行(例如於1 〇分鐘內)。其結果係於氧化銅轉化爲銅 金屬期間之顆粒生長係大大地減少,且已得到平均顆粒大 小爲0.12微米之銅粉末。 先前技藝業已建議將分散劑加入至該漿泥中。該加入 並不特別有益,因爲分散劑似乎會於該還原反應期間增加 顆粒生長。 吾人亦已發現爲避免除去微量硫酸鹽所需的多重沖洗 ,使用非硫酸銅之銅鹽作爲起始物以生成一氧化二銅係有 益的。較佳的起始物係鹼性碳酸銅,其若以大顆粒存在則 可藉由以次毫米锆石爲底質之硏磨媒質迅速地加以濕磨成 平均顆粒大小小於0.2微米。加入至鹼性碳酸銅之次毫米 顆粒的漿泥之少量氫氧化鈉及葡萄糖將會轉化該鹼性碳酸 -12- 200902193 銅爲一氧化二銅,且該一氧化二銅未殘留有硫酸鹽 殘餘鹽。 可替代地,起始物可爲經濕磨之次微米氫氧化 (12.9% Cu,0.1 1微米)。加入至氫氧化銅之次微 的漿泥之少量氫氧化鈉及葡萄糖將會轉化該氫氧化 氧化二銅,且該一氧化二銅未殘留有硫酸鹽或其他 〇 如上所述,吾人已發現若欲得到小平均顆粒大 起始該還原反應之前將少量之苛性劑加入至漿泥中 的。所加入之苛性劑量係很少(足以使pH介於1C ,較佳地介於10.5至1 1.5,例如約1 1 )。 於加入苛性劑之後,藉由簡單加入肼可將一氧 轉化爲銅粉末。該反應係於低溫下進行,且該反應 低溫下仍相當迅速(3 0分鐘至1小時)。即使如此 成之產物的顆粒大小分佈係呈兩種形態,此結果建 氧化二銅還原爲銅金屬期間藉由附聚作用所造成之 長。有益地,若起始之一氧化二銅漿泥係次至0-1 且若該反應係於例如55至80。(:(例如60至70°C 度下迅速進行,則所生成之粉末亦可爲次至0·15 末。 亦可生成大微米大小之銅粉末。藉由將含有葡 苛性劑及約1 .75 g單乙醇胺/g溶解之銅的溶液緩慢 沸騰之硫酸銅溶液並隨後經高溫蒸煮持續一段時間 生成顆粒大小爲3微米之銅粉末。 或其他 銅漿泥 米顆粒 銅爲一 殘餘鹽 小,於 係有益 ,至12 化二銅 即使於 ,所生 議於一 顆粒生 5微米 )之溫 微米粉 萄糖、 加入至 ,將可 -13- 200902193 選擇之較佳體系的描述 本發明之一較佳體系通常包括自含有銅離子(於溶液 中或呈鹽或氧化物之型式)和烷醇胺(較佳地單乙醇胺) 及可選擇地水、鹽、及/或無機鹼之組成物(其中該烷醇 胺係作爲主要之還原劑)藉由熱分解以製造微細分散銅之 方法。本發明之一較佳體系包括一種將前驅物組成物中之 乙醇胺錯合的銅離子還原爲銅金屬之方法。本發明更特別 地關於自包含或實質上由銅離子、無機陰離子、無機鹼、 單乙醇胺及可選擇地水組成之組成物製造微米和次微米銅 金屬粉末之組成物及方法。 於一方面,本發明提供一種製造微米大小至次微米大 小銅粉末之方法,其包含下述之步驟:提供前驅物組成物 ’其包含高於5重量%銅離子和高於20重量%單乙醇胺之 溶液,唯其係低於0.8莫耳之低分子量有機酸/莫耳銅離子 ;及加熱該前驅物組成物至使其中之銅離子轉化爲銅粉末 的溫度,該粉末含有大於90重量%的銅且其平均直徑係介 於約0.02微米至約5微米。本發明可包括數個較佳體系 。該還原反應係於介於90至15(TC (較佳地係介於130至 1 55 °C )之溫度下進行。較佳的是該組成物包含低於〇.4 莫耳之低分子量有機酸/莫耳銅離子。該組成物可進一步 包含低分子量有機酸與肼之總和低於0.4莫耳/莫耳銅離子 。較佳的是於該前驅物組成物中存有低於0.4莫耳之胼/莫 耳銅離子。較佳的是該前驅物組成物包含低於0 · 1莫耳之 -14- 200902193 低分子量有機酸/莫耳銅離子。最佳的是該組成物實 不含有該低分子量有機酸及/或肼。該還原反應可於 於該前驅物組成物中至少一部份之銅離子爲呈銅鹽、 化銅、氧化銅、或彼等之混合物或組合物的粒子型式 件下進行。該還原反應係於單乙醇胺對銅離子之莫耳 至少1.5 : 1下進行。該還原反應係於消耗至少丨莫 乙醇胺/生成1莫耳銅粉末下進行。所生成之銅粉末 均直徑係介於約0.2微米至約1.3微米。有利且較佳 該前驅物組成物包含高於1 2 %之銅、高於2 5 %之單乙 及高於0.2 %之抗衡離子,其中低於該抗衡離子之當 一半係低分子量有機酸。 於另一方面’本發明提供一種製造微米大小至次 大小銅粉末之方法,其包含下述之步驟:提供包含銅 和單乙醇胺之前驅物組成物,唯其單乙醇胺對銅離子 耳比係至少爲1,且每莫耳銅離子之低分子量有機酸 之總和係低於0.4莫耳;及加熱該前驅物組成物至使 之銅離子轉化爲銅粉末的溫度,該粉末含有大於90看 之銅且其平均直徑係介於約0.02微米至約5微米。 明之該方面可包括數個較佳體系。該還原反應係於未 前驅物組成物加入一般之還原劑下進行。該前驅物組 包含低於〇. 1莫耳之低分子量有機酸/莫耳溶解之銅離 較佳的是該前驅物組成物實質上不含有低分子量有機 該還原反應係於介於90至150 °C (較佳地介於1303 °C )之溫度下進行。該還原反應係於消耗至少1莫耳 質上 其中 氫氧 之條 比爲 耳單 的平 的是 醇胺 量的 微米 離子 之莫 與肼 其中 量% 本發 對該 成物 子。 酸。 155 單乙 -15- 200902193 醇胺/生成1莫耳銅粉末之還原反應下進行。 於第三方面,本發明提供一種製造微米大小至次 大小銅粉末之方法,其包含下述之步驟:提供前驅物 物’其實際上係由銅離子、單乙醇胺、無機抗衡離子 選擇地水及可選擇地還原糖所組成,其中單乙醇胺對 子之莫耳比係至少1 : 1 ;及加熱該前驅物組成物至使 之銅離子轉化爲銅粉末的溫度,該粉末含有大於90重 之銅且其平均直徑係介於約0.02微米至約5微米。 明之該方面可包括數個較佳體系。該還原反應係於未 前驅物組成物加入一般之還原劑下進行。較佳的是該 反應係於該前驅物組成物包含低於0.1莫耳之低分子 機酸/莫耳銅離子下進行。較佳的是該還原反應係於 驅物組成物實質上不含有低分子量有機酸下進行。該 反應係於介於9 0至1 5 0 °C (較佳地介於1 3 0至1 5 5 °C 溫度下進行。該還原反應係於消耗至少1莫耳單乙g 生成1莫耳銅粉末之還原反應下進行。該還原反應係 乙醇胺對銅離子之莫耳比爲至少1 .5 : 1下進行。 本發明包括一種製造微細粒子銅粉末之方法,其 由1 )提供前驅物組成物,其包含銅離子、微細分散 鹽、微細分散之一氧化二銅顆粒、或彼等之任何組合 及烷醇胺(較佳地係乙醇胺且更佳地係單乙醇胺)及 經由使該前驅物組成物熱分解以使該銅離子還原。有 是該組成物包含還原糖及足以維持pH介於10至12 佳地係介於1 0.5至1 1 . 5 )之苛性劑量.有利且較佳 微米 組成 、可 銅離 其中 量% 本發 對該 還原 量有 該刖 還原 )之 寥胺/ 於單 係藉 之銅 、以 2 ) 利的 (較 的是 200902193 該還原反應係於不含有其他還原劑(例如甲酸鹽、草酸鹽 、肼及類似者)之條件下進行。有利且較佳的是於該前驅 物組成物中經錯合或以固體存在之銅離子的還原反應係生 成微細、微米大小至次微米大小之銅金屬粒子。 起始實驗係於水溶性銅MEA碳酸鹽組成物中進行, 且該方法涉及加熱該組成物至介於約7 0 °C (其係緩慢升溫 )至最高約140至150 °C之溫度。該方法產生主要顆粒大 小介於1至2微米之均勻銅粉末。於水溶性銅MEA碳酸 鹽組成物中,水爲載體,銅爲錯合之金屬,MEA爲錯合配 位基且碳酸根爲抗衡離子。 本發明亦包括一種生成銅合金粒子之方法。該前驅物 溶液或漿泥僅需含有可形成合金之其他金屬離子,該等金 屬離子可於使銅離子還原之條件下被還原。若該前驅物溶 液係銅鹽、氫氧化銅或氧化銅之漿泥,則有益的是生成合 金之該非銅金屬應被分散於固相。通常,任何存在之非銅 金屬的量基於合金粉末產物之總重應限於數重量%或低於 數重星%。有利且較佳的是銅離子、非銅金屬離子(諸如 鎳離子)、可選擇地錫離子、可選擇地鋅離子、或彼等之 任何組合的還原反應係於不含有其他還原劑(例如甲酸鹽 '草酸鹽 '肼及類似者)之條件下進行。乙醇胺(較佳地 單乙醇胺)係作爲主要之還原劑。於某些較佳體系中,可 將葡萄糖或類似者加入至包含銅(II )離子之組成物中, 因該加入係具成本效益之製造銅(〗)離子之方法。於某 些較佳體系中’將苛性劑加入至該組成物中以幫助該還原 -17- 200902193 反應、使於該還原反應期間之粒子生長最少或該二者。於 該等較佳體系中,烷醇胺(較佳地單乙醇胺)係作爲使銅 (I)離子還原爲銅金屬之主要還原劑。 若本發明之還原方法未進行完全,則可得到包含或實 際上由氧化銅(I )、或氧化銅(I)與銅金屬之混合物所 組成的粒子。 除非特別指定,於本發明中使用之所有%係指重量% 〇 於一較佳體系(其中該前驅物組成物包含經錯合之銅 (II )離子的水溶液)中,該前驅物組成物包含至少8%之 銅(較佳地至少10%之銅且更佳地至少12%之銅)。該前 驅物組成物有利地包含至少3莫耳(較佳地介於約3.5至 約4莫耳)之單乙醇胺/莫耳待錯合之銅(II )離子。若該 前驅物組成物包含銅(I )離子,則該組成物有利地另外 包含至少1 . 5莫耳(較佳地介於約1 · 7 5至約2莫耳)之單 乙醇胺/莫耳待錯合之銅(I)離子。過多之單乙醇胺不會 有負面效應,除了該方法最終需要耗費能量以例如藉由蒸 飽將過多之單乙醇fe自反應混合物中除去。於此較佳體系 中,鎳可部分或完全取代銅,其中鎳係以莫耳對莫耳之基 礎取代銅。於另一較佳體系中,達至大約一半、但更佳地 低於四分之一且更佳地低於六分之一之銅離子莫耳數可被 其他金屬(例如鎮、鋅、錫及類似者)取代。該等混合物 可用於調製熔融溫度低於例如銅之熔融溫度的合金粉末。 於某些較佳體系(其中所有金屬離子(例如銅離子) -18- 200902193 係被錯合且係於該前驅物組成物之溶液中)中,存有介於 2.5至4莫耳之乙醇胺(較佳地單乙醇胺)/莫耳待還原爲 金屬粉末之金屬離子(例如銅)。於一可替代之較佳體系 中,本發明亦包含較佳體系,其中於前驅物組成物中達至 一半、但較佳地三分之一或低於三分之一之單乙醇胺莫耳 數係被其他能錯合水溶性組成物中之銅離子的烷醇胺(例 如二乙醇胺、三乙醇胺及/或異丙醇胺)取代。於某些較 佳體系中,較佳的是包含三乙醇胺及/或二乙醇胺以及 MEA之前驅物組成物。於某些條件下,吾人相信該等烷醇 胺之較高OH對化學式之OH的比例係有利於銅之還原。 於其他較佳體系中,該組成物實質上不含有(例如含有低 於2% )該等其他之烷醇胺,且單乙醇胺係主要之還原劑 〇 有利的是至少有1莫耳(較佳地至少1 .5莫耳)之烷 醇胺(較佳地乙醇胺且更佳地單乙醇胺)/莫耳待還原爲 金屬粉末之金屬離子。對諸如帶有1個正電荷之銅(I) 離子的金屬離子,有利的是至少有1莫耳(較佳地至少 1.5莫耳)之乙醇胺(較佳地單乙醇胺)/莫耳金屬離子。 對諸如帶有2個正電荷之銅(II)離子的金屬離子,有利 的是至少有1 · 5莫耳(較佳地2莫耳)之乙醇胺(較佳地 單乙醇胺)/莫耳金屬離子。包括用於還原銅(Π)離子爲 銅(I )離子之還原糖或其他非烷醇胺劑將會減少將金屬 離子完全轉化爲金屬粉末所需之烷醇胺量。 較佳的是該組成物係實質上不含有(例如含有低於 -19- 200902193 1 %且更佳地低於0.1 %或〇% )之氨。可替代地,該反 合物包含介於0.00 1至0.1莫耳之氨/莫耳待還原之金 例如銅)離子。 已知銅可直接溶解於乙醇胺。此溶解係極經濟, 於例如美國專利案號6,905,53 1和6,90 5,5 32中,該 利案所揭示之內容係併入本文作爲參考。藉由該等專 所描述之方法所製造的組成物包含明顯之水量。通常 係較不適存在於前驅物組成物中,其中該銅係呈可溶 合型式。咸信大部分之水係於藉由單乙醇胺將銅或鎳 於有用之速率下進行還原反應所需的溫度之前已自該 物組成物蒸餾除去。基於此理由,有利的是該組成物 低於50%水,較佳地低於35%水且更佳地低於20%水 入苛性劑和還原鹽亦可某種程度地減輕此一問題,因 較低溫度以得到產業上可接受之銅離子還原反應速率 較不適宜的是存在諸如甲酸之還原有機酸。單乙 中之甲酸將會還原銅離子爲銅金屬,但於該反應期間 度停滞區的詳細分析則顯示單乙醇胺並未參與該還原 ,至少係直至甲酸已經消耗。因此,該前驅物組成物 大多數(若非全部)的單乙醇胺並未用於銅離子之還 應,且該反應的之成本因含有昂貴但未有作用之成份 加。 可使固體銅鹽及/或氧化銅與該前驅物組成物中 醇胺接觸。然後,咸信該前驅物鹽之顆粒大小對銅離 化爲銅金屬之轉化程度會有強烈影響且亦對所生成之 應混 屬( 如述 等專 利案 ,水 之錯 離子 前驅 包含 。加 需要 〇 醇胺 之溫 反應 中之 原反 而增 之烷 子轉 銅鹽 -20- 200902193 的顆粒大小有強烈影響。然而,若所欲的是平均顆粒大小 小於〇.2微米(例如平均顆粒大小介於約〇·04至〇_07微 米之銅粉末(如下述之實施例所述)、平均顆粒大小介於 0.07至0.095微米之銅粉末或平均顆粒大小介於〇.1至 0.1 9微米之銅粉末),則於該還原反應期間藉由附聚作用 或藉由溶解/再沉澱程序或藉由該二者所造成之粒子生長 對最終之顆粒大小會有強烈影響。 如本文所使用者,粒子直徑可以”dXX"表示,其中"XX” 係直徑等於或小於該dxx之成分的重量% (或可替代地體 積%) 。d 5 0係指直徑,其中5 0重量%之該成份係直徑等 於或小於該d50之粒子,而僅低於50重量%之該成份係直 徑大於該d50之粒子。大於0.2微米之粒子直徑係較佳地 於流體中藉由史脫克(Stokes )定律之粒子沈降速度加以 測定(例如係利用 Horiba有限公司出售之LA 700型或 CAPA™ 700 或 Micromeritics 公司所製造之 SedigraphTM 5 1 00T,其係使用X射線檢測並以史脫克定律計算大小爲 基礎)至大小小至約0. 1 5微米。較小之粒子大小可藉由 動態光散射方法且較佳地利用雷射散射裝置加以測定,或 可藉由直接測量SEM相片中之代表性數量的粒子之直徑 而加以測定。對介於約0 · 0 1微米至約〇 . 1 5微米之粒子, 顆粒大小可藉由取在該大小範圍內之代表性粒子的SEM 並對粒子之代表性樣品(例如1 00個粒子至約400個粒子 )測量二個方向上的直徑(並使用其算數平均數)加以測 定’其中在該部分中之顆粒的相對重量係假設爲直徑等於 -21 - 200902193 該二次測量的直徑之算數平均數的球形顆粒之重量。 銅鹽及/或氧化銅之濕球硏磨(或等同之硏磨方法) 可藉由磨損而容易地除去大小大於1微米之粒子。顆粒之 大小分佈有利地係絕大部分之粒子(例如至少約9 5重量0/〇 、較佳地至少約9 9重量%、更佳地至少約9 9.5重量% )的 平均直徑爲低於約1微米’且有利的是該等粒子非爲單一 長維度之棒形。固體前驅物金屬鹽或氧化物於經硏磨程序 後應具有d99小於2微米,較佳地小於丨.4微米,更佳地 小於1微米;d9 8小於2微米,較佳地小於i微米,更佳 地小於〇 · 8微米;d 5 0小於0.9微米,較佳地小於〇 . 7微米 ,更佳地小於〇·5微米,例如介於約0.06至0.17微米或 介於0.1至微米。 存有許多不同之硏磨方法。較佳者係藉由砂磨機或濕 球硏磨機(其係經載入例如直徑爲約〇 . 2至約0.9 mm ( — 般爲約0.5 mm )之矽酸锆及/或氧化锆珠)進行濕硏磨, 或可替代地藉由旋轉式砂磨機(其係經載入例如直徑爲約 〇·2至約0.9 mm (—般爲約0.5 mm)之砂酸銷及/或氧化 锆珠)並於例如約1 〇〇〇 rpm之攪拌下進行濕硏磨。於本 發明之較佳體系中,金屬鹽及/或氧化物粒子有利地係於 含有硏磨介質(球)(其較佳地包含諸如矽酸锆或更佳地 氧化鉻之锆化合物)之球磨機中經濕磨。若粒子係存在於 該前驅物組成物中,則爲獲得產業上可接受之產物(於產 業上可接受之時間內經硏磨,諸如少於3 0分鐘),咸信 硏磨材料之大小係重要的且甚至係具關鍵性的。 -22- 200902193 硏磨介質不需爲一種組成或大小。再者,不是所有的 硏磨材料皆需爲較佳的材料,即具有介於0 J至〇 8 mm ( 較佳地介於0.2至0.7 mm且更佳地介於〇·3至0.6 mm) 之較佳直徑及等於或大於3.8 g/cm3 (較佳地大於或等於 5.5 g/Cm3且更佳地大於或等於6 g/cm3)之密度者。事實 上’該介質極少量(如1 0% )將提供有效之硏磨。以硏磨 機中介質之總重量爲基礎計,較佳之硏磨介質量可介於 5 %至1 0 0 %,有利地係介於丨〇 %至i 〇 〇 %,且較佳地係介於 2 5 %至9 0 % ’例如係介於約4 0 %至8 0 %。不屬該較佳範疇 之介質可稍微較大些,如直徑介於 1至4mm (較佳地介 於1至2 mm )者,且有利地亦具有等於或大於3.8 g/cm3 之密度。較佳地至少約1 0 % (較佳地約2 5 %,或至少約 3 0 %,例如介於約5 0 %至約9 9 % )之介質的平均直徑係介 於約0.1至約〇 · 8 mm (較佳地介於約0.3至約0 · 6 mm,或 介於約〇.3至約〇.5mm)。較佳之硏磨程序包括濕磨, 其一般係於硏磨機設定介於約600至約4000 rpm(例如介 於約1〇〇〇 rpm至約25 00 rpm)下進行。較快轉速提供較 短之處理時間以達到最小之產物粒子大小。通常,基於本 發明之優異處’熟習此技藝之人士當能無需過度實驗地容 易決定硏磨速度(其包括放大之產業硏磨機的速度)之選 擇。 銅(Π )前驅物組成物(諸如氫氧化銅之漿泥)可包 含至少0.5莫耳氫氧離子(較佳地介於約〇·75至2.5莫耳 氫氧離子)/莫耳銅(II)離子。然而,有利的是甚至一氧 -23- 200902193 化二銅漿泥前驅物組成物包含鹼(氫氧化物來源)。例如 ,氫氧化物來源係諸如氫氧化鈉、氫氧化錢、氫氧化鉀及 類似物,或彼等之任何混合物,或彼等之組合。可將該氫 氧化物來源以水溶液加入至溶液中或以固體加入至溶液中 並隨後溶於水中。若該銅粉末將用於微電子材料,則較佳 的是氫氧化錢或氣氧化錦。 有利的是反應組成物實質上不含有一般還原劑(例如 肼)。實質上不含有一般還原劑係意謂該前驅物組成物含 有低於約〇 · 1莫耳(較佳地低於〇 · 〇 5莫耳、更佳地低於 〇.〇1莫耳或〇莫耳)之一般還原劑/莫耳銅離子。 於其他較佳體系中,使用還原鹽和肼作爲主要之還原 劑。 於某些較佳體系中,該反應組成物實質上不含有弱主 要還原劑(例如己醛醣,諸如葡萄糖)。實質上不含有一 般還原劑係意謂該前驅物組成物含有低於約0.02莫耳( 更佳地低於0.01莫耳或〇莫耳)之弱主要還原劑/莫耳銅 離子。然而,較佳之方法使用還原糖。於溶解之前或期間 ,可選擇地於此技藝習知之將銅(II )離子轉化爲銅(I ) 離子之條件下加入某一用量之弱主要還原劑,例如通常於 溫度大於約50 °c下將一份己醛醣(諸如葡萄糖)加入至含 有一份銅和3至4份水之漿泥中即已足夠。 然而,較佳之方法使用還原糖。於其他較佳體系中, 該反應組成物包含弱主要還原劑(例如己醛醣,諸如葡萄 糖)。於藉由烷醇胺之熱分解的還原反應之前,該前驅物 -24- 200902193 組成物中通常含有約0.03至約0.4莫耳(一! 0.1莫耳)之弱主要還原劑/莫耳銅離子即足以 銅(II)離子轉化爲銅(I)離子。 未受限於理論,咸信單乙醇胺係主要負責 原成銅金屬。MEA係用於將銅(I )及/或銅( 一或二者還原成銅金屬粉末。 氧化銅(CuO,Cu20或該二者)係於單乙 (例如水溶性單乙醇胺組成物)中被還原。 於還原反應期間,銅鹽、氫氧化銅或氧化 至少部分溶解)於單乙醇胺組成物(例如水溶 組成物)中。 再於另一可替代之較佳體系中,將一或多 如可溶鹽,諸如硫酸銅、氯化銅及類似者)、 乎不溶之銅鹽(諸如碳酸銅、鹼式碳酸銅、鹼 其包括特別是三鹼式硫酸銅)、鹼式硝酸銅、 硼酸銅及鹼式硼酸銅)、或彼等之任何混合物 溶解於單乙醇胺組成物(例如水溶性單乙醇胺 以生成該前驅物組成物。可替代地,該等鹽可 後藉由加入苛性劑而以氫氧化物沉澱,且該反 爲氫氧化銅之漿泥。 大多數之前驅物組成物係包含水和過量烷 。該前驅物組成物極少被銅飽和,且通常銅! 銅可至少部分溶解於該前驅物組成物中。 該方法涉及加熱該前驅物組成物以生成反 Μ 系〇.〇4至 將大部分之 將銅離子還 II)離子之 醇胺組成物 銅可溶解( 性單乙醇胺 種銅鹽(諸 一或多種幾 式硫酸銅( 次氯酸銅、 溶解或部分 組成物)中 經溶解並隨 應組成物可 醇胺之溶液 I及/或氧化 應組成物。 -25- 200902193 典型上係令過量的水和反應之副產物汽化。通常係不欲曝 露於空氣下,雖然即使係曝露於空氣下,該方法仍可進行 ’唯其對氧之暴露係最小。參見例如美國專利案號 5,492,6 8 1,若水溶性氨化銅組成物係置於含有過量銨鹽和 氧之容器中並隨後攪拌該混合物且加熱至溫度介於約70 t: 至130 °C,可生成氧化銅粒子。該方法可於在大氣壓下、 真空下或增壓(例如介於約1至6巴之絕對壓力)下進行 。於某些較佳體系中,熱分解反應可於惰性環境下或低氧 環境下(例如於包含諸如氦氣或氮氣之一或多種惰性氣體 、水蒸氣、或包括單乙醇胺及/或有機反應副產物之有機 物的氣體環境下)進行。MEA於1大氣壓下之沸點係約 170°C。MEA之閃火點(於開放杯中)僅約93°C。因此, 不在諸如空氣之氧化環境下,該熱分解將會生成可燃燒或 爆炸之汽化副產物。消除氧即消除可燃性/爆炸混合物之 顧慮,且亦將幫助防止或延遲於新產生之銅粉末的表面上 產生氧化銅。 咸信該還原反應係於介於約9 5至1 5 0 °C (更可能地係 介於約100至14〇 t )之溫度下進行。若存有還原糖及/或 苛性劑,則於介於1 00至1 1 〇°C之溫度下可得到產業上可 接受之反應速率。若不存有該等額外之成分’則於介於 130至140。(:之溫度下可得到產業上可接受之反應速率。 可爲有利的是在增壓或減壓下進行該熱分解。若於減 壓下進行,則可於降溫下進行除去揮發物。另一方面,若 於增壓下進行,則將會省下許多用於使水和乙醇胺汽化之 -26- 200902193 能量,因爲該等成份可維持呈流體形式而未汽化。例如, 該熱分解可於包含水蒸氣、ME A蒸汽、氦氣或氮氣之一或 多者的惰性環境下且於約5巴之絕對壓力下進行,且極少 水將會被蒸發,因而當與於達到反應溫度之前自該反應混 合物蒸餾水所需之能量相比較能節省許多能量。 通常,咸信該還原反應之進行毋需水。藉由蒸餾除去 水涉及高能量成本。可爲有利的是自該前驅物組成物除去 部分水,其係藉由例如當該組成物與較易溶於水而較不溶 於乙醇之薄膜接觸時對該組成物施加壓力(逆滲透)、令 該前驅物組成物與脫水劑(諸如無水硫酸鈣及/或硫酸銅 )接觸(吸收)或電透析預處理(其中於濃縮該前驅物組 成物爲活性成分(特別是銅離子和MEA )之條件下,對與 該前驅物組成物接觸之離子交換薄膜施加電壓)。當然, 其他選擇係使用含有極少量之水或無水的Μ E A來源。 通常,該方法涉及加熱該前驅物組成物至約70至約 17〇°C (例如約90至約155t )之溫度。咸信當於約95至 150°C之溫度下反應發生,更可能的是當溫度超過1 10°C時 開始生成目視可見之銅粉末。有利的是藉由汽化自該反應 組成物除去水和反應副產物。可再利用之物質(諸如水/ 單乙醇胺蒸汽)可經凝結並重複使用。 很重要需注意的是咸信藉由單乙醇胺還原銅離子會改 變單乙醇胺之結構(可能還原1莫耳銅會消耗至少1莫耳 單乙醇胺),使得此部分之單乙醇胺不能再被利用。可能 會有未參與還原反應之單乙醇胺,此MEA可經回收並再 -27- 200902193 利用。相對地,當使用甲酸鹽或其他還原劑時’咸信大多 數或所有之MEA可經回收並再利用’因爲該MEA將未改 變其結構。 該方法有利地係於流體組成物中進行。於一較佳體系 中,該流體係經轉化爲氣懸膠且該熱轉化反應係於烘箱中 進行。所生成之銅的顆粒大小可受到導入至該烘箱中之該 前驅物組成物個別霧滴的顆粒大小所影響。該烘箱可維持 在某一溫度或該烘箱可於不同位置有不同之溫度以使反應 速率最大化並同時防止液滴破裂分開之揮發物過快汽化。 通常,該方法製造顆粒大小爲可變之高純度銅金屬粒 子(視方法條件而定),但所易於製造之顆粒大小不能小 於約0 · 1微米且不能大於約1 0微米。一般之製程條件和 輔劑可產生大小介於約〇 . 2至約1 · 5微米之球形或圓形粒 子。