200901263 九、發明說明： 【發明所屬之技術領域】 本發明係有關—種場發射顯示器，尤指一種具有封裝 邊框之場發射顯示器導線配置結構。 【先前技術】 、近年來由於奈米I管所具有極佳的電子產生效率，因 此被應用在場發射平面顯示器中的陰極電子發射源上，因 7較於其他的平面顯示器類型，不但具有較佳的亮度外 人莧廣的視角，以及低耗能及反應速度快等優勢，致使該 場發射型平面顯示器更趨於成熟。 而目前所常見的場發射平面顯示器結構，係由一陰極 板及一陽極板所組成，其中該陰極板及陽極板分別具有— 陰極基板及一陽極基板，並於陰陽極基板間設置封骏邊框 結構以阻隔形成内部的真空區域，配合内部真空區域所讯 置的電％ ’提供由奈米碳管所游離出的自由電子加迷的办 間及動力，最後撞擊設置於陽極板上所設的螢光層而形成 發光效應。 就上述的場發射平面顯示器結構中，為了提供真空區 域内分別設於陰極基板及陽極基板上的導電層與外部電源、 的電性銜接，習知常見的作法有兩種：一種係於陰陽基才反 上分別鋪設電極導線，並利用陰陽基板在對應接合時，，、, 相互偏移對接的方式讓陰陽基板上所設的電極導線外露於 真空區域外，形成電極導線的配接區域以供外部電源種于接 ;然而此種方式由於會降低板材的使用效率，即可做為有 200901263 =順佔整體板材面積的比例降低，而且為了產生额 二造成陰陽極板接合後產生不對稱的情況，、 二=Γ_行切割，確保其面板的方正 而求k成材料成本的浪費，成為其缺點所在。 另—種則是在面板上設置以 ，直接由真空區域㈣拉構成的電極導線 種作法在製程上較為簡易…此 ，改善前述方法材料的奸Ί料的配接區域200901263 IX. Description of the Invention: [Technical Field] The present invention relates to a field emission display, and more particularly to a field emission display wire arrangement structure having a package frame. [Prior Art] In recent years, because of the excellent electron generation efficiency of the nanotube I, it has been applied to the cathode electron emission source in the field emission flat panel display, because 7 is more than the other flat panel display types. The excellent brightness of the outside world, as well as the low energy consumption and fast response speed, make the field emission type flat panel display more mature. At present, the field emission flat-panel display structure is composed of a cathode plate and an anode plate, wherein the cathode plate and the anode plate respectively have a cathode substrate and an anode substrate, and a seal frame is arranged between the anode and cathode substrates. The structure is formed to block the internal vacuum region, and the electricity % 'interviewed by the internal vacuum region is provided to provide the free electrons entangled by the carbon nanotubes, and finally the impact is set on the anode plate. The light layer forms a luminescent effect. In the above field emission planar display structure, in order to provide electrical connection between the conductive layer respectively disposed on the cathode substrate and the anode substrate in the vacuum region and the external power source, there are two common methods: one is based on the yin and yang base. The electrode wires are respectively laid on the opposite side, and the electrode wires provided on the yin and yang substrates are exposed outside the vacuum region by means of the mating of the yin and yang substrates in the corresponding joints, and the mating regions of the electrode wires are formed. The external power source is connected; however, this method can reduce the use efficiency of the sheet material, and it can be used as 200901263 = the proportion of the overall sheet area is reduced, and the asymmetry of the anode and cathode plates is generated in order to generate the second amount. , , 2 = Γ _ line cutting, to ensure that the square of the panel is a waste of material costs, become its shortcomings. The other type is the electrode lead which is arranged on the panel and is directly drawn by the vacuum region (4). The method is simple in the process... This improves the mating area of the material of the aforementioned method.
電極導線線徑較—般網印7而’由固態金屬所構成的 你… 印製程所形成的導線為袓，因并X 斤之獲雜多組電極導線配置，且該4b固能全屬電 極導線在通過陰陽基板—口心盈屬電 差異，不易與基板密接而容 内部真空的環境；从^成、、田縫而造成漏氣，影響 的方法來解決此些^題的1知缺失’勢必要找尋更好 f發明内容】 針對上述之缺失，本發明之主 以將内部電極引出之尸 一 勺在方；提供一種用 Μ，每叙射顯示器之電極導線弓丨 藉由在作為封裝結構之邊框 ^出4， 部之陰極或陽極電極層形成電性連接，==與内 一引線板將f亥電極導引 自故框向外延伸 ，更可使陰陽基板保持方正之設::便於與外界電源銜接 示器之電極導線：:構本主要提供-種場發射顯 、、·口構’係包括一陰椏 —封裝邊框，其中今降扳 —％極板及 ^吾板U該陽極板係對應接合，該陰 200901263 極板具有一陰極基板，於陰極基板上設有一陰極導電層， 而該陽極板具有一陽極基板，於陽極基板上設有一陽極導 電層，另，該封裝邊框係設於陰極基板與陽極基板間，於 該封裝邊框之一側邊延伸一引線板，於該引線板之兩端面 上設有複數電極導線，且該些電極導線與該陰陽極基板間 設有一導電層以電性連結該陰陽極導電層，經由所延伸之 引線板將該陰極與陽極導電層之電性導引至外面，以供其 他電源連結。 【實施方式】 茲將本發明之内容配合圖式來加以說明： 請參閱第一圖，係為本發明之陰陽極板正視圖。如圖 所示，本發明之場發射顯示器結構係主要包括一陰極板1 、一陽極板2及一封裝邊框3，該陰極板1係與該陽極板 2對應結合；其中該陰極板1係具有一陰極基板11，於該 陰極基板11上設有複數陰極單元12，各陰極單元12更包括 一陰極電極層121，係設於該陰極基板11上，於該陰極電 極層121上設有複數陰極電子發射源122，且各陰極電子 發射源122係間隔設置，用以釋放自由電子；而該陽極板 2係具有一陽極基板21，於該基板21上設有一陽極單元22 ，該陽極單元22係包括一陽極導電層221及複數螢光層 222 ’其中該陽極導電層221係設於該陽極基板21上，而 該複數榮光層222係間隔設置於該陽極導電層221 ’且各 螢光層222之位置恰對應於各陰極電子發射源122位置。 配合參閱第一圖及第二圖，第二圖係為本發明第一圖 7 200901263 之2-2結構剖視圖；另該封裝邊框3係設由該陰極基板11 及陽極基板21之周緣，以作為陰極板1與陽極板2間之支 撐結構，同時於該陰極板1與陽極板2間形成一真空封裝 區域4，致使陰極板1所釋放之自由電子有足夠之移動空 間，該封裝邊框3之上下端面與該陰極板1及陽極板2之 接合面上分別設塗覆有一層封裝層5，該封裝層5係為一 玻璃膠，用以固定該封裝邊框3與該陰極板1與陽極板2 間之相對位置，如第二圖之正視圖所示，而該封裝邊框3 之一侧邊係具有一向外延伸之引線板31，如第三圖之3-3 封裝邊框剖視圖所示，該引線板31係呈長板狀，於該引線 板31上下板面上分別設有至少一電極導線6，於本實施例 中係為被數電極導線6 ’且該些電極導線6自該引線板31 向内延伸至封裝邊框3之同側邊上，同時於該電極導線6 與陰極板1之導電層121及陽極板2之導電層221間分別 設有一導電層7，如第三圖之3-3封裝邊框剖視圖所示， 該導電層7係由具有導電特性之含金、銀或氧化銦錫之玻 璃膠所構成’致使該些電極導線6與陰極導電層121及陽 極導電層221形成電性連結，以將真空封裝區4内部陰極 板1與陽極板2之電極層121、222電性，經由該導電層 7及自封裝邊框3之一側邊延伸至引線板31上之複數電極 導線6，將内部之陰極板1與陽極板2之電極層121、 222延伸至封裝區4外，以提供外部之驅動電源經由該所 延伸之電極導線6與真空封裝區4内之電極層121 、222 形成電性連接。 8 200901263 請參閱第四圖，係真士 n 。如圖所示，除了前逑”;實施例結構俯視圖 ?| A 於忒封裝邊框3之一侧邊位置延伸 —引線板31外，亦可自兮4+ # 伸該引線板31及灿，其 兩㈣分別向外延 電师 貫施例中係為複數電極導線6，各 =線6係經由該導電層7與封裝之 ： 層121形成電性連結；另 又U杜岭电 少-電極導續6 ,方人太/ '桌板…之上板面上設有至 夂貫施例中係為複數電極導線6，且 二極1.泉6經由該導電層7與 電層⑵卿性連結，藉 之㈣導 引軸…封裝區4内部延伸之 供外部之驅動電源與内部形㈣輯I 界，以提 惟以上所述之實施方式， — 能以此限定本發明實施範圍，若佑太:之“”例’當不 說明書内容所作之等效變化或修\ =明申請專利範圍及 專利涵蓋範圍。 ，皆應屬本發明下述之 【圖式簡單說明 第一圖 第 第 、係為本發明之陰陽極板正視圖。 本發明之2〜2結構剖視分解圖。 I係為本發明之3-3封裝邊框 ^ ，圖、係為本發明之另—實施例二視分解圖 【主要元件符號說明】 u構俯現圖。 陰極單元12The wire diameter of the electrode wire is better than that of the general screen printing 7 and 'the solid metal metal... The wire formed by the printing process is 袓, because the X jin is mixed with a plurality of sets of electrode wires, and the 4b solid energy is all electrodes The wire passes through the yin and yang substrate - the difference in the electrical power of the mouth, which is not easy to be closely connected with the substrate to accommodate the internal vacuum environment; the air leakage caused by the ^, the, and the seams, the method of affecting the problem of solving the problem It is necessary to find a better content of the invention. In view of the above-mentioned deficiency, the main body of the present invention is to scoop the internal electrode out of the body; a cymbal is provided, and the electrode lead of each of the display electrodes is used as a package structure. The frame of the frame is 4, and the cathode or anode electrode layer is electrically connected, and the inner lead plate extends the guide electrode outward from the frame, so that the yin and yang substrates can be kept square: The electrode lead of the display device with the external power supply:: The structure mainly provides - the field emission display, the · mouth structure' includes a haze - package frame, wherein the current plate - the % plate and the ^ plate U the anode Plate system