並非製造大顆粒大小分佈。顯然所製得之顆粒總重量 的至少80%之粒子直徑係落於平均重量粒子直徑之約50% 內。 本發明所描述者係一種合成銅金屬粉末之新穎方法, 其係藉由硏磨銅鹽至所欲之粒子大小,轉化該經硏磨之銅 鹽爲一氧化二銅(或氧化銅),及隨後藉由還原劑轉化該 一氧化二銅粒子爲銅粉末。不同之較佳體系包括下述之一 或多者:1 )添加還原糖;2 )添加表面活性劑(諸如甘胺 酸、阿拉伯膠、三仙膠及類似者),且較佳地係於銅粉末 產生之前;3 )添加表面活性劑(諸如唑),且較佳地係 於銅粉末產生之後;及4 )於將一部份經錯合之銅(II ) -28- 200902193 離子轉化爲銅(I)離子之前或其同時,將銅加入至銅-MEA前驅物組成物中以溶解另外的銅。 於本發明之一較佳體系中,藉由令銅(Π)離子曝露 於弱還原劑下(例如令銅(Π )離子曝露於還原糖(諸如 葡萄糖)下),可將銅(II)離子還原成銅(I)離子。此 時,該前驅物組成物可與另外之銅金屬、氧化銅及/或銅 鹽接觸(因銅(II)離子轉化成銅(I)離子生成與溶解該 銅所需之MEA量相比爲過量之ME A )。可替代地,該熱 分解反應可直接自將還原糖加入至該反應組成物之處進行 〇 於一較佳體系中,可將一或多種表面活性劑添加至該 反應混合物中以安定銅粉末並阻礙表面氧化。銅粉末通常 係用於產生電接點,且粒子表面上之氧化銅層可增加所得 產物失敗之機會。例示之表面活性劑包括唑及其經取代之 衍生物’特別是芳香族唑(其包括二唑、三唑及四哩), 諸如苯并三唑、甲苯基三唑、2,5-(胺基戊基)苯并咪唑 、院氧基苯并二哩’咪哩,諸如油基咪哩啉;噻哗,諸如 氫硫基苯并噻唑、1-苯基-5-氫硫基四唑;噻二唑、抗鹵哩 、及彼等之組合。在環上經氫硫基及/或胺基取代之噻二 唑及經氫硫基及/或胺基取代之三唑係有效的。抗鹵唑之 實例包括5,6-二甲基-苯并三唑、5,6_二苯基苯并三唑、5_ 苯甲醯基-苯并三唑、5 -苄基苯幷三唑及5_苯基苯并三唑 。經烷基取代之芳香族二唑(諸如甲苯基三唑)係較佳者 。唑對含銅之粉末(諸如純銅或銅合金,例如鋅銅)係特 -29- 200902193 別有用。該等化合物於顆粒上形成膜並有利地溶解於溶劑 中且與銅粒子接觸。 銅粉末之顆粒大小可於該銅粉末生成後經由硏磨而減 小。美國專利案號6,432,3 20描述一種製造用於冷凍劑之 0.05微米粉末之方法,其係藉由球磨產業上可得到之球形 1至5微米顆粒大小銅粒子。 於一重要較佳體系中,本發明包括一種製造微米大小 至次微米大小銅粉末之方法,其包含下述之步驟:1)提 供前驅物組成物,其包含或實質上係由大於5重量%銅和 大於20重量%單乙醇胺之溶液所組成;及2 )加熱該前驅 物組成物至使其中的銅單乙醇胺錯合物轉化爲銅粉末之溫 度。另一較佳體系包含1)提供前驅物組成物,其包含或 實質上係由大於5%重量銅、大於20重量%單乙醇胺及大 於0.2重量%碳酸鹽作爲二氧化碳之溶液所組成;及2 ) 加熱該前驅物組成物至使其中的銅單乙醇胺錯合物轉化爲 銅粉末之溫度。第三個重要較佳體系包含1)提供前驅物 組成物,其包含或實質上係由大於12%銅、大於25%單乙 醇胺及大於〇 . 2 %抗衡離子之溶液所組成’其中低於該抗 衡離子當量之一半係低分子量有機酸;及2)加熱該前驅 物組成物至使其中的銅單乙醇胺錯合物轉化爲銅粉末之溫 度。於上述之每個較佳體系中,有利的是該前驅物組成物 不含有或經添加一般還原劑;該前驅物組成物包含低於 0. 1莫耳低分子量有機酸/莫耳溶解之銅;該前驅物組成物 實質上係不含有低分子量有機酸(即低於〇. 1莫耳低分子 -30- 200902193 量有機酸/莫耳銅):該前驅物組成物包含至少0.5莫耳氫 氧離子/莫耳銅離子;且,有利的是加熱至約95至約150 °C (更有利地約105至約140°C )之溫度。於上述之每個 較佳體系中,有利的是至少1莫耳單乙醇胺因產生每莫耳 銅粉末之還原反應而被消耗。 【實施方式】 本發明之某些較佳體系及某些優點將藉由下述之非限 制性實施例加以說明。雖然基於簡潔與清晰之考量,本發 明僅揭示數量有限之實施例,但是熟習此技藝之人士當能 明瞭的是在未偏離本發明之目的與旨趣下可對材料及方法 進行許多修改。 實施例1 :藉由令硫酸銅與苛性劑溶液反應並隨後於 惰性氣體下藉由添加葡萄糖而將該氫氧化銅漿泥轉化爲一 氧化二銅以製備一氧化二銅。將所生成之一氧化二銅漿泥 加入至含有熱單乙醇胺溶液之反應器中。於該添加後3 0 分鐘內將一氧化二銅轉化爲銅粉末。回收該銅粉末並測定 其平均顆粒大小爲〇· 1 26微米。然而,顆粒大小分佈係呈 兩種形態,其中小部分粒子之顆粒大小分佈的中心値係該 漿泥之顆粒大小中位數的數倍。 實施例2:除了於一氧化二銅轉化爲銅粉末之前加入 少量分散劑(Ultrazine NA )之外,依照實施例1所述之 相同方法製備銅粉末。所生成之銅粉末的平均顆粒大小係 0.158微米。 -31 - 200902193 實施例3:利用次毫米錆石爲底質之硏磨媒質 酸銅漿泥至平均顆粒大小爲〇 . 1 5微米。將少量氫 加入至該漿泥中並藉由添加葡萄糖將該漿泥轉化爲 二銅。所得到之一氧化二銅的顆粒大小係約〇. 1 〇 藉由MEA將該一氧化二銅轉化爲銅,所得之銅粉 均顆粒大小係0.147微米。 實施例4 :於燒杯(500 ml )反應器中製備含 磨之氫氧化銅(38.6 g, 12.9%Cu, 0.11微米)和去 (100 g)之漿泥。藉由溶解D -葡萄糖(22 g)於 水(5 0 ml )中以製備還原溶液。經將該葡萄糖溶 至該經攪拌之碳酸銅漿泥(於氮氣下)並維持反應 於6 0至7 0 °C達1小時後,得到一氧化二銅漿泥。 應終了時,該漿泥之pH係8.2。於轉化該一氧化二 粉末之前,藉由加入50%苛性劑溶液(2.4 g )以調 氧化二銅漿泥之pH至11。於該反應起始時藉由一 肼(2.8 g, 80 %活性)並於氮氣及介於65至80° C 下且於相同之反應器中進行第二個還原反應達1小 化該一氧化二銅爲銅。藉由Microtrac測定所生成 末顆粒大小的平均顆粒大小係0.11微米。然而, 大小分佈明顯地係呈兩種形態,其中該粒子之約1 〇 的直徑係介於約0.4至1微米(中心値係約〇. 6微 該粒子之約8 7重量%的直徑係介於約0.2至0 . 〇 9 該銅粒子之掃描電子顯微照片(SEM )係示於圖1。 實施例5 :將經濕磨之鹼性碳酸銅(25 g, 濕磨碳 氧化鈉 一氧化 微米。 末的平 有經濕 離子水 去離子 液倒入 溫度介 於該反 銅爲銅 整該一 次加入 之溫度 時以轉 之銅粉 該顆粒 I重量% 米)且 微米。 2 0 % C u, -32- 200902193 0.10微米顆粒大小)和去離子水(100 g)載a 。於氮氣下攪拌該漿泥並於加入葡萄糖(22 g) 水(5 0 ml )溶液之前加熱至6 5 ° C。維持反應於5 7 5 ° C之溫度下達6小時,直至該漿泥轉變呈淡 表示次微米一氧化二銅)。於相同之反應器中, 肼(2.8 g,80%活性)將該一氧化二銅轉化爲銅 反應費時50分鐘。Microtrac分析顯示平均顆 0.04 5微米。然而,該顆粒大小分佈係呈兩種形 該粒子之約3.5重量%的直徑係約0.2微米且該 90重量%的直徑係介於約〇·3至0.12微米。 實施例6 :將已經加熱至約103至106°C之 的硫酸銅溶液載入至反應器中。將含有葡萄糖、 單乙醇胺(約1 · 7 5 g)/ g溶解之銅的溶液加入至 液中。維持溫度介於1 0 3至1 0 6。C且所生成之銅 粒大小係3微米。 實施例7至1 6 :下述表1摘錄許多實施例之 。於該等實施例中,單乙醇胺:銅離子之莫耳 1.5變化至約3.5。葡萄糖:銅之莫耳比係自約0 0.35。銅之回收通常係大於98%。 反應器中 之去離子 >於60至 黃色(其 藉由添加 。該轉化 粒大小係 態,其中 粒子之約 沸騰溫度 苛性劑及 該沸騰溶 粉末的顆 重要資料 比係自約 變化至約 -33- 200902193 表1 實施 例 MEA/Cu 莫耳比 Cu回 收率 葡萄糖/Cu 比例 陰離子 方法 直徑(微米) 7 3.5 92% 0 C〇3 CMC+AH/vac 1-2 8 3.5 98% 0 C〇3 CMC+gum+AH/vac 〜1 9 3.5 98% 0.04 C〇3 CMC+glu+AH/vac <1 10 3.5 98% 0.07 C03 CMC+glu+AH/vac <1 11 2.4 97% 0.05 co3/oh CMCH-CuC03+glu+AH/vac NM 12 2.5 98% 0 C03/OH CMC+AH/vac+CuC03/Cu(0H)2 1.3* +AH/vac 13 1.5 NM 0 SOVOH CuS04+NaOH+AH/vac 0.3-0.4 14 7.8 0.35 SOVOH CuS04+NaOH+glu+AH/vac 0.2 +MEA+AH/vac (3AGG) 15 1.5 0.34 so4 CuS〇4+NaOH+glu+MEA +AH/vac 〜0.9 16 3.5 99.6 % C03/OH CMC+AH/vac+NaOH+AH/vac 〜1(3.6AGG) *自表面積估計 實施例7 :於燒杯中且於沸騰溫度下,攪拌並加熱約 25 g銅單乙醇胺碳酸鹽(CMC )水溶液(d= 1.25 g/cc, 9.6%銅及32.5%MEA)。經該溶液整體汽化後,C M C之分 解自發地開始並產生棕色漿泥。藉由過濾使棕色粉末自該 漿泥分離。利用去離子水清洗該粉末並最終經丙酮清洗( 以下將稱爲標準方法)。經於50°C烘箱中乾燥後,藉由碘 滴定法分析該粉末中之銅。發現銅含量爲94%。 該CMC溶液含有32.5重量%MEA、9.6重量%銅、達 至約1 〇重量%二氧化碳(以碳酸鹽表示),且其餘者(例 如約5 0重量% )包含水。咸信大多數的水於該反應發生之 前業已自該CMC溶液蒸發,藉此推測該反應係於高於100 °C之溫度下以較快之速率進行。 -34- 200902193 實施例8 :將實施例7所用之相同CMC溶液(約 25 5 g)置於錐形過濾瓶(500 ml)中。攪拌該溶液並於部 分真空下(使用水泵)加熱直至組成物開始沸騰。於水( 約100至150 g )蒸發後,該反應介質中開始出現褐色粒 子。該CMC溶液之蒸發與分解持續約10分鐘直至該反應 介質轉變爲於漿泥表面上帶有某些可見之白色燻煙的褐色 漿泥。經該銅粉末與漿泥分離後,該粉末經標準之清洗與 乾燥。於該c M C前驅物組成物中約有銅(2 4 · 5 g )且回收 乾燥銅粉末(22.5 g )’回收率約92%。藉由碘滴定法發 現該粉末之銅含量爲約1 〇5%。所獲得之銅粉末的SEM照 片顯示粒子係以均勻的主要顆粒大小介於1至2微米附聚 〇 實施例9 :本實驗與實施例8類似,但於開始熱分解 反應之前令CMC ( 252 g)與RodoPo1 23 (三仙膠;〇·25 g )混合。於該c M c前驅物組成物中約有銅(2 4 _ 2 g )且回 收乾燥之銅粉末(23·9 S) ’回收率大於98 % °與實施例 8之粒子相比較’該粉末之顆粒大小略微減小(目視)° 實施例10 :本實驗與實施例8類似,但令CMC ( 250 g )與葡萄糖(2.5 g )混合以生成前驅物組成物。回收乾 燥之銅粉末(約23.3 g ) ’回收率97% °與先前批次相比 較,該粉末之顆粒大小明顯減小(目視)。 實施例1 1 :本實驗與實施例1 0類似’但使用葡萄糖 (5 g)。回收乾燥之銅粉末(約23.8 g) ’回收率約99% 。該粉末之顆粒大小些微小於實施例1 0者(目視),但 -35- 200902193 再度比實施例7至9者明顯減小。 實施例12 :本實驗與實施例1 1類似’但摻合CMC ( 251 g)、葡萄糖(5 g)及碳酸銅(22 g, 56%Cu)以生成 前驅物組成物。該組成物似乎形成溶液。因此,該前驅物 組成物含有自所加入之碳酸銅的銅(約12.3 g )及自該 CMC溶液之銅(24.1 g),共有銅(36.5 g)。回收乾燥 之銅粉末(約34.5 g),回收率94%。 實施例1 3 :秤取C M C溶液(約1 0 k g,9.5 %銅)並煮 沸直至剩下約原有體積之一半。將鹼式碳酸銅(約860 g )加入至反應器中並持續沸騰。當反應溫度達約150 °C時 ,轉化成銅粉末之反應完成。得到表面積爲0.4 7 m2/g且 顆粒大小約1 · 5微米之微細粉末(1 3 5 0 g )。 實施例14 :於燒杯中混合MEA (約340 g)與去離子 水(23 0 g )並隨後經攪拌。加入硫酸銅五水合物(CSP ; 約273 g )並令其完全溶解於MEA溶液中。隨後,加入苛 性劑溶液(477 g, 1 8% )且該燒杯中之溶液轉變爲黏稠漿 泥。加熱並蒸發該漿泥至約1 5 0 °C之沸騰溫度。經維持溫 度高於1 5 0 °C數分鐘後反應完成。將銅粒子過濾並經去離 子水清洗,隨後經丙酮(1 5 ml )最終清洗。得到某些紫 色(可能係因爲顆粒小而非表面氧化)之銅粉末。該銅粉 末含有97.7%銅並具有表面積2.11 m2/g且顆粒大小小於 0.5微米。 實施例15 :秤取CSP (約20 g)並令其溶解於去離子 水(6 0 m 1 )中。加入1 8 % N a Ο Η溶液(約3 6 g )以形成 -36- 200902193 具有良好攪拌之氫氧化銅漿泥。隨後將葡萄糖(5 g )加 入至該漿泥中。加熱該漿泥幾近至沸騰溫度。該漿泥逐漸 自藍色氫氧化銅轉變成綠色,隨後成黃色且最終呈淡粉紅 色一氧化二銅。此時,將MEA溶液(39 g, 85%)加入至 反應器中並持續加熱該漿泥並進行轉化反應。得到呈兩種 形態之顆粒大小分佈(分別爲0.2和3微米)的銅粉末。 該3微米粒子實際上係較小銅粒子之附聚。 實施例16:令CSP (約80 g)與去離子水(250 ml) 混合直至所有C S P結晶溶解。加入葡萄糖(約2 0 g )和 MEA ( 1 00 g )。加熱該溶液幾近至沸騰溫度。該溶液緩 慢轉變成黃色、紅色且隨後呈紫色漿泥。得到之銅粉末具 有表面積0.76 m2/g且顆粒大小小於1微米。 實施例1 7 :秤取c M C溶液(約3 1 7 7 g,9 · 5 %銅)並 令其蒸發直至於溶液中生成淡紅色沈澱物。隨後,將1 8 % NaOH溶液(5 1 5 g )加入至該溶液中。苛性劑與濃CMC 反應生成黏稠綠色漿泥。經該漿泥持續蒸發後,該漿泥之 顏色轉變成黃色,隨後淡紅色,且當最終轉化爲銅粒子時 呈暗紅色。該粉末經清洗及乾燥後,收集銅粉末(3 0 0 g )。藉由槌磨使該粉末去附聚後,經Micro track測定之顆 粒大小爲3.6微米。在顯微鏡下,發現每個粒子係1至3 個銅粒子黏附在一起之團聚物。 實施例18 :令硫酸鎳溶解於MEA和NaOH溶液中並 隨後加熱至沸騰溫度。目視觀察到於磁性攪拌棒上存有金 屬粉末,且在燒杯側邊上沈積金屬層,表示鎳金屬生成。 -37- 200902193 【圖式簡單說明】 所包括之附圖係提供粒子之數據和照片的進一步圖表 說明。 圖1係藉由述於實施例4之本發明的方法所製造之銅 粉末的掃描電子顯微照片。因機器顯現失焦模糊不清,故 未得到敏銳鮮明度。 圖2顯示藉由述於實施例4之本發明的方法所製造之 銅粉末的粒子大小分析之詳細資料。 圖3顯示藉由述於實施例5之本發明的方法所製造之 銅粉末的粒子大小分析之詳細資料。 圖4係藉由述於實施例5之本發明的方法所製造之銅 粉末的掃描電子顯微照片。因機器顯現失焦模糊不清,故 未得到敏銳鮮明度。 -38-Kimchenko, Y. I. Et al., in the paper Poroshkovaya Metallurgiya, No. 5 ( 245 ), pages 14-19 (May 1 983; entitled "Preparation of very finely dispersed copper by thermal decomposition of copper formate monoethanolamine complex" (Preparation A method for producing copper powder by thermal decomposition of copper-monoethanolamine formate complex by thermal decomposition of copper formate is described and compared in the Very Finely Divided Copper By The Thermal Decomposition Of Copper Formate Monoethanolamine Complexes). MEA) is a conventional substitute for the formation of ammonia in water-soluble copper complexes. To obtain a high concentration of dissolved complex in solution, an anion for the formation of a stable copper-MEA-anion complex should be supplied, and commercially The anion is a carbonate, a chloride, a nitrate, a borate, a citrate, a sulfate, an acetate or the like. Low molecular weight organic acids such as formic acid and oxalic acid are conventionally known as reducing agents. In this document, as formic acid When the copper dihydrate is dissolved in the linear MEA to form the starting mixture, the composition does not contain a significant amount of water. By copper formate dihydrate (or can be substituted It is known from the thermal decomposition of copper oxalate to form metallic copper. When copper formate is decomposed, differential thermal analysis shows the presence of two isotherms. The first isotherm (up to a maximum temperature of about 3 80 °K (107t) )) is the dehydration of the dihydrate, and the second isotherm (at the highest temperature of about 453 °K (180t)) corresponds to the decomposition of formate and the formation of metallic copper. When copper-monoethanolamine is used - For the formate brine, differential thermal analysis showed five endothermic effects. The first isotherm at 38CK ( -9- 200902193 1 1 1 °C) was related to dehydration at 405. Separation and removal of two isotherms from the MEA; f and the formation of a third isotherm and complex 5 with metallic copper at 419 °K (146 °C) (at low temperatures) The isotherms associated with the formation of 1391 are related to the boiling removal/coagulation of residual organic matter. This method is useful, but the use of copper formate as a precursor is also repeated. 'This document states that the copper powder produced is not compensated. As a result of the surface, it contains a lattice in an unbalanced state, which contains a giant stress. Powders require a cost effective method, one or more low molecular weight organic acids (such as formate and / or oxalic acid) or a reducing agent that is expensive and unstable for each copper ion (such as [invention]] A novel method for preparing micron to submicron particles (copper powder) of copper metal. A product of copper powder of different particle sizes, and there is a considerable need to reduce the manufacturing cost of the copper powder to have a very narrow particle size distribution. Copper powder with a value of 0. 04 to 0. 2 micron narrow particle size distribution (total granule size) of copper powder (preferably having an average particle size of 〇. 〇 4 microns, 0, 07 to 0. 095 micron, 0. 1 to 0. 15 microns and 0. 1 micron copper powder) has other advantages. By narrow particle size, we measured 90% by weight of each sample (preferably 94 weights today 1 3 2〇C ίOff': decomposition. The rest is expensive. The force and the micro-energy need . Collectively referred to as different 1 pressures. There is a center = quantity pair to 0. 07 5 to 0. 2 'Distribution, i) Copper -10- 200902193 The powder particles have an effective diameter falling within 30% (preferably 20%) of the average diameter. The copper powder is formed by blending a slurry of micron to submicron particles of copper oxide (preferably copper pentoxide) with a reducing agent. The reducing agent can be monoethanolamine and/or hydrazine, but monoethanolamine provides a substantial cost advantage. The copper particle size, particle size distribution and particle morphology can be further refined by wet milling the copper oxide particles prior to converting the copper oxide particles to copper powder. However, it has been found that the minimum particle size of the final copper metal powder product is limited to particle growth/agglomeration that occurs during the final reduction step of converting copper pentoxide to copper powder. The copper pentoxide can be prepared by a method known in the art (for example, by reacting copper sulfate with a caustic solution and then converting the copper hydroxide slurry to copper oxychloride by adding glucose). Advantageously, the reaction is carried out under a reducing gas or an inert gas. In a preferred system of the invention, the copper oxide slurry is added to a reactor containing a hot (>100 ° C) monoethanolamine solution, and the monoethanolamine is used as a reduction within 30 minutes of the addition. The agent is used to form a copper powder. In the foregoing reaction, the amount of monoethanolamine added is at least 3 (typically at least 3 · 5 ) molyl monoethanolamine / moor copper (which is about equivalent to g monoethanolamine / g copper). We have noticed that a simple conversion reaction using monoethanolamine requires a high temperature and a reaction time of about 30 minutes, and ignores the particle size of the starting copper oxide (the average diameter of which is one-half the diameter of the particle weight is larger than the average The diameter of one-half of the weight of the particles is smaller than the average 値), and it is difficult to obtain a particle size smaller than 0.  1 5 micron copper powder. Obviously, the dissolution and reprecipitation of the particles will increase the average particle size of the total -11 - 200902193. However, we have surprisingly found that if the presence of reducing sugars (such as glucose) and a small amount of caustic agent, the average diameter is between, for example, zero. 05 to 0. The reaction of one of the 4 micrometers of copper oxide particles requires only about one. 5 to 2 g (for example, 1·6 to 2 g or 1. 7 to 1. 8 g, typically only 1. 75 g) monoethanolamine to completely reduce 1 g of copper. The reaction of copper oxide with monoethanolamine (in which the monoethanolamine-based reducing agent; that is, the low molecular weight reducing acid, hydrazine and the like are not present, and the sugar and caustic are also absent) requires a temperature higher than 1 20 ° C to reach Industrially useful reaction rates. In addition, the reaction takes from 20 to 30 minutes to complete. However, at 1. In the presence of 75 g of monoethanolamine/g of copper, reducing sugars (such as glucose) and a small amount of caustic, the reduction of one of the micron-sized cuprous oxides is carried out rapidly at a temperature of only 101 to 106 ° C (for example, at 1). Within minutes). As a result, the particle growth system during the conversion of copper oxide to copper metal is greatly reduced, and the average particle size has been obtained as 0. 12 micron copper powder. Previous attempts have been made to add dispersants to the slurry. This addition is not particularly beneficial because the dispersant appears to increase particle growth during the reduction reaction. It has also been found that in order to avoid the multiple flushing required to remove traces of sulfate, it is advantageous to use a copper salt of non-copper sulfate as a starting material to form a cuprous oxide system. The preferred starting material is basic copper carbonate, which if it is present as a large particle, can be rapidly wet-milled by a honing medium having a sub-millimeter zircon substrate to an average particle size of less than 0. 2 microns. A small amount of sodium hydroxide and glucose added to the slurry of the sub-millimeter particles of alkaline copper carbonate will convert the basic carbonic acid-12-200902193 copper into copper oxide, and the residual copper sulfate has no residual sulfate residue. salt. Alternatively, the starting material may be a wet micronized submicron hydroxide (12. 9% Cu, 0. 1 1 micron). A small amount of sodium hydroxide and glucose added to the submicron slurry of copper hydroxide will convert the copper oxyhydroxide, and the copper oxydioxide does not have sulfate or other hydrazine remaining. As described above, we have found To obtain a small average particle size, a small amount of caustic is added to the slurry before the reduction reaction. The amount of caustic added is small (sufficient to bring the pH between 1 C, preferably between 10. 5 to 1 1. 5, for example about 1 1 ). After the addition of the caustic, the oxygen can be converted to copper powder by simply adding hydrazine. The reaction is carried out at a low temperature, and the reaction is still quite rapid at a low temperature (30 minutes to 1 hour). Even though the particle size distribution of the resulting product is in two forms, this result is due to the agglomeration caused by the reduction of cuprous oxide to copper metal. Beneficially, if one of the starting copper oxide muds is down to 0-1 and if the reaction is for example 55 to 80. (: (for example, at 60 to 70 ° C, the resulting powder may be as low as 0.15. It is also possible to produce copper powder of a large micron size. By containing a caustic agent and about 1. A solution of 75 g of monoethanolamine/g of dissolved copper was slowly boiled in a copper sulfate solution and then subjected to high temperature cooking for a period of time to form a copper powder having a particle size of 3 μm. Or other copper mud rice granules copper is a small residual salt, which is beneficial to the system. Even if it is 12 bismuth copper, it is considered to be a micron powder of 5 micrometers. - 200902193 Description of the preferred system of choice A preferred system of the invention typically comprises self-contained copper ions (in solution or in the form of a salt or oxide) and an alkanolamine (preferably monoethanolamine) and optionally A method of producing finely dispersed copper by thermal decomposition of a composition of water, a salt, and/or an inorganic base (wherein the alkanolamine is used as a main reducing agent). A preferred system of the invention comprises a method of reducing copper ions mismatched by ethanolamine in the precursor composition to copper metal. More particularly, the present invention relates to compositions and methods for making micron and submicron copper metal powders from compositions comprising or consisting essentially of copper ions, inorganic anions, inorganic bases, monoethanolamine, and optionally water. In one aspect, the invention provides a method of making a micron to submicron size copper powder comprising the steps of providing a precursor composition comprising more than 5% by weight copper ions and greater than 20% by weight monoethanolamine The solution, only below 0. 8 mole of low molecular weight organic acid/mole copper ion; and heating the precursor composition to a temperature at which copper ions are converted into copper powder, the powder containing more than 90% by weight of copper and having an average diameter of About 0. 02 microns to about 5 microns. The invention may include several preferred systems. The reduction reaction is carried out at a temperature of from 90 to 15 (TC, preferably from 130 to 1 55 ° C.) Preferably, the composition contains less than 〇. 4 Moer's low molecular weight organic acid / Mo Er copper ion. The composition may further comprise a total of low molecular weight organic acid and lanthanum less than 0. 4 mol / Mo Er copper ion. Preferably, less than 0 is present in the precursor composition. 4 Mo's 胼 / Mo Er copper ion. Preferably, the precursor composition comprises less than 0. 1 mole of -14-200902193 low molecular weight organic acid/mole copper ion. Most preferably, the composition does not contain the low molecular weight organic acid and/or hydrazine. The reduction reaction can be carried out under the particle form of at least a portion of the copper ion of the precursor composition being a copper salt, copper, copper oxide, or a mixture or composition thereof. The reduction reaction is based on monoethanolamine to copper ions at least 1. 5: 1 is carried out. The reduction is carried out by consuming at least 丨moethanolamine/forming 1 mole of copper powder. The copper powder produced has a mean diameter of about 0. 2 microns to about 1. 3 microns. Advantageously and preferably the precursor composition comprises more than 12% copper, more than 25% single B and above 0. 2% of the counter ion, wherein less than half of the counter ion is a low molecular weight organic acid. In another aspect, the invention provides a method of making a micron-sized to sub-sized copper powder comprising the steps of providing a precursor composition comprising copper and a monoethanolamine, the monoethanolamine to copper ion ratio system being at least Is 1, and the total of low molecular weight organic acids per mole of copper ions is less than 0. 4mol; and heating the precursor composition to a temperature at which the copper ions are converted to copper powder, the powder containing more than 90% of the copper and having an average diameter of about 0. 02 microns to about 5 microns. This aspect may include several preferred systems. The reduction is carried out by adding the precursor composition to a general reducing agent. The precursor group contains less than 〇.  