corresponding joint, the Yin 200901263 The anode plate has a cathode substrate, a cathode conductive layer is disposed on the cathode substrate, and the anode plate has an anode substrate, and an anode conductive layer is disposed on the anode substrate, and the package frame is disposed between the cathode substrate and the anode substrate. a lead plate is extended on one side of the package frame, and a plurality of electrode wires are disposed on both end faces of the lead plate, and a conductive layer is disposed between the electrode wires and the anode and cathode substrates to electrically connect the anode and the cathode The conductive layer guides the cathode and the anode conductive layer to the outside via the extended lead plate for connection to other power sources. [Embodiment] The contents of the present invention will be described with reference to the drawings: Please refer to the first drawing, which is a front view of the anode and cathode plates of the present invention. As shown in the figure, the field emission display structure of the present invention mainly comprises a cathode plate 1, an anode plate 2 and a package frame 3, and the cathode plate 1 is coupled with the anode plate 2; wherein the cathode plate 1 has A cathode substrate 11 is provided with a plurality of cathode units 12 on the cathode substrate 11. Each cathode unit 12 further includes a cathode electrode layer 121, which is disposed on the cathode substrate 11, and a plurality of cathodes are disposed on the cathode electrode layer 121. An electron emission source 122, and each cathode electron emission source 122 is spaced apart to release free electrons; and the anode plate 2 has an anode substrate 21, and an anode unit 22 is disposed on the substrate 21, and the anode unit 22 is provided. An anode conductive layer 221 and a plurality of phosphor layers 222 ′ are disposed on the anode substrate 21 , and the plurality of glory layers 222 are spaced apart from the anode conductive layer 221 ′ and each of the phosphor layers 222 . The position corresponds to the position of each cathode electron emission source 122. Referring to the first and second figures, the second drawing is a cross-sectional view of the structure of the first embodiment of FIG. 7 200901263; 2-2, the package frame 3 is provided by the periphery of the cathode substrate 11 and the anode substrate 21 as a supporting structure between the cathode plate 1 and the anode plate 2, and a vacuum package region 4 is formed between the cathode plate 1 and the anode plate 2, so that the free electrons released by the cathode plate 1 have sufficient moving space, and the package frame 3 The sealing surface of the upper and lower end surfaces and the cathode plate 1 and the anode plate 2 are respectively coated with a sealing layer 5, which is a glass glue for fixing the package frame 3 and the cathode plate 1 and the anode plate. The relative position of the two positions is as shown in the front view of the second figure, and one side of the package frame 3 has an outwardly extending lead plate 31, as shown in the cross-sectional view of the package frame of 3-3 in the third figure. The lead plate 31 is formed in a long plate shape, and at least one electrode lead 6 is respectively disposed on the upper and lower plates of the lead plate 31. In this embodiment, the electrode lead 6' is used and the electrode leads 6 are from the lead plate. 