Preferably, the precursor composition is substantially free of low molecular weight organic compounds. The reduction reaction is between 90 and 150 ° C (preferably between 1303). °C) at the temperature. The reduction reaction is based on the consumption of at least 1 mole of which the ratio of the hydroxide to the ear is flat, the amount of the alkanolamine, and the amount of the micron ion, which is the amount of the product. acid. 155 Monoethyl -15- 200902193 Alcoholamine / produced 1 mole of copper powder under the reduction reaction. In a third aspect, the present invention provides a method of making a micron to sub-sized copper powder comprising the steps of: providing a precursor material which is actually selected from copper ions, monoethanolamine, inorganic counter ions, and Optionally consisting of a reducing sugar composition wherein the monoethanolamine pair has a molar ratio of at least 1:1; and heating the precursor composition to a temperature at which the copper ion is converted to copper powder, the powder comprising greater than 90 weight copper And its average diameter is about 0. 02 microns to about 5 microns. This aspect may include several preferred systems. The reduction is carried out by adding the precursor composition to a general reducing agent. Preferably, the reaction is based on the precursor composition comprising less than zero. 1 Moule's low molecular weight is carried out under machine acid/mole copper ions. Preferably, the reduction is carried out under conditions in which the precursor composition is substantially free of low molecular weight organic acids. The reaction is carried out at a temperature of from 90 to 150 ° C (preferably at a temperature of from 1 30 to 15 5 ° C. The reduction reaction is carried out by consuming at least 1 mol of single g to form 1 mol. The reduction reaction of the copper powder is carried out. The reduction reaction is at least 1 molar ratio of ethanolamine to copper ion. 5: 1 is carried out. The present invention comprises a method of producing a fine particle copper powder, which comprises 1) providing a precursor composition comprising copper ions, finely divided salts, finely dispersed one of copper oxide particles, or any combination thereof and an alkanolamine (preferably ethanolamine and more preferably monoethanolamine) and the copper ion is reduced by thermally decomposing the precursor composition. Yes, the composition contains reducing sugars and is sufficient to maintain a pH between 10 and 12. 5 to 1 1 .  5) The caustic dose. An advantageous and preferred micron composition, the amount of copper which is from the middle of the reduction, the reduction of the reduction amount of the indole amine / in the single-system copper, 2) (more than 200,902,193) It is carried out under conditions which do not contain other reducing agents (for example, formate, oxalate, hydrazine and the like). It is advantageous and preferred to reduce the copper ions which are mis-synthesized or present in solid form in the precursor composition. The reaction system produces fine, micron to submicron copper metal particles. The initial experiment is carried out in a water soluble copper MEA carbonate composition, and the method involves heating the composition to about 70 ° C (which The temperature is slowly increased to a temperature of up to about 140 to 150 ° C. This method produces a uniform copper powder having a primary particle size of 1 to 2 μm. In the water-soluble copper MEA carbonate composition, water is the carrier and copper is the wrong a metal, MEA is a mismatched ligand and carbonate is a counter ion. The invention also includes a method of forming copper alloy particles. The precursor solution or slurry only needs to contain other metal ions capable of forming an alloy, such metal The precursor may be reduced under conditions for reducing copper ions. If the precursor solution is a slurry of copper salt, copper hydroxide or copper oxide, it is beneficial that the non-copper metal forming the alloy is dispersed in the solid phase. The amount of any non-copper metal present is limited to a few percent by weight or less than the total weight of the alloy powder product. Advantageously and preferably copper ions, non-copper metal ions (such as nickel ions), optional The reduction reaction of the tin ion, optionally the zinc ion, or any combination thereof, is carried out under conditions which do not contain other reducing agents such as formate 'oxalate' and the like. Ethanolamine (preferably) Monoethanolamine is used as the main reducing agent. In some preferred systems, glucose or the like can be added to the composition containing copper (II) ions, because of the cost-effective manufacturing of copper (〗 Method of ionizing. In some preferred systems, a caustic agent is added to the composition to aid in the reduction of the reaction -17-200902193, to minimize particle growth during the reduction reaction, or both. In a preferred system, an alkanolamine (preferably monoethanolamine) serves as the primary reducing agent for the reduction of copper (I) ions to copper metal. If the reduction process of the present invention is not carried out completely, it may be obtained or actually oxidized. Copper (I), or a mixture of copper (I) and copper metal. Unless otherwise specified, all % used in the present invention means % by weight of a preferred system (wherein the precursor composition) In an aqueous solution comprising a misaligned copper (II) ion, the precursor composition comprises at least 8% copper (preferably at least 10% copper and more preferably at least 12% copper). The article advantageously comprises at least 3 moles (preferably between about 3. 5 to about 4 moles of monoethanolamine per mole of copper (II) ions to be misaligned. If the precursor composition comprises copper (I) ions, the composition advantageously additionally comprises at least one.  5 moles (preferably between about 1 · 7 5 and about 2 moles) of monoethanolamine / mole of copper (I) ions to be misaligned. Excessive monoethanolamine does not have a negative effect, except that the process ultimately requires energy to remove excess monoethanol fe from the reaction mixture, e.g., by evaporation. In this preferred system, nickel may partially or completely replace copper, with nickel replacing copper with a molar to molar basis. In another preferred system, up to about half, but more preferably less than a quarter and more preferably less than one-sixth of the copper ion mole number can be used by other metals (eg, town, zinc, tin And similar) replaced. These mixtures can be used to prepare alloy powders having a melting temperature lower than, for example, the melting temperature of copper. In some preferred systems in which all metal ions (e.g., copper ions) -18-200902193 are mismatched and in solution to the precursor composition, there is a 2. 5 to 4 moles of ethanolamine (preferably monoethanolamine) / moles of metal ions (e.g., copper) to be reduced to metal powder. In an alternative preferred embodiment, the invention also encompasses a preferred system wherein up to one half, but preferably one third or less than one third of the monoethanolamine molars in the precursor composition It is substituted with other alkanolamines (eg, diethanolamine, triethanolamine, and/or isopropanolamine) that are capable of interfering with the copper ions in the water soluble composition. In some preferred systems, it is preferred to include triethanolamine and/or diethanolamine and a precursor composition of MEA. Under certain conditions, we believe that the higher OH ratio of the alkanolamines to the OH of the formula is advantageous for the reduction of copper. In other preferred systems, the composition is substantially free of (e.g., contains less than 2%) such other alkanolamines, and the monoethanolamine-based major reducing agent is advantageously at least 1 mole (preferably At least 1 . 5 moles of alkanolamine (preferably ethanolamine and more preferably monoethanolamine) / moles of metal ions to be reduced to metal powder. For a metal ion such as a copper (I) ion having a positive charge, it is advantageous to have at least 1 mole (preferably at least 1. 5 moles of ethanolamine (preferably monoethanolamine) / mole metal ion. For metal ions such as copper (II) ions having two positive charges, it is advantageous to have at least 1.5 moles (preferably 2 moles) of ethanolamine (preferably monoethanolamine) / mole metal ions . Reducing sugars or other non-alkanolamines, which are used to reduce copper (I) ions to copper (I) ions, will reduce the amount of alkanolamine required to completely convert the metal ions to metal powder. Preferably, the composition is substantially free of (e.g., contains less than -19 - 200902193 1% and more preferably less than 0. 1% or 〇%) of ammonia. Alternatively, the reaction comprises between 0. 00 1 to 0. 1 mole of ammonia / mole of gold to be reduced, such as copper) ions. Copper is known to be directly soluble in ethanolamine. This dissolution is extremely economical, and is disclosed, for example, in U.S. Patent Nos. 6,905,53, and 6,90 5,5, the disclosure of each of each of each of The compositions made by the methods described in these patents contain significant amounts of water. It is generally less suitable to be present in the precursor composition, wherein the copper system is in a soluble form. Most of the water is distilled from the composition prior to the temperature required to carry out the reduction reaction of copper or nickel at a useful rate by monoethanolamine. For this reason, it is advantageous that the composition is less than 50% water, preferably less than 35% water and more preferably less than 20% water. The caustic and reducing salts may also alleviate this problem to some extent. The lower temperature to obtain an industrially acceptable rate of copper ion reduction reaction is less desirable for the presence of reduced organic acids such as formic acid. The formic acid in monoethyl will reduce the copper ion to copper metal, but a detailed analysis of the stagnation zone during the reaction showed that monoethanolamine did not participate in the reduction, at least until the formic acid had been consumed. Therefore, most, if not all, of the monoethanolamine of the precursor composition is not used for copper ions, and the cost of the reaction is due to the inclusion of expensive but unaffected components. The solid copper salt and/or copper oxide can be contacted with an alcohol amine in the precursor composition. Then, it is believed that the particle size of the precursor salt has a strong influence on the degree of copper ionization to copper metal conversion and also on the generated mixture (as described in the patent case, the water mision precursor is included. The original reaction in the warm reaction of sterolamine has a strong effect on the particle size of the alkane-transferred copper salt-20-200902193. However, if desired, the average particle size is less than 〇. 2 microns (e.g., copper powder having an average particle size between about 〇·04 and 〇_07 microns (as described in the Examples below), with an average particle size of 0. 07 to 0. 095 micron copper powder or average particle size is between 〇. 1 to 0. The 1 9 micron copper powder) has a strong influence on the final particle size by agglomeration or by the dissolution/reprecipitation procedure or by particle growth caused by the two during the reduction reaction. As used herein, the particle diameter can be expressed as "dXX", where "XX" is a weight percent equal to or less than the weight percent of the component of the dxx (or alternatively, the volume %). d 5 0 means the diameter, wherein 50% by weight of the component is a particle having a diameter equal to or smaller than the d50, and only less than 50% by weight of the component is a particle having a diameter larger than the d50. Greater than 0. The 2 micron particle diameter is preferably determined in the fluid by the particle settling velocity of Stokes's law (for example, using the LA 700 model sold by Horiba Ltd. or the CAPATM 700 or the SedigraphTM manufactured by Micromeritics). 5 1 00T, which uses X-ray detection and is based on the calculation of Shrek's law) to a size as small as about 0.  1 5 microns. The smaller particle size can be determined by dynamic light scattering methods and preferably by means of a laser scattering device, or can be determined by directly measuring the diameter of a representative number of particles in the SEM print. Between about 0 · 0 1 micron to about 〇.  1 5 micron particles, the particle size can be measured by SEM of representative particles in the size range and the diameter of the representative sample (for example, 100 particles to about 400 particles) is measured in two directions ( And using its arithmetic mean) to determine 'the relative weight of the particles in this portion is assumed to be the weight of the spherical particles of the diameter of the second measured diameter equal to the average of the diameter of the second measured diameter - 21 - 200902193. Wet ball honing of copper salts and/or copper oxide (or equivalent honing method) particles which are larger than 1 micron in size can be easily removed by abrasion. The size distribution of the particles is advantageously a majority of the particles (e.g., at least about 95 weight 0 / Torr, preferably at least about 99 9% by weight, more preferably at least about 9 9. The average diameter of 5% by weight) is less than about 1 micron' and it is advantageous that the particles are not rod-shaped in a single long dimension. The solid precursor metal salt or oxide should have a d99 of less than 2 microns, preferably less than 丨 after the honing procedure. 4 microns, more preferably less than 1 micron; d9 8 is less than 2 microns, preferably less than i microns, more preferably less than 〇 8 microns; d 5 0 is less than 0. 9 microns, preferably less than 〇.  7 microns, more preferably less than 〇·5 microns, for example between about 0. 06 to 0. 17 microns or between 0. 1 to micron. There are many different ways of honing. Preferably, it is by a sand mill or a wet ball honing machine (which is loaded, for example, by a diameter of about 〇.  2 to about 0. 9 mm (usually about 0. 5 mm) of zirconium silicate and/or zirconia beads are subjected to wet honing, or alternatively by a rotary sand mill (which is loaded, for example, having a diameter of from about 〇·2 to about 0. 9 mm (typically about 0. 5 mm) of sour pin and/or zirconia beads are wet honed at a stirring of, for example, about 1 rpm. In a preferred embodiment of the invention, the metal salt and/or oxide particles are advantageously tied to a ball mill comprising a honing medium (sphere) which preferably comprises a zirconium compound such as zirconium silicate or more preferably chromium oxide. Medium wet grinding. If the particle system is present in the precursor composition, the size of the salt honing material is important in order to obtain an industrially acceptable product (honed in an industrially acceptable time, such as less than 30 minutes). And even critical. -22- 200902193 The honing medium does not need to be a composition or size. Furthermore, not all honing materials need to be preferred materials, i.e. having a range from 0 J to 〇 8 mm (preferably between 0. 2 to 0. 7 mm and more preferably between 〇·3 and 0. 6 mm) preferred diameter and equal to or greater than 3. 8 g/cm3 (preferably greater than or equal to 5. A density of 5 g/cm 3 and more preferably greater than or equal to 6 g/cm 3 ). In fact, a very small amount of the medium (such as 10%) will provide effective honing. Preferably, the amount of honing medium can be between 5% and 100%, based on the total weight of the medium in the honing machine, advantageously between 丨〇% and i 〇〇%, and preferably Between 2 5 % and 90 % ', for example, between about 40% and 80%. Media which are not in this preferred category may be somewhat larger, such as those having a diameter between 1 and 4 mm, preferably between 1 and 2 mm, and advantageously also equal to or greater than 3. Density of 8 g/cm3. Preferably, at least about 10% (preferably about 25%, or at least about 30%, such as from about 50% to about 99%) of the media has an average diameter of about 0. 1 to about 〇 · 8 mm (preferably between about 0. 3 to about 0 · 6 mm, or between about 〇. 3 to about 〇. 5mm). A preferred honing procedure includes wet milling, which is typically carried out at a honing machine setting of from about 600 to about 4000 rpm (e.g., from about 1 rpm to about 255 rpm). Faster speeds provide shorter processing times to achieve minimum product particle size. In general, a person skilled in the art based on the present invention can easily determine the honing speed (which includes the speed of the magnified industrial honing machine) without undue experimentation. The copper (Π) precursor composition (such as copper hydroxide slurry) may contain at least 0. 5 molar hydrogen oxide ions (preferably between about 〇·75 and 2. 5 moles of hydroxide ions/molar copper (II) ions. However, it is advantageous that even the oxygen--23-200902193 bismuth copper mud precursor composition contains a base (hydroxide source). For example, the hydroxide source is such as sodium hydroxide, hydrogen peroxide, potassium hydroxide, and the like, or any mixture thereof, or a combination thereof. The source of the hydroxide can be added to the solution as an aqueous solution or added to the solution as a solid and then dissolved in water. If the copper powder is to be used in a microelectronic material, it is preferably a hydrogen peroxide or a gas oxidized bromine. Advantageously, the reaction composition is substantially free of typical reducing agents (e.g., hydrazine). Substantially free of a general reducing agent means that the precursor composition contains less than about 1 mole per mole (preferably less than 〇 · 〇 5 moles, more preferably less than 〇. 〇 1 Mo or 〇 Mo) General Reducing Agent / Mo Er Copper Ion. In other preferred systems, reducing salts and hydrazine are used as the primary reducing agents. In certain preferred systems, the reaction composition is substantially free of weak primary reducing agents (e.g., aldohexose, such as glucose). Substantially free of a conventional reducing agent means that the precursor composition contains less than about 0. 02 mole (more preferably less than 0. 01 Moer or 〇 Mo ear) weak main reducing agent / Mo Er copper ion. However, the preferred method uses reducing sugars. Optionally, prior to or during dissolution, a certain amount of a weak primary reducing agent is added under conditions such as conversion of copper (II) ions to copper (I) ions, such as typically at temperatures greater than about 50 ° C. It is sufficient to add a part of an aldohexose (such as glucose) to a slurry containing one part of copper and 3 to 4 parts of water. However, the preferred method uses reducing sugars. In other preferred systems, the reaction composition comprises a weak primary reducing agent (e.g., an aldohexose such as glucose). Before the reduction reaction by thermal decomposition of the alkanolamine, the precursor -24-200902193 composition usually contains about 0. 03 to about 0. 4 Moer (one! 0. The weak main reducing agent/mole copper ion of 1 mole is sufficient to convert copper (II) ions into copper (I) ions. Unrestricted by theory, Xianxin monoethanolamine is mainly responsible for the original copper metal. MEA is used to reduce copper (I) and/or copper (one or both to copper metal powder. Copper oxide (CuO, Cu20 or both) is in a single ethyl (eg water soluble monoethanolamine composition) Reduction. During the reduction reaction, the copper salt, copper hydroxide or oxidation is at least partially dissolved in the monoethanolamine composition (eg, water soluble composition). In still another preferred system, one or more such as a soluble salt such as copper sulfate, copper chloride and the like, an insoluble copper salt (such as copper carbonate, basic copper carbonate, alkali Including, in particular, tribasic copper sulfate, basic copper nitrate, copper borate and basic copper borate, or any mixture thereof, is dissolved in a monoethanolamine composition (eg, water soluble monoethanolamine to form the precursor composition. Alternatively, the salts may be precipitated with hydroxide by the addition of a caustic agent, and the reverse is a slurry of copper hydroxide. Most of the precursor composition comprises water and excess alkane. The material is rarely saturated with copper, and usually copper! Copper can be at least partially dissolved in the precursor composition. The method involves heating the precursor composition to form a ruthenium system. 