31 extends inward to the same side of the package frame 3, while A conductive layer 7 is disposed between the electrode lead 6 and the conductive layer 121 of the cathode plate 1 and the conductive layer 221 of the anode plate 2, as shown in the cross-sectional view of the package frame of 3-3 of the third figure. The conductive layer 7 is electrically conductive. The characteristic of the gold, silver or indium tin oxide glass paste constitutes 'the electrode lead 6 and the cathode conductive layer 121 and the anode conductive layer 221 are electrically connected to the cathode package 1 and the anode plate of the vacuum package area 4 The electrode layers 121 and 222 of the second electrode are electrically connected to the electrode layer 121 of the cathode plate 1 and the anode plate 2 via the conductive layer 7 and the plurality of electrode wires 6 extending from one side of the package frame 3 to the lead plate 31. The 222 extends outside the package area 4 to provide an external driving power source to electrically connect to the electrode layers 121 and 222 in the vacuum package area 4 via the extended electrode lead 6. 8 200901263 Please refer to the fourth picture, which is the real n. As shown in the figure, in addition to the front 逑"; the top view of the structure of the embodiment? | A extends from the side of one side of the package frame 3 - outside the lead plate 31, the lead plate 31 and the can be extended from the 兮 4 + # The two (four) are respectively applied to the epitaxial electrician as a plurality of electrode wires 6, and each of the wires 6 is electrically connected to the package through the conductive layer 7: the layer 121 is electrically connected; 6 , Fang Rentai / 'Tabletop...The upper plate is provided with a plurality of electrode wires 6 in the upper embodiment, and the two poles 1. The spring 6 is connected to the electric layer (2) via the conductive layer 7 By means of (4) the guide shaft... the external driving power supply and the internal shape (4) of the package area 4 are extended to the extent that the above-mentioned embodiments are implemented, and the scope of the present invention can be limited thereby, if Yutai: "Example" When the equivalent changes or revisions of the contents of the manual are not included in the scope of the invention, the scope of the patent application and the scope of patent coverage shall belong to the following paragraphs of the present invention. Front view of the cathode plate of the present invention. Fig. 2 to 2 is a cross-sectional exploded view of the structure. I is a 3-3 package of the present invention. ^ Block, diagram of another system of the present invention - according to a second exploded view of the main element REFERENCE NUMERALS [u now a plan configuration of the cathode unit 12 embodiment of FIG.
陰極板1 陰極騎U 陰極電極層121 200901263 陰極電子發射源122 陽極板2 陽極基板21 陽極單元22 陽極導電層221 螢光層222 封裝邊框3 真空封裝區域 封裝層5 引線板31 電極導線6 導電層7 10Cathode plate 1 cathode ride U cathode electrode layer 121 200901263 cathode electron emission source 122 anode plate 2 anode substrate 21 anode unit 22 anode conductive layer 221 fluorescent layer 222 package frame 3 vacuum package region encapsulation layer 5 lead plate 31 electrode wire 6 7 10