〇4 to a large amount of copper amine ion II) ion alkanol composition copper soluble (single monoethanolamine copper salt (one or more kinds of copper sulfate (copper hypochlorite, dissolved or part of the composition) The solution I and/or the oxidizing composition which dissolves and conforms to the composition of the alcohol amine. -25- 200902193 Typically, the excess water and the by-product of the reaction are vaporized. Usually, it is not exposed to the air, although Even if exposed to air, the process can be carried out 'only its exposure to oxygen is minimal. See, for example, U.S. Patent No. 5,492,6 8 1, if the water-soluble copper amide composition is placed in an excess of ammonium and oxygen. The mixture is subsequently stirred and heated to a temperature of between about 70 t: and 130 ° C to form copper oxide particles. The process can be at atmospheric pressure, under vacuum or pressurized (eg, between about 1 and 6). In some preferred systems, the thermal decomposition reaction can be carried out under an inert environment or in a low oxygen environment (for example, containing one or more inert gases such as helium or nitrogen, water vapor, or Monoethanolamine and / Or the organic environment of the organic reaction by-products. The boiling point of the MEA at 1 atm is about 170 ° C. The flash point of the MEA (in the open cup) is only about 93 ° C. Therefore, it is not in the air. In an oxidizing environment, this thermal decomposition will produce vaporizable by-products that can be burned or exploded. Eliminating oxygen is a concern to eliminate flammability/explosive mixtures and will also help prevent or delay the production of copper oxide on the surface of newly produced copper powder. The reduction reaction is carried out at a temperature of between about 95 and 150 ° C (more likely, between about 100 and 14 〇t). If a reducing sugar and/or caustic is present, An industrially acceptable reaction rate is obtained at temperatures between 100 and 1 〇 ° C. If there are no such additional components, then the range is between 130 and 140. Acceptable reaction rate. It may be advantageous to carry out the thermal decomposition under pressurized or reduced pressure. If carried out under reduced pressure, the volatiles may be removed under cooling. Carrying out, it will save a lot of water for vaporization of water and ethanolamine -26- 200902193 Energy, because the components can be maintained in a fluid form without being vaporized. For example, the thermal decomposition can be carried out in an inert environment containing one or more of water vapor, ME A vapor, helium or nitrogen. It is carried out under an absolute pressure of 5 bar, and very little water will be evaporated, so that a lot of energy can be saved when compared with the energy required to distill the water from the reaction mixture before reaching the reaction temperature. Usually, the reduction reaction is carried out. Water is required. Removal of water by distillation involves high energy costs. It may be advantageous to remove a portion of the water from the precursor composition by, for example, when the composition is more soluble in water and less soluble in ethanol. Applying pressure (reverse osmosis) to the composition upon contact, contacting (absorbing) the precursor composition with a dehydrating agent (such as anhydrous calcium sulfate and/or copper sulfate) or electrodialysis pretreatment (wherein the precursor is concentrated) Under the conditions of the active ingredient (particularly copper ion and MEA), a voltage is applied to the ion exchange membrane in contact with the precursor composition. Of course, other options use a source of Μ E A containing very little water or water. Generally, the method involves heating the precursor composition to a temperature of from about 70 to about 17 ° C (e.g., from about 90 to about 155 t). The reaction occurs when the temperature is about 95 to 150 ° C, and it is more likely that the visible copper powder begins to form when the temperature exceeds 10 ° C. It is advantageous to remove water and reaction by-products from the reaction composition by vaporization. Reusable materials such as water/monoethanolamine vapor can be coagulated and reused. It is important to note that the reduction of copper ions by monoethanolamine alters the structure of monoethanolamine (possibly reducing 1 mole of copper will consume at least 1 mole of monoethanolamine), making this part of the monoethanolamine no longer available. There may be monoethanolamine that is not involved in the reduction reaction. This MEA can be recovered and reused at -27-200902193. In contrast, when a formate or other reducing agent is used, most or all of the MEA can be recovered and reused because the MEA will not change its structure. The method is advantageously carried out in a fluid composition. In a preferred system, the stream system is converted to an aerosol and the thermal conversion reaction is carried out in an oven. The particle size of the copper produced can be affected by the particle size of the individual droplets of the precursor composition introduced into the oven. The oven can be maintained at a certain temperature or the oven can have different temperatures at different locations to maximize the reaction rate while preventing the droplets from breaking apart and the volatiles vaporizing too quickly. Typically, the process produces high purity copper metal particles of variable particle size (depending on process conditions), but the particle size that can be easily fabricated cannot be less than about 0.1 micron and cannot be greater than about 10 microns. Typical process conditions and adjuvants can produce sizes between about 〇.  2 to about 1 · 5 μm spherical or round particles. It is not a large particle size distribution. It is apparent that at least 80% of the particle diameter of the total weight of the particles produced falls within about 50% of the average weight particle diameter. The present invention describes a novel method for synthesizing a copper metal powder by honing a copper salt to a desired particle size, converting the honed copper salt to copper monoxide (or copper oxide), and The copper oxychloride particles are then converted to copper powder by a reducing agent. Different preferred systems include one or more of the following: 1) addition of reducing sugars; 2) addition of surfactants (such as glycine, gum arabic, tri" and the like), and preferably to copper Before the powder is produced; 3) adding a surfactant (such as azole), and preferably after the copper powder is produced; and 4) converting a part of the misaligned copper (II) -28-200902193 ion into copper (I) Before or at the same time, copper is added to the copper-MEA precursor composition to dissolve additional copper. In a preferred embodiment of the invention, the copper (II) ion can be obtained by exposing the copper (Π) ion to a weak reducing agent (for example, exposing copper (Π) ions to a reducing sugar such as glucose). Reduction to copper (I) ions. At this time, the precursor composition may be contacted with another copper metal, copper oxide and/or copper salt (the conversion of copper (II) ions into copper (I) ions is compared with the amount of MEA required to dissolve the copper. Excess ME A). Alternatively, the thermal decomposition reaction may be carried out directly from the reaction composition by adding a reducing sugar to the reaction composition, and one or more surfactants may be added to the reaction mixture to stabilize the copper powder and Blocks surface oxidation. Copper powder is typically used to create electrical contacts, and the copper oxide layer on the surface of the particles increases the chances of failure of the resulting product. Exemplary surfactants include azoles and substituted derivatives thereof, particularly aromatic azoles (which include diazoles, triazoles, and tetramines), such as benzotriazole, tolyltriazole, 2,5-(amine Benzymidazole, oxobenzoquinone, such as oleoyl porphyrin; thiazide, such as thiothibenzothiazole, 1-phenyl-5-hydrothiotetrazole; Thiadiazole, anti-halogen, and combinations thereof. The thiadiazole substituted with a thiol group and/or an amine group on the ring and the triazole group substituted with a thiol group and/or an amine group are effective. Examples of anti-halazoles include 5,6-dimethyl-benzotriazole, 5,6-diphenylbenzotriazole, 5-benzoyl-benzotriazole, 5-benzylbenzotriazole And 5-phenylbenzotriazole. Alkyl-substituted aromatic diazoles such as tolyltriazole are preferred. The azole is useful for copper-containing powders (such as pure copper or copper alloys such as zinc copper) -29-200902193. The compounds form a film on the particles and are advantageously dissolved in a solvent and contacted with the copper particles. The particle size of the copper powder can be reduced by honing after the copper powder is formed. U.S. Patent No. 6,432,3 20 describes a process for the manufacture of a refrigerant. A 05 micron powder method by ball milling of spherical 1 to 5 micron particle size copper particles commercially available. In an important preferred system, the invention includes a method of making a micron to submicron size copper powder comprising the steps of: 1) providing a precursor composition comprising or substantially greater than 5% by weight a solution of copper and a solution of greater than 20% by weight of monoethanolamine; and 2) heating the precursor composition to a temperature at which the copper monoethanolamine complex is converted to copper powder. Another preferred system comprises 1) providing a precursor composition comprising or consisting essentially of greater than 5% by weight copper, greater than 20% by weight monoethanolamine and greater than zero. 2% by weight of carbonate as a solution of carbon dioxide; and 2) heating the precursor composition to a temperature at which the copper monoethanolamine complex is converted to copper powder. A third important preferred system comprises 1) providing a precursor composition comprising or consisting essentially of greater than 12% copper, greater than 25% monoethanolamine and greater than ruthenium.  The composition of the 2% counterion is composed of a lower half of the low molecular weight organic acid; and 2) the temperature at which the precursor composition is heated to convert the copper monoethanolamine complex into copper powder. In each of the above preferred systems, it is advantageous that the precursor composition does not contain or is added with a general reducing agent; the precursor composition comprises less than zero.  1 mole low molecular weight organic acid / Moer dissolved copper; the precursor composition is substantially free of low molecular weight organic acid (ie below 〇.  1 mole low molecule -30- 200902193 amount of organic acid / Mo Er copper): the precursor composition contains at least 0. 5 mole hydrogen oxide/mole copper ions; and, advantageously, heated to a temperature of from about 95 to about 150 ° C (more advantageously from about 105 to about 140 ° C). In each of the above preferred systems, it is advantageous that at least 1 mole of monoethanolamine is consumed by the reduction reaction produced per mole of copper powder. [Embodiment] Certain preferred systems and certain advantages of the present invention are illustrated by the following non-limiting embodiments. While the invention has been described by way of example only, the embodiments of the invention may Example 1: Bismuth oxide was prepared by reacting copper sulfate with a caustic solution and then converting the copper hydroxide slurry to copper monoxide by adding glucose under an inert gas. The resulting copper oxide slurry is added to a reactor containing a hot monoethanolamine solution. The copper pentoxide was converted to copper powder within 30 minutes after the addition. The copper powder was recovered and measured to have an average particle size of 〇·1 26 μm. However, the particle size distribution is in two forms, wherein the center of the particle size distribution of a small portion of the particles is several times the median size of the particle size of the slurry. Example 2: Copper powder was prepared in the same manner as in Example 1 except that a small amount of dispersant (Ultrazine NA) was added before the conversion of copper pentoxide to copper powder. The average particle size of the generated copper powder is 0. 158 microns. -31 - 200902193 Example 3: Using a sub-millimeter vermiculite as a substrate for the honing medium, the acid copper slurry to an average particle size of 〇.  1 5 microns. A small amount of hydrogen was added to the slurry and the slurry was converted to di-copper by the addition of glucose. The particle size of one of the obtained copper oxides is about 〇.  1 〇 The copper pentoxide is converted into copper by MEA, and the obtained copper powder has a particle size of 0. 147 microns. Example 4: Preparation of abraded copper hydroxide in a beaker (500 ml) reactor (38. 6 g, 12. 9% Cu, 0. 11 microns) and go (100 g) of puree. A reducing solution was prepared by dissolving D-glucose (22 g) in water (50 ml). After the glucose was dissolved in the stirred copper carbonate slurry (under nitrogen) and the reaction was maintained at 60 to 70 ° C for 1 hour, a copper oxide slurry was obtained. At the end of the process, the pH of the slurry is 8. 2. By adding a 50% caustic solution (2.) before converting the oxidized bismuth powder. 4 g) to adjust the pH of the oxidized copper slurry to 11. At the beginning of the reaction by a 肼 (2. 8 g, 80% active) and a second reduction reaction in nitrogen and at 65 to 80 ° C in the same reactor to reduce the copper oxychloride to copper. The average particle size of the resulting particle size determined by Microtrac is 0. 11 microns. However, the size distribution is clearly in two forms, wherein the particle has a diameter of about 1 介于 of about 0. 4 to 1 micron (the center is about 〇.  6 micro-particles of about 87% by weight of the diameter is between about 0. 2 to 0.  扫描 9 The scanning electron micrograph (SEM) of the copper particles is shown in Fig. 1. Example 5: wet-grinding alkaline copper carbonate (25 g, wet-milled sodium carbonate-micron. The end of the flat wet-ion ion deionized liquid is poured into the temperature between the anti-copper and copper. When the temperature is added, the particles are converted to copper powder by 1% by weight and micrometers. 2 0 % C u, -32- 200902193 0. 10 micron particle size) and deionized water (100 g) carrying a. The slurry was stirred under nitrogen and heated to 65 ° C before addition of a solution of glucose (22 g) water (50 ml). The reaction was maintained at a temperature of 57.5 ° C for 6 hours until the slurry transition was light to indicate submicron copper oxide. In the same reactor, 肼 (2. 8 g, 80% active) Conversion of the copper pentoxide to copper The reaction took 50 minutes. Microtrac analysis shows an average of 0. 04 5 microns. However, the particle size distribution is about two types of particles. 5 wt% of the diameter is about 0. 2 microns and the 90% by weight diameter is between about 〇·3 and 0. 12 microns. Example 6: A copper sulfate solution which had been heated to about 103 to 106 ° C was charged into the reactor. A solution containing glucose, monoethanolamine (about 1.7 g) / g of dissolved copper was added to the solution. Maintain the temperature between 1 0 3 and 1 0 6 . C and the resulting copper particles are 3 microns in size. Examples 7 to 16: Table 1 below is an excerpt from many of the examples. In these examples, monoethanolamine: the molar of copper ions. 5 changes to about 3. 5. Glucose: The molar ratio of copper is about 0 0. 35. The recovery of copper is usually greater than 98%. The deionized ion in the reactor is in the range of 60 to yellow (which is added by adding. The size of the transforming particles is in a state in which the important boiling ratio of the caustic of the particles and the boiling powder of the particles is changed from about to about - 33- 200902193 Table 1 Example MEA/Cu Mohr Ratio Cu Recovery Glucose/Cu Ratio Anion Method Diameter (μm) 7 3. 5 92% 0 C〇3 CMC+AH/vac 1-2 8 3. 5 98% 0 C〇3 CMC+gum+AH/vac ~1 9 3. 5 98% 0. 04 C〇3 CMC+glu+AH/vac <1 10 3.5 98% 0.07 C03 CMC+glu+AH/vac <1 11 2.4 97% 0.05 co3/oh CMCH-CuC03+glu+AH/vac NM 12 2.5 98% 0 C03/OH CMC+AH/vac+CuC03/Cu(0H)2 1.3* +AH/vac 13 1.5 NM 0 SOVOH CuS04+NaOH+AH/vac 0.3-0.4 14 7.8 0.35 SOVOH CuS04+NaOH+glu+AH/vac 0.2 +MEA+AH/vac (3AGG) 15 1.5 0.34 so4 CuS〇4+NaOH+glu+MEA + AH/vac ~0.9 16 3.5 99.6 % C03/OH CMC+AH/vac+NaOH+AH/vac ~1 (3.6AGG) * Self-surface area estimation Example 7: Stirring and heating in a beaker at boiling temperature 25 g of copper monoethanolamine carbonate (CMC) aqueous solution (d = 1.25 g/cc, 9.6% copper and 32.5% MEA). After the solution is vaporized as a whole, the decomposition of C M C spontaneously begins and brown mud is produced. The brown powder was separated from the slurry by filtration. The powder is washed with deionized water and finally washed with acetone (hereinafter referred to as standard method). After drying in an oven at 50 ° C, the copper in the powder was analyzed by iodine titration. The copper content was found to be 94%. The CMC solution contained 32.5 wt% MEA, 9.6% wt copper, up to about 1 wt% carbon dioxide (expressed as carbonate), and the remainder (e.g., about 50 wt%) contained water. Most of the water has been evaporated from the CMC solution before the reaction occurs, presumably the reaction is carried out at a faster rate than the temperature above 100 °C. -34- 200902193 Example 8: The same CMC solution (about 25 5 g) used in Example 7 was placed in a conical filter bottle (500 ml). The solution was stirred and heated under partial vacuum (using a water pump) until the composition began to boil. After evaporation of water (about 100 to 150 g), brown particles begin to appear in the reaction medium. The evaporation and decomposition of the CMC solution lasted for about 10 minutes until the reaction medium turned into a brown slurry with some visible white smoke on the surface of the slurry. After the copper powder is separated from the slurry, the powder is washed and dried by standard. About copper (24. 5 g) was formed in the composition of the c M C precursor and the recovered dry copper powder (22.5 g) was recovered by about 92%. The copper content of the powder was found to be about 1 〇 5% by iodine titration. SEM photographs of the obtained copper powder showed that the particles were agglomerated with a uniform primary particle size of 1 to 2 μm. Example 9: This experiment was similar to Example 8, but before starting the thermal decomposition reaction, CMC (252 g) ) mixed with RodoPo1 23 (Sanxianjiao; 〇·25 g). About copper (2 4 _ 2 g ) in the composition of the c M c precursor and recovered dry copper powder (23·9 S) 'recovery rate greater than 98% ° compared with the particles of Example 8' The particle size was slightly reduced (visual). Example 10: This experiment was similar to Example 8, except that CMC (250 g) was mixed with glucose (2.5 g) to form a precursor composition. The dry copper powder (about 23.3 g) was recovered and the recovery rate was 97%. The particle size of the powder was significantly reduced (visual) compared to the previous batch. Example 1 1 : This experiment was similar to Example 1 'but using glucose (5 g). The recovered copper powder (about 23.8 g) was recovered at a yield of about 99%. The particle size of the powder was slightly smaller than that of Example 10 (visual), but -35-200902193 was again significantly less than those of Examples 7 to 9. Example 12: This experiment was similar to Example 1 but blended with CMC (251 g), glucose (5 g) and copper carbonate (22 g, 56% Cu) to form a precursor composition. The composition appeared to form a solution. Thus, the precursor composition contained copper (about 12.3 g) from the copper carbonate added and copper (24.1 g) from the CMC solution, sharing copper (36.5 g). The dried copper powder (about 34.5 g) was recovered, and the recovery rate was 94%. Example 1 3: A C M C solution (about 10 k g, 9.5% copper) was weighed and boiled until about one and a half of the original volume remained. Basic copper carbonate (about 860 g) was added to the reactor and continued to boil. When the reaction temperature reached about 150 ° C, the reaction to convert into copper powder was completed. A fine powder (1,350 g) having a surface area of 0.47 m2/g and a particle size of about 1.5 μm was obtained. Example 14: MEA (about 340 g) and deionized water (23 0 g) were mixed in a beaker and then stirred. Copper sulfate pentahydrate (CSP; about 273 g) was added and completely dissolved in the MEA solution. Subsequently, a caustic solution (477 g, 1 8%) was added and the solution in the beaker was converted into a viscous slurry. The slurry is heated and evaporated to a boiling temperature of about 150 °C. The reaction was completed after maintaining the temperature above 150 °C for several minutes. The copper particles were filtered and washed with deionized water, followed by final cleaning with acetone (15 ml). A copper powder that is somewhat purple (probably because the particles are small rather than surface oxidized). The copper powder contained 97.7% copper and had a surface area of 2.11 m2/g and a particle size of less than 0.5 μm. Example 15: CSP (about 20 g) was weighed and dissolved in deionized water (60 m 1 ). A solution of 18% N a Ο ( (about 36 g) was added to form a copper hydroxide slurry with good agitation of -36-200902193. Glucose (5 g) was then added to the slurry. The slurry is heated to near boiling temperature. The slurry gradually turned from blue copper hydroxide to green, then yellowed and eventually pale pink copper oxide. At this time, a MEA solution (39 g, 85%) was added to the reactor and the slurry was continuously heated and subjected to a conversion reaction. Copper powder having a particle size distribution of two forms (0.2 and 3 μm, respectively) was obtained. The 3 micron particles are actually agglomerated by smaller copper particles. Example 16: CSP (about 80 g) was mixed with deionized water (250 ml) until all C S P crystals dissolved. Glucose (about 20 g) and MEA (100 g) were added. The solution is heated to near boiling temperature. The solution slowly turned into yellow, red and then purple slurry. The copper powder obtained had a surface area of 0.76 m2/g and a particle size of less than 1 μm. Example 1 7: A c M C solution (about 3 177 g, 9 · 5 % copper) was weighed and allowed to evaporate until a reddish precipitate formed in the solution. Subsequently, a 18% NaOH solution (5 1 5 g) was added to the solution. The caustic reacts with concentrated CMC to form a viscous green slurry. After the slurry has continued to evaporate, the color of the slurry turns yellow, then reddish, and dark red when eventually converted to copper particles. After the powder was washed and dried, copper powder (300 g) was collected. After the powder was deagglomerated by honing, the particle size determined by Micro track was 3.6 μm. Under the microscope, it was found that each particle was agglomerated with 1 to 3 copper particles adhered together. Example 18: The nickel sulfate was dissolved in the MEA and NaOH solution and subsequently heated to boiling temperature. It was visually observed that a metal powder was present on the magnetic stir bar, and a metal layer was deposited on the side of the beaker to indicate the formation of nickel metal. -37- 200902193 [Simple description of the diagram] The included drawings provide further graphical illustrations of the data and photos of the particles. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a scanning electron micrograph of a copper powder produced by the method of the present invention described in Example 4. Because the machine appeared to be out of focus, it was not clear, so it did not get sharpness. Fig. 2 shows details of particle size analysis of copper powder produced by the method of the present invention described in Example 4. Fig. 3 shows details of particle size analysis of copper powder produced by the method of the present invention described in Example 5. Figure 4 is a scanning electron micrograph of a copper powder produced by the method of the present invention described in Example 5. Because the machine appeared to be out of focus, it was not clear, so it did not get sharpness. -38-

Claims (1)

200902193 十、申請專利範圍 1.一種製造微細分開的銅或銅合金粉末之方法,其包 含將單乙醇胺加入至包含含有固態銅之前驅化合物的微細 分開粒子之漿泥中,該含有固態銅之前驅化合物選自銅鹽 、碳酸銅、氫氧化銅、氧化銅、一氧化二銅或彼等之任何 組合,其中溫度係介於9 0至1 5 0 °C且經一段足以轉化該前 驅化合物爲銅粉末之時間。 2 ·如申請專利範圍第1項之製造微細分開的銅或銅合 金粉末之方法,該漿泥另外包含苛性劑和還原糖。 3 .如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,該苛性劑之用量係提升該漿泥之pH至介 於1 0.5至1 1 . 5之間。 4 .如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,該單乙醇胺之用量係介於1_5至2 g單乙 醇胺/g銅之間。 5 ·如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,該單乙醇胺用量係介於1.7至1.8 g單乙 醇胺/g銅之間。 6 ·如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,其中該銅粉末之平均顆粒大小係介於0.04 至0.07微米之間。 7.如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,其中該銅粉末之平均顆粒大小係介於0.07 至0.0 9 5微米之間。 -39- 200902193 8. 如申請專利範圍第2項之製造微細分開的銅或銅合 金粉末之方法,其中該銅粉末之平均顆粒大小係介於0 ·1 至0.2微米之間。 9. 如申請專利範圍第1項之製造微細分開的銅或銅合 金粉末之方法,其中該含有固態銅之前驅化合物係一氧化 二銅。 I 〇.如申請專利範圍第1項之製造微細分開的銅或銅 合金粉末之方法,其另外包含於該含有銅之前驅化合物與 單乙醇胺反應前添加苛性劑和還原糖。 II ·如申請專利範圍第1項之製造微細分開的銅或銅 合金粉末之方法,該漿泥另外包含苛性劑和還原糖。 1 2 .如申請專利範圍第1項之製造微細分開的銅或銅 合金粉末之方法,其中該含有銅之前驅化合物係一氧化二 銅,該方法進一步包含於一氧化二銅與單乙醇胺反應前濕 磨該一氧化二銅。 1 3 ·如申請專利範圍第1項之製造微細分開的銅或銅 合金粉末之方法,其中該含有銅之前驅化合物係平均顆粒 大小介於0_05至〇·4微米之一氧化二銅,該漿泥另外包含 苛性劑和還原糖。 1 4.如申請專利範圍第1項之製造微細分開的銅或銅 合金粉末之方法’其中該含有銅之前驅化合物係一氧化二 銅’且其中該一氧化二銅於添加單乙醇胺後1 〇分鐘或少 於1 0分鐘轉化爲銅粉末。 I5. —種製造微細分開的銅或銅合金粉末之方法,其 -40- 200902193 包含將還原糖、致使漿泥之pH高至10至12所需用量之 苛性劑及肼加入至包含含有固態銅之前驅化合物的微細分 開粒子之漿泥中,該含有固態銅之前驅化合物選自銅鹽、 碳酸銅、氫氧化銅、氧化銅、一氧化二銅或彼等之任何組 合’其中溫度係介於5 5至8 0 °C且經一段足以轉化該前驅 化合物爲銅粉末之時間。 1 6 ·如申請專利範圍第1 5項之方法,其中該含有固態 銅之前驅化合物選自銅鹽、碳酸銅、氫氧化銅或彼等之混 合物,其中於加入胼和苛性劑之前令該含有固態銅之前驅 化合物與還原糖反應。 -41 -200902193 X. Patent Application No. 1. A method for producing a finely divided copper or copper alloy powder comprising adding monoethanolamine to a slurry comprising finely divided particles comprising a solid copper precursor compound, the precursor containing solid copper The compound is selected from the group consisting of copper salts, copper carbonates, copper hydroxides, copper oxides, copper pentoxide or any combination thereof, wherein the temperature is between 90 and 150 ° C and is sufficient to convert the precursor compound to copper over a period of time. The time of the powder. 2. A method of producing a finely divided copper or copper alloy powder according to the first aspect of the patent application, the slurry additionally comprising a caustic and a reducing sugar. 3. A method of producing a finely divided copper or copper alloy powder according to claim 2, wherein the caustic is used to raise the pH of the slurry to between 10.5 and 11.5. 4. A method of producing a finely divided copper or copper alloy powder according to claim 2, wherein the monoethanolamine is used in an amount of from 1 to 5 g to 2 g of monoethylamine/g copper. 5. The method of producing a finely divided copper or copper alloy powder according to item 2 of the patent application, wherein the monoethanolamine is used in an amount of from 1.7 to 1.8 g of monoethylamine/g copper. 6. A method of producing a finely divided copper or copper alloy powder according to claim 2, wherein the copper powder has an average particle size of between 0.04 and 0.07 μm. 7. A method of producing a finely divided copper or copper alloy powder according to claim 2, wherein the copper powder has an average particle size of between 0.07 and 0.095 micron. -39- 200902193 8. A method of producing a finely divided copper or copper alloy powder according to claim 2, wherein the copper powder has an average particle size of between 0.1 and 0.2 microns. 9. A method of making a finely divided copper or copper alloy powder according to claim 1 wherein the solid precursor copper precursor is copper pentoxide. I. The method of producing a finely divided copper or copper alloy powder according to the first aspect of the invention, further comprising adding a caustic and a reducing sugar before the reaction of the copper-containing precursor compound with the monoethanolamine. II. A method of producing a finely divided copper or copper alloy powder according to claim 1 of the patent, the slurry additionally comprising a caustic and a reducing sugar. A method for producing a finely divided copper or copper alloy powder according to the first aspect of the invention, wherein the copper precursor compound is copper pentoxide, the method further comprising before the reaction of the copper oxydioxide with the monoethanolamine The copper oxychloride is wet milled. 1 3 - A method for producing a finely divided copper or copper alloy powder according to claim 1, wherein the copper-containing precursor compound has an average particle size of from 0.05 to 44 micrometer of cuprous oxide, the slurry The mud additionally contains caustic and reducing sugars. 1 4. The method of producing a finely divided copper or copper alloy powder according to claim 1, wherein the copper precursor compound is copper oxide and wherein the copper oxide is added after adding monoethanolamine. Minute or less than 10 minutes converted to copper powder. I5. A method for producing a finely divided copper or copper alloy powder, the method of -40-200902193 comprising a caustic agent for reducing sugar, causing the pH of the slurry to be as high as 10 to 12, and hydrazine to be added to contain solid copper In the slurry of the finely divided particles of the precursor compound, the solid precursor containing the solid copper is selected from the group consisting of copper salt, copper carbonate, copper hydroxide, copper oxide, copper oxide or any combination thereof. 5 5 to 80 ° C and for a period of time sufficient to convert the precursor compound to copper powder. The method of claim 15, wherein the solid precursor copper precursor is selected from the group consisting of copper salts, copper carbonates, copper hydroxides or mixtures thereof, wherein the inclusions are added prior to the addition of the hydrazine and caustic The solid copper precursor compound reacts with the reducing sugar. -41 -
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